JP6062801B2 - Light emitting element substrate and light emitting device - Google Patents

Description

  The present invention relates to a substrate for a light emitting element used for a lighting device (for example, LED lighting or a signal lamp) or a display device (for example, an LED display), and a light emitting device including the same.

  Conventionally, a light emitting device mounted on a light emitting element substrate is used as a light emitting device used in an illumination device or a display device.

  As this light emitting element substrate, for example, as disclosed in Patent Document 1, an upper surface on which the light emitting element is mounted is configured by an insulating layer made of a resin material.

  By the way, in the light emitting device, part of visible light emitted from the light emitting element may reach the upper surface of the light emitting element substrate. For example, when a cover member for protecting the light emitting element is provided, part of visible light emitted from the light emitting element is reflected by the cover member and reaches the upper surface of the light emitting element substrate. Here, when the upper surface of the light emitting element substrate is formed of an insulating layer that is generally made of a resin material that easily absorbs visible light, a part of the visible light is easily absorbed on the upper surface of the light emitting element substrate. That is, part of visible light emitted from the light emitting element is lost, so that the brightness of the light emitting device is likely to be lowered.

JP 2004-39691 A

  It is an object of the present invention to provide a light emitting element substrate capable of improving the brightness of a light emitting device and a light emitting device using the same.

A light-emitting element substrate according to one embodiment of the present invention is a light-emitting element substrate on which a light-emitting element that emits light upward is mounted. The light-emitting element substrate includes an inorganic insulating layer that forms an upper surface of the light-emitting element substrate. A plurality of first inorganic insulating particles whose average particle diameter is smaller than a lower limit value of the wavelength of visible light, a part of which are connected to each other, and an average particle diameter of the lower limit of the wavelength of visible light A plurality of second inorganic insulating particles made of zirconia, which are larger than the value and surrounded by the first inorganic insulating particles, and a gap surrounded by the first inorganic insulating particles and the second inorganic insulating particles. And the upper surface of the inorganic insulating layer is located at a depth at which visible light entering the inside of the insulating layer reaches from the upper surface of the insulating layer, and the insulating layer is The resin layer disposed on the lower surface of the inorganic insulating layer Further comprising the resin portion, a part of the resin layer is ing enters into the gap.

  According to the light emitting element substrate according to the embodiment of the present invention, since the particle diameter of the first inorganic insulating particles is smaller than the wavelength of visible light, the visible light that has entered the inorganic insulating layer is the second inorganic insulating particles. Easy to reach. This visible light is likely to be reflected (recursively reflected) in the same direction as the incident direction by the second inorganic insulating particles made of zirconia larger than the wavelength of visible light. As a result, visible light that has reached the top surface of the light-emitting element substrate is likely to be reflected upward, so that the brightness of the light-emitting device can be improved.

It is sectional drawing which cut | disconnected the thickness direction (Z direction) which shows the light-emitting device in 1st Embodiment of this invention. It is sectional drawing cut | disconnected in the thickness direction (Z direction) which expanded and showed R1 part of FIG. It is sectional drawing cut | disconnected in the thickness direction (Z direction) which expanded and showed R2 part of FIG. (A)-(d) is sectional drawing cut | disconnected in the thickness direction (Z direction) for every process explaining the manufacturing process of the light-emitting device shown in FIG. It is sectional drawing cut | disconnected in the thickness direction (Z direction) which shows the light-emitting device in 2nd Embodiment of this invention. It is sectional drawing cut | disconnected in the thickness direction (Z direction) which shows the light-emitting device in 3rd Embodiment of this invention.

<First Embodiment>
(Light emitting device)
Hereinafter, a light emitting device including a light emitting element substrate according to a first embodiment of the present invention will be described in detail with reference to the drawings.

  The light-emitting device 1 shown in FIG. 1 is used for, for example, an illumination device such as an LED illumination or a signal lamp, or a display device such as an LED display. The light emitting device 1 includes a light emitting element 2 that emits light upward, a light emitting element substrate 3 on which the light emitting element 2 is mounted, and a periphery of the light emitting element 2 in order to reflect light emitted from the light emitting element 2 upward. And a translucent cover member 5 having both ends supported by the reflector 4 in order to protect the light emitting element 2 and the light emitting element substrate 3.

  In the following, in the thickness direction of the light emitting device 1 (Z direction in the drawing), the light emitting direction of the light emitting device 1 is defined as upward, and the opposite is defined as downward.

(Light emitting element)
The light emitting element 2 is mounted on the upper surface of the light emitting element substrate 3 and is electrically connected to the light emitting element substrate 3 through, for example, bonding wires. The light emitting element 2 includes, for example, a base portion 6 such as a sapphire substrate on which an electrode connected to a bonding wire is formed while supporting the light emitting portion 7 on the upper surface, and a semiconductor material such as gallium arsenide phosphorus, gallium nitride, or silicon carbide. And a lens portion 8 surrounding the light emitting portion 7.

  The thickness of the light emitting element 2 is set to 0.05 mm or more and 0.9 mm or less, for example. The thickness of the light-emitting element 2 is determined by observing a cross section including the light-emitting part 7 exposed by polishing the light-emitting element 2 in the planar direction (XY plane direction) with an optical microscope. It measures by measuring 10 or more lengths along the thickness direction (Z direction) to the upper surface of 8, and calculating the average value.

(Light emitting element substrate)
The light emitting element substrate 3 includes a first insulating layer 9 (insulating layer) that constitutes the upper surface of the light emitting element substrate 3, and a light emitting element that is partially disposed on the upper surface of the first insulating layer 9 together with the first insulating layer 9. Between the first conductive layer 10 constituting the upper surface of the substrate 3, the second insulating layer 11 disposed on the lower surface of the first insulating layer 9, and the first insulating layer 9 and the second insulating layer 11. The first conductive layer 10 and the second conductive layer 12 are electrically connected to each other through the second conductive layer 12 arranged in the thickness direction and the first insulating layer 9 or the second insulating layer 11 in the thickness direction (Z direction). A via conductor 13 and a metal plate 14 disposed on the lower surface of the second insulating layer 11 are included. The thickness of the light emitting element substrate 3 is set to, for example, 0.1 mm or more and 2 mm or less, and is measured in the same manner as the light emitting element 2.

  The first insulating layer 9 functions as an insulating member between the first conductive layer 10 and the second conductive layer 12. The first insulating layer 9 includes a first resin layer 15 (resin layer), a first inorganic insulating layer 16 (inorganic insulating layer) stacked on the upper surface of the first resin layer 15, and a first inorganic insulating layer 16. And a surface resin layer 17 laminated on the upper surface. In the first insulating layer 9, the upper surface of the first inorganic insulating layer 16 is located at a depth at which visible light entering the inside of the first insulating layer 9 reaches from the upper surface of the first insulating layer 9.

  The “depth at which visible light reaches” refers to the area from the top surface of the first insulating layer 9 in the first insulating layer 9 that constitutes the top surface of the light emitting element substrate 3 except for the region where the light emitting element 2 is mounted. The distance to the point where at least 80% of the visible light that has entered the first insulating layer 9 reaches. That is, in this embodiment, since the surface resin layer 17 is laminated on the upper surface of the first inorganic insulating layer 16, the surface resin layer 17 in which the visible light transmittance is 80% in the surface resin layer 17. Is the maximum value of “depth at which visible light reaches”.

  The visible light transmittance of the surface resin layer 17 is determined by removing the first insulating layer 9 by polishing the upper and lower surfaces of the light emitting element substrate 3, and then analyzing the resin material of the surface resin layer 17. A resin layer similar to the resin layer 17 is made as a prototype, and can be measured, for example, by measuring the transmittance of the prototyped resin layer with a transmittance meter.

  Further, the depth at which the visible light reaches differs depending on the wavelength of the visible light, but it is not necessary for the visible light of all wavelengths to reach, and it is sufficient to reach only the visible light of the wavelength emitted from the light emitting element 2. That is, for example, when the light emitting element 2 emits violet visible light, it is sufficient that the wavelength of the minimum visible light reaches, and when the light emitting element 2 emits red visible light, the maximum value of visible light is reached. It is sufficient if the wavelength reaches.

The thickness of the first insulating layer 9 is set to, for example, 20 μm or more and 100 μm or less. The Young's modulus of the first insulating layer 9 is set to, for example, 20 GPa or more and 45 GPa or less, and the coefficient of thermal expansion in the plane direction (XY plane direction) is set to, for example, 13 ppm / ° C. or more and 19 ppm / ° C. or less. Yes. The thickness of the first insulating layer 9 is measured in the same manner as the light emitting element 2. The Young's modulus of the first insulating layer 9 can be measured by a measuring method according to ISO 527-1: 1993, for example, using a nanoindenter. And the thermal expansion coefficient of the 1st insulating layer 9 is measured by the measuring method according to JISK7197-1991, for example using a commercially available TMA (thermomechanical analysis) apparatus.

  The first resin layer 15 is a main part of the first insulating layer 9, and includes, for example, a first resin 18 made of a resin material such as epoxy resin, bismaleimide triazine resin or cyanate resin, and filler particles 19. Contains.

  The thickness of the first resin layer 15 is set to 3 μm or more and 20 μm or less, for example. The Young's modulus of the first resin layer 15 is set to, for example, 1 GPa or more and 10 GPa or less. The coefficient of thermal expansion in the plane direction (XY plane direction) of the first resin layer 15 is set to 20 ppm / ° C. or more and 70 ppm / ° C. or less, for example. The thermal conductivity of the first resin layer 15 is set to, for example, 0.1 W / m · K to 1.5 W / m · K. The thickness, Young's modulus, and thermal expansion coefficient of the first resin layer 15 are measured in the same manner as the first insulating layer 9. The thermal conductivity of the first resin layer 15 is measured by, for example, a laser flash method by a measurement method according to JIS C2141-1992.

  Moreover, the volume ratio (volume%) of the filler particles 19 in the first resin layer 15 is set to, for example, 10 volume% or more and 70 volume% or less. The volume ratio (volume%) of the filler particles 19 is measured by first photographing a cross section exposed by polishing the first resin layer 15 with a scanning electron microscope or a transmission electron microscope, and analyzing the image from the photographed image. The area ratio (area%) is measured using an apparatus or the like. Next, the volume ratio (volume%) of the filler particles 19 is measured by regarding the average value calculated from these measured values as the volume ratio of the filler particles 19.

  The filler particles 19 are dispersed in the first resin layer 15 and reduce the thermal expansion coefficient of the first resin layer 15 and improve the Young's modulus of the first resin layer 15. The filler particles 19 are made of, for example, an inorganic insulating material such as zirconia (zirconium oxide), silica (silicon oxide), alumina (aluminum oxide), aluminum nitride, aluminum hydroxide, or calcium carbonate. The average particle diameter of the filler particles 19 is set to, for example, 0.3 μm or more and 5 μm or less. The average particle diameter of the filler particles 19 is obtained by observing the cross section of the first resin layer 15 with a scanning electron microscope or a transmission electron microscope, and photographing a cross section enlarged to include 20 or more and 50 or less particles. The maximum diameter of each particle is measured in this enlarged cross section, and the average value is calculated.

  The first inorganic insulating layer 16 makes the first insulating layer 9 have a low coefficient of thermal expansion and high rigidity. As a result, the difference in coefficient of thermal expansion between the light emitting element 2 and the light emitting element substrate 3 is reduced, and when the light emitting device 1 is heated when the light emitting element 2 is mounted or operated, the light emitting element 2 and the light emitting element use Warpage of the light emitting element substrate 3 due to the difference in thermal expansion coefficient with the substrate 3 can be reduced, and as a result, the reliability of the light emitting device 1 can be improved.

  As shown in FIG. 3, the first inorganic insulating layer 16 has a plurality of first inorganic insulating particles 20 that are partially connected to each other, and an average particle size larger than that of the first inorganic insulating particles 20. A plurality of second inorganic insulating particles 21 surrounded by the particles 20 and a resin portion 22 disposed in the gap G surrounded by the first inorganic insulating particles 20 and the second inorganic insulating particles 21 are included.

As a result, some of the first inorganic insulating particles 20 made of an inorganic insulating material having a low coefficient of thermal expansion and high rigidity compared to the resin material are connected to each other, and the first inorganic insulating particles 20 are restrained and flow. Therefore, the first inorganic insulating layer 16 can have a low coefficient of thermal expansion and high rigidity. Further, since a large amount of energy is required for the cracks generated in the first inorganic insulating layer 16 to bypass the second inorganic insulating particles 22 having a large average particle diameter, the cracks generated in the first inorganic insulating layer 16 are elongated. And the disconnection of the first conductive layer 10 or the second conductive layer 12 due to the crack can be suppressed. Further, the resin portion 22 that is more easily elastically deformed than the inorganic insulating material can relieve the stress applied to the first inorganic insulating layer 16 and suppress the occurrence of cracks in the first inorganic insulating layer 16.

  The thickness of the first inorganic insulating layer 16 is set to, for example, 1 μm or more and 80 μm or less. The Young's modulus of the first inorganic insulating layer 16 is set to, for example, 20 GPa or more and 50 GPa or less. The coefficient of thermal expansion in the plane direction (XY plane direction) of the first inorganic insulating layer 16 is set to, for example, 0.6 ppm / ° C. or more and 10 ppm / ° C. or less. The thermal conductivity of the first inorganic insulating layer 16 is set to, for example, 0.2 W / m · K or more and 3 W / m · K or less. The thickness, Young's modulus, thermal expansion coefficient, and thermal conductivity of the first inorganic insulating layer 16 are measured in the same manner as the first resin layer 15. Moreover, when the unevenness | corrugation is formed in the upper surface or lower surface of the 1st inorganic insulating layer 16, the thickness of the 1st inorganic insulating layer 16 is measured in the location in which the recessed part of the 1st inorganic insulating layer 16 is formed. .

  The total volume ratio (volume%) of the first inorganic insulating layer 16 and the first inorganic insulating particles 20 and the second inorganic insulating particles 21 in the first inorganic insulating layer 16 is set to, for example, 62 volume% or more and 75 volume% or less. The volume ratio (volume%) of the first inorganic insulating particles 20 in the combination of the first inorganic insulating particles 20 and the second inorganic insulating particles 21 is set to, for example, 20 volume% or more and 90 volume% or less. The volume ratio (volume%) of the 2 inorganic insulating particles 21 is set to 10 volume% or more and 80 volume% or less. The volume ratio (volume%) of the first inorganic insulating particles 20 and the second inorganic insulating particles 21 is measured in the same manner as the filler particles 19.

  The volume ratio (volume%) of the gap G is set to, for example, 25 volume% or more and 38 volume% or less. And the volume ratio of a part of resin material of the 1st resin layer 15 in the gap | interval G is set to 99.5 volume% or more and 100 volume% or less, for example. The width of the gap G is set to 10 nm or more and 300 nm or less. The volume ratio of the gap G is measured in the same manner as that of the filler particles 19, and the width of the gap G is first determined by scanning a cross section exposed by polishing the first inorganic insulating layer 16 with a scanning electron microscope or a transmission electron microscope. Observe and photograph a cross section enlarged so as to include a gap G of 20 or more and 50 or less in number, and calculate an average value of the maximum diameters of the gaps G in the enlarged cross section. Measured by considering the width of.

  The first inorganic insulating particles 20 are made of, for example, an inorganic insulating material such as zirconia, silica, alumina, magnesium oxide, or calcium oxide. The average particle diameter of the first inorganic insulating particles 20 is set to, for example, 3 nm or more and 110 nm or less, and is smaller than the lower limit value of the wavelength of visible light. In addition, the wavelength of visible light refers to that whose wavelength range is 360 nm or more and 830 nm or less according to JIS Z8120-2001, and the lower limit value of visible light means 360 nm. The average particle diameter of the first inorganic insulating particles 20 is measured in the same manner as the filler particles 19.

  The second inorganic insulating particles 21 are partially connected to the first inorganic insulating particles 20 and are separated from each other with the first inorganic insulating particles 20 interposed therebetween. The second inorganic insulating particles 21 are made of zirconia. The average particle diameter of the second inorganic insulating particles 21 is set to, for example, not less than 0.5 μm and not more than 5 μm, and is larger than the lower limit value of the wavelength of visible light. The average particle size of the second inorganic insulating particles 21 is measured in the same manner as the filler particles 19.

The resin portion 22 is configured such that a part of the first resin 18 of the first resin layer 15 enters the gap G. As a result, the adhesive strength between the first inorganic insulating layer 16 and the first resin layer 15 can be improved by the anchor effect. As a result, when heat is applied to the first insulating layer 9, the first inorganic insulating layer 16, which has a lower thermal expansion coefficient and higher rigidity than the first resin layer 15, restrains the first resin layer 15. The thermal expansion of the resin layer 15 can be reduced satisfactorily.

  The surface resin layer 17 is a resin layer disposed on the surface of the first insulating layer 9 and improves, for example, the adhesive strength between the first insulating layer 9 and the first conductive layer 10. The surface resin layer 17 is made of a resin material such as epoxy resin, bismaleimide triazine resin, cyanate resin, polyimide resin or polyamide resin. The thickness of the surface resin layer 17 is set to, for example, 0.5 μm or more and 5 μm or less. The thickness of the surface resin layer 17 is measured in the same manner as the light emitting element 2.

  Here, since the thickness of the surface resin layer 17 is set to be as thin as 5 μm or less, the visible light transmittance of the surface resin layer 17 is 80% or more, and the visible light reaching the upper surface of the light emitting element substrate 3 is reduced. It can penetrate well. As a result, visible light reaches the first inorganic insulating layer 12 disposed on the lower surface of the surface resin layer 17 in a satisfactory manner.

  Further, the surface resin layer 17 may contain filler particles. In that case, the volume ratio (volume%) of the filler particles in the surface resin layer 17 is set to, for example, 2 volume% or more and 3 volume% or less. Here, since the volume ratio (volume%) of the filler particles is set to be as small as 3 volume% or less, the surface resin layer 17 transmits the visible light that has reached the upper surface of the light emitting element substrate 3 satisfactorily. Can do. The average particle diameter of the filler particles contained in the surface resin layer 17 is desirably set smaller than the lower limit value of the visible light wavelength. As a result, the surface resin layer 17 can transmit visible light satisfactorily.

  The first conductive layer 10 is electrically connected to the light emitting element 2 via a bonding wire or the like, and electrically connected to an external circuit board (not shown) and a conductive metal wire. To be connected. The first conductive layer 10 is made of a conductive material such as copper, silver, gold, or aluminum. The thickness of the first conductive layer 10 is set to 3 μm or more and 20 μm or less, for example. The Young's modulus of the first conductive layer 10 is set to, for example, 50 GPa or more and 200 GPa or less. And the thermal expansion coefficient to the plane direction (XY plane direction) of the 1st conductive layer 10 is set to 16 ppm / degrees C or more and 18 ppm / degrees C or less, for example. The thickness, Young's modulus, and thermal expansion coefficient of the first conductive layer 10 are measured in the same manner as the first insulating layer 9.

  The second insulating layer 11 has the same configuration as the first insulating layer 9, and includes a second resin layer 23, a second inorganic insulating layer 24 laminated on the upper surface of the second resin layer 23, and a second And a surface resin layer 17 laminated on the upper surface of the inorganic insulating layer 24. The second resin layer 23 has the same configuration as the first resin layer 15, and the second inorganic insulating layer 24 has the same configuration as the first inorganic insulating layer 16.

  The second conductive layer 12 functions as a signal wiring, a ground wiring, or a power supply wiring, and has the same configuration as the first conductive layer 10.

  The via conductor 13 penetrates the first insulating layer 9 or the second insulating layer 11 in the thickness direction (Z direction), and electrically connects the first conductive layer 10 and the second conductive layer 12. For example, made of a conductive material such as copper, silver, gold or aluminum. The Young's modulus of the via conductor 13 is set to, for example, 50 GPa or more and 200 GPa or less. The thermal expansion coefficient in the planar direction (XY planar direction) of the via conductor 19 is set to, for example, 16 ppm / ° C. or more and 18 ppm / ° C. or less. Note that the Young's modulus and thermal expansion coefficient of the via conductor 13 are measured in the same manner as the first inorganic insulating layer 16.

The metal plate 14 dissipates heat generated by the light emitting element 2, and is made of, for example, copper, aluminum, iron, nickel, cobalt, or an alloy thereof. The thickness of the metal plate 14 is
For example, it is set to 0.05 mm or more and 2 mm or less. The Young's modulus of the metal plate 14 is set to, for example, 50 GPa or more and 200 GPa or less. The coefficient of thermal expansion in the plane direction (XY plane direction) of the metal plate 14 is set to, for example, 1 ppm / ° C. or more and 20 ppm / ° C. or less. The thermal conductivity of the metal plate 14 is set to, for example, 50 W / m · K or more and 430 W / m · K or less. The thickness, thermal expansion coefficient, and thermal conductivity of the metal plate 14 are measured in the same manner as the first insulating layer 9. The Young's modulus of the metal plate 14 is, for example, per unit cross-sectional area obtained by cutting a rectangular test piece from the metal plate 14 using a dicing machine, a knife, or a saw, and measuring the test piece with a tensile tester. It can be measured by dividing the tensile stress by the amount of elongation of the test piece.

  The first inorganic insulating layer 16 of the present embodiment has a plurality of first inorganic insulating particles 20 whose average particle diameter is smaller than the lower limit value of the wavelength of visible light, partly connected to each other, and an average particle diameter of visible light. A plurality of second inorganic insulating particles 21 made of zirconia and surrounded by the first inorganic insulating particles 20 and the gap surrounded by the first inorganic insulating particles 20 and the second inorganic insulating particles 21, which are larger than the lower limit of the wavelength. And a resin portion 22 disposed in G, and is located at a depth at which visible light entering the inside of the first insulating layer 9 reaches from the upper surface of the first insulating layer 9.

  As a result, since the average particle diameter of the first inorganic insulating particles 20 is smaller than the wavelength of visible light, visible light that has entered the first inorganic insulating layer 16 is less likely to be reflected by the first inorganic insulating particles 20, It reaches the second inorganic insulating particles 21 satisfactorily. When the visible light reaches the outer surface of the second inorganic insulating particle 21 having a wavelength larger than that of visible light, the visible light enters the second inorganic insulating particle 21 made of zirconia having high translucency.

  Here, since the refractive index of the second inorganic insulating particles 21 made of zirconia (refractive index of about 2.4) is larger than the refractive index of the resin portion 22 made of a resin material (refractive index of about 1.5), the second The reflectance on the inner surface of the inorganic insulating particles 21 is high, and total reflection is easy. In particular, since the second inorganic insulating particles 21 made of zirconia having a higher refractive index than other inorganic insulating materials such as silica (having a refractive index of about 1.5) are used, the inner surface of the second inorganic insulating particles 21 is used. The reflectivity is high, and total reflection is easy.

  Therefore, the visible light that has reached the inner surface of the second inorganic insulating particle 21 is well reflected by the inner surface of the second inorganic insulating particle 21 and goes out of the second inorganic insulating particle 21. At this time, the visible light is refracted when entering the second inorganic insulating particles 21, reflected by the inner surface of the second inorganic insulating particles 21, and refracted when going out of the second inorganic insulating particles 21. The visible light is reflected in the same direction as the direction of incidence on the second inorganic insulating particles 21 (recursive reflection).

  Therefore, the visible light reaching the upper surface of the light emitting element substrate 3 is again emitted upward by the first inorganic insulating layer 16 included in the first insulating layer 9 constituting the upper surface of the light emitting element substrate 3. As a result, the brightness of the light emitting device can be improved.

  In addition, since the second inorganic insulating particles 21 made of zirconia that hardly deteriorate the resin part 22 as compared with titanium oxide having a photocatalytic action are used, an increase in the absorption rate of visible light by the resin part 22 due to the deterioration is suppressed. In addition, the brightness of the light emitting device can be maintained satisfactorily.

  The first inorganic insulating layer 16 includes a plurality of first inorganic insulating particles 20 that surround the plurality of second inorganic insulating particles 21 and are partially connected to each other. As a result, the volume ratio of the resin portion 22 in the first inorganic insulating layer 16 can be reduced as compared with an insulating layer mainly composed of a conventional resin material, so that the absorption of visible light by the resin portion 22 is reduced. As a result, the brightness of the light emitting device can be improved. In particular, when the resin portion 22 deteriorates with age and the visible light absorption rate increases, the brightness of the light emitting device can be favorably maintained.

  The width of the gap G of the first inorganic insulating layer 16 is desirably smaller than the lower limit value of the visible light wavelength. As a result, the width of the resin part 22 filled in the gap G is also smaller than the lower limit of the wavelength of visible light, so that the visible light that has entered the first inorganic insulation 15 is absorbed by the resin part 22. It is difficult to reach the second inorganic insulating particles 21 well, so that the brightness of the light emitting device can be improved.

  Moreover, it is desirable that the volume ratio of the second inorganic insulating particles 21 in the combination of the first inorganic insulating particles 20 and the second inorganic insulating particles 21 is set to 50% by volume or more and 90% by volume or less. As a result, by setting the volume to 50% by volume or more, the number of locations where visible light is reflected by the second inorganic insulating particles 21 increases, and thus the reflectance of visible light by the first inorganic insulating layer 16 can be increased. Moreover, the 2nd inorganic insulating particle 21 can be favorably covered with the 1st inorganic insulating particle 20 and the resin part 22 by setting it as 90 volume% or less.

  Moreover, it is desirable that the thickness of the first inorganic insulating layer 16 is set to 4.5 μm or more and 15 μm or less. As a result, by setting the thickness to 4.5 μm or more, visible light reaches the second inorganic insulating particles 21 and is easily reflected, so that the reflectance of visible light by the first inorganic insulating layer 16 can be increased. Moreover, since it becomes easy to fill the gap G with the resin portion 22 by setting it to 15 μm or less, generation of voids (bubbles) in the gap G can be suppressed, and occurrence of swelling and cracks due to the voids can be suppressed. .

  The first inorganic insulating particles 20 are preferably made of silica. As a result, since the refractive index of silica (refractive index of about 1.5) and the resin material (refractive index of about 1.5) are close, the first surrounded by the first inorganic insulating particles 20 is the same as the resin part 22. 2 The reflectance on the inner surface of the inorganic insulating particles 21 can be increased to facilitate total reflection. As a result, visible light can be favorably reflected by the second inorganic insulating particles 21.

  The second inorganic insulating particles 21 are preferably spherical. As a result, the retroreflection of visible light can be favorably generated on the inner surface of the second inorganic insulating particle 21.

  Further, it is desirable that many filler particles 19 included in the first resin layer 15 are located on the first inorganic insulating layer 16 side of the first resin layer 15. As a result, the visible light transmitted through the first inorganic insulating layer 16 is favorably reflected by the filler particles 19 contained in the first resin layer 15, so that the visible light that has entered the light emitting element substrate 3 is absorbed. That is reduced, and thus the brightness of the light emitting device can be improved.

  In addition, when the 1st resin layer 15 is divided into two so that thickness may become equal, the one near the 1st inorganic insulating layer 16 is made into the 1st field, and the one far from the 1st inorganic insulating layer 16 is made into the 2nd field Furthermore, for example, 55% or more and 70% or more of the filler particles 19 are located in the first region, and for example, 30% or more and 45% or less are located in the second region.

  The lower surface of the metal plate 14 is desirably exposed to the atmosphere. As a result, the heat generated by the light emitting element 2 can be released well.

  Further, from the viewpoint of thermal conductivity, the metal plate 14 is preferably made of copper. As a result, the heat generated by the light emitting element 2 can be released well.

  The thermal expansion coefficient of the metal plate 14 is desirably smaller than that of the first resin layer 15 and larger than that of the first inorganic insulating layer 16. As a result, the difference in thermal expansion coefficient between the metal plate 14 and the first insulating layer 9 can be reduced, and distortion of the light emitting element substrate 3 can be reduced.

  In addition, when the metal plate 14 consists of copper, it is desirable that the 1st inorganic insulating particle 20 consists of silicon oxide from a viewpoint of a thermal expansion coefficient. As a result, the difference in coefficient of thermal expansion between the metal plate 14 and the first insulating layer 9 can be reduced satisfactorily.

  Further, it is desirable that the thermal expansion coefficient of the metal plate 14 is smaller than that of the second resin layer 23 and larger than that of the second inorganic insulating layer 24. As a result, the difference in thermal expansion coefficient between the second insulating layer 11 and the metal plate 14 can be reduced, and the second resin layer 23 and the metal plate 14 can be favorably reduced.

(Method for manufacturing light emitting device)
Next, the manufacturing method of the light-emitting device 1 mentioned above is demonstrated, referring FIG.

  (1) An inorganic insulating sol having a solid content including the first inorganic insulating particles 20 and the second inorganic insulating particles 21 and a solvent in which the solid content is dispersed is prepared.

  The inorganic insulating sol includes, for example, a solid content of 10% to 50% by volume and a solvent of 50% to 90% by volume. Further, the solid content of the inorganic insulating sol includes, for example, the first inorganic insulating particles 20 by 20% by volume to 90% by volume and the second inorganic insulating particles 21 by 10% by volume to 80% by volume.

  On the other hand, the solvent contained in the inorganic insulating sol is, for example, methanol, isopropanol, n-butanol, ethylene glycol, ethylene glycol monopropyl ether, methyl ethyl ketone, methyl isobutyl ketone, xylene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, dimethyl An organic solvent containing acetamide and / or a mixture of two or more selected from these may be used.

  (2) A support sheet 25 made of a resin material or a metal material having a surface resin layer 17 disposed on one main surface is prepared, and an inorganic insulating sol is applied on one main surface of the surface resin layer 17.

  The inorganic insulating sol can be applied using, for example, a dispenser, a bar coater, a die coater, or screen printing. At this time, as described above, since the solid content of the inorganic insulating sol is set to 50% by volume or less, the viscosity of the inorganic insulating sol is set low, and the flatness of the coated inorganic insulating sol can be increased. it can.

  In addition, if the surface resin layer 17 contains filler particles at a ratio of 2% by volume or more and 3% by volume or less, for example, the support sheet 25 can be peeled off at a later time.

  (3) The inorganic insulating sol is dried to evaporate the solvent.

  The inorganic insulating sol is dried by, for example, heating and air drying. The drying temperature is set to, for example, 20 ° C. or higher and lower than the boiling point of the solvent (the boiling point of the lowest boiling solvent when two or more solvents are mixed), and the drying time is, for example, 20 seconds to 30 minutes. Set to As a result, the boiling of the solvent is reduced, the extrusion of the first inorganic insulating particles 20 and the second inorganic insulating particles 21 due to the pressure of bubbles generated during the boiling is reduced, and the distribution of the particles is made more uniform. Is possible.

(4) The solid content of the remaining inorganic insulating sol is heated so that the plurality of first inorganic insulating particles 20 and the first inorganic insulating particles 20 and the second inorganic insulating particles 21 are partially connected to each other. The insulating layer 24 is produced.

  Here, the inorganic insulating sol has the first inorganic insulating particles 20 whose average particle size is set to be minute and below the lower limit of the wavelength of visible light. As a result, the heating temperature of the inorganic insulating sol is relatively low, for example, lower than the crystallization start temperature of the first inorganic insulating particles 20 and the second inorganic insulating particles 21 and further lower than the thermal decomposition temperature of the surface resin layer 17. However, the first inorganic insulating particles 20 can be firmly connected to each other.

  As for the heating of the inorganic insulating sol, the temperature is preferably set to, for example, 100 ° C. or more and less than 300 ° C., and the time is preferably set to, for example, 0.5 hours or more and 24 hours or less. By heating at such a low temperature, the first inorganic insulating particles 20 and the second inorganic insulating particles 21 maintain the shape of the particles, and the first inorganic insulating particles 20 and the first inorganic insulating particles 20 and the second inorganic particles are maintained. The insulating particles 21 can be connected only in the proximity region. As a result, the first inorganic insulating particles 20 and the first inorganic insulating particles 20 and the second inorganic insulating particles 21 can be connected to each other. As a result, the open pore gap G can be easily formed between the first inorganic insulating particles 20. Can be formed.

  (5) A resin precursor 26 including an uncured resin material and filler particles 19 coated with the resin material is prepared. Next, as shown in FIG. 4A, a resin precursor 26 is laminated on the main surface of the second inorganic insulating layer 24 opposite to the surface resin layer 17, and the support sheet 25, the surface resin layer 17, the second A laminated sheet 27 including the inorganic insulating layer 24 and the resin precursor 26 is produced.

  (6) The metal plate 14 is prepared, and the laminate sheet 27 is laminated on the metal plate 14 so that the resin precursor 26 of the laminate sheet 27 is disposed on the main surface of the metal plate 14. Next, the resin precursor 26 is cured by heating and pressing the laminated sheet 27 and the metal plate 14, the resin precursor 26 is used as the second resin layer 23, the support sheet 25 is peeled off, and the second insulating layer 11 is formed. It is arranged on the main surface of the metal plate 14.

  Note that the laminated sheet 27 and the metal plate 14 are heated and pressed in the vertical direction so that an uncured resin material enters a part of the gap G of the second inorganic insulating layer 24, and the second inorganic The insulating layer 24 and the resin precursor 26 are bonded. In addition, uncured is the state of A-stage or B-stage according to ISO472: 1999.

  The heating and pressurization of the laminated sheet 27 and the metal plate 14 are performed at a temperature equal to or higher than the curing start temperature of the resin precursor 26 and lower than the thermal decomposition temperature of the resin precursor 26. Specifically, the heating temperature is set, for example, to 150 ° C. or more and 250 ° C. or less, the pressure is set, for example, to 2 MPa or more and 3 MPa or less, and the time is set, for example, 0.5 hours or more and 2 hours or less. The curing start temperature is a temperature at which the resin becomes a C-stage according to ISO 472: 1999.

  (7) The second conductive layer 12 is formed on the upper surface of the second insulating layer 11.

  The second conductive layer 12 is formed by depositing a conductive material using, for example, an electroless plating method, an electroplating method, a vapor deposition method, a CVD method, or a sputtering method, and then using, for example, a photolithography technique, an etching method, or the like. It can be formed by patterning the conductive material deposited.

  (8) As shown in FIG. 4C, by repeating the steps (1) to (6), the first inorganic insulating layer 16 produced by drying the inorganic insulating sol and the resin precursor 26 are heated. A first insulating layer 9 including the cured first resin layer 15 is formed on the upper surfaces of the second insulating layer 11 and the second conductive layer 12.

  Here, the average particle diameter of the filler particles 19 contained in the resin precursor 26 that becomes the first resin layer 15 is desirably larger than the width of the gap G. As a result, the uncured resin material of the resin precursor 26 enters the gap G of the first inorganic insulating layer 16, so that a plurality of filler particles 19 are aggregated so as to be filtered on the surface of the first inorganic insulating layer 16. The first resin layer 15 in which the volume ratio of the filler particles 19 is larger in the region closer to the first inorganic insulating layer 16 than in the region farther from the first inorganic insulating layer 16 can be formed. Therefore, the first resin layer 15 having a small coefficient of thermal expansion on the first inorganic insulating layer 16 side can be easily produced, and as a result, the production efficiency can be improved.

  (9) The via conductor 13 that penetrates the first insulating layer 9 in the thickness direction (Z direction) is formed, and the first conductive layer 10 that is electrically connected to the via conductor 13 is formed on the first insulating layer 9.

  The via conductor 13 is formed by first forming a via hole in the second insulating layer 11 using, for example, a YAG laser device or a carbon dioxide gas laser device. Next, the via conductor 13 is formed by filling the via hole V with a conductive material using, for example, electroless plating, vapor deposition, CVD, or sputtering.

  (9) As shown in FIG. 4D, after the light emitting element 2 is mounted on the upper surface of the first insulating layer 9, the light emitting element 2 and the first conductive layer 10 are connected by a bonding wire. Next, the reflection plate 4 and the cover member 5 are arranged around the light emitting element 2 so as to cover the reflection plate 4.

  As described above, the light emitting device 1 in which the light emitting element 2 is mounted on the upper surface of the light emitting element substrate 3 is manufactured.

Second Embodiment
(Light emitting device)
Next, a second embodiment of the light-emitting element substrate and the light-emitting device of the present invention will be described in detail with reference to FIG. In addition, description is abbreviate | omitted regarding the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 5, the light emitting element substrate 3 of the second embodiment is different from the first embodiment, and the first inorganic insulating layer 16 is located in the uppermost layer of the first insulating layer 9 and the light emitting element substrate. 3 is constituted. As a result, the visible light that has reached the upper surface of the light emitting element substrate 3 can satisfactorily enter the first inorganic insulating layer 16, and more visible light can be reflected. Can be improved.

  Since the first inorganic insulating layer 16 is positioned at the uppermost layer of the first insulating layer 9, visible light reaching the upper surface of the first insulating layer 9 reaches the upper surface of the first inorganic insulating layer 16. Become. That is, in the first insulating layer 9, the upper surface of the first inorganic insulating layer 16 is naturally positioned at “depth at which visible light reaches”.

(Method for manufacturing light emitting device)
Next, the manufacturing method of the light-emitting device 1 of 2nd Embodiment mentioned above is demonstrated. In addition, description is abbreviate | omitted regarding the method similar to 1st Embodiment mentioned above.

  In the step (2) described above, the inorganic insulating sol is directly applied on the main surface of the support sheet 25 to form the second inorganic insulating layer 24, and then the resin is formed on the main surface opposite to the support sheet 25. The precursor 26 is laminated, and a laminated sheet 27 including the support sheet 25, the surface resin layer 17, the second inorganic insulating layer 24, and the resin precursor 26 is produced. And the light-emitting device 1 is producible with the process similar to 1st Embodiment mentioned above.

<Third Embodiment>
(Light emitting device)
Next, a third embodiment of the light-emitting element substrate and the light-emitting device of the present invention will be described in detail with reference to FIG. In addition, description is abbreviate | omitted regarding the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 6, unlike the first embodiment, the light emitting element substrate 3 of the second embodiment has a first through hole T1 penetrating the first insulating layer 9 in which the light emitting element 2 is accommodated, A concave portion D including the second through hole T2 penetrating the second insulating layer 11 and having the metal plate 14 as a bottom surface is formed.

  Thus, by forming the recess D, the light emitting element 2 accommodated in the recess D is mounted on the upper surface of the metal plate 14. As a result, since the metal material has higher thermal conductivity than the resin material and the inorganic insulating material, the heat generated by the light-emitting element 2 can be released well, and the light-emitting element caused by the temperature rise of the light-emitting element 2 2 can prevent a decrease in luminous efficiency and a decrease in lifetime.

  In addition, the thermal conductivity of the first inorganic insulating layer 16 and the second inorganic insulating layer 24 is preferably larger than the thermal conductivity of the first resin layer 15 and the second resin layer 23. As a result, the light emitting element 2 accommodated in the first through hole T1 and the second through hole T2 is surrounded by the first inorganic insulating layer 16 and the second inorganic insulating layer 24. The emitted heat can be released well.

  In addition, the inner diameter of the first inorganic insulating layer 16 of the first through hole T1 is desirably smaller than the inner diameter of the first resin layer 15. As a result, the distance between the first inorganic insulating layer 16 and the light emitting element 2 in the first through hole T1 is reduced, and among the visible light that has reached the upper surface of the light emitting element substrate 3, the light emitting element 2 and the first light emitting element 2 Visible light enters between the inner wall of the first through hole T1 and is absorbed by the inner wall or the like of the first through hole T1, thereby reducing the loss of visible light.

  Further, the thickness of the first inorganic insulating layer 16 is desirably larger than the thickness of the first resin layer 15. As a result, the area from which the heat generated by the light emitting element 2 is released becomes large, and the heat generated by the light emitting element 2 can be released well.

  Further, it is desirable that the inner diameter of the second through hole T2 in the second inorganic insulating layer 24 is smaller than the inner diameter of the second resin layer 23. As a result, the distance between the second inorganic insulating layer 24 and the light emitting element 2 in the second through hole T2 is reduced, and the heat generated by the light emitting element 2 can be released well.

  The thickness of the second inorganic insulating layer 24 is preferably larger than the thickness of the second resin layer 23. As a result, the area from which the heat generated by the light emitting element 2 is released becomes large, and the heat generated by the light emitting element 2 can be released well.

  In addition, the light emitting portion 7 of the light emitting element 2 is desirably located above the upper surface of the first inorganic insulating layer 16. As a result, the visible light emitted from the light emitting element 2 is reflected by the first inorganic insulating layer 16 constituting the inner wall surface of the first through hole T1, and the loss of visible light in the first through hole T1 is reduced. Can do.

  Moreover, it is desirable that the light emitting portion 7 of the light emitting element 2 is located above the opening of the first through hole T1. As a result, visible light emitted from the light emitting element 2 can be reduced from being absorbed by the first resin layer 15 and the like on the inner wall surface of the first through hole T1.

(Method for manufacturing light emitting device)
Next, a method for manufacturing the light emitting device 1 according to the third embodiment will be described. The first mentioned above
A description of the same method as in the embodiment will be omitted.

  After the step (8) described above, the first through hole T1 penetrating the first insulating layer 9 and the second through hole T2 penetrating the second insulating layer 11 for accommodating the light emitting element 2 are formed.

  The first through hole T1 and the second through hole T2 can be formed by, for example, laser processing, punching processing, or sand blast processing.

  In addition, after forming the first through hole T1 and the second through hole T2, it is desirable to subject the inner peripheral surfaces of the first through hole T1 and the second through hole T2 to desmear treatment.

  Specifically, the desmear treatment is performed by impregnating the permanganic acid solution with the light emitting element substrate 3 within 5 minutes to 10 minutes, for example. In this step, since the permanganic acid solution dissolves the resin material, not only the inside of the first through hole T1 and the second through hole T2 is satisfactorily treated, but also the first resin layer 15 and the second resin layer 23 A part can be melted. As a result, the inner diameter of the first through hole T1 in the first inorganic insulating layer 16 can be made smaller than the inner diameter of the first resin layer 15, and the inner diameter of the second through hole T2 in the second inorganic insulating layer 24 can be reduced to the second. The inner diameter of the resin layer 23 can be made smaller.

  The present invention is not limited to the above-described embodiment, and various changes, improvements, combinations, and the like can be made without departing from the spirit of the present invention.

  Moreover, although the embodiment of the present invention described above includes the metal plate 14, the metal plate 14 may not be included. Moreover, you may use the core board | substrate containing base materials, such as glass cloth, and resin, such as an epoxy resin, instead of the metal plate 14. FIG. In this case, the core substrate functions as a support member for the first insulating layer 9 and the second insulating layer 11, and the rigidity of the light emitting element substrate 3 can be increased.

  Moreover, although the embodiment of the present invention described above includes only one second inorganic insulating layer 24, it may include a plurality of second inorganic insulating layers 24.

  In the embodiment of the present invention described above, the second inorganic insulating layer 24 includes the second inorganic insulating particles 21, but the second inorganic insulating layer 24 may not include the second inorganic insulating particles 21. .

  In the embodiment of the present invention described above, nothing is arranged in the space surrounded by the light emitting element substrate 3, the reflector 4, and the cover member 5. For example, a resin material is arranged together with a fluorescent substance. It doesn't matter.

  Moreover, although 2nd Embodiment of this invention mentioned above formed 1st through-hole T1 and 2nd through-hole T2, you may form only 1st through-hole T1. In that case, the light emitting element 2 is mounted on the upper surface of the second insulating layer 11.

  Hereinafter, the present invention will be described in detail by way of examples. However, the present invention is not limited to the following examples, and all modifications and embodiments without departing from the gist of the present invention are not limited thereto. Included in the range.

(Evaluation method)
An inorganic insulating layer containing first inorganic insulating particles, second inorganic insulating particles and a resin part is prepared, and a method according to JIS Z8722-2009 using a spectrocolorimeter CM-3700A apparatus manufactured by Minolta (
The reflectance at the top surface of the inorganic insulating layer was measured at a measurement wavelength of 420 nm. In addition, the thickness of the inorganic insulating layer was measured using a high precision Digimatic Micrometer MDH-25M manufactured by Mitutoyo Corporation.

(Preparation conditions for inorganic insulating layer)
First, a first inorganic insulating sol containing first inorganic insulating particles and a solvent and a second inorganic insulating sol containing second inorganic insulating particles and a solvent are prepared in a predetermined amount, and the first inorganic insulating sol and the second inorganic insulating sol are prepared. The sol was mixed uniformly. In this way, inorganic insulating sols of Samples 1 to 7 were prepared. The inorganic insulating sols of Samples 1 to 7 include the first inorganic insulating particles and the first inorganic insulating particles having the materials, average particle diameters, and volume ratios (volume ratio in the combination of the first inorganic insulating particles and the second inorganic insulating particles) shown in Table 1. 2 Inorganic insulating particles are included.

  Next, a predetermined amount of the inorganic insulating sol of Samples 1 to 7 is applied on the copper foil, and the solvent is evaporated while heating the inorganic insulating sol under the conditions of temperature: 150 ° C., time: 2 hours, atmosphere: air. As a result, some of the first inorganic insulating particles were connected to each other. By this method, inorganic insulating layers of Samples 1 to 7 were produced. The inorganic insulating layers of Samples 1 to 7 have thicknesses shown in Table 1.

  Next, a resin precursor is laminated on the inorganic insulating layer, and a core substrate containing glass cloth and epoxy resin is further laminated on the resin precursor to form a laminated body. Next, by heating and pressurizing this laminate, the resin precursor is filled in the gap between the inorganic insulating layers and the resin precursor is thermally cured, and the resin portion and the inorganic insulating layer disposed in the gap between the inorganic insulating layers A resin layer disposed on the top was formed.

  Next, the copper foil was etched using a ferric chloride solution to expose the main surface of the inorganic insulating layer on the copper foil side, thereby forming an upper surface for measuring the reflectance.

(Measurement result of reflectance)
As shown in Table 1, in the samples 1 and 2 having different materials of the second inorganic insulating particles, the reflectance (62%) of the sample 2 using the second inorganic insulating particles made of zirconia is the second inorganic made of silica. It was larger than the reflectance (20%) of Sample 1 using insulating particles.

  Further, in Samples 2 to 4 having different volume ratios of the second inorganic insulating particles, the reflectance (62%) of Sample 2 in which the volume ratio of the second inorganic insulating particles is 70% by volume and Sample 3 having 50% by volume. The reflectance (62%) was larger than the reflectance (56%) of Sample 5 in which the volume ratio of the second inorganic insulating particles was 30% by volume or less.

  In Samples 3 and 5 to 7 having different inorganic insulating layer thicknesses, the reflectance of Sample 3 having an inorganic insulating layer thickness of 5.6 μm (62%) and the reflectance of Sample 5 having a thickness of 4.5 μm (59) %) Was larger than the reflectance (50%) of sample 6 in which the thickness of the inorganic insulating layer was 2.4 μm and the reflectance (42%) of sample 7 in which the thickness was 1.5 μm.

  Based on the above results, according to the light emitting element substrate in one embodiment of the present invention, the inorganic insulating layer has a plurality of first interconnected parts, the average particle diameter of which is smaller than the lower limit of the wavelength of visible light. Inorganic insulating particles, a plurality of second inorganic insulating particles made of zirconia having an average particle size larger than the lower limit of the wavelength of visible light and surrounded by the first inorganic insulating particles, the first inorganic insulating particles and the first inorganic insulating particles It was confirmed that the reflectance of visible light by the inorganic insulating layer can be increased and the brightness of the light emitting device can be improved by including the resin portion disposed in the gap surrounded by the two inorganic insulating particles.

DESCRIPTION OF SYMBOLS 1 Light emitting device 2 Light emitting element 3 Light emitting element substrate 4 Reflector 5 Cover member 6 Base part 7 Light emitting part 8 Lens part 9 First insulating layer 10 First conductive layer 11 Second insulating layer 12 Second conductive layer 13 Via conductor 14 Metal plate 15 First resin layer 16 First inorganic insulating layer 17 Surface resin layer 18 First resin 19 Filler particles 20 First inorganic insulating particles 21 Second inorganic insulating particles 22 Resin portion 23 Second resin layer 24 Second inorganic insulating layer 25 Support Sheet 26 Resin Precursor 27 Laminated Sheet G Gap T1 First Through Hole T2 Second Through Hole D Concave

Claims (4)

A light emitting element substrate on which a light emitting element that emits light upward is mounted,
Comprising an insulating layer comprising the inorganic insulating layer and constituting the upper surface of the substrate for light emitting element;
The inorganic insulating layer is
A plurality of first inorganic insulating particles whose average particle diameter is smaller than the lower limit value of the wavelength of visible light, partly connected to each other;
A plurality of second inorganic insulating particles made of zirconia having an average particle diameter larger than the lower limit of the wavelength of visible light and surrounded by the first inorganic insulating particles;
A resin portion disposed in a gap surrounded by the first inorganic insulating particles and the second inorganic insulating particles,
The upper surface of the inorganic insulating layer is located at a depth at which visible light entering the inside of the insulating layer reaches from the upper surface of the insulating layer, and the insulating layer is disposed on the lower surface of the inorganic insulating layer A resin layer;
The resin portion is the substrate for the light emitting element part of the resin layer is characterized Rukoto Do penetrate into the gap. The light emitting device substrate according to claim 1,
The insulating layer, the substrate for light-emitting element characterized in that further have a resin layer disposed on surfaces of the inorganic insulating layer. The light-emitting element substrate according to claim 1 or 2,
A substrate for a light emitting device, further comprising a metal plate disposed below the insulating layer. A substrate for light-emitting device according to any one of claims 1 to 3, the light emitting device characterized by comprising a light emitting element mounted on the substrate for the light emitting element.

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