JP5797182B2 - Matched substrate structure to prevent camera shake - Google Patents

Description

  The present invention relates to a matching substrate structure for preventing camera shake, and more particularly to a matching substrate structure for preventing camera shake in which an image sensing module and a seismic isolation device are jointly installed on the same substrate.

  The dramatic progress of science and technology is linked to the progress of information electronic products, and the components of each type of electronic products are making progress toward the goal of light, thin and short. How to make a product have a humanitarian and multi-functional concept, reduce volume, make it portable and ergonomic, and meet consumer expectations and demands for fashion Is one of the main development challenges of the current electronic products market. A digital camera function is combined with a mobile phone, and further, an MP3 or a notebook personal computer is combined, or a digital camera function is combined with a PAD. Of these, an important improvement is how to make the volume thinner and lighter. But whether the manufacturing process is easier to assemble, more convenient and faster, and this is the main goal of industry development.

Referring to FIG. 1, it is a cross-sectional explanatory diagram of a conventional image stabilization structure for preventing camera shake.
A conventional camera shake prevention image sensing structure 1 includes an image sensing module 11, a substrate 12, a mounting table 13, a lens module 14, a seismic isolation device 15, a circuit board 16, and a plurality of metal wires 17. Among them, the image sensing module 11 is installed on the substrate 12 and electrically connects the image sensing module 11 and the substrate 12 by a plurality of metal wires 17. The mounting table 13 is used to cover the image sensing module 11 and be installed on the substrate 12 to protect the plurality of metal wires 17 that are electrically connected to the image sensing module 11 and the substrate 12.
The seismic isolation device 15 is installed on the circuit board 16 and is located between the lens module 14 and the circuit board 16, and further, the lens module 14 is fixed above the circuit board 16 via the seismic isolation device 15. 16, a hole 161 corresponding to the lens module 14 is provided at the center, and the circuit board 16 is installed on the mounting table 13, and another through-hole 131 installed above the mounting table 13 is provided at the center of the circuit board 16. Corresponding to the hole 161 and the image sensing module 11, the image sensing module 11 is connected to the lens module 14 via the through hole 131 and the hole 161, respectively, and externally connected via the lens set 141 provided in the lens module 14 in advance. Get the image.

  However, in the conventional camera shake prevention image sensing structure 1, the image sensing module 11 and the seismic isolation device 15 are both provided on the substrate 12 and the circuit board 16, respectively, and the circuit board 16 is interposed via the insulated mounting table 13. The image sensing module 11 is placed over the image sensing module 11, and the lens module 14 and the image sensing module 11 are made to correspond to each other. Thus, the image stabilization structure 1 for preventing camera shake includes the circuit board 16 and the mounting table 13 itself. Alternatively, the tilt tolerance generated at the time of combination makes it easy to generate an imaging deviation on the imaging optical axis of the image sensing module 11, and further, the assembly becomes complicated and further thinning cannot be achieved.

JP 2006-119579 A JP 2009-71627 A

  It is an object of the present invention to provide two sets of different circuit paths using a board, and to make electrical connection to the image sensing module and the seismic isolation device, respectively, simplifying the number of parts, avoiding assembly tolerances, and reducing the thickness. An object of the present invention is to provide a matching substrate structure for preventing shaking and achieving an object.

  In order to achieve the above object, the anti-shake matched substrate structure provided by the present invention defines an imaging optical axis, which includes a substrate, a lens module, a seismic isolator, and an image sensing module. . The substrate has a frame structure of a predetermined thickness, which includes a first surface, a second surface, a first circuit path, and a second circuit path. The first circuit path and the second circuit path are each constituted by a plurality of first and second metal leads.

  The lens module is located on the imaging optical axis above the substrate. The seismic isolation device is installed between the lens module and the substrate, and further, the lens module is elastically suspended on the substrate via the seismic isolation device. The image sensing module has an operation surface and a non-operation surface, and the non-operation surface of the image sensing module is installed on the substrate, the operation surface is located on the imaging optical axis, Corresponds to the lens module. The seismic isolation device is electrically connected to the first circuit path on the substrate, and the image sensing module is electrically connected to the second circuit path on the substrate.

  The matching substrate structure for preventing camera shake according to the present invention uses a substrate, provides two sets of different circuit paths, and makes electrical connection to the image sensing module and the seismic isolation device, respectively, simplifying the number of parts and generating assembly tolerances. The purpose of avoiding and thinning is achieved.

It is sectional explanatory drawing of the conventional camera shake prevention image sensing structure. FIG. 2 is a three-dimensional exploded explanatory view of a preferred first embodiment of the matching type substrate structure for preventing camera shake according to the present invention. FIG. 3 is a three-dimensional combination explanatory diagram of a preferred first embodiment of the matching type substrate structure for preventing camera shake according to the present invention. FIG. 2 is a cross-sectional explanatory view of a first preferred embodiment of a matching substrate structure for preventing camera shake according to the present invention. FIG. 6 is a cross-sectional explanatory view of a second preferred embodiment of the matching type substrate structure for preventing camera shake according to the present invention. It is a three-dimensional explanatory drawing of the board | substrate of 2nd Example suitable for the matching type | mold board | substrate structure of hand-shake prevention of this invention. FIG. 6 is a cross-sectional explanatory view of a preferred third embodiment of the matching type substrate structure for preventing camera shake according to the present invention. FIG. 10 is a cross-sectional explanatory diagram of a fourth preferred embodiment of the matching type substrate structure for preventing camera shake according to the present invention. FIG. 10 is an overhead view explanatory diagram of a seismic isolator according to a fourth preferred embodiment of a matching substrate structure for preventing camera shake according to the present invention.

  2, 3, and 4, FIG. 2 is a three-dimensional exploded explanatory view of a preferred first embodiment of a matching substrate structure for preventing camera shake provided in an optical system such as a digital camera of the present invention. is there. FIG. 3 is an explanatory diagram of a three-dimensional combination of the first embodiment of the matching substrate structure for preventing camera shake according to the present invention. FIG. 4 is a cross-sectional explanatory view of a preferred first embodiment of the matching type substrate structure for preventing camera shake according to the present invention.

Of the matching substrate structure for preventing camera shake according to the first preferred embodiment of the present invention, the matching substrate structure 2 for preventing camera shake is composed of a substrate 21, a lens module 22, a seismic isolator 23, and an image sensing module 24. Is done. The substrate 21 has a frame structure having a predetermined thickness, and includes a first surface 211, a second surface 212, a first circuit passage 213, and a second circuit passage 214. In a preferred embodiment of the present invention, the substrate 21 can be constructed by depositing a plurality of integrated circuit layers.
Among these, each integrated circuit layer has a circuit loop, and the circuit loop to which the integrated circuit of each layer belongs passes through a plurality of conductive columns and alternately electrically penetrates the first surface. The first circuit passage 213 located at 211 and the second circuit passage 214 located at the second surface 212 are electrically connected to each other. The image sensing module 24 includes an operation surface 241 and a non-operation surface 242. An imaging optical axis 4 is defined between the lens module 22 and the image sensing module 24 to collect image light of an external object and form an image on the image sensing module 24.

In the present embodiment, the central portion of the substrate 21 has a through hole 210 and passes through the path of the imaging optical axis 4 between the lens module 22 and the image sensing module 24, and the second surface 212 is A concave step 215 that gradually decreases in a stepwise manner in the direction of one surface 211 is presented. The first surface 211 of the substrate 21 is provided with the first circuit passage 213 to electrically connect a plurality of contacts provided on the seismic isolation device 23.
The second circuit path 214 is provided in the concave step 215 provided on the second surface 212 of the substrate 21 to electrically connect the image sensing modules 24 to each other. The substrate 21 may be any one of a glass substrate, a ceramic substrate, and a printed circuit board (PCB).

  In this embodiment, each of the first and second circuit paths 213 and 214 includes a plurality of first and second metal leads 2131 and 2141, and each of the first and second circuit paths 213 and 214. The first and second metal leads 2131 and 2141 are planar and wound in a substantially radial form, and are fitted on the first and second surfaces 211 and 212, respectively. Among them, the plurality of first metal leads 2131 included in the first circuit passage 213 are folded in thickness from the outer edge of the substrate 21 and fit on the first surface 211 to be electrically connected to the seismic isolation device 23. The first metal lead 2131 is used as a plurality of contacts, and the other side located at a thickness from the outer edge of the substrate 21 provides a plurality of contacts for electrically connecting a control circuit for operating and controlling the seismic isolation device 23. .

  A plurality of second metal leads 2141 included in the second circuit passage 214 extends from the second surface 212, and is fitted into the concave step 215 to be electrically connected to the image sensing module 24. Used as a plurality of contacts, the other side of the second metal lead 2141 located on the second surface 212 provides a plurality of contacts for electrical connection with other electronic components. The first and second metal leads 2131 and 2141 of the first and second circuit passages 213 and 214 can be formed of metal flakes using a stamping or etching method, and can be formed of copper, aluminum, or alloy. Alternatively, it can be made of one of other conductive metal materials.

In the embodiment of the present invention, the substrate 21 may further include a passive member, a driving IC, and a driving member circuit of a gyroscope Gyro. Among them, the passive member, the drive IC, and the drive member circuit of the gyroscope Gyro can all be electrically connected to the outside via the first or second circuit passages 213 and 214.
A suitable position of a terminal used for electrical output output to the outside of the substrate 21 is that the ends of the first and second metal leads 2131, 2141 of the first and second circuit paths 213, 214 are respectively. A portion extending to the outer edge thickness (substrate side edge) of the substrate 21 or a portion of the second surface 212 (substrate bottom surface) of the substrate 21, and the thickness of the outer edge (substrate side edge) of the substrate 21. Or the second surface 212 (substrate bottom surface) of the substrate 21 or the position of both of them is used, and the first and second circuit paths 213 and 214 are electrically connected to the outside. The contact position is suitable for detection of output.
Similarly, for example, the second surface 212 (substrate bottom surface) is used as the terminal position of the electrical output output of the substrate 21, and the first metal lead 2131 has an outer edge thickness (substrate From the side edge) to the second surface 212 (substrate bottom surface) that is located at the same position as the second metal lead 2141, and to the second surface 212, outside the first circuit passage 213 and the second circuit passage 214. On the other hand, it is possible to simultaneously provide terminals for performing an electrical output output and to serve as contacts for electrical connection to the outside.

  The lens module 22 may be a fixed focus or zoom lens including a plurality of lenses. In the present embodiment, the lens module 22 is preferably a zoom lens module or a focus lens module that drives the movement of the lens by an electromagnetic driving device composed of a coil and a magnet. In a preferred embodiment of the present invention, the lens module 22 further includes a shell 221, a socket body 222, a lens mounting table 223, a lens 224 and an electromagnetic drive module 225. Among them, the lens 224 is installed at a central portion of the lens mounting table 223 and exhibits synchronous movement with the lens mounting table 223. The lens mounting table 223 is installed in the housing space 2221 in the socket body 222, and the lens mounting table 223 is placed in the housing space 2221 via the guide mechanism 2222 in the socket body 222. Axis motion can be exhibited along. In another embodiment, the guide mechanism 2222 may be a lead type drive motor, and the lead causes the elastic member 233 and the substrate 21 to pass through the first circuit passage 213 or the second circuit passage 214. Electrical connection can be made.

  The electromagnetic drive module 225 further includes a magnetic member 2251, a coil 2252, and a circuit board 2253. The magnetic member 2251 is installed on the lens mounting table 223 and corresponds to the coil 2252 provided on the socket body 222. The circuit board 2253 is fitted to the outside of the socket body 222, covers the circuit board 2253 by the shell body 221, and is fixed between the shell body 221 and the socket body 222. The circuit board 2253 can be electrically connected to the elastic member 233 and the first circuit passage 213 or the second circuit passage 214 of the substrate 21.

  In a preferred embodiment of the present invention, the magnetic member 2251 and the coil 2252 are two sets and correspond to each other. In an embodiment of the present invention, the magnetic member 2251 may be a permanent magnet. In other words, the circuit board 2253 applies predetermined currents in different directions to the coil 2252 to generate different magnetic field directions, causes the corresponding magnetic members 2251 to be affected by the magnetic field, and causes the lens mounting table 223 to The objective of causing the lens 224 coupled to the lens mounting table 223 to focus or zoom is achieved by changing the magnetic field by current in the housing space 2221 and displacing it in the direction of the imaging optical axis 4.

  The image sensing module 24 is used to acquire an external image, and is usually a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) image sensing device. The lens module 22 forms image light of an external object on the photosensitive member of the image sensing module 24 via the imaging optical axis 4, and the image sensing module 24 causes the computer to read the image light. Can be converted into digital image data, and functions of a digital camera or a digital video camera can be provided. Since the image module 22 and the image sensing module 24 described here can be directly selected from the prior art and are not technical features of the present invention, details will not be described here.

  In the present embodiment, the seismic isolator 23 of the present invention is installed at the center of the lens module 22 and the substrate 21. That is, the lens module 22 is suspended via the seismic isolator 23, and the image sensing module. The lens module 22 is positioned on the path of the tag optical axis 4, and the lens module 22 receives vibration of an external force, so that the optimal path of the imaging optical axis 4 of the image sensing module 24 The seismic isolator 23 of the present invention compensates and displaces the error amount shifted by the lens module 22 and returns it to the normal preferable path of the imaging optical axis 4.

  The seismic isolation device 23 includes at least one piezoelectric member 231, 231 ′ (see FIG. 2), a friction piece 232, a plurality of elastic members 233, and at least one position detection module 234, 234 ′. The first surface 211 of the substrate 21 defines a first axial direction 81 and a second axial direction 82 on the plane of the imaging optical axis 4, and the first axial direction 81 and the second axial direction 82 are The first surface 211 of the substrate 21 is 90 degrees perpendicular to each other, and the first surface 211 of the substrate 21 is positioned in the first axial direction 81 and the second axial direction 82, respectively. The first metal lead 2131 included in the first circuit passage 213 on the surface 211 is electrically connected through the conductive material 6. In other words, the two sets of piezoelectric members 231 and 231 ′ are perpendicular to each other and are installed on the substrate 21. Further, the upper portions of the two sets of piezoelectric members 231 and 231 ′ are respectively placed on the bottom surface of the lens module 22. Two sets of piezoelectric members 231 and 231 ′ are moved close to the friction piece 232 installed on 2201, and the lens module 22 is interlocked via the friction piece 232, and the first axial direction 81 and the second axial direction The displacement is performed on 82. The conductive material 6 can be one of a conductive adhesive, solder, solder pad or solder ball weld.

  That is, the first axial direction 81 and the second axial direction 82 represent axial directions that are perpendicular to each other, the X axis and the Y axis on the first surface 211 of the substrate 21. Further, the imaging optical axis 4 is perpendicular to the first axis direction 81 and the second axis direction 82, that is, constitutes a third dimension X-axis direction perpendicular to the X-axis and Y-axis. In an embodiment of the present invention, the two sets of piezoelectric members 231 and 231 ′ are each a piezoelectric motor, and a suitable use frequency of the piezoelectric motor can be 120 KHz or other frequencies, The lens module 22 is used to compensate for deviation displacement of the substrate 21 with respect to the second axial direction 82 and the first axial direction 81.

  In an embodiment of the present invention, when a voltage is applied to the piezoelectric member 231, a linear displacement along the first axis direction 81 (X-axis direction) is performed using the lens module 22 using the characteristics of the piezoelectric motor. It can be carried out. Similarly, when a voltage is applied to the other piezoelectric member 231 ′, the lens module 22 can be used to perform linear displacement along the second axial direction 82 (Y-axis direction). The function of adjusting the position of the lens module 22 in the X-axis and Y-axis directions on a horizontal plane perpendicular to the optical axis 4 (Z-axis direction) is achieved.

  Position detection modules 234 and 234 'are provided at predetermined positions on both sides of the first surface 211 of the substrate 21, respectively. In an embodiment of the present invention, the position detection modules 234 and 234 'are magnetoresistive sensors, for example, Hall elements. The position detection modules 234 and 234 ′ are electrically connected via the plurality of first metal leads 2131 included in the conductive material 6 and the first circuit path 213, respectively, and the lens is detected by the position detection modules 234 and 234 ′. The amount of deviation displacement by which the module 22 has shifted the imaging optical axis 4, that is, the degree to which the lens module 22 has shifted the imaging optical axis 4 in the first axial direction 81 and the second axial direction 82 is calculated. Then, a compensation value for correcting the displacement is applied to the lens module 22 that is coupled to the contacting friction piece 232 via the piezoelectric members 231 and 231 ′ on the substrate 21. The module 22 and the image sensing module 24 are restored on the same preferred path of the imaging optical axis 4.

  The friction piece 232 is installed on the bottom surface 2201 of the lens module 22, corresponds to the first surface 211 of the substrate 21, and is elastically pressure-bonded onto the upper portions of the piezoelectric members 231 and 231 ′. A frictional force between the lens module 22 and the piezoelectric members 231 and 231 ′ is increased, and a through hole 2321 is provided at a central portion of the friction piece 232 so as to penetrate the imaging optical axis 4. In the embodiment of the present invention, each of the plurality of elastic members 233 is either one of an elongated metal flake having a wavy reciprocating curve or one of an elongated metal screw spring. In addition, the plurality of elastic members 233 further distribute four sets of springs on the average and fix them near the corners of the four side edges around the substrate 21, and the upper and lower ends of the step-back member 233 (springs) respectively. The lens module 22 is elastically suspended above the first surface 211 of the substrate 21 using a method of fixing to the substrate 21 and the lens module 22. In other words, a plurality of elastic members 233 (springs) are wound and fixed around the substrate 21, and the lens module 22 is moved to the substrate in a direction perpendicular to the substrate 21, that is, a Z-axis direction parallel to the imaging optical axis 4. The lens module 22 can be elastically fixed on the substrate 21 so that the lens module 22 does not fall off the substrate 21 due to vibration, and a pre-tension (the tension that pulls the lens module 22 downward toward the substrate 21 ( pretension), an appropriate frictional force is retained between the friction piece 232 fixed on the bottom surface 2201 of the lens module 22 and the first piezoelectric members 231 and 231 ′, and the piezoelectric members 231 and 231 ′ The horizontal movement of the lens module 22 can be interlocked.

  In the first preferred embodiment of the present invention, the operating surface 241 of the image sensing module 24 has a stepped shape on the second surface 212 of the substrate 21 in a flip chip technology manner and gradually decreases. Installed in the step 215, covers the through-hole 210, positions the operation surface 241 of the image sensing module 24 on the imaging optical axis 4, corresponds to the lens module 22, and operates the operation surface 241. A plurality of peripheral conductive ends 2411 are electrically connected to the second circuit passage 214 fitted in the concave step 215.

  That is, the concave step 215 and the second surface 212 form an appropriate drop height, and the operating surface 241 is fitted to the concave step 215 by the flip chip technique at the same time as the image sensing module 24, In addition to fitting the operation surface 241 of the image sensing module 24 on the concave step 215, a plurality of conductive ends 2411 around the operation surface 241 of the image sensing module 24 are provided in the concave step 215. The plurality of second metal leads 2141 included in the second passage circuit 214 are electrically connected to each other by the conductive material 6 to reduce the risk of short circuit at the time of bridge connection.

  In the other embodiments of the present invention described above, the majority of the members are the same or similar to the embodiments, so the same members and structures will not be described again below, and the same members will have the same names and The reference numerals are used directly, and similar members use the same names, but English letters are added after the original codes to distinguish them, and details are not described.

  5 and FIG. 6, FIG. 5 is a cross-sectional explanatory diagram of a second preferred embodiment of the matching type substrate structure for preventing camera shake according to the present invention. FIG. 6 is a three-dimensional explanatory view of a substrate according to a second preferred embodiment of the matching substrate structure for preventing camera shake according to the present invention. The difference between the second embodiment of the hand-shake-preventing matching substrate structure of the present invention and the hand-shake-preventing matching substrate structure of the first preferred embodiment of FIG. A concave groove 216a is provided in the direction from the first surface 211a to the second surface 212a of the substrate 21a, the thickness surface of the substrate 21a extends to the first surface 211a, and the first passage circuit 213a is provided. The plurality of first metal leads 2131a included in the first circuit passage 213a electrically connect a plurality of contacts provided on the piezoelectric members 231 and 231 ′ (see FIG. 2) of the seismic isolation device 23 to each other. It is in.

  One end of the plurality of second metal leads 2141a included in the second circuit passage 214a is provided on the groove bottom surface 216a in the groove 2161a of the substrate 21a, and the other end of the second metal lead 2141a is The groove 216a extends from the groove wall surface 2162a to the first surface 211a, and is folded to fit over the thickness surface of the substrate 21a. The non-operating surface 242a of the image sensing module 24a is installed on the groove bottom surface 2161a in the concave groove 216a and is located on the groove bottom surface 2161a area where the second circuit passage 214a is not provided. The operation surface 241a of the sensing module 24a is positioned on the imaging optical axis 4, and a plurality of conductive ends 2411a provided on the operation surface 241a of the image sensing module 24a are respectively connected to the metal wire 5 in a manner of wiring. A plurality of second metal leads 2141a fitted on the groove bottom surface 2161a are electrically connected to each other.

As shown in FIG. 6, a plurality of first metal leads 2131a included in the first circuit passage 213a located on the substrate 21a are respectively a plurality of second metal passages 214a located in the concave groove 216a. Two metal leads and the first and second axial directions 81 and 82 are arranged on the first surface 211a constituting the XY axis in an interlaced manner with an interval, and are located in the concave groove 216a. When the second metal lead 2141a extends upward to the first surface 211a, the first metal lead 2131a with which the first surface 211a is fitted does not cross or interfere with each other.
That is, the first metal lead 2131a of the first circuit passage 213a and the second metal of the second circuit passage 214a are present on the first surface 211a of the substrate 21a and the thickness surface of the substrate 21a. Each of the leads 2141a has a radial shape in a cross fitting manner, is arranged at intervals, and represents the use of a plurality of contacts for making electrical connection with other electronic members.

  Although described with reference to FIG. 7, it is a cross-sectional explanatory view of a third preferred embodiment of the matching substrate structure for preventing camera shake according to the present invention. The difference between the preferred third embodiment of the anti-shake matching substrate structure of the present invention and the anti-shake matching substrate structure of the second preferred embodiment of FIG. 5 described above is that the anti-shake matching substrate structure is the same. The non-operating surface 242b of the image sensing module 24b of 2b is located on the groove bottom surface 2161a provided in the concave groove 216a and providing the second circuit passage 214a, and the operating surface of the image sensing module 24b. 241b is positioned on the imaging optical axis 4.

  That is, a plurality of conductive ends 2421b are provided on the non-operational surface 242b of the image sensing module 24b, and each of the grooves 216a is formed by welding using the conductive material 6 (conductive adhesive, solder, or solder ball). The image sensing module 24b installed in the concave groove 216a is electrically connected to a plurality of second metal leads 2141a included in the second circuit passage 214a fitted to the groove bottom surface 2161a. Image control can be performed externally by the electrical control of 2141a and the lens module 22.

  8 and 9, FIG. 8 is a cross-sectional explanatory view of a fourth preferred embodiment of the hand-shake-preventing matching substrate structure of the present invention. FIG. 9 is an overhead view explanatory diagram of a seismic isolator according to a fourth preferred embodiment of the matching substrate structure for preventing camera shake according to the present invention. The difference between the fourth embodiment of the matching substrate structure for preventing shaking according to the present invention and the matching substrate structure for preventing shaking in the second preferred embodiment shown in FIG. 5 is that the matching substrate structure 2c for preventing shaking. The seismic isolation device 23 a further includes at least two 235 a and 235 a ′, at least two magnets 236 a and 236 a ′, and a plurality of hanging wires 237. In a fourth preferred embodiment of the present invention, the hanging wire 237 is fixed and positioned on the four sides of the substrate 21a, and the lens module 22 is placed in a direction parallel to the imaging optical axis 4. Each of the hanging wires 237 fixed on 21a is formed of an upright hanging wire 237 that does not have elasticity. The two coils 235a and 235a ′ are respectively installed on the first surface 211a of the substrate 21a, and the first coil 211 is formed by welding using the conductive material 6 (conductive adhesive, solder, or solder ball). The first circuit 211 on one surface 211a and the plurality of first metal leads 2131a included in 213a are electrically connected to each other.

  The two magnets 236a and 236a 'are respectively installed on the bottom surface 2201 of the lens module 22, and correspond to the two coils 235a and 235a', respectively. Two sets of the coils 235a, 235a ′ and the magnets 236a, 236a ′ corresponding to each other are positioned on the first axial direction 81 and the second axial direction 82, respectively, and the direction of the input current is different depending on the direction of the input current. The direction of the lines of magnetic force of the coils 235a and 235a ′ is changed, and the lens module 22 provided with the magnets 236a and 236a ′ is interlocked to correct the deviation displacement on the imaging optical axis 4. Position detection modules 234a and 234a 'are installed at predetermined positions on the first surface 211a of the substrate 21a and in the vicinity of the two coils 235a and 235a'. The position detection modules 234a and 234a ' 6, the first metal leads 2131a included in the first circuit passage 213a are electrically connected, and the first axial direction 81 and the second axis of the lens module 22 are detected by the position detection modules 234a and 234a ′. A displacement amount obtained by shifting the imaging optical axis 4 in the direction 82 is calculated. That is, the direction of the input current is changed via the first metal lead 2131a, the direction of the magnetic field lines of the coils 235a and 235a ′ is changed, and the lens module 22 provided with the magnets 236a and 236a ′ is interlocked. Then, the deviation displacement on the imaging optical axis 4 is corrected.

As described above, the matching substrate structure 2 for preventing camera shake of the optical system such as the digital camera of the present invention defines the imaging optical axis 4, and the matching substrate structure 2 for preventing camera shake includes the substrate 21 and the lens. A module 22, a seismic isolation device 23 and an image sensing module 24 are included. The substrate 21 has a frame with a predetermined thickness, which includes a first surface 211, a second surface 212, a first circuit passage 213 and a second circuit passage 214.
Each of the first and second circuit paths 213 and 214 includes a plurality of first and second metal leads 2131 and 2141. The lens module 22 is located on the imaging optical axis 4 above the substrate 21. The seismic isolation device 23 is located between the lens module 22 and the substrate 21. That is, the lens module 22 is suspended via the seismic isolation device 23 so as to correspond to the upper side of the image sensing module 24. The lens module 22 is positioned on the path of the imaging optical axis 4. The image sensing module 24 includes an operation surface 241 and a non-operation surface 242, and the image sensing module 24 is installed on the substrate 21, and the operation surface 241 is located on the imaging optical axis 4. , Corresponding to the lens module 22. The seismic isolation device 23 is electrically connected to the first circuit passage 213, and the image sensing module 24 is electrically connected to the second circuit passage 214.

  Two different first circuit paths 213 and second circuit paths 214 are installed on the second surface 212 and the first surface 211 of the substrate 21, respectively, and the seismic isolation device 23 and the image sensing module 24 are electrically connected to each other. To reduce the phenomenon of the number of parts and the production cost, and further avoid the phenomenon that the imaging optical axis 4 shifts after each part is assembled due to its own tolerance, thereby improving the process efficiency and accuracy of the product. Provided is a matching substrate structure 2 that is efficiently improved and prevents shaking to achieve overall thinning.

  In the present invention, the preferred embodiments have been disclosed as described above, but these are not intended to limit the present invention in any way, and anyone who is familiar with the technology can make an equivalent scope without departing from the spirit and scope of the present invention. Of course, various fluctuations and hydration colors can be added.

1 Conventional image stabilization structure 11 Image sensing module
12 Substrate 13 Mounting table 131 Through hole 14 Lens module
141 Lens assembly 15 Seismic isolator 16 Circuit board 161 Hole 17 Metal wires 2, 2a, 2b, 2c Matching type substrate structure 21, 21a for preventing camera shake Substrate 210 Through hole 211, 211a First surface 212, 212a Second surface 213, 213a 1st circuit path 2131, 2131a 1st metal lead 214, 214a 2nd circuit path 2141, 2141a 2nd metal lead 215 Concave step 216a Concave groove 2161a Groove bottom surface 2162a Groove wall surface 22 Lens module
2201 Bottom 221 Shell 222 Socket body
2221 Housing space 2222 Guide mechanism 223 Lens mounting table 224 Lens 225 Electromagnetic drive module 2251 Magnetic member 2252 Coil
2253 Circuit board 23, 23a Seismic isolation device 231, 231 'Piezoelectric member 232 Friction piece 2321 Through hole 233 Elastic member 234, 234', 234a, 234a 'Position detection module 235a, 235a' Coil
236a, 236a 'magnet 237 hanging wire
24, 24a, 24b Image sensing module
241, 241 a, 241 b operation surface 2411, 2411 a conductive end 242, 242 a, 242 b non-operation surface 2421 b conductive end 4 imaging optical axis 5 metal wire 6 conductive material 81 first axis direction 82 second axis direction

Claims (7)

An anti-shake matching substrate structure that defines the imaging optical axis,
It has a predetermined thickness including a first surface that is perpendicular to the imaging optical axis and faces upward, and a second surface that opposes the first surface, and a through-hole or a groove is formed at a central portion of the first surface. A substrate having a frame structure formed with
A lens module located on the imaging optical axis above the substrate;
Installed between the lens module and the substrate and having at least one position detection module, the position detection module being installed on the first surface of the substrate and facing the imaging optical axis of the lens module An anti-seismic device used to detect the deviation displacement,
An image sensing module having an operating surface and a non-operating surface, disposed on the substrate, the operating surface being positioned on the imaging optical axis, and corresponding to the lens module;
It includes,
The substrate has a first circuit path and a second circuit path,
The seismic isolation device and at least one of the position detection modules are connected to the first circuit path, the image sensing module is electrically connected to the second circuit path, and the first circuit path includes a plurality of first metal leads. And the second circuit passage includes a plurality of second metal leads. The substrate has the through hole,
In the periphery of the through hole, a concave step is provided from the second surface of the substrate toward the first surface,
Providing the first circuit passage on the first surface of the substrate and electrically connecting a plurality of contacts provided on the seismic isolation device;
Providing the second circuit passage in the recessed step provided on the second surface of the substrate, and electrically connecting a plurality of conductive ends provided on the image sensing module;
And the image sensing module has the operating surface mounted on the second surface of the substrate by a flip chip technology method, and corresponds to the lens module,
And electrically connecting a plurality of conductive ends on the periphery of the operating surface and a plurality of second metal leads of the second circuit passage located on the concave step by a conductive material,
The conductive material is any one of a conductive adhesive, solder, or solder ball, and the substrate is any one of a glass substrate, a ceramic substrate, and a printed circuit board.
2. The lens module according to claim 1, wherein the lens module is one of a zoom lens module and a focus lens module, and the image sensing module is any one of a charge-coupled member or a mutual metal oxide semiconductor photosensitive member. Matching-type substrate structure for preventing camera shake as described. The concave groove is provided on the first surface of the substrate, the thickness surface of the substrate provided with the first circuit path extending up to said first surface to said thickness surface, a plurality provided on-proof Isolation System Electrically connect the contacts to each other,
The second circuit path is provided in the concave groove of the substrate, said second circuit path extends to the thickness plane of the first surface and the substrate,
And the second circuit passage in the concave groove electrically connects a plurality of conductive ends provided on the image sensing module,
And the image sensing module is installed on the groove bottom surface of the concave groove by the non-operation surface, the operation surface is positioned on the imaging optical axis, and corresponds to the lens module,
2. The matching substrate structure for preventing camera shake according to claim 1, wherein the image sensing module is electrically connected to the second circuit passage fitted into the concave groove. The image sensing module performs electrical connection with a plurality of second metal leads and a plurality of metal wires included in the second circuit passage fitted into the groove through a plurality of conductive ends on the periphery of the operation surface. Item 4. A matching substrate structure for preventing shaking according to Item 3. The image sensing module electrically connects the plurality of second metal leads of the second circuit passage fitted in the concave groove with a conductive material through a plurality of solder pads provided on the non-operating surface, 4. The anti-shake matched substrate structure of claim 3, wherein the material can be any one of conductive adhesive, solder, solder pad or solder ball weld. The substrate defines a first axial direction and a second axial direction on a plane perpendicular to the imaging optical axis, and the seismic isolator is further installed on the first surface of the substrate, and the bottom surface of the lens module At least one piezoelectric member proximate to the piezoelectric member, wherein at least one piezoelectric member capable of making full use of the displacement of the lens module by applying a voltage to the piezoelectric member;
A friction piece coupled to the lens module on the bottom surface, having a through hole in the center thereof, passing the imaging optical axis, and corresponding the lens module to the image sensing module;
A plurality of elastic members fixed and positioned on the four sides of the substrate and elastically fixing the lens module on the substrate in a direction parallel to the imaging optical axis, of which at least one The piezoelectric member includes two sets of piezoelectric members, and each of the two sets of piezoelectric members is a piezoelectric motor, and is disposed on the substrate at a relative vertical angle of 90 degrees. Compensating for deviation displacements relative to each other in the first axial direction and the second axial direction, the plurality of elastic members each have a corrugated shape, and a spring composed of an elongated metal flake that is reciprocally curved, or an elongated metal spiral spring. The hand-shake-preventing matching substrate structure according to claim 1, which is one of them. Defining a first axis direction and a second axis direction on a plane perpendicular to the imaging optical axis of the substrate,
At least two coils placed on the first surface of the substrate;
At least two magnets installed on the bottom surface of the lens module, each corresponding to the two coils;
A plurality of hanging wires fixed on each of the four sides of the substrate and fixing the lens module on the substrate in a direction parallel to the imaging optical axis. The coil and the magnet are positioned above the first axis direction and the second axis direction, respectively, and the direction of the magnetic field lines of the coil is changed depending on the direction of the input current, and the magnet is further installed. The matching substrate structure for preventing camera shake according to claim 1, wherein the lens module is linked to correct deviation displacement on the imaging optical axis.

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