JP5969898B2 - heatsink - Google Patents

Description

  The present invention relates to a heat sink.

  Conventionally, a heat sink is used for heat radiation of a heating element such as a semiconductor laser. For example, in the heat sink disclosed in Patent Document 1, a flat plate having a groove formed on the upper surface and a flat plate having a groove formed on the lower surface are connected via a partition plate having a plurality of through holes (fluid ejection holes). The flow path of the fluid for cooling is constituted by joining.

International Publication No. 00/11717 Pamphlet

  In the heat sink as described above, it is necessary to sufficiently secure the flow velocity and pressure of the fluid flowing through the flow path from the viewpoint of sufficiently ensuring the cooling efficiency. Moreover, it is necessary to suppress the fluid flow rate unevenness as much as possible from the viewpoint of ensuring the uniformity of cooling. In order to solve such a problem, it is difficult to secure the flow velocity and pressure in a configuration in which the diameter of the ejection holes is simply enlarged or a configuration in which a plurality of rows of ejection holes are connected to the flow path.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a heat sink that can cool a heating element uniformly with sufficient cooling efficiency.

  In order to solve the above problems, the heat sink according to the present invention has a mounting area on which a heating element is mounted, and a supply port to which a cooling fluid is supplied and a discharge port for discharging the fluid from the mounting area. The main body is provided at a distance from each other, and an IN side flow path for guiding the fluid supplied from the supply port toward the placement area side and a fluid passing through the IN side flow path are provided inside the main body. A flow path unit composed of an ejection hole array to be ejected under the placement area and an OUT-side flow path for guiding the fluid ejected from the ejection hole array toward the discharge port is laminated in a plurality of stages. Under the placement area, each of the ejection hole arrays of the flow path unit is arranged in a direction intersecting with the arrangement direction of the ejection holes.

  In this heat sink, a plurality of rows of ejection holes from which cooling fluid is ejected are arranged in a direction intersecting the arrangement direction of the ejection holes. As a result, the fluid can be ejected over a wide range with respect to the placement area on which the heating element is placed, and the heating element can be uniformly cooled. In this heat sink, the plurality of ejection hole arrays are not connected to a single flow path, but the ejection hole arrays are connected to the respective flow path units. Therefore, the pressure and flow velocity of the fluid in the flow path can be ensured, and sufficient cooling efficiency can be achieved. In this configuration, since the fluid flow velocity unevenness is also suppressed, it is possible to avoid the loss of cooling uniformity.

  In addition, the flow path length is different for each flow path unit, and the inner diameter of the ejection hole in the flow path unit with a longer flow path length is smaller than the inner diameter of the ejection hole in the flow path unit with a shorter flow path length. It is preferable. In this case, even when the flow path lengths are different, the pressure and flow velocity of the fluid ejected from the ejection holes of the flow path unit can be made uniform. Therefore, the cooling of the heating element can be made more uniform.

  Further, the flow path lengths of the flow path units are different from each other, and the number of ejection holes arranged in the flow path unit having a long flow path length is smaller than the number of ejection holes arranged in the flow path unit having a short flow path length. It is preferable. In this case, even when the flow path lengths are different, the pressure and flow velocity of the fluid ejected from the ejection holes of the flow path unit can be made uniform. Therefore, the cooling of the heating element can be made more uniform.

  In addition, the flow path lengths of the flow path units are different from each other, and the cross-sectional area of the IN-side flow path in the flow path unit with the long flow path length is the cross-sectional area of the IN-side flow path in the flow path unit with the short flow path length. It is preferable to be smaller. In this case, even when the flow path lengths are different, the pressure and flow velocity of the fluid ejected from the ejection holes of the flow path unit can be made uniform. Therefore, the cooling of the heating element can be made more uniform.

  Moreover, it is preferable that the IN-side flow path and the OUT-side flow path have a first portion extending in the in-plane direction of the flow path unit and a second portion extending in the stacking direction of the flow path units. In this case, the contact area between the fluid flowing through the flow path unit and the main body increases, and the cooling efficiency of the heating element can be further improved. Moreover, the rigidity of the lamination direction of a main-body part can be improved with the wall part of the main-body part which isolate | separates 2nd parts of each flow path unit.

  With the heat sink according to the present invention, the heating element can be uniformly cooled with sufficient cooling efficiency.

It is a perspective view showing one embodiment of a heat sink concerning the present invention. It is a principal part expansion perspective view which notches and shows a part of heat sink shown in FIG. It is a principal part expanded sectional view of the heat sink shown in FIG. It is a disassembled perspective view which shows the layer structure of the plate-shaped member which comprises the heat sink shown in FIG. It is a top view which shows the pattern of the 2nd layer of the plate-shaped member shown in FIG. It is a top view which shows the pattern of the 11th layer of the plate-shaped member shown in FIG. It is a figure which shows the modification of the heat sink which concerns on this invention. It is a figure which shows another modification of the heat sink which concerns on this invention. It is a figure which shows another modification of the heat sink which concerns on this invention.

  Hereinafter, preferred embodiments of a heat sink according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing an embodiment of a heat sink according to the present invention. The heat sink 1 shown in the figure is used as a cooling member for cooling the high-power semiconductor laser bar S (see FIG. 3), for example. The heat sink 1 includes a main body 2 having a flat rectangular parallelepiped shape having a length of 30 mm, a width of 12 mm, and a thickness of about 3 mm, for example.

  One end of the upper surface 2a of the main body 2 is a placement area P on which the semiconductor laser bar S is placed. Further, the main body 2 is provided with a supply port 3 to which a cooling fluid (for example, water) is supplied and a discharge port 4 for discharging the fluid in order from the placement region P side. Each of the supply port 3 and the discharge port 4 has a circular cross section, for example, and penetrates from the upper surface 2a to the lower surface 2b of the main body 2 at a position separated from the placement region P.

  As shown in FIGS. 2 and 3, a plurality (three systems in this embodiment) of flow path units 11 (11A to 11C in order from the lower surface side of the main body 2) are stacked inside the main body 2. . Each of the flow path units 11 places an IN side flow path 12 (12A to 12C) for guiding the fluid supplied from the supply port 3 toward the placement region P side, and a fluid passing through the IN side flow path 12. It is comprised by the ejection hole row | line | column 13 (13A-13C) ejected under the area | region P, and the OUT side flow path 14 (14A-14C) which guides the fluid ejected from the ejection hole row | line 13 toward the discharge port 4. FIG. . Further, the IN-side flow path 12 and the OUT-side flow path 14 of each flow path unit 11 are a stack of the flow path unit 11 and a first portion extending in the in-plane direction of the flow path unit 11 except for the flow path unit 11C. And a second portion extending in the direction.

  The first portion 12a of the IN-side flow path 12A in the flow path unit 11A is located on the lowermost surface 2b side in the main body 2 and extends to the vicinity of the end portion in the length direction of the main body 2 under the placement region P. Yes. The second portion 12b of the IN-side flow path 12A is bent at a substantially right angle from the end of the first portion 12a to the upper surface 2a side of the main body portion 2, and is connected to the ejection hole array 13A in the vicinity of the upper surface 2a of the main body portion 2. Has been. Further, the first portion 14a of the OUT-side flow path 14A in the flow path unit 11A is located on the upper layer side of the first portion 12a of the IN-side flow path 12A, and the IN-side flow path 12A is below the placement region P. It extends to a position slightly inside the second portion 12b. The second portion 14b of the OUT-side flow path 14A is bent at a substantially right angle from the end portion of the first portion 14a to the upper surface side of the main body portion 2, and is connected to the ejection hole array 13A.

  The first portion 12c of the IN-side flow path 12B in the flow path unit 11B is located at a substantially central portion in the thickness direction of the main body 2, and the second portion 14b of the OUT-side flow path 14A under the placement region P. It extends to a slightly inner position. The second portion 12d of the IN-side flow path 12B is bent at a substantially right angle from the end of the first portion 12c to the upper surface 2a side of the main body portion 2, and is connected to the ejection hole array 13B in the vicinity of the upper surface 2a of the main body portion 2. Has been. In addition, the first portion 14c of the OUT-side flow path 14B in the flow path unit 11B is located on the upper layer side of the first portion 12c of the IN-side flow path 12B, and below the placement region P, the first portion 14c of the IN-side flow path 12B. The second portion 12d extends to a slightly inner position. The second portion 14d of the OUT-side flow path 14B is bent at a substantially right angle from the end portion of the first portion 14c to the upper surface side of the main body portion 2, and is connected to the ejection hole array 13B.

  The IN-side flow path 12C of the flow path unit 11C extends in the in-plane direction of the flow path unit 11 on the upper surface 2a side in the thickness direction of the main body portion 2, and the second side of the OUT-side flow path 14B below the placement region P. It is connected to the ejection hole array 13C at a position slightly inside the portion 14d. Further, the OUT-side flow path 14C of the flow path unit 11C is located on the uppermost surface 2a side in the main body 2, extends in the in-plane direction of the flow path unit 11, and is connected to the ejection hole array 13B. With the configuration of the IN side flow path 12 and the OUT side flow path 14 as described above, the flow path length in each flow path unit 11 is the longest in the flow path unit 11A, and then the flow path unit 11B, The order is unit 11C.

  As shown in FIG. 4, the heat sink 1 having the above configuration is formed by laminating a plurality of (13 layers in this embodiment) flat plate members 21 each having a predetermined groove pattern. The flat plate member 21 is a member obtained by applying, for example, Ni plating with a thickness of about 1 μm to 5 μm and Au plating with a thickness of 2 μm or more on the surface of a copper plate. AuSn solder for joining the layers is deposited on the outermost surface of the flat plate member 21. In forming the heat sink 1, first, the plate-like members 21 are laminated in the order shown in FIG. And after grind | polishing and grinding a laminated body and adjusting an external dimension, for example, Ni plating about 1 micrometer-2 micrometers in thickness and Au plating about 0.1 micrometer-0.3 micrometer in thickness are given to the whole outer surface of a laminated body .

  Next, the main part of the flat plate member 21 of each layer will be described. Here, for convenience of explanation, the first layer to the thirteenth layer (flat plate members 21 </ b> A to 21 </ b> M) are formed from the lower surface 2 b side of the main body 2 toward the upper surface 2 a side. As shown in FIG. 4, a first groove pattern 22 corresponding to the supply port 3 and a second groove pattern 23 corresponding to the discharge port 4 are formed in all the flat plate members 21. The flat plate member 21A of the first layer and the flat plate member 21M of the thirteenth layer function as a cover member, and only the first groove pattern 22 and the second groove pattern 23 are formed.

  In the second layer flat plate member 21B to which the supply port 3 and the IN side flow path 12 are connected, as shown in FIG. 5, a third groove pattern 24 corresponding to the IN side flow path 12 is formed. The third groove pattern 24 has a shape that spreads from the supply port 3 toward the placement region P, and the tip of the third groove pattern 24 is branched by a plurality of partitions. Further, a constricted portion 24 a having a width smaller than the diameter of the first groove pattern 22 is formed at a connection portion between the first groove pattern 22 and the third groove pattern 24.

  By this narrowed portion 24a, it is possible to prevent the fluid from the supply port 3 from flowing excessively on both sides of the IN-side flow path 12. The central portion of the semiconductor laser bar S is a portion where the temperature is relatively likely to rise, and the cooling efficiency can be improved by collecting the fluid in the center of the placement region P. Such a narrowed portion 24a is similarly formed in the sixth-layer flat plate member 21F and the tenth-layer flat plate member 21J to which the supply port 3 and the IN-side flow path 12 are connected (see FIG. 4). .

  The second to fourth layer flat plate members 21B to 21D, the sixth to eighth layer flat plate members 21F to 21H, and the tenth to twelfth layers to which the discharge port 4 and the OUT-side flow path 14 are connected. In the flat plate members 21J to 21L, as shown in FIG. 4, a fourth groove pattern 25 corresponding to the OUT-side flow path 14 is formed. The fourth groove pattern 25 extends at a predetermined length along the end portion in the width direction of the main body portion 2, and is bent toward the center side of the main body portion 2 in the vicinity of the second groove pattern 23. 23.

  As shown in FIG. 6, the eleventh layer flat plate member 21 </ b> K is provided with an ejection hole array 13. The ejection hole array 13 is configured, for example, by arranging ejection holes 26 having a circular cross section at equal intervals in the width direction of the main body 2. The diameter of the ejection hole 26 is, for example, about 0.2 mm to 0.4 mm in diameter in consideration of securing the jet cooling effect and suppressing pressure loss. In the present embodiment, three rows of ejection hole rows 13A to 13C are arranged below the placement region P in correspondence with the three channel units 11A, 11B, and 11C, respectively. The ejection hole arrays 13 </ b> A to 13 </ b> C are arranged in a direction intersecting with the arrangement direction of the ejection holes 26, that is, in the length direction of the main body 2, and viewed from the end side in the length direction of the main body 2. 13A, the ejection hole row 13B, and the ejection holes 26C are arranged at equal intervals in this order. The arrangement direction of the ejection hole array 13 coincides with the resonator length direction of the semiconductor laser bar S placed in the placement region P (see FIG. 3).

  The groove pattern extending in a band shape in the width direction of the main body portion 2 between the ejection hole rows 13A and 13B is a fifth groove pattern 27 corresponding to the second portion 14b of the OUT side flow path 14A, and the ejection hole row 13B. , 13C is a sixth groove pattern 28 corresponding to the second portion 14d of the OUT-side flow path 14B. The fifth groove pattern 27 is formed at the same position from the plate member 21E of the fifth layer to the plate member 21K of the eleventh layer, and the sixth groove pattern 28 is formed from the plate member 21I of the ninth layer to the eleventh layer. The plate-shaped member 21K is formed at the same position.

  Further, on the outside of the fifth groove pattern 27, a seventh groove pattern 29 corresponding to the second portion 12b of the IN-side flow path 12A extends from the third layer plate member 21C to the eleventh layer plate member 21K. An eighth groove pattern 30 corresponding to the second portion 12d of the IN-side flow path 12B is formed between the fifth groove pattern 27 and the sixth groove pattern 28 from the seventh layer plate member 21G. It is formed over 11 layers of plate-like member 21K.

  As described above, in the heat sink 1, the ejection hole rows 13 from which the cooling fluid is ejected are arranged in a plurality of rows in a direction intersecting with the arrangement direction of the ejection holes 26. Thereby, the fluid can be ejected over a wide range with respect to the placement region P on which the semiconductor laser bar S is placed, and the semiconductor laser bar S can be uniformly cooled. In the heat sink 1, the plurality of ejection hole arrays 13 are not connected to a single flow path, but the ejection hole arrays 13 are connected to the respective flow path units 11. Therefore, the pressure and flow velocity of the fluid in the flow path can be ensured, and sufficient cooling efficiency can be achieved. In this configuration, since the fluid flow velocity unevenness is also suppressed, it is possible to avoid the loss of cooling uniformity.

  In the heat sink 1, the IN-side flow path 12 and the OUT-side flow path 14 are arranged in the stacking direction of the first portions 12 a, 12 c, 14 a, 14 c extending in the in-plane direction of the flow path unit 11 and the flow path unit 11. It has the 2nd part 12b, 12d, 14b, 14d extended. With such a configuration, the contact area between the fluid flowing through the flow path unit 11 and the main body 2 is increased, and the cooling efficiency of the semiconductor laser bar S can be further improved. Moreover, the rigidity of the main body part 2 in the stacking direction can be increased by the wall part of the main body part 2 that separates the second parts of the respective flow path units 11.

  The present invention is not limited to the above embodiment. For example, you may add the structure which considered the difference in the channel length of channel unit 11A, 11B, 11C with respect to embodiment mentioned above. That is, when there is a difference in the flow path length of the flow path unit 11, the longer the flow path length, the lower the fluid pressure and flow velocity. Therefore, a configuration for reducing the difference in fluid pressure and flow velocity may be added.

  As such a configuration, first, adjusting the inner diameter of the ejection hole 26 in each ejection hole array 13 may be mentioned. In this case, it is preferable to make the inner diameter of the ejection hole in the channel unit with a long channel length smaller than the inner diameter of the ejection hole in the channel unit with a short channel length. For example, as shown in FIG. It is preferable that the inner diameter of the ejection hole 26 of the path unit 11A <the inner diameter of the ejection hole 26 of the flow path unit 11B <the inner diameter of the ejection hole 26 of the flow path unit 11C.

  Further, the number of the ejection holes 26 in each ejection hole array 13 may be adjusted. In this case, it is preferable that the number of ejection holes arranged in the channel unit having a long channel length is smaller than the number of ejection holes arranged in the channel unit having a short channel length, for example, as shown in FIG. It is preferable that the number of the ejection holes 26 of the flow path unit 11A <the number of the ejection holes 26 of the flow path unit 11B <the number of the ejection holes 26 of the flow path unit 11C. Even when the number of arrangements is changed, it is preferable that the intervals between the ejection holes 26 and 26 are kept equal.

  Furthermore, it is possible to adjust the cross-sectional area of the IN-side flow path 12. In this case, it is preferable that the cross-sectional area of the IN-side flow path in the flow path unit with a long flow path length is not smaller than the cross-sectional area of the IN-side flow path in the flow path unit with a short flow path length. 9, the cross-sectional area of the IN-side flow path 12 in the flow path unit 11A <the cross-sectional area of the IN-side flow path 12 in the flow path unit 11B <the cross-sectional area of the IN-side flow path 12 in the flow path unit 11C. It is preferable. Such adjustment of the cross-sectional area can be easily realized, for example, by changing the plate thickness of the plate-like member 21 in each layer.

  In each of the modifications as described above, even when the flow path lengths of the flow path units 11 are different from each other, the pressure and flow velocity of the fluid ejected from the ejection holes 26 of the flow path unit 11 can be made uniform. Therefore, the cooling of the semiconductor laser bar S in the placement region P can be made more uniform.

  DESCRIPTION OF SYMBOLS 1 ... Heat sink, 2 ... Main-body part, 3 ... Supply port, 4 ... Discharge port, 11 (11A-11C) ... Channel unit, 12 (12A-12C) ... IN side channel, 12a, 12c ... IN side channel 1st part, 12b, 12d ... 2nd part of IN side flow path, 13 (13A-13C) ... ejection hole array, 14 (14A-14C) ... OUT side flow path, 14a, 14c ... OUT side flow First part of path, 14b, 14d, second part of OUT side flow path, S, semiconductor laser bar (heating element), P, placement area.

Claims (5)

A main body provided with a mounting region on which the heating element is mounted, a supply port to which a cooling fluid is supplied, and a discharge port for discharging the fluid are provided apart from the mounting region;
Inside the main body portion, an IN-side flow channel that guides the fluid supplied from the supply port toward the placement area side, and the fluid that passes through the IN-side flow path is below the placement area. A flow path unit constituted by a row of ejection holes to be ejected and an OUT side flow path for guiding the fluid ejected from the ejection hole array toward the discharge port is laminated in a plurality of stages.
The heat sink according to the above-described placement region, wherein the ejection hole arrays of the flow path units are arranged in a direction intersecting with an arrangement direction of the ejection holes. Each channel unit has a different channel length,
The inner diameter of the ejection hole in the flow path unit with the long flow path length is smaller than the inner diameter of the ejection hole in the flow path unit with the short flow path length. heatsink. Each channel unit has a different channel length,
2. The arrangement number of the ejection holes in the flow path unit having the long flow path length is smaller than the arrangement number of the ejection holes in the flow path unit having the short flow path length. The heat sink described. Each channel unit has a different channel length,
The cross-sectional area of the IN-side flow path in the flow path unit having the long flow path length is smaller than the cross-sectional area of the IN-side flow path in the flow path unit having the short flow path length. The heat sink according to claim 1.   The IN side flow path and the OUT side flow path have a first portion extending in the in-plane direction of the flow path unit and a second portion extending in the stacking direction of the flow path units. The heat sink according to claim 1, wherein the heat sink is characterized by the following.

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