JP5829477B2 - Semiconductor device - Google Patents

Description

The present invention relates to a semiconductor device and a manufacturing method thereof.

Note that in this specification, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics, and an electro-optical device, a semiconductor circuit, an electronic device, and the like are all semiconductor devices.

A technique for forming a transistor using a semiconductor film formed over a substrate having an insulating surface has attracted attention. The transistor is widely applied to semiconductor devices such as an integrated circuit (IC) and an image display device (display device). A silicon-based semiconductor material is known as a semiconductor film applicable to a transistor, but in recent years, an oxide-based semiconductor material has attracted attention.

For example, a transistor using an amorphous oxide film containing indium, gallium, and zinc having an electron carrier concentration of less than 10 ¹⁸ / cm ³ as an active layer of the transistor is disclosed (see Patent Document 1).

A transistor using an oxide semiconductor film operates faster than a transistor using amorphous silicon and is easier to manufacture than a transistor using polycrystalline silicon, but its electric characteristics are likely to fluctuate and reliability is low. The problem is known. For example, after the bias-thermal stress test (BT test), the threshold voltage of the transistor fluctuates. Note that in this specification, the threshold voltage refers to a gate voltage necessary to turn on a transistor. The gate voltage is a gate potential difference when the source potential is set to a reference (0 V).

JP 2006-165528 A

A transistor including an oxide semiconductor film is turned off by depleting a channel region. Therefore, when the oxide semiconductor film is thick, the gate voltage applied to deplete the channel region increases.

Note that in the case where the transistor including an oxide semiconductor film is n-type, a larger negative gate voltage is applied as the oxide semiconductor film is thicker in order to deplete the channel region. That is, when the oxide semiconductor film is thick, the threshold voltage of the transistor becomes negative, and normally-on electrical characteristics are obtained.

As a countermeasure, it is effective to make the oxide semiconductor film thinner. However, when the entire oxide semiconductor film is thinned, not only a channel region that is required to be thin but also a source region and a drain region are thinned. Therefore, the resistance of the source region and the drain region is increased, and the on-state current of the transistor is reduced.

Therefore, an object is to provide a transistor including an oxide semiconductor film which has normally-off electrical characteristics and high on-state current.

Another object is to provide a semiconductor device that can operate at high speed using the transistor.

A semiconductor device according to one embodiment of the present invention includes a base insulating film, an oxide semiconductor film provided over the base insulating film, a gate insulating film provided over the oxide semiconductor film, and the gate insulating film A gate electrode provided so as to overlap with the oxide semiconductor film, an interlayer insulating film having an opening provided so as to cover at least the gate electrode, and an oxide semiconductor provided on the interlayer insulating film through the opening A semiconductor having a buffer layer provided on the insulating film and the insulating film between the base insulating film and the oxide semiconductor film at least in a region where the oxide semiconductor film and the wiring are in contact with each other Device.

Alternatively, in the semiconductor device, the above base insulating film has a groove, and the insulating film and the buffer layer are provided in the groove of the base insulating film.

The conductivity of the oxide semiconductor film is significantly changed by the composition of the base insulating film and / or heat treatment performed after the oxide semiconductor film is formed. This is because the conductivity of the oxide semiconductor film is mainly determined by the carrier density of the oxide semiconductor film.

For example, the case where an oxide semiconductor film is formed by a sputtering method over a base insulating film containing silicon oxide or silicon oxynitride is described. At this time, although depending on the energy of the sputtered particles, a mixed layer having a thickness of several nm is formed at the interface between the base insulating film and the oxide semiconductor film. The mixed layer contains silicon and thus has a lower carrier density than an oxide semiconductor film that does not contain silicon. This is because the bond energy between silicon and oxygen is large, and an oxide semiconductor film containing silicon hardly generates oxygen vacancies serving as a carrier generation source. Note that since the thickness of the mixed layer does not depend on the thickness of the oxide semiconductor film, the thinner the oxide semiconductor film, the greater the property of the mixed layer in the oxide semiconductor film. That is, in the case where an oxide semiconductor film is formed over a base insulating film containing silicon, the thinner the oxide semiconductor film, the lower the conductivity.

A case where the base insulating film is an insulating film from which oxygen is released by heat treatment will be described. At this time, oxygen is supplied from the base insulating film to the oxide semiconductor film by performing heat treatment in a state where the base insulating film and the oxide semiconductor film are in contact with each other. As described above, since oxygen vacancies in the oxide semiconductor film serve as a carrier generation source, supply of oxygen to the oxide semiconductor film decreases the carrier density of the oxide semiconductor film. That is, when an oxide semiconductor film is provided over a base insulating film from which oxygen is released by heat treatment, conductivity of the oxide semiconductor film is reduced.

Accordingly, an oxide semiconductor film which includes silicon oxide or silicon oxynitride and is provided over a base insulating film from which oxygen is released by heat treatment has extremely low carrier density. In the transistor including the base insulating film and the oxide semiconductor film, the channel region can be depleted without much gate voltage application, so that normally-off electrical characteristics are easily obtained.

However, even in the above-described transistor, when the channel length is short, normally-on electrical characteristics may be obtained.

Therefore, a thin oxide semiconductor film, specifically, 1 nm to 30 nm, preferably 1 nm to 15 nm, more preferably 1 nm to 10 nm, even in a short channel transistor, the channel region is depleted. This makes it easy to obtain normally-off electrical characteristics.

Note that “normally off electrical characteristics” in this specification refers to electrical characteristics in which a transistor has a threshold voltage of 0 V or higher. In addition, “normally on electrical characteristics” refers to electrical characteristics in which a transistor has a threshold voltage of less than 0V.

On the other hand, in a transistor including the base insulating film and the oxide semiconductor film, the resistance of the source region and the drain region is easily increased, and it is difficult to increase the on-state current.

For example, by providing a buffer layer only below the source region and the drain region and increasing the thickness of the oxide semiconductor film in the region, increase in resistance of the source region and the drain region can be suppressed. However, if a buffer layer is provided over a base insulating film that contains silicon oxide or silicon oxynitride and releases oxygen by heat treatment, the buffer layer itself has a high resistance, and a sufficient effect cannot be obtained.

In view of this, a transistor having an insulating film which does not contain silicon oxide or silicon oxynitride and does not release oxygen by heat treatment is proposed as a base of the buffer layer.

In other words, the transistor according to one embodiment of the present invention includes a base insulating film that includes silicon oxide or silicon oxynitride and releases oxygen by heat treatment at a lower portion of a channel region, and lower portions of a source region and a drain region. Includes an insulating film which does not contain silicon oxide or silicon oxynitride and does not release oxygen by heat treatment, and a buffer layer provided over the insulating film.

The transistor has a thin channel region and a low carrier density. In addition, the resistance increase of the source region and the drain region can be suppressed. Therefore, the transistor has normally-off electrical characteristics and a high on-state current.

A semiconductor device using the transistor can operate at high speed because the on-state current of the transistor is sufficiently high.

A transistor including an oxide semiconductor film that has normally-off electrical characteristics and high on-state current can be provided.

In addition, a semiconductor device that can operate at high speed using the transistor can be provided.

4A and 4B are a top view and cross-sectional views illustrating an example of a transistor according to one embodiment of the present invention. 6A and 6B are cross-sectional views illustrating an example of a method for manufacturing a transistor according to one embodiment of the present invention. 6A and 6B are cross-sectional views illustrating an example of a method for manufacturing a transistor according to one embodiment of the present invention. 4A and 4B are a top view and cross-sectional views illustrating an example of a transistor according to one embodiment of the present invention. 6A and 6B are cross-sectional views illustrating an example of a method for manufacturing a transistor according to one embodiment of the present invention. 6A and 6B are cross-sectional views illustrating an example of a method for manufacturing a transistor according to one embodiment of the present invention. 6A and 6B are cross-sectional views illustrating an example of a method for manufacturing a transistor according to one embodiment of the present invention. The figure which shows the TDS spectrum of a sample. The figure which shows the Hall effect measurement result of a sample. FIG. 10 is a circuit diagram illustrating an example of a liquid crystal display device including a transistor according to one embodiment of the present invention. 6A and 6B are a circuit diagram and an electrical characteristic diagram illustrating an example of a semiconductor memory device including a transistor according to one embodiment of the present invention. 6A and 6B are a circuit diagram and an electrical characteristic diagram illustrating an example of a semiconductor memory device including a transistor according to one embodiment of the present invention. 4A and 4B are a block diagram and a circuit diagram of a part of a specific example of a CPU including a transistor according to one embodiment of the present invention. 4 is a perspective view illustrating an example of an electronic device including the semiconductor device according to one embodiment of the present invention.

Embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that modes and details can be variously changed. In addition, the present invention is not construed as being limited to the description of the embodiments below. Note that in describing the structure of the present invention with reference to drawings, the same portions are denoted by the same reference numerals in different drawings. In addition, when referring to the same thing, a hatch pattern is made the same and there is a case where it does not attach a code in particular.

The ordinal numbers attached as the first and second are used for convenience and do not indicate the order of steps or the order of lamination. In addition, a specific name is not shown as a matter for specifying the invention in this specification.

(Embodiment 1)
In this embodiment, a transistor and a manufacturing method thereof according to one embodiment of the present invention will be described with reference to FIGS.

FIG. 1A is a top view of a transistor according to one embodiment of the present invention. A cross-sectional view corresponding to a dashed-dotted line AB in FIG. 1A is illustrated in FIG. Note that for simplicity, the interlayer insulating film 118, the gate insulating film 112, and the like are not illustrated in FIG.

A transistor illustrated in FIG. 1B includes a substrate 100, a base insulating film 102 provided over the substrate 100, a pair of insulating films 103a and 103b provided over the base insulating film 102, and an insulating film. 103a and the insulating film 103b, and provided on the buffer layer 107a and the buffer layer 107b having the same top shape as the insulating film 103a and the insulating film 103b, and the base insulating film 102, the buffer layer 107a, and the buffer layer 107b. The oxide semiconductor film 106 including the first region 106 a, the second region 106 b, and the third region 106 c, the gate insulating film 112 provided over the oxide semiconductor film 106, and oxidation through the gate insulating film 112 A gate electrode 104 overlapping with the third region 106c of the physical semiconductor film 106, and at least the gate electrode 104 Having an interlayer insulating film 118 provided, provided over the interlayer insulating film 118, a first region 106a and second region 106b and the wiring 116a and a wiring 116b in contact with the oxide semiconductor film 106, the I.

In the present specification, the “similar top shape” means that the end portions of the stacked films overlap each other. However, the end portions do not completely match, and the upper layer film may be formed inside the lower layer film.

Note that in the transistor illustrated in FIG. 1B, the buffer layer 107a and the first region 106a of the oxide semiconductor film 106 are in contact with each other, and the buffer layer 107b and the second region 106b of the oxide semiconductor film 106 are in contact with each other.

In the transistor illustrated in FIG. 1B, the insulating film 103a and the insulating film 103b and the buffer layer 107a and the buffer layer 107b have similar top shapes; however, the transistor described in this embodiment is not limited to this structure. . For example, the top surface shapes of the insulating film 103a and the insulating film 103b may be larger or smaller than the top surface shapes of the buffer layer 107a and the buffer layer 107b.

Note that the gate electrode 104 is provided between the buffer layer 107a and the buffer layer 107b.

Note that the first region 106a and the second region 106b of the oxide semiconductor film 106 function as a source region and a drain region of the transistor. In addition, the third region 106c of the oxide semiconductor film 106 functions as a channel region of the transistor.

Alternatively, a wiring provided in the same layer and the same material as the wiring 116 a and the wiring 116 b may be connected to the gate electrode 104.

As the base insulating film 102, an insulating film containing silicon is used. Specifically, a silicon oxide film or a silicon oxynitride film is used, and a single layer or a stacked layer may be used.

Silicon oxynitride indicates a composition having a higher oxygen content than nitrogen. For example, oxygen is 50 atomic% to 70 atomic%, nitrogen is 0.5 atomic% to 15 atomic%, silicon In the range of 25 atomic% to 35 atomic% and hydrogen in the range of 0 atomic% to 10 atomic%. However, the above ranges are those measured using Rutherford Backscattering Spectrometry (RBS) or Hydrogen Forward Scattering Spectrometry (HFS). Further, the composition of the constituent elements takes a value that the total does not exceed 100 atomic%.

As the base insulating film 102, an insulating film from which oxygen is released by heat treatment at a temperature of 250 ° C to 450 ° C, preferably 325 ° C to 375 ° C is preferably used.

“Oxygen is released by heat treatment” means that the amount of released oxygen in terms of oxygen atoms is 1.0 × 10 ¹⁹ atoms / cm ³ or more, preferably 3.0 × 10 ¹⁹ atoms in TDS analysis. / Cm ³ or more, more preferably 1.0 × 10 ²⁰ atoms / cm ³ or more, and further preferably 3.0 × 10 ²⁰ atoms / cm ³ or more.

Here, a method for measuring the amount of released oxygen converted into oxygen atoms in TDS analysis will be described below.

The amount of gas released when TDS analysis is performed is proportional to the integral value of the spectrum. For this reason, the amount of gas emission can be calculated from the ratio between the measured integral value of the spectrum and the reference value of the standard sample. The reference value of the standard sample is the ratio of the atomic density to the integral value of the spectrum in a sample having a predetermined atomic density.

For example, the amount of released oxygen molecules (N _O2 ) of the insulating film can be obtained from Equation 1 from the TDS analysis result of a silicon wafer containing hydrogen of a predetermined density as a standard sample and the TDS analysis result of the insulating film. . Here, it is assumed that all of the spectra detected when the mass-to-charge ratio (M / z) obtained by TDS analysis is 32 are derived from oxygen molecules. There is CH ₃ OH in addition to M / z of 32, but it is not considered here as it is unlikely to exist. In addition, oxygen molecules containing an oxygen atom with an M / z of 17 and an oxygen atom with an M / z of 18 that are isotopes of oxygen atoms are not considered because their abundance ratio in nature is extremely small.

N _H2 is a value obtained by converting hydrogen molecules desorbed from the standard sample by density. _SH2 is an integral value of a spectrum when a standard sample is subjected to TDS analysis. Here, the reference value of the standard sample is N _H2 / SH ₂ . S _O2 is an integral value of a spectrum when the insulating film is subjected to TDS analysis. α is a coefficient that affects the spectral intensity in the TDS analysis. For details of Equation 1, refer to Japanese Patent Laid-Open No. Hei 6-275697. The oxygen release amount of the insulating film is a silicon wafer containing 1 × 10 ¹⁶ atoms / cm ³ hydrogen atoms as a standard sample using a temperature programmed desorption analyzer EMD-WA1000S / W manufactured by Electronic Science Co., Ltd. Use to measure.

In TDS analysis, part of oxygen is detected as oxygen atoms. The ratio of oxygen molecules to oxygen atoms can be calculated from the ionization rate of oxygen molecules. Note that since the above α includes the ionization rate of oxygen molecules, the amount of released oxygen atoms can be estimated by evaluating the amount of released oxygen molecules.

Note that N _{2 O 2} is the amount of released oxygen molecules. The amount of release when converted to oxygen atoms is twice the amount of release of oxygen molecules.

The base insulating film 102 preferably has sufficient flatness. Specifically, a film serving as a base is provided so that the average surface roughness (Ra) is 1 nm or less, preferably 0.3 nm or less, and more preferably 0.1 nm or less. When Ra is less than or equal to the above numerical value, a crystal region is easily formed in the oxide semiconductor film 106. In addition, since the unevenness at the interface between the base insulating film 102 and the oxide semiconductor film 106 is reduced, the influence of interface scattering can be reduced. Ra is a three-dimensional extension of the centerline average roughness defined in JIS B0601 so that it can be applied to a surface. “A value obtained by averaging the absolute values of deviations from a reference surface to a specified surface” ”And is defined by Equation 2.

In Equation 2, S ₀ is the area of the measurement surface (rectangular region surrounded by four points represented by coordinates (x1, y1) (x1, y2) (x2, y1) (x2, y2)). Z ₀ indicates the average height of the measurement surface. Ra can be evaluated with an atomic force microscope (AFM).

As the insulating film 103a and the insulating film 103b, an insulating film containing no silicon is used. “No silicon” means that the silicon concentration is less than 0.1 atomic% by ICP-MS (Inductively Coupled Plasma Mass Spectrometry). Specifically, an insulating film containing any one or more of aluminum oxide, gallium oxide, zirconium oxide, hafnium oxide, yttrium oxide, lanthanum oxide, and aluminum nitride may be used.

As the insulating film 103a and the insulating film 103b, an insulating film which does not release oxygen by heat treatment at a temperature of 250 ° C. to 450 ° C., preferably 325 ° C. to 375 ° C. is preferably used.

The insulating films 103a and 103b are insulating films that do not transmit oxygen released from the base insulating film 102. Therefore, it is preferable that the insulating film 103a and the insulating film 103b have a certain thickness. Specifically, the insulating film 103a and the insulating film 103b may have a thickness of 5 nm or more, preferably 10 nm or more.

As a material for the oxide semiconductor film 106, for example, an In-M-Zn-O-based material may be used. Here, M is an element whose binding energy with oxygen is higher than In and Zn. Alternatively, the element has a function of suppressing release of oxygen from the In-M-Zn-O-based material. By the action of M, generation of oxygen vacancies in the oxide semiconductor film is suppressed. Therefore, variation in electrical characteristics of the transistor due to oxygen deficiency can be reduced, and a highly reliable transistor can be obtained.

Specifically, M is Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Ga, Ge, Y, Zr, Nb, Mo, Sn, La, Ce, Pr, Nd, Sm. , Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Hf, Ta or W, preferably Al, Ti, Ga, Y, Zr, Ce or Hf.

The first region 106a and the second region 106b of the oxide semiconductor film 106 include an impurity that reduces the resistance of the oxide semiconductor film. Specifically, the region includes one or more selected from helium, boron, nitrogen, fluorine, neon, aluminum, phosphorus, argon, arsenic, krypton, indium, tin, antimony, and xenon.

The oxide semiconductor film 106 is in a single crystal state, a polycrystalline (also referred to as polycrystal) state, an amorphous state, or the like.

The oxide semiconductor film 106 is preferably a CAAC-OS (C Axis Aligned Crystal Oxide Semiconductor) film.

The CAAC-OS film is not completely single crystal nor completely amorphous. The CAAC-OS film is an oxide semiconductor film with a crystal-amorphous mixed phase structure where crystal parts are included in an amorphous phase. Note that the crystal part is often large enough to fit in a cube whose one side is less than 100 nm. Further, in the observation image obtained by a transmission electron microscope (TEM), the boundary between the amorphous part and the crystal part included in the CAAC-OS film is not clear. Further, a grain boundary (also referred to as a grain boundary) cannot be confirmed in the CAAC-OS film by TEM. Therefore, in the CAAC-OS film, reduction in electron mobility due to grain boundaries is suppressed.

In the crystal part included in the CAAC-OS film, the c-axis is aligned in a direction perpendicular to the formation surface or the surface of the CAAC-OS film, and a triangular or hexagonal atomic arrangement is seen from the direction perpendicular to the ab plane. The metal atoms are arranged in layers or the metal atoms and oxygen atoms are arranged in layers as viewed from the direction perpendicular to the c-axis. Note that the directions of the a-axis and the b-axis may be different between different crystal parts. In this specification, a simple term “perpendicular” includes a range from 85 ° to 95 °.

Note that the distribution of crystal parts in the CAAC-OS film is not necessarily uniform. For example, in the formation process of the CAAC-OS film, when crystal growth is performed from the surface side of the oxide semiconductor film 106, the ratio of crystal parts in the vicinity of the surface of the oxide semiconductor film 106 may increase in the vicinity of the surface. In addition, when an impurity is added to the CAAC-OS film, the crystal part in a region to which the impurity is added becomes amorphous in some cases.

Since the c-axis of the crystal part included in the CAAC-OS film is aligned in a direction perpendicular to the formation surface or the surface of the CAAC-OS film, the shape of the CAAC-OS film (the cross-sectional shape of the formation surface or the cross-sectional shape of the surface) ) May be in different directions. Note that the c-axis direction of the crystal part is perpendicular to the formation surface or surface when the CAAC-OS film is formed. The crystal part is formed by film formation or by performing crystallization treatment such as heat treatment after film formation.

A transistor including a CAAC-OS film can reduce variation in electrical characteristics due to irradiation with visible light or ultraviolet light. Therefore, the transistor has high reliability.

The buffer layer 107a and the buffer layer 107b may be provided with a thickness of 10 nm to 50 nm, preferably 10 nm to 30 nm. Since the buffer layer 107a and the buffer layer 107b serve as part of the source region and the drain region, it is preferable to have a certain thickness in order to reduce resistance. Further, when the thickness is too large, there is a concern that the step coverage of the oxide semiconductor film 106 may be reduced. However, the said range is an example and is not limited to this.

As the buffer layer 107a and the buffer layer 107b, a material that can exchange electrons with the oxide semiconductor film 106 is used. Specifically, a material that can be used for the oxide semiconductor film 106 is preferably used.

Alternatively, a known transparent conductive film material may be used for the buffer layer 107a and the buffer layer 107b.

There is no particular limitation on the substrate 100, but it is necessary to have at least heat resistance enough to withstand heat treatment performed later. For example, a glass substrate, a ceramic substrate, a quartz substrate, a sapphire substrate, or the like may be used as the substrate 100. In addition, a single crystal semiconductor substrate such as silicon or silicon carbide, a polycrystalline semiconductor substrate, a compound semiconductor substrate such as silicon germanium, an SOI (Silicon On Insulator) substrate, or the like can be applied, and a semiconductor element is formed on these substrates. A substrate provided with may be used as the substrate 100.

Further, a flexible substrate may be used as the substrate 100. Note that as a method for providing a transistor over a flexible substrate, there is a method in which after a transistor is manufactured over a non-flexible substrate, the transistor is peeled off and transferred to the substrate 100 which is a flexible substrate. In that case, a separation layer is preferably provided between the non-flexible substrate and the transistor.

The gate insulating film 112 includes one or more of silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, aluminum oxide, aluminum nitride, hafnium oxide, zirconium oxide, yttrium oxide, lanthanum oxide, cesium oxide, tantalum oxide, and magnesium oxide. A single layer or a stacked layer may be selected.

The gate electrode 104 is selected from one or more of Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ag, Ta, and W, their nitrides, oxides, and alloys, and is a single layer or a stacked layer Use it. Alternatively, an oxide or oxynitride containing at least In and Zn may be used. For example, an In—Ga—Zn—O—N-based material or the like may be used.

The interlayer insulating film 118 is formed using a method and a material similar to those of the gate insulating film 112.

The interlayer insulating film 118 preferably has a low relative dielectric constant and a sufficient thickness. For example, a silicon oxide film having a relative dielectric constant of about 3.8 may be used and provided with a thickness of 200 nm to 1000 nm. The surface of the interlayer insulating film 118 has a slight fixed charge due to the influence of atmospheric components and the like, and the threshold voltage of the transistor may fluctuate due to the influence. Therefore, it is preferable that the interlayer insulating film 118 has a relative dielectric constant and a thickness in a range in which the influence of charges generated on the surface is sufficiently reduced. For the same reason, the influence of electric charges generated on the surface may be reduced by forming a resin film over the interlayer insulating film 118.

The wiring 116 a and the wiring 116 b may be formed using a method and a material similar to those of the gate electrode 104. Note that the wiring 116a and the wiring 116b may be formed using the same layer and the same material.

Note that the transistor illustrated in FIG. 1C is similar to the transistor illustrated in FIG. 1B except that the shape of the gate insulating film is different. Specifically, in the transistor illustrated in FIG. 1B, the gate insulating film 112 is provided so as to cover the oxide semiconductor film 106, whereas in the transistor illustrated in FIG. The top shape is the same as

As described above, in the transistor according to one embodiment of the present invention, the channel region has few oxygen vacancies and the source region and the drain region are unlikely to have high resistance. Therefore, the transistor has normally-off electrical characteristics and a high on-state current.

A method for manufacturing the transistor illustrated in FIG. 1B is described below.

First, the substrate 100 is prepared, and the base insulating film 102 is formed over the substrate 100. The base insulating film 102 is formed by a sputtering method, a chemical vapor deposition (CVD) method, a molecular beam epitaxy (MBE) method, an atomic layer deposition (ALD) method, or a pulsed laser deposition method. The film may be formed using a PLD (Pulse Laser Deposition) method.

The base insulating film 102 is preferably formed by a sputtering method. At this time, a deposition gas containing 5% or more, preferably 10% or more, more preferably 20% or more, more preferably 50% or more of an oxidizing gas (oxygen, ozone, or nitrous oxide) is used. A gas having a low impurity concentration such as hydrogen is used as the film forming gas. The substrate temperature during film formation is from room temperature to 200 ° C., preferably from room temperature to 150 ° C., more preferably from room temperature to 120 ° C. When the base insulating film 102 is formed by the above-described method, the concentration of impurities such as hydrogen is low and oxygen is excessively contained, so that dangling bonds of oxygen atoms are easily formed in the base insulating film 102. That is, an insulating film from which oxygen is released by heat treatment can be formed.

Next, the insulating film 103 is formed over the base insulating film 102. The insulating film 103 may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

Next, the buffer layer 107 is formed over the insulating film 103 (see FIG. 2A). The buffer layer 107 may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

Next, the buffer layer 107 and the insulating film 103 are processed to form a pair of buffer layers 107a and 107b, and a pair of insulating films 103a and 103b (see FIG. 2B). At this time, after the buffer layer 107a and the buffer layer 107b are formed, the insulating film 103 may be processed using the buffer layer 107a and the buffer layer 107b as a mask, or a resist mask used for processing the buffer layer 107 may be used. The insulating film 103 may be processed by using it.

Note that in this specification, in the case where “processing” is simply described, this indicates that a film is formed into a desired shape using a resist mask formed by a photolithography process.

Next, an oxide semiconductor film is formed over the base insulating film 102. The oxide semiconductor film may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

After the oxide semiconductor film is formed, first heat treatment is preferably performed. The first heat treatment includes an atmosphere of an inert gas (nitrogen or a rare gas such as helium, neon, argon, krypton, or xenon) and an oxidizing gas of 10 ppm or more, preferably 1% or more, more preferably 10% or more. In an atmosphere or a reduced pressure state (10 Pa or less), the temperature is 250 ° C. or higher and 450 ° C. or lower, preferably 325 ° C. or higher and 375 ° C. or lower.

By the first heat treatment, the carrier density of the oxide semiconductor film can be reduced in a region in contact with the base insulating film 102. In addition, the increase in resistance of the buffer layer 107a and the buffer layer 107b over the insulating film 103a and the insulating film 103b can be suppressed.

Next, the above-described oxide semiconductor film is processed to form an island-shaped oxide semiconductor film 136 (see FIG. 2C).

The oxide semiconductor film is preferably formed by a sputtering method. At this time, a film forming gas containing an oxidizing gas of 5% or more, preferably 10% or more, more preferably 20% or more, and further preferably 50% or more is used. A gas having a low impurity concentration such as hydrogen is used as the deposition gas. The substrate temperature during film formation is from room temperature to 450 ° C., preferably from 100 ° C. to 400 ° C., more preferably from 150 ° C. to 350 ° C. When the oxide semiconductor film is formed by the above method, the concentration of impurities such as hydrogen is low and oxygen vacancies are less likely to occur.

Next, the gate insulating film 112 is formed over the oxide semiconductor film 136. The gate insulating film 112 may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method. Note that instead of after the oxide semiconductor film is formed, the first heat treatment may be performed after the gate insulating film 112 is formed.

The gate insulating film 112 may be formed using a method and a material similar to those of the base insulating film 102 or the insulating film 103.

Next, a conductive film to be the gate electrode 104 is formed over the oxide semiconductor film 136 with the gate insulating film 112 interposed therebetween. The conductive film may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

Next, the conductive film to be the gate electrode 104 is processed to form the gate electrode 104 (see FIG. 3A).

Next, by using the gate electrode 104 as a mask, an impurity is added to the oxide semiconductor film 136, so that regions to be the first region 106a, the second region 106b, and the third region 106c are formed. Here, the impurity is an impurity that lowers the resistance of the oxide semiconductor film. Specifically, one or more selected from helium, boron, nitrogen, fluorine, neon, aluminum, phosphorus, argon, arsenic, krypton, indium, tin, antimony, and xenon may be added. Note that this method may be performed by an ion implantation method or an ion doping method. Alternatively, plasma treatment or heat treatment may be performed in an atmosphere containing an impurity that reduces resistance of the oxide semiconductor film. An ion implantation method is preferably used. Note that the second heat treatment may be performed after an impurity that reduces the resistance of the oxide semiconductor film is added by an ion implantation method. The second heat treatment may be a heat treatment similar to the first heat treatment. Note that the second heat treatment may be performed instead of the first heat treatment. Note that the third region 106c is a region to which the above-described impurities are not added.

By the second heat treatment, resistance of part of the oxide semiconductor film 136 is reduced, so that the oxide semiconductor film 106 including the first region 106a, the second region 106b, and the third region 106c is formed. (See FIG. 3B).

Through such impurity addition and the second heat treatment, the resistance of part of the oxide semiconductor film 136 may be reduced, and the resistance of the buffer layer 107a and the buffer layer 107b may be reduced.

Next, an interlayer insulating film 118 is formed over the gate insulating film 112 and the gate electrode 104. The interlayer insulating film 118 may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

The interlayer insulating film 118 may be formed using a method and a material similar to those of the base insulating film 102 or the insulating film 103.

Next, the interlayer insulating film 118 and the gate insulating film 112 are processed so that the first region 106a and the second region 106b of the oxide semiconductor film 106 are exposed in a region overlapping with the buffer layer 107a and the buffer layer 107b. An opening is formed. The opening is formed under such a condition that the oxide semiconductor film 106 is not etched as much as possible, but is not limited thereto. Specifically, when the opening is formed, the buffer layer 107a and the buffer layer 107b, or the insulating film 103a and the insulating film 103b may be exposed through the oxide semiconductor film 106. In this manner, by including the buffer layer 107a and the buffer layer 107b, and the insulating film 103a and the insulating film 103b, the degree of freedom in etching conditions when the interlayer insulating film 118 and the gate insulating film 112 are processed is increased. Therefore, the yield of transistors can be increased.

Next, a conductive film to be the wiring 116 a and the wiring 116 b is formed over the interlayer insulating film 118 and the first region 106 a and the second region 106 b of the exposed oxide semiconductor film 106. The conductive film may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

Next, the conductive film to be the wiring 116a and the wiring 116b is processed to form the wiring 116a and the wiring 116b (see FIG. 3C).

Through the above steps, the transistor illustrated in FIG. 1B can be manufactured.

Note that the transistor illustrated in FIG. 1C is different from the transistor illustrated in FIG. 1B only in the shape of a gate insulating film. Therefore, the description of the method for manufacturing the transistor in FIG.

In the transistor obtained in this embodiment, the carrier density of the channel region is low, and the resistance of the source region and the drain region is difficult to increase. The transistor has normally-off electrical characteristics and a high on-state current.

In addition, a semiconductor device using the transistor can operate at high speed.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 2)
In this embodiment, a transistor having a structure different from that of the transistor described in Embodiment 1 and a manufacturing method thereof will be described with reference to FIGS.

FIG. 4A is a top view of a transistor according to one embodiment of the present invention. A cross-sectional view corresponding to the alternate long and short dash line AB illustrated in FIG. 4A is illustrated in FIG. Note that for simplicity, the interlayer insulating film 218, the gate insulating film 212, and the like are not illustrated in FIG.

The transistor illustrated in FIG. 4B is provided to cover the substrate 200, the base insulating film 202 including a pair of groove portions provided over the substrate 200, and the side surfaces and the bottom surface of the pair of groove portions of the base insulating film 202. A buffer layer 207a and a buffer layer 207b provided on the insulating film 203a and the insulating film 203b so as to fill a pair of groove portions of the insulating film 203a and the insulating film 203b forming a pair and the base insulating film 202, and the base insulating film 202 , An oxide semiconductor film 206 having a first region 206a, a second region 206b, and a third region 206c provided over the buffer layer 207a and the buffer layer 207b, and a gate provided over the oxide semiconductor film 206 The gate electrode 2 which overlaps with the insulating film 212 and the third region 206c of the oxide semiconductor film 206 with the gate insulating film 212 interposed therebetween. 4, an interlayer insulating film 218 provided so as to cover at least the gate electrode 204, and a wiring 216 a provided on the interlayer insulating film 218 and in contact with the first region 206 a and the second region 206 b of the oxide semiconductor film 206, respectively. And a wiring 216b.

Note that the gate electrode 204 is provided between the buffer layer 207a and the buffer layer 207b.

Note that the first region 206a and the second region 206b of the oxide semiconductor film 206 function as a source region and a drain region of the transistor. In addition, the third region 206c of the oxide semiconductor film 206 functions as a channel region of the transistor.

Alternatively, the wiring provided in the same layer and the same material as the wiring 216 a and the wiring 216 b may be connected to the gate electrode 204.

The base insulating film 202 may be formed using a material and a method similar to those of the base insulating film 102.

The insulating film 203a and the insulating film 203b may be formed using a material and a method similar to those of the insulating film 103a and the insulating film 103b.

The buffer layer 207a and the buffer layer 207b may be formed using a material and a method similar to those of the buffer layer 107a and the buffer layer 107b.

The oxide semiconductor film 206 may be formed using a material and a method similar to those of the oxide semiconductor film 106.

The first region 206a and the second region 206b of the oxide semiconductor film 206 may be formed using a material and a method similar to those of the first region 106a and the second region 106b of the oxide semiconductor film 106. Good.

The substrate 200 may be formed using the same material as the substrate 100.

The gate insulating film 212 may be formed using a material and a method similar to those of the gate insulating film 112.

The gate electrode 204 may be formed using a material and a method similar to those of the gate electrode 104.

The interlayer insulating film 218 may be formed using a material and a method similar to those of the interlayer insulating film 118.

The wiring 216a and the wiring 216b may be formed using a material and a method similar to those of the wiring 116a and the wiring 116b.

Note that the transistor illustrated in FIG. 4C is similar to the transistor illustrated in FIG. 4B except that the shape of the gate insulating film is different. Specifically, in the transistor illustrated in FIG. 4B, the gate insulating film 212 is provided so as to cover the oxide semiconductor film 206, whereas in the transistor illustrated in FIG. 4C, the gate insulating film 213 includes the gate electrode 204. The top shape is the same as

As described above, in the transistor of one embodiment of the present invention, the channel region has a low carrier density and the source region and the drain region are unlikely to have high resistance. Therefore, the transistor has normally-off electrical characteristics and a high on-state current.

A method for manufacturing the transistor illustrated in FIG. 4B is described below.

First, the substrate 200 is prepared, and a base insulating film 232 is formed over the substrate 200 (see FIG. 5A). The base insulating film 232 may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

Next, the base insulating film 232 is processed to form the base insulating film 202 having a pair of groove portions (see FIG. 5B).

Next, an insulating film 233 is formed over the base insulating film 202. The insulating film 233 may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

Note that the insulating film 233 is formed to be thinner than the depth of the pair of groove portions of the base insulating film 202. This is because, when the insulating film 233 is thicker than the depth of the pair of groove portions of the base insulating film 202, it is difficult to fill the buffer layer 207a and the buffer layer 207b to be formed later in the pair of groove portions of the base insulating film 202. It is because it becomes.

At this time, when the end portions of the pair of groove portions of the base insulating film 202 have a taper angle, the insulating film 233 can be satisfactorily covered on the base insulating film 202, and a gap is hardly formed in a stepped portion or the like.

“Having a taper angle” means that the taper angle θ is 20 ° or more and less than 90 ° (preferably 40 ° or more and 85 ° or less).

Next, a buffer layer 237 is formed over the insulating film 233 (see FIG. 5C). The buffer layer 237 may be formed by a sputtering method, a CVD method, an MBE method, an ALD method, or a PLD method.

Next, part of the buffer layer 237 and the insulating film 233 is etched to expose part of the base insulating film 202, thereby forming a pair of insulating films 203 a and 203 b in a pair of grooves in the base insulating film 202. , And a pair of buffer layers 207a and 207b are formed (see FIG. 6A). Note that by etching portions of the buffer layer 237 and the insulating film 233, the base insulating film 202, the buffer layer 207a, and the buffer layer 207b have the same surface height. However, the present invention is not limited to this, and the surface height of the base insulating film 202 may be different from that of the buffer layer 207a and the buffer layer 207b.

The process for etching part of the buffer layer 237 and the insulating film 233 may be specifically performed by a chemical mechanical polishing (CMP) process, a dry etching process, or the like.

Note that in order to etch part of the buffer layer 237 and the insulating film 233 by dry etching, a planarization film is formed over the buffer layer 237, and then the planarization film, the buffer layer 237, and the insulating film 233 are formed. However, the etching process may be performed under the condition that the etching rate is about the same.

Alternatively, dry etching treatment and CMP treatment may be combined. For example, after the buffer layer 237 is dry-etched, the insulating film 233 may be subjected to CMP. Alternatively, after the buffer layer 237 is subjected to CMP treatment, the insulating film 233 may be subjected to dry etching treatment.

Note that since the end portions of the pair of groove portions of the base insulating film 202 have a taper angle, the end portions of the insulating film 203a, the insulating film 203b, the buffer layer 207a, and the buffer layer 207b provided in the groove portion have reverse taper angles. . “Having a reverse taper angle” means that the angle θ of the taper angle is more than 90 ° and less than 110 ° (preferably more than 95 ° and less than 130 °).

Next, an oxide semiconductor film is formed. The oxide semiconductor film may be formed using a material and a method similar to those of the oxide semiconductor film described in Embodiment 1.

After the oxide semiconductor film is formed, first heat treatment is preferably performed. The first heat treatment may be a heat treatment similar to the first heat treatment described in Embodiment 1.

By the first heat treatment, the carrier density of the oxide semiconductor film can be reduced in a region in contact with the base insulating film 202. In addition, an increase in resistance of the buffer layer 207a and the buffer layer 207b over the insulating film 203a and the insulating film 203b can be suppressed.

Next, the oxide semiconductor film is processed to form the oxide semiconductor film 236 (see FIG. 6B). The oxide semiconductor film 236 may be formed using a material and a method similar to those of the oxide semiconductor film 136.

Next, the gate insulating film 212 is formed over the oxide semiconductor film 236. Instead of after the oxide semiconductor film is formed, the first heat treatment may be performed after the gate insulating film 212 is formed.

Next, the gate electrode 204 is formed over the gate insulating film 212 (see FIG. 6C).

Next, by using the gate electrode 204 as a mask, an impurity is added to the oxide semiconductor film 236, so that regions to be the first region 206a, the second region 206b, and the third region 206c are formed. Here, the addition of impurities may be performed using the materials and methods described in Embodiment Mode 1. Note that the second heat treatment may be performed after the impurity is added by an ion implantation method. The second heat treatment may be a heat treatment similar to the first heat treatment. Note that the second heat treatment may be performed instead of the first heat treatment. Note that the region to be the third region 206c is a region to which the above-described impurities are not added.

By the second heat treatment, part of the oxide semiconductor film 236 can be reduced in resistance, so that the oxide semiconductor film 206 including the first region 206a, the second region 206b, and the third region 206c can be obtained. (See FIG. 7A.)

Next, an interlayer insulating film 218 is formed over the gate insulating film 212 and the gate electrode 204.

Next, the interlayer insulating film 218 and the gate insulating film 212 are processed, so that openings that expose the first region 206a and the second region 206b of the oxide semiconductor film 206 are formed. The opening is formed under such a condition that the oxide semiconductor film 206 is not etched as much as possible, but is not limited thereto. Specifically, when the opening is formed, the insulating film 203a and / or the insulating film 203b may be exposed through the oxide semiconductor film 206.

Next, a wiring 216a and a wiring 216b are formed over the interlayer insulating film 218 and the first region 206a and the second region 206b of the exposed oxide semiconductor film 206 (see FIG. 7B).

Through the above process, the transistor illustrated in FIG. 4B can be manufactured.

Note that the transistor illustrated in FIG. 4C is different from the transistor illustrated in FIG. 4B only in the shape of the gate insulating film. Therefore, the description of the method for manufacturing the transistor in FIG.

In the transistor obtained by this embodiment, the carrier density of the channel region is low, and the resistance of the source region and the drain region is difficult to increase. Therefore, the transistor has normally-off electrical characteristics and can have a high on-state current.

In addition, a semiconductor device using the transistor can operate at high speed.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 3)
In this embodiment, a liquid crystal display device manufactured using the transistor described in Embodiment 1 or 2 will be described. Note that although an example in which one embodiment of the present invention is applied to a liquid crystal display device is described in this embodiment, the present invention is not limited thereto. For example, those skilled in the art can easily conceive applying one embodiment of the present invention to an EL (Electro Luminescence) display device which is one of light emitting devices.

FIG. 10 is a circuit diagram of an active matrix liquid crystal display device. The liquid crystal display device includes source lines SL_1 to SL_a, gate lines GL_1 to GL_b, and a plurality of pixels 2200. The pixel 2200 includes a transistor 2230, a capacitor 2220, and a liquid crystal element 2210. A plurality of such pixels 2200 constitute a pixel portion of the liquid crystal display device. Note that in the case where the source line or the gate line is simply referred to, it may be referred to as a source line SL or a gate line GL.

As the transistor 2230, the transistor described in Embodiment 1 or 2 is used. Since the transistor described in Embodiment 1 or 2 uses an oxide semiconductor with favorable electrical characteristics, a display device with high display quality can be obtained.

The gate line GL is connected to the gate of the transistor 2230, the source line SL is connected to the source of the transistor 2230, and the drain of the transistor 2230 is connected to one capacitor electrode of the capacitor 2220 and one pixel electrode of the liquid crystal element 2210. The other capacitor electrode of the capacitor 2220 and the other pixel electrode of the liquid crystal element 2210 are connected to a common electrode. Note that the common electrode may be provided in the same layer and the same material as the gate line GL.

The gate line GL is connected to a gate drive circuit. The gate driver circuit may include the transistor described in Embodiment 1 or Embodiment 2.

Further, the source line SL is connected to a source driving circuit. The source driver circuit may include the transistor described in Embodiment 1 or Embodiment 2.

Note that either or both of the gate driver circuit and the source driver circuit are formed over a separately prepared substrate and connected using a method such as COG (Chip On Glass), wire bonding, or TAB (Tape Automated Bonding). May be.

In addition, since the transistor is easily broken by static electricity or the like, it is preferable to provide a protective circuit. The protection circuit is preferably configured using a non-linear element.

When a voltage is applied to the gate line GL so as to be equal to or higher than the threshold voltage of the transistor 2230, the charge supplied from the source line SL becomes the drain current of the transistor 2230 and is accumulated in the capacitor 2220. After charging for one row, the transistor 2230 in the row is turned off and no voltage is applied to the source line SL, but a necessary voltage can be maintained by the charge accumulated in the capacitor 2220. Thereafter, the process moves to charging of the capacitor 2220 in the next row. In this way, charging from the first row to the b-th row is performed. The drain current is a current flowing from the source to the drain through the channel in the transistor. The drain current flows when the gate voltage is larger than the threshold voltage.

Note that the transistor 2230 has low off-state current. Therefore, in an image with little motion (including a still image), the display rewriting frequency can be reduced, and the power consumption can be further reduced. In addition, since the capacitance of the capacitor 2220 can be further reduced, power consumption required for charging can be reduced.

In addition, since the transistor 2230 has little variation in electrical characteristics due to the operation of the transistor, a highly reliable liquid crystal display device can be obtained.

As described above, according to one embodiment of the present invention, a liquid crystal display device with high display quality and low power consumption can be provided.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 4)
In this embodiment, an example in which a semiconductor memory device is manufactured using the transistor described in Embodiment 1 or 2 will be described.

As a typical example of a volatile semiconductor memory device, a circuit such as a DRAM (Dynamic Random Access Memory) or a flip-flop that stores information by selecting a transistor constituting a memory element and accumulating electric charge in a capacitor is used. There is an SRAM (Static Random Access Memory) that uses and holds stored contents.

As a typical example of a nonvolatile semiconductor memory device, there is a flash memory which has a node between a gate and a channel region of a transistor and stores data by holding electric charge in the node.

The transistor described in Embodiment 1 or 2 can be applied to part of the transistors included in the semiconductor memory device described above.

First, a DRAM to which the transistor described in Embodiment 1 or 2 is applied is described with reference to FIGS.

The DRAM includes a bit line BL, a word line WL, a sense amplifier SAmp, a transistor Tr, and a capacitor C (see FIG. 11A).

It is known that the time change of the voltage held in the capacitor C is gradually reduced as shown in FIG. 11B by the off-state current of the transistor Tr. The voltage initially charged from V0 to V1 is reduced to VA, which is a limit point for reading data1 over time. This period is a holding period T_1. That is, in the case of a binary DRAM, it is necessary to refresh during the holding period T_1.

Here, when the transistor described in Embodiment 1 or 2 is applied to the transistor Tr, the off-state current is small, so that the holding period T_1 can be extended. In other words, since the refresh period can be extended, power consumption can be reduced. For example, when a DRAM is formed using a transistor including an oxide semiconductor film with an off-state current of 1 × 10 ⁻²¹ A or less, preferably 1 × 10 ⁻²⁴ A or less, power is not supplied for several days to several tens of days. Data can be retained for a year.

In addition, when the transistor described in Embodiment 1 or 2 is applied to the transistor Tr, the transistor has little variation in electrical characteristics due to the operation of the transistor, so that a highly reliable semiconductor memory device can be obtained. .

As described above, according to one embodiment of the present invention, a DRAM with high reliability and low power consumption can be obtained.

Next, a nonvolatile memory to which the transistor described in Embodiment 1 or 2 is applied is described with reference to FIGS.

FIG. 12A is a circuit diagram of a nonvolatile memory. The nonvolatile memory includes a transistor Tr_1, a word line WL_1 connected to the gate of the transistor Tr_1, a source wiring SL_1 connected to the source of the transistor Tr_1, a transistor Tr_2, a source wiring SL_2 connected to the source of the transistor Tr_2, and a transistor. A drain wiring DL_2 connected to the drain of Tr_2, a capacitor C, a capacitance wiring CL connected to one end of the capacitor C, a node N connected to the other end of the capacitor C, the drain of the transistor Tr_1 and the gate of the transistor Tr_2. Have.

Note that the nonvolatile memory described in this embodiment is based on the fact that the threshold voltage of the transistor Tr_2 varies depending on the potential of the node N. For example, FIG. 12B illustrates a relationship between the voltage V _CL of the capacitor wiring CL and the drain current I _d _2 flowing through the transistor Tr_2.

Here, the voltage of the node N can be adjusted through the transistor Tr_1. For example, the potential of SL_1 is set to VDD. At this time, by setting the potential of WL_1 to be equal to or higher than the potential obtained by adding VDD to the threshold voltage Vth of Tr_1, the voltage of the node N can be HIGH. In addition, by setting the potential of WL_1 to be equal to or lower than the threshold voltage Vth of Tr_1, the potential of the node N can be set to LOW.

Therefore, it is possible to obtain a _V CL _-I d _2 curve indicated by N = LOW, one of _V CL _-I d _2 curve indicated by N = HIGH. That is, when N = LOW, since I _{d —} 2 is small at V _CL = 0V, data 0 is obtained. Further, when N = HIGH, I _{d —} 2 is large when V _CL = 0V, and therefore, data 1 is obtained. In this way, data can be stored.

Here, when the transistor described in Embodiment 1 or 2 is applied to the transistor Tr_1, the off-state current of the transistor can be extremely small; thus, the charge accumulated in the node N is supplied to the source and the drain of the transistor Tr_1. It is possible to suppress the leakage without intentional interval. Therefore, data can be held for a long time. In addition, since the threshold voltage of the transistor Tr_1 is adjusted by using one embodiment of the present invention, the voltage necessary for writing can be reduced and power consumption can be reduced compared to a flash memory or the like. Can do.

In addition, when the transistor described in Embodiment 1 or 2 is applied to the transistor Tr_1, a change in electric characteristics due to the operation of the transistor is small, so that a highly reliable semiconductor memory device can be obtained. .

Note that the transistor described in Embodiment 1 or 2 may be used as the transistor Tr_2.

As described above, according to one embodiment of the present invention, a semiconductor memory device with high long-term reliability, low power consumption, and high integration can be obtained.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 5)
A CPU (Central Processing Unit) can be formed using at least part of the transistor described in Embodiment 1 or 2 or the semiconductor memory device in Embodiment 5.

FIG. 13A is a block diagram illustrating a specific structure of a CPU. 13A includes an arithmetic circuit (ALU) 1191, an ALU controller 1192, an instruction decoder 1193, an interrupt controller 1194, a timing controller 1195, a register 1196, a register controller 1197, a bus, and the like. It has an interface (Bus I / F) 1198, a rewritable ROM 1199, and a ROM interface (ROM I / F) 1189. As the substrate 1190, a semiconductor substrate, an SOI substrate, a glass substrate, or the like is used. The ROM 1199 and the ROM interface 1189 may be provided in separate chips. Needless to say, the CPU illustrated in FIG. 13A is just an example in which the configuration is simplified, and an actual CPU may have various configurations depending on the application.

Instructions input to the CPU via the bus interface 1198 are input to the instruction decoder 1193, decoded, and then input to the ALU controller 1192, interrupt controller 1194, register controller 1197, and timing controller 1195.

The ALU controller 1192, interrupt controller 1194, register controller 1197, and timing controller 1195 perform various controls based on the decoded instructions. Specifically, the ALU controller 1192 generates a signal for controlling the operation of the ALU 1191. The interrupt controller 1194 determines and processes an interrupt request from an external input / output device or a peripheral circuit from the priority or mask state during execution of the CPU program. The register controller 1197 generates an address of the register 1196, and reads and writes the register 1196 according to the state of the CPU.

In addition, the timing controller 1195 generates a signal for controlling the operation timing of the ALU 1191, the ALU controller 1192, the instruction decoder 1193, the interrupt controller 1194, and the register controller 1197. For example, the timing controller 1195 includes an internal clock generation unit that generates an internal clock signal CLK2 based on the reference clock signal CLK1, and supplies the clock signal CLK2 to the various circuits.

In the CPU illustrated in FIG. 13A, a memory element is provided in the register 1196. As the memory element of the register 1196, the semiconductor memory device described in Embodiment 4 can be used.

In the CPU illustrated in FIG. 13A, the register controller 1197 performs a holding operation in the register 1196 in accordance with an instruction from the ALU 1191. That is, in the memory element included in the register 1196, data is held by a phase inversion element or data is held by a capacitor. When data is held by the phase inversion element, the power supply voltage is supplied to the storage element in the register 1196. When data is held by the capacitor, data is rewritten to the capacitor and supply of power supply voltage to the memory element in the register 1196 can be stopped.

The power supply is stopped by providing a switching element between the memory element group and the node to which the power supply potential VDD or the power supply potential VSS is applied, as shown in FIG. 13B or 13C. Can do. The circuits in FIGS. 13B and 13C will be described below.

FIG. 13B and FIG. 13C illustrate an example of a structure in which the transistor described in Embodiment 1 or 2 is used for a switching element that controls supply of a power supply potential to a memory element.

A memory device illustrated in FIG. 13B includes a switching element 1141 and a memory element group 1143 including a plurality of memory elements 1142. Specifically, the semiconductor memory device described in Embodiment 4 can be used for each memory element 1142. A high-level power supply potential VDD is supplied to each memory element 1142 included in the memory element group 1143 through the switching element 1141. Further, each memory element 1142 included in the memory element group 1143 is supplied with the potential of the signal IN and the low-level power supply potential VSS.

In FIG. 13B, a transistor having a semiconductor with a wide band gap such as an oxide semiconductor in an active layer is used as the switching element 1141, and the switching of the transistor is controlled by a signal SigA applied to the gate of the transistor. .

Note that FIG. 13B illustrates a structure in which the switching element 1141 includes only one transistor; however, the present invention is not limited to this, and a plurality of transistors may be included. In the case where the switching element 1141 includes a plurality of transistors functioning as switching elements, the plurality of transistors may be connected in parallel, may be connected in series, or may be combined in series and parallel. May be connected.

FIG. 13C illustrates an example of a memory device in which a low-level power supply potential VSS is supplied to each memory element 1142 included in the memory element group 1143 through the switching element 1141. The switching element 1141 can control supply of the low-level power supply potential VSS to each memory element 1142 included in the memory element group 1143.

A switching element is provided between the memory element group and a node to which the power supply potential VDD or the power supply potential VSS is applied, temporarily stopping the operation of the CPU and retaining data even when the supply of the power supply voltage is stopped. It is possible to reduce power consumption. For example, even when the user of the personal computer stops inputting information to an input device such as a keyboard, the operation of the CPU can be stopped, thereby reducing power consumption.

Here, the CPU has been described as an example, but the present invention can also be applied to LSIs such as a DSP (Digital Signal Processor), a custom LSI, and an FPGA (Field Programmable Gate Array).

This embodiment can be implemented in combination with any of the above embodiments as appropriate.

(Embodiment 6)
In this embodiment, examples of electronic devices to which at least one of Embodiments 1 to 5 is applied will be described.

FIG. 14A illustrates a portable information terminal. A portable information terminal illustrated in FIG. 14A includes a housing 9300, a button 9301, a microphone 9302, a display portion 9303, a speaker 9304, and a camera 9305, and functions as a portable phone. Have. One embodiment of the present invention can be applied to the display portion 9303 and the camera 9305. Although not illustrated, one embodiment of the present invention can also be applied to an arithmetic device, a wireless circuit, or a memory circuit in the main body.

FIG. 14B shows a display. A display illustrated in FIG. 14B includes a housing 9310 and a display portion 9311. One embodiment of the present invention can be applied to the display portion 9311. By applying one embodiment of the present invention, a display with high display quality can be obtained even when the size of the display portion 9311 is increased.

FIG. 14C illustrates a digital still camera. A digital still camera illustrated in FIG. 14C includes a housing 9320, a button 9321, a microphone 9322, and a display portion 9323. One embodiment of the present invention can be applied to the display portion 9323. Although not illustrated, one embodiment of the present invention can also be applied to a memory circuit or an image sensor.

FIG. 14D illustrates a portable information terminal that can be folded. A portable information terminal that can be folded in FIG. 14D includes a housing 9630, a display portion 9631a, a display portion 9631b, a fastener 9633, and an operation switch 9638. One embodiment of the present invention can be applied to the display portion 9631a and the display portion 9631b. Although not illustrated, one embodiment of the present invention can also be applied to an arithmetic device, a wireless circuit, or a memory circuit in the main body.

Note that part or all of the display portion 9631a and / or the display portion 9631b can be a touch panel, and data can be input by touching displayed operation keys.

With the use of the semiconductor device according to one embodiment of the present invention, the performance of the electronic device can be improved and the reliability can be increased.

This embodiment can be combined with any of the other embodiments as appropriate.

In this example, TDS was used and degassing evaluation of a sample having an insulating film was performed.

For degassing evaluation, a temperature-programmed desorption analyzer EMD-WA1000S / W manufactured by Electronic Science Co., Ltd. was used.

A method for manufacturing the sample is described below.

First, a silicon wafer was prepared, and a thermal oxide film was formed on the silicon wafer. The thermal oxide film was formed in an oxygen atmosphere containing 3% HCl at a temperature of 950 ° C. and had a thickness of 100 nm.

Next, a silicon oxide film was formed as an insulating film on the thermal oxide film. Alternatively, a silicon oxide film is formed over the thermal oxide film, and an aluminum oxide film is formed over the silicon oxide film.

The silicon oxide film was formed by a sputtering method. Specifically, using a silicon oxide target, the pressure is controlled to 0.4 Pa in an atmosphere containing 50 sccm of oxygen, the substrate heating temperature during film formation is 100 ° C., the film formation power is 2 kW (13.56 MHz), and 300 nm. The film was formed with a thickness of.

The aluminum oxide film was formed by a sputtering method. Specifically, using an aluminum oxide target, in an atmosphere containing 25 sccm of argon and 25 sccm of oxygen, the pressure is controlled to 0.4 Pa, the substrate heating temperature during film formation is 250 ° C., and the film formation power is 2.5 kW ( The film was formed with a thickness of 10 nm.

Next, degassing of each sample was evaluated.

A TDS spectrum with an M / z of 32 is shown in FIG. Here, FIG. 8A shows a TDS spectrum of a sample using a silicon oxide film as an insulating film. FIG. 8B shows a TDS spectrum of a sample using a silicon oxide film and an aluminum oxide film as insulating films.

From the TDS spectrum of the sample using a silicon oxide film as the insulating film shown in FIG. 8A, degassing with an M / z of 32 in the range of the substrate temperature of 200 ° C. to 400 ° C. was confirmed. The outgas amount was 5.0 × 10 ²⁰ atoms / cm ³ in terms of oxygen atoms.

On the other hand, from the TDS spectrum of the sample using a silicon oxide film and an aluminum oxide film as the insulating film shown in FIG. 8B, degassing with a substrate temperature of 100 ° C. to 500 ° C. and an M / z of 32 was confirmed. There wasn't.

This example shows that the silicon oxide film releases oxygen by heat treatment at 200 ° C. to 400 ° C. It can also be seen that by providing an aluminum oxide film over the silicon oxide film, oxygen is not released even when heat treatment is performed.

In this example, the specific resistance and carrier density of the oxide semiconductor film provided over the base insulating film were evaluated by Hall effect measurement.

The Hall effect measurement used ResiTest 8300 series manufactured by Toyo Corporation.

A method for manufacturing the sample is described below.

First, a glass substrate was prepared, and a base insulating film was formed on the glass substrate. The material of the base insulating film was an aluminum oxide film or a silicon oxide film.

The aluminum oxide film was formed by a sputtering method. Specifically, using an aluminum oxide target, in an atmosphere containing 25 sccm of argon and 25 sccm of oxygen, the pressure is controlled to 0.4 Pa, the substrate heating temperature during film formation is 250 ° C., and the film formation power is 2.5 kW ( The film was formed with a thickness of 100 nm.

The silicon oxide film was formed by a sputtering method. Specifically, a silicon oxide target is used, the pressure is controlled to 0.4 Pa in an atmosphere containing 25 sccm of argon and 25 sccm of oxygen, the substrate heating temperature during film formation is 100 ° C., and the film formation power is 2 kW (13. The film was formed with a thickness of 300 nm.

Next, an oxide semiconductor film was formed over the base insulating film.

The oxide semiconductor film was formed by a sputtering method. Specifically, using an In—Ga—Zn—O (In: Ga: Zn = 1: 1: 1 [atomic ratio]) target and controlling the pressure to 0.4 Pa in an atmosphere containing 45 sccm of oxygen, The substrate was heated at a deposition temperature of 400 ° C. and the deposition power was 500 W (DC) to form a film with a thickness of 30 nm.

Next, each substrate was divided into a size of 10 mm × 10 mm.

Next, the divided substrate was subjected to heat treatment at a temperature of 250 ° C., 275 ° C., 300 ° C., 325 ° C., 350 ° C., 375 ° C., or 450 ° C. for 1 hour in a nitrogen gas atmosphere.

Next, specific resistance and carrier density of each sample were evaluated by Hall effect measurement.

The results are shown in FIG. Here, the Hall effect measurement result of the sample using the aluminum oxide film as the base insulating film is indicated by a black circle symbol. In addition, the Hall effect measurement result of a sample using a silicon oxide film as a base insulating film is indicated by a white triangle symbol. 9A shows the relationship between the temperature of heat treatment and the specific resistance value, and FIG. 9B shows the relationship between the temperature of heat treatment and the carrier density.

From FIG. 9A, when the temperature of the heat treatment is in the range of 250 ° C. to 300 ° C., the difference in specific resistance value between the sample using the aluminum oxide film as the base insulating film and the sample using the silicon oxide film. Was hardly seen, indicating a low value. On the other hand, when the temperature of the heat treatment is in the range of 325 ° C. to 375 ° C., the sample using the aluminum oxide film as the base insulating film has a lower resistance than the sample using the silicon oxide film.

9B, in the range where the temperature of the heat treatment is in the range of 250 ° C. to 300 ° C., the carrier density is between the sample using the aluminum oxide film and the sample using the silicon oxide film as the base insulating film. Almost no difference was seen, indicating a high value. On the other hand, when the temperature of the heat treatment is in the range of 325 ° C. to 375 ° C., the sample using the aluminum oxide film as the base insulating film showed higher carrier density than the sample using the silicon oxide film.

Therefore, it can be seen that a region having a low carrier density and a region having a low specific resistance can be formed at the same time by separately forming the base insulating film.

That is, when this embodiment is applied to a transistor including an oxide semiconductor film, a silicon oxide film is provided below the channel region, and an aluminum oxide film is provided below the source region and the drain region. It can be seen that if heat treatment is performed at a temperature of less than or equal to ° C., the carrier density in the channel region is low and the increase in resistance of the source and drain regions can be suppressed.

100 Substrate 102 Base insulating film 103 Insulating film 103a Insulating film 103b Insulating film 104 Gate electrode 106 Oxide semiconductor film 106a First region 106b Second region 106c Third region 107 Buffer layer 107a Buffer layer 107b Buffer layer 112 Gate insulation Film 113 gate insulating film 116a wiring 116b wiring 118 interlayer insulating film 136 oxide semiconductor film 200 substrate 202 base insulating film 203a insulating film 203b insulating film 204 gate electrode 206 oxide semiconductor film 206a first region 206b second region 206c second 3 region 207a buffer layer 207b buffer layer 212 gate insulating film 213 gate insulating film 216a wiring 216b wiring 218 interlayer insulating film 232 base insulating film 233 insulating film 236 oxide semiconductor film 237 buffer layer 1141 switch Storage element 1143 Storage element group 1189 ROM interface 1190 Substrate 1191 ALU
1192 ALU Controller 1193 Instruction Decoder 1194 Interrupt Controller 1195 Timing Controller 1196 Register 1197 Register Controller 1198 Bus Interface 1199 ROM
2200 pixel 2210 liquid crystal element 2220 capacitor 2230 transistor 9300 case 9301 button 9302 microphone 9303 display unit 9304 speaker 9305 camera 9310 case 9311 display unit 9320 case 9321 button 9322 microphone 9323 display unit 9630 case 9631a display unit 9631b display unit 9633 9638 Operation switch

Claims (4)

A first insulating film;
A first groove of the first insulating film;
A second groove of the first insulating film;
A second insulating film and a first conductive film in the first groove;
A third insulating film and a second conductive film in the second groove;
An oxide semiconductor film over the first conductive film, the first insulating film, and the second conductive film;
A gate insulating film on the oxide semiconductor film;
A gate electrode on the gate insulating film,
The second insulating film has a region in contact with a bottom surface and a side surface of the first groove;
The second insulating film has a shape of a third groove along the first groove,
The first conductive film is in the third groove;
The surface of the first conductive film has the same position as the surface of the second insulating film,
The surface of the second insulating film has the same position as the surface of the first insulating film,
The third insulating film has a region in contact with a bottom and a side surface of the second groove;
The third insulating film has a shape of a fourth groove along the second groove;
The second conductive film is in the fourth groove,
The surface of the second conductive film has the same position as the surface of the third insulating film,
The surface of the third insulating film has the same position as the surface of the first insulating film;
The first insulating film has a function of releasing oxygen by heat treatment at 250 ° C. or higher and 450 ° C. or lower;
The second insulating film does not have a function of releasing the oxygen by heat treatment at 250 ° C. or higher and 450 ° C. or lower,
The third insulating film does not have a function of releasing the oxygen by heat treatment at 250 ° C. or higher and 450 ° C. or lower,
The second insulating film does not have silicon,
The third insulating film does not have silicon,
The oxide semiconductor film has a first region, a second region, and a third region,
The first conductive film is electrically connected to the first region;
The second conductive film is electrically connected to the third region;
The second region overlaps the gate electrode;
The second region functions as a channel formation region,
A first wiring electrically connected to the first region;
A semiconductor device comprising a second wiring electrically connected to the second region. A first insulating film;
A first groove of the first insulating film;
A second groove of the first insulating film;
A second insulating film and a first conductive film in the first groove;
A third insulating film and a second conductive film in the second groove;
An oxide semiconductor film over the first conductive film, the first insulating film, and the second conductive film;
A gate insulating film on the oxide semiconductor film;
A gate electrode on the gate insulating film,
The second insulating film has a region in contact with a bottom surface and a side surface of the first groove;
The second insulating film has a shape of a third groove along the first groove,
The first conductive film is in the third groove;
The surface of the first conductive film has the same position as the surface of the second insulating film,
The surface of the second insulating film has the same position as the surface of the first insulating film,
The third insulating film has a region in contact with a bottom and a side surface of the second groove;
The third insulating film has a shape of a fourth groove along the second groove;
The second conductive film is in the fourth groove,
The surface of the second conductive film has the same position as the surface of the third insulating film,
The surface of the third insulating film has the same position as the surface of the first insulating film;
The first insulating film has a function of releasing oxygen by heat treatment at 250 ° C. or higher and 450 ° C. or lower;
The second insulating film does not have a function of releasing the oxygen by the heat treatment,
The third insulating film does not have a function of releasing the oxygen by the heat treatment,
The silicon concentration of the second insulating film is less than 0.1 atomic%;
The silicon concentration of the third insulating film is less than 0.1 atomic%;
The oxide semiconductor film has a first region, a second region, and a third region,
The first conductive film is electrically connected to the first region;
The second conductive film is electrically connected to the third region;
The second region overlaps the gate electrode;
The second region functions as a channel formation region,
A first wiring electrically connected to the first region;
A semiconductor device comprising a second wiring electrically connected to the second region. In claim 1 or claim 2 ,
The second insulating film and the third insulating film each include one or more of aluminum oxide, gallium oxide, zirconium oxide, hafnium oxide, yttrium oxide, lanthanum oxide, and aluminum nitride. apparatus. In any one of Claims 1 to 3 ,
The semiconductor device, wherein the first conductive film and the second conductive film are oxide films containing In and Zn, respectively .

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