JP6005949B2 - Conductive adhesive sheet and method for manufacturing electronic component - Google Patents

Description

  The present invention relates to a conductive adhesive sheet and a method for manufacturing an electronic component using the conductive adhesive sheet.

  As a method for manufacturing electronic components such as ICs, a circuit pattern is formed on a semiconductor wafer such as silicon or gallium arsenide or an insulating substrate to form an electronic component assembly, and the electronic component assembly is attached to an adhesive sheet. Widely used is a method of cutting and separating (dicing) into chips, stretching the film as needed (expanding), picking up non-defective chips, and fixing the chips to a lead frame or the like with an adhesive and packaging them. (Refer nonpatent literature 1 grade | etc.,).

  In general electronic component manufacturing processes, as disclosed in Patent Documents 1 and 2, etc., a multilayer pressure-sensitive adhesive sheet that combines the function of a pressure-sensitive adhesive sheet for dicing and the function of an adhesive that fixes a semiconductor chip to a lead frame By using (die-attach film integrated sheet), the pressure-sensitive adhesive application step is omitted, and the efficiency of the manufacturing process is improved.

JP 2006-049509 A JP 2007-246633 A Ozawa et al., “Furukawa Electric Time Report”, No. 106, P31, Furukawa Electric Co., Ltd. (July 2000)

  As the use of semiconductor chips has diversified, it has been proposed that in the manufacture of light emitting diodes (hereinafter referred to as LEDs), inspection of good or bad is performed by measuring the brightness of each semiconductor chip before the pick-up process. . In such a case, after the dicing step, there is a demand for a conductive adhesive sheet suitable for transferring a chip fixed to a support such as a dicing tape, performing an inspection such as luminance measurement, and then picking up the chip. Yes.

  In accordance with the above requirements, it is conceivable to contain a conductive agent for the purpose of imparting conductivity to the pressure-sensitive adhesive sheet. However, if the conductive agent is simply contained, transferability of the semiconductor chip from the support and subsequent pickup In some cases, it was inferior.

  The present invention has been made in view of the above circumstances, and provides a conductive pressure-sensitive adhesive sheet that is excellent in transferability and pick-up performance of a semiconductor chip from a support and has conductivity suitable for measuring the brightness of a semiconductor chip. With the goal. Another object of the present invention is to provide an electronic component manufacturing method using the conductive adhesive sheet.

  As a result of intensive studies on these problems, the present inventors have found that the above-mentioned problems can be solved by including a specific conductive agent in a specific ratio in the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. It came to be completed.

  According to one aspect of the present invention, a conductive pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer laminated on at least one surface of the base material, wherein the composition constituting the pressure-sensitive adhesive layer comprises an acrylic polymer. There is provided a conductive pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive contained as a main component and a conductive agent. In one embodiment, the conductive adhesive sheet of the present application is used for transfer of a semiconductor chip after a dicing step and luminance measurement.

In a preferred embodiment of the present invention, the conductive agent is carbon black or carbon nanofiber. In a further embodiment, the pressure-sensitive adhesive is a mixture of an acrylic polymer and a functional group-containing monomer having a hydroxyl group. Moreover, in further embodiment, it is preferable that the electrically conductive agent contained in an adhesion layer is 10-40 mass % with respect to 100 mass parts of adhesive polymers. In preferable embodiment, the thickness of the said adhesion layer is 5-60 micrometers.

  According to another aspect of the present invention, the transferability and pick-up property of the semiconductor chip from the support can be maintained, and the luminance of each semiconductor chip can be measured before pick-up. In a preferred embodiment of the present invention, the semiconductor chip is an LED chip.

According to another aspect of the invention,
(1) a step of dicing the LED assembly 110 on the adhesive tape 200;
(2) After bonding another adhesive tape 300 to the light emitting layer 121 side of the diced LED chip, the adhesive tape 300 is radially expanded to widen the distance between the LED chips 120, or the adhesive tape 200 is radially A step of bonding another adhesive tape 300 to the light emitting layer 121 side of the LED chip after expanding the space between the LED chips 120 that have been expanded and diced into
(3) A step of bonding the LED chip substrate 122 and the adhesive layer 101 of the conductive adhesive sheet 100 to transfer the LED chip 120 to the conductive adhesive sheet 100;
(4) One probe 151 for measuring the resistance value is brought into contact with the upper electrode portion installed in the light emitting layer 121 of the LED chip, and the other probe 152 is brought into contact with the adhesive layer 101 of the conductive adhesive sheet. A step of measuring the luminance of the LED chip 120 by measuring a resistance value between the light emitting layer 121 and the adhesive layer 101 of the conductive adhesive sheet; and
(5) A method for manufacturing an LED chip is provided, which includes a step of peeling between the LED chip substrate 122 and the adhesive layer 101 of the conductive adhesive sheet and picking up the LED chip 120.

  According to the present invention, in the adhesive tape that contributes to the manufacture of electronic components, it is possible to maintain the transferability and pick-up property of the semiconductor chip from the support, and to measure the brightness of the semiconductor chip before pick-up. A conductive pressure-sensitive adhesive sheet is provided.

  In addition to picking up the chip, the conductive pressure-sensitive adhesive sheet of the present invention enables transfer of the chip from the support after the dicing process (transferability) and has conductivity. It can be used suitably for the manufacturing method of electronic components, such as LED which judges.

It is a conceptual diagram of the section of one embodiment of the present invention. It is a conceptual diagram which shows the manufacturing process of an electronic component.

DESCRIPTION OF SYMBOLS 100 Conductive adhesive sheet 101 Adhesive layer 102 Base material 110 LED assembly 111 Light emitting layer 112 LED board 200 Adhesive tape A
104 Dicing blade 120 LED chip 121 LED chip light emitting layer 122 LED chip substrate 300 Adhesive tape B
151 Probe 1 for inspection
152 Probe 2 for inspection

  As shown in FIG. 1, a conductive adhesive sheet 100 according to an embodiment of the present invention has a structure including a base material 102 and an adhesive layer 101 laminated on one surface of the base material 102.

1. Explanation of Terms A monomer unit means a structural unit derived from a monomer. In the present invention, “parts” and “%” are shown as mass standards unless otherwise specified. (Meth) acrylate is a general term for acrylate and methacrylate. Similarly, a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.

2. Outline of Embodiments The present invention is a conductive pressure-sensitive adhesive sheet having a base material and a pressure-sensitive adhesive layer laminated on at least one surface of the base material, and a conductive agent is contained in the composition constituting the pressure-sensitive adhesive layer. It is a conductive adhesive sheet. The conductive pressure-sensitive adhesive sheet of the present invention is suitable for use in semiconductor chip manufacturing processes, particularly semiconductor chip transfer and chip inspection after the dicing process. Moreover, it is preferable that the semiconductor chip in this invention is LED.

<Adhesive layer>
The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer includes a polymer obtained by polymerizing acrylic acid, methacrylic acid and ester monomers thereof, and an unsaturated monomer copolymerizable with these monomers (for example, vinyl acetate, styrene, acrylonitrile). There are copolymerized copolymers. In the conductive pressure-sensitive adhesive sheet of the present embodiment, the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is preferably an acrylic polymer that is easy to design the pressure-sensitive adhesive force, and the adhesive force can be adjusted more precisely by containing a curing agent. . And it is preferable that at least one of the acrylic monomers constituting the acrylic polymer contains a functional group-containing monomer. This functional group-containing monomer is preferably blended and polymerized in an acrylic polymer in an amount of 0% by mass to 10% by mass. If the blending ratio of the functional group-containing monomer is 0.01% by mass or more, the adhesive strength to the adherend is sufficiently strong and the generation around the water tends to be suppressed. If the blending ratio is 10 mass% or less, the adhesive force to the adherend will not be too high, so that it is possible to suppress the occurrence of adhesive residue.

  Examples of the main monomer of the acrylic polymer include butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, 2- Ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, myristyl ( Examples include (meth) acrylic monomers such as (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, and benzyl (meth) acrylate.

  As this acrylic monomer, those having a monomer containing a functional group at least in part are particularly preferable. The monomer containing this functional group includes a functional group such as hydroxyl group, carboxyl group, epoxy group, amide group, amino group, methylol group, sulfonic acid group, sulfamic acid group or (sub) phosphate group. A monomer having one or more types is exemplified. Of these, vinyl compounds having these functional groups are particularly preferable, and vinyl compounds having hydroxyl groups are particularly preferable. In addition, the acrylate mentioned later is included in the vinyl compound here.

  Examples of the functional group-containing monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.

  Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.

  Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.

  Examples of the monomer having an amide group include (meth) acrylamide.

  Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.

  Examples of the monomer having a methylol group include N-methylolacrylamide.

  In the pressure-sensitive adhesive layer of this embodiment, after the above-mentioned acrylic polymer and a curing agent are reacted to cure the pressure-sensitive adhesive layer, the monomer containing a carboxyl group constituting the acrylic polymer is It is preferable that it is 0.1-10 mass% or less in coalescence. That is, according to another expression, among functional group-containing monomers obtained by reacting an adhesive with a curing agent, the functional group-containing monomer containing a carboxyl group is preferably 10% by mass or less. By using a carboxyl group-containing functional group-containing monomer, the adhesion to metal increases, so the carboxyl group-containing functional group-containing monomer after reacting with the curing agent exceeds 10% by mass. In addition, the adhesive strength to the metal is high, and the adhesive residue tends to be generated. Therefore, the monomer having a carboxyl group is preferably one that easily disappears by reaction with a curing agent. For example, (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N -Glycolic acid and cinnamic acid are preferably used.

(Curing agent)
In the conductive adhesive sheet of this embodiment, it is preferable to mix a curing agent with the adhesive used for the adhesive layer. When mix | blending a hardening | curing agent, it is preferable that the compounding ratio of a hardening | curing agent is 0.1 to 10 mass parts with respect to 100 mass parts of acrylic polymers. This is because if the blending ratio of the curing agent is 0.1 parts by mass or more and 10 parts by mass or less, generation of adhesive residue can be suppressed.

  Examples of the curing agent to be blended in the adhesive layer include a polyfunctional isocyanate curing agent, a polyfunctional epoxy curing agent, an azirine compound, and a melamine compound, and a polyfunctional isocyanate curing agent and a polyfunctional epoxy curing agent are preferable. By using a polyfunctional epoxy curing agent or a polyfunctional isocyanate curing agent as at least a part of the above curing agent, it is possible to selectively cause a functional group-containing monomer having a carboxyl group to react and disappear. It is possible to adjust the amount of the functional group-containing monomer having a carboxyl group after curing.

  Examples of the polyfunctional isocyanate curing agent include an aromatic polyisocyanate curing agent, an aliphatic polyisocyanate curing agent, and an alicyclic polyisocyanate curing agent. In addition, an aliphatic polyisocyanate curing agent, particularly a xamethylene diisocyanate curing agent among them is preferable. The reason why this isocyanate curing agent is good is that it can impart flexibility to the pressure-sensitive adhesive and is also effective for an adherend having irregularities.

  The aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2 , 6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3-dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1,4- Diethyl Benzene, 1,4-tetramethylxylylene diisocyanate, and 1,3-tetramethylxylylene diisocyanate and the like.

  The aliphatic polyisocyanate is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene. Examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.

  The alicyclic polyisocyanate is not particularly limited. For example, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl -2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane, and 1,4-bis (isocyanatomethyl) cyclohexane There is.

  Among polyisocyanates, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate 4,4'-toluidine diisocyanate and hexamethylene diisocyanate are preferably used.

  The polyfunctional epoxy curing agent mainly refers to a compound having two or more epoxy groups and one or more tertiary nitrogen atoms, such as N.N-glycidylaniline, N.N-glycidyltoluidine, mN.N-N-. Glycidylaminophenyl glycidyl ether, pN · N-glycidylaminophenyl glycidyl ether, triglycidyl isocyanurate, N · N · N '· N'-tetraglycidyldiaminodiphenylmethane, N · N · N' · N'-tetraglycidyl -M-xylylenediamine, N · N · N ′ · N ′ · N ″ -pentaglycidyldiethylenetriamine and the like.

(Tackifying resin)
A tackifier resin may be added to the adhesive to adjust the adhesive strength. The tackifying resin is not particularly limited. For example, rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol resin, xylene resin, coumarone resin, coumarone indene resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin , Aliphatic aromatic copolymer petroleum resins, alicyclic hydrocarbon resins, and modified products, derivatives, hydrogenated products, and the like thereof.

(Additives, etc.)
For the pressure-sensitive adhesive, for example, various additives such as a curing agent, a polymerization initiator, a softening agent, an anti-aging agent, a filler, an ultraviolet absorber, a light stabilizer, a photopolymerizable compound, and a photoinitiator are added. Also good.

(Conductive agent)
The conductive agent added to the adhesive layer makes the adhesive sheet conductive and allows electricity to flow between the electrode part installed on the top of the semiconductor chip bonded to the adhesive sheet and the electrode part installed on the adhesive sheet. It is what. Examples of the conductive agent used here include conductive polymers, metal-based conductive fillers, conductive carbon fillers, and conductive fine particles. Examples of the metal conductive filler include silver, copper, boron nitride, alumina, gold, palladium, and nickel alone or in a mixture. Examples of the conductive carbon filler include carbon black, carbon nanofibers and carbon nanotubes, graphite, or a mixture thereof. Examples of the graphite used include expanded graphite and granular graphite. The average particle diameter of graphite is preferably 5 to 100 μm from the viewpoint of dispersibility. Moreover, as carbon black to be used, oil furnace black, acetylene black, furnace black, and thermal black are mentioned, for example. These average particle diameters are preferably 30 to 50 nm from the viewpoint of dispersibility and the like. These carbon blacks may contain up to 5% by weight of boron to improve conductivity. In one embodiment of the present invention, a conductive carbon filler, preferably carbon black or carbon nanofiber, may be included as a conductive agent in the pressure-sensitive adhesive composition in an amount of 5 to 50% by mass, more preferably 10 to 40% by mass. If the blending amount is too small, the current-carrying characteristics tend to be insufficient, and if the blending amount is too large, the brittleness tends to be poor and the film forming property tends to be poor.

3-80 micrometers is preferable and, as for the thickness of the adhesion layer of this embodiment, 5-60 micrometers is more preferable. Moreover, if thickness is below these upper limits, the cost at the time of adhesive tape production can be suppressed.
Further, if the adhesive layer is thin, the adhesive strength is reduced, and the transferability of the chip from the support to which the semiconductor chip is fixed may be inferior. If the adhesive layer is thick, the adhesive strength is high, and pickup failure may occur.

The volume resistivity of the conductive pressure-sensitive adhesive sheet was measured using R8340 manufactured by Advantest in accordance with JIS-K6911 or Loresta GP MCP-T610 manufactured by Mitsubishi Chemical Analytech in accordance with JIS-K7194. Moreover, when measuring volume resistivity with the double ring method, the base material of the adhesive sheet was made into metal foil. The volume resistivity of the conductive pressure-sensitive adhesive sheet according to the present invention is preferably 10 ⁴ to 10 ⁵ Ω · cm, and more preferably smaller than 10 ⁴ Ω · cm. If the volume resistivity is larger than these upper limit values, it is not suitable for measuring the luminance.

  The adhesive strength between the conductive adhesive sheet and the semiconductor chip tends to be pick-up failure when the adhesive strength is high, and tends to be inferior in transferability when the adhesive strength is low, and may be 1 to 5 N / 20 mm. Preferably, 2 to 3 N / 20 mm is more preferable.

<Base material>
The base material of the adhesive tape is preferably a material that does not undergo deformation such as expansion and contraction, and is preferably a synthetic resin or metal. Shapes include films, sheets, and foils. The thickness of the substrate is preferably 50 μm or more and 250 μm or less. A more preferable lower limit is 70 μm, and a more preferable upper limit is 150 μm or less. When the thickness of the substrate is reduced, the substrate tends to be cut during expansion in the pickup process, and when the thickness of the substrate is increased, the expandability tends to be inferior.
As the material for the substrate of the present invention, a propylene-based copolymer is preferable. This is because when the propylene-based copolymer is selected, the deformation is small, the semiconductor member does not fluctuate at the time of peeling, and better pickup properties can be obtained in the next pickup step. Examples of the propylene copolymer include a random copolymer of propylene and other components, a block copolymer of propylene and other components, and an alternating copolymer of propylene and other components. Examples of other components include α-olefins such as ethylene, 1-butene, 1-pentene, 1-hexene and 1-heptene, copolymers composed of at least two kinds of α-olefins, and styrene-diene copolymers. is there. Among these, 1-butene is preferable.

  Examples of the base material molding method include a calendar molding method, a T-die extrusion method, an inflation method, and a casting method.

  In order to prevent the base material from being charged when the release film is peeled off, an antistatic treatment may be applied to the pressure-sensitive adhesive contact surface and / or non-contact of the base material. The antistatic agent may be kneaded into the resin. For the antistatic treatment, an antistatic agent such as a quaternary amine salt monomer can be used.

  Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p- There are dimethylaminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride, and dimethylaminoethyl methacrylate quaternary chloride is preferred.

  The method of using the slip agent and the antistatic agent is not particularly limited. For example, the adhesive may be applied to one side of the base film, and the slip agent and / or the antistatic agent may be applied to the back side thereof. Alternatively, an antistatic agent may be kneaded into the resin of the base film to form a sheet.

  An adhesive can be laminated on one side of the substrate, and the other side can be an embossed surface having an average surface roughness (Ra) of 0.3 to 1.5 μm. By installing the embossed surface on the machine table side of the expanding device, the base film can be easily expanded in the expanding process after dicing.

(Slip agent)
In order to improve the expandability after dicing, a slip agent can be applied to the non-adhesive surface of the base material, or the slip agent can be kneaded into the base material.

  The slip agent is not particularly limited as long as it is a substance that reduces the friction coefficient of the pressure-sensitive adhesive sheet and the expanding device. For example, silicone compounds such as silicone resins and (modified) silicone oils, fluororesins, hexagonal boron nitride, carbon black, And molybdenum disulfide. These friction reducing agents may mix a plurality of components. Since manufacture of an electronic component is performed in a clean room, it is preferable to use a silicone compound or a fluororesin. Among silicone compounds, a copolymer having a silicone macromonomer unit is particularly preferred because it has good compatibility with the antistatic layer and can achieve a balance between antistatic properties and expandability.

<Manufacture of conductive adhesive sheet>
As a method of forming an adhesive layer on a substrate to form an adhesive sheet, for example, a method of directly applying an adhesive on a substrate with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater, or peeling There is a method in which a pressure-sensitive adhesive is applied to a film and dried and then bonded to a base film. The adhesive may be printed on the substrate by convex printing, concave printing, flat printing, flexographic printing, offset printing, screen printing, or the like.

<Method for manufacturing electronic parts>
Although the manufacturing method of the electronic component using the electroconductive adhesive sheet 100 of this embodiment is not specifically limited, For example, the following procedure is mentioned. An embodiment of the present invention will be described with reference to FIG. In the drawings, similar components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

The electronic component manufacturing method according to the present invention is, for example, an LED chip manufacturing method having the following procedure.
(1) The LED assembly 110 is attached to the adhesive tape A200 (see FIG. 2 (1)).
(2) The adhesive tape A200 is fixed to the ring frame (not shown).
(3) The LED assembly 110 is diced with the dicing blade 104 to form the LED chip 120 (see FIG. 2B).
(4) Adhesive tape B300 is bonded to the light emitting layer 121 side of the diced LED chip (transfer).
(5) The adhesive tape B300 is expanded radially to widen the interval between the LED chips 120 (see FIG. 2 (3)).
(6) Further, the LED chip substrate 122 and the adhesive layer 101 of the conductive adhesive sheet 100 according to the present invention are bonded together, and the LED chip 120 is transferred to the conductive adhesive sheet 100.
(7) One probe 1 151 for measuring the resistance value is brought into contact with the upper electrode portion installed in the light emitting layer 121 of the LED chip, and the other probe 2 152 is brought into contact with the adhesive layer 101 of the conductive adhesive sheet. The voltage is applied to cause the LED chip 120 to emit light, and the luminance is measured (see FIG. 2 (4)).
(8) The chip is adsorbed with a vacuum collet, peeled off between the LED chip substrate 122 and the adhesive layer 101 of the conductive adhesive sheet, and the LED chip 120 is picked up (not shown).
(9) The LED chip 120 is mounted on the lead frame.
(10) The LED chip mounted on the lead frame is molded with resin (not shown).
In the above (4) and (5), the expansion may be performed before the LED chip is transferred to the adhesive tape B, or may be performed after the transfer.

(Wafer)
The wafer is, for example, a silicon wafer, a silicon carbide wafer, and a compound semiconductor wafer such as gallium phosphide, gallium nitride, and indium phosphide. In the LED chip manufacturing method according to the present invention, a silicon wafer is preferable.

(Adhesive tape)
The pressure-sensitive adhesive tape (pressure-sensitive adhesive tapes A and B in FIG. 2) used in the LED chip manufacturing method is an arbitrary one used in dicing and / or expanding including a base material and a pressure-sensitive adhesive layer. The adhesive force between the adhesive tape and the adhesive tape is higher than the adhesive force between the semiconductor member and the adhesive layer. As a base material for the adhesive tape, a synthetic resin is preferable. Synthetic resins include PVC (polyvinyl chloride), polyethylene, PET (polyethylene terephthalate), EVA (ethylene-vinyl acetate copolymer), ethylene-ethyl acrylate copolymer, polypropylene, propylene-based copolymer, ethylene-acrylic. There are acid copolymers, ionomer resins, and polyimides, and the base material may be a mixture of these synthetic resins, a copolymer, or a laminate of synthetic resins.

  Since the method for manufacturing an electronic component according to the present embodiment uses the above-described conductive adhesive sheet, the semiconductor chip is excellent in both transferability from the support of the semiconductor chip to the conductive adhesive sheet and pick-up property. This is a method of manufacturing an electronic component that can measure the luminance of the electronic component. In one embodiment of the present invention, the electronic component according to the present invention is an LED.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further, this invention is not limited to these.

  The electroconductive adhesive sheet which concerns on an Example was manufactured with the following prescription.

(Base material)
As a base film, a propylene-based copolymer (containing propylene, ethylene, 1-butene as a polymerization component, MFR (melt flow rate) value 7.5 g / 10 min, density 0.89 g / cm ³ (manufactured by Sun Allomer, X500F)) and a thickness of 80 μm were used.

(Adhesive)
As a pressure-sensitive adhesive, a synthetic product (manufactured by Soken Chemical Co., Ltd., product name: SK Dyne 1496) made of an acrylate copolymer obtained by copolymerizing 96% 2-ethylhexyl acrylate and 4% 2-hydroxyethyl acrylate is obtained. It was. In addition, the glass transition point of the obtained synthetic product was -68 degreeC and the weight average molecular weight 450,000.

In addition, the above-mentioned synthetic product further includes a polyfunctional isocyanate curing agent containing 55% ethyl acetate and 45% polyisocyanate-modified product (including adducts of tolylene diisocyanate and trimethylol propane) (manufactured by Nippon Polyurethane Industry Co., Ltd., product) (Name: Coronate L-45E commercial product) was added in an amount of 0.5 parts by mass with respect to 100 parts by mass of the adhesive base polymer.
Three types of conductive fillers (acetylene black, carbon nanofibers or nickel powder) were mixed in the blend shown in Table 1 to the above mixture of the adhesive base polymer and the curing agent, and Examples 1 to 11 and comparison The pressure-sensitive adhesives of Examples 1 and 2 were produced.

  The pressure-sensitive adhesive containing the conductive filler is applied onto a PET separator film, and the adhesive layers after drying in Examples 1 to 11 and Comparative Examples 1 and 2 are coated so as to have the thicknesses shown in Table 1, respectively. And it laminated | stacked on the 80-micrometer-thick base film, and obtained the electroconductive adhesive sheet.

Table 1 shows the results of measuring the volume resistivity, transferability, and pickup property of the conductive adhesive sheets of Examples 1 to 11 and Comparative Examples 1 and 2 obtained above.

<Evaluation method>
The evaluation in Table 1 will be described.

(1) Transferability Transferability was evaluated by the ratio of semiconductor chips transferred from the adhesive tape to the conductive adhesive sheets of Examples 1 to 11 and Comparative Examples 1 and 2.
A (excellent): 91 to 100% of the chip was transferred.
○ (good): 81-90% of the chips were transferred.
X (impossible): 80% or less of the chip was transferred.

(2) Pickup property Pickup property was evaluated by the ratio of semiconductor chips that could be picked up in the pickup process.
(Excellent): 91 to 100% of chips could be picked up.
○ (Good): 81-90% of chips could be picked up.
X (impossible): 80% or less of chips could be picked up.

(3) Volume resistivity It measured with R8340 made from Advantest Corporation based on JIS-K6911, or Loresta GP MCP-T610 type made from Mitsubishi Chemical Analytech Co. based on JIS-K7194. Moreover, when measuring volume resistivity with the double ring method, the base material of the adhesive sheet was made into metal foil.
◎ (excellent): less than 10 ⁴ Ω · cm ○ (good): 10 ⁴ to 10 ⁵ Ω · cm
X (impossible): Greater than 10 ⁵ Ω · cm

<Method for manufacturing electronic parts>
An example of a method for manufacturing an electronic component, which is another method for producing a sample to be evaluated, will be described with reference to FIG.

(1) An LED assembly 110 having a diameter of 8 inches and a thickness of 725 μm is attached to the adhesive tape A200 (see FIG. 2 (1)).
(2) Fix the adhesive tape A200 to the ring frame.
(3) The LED assembly 110 is diced into LED chips 120 having a chip size of 2 mm × 3 mm by the dicing blade 104 (see FIG. 2B).
The main settings are as follows.
Cutting depth into dicing adhesive tape 200: 15 μm
Dicing machine: DAD341 manufactured by DISCO
Dicing blade: NBC-ZH205O-27HEEE made by DISCO
Dicing blade shape: outer diameter 55.56 mm, blade width 35 μm, inner diameter 19.05 mm
Dicing blade rotation speed: 40,000 rpm
Dicing blade feed rate: 50 mm / sec Cutting water temperature: 25 ° C.
Cutting water amount: 1.0 L / min (4) The light emitting layer 121 of the diced LED chip 120 and the adhesive tape B300 are bonded together.
(5) Expand the space between the LED chips by expanding the adhesive tape B300 radially (see FIG. 2 (3)). The amount of expansion at this time is 8 mm.
(6) Further, the LED chip substrate 122 and the adhesive layer 101 of the conductive adhesive sheet 100 according to the present invention are bonded together, and the LED chip 120 is transferred to the conductive adhesive sheet 100 (see FIG. 2 (4)).
(7) One probe 1 151 for measuring the resistance value is brought into contact with the upper electrode portion installed in the light emitting layer 121 of the LED chip, and the other probe 2 152 is brought into contact with the adhesive layer 101 of the conductive adhesive sheet to emit light. The brightness of the LED chip 120 is measured by measuring the resistance value between the layer 121 and the adhesive layer 101 (see FIG. 2 (4)).
(8) After pushing up with the needle pin, the semiconductor chip 120 is adsorbed with a vacuum collet, peeled off between the adhesive layer 101 and the chip substrate 122, and the semiconductor chip 120 is picked up (not shown).
The main settings are as follows.
Pickup device: CAP-300II manufactured by Canon Machinery
Needle pin shape: 250μmR
Needle pin push-up height: 0.5mm
(9) The semiconductor chip 120 is mounted on the lead frame.
(10) The semiconductor chip 120 mounted on the lead frame is molded with resin (not shown).

Claims (4)

A conductive adhesive sheet comprising a substrate and an adhesive layer laminated on at least one surface of the substrate, wherein the composition constituting the adhesive layer contains an acrylic polymer as a main component and carbon It contains black or carbon nanofibers, the thickness of the adhesive layer is 5 to 60 μm, and the content of the carbon black or carbon nanofibers in the composition is 10 to 40% by mass. A conductive adhesive sheet for manufacturing semiconductor chips . The electroconductive adhesive sheet for semiconductor chip manufacture of Claim 1 in which the said adhesive contains the copolymer of an acrylic polymer and the functional group containing monomer which has a hydroxyl group. The conductive adhesive sheet for manufacturing a semiconductor chip according to claim 1, wherein the LED chip fixed to the support is transferred to enable inspection for luminance measurement and subsequent pickup. (1) a step of dicing the LED assembly 110 on the adhesive tape 200;
(2) After bonding another adhesive tape 300 to the light emitting layer 121 side of the diced LED chip, the adhesive tape 300 is radially expanded to widen the distance between the LED chips 120, or the adhesive tape 200 is radially A step of bonding another adhesive tape 300 to the light emitting layer 121 side of the LED chip after expanding the space between the LED chips 120 that have been expanded and diced into
(3) The LED chip substrate 122 and the adhesive layer 101 of the conductive adhesive sheet 100 for manufacturing a semiconductor chip according to any one of claims 1 to 3 are bonded together, and the LED chip 120 is attached to the conductive adhesive sheet. Transferring to 100,
(4) One probe 151 for measuring the resistance value is brought into contact with the upper electrode portion installed on the light emitting layer 121 of the LED chip, and the other probe 152 is brought into contact with the adhesive layer 101 of the conductive adhesive sheet. Measuring the brightness of the LED chip 120 by measuring a resistance value between the adhesive layer 101 and the adhesive layer 101; and
(5) A method for producing an LED chip, comprising a step of peeling between the LED chip substrate 122 and the adhesive layer 101 of the conductive adhesive sheet and picking up the LED chip 120.