JP6050103B2 - Vacuum heating pressure sealing molding apparatus and vacuum heating pressure sealing molding method - Google Patents

Description

The present invention seals a substrate bonded with elements such as a semiconductor, a resistor and / or a capacitor with a sealing sheet, and vacuum heating and pressure sealing for molding a sealing sheet sealing the elements on the substrate The present invention relates to a molding apparatus and a vacuum heating and pressure sealing molding method. The vacuum heating and pressure sealing molding apparatus and the vacuum heating and pressure sealing molding method according to the present invention include a case where an element is bonded on a substrate in advance, and the element is disposed on the substrate via an adhesive. Can be applied to the case where the element is bonded to the substrate and the element is sealed to the substrate by a sealing sheet.

  When sealing an element on a substrate, the element is sealed on the substrate under pressure by a sealing sheet heated and softened under vacuum in order to prevent air from entering between the sealing sheet, the substrate and the element. Join. For this purpose, the applicant can adjust the fine pressing force while preventing air from entering the sealing layer (bonding layer) in vacuum, and the thickness of the sealing layer under moderate pressure. An apparatus and method for vacuum heating and pressurization that can uniformly seal and bond an element on a substrate are provided. Patent Document 1.

  However, the normally sealed substrate with an element is required to have a uniform overall height and is designated in the drawing, but the present inventor, in the vacuum heating and pressure sealing device and method of Patent Document 1, It has been found that the flatness of the upper surface of the sealing layer on the element of the obtained product is not sufficient, and that it is difficult to make the entire height of the sealed element-equipped substrate accurate and uniform. Furthermore, it has been found that when the plurality of elements on the substrate are different in height, the sealing sheet on the plurality of elements has a flatness, and thus cannot be accurately attracted and moved during assembly.

Japanese Patent Application 2011-199295

  The present invention uses a single vacuum heating and pressure sealing molding apparatus to prevent air from being mixed into the element and the substrate and the sealing sheet in heating and vacuum, while the element is accurately placed on the substrate by the sealing sheet. For example, by forming the sealing sheet in which the element is sealed in a softened state, sufficient flatness is imparted to the upper surface of the sealing sheet on the element, and sealing is performed. It is an object of the present invention to make it possible to make the entire height of a substrate with an element uniform with high accuracy.

(1) The present invention is a vacuum heating and pressure sealing / molding device for vacuum heating and pressure sealing / molding of an element on a substrate. A lower frame for forming a vacuum chamber;
2. A vacuum chamber forming upper frame disposed above a vacuum chamber forming lower frame, wherein the space between the vacuum chamber forming lower frame and the vacuum chamber forming upper frame is hermetically sealed to form a vacuum chamber inside Is formed, and the vacuum chamber forming upper frame body in which the workpiece can be taken out in a state where the vacuum chamber forming lower frame body and the vacuum chamber forming upper frame body are separated from each other,
3. A substrate table that is arranged inside a lower frame body for forming a vacuum chamber, and on which a substrate is placed, an element is arranged on the substrate, and a sealing sheet is placed on the element, Alternatively, on the sealing sheet, a substrate table that is adapted to place a pressure-release film extending radially outward from the sealing sheet, and
4). A heating device for heating and softening the sealing sheet on the element;
5. A vacuum exhaust and high-pressure gas introduction hole provided in either the vacuum chamber forming lower frame or the vacuum chamber forming upper frame;
6). An inner member that extends downward from the lower surface inside the upper frame body for forming a vacuum chamber, and the inner member is lowered so that the heat-softened sealing sheet is hermetically sealed between its lower end and the substrate table. Or an inner member adapted to be able to sandwich a pressure-release film on a sealing sheet,
7). It is characterized by comprising a molding die that seals an element on a substrate with a heat-softened sealing sheet and then presses the sealing sheet still softened onto the element to perform predetermined molding.

The preferred embodiments of the vacuum heating and pressure sealing / molding apparatus according to the present invention will be described below.
(2) The vacuum chamber forming lower frame body includes a lower frame member, the vacuum chamber forming upper frame body includes an upper frame member, and the vacuum chamber forming lower frame body or the vacuum chamber forming upper frame body further includes The lower frame member and the upper frame member have a sliding member that hermetically slides on the inner circumferential surface or the outer circumferential surface of the lower frame member, and the sliding frame body is slid to slide the lower frame member, the sliding frame body, A vacuum chamber is formed inside the frame member in an airtight manner, while a work piece can be taken in and out while the slide frame body is slid and the lower frame member and the upper frame member are separated from each other. The vacuum heating and pressure sealing / molding apparatus according to (1).
(3) The vacuum chamber forming lower frame and the vacuum chamber forming upper frame are moved relative to each other so that they are in contact with each other to form a vacuum chamber, while the vacuum chamber forming lower frame and the vacuum chamber are formed. The vacuum heating and pressure sealing / molding apparatus according to (1), wherein the workpiece can be taken in and out with the upper frame body relatively moved and separated.
(4) Sealing sheet or pressure release film heated and softened between the lower end portion of the inner member and the substrate table by moving the vacuum chamber forming lower frame and the vacuum chamber forming upper frame relative to each other. The vacuum heating and pressure sealing / molding apparatus according to (3), which can be hermetically sandwiched.

(5) A mold for pressing the heat-softened sealing sheet onto the element is arranged inside the vacuum chamber forming upper frame, and the vacuum chamber forming lower frame and the vacuum chamber forming upper frame are relatively moved. The vacuum heating and pressure sealing / molding apparatus according to (4), wherein the molding die is pressed against the element by a sealing sheet or a pressure-release film and a sealing sheet in a heat-softened state.
(6) The vacuum heating and pressure sealing / molding apparatus according to any one of (1) to (3), wherein the inner member is a pressing cylinder mechanism attached to the lower surface of the intermediate moving plate.
(7) When the molding die is not molded, it is retracted to the inner non-molding position of the vacuum chamber forming upper and lower frame members and is moved to the molding position inside the inner member during molding. ) To (6) The vacuum heating and pressure sealing / molding apparatus according to any one of the above.
(8) The vacuum heating and pressure sealing / molding device according to any one of (1) to (6), wherein the heating device is provided on the substrate table and the molding die.

(9) The vacuum heating and pressure sealing / molding device according to any one of (1) to (6), wherein the heating device is a light irradiation device such as a halogen lamp or an infrared, laser, or far infrared irradiation device.
(10) The vacuum chamber forming lower frame and the substrate table are arranged on the slide moving table, and the substrate and the substrate are sealed against the substrate table by taking out the vacuum chamber forming lower frame and the substrate table to the outside by the slide moving table. The vacuum heating and pressure sealing / molding apparatus according to any one of (1) to (8), wherein the stop sheet or the substrate, the sealing sheet, and the pressure release film are easily attached and detached.
(11) The vacuum heating process according to any one of (1) to (9), wherein the pressurizing mechanism for forming the vacuum chamber uses an air press pressure, a hydraulic press pressure, a servo press pressure, or an autoclave. Pressure sealing / molding equipment.

The present invention further relates to a vacuum heating and pressure sealing / molding method comprising the following steps.
1. With the vacuum chamber opened, the substrate is placed on a substrate table placed in the vacuum chamber, the device is placed on the substrate, the sealing sheet is placed on the device, or the sealing sheet is placed on the sealing sheet. Furthermore, a pressure release film extending radially outward from the sealing sheet is disposed,
2. Close the vacuum chamber and evacuate the vacuum chamber,
3. Heat-softening the sealing sheet or sealing sheet and pressure-release film,
4). The outer periphery of the heat-softened sealing sheet or pressure release film is hermetically pressed onto the substrate table, and the space formed by the heat-softened sealing sheet or pressure release film and the substrate table is kept in a vacuum state,
5. In this state, the inside of the vacuum chamber is opened to atmospheric pressure and the atmosphere is introduced, or if necessary, a high-pressure gas is further introduced and pressurized, and the element is sealed to the substrate with a heat-softened sealing sheet,
6). The mold is pressed onto the sealing sheet or pressure-release film and sealing sheet that are still in a softened state substantially at that position to perform predetermined molding.
In addition, the adhesiveness of the adhesive surface of a sealing sheet can be raised by reducing the volume of a vacuum chamber in the said process 5, and increasing the pressure inside a vacuum chamber.

According to the present invention, an element is sealed on a substrate with a heat-softened sealing sheet or a heat-softened pressure release film and a sealing sheet, and the element is sealed or heated while maintaining the heat-softened state on the element. Since the pressure release film and the sealing sheet are molded, sufficient flatness is obtained on the upper surface of the sealing layer on the element of the obtained product, and the entire height of the sealed element-equipped substrate is precisely uniform. Can be. Therefore, when assembling a substrate with an element that has been sealed and molded, an accurate suction movement can be performed.
Further, in the case where sealing is performed along the elements by positive pressure and flat pressing is performed, the sealing sheet extruded into the gap between the elements flows into the substrate and the plurality of elements can be more integrated.
Furthermore, when sealing through a pressure peeling film, there may be few sealing sheets, the local sealing for every several element will be possible, and the embossing to those localities can be performed simultaneously.

1 is a schematic cross-sectional view of a first embodiment of a vacuum heating and pressure sealing molding apparatus according to the present invention, wherein a vacuum chamber forming lower frame body and a vacuum chamber forming upper frame body are separated from each other, and a workpiece is shown. Shows the state of being placed inside. FIG. 3 is a schematic cross-sectional view showing a step of setting a substrate, an element, and a sealing sheet in the first embodiment of the vacuum heating and pressure sealing molding apparatus according to the present invention. FIG. 2 is a schematic cross-sectional view showing vacuum chamber formation, sealing sheet heating / softening, and evacuation process of the first embodiment of the vacuum heating and pressure sealing and molding apparatus according to the present invention. 1 is a schematic cross-sectional view showing a sealing sheet pressing step of a first embodiment of a vacuum heating and pressure sealing molding apparatus according to the present invention. FIG. 3 is a schematic cross-sectional view showing a process of positively pressurizing the inside of the vacuum chamber of the first embodiment of the vacuum heating and pressurizing and sealing apparatus according to the present invention. FIG. 3 is a schematic cross-sectional view showing a sealing sheet forming step by a forming die of the first embodiment of the vacuum heating and pressure sealing forming apparatus according to the present invention. It is typical sectional drawing which shows the sealing sheet shaping | molding process by the shaping | molding die of the 2nd embodiment of the vacuum heating pressurization sealing shaping | molding apparatus which concerns on this invention. It is typical sectional drawing which shows the setting process of the board | substrate of the 3rd embodiment of the vacuum heating pressurization sealing molding apparatus which concerns on this invention, an element, a sealing sheet, and a pressurization peeling film. It is typical sectional drawing which shows the heating / softening of the vacuum chamber formation of the 3rd embodiment of the vacuum heating pressurization sealing shaping | molding apparatus which concerns on this invention, a sealing sheet, and a pressure peeling film, and a evacuation process. The typical sectional view showing the pressing process of the sealing sheet and pressure release film of the 3rd embodiment of the vacuum heating pressure sealing molding device concerning the present invention is shown. It is typical sectional drawing which shows the process of carrying out the positive pressure pressurization inside the vacuum chamber of the 3rd embodiment of the vacuum heating pressurization sealing molding apparatus which concerns on this invention. It is typical sectional drawing which shows the shaping | molding process of the sealing sheet and pressurization peeling film by the shaping | molding die of the 3rd embodiment of the vacuum heating pressurization sealing molding apparatus which concerns on this invention. It is typical sectional drawing which shows the setting process of the board | substrate of the 4th embodiment of the vacuum heating pressurization sealing molding apparatus using the halogen lamp which concerns on this invention, an element, and a sealing sheet. It is typical sectional drawing which shows the vacuum chamber formation of the 4th embodiment of the vacuum heating pressurization sealing molding apparatus which concerns on this invention, the heating and softening of a sealing sheet, and a vacuum drawing process. The typical sectional view showing the sealing sheet pressing process of the 4th embodiment of the vacuum heating pressurization molding device concerning the present invention is shown. It is typical sectional drawing which shows the process of carrying out the positive pressure pressurization inside the vacuum chamber of the 4th embodiment of the vacuum heating pressurization sealing molding apparatus which concerns on this invention. It is typical sectional drawing which shows the shaping | molding die movement process of the 4th embodiment of the vacuum heating press-sealing shaping | molding apparatus which concerns on this invention. It is typical sectional drawing which shows the sealing sheet shaping | molding process by the shaping | molding die of the 4th embodiment of the vacuum heating pressurization sealing shaping | molding apparatus which concerns on this invention. It is typical sectional drawing which shows the setting process of the board | substrate of the 5th embodiment of the vacuum heat pressurization sealing molding apparatus which concerns on this invention, an element, a sealing sheet, and a pressurization peeling film. A structure for sealing an element on a substrate and a molding example using a mold will be described. In the state where the positive pressure port and the vacuum port are closed, the pressure of the air in the vacuum chamber is set to 0.1 MPa, and the downward movement distance (down stroke) and the measured internal pressure when the intermediate movement plate is lowered are shown.

In the vacuum heating and pressure sealing molding apparatus and the vacuum heating and pressure sealing molding method according to the present invention, when the sealing sheet is directly pressure sealed to the element on the substrate, and further pressurized on the sealing sheet. The present invention can be applied to a case where a release film is placed and the sealing sheet is indirectly pressed through the pressure release film to press-seal the device on the substrate. Further, in the process of pressure-sealing the molding die, there are cases where the molding process is performed by retreating outward from the molding position and moving to the molding position during molding, and cases where the molding process is not performed outward.
Below, based on the specific embodiment shown in figure, the vacuum heating press sealing molding apparatus and vacuum heating press sealing molding method which concern on this invention are demonstrated. These embodiments are merely examples and do not limit the present invention, and it is easy for those skilled in the art that various modifications and changes can be easily made within the scope of the claims.

In addition, in this invention, the following are said as an element and a sealing sheet.
In the present invention, “element” refers to an element such as an IC element, a semiconductor, a resistor, and / or a capacitor. The substrate may be a rigid substrate or a flexible substrate, and the number of elements bonded on the substrate may be one or a plurality of elements, and the heights may be the same or different. The “sealing sheet” is an adhesive sheet for sealing. The sealing sheet is placed on the element, the resin is flowed by heat and pressure, and vacuum heating and pressure sealing bonding is performed. The thickness is, for example, a thin film sheet for bonding and sealing of about 0.2 to 5 mm. The heat-softened sealing sheet bonds the element to the substrate by vacuum heating and pressure sealing, and reinforces the element to the substrate from the outer surface. To join. As the sealing sheet, an epoxy resin is mainly used, and urethane rubber, silicone rubber or the like can be used, and functions as an adhesive layer that is heat-cured.

  The “pressure release film” is a heat-resistant film or heat-resistant soft rubber that is softened by heating at atmospheric pressure, and has a property of stretching while maintaining strength under heating / pressure. In the present invention, the heating temperature is the softening temperature of the pressure-release film, and is, for example, 100 to 300 ° C. The material of the pressure release film can be a resin or rubber that is heat resistant and easily softened, and has a thickness of 30 to 1000 μm, for example. As the pressure release film, a heat-resistant release film can be used, and for example, PET, olefin resin, fluorine rubber, or silicone rubber can be used. In the present invention, depending on the thickness, it may be more appropriate to express “sheet” than “film”. In the present invention, “pressure release film” is “pressure release sheet”. Is also intended to be included.

(First embodiment)
FIG. 1 is a schematic cross-sectional view of a first embodiment of a vacuum heating and pressure sealing molding apparatus according to the present invention. An element is sealed on a substrate using an adhesive sealing sheet from a single vacuum heating and pressure sealing molding apparatus, and the element is directly pressure-sealed by a sealing sheet on the substrate using a molding die. Process.
In this vacuum heating pressure sealing molding apparatus, a pressure cylinder lower plate 2 is disposed on a base 1, a slide moving table 3 is placed on the pressure cylinder lower plate 2, and the slide cylinder 4 is a rod. Is connected to the side of the slide moving table 3. A lower frame member placing table 5 is placed on the slide moving table 3, a lower heating plate 7 is placed above the lower frame member placing table 5, and a substrate placing table 8 is placed on the lower heating plate 7. A substrate 10 with an element 9 is disposed on the substrate 9, and a sealing sheet 11 is disposed on the element 9.

  Further, a lower frame member 12 is airtightly fixed and erected on the outer peripheral surface of the lower frame member mounting table 5 outside the substrate mounting table 8, and the lower frame member forming table 5 and the lower frame member 12 form a lower frame for forming a vacuum chamber. The body is formed. With the vacuum chamber opened, the slide moving table 3 is moved in and out of the vacuum heating and pressure sealing molding apparatus by the slide cylinder 4 to thereby provide the lower frame member table 5, the lower heating plate 7 and the substrate on the slide moving table 3. The mounting table 8 and the lower frame member 12 can be taken in and out together with a vacuum heating and pressure sealing molding device, whereby the workpiece (substrate with element and sealing sheet) is placed on the substrate mounting table 8 and vacuum heated. It is possible to move into the pressure sealing molding apparatus and take out the sealing molded product from the apparatus. In the present embodiment, the plurality of elements 9 are bonded and fixed in advance to the upper surface of the substrate 10. However, if the elements can be accurately positioned on the upper surface of the substrate, an adhesive such as a thermoplastic adhesive is used. The element may be disposed on the upper surface of the substrate.

  A plurality of support columns 13 are erected on the base 1, and a pressure cylinder upper plate 14 is fixed to an upper end portion of the support column 13. An intermediate moving plate 15 is slidably disposed below the pressure cylinder upper plate 14 through a support column 13, and an upper heating plate 17 is fixed below the intermediate moving plate 15 via a heat insulating plate 16. . The upper heating plate 17 functions as a heater for film softening, and the lower heating plate 7 functions as a heater for substrate preheating or adhesive thermosetting. An upper frame member 18 corresponding to the lower frame member 12 extends airtightly from the lower surface of the intermediate moving plate 15 to the outside of the heat insulating plate 16. The upper frame member forming vacuum chamber is formed by the intermediate moving plate 15 and the upper frame member 18. The body is formed. A sliding member 19 is provided on the outer periphery of the upper frame member 18 so as to be airtightly slidable. The sliding member 19 is moved up and down by a sliding cylinder 20 on the upper plate of the pressure cylinder, and is lowered to lower frame member. 12 is made slidable on the outer periphery of the lower frame member 12, and the vacuum chamber is formed inside by maintaining airtightness between the lower frame member 12, the sliding member 19 and the upper frame member 18.

  An inward member 24 extending downward from the outer peripheral portion of the lower surface of the heat insulating plate 16 is fixed. The inner member 24 includes a rod 24a having one end fixed to the lower surface of the heat insulating plate 16, a frame-shaped presser portion 24b provided at the lower end of the rod, and a spring 24c disposed around the rod 24a. . The frame-shaped presser portion 24b is urged downward by a spring with respect to the rod 24a, and is pressed from below to be movable upward, so that the shock when the frame-shaped presser portion 24b abuts on the substrate table 8 is buffered. To do. The sealing sheet 11 is hermetically held between the frame-shaped pressing portion 24 b at the lower end portion of the inner member 24 and the substrate table 8.

A pressure cylinder 22 is disposed on the upper surface of the pressure cylinder upper plate 14, and a cylinder rod 23 of the pressure cylinder 22 passes through the pressure cylinder upper plate 14 and is fixed to the upper surface of the intermediate moving plate 15. Accordingly, the intermediate moving plate 15, the upper heating plate 17, the upper frame member 18, and the inner member 24 can be moved up and down integrally. A stopper (not shown) is provided for restricting the downward movement of the intermediate moving plate 15, the upper heating plate 17, and the upper frame member 18 by the pressurizing cylinder 22, and when the intermediate moving plate 15 is lowered by a predetermined distance, it is further lowered. Can also be prevented. As the pressure cylinder 22 and the sliding cylinder 20, a hydraulic cylinder, a pneumatic cylinder, a servo cylinder, or the like can be used.

  A molding die 21 is detachably attached to the lower surface of the upper heating plate 17 so that the molding die can be replaced depending on the molding purpose. In the present embodiment, the intermediate moving plate is provided with a positive pressure port 25 and a vacuum port 26. However, the positive pressure port and the vacuum port are set as one opening, and the opening is selectively connected to the positive pressure pressurizer and the vacuum exhauster through a solenoid valve and a switch so that the opening is a positive pressure port or It may be used as a vacuum port. This aspect is also included in the present invention.

(First embodiment: When a pressure release film is not used)
Below, based on Fig.2 (a) thru | or FIG.2 (e), operation | movement of the 1st embodiment of the vacuum heating pressurization sealing molding apparatus which concerns on this invention is demonstrated. 2A to 2E, the support column 13, the pressure cylinder upper plate 14, the pressure cylinder 22, the rod 23, and piping are omitted for simplification.
(1) Step of Setting Substrate, Element, and Sealing Sheet FIG. 2A shows a slide moving table 3, a lower frame member base 5, a lower frame member 12, and a lower frame by a slide cylinder 4 with the vacuum chamber opened. The heating plate 7 and the substrate mounting base 8 (for the sake of simplicity, these members are collectively referred to as “lower members”) are pulled out to the outside, and the substrate 10 with the element 9 disposed thereon is placed on the substrate base 8. A state in which the lower member is inserted into a predetermined position below the inner member 12 by the slide cylinder 4 after the sealing sheet 11 is placed thereon is shown.

(2) Vacuum chamber formation, sealing sheet softening, evacuation step FIG. 2B shows that the sliding member 19 is lowered by a predetermined distance by the sliding cylinder 20 and is slid airtightly on the outer periphery of the lower frame member 12, The space between the lower frame member 12, the sliding member 19 and the upper frame member 18 is kept airtight, a vacuum chamber is formed inside, the sealing sheet is heated and softened in the atmosphere, and vacuum is drawn through the vacuum port 26. The process to perform is shown. At this time, as shown in FIG. 2B, the sealing sheet 11 is inclined downward from the edge of the upper surface of the element 9 to the outer peripheral edge, and the outermost edge of the outer peripheral portion is a frame shape of the inner member 24. It extends to a position corresponding to the lower surface of the pressing portion 24b and touches the upper surface of the substrate table 8. The space inside the vacuum chamber and between the substrate table 8 and the sealing sheet 11 is evacuated by evacuation. When evacuating, the positive pressure port 25 is closed and the vacuum port 26 is opened.

(3) Sealing sheet pressing step FIG. 2 (c) shows that the intermediate moving plate 15, the upper heating plate 17, the upper frame member 18, and the inner member 24 (hereinafter referred to as the inner moving plate 15) are applied by the pressure cylinder 22 while evacuating under heating. In addition, for the sake of brevity, they are collectively referred to as an “upper member”), and the outer peripheral portion of the heat-softened sealing sheet 11 of the frame-like pressing portion 24b of the inner member 24 is stopped at a predetermined position. The process of airtightly pressing between the lower surface and the upper surface of the substrate mounting table 8 is shown. At this position, the mold 21 is located above the sealing sheet 11 and is not in contact with the sealing sheet. In addition, the space formed between the substrate table 8 and the sealing sheet 11 is kept in a vacuum state.

(4) Step of positively pressurizing the inside of the vacuum chamber Next, as shown in FIG. 2 (d), the vacuum port 26 is closed, the positive pressure port 25 is opened to introduce the atmospheric pressure, and the positive pressure port is used as necessary. The high pressure gas is introduced through the pressure, the pressure state is maintained, and the element 9 is sealed on the substrate 10 under pressure by the sealing sheet 11.

(5) Sealing sheet forming step by forming mold As shown in FIG. 2 (e), the upper member is integrally lowered by the pressure cylinder 22, and the lower surface of the forming mold is brought into contact with the sealing sheet for sealing. A predetermined forming process is performed on the sheet. In this case, a stopper (not shown) for the pressure cylinder 22 is provided, and the mold is stopped at a predetermined position. When stopping, the lower surface of the upper frame member 18 and the upper surface of the upper end of the lower frame member 12 may be brought into contact with each other without using the stopper of the pressure cylinder. In addition, when the pressure in the vacuum chamber is increased, in addition to the method of pressurizing and increasing the pressure by a predetermined stroke after press molding in FIG. 2 (d), the mold is brought into contact with the sealing sheet and molded at an appropriate position. There is a method in which the pressure increasing sealing is completed, the pressure increasing is stopped, the exhaust is exhausted, and the pressure is further lowered and brought into contact.
(6) Product removal, new element-attached substrate and sealing sheet arrangement step The upper member is moved upward by the pressure cylinder 22, the lower member is taken out by the slide cylinder 4, the product is recovered, and the substrate mounting table 8 The new element-equipped substrate 10 and the sealing sheet 11 are disposed on the lower member, and the lower member is returned to the pressure forming position by the slide cylinder 4 again (FIG. 2A).

(Second Embodiment)
FIG. 3 shows a second embodiment of the vacuum heating and pressure sealing molding apparatus according to the present invention.
In this embodiment, the sliding member 19 and the sliding cylinder 20 are omitted, and the upper surface of the upper frame portion 12 and the bottom surface of the lower frame member 18 are brought into airtight contact with the pressurizing cylinder 22a so that the inside is vacuumed. The chamber is the same as that of the first embodiment of the vacuum heating and pressure sealing molding apparatus except that the inner member 24 below the heat insulating plate 16 and the upper heating plate 17 are moved up and down by the cylinder mechanism 22b. . Therefore, detailed description is omitted.

(Third embodiment: When using a pressure release film)
4 (a) to 4 (e) show a third embodiment of the vacuum heating and pressure sealing molding apparatus according to the present invention. This embodiment is a vacuum heating and pressure sealing molding apparatus according to the present invention. The first embodiment is the same as the first embodiment except that a pressure-release film is used. 4A to 4E correspond to FIGS. 2A to 2E, respectively. 4A to 4E, the support column 13, the pressure cylinder upper plate 14, the pressure cylinder 22, and the rod 23 are omitted for simplification.

(1) Step of Setting Substrate, Element, Pressure Release Film, and Pressure Release Film FIG. 4A shows a step of setting the substrate 10, element 9, sealing sheet 40, and pressure release film 41. The difference between FIG. 4A and FIG. 2A is only that the pressure release film 41 is further placed on the sealing sheet 40. The size of the pressure release film 41 is not limited as long as the pressure release film can be kept airtight between the frame-shaped pressing portion 24 b at the lower end portion of the inner member 24 and the substrate table 8. In this case, the size of the sealing sheet may be the same as the size of the pressure release film, or may be a size necessary for sealing the element on the substrate. In the latter case, the amount of sealing sheet used can be reduced. In addition, local sealing at a plurality of locations is possible, and the local embossing can be performed simultaneously.

(2) Vacuum chamber formation, heat release softening of pressure release film and sealing sheet, vacuum drawing step FIG. 4 (b) shows the sliding member 19 lowered by a predetermined distance by the sliding cylinder 20 on the outer periphery of the lower frame member 12. A process of sliding airtightly, forming a vacuum chamber inside, heating and softening the sealing sheet 40 and the pressure release film 41 in the atmosphere, and drawing a vacuum through the vacuum port 26 is shown. At this time, as shown in FIG. 4B, the pressure release film 41 is inclined downward from the edge of the upper surface of the element 9 to the outer peripheral edge via the sealing sheet 40, and the outermost edge of the outer peripheral portion. Extends to a position corresponding to the lower surface of the frame-shaped pressing portion 24 b of the inner member 24, and touches the upper surface of the substrate table 8. The sealing sheet 40 is tilted following the pressure release film 41 tilting downward. The space in the vacuum chamber and between the substrate table 8 and the pressure release film 41 is brought to a vacuum state by evacuation.

(3) Sealing sheet pressing step FIG. 4 (c) shows that the intermediate moving plate 15, the upper heating plate 17, the upper frame member 18, and the inner member 24 are integrated by the pressure cylinder 22 while evacuating under heating. The outer peripheral portion of the pressure release film 41 heated and softened is hermetically pressed between the lower surface of the frame-shaped presser portion 24b of the inner member 24 and the upper surface of the substrate table 8. Indicates. At this position, the mold 21 is located above the pressure release film 41 and is not in contact with the pressure release film 41. Further, the space formed between the substrate table 8 and the pressure release film 41 is kept in a vacuum state.

(4) Step of positively pressurizing the inside of the vacuum chamber Next, as shown in FIG. 4 (d), the vacuum port 26 is closed, the positive pressure port 25 is opened and atmospheric pressure is introduced, and the positive pressure port is used as necessary. The high pressure gas is introduced through the pressure and the pressurized state is maintained, and the element 9 is sealed onto the substrate 10 under pressure by the sealing sheet 40 through the pressure release film 41.

(5) Sealing sheet forming step by forming mold As shown in FIG. 4 (e), the upper member is integrally lowered by the pressure cylinder 22, and the lower surface of the forming mold is sealed through the pressure release film 41. A predetermined pressure forming process is performed on the sealing sheet by bringing it into contact with the stop sheet. In this case, a stopper (not shown) for the pressure cylinder 22 is provided, and the mold is stopped at a predetermined position. As described above, when stopping, the upper frame member 18 and the lower plate member 12 may be brought into contact with each other without using the stopper of the pressure cylinder.
(6) Product removal, new element-attached substrate, sealing sheet, and pressure release film placement step The product is moved upward by the pressure cylinder 22, the lower member is taken out by the slide cylinder 4, and the product is recovered and the substrate A new substrate 10 with an element, a sealing sheet 40, and a pressure release film 41 are arranged on the mounting table 8, and the lower member is returned to the pressure forming position by the slide cylinder 4 again (FIG. 4A).

(Fourth embodiment)
FIG. 5A to FIG. 5F show a fourth embodiment of the vacuum heating and pressure sealing molding apparatus.
In the figure, the same members as those in the first and fourth embodiments are denoted by the same reference numerals, and the description thereof is omitted. In the fourth embodiment, the support 13, the pressurizing cylinder upper plate 14, the pressurizing cylinder 22, and the rod 23 are provided. However, in FIGS. The pressure cylinder upper plate 14, the pressure cylinder 22 and the rod 23 are omitted.

  In this embodiment, although a sliding frame body and a sliding cylinder can be used, a vacuum chamber is formed by the lower frame member 50 and the upper frame member 51 without using the sliding cylinder. More specifically, a lower frame member for forming a vacuum chamber is formed by the lower frame member base 5 and the lower frame member 50 placed in an airtight manner on the lower frame member mounting base 5, and the intermediate moving plate 15 and its lower surface are airtight. The upper frame member 51 is provided with a vacuum chamber forming upper frame. A step 51a is provided in the lower end portion of the upper frame member 51. When the intermediate moving plate 15 and the upper frame member 51 are lowered by the pressure cylinder 22, the inner peripheral surface of the step 51a of the upper frame member 51 is lowered. A vacuum chamber is formed inside by sliding airtightly on the outer peripheral surface of the frame member 50.

  In this embodiment, a heating lamp 52 such as a halogen lamp is attached to the lower surface of the intermediate moving plate 15 via a heat insulating plate, and the upper heating plate 17 and the molding die 21 attached to the lower surface thereof are moved to the molding position by the slide unit 53. It can move between the retreat positions. The slide unit 53 is configured to fix and hold the slide cylinder 53a attached to the outside of the upper frame member 51, the slide rail 53b attached to the lower side of the intermediate moving plate 15, the upper heating plate 17 and the mold 21 downward. The slider 53c is slidably attached to the lower surface of the rail 53b. The slider 53c is movable between a molding position and a retracted position by the slide cylinder 53a. A pressing cylinder mechanism 55 is provided on the lower surface of the intermediate moving plate 15. The pressing cylinder mechanism 55 includes a pressing cylinder 55a attached to the lower surface of the intermediate moving plate 15, a rod 55b extending downward from the pressing cylinder 55a, and a rod 55b. It consists of a pressing frame body 55c attached to the lower end, and the slide unit 53 and the pressing cylinder mechanism 55 are arranged at positions that do not conflict.

The operation of the fourth embodiment of the vacuum heating and pressure sealing molding apparatus according to the present invention shown in FIGS. 5 (a) to 5 (f) will be described below.
(1) Step of setting substrate, element and sealing sheet FIG. 5A shows a step of setting the substrate, element and sealing sheet. Except that the upper heating plate 17 and the mold 21 are moved to the retracted position by the slide unit 53, the step of setting the substrate, the element and the pressure release film is the step (1) of the first embodiment of the present invention. (FIG. 2A) is almost the same.

(2) Vacuum chamber formation, sealing sheet softening, evacuation step FIG. 5B shows vacuum chamber formation, sealing sheet softening, evacuation step. The intermediate moving plate 15 is lowered by the pressurizing cylinder 22 and the inner peripheral surface of the step 51a of the upper frame member 51 is slid airtightly to the outer peripheral surface of the lower frame member 50 for a predetermined distance to stop, thereby forming a vacuum chamber inside. To do. Next, the heating lamp 52 is turned on to heat and soften the sealing sheet in the atmosphere, and vacuuming is performed through the vacuum port 26. At this time, as shown in FIG. 5B, the sealing sheet 11 is inclined downward from the edge of the upper surface of the element 9 to the outer peripheral edge, and the outermost edge of the outer peripheral portion is a frame shape of the inner member 24. It extends to a position corresponding to the lower surface of the pressing portion 24b and touches the upper surface of the substrate table 8. The space inside the vacuum chamber and between the substrate table 8 and the sealing sheet 11 is evacuated by evacuation.

(3) Sealing sheet pressing process FIG.5 (c) shows a sealing sheet pressing process. While evacuating under heating, by pressing the outer periphery of the sealing sheet 11 with the substrate table 8 by the pressing frame 55a via the rod 55b by the pressing cylinder 55a of the pressing cylinder mechanism 55, The space formed between the substrate table 8 and the sealing sheet 11 is kept in a vacuum state.
(4) Step of positively pressurizing the inside of the vacuum chamber FIG. 5 (d) shows a step of positively pressurizing the inside of the vacuum chamber. As shown in FIG. 5 (d), the vacuum port 26 is closed, the positive pressure port 25 is opened, atmospheric pressure is introduced, and high pressure gas is introduced through the positive pressure port as necessary to maintain the pressurized state. Then, the element 9 is sealed on the substrate 10 by the sealing sheet 11 under pressure.

(5) Mold movement process FIG.5 (e) shows a mold movement process. While the heating lamp 52 is turned off and the upper heating plate 17 is heated, the slider 53c holding the upper heating plate 17 and the molding die 21 located at the retracted position is moved by the slide cylinder 53a along the slide rail 53b to the molding position. Let

(6) Sealing sheet forming step using a forming die FIG. 5 (f) shows a sealing sheet forming step using a forming die. As shown in FIG. 5 (f), the pressurizing cylinder 22 integrally opposes the pressing force of the pressing cylinder mechanism 55 by a predetermined distance between the intermediate moving plate 15, the upper heating plate 17 and the mold 21. The lower surface of the mold is brought into contact with the sealing sheet, and a predetermined molding process is performed on the sealing sheet. In this case, a stopper (not shown) for the pressure cylinder 22 is provided, and the mold is stopped at a predetermined position. When stopping, the upper frame member 18 and the lower plate member 12 may be brought into contact without using the stopper of the pressure cylinder.

(7) Product removal, new element-attached substrate and sealing sheet placement step After molding, the vacuum chamber is opened, the pressing frame 55c is raised by the pressing cylinder 55a, and the upper member is moved upward by the pressing cylinder 22. The lower member is taken out by the slide cylinder 4 to collect the product, and the new element-equipped substrate 10 and the sealing sheet 11 are arranged on the substrate table 8, and the lower member is again moved to the pressure forming position by the slide cylinder 4. Return (FIG. 5A).

(Fifth embodiment)
FIG. 6 shows a fifth embodiment of the vacuum heating and pressure sealing molding apparatus according to the present invention. As in the third embodiment, the fifth embodiment is the same as the fourth embodiment except that the pressure release film 41 is placed on the sealing sheet 40. For embodiments, refer to FIGS. 4A to 4D and FIGS. 5A to 5F, and description thereof will be omitted.

  FIG. 7 shows a configuration for sealing an element on a substrate and a molding example using a molding die. (A) shows the example which seals the element 9 on the board | substrate 10 directly using the sealing sheet 11, (b) shows the element 9 on the board | substrate 10 by the sealing sheet 40 via the pressure peeling film 41. An example of sealing is shown. (C) shows an example in which the thickness of the finished product is made uniform using a molding die having a flat bottom surface, and (d) shows an example on a sealing sheet using a molding die having a flat bottom surface and a plurality of rows of protrusions. (E) shows an example using a molding die that can provide an R portion or a tapered portion 60 on the upper surface edge. In (e), reference numerals 61 and 62 respectively denote protrusions and outer peripheral punches or guide holes, which are suitable for alignment with other parts. (F) shows an example in which a molding die for patterning a grid or an uneven pattern (for heat dissipation or the like) on the upper surface is shown. Needless to say, the mold is not limited to these.

  FIG. 8 shows the state in which the positive pressure port and the vacuum port are closed or the positive pressure port is not provided and the vacuum port is closed and the air pressure in the vacuum chamber is set to 0.1 MPa to lower the intermediate moving plate. Shows the downward movement distance (down stroke) and the measured internal pressure. An increase in the pressure in the vacuum chamber was confirmed when the volume in the vacuum chamber was lowered by 10 mm. Usually, when pressurizing the inside of the vacuum chamber, in the case of air pressure, the air pressure of the external compressor is generally set to 0.7 MPa. When the vacuum chamber is reduced (lowering stroke: 50 mm) by this pressurizing cylinder, it becomes possible to apply a higher pressurization of nearly 1,9 times with a stroke of 50 mm. That is, the adhesion degree of the adhesive surface of the sealing sheet can be increased by decreasing the volume of the vacuum chamber and increasing the pressure inside the vacuum chamber in the pressure sealing step.

  DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Pressure cylinder lower plate, 3 ... Slide movement table, 4 ... Slide cylinder, 5 ... Lower frame member mounting base, 7 ... Lower heating plate, 8 ...... Substrate table, 9 ... Element, 10 ... Substrate, 11 ... Sealing sheet, 12 ... Lower frame member, 13 ... Column, 14 ... Pressure cylinder upper plate, 15 ... Intermediate moving plate, 16 ... Heat insulation plate, 17 ... Upper heating plate, 18 ... Upper frame member, 19 ... Sliding member, 20 ... Sliding cylinder, 21 ... -Mold, 22, 22a ... Pressure cylinder, 22b ... Cylinder mechanism, 23 ... Rod, 24 ... Inner member, 24a ... Rod, 24b ... Frame-shaped presser part, 24c ... Spring, 25 ... Positive pressure port, 26 ... Vacuum port, 40 ... Sealing sheet, 41 ... Pressurization Release film, 50 ... lower frame member, 51 ... upper frame member, 51a ... step, 52 ... heating lamp, 53 ... slide unit, 53a ... slide cylinder, 53b ... Slide rail, 53c ... Slider, 55 ... Pressing cylinder mechanism, 55a ... Pressing cylinder, 55b ... Rod, 55c ... Pressing frame, 60 ... Tapered portion, 61 ... Protrusion 62 ... Outer periphery (guide hole)

Claims (13)

A vacuum heating and pressure sealing / molding apparatus for vacuum heating and pressure sealing / molding of an element on a substrate. A lower frame for forming a vacuum chamber;
2. A vacuum chamber forming upper frame disposed above a vacuum chamber forming lower frame, wherein the space between the vacuum chamber forming lower frame and the vacuum chamber forming upper frame is hermetically sealed to form a vacuum chamber inside Is formed, and the vacuum chamber forming upper frame body in which the workpiece can be taken out in a state where the vacuum chamber forming lower frame body and the vacuum chamber forming upper frame body are separated from each other,
3. A substrate table that is arranged inside a lower frame body for forming a vacuum chamber, and on which a substrate is placed, an element is arranged on the substrate, and a sealing sheet is placed on the element, Alternatively, on the sealing sheet, a substrate table that is adapted to place a pressure-release film extending radially outward from the sealing sheet, and
4). A heating device for heating and softening the sealing sheet on the element;
5. A vacuum exhaust and high-pressure gas introduction hole provided in either the vacuum chamber forming lower frame or the vacuum chamber forming upper frame;
6). An inner member that extends downward from the lower surface inside the upper frame body for forming a vacuum chamber, and the inner member is lowered so that the heat-softened sealing sheet is hermetically sealed between its lower end and the substrate table. An inner member that can be sandwiched or a pressure-release film on a sealing sheet can be sandwiched;
7). After sealing the element on the substrate with the heat-softened sealing sheet, the vacuum heating and pressure sealing / molding is composed of a molding die for pressing the sealing sheet still softened onto the element to perform predetermined molding. apparatus.
The vacuum chamber forming lower frame body has a lower frame member, the vacuum chamber forming upper frame body has an upper frame member, and the vacuum chamber forming lower frame body or the vacuum chamber forming upper frame body is further hermetically lowered. A sliding member that slides the inner circumferential surface or outer circumferential surface of the frame member and the upper frame member in an airtight manner, and sliding the sliding frame body to form a lower frame member, a sliding frame body, and an upper frame member; A vacuum chamber is formed inside with a space between the lower frame member and the upper frame member so that the workpiece can be taken in and out while the slide frame body is slid. The vacuum heating and pressure sealing / molding apparatus according to claim 1.
The vacuum chamber forming lower frame and the vacuum chamber forming upper frame are moved relative to each other and sealed between them to form a vacuum chamber, while the vacuum chamber forming lower frame and the vacuum chamber forming upper frame are The vacuum heating and pressure sealing / molding apparatus according to claim 1, wherein the workpiece can be taken in and out in a state of relative movement and separation.
The sealing sheet or the sealing sheet and the pressure peeling which are heated and softened between the lower end portion of the inner member and the substrate mounting table by relatively moving the vacuum chamber forming lower frame and the vacuum chamber forming upper frame. The vacuum heating and pressure sealing / molding apparatus according to claim 3, wherein the film can be sandwiched in an airtight manner.
A mold for pressing the heat-softened sealing sheet on the element is placed inside the vacuum chamber forming upper frame, and the vacuum chamber forming lower frame and the vacuum chamber forming upper frame are moved relative to each other to form the mold. The vacuum heating and pressure sealing / molding apparatus according to claim 4, wherein the heat-softened sealing sheet or pressure-release film and the sealing sheet are pressed onto the element.
The vacuum heating and pressure sealing / molding apparatus according to claim 1, wherein the inner member is a pressing cylinder mechanism attached to a lower surface of the intermediate moving plate.
The molding die is retracted to an inner non-molding position of the vacuum chamber forming upper and lower frame members when not molding, and is moved to a molding position inside the inner member during molding. The vacuum heating and pressure sealing / molding apparatus according to any one of the above.
The vacuum heating and pressure sealing / molding apparatus according to claim 1, wherein the heating apparatus is provided on the substrate table and the mold.
The vacuum heating and pressure sealing / molding device according to any one of claims 1 to 6, wherein the heating device is a light irradiation device such as a halogen lamp or an infrared, laser or far infrared irradiation device.
The vacuum chamber forming lower frame and the substrate table are arranged on a slide moving table, and the substrate and the sealing sheet or the substrate sheet are removed from the substrate table by taking out the vacuum chamber forming lower frame and the substrate table to the outside by the slide moving table. The vacuum heating and pressure sealing / molding apparatus according to claim 1, wherein the substrate, the sealing sheet, and the pressure release film are easily attached and detached.
The pressurizing mechanism for forming a vacuum chamber uses an air press pressure, a hydraulic press pressure, a servo press pressure, or an autoclave, and heat / pressure sealing / molding according to any one of claims 1 to 9 apparatus.
1. With the vacuum chamber opened, the substrate is placed on a substrate table placed in the vacuum chamber, the device is placed on the substrate, the sealing sheet is placed on the device, or the sealing sheet is placed on the sealing sheet. Furthermore, a pressure release film extending radially outward from the sealing sheet is disposed,
2. Close the vacuum chamber and evacuate the vacuum chamber,
3. Heat-softening the sealing sheet or sealing sheet and pressure-release film,
4). The outer periphery of the heat-softened sealing sheet or pressure release film is hermetically pressed onto the substrate table, and the space formed by the heat-softened sealing sheet or pressure release film and the substrate table is kept in a vacuum state,
5. In this state, the inside of the vacuum chamber is opened to atmospheric pressure and the atmosphere is introduced, or if necessary, a high-pressure gas is further introduced and pressurized, and the element is sealed to the substrate with a heat-softened sealing sheet,
6). A vacuum heating and pressure sealing / molding method in which a molding die is pressed onto a sealing sheet or pressure-release film and a sealing sheet that are still in a softened state substantially at that position to perform predetermined molding.
  The vacuum heating and pressure sealing / molding according to claim 12, wherein the volume of the vacuum chamber is reduced in the step 5 to increase the pressure inside the vacuum chamber to increase the adhesion degree of the adhesive surface of the sealing sheet. Method.

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