JP5959057B2 - X-ray analyzer - Google Patents

Description

  The present invention relates to an X-ray analyzer having a function capable of realizing a plurality of measurement techniques.

  Recently, an X-ray analyzer having a function capable of realizing a plurality of measurement methods has been proposed. For example, according to Patent Document 1, it is disclosed that X-ray diffraction measurement, X-ray small angle scattering measurement, reflectance measurement, and other various measurements performed using X-rays are performed by a single X-ray analyzer. ing.

  Further, for example, according to Patent Document 2, in an X-ray analyzer having a predetermined measurement technique, an X-ray analyzer that can easily select a measurement condition corresponding to the characteristics of a substance to be measured using a computer. Is disclosed.

JP 2008-057989 A Japanese Patent Laid-Open No. 06-074923

  The X-ray analyzer disclosed in Patent Document 1 is configured such that various X-ray optical elements can be attached to a predetermined position in one analyzer as required, and can be further removed. Therefore, by selecting a desired X-ray optical element and placing it at a predetermined position, different types of X-ray measurements can be performed as necessary.

  By the way, there are various materials in the industry that are desired to be measured and analyzed using X-rays. These materials belong to semiconductor epitaxial films, semiconductor polycrystal films, magnetic films, and other appropriate material fields. The same material may belong to different material fields. There are various combinations of such material fields and materials, and suitable evaluation items are determined for combinations of individual material fields and materials.

  For example, it is known that the characteristics of materials such as ZnO and ITO belonging to the material field of electrode films used as transparent electrodes are preferably evaluated by measurements such as qualitative analysis measurement, orientation analysis, and orientation measurement. Yes. For example, in order to perform qualitative analysis measurement, it is known that in-plane measurement is performed as a measurement technique, and it is desirable to use an optical system including a parallel beam optical element and a light receiving slit as an optical system. It has been. In order to perform orientation analysis and orientation measurement, it is known that rocking curve measurement is performed as a measurement method, and it is desirable to use an optical system including a parallel beam optical element and a light receiving slit as an optical system. ing.

  As described above, when both the material to be measured and the material field to which the material belongs are specified, a preferable evaluation item, a preferable measurement method, and a preferable optical system for the combination of the material and the material field. The fact is that is inevitably determined. However, it is also important for a skilled measurer to decide which evaluation items should be set, which measurement method should be adopted, and which optical system should be adopted for a certain combination of materials and material fields. It is very difficult and even impossible for an assistant with little knowledge of X-ray measurements.

  As described above, according to the X-ray analyzer of Patent Document 1, different types of X-ray measurement such as In-plane measurement and rocking curve measurement can be performed as necessary. Since it is very difficult to select a suitable measurement method for a material or the like, it is in a state where the functions possessed cannot be fully exhibited.

  Moreover, according to the X-ray analyzer of Patent Document 2, when an evaluation item is determined in advance, specifically, when an evaluation item is determined as qualitative analysis, it is suitable for performing the qualitative analysis. The measurement conditions can be easily determined using a computer. However, as in the case of Patent Document 1, what should be adopted as an evaluation item, a measurement method, and an optical system when a combination of a material and a material field is determined is at the discretion of the measurer. For this reason, there are many cases in which optimum measurement is not performed in relation to the material, and the actual situation is that correct data cannot be obtained in evaluating the material.

  The present invention has been made in view of the above problems in the conventional apparatus, and in an X-ray analyzer having a function capable of realizing a plurality of measurement methods (in-plane measurement, rocking curve measurement, etc.) The purpose is to make effective use of these measurement functions.

An X-ray analysis apparatus according to the present invention is an X-ray analysis apparatus having a function capable of realizing a plurality of measurement techniques, and selectively selects a measurement system capable of realizing a plurality of measurement techniques and each of the plurality of measurement techniques. The relationship between the measurement software to be realized, the information of the material that can be measured (name of material, name of material field, etc.) and the evaluation method for evaluating the characteristics of the material, and the evaluation method and the measurement method. A storage means storing the relation, an input means for inputting the material information, and an operation for selecting the evaluation method based on the material information input by the input means and the storage contents of the storage means Evaluation method computing means, and measurement method selection means for selecting the corresponding measurement method based on the selected evaluation method based on the stored contents of the storage means, and the measurement method includes the evaluation method A measurement technique which is suitable for implementing a, characterized in that constituted by which part of the X-ray optical system is a measurement technique that identifies how move those parts.

  The material information includes, for example, a material name, a material field name, a material size, and the like.

  According to the X-ray analyzer according to the present invention, anyone can easily and accurately recognize an evaluation method (for example, qualitative analysis, crystallinity evaluation, etc.) suitable for the material only by inputting the material information. A measurement technique suitable for the material can be easily and accurately recognized. Therefore, according to the present invention, it is possible to accurately select an optimum material for a material from among a plurality of measurement functions possessed by the X-ray analyzer. The measurement function can be used effectively.

  In the X-ray analyzer according to the present invention, the information on the material may include a name of a material field. The name of the material field is, for example, a semiconductor epitaxial film, a barrier film, a dielectric constant film, a nanomaterial, and the like. If the name of the material field is included as material information, it is possible to provide the user with an image display indicating what evaluation (eg, qualitative analysis, crystallinity evaluation, etc.) should be performed on the material belonging to which field. Therefore, the user can easily and reliably select what evaluation should be performed.

In the X-ray analyzer according to the present invention, the material information may include a name of the material. The name of the material is, for example, a compound composition such as Si, Cu, FeSi ₂ or the like, or a characteristic name such as a low molecule, a nanoparticle, or the like. If the name of the material is included as material information, what kind of evaluation (for example, qualitative analysis, crystallinity evaluation, etc.) should be performed for what material can be provided to the user as an image display. What kind of evaluation should be performed can be selected easily and reliably.

  In the X-ray analysis apparatus according to the present invention, the material information may include both the name of the material field and the name of the material. This allows the user to be provided with more accurate information about what is the appropriate rating for the material.

An X-ray analysis apparatus according to the present invention provides a storage unit storing a plurality of types of optical system configurations, and an evaluation method for an appropriate optical system configuration from the plurality of types of optical system configurations stored in the storage unit. And an optical system calculation means for performing a calculation to be selected based on a combination of the measurement method and the measurement method .
According to this configuration, an optical system for realizing the measurement technique can be appropriately selected without being influenced by the user's subjectivity.

The X-ray analysis apparatus according to the present invention can further include an input unit for inputting the size of the material. The optical system computing means can use the inputted material size as a judgment material for computation for selecting the configuration of the optical system.
According to this configuration, since the size of the material is added as the determination material when selecting the optical system, the optical system can be more appropriately selected for the material.

  According to the X-ray analyzer according to the present invention, anyone can easily and accurately recognize an evaluation method (for example, qualitative analysis, crystallinity evaluation, etc.) suitable for the material only by inputting the material information. A measurement technique suitable for the material can be easily and accurately recognized. Therefore, according to the present invention, it is possible to accurately select an optimum material for a material from among a plurality of measurement functions possessed by the X-ray analyzer. The measurement function can be used effectively.

1 is a block diagram showing an embodiment of an X-ray analysis apparatus according to the present invention. It is a figure which shows the structure of the X-ray measurement system which is the principal part of the X-ray analyzer of FIG. It is a figure which shows the function of the goniometer which is the principal part of the X-ray measurement system of FIG. It is a figure which shows an example of the polar net used in the pole measurement which is one of the measuring methods. It is a figure which shows typically the memory content of the data memorize | stored in the memory of FIG. It is a flowchart performed by the wizard program shown in FIG. It is a figure which shows an example of an image display. It is a figure which shows the other example of an image display. It is a figure which shows the further another example of an image display. It is a figure which shows the further another example of an image display. It is a figure which shows the further another example of an image display. It is a figure which shows the further another example of an image display. It is a figure which shows the further another example of an image display. It is a figure which shows the further another example of an image display. It is a figure which shows the further another example of an image display. It is a flowchart which shows an example of the flow of the calculation for selecting a measurement method etc. It is a figure which shows the example of a macro. It is a figure which shows the other example of a macro. It is a figure which shows the other example of a macro.

  Hereinafter, an X-ray analyzer according to the present invention will be described based on embodiments. Of course, the present invention is not limited to this embodiment. In addition, in the drawings attached to the present specification, components may be shown in different ratios from actual ones in order to show characteristic parts in an easy-to-understand manner.

  FIG. 1 shows an embodiment of an X-ray analyzer according to the present invention. The X-ray analyzer of the present embodiment, indicated as a whole by reference numeral 1, is a CPU 2, which is a central processing controller of a computer, a ROM (Read Only Memory) 3, a RAM (Random Access Memory) 4, and a memory which is a storage medium. 5. ROM 3 and RAM 4 constitute an internal memory of the computer.

  The memory 5 is composed of a semiconductor memory, a hard disk, and other arbitrary storage media. The memory 5 may be installed inside the computer or may be installed outside the computer. The memory 5 may be a single unit or a plurality of storage media. The CPU 2 implements a predetermined function according to a program stored in the memory 5 while accessing the ROM 3 and RAM 4 as necessary.

  The X-ray analyzer 1 also includes an X-ray measurement system 8 that is a measurement mechanism that realizes a plurality of types of measurement methods using X-rays, a display 9 that displays an image, and an input unit. It has a keyboard 10 and a mouse 11 as input means. The above elements are connected to each other by a data bus 12.

  In the present embodiment, as shown in FIG. 2, the X-ray measurement system 8 includes a goniometer 15 that is a goniometer, an X-ray generator 16 installed on one side of the goniometer 15, and the other of the goniometer 15. And an X-ray detector 17 installed on the side. Inside the X-ray generator 16, a filament 18 as a cathode and a target 19 as an anti-cathode are provided. The region where the electrons emitted from the filament 18 collide with the surface of the target 19 is an X-ray focal point F, and X-rays are generated from the X-ray focal point F. That is, the X-ray focal point F functions as an X-ray source.

  In the present embodiment, a 2 KW sealed tube using a Cu (copper) target is used as the X-ray generator 16. The size of the X-ray focal point F is 1 mm × 10 mm. The cross-sectional shape of the X-ray beam taken out can be set to point focus or line focus as necessary.

  The X-ray detector 17 may be a 0 (zero) -dimensional X-ray detector having no position resolution, a one-dimensional X-ray detector having a position resolution in a linear direction, or a two-dimensional X having a position resolution in a plane. It may be a line detector. As a zero-dimensional X-ray detector, a proportional counter, a scintillation counter, etc. can be considered. As the one-dimensional X-ray detector, a PSPC (Position Sensitive Proportional Counter / position sensitive proportional counter), a linear CCD (Charge Coupled Device) sensor, or the like can be considered. As the two-dimensional X-ray detector, a two-dimensional CCD sensor or a photon counting type pixel two-dimensional detector can be considered. The photon counting type pixel two-dimensional detector is an X-ray detector in which a plurality of pixels (pixels) that directly convert photons excited by X-rays into electric signals and output them are two-dimensionally arranged. . The photon counting type pixel two-dimensional detector can detect X-rays for each pixel and can output a signal for each pixel.

  An incident optical system 22 is provided between the X-ray generator 16 and the goniometer 15. A light receiving optical system 23 is provided between the goniometer 15 and the X-ray detector 17. The incident optical system 22 includes a CBO (Cross Beam Optics) unit 24, a monochromator unit 25, an incident optical unit 26, and an incident slit box 27.

  The CBO unit 24 can be equipped with a slit for concentration method (BB), a slit for parallel beam (PB), a slit for small angle scattering measurement (SA), and a slit for measurement of minute part (MA), and further removed. Can do. Further, it can be a simple space without a slit.

  The monochromator unit 25 can be equipped with a monochromator and can be removed. It can be a simple space without a monochromator. As the monochromator, a two-crystal monochromator Ge (220) × 2, a two-crystal monochromator Ge (400) × 2, a four-crystal monochromator Ge (220) × 4, and a four-crystal monochromator Ge (440) × 4 is selectively used.

  The incident optical unit 26 can be equipped with necessary slits and can be removed. It can also be a simple space without a slit. Several types of solar slits and in-plane PSC (Parallel Slit Collimator) are selectively used as the slits.

  The entrance slit box 27 can be fitted with a slit and can be removed. It can be a simple space without a slit. As the slit, for example, several types of slits that fall within a range of 0.5 mm to 15 mm, for example, five types of length limiting slits are conceivable.

  The light receiving optical system 23 includes a first light receiving slit box 30, a first light receiving optical unit 31, a second light receiving optical unit 32, a second light receiving slit box 33, and an attenuator 34. An appropriate filter (CuKβ filter in the case of the present embodiment) can be attached to the first light receiving slit box 30, and it can be removed. It can be a simple space without a filter.

  An appropriate analyzer can be attached to the first light receiving optical unit 31, and further, it can be removed. It can be a simple space without an analyzer. As the analyzer, a two-crystal analyzer Ge (220) × 2 and a two-crystal analyzer Ge (400) × 2 are selectively used. Also, several types of PSA (Parallel Slit Analyzer) having different angles are selectively used as analyzers. As the angle of PSA, for example, 1.0 degree, 0.5 degree, 0.114 degree, and 0.05 degree are used.

  A solar slit and an in-plane PSA (Parallel Slit Analyzer) can be selectively attached to the second light receiving optical unit 32, and further, it can be removed. It can be a simple space without a slit or the like. As the solar slit, for example, Soller slit 5.0 deg and Soller slit 2.5 deg are used. For example, In-plane PSA 1.0 deg, In-plane PSA 0.5 deg, In-plane PSA 0.114 deg are used as the in-plane PSA.

  A slit can be attached to the second light receiving slit box 33, and further, it can be removed. It can be a simple space without a slit.

  An attenuator can be attached to the attenuator 34, and it can be removed. It can also be a simple space without an attenuator. As the attenuator, for example, several types of Al (aluminum) plates having different thicknesses that attenuate X-rays are selectively used. For example, 1/10000, 1/1000, and 1/70 are used as the Al plates having different attenuation coefficients.

  The goniometer 15 can realize a plurality of measurement methods shown in FIG. In FIG. 3, a sample S is placed at a predetermined position by a sample support device or a sample support base (not shown). The sample support device or the sample support base is a component of the goniometer 15. In this embodiment, it is assumed that the sample S is placed in a horizontal plane. Note that the sample S may be placed in a vertical plane.

  In this specification, the term “axis” like the θ-axis refers to the line itself such as the virtual line, and the term “axis” like the θ-axis refers to various components described above. A support system that supports the "axis line" so as to be rotatable, or supports the "axis" so as to be movable is assumed.

1. Out-of-plane measurement In FIG. 3, an X-ray source F is provided on one side of the position where the sample S is placed. The X-ray source F is an X-ray focal point formed on the surface of an anti-cathode (target) arranged to face the cathode, such as a filament. Specifically, a region where electrons generated from the cathode collide with the surface of the counter cathode is an X-ray focal point, and X-rays are emitted from this X-ray focal point. In the present embodiment, this X-ray focal point is the X-ray source F.

  X-rays are emitted from the X-ray focal point F in all three-dimensional directions, but some of them are taken out to the outside and irradiated on the sample S as incident X-rays R1. When the crystal lattice plane in the sample S satisfies the Bragg diffraction condition with respect to the incident X-ray R1, a diffracted X-ray R2 is generated from the sample S. In the present embodiment, the X-ray detector 17 detects the diffracted X-ray R2.

  In the present embodiment, the θ axis is set so as to pass through the surface of the sample S placed at a predetermined measurement position and to be parallel to the sample surface. The θ axis is set to position immobility. By rotating the sample S with respect to the X-ray source F around the θ axis, the incident angle θ of the X-ray R1 with respect to the sample S can be changed. Further, by rotating the X-ray source F with respect to the sample S about the θ axis, the incident angle θ can be changed. Such rotational movement around the X axis of the X-ray source F or sample S is referred to as θ rotation of the sample S.

  Assuming that the diffracted X-ray R2 is generated when the X-ray is incident on the sample S at the incident angle θ, the angle 2θ of the diffracted X-ray R2 with respect to the incident X-ray R1 (hereinafter, this angle 2θ is referred to as the diffraction angle) is θ. Doubled. The X-ray detector 17 rotates about the θ axis so as to maintain an angle twice as large as the X-ray incident angle θ so that the diffracted X-ray R2 generated at the diffraction angle 2θ can be detected. The rotational movement of the X-ray detector 17 around the θ axis is referred to as 2θ rotation of the X-ray detector 17.

  As described above, rotating the X-ray source F or the sample S about the θ axis and rotating the X-ray detector 17 about the θ axis by 2θ synchronously is called 2θ / θ scan. Yes. Here, the notation “A / B (A and B respectively indicate some motion axis)” expresses that the movement of A and the movement of B are coupled, that is, linked. Yes.

  A plane including the center line of the incident X-ray R1 to the sample S and the center line of the diffracted X-ray R2 from the sample S is generally called an equatorial plane or an out-of-plane. . Out-of-plane measurement can be performed by performing measurement by causing the X-ray source F and the X-ray detector 17 to scan 2θ / θ as described above.

2. In-plane measurement In FIG. 3, a 2θχ axis that passes through the sample S placed at a predetermined sample position and is perpendicular to the position-fixed θ axis is set. If the θ axis is a horizontal line, the 2θχ axis is a vertical axis, and if the θ axis is a vertical axis, the 2θχ axis is a horizontal axis. In addition, a φ axis that is an axis orthogonal to the surface of the sample S placed at a predetermined sample position is set. In FIG. 3, the φ axis line and the 2θχ axis line overlap to form one line, but the 2θχ axis line is a position-immovable line, while the φ axis line indicates that the sample S moves when the sample S swings or tilts. It is an axis that moves according to the movement of.

  A direction perpendicular to the equator plane including the center line of the incident X-ray R1 to the sample S and the center line of the diffracted X-ray R2 from the sample S is generally called a latitudinal direction or an in-plane direction. Yes. In the present embodiment, a drive system for rotating the X-ray detector 17 about the 2θχ axis is provided. If the X-ray detector 17 is rotated about the 2θχ axis by this drive system, the X-ray detector 17 can be moved in the in-plane direction. Such movement of the X-ray detector 17 in the in-plane direction is called 2θχ scan.

  In the present embodiment, a drive system for rotating the sample S around the φ axis perpendicular to the sample S is provided. The rotational movement of the sample S about the φ axis is generally called φ scan, and the rotation of the sample S in the plane by this φ scan is generally called in-plane rotation of the sample S. Yes.

  Useful diffraction line data regarding the sample S can be obtained by performing φ scan of the sample S and scanning the X-ray detector 17 by 2θχ. Such a measurement technique is generally called in-plane measurement.

3. Rocking curve measurement (ω scan)
The rocking curve is an incident X-ray beam with high monochromaticity and parallelism to the sample crystal, and the X-ray incident angle on the sample is slowly rotated at a constant low speed in the vicinity of the angle that satisfies the Bragg diffraction condition. It is a diffraction intensity curve measured when it is made to. Normally, this curve is drawn on a graph with the X-ray incident angle on the horizontal axis and the X-ray intensity on the vertical axis.

  In FIG. 3, the angle θ (that is, the X-ray incident angle θ) of the X-ray R1 incident on the sample S from the X-ray source F may be conventionally called “angle ω” depending on the type of measurement. In this embodiment, the conventional designation is respected, and depending on the type of measurement, the θ axis is referred to as the ω axis, the θ axis is referred to as the ω axis, and the θ scan is referred to as the ω scan.

  The respective positions of the X-ray source F and the X-ray detector 17 are fixed, and the sample S or the X-ray source F is ω-scanned as described above. A rocking curve can be obtained. The measurement method performed in this way is called rocking curve measurement by ω scan.

4). Rocking curve measurement (φ scan)
By fixing the respective positions of the X-ray source F and the X-ray detector 17 and scanning the sample S with the φ axis as the center as described above, a flat or peak diffraction line intensity diagram, that is, A rocking curve can be obtained. The measurement method performed in this way is called rocking curve measurement by φ scan.

5. High resolution rocking curve measurement (2θ / ω scan)
High resolution rocking curve measurement is a measurement realized by scanning the 2θ / ω scan using the incident thin crystal or the four crystal monochromator and the light receiving double crystal analyzer as the components of the optical system and using the epitaxial thin film as the sample S. .

6). High-Resolution In-plane Measurement Here, the χ axis that is an axis that passes through the surface of the sample S placed at a predetermined sample position and is orthogonal to both the θ axis and the 2θχ axis is considered. The angle of the sample S around the χ axis may be referred to as the tilt angle χ. As described above, in-plane measurement can be performed by scanning the sample S with φ scan and scanning the X-ray detector 17 with 2θχ. However, the sample S is scanned with φ and the X-ray detector 17 is scanned with 2θχ. Instead, if the tilt angle χ is fixed to 90 ° and the sample S is scanned 2θ / ω in the vertical plane, in-plane measurement with high resolution can be performed. Here, the 2θ / ω scan is to simultaneously perform the 2θ scan for the X-ray detector 17 and the ω scan for the sample S. By adopting this scanning method, in-plane measurement with high resolution can be performed.

7). Thin Film Method Measurement In FIG. 3, the X-ray incident angle ω with respect to the sample S is fixed at a low angle of 1 ° or less, and the X-ray detector 17 is scanned 2θ around the θ axis (that is, the ω axis). By measuring the diffracted X-rays, the diffracted X-rays generated from the thin film formed on the substrate can be measured. The measurement technique performed in this way is called thin film method measurement.

8). Pole Measurement In general, the intersection of a sphere centered on a crystal (so-called projection sphere) and the normal of the lattice plane of the crystal is called a pole. Then, the projection sphere is stereo-projected onto the polar net (Polar Net) shown in FIG. 4 which is the plane coordinates, that is, the figure obtained on the polar net by the plane projection is a pole figure. This pole figure is sometimes called a polar figure. If this polar figure is used, the orientation state of the polycrystal, that is, the orientation of the polycrystal can be appropriately displayed. The polar net shown in FIG. 4 is polar coordinates having an angle α (°) in the radial direction and an angle β (°) in the circumferential direction.

  The polar figure can be measured as follows, for example. That is, in FIG. 3, the X-ray incident angle θ is set to a fixed state, and the angle 2θ at which the X-ray detector 17 looks at the sample S is set to a fixed state. Then, the angle (so-called tilt angle) χ of the sample S around the χ axis, which is an axis that passes through the surface of the sample S placed at a predetermined position and is orthogonal to both the θ axis and the 2θχ axis, and the φ axis The intensity I of the diffracted X-rays at the individual sample positions specified by the tilt angle χ and the in-plane angle φ is measured while changing the in-plane angle φ of the sample S centering on. Thereby, the pole data specified by (χ, φ, I) is measured.

  Next, the χ value is converted into an α value using a predetermined conversion equation, and the φ value is converted into a β value using a predetermined conversion equation to obtain extreme point data of (α, β, I). Then, by plotting the obtained (α, β, I) on the polar net of FIG. 4, a pole figure can be obtained. The pole measurement performed in this way is called χ pole measurement.

  The pole measurement is not limited to the χ pole measurement as described above. For example, according to Japanese Patent Application Laid-Open No. 2001-056304, the pole figure can be obtained by correcting the data obtained by the in-plane measurement described above. It is disclosed. The pole measurement performed in this way is called in-plane pole measurement.

9. Reciprocal lattice map measurement (ω step, 2θ / ω scan)
The reciprocal lattice map is a diagram showing the intensity distribution in the reciprocal space of diffracted X-rays from the crystal. As is well known, the reciprocal lattice space is a space constituted by reciprocal lattice vectors and reflects the periodicity of the real space. As is well known, the reciprocal lattice vector is a vector defined in a predetermined relationship with respect to the basic vector in the real space of the crystal. In general, a reciprocal lattice point exists at the tip of a reciprocal lattice vector, and a plurality of reciprocal lattice points are arranged in a reciprocal lattice space.

  If this reciprocal lattice map is created and observed, it is possible to know, for example, the fluctuation of the lattice constant of the crystal, the inclination of the lattice plane, and the like. According to this embodiment, the reciprocal lattice map measurement can be executed by adopting a measurement method in which the sample S is moved ω stepwise and a 2θ / ω scan is executed at each ω position.

10. Reciprocal lattice map measurement (φ step, 2θ / ω scan)
In FIG. 3, the reciprocal lattice map measurement can be performed by adopting a measurement method in which the sample S is φ-moved (that is, moved in-plane) stepwise and 2θχ / φ scan is executed at each φ position.

11. Wide-area reciprocal lattice map measurement In FIG. 3, the sample S is stepwise moved by χ, and a 2θ / ω scan is executed at each χ position, whereby a wide-area reciprocal lattice map measurement, A reciprocal lattice map measurement capable of measuring a wide range can be performed.

12 Reflectance measurement The refractive index of a substance with respect to X-rays is slightly smaller than 1, and if X-rays enter the substance at a very shallow angle, total reflection occurs. The X-ray reflectivity can be obtained by measuring the X-ray reflection intensity near the total reflection. The penetration depth of X-rays into a substance in the vicinity of total reflection is as shallow as about 10 to 100 nm from the surface, and X-ray reflectivity measurement is effective for evaluating the vicinity of the surface of the substance or a thin film.

  In the reflectance measurement, the X-ray incident angle ω to the sample S is set to a very small angle of, for example, ω = 0.1 ° to 4 °, the X-ray is totally reflected by the sample S, and the reflected X-ray is reflected. Are detected by an X-ray detector. In this reflectance measuring apparatus, the sample S is irradiated with strictly monochromatic X-rays, and only X-rays satisfying a predetermined angular resolution are selected from the X-rays emitted from the sample S and sent to the X-ray detector. If supplied, highly reliable reflectance data can be obtained.

  In the present embodiment, reflectance measurement is performed by executing 2θ / ω scan, that is, 2θ scan and ω scan in conjunction with each other.

13. Transmitted small-angle scattering measurement Depending on the substance, scattered X-rays may be generated in a small-angle region centered on the optical axis of incident X-rays, for example, an angle region of about 0 ° to 5 ° when irradiated with X-rays. . For example, if fine particles of about 10 to 1000 mm or a non-uniform region having a size corresponding to this exists in the substance, diffuse scattering in the incident line direction, so-called center scattering occurs. This central scattering is independent of the internal structure of the particle and spreads as the particle becomes smaller. In the present embodiment, the X-ray detector 17 is scanned 2θ to perform small-angle scattering measurement, in particular, the scattered radiation generated in the direction of transmitting through the sample can be measured.

(Calculation control system)
In FIG. 1, various program software, files, and the like are stored in a memory 5 in an area having a capacity necessary for each. In the figure, various software, files, and the like are drawn in one memory for convenience, but actually, the program software is stored in a plurality of storage media as necessary.

  Specifically, in the memory 5, a measurement software 37, a material evaluation table 38, a wizard program 39 as measurement support software, a condition file 40, a measurement data file 41, and an analysis data file 42 are set. .

  The measurement software 37 is a program software for realizing a predetermined function by the CPU 2, and specifically, various measurement methods such as Out-of-plane measurement, In-plane measurement, rocking curve measurement, etc. described above are individually provided. It is program software to be executed.

  The material evaluation table 38 is a data table schematically shown in FIG. 5 and includes name data of a material that can be analyzed, name data of a material field to which the material belongs, and evaluation to be performed on the material. Name data (eg, qualitative analysis, crystallinity evaluation, lattice strain evaluation, etc.) and measurement methods to be performed on materials (eg, out-of-plane measurement, rocking curve measurement, in-plane measurement, etc.) And the corresponding relationship between the X-ray optical system name data associated with the measurement technique. The material evaluation table 38 will be described in detail later.

  The wizard program 39 as measurement support software is program software for assisting an analyst, that is, a user who intends to input measurement conditions. Specifically, advice is given on the evaluation method when the name of the material field or the name of the material for the sample to be measured is input by the user, or the measurement method or use when the evaluation method is input by the user. It is software for realizing the function of giving advice on optical systems. The wizard program 39 will also be described in detail later.

  The condition file 40 is a storage area for storing measurement conditions input by the user or input using the wizard program 39. The measurement data file 41 is a storage area for storing data obtained as a result of measurement. The analysis data file 42 is a storage area for storing data after analysis processing, that is, analysis data when any analysis processing is performed on the data obtained as a result of measurement, that is, measurement data. .

(Material Evaluation Table 38)
Hereinafter, the material evaluation table 38 will be described in detail with reference to a table in a schematic format shown in FIG.

[First column “Material Field”]
In FIG. 5, the first column from the left end shows a plurality of sub-items belonging to the “material field” item, which is one of the material information, arranged vertically. Details of the material field include semiconductor epitaxial films, semiconductor polycrystal films, semiconductor amorphous films,..., And other material field details. In the details of the material field, “barrier film” refers to a protective film between layers when the material is a multilayer. A “substrate” is a single crystal substrate. “Bulk” is a polycrystalline substrate.

[Second column "Material"]
In the second column from the left end, a plurality of sub-items belonging to the item “material” which is another one of the material information are vertically arranged. Examples of the material details include materials belonging to the individual details in the above-mentioned material field. A line indicating the correspondence is drawn between the material field details and the material details. These lines show what materials belong to the details of the individual material fields. For example, in the material field “transparent electrode film” that is raised seventh from the top of the first row, the eleventh material “ITO, ZnO, CdO,... Is shown to belong.
Further, for example, in the “wiring film” that is the fifth finest from the “material field” in the first row, “Cu” that is the ninth finest from the “material” in the second row , Al,...

  That is, the material evaluation table 38 stored in the memory 5 in FIG. 1 stores all the details of the material details in the second column in FIG. 5 to which of the material fields in the first column. Yes.

[3rd column "Evaluation"]
The third column from the left end shows a plurality of items belonging to the item “evaluation” arranged vertically. Details of evaluation include qualitative analysis, crystallinity evaluation, lattice strain evaluation,... And other various evaluation details. “Qualitative analysis” is an analysis for determining what substances are contained in a material. “Crystallinity evaluation” is to evaluate the size of crystallites. “Orientation / orientation evaluation” means evaluation of crystal orientation and orientation. “Lattice strain evaluation” is to evaluate whether or not the crystal lattice is strained. “Composition evaluation” is evaluation of chemical composition (ie, evaluation of lattice constant). “Lattice constant evaluation” means evaluation of crystal lattice constant.

  "Relaxation degree evaluation" is the following evaluation. When a thin film is formed on the substrate, the thin film may be distorted due to the substrate. When the amount of distortion exceeds a certain limit, the distortion is released instantly. In this case, the degree indicating how much strain is released is the degree of relaxation.

  Of the individual details of the “material” in the second row and the individual details of the “evaluation” in the third row, those corresponding to each other are connected by a line. What is connected by a line is not one evaluation for one material, but a plurality of evaluations for one material, and conversely, a plurality of materials for one evaluation. In the figure, the eleventh material detail “ITO, ZnO, CdO,...” From the top of the second column and several other material details are connected to a plurality of evaluation details in a straight line. Yes. However, in practice, all the material details are connected with a plurality of corresponding evaluation details in a straight line. If this is drawn on FIG. 5 honestly, the number of lines connecting the second and third columns becomes large, and it becomes almost black and difficult to see. As a representative, only the corresponding states of the material details “ITO, ZnO, CdO,...” And some other material details and the evaluation details in the third row are connected by lines.

  In other words, the material evaluation table 38 stored in the memory 5 in FIG. 1 indicates which evaluation of the material in the second column in FIG. This is remembered for all material details.

[Fourth column "Measurement method"]
The fourth column from the left end of FIG. 5 shows a plurality of sub-items belonging to the item “measurement technique” arranged vertically. Details of the individual measurement methods presented, for example, “Out-of-Plane measurement” and the like have already been described in the description of the measurement method described above with reference to FIG. .

  Of the details of the “evaluation” in the third row and the details of the “measurement method” in the fourth row, those that correspond to each other are connected by a line. The connection with a line is not limited to one “measurement method” for one “evaluation”, but may be a plurality of “measurement methods” for one “evaluation”. Conversely, there may be a plurality of “evaluations” for one “measurement technique”.

  In FIG. 5, for example, the first evaluation item “qualitative analysis” from the top of the third column is the first “Out-of-Plane measurement” and the third “In-Plane measurement” from the top of the fourth column. The connection is drawn. This indicates that qualitative analysis can be performed properly if Out-of-Plane measurement or In-Plane measurement is performed.

  In addition, the eighth “film thickness evaluation”, the ninth “roughness evaluation”, and the tenth “density evaluation” in the third column are all associated with the twelfth “reflectance measurement” in the fourth column. This indicates that the three items of film thickness evaluation, roughness evaluation, and density evaluation are appropriately performed if reflectance measurement is performed.

  In other words, the material evaluation table 38 stored in the memory 5 in FIG. 1 indicates which measurement method of the fourth column in the third column in FIG. , Remember all the evaluation details.

[5th column "Optical system"]
The fifth column from the left end of FIG. 5 (that is, the rightmost column) shows a plurality of items belonging to the item “optical system” arranged vertically. The optical systems shown are “medium resolution PB / RS” (“PB” is Parallel Beam and “RS” is Receiving Slit), “medium resolution PB / PSA” (“PB” is Parallel Beam and “PSA” is Parallel Slit Analyzer), "High resolution PB-Ge (220) x 2 / RS", "High resolution PB-Ge (400) x 2 / RS", "Ultra high resolution PB-Ge (220) x 4 / RS" , "Ultra high resolution PB-Ge (440) x 4 / RS", "Ultra high resolution PB-Ge (440) x 4 / RS", "Small angle scattering", "Concentration method", "Medium resolution PB-focus" “Medium resolution PB-focus / PSA”.

  Among the details of the “measurement method” in the fourth row and the details of the “optical system” in the fifth row, those corresponding to each other are connected by a line. The connection with a line is not limited to one “optical system” for one “measurement method”, and a plurality of “optical systems” may be used for one “measurement method”. On the contrary, there may be a plurality of “measurement methods” for one “optical system”.

  In FIG. 5, for example, the first measurement method detail “Out-of-Plane measurement” from the top of the fourth column is linked to the first “medium resolution PB / RS” from the top of the fifth column. This indicates that “Out-of-Plane measurement” is performed using the “medium resolution PB / RS” optical system. In addition, the sixth measurement method detail “pole measurement” is linked to the first “medium resolution PB / RS” and the third “high resolution PB-Ge (220) × 2 / RS” in the fifth column. . This indicates that “pole measurement” is performed using an optical system of “medium resolution PB / RS” and an optical system of “high resolution PB-Ge (220) × 2 / RS”.

  Furthermore, the twelfth measurement method detail “reflectance measurement” in the fourth column is the first “medium resolution PB / RS” and the third “high resolution PB-Ge (220) × 2 / RS” in the fifth column. ”And the fifth“ ultra-high resolution PB-Ge (220) × 4 / RS ”. This is because the optical system of “medium resolution PB / RS”, the optical system of “high resolution PB-Ge (220) × 2 / RS”, and the optical system of “ultra high resolution PB-Ge (220) × 4 / RS”. This indicates that “reflectance measurement” is performed using.

  The eighth “small angle scattering” in the fifth column is an optical system suitable for detecting scattered radiation in a small angle region with a diffraction angle 2θ (for example, a region of 2θ = 0 ° to 5 °). The ninth “concentration method” is an optical system suitable for detecting, with an X-ray detector, X-rays emitted from an X-ray source and diffracted by a sample and condensed at a light receiving slit.

  In addition, if the lines indicating the relationship between the fourth column and the fifth column are displayed for all the details, the number of lines becomes too large and difficult to see, so only a few representative lines in FIG. Is shown.

  As can be seen from the above, the material evaluation table 38 stored in the memory 5 of FIG. 1 indicates which optical system of the fifth column optical system should be attached to the measurement method of the fourth column of FIG. This is remembered for all measurement method details.

  The data table shown in FIG. 5, that is, the data table stored in the material evaluation table 38 in the memory 5 of FIG. 1 is not determined by the inventor without any grounds. It is a gift. Table 1 shows results obtained by the inventor as results of experiments and results of experience, and the data table in FIG. 5 is exactly defined based on these findings. Table 1 shows a part of the results obtained by the inventor.

Table 1 shows what evaluation is actually performed on a certain material in many cases and what measurement method is employed. For example, materials “ITO, ZnO, CdO,...” Belonging to the material field “transparent electrode film”
(1) Frequently evaluated by “azimuth analysis / orientation evaluation”
(2) It is evaluated fairly frequently by each of “qualitative analysis evaluation”, “crystallinity evaluation”, “lattice strain evaluation”, “film thickness evaluation / interface evaluation” and “density evaluation”.
(3) Sometimes evaluated by “solid solution composition evaluation” and “lattice constant evaluation”. The data table in FIG. 5 is determined based on such knowledge of the present inventor.

Further, for example, the material “Cu, Al,...” Belonging to “wiring film” which is one of the material fields,
(1) Frequently evaluated by “azimuth analysis / orientation evaluation”
(2) Evaluation is fairly frequently performed by each of “qualitative analysis evaluation”, “crystallinity evaluation”, “lattice strain evaluation”, “film thickness evaluation / interface evaluation”, and “density evaluation”.
(3) Evaluation is sometimes made by “solid solution evaluation” and “lattice constant evaluation”. The data table in FIG. 5 is determined based on such knowledge of the present inventor.

(Wizard program 39)
The wizard program 39 stored in the memory 5 of FIG. 1 is a program software for supporting the explanation of how to use the X-ray analysis apparatus 1 step by step using the image display on the display 9 to the analyst, that is, the user. It is.

  Specifically, as shown in FIG. 6, the wizard program 39 first executes a material field selection routine in step S01. In this routine, a material field selection screen 45 as shown in FIG. 7 is displayed on the screen of the display 9 in FIG. In this screen, the details of the material field stored in the first column of the data table of FIG. 5 are displayed. The user selects the selection button 46a corresponding to the desired material field using the mouse 11 in FIG. The selected condition is stored in the condition file 40 of FIG.

  Control then proceeds to the material selection routine of step S02. In this routine, a material selection screen 47a as shown in FIG. 8 is displayed. This material selection screen 47a is a material selection screen that is displayed when “transparent conductive film” is selected on the material field selection screen 45 of FIG. In this screen, the materials in the second column of FIG. 5 belonging to the material field selected in FIG. 7 are displayed. In the figure, the names of three materials are displayed except for “others”, but if “others” is clicked, other material names are displayed in the adjacent window. The user selects the selection button 46b corresponding to the desired material using the mouse 11 in FIG. The selected condition is stored in the condition file 40 of FIG.

  For example, when “wiring film” is selected on the material field selection screen 45 in FIG. 7, a material selection screen 47b as shown in FIG. 9 is displayed in the material selection routine. In this screen, the materials in the second column of FIG. 5 belonging to the material field selected in FIG. 7 are displayed. In FIG. 9, the names of two materials are displayed except for “others”, but if “others” is clicked, other material names are displayed in the adjacent window. The user selects the selection button 46e corresponding to the desired material using the mouse 11 in FIG. The selected condition is stored in the condition file 40 of FIG.

  Next, control proceeds to the sample information input routine of step S03. In this routine, an input screen 48 as shown in FIG. 10 is displayed. In response to the instruction, the user inputs the thickness, width, and height of the sample in the predetermined column 49. The input condition data is stored in the condition file 40 of FIG.

  Next, control proceeds to the evaluation item selection routine of step S04. In this routine, an evaluation item selection screen 50 as shown in FIG. 11 is displayed. In this screen, the details of evaluation stored in the third column of the data table of FIG. 5 are displayed. More specifically, details of evaluation corresponding to the material name selected in FIG. 8 are displayed. The user selects the selection button 46c corresponding to the desired evaluation using the mouse 11 in FIG. The selected condition is stored in the condition file 40 of FIG.

  In this embodiment, when any evaluation is checked in FIG. 11, as shown in FIG. 12, an image 51 for explaining the checked evaluation is displayed as a window. . Thereby, the user can perform an operation without causing an input error. In this case, the image 51 includes a condition selection screen 57 that needs to be determined prior to each evaluation process. The user can input desired conditions through these selection screens 57.

  Control then proceeds to the automatic analysis setting routine of step S05. In this routine, an automatic analysis setting screen 52 as shown in FIG. 13 is displayed. In this display, the evaluation item selected by the user in the evaluation item selection routine of step S04 is displayed. When the user desires automatic analysis by the computer for the displayed evaluation item, the user checks the selection button 46d corresponding to the evaluation item for which automatic analysis is desired.

  Next, the control proceeds to a selection item confirmation routine in step S06. In this routine, a selection item confirmation screen 53 as shown in FIG. 14 is displayed. On this screen, the measurement conditions selected by the user in the process so far are displayed in a list format. If the user wishes to correct this measurement condition, the user can return to the original routine by clicking the return button 54. When the user agrees with the displayed measurement conditions, the user clicks the completion button 55a.

  In the control flow described above, when at least the evaluation item selection routine in step S04 is completed, the computer performs necessary “measurement” from the names of “material field”, “material”, and “evaluation” selected by the user in FIG. The names of “method” and “optical system” are specified according to the program.

  FIG. 16 shows an example of a calculation flow for specifying such a measurement technique. FIG. 16 particularly illustrates the case where the user selects the transparent electrode film as the “material field” and selects ZnO as the “material”.

  For example, if the user selects the qualitative analysis as the evaluation by selecting the evaluation item in FIG. 11 and further selects the Out-of-Plane measurement as the measurement method in the detailed condition setting in FIG. Select each of the adjustment process, normal sample position adjustment process, and general-purpose out-of-plane measurement process.

  Further, for example, if the user selects film thickness evaluation as the evaluation by selecting the evaluation item in FIG. 11 and selects 100 nm or less by the information input in FIG. 10, the computer performs the process of adjusting the optical system of PB / RS according to the program, The step of adjusting the sample position and the step of measuring the reflectance are selected.

As understood from the above description, the X-ray analysis apparatus of the present embodiment is based on the following current state in the conventional X-ray analysis apparatus.
(1) The target material fields are diverse as shown in the first column of FIG. 5, for example.
(2) With recent X-ray analyzers, there are a lot of evaluation contents that can be realized as shown in the third column of FIG. 5, for example.
(3) The measurement order for each evaluation content is almost established. For example, each evaluation of film thickness evaluation, density evaluation, and roughness evaluation is performed in the order of optical system selection / adjustment → sample position adjustment → reflectance measurement → reflectance analysis.
(4) Although various adjustment tools and measurement tools are prepared in advance, the specific adjustment contents and measurement contents vary depending on the material and evaluation, and it is difficult for an expert to determine them. It is extremely difficult for unskilled people.

In view of such a current situation, the present embodiment performs the following processing.
(A) The entrance of the work is the material field and the material (both are information on the material), and the necessary evaluation items and detailed information are asked in a wizard format (ie, with questions and answers at each stage) at any time. The measurement flow and measurement conditions are fixed.
(B) That is, a measurement flow including various options and measurement conditions are made into a library (ie, a data table). For the selected material, information necessary for measurement (for example, index value and 2θ value) is obtained from the material database.
By such processing, even a user who has no measurement experience can easily assemble the flow of the evaluation items and the measurement conditions into an optimum state according to his / her material.

  When the completion button 55a is clicked in FIG. 14, control proceeds to the macro creation routine in step S07 in FIG. In this macro creation routine, the CPU 2 in FIG. 1 defines a command for instructing a measurement procedure to be transmitted to the X-ray measurement system 8 as a macro. As is well known, a macro is a simple program in which processing composed of a plurality of instructions is defined in advance as one instruction. When the macro generation is completed and the user clicks the completion button 55a, the created macro 56 is described in the program. The created macro can be displayed on the screen as indicated by reference numeral 56 in FIG. Hereinafter, the macro will be described in detail.

(First embodiment of measurement macro)
Basically, the CPU 2 determines the material information (first column “material field” and second column “material”) in FIG. 5, determines the evaluation (third column), and measures the measurement method (fourth column) and optical. When the system (fifth column) is determined, a macro is created.

  For example, in FIG. 5, when “Evaluation for examining crystal phase” is selected in “Evaluation selection” in the third column, and “In-Plane measurement” is selected in “Selection of measurement method” in the fourth column. For example, the macro shown in FIG. 17A is created.

  Further, when “examine lattice constant” is selected in “selection of evaluation” in the third column and “in-plane direction” is selected in “selection of measurement method” in the fourth column, for example, FIG. The macro shown in b) is created.

  Further, when “examine orientation” is selected in “selection of evaluation” in the third column and “in-plane direction” is selected in “selection of measurement method” in the fourth column, for example, FIG. The macro shown in c) is created.

  The above three cases show an example of creating a macro when one type of evaluation is selected in the selection of evaluation in the third column in FIG. However, the selection of evaluation is not limited to one type, and there may be a plurality of types. For example, three types of evaluations (a) to (c) in FIG. 17 may be selected at the same time. In this case, if no contrivance is applied in the process of creating the macro, the three types of macros (a) to (c) in FIG. 17 are simply continued, so the final macro is 4 × 3 = This is a macro consisting of 12 processes.

  Here, the present inventor has noted that, in the three types of macros (a) to (c) in FIG. 17, steps 1 to 3 of each macro are the same, that is, common. That is, when the three types of macros (a) to (c) in FIG. 17 are continuously executed, the processes from step 1 to step 3 of each macro need not be repeated three times. It means that you can use it only once.

  Based on this idea, if the common process is set to be performed only once, the macro can be composed of six processes as shown in FIG. Thus, by setting the common process to be executed only once, it is possible to save time and further reduce the processing time.

(Second embodiment of measurement macro)
FIG. 19 shows another embodiment for creating a macro. In this embodiment, two types of evaluations (a) and (b) in FIG. 19 are selected simultaneously. In this case, in these two types of macros, steps 1 and 2 are common and can be made common.

  Looking at step 3 of these macros, these steps are different from each other, so it is basically considered that they cannot be shared. However, step 3 of macro (a) is “in-plane sample position adjustment”, and step 3 of macro (b) is “sample position adjustment”. In this case, considering the adjustment accuracy, it is necessary to set the accuracy of the in-plane sample position adjustment higher than the accuracy of the sample position adjustment. This means that after the in-plane sample position adjustment, the position accuracy is sufficiently high without performing the sample position adjustment in step 3 in the macro (b).

  Therefore, in the case of the present embodiment, as shown in FIG. 19C, in the final macro, Step 1 and Step 2 are made common, and the sample position adjustment in Step 3 is an in-plane sample that is highly accurate. Only position adjustment is executed once. According to this embodiment, if two types of macros are performed separately, eight steps must be performed. However, step 1 and step 2 are shared, and step 3 is also more accurate. Since the process is executed, the number of processes is five. For this reason, compared with the case where two types of macros are executed separately, it is possible to save time and further shorten the processing time.

  As described above, in the present embodiment, when a plurality of evaluations are selected, it is possible to perform measurement with minimum effort (that is, minimizing time, parts replacement, etc.) by adding a device to the macro. The flow of measurement is optimized so that Specifically, based on the selected evaluation contents and detailed information, a common process among a plurality of measurement techniques is shared among the measurement techniques by performing once. In addition, when the required optical system extends to a plurality of optical systems, items that can be measured by each optical system are summarized. By such processing, even a user who has no measurement experience can easily assemble the flow of the evaluation items and the measurement conditions into an optimum state according to his / her material.

(Execution of X-ray measurement)
As described above, when the measurement method of FIG. 5 (see the fourth column) and the associated optical system (see the fifth column) are determined, the information is transmitted to the measurement software 37 of FIG. The wear 37 transmits information for realizing the determined measurement method to the X-ray measurement system 8. As a result, the X-ray measurement system 8 realizes the measurement method determined according to the determined conditions, and as a result, measurement data desired by the user is obtained.

  As can be understood from the above description, according to the present embodiment, a material name that is one of material information and a material name that is also one of material information can be input. Anyone can easily and accurately recognize an evaluation method (for example, qualitative analysis, crystallinity evaluation, etc.) suitable for the material, and can easily and accurately recognize a measurement method suitable for the material.

  In particular, in the present embodiment, since the evaluation name is selected based on both the name of the material field and the name of the material, an appropriate evaluation method can be specified for the material.

(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
For example, the X-ray measurement system 8 is not limited to the one shown in FIG. The X-ray measurement system 8 can have any other configuration as long as it has a function capable of realizing a plurality of measurement methods.

  In the above embodiment, when the CPU and software select an evaluation method based on the material name and material name input by the user, and when the user specifies the evaluation method, the CPU and software are selected. Chose the measurement method and the associated optical system. However, the present invention includes a case in which the evaluation method is selected based on either one of the material field name and the material name.

  1. 1. X-ray analyzer, 2. CPU (arithmetic control means) ROM, 4. RAM, 5. Memory, 8. X-ray measurement system, 9. 10. Display (image display means) 10. Keyboard (input means) Mouse (input means), 12. Data bus, 15. Goniometer (angle measuring instrument), 16. X-ray generator, 17. X-ray detector, 18. Filament, 19. Target, 22. Incident optical system, 23. Light receiving optical system, 24. CBO unit, 25. Monochromator section, 26. Incident optical unit, 27. Incident slit box, 30. First light receiving slit box, 31. First light receiving optical unit, 32. Second light-receiving optical unit, 33. Second light receiving slit box, 34. Attenuator section, 37. Measurement software, 38. Material evaluation table, 39. Wizard program, 40. Condition file, 41. Measurement data file, 42. Analysis data file, 45. Material field selection screen, 46a, 46b, 46c, 46d, 46e. Select button 47a. Material selection screen, 48. Input screen, 49. Input entry field 50. 51. Evaluation item selection screen Description window, 52. Automatic analysis setting screen, 53. Selection item confirmation screen, 54. Back button, 55a. Completion button, 56. Macro, F.E. X-ray source, R1. Incident X-rays, R2. X-ray diffraction, S. Sample, θ. X-ray incident angle, 2θ. Diffraction angle,

Claims (6)

In an X-ray analyzer with a function that can implement multiple measurement methods,
A measurement system that can implement multiple measurement methods;
Measurement software for selectively realizing each of the plurality of measurement methods;
Storage means for storing information on a material that can be a measurement target and an evaluation method for evaluating characteristics of the material, and a relationship between the evaluation method and the measurement method,
Input means for inputting information of the material;
Evaluation method calculation means for performing calculation for selecting the evaluation method based on the material information input by the input means and the storage content of the storage means;
Measuring method selecting means for selecting the corresponding measuring method based on the selected evaluation method based on the storage content of the storage means, and
Said measurement technique is measurement technique suitable for implementing the evaluation method is a measurement method constituted by any part of the X-ray optical system that identifies how move those parts A featured X-ray analyzer.   The X-ray analyzer according to claim 1, wherein the material information includes a name of a material field.   The X-ray analyzer according to claim 1, wherein the material information includes a name of the material.   The X-ray analyzer according to claim 1, wherein the material information includes a name of a material field and a name of the material. Storage means for storing configurations of a plurality of types of optical systems;
An optical system computing means for performing computation to select an appropriate optical system configuration based on a combination of an evaluation method and a measurement technique from the plurality of types of optical system configurations stored in the storage unit;
5. The X-ray analysis apparatus according to claim 1, wherein the X-ray analysis apparatus comprises: Having input means for inputting the size of the material;
6. The X-ray analysis apparatus according to claim 5, wherein the optical system calculation means uses the inputted size of the material as a judgment material for calculation for selecting a configuration of the optical system.

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