JP5782283B2 - 新規のポリマーおよびフォトレジスト組成物 - Google Patents
新規のポリマーおよびフォトレジスト組成物 Download PDFInfo
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- JP5782283B2 JP5782283B2 JP2011076478A JP2011076478A JP5782283B2 JP 5782283 B2 JP5782283 B2 JP 5782283B2 JP 2011076478 A JP2011076478 A JP 2011076478A JP 2011076478 A JP2011076478 A JP 2011076478A JP 5782283 B2 JP5782283 B2 JP 5782283B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
- C08F220/382—Esters containing sulfur and containing oxygen, e.g. 2-sulfoethyl (meth)acrylate
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
別の形態においては、スルホニウム基もしくはヨードニウム基のようなオニウム塩として複合体を形成しているイオン性光酸発生剤基をはじめとする共有結合したイオン性光酸発生剤基を含む光活性ポリマーが提供される。
本発明の他の形態が以下に開示される。
本発明のポリマーは様々な繰り返し単位を含むことができる。好ましいポリマーは異なる繰り返し単位、例えば、コポリマー(ポリマー中に少なくとも2種の異なる繰り返し単位)、ターポリマー(3種の異なる繰り返し単位)、テトラポリマー(少なくとも4種の異なる繰り返し単位)、および他の高次のポリマーを含むことができる。
1)248nmでの像形成に特に好適な化学増幅ポジ型レジストを提供できる、酸不安定基を含むフェノール系樹脂。この種の特に好ましい樹脂には、以下のものが挙げられる:i)ビニルフェノールおよびアクリル酸アルキルの重合単位を含むポリマー、ここにおいて、重合されたアクリル酸アルキル単位は光酸の存在下でデブロッキング(deblocking)反応を受けうる。光酸誘起デブロッキング反応を受けうる代表的なアクリル酸アルキルには、例えば、アクリル酸t−ブチル、メタクリル酸t−ブチル、アクリル酸メチルアダマンチル、メタクリル酸メチルアダマンチル、および光酸誘起反応を受けうる他の非環式アルキルおよび脂環式アクリラートが挙げられ、例えば、米国特許第6,042,997号および第5,492,793号におけるポリマーである:ii)ビニルフェノール、場合によって置換されている(ヒドロキシもしくはカルボキシ環置換基を含まない)ビニルフェニル(例えばスチレン)、および上記ポリマーi)で記載されたデブロッキング基を有するもののようなアクリル酸アルキルの重合単位を含むポリマー;例えば、米国特許第6,042,997号に記載されたポリマー:およびiii)光酸と反応しうるアセタールもしくはケタール部分を含む繰り返し単位、および場合によってフェニルもしくはフェノール性基のような芳香族繰り返し単位を含むポリマー;このようなポリマーは、米国特許第5,929,176号および第6,090,526号に記載されている。
上で論じられたように、本発明に従って様々な光酸発生剤基が樹脂に共有結合されうる。
以下の非限定的な実施例は本発明の例示である。
本発明のフォトレジストは、レジスト組成物の全重量を基準にした重量パーセントとして表された量の下記成分を混合することにより製造される:
配合されたレジスト組成物はHMDS蒸気前処理された4インチシリコンウェハ上にスピンコートされ、90℃で60秒間、真空ホットプレートでソフトベークされる。レジスト塗膜層はフォトマスクを通した193nmで露光され、次いで露光された塗膜層は110℃で露光後ベークされる。次いで、コーティングされたウェハは0.26Nのテトラブチルアンモニウムヒドロキシド水溶液で処理され、像形成されたレジスト層を現像する。
Claims (8)
- (i)樹脂に共有結合している1以上の光酸発生剤部分;および(ii)1以上の光酸不安定基:を含む樹脂を含むフォトレジスト組成物であって、
前記1以上の光酸発生剤部分が1以上の前記光酸不安定基の構成要素であり、
前記光酸不安定基の光誘起反応が前記樹脂からの前記1以上の光酸発生剤基の開裂をもたらし、かかる開裂が樹脂から開裂したスルホン酸を生じさせる、フォトレジスト組成物。 - 光酸発生剤基がイオン性である請求項1に記載のフォトレジスト組成物。
- 光酸発生剤基が非イオン性である請求項1に記載のフォトレジスト組成物。
- 光酸発生剤基を含む前記樹脂がさらに、炭素脂環式、ヘテロ脂環式、酸無水物、ラクトン、ナフチル、ヒドロキシルおよび/またはアクリラート基を含む、請求項1〜3のいずれか1項に記載のフォトレジスト組成物。
- 光酸発生剤基を含む前記樹脂がさらに、アクリル酸2−メチルアダマンチル、アクリル酸ヒドロキシアダマンチル、メタクリル酸ヒドロキシアダマンチル、無水マレイン酸、ノルボルネン、3,4−ジヒドロピラン、場合によって置換されたフェニルおよび/または場合によって置換されたナフチルの重合単位を含む、請求項1〜4のいずれか1項に記載のフォトレジスト組成物。
- 請求項1〜5のいずれか1項に記載のフォトレジストの塗膜層を基体上に適用し;
フォトレジスト塗膜層をパターン化された活性化放射線に露光し;および
露光されたフォトレジスト塗膜層を現像して、フォトレジストレリーフ像を提供する;
ことを含む、電子デバイスを製造する方法。 - フォトレジスト組成物が193nmのパターン化された活性化放射線で液浸露光される、請求項6に記載の方法。
- (i)樹脂に共有結合している1以上の光酸発生剤部分;および
(ii)1以上の光酸不安定基:
を含む樹脂であって、
前記1以上の光酸発生剤部分が1以上の前記光酸不安定基の構成要素であり、
前記光酸不安定基の光誘起反応が前記樹脂からの前記1以上の光酸発生剤基の開裂をもたらし、かかる開裂が樹脂から開裂したスルホン酸を生じさせる、樹脂。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US31970610P | 2010-03-31 | 2010-03-31 | |
US61/319706 | 2010-03-31 |
Publications (2)
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JP2011215619A JP2011215619A (ja) | 2011-10-27 |
JP5782283B2 true JP5782283B2 (ja) | 2015-09-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011076478A Active JP5782283B2 (ja) | 2010-03-31 | 2011-03-30 | 新規のポリマーおよびフォトレジスト組成物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10670965B2 (ja) |
EP (1) | EP2372456A3 (ja) |
JP (1) | JP5782283B2 (ja) |
KR (1) | KR101949688B1 (ja) |
CN (2) | CN102279520A (ja) |
TW (1) | TWI618982B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11042089B2 (en) | 2017-09-15 | 2021-06-22 | Lg Chem, Ltd. | Chemically amplified photoresist composition, photoresist pattern, and method for preparing photoresist pattern |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5622448B2 (ja) * | 2010-06-15 | 2014-11-12 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、高分子化合物、化合物 |
JP5793489B2 (ja) * | 2011-11-30 | 2015-10-14 | 富士フイルム株式会社 | 感活性光線性又は感放射線性組成物、それを用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法 |
KR20130076598A (ko) | 2011-12-28 | 2013-07-08 | 금호석유화학 주식회사 | 친수성 광산발생제 및 이를 포함하는 레지스트 조성물 |
US8790861B2 (en) | 2011-12-31 | 2014-07-29 | Rohm And Haas Electronic Materials Llc | Cycloaliphatic monomer, polymer comprising the same, and photoresist composition comprising the polymer |
US20130171429A1 (en) * | 2011-12-31 | 2013-07-04 | Rohm And Haas Electronic Materials Llc | Cycloaliphatic monomer, polymer comprising the same, and photoresist composition comprising the polymer |
JP6020347B2 (ja) | 2012-06-04 | 2016-11-02 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
TWI619733B (zh) * | 2012-09-15 | 2018-04-01 | Rohm And Haas Electronic Materials Llc | 包含多種酸產生劑化合物之光阻劑 |
JP2014153440A (ja) * | 2013-02-05 | 2014-08-25 | Tokyo Ohka Kogyo Co Ltd | レジスト組成物、高分子化合物、化合物及びレジストパターン形成方法 |
JP6361455B2 (ja) * | 2013-10-25 | 2018-07-25 | Jsr株式会社 | 着色組成物、着色硬化膜及び表示素子 |
US9527936B2 (en) | 2014-10-10 | 2016-12-27 | Rohm And Haas Electronic Materials Llc | Polymer comprising repeat units with photoacid-generating functionality and base-solubility-enhancing functionality, and associated photoresist composition and electronic device forming method |
US9557642B2 (en) | 2014-10-10 | 2017-01-31 | Rohm And Haas Electronic Materials Llc | Photoresist composition and associated method of forming an electronic device |
US9606434B2 (en) | 2014-10-10 | 2017-03-28 | Rohm And Haas Electronic Materials, Llc | Polymer comprising repeat units with photoacid-generating functionality and base-solubility-enhancing functionality, and associated photoresist composition and electronic device forming method |
JP6769735B2 (ja) | 2015-05-12 | 2020-10-14 | 住友化学株式会社 | 塩、酸発生剤、樹脂、レジスト組成物及びレジストパターンの製造方法 |
JP6688147B2 (ja) * | 2015-05-12 | 2020-04-28 | 住友化学株式会社 | 塩、酸発生剤、樹脂、レジスト組成物及びレジストパターンの製造方法 |
US9758610B2 (en) * | 2015-12-18 | 2017-09-12 | Dow Global Technologies Llc | Acid-labile hyperbranched copolymer and associated photoresist composition and method of forming an electronic device |
TWI619699B (zh) * | 2015-12-31 | 2018-04-01 | Rohm And Haas Electronic Materials Llc | 光酸產生劑 |
TWI662364B (zh) | 2015-12-31 | 2019-06-11 | Rohm And Haas Electronic Materials Llc | 光致抗蝕劑組合物、包含光致抗蝕劑組合物的經塗佈基板及形成電子裝置的方法 |
JP7188976B2 (ja) * | 2017-11-29 | 2022-12-13 | 住友化学株式会社 | 塩、酸発生剤、樹脂、レジスト組成物及びレジストパターンの製造方法 |
CN109851539A (zh) * | 2017-11-30 | 2019-06-07 | 罗门哈斯电子材料有限责任公司 | 盐和包含其的光致抗蚀剂 |
TWI683801B (zh) * | 2017-11-30 | 2020-02-01 | 美商羅門哈斯電子材料有限公司 | 兩性離子化合物及包括其之光阻 |
JP7371574B2 (ja) | 2020-06-04 | 2023-10-31 | 信越化学工業株式会社 | 光酸発生剤、化学増幅ネガ型レジスト組成物及びレジストパターン形成方法 |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4442197A (en) | 1982-01-11 | 1984-04-10 | General Electric Company | Photocurable compositions |
EP0153904B1 (de) | 1984-02-10 | 1988-09-14 | Ciba-Geigy Ag | Verfahren zur Herstellung einer Schutzschicht oder einer Reliefabbildung |
MX170270B (es) | 1984-06-01 | 1993-08-11 | Rohm & Haas | Imagenes sobre una superficie y un metodo para formar imagenes positivas y negativas termicamente estables sobre una superficie |
US4603101A (en) | 1985-09-27 | 1986-07-29 | General Electric Company | Photoresist compositions containing t-substituted organomethyl vinylaryl ether materials |
CA1307695C (en) | 1986-01-13 | 1992-09-22 | Wayne Edmund Feely | Photosensitive compounds and thermally stable and aqueous developablenegative images |
EP0698230A1 (en) | 1992-10-29 | 1996-02-28 | International Business Machines Corporation | Chemically amplified photoresist |
EP0605089B1 (en) | 1992-11-03 | 1999-01-07 | International Business Machines Corporation | Photoresist composition |
US5558971A (en) | 1994-09-02 | 1996-09-24 | Wako Pure Chemical Industries, Ltd. | Resist material |
JP3317597B2 (ja) | 1994-10-18 | 2002-08-26 | 富士写真フイルム株式会社 | ポジ型感光性組成物 |
EP0717319B1 (en) | 1994-12-06 | 2001-04-11 | Ocg Microelectronic Materials, Inc. | Photoacid generating composition used in radiation-sensitive compositions |
US5843624A (en) | 1996-03-08 | 1998-12-01 | Lucent Technologies Inc. | Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material |
US5861231A (en) | 1996-06-11 | 1999-01-19 | Shipley Company, L.L.C. | Copolymers and photoresist compositions comprising copolymer resin binder component |
US6090526A (en) | 1996-09-13 | 2000-07-18 | Shipley Company, L.L.C. | Polymers and photoresist compositions |
KR100220951B1 (ko) | 1996-12-20 | 1999-09-15 | 김영환 | 비닐 4-테트라히드로피라닐옥시벤잘-비닐 4-히드록시벤잘-비닐 테트라히드로피라닐에테르-비닐 아세테이트 공중합체, 비닐 4-테트라히드로피라닐옥시벤잘-비닐 테트라히드로피라닐에테르-비닐 아세테이트 공중합체 및 그들의 제조방법 |
US6057083A (en) | 1997-11-04 | 2000-05-02 | Shipley Company, L.L.C. | Polymers and photoresist compositions |
US6165674A (en) | 1998-01-15 | 2000-12-26 | Shipley Company, L.L.C. | Polymers and photoresist compositions for short wavelength imaging |
US6458506B2 (en) | 1998-08-14 | 2002-10-01 | Shipley Company, Llc | Photoacid generators and photoresists comprising same |
KR20000047909A (ko) | 1998-12-10 | 2000-07-25 | 마티네즈 길러모 | 이타콘산 무수물 중합체 및 이를 함유하는 포토레지스트조성물 |
US6048662A (en) | 1998-12-15 | 2000-04-11 | Bruhnke; John D. | Antireflective coatings comprising poly(oxyalkylene) colorants |
US6048664A (en) | 1999-03-12 | 2000-04-11 | Lucent Technologies, Inc. | Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material |
WO2001063363A2 (en) | 2000-02-27 | 2001-08-30 | Shipley Company, L.L.C. | Photoacid generators and photoresists comprising same |
US6482567B1 (en) | 2000-08-25 | 2002-11-19 | Shipley Company, L.L.C. | Oxime sulfonate and N-oxyimidosulfonate photoacid generators and photoresists comprising same |
WO2002042845A2 (en) | 2000-11-03 | 2002-05-30 | Shipley Company, L.L.C. | Photoacid generators and photoresists comprising same |
CN1310090C (zh) * | 2001-02-25 | 2007-04-11 | 希普雷公司 | 新共聚物及光致抗蚀组合物 |
US7049044B2 (en) | 2002-12-19 | 2006-05-23 | The University Of North Carolina At Charlotte | Nanocomposite negative resists for next generation lithographies |
CN1527135A (zh) * | 2003-03-05 | 2004-09-08 | 希普利公司 | 光致抗蚀剂组合物 |
EP1586944A1 (en) | 2004-03-09 | 2005-10-19 | Rohm and Haas Electronic Materials, L.L.C. | Cyanoadamantyl compounds and polymers |
US20060057491A1 (en) * | 2004-05-18 | 2006-03-16 | Rohm And Haas Electronic Materials, L.L.C. | Coating compositions for use with an overcoated photoresist |
KR100574495B1 (ko) * | 2004-12-15 | 2006-04-27 | 주식회사 하이닉스반도체 | 광산발생제 중합체, 그 제조방법 및 이를 함유하는상부반사방지막 조성물 |
JP4597655B2 (ja) * | 2004-12-20 | 2010-12-15 | 東京応化工業株式会社 | レジストパターン形成方法 |
JP4425776B2 (ja) | 2004-12-24 | 2010-03-03 | 信越化学工業株式会社 | レジスト材料及びこれを用いたパターン形成方法 |
US7629106B2 (en) * | 2005-11-16 | 2009-12-08 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process using the same |
WO2007069640A1 (ja) * | 2005-12-14 | 2007-06-21 | Jsr Corporation | 新規化合物および重合体、ならびに樹脂組成物 |
JP5061612B2 (ja) * | 2005-12-27 | 2012-10-31 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物用酸発生樹脂 |
JP4921160B2 (ja) * | 2006-05-30 | 2012-04-25 | 兵庫県 | 感光性樹脂及び感光性組成物 |
TW200807155A (en) * | 2006-06-20 | 2008-02-01 | Tokyo Ohka Kogyo Co Ltd | Positive resist composition and resist pattern formation method |
JP4845650B2 (ja) * | 2006-09-08 | 2011-12-28 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
KR101439951B1 (ko) * | 2007-02-15 | 2014-09-17 | 주식회사 동진쎄미켐 | 설포닐기를 포함하는 포토레지스트 모노머, 폴리머 및 이를 포함하는 포토레지스트 조성물 |
JP2008281990A (ja) * | 2007-02-28 | 2008-11-20 | Rohm & Haas Electronic Materials Llc | 新規なポリマーおよびフォトレジスト組成物 |
EP1975705B1 (en) * | 2007-03-28 | 2016-04-27 | FUJIFILM Corporation | Positive resist composition and pattern-forming method |
JP5449675B2 (ja) * | 2007-09-21 | 2014-03-19 | 富士フイルム株式会社 | 感光性組成物、該感光性組成物を用いたパターン形成方法及び該感光性組成物に用いられる化合物 |
US7858287B2 (en) * | 2007-11-30 | 2010-12-28 | Hyogo Prefecture | Photosensitive resin, and photosensitive composition |
JP5104343B2 (ja) * | 2008-01-28 | 2012-12-19 | 富士通株式会社 | モノマー、樹脂及び該樹脂を用いたレジスト組成物、並びに、該レジスト組成物を用いた半導体装置の製造方法 |
WO2009105667A2 (en) * | 2008-02-20 | 2009-08-27 | The Research Foundation Of State University Of New York | Chain scission polyester polymers for photoresists |
DE102008018961A1 (de) | 2008-04-15 | 2009-10-29 | Wincor Nixdorf International Gmbh | Einzelblatthandhabungsvorrichtung zur Eingabe von rechteckigen Einzelblättern in einen Behälter |
JP5237173B2 (ja) | 2008-06-03 | 2013-07-17 | 信越化学工業株式会社 | 重合性化合物、高分子化合物及びポジ型レジスト材料並びにこれを用いたパターン形成方法 |
JP5364443B2 (ja) * | 2009-05-20 | 2013-12-11 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物 |
US9921912B1 (en) | 2015-09-30 | 2018-03-20 | EMC IP Holding Company LLC | Using spare disk drives to overprovision raid groups |
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2011
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- 2011-03-31 CN CN2011101375383A patent/CN102279520A/zh active Pending
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11042089B2 (en) | 2017-09-15 | 2021-06-22 | Lg Chem, Ltd. | Chemically amplified photoresist composition, photoresist pattern, and method for preparing photoresist pattern |
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US10670965B2 (en) | 2020-06-02 |
TW201142513A (en) | 2011-12-01 |
KR20110110047A (ko) | 2011-10-06 |
JP2011215619A (ja) | 2011-10-27 |
CN102279520A (zh) | 2011-12-14 |
TWI618982B (zh) | 2018-03-21 |
KR101949688B1 (ko) | 2019-02-19 |
EP2372456A2 (en) | 2011-10-05 |
US20110269074A1 (en) | 2011-11-03 |
CN106125506A (zh) | 2016-11-16 |
EP2372456A3 (en) | 2011-10-26 |
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