JP5849417B2 - Method for stopping pitting corrosion of copper-based member and pitting corrosion stopping agent - Google Patents
Method for stopping pitting corrosion of copper-based member and pitting corrosion stopping agent Download PDFInfo
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- 238000005260 corrosion Methods 0.000 title claims description 95
- 230000007797 corrosion Effects 0.000 title claims description 94
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 80
- 229910052802 copper Inorganic materials 0.000 title claims description 79
- 239000010949 copper Substances 0.000 title claims description 79
- 238000000034 method Methods 0.000 title claims description 24
- 239000003795 chemical substances by application Substances 0.000 title description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 35
- 150000003839 salts Chemical class 0.000 claims description 33
- -1 imidazole compound Chemical class 0.000 claims description 28
- 125000004181 carboxyalkyl group Chemical group 0.000 claims description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 125000003342 alkenyl group Chemical group 0.000 claims description 18
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 18
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 16
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 125000001424 substituent group Chemical group 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 12
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims description 11
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229960003237 betaine Drugs 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- CIEZZGWIJBXOTE-UHFFFAOYSA-N 2-[bis(carboxymethyl)amino]propanoic acid Chemical compound OC(=O)C(C)N(CC(O)=O)CC(O)=O CIEZZGWIJBXOTE-UHFFFAOYSA-N 0.000 claims description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 5
- 150000001721 carbon Chemical group 0.000 claims description 5
- AERBHQYSUWNIDS-UHFFFAOYSA-N 2-(1-methyl-4,5-dihydroimidazol-1-ium-1-yl)ethanol Chemical compound OCC[N+]1(C)CCN=C1 AERBHQYSUWNIDS-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 241001311547 Patina Species 0.000 description 7
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910052783 alkali metal Inorganic materials 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 5
- 230000002401 inhibitory effect Effects 0.000 description 5
- 239000002585 base Substances 0.000 description 3
- 239000003518 caustics Substances 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- FWIJLRSOBQIWFM-UHFFFAOYSA-N 2-[1-(2-hydroxyethyl)-2-undecyl-4,5-dihydroimidazol-1-ium-1-yl]acetate Chemical compound CCCCCCCCCCCC1=NCC[N+]1(CCO)CC([O-])=O FWIJLRSOBQIWFM-UHFFFAOYSA-N 0.000 description 2
- MLDWGLQSBBCMMO-UHFFFAOYSA-N [Na].[Na].[Na].CNCC(=O)O Chemical compound [Na].[Na].[Na].CNCC(=O)O MLDWGLQSBBCMMO-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- AYWHENVLARCQQQ-UHFFFAOYSA-N copper;1h-pyrrole Chemical compound [Cu].C=1C=CNC=1 AYWHENVLARCQQQ-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical class C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 2
- 150000002462 imidazolines Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002455 scale inhibitor Substances 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- LYNVLWLRSACENL-UHFFFAOYSA-N 2-decyl-1h-imidazole Chemical compound CCCCCCCCCCC1=NC=CN1 LYNVLWLRSACENL-UHFFFAOYSA-N 0.000 description 1
- LEHNQGSPRXHYRT-UHFFFAOYSA-N 2-dodecyl-1h-imidazole Chemical compound CCCCCCCCCCCCC1=NC=CN1 LEHNQGSPRXHYRT-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- ABLCFODXAYBNID-UHFFFAOYSA-N 2-heptyl-1h-imidazole Chemical compound CCCCCCCC1=NC=CN1 ABLCFODXAYBNID-UHFFFAOYSA-N 0.000 description 1
- UANAUSCAUXQBJK-UHFFFAOYSA-N 2-hexadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCC1=NC=CN1 UANAUSCAUXQBJK-UHFFFAOYSA-N 0.000 description 1
- DAPXOJOQSNBLKY-UHFFFAOYSA-N 2-hexyl-1h-imidazole Chemical compound CCCCCCC1=NC=CN1 DAPXOJOQSNBLKY-UHFFFAOYSA-N 0.000 description 1
- JPZKJZJFMLNIMB-UHFFFAOYSA-N 2-nonyl-1h-imidazole Chemical compound CCCCCCCCCC1=NC=CN1 JPZKJZJFMLNIMB-UHFFFAOYSA-N 0.000 description 1
- QCQBUZVEQZFGQV-UHFFFAOYSA-N 2-octadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCCC1=NC=CN1 QCQBUZVEQZFGQV-UHFFFAOYSA-N 0.000 description 1
- MMDFSEGJGPURPF-UHFFFAOYSA-N 2-octyl-1h-imidazole Chemical compound CCCCCCCCC1=NC=CN1 MMDFSEGJGPURPF-UHFFFAOYSA-N 0.000 description 1
- SDQCONAKTCBAMG-UHFFFAOYSA-N 2-pentadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCC1=NC=CN1 SDQCONAKTCBAMG-UHFFFAOYSA-N 0.000 description 1
- PNIWRYYJOIOTOY-UHFFFAOYSA-N 2-tetradecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCC1=NC=CN1 PNIWRYYJOIOTOY-UHFFFAOYSA-N 0.000 description 1
- VCWPWZZLRFHCLR-UHFFFAOYSA-N 2-tridecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCC1=NC=CN1 VCWPWZZLRFHCLR-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 1
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Description
本発明は、冷却水系などの水系に接する銅管等の銅系部材に対し、薬剤を用いて進行中の孔食を停止する方法及びそのための孔食停止剤に関する。 The present invention relates to a method of stopping a pitting corrosion in progress using a chemical agent for a copper-based member such as a copper pipe in contact with an aqueous system such as a cooling water system, and a pitting corrosion stopper for the same.
銅は熱伝導性に優れる特性を有し、空調機器や熱交換器などの伝熱管などに広く使用されているが、これらの水系に接する銅系部材には腐食の問題がある。特に、最近の機器は高効率化が進んでおり、熱交換器に用いられる銅管の肉厚が非常に薄くなっていることから、腐食の発生は銅管の貫通漏洩につながる危険性が高い。よって、銅系部材に腐食を発生させないこと、発生した腐食を進行させないことが、機器の安定稼動、長寿命化に不可欠である。 Copper has a characteristic of excellent thermal conductivity, and is widely used for heat transfer tubes such as air conditioners and heat exchangers. However, these copper-based members in contact with water systems have a problem of corrosion. In particular, the efficiency of recent equipment is increasing, and the thickness of copper pipes used in heat exchangers is extremely thin. Therefore, the occurrence of corrosion has a high risk of lead-through leakage of copper pipes. . Therefore, it is indispensable for stable operation and long life of the equipment that the copper-based member does not corrode and does not proceed with the generated corrosion.
一般に、腐食反応は金属の溶出反応(アノード反応)と酸化剤の還元反応(カソード反応)が対になって進行する。例えば、冷却水のようなpH中性から弱アルカリ性の環境では、水中の溶存酸素が酸化剤としてカソード反応の担い手になる。 In general, the corrosion reaction proceeds by a pair of metal elution reaction (anode reaction) and oxidant reduction reaction (cathode reaction). For example, in a pH neutral to weakly alkaline environment such as cooling water, dissolved oxygen in the water becomes a catalyst for the cathode reaction as an oxidizing agent.
従来、水系に接する銅系部材の腐食を抑制するために、ベンゾトリアゾール、トリルトリアゾール、メルカプトベンゾチアゾールといったアゾール系の銅用防食剤を水系に添加する水処理が行われている(例えば、特許文献1,2)。冷却水系などの水系に、これらのアゾール系銅用防食剤を添加することにより、水系に接する銅系部材に対して優れた腐食抑制効果を発揮することが知られており、広く適用されている。
即ち、アゾール系の銅用防食剤は、腐食反応における金属の溶出反応(アノード反応)を抑制する効果に優れており、良好な腐食抑制効果を示す。
Conventionally, in order to suppress corrosion of a copper-based member in contact with an aqueous system, water treatment in which an azole-based anticorrosive agent for copper such as benzotriazole, tolyltriazole, or mercaptobenzothiazole is added to the aqueous system has been performed (for example, Patent Documents). 1, 2). It is known that by adding these azole copper anticorrosives to an aqueous system such as a cooling water system, it exhibits an excellent corrosion-inhibiting effect on copper-based members in contact with the aqueous system, and is widely applied. .
That is, the azole-type anticorrosive agent for copper is excellent in the effect of suppressing the metal elution reaction (anode reaction) in the corrosion reaction, and exhibits a good corrosion-inhibiting effect.
しかしながら、アゾール系銅用防食剤を添加した場合においても、腐食の発生及び進行を十分に抑制できない場合もある。例えば、酸化剤の過剰添加など、何らかの原因によりアゾール系防食剤よりなる防食皮膜が局部的に破壊され、皮膜の破壊された部分からの銅の溶出をアゾール系防食剤が抑えきれない結果、皮膜破壊部が局部的なアノードとなり、腐食が進行する場合がある。 However, even when an azole copper anticorrosive is added, the occurrence and progression of corrosion may not be sufficiently suppressed. For example, an anti-corrosion film made of an azole anti-corrosive agent is locally destroyed for some reason, such as an excessive addition of an oxidizing agent, and as a result, the azole anti-corrosive agent cannot suppress the elution of copper from the destroyed part of the film. The destruction part becomes a local anode, and corrosion may progress.
本発明は、上記従来の問題を解決し、冷却水系などの水系に接する銅管等の銅系部材に発生した孔食に対し、薬剤を用いてその進行を停止し、腐食の再発を効果的に抑制すること、特に、運転中の機器の銅系部材に生じた孔食に対し、機器の運転を停止することなく孔食の進行を確実に停止させることができる銅系部材の孔食停止方法及び孔食停止剤を提供することを課題とする。 The present invention solves the above-mentioned conventional problems, and stops the progress of pitting corrosion generated in a copper-based member such as a copper pipe in contact with an aqueous system such as a cooling water system by using a chemical agent, thereby effectively preventing the recurrence of corrosion. In particular, for pitting corrosion occurring on copper-based members of equipment during operation, it is possible to reliably stop the progress of pitting corrosion without stopping the operation of the equipment. It is an object to provide a method and a pitting corrosion stopper.
本発明者らは上記課題を解決すべく鋭意検討を重ねた結果、孔食が発生し、これが進行中の銅系部材が接する水系に対し、銅に対してキレート作用を有する化合物と、水系に接した銅系部材の腐食抑制効果、特にカソード反応抑制効果に優れる化合物を添加することにより、短期間に孔食の進行を停止させ、再発を防止することが可能となることを見出した。 As a result of intensive studies to solve the above-mentioned problems, the present inventors have generated pitting corrosion, which is a compound having a chelating action on copper with respect to an aqueous system in contact with an ongoing copper-based member, and an aqueous system. It has been found that by adding a compound that is excellent in the corrosion-inhibiting effect of the contacted copper-based member, particularly the cathode reaction-inhibiting effect, the progress of pitting corrosion can be stopped in a short period of time and recurrence can be prevented.
本発明はこのような知見に基いて達成されたものであり、以下を要旨とする。 The present invention has been achieved on the basis of such findings, and the gist thereof is as follows.
[1] 銅系部材と接する水系に対し、(A)銅に対しキレート作用を有する化合物(以下、「(A)成分」という。)と、(B)下記式(1)で表される化合物(以下、「(B)成分」という。)及び/又は(C)下記式(2)で表される化合物(以下、「(C)成分」という。)とを添加する銅系部材の孔食停止方法であって、該(B)成分が、イミダゾール系化合物、イミダゾリン系化合物、イミダゾリニウム塩系化合物及びイミダゾリウム塩系化合物よりなる群から選ばれる1種又は2種以上であることを特徴とする銅系部材の孔食停止方法。 [1] (A) A compound having a chelating action on copper (hereinafter referred to as “component (A)”) and (B) a compound represented by the following formula (1) with respect to an aqueous system in contact with a copper-based member (Hereinafter referred to as “component (B)”) and / or (C) pitting corrosion of a copper-based member to which a compound represented by the following formula (2) (hereinafter referred to as “(C) component”) is added. A stopping method, wherein the component (B) is one or more selected from the group consisting of imidazole compounds, imidazoline compounds, imidazolinium salt compounds and imidazolium salt compounds. A method for stopping pitting corrosion of a copper-based member.
(上記(1)式中、環Aは1位と3位が窒素原子で、2位、4位及び5位が炭素原子で構成された含窒素不飽和5員環であり、R1はアルキル基又はアルケニル基を表し、4位及び5位の炭素原子には水素原子が結合している。ただし、含窒素不飽和5員環Aの1位及び3位の窒素原子は、アルキル基、ヒドロキシアルキル基、カルボキシルアルキル基(ヒドロキシアルキル基、カルボキシアルキル基は塩を形成していてもよい。)から選択される置換基を有していてもよく、これらの置換基を有さない場合は水素原子が結合しているか、或いは、水素原子も置換基も有さない。) (In the above formula (1), ring A is a nitrogen-containing unsaturated 5-membered ring in which the 1st and 3rd positions are nitrogen atoms and the 2nd, 4th and 5th positions are carbon atoms, and R 1 is alkyl. to display the group or alkenyl group, the carbon atom at the 4-position and 5-position are bonded hydrogen atom. However, the nitrogen atom of 1-position and 3-position of the nitrogen-containing unsaturated 5-membered ring a represents an alkyl group, hydroxyalkyl group, carboxyalkyl group (a hydroxyalkyl group, carboxyalkyl group may form a salt.) If no rather good may have a substituent group selected from, these substituents Is bonded to a hydrogen atom or has no hydrogen atom or substituent .)
(上記(2)式中、R2はアルキル基又はアルケニル基を表し、X,Y,Zはそれぞれ独立に水素原子、アルキル基、ベンジル基、ヒドロキシアルキル基、又はカルボキシアルキル基を表し、ヒドロキシアルキル基、カルボキシアルキル基は塩を形成していてもよい。) (In the formula (2), R 2 represents an alkyl group or an alkenyl group, and X, Y, and Z each independently represent a hydrogen atom, an alkyl group, a benzyl group, a hydroxyalkyl group, or a carboxyalkyl group, Group and carboxyalkyl group may form a salt.)
[2] 前記(A)成分が、クエン酸及びその塩、エチレンジアミン四酢酸及びその塩、並びにメチルグリシン二酢酸及びその塩よりなる群から選ばれる1種又は2種以上であることを特徴とする[1]に記載の銅系部材の孔食停止方法。 [2] The component (A) is one or more selected from the group consisting of citric acid and salts thereof, ethylenediaminetetraacetic acid and salts thereof, and methylglycine diacetic acid and salts thereof. The method for stopping pitting corrosion of a copper-based member according to [1].
[3] 前記(B)成分が、2−アルキル−N−カルボキシメチル−N−ヒドロキシエチルイミダゾリニウムベタインである[1]又は[2]に記載の銅系部材の孔食停止方法。 [ 3 ] The method for stopping pitting corrosion of a copper-based member according to [ 1 ] or [2] , wherein the component (B) is 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine.
[4] 前記(C)成分が、前記(2)式中のXが水素原子で、Yがヒドロキシエチル基で、Zがカルボキシメチル基又は塩を形成したカルボキシメチル基である[1]ないし[3]のいずれかに記載の銅系部材の孔食停止方法。 [ 4 ] The component (C) is [1] to [1], wherein X in the formula (2) is a hydrogen atom, Y is a hydroxyethyl group, and Z is a carboxymethyl group or a carboxymethyl group forming a salt. 3 ] The method for stopping pitting corrosion of a copper-based member according to any one of the above.
[5] 前記(1)式中のR1のアルキル基又はアルケニルキル基の炭素数が6〜18であり、前記(2)式中のR2のアルキル基又はアルケニル基の炭素数が6〜18であることを特徴とする[1]ないし[4]のいずれかに記載の銅系部材の孔食停止方法。 [5] (1) the number of carbon atoms in the alkyl group or Arukenirukiru group R 1 in the formula is 6 to 18, wherein (2) 6 carbon atoms in the alkyl or alkenyl group R 2 in formula 18. The method for stopping pitting corrosion of a copper-based member according to any one of [1] to [ 4 ], wherein
[6] 運転中の機器の銅系部材と接する水系に、前記(A)成分と、(B)成分及び/又は(C)成分を添加することを特徴とする[1]ないし[5]のいずれかに記載の銅系部材の孔食停止方法。 [ 6 ] The component (A), the component (B), and / or the component (C) are added to an aqueous system in contact with a copper-based member of a device in operation. [1] to [ 5 ] A method for stopping pitting corrosion of a copper-based member according to any one of the above.
[7] 銅系部材と接する水系に対して添加することにより、該銅系部材の孔食を停止させる銅系部材の孔食停止剤であって、(A)銅に対しキレート作用を有する化合物(以下、「(A)成分」という。)と、(B)下記式(1)で表される化合物(以下、「(B)成分」という。)及び/又は(C)下記式(2)で表される化合物(以下、「(C)成分」という。)とを含む銅系部材の孔食停止剤であって、(B)成分が、イミダゾール系化合物、イミダゾリン系化合物、イミダゾリニウム塩系化合物及びイミダゾリウム塩系化合物よりなる群から選ばれる1種又は2種以上であることを特徴とする銅系部材の孔食停止剤。 [ 7 ] A pitting corrosion stopping agent for a copper-based member that stops pitting corrosion of the copper-based member by adding to the aqueous system in contact with the copper-based member, and (A) a compound having a chelating action on copper (Hereinafter referred to as “component (A)”) and (B) a compound represented by formula (1) below (hereinafter referred to as “component (B)”) and / or (C) formula (2) below. A pitting corrosion stopper for a copper-based member containing a compound represented by the formula (hereinafter referred to as “component (C)”), wherein the component (B) is an imidazole compound, an imidazoline compound, or an imidazolinium salt. A pitting corrosion stopper for a copper-based member, which is one or more selected from the group consisting of a base compound and an imidazolium salt-based compound .
(上記(1)式中、環Aは1位と3位が窒素原子で、2位、4位及び5位が炭素原子で構成された含窒素不飽和5員環であり、R1はアルキル基又はアルケニル基を表し、4位及び5位の炭素原子には水素原子が結合している。ただし、含窒素不飽和5員環Aの1位及び3位の窒素原子は、アルキル基、ヒドロキシアルキル基、カルボキシルアルキル基(ヒドロキシアルキル基、カルボキシアルキル基は塩を形成していてもよい。)から選択される置換基を有していてもよく、これらの置換基を有さない場合は水素原子が結合しているか、或いは、水素原子も置換基も有さない。) (In the above formula (1), ring A is a nitrogen-containing unsaturated 5-membered ring in which the 1st and 3rd positions are nitrogen atoms and the 2nd, 4th and 5th positions are carbon atoms, and R 1 is alkyl. to display the group or alkenyl group, the carbon atom at the 4-position and 5-position are bonded hydrogen atom. However, the nitrogen atom of 1-position and 3-position of the nitrogen-containing unsaturated 5-membered ring a represents an alkyl group, hydroxyalkyl group, carboxyalkyl group (a hydroxyalkyl group, carboxyalkyl group may form a salt.) If no rather good may have a substituent group selected from, these substituents Is bonded to a hydrogen atom or has no hydrogen atom or substituent .)
(上記(2)式中、R2はアルキル基又はアルケニル基を表し、X,Y,Zはそれぞれ独立に水素原子、アルキル基、ベンジル基、ヒドロキシアルキル基、又はカルボキシアルキル基を表し、ヒドロキシアルキル基、カルボキシアルキル基は塩を形成していてもよい。) (In the formula (2), R 2 represents an alkyl group or an alkenyl group, and X, Y, and Z each independently represent a hydrogen atom, an alkyl group, a benzyl group, a hydroxyalkyl group, or a carboxyalkyl group, Group and carboxyalkyl group may form a salt.)
[8] 前記(A)成分が、クエン酸及びその塩、エチレンジアミン四酢酸及びその塩、並びにメチルグリシン二酢酸及びその塩よりなる群から選ばれる1種又は2種以上であることを特徴とする[7]に記載の銅系部材の孔食停止剤。 [ 8 ] The component (A) is one or more selected from the group consisting of citric acid and salts thereof, ethylenediaminetetraacetic acid and salts thereof, and methylglycine diacetic acid and salts thereof. [ 7 ] The pitting corrosion stopper for copper-based members according to [ 7 ].
[9] 前記(B)成分が、2−アルキル−N−カルボキシメチル−N−ヒドロキシエチルイミダゾリニウムベタインである[7]又は[8]に記載の銅系部材の孔食停止剤。 [ 9 ] The pitting corrosion stopper for copper-based members according to [ 7 ] or [8] , wherein the component (B) is 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine.
[10] 前記(C)成分が、前記(2)式中のXが水素原子で、Yがヒドロキシエチル基で、Zがカルボキシメチル基又は塩を形成したカルボキシメチル基である[7]ないし[9]のいずれかに記載の銅系部材の孔食停止剤。 [ 10 ] The component (C) is [ 7 ] to [ 7 ] wherein X in the formula (2) is a hydrogen atom, Y is a hydroxyethyl group, and Z is a carboxymethyl group or a carboxymethyl group forming a salt. 9 ] The pitting corrosion stopper for copper-based members according to any one of [ 9 ].
[11] 前記(1)式中のR1のアルキル基又はアルケニルキル基の炭素数が6〜18であり、前記(2)式中のR2のアルキル基又はアルケニル基の炭素数が6〜18であることを特徴とする[7]ないし[10]のいずれかに記載の銅系部材の孔食停止剤。 [11] (1) the number of carbon atoms in the alkyl group or Arukenirukiru group R 1 in the formula is 6 to 18, wherein (2) the number of carbon atoms in the alkyl or alkenyl group of R 2 in the formula 6 18. The pitting corrosion stopper for copper-based members according to any one of [ 7 ] to [ 10 ], wherein
本発明では、(A)成分の作用により、進行中の孔食に生じている腐食生成物(緑青)を溶解除去することが可能であり、孔食部の腐食性物質を除去するとともに、防食皮膜を形成可能な表面状態とすることができる。一方、(B)及び/又は(C)成分の作用により、銅表面にカソード反応抑制効果に優れる防食皮膜を形成することが可能であり、(A)成分による銅母材の腐食抑制効果と相俟って、形成された防食皮膜の効果により孔食の再発を有効に抑制することが可能となる。 In the present invention, by the action of the component (A), it is possible to dissolve and remove the corrosion product (greenish blue) generated in the ongoing pitting corrosion, while removing the corrosive substance in the pitting corrosion portion and preventing corrosion. A surface state capable of forming a film can be obtained. On the other hand, by the action of the components (B) and / or (C), it is possible to form an anticorrosive film having an excellent cathode reaction suppressing effect on the copper surface. Therefore, it becomes possible to effectively suppress the recurrence of pitting corrosion by the effect of the formed anticorrosion film.
従って、本発明によれば、冷却水系などの水系に接する銅管等の銅系部材に発生した孔食に対し、薬剤を用いてその進行を効果的に停止し、腐食の再発を確実に抑制して、機器の安定稼動を維持すると共に、寿命を延長することができる。特に、本発明によれば、運転中の機器の銅系部材に生じた孔食に対し、機器の運転を停止することなく孔食の進行停止措置を図ることができ、工業的に極めて有利である。 Therefore, according to the present invention, the pitting corrosion generated in the copper-based member such as the copper pipe in contact with the water system such as the cooling water system is effectively stopped by using the chemical, and the recurrence of the corrosion is surely suppressed. Thus, it is possible to maintain the stable operation of the device and extend the lifetime. In particular, according to the present invention, it is possible to take a measure to stop the progress of pitting corrosion without stopping the operation of the pitting caused to the copper-based member of the operating equipment, which is extremely advantageous industrially. is there.
以下に本発明の銅系部材の孔食停止方法及び孔食停止剤の実施の形態を詳細に説明する。 Embodiments of a pitting corrosion stopping method and a pitting corrosion stopping agent for a copper-based member of the present invention will be described in detail below.
本発明においては、以下の(A)成分と(B)成分及び/又は(C)成分とを銅系部材に接する水系に添加することを特徴とする。 In this invention, the following (A) component, (B) component, and / or (C) component are added to the aqueous system which touches a copper-type member, It is characterized by the above-mentioned.
<(A)成分>
本発明に係る(A)成分は、銅に対しキレート作用を有し、銅の孔食に伴い発生した腐食生成物(緑青)を溶解除去できる物質であれば制限はなく、例えば、クエン酸及びその塩(例えばアルカリ金属塩)、エチレンジアミン四酢酸及びその塩(例えばアルカリ金属塩)、メチルグリシン二酢酸及びその塩(例えばアルカリ金属塩)が好適であり、これらは1種を単独で用いてもよく、2種以上を併用してもよい。これらのうち、特にメチルグリシン二酢酸三ナトリウムが銅に対するキレート作用に優れることから好ましい。
<(A) component>
The component (A) according to the present invention is not limited as long as it has a chelating action on copper and can dissolve and remove the corrosion product (greenish blue) generated by copper pitting corrosion. For example, citric acid and The salt (for example, alkali metal salt), ethylenediaminetetraacetic acid and its salt (for example, alkali metal salt), methylglycine diacetic acid and its salt (for example, alkali metal salt) are preferable, and these may be used alone. In addition, two or more kinds may be used in combination. Of these, trisodium methylglycine diacetate is particularly preferable because of its excellent chelating action on copper.
<(B)成分>
本発明に係る(B)成分は、下記式(1)で表される化合物である。
<(B) component>
The component (B) according to the present invention is a compound represented by the following formula (1).
(上記(1)式中、環Aは1位と3位が窒素原子で、2位、4位及び5位が炭素原子で構成された含窒素不飽和5員環であり、R1はアルキル基又はアルケニル基を表す。ただし、含窒素不飽和5員環Aの窒素原子及び炭素原子は、R1以外の任意の置換基を有していてもよい。) (In the above formula (1), ring A is a nitrogen-containing unsaturated 5-membered ring in which the 1st and 3rd positions are nitrogen atoms and the 2nd, 4th and 5th positions are carbon atoms, and R 1 is alkyl. Represents a group or an alkenyl group, provided that the nitrogen atom and carbon atom of the nitrogen-containing unsaturated 5-membered ring A may have any substituent other than R 1. )
(B)成分としては、イミダゾール系化合物、イミダゾリン系化合物、イミダゾリニウム塩系化合物及びイミダゾリウム塩系化合物が挙げられ、特に、上記式(1)中のR1が、疎水性の炭素数6〜18のアルキル基又はアルケニル基であるもの、とりわけR1が炭素数6〜18のアルキル基であるものが好ましい。 Examples of the component (B) include imidazole compounds, imidazoline compounds, imidazolinium salt compounds, and imidazolium salt compounds. In particular, R 1 in the above formula (1) is a hydrophobic carbon number of 6 Those having an alkyl group or alkenyl group of ˜18, particularly those in which R 1 is an alkyl group having 6 to 18 carbon atoms are preferred.
このような化合物としては、含窒素不飽和5員環Aに各種官能基が導入されたものを用いることも可能であり、例えば含窒素不飽和5員環Aの置換基R1が結合した炭素原子に隣接する窒素原子に、アルキル基、ヒドロキシアルキル基、カルボキシルアルキル基(ヒドロキシアルキル基、カルボキシアルキル基は、ナトリウム塩、カリウム塩等のアルカリ金属塩等の塩を形成していてもよい。)などから選択される1種以上が導入された化合物を好適に用いることができる。 As such a compound, a compound in which various functional groups are introduced into a nitrogen-containing unsaturated 5-membered ring A can be used, for example, a carbon to which a substituent R 1 of the nitrogen-containing unsaturated 5-membered ring A is bonded. An alkyl group, hydroxyalkyl group, carboxylalkyl group (a hydroxyalkyl group, a carboxyalkyl group may form a salt such as an alkali metal salt such as a sodium salt or a potassium salt) on the nitrogen atom adjacent to the atom. A compound into which one or more selected from the above are introduced can be suitably used.
このような化合物として、例えば2−ヘキシルイミダゾール、2−ヘプチルイミダゾール、2−オクチルイミダゾール、2−ノニルイミダゾール、2−デシルイミダゾール、2−ウンデシルイミダゾール、2−ドデシルイミダゾール、2−トリデシルイミダゾール、2−テトラデシルイミダゾール、2−ペンタデシルイミダゾール、2−ヘキサデシルイミダゾール、2−ヘプタデシルイミダゾール、2−オクタデシルイミダゾール、2−アルキル−N−カルボキシメチル−N−ヒドロキシエチルイミダゾリニウムベタイン(アルキル基の炭素数は6〜18)、2−アルキル−N−ヒドロキシエチル−N−カルボキシラートメチルイミダゾリニウム塩(アルキル基の炭素数は6〜18)、2−アルキル−N,N−ビスヒドロキシエチルイミダゾリニウム塩(アルキル基の炭素数は6〜18)、1−メチル−1−ヒドロキシエチル−2−牛脂アルキル−イミダゾリニウム塩などが例示され、2−アルキル−N−カルボキシメチル−N−ヒドロキシエチルイミダゾリニウムベタイン(アルキル基の炭素数は6〜18)が好適であり、2−ウンデシル−N−カルボキシメチル−N−ヒドロキシエチルイミダゾリニウムベタインが特に好適である。 Examples of such compounds include 2-hexylimidazole, 2-heptylimidazole, 2-octylimidazole, 2-nonylimidazole, 2-decylimidazole, 2-undecylimidazole, 2-dodecylimidazole, 2-tridecylimidazole, 2 -Tetradecylimidazole, 2-pentadecylimidazole, 2-hexadecylimidazole, 2-heptadecylimidazole, 2-octadecylimidazole, 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine (carbon of alkyl group) The number is 6 to 18), 2-alkyl-N-hydroxyethyl-N-carboxylatemethylimidazolinium salt (the alkyl group has 6 to 18 carbon atoms), 2-alkyl-N, N-bishydroxyethylimidazo Examples thereof include nium salts (the alkyl group has 6 to 18 carbon atoms), 1-methyl-1-hydroxyethyl-2-tallow alkyl-imidazolinium salt, and the like, and 2-alkyl-N-carboxymethyl-N-hydroxyethyl Imidazolinium betaine (the alkyl group has 6 to 18 carbon atoms) is preferred, and 2-undecyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine is particularly preferred.
これらの(B)成分は、1種を単独で用いてもよく、2種以上を併用してもよい。 These (B) components may be used individually by 1 type, and may use 2 or more types together.
<(C)成分>
本発明に係る(C)成分は、下記式(2)で表される化合物である。
<(C) component>
The component (C) according to the present invention is a compound represented by the following formula (2).
(上記(2)式中、R2はアルキル基又はアルケニル基を表し、X,Y,Zはそれぞれ独立に水素原子、アルキル基、ベンジル基、ヒドロキシアルキル基、又はカルボキシアルキル基を表し、ヒドロキシアルキル基、カルボキシアルキル基は塩を形成していてもよい。) (In the formula (2), R 2 represents an alkyl group or an alkenyl group, and X, Y, and Z each independently represent a hydrogen atom, an alkyl group, a benzyl group, a hydroxyalkyl group, or a carboxyalkyl group, Group and carboxyalkyl group may form a salt.)
上記式(2)中のR2のアルキル基又はアルケニル基の炭素数は6〜18、特に11であることが好ましい。 The number of carbon atoms of the alkyl group or alkenyl group of R 2 in the above formula (2) is preferably 6 to 18, particularly 11.
また、X,Y,Zとしては、それぞれ独立に、水素原子、ヒドロキシエチル基、カルボキシメチル基(ヒドロキシエチル基、カルボキシメチル基はナトリウム塩、カリウム塩等のアルカリ金属塩等の塩を形成していてもよい。)であることが好ましい。 X, Y, and Z are each independently a hydrogen atom, a hydroxyethyl group, or a carboxymethyl group (the hydroxyethyl group or carboxymethyl group forms a salt such as an alkali metal salt such as sodium salt or potassium salt). It is preferable that
(C)成分は、1種を単独で用いてもよく、2種以上を併用してもよい。 As the component (C), one type may be used alone, or two or more types may be used in combination.
また、(B)成分の1種又は2種以上と(C)成分の1種又は2種以上を(A)成分の1種又は2種以上と併用してもよい。 Moreover, you may use together 1 type, or 2 or more types of (B) component, and 1 type or 2 or more types of (C) component with 1 type or 2 or more types of (A) component.
<水系への添加量>
本発明に用いる(A)成分の水系への添加量は、孔食部に生じた銅の腐食生成物(緑青)を溶解除去できる濃度であれば特に制限はなく、孔食の状態、処理対象の水質などにより最適な効果を得られる濃度に調整して用いることができる。(A)成分の水系への添加濃度は、通常50〜5000mg/Lの範囲であり、好ましくは100〜4000mg/Lの範囲で使用することができる。
<Amount added to water system>
The amount of the component (A) used in the present invention added to the aqueous system is not particularly limited as long as it is a concentration that can dissolve and remove the copper corrosion product (greenish blue) generated in the pitting portion. It can be used by adjusting the concentration to obtain an optimum effect depending on the water quality. The concentration of component (A) added to the aqueous system is usually in the range of 50 to 5000 mg / L, preferably in the range of 100 to 4000 mg / L.
(B)及び/又は(C)成分の水系への添加量は、(A)成分による銅母材の腐食を抑制可能で、銅系部材表面に防食皮膜を形成できる量であれば特に制限はなく、処理対象の水質、銅系部材の表面積などにより、最適な効果が得られる濃度に調整して用いることができる。(B)及び/又は(C)成分の水系への添加濃度は、通常0.5〜100mg/Lの範囲であり、好ましくは1〜50mg/Lの範囲で使用することができる。なお、(B)成分と(C)成分を併用する場合は、これらの合計の添加濃度が上記範囲となるようにする。 The amount of the component (B) and / or component (C) added to the aqueous system is not particularly limited as long as it can suppress the corrosion of the copper base material due to the component (A) and can form an anticorrosive film on the surface of the copper-based member. However, it can be used by adjusting the concentration to obtain an optimum effect depending on the water quality to be treated, the surface area of the copper-based member and the like. The concentration of component (B) and / or (C) added to the aqueous system is usually in the range of 0.5 to 100 mg / L, preferably 1 to 50 mg / L. In addition, when using together (B) component and (C) component, it is made for the total addition density | concentration of these to become the said range.
(A)成分と(B)成分及び/又は(C)成分との添加重量比については特に制限はないが、通常、(A)成分に対して、(B)成分及び/又は(C)成分の割合が0.5〜50重量%、特に1〜20重量%程度となるように添加することが好ましい。 Although there is no restriction | limiting in particular about the addition weight ratio of (A) component, (B) component, and / or (C) component, Usually, (B) component and / or (C) component with respect to (A) component It is preferable to add so that the ratio of the above becomes 0.5 to 50% by weight, particularly about 1 to 20% by weight.
<処理対象水系の条件>
本発明による処理時(即ち、(A)成分と(B)成分及び/又は(C)成分の添加時)の水系の温度(水温)としては、本発明の効果を得ることができる条件であれば特に制限はないが、5〜60℃の範囲が好ましい。また、処理時の水系のpHとしては、通常4〜11の範囲で処理が行われる。
<Conditions of target water system>
The temperature (water temperature) of the aqueous system at the time of treatment according to the present invention (that is, at the time of adding the component (A) and the component (B) and / or the component (C)) is a condition that can obtain the effect of the present invention. If it does not have a restriction | limiting in particular, The range of 5-60 degreeC is preferable. Moreover, as a pH of the aqueous system at the time of a process, a process is normally performed in the range of 4-11.
本発明による処理時の水系の流速についても、本発明の効果を得ることができる条件であれば特に制限はないが、通常0.1〜2m/sの範囲で処理を行う。静止条件においても処理を行うことが可能であるが、この場合には、添加した薬剤の銅系部材表面への拡散が律速となるため、添加濃度を高めるなどの措置が必要となる。 The flow rate of the aqueous system during the treatment according to the present invention is not particularly limited as long as the effect of the present invention can be obtained, but the treatment is usually performed in the range of 0.1 to 2 m / s. Although it is possible to perform the treatment even in a stationary condition, in this case, since the diffusion of the added drug to the surface of the copper-based member becomes rate-limiting, measures such as increasing the concentration of addition are required.
(A)成分と(B)及び/又は(C)成分の水系への添加方法には特に制限はなく、各成分を別々に添加することも可能であり、あらかじめ(A)成分と(B)及び/又は(C)成分とを一剤に配合した水処理剤として水系へ添加することも可能である。 There is no restriction | limiting in particular in the addition method to the aqueous system of (A) component and (B) and / or (C) component, It is also possible to add each component separately, (A) component and (B) beforehand It is also possible to add to the aqueous system as a water treatment agent in which the component (C) and / or component (C) are mixed.
本発明においては、本発明の効果を阻害しない範囲で、上記(A)〜(C)成分以外の他の水処理剤、例えば防食剤、スケール防止剤、分散剤、スライムコントロール剤、剥離剤、消泡剤などを併用することが可能である。 In the present invention, water treatment agents other than the above components (A) to (C), such as anticorrosives, scale inhibitors, dispersants, slime control agents, release agents, as long as the effects of the present invention are not impaired. It is possible to use an antifoaming agent in combination.
本発明の銅系部材の孔食停止方法は、特に運転中の機器の銅系部材と接する水系に(A)成分と(B)成分及び/又は(C)成分を添加して実施することもでき、工業的に極めて有利である。ただし、本発明の銅系部材の孔食停止方法は運転を停止した状態で行ってもよいことは言うまでもない。 The method for stopping pitting corrosion of a copper-based member of the present invention may be carried out by adding the component (A), the component (B) and / or the component (C) to an aqueous system that is in contact with the copper-based member of an operating device. This is industrially extremely advantageous. However, it goes without saying that the pitting corrosion stopping method for a copper-based member of the present invention may be performed in a state where the operation is stopped.
<銅系部材の孔食停止剤>
本発明の銅系部材の孔食停止剤は、前述の(A)成分と(B)成分及び/又は(C)成分とを含有するものであり、これらが一剤化されたものであってもよく、各成分が別々に提供されるものであってもよい。
<Pitting corrosion stopper for copper-based members>
The pitting corrosion stopper of the copper-based member of the present invention contains the aforementioned component (A), component (B), and / or component (C), and these are integrated into a single agent. Alternatively, each component may be provided separately.
本発明の銅系部材の孔食停止剤中の各成分の含有割合には特に制限はなく、また、本発明の銅系部材の孔食停止剤は、(A)〜(C)成分以外の防食剤、スケール防止剤、分散剤、スライムコントロール剤、剥離剤、消泡剤等の他の薬剤を含むものであってもよいが、(A)成分と(B)成分及び/又は(C)成分の併用による優れた効果を十分に得るために、本発明の孔食停止剤は、(A)成分に対して、(B)成分及び/又は(C)成分の割合が0.5〜50重量%、特に1〜20重量%程度となるようにこれらを含有することが好ましい。 There is no restriction | limiting in particular in the content rate of each component in the pitting corrosion stopper of the copper-type member of this invention, Moreover, the pitting corrosion stopper of the copper-type member of this invention is other than (A)-(C) component. Although it may contain other chemicals such as anticorrosive, scale inhibitor, dispersant, slime control agent, release agent, antifoaming agent, (A) component and (B) component and / or (C) In order to sufficiently obtain the excellent effect of the combined use of the components, the pitting corrosion stopper of the present invention has a ratio of the component (B) and / or the component (C) of 0.5 to 50 with respect to the component (A). It is preferable to contain these in an amount of about 1% by weight, particularly about 1 to 20% by weight.
以下に実施例を挙げて本発明をより具体的に説明する。 Hereinafter, the present invention will be described more specifically with reference to examples.
なお、以下において用いた(A)〜(C)成分の各薬剤は以下の略号で示す。 In addition, each chemical | medical agent of the (A)-(C) component used below is shown with the following abbreviations.
<(A)成分>
MG:メチルグリシン二酢酸三ナトリウム
ED:エチレンジアミン四酢酸二ナトリウム
CA:クエン酸
<(B)成分>
AC:2−ウンデシル−N−カルボキシメチル−N−ヒドロキシエチルイミダゾリニウムベタイン
<(C)成分>
AA:(2)式中、R2がウンデシル基、Xが水素原子、Yがヒドロキシエチル基、Zがカルボキシメチル基の化合物
<(A) component>
MG: trisodium methylglycine diacetate ED: disodium ethylenediaminetetraacetate CA: citric acid <component (B)>
AC: 2-undecyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine <(C) component>
AA: (2) In the formula, R 2 is an undecyl group, X is a hydrogen atom, Y is a hydroxyethyl group, and Z is a carboxymethyl group
〔実施例1〜7、比較例1〜5:緑青の溶解除去効果と腐食への影響〕
表1に示す試験水に表2に示す濃度で各薬剤を添加した調整水(ただし、比較例1では薬剤添加せず。)を1Lのビーカーに入れ、この調整水中に、以下の試験片I,IIを浸漬し、スターラーで攪拌し、水温30℃の条件で緑青の溶解除去効果と腐食への影響を調べる実験を行った。
[Examples 1 to 7, Comparative Examples 1 to 5: Effect of dissolution and removal of patina and corrosion]
Adjusted water (not added in Comparative Example 1) with each drug added at the concentration shown in Table 2 to the test water shown in Table 1 was placed in a 1 L beaker, and the following test piece I was placed in this adjusted water: , II were immersed, stirred with a stirrer, and an experiment was conducted to investigate the effect of removing and dissolving patina and the effect on corrosion under the condition of a water temperature of 30 ° C.
試験片I:銅の孔食が生じ、腐食生成物である緑青が発生した銅管を半割りし、
長手方向に2cmの長さとなるよう切断したもの。
試験片II:表面を#400番研磨した銅片(W30mm×L50mm×t1mm)
Specimen I: Copper pitting corrosion occurred, and the copper tube in which the corrosion product patina was generated was halved.
Cut to a length of 2 cm in the longitudinal direction.
Test piece II: Copper piece # 400 polished (W30 mm × L50 mm × t1 mm)
試験片Iを調整水に浸漬し、試験片I表面の緑青の状態変化(緑青が除去されるか否か)を確認した。
また、試験片IIを調整水に浸漬し、浸漬前後の試験片IIの重量変化から腐食速度を求め、腐食抑制効果を評価した。
これらの結果を総合判定結果と共に、表2に示した。
The test piece I was immersed in adjustment water, and the greenish blue state change (whether the patina was removed) on the surface of the test piece I was confirmed.
Moreover, the test piece II was immersed in adjustment water, the corrosion rate was calculated | required from the weight change of the test piece II before and behind immersion, and the corrosion inhibitory effect was evaluated.
These results are shown in Table 2 together with the comprehensive judgment results.
(A)成分と(B)及び/又は(C)成分を添加した実施例1〜7では、試験片Iの緑青が溶解除去され、試験片IIの腐食速度も低い値に抑制することができたのに対し、(A)成分のみを添加した比較例2では腐食速度が大きくなり、一方、(B)成分や(C)成分のみを添加した比較例3〜5では、試験片Iの緑青が溶解除去されない結果となった。
以上の通り、本発明により、緑青の溶解除去により防食皮膜の形成可能な表面状態を実現するとともに、防食皮膜の形成により母材が腐食しない状態を実現することができることが確認された。
In Examples 1 to 7 in which the component (A) and the component (B) and / or the component (C) are added, the patina of the test piece I is dissolved and removed, and the corrosion rate of the test piece II can be suppressed to a low value. On the other hand, in Comparative Example 2 in which only component (A) was added, the corrosion rate increased, while in Comparative Examples 3 to 5 in which only component (B) or component (C) was added, the patina of test piece I As a result, it was not dissolved and removed.
As described above, according to the present invention, it was confirmed that a surface state capable of forming an anticorrosion film can be realized by dissolving and removing patina, and a state where the base material is not corroded can be realized by forming the anticorrosion film.
〔実施例8,9、比較例6,7:孔食停止効果〕
図1に示す構造の評価電極1を用い、孔食の進行状況を評価した。ここでは、人工的アノード2としてφ0.45mmのリン脱酸銅ワイヤーを、人工的カソード3として中心部にφ1mmの孔をあけたφ3cmのリン脱酸銅試片を用い、これらを樹脂4で絶縁して評価電極1とした。5は被覆導線である。
評価電極1の人工的アノード2の表面及び人工的カソード3の表面は#400番の研磨紙にて湿式研磨を行った。
この評価電極1を、表3に示す水質の試験水に浸漬した。
[Examples 8 and 9, Comparative Examples 6 and 7: Pitting corrosion stopping effect]
The progress of pitting corrosion was evaluated using the
The surface of the
The
ポテンショガルバノスタット(北斗電工製ポテンショスタット/ガルバノスタットHA−151A型)を用い、人工的アノード2部に所定の電流を一定時間通電する方法により、人工的アノード2部が腐食生成物で覆われた状態とする措置を行った。対極として炭素棒、照合極として飽和KCl銀塩化銀電極を用い、評価電極1の人工的アノード2部を試料極とし、人工的アノード2部に腐食生成物を発生させた。ここでは、10μAの電流を2時間通電し、人工的アノード2部が腐食生成物で覆われた状態とした。
Using a potentiogalvanostat (potentiostat / galvanostat HA-151A type, manufactured by Hokuto Denko), the
人工的アノード2部が腐食生成物で覆われた状態とする措置を行ったアノードは、直ちに人工的カソード3と無抵抗電流計(東方技研製ポータブル無抵抗電流計MODEL AM−03)を介して接続し、孔食進行にともなう電流を測定した。
The anode which took measures to make the
試験水に定期的に次亜塩素酸ナトリウムを添加し、人工的アノード2−人工的カソード3間を流れる孔食進行に伴う電流(以下「孔食電流」と表記する。)が継続して約110nA(孔食進行速度約0.8mm/yに相当)を推移する状態(孔食が進行している状態)を再現し、評価を実施した。
Sodium hypochlorite is periodically added to the test water, and the current accompanying the progress of pitting corrosion flowing between the
このような評価において、試験水に表4に示す薬剤を表4に示す濃度で添加して(ただし、比較例6では薬剤添加せず。)、孔食電流の推移を確認した。 In such an evaluation, the chemicals shown in Table 4 were added to the test water at the concentrations shown in Table 4 (however, no chemicals were added in Comparative Example 6), and the transition of the pitting current was confirmed.
孔食電流の推移を図2に示す。
本発明の方法による実施例8及び9では、(A)成分と(B)成分及び/又は(C)成分添加直後に孔食電流の急激な低下が認められ、その後の腐食の再発に伴う電流上昇は確認されなかった。一方、各種薬剤を添加しない比較例6では、孔食電流の低下が認められなかった。また、(C)成分のみを添加した比較例7では、緩やかな孔食電流の低下が認められたものの、短期間の孔食停止を示す電流挙動は認められなかった。
以上の通り、本発明の方法により、進行中の孔食を速やかに停止させることができることが確認された。
The transition of the pitting current is shown in FIG.
In Examples 8 and 9 according to the method of the present invention, a rapid decrease in the pitting current was observed immediately after the addition of the component (A) and the component (B) and / or the component (C). An increase was not confirmed. On the other hand, in Comparative Example 6 in which various chemicals were not added, no decrease in pitting current was observed. Further, in Comparative Example 7 in which only the component (C) was added, although a gradual decrease in pitting current was observed, no current behavior indicating a short-term stop of pitting corrosion was observed.
As described above, it was confirmed that the pitting corrosion in progress can be quickly stopped by the method of the present invention.
1 評価電極
2 人工的アノード
3 人工的カソード
4 樹脂
5 被覆導線
1
Claims (11)
該(B)成分が、イミダゾール系化合物、イミダゾリン系化合物、イミダゾリニウム塩系化合物及びイミダゾリウム塩系化合物よりなる群から選ばれる1種又は2種以上であることを特徴とする銅系部材の孔食停止方法。
The component (B) is one or more selected from the group consisting of an imidazole compound, an imidazoline compound, an imidazolinium salt compound, and an imidazolium salt compound. How to stop pitting corrosion.
(B)成分が、イミダゾール系化合物、イミダゾリン系化合物、イミダゾリニウム塩系化合物及びイミダゾリウム塩系化合物よりなる群から選ばれる1種又は2種以上であることを特徴とする銅系部材の孔食停止剤。
(B) The hole of the copper-based member, wherein the component is one or more selected from the group consisting of an imidazole compound, an imidazoline compound, an imidazolinium salt compound, and an imidazolium salt compound Stop food.
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