JP6087483B1 - Laser processing machine, correction value calculation device, and program - Google Patents

Abstract

The laser processing machine (1) irradiates the processing object (W) with laser light (L) to process the processing object (W), and forms a cut surface (CS) on the processing object (W). To do. The laser processing machine (1) includes a processing target support unit (10) that supports the processing target (W), a processing head (20) that irradiates the processing target (W) with laser light (L), and a processing A relative movement unit (30) capable of moving the head (20) in the X direction, the Y direction, and the Z direction. The laser beam machine (1) uses a contact detection unit (50) that detects that the workpiece (W) and the machining head (20) are in contact with each other, and a tool diameter correction during machining using the cut surface (CS). And a control device (40) for calculating a value. The control device (40) includes processing position information indicating the position of the processing head (20) when the cutting surface (CS) is formed on the processing object (W), and processing head (20) on the cutting surface (CS). A tool radius correction value is calculated based on contact position information indicating the position of the machining head (20) at the time of contact.

Description

  The present invention relates to a laser processing machine, a correction value calculation device, and a program for processing a workpiece.

  In order to carry out laser processing with high accuracy, the width of the cutting groove formed by laser processing is taken into consideration, and the processing head and the workpiece are relatively moved along a path corrected by half the width of the cutting groove. It is necessary to irradiate with laser light. A dimension that is half the width of the cutting groove is called a tool radius correction value. A general laser beam machine can set a tool radius correction value, which is half the width of the cutting groove, to an arbitrary value.

  Further, the processing conditions of the laser processing machine are determined by the output of the laser beam, the frequency of the laser beam, the duty of the laser beam, the pressure of the laser gas, and the focal position. The laser processing machine needs to calculate a tool radius correction value every time the machining conditions change because the width of the cutting groove changes when the machining conditions are changed.

  In order to calculate the tool radius correction value, the current laser processing machine is configured by measuring the actual dimensions of the part using a measuring device after forming a part of the set dimension from the workpiece. Calculated from the difference between the dimensions and actual dimensions. However, this method requires a measuring instrument, and requires a lot of time and man-hours to calculate the tool radius correction value. There has been proposed a laser processing machine that is configured by a CCD (Charge-Coupled Device) camera and includes an optical device that measures the width of a cutting groove (see Patent Document 1).

Japanese Patent Laid-Open No. 10-258384

  The laser processing machine disclosed in Patent Document 1 includes an expensive optical device, and performs image processing on an image captured by the optical device to calculate a tool diameter correction value, which increases the cost. .

  The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing machine capable of calculating a tool radius correction value in a short time without increasing the cost.

  In order to solve the above-described problems and achieve the object, the present invention irradiates a laser beam onto a workpiece, processes the workpiece, and forms a cut surface on the workpiece. It is. The laser processing machine includes a processing head that irradiates a processing target with laser light, and a correction value calculation device that calculates a tool diameter correction value during processing using the cut surface. The correction value calculation device includes processing position information indicating the position of the processing head with respect to the processing target when the cutting surface is formed on the processing target, and the processing head of the processing head with respect to the processing target when the processing head contacts the cutting surface. A tool radius correction value is calculated based on the contact position information indicating the position. The machining head is brought close to the cut surface along the surface from the state in which the tip of the machining head is positioned closer to the back surface of the workpiece than the surface of the workpiece, and comes into contact with the cut surface.

  The laser beam machine according to the present invention has an effect that the tool radius correction value can be calculated in a short time without cost increase.

The figure which shows the structure of the laser beam machine which concerns on Embodiment 1. FIG. The perspective view which shows an example of the process target object cut | disconnected by parts and the remaining material with the laser processing machine shown by FIG. The flowchart which shows the process in which the control apparatus of the laser beam machine which concerns on Embodiment 1 calculates a tool diameter correction value. The perspective view which shows the processing target object in which the punch hole was formed in step ST1 shown by FIG. The figure explaining the coordinate of the cut surface formed in the inner surface of the punch hole formed in the workpiece shown by FIG. The perspective view which shows the state which made the front-end | tip of the process head approach the inside of a punch hole in step ST2 shown by FIG. The perspective view which shows the state which made the front-end | tip of the process head contact the cut surface of a punch hole in step ST3 shown by FIG. Sectional view of the workpiece and the tip of the machining head shown in FIG. The figure explaining the coordinate of the cut surface formed in the inner surface of the punch hole which the laser beam machine concerning Embodiment 2 formed Sectional drawing which shows the state which the front-end | tip of the processing head of the laser beam machine concerning Embodiment 3 contacted the cut surface of the punching hole. Sectional drawing which shows the state which the front-end | tip of the processing head of the laser beam machine concerning Embodiment 4 contacted the location near the surface of the workpiece of a cut surface. Sectional drawing which shows the state which the front-end | tip of the processing head of the laser beam machine concerning Embodiment 4 contacted the location near the back surface of the workpiece of a cut surface. The flowchart which shows the process in which the control apparatus of the laser beam machine which concerns on Embodiment 5 calculates a tool diameter correction value. The figure explaining the coordinate of the cut surface formed in the inner surface of the punch hole formed in the workpiece in step ST1 shown in FIG. The perspective view which shows the state by which the front-end | tip of the process head was made to oppose the surface of the process target object in which the hole was formed in step ST2-5 shown by FIG. Sectional view of the workpiece and the tip of the machining head shown in FIG. The perspective view which shows the state which made the front-end | tip of the process head approach the inside of a punch hole in step ST3-5 shown by FIG. Sectional drawing of the workpiece and the tip of the machining head shown in FIG. The figure which shows an example of the structure of the hardware of the control apparatus of the laser beam machine which concerns on each embodiment

  Hereinafter, a laser beam machine, a correction value calculation device, and a program according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a diagram illustrating a configuration of a laser beam machine according to the first embodiment. FIG. 2 is a perspective view showing an example of a workpiece to be cut into parts and a remaining material by the laser processing machine shown in FIG.

  The laser processing machine 1 shown in FIG. 1 processes the processing target object W by irradiating the processing target object W with a laser beam L. In the first embodiment, the laser beam machine 1 irradiates the workpiece W with the laser light L, and forms the cutting groove CD in the workpiece W as shown in FIG. Is a device for cutting the part PT and the remaining material BM. In the first embodiment, the workpiece W to be cut into the part PT and the remaining material BM by the laser processing machine 1 is made of metal and is formed in a flat plate shape. That is, the workpiece W is a sheet metal.

  The part PT is cut from the workpiece W, and is subjected to at least one of bending, welding, and painting in a later process than the laser processing machine 1 and assembled into a product. The remaining material BM is discarded without being assembled into a product. The cutting groove CD formed in the workpiece W by the laser beam machine 1 is a groove that penetrates the workpiece W and separates the workpiece W into a part PT and a remaining material BM. The cutting groove CD is formed outside the outer edge of the part PT. Since the cutting groove CD is formed by irradiating the laser beam L with the laser beam machine 1, it is thin but has a width. The information on the part PT input to the laser beam machine 1 indicates the position of the outer edge of the part PT on the workpiece W. When the laser processing machine 1 forms the cutting groove CD along the position of the outer edge of the input part PT, the outer edge of the part PT is cut by the half of the width DW of the cutting groove CD. It is necessary to form the cutting groove CD outside the outer edge of the part PT by the half of the width DW of the cutting groove CD.

  As shown in FIG. 1, the laser processing machine 1 includes a processing target support unit 10 that supports the processing target W, a processing head 20 that irradiates the processing target W with laser light L, and a processing target support unit 10. A relative movement unit 30 that can relatively move the machining head 20, a contact detection unit 50 that detects contact between the workpiece W and the machining head 20, and a control device 40 that is a correction value calculation device; Is provided.

  The processing target object support unit 10 supports the processing target object W on which the processing target object W is placed. The processing object support unit 10 suppresses the movement of the supported processing object W by supporting the processing object W in a posture parallel to the horizontal direction.

  The processing head 20 irradiates the processing object W with the laser light L, and forms a cutting groove CD for cutting the processing object W in the processing object W. The machining head 20 cuts the workpiece W into a part PT and a remaining material BM. In the first embodiment, the tip 21 of the machining head 20 that faces the workpiece W is formed with a smaller diameter as it approaches the workpiece W. Further, the tip 21 of the processing head 20 includes a laser through hole 22 through which the laser light L passes.

  The relative movement unit 30 relatively moves the machining head 20 and the workpiece support 10. In the first embodiment, the relative moving unit 30 moves the processing head 20, but the processing target support unit 10 may be moved, and both the processing head 20 and the processing target support unit 10 are moved. Also good.

  In addition, the relative movement unit 30 relatively moves the machining head 20 and the workpiece support unit 10 along the X direction that is the surface direction along the surface WS of the workpiece W facing the machining head 20. A direction moving unit 31 is provided. The relative movement unit 30 is a surface direction along the surface WS of the workpiece W and moves in the Y direction to relatively move the machining head 20 and the workpiece support unit 10 along the Y direction intersecting the X direction. The unit 32 is provided. The relative movement unit 30 includes a Z-direction movement unit 33 that relatively moves the machining head 20 and the workpiece support unit 10 along the Z direction that is the thickness direction of the workpiece W. The X direction is the first linear direction, and the Y direction is the second linear direction. In the first embodiment, the X direction, the Y direction, and the Z direction are orthogonal to each other. In the first embodiment, the X direction moving unit 31 moves the processing head 20 in the X direction, the Y direction moving unit 32 moves the processing head 20 in the Y direction, and the Z direction moving unit 33 sets the processing head 20. Is moved in the Z direction.

  The X-direction moving unit 31, the Y-direction moving unit 32, and the Z-direction moving unit 33 include a motor, a lead screw that moves the machining head 20 by the rotational driving force of the motor, and a linear guide that guides the movement direction of the machining head 20. Is done. The configuration of the X-direction moving unit 31, the Y-direction moving unit 32, and the Z-direction moving unit 33 is not limited to the configuration using a motor, a lead screw, and a linear guide.

  The contact detection unit 50 detects that the machining head 20 and the workpiece W are in contact with each other. In the first embodiment, the contact detection unit 50 applies a voltage to the machining head 20 and the workpiece W, and a current flowing between the machining head 20 and the workpiece W or the machining head 20 and the workpiece W. Is detected as a contact between the machining head 20 and the workpiece W. The contact detection unit 50 outputs the detection result to the control device 40.

  The laser beam machine 1 also includes a distance measuring unit 60 that measures the distance between the machining head 20 and the workpiece W. In the first embodiment, the distance measuring unit 60 measures the capacitance according to the distance between the machining head 20 and the workpiece W. The electrostatic capacitance between the machining head 20 and the workpiece W measured by the distance measuring unit 60 changes according to the distance between the machining head 20 and the workpiece W. That is, when the distance between the machining head 20 and the workpiece W changes, the capacitance between the machining head 20 and the workpiece W changes. The distance measuring unit 60 outputs the capacitance between the machining head 20 and the workpiece W to the control device 40. In the first embodiment, the distance measuring unit 60 is a capacitance type sensor that measures the capacitance between the machining head 20 and the workpiece W, but may be an optical sensor.

  The control device 40 is a computer. The control device 40 controls the relative moving unit 30 and the processing head 20 to form the cutting groove CD in the processing target object W, and cuts a part of the processing target object W. The inner surface of the cutting groove CD formed in the workpiece W becomes a cutting surface CS for cutting the part PT and the remaining material BM. When the control device 40 laser-processes the workpiece W and cuts the part PT and the remaining material BM, the control device 20 relatively moves the workpiece head 20 and the workpiece W along the X and Y directions. While moving, based on the measurement result of the distance measurement part 60, the distance between the process head 20 and the process target object W is maintained at the set distance. For this purpose, the control device 40 moves the processing head 20 and the processing target W relative to the relative movement unit 30 based on the measurement result of the distance measuring unit 60, and the processing target W and the processing head 20. This is a copying portion that keeps the distance to the constant.

  The control device 40 is connected to an input device 41 for inputting information on each part PT in the workpiece W, a program PG for machining, and machining conditions. The processing conditions include the output of the laser light L, the frequency of the laser light L, the duty of the laser light L, the pressure of the laser gas, the focal position of the laser light L, and the distance between the processing head 20 and the processing target W during processing. It is. The control device 40 is connected to a display device 42 that displays information on each part PT in the workpiece W.

  The control device 40 includes a storage unit 43 that stores information on each part PT, a program PG, and processing conditions, a control unit 44 that controls the relative movement unit 30 and the processing head 20 during processing, and laser processing using the cut surface CS. A correction value calculation unit 45 that measures half the width DW of the cutting groove CD formed according to the previously input machining conditions and calculates tool diameter correction values ΔX and ΔY at the time of machining is provided. In the first embodiment, the correction value calculation unit 45 of the control device 40 calculates tool radius correction values ΔX and ΔY in the X direction and the Y direction, respectively. The storage unit 43 stores the shape of the machining head 20. The program PG stored in the storage unit 43 includes a program PG1 for calculating tool radius correction values ΔX and ΔY.

  The tool diameter correction values ΔX and ΔY are half the width DW of the cutting groove CD. The tool diameter correction values ΔX and ΔY are processed with the machining head 20 positioned outside each part PT by the half of the width DW of the cutting groove CD rather than the outer edge of each part PT indicated by the information of each part PT. Is the value of The laser beam L is emitted from the machining head 20 in a state where the machining head 20 is positioned on the outside of each part PT by the half of the width DW of the cutting groove CD than the outer edge of each part PT indicated by the information of each part PT. Then, the part PT is formed inside the cutting groove CD. That is, in order to form each part PT according to the information of each part PT, the tool diameter correction values ΔX and ΔY are positioned outside the outer edge of the part PT indicated by the information of each part PT and the outer edge of each part PT. The distance between the optical axis LP of the laser beam L irradiated from the processing head 20 to be applied is shown.

  Next, the process in which the laser beam machine 1 according to Embodiment 1 calculates the tool radius correction values ΔX and ΔY will be described. FIG. 3 is a flowchart illustrating a process in which the control device for the laser beam machine according to the first embodiment calculates a tool radius correction value. FIG. 4 is a perspective view showing the object to be processed in which the punched hole is formed in step ST1 shown in FIG. FIG. 5 is a diagram for explaining the coordinates of the cut surface formed on the inner surface of the punched hole formed in the workpiece shown in FIG. 4. FIG. 6 is a perspective view showing a state in which the tip of the machining head has entered the inside of the punched hole in step ST2 shown in FIG. FIG. 7 is a perspective view showing a state where the tip of the machining head is in contact with the cut surface of the punched hole in step ST3 shown in FIG. FIG. 8 is a cross-sectional view of the workpiece and the tip of the machining head shown in FIG.

  In the control device 40, the correction value calculation unit 45 calculates the tool radius correction values ΔX and ΔY in the X direction and the Y direction before the control unit 44 performs laser processing. When calculating the tool diameter correction values ΔX and ΔY, the control device 40 is a position where the punch hole 100 shown in FIG. 4 for calculating the tool diameter correction values ΔX and ΔY of the workpiece W from the input device 41 is formed. Is entered. The position where the hole 100 for calculating the tool diameter correction values ΔX and ΔY is formed is a position that becomes the remaining material BM when the workpiece W is cut into the part PT and the remaining material BM. In addition, the control device 40 receives processing conditions when performing laser processing from the input device 41.

  The control device 40 irradiates the processing object W with the laser light L from the processing head 20 according to the processing conditions while moving the processing head 20 relative to the processing object W, and cuts a part of the processing object W. Thus, the cut surface CS is formed on the workpiece W (step ST1). In the first embodiment, as shown in FIG. 4, the control device 40 cuts a part of the workpiece W into a rectangular shape and forms a hole 100 at a position where the remaining material BM is formed. Although the cut surface CS is formed on the inner surface of 100, the shape of cutting a part of the workpiece W is not limited to a rectangular shape.

  As shown in FIG. 4, the hole 100 formed in the first embodiment has a longitudinal direction parallel to the X direction and a short side direction parallel to the Y direction. For this reason, as shown in FIGS. 4 and 5, the cut surface CS formed on the inner surface of the punched hole 100 is a first X direction cut surface CSX1 parallel to the X direction, and a second X direction cut surface parallel to the X direction. CSX2, a first Y-direction cut surface CSY1 parallel to the Y direction, and a second Y-direction cut surface CSY2 parallel to the Y direction.

  FIG. 5 of the machining head 20 shows the relative machining position of the machining head 20 with respect to the workpiece W when the cut surfaces CSX1, CSX2, CSY1, CSY2 of the punch hole 100 are formed in step ST1. The coordinates (X1, Y1) of the corner P1 of the movement path K1 shown in FIG. 2, the coordinates (X2, Y1) of the corner P2, the coordinates (X1, Y2) of the corner P3, and the coordinates (X2, Y2) of the corner P4 are calculated. get. The coordinates (X1, Y1) of the corner P1 of the movement path K1, the coordinates (X2, Y1) of the corner P2, the coordinates (X1, Y2) of the corner P3, and the coordinates (X2, Y2) of the corner P4 are the X direction and Y The distances in the X direction and the Y direction from the preset origin on the plane defined by the direction are shown. The coordinates X1, X2, Y1, Y2 of the movement path K1 are machining position information. That is, step ST1 is a processing position information calculation step for calculating the coordinates X1, X2, Y1, Y2 of the movement path K1.

  As shown in FIG. 6, the control device 40 inserts the tip 21 of the machining head 20 inside the hole 100, and the tip 21 of the machining head 20 is placed on the surface of the workpiece W rather than the surface WS of the workpiece W. Positioned near the back surface WR on the back side of WS, that is, below the surface WS of the workpiece W (step ST2). The control device 40 brings the machining head 20 close to the cut surfaces CSX1, CSX2, CSY1, and CSY2 in order along the surface WS of the relative moving unit 30, and as shown in FIG. 7, the cut surfaces CSX1, CSX2, CSY1, and so on. The tip 21 of the machining head 20 is brought into contact with CSY2 in order (step ST3). In step ST3, the control device 40 moves the machining head 20 along the surface WS from the state in which the tip 21 of the machining head 20 is positioned closer to the back surface WR than the surface WS of the workpiece W, and cuts the cut surfaces CSX1, CSX2, CSY1. , CSY2 in order.

  Based on the detection result of the contact detection unit 50 and the amount of movement of the processing head 20 by the X-direction moving unit 31 and the Y-direction moving unit 32 of the relative moving unit 30, the control device 40 causes the cutting head 20 to move each cutting plane CSX1. , CSX2, CSY1, and CSY2 are calculated and obtained coordinates X3 ′, X4 ′, Y3 ′, and Y4 ′ that indicate the position of the machining head 20 with respect to the workpiece W when contacting. Further, the Y-direction coordinate of the first X-direction cut surface CSX1 is Y3, and corresponds to the Y-direction coordinate Y3 ′ of the machining head 20 when it contacts the first X-direction cut surface CSX1. The coordinate in the Y direction of the second X-direction cut surface CSX2 is Y4, and corresponds to the coordinate Y4 ′ in the Y direction of the machining head 20 when contacting the second X-direction cut surface CSX2. The X-direction coordinate of the first Y-direction cut surface CSY1 is X3, and corresponds to the X-direction coordinate X3 ′ of the machining head 20 when it contacts the first Y-direction cut surface CSY1. The X-direction coordinate of the second Y-direction cut surface CSY2 is X4, and corresponds to the X-direction coordinate X4 ′ of the machining head 20 when it contacts the second Y-direction cut surface CSY2.

  The coordinates X3 ′, X4 ′, Y3 ′, and Y4 ′ indicating the position of the machining head 20 with respect to the workpiece W when the machining head 20 comes into contact with the respective cut surfaces CSX1, CSX2, CSY1, and CSY2 are position information at the time of contact. is there. That is, in step ST3, the Y-direction coordinate Y3 ′ of the machining head 20 when contacting the first X-direction cut surface CSX1, the Y-direction coordinate Y4 ′ of the machining head 20 when contacting the second X-direction cutting surface CSX2, The contact position for calculating the X-direction coordinate X3 ′ of the machining head 20 when contacting the first Y-direction cut surface CSY1 and the X-direction coordinate X4 ′ of the machining head 20 when contacting the second Y-direction cutting surface CSY2. This is an information calculation step.

  The control device 40 determines the distance in the Z direction between the surface WS of the workpiece W shown in FIG. 8 and the tip 21 of the machining head 20 based on the amount of movement of the machining head 20 by the Z direction moving unit 33 in step ST2. LA is calculated. Based on the distance LA and the shape of the tip 21 of the machining head 20 stored in the storage unit 43, the control device 40 determines the laser light L in the machining head 20 when the machining head 20 contacts each cut surface CS. The distance d between the optical axis LP and the position of the cutting surface CSX1, CSX2, CSY1, CSY2 where the tip 21 of the machining head 20 contacts is calculated, and the position of each cutting surface CSX1, CSX2, CSY1, CSY2 is calculated. (Step ST4).

  In step ST4, the control device 40 determines the Y-direction coordinate Y3 of the first X-direction cut surface CSX1 based on the Y-direction coordinate Y3 ′ and the distance d of the machining head 20 when it contacts the first X-direction cut surface CSX1. Is calculated. In the first embodiment, the control device 40 calculates that the Y-direction coordinate Y3 = Y3′-d of the first X-direction cut surface CSX1.

  In step ST4, the control device 40 determines the Y-direction coordinate Y4 of the second X-direction cut surface CSX2 based on the Y-direction coordinate Y4 ′ and the distance d of the machining head 20 when it contacts the second X-direction cut surface CSX2. Is calculated. In the first embodiment, the control device 40 calculates that the Y-direction coordinate Y4 = Y4 ′ + d of the second X-direction cut surface CSX2.

  In step ST4, the control device 40 determines the X-direction coordinate X3 of the first Y-direction cut surface CSY1 based on the X-direction coordinate X3 ′ and the distance d of the machining head 20 when contacting the first Y-direction cut surface CSY1. Is calculated. In the first embodiment, the control device 40 calculates that the X-direction coordinate X3 = X3′-d of the first Y-direction cut surface CSY1.

  In step ST4, the control device 40 determines the X-direction coordinate X4 of the second Y-direction cut surface CSY2 based on the X-direction coordinate X4 ′ and the distance d of the machining head 20 when contacting the second Y-direction cut surface CSY2. Is calculated. In the first embodiment, the control device 40 calculates that the X-direction coordinate X4 = X4 ′ + d of the second Y-direction cut surface CSY2.

  The coordinates X3, X4, Y3, and Y4 of the cutting planes CSX1, CSX2, CSY1, and CSY2 calculated by the control device 40 are cutting plane position information that indicates the positions of the cutting planes CSX1, CSX2, CSY1, and CSY2.

  The control device 40 determines the tool diameter based on the coordinates X1, X2, Y1, Y2 of the movement path K1, which is position information at the time of machining, and the coordinates Y3 ′, Y4 ′, X3 ′, X4 ′, which are position information at the time of contact. Correction values ΔX and ΔY are calculated (step ST5), and the flowchart shown in FIG. 3 is terminated. In step ST5, the control device 40 determines the tool diameter based on the coordinates X1, X2, Y1, and Y2 of the movement path K1 that is position information during processing and the coordinates Y3, Y4, X3, and X4 that are cutting surface position information. Correction values ΔX and ΔY are calculated.

  Coordinates X1, X2, Y1, and Y2, which are position information at the time of processing, indicate the position of the moving path K1 of the optical axis LP of the laser beam L emitted from the processing head 20, that is, the processing head 20, when forming the punch hole 100. The coordinates Y3, Y4, X3, and X4, which are cut surface position information, indicate the positions of the cut surfaces CSX1, CSX2, CSY1, and CSY2. For this reason, the tool radius correction value ΔX, which is a half dimension of the width DW of the cutting groove CD in the X direction, can be calculated using the following formula 1, and is half of the width DW of the cutting groove CD in the Y direction. The tool radius correction value ΔY that is the dimension of can be calculated using Equation 2 below.

[(X4-X3)-(X2-X1)] / 2 = ΔX Equation 1
[(Y4-Y3)-(Y2-Y1)] / 2 = ΔY Equation 2

  In step ST5, the control device 40 calculates the tool radius correction values ΔX and ΔY using Equations 1 and 2. That is, the step ST5 is based on the coordinates X1, X2, Y1, Y2 of the movement path K1, which is position information at the time of machining, and the coordinates Y3 ′, Y4 ′, X3 ′, X4 ′, which are position information at the time of contact. This is a tool radius correction value calculation step for calculating the radius correction values ΔX and ΔY. The program PG1 stored in the storage unit 43 of the control device 40 causes the control device 40, which is a computer, to execute steps ST1, ST3, and ST5, and calculates tool radius correction values ΔX and ΔY at the time of machining. It is a program to do. The laser beam machine 1 uses the tool radius correction values ΔX and ΔY when machining the workpiece W.

  The laser processing machine 1, the control device 40, and the program PG1 according to the first embodiment are processing position information indicating the position of the processing head 20 when the cut surfaces CSX1, CSX2, CSY1, and CSY2 are formed on the processing target W. Coordinates X1, X2, Y1, Y2, and coordinates X3 ′, X4 ′, Y3 ′, which are position information at the time of showing the position of the machining head 20 when the tip 21 of the machining head 20 is brought into contact with the cut surface CS, Based on Y4 ′, tool radius correction values ΔX and ΔY are calculated. Therefore, the laser processing machine 1, the control device 40, and the program PG1 can calculate the tool diameter correction values ΔX and ΔY by providing the laser processing machine 1 with the contact detection unit 50. It is not necessary to use a measuring instrument to calculate ΔX and ΔY, and it is not necessary to provide an expensive optical instrument. As a result, the laser beam machine 1, the control device 40, and the program PG1 can calculate the tool radius correction values ΔX and ΔY in a short time without increasing costs.

  Further, the laser beam machine 1, the control device 40, and the program PG1 according to the first embodiment determine the position of the machining head 20 when the tip 21 of the machining head 20 is brought into contact with the cut surfaces CSX1, CSX2, CSY1, and CSY2. Each cutting based on the coordinates X3 ′, X4 ′, Y3 ′, Y4 ′, which are positional information at the time of contact, and the distance d when the machining head 20 contacts each of the cutting surfaces CSX1, CSX2, CSY1, CSY2 Coordinates X3, X4, Y3, and Y4, which are cut surface position information indicating the positions of the surfaces CSX1, CSX2, CSY1, and CSY2, are calculated. The laser beam machine 1, the control device 40, and the program PG1 according to the first embodiment include coordinates X1, X2, Y1, and Y2 that are position information during processing, and coordinates X3, X4, Y3, and Y4 that are cutting surface position information. Since the tool radius correction values ΔX and ΔY are calculated based on the above, the tool radius correction values ΔX and ΔY can be accurately calculated.

  Moreover, since the laser beam machine 1, the control device 40, and the program PG1 according to the first embodiment calculate the tool diameter correction value ΔX in the X direction and the tool diameter correction value ΔY in the Y direction, Even if the shape differs from the Y direction, the part PT can be accurately cut from the workpiece W.

Embodiment 2. FIG.
Next, a laser beam machine 1 according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 9 is a diagram for explaining coordinates of a cut surface formed on the inner surface of the punched hole formed by the laser beam machine according to the second embodiment. In FIG. 9, the same parts as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 9, the laser beam machine 1 according to the second embodiment is different from the laser beam machine 1 except that a round hole 100-2 is formed in the workpiece W in order to calculate the tool radius correction value ΔD. 1 and the same processing as in the first embodiment is executed. In the laser beam machine 1 according to the second embodiment, the machining head 20 is applied to the cut surface CS formed on the inner surface of the punch hole 100-2 at every predetermined angle θ set around the center of the punch hole 100-2. The position of the cut surface CS is calculated by bringing the tip 21 into contact. The laser beam machine 1 according to the second embodiment calculates the position of the cutting plane CS and calculates tool diameter correction values ΔD1, ΔD2, ΔD3... ΔDN for each predetermined angle θ.

  As in the first embodiment, the laser beam machine 1, the control device 40, and the program PG1 according to the second embodiment contact the tip 21 of the machining head 20 with the cut surface CS formed on the inner surface of the punch hole 100-2. In order to calculate the tool diameter correction values ΔD1, ΔD2, ΔD3,..., DN for each predetermined angle θ, it is necessary to use a measuring device to calculate the tool diameter correction values ΔD1, ΔD2, ΔD3,. There is no need to provide expensive optical equipment. As a result, the laser beam machine 1, the control device 40, and the program PG1 can calculate the tool diameter correction values ΔD1, ΔD2, ΔD3,... ΔDN in a short time without increasing costs.

  Further, the laser beam machine 1, the control device 40, and the program PG1 according to the second embodiment form a circular punch hole 100-2, and the tool radius correction values ΔD1, ΔD2, ΔD3,... At each predetermined angle θ. Since ΔDN is calculated, the part PT can be accurately cut from the workpiece W even if the laser light L has an asymmetric shape with respect to the optical axis LP.

Embodiment 3 FIG.
Next, a laser beam machine 1 according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 10 is a cross-sectional view showing a state where the tip of the machining head of the laser beam machine according to Embodiment 3 is in contact with the cut surface of the punched hole. In FIG. 10, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The laser beam machine 1 according to the third embodiment has the same configuration as the first embodiment and performs the same processing as the first embodiment except that the shape of the tip 21 of the machining head 20-3 is different from that of the first embodiment. To do. As shown in FIG. 10, in the laser beam machine 1 according to the third embodiment, the width of the portion closer to the base end of the machining head 20-3 than the tip 21 of the machining head 20-3 is equal to that of the machining head 20-3. It is formed narrower than the width of the tip 21. The distal end 21 of the machining head 20-3 of the laser beam machine 1 according to Embodiment 3 is provided with a wide portion 23 that is formed wider than a portion near the proximal end. As shown in FIG. 10, the laser beam machine 1 according to the third embodiment causes the wide portion 23 provided at the tip 21 of the machining head 20-3 to contact the cut surface CS formed on the inner surface of the punch hole 100. Then, the position of the cutting plane CS is calculated, and the tool radius correction values ΔX and ΔY are calculated.

  Similarly to the first embodiment, the laser beam machine 1, the control device 40, and the program PG1 according to the third embodiment bring the tip 21 of the machining head 20-3 into contact with the cutting surface CS, and position the cutting surface CS. In order to calculate and calculate the tool radius correction values ΔX and ΔY, it is not necessary to use a measuring instrument to calculate the tool radius correction values ΔX and ΔY, and it is not necessary to provide an expensive optical instrument. As a result, the laser beam machine 1, the control device 40, and the program PG1 can calculate the tool radius correction values ΔX and ΔY in a short time without increasing costs.

  Moreover, since the laser beam machine 1, the control device 40, and the program PG1 according to the third embodiment are provided with the wide portion 23 at the tip 21 of the machining head 20-3, the wide portion at the tip 21 of the machining head 20-3. 23 can be brought into contact with the cut surface CS, and the position of the cut surface CS can be accurately calculated.

Embodiment 4 FIG.
Next, a laser beam machine 1 according to Embodiment 4 of the present invention will be described with reference to the drawings. FIG. 11 is a cross-sectional view showing a state in which the tip of the machining head of the laser beam machine according to Embodiment 4 is in contact with a portion of the cut surface near the surface of the workpiece. FIG. 12 is a cross-sectional view showing a state in which the tip of the machining head of the laser beam machine according to Embodiment 4 is in contact with a portion of the cut surface near the back surface of the workpiece. 11 and 12, the same parts as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The laser beam machine 1 according to the fourth embodiment has the same configuration as that of the first embodiment except that the shape of the tip of the machining head 20-4 is different from that of the first embodiment, as in the third embodiment. The same process as in the first mode is executed. As in the third embodiment, the laser beam machine 1 according to the fourth embodiment is provided with a wide portion 23 at the tip 21 of the machining head 20-4 as shown in FIGS. The surface WS of the workpiece W is a surface irradiated with the laser light L from the machining head 20-4, and the back surface WR of the workpiece W is processed by the laser light L penetrating the workpiece W. It is a surface that is ejected from the object W.

  As shown in FIG. 11, the laser beam machine 1 according to the fourth embodiment contacts the wide portion 23 provided at the tip of the machining head 20-4 with a location near the surface WS of the workpiece W on the cut surface CS. Thus, the position of the cut surface CS is calculated, and the tool radius correction values ΔX and ΔY near the surface WS of the workpiece W are calculated. In the laser beam machine 1 according to the fourth embodiment, as shown in FIG. 12, the wide portion 23 provided at the tip 21 of the machining head 20-4 is placed near the back surface WR of the workpiece W on the cut surface CS. The position of the cut surface CS is calculated by making contact, and the tool diameter correction values ΔX and ΔY near the back surface WR of the workpiece W are calculated. When the laser beam machine 1 according to the fourth embodiment processes the workpiece W, the tool radius correction values ΔX and ΔY near the front surface WS of the workpiece W and the tool radius near the back surface WR of the workpiece W are processed. An average value of the correction values ΔX and ΔY is used.

  As in the first embodiment, the laser beam machine 1, the control device 40, and the program PG1 according to the fourth embodiment bring the tip 21 of the machining head 20-4 into contact with the cutting surface CS, and position the cutting surface CS. In order to calculate and calculate the tool radius correction values ΔX and ΔY, it is not necessary to use a measuring instrument to calculate the tool radius correction values ΔX and ΔY, and it is not necessary to provide an expensive optical instrument. As a result, the laser beam machine 1, the control device 40, and the program PG1 can calculate the tool radius correction values ΔX and ΔY in a short time without increasing costs.

  In addition, since the laser processing machine 1, the control device 40, and the program PG1 according to the fourth embodiment calculate the average value of the tool radius correction values ΔX and ΔY, the part PT can be accurately cut from the workpiece W. it can.

  In the fourth embodiment, the cut surface CS is inclined so that the planar shape of the punch hole 100 on the surface WS side of the workpiece W is larger than the planar shape of the punch hole 100 on the back surface WR side. . In the present invention, the cut surface CS may be inclined so that the planar shape of the hole 100 on the front surface WS side of the workpiece W is smaller than the planar shape of the hole 100 on the rear surface WR side.

Embodiment 5 FIG.
Next, a laser beam machine 1 according to Embodiment 5 of the present invention will be described with reference to the drawings. FIG. 13 is a flowchart illustrating a process in which the control device for a laser beam machine according to the fifth embodiment calculates a tool radius correction value. FIG. 14 is a diagram for explaining the coordinates of the cut surface formed on the inner surface of the punched hole formed in the workpiece in step ST1 shown in FIG. FIG. 15 is a perspective view showing a state in which the tip of the machining head is opposed to the surface of the workpiece on which the hole is formed in step ST2-5 shown in FIG. 16 is a cross-sectional view of the workpiece and the tip of the machining head shown in FIG. FIG. 17 is a perspective view showing a state in which the tip of the machining head has entered the inside of the punched hole in step ST3-5 shown in FIG. 18 is a cross-sectional view of the workpiece and the tip of the machining head shown in FIG.

  The laser beam machine 1 according to the fifth embodiment uses the function as a copying unit of the control device 40 in place of the contact detection unit 50 of the laser beam machine 1 according to the first embodiment, and uses the cut surfaces CSX1, CSX2, and the like. Except for detecting the positions of CSY1 and CSY2, the same configuration as in the first embodiment and the same processing as in the first embodiment are executed.

  The control device 40 of the laser beam machine 1 according to the fifth embodiment is the same as the first embodiment when the correction value calculation unit 45 calculates the respective tool diameter correction values ΔX and ΔY in the X direction and the Y direction. In addition, a part of the workpiece W is cut to form a rectangular punched hole 100 at a position where the workpiece WB becomes the remaining material BM (step ST1). In step ST1, the control device 40 of the laser beam machine 1 according to the fifth embodiment, like the first embodiment, coordinates X1, X2, Y1, Y2 of the movement path K1, which is position information at the time of processing shown in FIG. Is calculated and acquired.

  As shown in FIG. 15, the control device 40 causes the tip 21 of the machining head 20 to face the surface WS where the punch hole 100 of the workpiece W is not formed (step ST2-5). At this time, as shown in FIG. 16, the control device 40 sets the distance LB between the surface WS of the workpiece W and the tip 21 of the machining head 20 to a distance determined by the machining conditions by the function of the copying portion. To do. The control device 40 moves the machining head 21 from the position where the tip 21 faces the surface WS of the workpiece W to the hole 100 along the surface WS, and moves the machining head 20 to each of the cut surfaces CSX1, CSX2, CSY1, and so on. It approaches CSY2 in order (step ST3-5). When the machining head 20 faces the punch hole 100 in the Z direction, the control device 40 uses the function of the copying unit based on the measurement result of the distance measurement unit 60, as shown in FIGS. The workpiece W is moved relative to the workpiece W in the Z direction, and the machining head 20 enters the inside of the punch hole 100. As shown in FIG. 18, the distance LB between the tip 21 of the machining head 20 and each of the cut surfaces CSX1, CSX2, CSY1, CSY2 is maintained at a distance determined by the machining conditions.

  Based on the amount of movement of the machining head 20 by the X-direction movement unit 31, the Y-direction movement unit 32, and the Z-direction movement unit 33 of the relative movement unit 30, the control device 40 uses the function of the copying unit and the machining head 20 and the workpiece. Calculate and obtain coordinates X3 ″, X4 ″, Y3 ″, Y4 ″ of the machining head 20 indicating the position of the machining head 20 with respect to the workpiece W when the W moves relative to the Z direction. To do. The coordinate in the Y direction of the first X-direction cut surface CSX1 is Y3, and corresponds to the Y-direction coordinate Y3 '' of the machining head 20 when approaching the first X-direction cut surface CSX1. The coordinate in the Y direction of the second X-direction cut surface CSX2 is Y4, and corresponds to the coordinate Y4 ″ in the Y direction of the machining head 20 when approaching the second X-direction cut surface CSX2. The X-direction coordinate of the first Y-direction cut surface CSY1 is X3, and corresponds to the X-direction coordinate X3 ″ of the machining head 20 when approaching the first Y-direction cut surface CSY1. The X-direction coordinate of the second Y-direction cut surface CSY2 is X4 and corresponds to the X-direction coordinate X4 '' of the machining head 20 when approaching the second Y-direction cut surface CSY2.

  Coordinates X3 ″, X4 ″, Y3 ″, Y4 ″ indicating the position of the processing head 20 with respect to the processing object W when the processing head 20 approaches each cut surface CSX1, CSX2, CSY1, CSY2 are: It is position information at the time of movement. That is, in step ST3-5, the Y-direction coordinate Y3 ″ of the machining head 20 when approaching the first X-direction cutting plane CSX1, and the Y-direction coordinate of the machining head 20 when approaching the second X-direction cutting plane CSX2. Y4 ″, X-direction coordinate X3 ″ of the machining head 20 when approaching the first Y-direction cutting plane CSY1, and X-direction coordinate X4 ″ of the machining head 20 when approaching the second Y-direction cutting plane CSY2. It is a position information calculation step at the time of movement for calculating.

  Based on the amount of movement of the machining head 20 by the X-direction movement unit 31, the Y-direction movement unit 32, and the Z-direction movement unit 33 of the relative movement unit 30 in step ST3-5, the control device 40 performs the machining object shown in FIG. A distance LC in the Z direction between the surface WS of the W and the tip 21 of the machining head 20, and a distance between the optical axis LP of the laser beam L in the machining head 20 and each of the cut surfaces CSX1, CSX2, CSY1, CSY2 d5 is calculated, and the position of each cut plane CSX1, CSX2, CSY1, CSY2 is calculated (step ST4-5).

  In step ST4-5, the control device 40 determines the Y direction of the first X-direction cut surface CSX1 based on the Y-direction coordinate Y3 ″ of the machining head 20 and the distance d5 when approaching the first X-direction cut surface CSX1. The coordinate Y3 is calculated. In the fifth embodiment, the control device 40 calculates that the Y-direction coordinate Y3 = Y3 ″ −d5 of the first X-direction cut surface CSX1.

  Similarly, in step ST4-5, the control device 40 determines the Y-direction coordinate Y4 ″ of the machining head 20 when approaching the second X-direction cutting plane CSX2, and the machining head when approaching the first Y-direction cutting plane CSY1. 20 based on the X direction coordinate X3 ″, the X direction coordinate X4 ″ of the machining head 20 when approaching the second Y direction cut surface CSY2, and the distance d5, the Y direction of the second X direction cut surface CSX2 The coordinate Y4, the X-direction coordinate X3 of the first Y-direction cut surface CSY1, and the X-direction coordinate X4 of the second Y-direction cut surface CSY2 are calculated.

  In the fifth embodiment, the control device 40 calculates that the Y-direction coordinate Y4 = Y4 ″ + d5 of the second X-direction cut surface CSX2 and the X-direction coordinate X3 = X3 ″ of the first Y-direction cut surface CSY1. -D5 is calculated, and the X-direction coordinate X4 = X4 '' + d5 of the second Y-direction cut surface CSY2 is calculated. The coordinates X3, X4, Y3, and Y4 of the cut surfaces CSX1, CSX2, CSY1, and CSY2 by the control device 40 are cut surface position information.

  The control device 40 is based on the coordinates X1, X2, Y1, Y2 of the movement path K1 that is position information at the time of processing, and the coordinates X3 ″, X4 ″, Y3 ″, Y4 ″ that are position information at the time of movement. Then, the tool radius correction values ΔX and ΔY are calculated (step ST5-5), and the process of the flowchart shown in FIG. In step ST5-5, the control device 40, based on the coordinates X1, X2, Y1, Y2 of the movement path K1, which is position information during processing, and the coordinates X3, X4, Y3, Y4, which are cutting surface position information, Similarly to the first embodiment described above, the tool radius correction values ΔX and ΔY are calculated using Equations 1 and 2.

  That is, in step ST5-5, the coordinates X1, X2, Y1, Y2 of the movement path K1 which is position information at the time of processing, and the coordinates X3 ″, X4 ″, Y3 ″, Y4 ″ which are position information at the time of movement. Is a tool radius correction value calculating step for calculating tool radius correction values ΔX and ΔY based on the above. The program PG1 stored in the storage unit 43 of the control device 40 is a program for causing the control device 40, which is a computer, to execute step ST1, step ST3-5, and step ST5-5. The laser beam machine 1 uses the tool radius correction values ΔX and ΔY when machining the workpiece W.

  The laser processing machine 1, the control device 40, and the program PG1 according to the fifth embodiment are processing position information indicating the position of the processing head 20 when the cut surfaces CSX1, CSX2, CSY1, and CSY2 are formed on the processing target W. And coordinates X3 ″, X4 ″, Y3 ″, Y4 which are position information at the time of movement indicating the position of the machining head 20 when the machining head 20 moves in the Z direction. Based on ″, tool radius correction values ΔX and ΔY are calculated. For this reason, since the laser processing machine 1, the control device 40, and the program PG1 can calculate the tool radius correction values ΔX and ΔY when the control device 40 functions as a copying unit, the tool radius correction values ΔX, It is not necessary to use a measuring instrument to calculate ΔY, and it is not necessary to provide an expensive optical instrument. As a result, the laser beam machine 1, the control device 40, and the program PG1 can calculate the tool radius correction values ΔX and ΔY in a short time without increasing costs.

  Further, the laser beam machine 1, the control device 40, and the program PG1 according to the fifth embodiment have coordinates X3 ″, which are position information at the time of movement indicating the position of the machining head 20 when the machining head 20 moves in the Z direction. Cut surface position information indicating the positions of the cut surfaces CSX1, CSX2, CSY1, CSY2 based on X4 ″, Y3 ″, Y4 ″ and the distance d5 when the machining head 20 moves in the Z direction. Certain coordinates X3, X4, Y3, and Y4 are calculated. The laser beam machine 1, the control device 40, and the program PG1 according to the first embodiment include coordinates X1, X2, Y1, and Y2 that are position information during processing, and coordinates X3, X4, Y3, and Y4 that are cutting surface position information. Since the tool radius correction values ΔX and ΔY are calculated based on the above, the tool radius correction values ΔX and ΔY can be accurately calculated.

  Further, the laser beam machine 1, the control device 40, and the program PG1 according to the fifth embodiment calculate the tool radius correction value ΔX in the X direction and the tool radius correction value ΔY in the Y direction. Even if the shape differs from the Y direction, the part PT can be accurately cut from the workpiece W.

  Next, the configuration of the control device 40 of the laser beam machine 1 according to each embodiment will be described. FIG. 19 is a diagram illustrating an example of a hardware configuration of a control device for a laser beam machine according to each embodiment. The control device 40 receives information on each part PT on the workpiece W and machining conditions from an input device 41 connected to the input / output interface 441 shown in FIG. The input device 41 is configured by a touch panel, a keyboard, a mouse, a trackball, or a combination thereof. The control device 40 displays information on each part PT in the workpiece W on the display device 42 connected to the input / output interface 441. In each embodiment, the display device 42 is a liquid crystal display device, but is not limited to a liquid crystal display device.

  As illustrated in FIG. 19, the control device 40 is a computer including a CPU (Central Processing Unit) 443, a memory 444, and an input / output interface 441. The memory 444 stores software, firmware, or a combination of software and firmware as a program PG. The program PG stored in the memory 444 includes a program PG1 for calculating tool radius correction values ΔX, ΔY, ΔD. In addition, the memory 444 stores information on the parts PT in the workpiece W input from the input device 41 and the processing conditions. The memory 444 is configured by a nonvolatile or volatile semiconductor memory, a magnetic disk, an optical disk, or a magneto-optical disk. As the nonvolatile or volatile semiconductor memory, RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), or EEPROM (Electrically Erasable Programmable Read-Only Memory) is used. It is done. In the control device 40, the CPU 443 executes the program PG stored in the memory 444 to realize the functions of the control unit 44 and the correction value calculation unit 45. The control device 40 realizes the function of the storage unit 43 by the memory 444.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

  DESCRIPTION OF SYMBOLS 1 Laser processing machine, 10 processing object support part, 20, 20-3, 20-4 processing head, 30 relative movement part, 40 control apparatus (correction value calculation apparatus, copying part, computer), 50 contact detection part, W Work object, L laser beam, CS, CSX1, CSX2, CSY1, CSY2 Cut surface, ΔX, ΔY, ΔD Tool radius correction value, d, d5 distance, X surface direction, first linear direction, Y surface direction, first 2 linear direction, Z thickness direction, X1, X2, Y1, Y2 machining position information, X3, X4, Y3, Y4 cut surface position information, X3 ′, X4 ′, Y3 ′, Y4 ′ contact position information, X3 ″, X4 ″, Y3 ″, Y4 ″ Movement position information, PG1 program, ST1 machining position information calculation step, ST3 contact position information calculation step, ST5 tool radius correction value calculation step.

Claims (9)

A laser processing machine that irradiates a processing target with laser light to process the processing target and forms a cut surface on the processing target,
A machining head for irradiating the workpiece with the laser beam;
And a correction value calculator for calculating a tool diameter correction value during pressure engineering using said cutting plane,
The correction value calculation device includes:
Processing position information indicating the position of the processing head relative to the processing target when the cut surface is formed on the processing target;
The processing head is brought close to the cutting surface from a state in which the tip of the processing head is positioned closer to the back surface of the processing object than the surface of the processing object, and the processing head comes into contact with the cutting surface. The laser processing machine, wherein the tool radius correction value is calculated on the basis of contact position information indicating a position of the processing head with respect to a processing target. The correction value calculation device includes:
Based on the position information at the time of contact and the distance between the optical axis of the laser beam when the processing head contacts the cutting surface and the position at which the processing head contacts the cutting surface, the cutting surface Calculate cut surface position information indicating the position,
The laser processing machine according to claim 1, wherein the tool radius correction value is calculated based on the processing position information and the cut surface position information. A laser processing machine that irradiates a processing target with laser light to process the processing target and forms a cut surface on the processing target,
A workpiece support section for supporting the workpiece,
A machining head for irradiating the workpiece with the laser beam;
A relative movement unit capable of relatively moving the processing head and the processing object support unit along the surface direction along the surface of the processing object and the thickness direction of the processing object;
A copying unit that moves the processing head and the processing object to a relative position in the relative movement unit, and maintains a constant distance between the processing object and the processing head;
And a correction value calculator for calculating a tool diameter correction value during pressure engineering using said cutting plane,
The correction value calculation device includes:
Processing position information indicating the position of the processing head relative to the processing target when the cut surface of the processing target is formed;
The processing target when the processing head is moved closer to the cutting surface from a position facing the surface of the processing target, and the processing head and the processing target are relatively moved in the thickness direction by the copying unit. The tool diameter correction value is calculated based on position information at the time of movement indicating the position of the machining head with respect to an object. The correction value calculation device includes:
A first linear direction is the front surface direction, claims and calculates each of the tool diameter correction value and the second linear direction crossing the a surface direction and the first linear direction Item 4. The laser beam machine according to item 2 or item 3. A correction value calculation device for calculating a tool diameter correction value at the time of processing of a laser processing machine that irradiates a laser beam from a processing head to form a cut surface on a processing object,
Processing position information indicating the position of the processing head relative to the processing target when the cut surface is formed on the processing target;
The processing head is brought close to the cutting surface from a state in which the tip of the processing head is positioned closer to the back surface of the processing object than the surface of the processing object, and the processing head comes into contact with the cutting surface. The correction value calculation apparatus characterized in that the tool radius correction value is calculated based on position information at the time of contact indicating a position of the processing head with respect to a processing object. Based on the position information at the time of contact and the distance between the optical axis of the laser beam when the processing head contacts the cutting surface and the position at which the processing head contacts the cutting surface, the cutting surface Calculate cut surface position information indicating the position,
The correction value calculation apparatus according to claim 5, wherein the tool radius correction value is calculated based on the processing position information and the cut surface position information. A correction value calculation device for calculating a tool diameter correction value at the time of processing of a laser processing machine that irradiates a laser beam from a processing head to form a cut surface on a processing object,
Processing position information indicating the position of the processing head relative to the processing target when the cut surface is formed on the processing target;
When the machining head is brought close to the cut surface from a position facing the surface of the workpiece, the machining head and the workpiece are relatively moved in the thickness direction by the copying unit of the laser beam machine. The correction value calculation device, wherein the tool radius correction value is calculated based on position information at the time of movement indicating the position of the processing head with respect to the processing object. A program for calculating a tool radius correction value at the time of processing of a laser processing machine that irradiates a laser beam from a processing head to form a cut surface on a processing object,
Processing position information calculation step for calculating processing position information indicating the position of the processing head with respect to the processing object when the cut surface is formed on the processing object;
The processing head is brought close to the cutting surface from a state in which the tip of the processing head is positioned closer to the back surface of the processing object than the surface of the processing object, and the processing head comes into contact with the cutting surface. A position information calculation step for contact that calculates position information for contact indicating the position of the processing head with respect to the processing object;
A tool radius correction value calculating step for calculating the tool radius correction value based on the processing position information and the contact position information;
A program that causes a computer to execute. The tool radius correction value calculating step includes:
Based on the position information at the time of contact and the distance between the optical axis of the laser beam when the processing head contacts the cutting surface and the position at which the processing head contacts the cutting surface, the cutting surface Calculate cut surface position information indicating the position,
The program according to claim 8, wherein the tool radius correction value is calculated based on the processing position information and the cut surface position information.

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