JP5836626B2 - Thin display device - Google Patents

Description

  The present invention relates to a thin display device, and more particularly to a thin display device having a heat shielding structure.

  In recent years, thin display devices such as liquid crystal televisions and PDP (Plasma Display Panel) televisions have been increasing in size. When the display device becomes larger (the inch size of the screen becomes larger), the power consumption increases and the heat generation amount inside the device increases, so that the temperature inside the device rises. When the temperature inside the device rises, it causes a reduction in the reliability or failure of the internal electronic components of the driving electronic circuit board and power supply circuit board arranged on the back of the display panel, and the cause is the heat generation of the electronic components. There was a problem that led to damage.

  As a countermeasure for the above problem, generally, a heat radiation hole (opening) for cooling the temperature inside the device is provided on the top surface (upper surface) of the casing of the thin display device. Also, in the unlikely event that heat damage is caused to an electronic component, the top side of the housing, the driving electronic circuit board, and the power circuit board must be Provide sufficient space so that the heat generated during heat damage is more than the direct range, so that the heat does not directly reach the outside of the heat dissipation hole provided on the top side of the housing. It was a simple structure.

  However, in recent thin display devices, as the size increases, the depth direction of the device is preferred to be thinner than before, and other than the driving electronic circuit board and power circuit board disposed on the back of the display panel. The portion (that is, the portion where only the display panel is arranged in the depth direction of the device) needs to have a structure in which the depth direction of the device is as thin as possible. However, in such a structure, there is a tendency that a sufficient space cannot be secured around the electronic circuit board and the power circuit board, the space inside the device becomes small (narrow), the internal temperature rises, There was a problem that it caused heat damage of electronic parts.

  As the above improvement measures, conventionally, in order to thermally shield electronic components provided in the apparatus, there is one configured to shield heat by covering a cable or the like so as to wrap a sheet-like fireproof material. Yes (for example, see Patent Document 1).

  In addition, a separate part for heat shielding is not required, and a part of the heat radiating plate parts arranged on the electronic circuit board and the power circuit board are formed so as to cover the electronic parts that are the cause of ignition so as to be heat shielded. There exists what was comprised (for example, refer patent document 2).

JP 62-264506 A (FIG. 1) JP-A-8-27862 (pages 2 and 3, FIG. 1)

  In patent document 1, since another component used as a sheet-like heat shielding material is needed, there existed a problem that the said component cost increased, the number of processes in an assembly process increased, and complicated.

  Further, in Patent Document 2, since it is necessary to form the heat radiating plate disposed in the substrate so as to cover the electronic components that may be ignited disposed on the electronic circuit board and the power circuit board, If an electronic component that requires heat and an electronic component that may ignite are not close to each other, the heat sink component itself may be larger than the area required for heat dissipation or an electronic component that may ignite. Since the shape becomes complicated to cover, the problem is that the mold structure required for manufacturing the heat sink parts is complicated, the mold construction period is prolonged, and the mold costs are expensive, and the unit price of the heat sink parts increases. was there.

  In addition, in Patent Document 2, since the electronic component is covered with the heat sink component, the temperature around the electronic component is increased by heat dissipation from the heat sink component, and the reliability of the electronic component that may catch fire is reduced. There was a problem of inducing a fire caused by a failure. In addition, there is a problem that the electronic components arranged around the heat sink components also require a sufficient electrical insulation distance from the heat sink components, so that there are restrictions on the board arrangement and the board size cannot be reduced. . In addition, when replacing an electronic component in the event of a malfunction (failure), it may be necessary to remove heat sink components that do not need to be removed. It was a factor to worsen. Further, it cannot be applied to an electronic circuit board and a power supply circuit board that do not require the arrangement of heat sink components in the board.

  The present invention has been made in order to solve these problems, and does not require a separate part, and can be easily prevented from heat damage without depending on the arrangement configuration of electronic parts in the substrate. An object is to provide an apparatus.

In order to solve the above-described problems, a thin display device according to the present invention has a front opening, a housing that encloses the display panel with the display surface of the display panel facing the front opening, And an electronic component provided on the back side of the display panel, and a shielding wall-shaped portion that is disposed above the electronic component and covers the electronic component in a bowl shape, and the housing is thereafter The surface is provided with heat radiation holes, and the shielding wall shape part is provided to project from the rear surface of the housing to the front side between all of the heat radiation holes and the electronic components. It is characterized by not reaching.

According to the present invention, a housing having a front opening and containing the display panel in a state where the display surface of the display panel faces the front opening, and the housing is provided on the back side of the display panel. An electronic component and a shielding wall shape portion that is disposed above the electronic component and covers the electronic component in a bowl shape, the housing includes a heat dissipation hole on the rear surface, and the shielding wall shape portion is In order to prevent the heat generation of the electronic component from reaching the outside of the housing, it is provided to project from the rear surface of the housing to the front surface side between all of the heat radiation holes and the electronic component , Heat generation damage can be easily prevented without requiring separate parts and without depending on the arrangement configuration of the electronic parts in the substrate.

1 is a partial longitudinal sectional view of a thin display device according to an embodiment of the present invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a partial longitudinal sectional view of a thin display device according to an embodiment of the present invention. In the present embodiment, a liquid crystal display device is assumed as a thin display device, and will be described below as a liquid crystal device.

  As shown in FIG. 1, the housing of the liquid crystal display device includes a front housing 4 (front surface of the housing) and a rear housing 5 (rear surface of the housing), and a liquid crystal display unit 2 for image display. A liquid crystal display panel 1 (display panel) having a front panel 4 and a rear panel 5 is fixed. That is, the housing has an opening (front opening) in the front housing 4 and encloses the liquid crystal display panel 1 with the display surface of the liquid crystal display unit 2 of the liquid crystal display panel 1 facing the opening. .

  In addition, on the back side of the liquid crystal display panel 1 in the housing, a circuit board 8 (power supply circuit board for driving the liquid crystal display device and an electronic circuit board) and an electronic component 9 that may cause heat damage are disposed on the electronic component 9. Is disposed on the mounting member 15 so as to be positioned upward. The attachment member 15 is attached to the rear case 5, and a cover 6 that forms a part of the rear case 5 is arranged so as to cover the circuit board 8 and the electronic component 9 arranged on the attachment member 15.

  Further, a shielding wall shape portion 14 that covers the electronic component 9 in a bowl shape is disposed above the electronic component 9. That is, the shielding wall-shaped portion 14 is provided so as to protrude from the rear housing 5 (the cover 6 in FIG. 1) to the front side in a bowl shape.

  Further, the rear housing 5 has a heat radiating hole 7, and the portion of the rear housing 5 provided with the heat radiating hole 7 is more than the other portion from the upper end of the rear housing 5 to just above the shielding wall shape portion 14. Is also formed close to the liquid crystal display panel 1.

  In FIG. 1, depth 3 indicates the depth of the liquid crystal display panel 1. Depth 11 indicates the depth of the liquid crystal display device at a location where only the liquid crystal display panel 1 is disposed, and depth 12 indicates the depth of the liquid crystal display device at a location where the circuit board 8 is disposed. In addition, said depth has shown the width | variety (length or dimension) of the paper surface left-right direction in FIG.

  Further, in FIG. 1, a heat generation range 10 indicates a range in which heat generation directly occurs when the electronic component 9 is damaged by heat generation. Further, the height 13 indicates the length from the position where the electronic component 9 is disposed to the portion where the heat radiating hole 7 of the rear housing 5 located immediately above the electronic component 9 is provided.

  From the above, in the thin display device according to the present embodiment, even if the electronic component 9 is damaged due to heat generation, the heat generation is shielded by the shielding wall shape portion 14, and the heat generation directly reaches the outside from the heat radiation hole 7 of the rear housing 5. There is nothing. In addition, since the shielding wall shape portion 14 is provided, the height 13 can be made lower than the heat generation range 10 (that is, the position of the rear housing 5 having the heat radiation holes 8 is on the electronic component 9 side). The range of the depth 11 of the display device can be further expanded. Further, in the rear housing 5, it is necessary to increase the thickness of all the rear housings 5 by increasing the thickness of only the shielding wall shape portion 14 that directly generates heat when the electronic component 9 is damaged by heat. However, since the thickness of the other rear housing 5 can be reduced, the amount of molding material used can be reduced.

  The present invention is also applicable to a housing structure for a thin display panel other than a liquid crystal display device.

  DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel, 2 Liquid crystal display part, 3 Depth, 4 Front housing | casing, 5 Rear housing | casing, 6 Cover, 7 Heat radiation hole, 8 Circuit board, 9 Electronic component, 10 Heating range, 11 Depth, 12 Depth, 13 High 14 Shield wall shape portion, 15 mounting member.

Claims (2)

A housing having a front opening and enclosing the display panel with the display surface of the display panel facing the front opening;
In the housing, electronic components provided on the back side of the display panel;
A shielding wall-shaped portion disposed in the casing and disposed above the electronic component and covering the electronic component in a bowl shape;
With
The housing is provided with a heat dissipation hole on the rear surface,
The shielding wall-shaped portion is provided so as to protrude from the rear surface of the housing to the front surface side between all of the heat dissipation holes and the electronic component, and heat generated by the electronic component reaches the outside of the housing. A thin display device, characterized in that it is not present.   The rear surface of the housing has a heat radiating hole, and the portion of the rear surface where the heat radiating hole is provided is closer to the display panel than the other portion from the upper end of the rear surface to directly above the shielding wall shape portion. The thin display device according to claim 1, wherein the thin display device is formed.

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