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JP5918003B2 - Vacuum suction sheet for singulation device and method for manufacturing fixing jig using the same - Google Patents

Vacuum suction sheet for singulation device and method for manufacturing fixing jig using the same Download PDF

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JP5918003B2
JP5918003B2 JP2012102261A JP2012102261A JP5918003B2 JP 5918003 B2 JP5918003 B2 JP 5918003B2 JP 2012102261 A JP2012102261 A JP 2012102261A JP 2012102261 A JP2012102261 A JP 2012102261A JP 5918003 B2 JP5918003 B2 JP 5918003B2
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sheet
vacuum suction
suction
vacuum
suction hole
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JP2013232450A (en
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渡辺 創
創 渡辺
天川 剛
剛 天川
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Towa Corp
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Towa Corp
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Priority to JP2012102261A priority Critical patent/JP5918003B2/en
Priority to CN201280072573.4A priority patent/CN104245234B/en
Priority to KR1020147032431A priority patent/KR101665840B1/en
Priority to PCT/JP2012/081824 priority patent/WO2013161119A1/en
Priority to TW101148277A priority patent/TWI492293B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00Shaping techniques involving a cutting or machining operation

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  • Engineering & Computer Science (AREA)
  • Manipulator (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Description

本発明は、個片化装置において個片化物を吸着固定するための固定治具に用いられる真空吸着シート、及びそれを用いた固定治具の製造方法に関する。   The present invention relates to a vacuum suction sheet used for a fixing jig for adsorbing and fixing individualized pieces in an individualizing apparatus, and a method for manufacturing a fixing jig using the same.

基板を格子状の複数の領域に区画して、各々の領域にチップ状の電子素子を装着した後、該基板全体を樹脂封止したものを樹脂封止体という。この樹脂封止体を回転刃等を用いて切断し、各領域単位に個片化したものが電子部品となる。   A substrate in which a substrate is partitioned into a plurality of lattice-shaped regions, chip-shaped electronic elements are mounted in each region, and the entire substrate is resin-sealed is referred to as a resin sealing body. This resin sealing body is cut using a rotary blade or the like, and is divided into individual regions to form an electronic component.

多数の電子素子を一体封止した樹脂封止体を個片化し、各電子素子を含む個々の電子部品を製造するための装置は、樹脂封止体の切断工程、前記切断工程により得られた電子部品の洗浄工程、乾燥工程、検査工程等の各工程に対応した複数の製造ユニットが工程順に連結されて成る。これらの複数の製造ユニットの間で個片化された電子部品を受け渡しするために、個片化された電子部品を吸着固定するための固定治具がそれぞれ設けられている。固定治具は、移動及び回動自在なベースと、該ベースに固定されたゴム等の弾性体から成る真空吸着シートで構成され、真空吸着シートには電子部品を各別に真空吸着するための吸着孔が形成されている。各々の吸着孔は、ベースの内部に設けられた吸気用貫通路、及びベースの外部に設けられた排気路を経由して排気ポンプに連通している。該排気路の途中には排気弁が設けられており、また、排気路において該排気弁よりも吸着孔に近い位置には排気路内を外部に開放するための開放弁が設けられている。これらの排気弁及び開放弁を開閉することによって、電子部品を固定治具の真空吸着シートに吸着固定したり、或いは真空吸着シートから取り除くことができるようになっている(特許文献1及び2)。   An apparatus for manufacturing individual electronic components including individual electronic elements obtained by dividing a resin sealing body in which a large number of electronic elements are integrally sealed was obtained by the resin sealing body cutting step, the cutting step. A plurality of manufacturing units corresponding to each process such as an electronic component cleaning process, a drying process, and an inspection process are connected in the order of processes. In order to deliver the separated electronic parts between the plurality of manufacturing units, fixing jigs for sucking and fixing the separated electronic parts are provided. The fixing jig is composed of a movable and rotatable base and a vacuum suction sheet made of an elastic body such as rubber fixed to the base, and the vacuum suction sheet is used for vacuum suction of electronic components. A hole is formed. Each of the suction holes communicates with an exhaust pump via an intake through passage provided inside the base and an exhaust passage provided outside the base. An exhaust valve is provided in the middle of the exhaust path, and an open valve for opening the inside of the exhaust path to the outside is provided at a position closer to the suction hole than the exhaust valve in the exhaust path. By opening and closing these exhaust valves and release valves, the electronic components can be adsorbed and fixed to the vacuum adsorbing sheet of the fixing jig, or removed from the vacuum adsorbing sheet (Patent Documents 1 and 2). .

上述した固定治具の真空吸着シートに電子部品を吸着固定するためには、まず、個片化された電子部品を、各吸着孔を覆うように真空吸着シートに載置する。次に、上述した開放弁を閉じると共に排気弁を開き、吸着孔を排気ポンプに連通させる。すると、吸着孔に連通する排気路を排気ポンプが真空吸引し、吸着孔の内部が減圧状態となるため、電子部品が真空吸着により真空吸着シートに吸着固定される。一方、電子部品の吸着を解除するためには、排気弁を閉じるとともに開放弁を開くことによって吸着孔の内部を大気開放する。これにより、電子部品を真空吸着シートから取り除くことができるようになる。
樹脂封止体を各領域単位に切断し、電子部品を製造する際にもこの真空吸着シートによる吸着が用いられる。
In order to suck and fix the electronic component on the vacuum suction sheet of the fixing jig described above, first, the separated electronic component is placed on the vacuum suction sheet so as to cover each suction hole. Next, the above-described open valve is closed and the exhaust valve is opened, so that the suction hole communicates with the exhaust pump. Then, the exhaust pump communicates with the suction hole by vacuum, and the inside of the suction hole is in a reduced pressure state, so that the electronic component is sucked and fixed to the vacuum suction sheet by vacuum suction. On the other hand, in order to release the suction of the electronic component, the inside of the suction hole is opened to the atmosphere by closing the exhaust valve and opening the release valve. As a result, the electronic component can be removed from the vacuum suction sheet.
The suction by the vacuum suction sheet is also used when an electronic component is manufactured by cutting the resin sealing body into each region unit.

特開2003-203830号公報Japanese Patent Laid-Open No. 2003-203830 特開2007-201275号公報Japanese Unexamined Patent Publication No. 2007-201275

上述したような従来の真空吸着シートでは、電子部品を洗浄するための洗浄液等によって真空吸着シートが濡れてしまうと、電子部品を真空吸着シートに吸着固定した際に電子部品と真空吸着シートとの接触面に液膜が形成され、表面張力による吸着力が発生する。一方、真空吸着シートが乾燥していると、電子部品の吸着固定及び吸着解除を繰り返すうちに真空吸着シートが静電気を帯びることがあり、その場合、電子部品と真空吸着シートとの接触面に静電気による吸着力が発生する。いずれにせよ、こうした意図しない吸着力が発生することにより、真空吸着を解除したにも拘わらず電子部品が真空吸着シートに吸着されたままとなってしまい、その電子部品が次の工程に移送されないという問題があった。   In the conventional vacuum suction sheet as described above, when the vacuum suction sheet gets wet by the cleaning liquid for cleaning the electronic component, the electronic component and the vacuum suction sheet are not fixed when the electronic component is sucked and fixed to the vacuum suction sheet. A liquid film is formed on the contact surface, and an adsorption force due to surface tension is generated. On the other hand, if the vacuum suction sheet is dry, the vacuum suction sheet may become static while repeatedly holding and releasing the suction of the electronic component. In this case, the contact surface between the electronic component and the vacuum suction sheet may become static. Adsorption force due to is generated. In any case, the generation of such unintentional suction force causes the electronic component to remain sucked on the vacuum suction sheet even though the vacuum suction is released, and the electronic component is not transferred to the next process. There was a problem.

本発明は上記課題を解決するために成されたものであり、その目的とするところは、真空吸着を解除した際には個片化物の吸着が確実に解除され、個片化物を次の工程に確実に移送することが可能な個片化装置用真空吸着シートを提供することにある。また、該シートを用いた固定治具の製造方法も提供する。   The present invention has been made in order to solve the above-mentioned problems. The purpose of the present invention is to ensure that when the vacuum adsorption is released, the adsorption of the individualized product is surely released, and the individualized product is subjected to the next step. An object of the present invention is to provide a vacuum suction sheet for a singulation apparatus that can be reliably transferred. Moreover, the manufacturing method of the fixing jig using this sheet | seat is also provided.

上記課題を解決するために成された本発明に係る個片化装置用真空吸着シートの第一の態様のものは、個片化物を真空吸着するための吸着孔を有する弾性体から成るシートであって、
該シートと一体に形成された、前記吸着孔を完全に囲繞し、前記個片化物が載置された状態で前記吸着孔から空気が吸引されると弾性変形して該個片化物との接触面積が大きくなり、前記吸着孔からの空気の吸引が解除されると弾性復元力により該個片化物を押し上げて該個片化物との接触面積が小さくなる突出部
を有することを特徴とする。
The first aspect of the vacuum suction sheet for a singulation apparatus according to the present invention, which has been made to solve the above problems, is a sheet made of an elastic body having suction holes for vacuum-suctioning the singulation. There,
The suction hole, which is formed integrally with the sheet, completely surrounds the suction hole, and is elastically deformed when air is sucked from the suction hole in a state where the individual piece is placed, and contacts with the individual piece. When the suction of the air from the suction hole is released, the protrusion is pushed up by the elastic restoring force to reduce the contact area with the separate piece .

上述した「個片化物」には、例えば各種の基板、該基板に電子素子等を装着したもの、それを樹脂封止したもの等を個片化したものを含む。   The above-mentioned “individualized product” includes, for example, various substrates, those in which an electronic element or the like is mounted on the substrate, and those obtained by resin-sealing those substrates.

本発明に係る個片化装置用真空吸着シート(以下、単に「真空吸着シート」という)の第一の態様のものに個片化物を載置し、吸着孔から空気を排出し始めると、突出部は吸着孔を完全に囲繞しているため、吸着孔の上の空間は個片化物と突出部により閉じられ、真空吸引が行われるようになる。真空吸引を継続してゆくと、個片化物は突出部に押し付けられ、突出部は弾性変形して両者の接触面積が広がる。これにより吸着孔と個片化物の間の密着はより完全なものとなり、確実な個片物の真空吸着が行われる。
吸着孔に空気を導入することにより真空吸着を解除すると、突出部がその弾性により元の形に戻り、個片化物を押し上げる。また、個片化物と突出部の接触面積が小さくなるため、たとえ両者間に液膜が存在していたり、両者間に静電気力が働いていたとしても、それらの力は小さく、個片化物は容易に真空吸着シートから取り外すことができるようになる。
When the singulated material is placed on the first embodiment of the vacuum suction sheet for the singulation apparatus (hereinafter simply referred to as “vacuum suction sheet”) according to the present invention and the air starts to be discharged from the suction hole, the protrusion Since the part completely surrounds the suction hole, the space above the suction hole is closed by the singulated material and the protrusion, and vacuum suction is performed. When the vacuum suction is continued, the singulated material is pressed against the projecting portion, and the projecting portion is elastically deformed to increase the contact area between the two. As a result, the adhesion between the suction hole and the singulated material becomes more complete, and reliable vacuum suction of the singulated material is performed.
When the vacuum suction is released by introducing air into the suction hole, the projecting portion returns to its original shape due to its elasticity and pushes up the singulated material. In addition, since the contact area between the singulated product and the projecting portion is reduced, even if there is a liquid film between them or an electrostatic force is acting between them, the force is small, and the singulated product is It can be easily removed from the vacuum suction sheet.

また、本発明に係る個片化装置用真空吸着シートの第二の態様のものは、個片化物を真空吸着するための吸着孔を有する弾性体から成るシートであって、
前記吸着孔の周囲のシート面上に該シートと一体に設けられた突出部であって、前記吸着孔から空気が吸引されると前記周囲のシート面に埋没して前記個片化物と前記周囲のシート面との接触面積が大きくなるように弾性変形し、前記吸着孔からの空気の吸引が解除されると弾性復元力により該個片化物を押し上げて該個片化物との接触面積が小さくなる突出部
を有することを特徴とする。
Further, the second aspect of the vacuum suction sheet for the singulation apparatus according to the present invention is a sheet made of an elastic body having suction holes for vacuum-suctioning the singulated material,
Wherein a protruding portion provided on the sheet integrally on the sheet surface around the suction holes, the pieces product and the ambient buried from the suction holes on the seat surface of the ambient air is Ru sucked Elastically deforms so that the contact area with the sheet surface increases, and when the suction of air from the suction hole is released, the singulated material is pushed up by the elastic restoring force to reduce the contact area with the singulated material. It has the protrusion part which becomes .

本態様に係る真空吸着シートに設けられる突出部は、前記態様のものとは異なり、吸着孔を完全に囲繞する必要はない。点状のものでもよいし、線状や或る程度の広さを有する面状のものでもよい。個数は一個でも良いし、複数個であってもよい。なお、上記のような特性を有するものであれば、吸着孔を完全に囲繞するものであってもよい。   The protrusion provided on the vacuum suction sheet according to this aspect does not need to completely surround the suction hole, unlike the above-described aspect. It may be a dot shape, a line shape, or a planar shape having a certain size. The number may be one or plural. In addition, as long as it has the above characteristics, you may completely surround an adsorption hole.

本態様に係る真空吸着シートでは、個片化物を吸着孔の上部に載置し、吸着孔から空気を排出して真空吸引を行うと、個片化物が押し付けられることにより突出部が変形し、吸着孔の周囲のシート面に埋没する。これにより、個片化物が吸着孔の周囲のシート面と接触し、真空吸着が完全に行われるようになる。
吸着孔に空気を導入することにより真空吸着を解除すると、突出部がその弾性により元の形に戻り、個片化物を押し上げる。また、突出部が吸着孔を完全に囲繞するものではない場合、個片化物と吸着孔の周囲のシート面の間に隙間ができ、真空吸着がより確実に解除される。突出部が吸着孔を完全に囲繞するものである場合も、前記第一の態様と同様の作用により、真空吸引が解除された際、突出部の弾性復元力により個片化物が周囲のシート面から引き離され、個片化物は容易に取り外すことができるようになる。
In the vacuum suction sheet according to this aspect, when the singulated product is placed on the upper portion of the suction hole, and the vacuum suction is performed by discharging air from the suction hole, the projecting portion is deformed by pressing the singulated product, It is buried in the sheet surface around the suction holes. Thereby, the singulated material comes into contact with the sheet surface around the suction hole, and vacuum suction is completely performed.
When the vacuum suction is released by introducing air into the suction hole, the projecting portion returns to its original shape due to its elasticity and pushes up the singulated material. Further, when the protrusion does not completely surround the suction hole, a gap is formed between the singulated material and the sheet surface around the suction hole, and the vacuum suction is more reliably released. Even when the protruding portion completely surrounds the suction hole, when the vacuum suction is released by the same action as in the first aspect, the singulated material is surrounded by the elastic restoring force of the protruding portion. The separated pieces can be easily removed.

本態様の真空吸着シートでは、最初に吸着孔から空気を排出する際に個片化物が早期に吸着孔の周辺のシート面に接触し、吸着されるようにするために、突出物はできるだけ低いものとしておくか、或いは、吸着孔を完全に囲繞した状態から少し空気逃げ部を設けたようなものとしておくことが望ましい。   In the vacuum suction sheet of this embodiment, when the air is first discharged from the suction holes, the protrusions are as low as possible so that the singulated material comes into contact with the sheet surface around the suction holes and is sucked at an early stage. It is desirable that the air hole is slightly provided from the state where the suction hole is completely surrounded.

上述した各態様に係る真空吸着シートを用いた、個片化物を吸着固定するための固定治具は、
a) 前記突出部を反転した形状の凹部が底面に設けられた、前記真空吸着シートに対応したキャビティを有する型の前記キャビティに常温硬化性液状樹脂を供給する成型工程と、
b) 前記キャビティに前記常温硬化性液状樹脂が供給された前記型の型面に、吸気用貫通路を有するベースを位置決めしつつ当接させる当接工程と、
c) 前記常温硬化性液状樹脂を常温で硬化させる硬化工程と、
d) 離型により前記ベースの上に前記シートを形成する離型工程と、
e) 前記吸気用貫通路を通じて前記シートを穿孔することにより前記シートに前記吸着孔を作製する吸着孔作製工程と、
を有する方法により製造することができる。
Using the vacuum suction sheet according to each aspect described above, a fixing jig for adsorbing and fixing individualized products is,
a) a molding step of supplying a room temperature curable liquid resin to the cavity of a mold having a cavity corresponding to the vacuum suction sheet provided with a concave portion having a shape obtained by inverting the protruding portion;
b) an abutting step of positioning and abutting a base having an intake through passage to a mold surface of the mold in which the room temperature curable liquid resin is supplied to the cavity;
c) a curing step for curing the room temperature curable liquid resin at room temperature ;
d) a mold release step of forming the sheet on the base by mold release;
e) a suction hole creating step of creating the suction hole in the sheet by punching the sheet through the intake through-passage;
It can manufacture by the method which has this.

本発明に係る個片化装置用真空吸着シートでは、上述した第一及び第二のいずれの態様においても、個片化物の真空吸着を解除した際に、突出部がその弾性復元力により個片化物を押し上げ、個片化物と突出部の接触面積が小さくなり、或いは、個片化物と突出部の周囲のシート面の間の接触が解除されるため、たとえ両者間に液膜が存在していたり、両者間に静電気力が働いていたとしても、それらの力は小さく、個片化物は容易に真空吸着シートから取り外すことができる。即ち、真空吸着を解除したにも拘わらず個片化物がシートに吸着されたままとなるといったことがなく、個片化物を次の工程に確実に移送することが可能となる。   In the vacuum suction sheet for a singulation apparatus according to the present invention, in any of the first and second aspects described above, when the vacuum suction of the singulated material is released, the protruding portion is separated by its elastic restoring force. The chemicals are pushed up, the contact area between the individualized products and the protrusions is reduced, or the contact between the individualized products and the sheet surface around the protrusions is released, so there is a liquid film between them. Even if an electrostatic force is acting between them, the force is small, and the singulated material can be easily removed from the vacuum suction sheet. In other words, the singulated product does not remain adsorbed to the sheet even though the vacuum suction is released, and the singulated product can be reliably transferred to the next step.

また、本発明に係る固定治具の製造方法では、真空吸着シートの突出部に対応する凹部が底面に設けられたキャビティ内で液状の樹脂を硬化させて該シートを作製するようにしたことにより、上述した各態様の真空吸着シートを用いた固定治具を容易に製造することができる。   Further, in the method of manufacturing the fixing jig according to the present invention, the liquid resin is cured in the cavity provided with the concave portion corresponding to the protruding portion of the vacuum suction sheet on the bottom surface, thereby producing the sheet. And the fixing jig using the vacuum suction sheet of each aspect mentioned above can be manufactured easily.

本発明の実施例1に係る真空吸着シートを備えた固定治具の斜視全体図。The perspective whole view of the fixing jig provided with the vacuum suction sheet | seat which concerns on Example 1 of this invention. 図1におけるA−A'線断面図。AA 'line sectional drawing in FIG. (a)は実施例1に係る真空吸着シートに電子部品を載置した状態を示す縦断面拡大図、(b)は電子部品を真空吸着した状態を示す縦断面拡大図である。(A) is a longitudinal cross-sectional enlarged view which shows the state which mounted the electronic component in the vacuum suction sheet | seat which concerns on Example 1, (b) is a longitudinal cross-sectional enlarged view which shows the state which vacuum-sucked the electronic component. (a)は実施例1に係る真空吸着シートに電子部品を載置した状態を示す平面拡大図、(b)は電子部品を真空吸着した状態を示す平面拡大図である。(A) is the plane enlarged view which shows the state which mounted the electronic component in the vacuum suction sheet | seat which concerns on Example 1, (b) is the plane enlarged view which shows the state which vacuum-sucked the electronic component. 実施例1の変形例に係る真空吸着シートに電子部品を載置した状態を示す平面拡大図。FIG. 6 is an enlarged plan view showing a state where electronic components are placed on a vacuum suction sheet according to a modification of Example 1; 本発明の実施例2に係る真空吸着シートを備えた固定治具の斜視拡大図。The perspective enlarged view of the fixing jig provided with the vacuum suction sheet | seat which concerns on Example 2 of this invention. 図6におけるB−B’線断面図を示したものであり、(a)は真空吸着シートに電子部品を載置した状態を示す縦断面拡大図、(b)は電子部品を真空吸着した状態を示す縦断面拡大図である。FIG. 7 is a cross-sectional view taken along line BB ′ in FIG. 6, (a) is an enlarged vertical cross-sectional view showing a state in which an electronic component is placed on a vacuum suction sheet, and (b) is a state in which the electronic component is vacuum-sucked. FIG. 実施例2に係る真空吸着シートの変形例を示す平面拡大図。FIG. 9 is an enlarged plan view showing a modification of the vacuum suction sheet according to the second embodiment. 実施例2に係る真空吸着シートの他の変形例を示す平面拡大図。FIG. 9 is an enlarged plan view showing another modification of the vacuum suction sheet according to the second embodiment. 実施例1に係る真空吸着シートを製造するための型の斜視全体図。1 is an overall perspective view of a mold for manufacturing a vacuum suction sheet according to Embodiment 1. FIG. 図10におけるC−C'線断面図。CC 'sectional view taken on the line in FIG. 実施例1に係る真空吸着シートを備えた固定治具を製造する工程を示す模式図。FIG. 3 is a schematic diagram illustrating a process for manufacturing a fixing jig including the vacuum suction sheet according to the first embodiment.

以下、図面に基づき、本発明に係る真空吸着シートの各実施例について説明する。   Embodiments of the vacuum suction sheet according to the present invention will be described below with reference to the drawings.

図1及び図2を参照して、本発明の第1の実施例(実施例1)に係る真空吸着シート2の構成について説明する。本実施例の真空吸着シート2は、多数の個片化された電子部品を一度に洗浄、検査等するために用いられる固定治具1において、金属製のベース3上に載置固定されて使用されるものである。真空吸着シート2は、ベース3の上面から突出した突出面31を覆うように設けられる。   With reference to FIG.1 and FIG.2, the structure of the vacuum suction sheet | seat 2 which concerns on the 1st Example (Example 1) of this invention is demonstrated. The vacuum suction sheet 2 of the present embodiment is used by being mounted and fixed on a metal base 3 in a fixing jig 1 used for cleaning, inspecting, etc. a large number of individual electronic components at once. It is what is done. The vacuum suction sheet 2 is provided so as to cover the protruding surface 31 protruding from the upper surface of the base 3.

真空吸着シート2は、シリコーン系樹脂又はフッ素系樹脂をシート状に成型したものであり、そのシート面には対象とする電子部品に対応した形状の空間である収容部23が格子状に形成されている。本実施例では各収容部23は格子状の境界26によって互いに分離して設けられているが、個片化する前の樹脂封止体を切断して各電子部品を個片化する際に用いられる真空吸着シートではこの境界26は設けられていない。なお、収容部23の配置及び数が図1のものに限定されるものではないことは明らかである。各収容部23の底面には吸着孔24が設けられており、各吸着孔24がベース3の後述する吸気用貫通路32とそれぞれ一致するように、真空吸着シート2がベース3の突出面31に接着固定されている。本実施例の真空吸着シート2では、各収容部23の底面に、吸着孔24を取り囲むように井桁状の、断面が半円状の突出部25が形成されている。   The vacuum suction sheet 2 is formed by molding a silicone resin or a fluorine-based resin into a sheet shape, and on the sheet surface, accommodating portions 23 that are spaces having shapes corresponding to the target electronic components are formed in a lattice shape. ing. In the present embodiment, each accommodating portion 23 is provided separated from each other by a lattice-like boundary 26, but is used when individual electronic components are separated by cutting the resin sealing body before separation. This boundary 26 is not provided in the vacuum suction sheet. Obviously, the arrangement and number of the accommodating portions 23 are not limited to those shown in FIG. A suction hole 24 is provided on the bottom surface of each accommodating portion 23, and the vacuum suction sheet 2 protrudes from the protruding surface 31 of the base 3 so that each suction hole 24 coincides with a later-described suction through-passage 32 of the base 3. It is fixed to the adhesive. In the vacuum suction sheet 2 of the present embodiment, a projecting portion 25 having a cross-beam shape and a semicircular cross section is formed on the bottom surface of each housing portion 23 so as to surround the suction hole 24.

図2に示すように、ベース3の各吸気用貫通路32は、それぞれに設けられた個別排気管及びそれらをまとめた排気管51を通じて排気ポンプ50に接続されている。排気管51には排気弁52が設けられており、排気弁52よりも上流(吸着孔24)側には開放弁53が設けられている。   As shown in FIG. 2, each intake through passage 32 of the base 3 is connected to an exhaust pump 50 through an individual exhaust pipe provided in each and an exhaust pipe 51 in which they are collected. An exhaust valve 52 is provided in the exhaust pipe 51, and an open valve 53 is provided on the upstream side (adsorption hole 24) side of the exhaust valve 52.

真空吸着シート2の使用形態について、図3を参照して説明する。真空吸着シート2の各収容部23に、平坦な下面41を有する電子部品40を収容すると、電子部品40が吸着孔24の上部に載置された状態となる。このとき、突出部25が吸着孔24を完全に囲繞していることにより、吸着孔24の上の空間30は電子部品40の下面41と井桁状の突出部25により閉じられる(図3(a))。この状態で排気弁52を開くとともに開放弁53を閉じて排気ポンプ50を作動させると、吸着孔24上部の空間から空気が排出され、電子部品40の真空吸着が行われるようになる。空気の排出(真空吸引)を継続してゆくと、電子部品40の下面41は突出部25に押し付けられ、突出部25は弾性変形して両者の接触面積が広がる(図3(b))。これにより吸着孔24と電子部品40の間の密着はより完全なものとなり、確実な電子部品40の真空吸着が行われる。   The usage pattern of the vacuum suction sheet 2 will be described with reference to FIG. When the electronic component 40 having the flat lower surface 41 is accommodated in each accommodating portion 23 of the vacuum suction sheet 2, the electronic component 40 is placed on the upper portion of the suction hole 24. At this time, since the protrusion 25 completely surrounds the suction hole 24, the space 30 above the suction hole 24 is closed by the lower surface 41 of the electronic component 40 and the cross-shaped protrusion 25 (FIG. 3A). )). In this state, when the exhaust valve 52 is opened and the release valve 53 is closed and the exhaust pump 50 is operated, air is discharged from the space above the suction hole 24 and the electronic component 40 is vacuum-sucked. When the discharge of air (vacuum suction) is continued, the lower surface 41 of the electronic component 40 is pressed against the protrusion 25, and the protrusion 25 is elastically deformed to increase the contact area between them (FIG. 3B). Thereby, the adhesion between the suction hole 24 and the electronic component 40 becomes more complete, and the vacuum suction of the electronic component 40 is performed reliably.

電子部品40の真空吸着を解除する場合には、排気弁52を閉じるとともに、開放弁53を開く。これにより、吸着孔24上部の空間に空気が導入され、電子部品40の真空吸着が解除される。すると、突出部25がその弾性復元力により元の形に戻り(即ち、図3(b)の状態から図3(a)の状態に戻り)、電子部品40を押し上げる。従って、電子部品40の下面41と突出部25の間の接触面積が小さくなるため、たとえ両者間に液膜が存在していたり、両者間に静電気力が働いていたとしても、それらの力は小さく、電子部品40は容易に真空吸着シート2から取り外すことができるようになる。すなわち、これらの電子部品40を別の固定治具を用いて吸着した際、一つの電子部品40も残すことなく吸着することができるようになる。   When releasing the vacuum suction of the electronic component 40, the exhaust valve 52 is closed and the release valve 53 is opened. Thereby, air is introduced into the space above the suction hole 24 and the vacuum suction of the electronic component 40 is released. Then, the protrusion 25 returns to its original shape by the elastic restoring force (that is, returns from the state of FIG. 3B to the state of FIG. 3A), and pushes up the electronic component 40. Therefore, since the contact area between the lower surface 41 of the electronic component 40 and the protruding portion 25 is reduced, even if a liquid film exists between them or an electrostatic force acts between them, the force is The electronic component 40 is small and can be easily detached from the vacuum suction sheet 2. That is, when these electronic components 40 are sucked by using another fixing jig, the single electronic component 40 can be sucked without being left.

図4(a)は、真空吸着シート2の収容部23に電子部品40を収容した状態を示す平面拡大図である。図中の点線は電子部品40の輪郭を示す。上述したように真空吸着シート2の突出部25の断面は半円状であるため、電子部品40を収容部23に収容した状態では、電子部品40の下面41は突出部25の頂部と接触し、両者の接触部分70は線状となる。一方、電子部品40を真空吸着すると、電子部品40の下面41が突出部25に押し付けられることにより、線状であった両者の接触部分70は面状となる(図4(b))。   FIG. 4A is an enlarged plan view showing a state where the electronic component 40 is accommodated in the accommodating portion 23 of the vacuum suction sheet 2. The dotted line in the figure shows the outline of the electronic component 40. As described above, since the cross section of the protrusion 25 of the vacuum suction sheet 2 is semicircular, the lower surface 41 of the electronic component 40 is in contact with the top of the protrusion 25 in a state where the electronic component 40 is stored in the storage 23. Both contact portions 70 are linear. On the other hand, when the electronic component 40 is vacuum-sucked, the lower surface 41 of the electronic component 40 is pressed against the protruding portion 25, so that the contact portion 70 of the two linear shapes becomes planar (FIG. 4B).

なお、突出部25の形状は井桁状に限定されるものではなく、例えば図5に示されるように、環状(突出部25A)としてもよい。また、突出部25、25Aの断面は半円の他に、三角形や台形等であってもよい。   In addition, the shape of the protrusion part 25 is not limited to a cross-beam shape, For example, as FIG. 5 shows, it is good also as a cyclic | annular form (protrusion part 25A). Further, the cross section of the protrusions 25, 25A may be a triangle, a trapezoid, or the like in addition to a semicircle.

本発明の第2の実施例(実施例2)に係る真空吸着シート2Aを備えた固定治具1Aの斜視拡大図を図6に示す。本実施例に係る真空吸着シート2Aでは、収容部23Aの底面に半球状の突出部28が一個形成されている。突出部28は、真空吸着シート2Aの弾性及び真空吸引の強さを考慮して、吸着孔24Aから真空吸引を開始した後、短時間のうちに該突出部28がシート面の方に押し付けられ、埋没するように、できるだけ低くしておく。なお、突出部28は多角錘状、多角柱状、円柱状等であってもよい。   FIG. 6 shows an enlarged perspective view of a fixing jig 1A provided with a vacuum suction sheet 2A according to a second embodiment (Example 2) of the present invention. In the vacuum suction sheet 2A according to the present embodiment, one hemispherical protrusion 28 is formed on the bottom surface of the housing 23A. In consideration of the elasticity of the vacuum suction sheet 2A and the strength of vacuum suction, the protrusion 28 is pressed toward the sheet surface within a short time after starting vacuum suction from the suction hole 24A. Keep as low as possible, so as to be buried. The protruding portion 28 may have a polygonal pyramid shape, a polygonal column shape, a cylindrical shape, or the like.

この真空吸着シート2Aの使用形態について、図6を参照して説明する。真空吸着シート2Aの収容部23Aに下面41が平坦である電子部品40を収容すると、その下面41が突出部28の頂部と接触することになるため、電子部品40が傾いた状態で吸着孔24Aの上部に載置される(図7(a))。なお、上述したように突出部28は低く設けられているため、電子部品40の下面41と真空吸着シート2Aのシート面の間に形成される隙間は小さい。従って、前述した実施例1と同じく吸着孔24Aから空気を排出して真空吸引を行うと、電子部品40の下面41が真空吸着シート2Aのシート面に早期に吸着される。そして、電子部品40が押し付けられることにより突出部28が変形し、吸着孔24Aの周囲のシート面に埋没する(図7(b))。これにより、電子部品40の下面41が吸着孔24Aの周囲のシート面と接触し、真空吸着が完全に行われるようになる。 A usage pattern of the vacuum suction sheet 2A will be described with reference to FIG. When the electronic component 40 having the flat lower surface 41 is accommodated in the accommodating portion 23A of the vacuum suction sheet 2A, the lower surface 41 comes into contact with the top of the protruding portion 28, so that the adsorption hole 24A is in a state where the electronic component 40 is inclined. (FIG. 7A). In addition, since the protrusion part 28 is provided low as mentioned above, the clearance gap formed between the lower surface 41 of the electronic component 40 and the sheet | seat surface of the vacuum suction sheet 2A is small. Therefore, when the air is discharged from the suction hole 24A and vacuum suction is performed as in the first embodiment, the lower surface 41 of the electronic component 40 is quickly sucked onto the sheet surface of the vacuum suction sheet 2A. When the electronic component 40 is pressed, the protruding portion 28 is deformed and buried in the sheet surface around the suction hole 24A (FIG. 7B). As a result, the lower surface 41 of the electronic component 40 comes into contact with the sheet surface around the suction hole 24A, and vacuum suction is completely performed.

吸着孔24Aの上部の空間に空気を導入することにより真空吸着を解除すると、突出部28がその弾性復元力により元の形に戻り(即ち、図7(b)の状態から図7(a)の状態に戻り)、電子部品40を押し上げる。これにより、真空吸着がより確実に解除され、電子部品40は容易に取り外すことができるようになる。   When the vacuum suction is released by introducing air into the space above the suction hole 24A, the projecting portion 28 returns to its original shape by its elastic restoring force (that is, from the state of FIG. 7B to FIG. 7A). The electronic component 40 is pushed up. As a result, the vacuum suction is more reliably released, and the electronic component 40 can be easily removed.

図8は、実施例2の真空吸着シートの他の態様を示したものである。本態様では、C字型の突出部28Bが吸着孔24Bを囲むように設けられている。即ち、突出部28Bは、吸着孔24Bを囲繞する環の一部を切除した形状とすることにより空気逃げ部29を設けた形状とする。また、上述した真空吸着シート2Aの突出部28と同様に、突出部2Bはできるだけ低く設ける。これらのことにより、真空吸着シートにおいても、最初に吸着孔24から空気を排出する際に電子部品40の下面41が早期に吸着孔24Bの周辺のシート面に接触し、吸着される。 FIG. 8 shows another aspect of the vacuum suction sheet of Example 2. In this embodiment, a C-shaped protrusion 28B is provided so as to surround the suction hole 24B. That is, the protruding portion 28B has a shape in which the air escape portion 29 is provided by cutting a part of the ring surrounding the suction hole 24B. Further, similarly to the protrusion 28 of the vacuum suction sheet 2A described above, the protrusion 2 8 B is provided as low as possible. By these, also Oite vacuum suction sheet, the lower surface 41 of the electronic component 40 comes into contact with the sheet surface near the suction holes 24B early when discharging air from the first suction hole 24 B, it is adsorbed The

図9は、実施例2の真空吸着シートの更に他の態様を示したものである。本態様では、突出部28Cを非常に小さなものとし、シート面全面に多数形成したものである。すなわち、このような突出部28Cは、収容部23Cの底面を梨地とすることによって実現することができる。   FIG. 9 shows still another aspect of the vacuum suction sheet of Example 2. In this embodiment, the protruding portion 28C is very small, and a large number are formed on the entire sheet surface. That is, such a protruding portion 28C can be realized by making the bottom surface of the accommodating portion 23C a satin finish.

なお、上述した実施例1及び2において、電子部品40の下面41は平坦であるとしたが、電子部品40の下面は必ずしも平坦である必要はない。電子部品40を真空吸着シート2のシート面に吸着可能であるとともに、該シート面に設けられた突出部により弾性的に押し上げ可能であれば、電子部品40の下面は例えば曲面状であったり、小さな突出物を有していてもよい。   In the first and second embodiments described above, the lower surface 41 of the electronic component 40 is flat. However, the lower surface of the electronic component 40 is not necessarily flat. If the electronic component 40 can be adsorbed to the sheet surface of the vacuum suction sheet 2 and can be elastically pushed up by the protrusion provided on the sheet surface, the lower surface of the electronic component 40 is, for example, a curved surface, You may have a small protrusion.

次に、上述した実施例1の真空吸着シート2を備えた固定治具を製造する方法について図10〜12を参照して以下に説明する。図10は真空吸着シート2を作製するための型10の斜視全体図であり、図11は該型10のC−C’線縦断面図であり、図12は真空吸着シート2を備えた固定治具1の製造工程を示す図である。なお、実施例2の真空吸着シートを備えた固定治具を製造する方法も、以下に説明する製造方法と基本的には同じである。
It will be described below with reference to FIG. 10 to 12 a method for manufacturing a fixture with a vacuum suction sheet 2 of the first embodiment described above. 10 is an overall perspective view of the mold 10 for producing the vacuum suction sheet 2, FIG. 11 is a longitudinal sectional view taken along the line CC ′ of the mold 10, and FIG. FIG. 6 is a diagram illustrating a manufacturing process of the jig 1. In addition, the method of manufacturing the fixing jig provided with the vacuum suction sheet of Example 2 is basically the same as the manufacturing method described below.

型10は、1枚の真空吸着シート2に対応したキャビティ14を有している。キャビティ14の底面には、収容部23に対応する形状を有する凸部11が設けられており、凸部11の表面には、突出部25に対応する井桁状の溝である断面半円状の凹部12が形成されている。凸部11と凸部11の間の境界溝15は、真空吸着シート2における格子状の境界26に対応している。キャビティ14の開口はベース3の突出面31と略同一の矩形状である。   The mold 10 has a cavity 14 corresponding to one vacuum suction sheet 2. A convex portion 11 having a shape corresponding to the accommodating portion 23 is provided on the bottom surface of the cavity 14, and the surface of the convex portion 11 has a semicircular cross section that is a cross-shaped groove corresponding to the protruding portion 25. A recess 12 is formed. The boundary groove 15 between the protrusion 11 and the protrusion 11 corresponds to a lattice-like boundary 26 in the vacuum suction sheet 2. The opening of the cavity 14 has substantially the same rectangular shape as the protruding surface 31 of the base 3.

まず、シリコーン系又はフッ素系の常温硬化性液状樹脂20(以下、単に「樹脂20」という)を型10のキャビティ14に流し込む(図12のステップS1)。このとき、樹脂20の液面が型10の型面13を上回るようにする。次に、真空デシケータ61の中に前記型10を入れ、常温、約100kPaの条件下で20分間静置することにより、樹脂20の内部の気泡54を除去する(ステップS2)。更に、ベース3の突出面31に予めプライマーを塗布しておき、突出面31をキャビティ14の開口に挿入しつつ、型10の型面13にベース3を当接する(ステップS3)。突出面31をキャビティ14に挿入することによって型面13に対するベース3の位置が決まる。   First, a silicone-based or fluorine-based room temperature curable liquid resin 20 (hereinafter simply referred to as “resin 20”) is poured into the cavity 14 of the mold 10 (step S1 in FIG. 12). At this time, the liquid level of the resin 20 is set to exceed the mold surface 13 of the mold 10. Next, the mold 10 is placed in the vacuum desiccator 61, and left for 20 minutes at room temperature and about 100 kPa, thereby removing the bubbles 54 inside the resin 20 (step S2). Further, a primer is applied in advance to the projecting surface 31 of the base 3, and the base 3 is brought into contact with the mold surface 13 of the mold 10 while the projecting surface 31 is inserted into the opening of the cavity 14 (step S3). By inserting the protruding surface 31 into the cavity 14, the position of the base 3 with respect to the mold surface 13 is determined.

このように型10の型面13にベース3を当接すると、突出面31によりキャビティ14内部の樹脂20に圧が加わることにより、樹脂20がベース3の吸気用貫通路32に入り込み、ベース3の裏側にまで溢れ出る。この状態で型10及びベース3を24時間常温放置し、樹脂20を硬化させる(図12のステップS4)。樹脂20が完全に硬化したら、型10及びベース3をオーブン62に入れ、100℃で1時間加熱する(ステップS5)。これにより、ベース3の突出面31に塗布したプライマーが硬化し、樹脂20が突出面31に強固に接着する。なお、樹脂20のベース3への接着は、充分な接着強度が得られるのであれば樹脂20の硬化により生ずる自然接着でも構わず、この場合、プライマーの塗布及び接着工程は不要となる。   When the base 3 is brought into contact with the mold surface 13 of the mold 10 in this way, pressure is applied to the resin 20 inside the cavity 14 by the projecting surface 31, so that the resin 20 enters the intake through passage 32 of the base 3 and the base 3. It overflows to the back side. In this state, the mold 10 and the base 3 are left at room temperature for 24 hours to cure the resin 20 (step S4 in FIG. 12). When the resin 20 is completely cured, the mold 10 and the base 3 are placed in the oven 62 and heated at 100 ° C. for 1 hour (step S5). As a result, the primer applied to the protruding surface 31 of the base 3 is cured, and the resin 20 is firmly bonded to the protruding surface 31. The resin 20 may be bonded to the base 3 as long as sufficient adhesive strength is obtained, and natural bonding caused by curing of the resin 20 may be used. In this case, the primer application and bonding steps are not necessary.

その後、ベース3の裏側に達していた樹脂20を除去するとともに、型10を外す(図12のステップS6)。これにより、真空吸着シート2がベース3の突出面31上に現れる。最後に、吸気用貫通路32を通じてドリルで穿孔し、該吸気用貫通路32の内部で硬化した樹脂20を除去するとともに真空吸着シート2に吸着孔24を作製する(ステップS7)。こうして実施例1に係る真空吸着シート2を備えた固定治具1が得られる。   Thereafter, the resin 20 that has reached the back side of the base 3 is removed, and the mold 10 is removed (step S6 in FIG. 12). Thereby, the vacuum suction sheet 2 appears on the protruding surface 31 of the base 3. Finally, a hole is drilled through the intake through passage 32 to remove the resin 20 cured inside the intake through passage 32 and the suction hole 24 is formed in the vacuum suction sheet 2 (step S7). Thus, the fixing jig 1 including the vacuum suction sheet 2 according to the first embodiment is obtained.

実施例2の真空吸着シートを備えた固定治具を作製する場合においても、各突出部に対応する形状の凹部を底面に有するキャビティ14を型10に設け、上記同様の方法で製造すればよい。図9に示した真空吸着シートのように多数の低く小さな突出部28Cを設けたい場合は、型10のキャビティ14の凸部11の表面を梨地とする。   Even in the case of manufacturing a fixing jig including the vacuum suction sheet of Example 2, a cavity 14 having a concave portion having a shape corresponding to each protruding portion on the bottom surface may be provided in the mold 10 and manufactured by the same method as described above. . When it is desired to provide a large number of small and small protrusions 28 </ b> C as in the vacuum suction sheet shown in FIG. 9, the surface of the protrusions 11 of the cavity 14 of the mold 10 is a satin finish.

樹脂20を型10に供給する前に、該樹脂20に炭素粉末を添加しておくことにより、得られる真空吸着シートに導電性を持たせるようにしてもよい。このような真空吸着シートでは、電子部品の吸着固定及び吸着解除を繰り返すことにより発生する静電気を逃がすことができるため、静電気が電子部品40内部の電子素子にダメージを与えることが防止される。また、キャビティ14の底面に境界溝15を設けない代わりに、該溝15に対応する真空吸着シートの位置に機械加工で切り溝を設けることにより、樹脂封止体を回転刃等で切断して電子部品を製造する際に用いられる真空吸着シートを製造することもできる。   Before supplying the resin 20 to the mold 10, carbon powder may be added to the resin 20 so that the obtained vacuum suction sheet has conductivity. In such a vacuum suction sheet, static electricity generated by repeating the suction fixation and release of the electronic component can be released, so that the static electricity is prevented from damaging the electronic elements inside the electronic component 40. Further, instead of providing the boundary groove 15 on the bottom surface of the cavity 14, the resin sealing body is cut with a rotary blade or the like by providing a cut groove at the position of the vacuum suction sheet corresponding to the groove 15 by machining. It is also possible to manufacture a vacuum suction sheet used when manufacturing electronic components.

1…固定治具
10…型
11…凸部
12…凹部
13…型面
14…キャビティ
15…境界溝
2…真空吸着シート
20…樹脂
23…収容部
24…吸着孔
25、28…突出部
26…境界
29…空気逃げ部
3…ベース
31…突出面
32…吸気用貫通路
40…電子部品
50…排気ポンプ
51…排気管
52…排気弁
53…開放弁
70…接触部分
DESCRIPTION OF SYMBOLS 1 ... Fixing jig 10 ... Type | mold 11 ... Convex part 12 ... Concave part 13 ... Mold surface 14 ... Cavity 15 ... Boundary groove 2 ... Vacuum adsorption sheet 20 ... Resin 23 ... Accommodating part 24 ... Adsorption hole 25, 28 ... Protrusion part 26 ... Boundary 29 ... Air escape portion 3 ... Base 31 ... Projection surface 32 ... Intake through passage 40 ... Electronic component 50 ... Exhaust pump 51 ... Exhaust pipe 52 ... Exhaust valve 53 ... Open valve 70 ... Contact part

Claims (8)

個片化物を真空吸着するための吸着孔を有する弾性体から成るシートであって、
該シートと一体に形成された、前記吸着孔を完全に囲繞し、前記個片化物が載置された状態で前記吸着孔から空気が吸引されると弾性変形して該個片化物との接触面積が大きくなり、前記吸着孔からの空気の吸引が解除されると弾性復元力により該個片化物を押し上げて該個片化物との接触面積が小さくなる突出部
を有することを特徴とする個片化装置用真空吸着シート。
A sheet made of an elastic body having suction holes for vacuum-splitting individualized pieces,
The suction hole, which is formed integrally with the sheet, completely surrounds the suction hole, and is elastically deformed when air is sucked from the suction hole in a state where the individual piece is placed, and contacts with the individual piece. An individual having a projecting portion that increases in area and reduces the contact area with the individualized product by pushing up the individualized product by elastic restoring force when suction of air from the suction hole is released Vacuum adsorption sheet for singulation device.
前記個片化物が平坦な下面を有することを特徴とする請求項1に記載の個片化装置用真空吸着シート。   The vacuum suction sheet for an individualization device according to claim 1, wherein the individualization has a flat lower surface. 前記突出部の前記シート垂直方向の断面が半円形であることを特徴とする請求項1又は2に記載の個片化装置用真空吸着シート。   The vacuum suction sheet for a singulation apparatus according to claim 1 or 2, wherein a cross section of the protrusion in a direction perpendicular to the sheet is a semicircular shape. 個片化物を真空吸着するための吸着孔を有する弾性体から成るシートであって、
前記吸着孔の周囲のシート面上に該シートと一体に設けられた突出部であって、前記吸着孔から空気が吸引されると前記周囲のシート面に埋没して前記個片化物と前記周囲のシート面との接触面積が大きくなるように弾性変形し、前記吸着孔からの空気の吸引が解除されると弾性復元力により該個片化物を押し上げて該個片化物との接触面積が小さくなる突出部
を有することを特徴とする個片化装置用真空吸着シート。
A sheet made of an elastic body having suction holes for vacuum-splitting individualized pieces,
Wherein a protrusion provided on said sheet and integrally on a sheet surface around the suction holes, the pieces product and the ambient buried from the suction holes on the seat surface of the ambient air is Ru sucked Elastically deforms so that the contact area with the sheet surface increases, and when the suction of air from the suction hole is released, the singulated material is pushed up by the elastic restoring force to reduce the contact area with the singulated material. A vacuum suction sheet for a singulation apparatus, characterized by having a protruding portion.
前記個片化物が平坦な下面を有することを特徴とする請求項4に記載の個片化装置用真空吸着シート。   The vacuum adsorption sheet for an individualization device according to claim 4, wherein the individualization product has a flat lower surface. 請求項1〜5のいずれかに記載の個片化装置用真空吸着シートを用いた、個片化物を吸着固定するための固定治具を製造する方法であって、
a) 前記突出部を反転した形状の凹部が底面に設けられた、前記真空吸着シートに対応したキャビティを有する型の前記キャビティに常温硬化性液状樹脂を供給する成型工程と、
b) 前記キャビティに前記常温硬化性液状樹脂が供給された前記型の型面に、吸気用貫通路を有するベースを位置決めしつつ当接させる当接工程と、
c) 前記常温硬化性液状樹脂を常温で硬化させる硬化工程と、
d) 離型により前記ベースの上に前記シートを形成する離型工程と、
e) 前記吸気用貫通路を通じて前記シートを穿孔することにより前記シートに前記吸着孔を作製する吸着孔作製工程と、
を有することを特徴とする固定治具製造方法。
A method for producing a fixing jig for adsorbing and fixing individualized products using the vacuum suction sheet for an individualizing device according to any one of claims 1 to 5,
a) a molding step of supplying a room temperature curable liquid resin to the cavity of a mold having a cavity corresponding to the vacuum suction sheet provided with a concave portion having a shape obtained by inverting the protruding portion;
b) an abutting step of positioning and abutting a base having an intake through passage to a mold surface of the mold in which the room temperature curable liquid resin is supplied to the cavity;
c) a curing step for curing the room temperature curable liquid resin at room temperature ;
d) a mold release step of forming the sheet on the base by mold release;
e) a suction hole creating step of creating the suction hole in the sheet by punching the sheet through the intake through-passage;
A method for manufacturing a fixing jig, comprising:
前記キャビティの前記底面に井桁状の溝を設けることにより前記凹部が形成されることを特徴とする請求項6に記載の固定治具製造方法。   The method for manufacturing a fixing jig according to claim 6, wherein the concave portion is formed by providing a girder-shaped groove on the bottom surface of the cavity. 前記キャビティの前記底面に梨地加工が施されていることを特徴とする請求項6に記載の固定治具製造方法。   The fixing jig manufacturing method according to claim 6, wherein the bottom surface of the cavity is textured.
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KR1020147032431A KR101665840B1 (en) 2012-04-27 2012-12-07 Vacuum suction sheet for singulating device, and method for producing fixing jig
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016100559A (en) * 2014-11-26 2016-05-30 信越ポリマー株式会社 Component transfer member
JP2017130575A (en) * 2016-01-21 2017-07-27 株式会社ディスコ Fixture and processing method with fixture
KR101728303B1 (en) * 2016-08-05 2017-04-19 세종기술 주식회사 Visual inspection device for battery
KR101729224B1 (en) * 2016-08-05 2017-04-20 세종기술 주식회사 Rotating Stage equipped with Vacuum Pad having Cushion Function
JP6861602B2 (en) * 2017-09-15 2021-04-21 Towa株式会社 Holding member, manufacturing method of holding member, holding mechanism and product manufacturing equipment
JP6886379B2 (en) * 2017-09-28 2021-06-16 Towa株式会社 Holding member, manufacturing method of holding member, inspection device and cutting device
CN108015077B (en) * 2018-01-10 2024-06-11 池州市琼琚信息技术服务有限公司 Integrated pneumatic clamp
KR102028360B1 (en) * 2018-05-24 2019-10-07 휴비오 주식회사 Appearance inspection device of secondary battery
JP6746756B1 (en) * 2019-05-24 2020-08-26 Towa株式会社 Suction plate, cutting device and cutting method
CN112289729A (en) * 2019-07-24 2021-01-29 深圳市丰泰工业科技有限公司 Adsorption device and solid brilliant machine of solid brilliant usefulness
JP2021038002A (en) * 2019-09-04 2021-03-11 日本電気硝子株式会社 Glass plate packing body and manufacturing method thereof
CN110970341B (en) * 2019-12-11 2023-03-14 华天科技(西安)有限公司 Dry Block board for product cutting post-treatment and processing method thereof
CN111031689B (en) * 2019-12-30 2021-01-01 上海天马微电子有限公司 Clamp, flexible circuit board, display panel and bending method of display panel
CN113993367B (en) * 2021-09-24 2023-06-16 广州市安旭特电子有限公司 PCB transferring method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63104346U (en) * 1986-12-24 1988-07-06
JPH03201458A (en) * 1989-12-28 1991-09-03 Nippon Mining Co Ltd Suction/holding device
US5671910A (en) * 1992-05-06 1997-09-30 James C. Carne Vacuum plates
JPH10229115A (en) * 1997-02-14 1998-08-25 Sumitomo Metal Ind Ltd Vacuum chuck for wafer
JP2000286329A (en) * 1999-03-31 2000-10-13 Hoya Corp Substrate-holding chuck, manufacture thereof, exposure method, manufacture of semiconductor device and aligner
KR100331165B1 (en) * 1999-08-05 2002-04-01 김도열 Jig for batch production of device and thereby batch production method of device
JP2003203830A (en) 2002-01-10 2003-07-18 Shin Etsu Polymer Co Ltd Method for manufacturing holding plate used for coating external electrode of electronic component
JP3957166B2 (en) * 2002-05-09 2007-08-15 Tdk株式会社 Stamper peeling method and apparatus, and multilayer recording medium
CN1750917A (en) * 2003-02-21 2006-03-22 三星钻石工业股份有限公司 Substrate-processing table and substrate processing device
JP4268091B2 (en) * 2004-05-12 2009-05-27 信越ポリマー株式会社 Parts holder
JP2006229129A (en) * 2005-02-21 2006-08-31 Fujitsu Ltd Vacuum suction apparatus
JP2007201275A (en) 2006-01-27 2007-08-09 Fuji Mach Mfg Co Ltd Substrate sucking/transferring device
JP4707593B2 (en) * 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 Heat treatment apparatus and substrate adsorption method
CN1944203B (en) * 2006-11-03 2011-06-01 友达光电股份有限公司 Auxiliary moving, loading assembly
KR101446724B1 (en) * 2007-04-23 2014-10-07 한미반도체 주식회사 Suction Pad for Semiconductor Package
TWI436702B (en) * 2007-07-31 2014-05-01 Ulvac Inc Substrate bonding apparatus and method for controlling the same
CN201405209Y (en) * 2009-05-06 2010-02-17 大量科技股份有限公司 Vacuum chuck
KR101695289B1 (en) * 2010-04-30 2017-01-16 엘지디스플레이 주식회사 Apparatus and method of fabricating flat display device
JP2012071515A (en) * 2010-09-29 2012-04-12 Towa Corp Molding die manufacturing method, molding die, resin molding manufacturing method, and resin molding

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