JP5821293B2 - Optical filter, optical filter module, optical analyzer, and optical filter manufacturing method - Google Patents

Description

  The present invention relates to an optical filter, an optical filter module, an optical analyzer, and an optical filter manufacturing method.

An optical filter that extracts light having a specific wavelength from light having a plurality of wavelengths is known. An example of the optical filter is a wavelength variable interference filter.
The wavelength tunable interference filter arranges reflective films (optical films) formed on two substrates facing each other, and changes the gap dimension between the reflective films using an electrostatic actuator, etc., and emits light of a wavelength according to the gap dimension. An optical filter configured to transmit light.
For example, the deformable mirror disclosed in Patent Document 1 discloses a structure in which an intermediate member such as an Au bump is used for electrical conduction between an opposing mirror substrate and a wiring substrate. In this way, a structure that enables connection from the wiring board to the outside is provided.

JP 2008-261951 A

  However, in the deformable mirror described in Patent Document 1, it is necessary to provide an intermediate member such as an Au bump for electrical connection between the mirror substrate and the wiring substrate. Further, it is necessary to join the wiring board and the intermediate member, and the intermediate member and the mirror board, and there is a problem that the opposing boards cannot be easily connected.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
An optical filter of one embodiment of the present invention includes a first substrate, a second substrate facing the first substrate, a first reflective film formed on a surface of the first substrate facing the second substrate, A second reflective film provided on the second substrate and facing the first reflective film via a gap; a first drive electrode provided on a surface of the first substrate facing the second substrate; A second drive electrode provided on the second substrate and facing the first drive electrode; a first connection electrode provided on the first substrate; and a second connection electrode provided on the second substrate, Formed in a position opposite to the portion, and is formed in the thin portion connected to the second drive electrode and opposed to the first connection electrode. The thin portion has flexibility in the thickness direction of the second substrate. A second connection electrode, wherein the first substrate and the second substrate are bonded to each other, and the first connection electrode Wherein said formed thin portion and the second connection electrode, wherein the thin portion is connected in a state of being deformed in a direction toward the first substrate and.

  Application Example 1 An optical filter according to this application example includes a first substrate, a second substrate facing the first substrate, and a first surface formed on a surface of the first substrate facing the second substrate. A reflective film, a second reflective film provided on the second substrate and facing the first reflective film via a gap, and a first drive provided on a surface of the first substrate facing the second substrate An electrode, a second drive electrode provided on the second substrate and facing the first drive electrode, a first connection electrode provided on the first substrate, and provided on the second substrate, A thin-walled portion formed at a position facing a part of the connection electrode and having flexibility in the thickness direction of the second substrate, connected to the second drive electrode, and opposed to the first connection electrode A second connection electrode formed on the portion, wherein the first substrate and the second substrate are joined together, And the second connection electrode formed on the thin portion and the first connection electrode is characterized in that it is connected.

  According to this configuration, the first connection electrode of the first substrate and the second connection electrode formed on the thin portion of the second substrate are connected. Since the thin portion formed on the second substrate is flexible in the thickness direction of the second substrate, electrical connection between the first substrate and the second substrate can be facilitated without using an intermediate member.

  Application Example 2 In the optical filter according to the application example described above, the thin-walled portion is provided with a circular recess in a plan view on a surface opposite to the surface facing the first substrate of the second substrate. It is preferable that the thin portion having a thickness between a bottom surface of the second substrate and a surface of the second substrate facing the first substrate is formed.

  According to this configuration, the thin portion is formed by providing the concave portion on the surface of the second substrate opposite to the surface facing the first substrate. That is, the thin portion can be formed at a position close to the first connection electrode of the first substrate. Further, since the thin portion is circular in plan view, it is easily deformed in the thickness direction of the second substrate, and the second connection electrode formed on the thin portion and the first connection electrode of the first substrate are easily connected. it can.

  Application Example 3 In the optical filter according to the application example, the first connection electrode and the second connection electrode are connected in a state where the thin portion is deformed in a direction approaching the first substrate. Is preferred.

  According to this configuration, in the state before the first connection electrode and the second connection electrode are connected, there is a gap between them, so that the electrode film necessary for the connection between the first connection electrode and the second connection electrode Thickness can be set and reliable connection is possible.

  Application Example 4 In the optical filter according to the application example, it is preferable that the first connection electrode is provided on a protrusion protruding in the thickness direction of the first substrate.

  According to this configuration, the first connection electrode is provided on the protrusion protruding in the thickness direction of the first substrate. Accordingly, the distance between the first connection electrode and the second connection electrode is shortened, the deformation amount of the thin portion is small, and the first connection electrode and the second connection electrode can be easily connected. In addition, the reaction force after the connection between the first connection electrode and the second connection electrode (the force that peels off the connection between the first connection electrode and the second connection electrode) is reduced, and no stress is applied to the optical filter.

  Application Example 5 An optical filter module according to this application example is formed on a first substrate, a second substrate facing the first substrate, and a surface of the first substrate facing the second substrate. A first reflective film, a second reflective film provided on the second substrate and facing the first reflective film via a gap, and a first surface provided on a surface of the first substrate facing the second substrate; A drive electrode; a second drive electrode provided on the second substrate and facing the first drive electrode; a first connection electrode provided on the first substrate; provided on the second substrate; A thin portion formed at a position facing a part of one connection electrode, a second connection electrode connected to the second drive electrode and formed at the thin portion facing the first connection electrode, A light receiving portion that receives light transmitted through the first reflective film or the second reflective film, and A first connection electrode and the second connection electrode formed on the thin portion, characterized in that it is connected.

  The optical filter module of this application example can electrically connect the first substrate and the second substrate without using an intermediate member. Thus, the first connection electrode of the first substrate and the second connection electrode of the second substrate can be connected with a simple structure, which can contribute to simplification of the structure of the optical filter module.

  Application Example 6 An optical analyzer according to this application example is formed on a first substrate, a second substrate facing the first substrate, and a surface of the first substrate facing the second substrate. A first reflective film, a second reflective film provided on the second substrate and facing the first reflective film via a gap, and a first surface provided on a surface of the first substrate facing the second substrate; A drive electrode; a second drive electrode provided on the second substrate and facing the first drive electrode; a first connection electrode provided on the first substrate; provided on the second substrate; A thin portion formed at a position facing a part of one connection electrode, a second connection electrode connected to the second drive electrode and formed at the thin portion facing the first connection electrode, A light receiving unit that receives light transmitted through the first reflective film or the second reflective film, and a signal obtained from the light receiving unit; And a analysis processor for analyzing optical properties of the light on the basis of the said first formed in the connection electrode and the thin-walled portion the second connection electrode is characterized in that it is connected.

  The optical analyzer according to this application example can electrically connect the first substrate and the second substrate without using an intermediate member. Thus, the first connection electrode of the first substrate and the second connection electrode of the second substrate can be connected with a simple structure, which can contribute to simplification of the structure of the optical analyzer.

  Application Example 7 An optical filter manufacturing method according to this application example includes an electrode forming part forming step of forming an electrode forming part by etching a first substrate, and a first drive electrode and a first connection electrode in the electrode forming part. Forming a first reflective film on the first substrate, and forming a thin portion at a position facing the first connection electrode by etching the second substrate. Forming a thin portion, forming a second drive electrode on the second substrate, and forming a second connection electrode at a position connected to the second drive electrode and facing the first connection electrode of the thin portion. A two-electrode forming step, a second reflecting film forming step for forming a second reflecting film on the second substrate, a joining step for joining the first substrate and the second substrate, and applying an external force to the thin portion. In addition, the first connection electrode of the first substrate and the second contact of the second substrate. Characterized in that it comprises a connecting step of connecting the electrodes.

  According to this manufacturing method, an external force is applied to the thin portion to connect the first connection electrode of the first substrate and the second connection electrode of the second substrate. For this reason, the first substrate and the second substrate can be electrically connected without using an intermediate member. And since the thin part formed in the 2nd board | substrate is easy to deform | transform, connection is easy.

  Application Example 8 In the method for manufacturing an optical filter according to the application example, the connection step heats the first connection electrode and the second connection electrode and applies an external force to apply the first connection electrode and the second connection. It is preferable to bond the electrodes to each other.

  According to this manufacturing method, the first connection electrode and the second connection electrode are heated, and an external force is applied to bring them into contact with each other, whereby metal-to-metal bonding can be performed between the electrodes. And the reliable connection with high reliability with a 1st connection electrode and a 2nd connection electrode can be performed by metal bonding.

  Application Example 9 In the method of manufacturing an optical filter according to the application example, the connection step includes applying an external force after subjecting the surfaces of the first connection electrode and the second connection electrode to surface activation treatment, and thereby applying the first connection electrode. It is preferable to bond the second connection electrode to the second metal.

  According to this manufacturing method, the surfaces of the first connection electrode and the second connection electrode are subjected to surface activation treatment and brought into contact with each other, whereby metal-to-metal bonding can be performed between the electrodes at room temperature. And the reliable connection with high reliability with a 1st connection electrode and a 2nd connection electrode can be performed by metal bonding.

  Application Example 10 In the method for manufacturing an optical filter according to the application example, it is preferable that the first connection electrode, the first reflection film, the second connection electrode, and the second reflection film are made of the same metal material.

  According to this manufacturing method, the first connection electrode and the first reflection film formed on the first substrate are formed of the same metal material, and the second connection electrode and the second reflection film formed on the second substrate are the same metal. Form with material. Therefore, in the production of the first substrate or the second substrate, the first connection electrode and the first reflection film or the second connection electrode and the second reflection film can be formed in the same process, and the optical filter can be efficiently formed. Can be manufactured.

  Application Example 11 In the method for manufacturing an optical filter according to the application example, it is preferable that the metal material is Ag or an Ag alloy.

  According to this manufacturing method, the first connection electrode, the first reflection film, the second connection electrode, and the second reflection film are formed of Ag or an Ag alloy. This Ag or Ag alloy is a good material as a material for the reflective film, and is also a good material with low resistance as a material for the wiring. Therefore, according to this application example, an optical filter having excellent characteristics can be provided.

1 is a block diagram illustrating a configuration of a color measurement device according to a first embodiment. The top view which shows the structure of the etalon in 1st Embodiment. Sectional drawing which shows the structure of the etalon in 1st Embodiment. Sectional drawing which shows the structure of the etalon in 1st Embodiment. The top view which shows the structure of the fixed board | substrate in 1st Embodiment. The top view which shows the structure of the movable substrate in 1st Embodiment. Sectional drawing explaining the manufacturing process of the etalon in 1st Embodiment (the 1). Sectional drawing explaining the manufacturing process of the etalon in 1st Embodiment (the 2). Sectional drawing explaining the manufacturing process of the etalon in 1st Embodiment (the 3). Sectional drawing explaining the manufacturing process of the etalon in 1st Embodiment (the 4). Sectional drawing explaining the manufacturing process of the etalon in 1st Embodiment (the 5). Sectional drawing of the etalon which shows the modification in 1st Embodiment. Sectional drawing which shows the structure of the etalon in 2nd Embodiment. The top view which shows the structure of the fixed board | substrate in 2nd Embodiment. Sectional drawing of the etalon which shows the modification in 2nd Embodiment. Sectional drawing which shows the structure of the gas detection apparatus as an optical analyzer in 3rd Embodiment. The circuit block diagram of the gas detection apparatus in 3rd Embodiment. The block diagram which shows the structure of the food analyzer as an optical analyzer in 4th Embodiment. The perspective view which shows the structure of the spectroscopic camera as an optical analyzer in 5th Embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. In each drawing used in the following description, in order to make each member a recognizable size, a schematic configuration is shown by appropriately changing the ratio of dimensions of each member.
(First embodiment)

Hereinafter, a first embodiment according to the present invention will be described with reference to the drawings.
<Schematic configuration of the color measuring device>
FIG. 1 is a block diagram showing the configuration of a color measuring device as an optical analyzer.
The color measurement device 1 includes a light source device 2 that irradiates light to the inspection object A, a color measurement sensor 3 (light filter module), and a control device 4 that controls the overall operation of the color measurement device 1.
The color measurement device 1 irradiates the inspection target A with light from the light source device 2, receives the inspection target light reflected from the inspection target A with the color measurement sensor 3, and outputs a detection signal output from the color measurement sensor 3. This is a device for analyzing and measuring the chromaticity of the inspection target light.

<Configuration of light source device>
The light source device 2 includes a light source 21 and a plurality of lenses 22 (only one is shown in FIG. 1), and emits white light to the inspection target A. In addition, the plurality of lenses 22 may include a collimator lens. In this case, the light source device 2 converts the light emitted from the light source 21 into parallel light by the collimator lens, and performs inspection from a projection lens (not shown). Inject toward A.
In the present embodiment, the color measurement device 1 including the light source device 2 is illustrated. However, for example, when the inspection target A is a light emitting member, the color measurement device may be configured without providing the light source device 2.

<Configuration of colorimetric sensor>
The colorimetric sensor 3 as an optical filter module includes an etalon (variable wavelength interference filter) 5, a voltage controller 32 that controls the voltage applied to the electrostatic actuator and changes the wavelength of light transmitted through the etalon 5, and the etalon 5. A light receiving unit 31 that receives light transmitted through the light receiving unit.
The colorimetric sensor 3 also includes an optical lens (not shown) that guides the reflected light (inspection light) reflected by the inspection object A to the etalon 5. The colorimetric sensor 3 splits the inspection target light incident on the optical lens into light of a predetermined wavelength band by the etalon 5, and the split light is received by the light receiving unit 31.
The light receiving unit 31 includes a photoelectric conversion element such as a photodiode, and generates an electric signal corresponding to the amount of received light. The light receiving unit 31 is connected to the control device 4 and outputs the generated electrical signal to the control device 4 as a light reception signal.

(Composition of etalon)
FIG. 2 is a plan view showing the configuration of the etalon, and FIG. 3 is a cross-sectional view taken along the line AA in FIG. 4 is a cross-sectional view taken along the line BB in FIG.
As shown in FIG. 2, the etalon 5 as an optical filter is a plate-like optical member having a square shape in plan view, and one side is formed, for example, at 10 mm. As shown in FIGS. 3 and 4, the etalon 5 includes a fixed substrate (first substrate) 51 and a movable substrate (second substrate) 52.
Each of these substrates 51 and 52 is made of, for example, various glasses such as soda glass, crystalline glass, quartz glass, lead glass, potassium glass, borosilicate glass and non-alkali glass, or a base material such as crystal, and is in the form of a plate. It is formed by etching the substrate.
The etalon 5 is integrally formed by bonding a fixed substrate 51 and a movable substrate 52 with a bonding film 53. The bonding film 53 is a plasma polymerized film using polyorganosiloxane.

  Between the fixed substrate 51 and the movable substrate 52, a first reflective film 54 and a second reflective film 55 having light reflection characteristics and transmission characteristics are provided. Here, the first reflective film 54 is fixed to the surface of the fixed substrate 51 facing the movable substrate 52, and the second reflective film 55 is fixed to the surface of the movable substrate 52 facing the fixed substrate 51. Further, the first reflective film 54 and the second reflective film 55 are arranged to face each other with a gap interposed therebetween.

Further, an electrostatic actuator 56 is provided between the fixed substrate 51 and the movable substrate 52 to adjust the gap dimension between the first reflective film 54 and the second reflective film 55.
The electrostatic actuator 56 includes a first drive electrode 561 provided on the fixed substrate 51 and a second drive electrode 562 provided on the movable substrate 52.

  The etalon 5 is formed such that the distance between the first drive electrode 561 and the second drive electrode 562 is greater than the distance between the first reflective film 54 and the second reflective film 55. For example, in an initial state where no voltage is applied between the first drive electrode 561 and the second drive electrode 562, the distance between the first drive electrode 561 and the second drive electrode 562 is 2 μm, and the first reflective film 54 and the second reflective film The distance (gap size) from the film 55 is set to 0.5 μm. Therefore, the pull-in phenomenon in which the pulling force increases rapidly when the gap size between the first drive electrode 561 and the second drive electrode 562 becomes small can be suppressed.

As shown in FIGS. 2 and 4, the movable substrate 52 is provided with a second connection electrode 572 connected to the second drive electrode 562. A part of the second connection electrode 572 is provided in a thin portion 582 formed on the movable substrate 52.
The fixed substrate 51 is provided with electrode pads 564P that are connected to the outside, and the first connection electrodes 571 are connected to the electrode pads 564P.
Then, the thin portion 582 is deformed toward the fixed substrate 51, and the second connection electrode 572 and the first connection electrode 571 are bonded to each other between metals, thereby enabling electrical connection between the fixed substrate 51 and the movable substrate 52. Yes. In this way, a structure that enables connection to the outside from the fixed substrate 51 that is one of the substrates is obtained.

Next, in order to understand the configuration of the etalon 5, the configuration of the fixed substrate 51 and the movable substrate 52 will be described in detail.
(Configuration of fixed substrate)
FIG. 5 is a plan view showing the configuration of the fixed substrate, and is a view of the surface facing the movable substrate.
The fixed substrate 51 is formed by etching a quartz glass substrate having a thickness of, for example, 500 μm. The fixed substrate 51 is provided with a circular recess centered on the center of the fixed substrate 51 by etching, and an electrode forming portion 511 and a reflective film forming portion 512 are formed.
The electrode forming portion 511 is etched deeper than the reflecting film forming portion 512, and the cylindrical reflecting film forming portion 512 protrudes, and the electrode forming portion 511 is formed concentrically around the protruding portion (see FIGS. 3 and 4). .

A circular first reflection film 54 is formed on the reflection film forming portion 512, and the first reflection film 54 is formed with a thickness of about 100 nm by a metal film such as Ag or an Ag alloy. The first reflective film 54 may have a structure in which an AgC alloy, an Ag alloy, or the like is laminated on a dielectric film such as an AgC alloy or TiO ₂ .

  An annular first drive electrode 561 is formed on the electrode forming portion 511. The first drive electrode 561 is a conductive film, for example, an ITO (Indium Tin Oxide) film. The first drive electrode 561 may be a Cr / Au film having a Cr film as a base and an Au film stacked thereon. The thickness of the first drive electrode 561 is formed to be about 50 nm.

  Further, a groove extends from the outer peripheral edge of the electrode forming portion 511 toward the vertices C1 and C2 at the diagonal positions of the fixed substrate 51. A conductive electrode 563 connected to the first drive electrode 561 is formed in the groove toward the vertex C1. An electrode pad 563P that is connected to the outside and is connected to the outside is formed at a corner portion of the fixed substrate 51 having the vertex C1.

An electrode pad 564P that is connected to the outside is also formed on the apex C2 side of the fixed substrate 51. A first connection electrode 571 that is not connected to the first drive electrode 561 is formed in the groove toward the vertex C2. The first connection electrode 571 is connected to the electrode pad 564P.
Note that the groove in which the conductive electrode 563, the electrode pad 563P, the first connection electrode 571, and the electrode pad 564P are provided is formed to the same depth as the electrode formation portion 511 by etching.

  The conductive electrode 563, the electrode pad 563P, and the electrode pad 564P are formed of, for example, an ITO film made of a conductive material. The first connection electrode 571 is formed of a metal film, for example, a Cr / Au film. As the first connection electrode 571, an Ag film, an Ag alloy film, an Al film, or the like may be used in addition to the Cr / Au film.

In the fixed substrate 51, a planar portion excluding a groove extending from the electrode forming portion 511, the reflective film forming portion 512, and the electrode forming portion 511 serves as a bonding surface 515 bonded to the movable substrate 52.
A bonding film 53 using polyorganosiloxane as a main material is provided on the bonding surface 515. The bonding film 53 is a plasma polymerized film formed by CVD (Chemical Vapor Deposition) or the like.

(Configuration of movable substrate)
FIG. 6 is a plan view showing the configuration of the movable substrate, and is a view of the surface facing the fixed substrate.
The movable substrate 52 is formed by processing one surface of a quartz glass substrate having a thickness of, for example, 200 μm by etching.
Cutout portions 526 are formed at two corners that are diagonal of the four corners of the movable substrate 52. The notch 526 is formed at a position corresponding to the electrode pads 563P and 564P of the fixed substrate 51.
The movable substrate 52 is formed with a cylindrical movable portion 522 centered on the center of the substrate, and a connection holding portion 523 that holds the movable portion 522 concentrically around the movable portion 522.
The connection holding part 523 is formed so that an annular groove is formed on the surface opposite to the surface facing the fixed substrate 51 so as to be thinner than the thickness of the movable part 522 (see FIGS. 3 and 4).
Thus, the movable substrate 52 has a diaphragm structure, and the movable portion 522 is configured to easily move in the thickness direction of the movable substrate 52.

Further, a circular recess 581 is formed between the connection holding portion 523 and one notch 526 (see FIG. 2). The concave portion 581 is formed on the surface opposite to the surface facing the fixed substrate 51, similarly to the connection holding portion 523. The bottom portion of the concave portion 581 is formed to the same depth as the connection holding portion 523, and a thin portion 582 that is thin relative to the thickness of the movable substrate 52 is formed. The thin portion 582 has flexibility with respect to the thickness direction of the movable substrate 52.
Since the thin portion 582 is formed by the circular concave portion 581, it is circular in this embodiment, but is not limited to this shape, and may be any shape such as a rectangle or a polygon. If the shape of the thin portion 582 is circular, when the thin portion 582 is deformed, the stress at the boundary surface becomes uniform and the thin portion 582 is easily deformed. Further, stress concentration due to the deformation of the thin portion 582 does not occur, and the thin portion 582 can be prevented from being damaged.
The position where the thin portion 582 is formed is formed at a position overlapping with a part of the first connection electrode 571 of the fixed substrate 51 when the plane is seen through in an alignment state where the fixed substrate 51 and the movable substrate 52 are joined.

Thus, the surface of the movable substrate 52 that faces the fixed substrate 51 uses the flat surface of the base material and does not have an etched surface. A second reflection film 55 and a second drive electrode 562 formed on the connection holding portion 523 are provided so as to surround the second reflection film 55 at the center of the movable substrate 52. Note that the second drive electrode 562 may be provided on the movable portion 522.
Ag or an Ag alloy is used as the material of the second reflective film 55, but an AgC alloy, an Ag alloy, or the like may be laminated on a dielectric film such as an AgC alloy or TiO ₂ . The second reflective film 55 is formed with a thickness of about 100 nm.
The second drive electrode 562 is a conductive film, and an ITO film, for example, is used similarly to the first drive electrode.

A second connection electrode 572 is formed on the movable substrate 52 from the second drive electrode 562 through the thin portion 582 toward the cutout portion 526.
The second connection electrode 572 is formed of a metal film, for example, a Cr / Au film. The second connection electrode 572 may use an Ag film, an Ag alloy film, an Al film, or the like in addition to the Cr / Au film.

The portion of the fixed substrate 51 that faces the bonding surface 515 becomes the bonding surface of the movable substrate 52.
This bonding surface is provided with a bonding film using polyorganosiloxane as a main material. A plasma polymerization film formed by CVD or the like is employed as the bonding film.

In this embodiment, the thin portion is formed by providing a recess on the surface opposite to the surface facing the fixed substrate. However, the thin portion may be formed by providing a recess on the surface facing the fixed substrate. Furthermore, a thin part may be formed by providing recesses from both sides.
In this embodiment, the thin portion is formed on the movable substrate. However, the thin portion may be provided on the fixed substrate, and the thin portion may be formed on both substrates.

(Connection between etalon and voltage controller)
Returning to FIGS. 1 and 2, the voltage control unit 32 controls the voltage applied to the first drive electrode 561 and the second drive electrode 562 of the electrostatic actuator 56 based on the control signal input from the control device 4. To do.
In the connection between the etalon 5 and the voltage control unit 32, conductive wires connected to the voltage control unit 32 are connected to the two electrode pads 563P and the electrode pad 564P, respectively.
Here, the movable substrate 52 of the etalon 5 is formed with an electrode pad 563P and a notch 526 in which a position facing the electrode pad 564P is notched. For this reason, the electrode pads 563P and 564P are exposed, and the connection between the electrode pads 563P and 564P and the external wiring is easy.

<Configuration of control device>
The control device 4 controls the overall operation of the color measurement device 1. As the control device 4, for example, a general-purpose personal computer, a portable information terminal, other color measurement dedicated computer, or the like can be used.
As shown in FIG. 1, the control device 4 includes a light source control unit 41, a colorimetric sensor control unit 42, a colorimetric processing unit 43 (analysis processing unit), and the like.

The light source control unit 41 is connected to the light source device 2. Then, the light source control unit 41 outputs a predetermined control signal to the light source device 2 based on, for example, a user setting input, and causes the light source device 2 to emit white light with a predetermined brightness.
The colorimetric sensor control unit 42 is connected to the colorimetric sensor 3. The colorimetric sensor control unit 42 sets a wavelength of light received by the colorimetric sensor 3 based on, for example, a user's setting input, and outputs a control signal for detecting the amount of light received at this wavelength. Output to the colorimetric sensor 3. Thereby, the voltage control unit 32 of the colorimetric sensor 3 sets the voltage applied to the electrostatic actuator 56 so as to transmit the wavelength of light desired by the user based on the control signal.

  The colorimetric processing unit 43 controls the colorimetric sensor control unit 42 to change the gap dimension between the reflective films of the etalon 5 to change the wavelength of light transmitted through the etalon 5. The colorimetric processing unit 43 acquires the amount of light transmitted through the etalon 5 based on the light reception signal input from the light receiving unit 31. Then, the colorimetric processing unit 43 calculates the chromaticity of the light reflected from the inspection target A based on the received light amount of each wavelength obtained as described above.

<Method of manufacturing etalon>
Next, a method for producing the etalon will be described.
The etalon 5 is manufactured by manufacturing the fixed substrate 51 and the movable substrate 52 and bonding them together.

(Fixed substrate manufacturing process)
7 and 8 are cross-sectional views illustrating the manufacturing process of the fixed substrate. This sectional view corresponds to a section taken along the line BB in FIG.
As shown in FIG. 7A, a resist 61 is applied to the surface of the fixed substrate 51, and the resist in the portion to be etched is removed. Here, the patterning is performed so as to leave a portion where the reflective film is to be formed and a resist on the bonding surface (not shown).
Next, as shown in FIG. 7B, wet etching is performed for a predetermined time using the resist 61 as a mask, and then the resist 61 is peeled off. By this etching, an electrode forming portion 511 is formed, and an etching remaining portion 62 remains in a portion covered with the resist 61 (electrode forming portion forming step).
Then, a resist is applied again on the surface of the fixed substrate 51, the resist at the portion of the etching remaining portion 62 is removed, and wet etching is performed for a predetermined time, whereby a reflective film forming portion 512 as shown in FIG. Form.

Subsequently, an ITO film is formed on the surface of the fixed substrate 51 by sputtering or the like and patterned, and as shown in FIG. 8A, the first drive electrode 561, the conductive electrode 563, and the electrode pad 563P are formed on the electrode forming portion 511. 564P is formed.
Next, a Cr / Au film as a metal film is formed on the surface of the fixed substrate 51 by sputtering and patterned to form a first connection electrode 571 connected to the electrode pad 564P as shown in FIG. 8B. (First electrode forming step).
Then, an Ag alloy film is formed on the surface of the fixed substrate 51 by sputtering or the like and patterned to form a first reflective film 54 on the reflective film forming portion 512 (first reflection) as shown in FIG. Film formation step).
Although not shown, a plasma polymerization film is formed on the bonding surface to form a bonding film.
In this way, the fixed substrate 51 is manufactured through the above steps.

(Movable substrate manufacturing process)
9 and 10 are cross-sectional views illustrating the manufacturing process of the movable substrate. This sectional view corresponds to a section taken along the line BB in FIG.
As shown in FIG. 9A, a resist 61 is applied to the surface of the movable substrate 52, and the resist in the portion to be etched is removed. Here, the resist in the portions that form the connection holding portion 523 and the thin portion 582 is removed.
Next, wet etching is performed for a predetermined time using the resist 61 as a mask, and the resist is peeled off. By this etching, as shown in FIG. 9B, a connection holding portion 523 and a thin portion 582 are formed (thin portion forming step).
Then, as shown in FIG. 9C, an ITO film 63 is formed on the surface opposite to the surface etched in the previous step by sputtering or the like.
Subsequently, as shown in FIG. 9D, the ITO film 63 is patterned to form a second drive electrode 562.

Next, as shown in FIG. 10A, a Cr / Au film 65 is formed as a metal film on the surface of the movable substrate 52 by sputtering or the like.
Then, the Cr / Au film 65 is patterned to form the second connection electrode 572 connected to the second drive electrode 562 as shown in FIG. 10B (second electrode formation step).
Subsequently, an Ag alloy film is formed on the surface of the movable substrate 52 by sputtering or the like and patterned to form the second reflective film 55 as shown in FIG. 10C (second reflective film forming step).
Although not shown, a plasma polymerization film is formed on the bonding surface to form a bonding film.
In this way, the movable substrate 52 is manufactured through the above steps.

(Joint process of fixed substrate and movable substrate and connection process of first connection electrode and second connection electrode)
FIG. 11 is a cross-sectional view for explaining the bonding process of the fixed substrate and the movable substrate and the connection process of the first connection electrode and the second connection electrode.
As shown in FIG. 11A, the fixed substrate 51 and the movable substrate 52 are joined. Specifically, the bonding film (not shown, see FIG. 3) formed on the bonding surface between the fixed substrate 51 and the movable substrate 52 is subjected to O ₂ plasma or UV treatment, N ₂ plasma activation treatment, etc., and activation energy is obtained. To the surface.
Thereafter, the two substrates 51 and 52 are aligned and overlapped, and a load is applied to bond the fixed substrate 51 and the movable substrate 52 (bonding step).

Next, as shown in FIG. 11B, while the fixed substrate 51 and the movable substrate 52 are heated, an external force is applied from the movable substrate 52 to the fixed substrate 51 using a needle or the like on the thin portion 582 of the movable substrate 52. give. The thin portion 582 is deformed by this external force, and the first connection electrode 571 and the second connection electrode 572 come into contact with each other. In this state, when holding for a certain period of time, the electrode materials Au are bonded to each other (connection process).
In the state in which the first connection electrode 571 and the second connection electrode 572 are bonded to each other, even if the external force with the needle is removed, the force that the thin portion 582 returns to the original state is weak, and the bonding is maintained. In this way, the etalon 5 is manufactured through the above steps.
In addition, it is not necessary to heat the whole board | substrate, and heating should just be made for the part to connect.

Further, as a method of connecting the first connection electrode 571 and the second connection electrode 572 at room temperature without heating the substrate, the surface of the electrode contact portion is irradiated with an ion beam such as an inert gas before the substrate is bonded. After the activation treatment, the metal-to-metal bonding can be performed by applying an external force using a needle or the like in the same manner as described above.
When metal-to-metal bonding is performed, in addition to the above-described heating and surface activation treatment, ultrasonic waves may be applied to the contact portion, and these can also be combined to perform metal-to-metal bonding.
In this way, a reliable and highly reliable connection can be achieved by bonding the connection electrodes between metals.
About the method of giving external force to the thin part 582, it is not limited to the press by said needle, A well-known method is employable.

In this embodiment, in the present embodiment, the connection electrode material has been described with reference to the bonding of Au and Au. However, bonding is possible even with a combination of Ag and Ag, an Ag alloy and an Ag alloy, or Al and Al. .
In particular, when the connection electrode is made of Ag and Ag or Ag alloy and Ag alloy, since the metal can be used for the first reflection film and the second reflection film, the process of forming the connection electrode and the reflection film is the same process. It is possible to improve the efficiency of the manufacturing process.
The formation position of the thin portion 582 is preferably closer to the electrode pad 564P than the connection holding portion 523. This is an effective means for preventing the influence of the reaction force after connecting the connection electrodes (the force to peel off the connection between the first connection electrode and the second connection electrode) from reaching the reflective film.

(Operational effects of the first embodiment)
As described above, this embodiment has the following effects.
In the etalon (wavelength variable interference filter) 5 as an optical filter of the present embodiment, the first connection electrode 571 of the fixed substrate 51 and the second connection electrode 572 formed on the thin portion 582 of the movable substrate 52 are intermetallic bonded. Connected by. Since the thin portion 582 formed on the movable substrate 52 is easily deformed, electrical connection between the fixed substrate 51 and the movable substrate 52 is easy without using an intermediate member. Also, with this structure, a terminal that is electrically connected to the movable substrate 52 can be disposed on the fixed substrate 51 side, and connection to an external circuit is possible on the fixed substrate 51 side.

  Further, the thin portion 582 is formed by providing a concave portion 581 on the surface of the movable substrate 52 opposite to the surface facing the fixed substrate 51. That is, the thin portion 582 can be formed at a position close to the first connection electrode 571 of the fixed substrate 51. Since the thin portion 582 is circular in plan view, the thin portion 582 is easily deformed in the thickness direction of the movable substrate 52, and the second connection electrode 572 formed on the thin portion 582, the first connection electrode 571 of the fixed substrate 51, Can be easily connected.

Further, the first connection electrode 571 and the second connection electrode 572 are connected in a state where the thin portion 582 is deformed in a direction approaching the fixed substrate 51.
For this reason, in the state before the first connection electrode 571 and the second connection electrode 572 are connected, there is a gap between them, so that the electrodes necessary for the connection between the first connection electrode 571 and the second connection electrode 572 are not present. The film thickness can be set and a highly reliable connection is possible.

In the manufacturing method of the etalon 5, after the fixed substrate 51 and the movable substrate 52 are joined, an external force is applied to the thin portion 582 to connect the first connection electrode 571 of the fixed substrate 51 and the second connection electrode 572 of the movable substrate 52. . For this reason, the fixed substrate 51 and the movable substrate 52 can be electrically connected without using an intermediate member. Since the thin portion 582 formed on the movable substrate 52 is easily deformed, it can be easily connected.
Further, in the present embodiment, the parallelism between the fixed substrate 51 and the movable substrate 52 can be ensured by joining the fixed substrate 51 and the movable substrate 52 first, and the parallelism between the reflective films and the gap dimension are accurately determined. It can be secured well. And since the 1st connection electrode 571 and the 2nd connection electrode 572 are connected after joining the fixed board | substrate 51 and the movable board | substrate 52, the connection process of a connection electrode does not affect the precision of board | substrate joining. The spectral accuracy of the etalon 5 depends on the gap size between the reflective films, and a method of manufacturing an etalon that can ensure the spectral accuracy can be provided.

  The colorimetric sensor 3 as the optical filter module of this embodiment includes an etalon 5 that can electrically connect the fixed substrate 51 and the movable substrate 52 without using an intermediate member. In this way, the first connection electrode 571 of the fixed substrate 51 and the second connection electrode 572 of the movable substrate 52 can be connected with a simple structure, which can contribute to simplification of the structure of the colorimetric sensor 3.

  A colorimetric device 1 as an optical analyzer of the present embodiment includes an etalon 5 that can electrically connect a fixed substrate 51 and a movable substrate 52 without using an intermediate member. In this way, the first connection electrode 571 of the fixed substrate 51 and the second connection electrode 572 of the movable substrate 52 can be connected with a simple structure, which can contribute to the simplification of the structure of the colorimetric device 1.

(Modification of the etalon in the first embodiment)
Next, a modification of the etalon described in the first embodiment will be described. FIG. 12 is a cross-sectional view showing a modification of the etalon in the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
In this modification, the second drive electrode and the second connection electrode connected thereto are formed of the same metal material, and the first connection electrode and the electrode pad connected thereto are formed of the same metal material. Different from the first embodiment.

The etalon 6 is configured by bonding a fixed substrate 51 and a movable substrate 52.
The fixed substrate 51 is provided with a first connection electrode 571A and an electrode pad 566P, which are continuously formed of a Cr / Au film. Also, an annular first drive electrode 561A, a conductive electrode 563A drawn from the first drive electrode 561A, and an electrode pad 565P connected to the conductive electrode 563A are provided, and these are continuously formed by a Cr / Au film. Is formed.
The movable substrate 52 is provided with a second drive electrode 562A and a second connection electrode 572A connected to the second drive electrode 562A, and is continuously formed of a Cr / Au film. A part of the second connection electrode 572 </ b> A is formed in a thin portion 582 formed on the movable substrate 52.
And the thin part 582 deform | transforms and the 2nd connection electrode 572A and the 1st connection electrode 571A are joined between metals, and the electrical connection between the fixed board | substrate 51 and the movable board | substrate 52 is enabled.

As described above, in the etalon 6, the electrode that is a conductor may be continuously formed using the same metal material except for the reflective film, and the manufacturing process can be simplified. Even with such a structure, the same effect as the etalon 5 according to the first embodiment can be obtained.
(Second Embodiment)

Next, another embodiment of the etalon will be described.
FIG. 13 is a cross-sectional view showing an etalon in the second embodiment. FIG. 14 is a plan view showing the configuration of the fixed substrate.
The etalon of the second embodiment is different from the first embodiment in that a part of the first connection electrode is provided on a protrusion protruding in the thickness direction of the first substrate. As a component, a part of the configuration of the fixed substrate is different, and the movable substrate has the same configuration as that of the first embodiment. For this reason, the same code | symbol is attached | subjected about the same structure as 1st Embodiment, and description is abbreviate | omitted.

As shown in FIG. 13, the etalon 7 is configured by bonding a fixed substrate 51 and a movable substrate 52.
A protrusion 514 is formed on the fixed substrate 51 at a position corresponding to the thin portion 582 of the movable substrate 52. The protrusion 514 faces the movable substrate 52 and protrudes in the thickness direction of the fixed substrate 51. And as shown in FIG. 14, the protrusion 514 is a rectangular parallelepiped shape, and the front-end | tip part has a flat surface. The height of the flat surface from the electrode forming portion 511 is the same as that of the reflective film forming portion 512. With such a configuration, the protrusion 514 and the electrode forming portion 511 can be formed in the same process.

And the 1st connection electrode 591 connected to the electrode pad 564P via the side surface from the flat surface of the front-end | tip part of the protrusion 514 is formed. The first connection electrode 591 is formed of a Cr / Au film.
A second connection electrode 592 formed of a Cr / Au film is formed on the thin portion 582 of the movable substrate 52 facing the protrusion 514 of the fixed substrate 51, and the thin portion 582 is deformed to deform the second connection electrode 592 and the second connection electrode 592. One connection electrode 591 is bonded to metal. In this way, electrical connection between the fixed substrate 51 and the movable substrate 52 is enabled.

  In the etalon 7 described above, by providing the fixed substrate 51 with the protrusion 514 protruding in the thickness direction, the distance between the first connection electrode 591 and the second connection electrode 592 is shortened, and the deformation amount of the thin portion 582 is small. In fact, the second connection electrode 592 and the first connection electrode 591 can be easily connected. Further, there is an advantage that the reaction force after connection (the force for peeling off the connection between the first connection electrode 591 and the second connection electrode 592) is small, and the etalon 7 is not stressed.

(Modification)
Next, a modification of the etalon described in the second embodiment will be described. FIG. 15 is a cross-sectional view showing a modification of the etalon in the second embodiment. The same components as those in the second embodiment are denoted by the same reference numerals and description thereof is omitted.
In this modification, the second drive electrode and the second connection electrode connected thereto are formed of the same metal material, and the first connection electrode and the electrode pad connected thereto are formed of the same metal material. Different from the second embodiment.

The etalon 8 is configured by bonding a fixed substrate 51 and a movable substrate 52.
A first connection electrode 591A is formed on the protrusion 514 of the fixed substrate 51, an electrode pad 566P connected to the first connection electrode 591A is provided, and is continuously formed of a Cr / Au film. Also, an annular first drive electrode 561A, a conductive electrode 563A drawn from the first drive electrode 561A, and an electrode pad 565P connected to the conductive electrode 563A are provided, and these are continuously formed by a Cr / Au film. Is formed.
The movable substrate 52 is provided with a second drive electrode 562A and a second connection electrode 592A connected to the second drive electrode 562A, and is continuously formed of a Cr / Au film. A part of the second connection electrode 592A is formed in a thin portion 582 formed in the movable substrate 52.
Then, the thin portion 582 is deformed, and the second connection electrode 592A and the first connection electrode 591A are bonded to each other between metals, and electrical connection between the fixed substrate 51 and the movable substrate 52 is enabled.

  As described above, in the etalon 8, the electrode that is a conductor may be continuously formed using the same metal material except for the reflective film, and the manufacturing process can be simplified. Even with such a structure, the same effect as the etalon of the second embodiment can be obtained.

In the first embodiment, the colorimetric device 1 is illustrated as an optical analysis device, but in addition, an optical filter, an optical filter module, and an optical analysis device can be used in various fields.
For example, it can be used as a light-based system for detecting the presence of a specific substance. As such a system, for example, an in-vehicle gas leak detector that detects a specific gas with high sensitivity by adopting a spectroscopic measurement method using an etalon (wavelength variable interference filter) as an optical filter, or a photoacoustic for a breath test A gas detection device such as a rare gas detector can be exemplified.
(Third embodiment)

  Hereinafter, an example of the gas detection device will be described with reference to the drawings.

FIG. 16 is a cross-sectional view illustrating an example of a gas detection device including an etalon.
FIG. 17 is a block diagram illustrating a configuration of a control system of the gas detection device.
As illustrated in FIG. 16, the gas detection device 100 includes a sensor chip 110, a flow path 120 including a suction port 120A, a suction flow path 120B, a discharge flow path 120C, and a discharge port 120D, a main body 130, It is configured with.
The main body unit 130 includes a sensor unit cover 131 having an opening through which the flow channel 120 can be attached, a discharge unit 133, a housing 134, an optical unit 135, a filter 136, an etalon (wavelength variable interference filter) 5, and a light receiving element 137 (light receiving element). A control unit 138 that processes the detected signal and controls the detection unit, a power supply unit 139 that supplies power, and the like. The optical unit 135 emits light, and a beam splitter 135B that reflects light incident from the light source 135A toward the sensor chip 110 and transmits light incident from the sensor chip toward the light receiving element 137. And lenses 135C, 135D, and 135E.

As shown in FIG. 17, the gas detection apparatus 100 is provided with an operation panel 140, a display unit 141, a connection unit 142 for interface with the outside, and a power supply unit 139. When the power supply unit 139 is a secondary battery, a connection unit 143 for charging may be provided.
Further, the control unit 138 of the gas detection device 100 includes a signal processing unit 144 configured by a CPU or the like, a light source driver circuit 145 for controlling the light source 135A, a voltage control unit 146 for controlling the etalon 5, and a light receiving element 137. A light receiving circuit 147 that receives a signal from the sensor chip, reads a code of the sensor chip 110, controls a sensor chip detection circuit 149 that receives a signal from a sensor chip detector 148 that detects the presence or absence of the sensor chip 110, and a discharge means 133. A discharge driver circuit 150 is provided.

Next, operation | movement of the gas detection apparatus 100 is demonstrated below.
A sensor chip detector 148 is provided inside the sensor unit cover 131 at the upper part of the main body unit 130, and the sensor chip detector 148 detects the presence or absence of the sensor chip 110. When the signal processing unit 144 detects the detection signal from the sensor chip detector 148, the signal processing unit 144 determines that the sensor chip 110 is attached, and displays a display signal for displaying on the display unit 141 that the detection operation can be performed. put out.

  For example, when the operation panel 140 is operated by the user and an instruction signal to start the detection process is output from the operation panel 140 to the signal processing unit 144, the signal processing unit 144 first sends the signal processing unit 144 to the light source driver circuit 145. A light source activation signal is output to activate the light source 135A. When the light source 135A is driven, laser light having a single wavelength and stable linear polarization is emitted from the light source 135A. The light source 135A includes a temperature sensor and a light amount sensor, and the information is output to the signal processing unit 144. When the signal processing unit 144 determines that the light source 135A is stably operating based on the temperature and light quantity input from the light source 135A, the signal processing unit 144 controls the discharge driver circuit 150 to operate the discharge unit 133. Thereby, the gas sample containing the target substance (gas molecule) to be detected is guided from the suction port 120A to the suction channel 120B, the sensor chip 110, the discharge channel 120C, and the discharge port 120D.

The sensor chip 110 is a sensor that incorporates a plurality of metal nanostructures and uses localized surface plasmon resonance. In such a sensor chip 110, an enhanced electric field is formed between the metal nanostructures by laser light, and when gas molecules enter the enhanced electric field, Raman scattered light and Rayleigh scattered light including information on molecular vibrations are generated. Occur.
These Rayleigh scattered light and Raman scattered light enter the filter 136 through the optical unit 135, and the Rayleigh scattered light is separated by the filter 136, and the Raman scattered light enters the etalon 5. Then, the signal processing unit 144 controls the voltage control unit 146 to adjust the voltage applied to the etalon 5 and causes the etalon 5 to split the Raman scattered light corresponding to the gas molecule to be detected. Thereafter, when the dispersed light is received by the light receiving element 137, a light reception signal corresponding to the amount of received light is output to the signal processing unit 144 via the light receiving circuit 147.
The signal processing unit 144 compares the spectrum data of the Raman scattered light corresponding to the gas molecule to be detected obtained as described above and the data stored in the ROM, and determines whether or not the target gas molecule is the target gas molecule. To determine the substance. Further, the signal processing unit 144 displays the result information on the display unit 141 or outputs the result information from the connection unit 142 to the outside.

  16 and 17 exemplify the gas detection device 100 that performs gas detection from the Raman scattered light obtained by separating the Raman scattered light with the etalon 5, but the gas detection device detects absorbance specific to the gas. Therefore, it may be used as a gas detection device that identifies the gas type. In this case, a gas sensor that allows gas to flow into the sensor and detects light absorbed by the gas in the incident light is used as the optical filter module of the present invention. A gas detector that analyzes and discriminates the gas flowing into the sensor by such a gas sensor is an optical analyzer of the present invention. Even in such a configuration, a gas component can be detected using the optical filter of the present invention.

In addition, the system for detecting the presence of a specific substance is not limited to the detection of the gas as described above, but a non-invasive measuring device for saccharides by near-infrared spectroscopy, and non-invasive information on food, living body, minerals, etc. A substance component analyzer such as a measuring device can be exemplified.
(Fourth embodiment)

  Next, a food analyzer will be described as an example of the substance component analyzer.

FIG. 18 is a block diagram illustrating a configuration of a food analysis apparatus that is an example of an optical analysis apparatus using the etalon 5.
The food analysis apparatus 200 includes a detector (light filter module) 210, a control unit 220, and a display unit 230. The detector 210 includes a light source 211 that emits light, an imaging lens 212 into which light from a measurement object is introduced, an etalon (wavelength variable interference filter) 5 that splits light introduced from the imaging lens 212, and a spectral And an imaging unit (light receiving unit) 213 for detecting the emitted light.
Further, the control unit 220 controls the light source control unit 221 that controls the turning on / off of the light source 211 and the brightness at the time of lighting, the voltage control unit 222 that controls the etalon 5, and the imaging unit 213. A detection control unit 223 that acquires a spectral image captured by the unit 213, a signal processing unit 224, and a storage unit 225.

  In the food analyzer 200, when the apparatus is driven, the light source 211 is controlled by the light source control unit 221, and the measurement object is irradiated with light from the light source 211. Then, the light reflected by the measurement object enters the etalon 5 through the imaging lens 212. The etalon 5 is applied with a voltage capable of dispersing a desired wavelength under the control of the voltage control unit 222, and the dispersed light is imaged by an imaging unit 213 configured by, for example, a CCD camera or the like. The captured light is accumulated in the storage unit 225 as a spectral image. Further, the signal processing unit 224 controls the voltage control unit 222 to change the voltage value applied to the etalon 5, and acquires a spectral image for each wavelength.

Then, the signal processing unit 224 performs arithmetic processing on the data of each pixel in each image accumulated in the storage unit 225, and obtains a spectrum at each pixel. In addition, the storage unit 225 stores, for example, information related to food components with respect to the spectrum, and the signal processing unit 224 analyzes the obtained spectrum data based on the information related to food stored in the storage unit 225. The food component contained in the detection target and the content thereof are obtained. Moreover, a food calorie, a freshness, etc. are computable from the obtained food component and content. Furthermore, by analyzing the spectral distribution in the image, it is possible to extract a portion of the food to be inspected that has reduced freshness, and to detect foreign substances contained in the food. Can also be implemented.
Then, the signal processing unit 224 performs processing for causing the display unit 230 to display information such as the component and content of the obtained food to be inspected, calories, and freshness.

FIG. 18 shows an example of the food analysis apparatus 200, but it can also be used as a non-invasive measurement apparatus for other information as described above with a substantially similar configuration. For example, it can be used as a biological analyzer for analyzing biological components such as measurement and analysis of body fluid components such as blood. As such a bioanalytical device, for example, a device that detects ethyl alcohol as a device that measures body fluid components such as blood, it can be used as a drunk driving prevention device that detects the drinking state of an automobile driver. . Further, it can also be used as an electronic endoscope system provided with such a biological analyzer.
Furthermore, it can also be used as a mineral analyzer for performing component analysis of minerals.

Furthermore, the optical filter, optical filter module, and optical analysis device of the present invention can be applied to the following devices.
For example, it is possible to transmit data using light of each wavelength by changing the intensity of light of each wavelength over time. In this case, the light of a specific wavelength is spectrally separated by an etalon provided in the optical filter module. By receiving light at the light receiving unit, data transmitted by light of a specific wavelength can be extracted. By using an optical analyzer equipped with such an optical filter module for data extraction, data of light of each wavelength can be extracted. By processing, optical communication can be performed.
(Fifth embodiment)

Further, as another optical analysis apparatus, the present invention can be applied to a spectroscopic camera, a spectroscopic analyzer, and the like that spectrally divide light with the etalon (wavelength variable interference filter) of the present invention to capture a spectral image. An example of such a spectroscopic camera is an infrared camera incorporating an etalon.
FIG. 19 is a perspective view showing the configuration of the spectroscopic camera. As shown in FIG. 19, the spectroscopic camera 300 includes a camera body 310, an imaging lens unit 320, and an imaging unit 330.
The camera body 310 is a part that is gripped and operated by a user.
The imaging lens unit 320 is provided in the camera body 310 and guides incident image light to the imaging unit 330. The imaging lens unit 320 includes an objective lens 321, an imaging lens 322, and an etalon 5 provided between these lenses.
The imaging unit 330 includes a light receiving element, and images the image light guided by the imaging lens unit 320.
In such a spectroscopic camera 300, a spectral image of light having a desired wavelength can be captured by transmitting light having a wavelength to be imaged by the etalon 5.

Furthermore, the etalon of the present invention may be used as a bandpass filter. For example, among the light in a predetermined wavelength range emitted from the light emitting element, only light in a narrow band centered on a predetermined wavelength is spectrally transmitted. It can also be used as an optical laser device.
Further, the etalon of the present invention may be used as a biometric authentication device, and can also be applied to authentication devices such as blood vessels, fingerprints, retinas, and irises using light in the near infrared region and visible region.

  Furthermore, an optical filter module and an optical analyzer can be used as a concentration detector. In this case, the infrared energy (infrared light) emitted from the substance is separated and analyzed by the etalon, and the analyte concentration in the sample is measured.

  As described above, the optical filter, optical filter module, and optical analysis device of the present invention can be applied to any device that separates predetermined light from incident light. And since the etalon of this invention can disperse | distribute a some wavelength with one device as mentioned above, the measurement of the spectrum of a some wavelength and the detection with respect to a some component can be implemented accurately. Therefore, compared with the conventional apparatus which takes out a desired wavelength with several devices, size reduction of an optical filter module or an optical analyzer can be accelerated | stimulated, for example, it can use suitably for portable use or vehicle-mounted use.

  The present invention is not limited to the embodiment described above, and the specific structure and procedure for carrying out the present invention can be appropriately changed to other structures and the like as long as the object of the present invention can be achieved. it can. Many modifications can be made by those skilled in the art within the technical idea of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Color measuring device, 2 ... Light source device, 3 ... Color measuring sensor, 4 ... Control device, 5, 6, 7, 8 ... Etalon, 31 ... Light-receiving part, 32 ... Voltage control part, 41 ... Light source control part, 42 ... colorimetric sensor control unit, 43 ... colorimetric processing unit, 51 ... fixed substrate (first substrate), 52 ... movable substrate (second substrate), 53 ... bonding film, 54 ... first reflection film, 55 ... second Reflective film 56 ... Electrostatic actuator 100 ... Gas detector 200 ... Food analyzer 300 ... Spectroscopic camera 511 ... Electrode forming part 512 ... Reflecting film forming part 514 ... Projection part 515 ... Bonding surface 522 ... movable part, 523 ... connection holding part, 526 ... notch part, 561 ... first drive electrode, 562 ... second drive electrode, 563 ... conduction electrode, 563P, 564P ... electrode pad, 571 ... first connection electrode, 572 ... Second connection electrode, 581 ... concave portion, 582 ... thin wall , 591 ... first connecting electrode, 592: second connection electrode.

Claims (10)

A first substrate;
A second substrate facing the first substrate;
A first reflective film formed on a surface of the first substrate facing the second substrate;
A second reflective film provided on the second substrate and opposed to the first reflective film via a gap;
A first drive electrode provided on a surface of the first substrate facing the second substrate;
A second drive electrode provided on the second substrate and facing the first drive electrode;
A first connection electrode provided on the first substrate;
A thin portion provided on the second substrate, formed at a position facing a part of the first connection electrode, and having flexibility in a thickness direction of the second substrate;
A second connection electrode connected to the second drive electrode and formed in the thin portion facing the first connection electrode;
With
The first substrate and the second substrate are joined, and the first connection electrode and the second connection electrode formed on the thin portion are deformed in a direction in which the thin portion approaches the first substrate. An optical filter characterized by being connected in a state . The optical filter according to claim 1,
The thin-walled portion is provided with a circular concave portion in a plan view on a surface of the second substrate opposite to the surface facing the first substrate, and the bottom surface of the concave portion faces the first substrate of the second substrate. The optical filter is characterized in that the thin portion having a thickness between the surface and the surface to be formed is formed. The optical filter according to any one of claims 1 and 2 ,
The optical filter according to claim 1, wherein the first connection electrode is provided on a protrusion protruding in the thickness direction of the first substrate. An optical filter module comprising the optical filter according to claim 1 . An optical filter according to any one of claims 1 to 3,
A light receiving unit that receives light transmitted through the first reflective film or the second reflective film;
Optical analysis device characterized by comprising a, an analysis processing unit for analyzing the light characteristics of the light based on a signal obtained from the light receiving portion. An electrode forming part forming step of etching the first substrate to form an electrode forming part;
A first electrode forming step of forming a first drive electrode and a first connection electrode in the electrode forming portion;
A first reflective film forming step of forming a first reflective film on the first substrate;
A thin portion forming step of etching the second substrate to form a thin portion at a position facing the first connection electrode;
A second electrode forming step of forming a second drive electrode on the second substrate and a second connection electrode connected to the second drive electrode at a position facing the first connection electrode of the thin portion;
A second reflective film forming step of forming a second reflective film on the second substrate;
A bonding step of bonding the first substrate and the second substrate;
A method of manufacturing an optical filter, comprising: a connecting step of applying an external force to the thin portion to connect the first connection electrode of the first substrate and the second connection electrode of the second substrate. In the manufacturing method of the optical filter of Claim 6 ,
The connection step includes heating the first connection electrode and the second connection electrode, and applying an external force to bond the first connection electrode and the second connection electrode between metals. . In the manufacturing method of the optical filter of Claim 6 ,
The connecting step is characterized in that an external force is applied after the surfaces of the first connection electrode and the second connection electrode are subjected to a surface activation process, and the first connection electrode and the second connection electrode are bonded to each other between metals. Manufacturing method of optical filter. In the manufacturing method of the optical filter of Claim 6 ,
The method for manufacturing an optical filter, wherein the first connection electrode, the first reflection film, the second connection electrode, and the second reflection film are made of the same metal material. In the manufacturing method of the optical filter of Claim 9 ,
The method for producing an optical filter, wherein the metal material is Ag or an Ag alloy.

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