JP6062810B2 - Resin mold and resin mold apparatus - Google Patents

Description

  The present invention relates to a resin molding apparatus that clamps a workpiece and performs resin molding.

  The present applicant has already proposed a transfer molding apparatus capable of mass-producing a thin package without molding a resin-filled region by molding the package with a thickness as intended when sealing a thin semiconductor device with resin. .

  Specifically, the work carried into the mold is clamped by a clamper while keeping the retracted position in which the cavity piece is retracted by a predetermined thickness from the thickness dimension of the molded product, and the plunger is clamped while the clamper clamps the work. Operate to fill the cavity recess with molten resin to maintain the first holding pressure. After filling the resin, the cavity piece is further pushed into the cavity recess to the molding position corresponding to the thickness dimension of the molded product, and the excess resin in the cavity recess is pushed back from the gate to the pot side. Adjust the resin amount to match the size. Further, the sealing resin is heat-cured while operating the plunger again and maintaining the second holding pressure higher than the first holding pressure (Patent Document 1).

JP 2009-190400 A

  However, the mold used in Patent Document 1 described above is configured to clamp a workpiece with an upper die in which an upper die insert is movably provided and a lower die having a rigid structure on which a workpiece (substrate or the like) is placed. Therefore, there is no problem when the workpiece has a small variation in thickness, such as a single-layer substrate, but when the thickness variation is large, such as in a multilayer substrate, the clamping force between the clamper and the substrate varies. As a result, a flash flash of the mold resin is generated, and there is a possibility that the molding quality is deteriorated.

For example, in a product formed by exposing a workpiece from a mold resin, specifically, a product having a heat radiating portion, the molding quality may be deteriorated by the resin flash.
In addition, if the mold clamping force is increased in order to suppress the resin flash, excessive clamping stress may act on the workpiece and the workpiece may be damaged or damaged. Further, in the case of a thin product such as a memory, the molding thickness is affected by the thickness of the workpiece, and it may be difficult to uniformly mold the molding thickness.

  The present invention solves the above-mentioned problems of the prior art, and uses a resin mold that can be clamped without excessive stress acting on the workpiece, regardless of whether the workpiece thickness varies or not. It is an object of the present invention to provide a resin molding apparatus having a stable mold clamping balance and improved molding quality free from flash flash.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, a resin mold for resin molding a work having a second member mounted on a first member, the cavity piece forming the bottom of the cavity, and the first insert disposed around the cavity piece, cavities are formed to constitute a cavity in which the second member is accommodated, while the surrounding pressing surface of the first member is formed on the convex surface portion of the cavity piece is that is formed uneven surface recessed groove part is formed The mold, the workpiece support part for supporting the workpiece, the other mold having a second insert adjacent to the workpiece support part, and either the one mold or the other mold. a pot and the plunger for supplying the molding resin, the cavity in accordance with the height of the second member by relatively moving the cavity piece in the mold opening and closing direction A cavity height variable mechanism that makes the height of the part variable, and by moving the work support part in the mold opening / closing direction with respect to the second insert, the work support part has a thickness that matches the thickness of the first member. A plate thickness variable mechanism that varies the height, and adjusts the height of the workpiece support portion by the plate thickness variable mechanism in accordance with the thickness of the first member and the first insert by the first insert. By clamping one member, the cavity piece is relatively moved by the cavity height changing mechanism, and the convex surface portion formed on the pressing surface presses the exposed surface of the two members into the surrounding concave groove portion. It is characterized by being filled with a mold resin and resin-molded .

If the above resin mold is used, the workpiece support portion and the cavity concave portion of all workpieces (first member, second member) regardless of whether the thickness in the mold opening / closing direction varies or not. Since the height is adjusted, excessive stress does not act on the workpiece, and it is possible to stabilize the mold clamping balance and prevent the occurrence of a resin flash beam.
In this case, for example, the light emitting surface of the semiconductor chip is exposed by being pressed by the convex portion of the cavity piece, and a concave groove surrounding the periphery is filled with a low viscosity silicone resin (white resin), and a reflector surrounding the light emitting surface is efficiently transferred by transfer molding. Can be molded well. Further, if the semiconductor chip is flip-chip mounted, underfill molding can be performed by introducing a molten resin between the substrate and the substrate.

The cavity height variable mechanism may be provided with a wedge mechanism that adjusts the position of the cavity piece in the mold opening / closing direction by moving a movable taper block by a driving source.
In this case, the position control of the cavity piece in the mold opening and closing direction can be made highly accurate, so the stress acting on the workpiece (second member) can be reduced as much as possible during mold clamping, and high-precision molding quality Can be maintained.

In the cavity height varying mechanism, one or both of the cavity piece and the first insert may be floatingly supported on the one mold chase.
In this case, the cavity depth (height from the substrate to the cavity piece) can be changed instantaneously by adjusting the float amount of the cavity piece and / or the first insert in accordance with the mold opening / closing operation. In particular, even if there is a variation in the height position of the second member from the first member, resin mold differences can be absorbed by the cavity structure and / or the float structure of the first insert.

Further, the plate thickness variable mechanism may be provided with a wedge mechanism that adjusts the position of the workpiece support portion in the mold opening / closing direction by moving the movable taper block by a drive source.
In this case, since the position control in the mold opening / closing direction of the work support portion can be made highly accurate, the stress acting on the work (first member) at the time of mold clamping can be reduced as much as possible. Molding quality can be maintained.

Further, it is preferable that a dummy cavity is provided on the clamping surface of the first insert, and the surplus resin is accommodated in the dummy cavity from the cavity recess.
Thereby, the void generated in the mold resin filled in the cavity concave portion can be pushed to the dummy cavity to improve the molding quality. In particular, it is possible to improve resin filling properties when performing underfill molding.

Moreover, you may provide the closing means which stops discharge | emission of air by pressing the clamp surface which opposes an outer peripheral side from the said dummy cavity of said 1st insert.
In this case, it is possible to prevent the leakage of the resin from the dummy cavity and the unfilling of the resin in the cavity by stopping the discharge of the air from the decompression space at the desired timing.

Before the one mold and the other mold are closed, a closed space that is cut off from the external space is formed, and a reduced pressure space including the cavity is formed by reducing the pressure in the closed space. It is desirable to have a mechanism.
As a result, the air remaining in the cavity is exhausted, and voids are less likely to occur in the mold resin.

In addition, a through hole that accommodates the second member and a resin path that communicates with the through hole are formed, and the other member straddling the gap between the first member outer peripheral end supported by the work support portion and the second insert. You may provide the intermediate | middle plate used overlapping with a metal mold | die clamp surface.
In this case, gold plating for the runner is not required on the first member (for example, the substrate), and even if a mold resin with a fine filler and a low viscosity is used, the mold resin is placed in the gap between the first member and the mold. There is no risk of spilling and causing poor sliding of the mold.

In addition, a dummy cavity may be provided on the outer peripheral side of the first member of the intermediate plate, and the excess resin may be accommodated in the dummy cavity from the through hole. In this case, if the dummy cavities are formed on the outer peripheral side of the first member, the number of molded products on the first member (for example, the substrate) can be increased to improve the utilization rate of the substrate.
Moreover, if the dummy cavity is formed in the through hole that penetrates the intermediate plate, the unnecessary resin can be easily released.

In addition, a swivel mechanism may be provided in which the cavity piece can be tilted by being guided by a guide surface portion of a guide piece that is disposed opposite to the work contact surface of the cavity piece that contacts the second member.
As a result, even if the second member (for example, a semiconductor chip) mounted on the first member (for example, the substrate) is tilted, the second member (for example, the semiconductor chip) follows the tilt of the second member without coming into contact with the cavity piece and the release film. Since the cavity piece is tilted, excessive stress does not act on the second member, and there is no possibility that the second member is damaged or broken.

  Also, if a release film that covers and holds the one mold clamping surface including the cavity recess is provided, the mold resin does not come into direct contact with the cavity recess, so that mold maintenance can be reduced. And resin leakage can be prevented. Moreover, it can prevent that a workpiece | work surface is damaged because the cavity piece which forms a cavity bottom part contact | abuts to a workpiece | work via a release film.

The resin mold apparatus includes any of the resin molds described above, a workpiece supply unit, a press unit that clamps the workpiece with the resin mold die and resin molds, a molded product storage unit, And clamping the first member with the first insert, the convex portion formed on the pressing surface of the cavity piece presses the exposed surface of the two members , and the surrounding concave groove portion is filled with mold resin. It is characterized by Rukoto.
If the said resin mold apparatus is used, when clamping a resin mold metal mold | die, the stress which acts on the 1st member which is a workpiece | work, or a 2nd member can be reduced as much as possible.

A liquid resin supply unit may be provided adjacent to the press unit, and the supply resin may be moved back and forth in the pot of the mold mold opened by the press unit to supply the liquid resin. In this case, flip chip mounted semiconductor chip underfill molding using a low viscosity epoxy-based liquid resin can be realized by transfer molding, or the molding quality of LEDs, reflectors, etc. with a low viscosity silicone resin can be improved. To extend the service life.
In addition, not only liquid resin but tablet resin may be sufficient.

  By using the above-described present invention, a resin mold die that can be clamped without excessive stress acting on the workpiece regardless of whether the workpiece thickness varies or not is provided. It is possible to provide a resin molding apparatus that has a stable fastening balance and has improved molding quality that does not cause resin flash flash.

It is a layout block diagram of the resin mold apparatus which concerns on Example 1. FIG. FIG. 5 is a mold cross-sectional view illustrating a molding operation of the mold according to the first embodiment. FIG. 3 is a mold cross-sectional view illustrating a molding operation of a mold after FIG. 2. FIG. 4 is a mold cross-sectional view illustrating a molding operation of a mold after FIG. 3. FIG. 6 is a mold cross-sectional view illustrating a molding operation of a mold according to Example 2. FIG. 9 is a mold cross-sectional view illustrating a molding operation of a mold according to Example 3. 10 is a mold cross-sectional view illustrating a molding operation of a mold according to Example 4. FIG. 10 is a mold cross-sectional view illustrating a molding operation of a mold according to Example 5. FIG. 10 is a mold cross-sectional view illustrating a molding operation of a mold according to Example 6. FIG. It is a layout block diagram of the resin mold apparatus which concerns on Example 7. FIG. It is a metal mold sectional view explaining liquid resin supply operation of a mold metallic mold concerning Example 7.

  Hereinafter, a preferred embodiment of a resin mold device according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, a transfer molding apparatus using a molding die in which a cavity recess is formed on the upper mold side and a pot is formed on the lower mold side will be described as an example. In the transfer molding apparatus, the lower mold is described as a movable mold and the upper mold is described as a fixed mold.

[Example 1]
As shown in FIG. 1, the resin molding apparatus of this embodiment includes a workpiece supply unit A, a preheating unit B for preheating the workpiece, a press unit C for resin molding the workpiece, a molded product storage unit D after the resin molding, and a transport mechanism. E is provided. The press part C includes a press device equipped with a mold for clamping a workpiece and resin molding. The conveyance mechanism E carries in the conveyance action which carries in a workpiece | work to the press part C, and carries out a molded article from the press part C. FIG.

(Work supply part A)
In FIG. 1, a workpiece supply unit A includes a stocker that stores a magazine that stores, for example, a substrate (lead frame, resin substrate, etc.) 1 formed in a strip shape. The substrates 1 cut out by pushers from each magazine are arranged facing the set table 2 in pairs, for example. Note that the substrate 1 may be rearranged so as to face the turntable by a pusher from a magazine in which the substrates 1 are aligned and stored in one direction, and the substrate 1 may be transferred from the turntable to the set table 2.

  A tablet supply unit 4 for supplying the resin tablet 3 in accordance with the planar arrangement of the mold mold pot is provided on the side of the set table 2. The substrate 1 of the set table 2 is held by a transfer mechanism E (loader 16) described later and transferred to the preheating unit B. The resin tablet 3 of the tablet supply unit 4 is held by the loader 16 and transferred to the press unit C.

  The workpiece (molded product) that is the object of the resin mold corresponds to the “first member” of the present invention. For example, the semiconductor chip 5 corresponds to the “second member” of the present invention on the substrate 1 formed in a strip shape. Is a product mounted (flip chip mounting, wire bonding mounting, etc.) (see FIG. 2B). In addition, the product in which the semiconductor chip 5 is mounted on the substrate 1 in one or more stages, the product in which the semiconductor device is mounted on the substrate 1, the image sensor is mounted on the substrate 1, and the light transmitting glass is bonded to the light receiving surface of the image sensor. Products that have been purchased are also covered. In addition, as the “first member” in the present invention, various plate-like members such as a resin substrate, a ceramic substrate, a metal substrate, a lead frame, a carrier, and a wafer can be used. As the “second member” in the present invention, in addition to the semiconductor chip, various members such as a heat sink, wiring, a lead frame used for heat dissipation, and an electronic component such as a bump for electrical connection are used. be able to. Therefore, the “workpiece” in the present invention refers to a state in which the “second member” is mounted on and superposed on these “first members”. Resin molds may be individually molded in a cavity for each individual mounted component, or multiple mounted components mounted on a substrate may be accommodated in a single cavity and molded in a batch There is also. By these structures, it can also seal so that the end surface of a 1st member and the end surface of a 2nd member may be exposed by performing the resin mold mentioned later.

(Preheating part B)
The substrate 1 supplied from the workpiece supply unit A is transferred from a measurement table to a heater block (not shown) provided in the preheating unit B by a loader 16 in a transport mechanism E described later. The heater block preheats to a predetermined temperature while the substrate 1 is placed. It is preferable that the heater block is configured to suppress the influence on other units by covering the periphery thereof with an openable cover. The preheated substrate 1 is held by the loader 16 and conveyed to the press section C.

(Press part C)
The pressing part C includes a pressing device 6 that clamps a preheated work by driving the mold 19 (see FIG. 2A) to open and close and molds the resin. The press device 6 has a press mechanism that pushes a mold 19 to be described later in the mold opening / closing direction, and resin melted in the pot 35 of the mold 19 from the pot 35 to the cavity recess 32 (see FIG. 2A). A transfer mechanism for filling is provided.

  The pressing device 6 pushes the cavity height variable mechanism that pushes the cavity piece 23 (see FIG. 2A) in the mold opening / closing direction and the workpiece support portion 37 (see FIG. 2A) in the mold opening / closing direction. A plate thickness variable mechanism is provided. The cavity height variable mechanism includes an upper mold drive unit 7 that relatively changes the height of the cavity recess by pushing the upper mold insert member (cavity piece 23) in the mold opening and closing direction, for example. This upper mold drive unit 7 has servo motors 31 described later as many as the number of cavities provided for one substrate (in other words, the number of cavity pieces 23), and the height of the cavities can be individually adjusted. It is configured. Therefore, when a plurality (for example, three) of resin-sealed regions are formed on the rectangular substrate 1, the same number (three in this case) of servo motors 31 and a drive mechanism described later may be provided.

  Further, the plate thickness variable mechanism includes a lower mold drive unit 8 that pushes the lower mold insert member (work support unit 37) in the mold opening / closing direction (see FIG. 2A). Depending on the workpiece 1, before the mold resin is injected into the cavity, the operation amounts of the cavity height variable mechanism and the plate thickness variable mechanism are adjusted so that the height position of the cavity recess 32 in the mold opening / closing direction becomes a relatively predetermined position. Set as follows. That is, before the mold resin is injected into the cavity, the cavity height variable mechanism is set according to the height of the semiconductor chip 5 and the plate thickness variable mechanism is set according to the thickness of the substrate 1.

  In the present embodiment, a method is used in which the mold surface (resin mold surface) of the mold is covered with the release film 10 and resin molded. For this reason, the press apparatus 6 includes a film supply mechanism 9 that supplies the release film 10 to the mold surface of the mold. The film supply mechanism 9 includes a supply roll 9 a that supplies the release film 10 to the mold surface (upper mold surface) and a take-up roll 9 b that winds the release film 10 on both sides of the mold. However, a configuration in which the mold surface of the mold is not covered with the release film 10 may be adopted. A configuration without the release film 10 may be employed. For example, a resin or metal ring-shaped seal member is disposed on the outer periphery of the cavity piece 23, and the resin leaks from this gap by eliminating the gap with the upper mold insert block 26, which will be described later, due to thermal expansion of the seal member. May be prevented.

(Molded product storage D)
The molded product storage unit D stores a set unit 12 for setting a molded product 11 after resin molding, a gate break unit 13 for removing unnecessary resin such as a gate from the molded product 11, and a molded product 11 from which unnecessary resin is removed. A storage unit 14 is provided. The molded product 11 is stored in a magazine 15 for storage, and the magazine 15 in which the molded product is stored is sequentially stored in a stocker.

(Transport mechanism E)
The transport mechanism E includes a loader 16 that loads a workpiece into the press section C and an unloader 17 that unloads the molded product 11 from the press section. The workpiece supply unit A, the preheating unit B, the press unit C, and the molded product storage unit D are assembled as a resin molding apparatus by connecting unitized bases. Guide units 18 are provided on the back side of each unit, and guide rails are formed by assembling the guide units 18 so as to be linearly connected. The loader 16 and the unloader 17 are provided so as to reciprocate along the guide rail. The loader 16 and the unloader 17 are provided so as to be linearly movable from a predetermined position on the guide portion 18 toward the workpiece supply portion A, the preheating portion B, the press portion C, and the molded product storage portion D.

  Therefore, by changing the configuration of the unit, the configuration mode of the resin mold apparatus can be changed while maintaining the state where the guide portions 18 are connected to each other. For example, the example shown in FIG. 1 is an example in which two press devices 6 are installed, but it is also possible to configure a resin mold device in which a single press device or a plurality of three or more press devices 6 are connected. Similarly, it is good also as a structure provided with multiple liquid resin supply part F mentioned later.

  An outline of the resin mold operation will be described. The workpiece (substrate 1) set on the setting table 2 in the workpiece supply section A moves to the preheating section B along the guide section 18 while being picked up and held by the loader 16, and is preheated before being molded with resin. The

  On the other hand, in parallel with the operation in which the unloader 17 takes out the molded product 11 after the resin molding from the pressing device 6, the loader 16 moves on the guide rail and picks up the resin tablet 3 from the tablet supply unit 4, and also the preheating unit B. Then, the substrate 1 is taken up. Subsequently, the loader 16 moves to the side of the press device 6, enters the press device 6, and supplies the substrate 1 and the resin tablet 3 to a mold die that is opened. The substrate 1 and the resin tablet 3 are heated by a heater (not shown) provided in the mold. After the loader 16 is withdrawn from the press device 6, the work is clamped by the mold 19 (see FIG. 3C), and the cavity recess 32 that accommodates the semiconductor chip 5 and forms the cavity (see FIG. 3D). The melted mold resin is filled in and the semiconductor chip 5 is resin-molded.

  After the resin molding, the unloader 17 enters the mold mold opened from the side of the press device 6, picks up the molded product, and carries the molded product 11 out of the press device 6. The unloader 17 is moved along the guide rail and transferred to the set unit 12 of the molded product storage unit D, and then transferred from the set unit 12 to the gate break unit 13 for gate break. Unnecessary resin is removed, and the molded product 11 is stored in the storage unit 14. In addition, when using liquid resin as mold resin, the thickness measurement part of the molded article 11 is provided, the thickness of the resin mold part is measured, and the supply amount is adjusted based on the measurement result of the thickness of the resin mold part. You can also.

As described above, the substrate 1 is sequentially supplied from the workpiece supply unit A, the substrate 10 is resin-molded in the press unit C, and the molded product 11 is stored in the molded product storage unit D.
In the resin molding apparatus according to the present embodiment, the mold is driven so as to be clamped in accordance with the thickness of the workpiece (the substrate 1 and the semiconductor chip 5), and then the resin mold is performed. Resin molding can be performed with high accuracy without reducing the acting stress as much as possible and generating a resin beam.

Next, the structure of the mold die provided in the resin mold apparatus will be described with reference to FIG. The mold 19 includes an upper mold 20 (one mold) and a lower mold 21 (the other mold).
The configuration of the upper mold 20 will be described with reference to FIG. In the upper mold 20, a cavity piece 23 that forms a cavity bottom portion on an upper mold chase block 22 is suspended and supported via a spring 24. A taper surface 23 a is formed on the surface of the cavity piece 23 opposite to the work contact surface. The cavity piece 23 is supported so that the taper surface 23a overlaps the taper surface 25a of the first movable taper block 25 provided between the cavity piece 23 and the upper chase block 22 (wedge mechanism).

  Further, an upper mold insert block 26 (first insert) is supported on the upper chase block 22 in a rigid shape. The cavity piece 23 is suspended and supported by being inserted into the through hole 26a so as to form the bottom of a cavity recess formed in the upper mold insert block 26. Further, the cavity piece 23 may be supported by the first movable taper block 25 in a state where the spring 24 is extended from the natural length (a state in which a restoring force is applied). In this case, the cavity piece 23 is rigidly supported by contacting the first movable taper block 25 and the tapered surfaces. In the upper mold insert block 26, dummy cavities 26e are engraved on resin paths and upper mold clamping surfaces such as the recess 26b forming the cavity recess 32, the upper mold cull 26c, and the upper mold runner 26d. Note that the depth of the groove (through gate) connecting the dummy cavity 26e and the cavity recess 32 is the gap between the flip-chip mounted semiconductor chip 5 and the substrate 1 (in other words, the underfilled portion). It can be formed narrower than. In this case, the underfill under the semiconductor chip 5 can be prioritized over the resin filling of the dummy cavity 26e, which is preferable. Further, an upper mold seal ring 27 is provided for closing a gap between the outer surface of the upper mold insert block 26 and the inner wall surface of the upper mold chase block 22 facing the outer circumferential surface. The upper mold seal ring 27 is provided in order to realize different functions by two pressure reducing devices 29 and 58 described later. That is, it is provided to separate the suction of the release film 10 by the upper mold seal ring 27 and the space for decompressing the cavity by the decompression device 58.

  An upper mold suction path 28 is provided in the upper mold chase block 22. The upper mold suction path 28 is connected to a decompression device 29. The upper mold chase block 22 and the upper mold insert block 26, the upper mold insert block 26 and the cavity piece 23, and the suction hole (not shown) formed in the clamp surface of the upper mold insert block 26 are the upper mold. Connected to the suction path 28 and connected to the decompression device 29. The release film 10 is sucked and held on the upper mold clamping surface including the cavity piece 23 by a suction hole (not shown) formed in the upper mold clamping surface and a suction mechanism using a gap between the cavity piece 23 and the upper mold insert block 26. Is done. The release film 10 has heat resistance that can withstand the heating temperature of the mold 19 and is easily peeled off from the mold surface, and is a film material having flexibility and extensibility, such as PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidyne chloride and the like are preferably used.

  The first movable taper block 25 is formed with a taper surface 25 a having a predetermined inclination angle so that the plate thickness decreases (or increases) toward the cavity piece 23. The first movable taper block 25 is connected to the servo motor 31 via the screw shaft 30 (upper die drive unit 7). When the servo motor 31 is activated in a predetermined direction, the first movable taper block 25 that is screwed through the screw shaft 30 moves forward and backward along the bottom of the upper chase block 22. Thereby, the cavity piece 23 can adjust the height position (upper surface part) of the mold opening / closing direction of the cavity recess 32 via the release film 10. The servo motor 31 can be arranged separately from the mold wall surface heated in the upper mold 20. Further, the servo motor 31 may be configured to be able to be disconnected from the screw shaft 30 as necessary in order to prevent heating by the mold and improve maintainability.

  Next, the configuration of the lower mold 21 will be described with reference to FIG. The lower mold 21 is a known type that moves up and down a lower mold movable platen on which the lower mold chase block 33 is placed via a drive transmission mechanism (link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor). The mold is opened and closed by a mold clamping mechanism. Further, it is possible to correct the inclination of the lower movable platen relative to the fixed platen that supports the upper die by supporting the corners of the lower movable platen by three or more ball screw mechanisms and finely adjusting the driving amount. . In these cases, the raising / lowering operation of the lower die 21 can arbitrarily set the moving speed, the applied pressure, and the like, and the mold resin is filled with the mold resin into the cavity recess 32 and the operation of pushing back the surplus resin described later from the cavity recess 32 The flow rate and resin pressure of the resin can be set arbitrarily. For this reason, since these can also be controlled by the mold clamping mechanism, the apparatus configuration can be simplified.

  A lower insert block 34 (second insert) is assembled to the lower chase block 33. A cylindrical pot 35 in which a mold resin (resin tablet 3) is loaded is assembled at the center of the lower mold insert block 34. The upper end surface of the lower mold insert block 34 is formed flush with the upper end surface of the pot 35. A plunger 36 that moves up and down by a known transfer drive mechanism is provided in the pot 35. The plunger 36 is a multi-plunger in which a plurality of plungers 36 are provided on a support block (not shown) corresponding to the plurality of pots 35. An elastic member (not shown) is provided on the support portion of each plunger 36, and each plunger 36 is slightly displaced by the elasticity of the elastic member to release an excessive pressing force, and adapts to variations in the resin amount of the tablet during holding. Can be done.

  On the upper surface of the lower die chase block 33, workpiece support portions 37 on which workpieces are placed are provided adjacent to both sides of the lower die insert block 34, respectively. As the workpiece, a single-sided mold product in which the semiconductor chip 5 is mounted on one side of the substrate 1 is used. The work support portion 37 is floatingly supported by a spring 38 provided between the upper surface of the lower chase block 33.

  A fixed taper block 57 and a second movable taper block 39 are overlapped between the work support portion 37 and the lower chase block 33. The taper surface 57a formed on the lower surface of the fixed taper block 57 and the taper surface 39a formed on the upper surface of the second movable taper block 39 are overlapped and supported on the lower chase block 33 (wedge mechanism). ). The work support portion 37 can be configured to be supported in a state where the spring 38 is contracted from its natural length (a state in which an elastic force is applied). The second movable taper block 39 is connected to the servo motor 41 via the screw shaft 40 (lower mold drive unit 8). When the servo motor 41 is activated in a predetermined direction, the second movable taper block 39 that is screwed through the screw shaft 40 moves forward and backward along the bottom of the lower chase block 33. Accordingly, the position of the workpiece support portion 37 in the mold opening / closing direction can be adjusted according to the thickness of the workpiece (substrate 1), for example, so that the upper surface of the substrate is substantially flush with the lower mold clamping surface. . That is, regardless of the thickness of the substrate 1, the upper surface of the substrate 1 is raised from the lower mold clamping surface by the same amount, so that an appropriate clamping state can be achieved in which resin leakage can be prevented without damaging the substrate 1. Although the work support portion 37 is rigidly supported by the fixed taper block 57, a gap may be formed between the work support portion 37 and the fixed taper block 57. In this case, the substrate 38 can be clamped without applying an excessive clamping force by the deflection of the spring 38. In addition, according to the thickness of a workpiece | work (board | substrate 1), the board | substrate thickness can also be adjusted by exchanging the workpiece | work support part 37 from which thickness differs. Furthermore, the workpiece support portion 37 can be provided with a suction structure (not shown). In this case, even if the substrate 1 is likely to be distorted by being preheated, it may be clamped in a state of being held flat by being attracted to the work support portion 37. Thereby, even the substrate 1 that is thin and easily warps can be reliably held and clamped without being displaced.

  Further, a lower mold seal ring 42 is provided at the outer peripheral position of the lower mold chase block 33 (lower mold 21). The lower chase block 33 is provided with a lower suction path 43. The lower mold suction path 43 is connected to a decompression device 58. The lower mold suction path 43 opens to the inner peripheral side from the lower mold seal ring 42. When the mold 19 is closed, the upper mold chase block 22 and the lower mold chase block 33 sandwich the lower mold seal ring 42, and the outer periphery is closed between the upper mold 20 and the lower mold 21. A space is formed. When the decompression device 58 is activated, a decompression space is formed through the lower mold suction path 43.

  Here, the opening / closing operation associated with the resin molding operation of the mold 19 will be described with reference to FIGS. FIG. 2A shows a state where the mold 19 is opened. The decompression device 29 is operated on the upper clamp surface to hold the release film 10 by suction. In the present embodiment, for example, the amount of operation of the cavity height variable mechanism and the plate thickness variable mechanism is finely adjusted before closing the mold 19 according to the thickness of the workpiece (substrate 1 and semiconductor chip 5).

That is, the servo motor 31 is activated in accordance with the height of the semiconductor chip 5 and the first movable taper block 25 is slid (moved or retracted) to either one through the screw shaft 30 so that the cavity piece 23 becomes the semiconductor chip. 5 is adjusted to a height position where pressing can be performed without applying excessive stress.
Further, the servo motor 41 is activated in accordance with the thickness of the substrate 1 and the second movable taper block 39 is slid (moved or retracted) to either one through the screw shaft 40 so that the work support portion 37 is moved to the substrate 1. Adjust the height so that it can be clamped without excessive stress.

  Next, in FIG. 2 (B), the work is supplied to the lower mold 21 of the mold mold 19 opened by the loader 16 (see FIG. 1). That is, the substrate 1 on which the semiconductor chip 5 is mounted is loaded into the work support portion 37, and the resin tablet 3 is loaded into the pot 35. At this time, since the workpiece support portion 37 has been adjusted in thickness by the lower die driving portion 8 in advance, the substrate 1 is supported so as to be substantially flush with the lower die clamping surface. The semiconductor chip 5 may be mounted by wire bonding. In this case, the cavity piece 23 is formed in a protruding shape so that it can be clamped against the inner flat portion of the semiconductor chip 5 where the wire is bonded, so that even if the workpiece is mounted by wire bonding, the semiconductor chip 5 is clamped. Can be molded.

  Next, in FIG. 3C, the lower mold 21 is raised and the mold 19 is closed. At this time, prior to the mold clamping operation or when the clamping operation is started, the decompression device 58 may be activated to start the suction operation from the lower mold suction path 43. When the upper mold chase block 22 contacts the lower mold seal ring 42, a closed space is formed between the upper mold 20 and the lower mold 21, and a decompression space is formed by a suction operation from the lower mold suction path 43.

  When the clamping operation further proceeds, the upper mold insert block 26 contacts the lower mold insert block 34 and the substrate 1 via the release film 10, and the cavity piece 23 contacts the semiconductor chip 5 via the release film 10, the clamp The operation is complete. Note that the operation amounts of the cavity height variable mechanism and the plate thickness variable mechanism may be finely adjusted after the mold 19 is closed.

  Next, in FIG. 3D, the transfer mechanism is actuated to push up the plunger 36 and press the molten mold resin into the cavity recess 32 through the upper die 26c and the upper die runner 26d. At this time, since the upper surface of the semiconductor chip 5 is pressed by the cavity piece 23, underfilling can be performed by introducing a molten resin between the semiconductor chip 5 and the substrate 1 if the semiconductor chip 5 is flip-chip mounted. That is, mold underfill (MUF) for underfilling in the mold 19 can be performed. In addition, even if there is a void in the molten resin filled in the region immediately below the semiconductor chip 5 to be underfilled, the mold resin overflows from the cavity recess 32 to the dummy cavity 26e, so that the void is pushed away and the resin filling property in the cavity is improved. Can be made. The air bubbles mixed in the mold resin may be made to flow preferentially over the resin, overflow, and then discharged to a decompressed space through an air vent (not shown) and sucked from the lower mold suction path 43 and exhausted. In addition, the operation of the plate thickness varying mechanism can push the mold resin into the dummy cavity 26e through the groove portion having a uniform depth regardless of the thickness of the substrate 1. That is, depending on the material of the substrate 1, it is possible to prevent a situation in which the substrate 1 is deformed by the clamping force and rises in the groove portion and narrows the cross-sectional area. Therefore, even if the thickness varies from workpiece to workpiece, it is possible to prevent resin leakage while reliably overflowing the mold resin into the dummy cavity 26e. Therefore, voids can be reliably discharged regardless of the workpiece thickness, and the molding quality can be improved. It is possible to stabilize.

  FIG. 4E shows a process of not only performing mold underfill of the semiconductor chip 5 mounted on the substrate 1 but also overmolding without exposing the semiconductor chip 5. This step can be arbitrarily performed according to the product requirements of the workpiece. In FIG. 3D, if the semiconductor chip 5 is flip-chip mounted, after underfill molding is performed, that is, after the mold resin overflows into the dummy cavity 26e, the upper die driving unit 7 is activated to start the cavity. The piece 23 is raised to increase the volume of the cavity recess 32. Specifically, the servo motor 31 is activated and the first movable taper block 25 is slid in the direction of retracting from the planar position of the cavity piece 23 through the screw shaft 30. As a result, the cavity piece 23 rises along the inclination of the tapered surface 25a, and a gap (cavity volume) is formed between the semiconductor chip 5 and the mold resin is filled. By performing the overmolding process after performing the underfill process in advance as described above, unfilling in the underfill can be more reliably prevented as compared with the case where these processes are performed simultaneously.

  In addition, in order to further improve the filling property in the underfill, the vertical movement of the cavity piece 23 may be repeated. In this case, the servo motor 31 is driven to rotate forward and backward, and the first movable taper block 25 is moved forward and backward through the screw shaft 30, that is, the states shown in FIGS. 3D and 4E are repeated. At the same time, the resin may be pushed back from the cavity recess 32 toward the pot 35 by repeatedly moving the plunger 36 up and down. Thereby, it becomes easy to fill the space part which is a clearance gap by increasing the flow amount of mold resin. In addition, when using the structure which makes the height of the cavity piece 23 variable by mold | die closing operation | movement like the below-mentioned Example, it can repeat rapidly and can perform high filling property in a short time. .

  When the mold 19 is used, even if the thickness of the substrate varies, the height position of the work support portion 37 is changed by the plate thickness adjusting mechanism so that the upper surface of the substrate 1 coincides with the mold clamp surface. The height of the cavity piece 23 can be adjusted by the cavity piece adjusting mechanism even if the height of the semiconductor chip 5 (including the stacked height) from the substrate 1 varies from workpiece to workpiece. By changing, the molding thickness can be adjusted to be constant.

Therefore, regardless of the presence or absence of variation in the thickness direction of the workpiece (substrate 1 or semiconductor chip) and the amount of variation, excessive stress is not applied to the workpiece, and the clamping balance can be stabilized and clamped. If a wedge mechanism for adjusting the position in the mold opening / closing direction is provided in both the cavity piece 23 and the work support part 37, the position control in the mold opening / closing direction of the cavity piece 23 and the work support part 37 can be made highly accurate. As a result, the stress acting on the workpiece during mold clamping can be reduced as much as possible, and high-precision molding quality can be maintained.
In addition, the void generated in the mold resin filled in the cavity recess 32 can be pushed to the dummy cavity to improve the molding quality. In particular, it is possible to improve resin filling properties when performing underfill molding.
Therefore, it is possible to provide a resin mold apparatus having a uniform molding thickness and no flash flash and having improved molding quality.

[Example 2]
Next, another example of the resin molding apparatus will be described. Since the apparatus configuration is common, the description will mainly focus on the changes in the mold. The same members as those in the first embodiment are denoted by the same reference numerals and the description is incorporated.

  5A and 5B, a difference is that resin molding is performed by interposing an intermediate plate 44 between the upper mold 20 and the lower mold 21. The intermediate plate 44 has a first through hole 44a that communicates with the pot 35, a gate 44b (resin passage) that communicates with the upper runner 26d, and a second through hole 44c that houses the semiconductor chip 5 that communicates with the gate 44b. (Corresponding to a cavity) and a through gate 44d (resin passage) that connects the second through hole 44c and the dummy cavity 26e are formed. As the intermediate plate 44, for example, a plate whose thickness matches the height of the semiconductor chip 5 of the workpiece and whose resin mold region matches the second through hole 44c is used.

In FIG. 5A, as a premise, the servo motor 31 is activated in accordance with the height of the semiconductor chip 5 according to the measurement result in the workpiece measurement unit B, and either the first movable taper block 25 is set through the screw shaft 30. The cavity piece 23 is adjusted in advance to a height position at which the cavity piece 23 can be pressed without applying excessive stress to the semiconductor chip 5.
Further, the servo motor 41 is activated in accordance with the thickness of the substrate 1 and the second movable taper block 39 is slid (moved or retracted) to either one through the screw shaft 40 so that the work support portion 37 is moved to the substrate 1. The height is adjusted in advance so that it can be clamped without excessive stress.

  Next, after the substrate 1 is placed on the work support portion 37 and the resin tablet 3 is loaded in the pot 35 by the loader 16, the intermediate plate 44 is placed across the gap between the outer peripheral end of the substrate 1 and the lower mold insert block 34. Overlay the lower clamp surface. At this time, the intermediate plate 44 is positioned so that the first through hole 44a is aligned with the pot 35, and the semiconductor chip 5 is accommodated in the second through hole 44c, and is placed on the lower mold clamping surface. Is done. The intermediate plate 44 may be supplied to the mold 19 by a unique transport mechanism provided with a supply unit, but may be supplied together with the resin tablet 3 by the loader 16.

  Next, the lower mold 21 is raised and the mold 19 is closed. When the upper mold chase block 22 contacts the lower mold seal ring 42, a closed space is formed between the upper mold 20 and the lower mold 21, and a decompression space is formed by a suction operation from the lower mold suction path 43. When the clamping operation further proceeds and the upper insert block 26 contacts the intermediate plate 44 via the release film 10 and the cavity piece 23 contacts the semiconductor chip 5 via the release film 10, the clamping operation is completed.

  Next, in FIG. 5B, the transfer mechanism is actuated to push the plunger 36 up and melt the molded resin through the first through hole 44a, the upper die 26c, the upper runner 26d, and the gate 44b. It pressure-feeds to the hole 44c. At this time, the melted mold resin passes through the upper surface of the intermediate plate 44 and is directly injected into the second through-hole 44c constituting the cavity across the gap between the substrate 1 and the mold. Further, since the upper surface of the flip-chip mounted semiconductor chip 5 is pressed by the cavity piece 23, an underfill molding can be performed by introducing a molten resin between the semiconductor chip 5 and the substrate 1. Further, by overflowing the mold resin from the second through hole 44c to the dummy cavity 26e through the through gate 44d, the void (unfilled) can be washed away, and the resin filling property in the cavity can be improved.

  In this case, gold plating for facilitating peeling of a portion that needs to be peeled off after molding, such as a runner or a dummy cavity, on the substrate 1 becomes unnecessary, and the mold is formed in the gap between the substrate 1 and the lower mold insert block 34. There is no risk of resin leakage and defective sliding of the mold.

[Example 3]
Next, another example of the resin molding apparatus will be described. Since the apparatus configuration is common, the description will mainly focus on the changes in the mold. The same members as those in the first embodiment are denoted by the same reference numerals and the description is incorporated.
The present embodiment is similar to the second embodiment in that the intermediate plate 44 is used, except that a swivel mechanism 45 is added to the upper mold 20. Specifically, a guide piece 46 is provided between the first movable taper block 25 and the cavity piece 23 that comes into contact with the semiconductor chip 5 via the release film 10. The guide piece 46 is suspended and supported by the upper chase block 22 by the spring 24. Between the cavity piece 23 and the guide piece 46, that is, on the side opposite to the workpiece contact surface, a pressing spring 47 whose output is sufficiently smaller than that of the spring 24 is elastically mounted. A gap is formed between the two. Although it is not always necessary to provide this gap, it is desirable to provide a slight gap in order to reduce the sliding resistance between the cavity piece 23 and the guide piece 46 and to smoothly tilt the cavity piece 23.

  A convex surface portion 23d (guide surface portion) is formed in the central portion of the cavity piece 23 facing the guide piece 46, and the convex portion 23d is fitted in the central part of the opposed surface of the guide piece 46 facing the cavity piece 23. Concave concave portions (guide surface portions; not shown) are formed. When the cavity piece 23 comes into contact with a plurality (or a single number) of semiconductor chips 5 via the release film 10, the cavity piece 23 becomes an appropriate inclined state following the height variation (inclination) of the semiconductor chip 5, and the convex surface portion 23 d is formed. Press in a tilted state as the center. When the clamping of the upper mold 20 and the lower mold 21 is completed, the pressing spring 47 between the cavity piece 23 and the guide piece 46 is compressed and the convex surface portion 23d and the concave surface portion (not shown) are fitted to each other to form a gap. It is clamped in a rigid (rigid) state in which is eliminated. In this case, the convex surface portion 23 d can be formed of a spherical surface, and the center of this spherical surface can be made to coincide with the end surface directed to the semiconductor chip 5 in the cavity piece 23. According to this, even if the semiconductor chip 5 is clamped while the cavity piece 23 is tilted, it is more preferable because the semiconductor chip 5 can be clamped without generating a stress in the shear direction. However, the convex surface portion 23d may be provided on the guide piece 46 side.

  6A, it is assumed that the cavity piece 23 applies excessive stress to the semiconductor chip 5 by starting the servo motor 31 according to the height of the semiconductor chip 5 according to the measurement result in the workpiece measurement unit B. The height is adjusted in advance so that it can be pressed without any problem. Similarly, the servo motor 41 is activated in accordance with the thickness of the substrate 1 and is adjusted in advance to a height position at which the workpiece support portion 37 can be clamped without applying excessive stress to the substrate 1.

  Next, after the substrate 1 is placed on the work support portion 37 and the resin tablet 3 is loaded in the pot 35 by the loader 16, the intermediate plate 44 is placed across the gap between the outer peripheral end of the substrate 1 and the lower mold insert block 34. Overlay the lower clamp surface.

  Next, the lower mold 21 is raised and the mold 19 is closed. When the upper mold chase block 22 contacts the lower mold seal ring 42, a closed space is formed between the upper mold 20 and the lower mold 21, and a decompression space is formed by a suction operation from the lower mold suction path 43. When the clamping operation further proceeds and the upper insert block 26 comes into contact with the intermediate plate 44 via the release film 10 and the cavity piece 23 comes into contact with the semiconductor chip 5 via the release film 10, the swivel mechanism 45 causes the cavity piece to come into contact. The clamping operation is completed while 23 is tilted about the convex surface portion 23d.

  Next, in FIG. 6B, the transfer mechanism is actuated to push the plunger 36 up and melt the molded resin through the first through hole 44a, the upper die 26c, the upper runner 26d, and the gate 44b. The pressure is fed to the through hole 44c. At this time, since the upper surface of the semiconductor chip 5 is pressed by the cavity piece 23, the underfill molding can be performed by introducing a molten resin between the semiconductor chip 5 and the substrate 1 if the semiconductor chip 5 is flip-chip mounted. Further, by overflowing the mold resin from the second through hole 44c to the dummy cavity 26e through the through gate 44d, the void can be washed away, and the resin filling property in the cavity can be improved.

  As described above, even if the semiconductor chip 5 mounted on the substrate 1 is inclined, the cavity piece 23 is tilted following the inclination of the semiconductor chip 5 without being partly contacted via the cavity piece 23 and the release film 10. The semiconductor chip 5 is not stressed, and there is no possibility that the chip is damaged or broken, or flash flash is generated. Therefore, the molding quality is improved. Further, by enabling the cavity piece 23 to be tilted in this way, different elements such as a package constituting an inverter by sandwiching an IGBT (Insulated Gate Bipolar Transistor) and an FWD (Free Wheeling Diode) between a pair of lead frames are provided. Since the structure is sandwiched between the workpieces, it is possible to reliably prevent the flash flash even when the pair of lead frames is a workpiece that is easily tilted. In such a molding example, the lead frame disposed on the lower side corresponds to the “first member” of the present invention, and the lead frame disposed on the IGBT, FWD and the upper side is the “second member” of the present invention. Is equivalent to.

[Example 4]
Next, another example of the resin molding apparatus will be described. Since the apparatus configuration is common, the description will mainly focus on the changes in the mold. The same members as those in the first embodiment are denoted by the same reference numerals and the description is incorporated.
In FIG. 7A, a dummy cavity 26e is provided on the clamp surface of the upper insert block 26 on the outer side from the substrate facing surface. In addition, a closing pin 48 (closing means) that stops the pressure reducing operation by pressing the clamping surface of the lower insert block 34 facing the release film 10 on the outer peripheral side of the dummy cavity 26e moves forward and backward. It may be provided. The closing pin 48 may be moved forward and backward by a driving mechanism such as a solenoid or a cylinder.

  According to the above configuration, it is not necessary to form the dummy cavity 26e on the substrate 1, so that the utilization rate of the substrate 1 can be improved by increasing the number of molded products 11 on the substrate 1. Further, it is possible to prevent leakage of the resin by preventing air from being discharged from the mold 19 in a desired timing, for example, when the dummy cavity 26e is filled with the overflowing mold resin. In addition, the air vent (not shown) that extends from the dummy cavity 26e to the outer periphery and discharges air from the cavity can be deeply formed to facilitate air discharge. be able to.

  FIG. 7B shows an embodiment in which the intermediate plate 44 is used. A dummy cavity 44e is provided on the outer peripheral side from the substrate facing surface. The dummy cavity 44e is formed by a through hole, and overflows from the second through hole 44c through the through gate 44d to accommodate excess resin. Further, the upper insert block 26 is provided with a closing pin 48 on the clamp surface on the outer peripheral side of the dummy cavity 44e for pressing the clamp surface of the intermediate plate 44 facing the release film 10. According to the above configuration, when the dummy cavity 44e is formed outside the substrate 1, it is not necessary to form the dummy cavity 44e and the groove portion connected to the cavity recess 32 on the substrate 1, so that the molded product on the substrate 1 is formed. The utilization rate of the board | substrate 1 can be improved by increasing the number of 11 pieces. Further, when the dummy cavity 44e is formed in a through-hole penetrating the intermediate plate 44, unnecessary resin filled in the dummy cavity 44e can be released simply by pushing it out with a pin or the like (not shown). Resin release can also be facilitated. In addition, it is good also as a structure provided with both the dummy cavity 26e and the dummy cavity 44e.

[Fifth embodiment]
Next, another example of the resin molding apparatus will be described. The description will mainly focus on the changes in the mold. The same members as those in the first embodiment are denoted by the same reference numerals and the description is incorporated. In the first to fourth embodiments, the cavity piece 23 is supported via the wedge mechanism as the cavity height variable mechanism, but the cavity piece 23 is rigidly attached to the upper chase block 22 as shown in FIG. It is supported in the shape. The upper mold insert block 26 may be supported by being suspended by a spring 49. The upper mold 20 is not provided with a wedge mechanism, and is provided with only a wedge mechanism including the workpiece support portion 37 of the lower mold 21 and the second movable taper block 39.

  The clamping operation of the mold 19 will be described. In FIG. 8A, the servo motor 41 is activated in accordance with the thickness of the substrate 1 and the second movable taper block 39 is slid to either one through the screw shaft 40 ( (Advance or retreat), and the work support unit 37 is adjusted to a height position at which it can be clamped without applying excessive stress to the substrate 1. In this state, the work is supplied to the lower mold 21 of the mold 19 opened by the loader 16 (see FIG. 1). At this time, since the thickness of the work support portion 37 is adjusted in advance by the lower die drive portion 8, the substrate 1 is supported so as to be flush with the lower die clamp surface or slightly higher than the lower die clamp surface.

Next, in FIG. 8B, the lower mold 21 is raised and the mold 19 is closed. At this time, prior to the mold clamping operation or when the clamping operation is started, the decompression device 58 may be activated to start the suction operation from the lower mold suction path 43. When the upper mold chase block 22 contacts the lower mold seal ring 42, a closed space is formed between the upper mold 20 and the lower mold 21, and a decompression space is formed by a suction operation from the lower mold suction path 43.
As the clamping operation proceeds, the upper mold insert block 26 comes into contact with the lower mold insert block 34 and the substrate 1 through the release film 10.
When the clamping operation further proceeds, as shown in FIG. 8C, the spring 49 is compressed while the upper die insert block 26 is in contact with the lower die insert block 34 and the substrate 1, and the cavity piece 23 causes the release film 10 to move. Via the semiconductor chip 5. In this case, the clamping force generated as a reaction force against the lower mold platen is detected by the spring 49 being compressed, and the clamping operation is completed when the predetermined clamping force is reached.

  Accordingly, the cavity piece 23 moves up and down relatively with respect to the upper mold insert block 26 and moves in the mold opening / closing direction, so that the mold clamping mechanism that raises and lowers the lower mold movable platen functions as a cavity height variable mechanism. Subsequently, the transfer mechanism is operated to push up the plunger 36, and the molten mold resin is pressure-fed and injected into the cavity recess 32. In this case, the cavity height is set in accordance with the height of the semiconductor chip 5 only by completing the mold closing operation before injecting the mold resin into the cavity recess 32.

In order to eliminate the gap between the substrate 1 and the lower mold insert block 34, a pressing mechanism for pressing the substrate 1 from the outside to the wall surface of the lower mold insert 34 on the pot 35 side as necessary, or the substrate 1 physically A crushing mechanism or the like that eliminates the gap may be provided by deforming it. Thereby, leakage of mold resin with high fluidity can be prevented as much as possible.
Further, the cavity piece 23 is supported by the upper chase block 22 in a rigid shape, but may be supported by being suspended through a spring. In this case, the upper mold insert block 26 may be rigidly supported by the upper mold chase block 22 so that the mold closing may be completed after the semiconductor chip 5 is clamped by the cavity piece 23 before the clamping is completed.

  According to the above configuration, the float of the cavity piece 23 and / or the upper mold insert block 26 (clamper) is simply raised by raising the lower mold 21 by a predetermined amount corresponding to the height of the semiconductor chip 5 in the mold closing operation of the mold 19. The amount is adjusted. Thereby, it can set, without performing the separate operation | movement which adjusts the depth position (height from the board | substrate 1 to the cavity piece 23) of a cavity. That is, it is possible to clamp the workpiece without excessive pressure by simply raising the lower die 21 to a position set in accordance with the height of the semiconductor chip 5, and with the above-described embodiment with a simple configuration. Similar effects can be achieved.

[Example 6]
Next, another example of the resin molding apparatus will be described. Since the apparatus configuration is common, the description will mainly focus on the changes in the mold. The same members as those in the first embodiment are denoted by the same reference numerals and the description is incorporated.
In FIG. 9A, the cavity piece 23 and the upper mold insert block 26 are suspended and supported by the upper mold chase block 22 by springs 24 and 49, respectively. The semiconductor chip contact surface of the cavity piece 23 is formed in a protruding shape that protrudes downward from the periphery thereof. That is, a concave groove 23c is formed around the convex surface 23b. Similarly to the fifth embodiment, the upper mold 20 is not provided with a wedge mechanism, and is provided with only a wedge mechanism including the work support portion 37 of the lower mold 21 and the second movable taper block 39.

  The clamping operation of the mold 19 will be described. In FIG. 9A, the servo motor 41 is activated in accordance with the thickness of the substrate 1 and the second movable taper block 39 is slid to either one through the screw shaft 40 ( (Advance or retreat), and the work support unit 37 is adjusted to a height position at which it can be clamped without applying excessive stress to the substrate 1. In this state, the work is supplied to the lower mold 21 of the mold 19 opened by the loader 16 (see FIG. 1). At this time, since the thickness of the work support portion 37 is adjusted in advance by the lower die drive portion 8, the substrate 1 is supported so as to be flush with the lower die clamp surface or slightly higher than the lower die clamp surface.

Next, in FIG. 9B, the lower mold 21 is raised and the mold 19 is closed. At this time, prior to the mold clamping operation or when the clamping operation is started, the decompression device 58 may be activated to start the suction operation from the lower mold suction path 43. When the upper mold chase block 22 contacts the lower mold seal ring 42, a closed space is formed between the upper mold 20 and the lower mold 21, and a decompression space is formed by a suction operation from the lower mold suction path 43.
As the clamping operation proceeds, the upper mold insert block 26 comes into contact with the lower mold insert block 34 and the substrate 1 through the release film 10. Moreover, when the convex surface part 23b formed in the cavity piece 23 contacts each semiconductor chip 5 through the release film 10, the clamping operation is completed. At this time, the excessive pressing force that the cavity piece 23 presses the semiconductor chip 5 and the upper mold insert block 26 presses the substrate 1 can be released by the bending of the springs 24 and 49. Therefore, the molding quality is improved even when it is necessary to clamp the semiconductor chip 5 while protecting the upper surface of the semiconductor chip 5 more reliably and preventing flashing on the upper surface of the chip, as in the case of using a top-emitting LED element as the semiconductor chip 5. Can be made.

  In FIG. 9C, the transfer mechanism is actuated to push up the plunger 36 and press the molten mold resin into the cavity recess 32 through the upper die 26c and the upper die runner 26d. At this time, since the upper surface of each semiconductor chip 5 is pressed by the convex portion 23b of the cavity piece 23, if the semiconductor chip 5 is flip-chip mounted, a molten resin is introduced between the substrate 1 and an underfill mold is formed. In addition, the groove 23c is filled with mold resin and resin-molded so as to surround the upper surface of each semiconductor chip 5. The mold resin filled in the cavity recess 32 overflows into the dummy cavity 26e through the through gate 26f, so that the void can be washed away and the resin filling property in the cavity can be improved.

  According to the above configuration, the light emitting surface of the LED element as the semiconductor element 5 is exposed by being pressed by the convex surface portion 23b of the cavity piece 23, and the concave groove portion 23c surrounding the periphery is filled with a low viscosity silicone resin (white resin). The reflector surrounding the light emitting surface can be efficiently formed by transfer molding. Note that the reflector may not have a configuration in which the height around the light emitting surface is increased, and a reflector having a height that is flush with the light emitting surface may be formed. In this case, the semiconductor chip contact surface of the cavity piece 23 is formed flat.

[Example 7]
Next, another example of the resin molding apparatus will be described. The same members as those in the first embodiment are denoted by the same reference numerals and the description is incorporated. Below, it demonstrates focusing on a different structure.
As shown in FIG. 10, in the resin molding apparatus, a liquid resin supply unit F is provided adjacent to the press unit C separately from the substrate supply unit (work supply unit A). Specifically, the liquid resin supply unit F is provided between the press units C. As in FIG. 1, the resin molding apparatus is assembled by connecting the unitized bases so that the guide portions 18 are continuous.
Although the configuration of the mold 19 is described as being the same as that of the first embodiment, the mold 19 of another embodiment may be used.

  The configuration of the liquid resin supply unit F will be described with reference to FIG. The dispenser (liquid resin supply device) 50 is rotatable on a base (not shown), a moving mechanism (including rails) provided on the base, and a moving base provided on the moving mechanism. And a rotation mechanism. The dispenser 50 rotates the syringe 51 held along the vertical direction to a position corresponding to each of the two press devices 6 and then moves the syringe 51 forward and backward into the mold 19 to supply the liquid resin.

  The dispenser 50 includes a syringe 51 filled with a liquid resin, a tube 52 through which the liquid resin extruded from the syringe 51 flows, and a dropping mechanism 53 that is disposed on the distal end side of the tube 52 and drops the liquid resin onto the pot 35. Yes. A tube 52 connected to a syringe 51 held in a vertical direction by a dispenser main body (not shown) is bent and extended in the horizontal direction by approximately 90 degrees from the vertical direction.

  In addition, the dropping mechanism 53 is provided at an end portion (to serve as a supply port) of the tube 52 bent downward from the horizontal direction, and a pinch valve 54 that presses and closes the tube 52, and moves forward and backward in the tube opening. A possible resin receiving portion 55 and a cooling mechanism 56 for cooling the periphery of the tube 52 are provided. The pinch valve 54 seals the tube 52 except when dripping the liquid resin to prevent the liquid resin from dripping, prevents the liquid resin from being deteriorated by contact with the outside air, and air enters the tube 52. To prevent it. Further, the resin receiving portion 55 is retracted from below the opening of the tube 52 when the liquid resin is dropped, and other than that, the resin receiving portion 55 is positioned below the opening of the tube 52 and receives the dropping liquid resin. In addition to preventing the liquid resin from dripping, the resin receiving portion 55 can prevent the distal end opening of the tube 52 from being heated when entering the mold 19.

  The cooling mechanism 56 is used to cool the periphery of the tube 52 and suppress the reaction of the liquid resin when the dropping mechanism 53 is positioned inside the high-temperature press device 6 when supplying the liquid resin. . The cooling mechanism 56 may be configured, for example, to cool the inside of the housing provided to store the tube 52 by a cooling means such as air cooling or water cooling, or by passing a refrigerant through the wall thickness of the tube 52. It is good also as a structure which cools directly, and you may use these together. Further, the tube 52 may be cooled by providing a cooling element (cooling means) such as a Peltier element in the housing.

Next, an example of the liquid resin supply operation of the dispenser 50 will be described.
As a premise, in accordance with the height of the semiconductor chip 5, the servo motor 31 is activated and adjusted in advance to a height position at which the cavity piece 23 can be pressed without applying excessive stress to the semiconductor chip 5. Similarly, in accordance with the thickness of the substrate 1, the servo motor 41 is activated and adjusted in advance to a height position at which the workpiece support portion 37 can be clamped without applying excessive stress to the substrate 1.

  Next, the substrate 1 is supplied to the work support unit 37 by the loader 16. Further, as shown in FIG. 11 (A), a mold in which a drip mechanism 53 is opened with a pinch valve 54 at the head by rotating a rotating mechanism (not shown) to rotate toward a pressing device 6 that supplies a dispenser 50. The posture is changed so that it can enter between the molds 19. At this time, the pinch valve 54 remains closed, and the resin receiving portion 55 is in a state where the portion immediately below the opening of the tube 52 is closed. Further, the cooling device 56 is activated to keep the reaction of the liquid resin in the tube 52 suppressed.

  Next, as shown in FIG. 11 (B), a moving mechanism (not shown) is operated to move closer to the press device 6 that supplies the dispenser 50. At this time, the dropping mechanism 53 enters the mold 19 opened in the press device 6, and the pinch valve 54 provided at the tip of the tube 52 is arranged directly above the pot 35. Then, after the resin receiving portion 55 is retracted from the position below the opening of the tube 52, the pinch valve 54 is opened, and a liquid resin necessary for one resin mold is dropped into the pot 35 from the syringe 51.

  When the required amount of liquid resin has been dropped, the pinch valve 54 is closed and the resin receiving portion 55 is moved to a position below the opening of the tube 52. Then, a movement mechanism (not shown) is operated to move the dispenser 50 away from the press device 6 that has finished supplying. Thereby, the dropping mechanism 53 is retracted from the mold 19.

  Next, as in the first embodiment, in FIG. 3C, the lower mold 21 is raised and the mold 19 is closed. When the clamping operation further proceeds, the upper mold insert block 26 contacts the lower mold insert block 34 and the substrate 1 via the release film 10, and the cavity piece 23 contacts the semiconductor chip 5 via the release film 10, the clamp The operation is complete.

  Next, as in FIG. 3D, the transfer mechanism is operated, and the plunger 36 is pushed up so that the liquid resin can be pressure-fed to the cavity recess 32 through the upper die 26c and the upper die runner 26d to perform underfill molding. . The liquid resin filled in the cavity recess 32 overflows into the dummy cavity 26e, so that the voids can be swept away and the resin filling property in the cavity can be improved.

  According to the above configuration, a mold underfill using a low-viscosity epoxy-based liquid resin can be realized by transfer molding because the filler becomes fine in order to fill the gaps between the fine bumps. Alternatively, it is possible to form an LED lens, a reflector, or the like made of a silicone resin having a low filler filling rate and a low viscosity, thereby improving the molding quality and extending the life.

The resin mold apparatus described above has been described using an upper mold cavity and a lower mold pot arrangement type mold mold, but may be a lower mold cavity, or an upper mold pot and a lower mold cavity arrangement mold mold. There may be.
Further, although the fixed mold is described as the upper mold 20 and the movable mold is the lower mold 21, the present invention is not limited to this, and the fixed mold may be the lower mold 21 and the movable mold may be the upper mold 20.
In addition to the semiconductor chip 5 that is not only flip-chip mounted on the substrate 1 but also wire bonded, the work can be applied to a light emitting element such as a white LED in which a phosphor is mixed into a sealing resin. . Furthermore, as work, switching elements (IGBT, MOS-FET, etc.) used in power supply circuits, elements with high heat generation (CPU, MPU, etc.), semiconductor elements having input / output units (LEDs, etc.), signal input / output It is also possible to use a substrate on which a sensor (CCD sensor, CMOS sensor, fingerprint sensor, MEMS, etc.) that performs the above is mounted. Furthermore, wafer level package molding can be performed using a wafer on which electronic parts such as bumps and solder balls are mounted as a workpiece. In this case, it is possible to perform wafer level package molding in which bumps and solder balls are clamped by the cavity piece 32 and the bumps and solder balls are appropriately clamped and sealed.

Moreover, although the example using solid resin tablet 3 or liquid resin was demonstrated as mold resin, for example, various resin, such as granular resin and powdered resin, can also be used. Further, the mold 19 may be used for resin-sealing a plurality of semiconductor elements individually or collectively, for map-type molding or matrix-type molding.
Moreover, although the pot 35 was provided in the lower mold | type insert block 34, you may be provided in the upper mold | type 20 side. In such a configuration, the mold dies may be arranged upside down.

  Moreover, although the structure which drives the cavity piece 23 by a wedge mechanism was demonstrated as a cavity height variable mechanism, this invention is not limited to this. For example, the upper mold insert block 26 can be driven by a single wedge mechanism. In this case, the cavity height can be changed by supporting the cavity piece 23 rigidly on the upper die chase block 22 and moving the upper die insert block 26 up and down. In addition, an example in which a wedge mechanism or a mold clamping mechanism is used to make the cavity height variable has been described. However, the cavity piece 23 and the upper mold insert block 26 are directly driven by other driving sources such as hydraulic pressure and a ball screw. Also good.

  Moreover, although the structure which provided the workpiece | work support part 37 in each of the two board | substrate 1 which pinched | interposed the plunger 36 as a plate | board thickness variable mechanism and demonstrated the drive individually with a wedge mechanism was demonstrated, this invention is not limited to this. For example, it is good also as a structure provided with the wedge mechanism which raises / lowers the same number of workpiece | work support parts 37 separately when arrange | positioning the some board | substrate 1 on both sides which pinch | interpose the plunger 36. FIG. Specifically, the servo motor 41 and the wedge mechanism in the lower mold drive unit 8 are arranged in the same manner as the upper mold drive unit 7. In other words, the lower mold drive unit 8 can be finely adjusted with respect to the thickness of the substrate 1 by disposing the lower mold drive unit 8 so as to be inverted in the vertical direction with respect to the upper mold drive unit 7. For example, as shown in FIG. 1, one substrate 1 is arranged on the left and right of three plungers 36 arranged in a line, and the workpiece support portion 37 is matched to the thickness of each of the six substrates 1 in total. It is good also as a structure which can mold-mold collectively with the mold die 19, after adjusting the height of each.

  A workpiece supply unit, B preheating unit, C press unit, D molded product storage unit, E transport mechanism, F liquid resin supply unit 1 substrate 2 set base 3 resin tablet 4 tablet supply unit 5 semiconductor chip 6 press device 7 upper mold drive Section 8 Lower mold drive section 9 Film supply mechanism 9a Supply roll 9b Winding roll 10 Release film 11 Molded product 12 Set section 13 Gate break section 14 Storage section 15 Magazine 16 Loader 17 Unloader 18 Guide section 19 Mold mold 20 Upper mold 21 Lower die 22 Upper die chase block 23 Cavity piece 23a, 25a, 39a, 57a Tapered surface 23b, 23d Convex portion 23c Concave groove portion 24, 38, 49 Spring 25 First movable taper block 26 Upper die insert block 26a Through hole 26b Recess 26c Upper die Cull 26d Upper die runner 26e, 44e Dummy cavity 26f, 44d Through gate 27 Upper die seal ring 28 Upper die suction path 29, 58 Pressure reducing device 30, 40 Screw shaft 31, 41 Servo motor 32 Cavity recess 33 Lower mold chase block 34 Lower mold insert block 35 Pot 36 Plunger 37 Work support portion 39 Second movable taper block 42 Lower mold seal ring 43 Lower mold suction path 44 Intermediate plate 44a First through hole 44b Gate 44c Second penetration Hole 45 Swivel mechanism 46 Guide piece 47 Pressing spring 48 Closing pin 50 Dispenser 51 Syringe 52 Tube 53 Drip mechanism 54 Pinch valve 55 Resin receiving part 56 Cooling mechanism 57 Constant taper block

Claims (12)

A resin mold that resin molds a work in which a second member is mounted on a first member,
A cavity recess that forms the cavity in which the second member is accommodated is formed by the cavity piece that forms the bottom of the cavity and the first insert that is disposed so as to surround the cavity piece, and the second member is pressed by the cavity piece. periphery thereof with one of the mold uneven surface recessed groove part is formed that is formed surface is formed on the convex portion,
A workpiece support portion for supporting the workpiece, and the other mold having a second insert adjacent to the workpiece support portion;
A pot and a plunger which are assembled to either the one mold or the other mold and supply mold resin;
A cavity height variable mechanism that makes the height of the cavity recess variable according to the height of the second member by relatively moving the cavity piece in the mold opening and closing direction;
A plate thickness variable mechanism that makes the height of the workpiece support portion variable according to the thickness of the first member by moving the workpiece support portion in the mold opening / closing direction with respect to the second insert. ,
By adjusting the height of the work support portion by the plate thickness variable mechanism according to the thickness of the first member and clamping the first member by the first insert, the cavity height variable mechanism A resin, wherein a cavity piece is relatively moved and the convex surface portion formed on the pressing surface presses the exposed surface of the two members while the surrounding concave groove portion is filled with a mold resin and is resin-molded. Mold mold. 2. The resin mold according to claim 1, wherein one or both of the cavity piece and the first insert is floatingly supported by the one mold chase . 3. The resin mold mold according to claim 1, wherein the plate thickness variable mechanism is provided with a wedge mechanism that moves a movable taper block by a drive source to adjust a position of the work support portion in a mold opening / closing direction. . 4. The resin mold according to claim 1 , wherein a dummy cavity is provided on a clamp surface of the first insert, and the surplus resin is accommodated in the dummy cavity from the cavity recess . 5. The resin mold die according to claim 4, further comprising a closing means for stopping the discharge of air by pressing a clamp surface facing the outer peripheral side of the dummy cavity of the first insert . Before the one mold and the other mold are closed, a closed space that is cut off from the external space is formed, and a reduced pressure space including the cavity is formed by reducing the pressure in the closed space. The resin mold die according to any one of claims 1 to 5, further comprising a mechanism . A through hole for accommodating the second member and a resin passage communicating therewith are formed, and the other mold is formed across the gap between the first member outer peripheral end supported by the work support portion and the second insert. The resin mold die according to any one of claims 1 to 6, further comprising an intermediate plate that is used while being superimposed on a clamp surface . 8. The resin mold according to claim 7, wherein a dummy cavity is provided on an outer peripheral side of the first member of the intermediate plate, and the surplus resin is accommodated in the dummy cavity through the through hole . 9. A swivel mechanism capable of tilting the cavity piece by being guided by a guide surface portion of a guide piece disposed opposite to a surface of the cavity piece that is in contact with the second member and opposite to the work contact surface of the cavity piece. The resin mold die according to any one of the above. 10. The resin mold according to claim 1, further comprising a release film that covers and holds the one mold clamping surface including the cavity recess . 10. 11. A resin mold according to claim 1, a workpiece supply unit, a press unit that clamps the workpiece with the resin mold and performs resin molding, and a molded product storage unit. And a resin mold device comprising:
By clamping the first member with the first insert, the convex surface portion formed on the pressing surface of the cavity piece holds the exposed surface of the two members and the surrounding concave groove portion is filled with mold resin. A resin molding apparatus characterized by the above . The resin according to claim 11, wherein a liquid resin supply unit is provided adjacent to the press unit, and the liquid nozzle is supplied by moving a supply nozzle forward and backward in a pot of a mold die opened in the press unit. Mold device .

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