JP5872545B2 - Thermally conductive composition and method for producing thermal conductor - Google Patents

Description

  The present invention relates to a heat conductive composition and a heat conductor obtained by heat-treating the composition.

  Conventionally, a silver paste containing silver powder, a thermosetting resin, and a solvent has been used for bonding and fixing (die bonding) a semiconductor chip to a metal plate such as a lead frame. When the chip is bonded and fixed using this silver paste, the heat generated in the chip can be quickly released to the lead frame because silver has a high thermal conductivity. Further, since the curing temperature of the resin is relatively low, the chip is not easily deteriorated by heat when the chip is bonded and fixed. Further, silver and resin contained in the silver paste are cheaper than gold. Furthermore, the viscosity and thixotropy of the silver paste can be controlled by adjusting the addition amount of the viscosity adjusting agent (solvent) contained in the silver paste. Since the silver paste is easy to handle, it can be applied selectively and in a certain amount to the adhesive surface by application by printing, injection, dripping or the like. For this reason, silver paste is often used for bonding and fixing chips.

  As such a silver paste, Patent Document 1 discloses a silver paste in which spherical silver fine particles smaller than silver powder are mixed in a conductive paste containing silver powder, a thermosetting resin, and a solvent. Patent Document 2 discloses a thermally conductive resin composition containing silver powder, a thermosetting resin, and a compound having a sulfide bond and a hydroxyl group. Patent Document 3 discloses a method for producing a bump for connecting an electronic circuit obtained by heat-treating silver particles coated with a higher fatty acid or a derivative of higher fatty acid. Patent Document 4 discloses an adhesive paste having excellent thermal conductivity, including silver fine particles obtained by reducing silver ions and a thermosetting resin as an adhesive component.

JP-A-11-150135 JP 2009-191214 A JP 2009-289745 A JP 2003-183616 A

  In recent years, the amount of heat generated from the chip has increased due to the high performance of electronic components using semiconductor chips, and the silver paste for bonding and fixing the chip to the lead frame has a high thermal conductivity. There is a stronger demand.

  Then, an object of this invention is to provide the heat conductive composition which can obtain the heat conductor which has high heat conductivity.

The present inventors have conducted research in order to solve the above problems.
As a result, the present inventors use a thermally conductive composition containing silver powder, silver fine particles, fatty acid silver, and an amine, so that the heat is higher than that of conventional silver powder and silver paste containing silver fine particles. It has been discovered that a thermal conductor with conductivity can be obtained.
The present invention has been completed based on such a novel discovery.

  The present invention is a thermally conductive composition characterized by containing (A) silver powder, (B) silver fine particles, (C) fatty acid silver, and (D) amine.

  The (A) silver powder preferably has an average particle size of 0.3 μm to 100 μm.

The silver fine particles (B)
The average particle diameter of the primary particles is 50 to 150 nm,
The crystallite diameter is 20-50 nm, and
The ratio of the average particle diameter to the crystallite diameter is preferably 1 to 7.5.

  The silver fine particles (B) were produced by mixing a silver salt of a carboxylic acid and an aliphatic primary amine and then adding a reducing agent to precipitate silver fine particles at a reaction temperature of 20 to 80 ° C. It is preferable.

  It is preferable that the heat conductive composition of this invention contains (E) silver resinate further.

  It is preferable that the heat conductive composition of this invention contains (F) resin further.

  This invention provides the heat conductor obtained by heat-processing one of the said heat conductive compositions in the temperature range of 100-400 degreeC.

This invention provides the adhesive agent containing one of the said heat conductive compositions.
The present invention provides an electronic component including the above heat conductor.

  ADVANTAGE OF THE INVENTION According to this invention, the heat conductive composition which can obtain the heat conductor which has high heat conductivity can be provided.

The electron micrograph of the cross section of the heat conductive film obtained from the heat conductive composition of Examples 1-3 is shown. The electron micrograph of the cross section of the heat conductive film obtained from the heat conductive composition of Comparative Examples 1-3 is shown.

Hereinafter, embodiments for carrying out the present invention will be described in detail.
The heat conductive composition which concerns on embodiment of this invention is characterized by containing (A) silver powder, (B) silver fine particle, (C) fatty acid silver, and (D) amine.

(A) Silver powder As silver powder in this invention, the powder which consists of pure silver or a silver alloy can be used. The shape of the silver powder is not particularly limited, and for example, spherical, granular, or flaky (flaky) silver powder can be used.

  The average particle diameter of the silver powder used in the present invention is preferably 0.3 μm to 100 μm, more preferably 1 μm to 50 μm, and most preferably 2.4 μm to 16 μm. The average particle size here means the average particle size (D50) of primary particles obtained by a laser diffraction / scattering particle size distribution measurement method.

  In order to increase the thermal conductivity of the thermal conductor, it is preferable to increase the particle size of the silver powder contained in the thermal conductive composition. However, if the particle size of the silver powder is too large, the coating properties and workability of the thermally conductive composition on the device will be impaired. Therefore, it is preferable to use silver powder having a large particle size as long as the coating properties and workability to the device are not impaired. Considering these matters, the average particle diameter of the silver powder used in the present invention is preferably in the above range.

  Moreover, the contact point or contact surface of silver powder can be increased by using silver powder with a high filling density (tap density). As a result, the heat conduction point or heat conduction surface between silver powders can be increased. In order to increase the packing density of silver powder, it is preferable to use a mixture of a plurality of types of silver powder having different particle size distributions and / or shapes.

  The heat conductive composition of the present invention contains an additive for promoting metal fusion at a heat conduction point between silver powders. By including such an additive, a larger heat conduction path is formed inside the heat conductor obtained by heating the heat conductive composition. In the present invention, the following (C) fatty acid silver and (D) amine are used as such additives.

  The method for producing silver powder is not particularly limited. Silver powder can be produced by, for example, a reduction method, a pulverization method, an electrolysis method, an atomization method, a heat treatment method, or a combination thereof. The flaky silver powder can be produced, for example, by crushing spherical or granular silver particles with a ball mill or the like.

(B) Silver fine particles The silver fine particles in the present invention are, for example, particles made of pure silver or a silver alloy having an average particle size relatively smaller than that of the above-described silver powder.

  In the silver fine particles of the present invention, the average particle size of primary particles is 40 to 150 nm, preferably 50 to 150 nm, and more preferably 70 to 140 nm. When the average particle diameter of the silver fine particles is within this range, aggregation of the silver fine particles is suppressed, and the storage stability of the silver paste is improved. Here, the average particle diameter means an average value of Haywood diameters obtained by observing particles with a scanning electron microscope (SEM) and image analysis.

  The silver fine particles used in the present invention have a crystallite diameter of 15 to 50 nm, preferably 20 to 50 nm. When the crystallite diameter is within this range, volume shrinkage when the heat conductive composition is heat-treated is suppressed, and the denseness and surface smoothness of the heat conductor formed after the heat treatment are improved. The crystallite diameter is a value calculated from Scherrer's equation by obtaining the half-value width of the plane index (1,1,1) plane peak from powder X-ray diffractometry using Cu Kα ray as a radiation source. Means that.

  In the silver fine particles used in the present invention, the ratio of the average particle diameter to the crystallite diameter of the primary silver fine particles (average particle diameter / crystallite diameter) is 1 to 10, preferably 1 to 7.5, more preferably. Is in the range of 1-5.

  The silver fine particles used in the present invention are produced by mixing a silver salt of a carboxylic acid and an aliphatic primary amine and then adding a reducing agent to precipitate silver fine particles at a reaction temperature of 20 to 80 ° C. Can do.

  First, a silver salt of carboxylic acid and an aliphatic primary amine are mixed to obtain a solution in which the silver salt of carboxylic acid is dissolved. In solution, it is considered that an aliphatic primary amine is coordinated to a silver salt of carboxylic acid to form a kind of amine complex.

  The silver salt of a carboxylic acid may be a silver salt of any aliphatic or aromatic carboxylic acid. The silver salt of carboxylic acid may be a silver salt of monocarboxylic acid or a silver salt of polycarboxylic acid such as dicarboxylic acid. The silver salt of an aliphatic carboxylic acid may be a silver salt of a chain aliphatic carboxylic acid or a silver salt of a cyclic aliphatic carboxylic acid. The silver salt of an aliphatic carboxylic acid is preferably a silver salt of a chain aliphatic monocarboxylic acid, more preferably silver acetate, silver propionate or silver butyrate, and particularly preferably silver acetate. These may use only 1 type and may use 2 or more types together.

  The aliphatic primary amine may be a chain aliphatic primary amine or a cyclic aliphatic primary amine. Moreover, even if it is a monoamine compound, polyamine compounds, such as a diamine compound, may be sufficient. The aliphatic primary amine may be one in which a hydrogen atom of an aliphatic hydrocarbon group is substituted with an alkoxy group such as a hydroxyl group, a methoxy group, or an ethoxy group. The aliphatic primary amine is more preferably 3-methoxypropylamine, 3-aminopropanol, or 1,2-diaminocyclohexane. These may use only 1 type and may use 2 or more types together.

  The amount of the aliphatic primary amine used is preferably 1 equivalent or more with respect to 1 equivalent of the silver salt of carboxylic acid. The amount of the aliphatic primary amine used is preferably 1.0 to 3.0 equivalents, more preferably 1.0 to 2.0 equivalents, relative to 1 equivalent of the silver salt of the carboxylic acid. Particularly preferred is 1.2 to 1.8 equivalents.

  Mixing of the silver salt of the carboxylic acid and the aliphatic primary amine can be performed in the absence or presence of an organic solvent. Mixing can be facilitated by the use of organic solvents. Examples of the organic solvent include alcohols such as ethanol, propanol and butanol, ethers such as propylene glycol dibutyl ether, and aromatic hydrocarbons such as toluene. These organic solvents may use only 1 type and may use 2 or more types together. The amount of the organic solvent used is arbitrary, and can be determined in consideration of ease of mixing, productivity of silver fine particles in a later step, and the like.

  In order to mix the silver salt of the carboxylate and the aliphatic primary amine, for example, while stirring the primary aliphatic amine or the mixture of the primary aliphatic amine and the organic solvent, Silver salt is added to this. Stirring can be continued as appropriate even after the end of the addition. In the meantime, it is preferable to maintain temperature at 20-80 degreeC, and it is more preferable to maintain at 20-60 degreeC.

  Thereafter, a reducing agent is added to the mixture of the silver salt of carboxylic acid and the aliphatic primary amine to precipitate silver fine particles. The reducing agent is preferably formic acid, formaldehyde, ascorbic acid or hydrazine, more preferably formic acid, from the viewpoint of reaction control. These may be used alone or in combination of two or more. The amount of the reducing agent used is preferably not less than the redox equivalent relative to the silver salt of the carboxylic acid, more preferably 1 to 3 times the redox equivalent.

  The temperature is maintained between 20 ° C. and 80 ° C. during the addition of the reducing agent and the subsequent reaction. The temperature is preferably 20 to 70 ° C, and more preferably 20 to 60 ° C. When the temperature is within this range, the silver fine particles are sufficiently grown, the productivity is increased, and secondary aggregation of the silver fine particles is also suppressed. The time required for the addition of the reducing agent and the subsequent reaction is usually 10 minutes to 10 hours, depending on the scale of the reactor. In addition, in the addition of the reducing agent and the subsequent reaction, an organic solvent such as an alcohol such as ethanol, propanol or butanol, an ether such as propylene glycol dibutyl ether, or an aromatic hydrocarbon such as toluene is added as necessary. Can be added.

  In the addition of the reducing agent and the subsequent reaction, the silver of the carboxylic acid with respect to the total volume (L) of the mixed solution of the silver salt of the carboxylic acid and the aliphatic primary amine, the reducing agent, and the organic solvent. The amount (mol) of the salt is preferably 1.0 to 6.0 mol / L, more preferably 2.0 to 5.0 mol / L, and 2.0 to 4.0 mol / L. More preferably. When the concentration of the carboxylic acid silver salt is within this range, the reaction solution can be sufficiently stirred, and the heat of reaction can be removed. As a result, since the average particle diameter of the silver fine particles to be precipitated becomes appropriate, it is possible to prevent troubles in operations such as precipitation decantation and solvent replacement performed in the subsequent steps.

  A solution obtained by mixing a silver salt of a carboxylic acid and an aliphatic primary amine and an arbitrary organic solvent are placed in a reaction vessel, and then a reducing agent is continuously supplied to the reaction vessel. When the reaction is performed in such a semi-batch mode, the amount of silver fine particles deposited per hour from the start of addition of the reducing agent to the end of the reaction is, for example, 0.3 to 1.0 mol / h / L. Therefore, when the reaction is performed in a semi-batch mode, the productivity of silver fine particles becomes very large. The amount of silver fine particles referred to here means the amount of silver fine particles deposited with respect to a total volume of 1 L of a solution obtained by mixing a silver salt of a carboxylic acid and an aliphatic primary amine, a reducing agent, and an organic solvent. . When the reaction is carried out by a continuous reaction system (continuous complete mixing tank, flow system), the productivity of silver fine particles is further increased.

  After the silver fine particles precipitated by the above reaction are allowed to settle, the supernatant is removed by decantation or the like, or a solvent such as alcohol, for example, methanol, ethanol, terpineol or the like is added. Thereby, silver fine particles can be separated from the reaction solution.

  In addition, the manufacturing method itself of the silver fine particle demonstrated above is well-known, For example, it is disclosed by Unexamined-Japanese-Patent No. 2006-183072.

(C) Fatty acid silver Examples of the fatty acid silver in the present invention include acetic acid, propionic acid, butyric acid, caprylic acid, lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid, acrylic acid, oleic acid, linoleic acid, and arachidone. Silver salts such as acids can be used. Of these, the silver salt of acetic acid is most preferably used.
Moreover, the silver salt of the carboxylic acid which is a raw material of the said (B) silver fine particle can also be used as (C) fatty acid silver.

(D) Amine As the amine in the present invention, any of primary amine, secondary amine, and tertiary amine can be used. Examples of amines include aliphatic amines, aromatic amines, modified polyamines (eg, polyaminoamides, polyaminoimides, polyaminoesters, polyaminoureas, polyether-modified amines), tertiary amine compounds, imidazole compounds (eg, 2 -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2,2-diamino- 6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, etc.), hydrazide compounds, dicyanamide compounds, melamine compounds and the like.
Further, as the (D) amine, an aliphatic primary amine which is a raw material for the above (B) silver fine particles can also be used.

(E) Silver resinate It is preferable that the heat conductive composition of this invention contains (E) silver resinate further.
The silver resinate used in the present invention is a compound represented by the following formula (1).
R-S-Ag (1)

  In the above formula (1), Ag represents a silver atom, S represents a sulfur atom, and R represents an alkyl group. There is no restriction | limiting in particular in carbon number of the alkyl group represented by R, Carbon number is arbitrary. The alkyl group may be linear, branched or cyclic. The alkyl group may be an alkyl group obtained by removing one hydrogen from a saturated hydrocarbon, or an alkyl group obtained by removing one hydrogen from an unsaturated hydrocarbon. In the alkyl group, continuous carbon atoms may be separated by an oxygen atom. Moreover, some hydrogen atoms of the alkyl group may be substituted with other functional groups such as a hydroxyl group.

  The silver resinate represented by the above formula (1) is preferably a reaction product of a silver salt of a carboxylic acid and a mercaptan, and more preferably a reaction product of a silver salt of a carboxylic acid and t-dodecyl mercaptan. .

  The silver salt of a carboxylic acid may be a silver salt of any aliphatic or aromatic carboxylic acid. The silver salt of carboxylic acid may be a silver salt of monocarboxylic acid or a silver salt of polycarboxylic acid such as dicarboxylic acid. The silver salt of a carboxylic acid may be a silver salt of a chain aliphatic carboxylic acid or a silver salt of a cyclic aliphatic carboxylic acid. The silver salt of carboxylic acid is preferably silver acetate, silver propionate, or silver butyrate, and particularly preferably silver acetate. These may use only 1 type and may use 2 or more types together.

  Mercaptan (thiol) is a compound having one or more mercapto groups (—SH) in the molecule. The mercaptan is preferably benzyl mercaptan or t-dodecyl mercaptan, and more preferably t-dodecyl mercaptan. These may use only 1 type and may use 2 or more types together.

  A silver resinate can be produced by mixing the above-described silver salt of carboxylic acid and mercaptan with stirring. Mixing of the silver salt of carboxylic acid and mercaptan can be carried out in the absence or presence of an organic solvent. Mixing can be facilitated by the use of organic solvents. Examples of the organic solvent include alcohols such as ethanol, propanol and butanol, ethers such as propylene glycol dibutyl ether, cyclic hydrocarbons such as cyclohexane, aromatic hydrocarbons such as toluene, and the like. These organic solvents may use only 1 type and may use 2 or more types together.

(F) Resin The heat conductive composition of this invention can contain (F) resin further.
The resin used in the present invention may be a thermosetting resin or a thermoplastic resin.
The thermosetting resin is not particularly limited as long as it is a resin that is cured by heating. Examples of thermosetting resins include epoxy resins, urethane resins, vinyl ester resins, silicone resins, phenol resins, urea resins, melamine resins, unsaturated polyester resins, diallyl phthalate resins, polyimide resins, and the like.
The thermoplastic resin is not particularly limited as long as the resin is softened by heating. Examples of the thermoplastic resin include cellulose resins such as ethyl cellulose and nitrocellulose, acrylic resins, alkyd resins, saturated polyester resins, butyral resins, polyvinyl alcohol, and hydroxypropyl cellulose.
These resins may be used alone or in combination of two or more.

(G) Solvent The thermally conductive composition of the present invention may further contain (G) a solvent for viscosity adjustment and the like.
As the solvent, those known in the art can be used. Examples of solvents include alcohol solvents such as methanol, ethylene glycol, propylene glycol, dihydroterpineol; toluene, xylene, ethylbenzene, diethylbenzene, isopropylbenzene, amylbenzene, p-cymene, tetralin, and petroleum aromatic hydrocarbon mixtures, etc. Aromatic hydrocarbon solvents; terpene alcohols such as terpineol, linalool, geraniol, citronellol; ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene Glycol mono-tert-butyl ether, diethylene glycol monoethyl ether, diethylene glycol Ether alcohol solvents such as call monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monobutyl ether and tripropylene glycol monomethyl ether; ketone solvents such as methyl isobutyl ketone; and ethylene glycol monomethyl ether acetate and ethylene glycol monoethyl ether Examples thereof include ester solvents such as acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate, and water. These solvents may use only 1 type and may use 2 or more types together.

(H) Others Further, the thermally conductive composition of the present invention may include any one or more of the following substances.
・ Inorganic fillers (eg fumed silica, calcium carbonate, talc)
Coupling agents (for example, silane coupling agents such as γ-glycidoxypropyltrimethoxysilane, titanate coupling agents such as tetraoctyl bis (ditridecyl phosphite) titanate)
Silane monomer (for example, tris (3- (trimethoxysilyl) propyl) isocyanurate)
・ Plasticizer (for example, copolymer such as carboxyl-terminated polybutadiene-acrylonitrile, silicone rubber, silicone rubber powder, silicone resin powder, resin powder such as acrylic resin powder)
・ Flame retardants ・ Antioxidants ・ Defoamers

By adding and mixing the above (A) silver powder, (B) silver fine particles, (C) fatty acid silver, and (D) amine, the thermally conductive composition of the present invention can be prepared.
Further, by adding one or more selected from the above (E) silver resinate, (F) resin, (G) solvent, and (H) other components as optional components and mixing them, the heat conduction of the present invention. Sex compositions can be prepared.
In addition, the order which adds said (A)-(H) component is arbitrary, Said (A)-(H) component may be added and mixed simultaneously, and said (A)-(H) component may be added in order. You may mix in addition to.

  Next, a method for forming a heat conductor on a substrate using the heat conductive composition obtained as described above will be described.

  The components (A) to (D) and, if necessary, the components (E) to (H) are mixed to prepare a paste-like heat conductive composition. This prepared heat conductive composition is apply | coated on a board | substrate. The application method is arbitrary, and for example, it can be applied by methods such as dispensing, jet dispensing, stencil printing, screen printing, pin transfer, and stamping.

  After applying the paste-like heat conductive composition on the substrate, the heat conductive composition is heat-treated at a temperature range of 100 to 400 ° C, more preferably 150 to 350 ° C, and even more preferably 200 to 300 ° C. . Thereby, the film | membrane which consists of a heat conductor can be formed on a board | substrate.

  The heat conductor film thus obtained has a characteristic that the heat conductivity is very high. The reason for this is not clear, but (C) the fatty acid silver and (D) the two components of the amine form a kind of complex, and this complex brings the silver powder and the silver fine particles closer to each other, thereby heat treatment. In this case, it is considered that the fusion of the silver powder and the silver fine particles is promoted.

The heat conductive composition of this invention can be used for formation of the conductive circuit of various electronic components, for example, formation of the circuit pattern in a printed circuit board.
The thermally conductive composition of the present invention can be used as an adhesive (die bonding agent) for adhering and fixing a semiconductor chip to a lead frame.
The heat conductor obtained by heating the heat conductive composition of the present invention has a very high heat conductivity. By using the heat conductive composition of the present invention, it is possible to manufacture an electronic component with high heat dissipation that can easily release, for example, heat generated in a chip.

  Moreover, the heat conductive composition of this invention can be used for adhesion | attachment / fixation to substrates, such as a capacitor | condenser, resistance, a diode, memory, a computing element (CPU) other than adhesion | attachment / fixation of a chip | tip.

  Examples of the present invention will be described below, but the present invention is not limited thereto.

(A) Silver powder The silver powder which mixed the following 2 types (A1 and A2) silver flakes in the ratio of 1: 1 was used.
(A1)
Composition “silver”, shape “spherical”, particle size distribution “D50: 1.4 μm, D10: 0.7 μm, D90: 4.1 μm”, tap density “5.1 g / ml”
(A2)
Composition “Silver”, Shape “Flake”, Particle size distribution “D50: 4.2 μm, D10: 1.9 μm, D90: 7.9 μm”, Tap density “5.2 g / ml”

(B) Silver fine particles Silver fine particles were prepared by the following method.
First, 4.0 kg (45.0 mol) of 3-methoxypropylamine was placed in a 10 L glass reaction vessel. To this 3-methoxypropylamine, 5.0 kg (30.0 mol) of silver acetate was added with stirring while maintaining the reaction temperature at 45 ° C. or lower. Immediately after the addition of silver acetate, silver acetate was a clear solution and dissolved in 3-methoxypropylamine. As more silver acetate was added, the silver acetate gradually began to become cloudy. When all of the silver acetate was added, the silver acetate became a cloudy gray, viscous solution. To the solution, 0.7 kg (15.0 mol) of 95% by weight formic acid was slowly added dropwise. Immediately after the formic acid was added dropwise, the solution exothermed vigorously. Meanwhile, the reaction temperature was maintained at 30-45 ° C. The cloudy gray, viscous solution turned brown and then black. After the entire amount of formic acid was dropped, the reaction was completed. When the mixture obtained by the reaction was allowed to stand at 40 ° C., the mixture was separated into two layers. The upper layer was a yellow transparent liquid. The lower layer was precipitated black silver fine particles. The upper liquid did not contain silver. The upper layer liquid was removed by decantation. Separation using methanol gave true spherical silver fine particles with a silver content of 90% by weight.

  The obtained silver fine particles had an average particle diameter of 130 nm, a crystallite diameter of 40 nm, and an average particle diameter / crystallite diameter = 3.25. The average particle diameter is an average value of Haywood diameters obtained by image analysis by observation with a scanning electron microscope (SEM). The crystallite diameter is a value measured with an X-ray diffractometer (M18XHF22) manufactured by Mac Science Co., Ltd. From a measurement by a powder X-ray diffraction method using Cu Kα ray as a radiation source, the surface index (1,1,1 ) The half-value width of the surface peak is obtained and calculated from the Scherrer equation.

(C) Fatty acid silver Silver acetate was used for fatty acid silver.

(D) Amine The following two types of amines were used.
(D1) Methoxypropylamine (D2) Diaminocyclohexane

(E) Silver resinate The silver resinate used the reaction material of t-dodecyl mercaptan and silver acetate.

(F) Resin Polyester powder was used for the resin.

(G) Solvent The following two types of solvents (G1 to G2) were used as the solvent.
(G1) Methanol (G2) Normal paraffin mixture (C14-C16 mixture)

  The components (A) to (G) were mixed in the proportions shown in Table 1 below. This prepared the heat conductive composition of Examples 1-3 and Comparative Examples 1-3. In addition, all the mixture ratios of each component shown in Table 1 are shown by weight%.

  The silver paste which consists of a heat conductive composition of Examples 1-3 and Comparative Examples 1-3 was apply | coated to the board | substrate made from Teflon (trademark), respectively by the stencil printing method. Next, the substrate was heat-treated at 200 ° C. for 30 minutes. After the heat treatment, the coating film was peeled off from the Teflon (registered trademark) substrate. Thereby, a film made of a heat conductor having a thickness of 300 μm was obtained. The thermal conductivity of the film made of a heat conductor was measured by a laser flash method. The measurement results are shown in Table 1 above.

  The laser flash method is a method of measuring the thermal diffusivity, and is a method of irradiating the back surface of the sample with xenon flash light in a pulse shape and measuring how heat is transmitted to the sample surface with an infrared detector. The thermal conductivity can be calculated by thermal diffusivity x specific heat x density.

As can be seen from the results shown in Table 1, the thermal conductor obtained by heat-treating the thermal conductive compositions of Examples 1 to 3 has a thermal conductivity of 45.0 [W / mK] or higher, and high thermal conductivity. Had a rate.
From this result, the thermal conductive composition containing (A) silver powder, (B) silver fine particles, (C) fatty acid silver, and (D) amine is (A) only silver powder or (A) silver powder and ( B) It has been demonstrated that a thermal conductor having a higher thermal conductivity than that of a thermal conductive composition containing only silver fine particles can be obtained.

  As can be seen by comparing the results of Example 1 and Example 3, (E) the thermally conductive composition containing the silver resinate has a higher thermal conductivity than the (E) thermally conductive composition containing no silver resinate. It was found that a heat conductor having

  As can be seen by comparing the results of Example 3 and Comparative Example 2, thermal conductivity containing (A) silver powder, (B) silver fine particles, (C) fatty acid silver, (D) amine, and (E) silver resinate. It turned out that the heat conductor which has a heat conductivity higher than a heat conductive composition containing only (A) silver powder, (B) silver fine particles, and (E) silver resinate is obtained.

FIG. 1 shows an electron micrograph of a cross section of a heat conductive film obtained by heating the heat conductive compositions of Examples 1 to 3. FIG. 2 shows an electron micrograph of a cross section of a heat conductive film obtained by heating the heat conductive compositions of Comparative Examples 1 to 3.
As can be seen from a comparison of FIG. 1 and FIG. 2, the heat conductive film obtained by heating the heat conductive compositions of Examples 1 to 3 is greatly heated by the fusion of silver powder and silver fine particles to each other. A conduction path was formed, and the thermal conductivity was high. On the other hand, the heat conductive films obtained by heating the heat conductive compositions of Comparative Examples 1 to 3 have a high heat conductivity because the silver powder and the silver fine particles are not fused so much. There wasn't.

Claims (8)

  (A) silver powder, (B) silver fine particles, (C) fatty acid silver, and (D) an amine,
  The (A) silver powder has an average particle size of 0.3 μm to 100 μm,
  The silver fine particles (B)
    The average particle diameter of the primary particles is 50 to 150 nm,
    The crystallite diameter is 20-50 nm, and
    The ratio of the average particle diameter to the crystallite diameter is 1 to 7.5,
  Furthermore, (E) including silver resinate,
  Thermally conductive composition. Furthermore, the heat conductive composition of Claim 1 containing (F) resin. The thermally conductive composition according to claim 1 or 2, wherein the (C) fatty acid silver is silver acetate. The thermally conductive composition according to any one of claims 1 to 3, wherein the (D) amine is methoxypropylamine or diaminocyclohexane. The heat conductive composition according to any one of claims 1 to 4, wherein the (E) silver resinate is a compound represented by the following formula (1).
  R-S-Ag (1)
  (In the above formula (1), Ag represents a silver atom, S represents a sulfur atom, and R represents an alkyl group.) The thermally conductive composition according to claim 5, wherein the (E) silver resinate is a reaction product of t-dodecyl mercaptan and silver acetate. The manufacturing method of a heat conductor including the process of heat-processing the heat conductive composition of any one of Claims 1-6 in the temperature range of 100-400 degreeC.   The adhesive agent containing the heat conductive composition of any one of Claims 1-6.