JP5716149B2 - Acceleration sensor - Google Patents

Description

  The present invention relates to a capacitance type acceleration sensor.

  Conventionally, as shown in FIG. 5A, a rectangular parallelepiped weight portion 100 having a movable electrode, and a pair of beam portions 101 that rotatably support the weight portion 100 at a substantially center in the longitudinal direction of the weight portion 100. And a pair of fixed electrodes 102 and 103 arranged to face each other on the one side and the other side of the surface of the weight portion 100 with a straight line connecting the pair of beam portions 101 as a boundary line. An acceleration sensor provided is known (for example, see Patent Document 1). This acceleration sensor includes a movable electrode (a portion facing the fixed electrodes 102 and 103 in the weight portion 100) and the fixed electrodes 102 and 103 that accompany the rotation of the weight portion 100 with the boundary line as a rotation axis. The acceleration applied to the weight part 100 is detected by differentially detecting the change in capacitance. In such an acceleration sensor, by forming the recess 104 on one side (right side in FIG. 5A) of the back surface of the weight part 100 with the boundary line interposed therebetween, the weight part 100 has one side of the boundary line interposed therebetween. The side (right side) and the other side (left side) are configured to have different weights. Thus, when the acceleration is applied, a moment with the boundary line as the rotation axis is generated in the weight portion 100. Here, in order to prevent the portion of the weight portion 100 where the concave portion 104 is formed from being deformed by stress from the surroundings, the reinforcing wall 105 that divides the concave portion 104 into two is arranged in a direction parallel to the boundary line. It is formed integrally with the weight part 100 along.

Special table 2008-544243 gazette

  By the way, although the acceleration sensor described above can detect acceleration in two directions orthogonal to the rotation axis, an angle formed by a perpendicular line drawn from the center of gravity of the weight portion 100 to the rotation axis and the surface of the weight portion 100. By setting θ to approximately 45 degrees, the detection sensitivities in these two directions are made equivalent. Here, as one of the means for improving the detection sensitivity of the acceleration sensor, there is a method of increasing the area of the movable electrode. When this method is adopted, in order to maintain the above angle θ at about 45 degrees. The thickness dimension of the weight part 100 must be increased. When the thickness of the weight part 100 is increased, the etching process for forming the weight part 100 takes a long time, which is not practical.

  Therefore, in order to maintain the above angle θ at about 45 degrees without increasing the thickness dimension of the weight portion 100, as shown in FIG. There is a method of reducing the weight of the weight part 100 by punching. However, when this method is adopted, there is a problem in that the strength of the thin portion reduced in weight in the weight portion 100 is insufficient, which is not preferable.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an acceleration sensor capable of improving detection sensitivity without increasing the thickness or weight of the weight portion.

The invention of claim 1, in order to achieve the above object, the weight as the weight portions a recess and the charge real part is formed integrally to open on one side, and the concave portion and the solid portion are arranged along the rotational direction A pair of beam portions that rotatably support the portion, a movable electrode provided across the concave portion and the solid portion on the other surface different from the one surface where the concave portion opens, and the concave portion side of the movable electrode. A sensor portion having a first fixed electrode disposed at a position, and a static portion between the movable electrode and the fixed electrode associated with the rotation of the weight portion with a straight line connecting the pair of beam portions as a rotation axis. a acceleration sensor for detecting acceleration from a change in capacitance, characterized by being staggered on the concave side of the bi over beam portion from substantially the center in the longitudinal direction of the weight portion.

  The invention of claim 2 is characterized in that, in the invention of claim 1, the acceleration in the first direction applied to the weight portion and the acceleration in the second direction orthogonal to the first direction are detected. .

  According to a third aspect of the present invention, in the second aspect of the present invention, a plurality of sensor portions are formed on the same chip.

  According to a fourth aspect of the present invention, in the third aspect of the present invention, two sensor portions are formed on the same chip, and one sensor portion is rotated 180 degrees in the same plane with respect to the other sensor portion. It is characterized by.

  The invention of claim 5 is characterized in that, in the invention of claim 4, two sensor portions are arranged adjacent to each other.

  According to a sixth aspect of the present invention, in the third aspect of the present invention, three sensor portions are formed on the same chip, and the two sensor portions are respectively 90 degrees and 180 degrees in the same plane with respect to the remaining one sensor portion. It is characterized by being rotated.

The invention of claim 7 is the invention of any one of claims 1 to 6, the protrusion is formed on the surface facing the fixed electrode of the solid-facing surface of the movable electrode of the constant electrode or the movable electrode It is characterized by that.

The invention according to claim 8 is the invention according to claim 7 , wherein the protrusion is formed of silicon or a silicon oxide film.

The invention according to claim 9 is the invention according to claim 7 , characterized in that the projection has a surface layer formed of a carbon material.

The invention of claim 10 is characterized in that, in the invention of claim 9 , the carbon material is a carbon nanotube.

An eleventh aspect of the invention is the invention according to any one of the first to tenth aspects, further comprising a fixing plate arranged with a predetermined distance from a surface opposite to a side where the fixed electrode of the weight portion faces. The surface of the fixing plate facing the weight portion is provided with an adhesion preventing film for preventing the weight portion from adhering.

The invention of claim 12 is characterized in that, in the invention of claim 11 , the adhesion preventing film is formed of the same material as the fixed electrode.

The invention of claim 13 is characterized in that, in the invention of claim 11 or 12 , the adhesion preventing film is formed simultaneously with the fixed electrode.

According to a fourteenth aspect of the present invention, in the invention according to any one of the eleventh to thirteenth aspects, the adhesion preventing film is formed using a semiconductor manufacturing process.

A fifteenth aspect of the invention is characterized in that, in the invention of any one of the eleventh to fourteenth aspects, the adhesion preventing film is formed of an aluminum alloy.

The invention of claim 16 is the invention of any one of claims 11 to 15, by generating a suction force between the fixed electrode and the movable electrode, electrostatic between the fixed electrode and the movable electrode It is characterized by detecting a change in capacitance.

The invention of claim 17 is characterized in that, in the invention of claim 16, a thin film made of an organic material is provided on the surface of the adhesion preventing film.

The invention of claim 18 is the invention of claim 17 , characterized in that the thin film is a polyimide thin film.
The invention of claim 19 is the invention according to any one of claims 1 to 18, wherein the sensor portion includes a second fixed electrode disposed at a position facing the solid portion side of the movable electrode. And
The invention of claim 20 comprises, in the invention of claim 19, a frame part including the weight part, and a pair of detection electrodes formed on the frame part and electrically connected to each fixed electrode, A gap is provided between the detection electrodes, between each detection electrode and the frame portion, and between each detection electrode and the weight portion.
The invention according to claim 21 is the invention according to any one of claims 1 to 20, wherein the angle formed by the perpendicular line drawn from the center of gravity of the weight portion to the rotation shaft and the surface of the movable electrode is approximately 45 degrees. It is characterized by that.

According to the present invention, when improving the detection sensitivity by increasing the area of the movable electrode, because it can cope with only staggered bicycloalkyl over arm portions, increasing the thickness of the weight portion, or the weight section Detection sensitivity can be improved without reducing the weight.

It is principal part sectional drawing which shows embodiment of the acceleration sensor which concerns on this invention. It is an exploded perspective view same as the above. (A) is the top view which abbreviate | omitted the upper fixing board and conductive pattern same as the above, (b) is the A-A 'sectional view taken on the line A-A' of (a). It is a bottom view of a sensor chip same as the above. (A) is principal part sectional drawing which shows the conventional acceleration sensor, (b) is principal part sectional drawing at the time of penetrating directly under the beam part of (a).

  Hereinafter, embodiments of an acceleration sensor according to the present invention will be described with reference to the drawings. In the following description, the vertical direction in FIG. 1 is the vertical direction, the direction parallel to the short direction of the sensor chip 1 is the x direction, and the direction parallel to the longitudinal direction of the sensor chip 1 is the y direction, x direction, and y direction. The directions orthogonal to each other are defined as the z direction. In the present embodiment, as shown in FIGS. 1 and 2, the sensor chip 1 whose outer shape is a rectangular plate, the upper fixing plate 2 a fixed to the upper surface side of the sensor chip 1, and the lower surface side of the sensor chip 1 are fixed. And a lower fixing plate 2b.

  The sensor chip 1 has a state in which a gap is formed between a frame portion 3 in which two rectangular frame portions 3a and 3b as viewed in the vertical direction are arranged in parallel in the longitudinal direction and an inner peripheral surface of the frame portions 3a and 3b. The weights 4 and 5 having a rectangular parallelepiped shape arranged in the frame portions 3a and 3b and the inner peripheral surface of the frame portions 3a and 3b and the side surfaces of the weight portions 4 and 5 are connected to the frame portion 3 to be weighted. A pair of beam portions 6a, 6b and 7a, 7b for rotatably supporting the portions 4, 5 and movable electrodes 4a, 5a formed on the upper surfaces of the weight portions 4, 5 are provided.

  As shown in FIGS. 1 and 3 (b), the weight portions 4 and 5 are formed integrally with concave portions 41 and 51 that open on one surface (lower surface) and solid portions 40 and 50 excluding the concave portions 41 and 51, respectively. Yes. The concave portions 41 and 51 are formed in a square shape in plan view when viewed from the normal direction (vertical direction) of the opening surface, and the reinforcing walls 42 and 52 that divide the concave portions 41 and 51 into four parts are formed with the weight portions 4 and 5. It is integrally formed.

  Here, in this embodiment, as shown in FIG. 4, a pair of reinforcing walls 42, 52 having a square shape in plan view and the central portions of the reinforcing walls 42, 52 are connected by flat reinforcing walls 42 ', 52'. In other words, a configuration is adopted in which the plurality of reinforcing walls 42 and 52 are coupled to the inner wall surface at positions where they do not intersect with the apex angles of the recesses 41 and 51. Thus, since the angles formed by the reinforcing walls 42 and 52 and the inner wall surface at the four corners of the recesses 41 and 51 are obtuse, it is easy to form (etch) the recesses 41 and 51 in the weights 4 and 5. ing.

  The pair of beam portions 6a and 6b connects the frame portion 3a and the substantially central portion in the x direction of the side surface facing the frame portion 3a of the weight portion 4. Similarly, the pair of beam portions 7a and 7b connects the frame portion 3b and the substantially central portion in the x direction of the side surface facing the frame portion 3b of the weight portion 5. Thus, a straight line connecting the pair of beam portions 6a and 6b and a straight line connecting the pair of beam portions 7a and 7b serve as a rotation axis, and the weight portions 4 and 5 rotate around the rotation axis. It is like that.

  The sensor chip 1 is formed by processing an SOI (Silicon on Insulator) substrate by a semiconductor microfabrication technique, and the portions including the upper surfaces of the weight portions 4 and 5 become the movable electrodes 4a and 5a. Further, protrusions 43a, 43b, 53a, 53b for preventing the weights 4, 5 from directly colliding with the upper fixing plate 2a and the lower fixing plate 2b protrude from the upper and lower surfaces of the weights 4, 5, respectively. It is installed.

  Here, when the protrusions 43a, 43b, 53a, and 53b are formed of the main material of the sensor chip such as silicon or silicon oxide film, the protrusions 43a, 43b, 53a, and 53b can be easily manufactured. The surface layers of the protrusions 43a, 43b, 53a, 53b may be coated with a carbon material. In this case, the mechanical strength of the protrusions 43a, 43b, 53a, 53b is increased, and the protrusions 43a, 43b, 53a, 53b can be prevented from being damaged by the collision with the upper fixing plate 2a and the lower fixing plate 2b. it can. Furthermore, if carbon nanotubes are used as the carbon material, the thickness of the coating can be reduced, so that the protrusions 43a, 43b, 53a, 53b can be easily adjusted to the desired height.

  The upper fixed plate 2a is made of an insulating material such as glass, for example, and the lower surface thereof has the first fixed electrode 20a and the first fixed electrode 20a at a position facing the weight portion 4 (movable electrode 4a) of the sensor chip 1 along the vertical direction. The second fixed electrode 20b and the second fixed electrode 20b are arranged side by side in the x direction, and the first fixed electrode 21a and the second fixed electrode 20a are arranged at positions facing the weight portion 5 (movable electrode 5a) of the sensor chip 1 along the vertical direction. The fixed electrode 21b is juxtaposed in the x direction. Further, five through holes 22a to 22e are arranged side by side in the y direction on one end side in the x direction of the upper fixing plate 2a. Further, a plurality of conductive patterns (not shown) electrically connected to the fixed electrodes 20a, 20b and 21a, 21b are formed on the lower surface of the upper fixed plate 2a.

  On the other hand, a total of four electrode portions 8 a, 8 b, 9 a, 9 b separated from the frame portion 3 are juxtaposed on one end side in the x direction of the sensor chip 1. The four electrode portions 8a, 8b, 9a, and 9b are formed with detection electrodes 80a, 80b, 90a, and 90b made of a metal film substantially at the center on the upper surface, and upper surfaces of end portions facing the frame portions 3a and 3b. Further, press contact electrodes 81a, 81b, 91a, 91b (only the press contact electrode 91a are shown) made of a metal film are formed respectively. A ground electrode 10 is formed between the electrode portions 8b and 9a on the upper surface of the frame portion 3. Then, when the upper fixing plate 2a is joined to the upper surface of the sensor chip 1, the conductive pattern formed on the lower surface of the upper fixing plate 2a and the press contact electrodes 81a, 81b, 91a, 91b are press contact connected. Each detection electrode 80a, 80b, 90a, 90b is electrically connected to each fixed electrode 20a, 20b, 21a, 21b, and each detection electrode 80a, 80b, through the through holes 22a-22d of the upper fixed plate 2a. 90a and 90b are exposed to the outside. The ground electrode 10 is also exposed to the outside through the through hole 22e.

  In this embodiment, as shown in FIG. 2, between the electrode portion 8 a and the electrode portion 8 b, between the electrode portion 9 a and the electrode portion 9 b, each electrode portion 8 a, 8 b, 9 a, 9 b and the frame portion 3. Between the electrode portions 8a, 8b, 9a, 9b and the weight portions 4, 5, gaps are provided. With this configuration, the detection electrodes 80a, 80b, 90a, and 90b are electrically insulated from each other, thereby reducing parasitic capacitance of the detection electrodes 80a, 80b, 90a, and 90b and crosstalk between the electrodes. Highly accurate capacitance detection can be performed.

  The lower fixing plate 2b is made of an insulating material such as glass like the upper fixing plate 2a, and the upper surface of the lower fixing plate 2b is respectively attached to the sensor chip 1 at positions facing the weight portions 4 and 5 along the vertical direction. , 23b are formed. These adhesion preventing films 23a, 23b are made of the same material as the fixed electrodes 20a,... Such as an aluminum alloy, and prevent the lower surfaces of the rotated weight parts 4, 5 from adhering to the lower fixed plate 2b. ing. In this way, the adhesion preventing films 23a, 23b can be easily formed by forming the adhesion preventing films 23a, 23b from the same material as the fixed electrodes 20a,. At this time, if the adhesion preventing films 23a, 23b are formed simultaneously with the fixed electrodes 20a,..., Between the weight portions 4, 5 and the fixed electrodes 20a,... And between the weight portions 4, 5 and the lower fixed plate 2b. The accuracy of the distance can be increased.

  When the adhesion preventing films 23a and 23b are formed by a semiconductor manufacturing process, minute irregularities are formed on the surfaces of the adhesion preventing films 23a and 23b, so that the weight portions 4 and 5 adhere to the lower fixing plate 2b. Can be more suitably prevented. Here, when the adhesion preventing films 23a and 23b are formed of an aluminum alloy, the etching process becomes easy. Further, by forming an organic material thin film such as a polyimide thin film having good consistency with the semiconductor manufacturing process and easy to process on the surface of the adhesion preventing films 23a and 23b, the adhesion preventing films 23a and 23b and the weight part 4 are formed. , 5 may be prevented from being short-circuited.

  Here, in this embodiment, the frame portion 3a, the weight portion 4, the beam portions 6a and 6b, the movable electrode 4a, the first and second fixed electrodes 20a and 20b, the detection electrodes 80a and 80b, the frame portion 3b and the weight. The sensor unit is composed of the unit 5, the beam units 7a and 7b, the movable electrode 5a, the first and second fixed electrodes 21a and 21b, and the detection electrodes 90a and 90b. , 50 and recesses 41, 51) are inverted by 180 degrees, and the two sensor parts are formed integrally.

Next, the detection operation of this embodiment will be described. First, consider a case where an acceleration in the x direction is applied to one weight portion 4. When acceleration is applied in the x direction, the weight 4 rotates about the rotation axis, and the distance between the movable electrode 4a and the first fixed electrode 20a and the second fixed electrode 20b changes. As a result, the capacitances C1 and C2 between the movable electrode 4a and the fixed electrodes 20a and 20b also change. Here, the capacitance between the movable electrode 4a and each fixed electrode 20a, 20b when no acceleration in the x direction is applied is C0, and the change in capacitance caused by the application of acceleration is ΔC. For example, the capacitances C1 and C2 when the acceleration in the x direction is applied are:
C1 = C0−ΔC (1)
C2 = C0 + ΔC (2)
It can be expressed as.

Similarly, when an acceleration in the x direction is applied to the other weight portion 5, the capacitances C3 and C4 between the movable electrode 5a and the fixed electrodes 21a and 21b are:
C3 = C0−ΔC (3)
C4 = C0 + ΔC (4)
It can be expressed as.

  Here, the values of the capacitances C1 to C4 can be detected by performing arithmetic processing on voltage signals taken from the detection electrodes 80a and 80b and 90a and 90b. Then, the difference value CA (= C1-C2) between the capacitances C1, C2 obtained from one sensor unit and the difference value CB (= C3-C4) between the capacitances C3, C4 obtained from the other sensor unit. Is calculated (± 4ΔC), the direction and magnitude of the acceleration applied in the x direction can be calculated based on the sum of the difference values CA and CB.

Next, consider a case where an acceleration in the z direction is applied to one weight portion 4. When acceleration is applied in the z direction, the weight portion 4 rotates around the rotation axis, and the distance between the movable electrode 4a and the first fixed electrode 20a and the second fixed electrode 20b changes. As a result, the capacitances C1 and C2 between the movable electrode 4a and the fixed electrodes 20a and 20b also change. Here, the capacitance between the movable electrode 4a and the fixed electrodes 20a and 20b when no acceleration in the z direction is applied is C0, and the change in capacitance caused by the application of acceleration is ΔC. For example, the capacitances C1 and C2 when the acceleration in the z direction is applied are:
C1 = C0 + ΔC (5)
C2 = C0−ΔC (6)
It can be expressed as.

Similarly, when acceleration in the z direction is applied to the other weight portion 5, the capacitances C3 and C4 between the movable electrode 5a and the fixed electrodes 21 and 21b are:
C3 = C0−ΔC (7)
C4 = C0 + ΔC (8)
It can be expressed as.

  Then, the difference value CA (= C1-C2) between the capacitances C1, C2 obtained from one sensor unit and the difference value CB (= C3-C4) between the capacitances C3, C4 obtained from the other sensor unit. Is calculated (± 4ΔC), the direction and magnitude of the acceleration applied in the z direction can be calculated based on the difference between the difference values CA and CB. Note that calculation processing for obtaining the direction and magnitude of the acceleration in the x direction and the z direction based on the sum and difference of the difference values CA and CB is well known in the art, and detailed description thereof is omitted here.

  By the way, as described above, when the area of the movable electrodes 4a and 5a is increased in order to increase the detection sensitivity of the acceleration sensor, the perpendicular line drawn from the center of gravity of the weights 4 and 5 to the rotation axis and the movable electrodes 4a and 5a. In order to maintain the angle formed with the surface at about 45 degrees, the thickness of the weight portions 4 and 5 is increased, or the weight portions 4 and 5 are lightly penetrated directly under the beam portions 6a, 6b, 7a and 7b. It is not desirable to change the method. Therefore, in this embodiment, as shown in FIG. 1, the beam portions 6a, 6b, 7a, 7b (only the beam portion 6b is shown in the figure) are recessed from the approximate center in the longitudinal direction of the weight portions 4, 5. By shifting to the side (right side), the angle θ formed by the perpendicular line drawn from the center of gravity of the weights 4 and 5 to the rotation axis and the surfaces of the movable electrodes 4a and 5a is approximately 45 degrees. Yes. Thus, the angle θ can be maintained at about 45 degrees simply by shifting the beam portions 6a, 6b, 7a, 7b, so that the thickness dimensions of the weight portions 4, 5 are increased, or the weight portion 4 , 5 can be improved without reducing the weight.

  In the present embodiment, the operation of the acceleration sensor can be confirmed by following the following procedure. That is, an attractive force is generated between the first fixed electrode 20a or the second fixed electrode 20b and the movable electrode 4a, or between the first fixed electrode 21a or the second fixed electrode 21b and the movable electrode 5a. Thus, the weight parts 4 and 5 are rotated. Whether the acceleration sensor is operating normally by detecting a change in capacitance between the fixed electrodes 20a,... And the weights 4 and 5 that occur as the weights 4 and 5 rotate. You can check whether or not. The same operation confirmation may be performed by generating a suction force between the adhesion preventing films 23a and 23b and the movable electrodes 4a and 5a.

  In the present embodiment, an acceleration sensor that detects acceleration in two directions, the x direction and the z direction, is illustrated. However, if one of the above-described sensor units is arranged 90 degrees rotationally symmetrical in the xy plane, the y direction Thus, it is possible to realize an acceleration sensor that detects acceleration in three directions with the addition of. Further, even if three sensor units are arranged on the same chip and two sensor units are arranged symmetrically by 90 degrees and 180 degrees on the xy plane with respect to the remaining one sensor part, 3 An acceleration sensor that detects the acceleration in the direction can be realized.

20a, 21a 1st fixed electrode 20b, 21b 2nd fixed electrode 4, 5 Weight part 40, 50 Solid part 41, 51 Recessed part 4a, 5a Movable electrode 6a, 6b Beam part 7a, 7b Beam part

Claims (19)

A weight part formed integrally with a concave part and a solid part opening on one surface;
A pair of beam portions that rotatably support the weight portion so that the concave portion and the solid portion are aligned along the rotation direction;
A movable electrode provided across the recess and the solid portion on the other surface different from the one surface where the recess opens,
A sensor unit having a first fixed electrode disposed at a position facing the concave side of the movable electrode;
An acceleration sensor that detects acceleration from a change in capacitance between a movable electrode and a fixed electrode that accompanies rotation of a weight portion with a straight line connecting a pair of beam portions as a rotation axis,
The beam part is shifted from the approximate center in the longitudinal direction of the weight part to the concave part side ,
A fixing plate disposed at a predetermined distance from a surface opposite to a surface of the weight portion opposite to the fixed electrode; and preventing the weight portion from adhering to the surface of the fixing plate facing the weight portion. An anti-adhesion film is provided for
The acceleration sensor , wherein the adhesion preventing film is formed simultaneously with the fixed electrode .   2. The acceleration sensor according to claim 1, wherein an acceleration in a first direction applied to the weight part and an acceleration in a second direction orthogonal to the first direction are detected.   The acceleration sensor according to claim 2, wherein a plurality of the sensor units are formed on the same chip.   4. The acceleration sensor according to claim 3, wherein two sensor parts are formed on the same chip, and one sensor part is rotated 180 degrees in the same plane with respect to the other sensor part.   The acceleration sensor according to claim 4, wherein the two sensor units are arranged adjacent to each other.   3. The sensor unit according to claim 1, wherein three sensor units are formed on the same chip, and the two sensor units are respectively rotated by 90 degrees and 180 degrees on the same plane with respect to the remaining one sensor unit. 3. The acceleration sensor according to 3.   The acceleration according to any one of claims 1 to 6, wherein a protrusion is formed on a surface of each fixed electrode facing the movable electrode or on a surface facing each fixed electrode of the movable electrode. Sensor.   The acceleration sensor according to claim 7, wherein the protrusion is formed of silicon or a silicon oxide film.   The acceleration sensor according to claim 7, wherein a surface layer of the protrusion is made of a carbon material.   The acceleration sensor according to claim 9, wherein the carbon material is a carbon nanotube. It said anti-adhesion film, an acceleration sensor according to claim 1, characterized in that it is formed of the same material as the fixed electrode. It said anti-adhesion film, an acceleration sensor according to any one of claims 1 or 11, characterized in that it is formed by using a semiconductor manufacturing process. It said anti-adhesion film, an acceleration sensor according to any one of claims 1, 11 or 12, characterized in that it is formed of an aluminum-based alloy. 14. The change in capacitance between the fixed electrode and the movable electrode is detected by generating an attractive force between the fixed electrode and the movable electrode . The acceleration sensor according to any one of the above. The acceleration sensor according to claim 14 , wherein a thin film made of an organic material is provided on a surface of the adhesion preventing film . The acceleration sensor according to claim 15 , wherein the thin film is a polyimide thin film . 17. The acceleration sensor according to claim 1 , wherein the sensor unit includes a second fixed electrode disposed at a position facing the solid portion side of the movable electrode . A frame part including the weight part, and a pair of detection electrodes formed on the frame part and electrically connected to the fixed electrodes, and between the detection electrodes and between the detection electrodes and the frame part 18. The acceleration sensor according to claim 17 , wherein a gap is provided between each of the electrodes and between each of the detection electrodes and the weight portion . The acceleration sensor according to any one of claims 1 to 18, wherein an angle formed by a perpendicular drawn from the center of gravity of the weight portion to the rotation shaft and the surface of the movable electrode is approximately 45 degrees. .

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