JP6060518B2 - Electronic module - Google Patents

Description

  The present invention relates to an electronic module.

  Generally, when a power (voltage) amplifier mounted on a drive circuit operates, a temperature rise is caused by its own heat generation. In a high output power (voltage) amplifier that operates at a high frequency, particularly several W or more, a temperature rise accompanying heat generation is particularly remarkable, and it is usually mounted on a heat sink for stable operation.

  On the other hand, an optical element typified by a laser diode (LD) or a light emitting diode (LED) generally has an operating characteristic depending on temperature. In particular, a high-speed, high-power LD that operates at an LD output of 100 mV or more and exceeds an operating frequency of 1 GHz has a large temperature dependence and needs to be operated near room temperature for stable operation. Therefore, when mounting the LD, it is essential to control the temperature in consideration of the heat generation of the LD itself. For example, in Patent Document 1 below, in an optical module equipped with an LD, the thermal resistance from the semiconductor chip to the metal pedestal is reduced by using aluminum nitride having a high heat transfer coefficient for the substrate and copper tungsten for the metal pedestal. However, a technique for suppressing the temperature rise of the element is disclosed.

  Further, when an electronic module is configured by connecting a drive circuit and an LD mounting circuit, both must be arranged in consideration of heat transfer from the drive circuit to the LD mounting circuit. Conventionally, when the operating speed of the LD is sufficiently low, the thermal influence on the LD mounting circuit from the driving circuit can be reduced by taking a physical distance between the driving circuit and the LD mounting circuit. . However, in recent years, as the speed and output of an LD have increased, it is necessary to dispose the drive circuit and the LD mounting circuit closer to each other when considering impedance matching between the LD and the amplifier of the drive circuit. Has occurred.

  For example, in driving a high-speed and high-power LD having a frequency of 1 GHz or more and an amplitude exceeding 40 V, the amount of heat generated by the high-output power (voltage) amplifier can exceed 100 W, and the temperature of the drive circuit can be 50 ° C. or more. As described above, since the LD is desired to be driven at about room temperature, the LD is required to be sufficiently thermally disconnected from the drive circuit, that is, disposed away from the drive circuit. However, on the other hand, from the viewpoint of driving the LD at high speed, it is desirable that the drive circuit and the LD be arranged as close as possible. Therefore, there is a trade-off between shutting off the heat between the drive circuit and the LD and reducing the distance between the two, which is a major factor in further downsizing of electronic modules. It becomes a problem.

  1A and 1B are schematic views of such a conventional electronic module. FIG. 1A is a top view showing a schematic configuration of a conventional electronic module, and FIG. 1B is a side view corresponding to FIG. 1A. However, in FIG. 1B, some elements and devices shown in FIG. 1A are not shown. Referring to FIGS. 1A and 1B, the conventional electronic module 800 includes a first element 820 and a second element 830.

  The first element 820 includes a first heat sink 89 and a drive circuit 86 mounted on the first heat sink 89 via a mounting substrate 87. Further, the drive circuit 86 includes a high output power (voltage) amplifier 82. For impedance matching, an input side impedance matching circuit 81 is connected to the front stage of the high output power (voltage) amplifier 82, and an output side impedance matching circuit 83 is connected to the rear stage. Since the high output power (voltage) amplifier 82 mounted on the first element 820 generates significant heat as described above, in the following description, an element having a drive circuit exemplified by the first element 820 is used. This is also referred to as a heating element.

  The second element 830 includes a second heat sink 90 and an LD mounting circuit 88 mounted on the second heat sink 90 via a mounting substrate 87 common to the first element 820. The LD mounting circuit 88 has a high speed and high output LD 85. Since the high-speed and high-power LD 85 mounted on the second element 830 is required to operate at a constant temperature as described above, in the following description, it refers to an element having an LD mounting circuit exemplified by the second element 830. Is also referred to as a constant temperature operating element.

  In such a conventional electronic module 800, two paths can be considered as heat transfer paths from the first element 820 to the second element 830. The first heat transfer path is radiation (radiation) of heat between the first heat sink 89 and the second heat sink 90, and the second heat transfer path is heat conduction through the mounting substrate 87. is there.

  In the conventional electronic module 800, the following two measures are taken as measures against the heat transfer path. For the first heat transfer path, the first element 820 and the second element 830 are spaced apart from each other with a predetermined interval in order to reduce heat transfer. . That is, a gap B as a heat separation structure is provided between the first heat sink 89 and the second heat sink 90.

  Further, for the second heat transfer path, a signal line (not shown) on the surface of the mounting substrate 87, that is, a metal wire is cut off between the first element 820 and the second element 830. doing. Therefore, heat conduction from the first element 820 to the second element 830 through the metal wire on the surface of the mounting substrate 87 is prevented. Here, in order to electrically connect the first element 820 and the second element 830, a coupling capacitor 84 is mounted at a location corresponding to the gap B on the mounting substrate 87.

JP 2006-128545 A

  However, in the conventional electronic module represented by FIG. 1A and FIG. 1B, since the heating element and the constant temperature operation element use a common mounting board, the heat transfer through the mounting board is sufficiently suppressed. There was a problem that it was not done. As described above, heat transfer through the metal wire on the surface of the mounting substrate can be prevented, but heat transfer through the substrate itself, that is, the dielectric and metal thin film used in the substrate can occur. With the further miniaturization of electronic modules, it is necessary to consider the effect of heat transfer through such a substrate itself. Further, as the electronic module is further reduced in size, the gap between the heat sinks becomes smaller, so the influence of heat transfer due to heat radiation between the heat sinks cannot be ignored.

  Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to further suppress the transfer of heat between the heating element and the constant temperature operation element, and the heating element and the constant temperature operation element. It is an object of the present invention to provide a new and improved electronic module that can be placed closer together.

  In order to solve the above-described problem, according to an aspect of the present invention, a first element having an amplifier circuit and a second element driven and controlled by the first element are provided, and the first element The element includes a first heat sink, a first mounting board mounted on the first heat sink, and a first electric circuit mounted on the first mounting board, The second element includes a second heat sink, a second mounting board mounted on the second heat sink, and a second electric circuit mounted on the second mounting board; The first element and the second element are spaced apart from each other with a predetermined distance, and at least one passive connection is established between the first element and the second element. An electronic module is provided that is characterized by being made by an element.

  The passive element may be a capacitor.

  In addition, an interval between the first heat sink and the second heat sink in at least a part of a region of the first heat sink and the second heat sink facing each other is larger than the predetermined interval. You may have.

  In addition, an infrared reflective layer may be formed in at least a partial region of the surfaces of the first heat sink and the second heat sink facing each other.

  The infrared reflective layer may be made of gold.

  The first element has at least one first fixing pin that penetrates the first mounting substrate and the first heat sink around the passive element, and the second element. May have at least one second fixing pin that penetrates the second mounting substrate and the second heat sink around the passive element.

  Further, the first mounting board and the second mounting board are connected to each other, and the connected board corresponds to a gap between the first heat sink and the second heat sink. You may have at least 1 opening part in a site | part.

  The first mounting board and the second mounting board may be connected by a heat insulating material.

  As described above, according to the present invention, it is possible to dispose the heating element and the constant temperature operation element closer by further suppressing the transfer of heat between the heating element and the constant temperature operation element.

It is a top view which shows schematic structure of the conventional electronic module. It is a side view which shows schematic structure of the conventional electronic module. It is a top view which shows schematic structure of the electronic module which concerns on the 1st Embodiment of this invention. It is a side view showing a schematic structure of an electronic module concerning a 1st embodiment of the present invention. It is a top view which shows schematic structure of the electronic module which concerns on the 2nd Embodiment of this invention. It is a side view which shows schematic structure of the electronic module which concerns on the 2nd Embodiment of this invention. It is a top view which shows the other Example of the electronic module which concerns on the 2nd Embodiment of this invention. It is a top view which shows the other Example of the electronic module which concerns on the 2nd Embodiment of this invention. It is a top view which shows the other Example of the electronic module which concerns on the 2nd Embodiment of this invention. It is a side view which shows the other Example of the electronic module which concerns on the 2nd Embodiment of this invention. It is a top view which shows schematic structure of the electronic module which concerns on the 3rd Embodiment of this invention. It is a side view which shows schematic structure of the electronic module which concerns on the 3rd Embodiment of this invention. It is a top view which shows schematic structure of the electronic module which concerns on the 4th Embodiment of this invention. It is a side view which shows schematic structure of the electronic module which concerns on the 4th Embodiment of this invention.

  Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, duplication description is abbreviate | omitted by attaching | subjecting the same code | symbol.

<1. First Embodiment>
First, the schematic configuration of the electronic module according to the first embodiment of the present invention will be described with reference to FIGS. 2A and 2B. FIG. 2A is a top view illustrating a schematic configuration of the electronic module according to the first embodiment, and FIG. 2B is a side view corresponding to FIG. 2A. However, in FIG. 2B, illustration of some elements and devices shown in FIG. 2A is omitted. 2A and 2B, the electronic module 100 according to the first embodiment includes a first element 200 and a second element 300.

  The first element 200 includes a first heat sink 9 and a first electric circuit (hereinafter referred to as a drive circuit 6) mounted on the first heat sink 9 via the first mounting substrate 20. Have. The first heat sink 9 serves as a heat radiator, dissipates heat generated by the drive circuit 6, and lowers the temperature of the drive circuit 6. The first heat sink 9 is made of, for example, copper or aluminum having a high heat transfer coefficient. The first heat sink 9 may be connected to a larger separate heat sink or may have a cooling mechanism such as an air cooling fan or a Peltier element. The first heat sink 9 can be fixed on yet another structure. Here, in the following description, a heat sink, a heat spreader, and a structure having an equivalent function are all referred to as a heat sink.

  The drive circuit 6 includes a high output power (voltage) amplifier 2. Since the high output power (voltage) amplifier 2 normally has an input / output impedance as small as several Ω, the input impedance matching circuit 1 is connected to the preceding stage, and the output impedance matching circuit 3 is connected to the subsequent stage. Further, the impedance matching circuit may include an attenuator (attenuator) according to the driving method of the high-speed and high-power LD5. Here, FIG. 2A only shows a schematic configuration of the drive circuit 6, and the drive circuit 6 may be mounted with various elements not shown in FIG. 2A. In addition, since the high output power (voltage) amplifier 2 mounted on the first element 200 generates significant heat as described above, the following description has a drive circuit exemplified by the first element 200. The element is also referred to as a heating element.

  The second element 300 is a second electric circuit (hereinafter referred to as an LD mounting circuit 8) mounted on the second heat sink 10 via the second heat sink 10 and the second mounting substrate 30. Have. Since the function and configuration of the second heat sink 10 are the same as those of the first heat sink 9, detailed description thereof is omitted.

  The LD mounting circuit 8 has a high speed and high output LD5. The high speed and high output LD 5 is driven by the output from the first element 200. Here, FIG. 2A only shows a schematic configuration of the LD mounting circuit 8, and the LD mounting circuit 8 may be mounted with various elements not shown in FIG. 2A. In addition, since the high-speed and high-output LD 5 mounted on the second element 300 is required to operate at a constant temperature as described above, in the following description, an element having an LD mounting circuit exemplified by the second element 300 This is also referred to as a constant temperature operation element.

  The first element 200 and the second element 300 are spaced apart from each other with a predetermined interval in order to alleviate heat transfer. That is, a gap A as a heat separation structure is provided between the first heat sink 9 and the second heat sink 10.

  Here, the infrared reflective layer 13 may be formed in at least a partial region of each of the opposing surfaces of the first heat sink 9 and the second heat sink 10. The infrared reflection layer 13 can be formed of a pigment, glass, metal or the like having an effect of reflecting infrared rays. For example, when a metal is used, a gold film may be formed on the facing surface using a vapor deposition method, a plating method, or the like.

  Further, the coupling capacitor 4 is mounted at a location corresponding to the gap A between the first mounting substrate 20 of the first element 200 and the second mounting substrate 30 of the second element 300, The first element 200 and the second element 300 are electrically connected. That is, the gap A may be provided in accordance with the size of the coupling capacitor 4. Here, as the coupling capacitor 4, for example, a ceramic capacitor can be used. Heat transfer from the first element 200 to the second element 300 is also performed via the coupling capacitor 4, but ceramic has a lower thermal conductivity than copper normally used as a metal wiring, A thermal barrier effect can be expected. Here, the coupling capacitor 4 may not be a ceramic capacitor, but may be a capacitor using other materials such as an aluminum electrolytic capacitor. The coupling capacitor 4 may be other than a chip capacitor, and may be a capacitor having another shape such as an axial type. Furthermore, the electrical connection between the first element 200 and the second element 300 is not limited to that via a capacitor, and may be made by other passive elements.

  The input side impedance matching circuit 1 is provided with an input voltage terminal RFin and a control voltage terminal Vgg to which a control voltage for controlling the input voltage is applied. Here, for example, a high frequency signal may be input to the input voltage terminal RFin. Further, for example, a gate voltage may be applied to the control voltage terminal Vgg. The input voltage input to the drive circuit 6 is appropriately amplified by the high output power (voltage) amplifier 2 so as to correspond to the high speed and high output LD 5 to be driven, and is output to the LD mounting circuit 8. A power supply voltage terminal Vdd and a bias voltage terminal Bias are provided at both ends of the coupling capacitor 4, and an input current (voltage) to the high speed and high output LD 5 is controlled by appropriately applying a voltage to the terminals. . Here, for example, a drain voltage may be applied to the power supply voltage terminal Vdd. For example, an LD applied voltage (current) may be input to the bias voltage terminal Bias. Here, the circuit configuration for driving the high-speed and high-output LD 5 is not limited to this example. For example, the number and configuration of elements, the arrangement of terminals, and the like can be appropriately changed during circuit design.

  As described above, in the electronic module 100 according to the first embodiment of the present invention, unlike the conventional electronic module, the mounting substrate is divided into the first element 200 and the second element 300, for example, ceramic. Both are electrically and physically connected only by the capacitor. Thereby, the heat transfer path through the substrate from the first element 200 to the second element 300 can be eliminated, and a high heat blocking effect can be expected. In addition, an infrared reflection layer 13 may be formed on each of the opposing surfaces of the first heat sink 9 and the second heat sink 10. Thereby, heat transfer by radiation of heat between the heat sinks from the first element 200 to the second element 300 can be suppressed. Due to the above effects, the heating element and the constant temperature operation element can be arranged closer to each other. Here, the electronic module 100 according to the first embodiment of the present invention may have a size of about 80 mm × about 50 mm, for example, and in that case, the gap A may be about 1 mm. .

<2. Second Embodiment>
Next, a schematic configuration of the electronic module according to the second embodiment of the present invention will be described with reference to FIGS. 3A and 3B. FIG. 3A is a top view showing a schematic configuration of the electronic module according to the second embodiment, and FIG. 3B is a side view corresponding to FIG. 3A. However, in FIG. 3B, illustration of some elements and devices shown in FIG. 3A is omitted. Hereinafter, differences from the first embodiment will be mainly described, and detailed description of the same parts will be omitted.

  3A and 3B, the electronic module 100 according to the second embodiment of the present invention includes a first heat sink 9 and a second heat sink as compared with the electronic module according to the first embodiment. 10 is different in that a part of a region in a plane facing each other has a recess. By having the concave portion, the distance in the partial region between the first heat sink 9 and the second heat sink 10 is larger than the gap A in the first embodiment, that is, the gap that can be defined by the coupling capacitor 4. Also become wider. Therefore, heat transfer due to radiation between the heat sinks from the first element 200 to the second element 300 can be suppressed, and a further heat blocking effect can be expected.

  In addition, the shape of the concave portions of the surfaces of the first heat sink 9 and the second heat sink 10 facing each other is not limited to a substantially semicircular shape as shown in FIG. 3B, and may be a polygon or a rectangle. Moreover, in FIG. 3B, although the recessed part is formed over the whole surface where the 1st heat sink 9 and the 2nd heat sink 10 mutually oppose, a recessed part is formed in the at least one part area | region of each said opposing surface. May be.

  Moreover, the shape of the mutually opposing surfaces of the first heat sink 9 and the second heat sink 10 is not limited to the concave portion, and may be a shape in which the distance between the first heat sink 9 and the second heat sink 10 is increased. In this case, the same heat shielding effect can be expected. Examples of such a configuration are shown in FIGS. 4A, 4B, 4C, and 4D. 4A to 4C are top views illustrating another configuration example of the electronic module 100 according to the second embodiment, and FIG. 4D illustrates another configuration example of the electronic module 100 according to the second embodiment. It is a side view. 4A to 4D, components other than the first heat sink 9, the second heat sink 10, and the coupling capacitor 4 are not shown for the sake of simplicity.

  Referring to FIGS. 4A to 4C, the electronic module 100 according to the second embodiment changes not only the shape of the opposing surfaces of the first heat sink 9 and the second heat sink 10, but also the shape of the heat sink itself. Thus, the distance between the two may be increased. Referring to FIG. 4D, in the electronic module 100 according to the second embodiment, the distance between the first heat sink 9 and the second heat sink 10 gradually increases as the distance from the mounting substrate increases. You may have such an inclined structure. Here, the shapes of the first heat sink 9 and the second heat sink 10 are not limited to the shapes shown in FIG. 3 and FIGS. It does not matter. Further, the shapes of the first heat sink 9 and the second heat sink 10 are other than the concavity structure shown in FIG. 3B, the structures shown in FIGS. These structures can be applied in combination with each other as far as possible.

  As described above, the electronic module 100 according to the second embodiment of the present invention has a distance between the first heat sink 9 and the second heat sink 10 in addition to the structure described in the first embodiment. It further has a structure that makes it wider. Thereby, both heat transfer by conduction of heat through the substrate and heat transfer by heat radiation between the heat sinks can be suppressed. Therefore, the transfer of heat from the heating element to the constant temperature operation element can be effectively suppressed, and the heating element and the constant temperature operation element can be arranged closer to each other.

<3. Third Embodiment>
Next, a schematic configuration of an electronic module according to the third embodiment of the present invention will be described with reference to FIGS. 5A and 5B. FIG. 5A is a top view illustrating a schematic configuration of the electronic module according to the third embodiment, and FIG. 5B is a side view corresponding to FIG. 5A. However, in FIG. 5B, some elements and devices shown in FIG. 5A are not shown. Hereinafter, differences from the second embodiment will be mainly described, and detailed description of the same parts will be omitted.

  5A and 5B, the electronic module 100 according to the third embodiment of the present invention includes a first element 200 and a second element as compared with the electronic module according to the second embodiment. The difference is that at least one fixing pin 11 is provided around each of the 300 coupling capacitors 4. The fixing pin 11 may be formed of, for example, an iron-nickel alloy such as Invar.

  The fixing pin 11 provided in the first element is formed so as to penetrate the first mounting substrate 20 and the first heat sink 9. The fixing pin 11 provided in the second element is formed so as to penetrate the second mounting substrate 30 and the second heat sink 10. Here, a plurality of fixing pins 11 may be provided on each of the first element 200 and the second element 300. Further, the fixing pins 11 may be formed so as to reach the lower structures of the first heat sink 9 and the second heat sink 10, respectively.

  As described above, the first heat sink 9 and the second heat sink 10 are formed of, for example, copper or aluminum having high thermal conductivity. Since copper and aluminum have a large coefficient of thermal expansion, thermal expansion and contraction due to temperature change are significant. Accordingly, during the operation of the electronic module, physical stress due to thermal expansion and contraction of the heat sink is applied to the coupling capacitor 4. This physical stress does not pose a problem when used under a certain condition with little temperature change. However, when the temperature change is large, there is a problem in reliability from the viewpoint of connection between the first element 200 and the second element 300. There is a possibility.

  In contrast, in the electronic module 100 according to the third embodiment of the present invention, the fixing pin 11 that penetrates the mounting substrate and the heat sink is provided around the coupling capacitor 4. By providing the fixing pin 11, physical stress applied to the coupling capacitor 4 due to thermal expansion and contraction of the heat sink can be reduced. Therefore, while maintaining the effect of suppressing both the heat transfer by heat conduction through the substrate and the heat transfer by heat radiation between the heat sinks, that is, a further proximity arrangement of the heating element and the constant temperature operation element is realized. However, the connection reliability in the coupling capacitor 4 can be improved.

  Here, in the above description, the embodiment in which the fixing pin 11 is further provided for the second embodiment has been described, but the electronic module according to the third embodiment of the present invention is not limited to this example. For example, the third embodiment of the present invention may be an embodiment in which a fixing pin 11 is further provided with respect to the first embodiment.

<4. Fourth Embodiment>
Next, a schematic configuration of an electronic module according to the fourth embodiment of the present invention will be described with reference to FIGS. 6A and 6B. FIG. 6A is a top view showing a schematic configuration of an electronic module according to the fourth embodiment, and FIG. 6B is a side view corresponding to FIG. 6A. However, in FIG. 6B, the illustration of some elements and devices shown in FIG. 6A is omitted. Hereinafter, differences from the second embodiment will be mainly described, and detailed description of the same parts will be omitted.

  Referring to FIGS. 6A and 6B, the electronic module 100 according to the fourth embodiment of the present invention is different from the electronic module according to the second embodiment in that the first mounting substrate 20 and the second mounting module 20 The mounting substrate 30 is connected to each other, and is different in that at least one or more openings 12 are provided in a portion corresponding to the gap A of the connected mounting substrate (mounting substrate 7).

  By adopting this structure, the physical connection between the first element 200 and the second element 300 is made not only by the coupling capacitor 4 but also by a region other than the opening 12 in the connecting portion of the mounting substrate. Therefore, it is possible to reduce the load on the coupling capacitor 4 due to physical stress caused by thermal expansion and contraction of the heat sink.

  In the fourth embodiment of the present invention, since the first element 200 and the second element 300 are also connected by the mounting substrate, heat can be transmitted through the mounting substrate. However, since the mounting substrate has the opening 12, the area of the mounting substrate that contributes to the physical connection between the first element 200 and the second element 300 is smaller than that of the conventional electronic module. Therefore, the electronic module according to the fourth embodiment of the present invention can suppress the heat transfer through the substrate as compared with the conventional electronic module, and the heating element and the constant temperature operation element are arranged closer to each other. It becomes possible to do.

  Here, the connection between the first mounting board 20 and the second mounting board 30 may be made by a heat insulating material. By using the heat insulating material, it can be expected that the heat transfer from the first element 200 to the second element 300 through the region other than the opening 12 of the mounting substrate is further suppressed.

  As described above, in the electronic module 100 according to the fourth embodiment of the present invention, the first mounting board 20 and the second mounting board 30 include the structure described in the second embodiment. At least one or more openings 12 are provided in a portion corresponding to the gap A of the connected mounting substrates. By having the structure, physical stress applied to the coupling capacitor 4 can be reduced. Therefore, while maintaining the effect of suppressing both the heat transfer by heat conduction through the substrate and the heat transfer by heat radiation between the heat sinks, that is, a further proximity arrangement of the heating element and the constant temperature operation element is realized. However, the reliability of the connection between the heating element and the constant temperature operation element can be improved.

  Here, in the above description, the embodiment in which the opening 12 is provided by connecting the first mounting substrate 20 and the second mounting substrate 30 to the second embodiment has been described. The electronic module according to the fourth embodiment is not limited to this example. For example, the fourth embodiment of the present invention is an embodiment in which the first mounting substrate 20 and the second mounting substrate 30 are connected to the first embodiment or the third embodiment described above. May be.

  As described above, in the electronic module according to the present invention, the mounting substrate for the heating element and the constant temperature operation element is separated, or the physical connection area through the both substrates is made smaller than that of the conventional structure. Therefore, the transfer of heat by heat conduction through the substrate from the heating element to the constant temperature operation element is suppressed.

  In the electronic module according to the present invention, the distance between at least a part of the heat sink facing surfaces of the heat generating element and the constant temperature operation element is made wider than that of the conventional structure. In addition, an infrared reflective layer is provided in at least a partial region of the facing surface. Therefore, heat transfer due to heat radiation between the heat sinks from the heating element to the constant temperature operation element is suppressed.

  By having the above structure, the heating element and the constant temperature operation element can be arranged closer to each other. Further, as described above, since the LD has a large temperature dependency of the oscillation frequency, and characteristic deterioration particularly in a high temperature region is remarkable, stable operation of the LD and improvement of the life can be expected.

  The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious that a person having ordinary knowledge in the technical field to which the present invention pertains can come up with various changes or modifications within the scope of the technical idea described in the claims. Of course, it is understood that these also belong to the technical scope of the present invention.

  For example, in the first to fourth embodiments, the case where the heating element and the constant temperature operation element include a high output power (voltage) amplifier and a high speed and high output LD has been described. However, the present invention is limited to such an example. Not. For example, the present invention can also be applied to an optical integrated IC in which a heat generating element having an electric circuit on which an active element is mounted and a constant temperature operation element on which an optical element having a large temperature characteristic is installed are installed in close proximity.

  In the first to fourth embodiments, the electronic module has been described. However, the present invention can be applied to an element and IC level structure.

  In the first to fourth embodiments, the high-speed operation module used in the gigahertz band or higher has been described. However, the present invention can be applied to the entire frequency band.

  Moreover, in the said 4th Embodiment, although the opening part 12 has circular shape in FIG. 6A, the opening part 12 may have arbitrary shapes, such as an ellipse and a polygon.

  Moreover, each of the items described in the first to fourth embodiments can be implemented in combination within a possible range. For example, the structure described in the first embodiment in which an infrared reflecting layer is provided in at least a partial region of the facing surface of the first heat sink 9 and the second heat sink 10 in the second to fourth embodiments. You may apply.

DESCRIPTION OF SYMBOLS 100 Electronic module 200 1st element 300 2nd element 20 1st mounting board 30 2nd mounting board 1 Input side impedance matching circuit 2 High output power (voltage) amplifier 3 Output side impedance matching circuit 4 Coupling capacitor 5 High-speed and high-power laser diode (LD)
6 Driving Circuit 7 Mounting Board 8 LD Mounting Circuit 9 First Heat Sink 10 Second Heat Sink 11 Fixing Pin 12 Opening 13 Infrared Reflecting Layer

Claims (13)

A first element having an amplifier circuit;
A second element driven and controlled by the first element;
With
The first element includes a first heat sink, a first mounting board mounted on the first heat sink, and a first electric circuit mounted on the first mounting board. And
The second element has a second heat sink, a second mounting board mounted on the second heat sink, and a second electric circuit mounted on the second mounting board. And
The first element and the second element are spaced apart from each other with a predetermined interval,
The electrical connection between the first element and the second element is made by at least one capacitor ,
An electronic module , wherein an infrared reflecting layer is formed in at least a partial region of the mutually opposing surfaces of the first heat sink and the second heat sink . An interval between the first heat sink and the second heat sink in at least a part of a region of the first heat sink and the second heat sink facing each other is larger than the predetermined interval. The electronic module according to claim 1, wherein: The infrared reflective layer, characterized in that it is composed of gold, an electronic module according to claim 1 or 2. The first element has at least one first fixing pin passing through the first mounting substrate and the first heat sink around the capacitor.
The second element has at least one second fixing pin that penetrates the second mounting substrate and the second heat sink around the capacitor. 3 electronic module according to any one of. The first mounting board and the second mounting board are connected to each other,
The said connected board | substrate has at least 1 opening part in the site | part corresponding to the space | gap between a said 1st heat sink and a said 2nd heat sink, The any one of Claims 1-4 characterized by the above-mentioned. The electronic module according to item. The electronic module according to claim 5 , wherein the first mounting board and the second mounting board are connected by a heat insulating material. A first element having an amplifier circuit;
A second element driven and controlled by the first element;
With
The first element includes a first heat sink, a first mounting board mounted on the first heat sink, and a first electric circuit mounted on the first mounting board. And
The second element has a second heat sink, a second mounting board mounted on the second heat sink, and a second electric circuit mounted on the second mounting board. And
The first element and the second element are spaced apart from each other with a predetermined interval,
The electrical connection between the first element and the second element is made by at least one capacitor,
The first element has at least one first fixing pin passing through the first mounting substrate and the first heat sink around the capacitor.
The second element has at least one second fixing pin that penetrates the second mounting substrate and the second heat sink around the capacitor.
An electronic module characterized by that. An interval between the first heat sink and the second heat sink in at least a part of a region of the first heat sink and the second heat sink facing each other is larger than the predetermined interval.
The electronic module according to claim 7, wherein: The first mounting board and the second mounting board are connected to each other,
The connected substrate has at least one opening at a portion corresponding to a gap between the first heat sink and the second heat sink.
The electronic module according to claim 7 or 8, characterized in that. The first mounting board and the second mounting board are connected by a heat insulating material.
The electronic module according to claim 9, wherein: A first element having an amplifier circuit;
A second element driven and controlled by the first element;
With
The first element includes a first heat sink, a first mounting board mounted on the first heat sink, and a first electric circuit mounted on the first mounting board. And
The second element has a second heat sink, a second mounting board mounted on the second heat sink, and a second electric circuit mounted on the second mounting board. And
The first element and the second element are spaced apart from each other with a predetermined interval,
The electrical connection between the first element and the second element is made by at least one capacitor,
The first mounting board and the second mounting board are connected to each other,
The connected substrate has at least one opening at a portion corresponding to a gap between the first heat sink and the second heat sink.
An electronic module characterized by that. An interval between the first heat sink and the second heat sink in at least a part of a region of the first heat sink and the second heat sink facing each other is larger than the predetermined interval.
The electronic module according to claim 11, wherein: The first mounting board and the second mounting board are connected by a heat insulating material.
The electronic module according to claim 11 or 12, characterized by the above.

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