JP5943486B2 - Semiconductor sealing resin composition and semiconductor device provided with cured product thereof - Google Patents

Description

  The present invention relates to a semiconductor sealing resin composition. Specifically, it is a composition having excellent adhesion with a Cu lead frame (LF) and Ag plating, excellent thermal stability for a long time at high temperature, and adhesion to a metal substrate at high temperature and high humidity. The present invention relates to a resin composition that can be maintained and provides a cured product with excellent reliability, and a semiconductor device including the cured product of the composition.

  In recent years, semiconductor devices have undergone remarkable technological innovation. TSV (through silicon via) technology is used so that portable information such as smartphones and tablets and communication terminals can process large volumes of information at high speed. In this technique, first, semiconductor elements are connected in multiple layers and flip-chip connected to an 8 inch to 12 inch silicon interposer. Thereafter, the interposer on which a plurality of semiconductor elements connected in multiple layers are mounted is sealed with a thermosetting resin. After polishing unnecessary cured resin on the semiconductor element, it is separated into individual pieces, and a thin, small, multifunctional, and high-speed semiconductor device can be obtained. However, when a thermosetting resin is applied to the entire surface of a thin silicon interposer of 8 inches to 12 inches and sealed, a large warp occurs due to the difference in thermal expansion coefficient between silicon and the thermosetting resin. If the warpage is large, it cannot be applied to the subsequent polishing process or singulation process, which is a major technical problem.

  In recent years, as a measure against global warming, environmental measures on a global level such as energy conversion from fossil fuels have been promoted. Therefore, the number of hybrid cars and electric cars produced is increasing. In addition, household electrical appliances in emerging countries such as China and India are also increasingly equipped with inverter motors as energy saving measures.

  For hybrid vehicles, electric vehicles, and inverter motors, power semiconductors that play a role of converting AC to DC, converting DC to AC, and transforming voltage are important. However, silicon (Si), which has been used as a semiconductor for many years, is approaching its performance limit, and it has become difficult to expect dramatic performance improvements. Accordingly, attention has been focused on next-generation power semiconductors using materials such as silicon carbide (SiC), gallium nitride (GaN), and diamond. For example, a reduction in resistance of a power MOSFET is required to reduce loss during power conversion. However, it is difficult to significantly reduce the resistance in the current mainstream Si-MOSFET. Therefore, development of a low-loss power MOSFET using SiC, which is a semiconductor with a wide band gap (wide gap), is in progress.

  SiC and GaN have excellent characteristics that the band gap is about 3 times that of Si and the breakdown electric field strength is 10 times or more. In addition, there are also features such as high-temperature operation (SiC reports 650 ° C operation), high thermal conductivity (SiC is equivalent to Cu), and large saturated electron drift velocity. As a result, if SiC or GaN is used, the on-resistance of the power semiconductor can be lowered and the power loss of the power conversion circuit can be greatly reduced.

  The power semiconductor is generally protected by transfer molding using an epoxy resin and potting sealing using a silicone gel. Recently, transfer molding using an epoxy resin is becoming mainstream from the viewpoint of miniaturization and weight reduction (particularly for automobiles). However, epoxy resin is a well-balanced thermosetting resin with excellent moldability, adhesion to the substrate, and mechanical strength, but at temperatures exceeding 200 ° C, the thermal decomposition of the cross-linking point proceeds, and SiC and GaN are transformed. There is anxiety that it may not serve as a sealing material in the expected high-temperature operating environment (Non-Patent Document 1).

  Therefore, a thermosetting resin composition containing a cyanate resin has been studied as a material having excellent heat resistance. For example, Patent Document 1 describes that an epoxy resin is formed in a cured product of a phenol novolak resin to form an oxazole ring by a reaction between a polyvalent cyanate ester and an epoxy resin, thereby obtaining stable heat resistance. In Patent Document 1, the epoxy equivalent of the epoxy resin is 1 and the hydroxyl equivalent of the phenol novolac resin is 0.4 to 1.0, and the cyanate equivalent of the polyvalent cyanate ester is 0.1 to 0.6. Describes that a cured product having excellent heat resistance and water resistance can be provided. Patent Document 2 describes a thermosetting resin composition containing a cyanate ester compound having a specific structure, a phenol compound, and an inorganic filler, and the resin composition has excellent heat resistance and high mechanical properties. It is described as having strength.

Japanese Patent Publication No. 6-15603 JP2013-53218A

Industrial Materials November 2011 Issue (vol59 No.11)

  However, the composition described in Patent Document 1 has a problem that it is inferior in mass productivity because it requires high-temperature and long-time thermosetting to form an oxazole ring by the reaction of an epoxy and a cyanato group. Moreover, since the composition described in Patent Document 2 has insufficient moisture resistance, when it is placed under a high temperature and high humidity for a long period of time, the adhesion between the CuLF or Ag plating and the cured product is reduced, and peeling or cracking occurs. Have a problem. Therefore, in view of the above circumstances, the present invention has less thermal decomposition (weight reduction) even when placed at a high temperature of 200 ° C. or higher, for example, 200 ° C. to 250 ° C. for a long period of time. It aims at providing the resin composition excellent in the reliability which provides the hardened | cured material which is excellent in adhesiveness.

  As a result of intensive studies to solve the above problems, the inventors of the present invention blended a phenol compound having a specific structure and an epoxy resin in a composition containing a cyanate ester compound and an inorganic filler, and the cyanate ester compound. By setting the blending amount of the phenol compound and the blending amount of the epoxy resin with respect to the cyanate ester compound within a specific range, a cured product having excellent thermal stability can be obtained, and the cured product operates at high temperature and high humidity. It has been found that even when exposed to the environment for a long period of time, thermal decomposition (weight reduction) is small, and excellent adhesion to CuLF and Ag plating can be maintained, and the present invention has been achieved.

（式中、Ｒ^５及びＲ^６は、互いに独立に、水素原子または炭素数１〜４のアルキル基であり、Ｒ^７は、互いに独立に、下記のいずれかである。

Ｒ^４は、互いに独立に、水素原子またはメチル基であり、ｍは０〜１０の整数である）
（Ｃ）無機充填剤（ただし、不定形の無機充填剤、並びに、窒化ホウ素、及びジルコニウム粒子を除く）、及び
（Ｄ）下記一般式（３）または（４）で表されるエポキシ樹脂

（上記式（３）及び（４）中、ｋ及びｐは、互いに独立に、０以上１０以下の整数であり、ｊは１〜６の整数であり、Ｒ^５は互いに独立に、水素原子又は炭素数１〜４のアルキル基であり、Ｒ^６及びＲ^７は互いに独立に、下記のいずれかである）

を含み、（Ａ）シアネートエステル化合物中のシアナト基に対する（Ｂ）フェノール化合物中のフェノール性水酸基のモル比が０．２〜０．４であり、かつ（Ａ）シアネートエステル化合物中のシアナト基に対する（Ｄ）エポキシ樹脂中のエポキシ基のモル比が０．０４〜０．２５であることを特徴とする組成物である。 That is, the present invention
(A) Cyanate ester compound having two or more cyanato groups in one molecule (B) Phenol compound represented by the following general formula (2)

(In the formula, R ⁵ and R ⁶ are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R ⁷ is each independently one of the following:

R ⁴ is independently a hydrogen atom or a methyl group, and m is an integer of 0 to 10.
(C) Inorganic filler (excluding amorphous inorganic filler and boron nitride and zirconium particles) and (D) Epoxy resin represented by the following general formula (3) or (4)

(In the above formulas (3) and (4), k and p are each independently an integer of 0 or more and 10 or less, j is an integer of 1 to 6, and R ⁵ is independently of each other a hydrogen atom or A C 1-4 alkyl group, and R ⁶ and R ⁷ are each independently one of the following)

(A) the molar ratio of the phenolic hydroxyl group in the phenolic compound to the (B) phenolic compound in the cyanate ester compound is 0.2 to 0.4, and (A) the cyanate group in the cyanate ester compound (D) The composition is characterized in that the molar ratio of epoxy groups in the epoxy resin is 0.04 to 0.25.

  The composition of the present invention has little thermal decomposition (weight reduction) even when placed at a high temperature of 200 ° C. or higher, particularly 200 ° C. to 250 ° C. for a long period of time, and adhesion to CuLF or Ag plating even in a high temperature and high humidity environment. And a cured product having excellent insulating properties. Therefore, a semiconductor device sealed with a cured product of the composition of the present invention has long-term reliability under high temperature and high humidity.

  The present invention will be described in more detail below.

（式中、Ｒ^１及びＲ^２は、互いに独立に、水素原子または炭素数１〜４のアルキル基であり、Ｒ^３は、互いに独立に、下記のいずれかである。

Ｒ^４は水素原子またはメチル基であり、ｎは０〜１０の整数である） (A) Cyanate ester compound The component (A) is a cyanate ester compound having two or more cyanato groups in one molecule. The cyanate ester compound in the present invention may be one having two or more cyanato groups in one molecule, and generally known ones can be used. The cyanate ester compound can be represented, for example, by the following general formula (1).

(In the formula, R ¹ and R ² are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R ³ is each independently one of the following:

R ⁴ is a hydrogen atom or a methyl group, and n is an integer of 0 to 10)

  Examples of the cyanate ester compound of the present invention include bis (4-cyanatophenyl) methane, bis (3-methyl-4-cyanatophenyl) methane, bis (3-ethyl-4-cyanatophenyl) methane, and bis. (3,5-dimethyl-4-cyanatophenyl) methane, 1,1-bis (4-cyanatophenyl) ethane, 2,2-bis (4-cyanatophenyl) propane, 2,2-bis (4 -Cyanatophenyl) -1,1,1,3,3,3-hexafluoropropane, di (4-cyanatophenyl) thioether, 1,3- and 1,4-dicyanatobenzene, 2-tert-zotyl -1,4-dicyanatobenzene, 2,4-dimethyl-1,3-dicyanatobenzene, 2,5-di-tert-butyl-1,4-dicyanatobenzene, tetramethyl-1, -Dicyanatobenzene, 1,3,5-tricyanatobenzene, 2,2'- or 4,4'-dicyanatobiphenyl, 3,3 ', 5,5'-tetramethyl-4,4'-dicyanato Biphenyl, 1,3-, 1,4-, 1,5-, 1,6-, 1,8-, 2,6-, or 2,7-dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene Bis (4-cyanatophenyl) methane; 2,2-bis (4-cyanatophenyl) propane, 1,1,1-1 tris (4-cyanatophenyl) ethane, bis (4-cyanatophenyl) Ether; 4,4 ′-(1,3-phenylenediisopropylpyridene) diphenyl cyanate, bis (4-cyanatophenyl) thioether, bis (4-cyanatophenyl) sulfone, tris (4-cyanato-phenyl) phosphine , Tris (4-cyanatophenyl) phosphate, phenol novolac cyanate, cresol novolac cyanate, dicyclopentadiene novolac cyanate, phenylaralkyl cyanate ester, biphenylaralkyl cyanate ester, naphthalene aralkyl cyanate ester, etc. . These cyanate ester compounds can be used alone or in combination.

  The cyanate ester compound can be obtained by reacting phenols and cyanogen chloride under basic conditions. The cyanate ester compound can be appropriately selected from those having a wide range of properties from a solid having a softening point of 106 ° C. to a liquid at room temperature, depending on the application. For example, when a liquid epoxy resin composition is produced, a liquid compound is used at room temperature, and when it is dissolved in a solvent to form a varnish, it is preferably selected according to solubility and solution viscosity. Moreover, when using it by transfer molding for power semiconductor sealing, it is preferable to select a solid compound at room temperature.

  Moreover, the thing with small equivalent of a cyanate group, ie, the thing with a small molecular weight between functional groups, has a small cure shrinkage, and can obtain the hardened | cured material of low thermal expansion and high Tg. Those having a large cyanate group equivalent have a slight decrease in Tg, but the triazine cross-linking interval becomes flexible, and low elasticity, high toughness, and low water absorption can be expected. The chlorine bonded or remaining in the cyanate ester compound is preferably 50 ppm or less, more preferably 20 ppm or less. If the amount of chlorine exceeds 50 ppm, chlorine or chlorine ions liberated by thermal decomposition when placed at high temperatures for a long period of time corrode the oxidized Cu frame, Cu wire, and Ag plating, and peeling of the cured product or electrical It can cause defects. In addition, the insulating properties of the resin may be reduced.

上記式中、Ｒ^５及びＲ^６は、互いに独立に、水素原子または炭素数１〜４のアルキル基であり、ｍは０〜１０の整数である。
上記式中、Ｒ^７は、互いに独立に、下記のいずれかである。

（上記式中、Ｒ^４は、互いに独立に、水素原子またはメチル基である）
本発明の（Ｂ）成分は上記式（２）においてＲ^７がＣＨ_２であるもの（例えば、フェノールノボラック樹脂）を含まない。Ｒ^７がＣＨ_２であるフェノール化合物を含む組成物は、高温下に長期間置いたときに熱分解をおこしやすく、また銅リードフレームと硬化物の界面に剥離やクラックを生じるおそれがある。 (B) Phenol Compound The (B) phenol compound of the present invention is represented by the following general formula (2), and has two or more hydroxyl groups in one molecule.

In said formula, R < ⁵ > and R < ⁶ > are a hydrogen atom or a C1-C4 alkyl group mutually independently, and m is an integer of 0-10.
In the above formulae, R ⁷ is independently of each other below.

(In the above formula, R ^{4 s} independently of one another are a hydrogen atom or a methyl group)
The component (B) of the present invention does not include those in which R ⁷ is CH ₂ in the above formula (2) (for example, phenol novolac resin). A composition containing a phenol compound in which R ⁷ is CH ₂ tends to undergo thermal decomposition when placed at a high temperature for a long period of time, and may cause peeling or cracking at the interface between the copper lead frame and the cured product.

  Conventionally, metal salts, metal complexes, and the like have been used as curing catalysts for cyanate ester compounds (Japanese Patent Laid-Open Nos. 64-43527, 11-106480, and 2005-506422). However, transition metals are used as metal salts and metal complexes, and transition metals are likely to promote oxidative degradation of organic resins at high temperatures. In the composition of the present invention, the phenol compound functions as a catalyst for the cyclization reaction of the cyanate ester compound. Therefore, it is not necessary to use metal salts and metal complexes. Thereby, long-term storage stability under high temperature can be further improved.

  In addition, a phenol compound having at least two hydroxyl groups in one molecule can be expected as a crosslinking agent that connects triazine rings. Unlike an epoxy resin or an amine compound, a phenol compound can form a structure represented by —C—O—Ar— by bonding with a cyanate ester compound. Since this structure is similar to the triazine ring structure formed when the cyanate ester compound is cured alone, it can be expected to further improve the heat resistance of the resulting cured product.

  A phenol compound having a small hydroxyl equivalent, for example, a phenol compound having a hydroxyl equivalent of 110 or less has high reactivity with a cyanate group. Therefore, the curing reaction proceeds when the composition is melt-kneaded at 120 ° C. or lower, and the fluidity may be significantly impaired, which is not preferable for transfer molding. Therefore, it is particularly preferable that the phenol compound has a hydroxyl equivalent of 111 or more.

  In this invention, the compounding quantity of a phenol compound is an quantity from which a hydroxyl group will be 0.2-0.4 mol with respect to 1 mol of cyanate groups of a cyanate ester compound. When the amount of the phenol compound is less than the above lower limit, the reaction of the cyanate group becomes insufficient, and an unreacted cyanato group remains. The remaining cyanato group undergoes hydrolysis in a high humidity atmosphere. For this reason, when placed under high temperature and high humidity, it causes a decrease in mechanical strength and a decrease in adhesion to the substrate. Moreover, when there is more quantity of a phenol compound than the said upper limit, hardening reaction will advance from low temperature. Therefore, the fluidity of the composition is impaired, and the moldability is deteriorated. Further, the halogen element and alkali metal in the phenol compound are preferably 10 ppm, particularly 5 ppm or less when extracted at 120 ° C. under 2 atm.

(C) Inorganic filler In this invention, the kind in particular of an inorganic filler is not restrict | limited, A well-known thing can be used as an inorganic filler of the resin composition for semiconductor sealing. Examples thereof include silicas such as fused silica, crystalline silica, cristobalite, alumina, silicon nitride, aluminum nitride, boron nitride, titanium oxide, glass fiber, magnesium oxide, and zinc oxide. The average particle size and shape of these inorganic fillers may be selected according to the application. Among them, in order to obtain a thermal expansion coefficient close to that of silicon, fused silica is preferable, and a spherical shape is preferable. The average particle size of the inorganic filler is preferably 0.1 to 40 μm, more preferably 0.5 to 15 μm. The average particle diameter can be obtained, for example, as a weight average value (or median diameter) by a laser light diffraction method or the like.

  The inorganic filler is preferably 10 ppm or less of chlorine ions and 10 ppm or less of sodium ions as impurities extracted under the extraction conditions of 5 g of sample and 50 g of water at 120 ° C. and 2.1 atm. If it exceeds 10 ppm, the moisture resistance of the semiconductor device encapsulated with the composition may deteriorate.

  In the present invention, the blending amount of the inorganic filler can be 60 to 94% by weight, preferably 70 to 92% by weight, more preferably 75 to 90% by weight of the entire composition.

  In order to increase the bond strength between the resin and the inorganic filler, the inorganic filler is preferably blended in advance with a surface treatment with a coupling agent such as a silane coupling agent or a titanate coupling agent. As such a coupling agent, epoxy silane such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N -Β (aminoethyl) -γ-aminopropyltrimethoxysilane, reaction product of imidazole and γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, etc. It is preferable to use a silane coupling agent such as mercaptosilane such as aminosilane, γ-mercaptosilane, and γ-episulfideoxypropyltrimethoxysilane. Here, the blending amount of the coupling agent used for the surface treatment and the surface treatment method are not particularly limited.

上記式（３）及び（４）中、ｋ及びｐは、互いに独立に、０以上１０以下の整数であり、ｊは１〜６の整数であり、Ｒ^５は互いに独立に、水素原子又は炭素数１〜４のアルキル基であり、Ｒ^６及びＲ^７は互いに独立に、下記のいずれかである。

(D) The epoxy resin (D) component is an epoxy resin represented by the following formula (3) or (4).

In the above formulas (3) and (4), k and p are each independently an integer of 0 or more and 10 or less, j is an integer of 1 to 6, and R ⁵ is independently of each other a hydrogen atom or carbon. number from 1 to 4 alkyl groups, ^{R 6} and ^{R 7} independently of one another, is any of the following.

  Examples of the epoxy resin include a phenol aralkyl type epoxy resin, a biphenyl aralkyl type epoxy resin, and a naphthalene type aralkyl epoxy resin. Epoxy resins form oxazole rings with cyanate resins, but are less reactive than triazine ring formation of cyanate groups. In addition, when there are many ratios of an epoxy group, hardening time becomes long and is disadvantageous for transfer molding. Although there is an example using a tertiary amine such as triethylamine, there is a possibility that the storage stability is deteriorated.

  The epoxy resin reacts with a cyanate ester compound to form an oxazole ring. In the present invention, the addition amount of the epoxy resin compound is such that the epoxy group equivalent is 0.04 to 0.25 mol per 1 mol of cyanate group of the cyanate ester compound. When the amount of the epoxy resin is less than the lower limit, the moisture absorption amount of the cured product increases, and peeling occurs between the lead frame and the cured product under high temperature and high humidity. Moreover, when there are more amounts of an epoxy resin than the said upper limit, hardening will become inadequate and will cause the fall of the glass transition temperature of hardened | cured material, and the fall of a high temperature, high humidity storage characteristic.

  In the composition of the present invention, in addition to triazine ring formation by cyclization reaction of cyanate ester compound, reaction of epoxy compound and cyanate ester compound (formation of oxazole ring), reaction of phenol compound and cyanate ester compound, and epoxy A reaction between the compound and the phenol compound occurs. The composition of this invention can provide the hardened | cured material which was extremely excellent in high temperature high-humidity tolerance by raise | generating these reactions on the basis of the specific compounding ratio mentioned above.

  The sealing resin composition of the present invention may further contain various additives such as a release agent, a flame retardant, an ion trap agent, an antioxidant, an adhesion-imparting agent, and a low stress agent as necessary. Moreover, the coupling agent mentioned above can be used as an adhesiveness imparting agent. In order to improve the adhesion to the metal frame, a mercapto silane coupling agent is particularly suitable.

  The release agent is not particularly limited, and a known release agent can be used. For example, carnauba wax, rice wax, candelilla wax, polyethylene, polyethylene oxide, polypropylene, montanic acid, montanic acid and ester compounds of saturated alcohol, 2- (2-hydroxyethylamino) -ethanol, ethylene glycol, glycerin, etc. And montanic acid wax, stearic acid, stearic acid ester, stearic acid amide, ethylenebisstearic acid amide, and a copolymer of ethylene and vinyl acetate. These can be used individually by 1 type or in combination of 2 or more types.

  The flame retardant is not particularly limited, and any known flame retardant can be used. Examples include phosphazene compounds, silicone compounds, zinc molybdate-supported talc, zinc molybdate-supported zinc oxide, aluminum hydroxide, magnesium hydroxide, molybdenum oxide, and antimony trioxide.

  The ion trapping agent is not particularly limited, and known ones can be used. Examples thereof include hydrotalcites, bismuth hydroxide compounds, rare earth oxides, and the like.

  The method for producing the composition of the present invention is not particularly limited. For example, the above components (A) to (D) may be stirred or dissolved, mixed or dispersed simultaneously or separately, if necessary with heat treatment, and optionally mixed with other additives. It can be obtained by stirring and dispersing. Although the apparatus used for mixing etc. is not specifically limited, A raikai machine provided with stirring and a heating apparatus, 2 rolls, 3 rolls, a ball mill, a continuous extruder, a planetary mixer, a mass collider, etc. can be used. You may use combining these apparatuses suitably.

  The composition of the present invention is useful for semiconductor packages such as transistor type, module type, DIP type, SO type, flat pack type, and ball grid array type. Molding of the composition of the present invention may be performed in accordance with a molding method conventionally employed. For example, transfer molding, compression molding, injection molding, casting method and the like can be used. Particularly preferred is transfer molding. The molding temperature of the composition of the present invention is preferably 160 to 190 ° C. for 45 to 180 seconds, and the post cure is 170 to 250 ° C. for 2 to 16 hours.

  The composition of the present invention has little thermal decomposition (weight reduction) when placed at a high temperature of 200 ° C. or higher, particularly 200 ° C. to 250 ° C. for a long time, has excellent adhesion to CuLF and Ag plating, and has high insulation. A cured product having properties can be provided. Therefore, a semiconductor device sealed with a cured product of the composition of the present invention can have high temperature and long-term reliability. Further, since the composition of the present invention has good continuous moldability, it can be used in the same apparatus as the epoxy resin composition generally used as a transfer molding material in the past, and the same molding conditions should be used. Can do. Furthermore, it is excellent in productivity.

  EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated in detail, this invention is not restrict | limited to the following Example. In addition, all the parts in each example are parts by weight.

[Examples 1-6, Comparative Examples 1-5]
Each component shown below was blended with the composition shown in Table 1, mixed uniformly with a high-speed mixer, then uniformly kneaded with two heated rolls, cooled and pulverized to obtain a resin composition.

（ｎ＝０〜１０の混合物）
(A) Cyanate ester compound (I) Cyanate ester compound represented by the following formula (5) (Primaset PT-60, Lonza Japan Co., Ltd., cyanate group equivalent 119)

(Mixture of n = 0 to 10)

（ｎ＝０〜１０の混合物）
(B) Cyanate ester compound obtained in Synthesis Example 1 below
[Synthesis Example 1]
100 g of the phenol compound MEH-7785SS (manufactured by Meiwa Kasei) was dissolved in 600 g of butyl acetate. The solution was cooled to about −15 ° C. and 32 g of gaseous cyanogen chloride was introduced. Then, over a period of about 30 minutes, 50 g of triethylamine was added dropwise with stirring while maintaining the temperature below -10 ° C. After maintaining this temperature for an additional 30 minutes, cooling was stopped and the reaction mixture was filtered. The filtrate was continuously passed through an ion exchanger packed column. Subsequently, the solvent is removed under reduced pressure at a bath temperature of 70 ° C., after which volatile impurities (including solvent residues, free triethylamine, diethyl cyanamide) are removed using a falling film evaporator at 1 mbar, 130 ° C. Removed. The obtained product was a cyanate ester compound (cyanate group equivalent 208) represented by the following formula (6).

(Mixture of n = 0 to 10)

（ｎ＝０〜１０の混合物）

（ニ）下記式（８）で示すフェノール化合物（ＭＥＨ−７８５１ＳＳ、明和化成製、フェノール性水酸基当量２０３）

（ｎ＝０〜１０の混合物）
(B) Phenol compound (C) Phenol compound represented by the following formula (7) (MEH-7800SS, manufactured by Meiwa Kasei Co., Ltd., phenolic hydroxyl group equivalent 175)

(Mixture of n = 0 to 10)

(D) Phenol compound represented by the following formula (8) (MEH-7851SS, manufactured by Meiwa Kasei, phenolic hydroxyl group equivalent 203)

(Mixture of n = 0 to 10)

（ｎ＝０〜１０の混合物）
(E) Phenol compound for comparative example-Phenol compound represented by the following formula (9) (TD-2131, manufactured by DIC, phenolic hydroxyl group equivalent 110)

(Mixture of n = 0 to 10)

(C) Inorganic filler (F) Fused spherical silica with an average particle size of 15 μm (manufactured by Tatsumori)

（ｎ＝０〜１０の混合物）

（チ）下記式（１１）で示すエポキシ樹脂化合物（ＨＰ−４７７０、日本化薬製、エポキシ当量２０４）

（ｎ及びｍは０または１） (D) Epoxy resin (g) Epoxy resin compound represented by the following formula (10) (NC-3000, manufactured by Nippon Kayaku, epoxy equivalent 272)

(Mixture of n = 0 to 10)

(H) Epoxy resin compound represented by the following formula (11) (HP-4770, manufactured by Nippon Kayaku, epoxy equivalent 204)

(N and m are 0 or 1)

(E) Other ingredients Carnauba wax (TOWAX-131, manufactured by Toa Kasei)
Silane coupling agent: 3-mercaptopropyltrimethoxysilane (KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd.)
・ Imidazole (manufactured by Shikoku Chemicals)

The following evaluation tests were performed for each composition. The results are shown in Table 1.
[Spiral flow]
Using a mold conforming to the EMMI standard, measurement was performed under the conditions of 175 ° C., 6.9 N / mm ² , and a molding time of 180 seconds.

[Change in weight during storage at high temperatures]
Transfer molding was performed at 175 ° C. for 120 seconds under a molding pressure of 6.9 MPa, and then post-curing was performed at 180 ° C. for 4 hours to obtain a 10 × 100 × 4 mm test piece. The test piece was stored in an oven at 250 ° C. for 500 hours, and the weight loss rate was measured.

[Adhesion confirmation with Ag-plated CuLF-1]
Using a 100-pin QFP lead frame made of Cu alloy (Olin C7025) in which the die pad portion (8 mm × 8 mm) and the wire bonding portion were Ag-plated, transfer molding was performed at 175 ° C. for 120 seconds under a molding pressure of 6.9 MPa. Subsequently, it was post-cured at 180 ° C. for 4 hours. The tie bar was cut with a lead frame cutter to obtain a QFP package of 20 mm × 14 mm × 2.7 mm.
Twelve of these packages were stored in an oven at 250 ° C. for 500 hours, and the presence or absence of cracks in the package was visually confirmed after storage. Moreover, the presence or absence of peeling from the internal crack and the lead frame was observed using an ultrasonic flaw detector. Table 1 shows the number of packages in which cracks or peeling occurred.

[Adhesion confirmation with Ag-plated CuLF-2]
Using a 100-pin QFP lead frame made of Cu alloy (Olin C7025) in which the die pad portion (8 mm × 8 mm) and the wire bonding portion were Ag-plated, transfer molding was performed at 175 ° C. for 120 seconds under a molding pressure of 6.9 MPa. Subsequently, it was post-cured at 180 ° C. for 4 hours. The tie bar was cut with a lead frame cutter to obtain a QFP package of 20 mm × 14 mm × 2.7 mm.
Twelve of these packages were stored in PCT (121 ° C. × 100% RH 2.1 atm) for 96 hours, and after storage, the presence or absence of internal cracks and peeling from the lead frame were observed using an ultrasonic flaw detector. Table 1 shows the number of packages in which cracks or peeling occurred.

[Formability]
80-pin QFP (14 × 20 × 2.7 mm) was molded into 20 shots at 175 ° C. × 120 seconds and 6.9 MPa, and the number of shots until die sticking, cull, and runner breakage were observed.

  The cured product obtained from the compositions of Comparative Examples 3 to 5 in which at least one of the molar ratio of the phenolic hydroxyl group to the cyanate group or the molar ratio of the epoxy group to the cyanate group does not satisfy the scope of the present invention is 500 ° C. at 250 ° C. The rate of weight loss over time is large. Further, when the cured product was stored at a high temperature for a long time or placed in a high temperature and high humidity environment, peeling and cracking occurred at the interface with the Ag-plated Cu lead frame. Furthermore, the compositions of Comparative Examples 3 and 4 in which one of the molar ratios exceeded the upper limit of the range of the present invention were inferior in continuous moldability. On the other hand, the cured product obtained from the composition of the present invention had a small weight loss rate when kept at 250 ° C. for 500 hours, and did not cause peeling or cracking even when placed under high temperature and high humidity for a long time. The composition of the present invention was also excellent in continuous moldability.

  The resin composition of the present invention has good moldability, and the cured product has little thermal decomposition (weight reduction) even when placed at a high temperature of 200 ° C. or higher, for example, 200 ° C. to 250 ° C. for a long period of time. However, it has excellent adhesion to CuLF and Ag plating. Therefore, a semiconductor device having excellent long-term reliability under high temperature and high humidity conditions can be provided.

Claims (6)

(A) Cyanate ester compound having two or more cyanato groups in one molecule (B) Phenol compound represented by the following general formula (2)

(In the formula, R ⁵ and R ⁶ are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R ⁷ is each independently one of the following:

R ⁴ is independently a hydrogen atom or a methyl group, and m is an integer of 0 to 10.
(C) Inorganic filler (excluding amorphous inorganic filler and boron nitride and zirconium particles) and (D) Epoxy resin represented by the following general formula (3) or (4)

(In the above formulas (3) and (4), k and p are each independently an integer of 0 or more and 10 or less, j is an integer of 1 to 6, and R ⁵ is independently of each other a hydrogen atom or A C 1-4 alkyl group, and R ⁶ and R ⁷ are each independently one of the following)

(A) the molar ratio of the phenolic hydroxyl group in the phenolic compound to the (B) phenolic compound in the cyanate ester compound is 0.2 to 0.4, and (A) the cyanate group in the cyanate ester compound (D) The composition characterized by the molar ratio of the epoxy group in an epoxy resin being 0.04-0.25. (A) The composition of Claim 1 whose component is a compound represented by following General formula (1).

(In the formula, R ¹ and R ² are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R ³ is each independently one of the following:

R ⁴ are each independently a hydrogen atom or a methyl radical, n is an integer of 0). The composition according to claim 1 or 2, wherein (C) the inorganic filler is selected from fused silica, alumina, cristobalite, and silicon nitride . (C) The composition of Claim 3 whose inorganic filler is spherical fused silica. The semiconductor device provided with the hardened | cured material of the composition of any one of Claims 1-4 . 6. The semiconductor device according to claim 5 , wherein a semiconductor element made of SiC or GaN is mounted.