JP6005386B2 - Superconducting coil device and manufacturing method thereof - Google Patents

Description

  The present invention is, for example, formed by winding a tape-shaped superconducting wire having a superconducting layer made of a rare earth oxide superconductor on a substrate, and suppressing the strain due to deformation of the superconducting wire and maintaining superconducting characteristics. The present invention relates to a coil device and a manufacturing method thereof.

  A superconducting pancake coil formed by winding a tape-shaped superconducting wire using a rare earth oxide superconductor is suitably used as a high magnetic field magnet or the like. In this high magnetic field magnet, hoop stress (electromagnetic stress) acts in the circumferential direction so as to expand the coil diameter of the superconducting wire based on the generated high magnetic field. For this reason, the superconducting pancake coil is required to have a mechanical strength that can withstand the hoop stress, and is required to have a large amount of strain that can be tolerated against deformation such as tension and bending.

  This type of superconducting coil is disclosed in Patent Document 1, for example. That is, the superconducting coil has a winding frame having an inner peripheral surface and a flat surface on the flange side, and a superconductor wound around the winding frame, and an insulating material is provided between the winding frame and the superconductor. A spacer is disposed. This spacer is formed by laminating a plurality of insulating materials in the form of a sheet on the inner peripheral surface, and a plate-like insulating material is disposed on the flat surface on the flange side. Further, the outer peripheral surface of the winding frame has a binding, and a spacer having an insulating material is disposed between the binding and the superconductor.

JP 2007-214466 A

  In the superconducting coil having the conventional configuration described in Patent Document 1 described above, since the binding is provided between the outer surfaces of a pair of flanges provided on the winding frame, the binding has a reduced diameter with respect to the superconducting coil. The compressive force in the direction could not be applied directly. For this reason, when the superconducting coil is subjected to electromagnetic stress during use and attempts to expand its diameter, the binding cannot sufficiently receive the electromagnetic stress, and the superconducting coil may be deformed to cause deterioration of the superconducting characteristics. . Further, when the superconducting coil is deformed by electromagnetic stress, the electrode connected to the end of the superconducting coil is likely to be peeled off, and the performance of the superconducting coil may not be expressed.

  Accordingly, an object of the present invention is to provide a superconducting coil device capable of suppressing the deformation of the superconducting coil when subjected to electromagnetic stress and exhibiting superconducting characteristics well, and a method for manufacturing the same. It is in.

In order to achieve the above object, a superconducting coil device according to claim 1 is formed by winding a tape-shaped superconducting wire having a rare-earth oxide superconductor to form a superconducting coil, and forming the superconducting coil on the outer periphery of the superconducting coil. Is provided with an outer peripheral frame for suppressing the diameter expansion of the superconducting coil, a part of the outer peripheral frame is notched and an electrode is mounted on the notch, and an electrically insulating retaining ring is provided on the outer periphery of the outer peripheral frame. arranged to, as well as configured to exert a compressive force direction of reducing the diameter to the superconducting coil by tightening the peripheral frame, wherein the superconducting coil 2 stages on both surfaces of the intermediate regulating frame superconducting wire through the through hole of the intermediate regulation frame It is comprised by the double pancake coil wound around.

  A superconducting coil device according to a second aspect of the present invention is the superconducting coil device according to the first aspect, wherein the electrically insulating retaining ring is formed by annularly forming a metal tape with an electrically insulating coating. It is characterized by that.

The superconducting coil device according to a third aspect of the present invention is the superconducting coil device according to the second aspect , wherein the superconducting wire is a tape-shaped superconducting wire in which a superconducting layer made of a rare earth oxide superconductor is formed on a substrate. The metal tape is formed of the same material as the substrate of the superconducting wire or a material having a higher thermal expansion coefficient than the substrate of the superconducting wire.

A method for manufacturing a superconducting coil device according to a fourth aspect of the present invention is the method for manufacturing a superconducting coil device according to any one of the first to third aspects, wherein the superconducting wire is attached to an intermediate restriction frame. A superconducting coil is formed by a double pancake coil wound in two steps on both sides of the intermediate regulation frame through the through hole, an outer peripheral frame is provided on the outer periphery, and an electrode is attached to a notch portion of the outer peripheral frame, A metal tape with an electrically insulating coating forming an electrically insulating retaining ring is wound so that the diameter is smaller than that of the outer peripheral frame, the end of the metal tape is fixed to form a retaining ring, and the retaining ring is It is heated and expanded, its diameter is made larger than the diameter of the outer peripheral frame, it is placed on the outer periphery of the outer peripheral frame, and then cooled, the holding ring is reduced, the outer peripheral frame is tightened, and the compressive force in the reduced diameter direction is applied to the superconducting coil. It characterized the Turkey to act.

According to the present invention, the following effects can be exhibited.
In the superconducting coil device of the present invention, an outer peripheral frame is provided on the outer periphery of the superconducting coil, an electrode is mounted on a notch portion of the outer peripheral frame, and an electrically insulating holding ring is disposed on the outer periphery of the outer peripheral frame. Yes. The retaining ring tightens the outer peripheral frame and applies a compressive force in the direction of diameter reduction to the superconducting coil.

For this reason, when the superconducting coil is used as, for example, a high magnetic field magnet or the like, when the electromagnetic stress due to the high magnetic field acts on the superconducting coil to expand the coil, the stress is relieved by the compressive force. That is, the electromagnetic stress acting on the superconducting wire is received and reduced by being shared by the outer peripheral frame and the holding ring. Therefore, the function of the superconducting coil is satisfactorily exhibited by the influence of electromagnetic stress being suppressed.
In addition, since the superconducting coil is formed of a double pancake coil, the outer peripheral frame and the retaining ring can alleviate electromagnetic stress acting on the superconducting wire wound in two stages.

  Therefore, according to the superconducting coil device of the present invention, the deformation of the superconducting coil can be suppressed when subjected to electromagnetic stress, and the superconducting characteristics can be exhibited well.

It is a figure which shows the superconducting coil apparatus of a reference form, Comprising: (a) is a schematic cross-sectional view which shows the state which has arrange | positioned the outer periphery frame and the holding ring to the outer periphery of a single pancake coil, (b) shows the superconducting coil apparatus. A schematic longitudinal cross-sectional view, (c) is an enlarged vertical cross-sectional view of a main part showing a superconducting coil device. Sectional drawing which shows a tape-shaped superconducting wire. It is a figure which shows the manufacturing process of the superconducting coil apparatus, Comprising: (a) is a schematic cross-sectional view which shows the state which wound the tape-shaped superconducting wire around the inner peripheral frame, (b) is outer periphery on the outer periphery of the superconducting wire The schematic cross-sectional view which shows the state which arrange | positions a frame and an electrode. It is a figure which shows the manufacturing process of a superconducting coil apparatus, Comprising: (a) is a top view which shows the ring of a metal tape smaller in diameter than an outer periphery frame, (b) is thermally expanded and arrange | positioned the outer side of the outer periphery frame. Sectional drawing which shows the state which carried out. A diagram showing a superconducting coil apparatus implementation form, (a) shows the schematic cross-sectional view showing a state of arranging the peripheral frame and the retaining ring on the outer periphery of the double pancake coils, a (b) its superconducting coil apparatus The schematic longitudinal cross-sectional view shown, (c) is a principal part expanded longitudinal cross-sectional view which shows a superconducting coil apparatus. It is a figure which shows the manufacturing process of the double pancake coil, Comprising: The perspective view which shows the state which started winding the tape-shaped superconducting wire around the inner peripheral frame. The partial longitudinal cross-sectional view which shows the state which wound the superconducting wire from the state of FIG. The partial longitudinal cross-sectional view which shows the state which formed the paraffin mold layer in the upper part of a superconducting wire after arrange | positioning an outer periphery frame to the outer periphery of a superconducting wire from the state of FIG. Sectional drawing which shows the superconducting wire as another example of this invention.

( Reference form)
Hereinafter relates Reference Embodiment forming the superconducting coil device with a single pancake coil, it is described in detail with reference to FIGS.

  As shown in FIGS. 1A to 1C, a single pancake coil 11 </ b> A (hereinafter also simply referred to as a coil) constituting the superconducting coil device 10 is disposed around a cylindrical inner peripheral frame 12. Tape-shaped superconducting wire 13 is formed by winding. A cylindrical outer peripheral frame 14 is disposed on the outer periphery of the coil 11A. A part of the outer peripheral frame 14 is notched, and a pair of electrodes 15 are provided in the notch portion 14a. One electrode 15 is connected to the outer peripheral end of the wound superconducting wire 13, and the other electrode 15 is connected to the inner peripheral end of the superconducting wire 13 via a lead wire (not shown). By providing the outer peripheral frame 14 on the outer periphery of the coil 11A, when the coil 11A receives a hoop stress (electromagnetic stress) due to a high magnetic field, the diameter expansion of the coil is suppressed.

  On the outer periphery of the outer peripheral frame 14, a metal ring 16 with an electrically insulating coating is wound, and a holding ring 17 formed in an annular shape is disposed. The width (height) of the holding ring 17 is set to be the same as the width of the outer peripheral frame 14. The holding ring 17 is configured to apply a compressive force in the diameter reducing direction to the coil 11 </ b> A via the outer peripheral frame 14.

As shown in FIG. 2, the tape-shaped superconducting wire 13 has a superconducting layer 20 formed on a substrate 18 via an intermediate layer 19, and a first stabilizing layer 21 is formed on the superconducting layer 20. The second stabilizing layer 22 is covered on the outer peripheral portion thereof. The substrate 18 is made of a metal such as nickel alloy (Hastelloy), silver, or silver alloy, for example, with a thickness of 100 μm and a width of 10 mm. Hastelloy is an alloy containing nickel as a main component and containing chromium, molybdenum, and the like, and has good heat resistance, mechanical strength, and the like. The intermediate layer 19 includes gadolinium / zirconium oxide (Gd / Zr oxide), magnesium oxide (MgO), yttrium-stabilized zirconium (YSZ), barium / zirconium oxide (Ba / Zr oxide), cerium oxide (CeO ₂ ). ) And the like, for example, a thickness of 500 nm and a width of 10 mm.

  The superconducting layer 20 is formed, for example, to a thickness of about 1 μm and a width of 10 mm by a rare earth oxide superconductor CVD method (chemical vapor deposition method). As rare earth elements, lanthanum (La), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), dysprosium (Dy), holmium (Ho), erbium (Er), yttrium (Y), And ytterbium (Yb). Examples of rare earth oxides include RE, Ba, Cu, and O. However, RE represents a rare earth element. Specific examples of the superconducting layer 20 include yttrium / barium / copper oxide (Y / Ba / Cu oxide), lanthanum / barium / copper oxide (La / Ba / Cu oxide), and the like.

  The first stabilization layer 21 is formed to have a thickness of about 15 μm and a width of 10 mm, for example, by sputtering metal such as silver. The second stabilization layer 22 is formed to have a thickness of about 50 μm, for example, by plating with a metal such as copper.

  The outer peripheral frame 14 is formed of a fiber reinforced resin or a metal with an electrically insulating coating. As the fiber reinforced resin (FRP), glass fiber reinforced resin (GFRP), carbon fiber reinforced resin (CFRP), or the like is used. As the metal having an electrically insulating coating, stainless steel coated with a synthetic resin such as an epoxy resin or a polyamide resin (nylon resin) is used.

  As shown in FIG. 1C, a mold layer 23 made of a mold material such as paraffin or wax is formed on the coil 11A. This mold material is a low-strength material for protecting the superconducting wire 13 from being damaged when the single pancake coil 11A is cooled with liquid helium, liquid nitrogen or the like. That is, at the time of cooling, the mold layer 23 receives the stress due to cooling, and in some cases breaks itself, thereby protecting the superconducting wire 13.

  When the tape-shaped superconducting wire 13 is wound in a coil shape, the superconducting wire 13 is disposed such that the superconducting layer 20 is located on the inner peripheral side and the substrate 18 is located on the outer peripheral side. By disposing the superconducting layer 20 on the inner peripheral side, the arc of the superconducting layer 20 becomes smaller than the arc on the outer peripheral side of the substrate 18, so that the compressive strain increases and the coil 11A receives a hoop stress. This is preferable because the tensile strain exerted is relaxed and the resistance to the hoop stress is increased.

As the metal constituting the metal tape 16, a metal having a higher coefficient of thermal expansion than the same material as the substrate 18 of the superconducting wire 13 or the material forming the substrate 18 is preferably used. Specific examples of such metals include nickel alloys (Hastelloy) and aluminum alloys. The thermal expansion coefficient of the nickel alloy is 10 × 10 ^{−6 to} 11 × 10 ⁻⁶ / ° C., and the thermal expansion coefficient of the aluminum alloy is 23 × 10 ^{−6 to} 24 × 10 ⁻⁶ / ° C. The thermal expansion coefficient of silver forming the substrate 18 is 19 × 10 ⁻⁶ / ° C. Moreover, the electrically insulating coating of the metal is performed using an electrically insulating synthetic resin having heat resistance (heat resistance of 200 ° C. or higher) such as epoxy resin and polyamide resin (nylon resin).

  When the retaining ring 17 is disposed on the outer periphery of the outer peripheral frame 14, first, the metal tape 16 with the electrically insulating coating is wound into a circle smaller than the outer diameter of the outer peripheral frame 14, and in this state, the epoxy resin adhesive An annular holding ring 17 is formed by bonding such that at least both ends of the metal tape 16 do not move with an adhesive such as. The joining of the metal tape 16 can also be performed by a method in which the metal tape 16 is impregnated with an epoxy resin and bonded. The obtained retaining ring 17 is heated and expanded so that the inner diameter of the retaining ring 17 is larger than the outer diameter of the outer peripheral frame 14, and can be arranged outside the outer peripheral frame 14 in the expanded state. . Thereafter, when the holding ring 17 is cooled, a tightening force is applied to the coil 11 </ b> A via the outer peripheral frame 14.

Next, a method for manufacturing the superconducting coil device 10 will be described.
As shown in FIG. 3A, first, a tape-shaped superconducting wire 13 is wound around one end of the inner peripheral frame 12 formed in a cylindrical shape at a predetermined number of turns to form a coil 11A. Subsequently, as shown in FIG. 3B, the outer peripheral frame 14 is arranged on the outer periphery of the coil 11A of the superconducting wire 13 to form the coil 11A. In this case, a slight gap may be formed between the outer peripheral surface of the coil 11 </ b> A and the inner peripheral surface of the outer peripheral frame 14. Then, the electrode 15 is inserted into the notch portion 14a of the outer peripheral frame 14 to form an assembly of the coil 11A. In this state, the assembly of the coil 11 </ b> A is immersed in molten paraffin, degassed, and then cooled to form the mold layer 23.

  On the other hand, as shown in FIG. 4A, an annular retaining ring is formed by winding a metal tape 16 coated with an electrical insulating coating a predetermined number of times and adhering it with an epoxy resin adhesive so that both ends thereof do not move. 17 is formed. The inner diameter of the holding ring 17 is set to be smaller than the outer diameter of the outer peripheral frame 14. Thereafter, as shown in FIG. 4B, the holding ring 17 is heated to about 200 ° C. to thermally expand the metal tape 16 so that the inner diameter of the holding ring 17 is larger than the outer diameter of the outer peripheral frame 14. The retaining ring 17 is disposed outside the outer peripheral frame 14 in the expanded state. Thereafter, as shown in FIG. 1A, the metal tape 16 contracts as the holding ring 17 cools, and the outer peripheral frame 14 is tightened.

Next, the operation of the superconducting coil device 10 configured as described above will be described.
Now, when using the superconducting coil apparatus 10 of the present reference embodiment as a high magnetic field magnet or the like, a tangential direction (circumferential direction) on the hoop stress (tensile stress of coil 11A on the basis of a high magnetic field generated by energizing the coil 11A ) Acts so that the hoop stress expands the coil 11A. In this case, since the outer peripheral frame 14 is disposed on the outer peripheral portion of the coil 11A and the holding ring 17 is fitted on the outer peripheral frame 14, the hoop stress is shared between the outer peripheral frame 14 and the holding ring 17. It is accepted.

  Further, since the compressive force in the direction of diameter reduction acts on the coil 11A via the outer peripheral frame 14 by the holding ring 17, the compressive force is balanced against the hoop stress and the coil 11A is deformed. It can be suppressed. For this reason, even if the hoop stress acts on the coil 11 </ b> A and a force to increase the diameter acts, the stress can be prevented from reaching the superconducting wire 13.

  As a result, the tensile strain of the superconducting wire 13 can be made smaller than the limit strain amount (irreversible strain amount, about 0.7%), and the current-carrying characteristics can be maintained. In other words, the coil 11A can retain its shape, can avoid the influence of hoop stress as much as possible, and can exhibit the superconducting characteristics well.

The effects obtained by the reference embodiment detailed above will be summarized below.
(1) In the superconducting coil device 10 of this reference embodiment, an outer peripheral frame 14 is disposed on the outer periphery of a single pancake coil 11A around which a tape-like superconducting wire 13 is wound, and a holding ring 17 is provided on the outer peripheral frame 14. Is externally fitted. The holding ring 17 tightens the outer peripheral frame 14 to apply a compressive force in the diameter reducing direction to the coil 11A.

  For this reason, when the coil 11A is used as, for example, a high magnetic field magnet or the like, when the electromagnetic stress due to the high magnetic field acts on the coil 11A to expand the diameter of the coil 11A, the stress is relieved by the compressive force. The Therefore, the electromagnetic stress acting on the superconducting wire 13 is distributed and received by the outer peripheral frame 14 and the holding ring 17, and the coil 11A is prevented from being affected by the electromagnetic stress as much as possible, and its function is exhibited well. Is done.

Therefore, according to the superconducting coil device 10 of the reference embodiment, the deformation of the single pancake coil 11 </ b> A can be suppressed when subjected to electromagnetic stress, and the excellent effect that the superconducting characteristics can be satisfactorily exhibited. .
(2) The electrically insulating retaining ring 17 is formed in an annular shape by winding a metal tape 16 having an electrically insulating coating. For this reason, the holding ring 17 can be configured easily, and the diameter of the holding ring 17 can be easily set.
(3) The metal tape 16 with the electrically insulating coating is formed in an annular shape so as to have a diameter smaller than that of the outer peripheral frame 14, and is heated in that state and placed on the outer periphery of the outer peripheral frame 14 in an expanded state. By being cooled, the outer peripheral frame 14 is tightened to apply a compressive force in the diameter reducing direction to the coil 11A. Therefore, by setting the material of the metal tape 16 and the diameter of the holding ring 17, the compressive force of the holding ring 17 for tightening the coil 11 </ b> A via the outer peripheral frame 14 can be easily adjusted.
(4) The superconducting wire 13 is a tape-shaped superconducting wire 13 in which a superconducting layer 20 made of a rare earth oxide superconductor is formed on a substrate 18, and the metal tape 16 is the same material as the substrate 18 of the superconducting wire 13 or The superconducting wire 13 is made of a material having a higher coefficient of thermal expansion than the substrate 18. Therefore, a compressive force toward the center of the coil 11 </ b> A can be applied to the coil 11 </ b> A by a contraction force based on cooling of the thermally expanded metal tape 16.
(5) In the method of manufacturing the superconducting coil device 10, the metal tape 16 is wound so that the diameter is smaller than that of the outer peripheral frame 14, the end is fixed to form the holding ring 17, and the holding ring 17 is heated and expanded. The diameter of the outer peripheral frame 14 is made larger than that of the outer peripheral frame 14 and the outer peripheral frame 14 is cooled. According to this manufacturing method, the holding ring 17 can tighten the outer peripheral frame 14 by a simple operation to apply a compressive force in the diameter reducing direction to the coil 11A, and the superconducting coil device 10 can be manufactured efficiently.
(Implementation form)
Next, relates implementation form a superconducting coil apparatus 10 is formed in a double pancake coil of the present invention will be described in detail with reference to FIGS. 5-8. In the implementation form of this, a description of the parts which differ mainly the reference embodiment, the description thereof is omitted for overlapping portions.

  As shown in FIGS. 5A to 5C, the double pancake coil 11 </ b> B as a superconducting coil has a coil 11 </ b> B formed by winding a superconducting wire 13 around the outer periphery of the inner peripheral frame 12, and an intermediate restriction frame 24. Are stacked in two upper and lower stages. An outer peripheral frame 14 is disposed on the outer periphery of each stage of the coil 11B. In the lower coil 11B, a mold layer 23 made of a molding material such as paraffin is formed in the lower part, and in the upper coil 11B, a similar mold layer 23 is formed in the upper part. On the outer periphery of each of the upper and lower outer peripheral frames 14, a holding ring 17 formed by a metal tape 16 with an electrically insulating coating is disposed.

Next, a method for manufacturing the superconducting coil device 10 will be described.
As shown in FIG. 6, the inner peripheral frame 12 to which the intermediate restriction frame 24 is connected is wound in two opposite directions in the upper and lower stages around the central portion of the superconducting wire 13 having a single tape shape. That is, the upper coil 11B is wound counterclockwise when viewed from above, and the lower coil 11B is wound clockwise when viewed from above. A through hole (not shown) is provided in the intermediate restriction frame 24 so that the superconducting wire 13 passes through the through hole. Further, the winding direction of the superconducting wire 13 around the inner peripheral frame 12 may be opposite to the above.

  As shown in FIG. 7, the coil 11 </ b> B is formed on both upper and lower surfaces of the intermediate restriction frame 24 by winding the superconducting wire 13 in a predetermined direction at each stage. Then, as shown in FIG. 8, the outer peripheral frame 14 is arrange | positioned to the outer periphery of the coil 11B of each step, respectively, and the assembly of the coil 11B is formed. Next, the assembly of the coils 11B is immersed in molten paraffin, deaerated, and then cooled to form the mold layer 23 in the upper and lower space portions of each coil 11B.

  After that, as shown in FIG. 5C, holding rings 17 are respectively fitted onto the upper and lower outer peripheral frames 14 in the same manner as in the first embodiment. In this way, the superconducting coil device 10 can be obtained.

Next, the operation of the superconducting coil device 10 configured as described above will be described.
When the superconducting coil device 10 of the second embodiment is used as a high magnetic field magnet or the like, hoop stress acts in the direction of expanding the coil 11B based on the generated high magnetic field. At this time, since the outer peripheral frame 14 and the holding ring 17 are arranged on the outer peripheral portions of the upper and lower coils 11B, the hoop stress is shared by the outer peripheral frame 14 and the holding ring 17 and received.

  Further, holding rings 17 are fitted on the upper and lower outer peripheral frames 14, respectively, and the holding rings 17 exert a compressive force acting on the inner side in the radial direction of the coil 11B, so that a hoop stress acts on each coil 11B. Even if the diameter expansion force works, the diameter expansion force is alleviated by the compressive force, and it is possible to suppress the diameter expansion force from reaching the superconducting wire 13. Therefore, the double pancake coil 11B can maintain its shape, can reduce the influence of the hoop stress as much as possible, and can exhibit excellent superconducting characteristics.

Here, the result of having conducted the test of the energization characteristic regarding the superconducting coil device 10 using the double pancake coil 11B will be described.
In an external magnetic field with a temperature of 4.2 K (in liquid helium) and a magnetic flux density of 8 T, a current of 17 A / second is applied to the double pancake coil 11B (the length of the superconducting wire 13 is 50 m) until the total current reaches 1500 A. Energized. At this time, the voltage generated by electromagnetic induction in the coil 11B was about 40 mV. In this external magnetic field, a hoop stress of 2 GPa or more was applied to the coil 11B.

  In this state, when changes in the coil current (A) and the coil voltage (mV) flowing through the coil 11B were measured according to a conventional method, the coil voltage has a voltage exceeding the limit current (a current value when a voltage of 5 mV is generated). No limit current was observed, and good current-carrying characteristics were obtained. In addition, no deterioration was found in the coil 11B even after repeating the above test of the energization characteristics.

  Further, as a result of measuring the strain amount of the superconducting wire 13 using a strain gauge, the strain amount was less than 0.7% which is the limit strain amount of the superconducting wire 13. Even when the test for the current-carrying characteristics was repeated a plurality of times, the strain amount of the superconducting wire 13 was less than the limit strain amount. Therefore, it was confirmed that the superconducting coil device 10 can maintain excellent superconducting characteristics.

It is also possible to embody changed before you facilities embodiment as follows.
As the tape-shaped superconducting wire 13, a superconducting wire 13 configured as shown in FIG. 9 may be used. That is, the superconducting wire 13 has a structure in which a bismuth oxide superconductor 25 is dispersed in a silver (Ag) sheath 26.

- before you facilities embodiment, the coils 11A, 11B top and at least one of the lower, provided the upper regulating frame or lower regulating frame which is connected and fixed to the peripheral frame 14 and the inner peripheral frame 12 by bolts or adhesives, hoop You may comprise so that the movement (expansion) of the outer periphery frame 14 by stress may be suppressed more effectively.

Coil 11A before you facilities embodiment, may be configured superconducting coil apparatus 10 and remove the inner peripheral frame 12 of 11B.
- before you facilities embodiment, at least one of the inner peripheral frame 12 and the outer peripheral frame 14, with upper and lower may be configured so as to be integrated. In that case, the intermediate restriction frame 24 is formed to be narrow in the radial direction by the amount corresponding to the inner peripheral frame 12 or the outer peripheral frame 14.

  The retaining ring 17 may be configured as a C ring by cutting out a part of the retaining ring 17. In this case, the inner diameter of the C-ring is set so as to be smaller than the outer diameter of the outer peripheral frame 14, and the compression is applied to the coils 11 </ b> A and 11 </ b> B via the outer peripheral frame 14 by expanding the diameter and fitting the outer periphery frame 14. Can act.

  DESCRIPTION OF SYMBOLS 10 ... Superconducting coil apparatus, 11A ... Single pancake coil as a superconducting coil, 11B ... Double pancake coil as a superconducting coil, 13 ... Superconducting wire, 14 ... Outer frame, 14a ... Notch part, 15 ... Electrode, 16 ... Metal tape, 17 ... retaining ring, 18 ... substrate, 20 ... superconducting layer.

Claims (4)

A superconducting coil is formed by winding a tape-shaped superconducting wire having a rare earth oxide superconductor, and an outer peripheral frame for suppressing the expansion of the superconducting coil is provided on the outer periphery of the superconducting coil, and a part of the outer peripheral frame In order to apply a compressive force in the reduced diameter direction to the superconducting coil by placing an electrically insulating retaining ring on the outer periphery of the outer peripheral frame and tightening the outer peripheral frame. The superconducting coil device is characterized in that the superconducting coil is constituted by a double pancake coil in which a superconducting wire is wound in two stages on both surfaces of the intermediate restricting frame through the through hole of the intermediate restricting frame. . 2. The superconducting coil device according to claim 1, wherein the electrically insulating retaining ring is formed by forming an annular metal tape with an electrically insulating coating . The superconducting wire is a tape-shaped superconducting wire in which a superconducting layer made of a rare earth oxide superconductor is formed on a substrate, and the metal tape has the same coefficient of thermal expansion as the superconducting wire substrate or the superconducting wire substrate. The superconducting coil device according to claim 2, wherein the superconducting coil device is made of a high material. It is a manufacturing method of the superconducting coil device according to any one of claims 1 to 3,
  A superconducting coil is formed by a double pancake coil in which the superconducting wire is wound in two stages on both sides of the intermediate restriction frame through the through hole of the intermediate restriction frame, and an outer peripheral frame is provided on the outer periphery thereof. An electrode is attached to the notch, and a metal tape with an electrically insulating coating that forms an electrically insulating retaining ring is wound so that the diameter is smaller than the outer peripheral frame, and the end of the metal tape is fixed and held. A ring is formed, the holding ring is heated to expand, the diameter is made larger than the diameter of the outer peripheral frame and the outer ring is arranged and then cooled, the holding ring is reduced in diameter, and the outer peripheral frame is tightened to superconducting. A manufacturing method of a superconducting coil device, wherein a compressive force in a diameter reducing direction is applied to a coil.