JP5776396B2 - Light source unit of semiconductor light source for vehicle lamp, vehicle lamp - Google Patents

Description

  The present invention relates to a light source unit of a semiconductor-type light source for a vehicle lamp. The present invention also relates to a vehicular lamp using a semiconductor-type light source as a light source.

  This type of light source unit is conventionally known (for example, Patent Document 1). Hereinafter, a conventional light source unit will be described. A conventional light source unit is formed by providing a plurality of LED chips in an array (vertical and horizontal) on the base portion, providing a plurality of printed wiring portions on the base portion, and bonding wires to the LED chips and the printed wiring portion. It is.

JP 2009-21264 A

  When a conventional light source unit is provided with a control element that controls light emission of a plurality of LED chips and a power supply member that supplies power to the plurality of LED chips, the base portion, that is, the light source unit tends to be enlarged. In such a light source unit, it is important to miniaturize the light source unit to have a size substantially equal to that of a bulb type light source unit.

  The problem to be solved by the present invention is that it is important to reduce the size of the light source unit.

The present invention (the invention according to claim 1) includes a substrate, a light emitting chip of a plurality of semiconductor light sources mounted on the substrate, a control element mounted on the substrate and controlling light emission of the light emitting chip, and a substrate A wiring element that is mounted on the power supply to supply power to the light emitting chip via the control element, a conductive metal member that is embedded (embedded) in the substrate and is electrically connected to the wiring element, and a conductive metal member A power supply member that is mechanically and electrically connected to the light-emitting chip, supplies heat to the light-emitting chip, a heat-dissipating member that radiates heat generated by the substrate to the outside, and a portion of the substrate corresponding to the light-emitting chip And a heat conducting metal member that conducts heat generated by the light emitting chip to the heat radiating member, and the heat conducting metal member has a plate shape .

In this invention (the invention according to claim 2), a mounting surface on which the light emitting chip, the control element, and the wiring element are mounted is provided on one surface of the substrate, and a contact surface is provided on the other surface of the substrate. One surface of the heat conducting metal member is covered with a part of the substrate, the other surface of the heat conducting metal member and the contact surface of the substrate are flush with each other, and one end of the heat radiating member to the upper surface, have abutment surfaces are provided on the contact surface of the heat radiating member, the abutment surface and the other surface of the heat-conducting metal member of the substrate that are in contact with each other, it is characterized.

  According to a third aspect of the present invention, there is provided a lamp housing and a lamp lens that define a lamp chamber, and a light source unit of a semiconductor-type light source for a vehicular lamp according to the first or second embodiment, which is disposed in the lamp chamber. And comprising.

  The light source unit of the semiconductor light source of the vehicle lamp according to the present invention (the invention according to claim 1) embeds a conductive metal member as an intermediary member that electrically connects the wiring element and the power supply member in the substrate. The occupation area of the metal member on the mounting surface of the substrate can be greatly reduced. Thereby, a board | substrate can be reduced in size, ie, light source unit itself can be reduced in size.

  Moreover, since the light source unit of the semiconductor type light source of the vehicular lamp according to the present invention (the invention according to claim 1) embeds the conductive metal member in the substrate, the conductive metal member and the substrate can be manufactured in an integrated structure. . As a result, the light source unit of the semiconductor-type light source for the vehicular lamp according to the present invention (the invention according to claim 1) feeds power to the substrate through the conductive metal member by mechanically connecting the power supply member to the conductive metal member. The relative positional accuracy with respect to the member can be improved. As a result, the light emitting chip on the substrate (light source part) side can be positioned with high accuracy with respect to the power supply member (the socket part and the cover part as an optical component) side, so that the optical performance can be improved, and Variation in optical performance can be reduced.

  In addition, the light source unit of the semiconductor-type light source of the vehicular lamp of the present invention (invention according to claim 1) has a conductive metal member embedded in the substrate, so compared to a conductive metal member separate from the substrate, The step of assembling the conductive metal member to the substrate can be omitted.

The light source unit of the semiconductor-type light source of the vehicle lamp according to the present invention (inventions according to claims 1 and 2) can conduct heat generated in the light emitting chip from the substrate to the heat dissipation member by the heat conducting metal member. As a result, the light source unit of the semiconductor-type light source of the vehicular lamp according to the present invention (inventions according to claims 1 and 2) can increase the thermal conductivity of the substrate by the thermal conductivity of the heat-conducting metal member. As the conductivity is increased, the size of the substrate and the heat dissipation member can be reduced. Thereby, light source unit itself can be reduced in size.

  The vehicle lamp according to the present invention (the invention according to claim 3) is similar to the light source unit of the semiconductor light source of the vehicle lamp according to claim 1 or 2 by means for solving the above-mentioned problems. The effect can be achieved.

FIG. 1 shows an embodiment of a light source unit of a semiconductor-type light source of a vehicular lamp according to the present invention, and an embodiment of a vehicular lamp according to the present invention, in which a light source unit is assembled to a vehicular lamp. It is a figure (vertical sectional view). FIG. 2 is a plan view showing a state in which the light source unit and the socket unit of the light source unit are assembled. FIG. 3 is an exploded perspective view showing an insulating member, a heat radiating member, and a power feeding member of the light source unit and the socket unit of the light source unit. FIG. 4 is an exploded perspective view showing a light source unit and a socket unit of the light source unit. FIG. 5 is a perspective view showing a state in which the light source unit and the socket unit of the light source unit are assembled. FIG. 6 is a longitudinal sectional view (vertical sectional view) showing a light source portion of the light source unit. 7 is a cross-sectional view taken along line VII-VII in FIG. FIG. 8 is an enlarged plan view illustrating the substrate of the light source unit of the light source unit.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments (examples) of a light source unit of a semiconductor-type light source of a vehicle lamp according to the present invention and embodiments (examples) of a vehicle lamp according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. 2 to 7, illustration of the control element and the wiring element is omitted.

(Description of configuration)
Hereinafter, the structure of the light source unit of the semiconductor type light source of the vehicle lamp in this embodiment and the vehicle lamp in this embodiment will be described. In FIG. 1, reference numeral 100 denotes a vehicular lamp in this embodiment. In FIG. 8, the symbol “XX” is the horizontal direction (left-right direction) when the vehicle lamp 100 is mounted on a vehicle (not shown), and the symbol “YY” is the horizontal It is a vertical direction (vertical direction) orthogonal to the direction XX.

(Description of vehicle lamp 100)
The vehicle lamp 100 is a one-lamp tail / stop lamp in this example. That is, the vehicular lamp 100 uses a tail lamp function and a stop lamp function together with one lamp (one lamp, one lamp). The vehicle lamps 100 are respectively provided on the left and right of the rear part of a vehicle (not shown). The vehicle lamp 100 may be combined with other lamp functions (not shown) (for example, a backup lamp function and a turn signal lamp function) to form a rear combination lamp.

  As shown in FIG. 1, the vehicular lamp 100 includes a lamp housing 101, a lamp lens 102, a reflector 103, and a light source unit having a semiconductor light source as a light source, that is, a semiconductor light source of the vehicular lamp in this embodiment. The light source unit 1 and a driving circuit (not shown) for the semiconductor light source of the light source unit 1 are provided.

  The lamp housing 101 is made of, for example, a light impermeable member (for example, a resin member). The lamp housing 101 has a hollow shape in which one side is open and the other side is closed. A through hole 104 is provided in the closed portion of the lamp housing 101. The through hole 104 has a circular shape. A plurality of concave portions (not shown) and a plurality of stopper portions (not shown) are provided at substantially equal intervals on the edge of the through hole 104.

  The lamp lens 102 is made of, for example, a light transmissive member (for example, a transparent resin member or a glass member). The lamp lens 102 has a hollow shape in which one side is open and the other side is closed. The periphery of the opening of the lamp lens 102 and the periphery of the opening of the lamp housing 101 are fixed in a watertight manner. A lamp chamber 105 is defined by the lamp housing 101 and the lamp lens 102.

  The reflector 103 is a light distribution control unit that performs light distribution control so that the light emitted from the light source unit 1 is collected at a focal point F (see FIG. 2). The reflector 103 is disposed in the lamp chamber 105 and is fixed to the lamp housing 101 or the like. The reflector 103 is composed of, for example, a light impermeable member (for example, a resin member or a metal member). The reflector 103 has a hollow shape in which one side is open and the other side is closed. A through hole 106 is provided in the closed portion of the reflector 103 so as to communicate with the through hole 104 of the lamp housing 101. A reflective surface 107 is provided on the inner surface of the reflector 103. The reflector 103 is made of a separate member from the lamp housing 101, but may be a reflector integrated with the lamp housing. In this case, a reflecting surface is provided on a part of the lamp housing to provide a reflector function.

(Description of the light source unit 1)
The said light source unit 1 is provided with the light source part 10, the socket part 11, and the cover part 12 as an optical component, as shown in FIGS. The light source unit 10 and the cover unit 12 are attached to one end (upper end) of the socket unit 11. The light source unit 10 is covered by the cover unit 12.

  The light source unit 1 is mounted on the vehicular lamp 100 as shown in FIG. That is, the socket part 11 is detachably attached to the lamp housing 101 via a packing (O-ring) 108. The light source unit 10 and the cover unit 12 are arranged in the lamp chamber 105 through the through hole 104 of the lamp housing 101 and the through hole 106 of the reflector 103 and on the reflecting surface 107 side of the reflector 103. Has been.

(Description of the light source unit 10)
2 to 8, the light source unit 10 includes a substrate 3 and a plurality of light emitting chips 40, 41, 42, 43, 44 (hereinafter referred to as “40˜ 44 ”), resistors RS, RT, RP and diodes DS, DT as control elements, and conductors 51, 52, 53, 54, 55, 56 (hereinafter referred to as“ 51-51 ”as wiring elements). 56 ”and the wire 6 and the conductive adhesive (not shown) and the mounting pad 60 and the wire pad 61, the conductive metal member 17, the heat conducting metal member 170, the surrounding wall member 18, And a sealing member 180.

(Description of substrate 3)
In this example, the substrate 3 is made of ceramic. As shown in FIGS. 2 to 8, the substrate 3 has a substantially octagonal plate shape when viewed from the plane (top). As shown in FIG. 6, the substrate 3 has a laminated structure of three layers 300, 301, and 302 in this example. The thickness of the layer 300 on the one surface (upper surface) side and the thickness of the layer 301 on the other surface (lower surface) side are, for example, about 50 μm. The intermediate layer 302 is thicker than the upper and lower layers.

  Although not shown, the substrate 3 is provided with at least two (in this example, two) fitting holes (or fitting recesses) for fixing and positioning (positioning) as fitting portions. Yes. Insertion holes 31, 32, and 33 through which the power supply members 91, 92, and 93 of the socket part 11 are inserted are provided by punching at substantially the center of the three sides (right side, left side, and lower side) of the substrate 3. A flat mounting surface 34 is provided on one surface (upper surface) of the substrate 3. A flat contact surface 35 is provided on the other surface (lower surface) of the substrate 3. A highly reflective surface 30 such as highly reflective paint or highly reflective vapor deposition may be further provided on the mounting surface 34 of the ceramic substrate 3 that is a highly reflective member.

  On the mounting surface 34 of the substrate 3, the five light emitting chips 40 to 44 and the control elements RS, RT, RP, DS, DT and the wiring elements 51 to 56, 6, 61, 62 and the surrounding wall The member 18 is mounted (that is, provided by printing, baking, vapor deposition, adhesion, fitting, etc.).

  As shown in FIGS. 6 and 7, the conductive metal member 17 and the heat conductive metal member 170 are embedded in the substrate 3. That is, the upper surface layer 300 and the intermediate layer 302 corresponding to the insertion holes 31, 32, 33 of the substrate 3 are provided with the recesses 303 by punching. The conductive metal member 17 is embedded in the recess 303. The lower surface layer 301 and the intermediate layer 302 corresponding to the five light emitting chips 40 to 44 of the substrate 3 are provided with holes 304 by punching. The heat conducting metal member 170 is embedded in the hole 304.

(Description of light emitting chips 40 to 44)
The semiconductor-type light source composed of the five light-emitting chips 40 to 44 uses a self-luminous semiconductor-type light source (LED in this embodiment) such as LED and EL (organic EL). As shown in FIGS. 2 to 8, the light emitting chips 40 to 44 are small rectangular (square or rectangular) semiconductor chips as viewed from the plane (upper direction perpendicular to the mounting surface 34 of the substrate 3). (Light source chip), and in this example, a bare chip. The five light emitting chips 40 to 44 emit light from one front surface and four side surfaces other than the surface mounted on the substrate 3.

  As shown in FIGS. 2 to 8, the five light emitting chips 40 to 44 include the focal point F of the reflector 103 of the optical system and the center (mounting rotation center) O of the socket portion 11 of the light source unit 1. One (40) is arranged in the vicinity, and four (41 to 44) are arranged on the circumference centered on the focal point F and the center O with gaps at substantially equal intervals.

  The five light emitting chips 40 to 44 are light emitting chips to which a small current is supplied. One light emitting chip 40 that is a light source of a tail lamp, that is, a first group of light emitting chips 40 and a large current (the light emitting chip). The light emitting chip is supplied with a large current (compared to the current supplied to 40), and the four light emitting chips 41 to 44, that is, the light source of the stop lamp, that is, the second group of light emitting chips 41 to 44, It is divided.

  One light emitting chip 40 of the tail lamp function (tail lamp light source) has four focus lamps and the center O and the stop lamp function (stop lamp light source) arranged on the circumference. It is arranged at the center of the light emitting chips 41 to 44. That is, one light emitting chip 40 having the tail lamp function is located in the middle of the five light emitting chips 40 to 44. The four light emitting chips 41 to 44 having the stop lamp function are connected in series in the forward direction (direction in which current flows).

  Of the five light emitting chips 40 to 44, one light emitting chip 40 having the tail lamp function is disposed at the center O of the substrate 3 and at or near the center O of the heat radiating member 8 described later. That is, the center of one light emitting chip 40 having the tail lamp function and the center O of the substrate 3 (center O of the heat radiating member 8 to be described later) coincide with or substantially coincide with each other.

(Description of control elements RS, RT, RP, DS, DT)
As shown in FIG. 8, the control element includes resistors RS, RT, and RP and diodes DS and DT. The control element controls light emission of the five light emitting chips 40 to 44.

  The resistors RS, RT, and RP are, for example, thin film resistors, thick film resistors, or SMD type resistors. The resistors RS and RT are adjustment resistors for obtaining a predetermined drive current value. That is, due to the variation in Vf (forward voltage characteristics) of the light emitting chips 40 to 44, the value of the drive current supplied to the light emitting chips 40 to 44 changes, and the brightness (light flux) of the light emitting chips 40 to 44 changes. Variations occur in brightness, brightness, and illuminance. For this purpose, by adjusting (trimming) the values of the resistors RS and RT, the value of the drive current supplied to the light emitting chips 40 to 44 is set to a predetermined value almost constant, thereby making the light emitting chip 40 It is possible to adjust (absorb) variations in brightness (luminous flux, luminance, luminous intensity, illuminance) of .about.44. Alternatively, the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitting chips 40-44 is made constant while directly monitoring the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitting chips 40-44. The values of the resistors RS and RT can be trimmed. In the trimming, for example, a part of the resistors RS and RT are cut out by a laser, or the whole is cut out (open) to adjust the resistance value. Note that the resistance value increases by opening and trimming.

  The resistor RP is a pull-down resistor for detecting disconnection of the four light emitting chips 41 to 44 in the second group, which is a light source of a stop lamp. The resistor RP is connected in series between the rear stage (cathode side) of the diode DS having a stop lamp function and the power supply member 93 on the ground side.

  The resistor RT connected in series to the one light emitting chip 40 having the tail lamp function, the resistor RS connected in series to the four light emitting chips 41 to 44 having the stop lamp function, and the stop lamp The resistor RP connected in series in the subsequent stage of the functional diode DS is one, three, or two, respectively. The number of resistors RP is determined by the capacitance of the resistor and the variable width of the resistor to be adjusted. May change. That is, the number of the resistors RS, RT, RP is not limited. In the resistor RS, as shown in FIG. 8, the left two resistors RS are connected in parallel to each other, and the right one resistor RS is connected in series to the left two resistors RS. Yes.

  When the light source unit 1 is mounted on the vehicle lamp 100 (see FIG. 1), the resistor RS having a large heat generation capacity of the stop lamp function for supplying a large current is more than the five light emitting chips 40 to 44. It is arranged so as to be located at a higher position. This makes it possible to release the heat generated in the resistor RS upward without affecting the five light emitting chips 40 to 44 by utilizing the property that heat rises.

  The diodes DS and DT include, for example, bare chip diodes or SMD diodes. The light emitting chip 40 having the tail lamp function and the diode DT connected in series to the resistor RT, the four light emitting chips 41 to 44 having the stop lamp function and the resistor RS are connected in series. The diode DS is a diode having a reverse connection prevention function and a pulse noise protection function from the reverse direction.

(Description of wiring elements 51 to 56, 6, 60, 61)
As shown in FIG. 8, the wiring element includes conductors (patterns, conductor patterns) 51 to 56, five wires (wiring wires, gold wires, bonding wires) 6, and five mounting pads (first pads). 60 and five wire pads (second pad, bonding part, bonding pad) 61. The wiring elements 51 to 56, 6, 60, 61 are electrically connected to the power feeding members 91, 92, 93 of the socket part 11 through the conductive metal member 17, and the control elements RS, RT, Power is supplied to the five light emitting chips 40 to 44 through RP, DS, and DT.

  The conductors 51 to 56 are made of, for example, thin film wiring or thick film wiring of a conductive member. The conductors 51 to 56 are connected to the resistors RS, RT, RP and the diodes DS, DT. The conductors 51 to 56 are provided with the mounting pad 60 and the wire pad 61, respectively. Of the conductors 51 to 56, the areas of the conductors 52 to 56 that supply a large current to the four light emitting chips 41 to 44 having the stop lamp function are substantially equal. Thereby, the heat generated in the conductors 52 to 56 can be released almost evenly to the outside (the heat radiating member 8 described later) through the substrate 3.

  The same number of the mounting pads 60 as the five light emitting chips 40 to 44, five in this example, are arranged. The five light emitting chips 40 to 44 are bonded to the five mounting pads 60 via the conductive adhesive such as silver paste. The mounting pad 60 has a small rectangular (square or rectangular) shape when viewed from the plane (upper direction perpendicular to the mounting surface 34 of the substrate 3).

  The same number of the wire pads 61 as the five light emitting chips 40 to 44, in this example, five are provided (mounted). The wire pad 61 has a minute rectangular (square or rectangular) shape when viewed from the plane (upper direction perpendicular to the mounting surface 34 of the substrate 3).

  The same number of the wires 6 as the five light emitting chips 40 to 44, in this example, five wires, are bonded. That is, both ends of the five wires 6 are electrically connected to the five light emitting chips 40 to 44 and the five wire pads 61, respectively. Electrodes are provided at locations where the wires 6 of the light emitting chips 40 to 44 are bonded and locations where the light emitting chips 40 to 44 are bonded to the mounting pads 60 via the conductive adhesive. ing.

(Description of conductive metal member 17)
The conductive metal member 17 is made of a conductive metal, in this example, a copper-based alloy (CuW, CuMo, etc.) that can withstand the firing of the substrate (ceramic substrate) 3. In particular, it is made of CuW having a linear expansion coefficient substantially equal to or close to that of the substrate (ceramic substrate) 3. The conductive metal member 17 has a rectangular tube shape. The conductive metal member 17 is embedded in the upper surface layer 300 of the substrate 3 and the concave portion 303 of the intermediate layer 302. One surface (upper surface) of the conductive metal member 17 and the mounting surface 34 of the substrate 3 are flush with each other. A part of the other surface (lower surface) of the conductive metal member 17 is covered with the lower surface layer 301 of the substrate 3.

  The conductive metal member 17 is for electrically connecting the light source unit 10 and the socket unit 11. On one surface of the conductive metal member 17, the conductors 51, 52, 53 of the wiring element mounted on the mounting surface 34 of the substrate 3 of the light source unit 10 are formed by solder or conductive adhesive (not shown). Are electrically connected. One end portions of the power feeding members 91 to 93 of the socket portion 11 are electrically and mechanically connected to the conductive metal member 17 by, for example, welding (leather welding).

(Description of heat conducting metal member 170)
The heat conducting metal member 170 is made of a metal having a high thermal conductivity, in this example, a copper alloy (CuW, CuMo, etc.) that can withstand the firing of the substrate (ceramic substrate) 3, like the conductive metal member 17. . In particular, it is made of CuW having a linear expansion coefficient substantially equal to or close to that of the substrate (ceramic substrate) 3. The heat conducting metal member 170 has a plate shape of a circle or a rectangle (the shape is not limited). The heat conducting metal member 170 is embedded in the lower surface layer 301 of the substrate 3 and the hole 304 of the intermediate layer 302. One surface (upper surface) of the heat conducting metal member 170 is covered with the upper surface layer 300 of the substrate 3. The other surface (lower surface) of the heat conducting metal member 170 and the contact surface 35 of the substrate 3 are flush with each other. The heat conducting metal member 170 is heat generated in the light emitting chips 40 to 44, and conducts heat transmitted through the upper surface layer 300 of the substrate 3 to the heat radiating member 8 of the socket portion 11.

(Description of the surrounding wall member 18)
The surrounding wall member 18 is made of an insulating member, for example, a resin, in this example, a resin having elasticity that can follow the expansion and contraction of the sealing member 180 (thermoplastic elastomer, olefinic TPO resin). ing. As shown in FIGS. 2 to 7, the surrounding wall member 18 includes all of the five light emitting chips 40 to 44, a part of the wiring element (that is, a part of the conductors 51 to 56 and five parts. All of the wires 6 and all of the five mounting pads 60 and all of the five wire pads 61 are formed in an annular shape. That is, the surrounding wall member 18 has an annular shape in which the central portion is the hollow portion 181 and the peripheral portion is the wall portion 182. The wall portion 182 of the surrounding wall member 18 has a substantially uniform thickness (thickness from the inner peripheral surface to the outer peripheral surface of the wall portion 182).

  The surrounding wall member 18 has a height sufficiently higher than the height of the light emitting chips 40 to 44 and the wire 6 of the wiring element. The surrounding wall member 18 is a member (bank, dam) that regulates the capacity (range) for filling (injecting, molding, molding) the sealing member 180 to a small capacity. On one end surface (lower end surface) of the wall portion 182 of the surrounding wall member 18, there are at least two fitting convex portions (not shown) for fixing and positioning (positioning) as fitting portions (this example). 2) are provided corresponding to the fitting holes of the substrate 3. By fitting the fitting protrusion and the fitting hole to each other, the surrounding wall member 18 and the substrate 3 are fixed to each other and positioned.

  One end surface (lower end surface) of the wall portion 182 of the surrounding wall member 18 fixed and positioned with the substrate 3 by the fitting convex portion and the fitting hole is the mounting surface of the substrate 3. 34 is bonded and fixed (mounted) with an adhesive (not shown). In this example, the adhesive uses an epoxy resin having a glass transition temperature in the vicinity of the upper limit temperature of the light emitting chips 40 to 44 and having an elastic modulus that decreases from about 20 ° C. before the glass transition temperature.

  It is in the hollow portion 181 of the surrounding wall member 18 mounted on the substrate 3, and is defined by the mounting surface 34 of the substrate 3 and the inner peripheral surface of the wall portion 182 of the surrounding wall member 18. The light emitting chips 40 to 44 and the five wire pads 61 are mounted in the space, the five wires 6 are bonded to each other, and the sealing member 180 is formed. Filled. The place for filling the sealing member 180 into the hollow portion 181 of the surrounding wall member 18 is a place where the wire 6 is not wired.

  Light (not shown) emitted from the light emitting chips 40 to 44 (particularly, the four side surfaces of the light emitting chips 40 to 44) is applied to the inner peripheral surface of the wall portion 182 of the surrounding wall member 18 in a predetermined direction. A reflective surface 184 is provided for reflection in the direction (for example, substantially the same direction as the light emitted from one front surface of the light emitting chips 40 to 44). The reflection surface 184 is inclined so as to extend from one end (lower end) to the other end (upper end) of the inner peripheral surface of the wall portion 182. The reflective surface 184 is configured such that the entire surrounding wall member 18 is made of a highly reflective member, for example, the entire surrounding wall member 18 is whitened by containing titanium oxide in an elastomeric resin, or the surrounding surface. Only the inner peripheral surface of the wall portion 182 of the wall member 18 is formed of a highly reflective member.

(Description of sealing member 180)
The sealing member 180 is made of a light transmissive member, for example, an epoxy resin. In this example, the sealing member 180 has a glass transition temperature in the vicinity of the upper limit temperature of the light emitting chips 40 to 44 and is elastic from about 20 ° C. before the glass transition temperature in the same manner as the adhesive. Use an epoxy resin that reduces the rate.

  The sealing member 180 includes the hollow portion of the surrounding wall member 18 mounted on the substrate 3 after the light emitting chips 40 to 44 are mounted on the substrate 3 and the wires 6 are bonded to each other. 181 and filled in a space defined by the mounting surface 34 of the substrate 3 and the inner peripheral surface of the wall portion 182 of the surrounding wall member 18. When the sealing member 180 is cured, all of the five light emitting chips 40 to 44, a part of the conductors 51 to 56, the whole wire 6, the whole mounting pad 60, the whole wire pad 61, and the whole The conductive adhesive is sealed by the sealing member 180.

  The sealing member 180 includes all five light emitting chips 40 to 44, a part of the conductors 51 to 56, all the wires 6, all the mounting pads 60, all the wire pads 61, and the conductive adhesive. This prevents the external influence, for example, contact with other things or adhesion of dust, and protection from ultraviolet rays, sulfide gas, NOx and water. That is, the sealing member 180 protects the five light emitting chips 40 to 44 from disturbance.

(Description of socket part 11)
As shown in FIGS. 2 to 5 and 7, the socket portion 11 includes an insulating member 7, a heat radiating member 8, and three power feeding members 91, 92, and 93. The heat radiating member 8 having thermal conductivity and conductivity and the power feeding members 91 to 93 having conductivity are integrally incorporated in the insulating member 7 having insulation properties in an insulated state.

  The socket portion 11 has an integral structure of the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93. For example, the insulating member 7, the heat radiating member 8, and the power feeding members 91 to 93 are integrally formed by insert molding (integral molding). Alternatively, the insulating member 7 and the power feeding members 91 to 93 are integrally formed by insert molding (integral molding), and the heat radiating member 8 is integrally attached to the insulating member 7 and the power feeding members 91 to 93 having an integrated structure. This is a structure. Alternatively, the power feeding members 91 to 93 are integrally assembled to the insulating member 7, and the heat radiating member 8 is integrally attached to the integrally assembled insulating member 7 and the power feeding members 91 to 93.

(Description of insulating member 7)
The insulating member 7 is provided with an attachment portion for attaching the light source unit 1 to the vehicular lamp 100 detachably or fixedly. The insulating member 7 is made of, for example, an insulating resin member. The insulating member 7 has a substantially cylindrical shape whose outer diameter is slightly smaller than the inner diameter of the through hole 104 of the lamp housing 101. A disc-shaped flange 71 is integrally provided at one end (upper end) of the insulating member 7. At one end (upper end) of the insulating member 7, a plurality of, in this example, four mounting portions 70 are integrally provided so as to correspond to the concave portion of the lamp housing 101. Note that only three attachment portions 70 are shown in FIGS.

  The mounting portion 70 is used to equip the vehicle lamp 100 with the light source unit 1. That is, a part of the socket part 11 on the cover part 12 side and the attachment part 70 are inserted into the through hole 104 and the recess of the lamp housing 101. In this state, the socket portion 11 is rotated around the center O axis, and the mounting portion 70 is brought into contact with the stopper portion of the lamp housing 101. At this time, the mounting portion 70 and the flange portion 71 sandwich the edge portion of the through hole 104 of the lamp housing 101 from above and below via the packing 108 (see FIG. 1).

  As a result, as shown in FIG. 1, the socket portion 11 of the light source unit 1 is detachably or fixedly attached to the lamp housing 101 of the vehicle lamp 100 via the packing 108. At this time, as shown in FIG. 1, the portion of the socket portion 11 that protrudes outward from the lamp housing 101 (the portion below the lamp housing 101 in FIG. 1) is the lamp chamber 105 of the socket portion 11. It is larger than the portion housed inside (the portion above the lamp housing 101 in FIG. 1).

  On one end surface (upper end surface) of the insulating member 7, a convex portion 72 is integrally provided. A light source side connector portion 13 is integrally provided at the other end portion (lower end portion) of the insulating member 7. A connector 14 on the power supply side is attached to the connector portion 13 so as to be mechanically detachable and electrically connectable.

(Description of heat dissipation member 8)
The heat radiating member 8 radiates heat generated by the light source unit 10 to the outside. The heat radiating member 8 is made of, for example, an aluminum die casting or a resin member having thermal conductivity (also having conductivity). The heat radiating member 8 has one end portion (upper end portion) 84 having a disc shape and a fin shape from the intermediate portion to the other end portion (lower end portion) 85. A contact surface 80 is provided on the upper surface of one end of the heat radiating member 8. The contact surface 80 of the heat radiating member 8 is bonded with a heat conductive medium (not shown) in a state where the contact surfaces 35 of the substrate 3 are in contact with each other. As a result, the light emitting chips 40 to 44 are positioned corresponding to locations where the vicinity of the center O of the heat radiating member 8 (the center O of the socket portion 11) is located via the substrate 3.

  The heat conductive medium is, for example, a heat conductive adhesive, and is made of an epoxy resin adhesive, a silicon resin adhesive, an acrylic resin adhesive, or the like as a material. Form, tape form, etc. The heat conductive medium may be a heat conductive grease in addition to the heat conductive adhesive.

  At substantially the center of the three sides (right side, left side, and lower side) of the heat radiating member 8, notches 81, 82, and 83 are provided in the insertion holes 31 to 33 of the substrate 3 and the convex portion 72 of the insulating member 7, respectively. Correspondingly provided. The three power supply members 91 to 93 are arranged in the notches 81 to 83 of the heat radiating member 8 and the insertion holes 31 to 33 of the substrate 3, respectively. The insulating member 7 is interposed between the heat radiating member 8 and the power feeding members 91 to 93. The heat radiating member 8 is in close contact with the insulating member 7. The power supply members 91 to 93 are in close contact with the insulating member 7.

  A disc-shaped flange 86 is integrally provided at an intermediate portion of the heat radiating member 8 so as to correspond to the flange 71 of the insulating member 7. As shown in FIG. 7, two (or one or plural) biting recesses 87 (or biting projections) are provided on the surface of the flange portion 86 on the one end portion 84 side. When the insulating member 7 and the heat radiating member 8 are insert-molded (integrated molding), the resin of the insulating member 7 bites into the biting recess 87 of the heat radiating member 8. As a result, high water tightness between the insulating member 7 and the heat radiating member 8 is maintained. In FIG. 3, the biting recess 87 is not shown.

(Description of power supply members 91-93)
The power supply members 91 to 93 supply power to the light source unit 10. The power feeding members 91 to 93 are made of, for example, a conductive metal member. One end portions (upper end portions) of the power supply members 91 to 93 have a divergent shape, and are formed in the notches 81 to 83 of the heat radiating member 8, the insertion holes 31 to 33 of the substrate 3, and the conductive metal member 17. Each is located. One end portions of the power supply members 91 to 93 protrude from the convex portion 72 of the insulating member 7 and are electrically and mechanically connected to the conductive metal member 17 by, for example, welding (leather welding).

  The other end portions (lower end portions) of the power supply members 91 to 93 have a narrowed shape and are disposed in the connector portion 13. The other end portions of the power supply members 91 to 93 constitute male terminals (male terminals) 910, 920, and 930.

(Description of connector portion 13 and connector 14)
The connector 14 is provided with a female terminal (female terminal) (not shown) that is electrically connected to the male terminals 910 to 930 of the connector portion 13. By attaching the connector 14 to the connector portion 13, the female terminal is electrically connected to the male terminals 910 to 930. Further, by removing the connector 14 from the connector portion 13, electrical connection between the female terminal and the male terminals 910 to 930 is interrupted.

  As shown in FIG. 1, the first female terminal and the second female terminal among the female terminals of the connector 14 are connected to a power supply (DC power supply battery) via harnesses 144 and 145 and a switch (not shown). (Not shown). A third female terminal among the female terminals of the connector 14 is grounded (grounded) via a harness 146. The connector portion 13 and the connector 14 are 3-pin (the three power feeding members 91 to 93, the three male terminals 910 to 930, and the three female terminals) type connector portions and connectors.

(Description of cover part 12)
The cover portion 12 is made of a light transmissive member. The cover unit 12 is provided with an optical control unit (not shown) such as a prism that optically controls and emits light from the five light emitting chips 40 to 44. The cover portion 12 is an optical component.

  As shown in FIG. 1, the cover part 12 is attached to one end part (one end opening part) of the cylindrical socket part 11 so as to cover the light source part 10. The cover portion 12 together with the sealing member 180 prevents the five light emitting chips 40 to 44 from being affected from the outside, for example, contact with other things or adhesion of dust, and It protects against ultraviolet rays, sulfur gas, NOx and water. That is, the cover 12 protects the five light emitting chips 40 to 44 from disturbance. In addition to the five light emitting chips 40 to 44, the cover portion 12 includes the resistors RS, RT, RP, the diodes DS, DT of the control element, the conductors 51 to 56 of the wiring element, and the wires. 6. The mounting pad 60, the wire pad 61, and the conductive adhesive are also protected from disturbance. The cover portion 12 may be provided with a vent hole (not shown).

(Description of action)
The light source unit 1 of the semiconductor-type light source of the vehicle lamp in this embodiment and the vehicle lamp 100 in this embodiment (hereinafter referred to as “the light source unit 1 and the vehicle lamp 100 in this embodiment”) are configured as described above. The operation will be described below.

  First, the switch is operated to turn on the tail lamp. Then, the current (drive current) is supplied to one light emitting chip 40 having the tail lamp function through the control element and the wiring element having the tail lamp function. As a result, one light emitting chip 40 having a tail lamp function emits light.

  Light emitted from one light emitting chip 40 having the tail lamp function is transmitted through the sealing member 180, the air layer, and the cover portion 12 of the light source unit 1, and light distribution is controlled. A part of the light emitted from the light emitting chip 40 is reflected by the highly reflective surface 30 of the substrate 3 toward the cover unit 12. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the tail lamp function to the outside.

  Next, the switch is operated to turn on the stop lamp. Then, the current (drive current) is supplied to the four light emitting chips 41 to 44 having the stop lamp function through the control element and the wiring element having the stop lamp function. As a result, the four light emitting chips 41 to 44 having the stop lamp function emit light.

  Light emitted from the four light emitting chips 41 to 44 having the stop lamp function is transmitted through the sealing member 180, the air layer, and the cover portion 12 of the light source unit 1, and the light distribution is controlled. A part of the light emitted from the light emitting chips 41 to 44 is reflected by the highly reflective surface 30 of the substrate 3 to the cover unit 12 side. The light subjected to the light distribution control is transmitted through the lamp lens 102 of the vehicular lamp 100, is again subjected to the light distribution control, and is irradiated to the outside. Thereby, the vehicular lamp 100 irradiates the light distribution of the stop lamp function to the outside. The light distribution of the stop lamp function is brighter than the light distribution of the tail lamp function (the luminous flux, luminance, luminous intensity, and illuminance are large).

  Then, turn off the switch. Then, the current (drive current) is interrupted. As a result, one light emitting chip 40 or four light emitting chips 41 to 44 are extinguished. Thereby, the vehicular lamp 100 is turned off.

  Here, the heat generated in the light emitting chips 40 to 44 of the light source unit 10, the resistance of the control element, and the conductor of the diode and the wiring element is transmitted to the heat radiating member 8 through the substrate 3, the heat conducting metal member 170, and the heat conductive medium. The heat radiation member 8 radiates outside.

(Explanation of effect)
The light source unit 1 and the vehicular lamp 100 in this embodiment are configured and operated as described above, and the effects thereof will be described below.

  In this embodiment, the light source unit 1 and the vehicular lamp 100 are provided with a conductive metal member 17 on the substrate 3 as an intermediary member that electrically connects the conductors 51, 52, 53 of the wiring elements and the power supply members 91, 92, 93. Since it embeds, the occupation area in the mounting surface 34 of the board | substrate 3 of the conductive metal member 17 can be reduced significantly. Thereby, the board | substrate 3 can be reduced in size, ie, light source unit 1 itself can be reduced in size.

  Moreover, since the light source unit 1 and the vehicle lamp 100 in this embodiment embed the conductive metal member 17 in the substrate 3, the conductive metal member 17 and the substrate 3 can be manufactured in an integrated structure. As a result, the light source unit 1 and the vehicle lamp 100 according to this embodiment mechanically connect the power supply members 91, 92, and 93 to the conductive metal member 17 by welding (leather welding) or the like. Thus, the relative positional accuracy between the substrate 3 and the power supply members 91, 92, 93 can be improved. Thereby, the light emitting chips 40 to 44 on the substrate 3 (light source unit 10) side can be positioned with high accuracy with respect to the power supply members 91, 92, and 93 (the socket unit 11 and the cover unit 12 as an optical component) side. Therefore, the optical performance can be improved, and variations in the optical performance can be reduced.

  In addition, in the light source unit 1 and the vehicle lamp 100 in this embodiment, since the conductive metal member 17 is embedded in the substrate 3, the conductive metal member 17 is compared with the conductive metal member separate from the substrate 3. 3 can be omitted.

  The light source unit 1 and the vehicular lamp 100 in this embodiment can conduct heat generated in the light emitting chips 40 to 44 from the substrate 3 to the heat radiating member 8 by the heat conducting metal member 170. As a result, the light source unit 1 and the vehicular lamp 100 in this embodiment can increase the thermal conductivity of the substrate 3 by the thermal conductivity of the heat conducting metal member 170, and increase the thermal conductivity by the amount of the substrate 3 In addition, the size of the heat dissipation member 8 can be reduced. Thereby, light source unit 1 itself can be reduced in size.

  In the light source unit 1 and the vehicle lamp 100 in this embodiment, the conductive metal member 17 and the heat conductive metal member 170 are simultaneously embedded in the substrate 3, thereby simplifying the manufacturing process of the substrate 3 and suppressing the manufacturing cost at a low cost. be able to.

  Here, the conductive metal member 17 and the heat conductive metal member 170 are made of a metal (CuW) having a linear expansion coefficient substantially equal to or close to the linear expansion coefficient of the substrate (ceramic substrate) 3. The stress generated by the thermal expansion and heat shrinkage between the heat conducting metal member 170 and the substrate 3 can be reduced. As a result, peeling of the light emitting chips 40 to 44 and disconnection of the wire 6 can be reliably prevented.

(Description of example other than embodiment)
In the above embodiment, five light emitting chips 40 to 44 are used. However, in the present invention, the number of light emitting chips may be two to four, six or more. The number and layout of the light emitting chips used as the tail lamp function and the number and layout of the light emitting chips used as the stop lamp function are not particularly limited. That is, it is only necessary that a plurality of light emitting chips are mounted in a row or on the circumference. In addition, when a plurality of light emitting chips are arranged on the circumference, the light emitting chips do not have to be arranged at the center of the circumference. In addition, when two or more light emitting chips are arranged on the circumference, it is not necessary to arrange them at equal intervals.

  Moreover, in the said embodiment, it uses for the dual function lamp of a tail stop lamp. However, in the present invention, it can also be used for a dual function lamp of a combination lamp other than a dual function lamp of a tail stop lamp. That is, a light-emitting chip that is supplied with a small current and emits a small amount of light and a light-emitting chip that is supplied with a large current and emits a large amount of light can be substituted for a sub-filament having a small amount of light and a main filament having a large amount of light.

  Furthermore, in the said embodiment, it uses for the dual function lamp of a tail stop lamp. However, in the present invention, it can be used for a single-function lamp. That is, a plurality of light emitting chips can be used for a single function lamp instead of a single filament. Single function lamps include turn signal lamp, backup lamp, stop lamp, tail lamp, headlamp low beam lamp (passing headlamp), headlamp high beam lamp (running headlamp), fog lamp, clearance lamp, cornering lamp There is a detime running lamp.

  Furthermore, in the said embodiment, it uses for switching of two lamps, a tail lamp and a stop lamp. However, in the present invention, it can be used for switching three or more lamps, or can be used for one lamp that does not perform switching.

  Furthermore, in the above-described embodiment, the connector portion 13 is provided integrally with the socket portion 11. However, in the present invention, the connector portion 13 may not be provided integrally with the socket portion 11. In this case, a light source side connector is provided separately from the socket portion 11, and the light source side connector is electrically connected to a power supply member of the light source unit 1 (see power supply members 91 to 93 in the embodiment) via a harness. To do. By attaching the power source side connector 14 to the light source side connector, electricity is supplied to the light source unit 10, and by removing the power source side connector 14 from the light source side connector, electricity supply to the light source unit 10 is achieved. Blocked.

  Furthermore, in the above-described embodiment, the board 3 is provided with a fitting hole (fitting concave portion), while the surrounding wall member 18 is provided with a fitting convex portion. However, in this invention, the board 3 may be provided with a fitting convex part, while the surrounding wall member 18 may be provided with a fitting hole (fitting concave part). The concave portion) and the fitting convex portion may be provided, respectively, while the surrounding wall member 18 may be provided with the fitting convex portion and the fitting hole (fitting concave portion).

  Furthermore, in the above-described embodiment, the fin-shaped other end portion 85 of the heat radiating member 8 of the socket portion 11 is exposed from the insulating member 7. However, in the present invention, the other end portion of the heat radiating member 8 of the socket portion 11 may be covered with the insulating member 7.

  Furthermore, in the said embodiment, the attachment direction to the connector part 13 of the connector 14 of the power supply side and the attachment direction to the vehicle lamp 100 of the light source unit 1 correspond (it is parallel). However, in the present invention, the mounting direction of the power supply side connector 14 to the connector portion 13 and the mounting direction of the light source unit 1 to the vehicle lamp 100 may intersect (orthogonal).

  Furthermore, in the above-described embodiment, the socket portion 11 includes the insulating member 7, the heat radiating member 8, and the three power feeding members 91, 92, and 93. However, in the present invention, the socket portion 11 may not have the heat radiating member 8.

  Furthermore, in the above embodiment, after the wire pad 61 and the mounting pad 60 are mounted on the substrate 3, the surrounding wall member 18 is mounted on the substrate 3, and then the light emitting chips 40 to 44 are mounted on the substrate 3. In addition, the wire 6 is bonded. However, in the present invention, the mounting process of the surrounding wall member, the mounting process of the light emitting chip, and the bonding process of the wires may be interchanged.

  Furthermore, in the above embodiment, an epoxy resin is used as the sealing member 180. However, in the present invention, a resin other than an epoxy resin, for example, silicon may be used as the sealing member 180.

  Furthermore, in the above-described embodiment, an elastomeric resin is used as the surrounding wall member 18. However, in the present invention, a resin other than the elastomeric resin may be used as the surrounding wall member 18. However, when an epoxy resin is used as the sealing member 180, an elastomeric resin is used as the surrounding wall member 18 in order to relieve stress due to expansion and contraction of the epoxy resin.

  Furthermore, in the said embodiment, the reflective surface 184 which inclines so that it may spread toward the end from the one end (lower end) of the inner peripheral surface of the wall part 182 of the surrounding wall member 18 to the other end (upper end) is provided. is there. However, in this invention, it is not necessary to provide a reflecting surface on the inner peripheral surface of the wall portion of the surrounding wall member. In this case, the inner peripheral surface of the wall portion of the surrounding wall member may be a vertical surface instead of an inclined surface.

  Furthermore, in the above-described embodiment, the wall thickness 182 (thickness from the inner peripheral surface to the outer peripheral surface of the wall portion 182) of the surrounding wall member 18 is substantially uniform (equal). However, in the present invention, the wall thickness of the surrounding wall member may not be substantially uniform.

  Furthermore, in the above embodiment, the shape of the inner peripheral surface of the wall portion 182 of the surrounding wall member 18 is circular, that is, four light emitting chips as viewed in the direction perpendicular to the mounting surface 34 of the substrate 3. It is a circular shape concentric with the circumference of 41-44. However, in the present invention, the shape of the inner peripheral surface of the wall portion 182 of the surrounding wall member 18 is an elliptical shape or a shape based on the ellipse (that is, based on the curves at both ends in the major axis direction of the reference ellipse). It may be a shape displaced toward the center of the ellipse). In this case, a plurality of light emitting chips are arranged in a line in the major axis direction of an ellipse or a reference ellipse.

  Furthermore, in the above-described embodiment, the heat conducting metal member 170 is embedded in the substrate 3. However, in the present invention, the heat conducting metal member 170 need not be embedded in the substrate 3. In this case, only the conductive metal member 17 is embedded in the substrate 3.

  Furthermore, in the above-described embodiment, the substrate 3 has a laminated structure of three layers 300, 301, and 302. However, in the present invention, the substrate may have a laminated structure of two layers or a laminated structure of four or more layers.

DESCRIPTION OF SYMBOLS 100 Vehicle lamp 101 Lamp housing 102 Lamp lens 103 Reflector 104 Through-hole 105 Lamp chamber 106 Through-hole 107 Reflecting surface 108 Packing 1 Light source unit 10 Light source part 11 Socket part 12 Cover part 13 Connector part 14 Connector 144, 145, 146 Harness 17 Conductive metal member 170 Heat conducting metal member 18 Surrounding wall member 180 Sealing member 181 Hollow portion 182 Wall portion 184 Reflecting surface 3 Substrate 30 High reflecting surface 31, 32, 33 Insertion hole 34 Mounting surface 35 Contact surface 300 Upper surface layer 301 Lower surface layer 302 Intermediate layer 303 Recess 304 Hole 40, 41, 42, 43, 44 Light emitting chip 51, 52, 53, 54, 55, 56 Conductor (wiring element)
6 Wire (Wiring element)
60 Mounting pads (wiring elements)
61 Wire pads (wiring elements)
7 Insulating member 70 Mounting portion 71 Hook portion 72 Protruding portion 8 Heat radiation member 80 Contact surface 81, 82, 83 Notch 84 One end portion 85 Other end portion 86 Hook portion 87 Biting concave portion 91, 92, 93 Feed member 910, 920, 930 Male terminal DS, DT diode (control element)
F Focus O Center RS, RT, RP Resistance (control element)
XX Horizontal direction (left-right direction)
YY Vertical direction (vertical direction)

Claims (3)

In a light source unit of a semiconductor-type light source for a vehicle lamp,
A substrate,
A plurality of semiconductor-type light source light-emitting chips mounted on the substrate;
A control element mounted on the substrate for controlling light emission of the light emitting chip;
A wiring element mounted on the substrate and supplying power to the light emitting chip via the control element;
A conductive metal member embedded in the substrate and electrically connected to the wiring element;
A power supply member that is mechanically and electrically connected to the conductive metal member and supplies power to the light emitting chip;
A heat dissipating member that is attached to the substrate and radiates heat generated by the substrate to the outside;
A thermally conductive metal member that is embedded in a portion of the substrate corresponding to the light emitting chip and conducts heat generated by the light emitting chip to the heat radiating member;
Equipped with a,
The heat conducting metal member has a plate shape ,
A light source unit for a semiconductor light source of a vehicular lamp. On one surface of the substrate , a mounting surface on which the light emitting chip, the control element, and the wiring element are mounted is provided,
A contact surface is provided on the other surface of the substrate,
One surface of the heat conducting metal member is covered with a part of the layer of the substrate,
The other surface of the heat conducting metal member and the contact surface of the substrate are flush with each other,
A contact surface is provided on the upper surface of one end of the heat dissipation member,
Wherein the said abutment surface of the heat radiating member, the other surface of the abutment surface and the heat-conducting metal member of the substrate that are in contact with each other,
The light source unit of the semiconductor type light source of the vehicular lamp according to claim 1. In a vehicular lamp using a semiconductor-type light source as a light source,
A lamp housing and a lamp lens that partition the lamp chamber;
The light source unit of the semiconductor type light source of the vehicular lamp according to claim 1 or 2, wherein the light source unit is disposed in the lamp chamber;
A vehicular lamp characterized by comprising:

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