JP5950764B2 - Printed wiring board - Google Patents

Description

  The present invention relates to a printed wiring board used in a communication apparatus that requires high-speed signal transmission such as large-capacity communication.

  Demand for communication services compatible with mobile devices such as PCs that have been widely used in the past and smartphones that have become popular in recent years has increased dramatically. To meet these needs, the capacity and bandwidth have been further increased. There is a need to develop communication devices that realize the above.

  An optical fiber is used as an interface between such communication apparatuses, and large-capacity data communication is performed by optical signals. In such a communication device, an optical signal and an electric signal are converted by an conversion module as an interface from the outside, and processing is mainly performed by the electric signal in the communication device. As an electrical signal directly transmitted to the conversion module and an electrical signal transmitted from the conversion module, it is necessary to perform very high-speed signal transmission such as 30 Gbps. Since a 30 Gbps digital signal includes a component of a frequency band up to about 45 GHz when including a wide third harmonic, it is important to ensure high frequency characteristics with little loss in the frequency band in the transmission system.

  Conventionally, coaxial connectors and coaxial cables having excellent high-frequency characteristics have been widely used for connecting the conversion module and the printed wiring board in such a transmission system. However, as the speed of electrical signals has increased in recent years, it has become clear that it is difficult to ensure high-frequency characteristics simply by keeping the characteristic impedance of the coaxial cable, coaxial connector, and printed wiring board constant.

First, the structure of the signal wiring in the coaxial connector and the printed wiring board will be described.
FIG. 15 is a diagram showing a general structure of a coaxial connector.
The example of the coaxial connector 2 shown in FIG. 15 includes a coaxial cable connecting portion 210, a coaxial line portion 220, and a printed wiring board connecting portion 230. The coaxial line portion 220 includes an inner conductor 221 having a circular cross section and an inner conductor. The outer conductor 222 is arranged on the outer peripheral side of the outer surface 221 with an interval, and the inner dielectric layer 223 for characteristic impedance matching is provided between the inner conductor 221 and the outer conductor 222. In the printed wiring board connecting portion 230, the signal terminal 231 having a circular cross section so that the conductor connected to the inner conductor 221 can be connected to the signal conductor of the printed wiring board, and the conductor connected to the outer conductor 222 is the reference of the printed wiring board. A coaxial connector ground terminal 232 having a rectangular cross section that can be connected to the ground conductor is provided.

FIG. 16 is a cross-sectional view of a general signal transmission structure in a printed wiring board.
The microstrip line 300 configured on the printed wiring board shown in FIG. 16A has a structure in which a dielectric 330 is disposed between a signal conductor 301 on the surface layer and a reference ground conductor 302a that functions as the ground on the inner layer. The wider the width of the signal conductor 301, the smaller the characteristic impedance of the microstrip line 300. A structure in which a ground conductor 302b is added to the same surface layer as the signal conductor 301 in addition to the inner reference ground conductor 302a as shown in FIG. 16A is referred to as a grounded microstrip line (FIG. 16B).

Next, the coplanar line 310 shown in FIG. 16C has a structure in which the reference ground conductor 312 is disposed only in the same layer with respect to the signal conductor 311 on the surface layer. In order to ensure normal characteristic impedance, the signal conductor 311 and the reference conductor 310 are arranged. Since the distance between the ground conductors 312 is smaller than the signal conductor width, and the signal conductor width is increased, the distance between the signal conductor 311 and the reference ground conductor 312 can be increased, so that the characteristic impedance tolerance in manufacturing the printed wiring board can be reduced.
That is, the characteristic impedance Z is Z = √ (L / C) at high frequencies, but the distance between the signal conductor and the ground conductor is increased here, and the signal conductor width is increased even if the capacitance C is decreased. By doing so, the inductance L is also reduced, and the characteristic impedance can be maintained by performing this fine adjustment.

FIG. 17 is a diagram showing a connection structure between a conventional coaxial connector and a printed wiring board.
FIG. 17A shows a top view, and FIG. 17B shows a perspective view.
FIG. 18 is a schematic diagram of a signal current and a return current in a microstrip line with a ground on a printed wiring board.
18A shows the surface layer surface of the printed wiring board, and FIG. 18B shows the inner layer surface of the printed wiring board.
In the grounded microstrip line shown in FIG. 17, as shown in FIG. 18, the signal current 100 flows through the signal conductor, and the return current 101 corresponding to the signal current 100 is the portion of the reference ground conductor closest to the signal current 100. It flows mainly. When the return current 101 reaches the end of the printed wiring board on the side where the coaxial connector 2 is mounted, the return current 101 passes through the ground through hole of the printed wiring board closest to the signal conductor and the coaxial connector 2 to the outer conductor of the coaxial connector 2. Propagate.

  As a result, when the microstrip line is connected to the coaxial connector 2, the signal current 100 directly flows through the signal conductor and thus propagates through a short path, whereas the return current 101 flowing through the reference ground needs to pass through a long path. Therefore, the quasi-TEM (Transvers Electromagnetic mode) mode, which is the electromagnetic field distribution on the printed wiring board, is greatly collapsed, and the high frequency component of the signal is deteriorated.

In order to solve the above problem, Patent Documents 1 to 3 show a structure for shortening a return current path on a printed wiring board.
FIG. 19 is a top view and a perspective view of a coaxial connector and a printed wiring board for explaining the structures of Patent Documents 1 to 3 described above.
19 (a) is a top view, FIG. 19 (b) is a perspective view, and FIG. 19 (c) is a perspective view in which the orientation of the printed wiring board is reversed without connecting the coaxial connector of FIG. 19 (b). .
FIG. 20 is a cross-sectional view of a printed wiring board for explaining the structures of Patent Documents 1 to 3.
20A shows the surface layer surface of the printed wiring board, and FIG. 20B shows the inner layer surface of the printed wiring board.
Patent Documents 1 to 3 have a structure in which an end face through hole 110 and end face plating (not shown) are provided at the end of a printed wiring board as shown in FIG. As a result, as shown in FIG. 20, the return current 101 flows to the outer conductor of the coaxial connector 2 via the end surface through hole 110 provided at a location where the printed wiring board can contact the coaxial connector 2. As a result, the path of the return current 101 is shortened and the high-frequency characteristics can be improved as compared with the case where there is no end face through hole 110 or end face plating of the printed wiring board.

JP 2007-123950 A JP 2009-089147 A JP 2011-222576 A

  However, in the configuration of the conventional invention as disclosed in Patent Documents 1 to 3, there is a problem that the printed wiring board manufacturing process is increased and the cost is increased because the through hole is arranged on the end surface. In addition, there is a problem in that metal burrs and peeling occur when processing through holes in half. In addition, there is a method of performing end face plating on the printed wiring board instead of the through hole, but there is also a problem that the manufacturing process increases because the processing after the outer shape processing of the printed wiring board increases and the manufacturing cost increases.

  Furthermore, in the configuration of the conventional invention as described above, the ground conductor disposed in the same layer as the pad and the signal conductor for soldering the coaxial connector and the inner layer reference ground conductor are opposed to each other. There is a problem that high-frequency passage characteristics of several tens of GHz or more cannot be secured due to the occurrence of a resonance phenomenon at high frequencies in the portion.

  The present invention has been made to solve the above-described problems, and can reduce printed circuit board manufacturing processes and costs, shorten the return current path, and suppress high-frequency resonance phenomena. A board is provided.

The printed wiring board according to the present invention is a printed wiring board for mounting a coaxial connector and an integrated circuit, wherein the signal conductor and the reference ground conductor are formed on the same surface layer, the coplanar line connected to the coaxial connector, and the signal conductor The coplanar line is formed on the surface layer, the reference ground conductor is formed on another layer different from the surface layer, the microstrip line connecting the coplanar line and the integrated circuit, and the signal conductor of the coplanar line is formed on both sides. The first ground through hole connecting the termination region in the direction of the microstrip line in the reference ground conductor and the termination region in the direction of the coplanar line in the reference ground conductor of the microstrip line, and the signal conductor of the microstrip line Integrated circuit signals A second ground through-hole for connecting the reference ground conductor lands and the microstrip line of the ground terminal of the integrated circuit disposed on either side of the child, the conductor width of the reference ground conductor of the microstrip line, the first ground through The reference ground conductor of the microstrip line is provided with an inclined portion toward the first ground through hole by being gradually narrowed toward the hole .

  According to the present invention, the return current can be shortened without the end face through hole or end face plating of the printed wiring board with respect to the coaxial connector, thereby preventing an abrupt change in the propagation mode of the electromagnetic field. Therefore, high frequency characteristics can be secured, and the manufacturing process and manufacturing cost can be reduced as compared with the case where an end face through hole is used in the return current path. Furthermore, since the area where the coaxial connector mounting pad portion and the ground pattern for return current face each other is reduced, resonance can be suppressed even at high frequencies.

1 is a schematic top view of a printed wiring board according to Embodiment 1 of the present invention. It is a schematic top view which mounted the coaxial connector and LSI on the printed wiring board concerning Embodiment 1 of this invention. It is a perspective view of the printed wiring board concerning Embodiment 1 of this invention. It is a schematic sectional drawing of the printed wiring board which concerns on Embodiment 1 of this invention. It is a figure which shows the inner layer surface of the printed wiring board which concerns on Embodiment 1 of this invention. It is a figure showing the path | route of the signal current 100 and the return current 101 of the printed wiring board concerning Embodiment 1 of this invention. It is an upper surface perspective view of the printed wiring board concerning Embodiment 1 of this invention. It is a figure explaining the passage characteristic of the printed wiring board concerning Embodiment 1 of this invention. It is a figure explaining the passage characteristic of the printed wiring board using the conventional end surface through hole. It is a figure which shows the surface layer surface of the printed wiring board which concerns on Embodiment 2 of this invention. It is a figure which shows the inner layer surface of the printed wiring board which concerns on Embodiment 2 of this invention. It is a figure which shows the inner layer surface of the printed wiring board which concerns on Embodiment 2 of this invention. It is a figure which shows the density distribution of the return current of the printed wiring board concerning Embodiment 2 of this invention. It is the top view and enlarged view of the printed wiring board concerning Embodiment 3 of this invention. It is a figure which shows the general structure of a coaxial connector. It is sectional drawing of the general signal transmission structure in a printed wiring board. It is a figure which shows the connection structure of the conventional coaxial connector and a printed wiring board. It is a schematic diagram of a signal current and a return current in a microstrip line with a ground of a printed wiring board. It is the upper side figure and perspective view of a coaxial connector and printed wiring board explaining the structure of patent documents 1-3. It is sectional drawing of the printed wiring board explaining the structure of patent documents 1-3.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
Embodiment 1 FIG.
1 is a schematic top view of a printed wiring board according to Embodiment 1 of the present invention. FIG. 2 is a schematic top view of a coaxial connector and an LSI (Large Scale Integration, integrated circuit) mounted on the printed wiring board according to Embodiment 1 of the present invention. FIG. 3 is a perspective view of the printed wiring board shown in FIG. 4 is a schematic cross-sectional view of the printed wiring board shown in FIG. Note that the printed wiring board is a multilayer printed wiring board composed of a solder resist that protects the conductor surface, a signal layer, a power supply layer, and a ground layer. However, in order to facilitate understanding of the configuration, in FIG. A cross-sectional view is shown. FIG. 5 shows the inner layer surface of the printed wiring board according to Embodiment 1 of the present invention.
Hereinafter, the configuration of the printed wiring board according to Embodiment 1 will be described in detail with reference to FIGS.

  In FIG. 1, the printed wiring board 1 includes a coaxial connector signal terminal land 8a, a coaxial connector ground terminal land 8b, a coplanar line 310, a reference ground conductor 312 of the coplanar line 310, a microstrip line 300, and FIGS. The microstrip line 300 includes a reference ground conductor 302a, an LSI signal terminal land 9a, and an LSI ground terminal land 9b. The coaxial connector 2 and the LSI 3 are mounted as shown in FIG. In addition, ground through holes (first ground through holes) 6a are provided at both ends of the signal conductor 311 of the coplanar line 310, and ground through holes (second ground through holes) are provided at both ends of the signal conductor 301 of the microstrip line 300. 6b is arranged.

  In the coplanar line 310, the signal conductor 311 and the reference ground conductor 312 are formed on the same surface layer and are connected to the coaxial connector 2. The coaxial connector 2 is connected to the printed wiring board 1 at the printed wiring board end 1a as shown in FIGS. In the microstrip line 300, the signal conductor 301 is formed on the surface layer, the reference ground conductor 302a is formed on another layer different from the surface layer, and the coplanar line 310 and the LSI 3 are connected.

FIG. 5 shows the positional relationship between the ground through holes 6 a and 6 b, the reference ground conductor 312 of the coplanar line 310, and the reference ground conductor 302 a of the microstrip line 300.
The ground through hole 6 a is formed adjacent to both sides of the signal conductor 311 of the coplanar line 310, the termination region of the reference ground conductor 312 of the coplanar line 310 toward the microstrip line 300, and the reference ground conductor 302 a of the microstrip line 300. The termination region in the direction of the coplanar line 310 is connected.

Here, the distance close to both sides of the signal conductor 311 of the coplanar line 310 refers to a distance having a distance corresponding to the radius of the ground through hole 6 a from the end of the reference ground conductor close to the signal conductor 311.
For example, the land diameter of the ground through hole 6a (the ground through hole 6a is formed by electroplating a metal after drilling with a drill or a laser. Since it is not possible to perform electroplating, it is usually necessary to form a land and place a hole in it), where 0.5 mm is the position of 0.25 mm from the end of the reference ground conductor, that is, the radius of the land of the ground through hole 6a The distance when the center of the ground through hole 6a is at the same distance.

  The ground through hole 6 b connects the LSI ground terminal lands 9 b arranged on both sides of the LSI signal terminal land 9 a connected to the signal conductor 301 of the microstrip line 300 and the reference ground conductor 302 a of the microstrip line 300.

  The shaded region in FIG. 5 is a region (opposing region 340) where the ground reference conductors 312 and 302a of the coplanar line 310 and the microstrip line 300 face each other in the vertical direction. The area of the opposing region 340 is configured to be small, and may be an area that can form the ground through hole 6a at a minimum.

  One or more ground through holes 6 a may be arranged at both ends of the signal conductor 311. By arranging a plurality of ground through holes 6a in this way, the spread return current component can be connected to the reference ground conductor 312 of the coplanar line 310 and the reference ground conductor 302a of the microstrip line 300 through a short path. . Further, since the reference ground conductors 312 and 302a partially overlap with each other in a small area facing region 340, resonance that may occur between the reference ground conductor 312 of the coplanar line 310 and the reference ground conductor 302a of the microstrip line 300 is suppressed. can do.

  The coaxial line portion 220, the coplanar line 310, and the microstrip line 300 in the coaxial connector 2 have the conductor widths of the signal conductors 311 and 301, the signal conductor 311, and the reference ground conductor so that the characteristic impedance becomes a predetermined value, for example, 50Ω. The distance between 312 is adjusted.

  As shown in FIG. 1, the coaxial connector ground terminal land 8b mounting portion of the coplanar line 310 includes a characteristic impedance adjustment unit 320 that performs characteristic impedance matching (see an enlarged view of the characteristic impedance adjustment unit 320). This is to reduce the capacitive coupling between the reference ground conductor 312 of the coplanar line 310 and the coaxial connector signal terminal 231 shown in FIGS. 3 and 4, and to suppress the characteristic impedance from greatly decreasing from a desired value. Is.

  That is, when the coaxial connector signal terminal 231 is soldered to the coaxial connector signal terminal land 8 a connected to the signal conductor 311 of the coplanar line 310, the electrostatic potential between the signal conductor 311 of the coplanar line 310 and the reference ground conductor 312. Compared with the capacitance, the capacitance between the soldered coaxial connector signal terminal land 8a and the reference ground conductor 312 becomes large, causing a reduction in characteristic impedance and deterioration in transmission characteristics. In order to prevent this, the reference ground conductor 312 of the coplanar line 310 is closer to the coaxial connector than the distance (A) between the coplanar line 310 and the signal conductor 311 as shown in the enlarged view of the characteristic impedance adjustment unit 320 of FIG. The signal terminal 231 is disposed so that the distance (b) from the coaxial connector signal terminal land 8a to which the signal terminal 231 is soldered is larger.

  Similarly, as shown in FIG. 1, a connection portion between the coplanar line 310 and the microstrip line 300 is also provided with a characteristic impedance adjustment unit 321 for matching characteristic impedance (see an enlarged view of the characteristic impedance adjustment unit 321). The signal conductor 311 of the line 310 is connected to the signal conductor 301 of the microstrip line 300 in a tapered shape.

  The coaxial connector ground terminal 232 is located near the outer conductor 222 of the coaxial line portion 220 in the coaxial connector 2 shown in FIG. 15 so that it can be soldered to the reference ground conductor 312 of the coplanar line 310. A coaxial connector ground terminal land 8b is arranged in the vicinity of 8a so that the solder resist is not covered.

  The microstrip line 300 may be a microstrip line with a ground as shown in FIG. When using a microstrip line with a ground, the reference ground conductor 302a and the other ground conductor 302b are connected using a conductive material (not shown) such as solder. In addition, it is necessary to dispose the ground through holes densely, for example, with microstrip lines with ground at intervals of 0.8 mm so that resonance between the reference ground conductor 312 and the ground conductor 302b does not occur.

  In addition, as the coaxial connector 2, an SMA (Sub Miniature Type A) connector, a SMPM connector, an SMP connector, an SMV connector, a 2.92 mm connector, a 1.85 mm connector, a 1 mm connector, or the like for a frequency range of 1 GHz or more is used.

6 is a diagram showing paths of signal current 100 and return current 101 of the printed wiring board according to Embodiment 1 of the present invention, and FIG. 7 is a top perspective view of the printed wiring board according to Embodiment 1 of the present invention. It is.
As described above, the ground through hole 6a is located near both sides of the signal conductor 311 of the coplanar line 310, and the termination region of the reference ground conductor 312 of the coplanar line 310 toward the microstrip line 300 and the microstrip line 300 The reference ground conductor 302a is disposed so as to connect the termination region in the direction of the coplanar line 310, and the ground through hole 6b is disposed on both sides of the LSI signal terminal land 9a connected to the signal conductor 301 of the microstrip line 300. The LSI ground terminal land 9b and the reference ground conductor 302a of the microstrip line 300 are arranged to be connected. With such an arrangement, as shown in FIGS. 6 and 7, the return current 101 of the signal current 100 that is a high-frequency signal is sent from the inner conductor 221 portion of the coaxial line portion 220 in the coaxial connector 2 shown in FIG. 15 to the coaxial connector. A short path from the ground terminal connection land 8b, the reference ground conductor 312 of the coplanar line 310, the ground through hole 6a, the reference ground conductor 302a of the microstrip line 300, the ground through hole 6b, and the ground terminal land 9b of the LSI 3 to the LSI 3. It is possible to pass.

  According to this configuration, good pass characteristics can be obtained even at 15 GHz, which is the fundamental frequency of a 30 Gbps NRZ signal, for example. FIG. 8 is a diagram for explaining pass characteristics of the printed wiring board according to Embodiment 1 of the present invention. The pass characteristic required at the fundamental frequency is, for example, -3 dB or more. For evaluation, two coaxial connectors are mounted on the signal input part and the signal output part, and the coplanar line-microstrip line-coplanar line is connected between the coaxial connectors. The result of measuring the printed wiring board connected by the structure with a network analyzer is shown in FIG. From the measurement result, it can be determined that the characteristics of −3 dB or more can be secured, and it is possible to transmit the 30 Gbps NRZ signal without any problem.

On the other hand, FIG. 9 is a diagram for explaining pass characteristics of a printed wiring board using a conventional end face through hole. In FIG. 9, the result of measuring the printed wiring board using the conventional end face through hole by the same method is shown in FIG.
In this case, due to resonance in the coaxial connector ground terminal land 8b and the reference ground conductor of the microstrip line, the pass characteristic is deteriorated at 30 GHz, which is difficult to use in a high-frequency digital signal requiring a wide band. It was. This resonance can be moved to a higher frequency by increasing the number of ground through holes and how they are arranged. However, the number of ground through holes cannot be increased as much as possible in the production of printed wiring boards, and the higher frequency band. Including is not a fundamental solution.

  As described above, according to the first embodiment of the present invention, the return current can be shortened with respect to the coaxial connector 2 without the end face through-hole or end face plating of the printed wiring board 1. Since a rapid change in the propagation mode of the electromagnetic field can be prevented, high frequency characteristics can be ensured, and the manufacturing process and manufacturing cost can be reduced as compared with the case where an end face through hole is used in the return current path.

  Further, when a conventional printed wiring board having end face through holes or end face plating is used, resonance may occur. According to the first embodiment of the present invention, the reference ground conductor 312 of the coplanar line 310 and Since the area of the opposing region 340 between the reference ground conductors 302a of the microstrip line 300 can be reduced, it is possible to suppress high-frequency characteristic deterioration due to resonance that easily occurs at several tens of GHz or more.

  Further, when the end surface through hole is provided as in the prior art, the solder may flow into the wall surface of the through hole, and there is a problem that the soldering is not stable, but according to the first embodiment of the present invention, the coaxial connector 2 is arranged at the end of the printed wiring board 1a so that it can be soldered directly to the land 8b for the coaxial connector ground, and does not have an end face through hole or end face plating so that the solder does not flow into the wall surface of the printed wiring board 1. By doing so, stable soldering can be performed as compared with the case where end face through holes and end face plating are provided, and the high frequency characteristics of the coaxial connector can be secured, so that the yield can be improved. In addition, by using the ground through hole 6a without using the end face through hole, heat escape from the end face through hole and end face plating during soldering of the coaxial connector 2 in the reflow soldering process is suppressed. Can improve the spread of wetness.

  In the first embodiment, the microstrip line 300 is connected to the LSI 3, but the microstrip line 300 may be connected to other semiconductor elements or electric elements instead of the LSI 3.

Embodiment 2. FIG.
FIG. 10 is a view showing a surface layer surface of a printed wiring board according to Embodiment 2 of the present invention.
11 and 12 are views showing an inner layer surface of a printed wiring board according to Embodiment 2 of the present invention.
FIG. 13 is a diagram showing a density distribution of return currents of the printed wiring board according to Embodiment 2 of the present invention.
A printed wiring board 1 according to Embodiment 2 of the present invention will be described with reference to FIGS.

  As shown in FIG. 10, in the microstrip line 300 on the printed wiring board 1, the signal current 100 that is a high-frequency signal flows through the signal conductor 301, and the return current 101 corresponding to the signal flows mainly directly below the signal conductor 301. . The return current 101 flows with a certain current density distribution as shown in FIG.

  Therefore, as shown in FIG. 11, the reference ground conductor 302a of the microstrip line 300 is gradually formed on both sides of the microstrip line 300 around the signal conductor 301 in the vicinity of the connection part of the microstrip line 300 with the coplanar line 310. By making the structure having the inclined portion 302c narrowed, that is, the conductor width of the reference ground conductor 302a of the microstrip line 300 is gradually narrowed toward the ground through hole 6a, so that the reference ground conductor 302a of the microstrip line 300 is reduced. By providing the inclined portion 302c toward the ground through hole 6a, the path including the component spread by the distribution of the return current 101 can be shortened. In addition, since the area of the facing region 340 between the reference ground conductor 312 of the coplanar line 310 and the reference ground conductor 302a of the microstrip line 300 can be further reduced as compared with the first embodiment, resonance can be further suppressed. .

  Further, as shown in FIG. 12, by providing a notch 302d along the periphery of the ground through hole 6a at the apex of the inclined portion 302c of the reference ground conductor 302a of the microstrip line 300, the path of the return current 101 is further increased. The resonance can be further suppressed.

Embodiment 3 FIG.
When the printed wiring board 1 on which the LSI 3 is mounted is operated at a high frequency, an AC coupling capacitor for adjusting the bias used in the LSI 3 or a high-frequency compatible inductor for bias tee is required as another component land. There is. In the prior art, the pad for mounting the AC coupling capacitor and inductor is larger than the signal conductor of the microstrip line, and becomes a capacitive component in the microstrip line and the microstrip line with ground, which causes the transmission characteristics to deteriorate at high frequencies. Become.

The printed wiring board according to Embodiment 3 of the present invention is for solving such problems.
FIG. 14 is a top view and an enlarged view of a printed wiring board according to Embodiment 3 of the present invention.
FIG. 14A is a top view and an enlarged view of the printed wiring board 1 on which the inductor 4 is mounted.
In the coplanar line 310, for example, the inductor signal terminal connection land 4a is disposed on the signal conductor 311 of the coplanar line 310, and the inductor power terminal connection land 4b is disposed on the power supply wiring conductor. At this time, the width of the signal conductor 311 of the coplanar line 310 is set to be approximately the same as the width of the inductor signal terminal connection land 4a. That is, a land for mounting an electronic component is formed within the conductor width of the signal conductor 311 of the coplanar line 310.

  When the inductor 4 mounted on the microstrip line 300 is large, the inductor signal terminal connection land 4a may be larger than the signal conductor width. When 4a is arranged, the characteristic impedance of that portion is lowered, and as a result, the characteristic impedance is not constant. This is because the distance between the signal conductor 301 and the reference ground conductor 302a cannot be partially adjusted. Further, when the width of the signal conductor 301 is matched to the width of the inductor signal terminal connection land 4a, the overall characteristic impedance is lowered.

  On the other hand, when the inductor 4 mounted on the coplanar line 310 is large and the inductor signal terminal connection land 4a is also large, the signal conductor width is adjusted to the width of the inductor signal connection land 4a, and the signal conductor 311 -reference ground conductor 312. The distance between can be adjusted. As a result, the characteristic impedance can be kept constant.

  As described above, in the microstrip line 300, when the inductor signal terminal connection land 4a larger than the signal conductor width is arranged and the signal conductor width is increased, the characteristic impedance of the signal conductor 301 is reduced, but in the coplanar line 310, Even when the conductor width of the signal conductor 311 is increased to the same extent as that of the inductor signal terminal connection land 4a, the characteristic impedance of the signal conductor 311 can be made constant. Characteristics can be secured. When the conductor width of the signal conductor 311 of the coplanar line 310 is increased, the distance between the signal conductor 311 and the reference ground conductor 312 can be increased to match a predetermined impedance, for example, 50Ω.

FIG. 14B is a top view and an enlarged view of the printed wiring board 1 on which the capacitor 5 is mounted.
For example, the capacitor connecting land 5a is arranged on the coplanar line 310, and the conductor width is adjusted to the same extent as the capacitor connecting land 5a, that is, the electronic component is mounted within the conductor width of the signal conductor 311 of the coplanar line 310. By forming the lands for this purpose, the characteristic impedance can be kept constant and the high frequency characteristics can be ensured, as in the case of FIG.

  In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

  DESCRIPTION OF SYMBOLS 1 Printed wiring board, 1a Printed wiring board edge, 2 Coaxial connector, 3 LSI, 4 Inductor, 4a Inductor signal terminal connection land, 4b Inductor power supply terminal connection land, 5 Capacitor, 5a Capacitor terminal connection land, 6a, 6b Ground through hole, 8a coaxial connector signal terminal land, 8b coaxial connector ground terminal land, 9a LSI signal terminal land, 9b LSI ground terminal land, 100 signal current, 101 return current, 110 end face through hole, 210 coaxial cable Connection part, 220 coaxial line part, 221 inner conductor, 222 outer conductor, 223 inner dielectric layer, 230 printed wiring board connection part, 231 signal terminal, 232 coaxial connector ground terminal, 300 microstrip line, 301, 31 1 Signal conductor, 302a, 312 Reference ground conductor, 302b Ground conductor, 302c Inclined part, 302d Notch part, 310 Coplanar line, 320, 321 Characteristic impedance adjusting part, 330 Dielectric, 340 Opposite region

Claims (5)

In printed wiring boards for mounting coaxial connectors and integrated circuits,
A signal conductor and a reference ground conductor are formed on the same surface layer, and a coplanar line connected to the coaxial connector;
A signal conductor is formed on the surface layer, a reference ground conductor is formed on another layer different from the surface layer, and a microstrip line that connects the coplanar line and the integrated circuit;
A termination region in the direction of the microstrip line in the reference ground conductor of the coplanar line and a termination region in the direction of the coplanar line in the reference ground conductor of the microstrip line, formed close to both sides of the signal conductor of the coplanar line. A first ground through hole connecting the
A ground terminal land of the integrated circuit disposed on both sides of the signal terminal of the integrated circuit connected to the signal conductor of the microstrip line and a second ground through hole connecting the reference ground conductor of the microstrip line ; ,
An inclined portion toward the first ground through hole in the reference ground conductor of the micro strip line by gradually narrowing a conductor width of the reference ground conductor of the micro strip line toward the first ground through hole;
Printed wiring board comprising the.   The printed wiring according to claim 1, further comprising an impedance adjusting unit that performs characteristic impedance matching at a connection portion between the coaxial connector and the coplanar line and a connection portion between the coplanar line and the microstrip line. Board. Wherein the apex of the inclined portion of the reference ground conductor of a microstrip line, said first printed wiring board according to claim 1, further comprising a cutout portion along the circumference of the ground through-hole.   2. The printed wiring board according to claim 1, wherein lands for mounting electronic components are formed within the conductor width of the signal conductor of the coplanar line.   The printed wiring board according to claim 1, wherein a ground conductor is formed on the same surface layer as the signal conductor of the microstrip line.

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