JP5765981B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device in which a light emitting element is mounted on a substrate on which a wiring pattern is formed.

  Various methods are known as a method of mounting a flip chip type light emitting element having an anode and a cathode on the same surface on a substrate on which a wiring pattern is formed. For example, in Patent Document 1, solder bumps are formed in advance on the anode and cathode of a light-emitting element and mounted on a pattern electrode on a substrate for reflow, or Au bumps are formed on the anode and cathode to form a pattern electrode. A method of ultrasonic bonding of Au and Au-Au constituting the electrode, and a method of applying solder on the pattern electrode and bonding by reflow to the anode and cathode with Au bumps are disclosed.

  In Patent Document 2, solder layers are formed in a plurality of islands on the surfaces of the anode and cathode of a light emitting element by sputtering film formation using a mask, and mounted on a wiring pattern of a substrate on which a flux film is formed. A method of performing solder bonding by reducing the contact area with the wiring pattern by reflow is disclosed. Thereby, joining by a thin solder layer is enabled.

  Patent Document 3 discloses a method of bonding a bump and a pad by mounting a chip provided with a solder or Au bump on a pad of a substrate pattern, pressing it strongly and heating it.

  On the other hand, unlike the flip-chip type, Patent Document 4 discloses a technique in which light-emitting elements each having one of an anode and a cathode on the top surface and the other on the back surface are arranged in an array and mounted on a substrate. Solder paste is printed on the die bonding pattern on the substrate, the light emitting elements are mounted side by side, and bonded by reflowing. Excess solder flows at the end of the die bonding pattern during reflow. This prevents the phenomenon of climbing upward from the gap between adjacent light emitting elements.

JP 2003-304003 A JP 2007-251021 A Japanese Patent No. 2830824 JP-A-7-147430

  In the prior art, in the case of flip chip, bonding is performed using bumps as in Patent Documents 1 and 3, or using an island-shaped solder layer as in Patent Document 2. However, when bonding is performed using a bump or island-shaped solder layer, the area of contact of the bump or island-shaped solder layer with the light emitting element or the substrate is small, so that the heat capacity that can be conducted by the bump or island-shaped solder layer is limited. For this reason, in the case of a light-emitting element having a large amount of heat and a large amount of light, it is difficult to cool the substrate by sufficiently conducting the heat to the substrate.

  On the other hand, as in the technique of Patent Document 4, a method of printing a solder paste on a substrate pattern to mount a light emitting element and reflowing the solder layer increases the thickness of the solder layer. The contact area is large, and the efficiency of heat conduction of the light emitting element to the substrate is good.

  For this reason, in the case of a light emitting element having a large calorific value, a method of printing and reflowing solder paste is desirable from the viewpoint of heat conduction even if it is a flip chip. However, the anode and cathode of the flip chip are formed such that at least one electrode has a small area, and it is difficult to supply the solder paste to the small electrode area. Further, when the solder melted at the time of reflow spreads out over the gap, a short circuit occurs. For this reason, it has been difficult to perform the reflow method for supplying solder paste to flip chip mounting.

  An object of the present invention is to provide a light-emitting device in which a flip-chip type light-emitting element is mounted on a substrate with high thermal conductivity.

  In order to achieve the above object, according to the first aspect of the present invention, the following light emitting device is provided. That is, a light-emitting device having a substrate, a conductive pattern formed on the substrate, and a plurality of light-emitting elements mounted in a row on the conductive pattern and bonded to the conductive pattern via a solder layer. The light emitting element includes a first electrode and a second electrode having a smaller area than the first electrode on the bottom surface side. The conductive pattern is arranged for each of the plurality of light emitting elements, and is connected to the first pad facing the first electrode, the second pad facing the second electrode, and the first pad of the adjacent light emitting element. And a connecting portion. A solder layer is disposed on the first pad, the second pad, and the connecting portion.

  The connecting portion is preferably arranged on one side of the first pad, and the second connecting portion is connected to the other side.

  It is preferable that the solder layer on the connecting portion described above is continuous with the solder layer on each of the first pad and the second pad connected by the connecting portion.

  The conductive pattern can be configured to further include a lighting test terminal disposed beside the first pad. In this case, the second connecting portion may be configured to connect the first pad and the lighting test terminal. It is preferable that the lighting test terminal is disposed for each light emitting element, and all of the lighting test terminals are disposed on one side of the row of the plurality of light emitting elements.

  It is preferable that the first pad is rectangular, and the connecting portion and the second connecting portion are each connected to the central portion of the side of the first pad, and there are corners at both ends of the side.

  Moreover, according to the 2nd aspect of this invention, the following light-emitting devices are provided. A light-emitting device having a substrate, a conductive pattern formed on the substrate, and a light-emitting element mounted on the conductive pattern and bonded to the conductive pattern via a solder layer, the light-emitting element being first on the bottom side An electrode and a second electrode having a smaller area than the first electrode are provided. The conductive pattern includes a first pad facing the first electrode, a second pad facing the second electrode, and a solder supply pad continuous with the second pad. A solder layer is disposed on the first pad, the second pad, and the solder supply pad, and the solder layer formed on the second pad and the solder supply pad is continuous.

  Moreover, according to the 3rd aspect of this invention, the following board | substrates with a conductive pattern are provided. That is, the substrate is provided with a conductive pattern on the upper surface, and the conductive pattern has a configuration in which a plurality of first pads and second pads having a smaller area than the first pads are arranged in a row. Between the pad and the adjacent first pad, a connecting portion for connecting the two is disposed.

  Moreover, according to the 4th aspect of this invention, the manufacturing method of the following light-emitting devices is provided. That is, a set of first pads and second pads having an area smaller than that of the first pads are arranged in a plurality of rows and connected between the second pads and the adjacent first pads. A first step of supplying solder onto the first pad of the conductive pattern substrate on which the connecting portion is disposed, and a first electrode and a second electrode on the bottom surface on the set of the first pad and the second pad A second step of mounting each of the light-emitting elements each having the above-mentioned structure, heating the substrate to a predetermined temperature, melting the solder on the first pad, wetting and spreading the first pad, and further via the connecting portion, the second step A third step of joining the first pad and the first electrode and the second pad and the second electrode by forming the solder layer by wetting and spreading the molten solder on the pad, respectively.

  According to the present invention, a flip-chip type light emitting element can be mounted on a substrate efficiently by heat conduction by a solder layer obtained by curing molten solder.

1A is a top view of a light emitting device according to a first embodiment, FIG. 1B is a top view of a substrate 2, and FIG. The bottom view of the light emitting element of FIG. FIG. 2 is an explanatory diagram showing a positional relationship between a wiring pattern and a light emitting element of the light emitting device of FIG. 1. Explanatory drawing which shows the wetting spread at the time of supplying solder to the wiring pattern of FIG.1 (b), and fuse | melting. (A)-(c) Explanatory drawing which shows the manufacturing process of the light-emitting device of 1st Embodiment. (A) And (b) Explanatory drawing which shows the modification of the connection part of 1st Embodiment. The top view of the board | substrate of the light-emitting device of 2nd Embodiment. (A) And (b) The top view which shows the modification of the board | substrate pattern of 3rd Embodiment.

  Hereinafter, a light-emitting device according to an embodiment of the present invention will be described with reference to the drawings.

  According to the present invention, the shape of the wiring pattern on which the flip chip of the light emitting device is mounted has a shape described in detail below, whereby molten solder can be supplied from a pattern adjacent to a narrow pattern.

<First Embodiment>
A top view of the light emitting device of the first embodiment is shown in FIG. (Note that in the drawings of the present application, even a top view is partially hatched for easy understanding of the drawing.) The light-emitting device includes a substrate 2 and a conductor disposed on the upper surface of the substrate 2. The wiring pattern 3 is composed of a film, and the light emitting elements 1a to 1d are mounted on the wiring pattern 3 at predetermined positions. The light emitting elements 1a to 1d are electrically bonded and bonded to the wiring pattern 3 by the solder layer 40. The light emitting elements 1a to 1d are arranged in a straight line with a predetermined minute gap. Here, as an example, a structure in which four light emitting elements 1a and 1b are arranged will be described. However, the number of light emitting elements only needs to be plural, and a large number of elements can be arranged.

  Each of the light emitting elements 1a to 1d is a flip chip in which a cathode 11 and an anode 12 are provided on the bottom surface of the element as shown in FIG. The cathode 11 is a rectangle that occupies most of the bottom surface of the element. On the other hand, the anode 12 has a thin rectangular strip shape. The anode 12 and the cathode 11 are arranged with a band-shaped gap 13 interposed therebetween. Here, the width (short side) of the strip-shaped anode 12 is several tens of μm. The width of the gap 13 is about the same as the width of the anode 12.

  In addition, the anode 12 and the cathode 11 have a rectangular shape having corners that are substantially perpendicular. These corners are effective for self-alignment on the molten solder with respect to the right-angled corners of the wiring pattern 3.

  Further, the light emitting elements 1a and 1b have a structure (junction down) in which the active layer is located on the bottom side of the element substrate, thereby efficiently radiating heat generated in the active layer to the substrate 2 through the solder layer 40. Can do.

  The material of the metal provided on the outermost surfaces of the anode 12 and the cathode 11 is preferably a material having high wettability to the solder material constituting the solder layer 40. For example, AuSn or Au is used.

  As the substrate 2, ceramic, resin, metal, or the like can be used, and ceramic is particularly preferable. The wiring pattern is preferably Au or Cu, but the outermost surface is preferably Au.

  The wiring pattern 3 of the substrate 2 will be described with reference to FIGS. 1B, 1C, 3 and 4. FIG. As shown in FIG. 1B, the wiring pattern 3 includes first pads 31a to 31d corresponding to the cathodes 11 of the light emitting elements 1a to 1d, second pads 32a to 32d corresponding to the anodes 12, and currents. Supply terminals 34 and 35, lighting check terminals 36a to 36e, first connecting portions 33a to 33c, and second connecting portions 37a to 37c are included. As shown in FIG. 3, the first pads 31 a to 31 d and the second pads 32 a to 32 d are arranged at positions corresponding to the cathodes 11 and the anodes 12 of the light emitting elements 1 a to 1 d mounted in a straight line. That is, the set 30a of the first pad 31a and the second pad 32a is joined to the cathode 11 and the anode 12 of the light emitting element 1a. A set 30b of the first pad 31b and the second pad 32b is joined to the cathode 11 and the anode 12 of the light emitting element 1b. The set 30c of the pads 31c and 32c and the set 30d of the pads 31d and 31d are similarly bonded to the corresponding light emitting elements 1c and 1d.

  The current supply terminals 34 and 35 are respectively connected to the first pad 31a and the second pad 32d located at both ends.

  The 1st connection parts 33a-33c are arrange | positioned in the position of the gap | interval of the light emitting elements 1a-1d. The first connecting portion 33a connects the second pad 32a below the light emitting element 1a and the first pad 31b below the adjacent light emitting element 1b. Similarly, the first connecting portions 33b and 33c connect the anodes 32b and 32c of the light emitting element 1b and the cathodes 31c and 31d of the adjacent light emitting elements 1c and 1d, respectively.

  The first connecting portions 33a to 33c electrically connect the plurality of light emitting elements in series by electrically connecting the cathode of the light emitting element to the anode of the adjacent light emitting element. At the same time, the solder supplied to the first pads 31a to 31d having a large area also acts as a route for supplying the solder in a molten state to the adjacent second pads 32a to 32d having a small area.

  In addition, as shown in FIG. 1C, the region of the second pads 32 a to 32 d that projects outward from the outer periphery of the light emitting elements 1 a to 1 e at the end of the lighting check terminals 36 b to 36 d side when viewed from above. 38a to 38d are provided. When the solder spreads in these areas 38a to 38d, it can be determined that the solder has spread all over the second pads 32a to 32d, and is thus used as a wet spread check area. The shapes of the regions 38a to 38d may be other shapes such as a narrower, thicker, or triangular shape than the second pads 32a to 32d, but the shapes of the second pads 32a to 32d are not changed. The extended shape as shown in FIG. 1 is preferable because the pattern can be easily produced and the solder can easily flow.

  The second connecting portions 37a to 37c electrically connect the lighting check terminals 36b to 36d with the first pads 31b to 31d, respectively, and enable lighting check of individual light emitting elements in the manufacturing process. At the same time, when the solder supplied to the first pads 31a to 31d is melted and supplied to the adjacent second pads 32a to 32d as shown in FIG. 4, the molten solder is supplied to the second connecting portions 37a to 37d. A force for wetting and spreading in the direction of 37c is also generated. Thereby, the direction of the pulling force of the light emitting element is dispersed and balanced by the flow of the molten solder, and the positions where the light emitting elements 1a to 1d are desired to be arranged, that is, above the first pad and second pad sets 30a to 30d are arranged. The effect of staying in is obtained.

  In the present embodiment, the second connecting part continuous to the first pad 31a is not formed, but a second connecting part continuous to the first pad 31a can be formed.

  As shown in FIG.1 (c), the long side B (length of a connection part with 1st pads 31b-31d) of 2nd connection part 37a-37b is long side A (first connection part 33a-33c). It is desirable that the length is equal to or less than the length of the connecting portion with the first pads 31b to 31d. This is to cause more solder flow in the direction of the second pad 32a and the like.

  As for the shape of the 1st pads 31b-31d, it is desirable that the corner | angular part C of the both sides of the 1st connection parts 33a-33c is substantially right angle. This is because when the light emitting elements 1b to 1d are pulled toward the first connecting portions 33a to 33c by the molten solder, the presence of the corner portion C provides an action of staying in the first pads 31b to 31d.

  Moreover, the 2nd connection parts 37a-37c are arrange | positioned so that it may protrude in the same side of the row | line | column of three 1st pads 31a-31d in the structure of FIG. Similarly, the lighting check terminals 36a to 36e are arranged on the same side of the column. Thereby, since there is no wiring pattern 3 located outside the light emitting elements 1a to 1d on the other side of the column, the light of the light emitting elements 1a to 1d is reflected by the wiring pattern 3 on the other side of the column. There is no fear, and the light / dark boundary of the light distribution can be formed steeply. Therefore, for example, when this light-emitting device is used for a vehicle headlamp, a steep cut-off line can be formed, which is preferable.

  When it is not necessary to form a steep light / dark boundary on one side of the column, the second connecting portions 37a to 37c and the lighting check terminals 36a to 36e can be alternately arranged on both sides of the column, for example. It is.

  The material of the wiring pattern 3 is preferably a material having high wettability to the solder material that the solder layer 40 constitutes. For example, the wiring pattern 3 is made of Au or Cu. In particular, the surface is preferably Au.

  A method for manufacturing a light emitting device of the present invention will be described with reference to FIGS.

  As shown in FIG. 5A, the solder 4 is supplied onto the first pads 31a to 31d and the current supply terminal 35, respectively. The solder 4 may be any conductive material having high wettability and adhesion to the cathode 11 and the anode 12 such as the wiring pattern 3 and the light emitting element 1a by reflow and excellent in thermal conductivity. For example, solder paste, solder Pellets can be used. The supply of the solder 4 can be performed by application using a dispenser, printing using a mask, and mounting of solder pellets. The amount of the solder 4 supplied to the first pad 31a is set to an amount that can spread over the entire first pad 31a during reflow. The amount of solder 4 supplied to the first pads 31b, 31c, 31d is not limited to the first pad mounted at the time of reflow, but also adjacent second pads 32a, 32b, 32c through the connecting portions 33a, 33b, 33c. It is the amount that can spread throughout the whole. The amount of the solder 4 to be supplied to the current supply terminal 35 is an amount that can spread over the entire second pad 32b.

  As shown in FIG. 5B, the light emitting elements 1a to 1d are arranged on the first pad and second pad sets 30a to 30d. (In FIGS. 5B and 5C, the light emitting elements 1a and 1b are indicated by dotted lines in order to show the spread of the solder.) The substrate 2 is heated to a predetermined temperature to melt the solder. . The solder melted on the first pad 31a spreads over the entire first pad 31a. The solder 4 melted on the first pads 31b to 31d wets and spreads over the entire first pads 31b to 31d, further travels along the connecting portions 33a to 33c, and spreads to the second pads 32a to 32c. The solder 4 melted on the current supply terminal 35 wets and spreads to the second pad 32d.

  Since the second pads 32a to 32d are electrically joined to the anode 12 of the light emitting elements 1a to 1d by the solder layer 40, it is necessary to reliably spread the solder on the entire surface. Since most of the second pads 32a to 32d are located under the light emitting elements 1a to 1d, it is difficult to visually check whether the solder 4 is spread over the entire surface. Regions 38a to 38d projecting outward from the outer periphery of the light emitting elements 1a to 1d are provided at the ends of 32a to 32d. Thereby, it can be visually confirmed whether solder has spread in the regions 38a to 38d.

  Since the melted solder 4 moves from the first pad in the direction of the connecting portions 33a to 33c, a force that pulls the light emitting elements 1b to 1d in the direction of the connecting portions 33a to 33c is generated by the melted solder 4. However, in this embodiment, since the 2nd connection parts 37a-37c are also arrange | positioned, the solder 4 gets wet not only in the direction of 1st connection parts 33a-33c but in the direction of 2nd connection parts 37a-37c. By spreading, the direction of the force pulling the light emitting elements 1b to 1d can be dispersed, and the light emitting elements 1b to 1d can be kept on the first pads 31b to 31d. Similarly, the corners C of the first pads 31b to 31c also act to position the light emitting elements 1b to 1d on the first pad.

  Further, since the regions 38a to 38d of the second pads 32a to 32d are located at the corners of the light emitting elements 1a to 1d, the molten solder spreading wet in the regions 38a to 38d generates a force to pull the light emitting elements 1a to 1b. Since the second pads 32a to 32d are narrow and the amount of solder in the regions 38a to 38d is small, the pulling force of the light emitting elements 1a to 1d is weak and does not cause displacement.

  As shown in FIG. 5C, when the solder 4 spreads wet, it is cooled to solidify the solder and form the solder layer 40. Thereby, the light emitting device in which the first pad and the second pad are joined to the cathode 11 and the anode 12 of each of the light emitting elements 1a to 1d by the solder layer 40 can be manufactured.

  The solder layer 40 includes a first pad 31a to 31d, a second pad 32a to 32d, a first connection part 33a to 33d, a part or all of the second connection part 37a to 37c on the wiring pattern 3, and a current supply terminal. 34, a partial region on the first pad 31a side, a region between the solder supply portion of the current supply terminal 35 and the second pad 32d, a region around the solder supply portion of the current supply terminal 35, and, optionally, a lighting check 36b. It is formed in a partial region of .about.36d. That is, the solder layer 40 is formed not only on the wiring pattern 3 positioned under the light emitting elements 1a to 1d but also on the first connecting portions 33a to 33c.

  Also, the solder layer 40 formed on the first pad 31b, the first connecting portion 33a, the second pad 32a, and the second connecting portion 37a is formed continuously, and similarly, the first pad 31c, the first pad The connecting portion 33b, the second pad 32b, the solder layer 40 formed on the second connecting portion 37b, the first pad 31d, the first connecting portion 33c, the second pad 32c, and the solder layer formed on the second connecting portion 37c. 40 is also formed continuously.

  Thereafter, if necessary, the lighting check can be performed for each of the light emitting elements 1a to 1d using the lighting check terminals 36a to 36e. Further, by supplying current from the current supply terminals 34 and 35, all the light emitting elements 1a to 1d can be turned on. The heat generated by the light emitting elements 1a to 1d can be efficiently conducted to the substrate 2 through the solder layer 40 formed of molten solder and having a large contact area.

  As described above, by using the wiring pattern 3 of the present embodiment, a semiconductor light emitting element having a narrow gap 13 between the anode 12 and the cathode 11 and a narrow width of the anode 12 can be bonded to the substrate 2 using molten solder. it can.

  Further, by providing the first connecting portions 33a to 33c, the second connecting portions 37a to 37c, and the regions 38a to 38d in the substrate pattern 3, when joining to the substrate 2 with molten solder, reliable joining can be performed, and It can arrange | position, without shifting | deviating from the position to arrange | position.

  Moreover, as a modification of this embodiment, the shape which made the short side of the 1st connection part 33a curved like FIG. 6A, or the short side of the 1st connection part 33a like FIG. Can be tapered. The tapered shape is such that the long side A of the first connecting portion 33a is narrow on the first pad 31b side and wide on the second pad 32a side. With such a shape, the molten solder can easily flow from the first pad 31b to the second pad 32a through the first connecting portion 33a.

  In addition, although the 1st connection part 33a was demonstrated here, of course, it is also possible to apply the shape of Fig.6 (a), (b) to the other 1st connection part 33c. Moreover, the 2nd connection parts 37a-37c can also be made into the shape of Fig.6 (a), (b).

<Second Embodiment>
In the first embodiment, the light emitting device including a plurality of light emitting elements has been described. However, an example applied to a light emitting device having one light emitting element will be described with reference to FIG. FIG. 7 is a top view of the substrate pattern 3.

  As shown in FIG. 7, similarly to the first embodiment, the first connection portion 33 a and the second connection portion 37 a are provided, and the solder supply pad portion 39 is provided on the current supply terminal 35. Thereby, the same effect as the first embodiment can be obtained.

<Third Embodiment>
As a third embodiment, a modification of the shape of the first pad applicable to the light emitting devices of the first and second embodiments is shown in FIGS.

  In the example of FIG. 8A, two cuts 81 are provided in the first pad 31b, and a wiring pattern 82 having the same thickness as the first connecting portion 33a is formed in the first pad 31b. As a result, the solder is supplied from the wiring pattern 82 having the same thickness to the first connecting portion 33a, so that the solder easily flows into the first connecting portion 33a. However, it is preferable that the notch 81 is as thin as possible. This is because the solder does not get wet and spread in the notch 81, so that the contact area between the solder layer 40 and the light emitting element is reduced and the thermal resistance is increased.

  In FIG. 8B, a notch 83 is made in parallel with the second pad 32a at a portion of the first pad 31b close to the first connecting portion 33a. As a result, a wiring pattern 84 having substantially the same size as the second pad 32a is formed in the first pad 31b.

  By forming the notch 83, the shape of the first pad 31b and the second pad 32b on the lower surface of the light emitting element 1b is substantially symmetrical about the center of the light emitting element 1b. For this reason, when the solder is melted in the manufacturing process, the light emitting element 1b can be prevented from being inclined.

  The effects of the first to third embodiments of the present invention are summarized as follows.

  In the present invention, by providing the first connecting portions 33a to 33d in the wiring pattern 2, the second pads 32a to 32d having a narrow pattern width and difficult to supply solder can be joined by molten solder. .

  The solder supplied to the second pads 32a to 32d is not directly supplied to the second pad, but the solder supplied to the first pads 31b to 31d for the adjacent elements flows through the first connecting portions 33a to 33c. Therefore, the possibility of a short circuit between the first pad and the second pad under the light emitting elements 1a to 1d is reduced.

  By providing the second connecting portions 37a to 37c in the wiring pattern 2, it is possible to balance the stress of the solder flowing through the first connecting portions 33a to 33c, and the light emitting elements 1a to 1b are pulled by the molten solder and displaced. Can be prevented.

  Since the first connecting portion 33a and the like, the second connecting portion 37a and the like are arranged at the center of the side of the first pad 31b, the corners of the light emitting elements and the corners of the first pad can be arranged to coincide with each other. When the solder is melted, a self-alignment effect can be obtained.

  By providing the regions 38 a to 38 d in the wiring pattern 2, it can be confirmed that the solder has surely spread on the second pads 32 a to 32 d.

  In the embodiment described above, the light emitting device including the light emitting element has been described. However, the present invention is not limited to the light emitting device, and the light emitting element can be replaced with a flip-chip type semiconductor element.

  The light-emitting device of the present invention is suitable as an LED light source for lighting or a vehicle headlamp.

DESCRIPTION OF SYMBOLS 1a-1d ... Light-emitting device, 2 ... Board | substrate, 3 ... Wiring pattern, 31a-31d ... 1st pad, 32a-32d ... 2nd pad, 33a-33c ... 1st connection part, 34, 35 ... Current supply terminal, 36a -36e ... lighting check terminal, 37a-37c ... second connecting part, 38a-38d ... area

Claims (4)

A substrate, a conductive pattern formed on the substrate, a plurality of light-emitting elements mounted in a row on the conductive pattern, and a solder layer that joins the conductive pattern and the plurality of light-emitting elements. ,
The light-emitting element includes a first electrode and a second electrode having a smaller area than the first electrode on the bottom surface side,
The conductive pattern, the disposed for each of a plurality of light emitting elements, a first pad facing the first electrode, and a second pad facing the second electrode, wherein the adjacent ones of said plurality of light emitting elements Including a connecting portion disposed between the light emitting elements ,
The connecting portion connects the first pad corresponding to one light emitting element among the adjacent light emitting elements and the second pad corresponding to the other light emitting element,
The second electrode has a strip shape along one side of the first electrode, the second pad has a strip shape corresponding to the second electrode, the second pad has the connection portion, and the second electrode. Connected at the long side of the pad,
A solder layer is disposed on the first pad, the second pad, and the connecting portion, and the solder layer on the connecting portion is connected to the first pad and the second pad by the connecting portion. Continuous with the solder layer on each of the
The length of the second pad in the longitudinal direction is longer than the length of the second electrode in the longitudinal direction, and the region of one end of the second pad protrudes outside the outer periphery of the light emitting device, A light-emitting device, wherein the solder layer is also disposed in a region . In the light-emitting device according to claim 1, wherein the connecting portion, the first arranged on one side of the pad, the other one side emitting apparatus characterized by being connected to the second connecting portion. 3. The light emitting device according to claim 2, wherein the conductive pattern further includes a lighting test terminal disposed beside the first pad, and the second connecting portion includes the first pad and the lighting test terminal. And
The lighting test terminals are on one side of the row of the plurality of light emitting elements, light-emitting device comprising that you are respectively arranged for each of the light emitting element. 4. The light emitting device according to claim 2 , wherein the first pad is rectangular, and the connecting portion and the second connecting portion are respectively connected to a central portion of the side of the first pad, and are connected to both ends of the side. Has a corner portion of the first pad .

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