JP5758034B2 - Surface-treated copper foil, laminate using the same, printed wiring board, electronic device, and method for manufacturing printed wiring board - Google Patents

Description

  The present invention relates to a surface-treated copper foil and a laminated board, a printed wiring board, an electronic device, and a printed wiring board manufacturing method using the same, and in particular, the transparency of the remaining resin after etching the copper foil is required. The present invention relates to a surface-treated copper foil suitable for a field to be used, a laminated board using the copper foil, a printed wiring board, an electronic device, and a printed wiring board manufacturing method.

  In a small electronic device such as a smartphone or a tablet PC, a flexible printed wiring board (hereinafter referred to as FPC) is adopted because of easy wiring and light weight. In recent years, with the enhancement of functions of these electronic devices, the signal transmission speed has been increased, and impedance matching has become an important factor in FPC. As a measure for impedance matching with respect to an increase in signal capacity, a resin insulation layer (for example, polyimide) serving as a base of an FPC has been increased in thickness. In addition, the demand for higher wiring density has further increased the number of FPC layers. On the other hand, processing such as bonding to a liquid crystal substrate and mounting of an IC chip is performed on the FPC, but the alignment at this time is the resin insulation remaining after etching the copper foil in the laminate of the copper foil and the resin insulating layer The visibility of the resin insulation layer is important because it is performed through a positioning pattern that is visible through the layer.

  Moreover, the copper clad laminated board which is a laminated board of copper foil and a resin insulating layer can also be manufactured even if it uses the rolled copper foil by which roughening plating was given to the surface. This rolled copper foil usually uses tough pitch copper (oxygen content of 100 to 500 ppm by weight) or oxygen-free copper (oxygen content of 10 ppm by weight or less) as a raw material, and after hot rolling these ingots, It is manufactured by repeating cold rolling and annealing to a thickness.

As such a technique, for example, in Patent Document 1, a polyimide film and a low-roughness copper foil are laminated, and a light transmittance at a wavelength of 600 nm of the film after copper foil etching is 40% or more, a haze value. An invention relating to a copper clad laminate having (HAZE) of 30% or less and an adhesive strength of 500 N / m or more is disclosed.
Further, Patent Document 2 has an insulating layer in which a conductive layer made of electrolytic copper foil is laminated, and the light transmittance of the insulating layer in the etching region when the circuit is formed by etching the conductive layer is 50% or more. In a flexible printed wiring board for chip-on-flex (COF), the electrolytic copper foil has a rust-proofing layer made of a nickel-zinc alloy on an adhesive surface bonded to an insulating layer, and the surface roughness (Rz) of the adhesive surface ) Is 0.05 to 1.5 μm, and the specular gloss at an incident angle of 60 ° is 250 or more, and an invention relating to a flexible printed wiring board for COF is disclosed.
Moreover, in patent document 3, in the processing method of the copper foil for printed circuits, after the roughening process by copper-cobalt-nickel alloy plating on the surface of copper foil, a cobalt-nickel alloy plating layer is formed, and also zinc-nickel An invention relating to a method for treating a copper foil for printed circuit, characterized by forming an alloy plating layer is disclosed.

  In addition, when the signal transmission speed is increased due to the higher functionality of electronic devices, the high frequency board is required to reduce transmission loss in order to ensure the quality of the output signal. The transmission loss mainly consists of a dielectric loss due to the resin (substrate side) and a conductor loss due to the conductor (copper foil side). The dielectric loss decreases as the dielectric constant and dielectric loss tangent of the resin decrease. In a high-frequency signal, the conductor loss is mainly caused by a decrease in the cross-sectional area through which the current flows due to the skin effect that only the surface of the conductor flows as the frequency increases, and the resistance increases.

  Patent Document 4 discloses an electrolytic copper foil characterized in that a part of the surface of the copper foil is a concavo-convex surface having a surface roughness of 2 to 4 μm made of bump-shaped protrusions. And according to this, it describes that the electrolytic copper foil excellent in the high frequency transmission characteristic can be provided.

JP 2004-98659 A WO2003 / 096776 Japanese Patent No. 2849059 JP 2004-244656 A

In Patent Document 1, a low-roughness copper foil obtained by improving adhesion with an organic treatment agent after blackening treatment or plating treatment is broken due to fatigue in applications where flexibility is required for a copper-clad laminate. May be inferior in resin transparency.
Moreover, in patent document 2, the roughening process is not made and the adhesive strength of copper foil and resin is low and inadequate in uses other than the flexible printed wiring board for COF.
Furthermore, in the processing method described in Patent Document 3, Cu-Co-Ni fine processing on the copper foil was possible, but the resin after bonding the copper foil with the resin and removing it by etching was excellent. Transparency is not realized.
In Patent Documents 1 to 3, reduction of transmission loss cannot be realized.
In Patent Document 4, excellent transparency cannot be realized for the resin after the copper foil is bonded to the resin and removed by etching.
The present invention provides a surface-treated copper foil that adheres well to a resin, has excellent resin transparency after removing the copper foil by etching, and has a small signal transmission loss, and a laminate using the surface-treated copper foil.

As a result of intensive studies, the present inventors have made a mark on the polyimide substrate from which the surface-mean-square-root height Rq is controlled within a predetermined range by the surface treatment and is removed from the treated surface side by bonding. Paying attention to the slope of the lightness curve near the mark edge drawn in the observation point-lightness graph obtained from the image of the mark part taken by the CCD camera over the polyimide substrate with the printed material attached, Controlling the slope of the brightness curve affects the resin transparency and signal transmission loss after the copper foil is etched away without being affected by the type of substrate resin film or the thickness of the substrate resin film. I found out.
In addition, the inventors of the present invention are factors in which the surface treatment metal species of the copper foil and the amount of adhesion thereof affect the signal transmission loss, and these factors together with the number density and glossiness of the roughened particles on the copper foil surface It has been found that, by controlling, a surface-treated copper foil with a small signal transmission loss can be obtained even when used for a high-frequency circuit board.

One aspect of the present invention completed based on the above knowledge is that one copper foil surface and / or both copper foil surfaces are the surface-treated surface S, and the wavelength of the laser light on the surface-treated surface S is A surface-treated copper foil having a root mean square height Rq measured by a laser microscope of 405 nm of 0.14 to 0.63 μm, and the copper foil was bonded to both surfaces of the polyimide resin substrate from the surface-treated surface S side. Thereafter, the copper foil on both sides is removed by etching, and a printed matter on which a line-shaped mark is printed is laid under the exposed polyimide substrate, and the printed matter is photographed with a CCD camera through the polyimide substrate, Observation point-brightness produced by measuring the lightness of each observation point along the direction perpendicular to the direction in which the observed line-shaped mark extends for the image obtained by photographing. In the rough, the difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the part where the mark is not drawn is ΔB (ΔB = Bt−Bb), and the observation point-lightness graph , The value indicating the position of the intersection closest to the line-shaped mark among the intersections of the lightness curve and Bt is t1, and the depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with reference to Bt , When the value indicating the position of the intersection closest to the line-shaped mark among the intersections of the lightness curve and 0.1 ΔB is t2, Sv defined by the following equation (1) is 3.5 or more The surface-treated surface S contains at least one element selected from the group consisting of Ni and Co. When the surface-treated surface S contains Ni, the adhesion amount of Ni is 1000 μg / dm ² or less. And said When the surface-treated surface S contains Co , the surface-treated copper foil has a Co adhesion amount of 2000 μg / dm ² or less.
Sv = (ΔB × 0.1) / (t1-t2) (1)
Further, in another aspect of the present invention , a laser microscope in which one copper foil surface and / or both copper foil surfaces is a surface-treated surface S, and the wavelength of laser light on the surface-treated surface S is 405 nm. Is a surface-treated copper foil having a root-mean-square height Rq of 0.14 to 0.63 μm measured in Step 1. The copper foil is bonded to both surfaces of the polyimide resin substrate from the surface-treated surface S side, and then etched. When the printed matter obtained by removing the copper foil on both sides and laying the printed mark with the line-shaped mark under the exposed polyimide substrate and photographing the printed matter through the polyimide substrate with a CCD camera was obtained by the photographing. In the observation point-lightness graph prepared by measuring the brightness at each observation point along the direction perpendicular to the direction in which the observed line-shaped mark extends, ΔB (ΔB = Bt−Bb) is the difference between the top average value Bt and the bottom average value Bb of the lightness curve generated from the edge of the mark to the part where the mark is not drawn, and the lightness curve in the observation point-lightness graph In the depth range from the intersection of the lightness curve and Bt to 0.1 ΔB on the basis of Bt, the value indicating the position of the intersection closest to the line-shaped mark among the intersections of Bt and Bt Sv defined by the following equation (1) is 3.5 or more when the value indicating the position of the intersection closest to the line-shaped mark is the intersection of 0.1ΔB and 0.1ΔB, and the surface treatment The surface S contains one or more elements selected from the group consisting of Ni and Co. When the surface-treated surface S contains Ni, the adhesion amount of Ni is 1400 μg / dm ² or less, and the surface-treated surface C if S contains Co The adhesion amount of o is 2400 μg / dm ² or less.
Sv = (ΔB × 0.1) / (t1-t2) (1)

  In another embodiment of the surface-treated copper foil according to the present invention, the one copper foil surface is a surface-treated surface S, and the other copper foil surface is surface-treated.

In another embodiment of the surface-treated copper foil according to the present invention, when the surface-treated surface S contains Ni, the adhesion amount of Ni is 1000 μg / dm ² or less.

In another embodiment of the surface-treated copper foil according to the present invention, when the surface-treated surface S contains Ni, the adhesion amount of Ni is 100 μg / dm ² or more.

In another embodiment of the surface-treated copper foil according to the present invention, when the surface-treated surface S contains Co, the adhesion amount of Co is 2000 μg / dm ² or less.

In another embodiment of the surface-treated copper foil according to the present invention, when the surface-treated surface S contains Co, the adhesion amount of Co is 300 μg / dm ² or more.

  In another embodiment of the surface-treated copper foil according to the present invention, the root-mean-square height Rq measured with a laser microscope whose surface-treated surface S has a laser beam wavelength of 405 nm is 0.25 to 0.60 μm. .

  In still another embodiment of the surface-treated copper foil according to the present invention, Sv defined by the formula (1) in the brightness curve is 3.9 or more.

  In still another embodiment of the surface-treated copper foil according to the present invention, Sv defined by the formula (1) in the brightness curve is 5.0 or more.

  In still another embodiment of the surface-treated copper foil according to the present invention, the ten-point average roughness Rz of TD measured with a contact-type roughness meter of the surface-treated surface S is 0.20 to 0.64 μm.

  In still another embodiment of the surface-treated copper foil according to the present invention, the ten-point average roughness Rz of TD measured with a contact-type roughness meter of the surface-treated surface S is 0.26 to 0.62 μm.

  In still another embodiment of the surface-treated copper foil according to the present invention, the ratio A / B of the three-dimensional surface area A and the two-dimensional surface area B of the surface-treated surface S is 1.0 to 1.7.

  In another embodiment of the surface-treated copper foil which concerns on this invention, said A / B is 1.0-1.6.

  In still another embodiment of the surface-treated copper foil according to the present invention, the surface-treated surface S and / or the surface of the copper foil that is not the surface-treated surface S is measured with a laser microscope having a wavelength of 405 nm. The TD 10-point average roughness Rz is 0.35 μm or more.

  In still another embodiment of the surface-treated copper foil according to the present invention, the surface-treated surface S and / or the surface of the copper foil that is not the surface-treated surface S is measured with a laser microscope having a wavelength of 405 nm. The arithmetic average roughness Ra of the obtained TD is 0.05 μm or more.

  In still another embodiment of the surface-treated copper foil according to the present invention, the root mean square height Rq of TD measured with a laser microscope having a laser light wavelength of 405 nm on the surface of the copper foil that is not the surface-treated surface S is 0.08 μm or more.

  In still another embodiment of the surface-treated copper foil according to the present invention, the surface-treated surface S is selected from the group consisting of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium, and zinc. Contains one or more.

  In still another embodiment of the surface-treated copper foil according to the present invention, the surface-treated copper foil includes a resin layer on the surface-treated surface S.

  In still another embodiment of the surface-treated copper foil according to the present invention, the resin layer includes a dielectric.

  In still another aspect, the present invention provides a carrier-attached copper foil having a carrier, an intermediate layer, and an ultrathin copper layer in this order, wherein the ultrathin copper layer is the surface-treated copper foil according to the present invention. It is a foil.

  In another embodiment of the copper foil with a carrier according to the present invention, the ultrathin copper layer is provided on both surfaces of the carrier.

  In still another embodiment of the copper foil with a carrier according to the present invention, a roughening treatment layer is provided on the surface of the carrier opposite to the ultrathin copper layer side.

  In yet another aspect, the present invention is a laminated plate produced by laminating the surface-treated copper foil of the present invention or the copper foil with carrier of the present invention and a resin substrate.

  In still another aspect, the present invention is a printed wiring board using the surface-treated copper foil of the present invention or the copper foil with a carrier of the present invention.

  In still another aspect, the present invention is an electronic device using the printed wiring board of the present invention or the copper foil with a carrier of the present invention.

  In still another aspect, the present invention is a method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards of the present invention.

  In yet another aspect, the present invention includes a step of connecting at least one printed wiring board of the present invention and another printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention, This is a method for manufacturing a printed wiring board in which two or more printed wiring boards are connected.

  In still another aspect, the present invention is an electronic apparatus using one or more printed wiring boards to which at least one printed wiring board of the present invention is connected.

  In still another aspect, the present invention is a method for manufacturing a printed wiring board, including at least a step of connecting a printed wiring board produced by the method of the present invention and a component.

In still another aspect of the present invention, at least one printed wiring board according to the present invention is connected to another printed wiring board according to the present invention or a printed wiring board not corresponding to the printed wiring board according to the present invention. Manufacturing A, and
This is a method of manufacturing a printed wiring board in which two or more printed wiring boards are connected, including at least a step of connecting the printed wiring board A and components.

In yet another aspect of the present invention, the printed wiring board of the present invention,
Printed wiring board produced by the method of the present invention, and
A printed wiring board not corresponding to any of the printed wiring board of the present invention or the printed wiring board produced by the method of the present invention,
One or more printed wiring boards selected from the group consisting of:
A printed wiring board manufactured by the method of the present invention;
And a printed wiring board in which two or more printed wiring boards are connected is manufactured.

In another aspect of the present invention, a step of preparing the carrier-attached copper foil of the present invention and an insulating substrate,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the carrier-attached copper foil and the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the carrier-attached copper foil,
Thereafter, the printed wiring board manufacturing method includes a step of forming a circuit by any one of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.

In another aspect of the present invention, the step of forming a circuit on the ultrathin copper layer side surface or the carrier side surface of the carrier-attached copper foil of the present invention,
Forming a resin layer on the ultrathin copper layer side surface or the carrier side surface of the copper foil with carrier so that the circuit is buried;
Forming a circuit on the resin layer;
After forming a circuit on the resin layer, peeling the carrier or the ultra-thin copper layer; and
After the carrier or the ultra-thin copper layer is peeled off, the ultra-thin copper layer or the carrier is removed to be buried in the resin layer formed on the ultra-thin copper layer-side surface or the carrier-side surface. It is a manufacturing method of a printed wiring board including the process of exposing the circuit which has been carried out.

  In another aspect of the present invention, in the step of forming a circuit on the resin layer, another carrier-attached copper foil is bonded to the resin layer from the ultrathin copper layer side and bonded to the resin layer. It is a manufacturing method of the printed wiring board which is the process of forming the said circuit using an attached copper foil.

  In another aspect of the present invention, there is provided a method for producing a printed wiring board, wherein another carrier-attached copper foil to be bonded onto the resin layer is the carrier-attached copper foil of the present invention.

  In another aspect of the present invention, the process for forming a circuit on the resin layer is performed by any one of a semi-additive method, a subtractive method, a partial additive method, or a modified semi-additive method. Is the method.

  In another aspect of the present invention, the copper foil with carrier for forming a circuit on the surface has a substrate or a resin layer on the carrier side surface of the copper foil with carrier or the surface on the ultrathin copper layer side. It is a manufacturing method of a board.

  According to the present invention, a surface-treated copper foil that adheres well to a resin and is excellent in resin transparency after removing the copper foil by etching and has a small signal transmission loss, and a laminate using the same Can be provided.

It is a schematic diagram which defines Bt and Bb. It is a schematic diagram which defines t1, t2, and Sv. It is a schematic diagram showing the structure of an imaging device and the measuring method of the inclination of a lightness curve in the case of evaluation of the lightness curve inclination. It is a SEM observation photograph of the copper foil surface of the comparative example 1 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 1 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 2 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 3 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 4 in the case of Rz evaluation. It is a SEM observation photograph on the copper foil surface of Example 5 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 6 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 7 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 8 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of Example 9 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of the comparative example 2 in the case of Rz evaluation. It is a SEM observation photograph of the copper foil surface of the comparative example 3 in the case of Rz evaluation. AC is a schematic diagram of the wiring board cross section in the process to circuit plating and the resist removal based on the specific example of the manufacturing method of the printed wiring board using the copper foil with a carrier of this invention. DF is a schematic diagram of a cross section of a wiring board in a process from lamination of a resin and copper foil with a second layer carrier to laser drilling according to a specific example of a method for producing a printed wiring board using a copper foil with a carrier of the present invention. It is. GI is a schematic diagram of the wiring board cross section in the process from the via fill formation to the first layer carrier peeling according to a specific example of the method for manufacturing a printed wiring board using the carrier-attached copper foil of the present invention. J to K are schematic views of a cross section of a wiring board in steps from flash etching to bump / copper pillar formation according to a specific example of a method of manufacturing a printed wiring board using the carrier-attached copper foil of the present invention. It is an external appearance photograph of the foreign material used in the Example. It is an external appearance photograph of the foreign material used in the Example.

[Form and manufacturing method of surface-treated copper foil]
The surface-treated copper foil which is one embodiment of the present invention is useful for a copper foil used by making a laminate by bonding to a resin substrate and removing it by etching.
The copper foil used in the present invention may be either an electrolytic copper foil or a rolled copper foil. Usually, the surface of the copper foil that adheres to the resin substrate, that is, the surface on the surface treatment side, has the shape of the surface of the copper foil after degreasing for the purpose of improving the peel strength of the copper foil after lamination. A roughening treatment for performing electrodeposition may be performed. Although the electrolytic copper foil has irregularities at the time of manufacture, the irregularities can be further increased by enhancing the convex portions of the electrolytic copper foil by roughening treatment. In the present invention, when the roughening treatment is performed, the roughening treatment is performed by alloy plating such as copper-cobalt-nickel alloy plating, copper-nickel-phosphorus alloy plating, or nickel-zinc alloy plating. Moreover, Preferably it can carry out by copper alloy plating. As the copper alloy plating bath, for example, a plating bath containing one or more elements other than copper and copper, more preferably any selected from the group consisting of copper and cobalt, nickel, arsenic, tungsten, chromium, zinc, phosphorus, manganese and molybdenum It is preferable to use a plating bath containing at least one kind. And in this invention, when performing a roughening process, the said roughening process makes a current density higher than the conventional roughening process, and shortens a roughening process time. Hereinafter, in the present invention, the surface of the copper foil subjected to the surface treatment including such treatment is also referred to as a surface-treated surface S.

In the surface-treated copper foil of the present invention, one copper foil surface and / or both copper foil surfaces are the surface-treated surface S. Ordinary copper plating or the like may be performed as a pretreatment before the roughening treatment, and ordinary copper plating or the like may be performed as a finishing treatment after the roughening in order to prevent the electrodeposit from falling off. In the present invention, such pretreatment and finishing treatment may be performed. Moreover, surface treatment may be performed on both copper foil surfaces.
In the surface-treated copper foil of the present invention, one copper foil surface may be a surface-treated surface S, and the other copper foil surface may be surface-treated.

The surface-treated copper foil according to one embodiment of the present invention is applied with a heat-resistant (plating) layer or a rust-preventing (plating) layer on the surface after performing the roughening treatment or omitting the roughening treatment. May be. When the roughening treatment is omitted and a heat-resistant layer and a rust-preventing layer are provided, the current density is made higher than the conventional normal plating conditions and the plating time is shortened.
The thickness of the copper foil used in the present invention is not particularly limited, but is, for example, 1 μm or more, 2 μm or more, 3 μm or more, 5 μm or more, for example, 3000 μm or less, 1500 μm or less, 800 μm or less, 300 μm or less, 150 μm or less. 100 μm or less, 70 μm or less, 50 μm or less, or 40 μm or less.
The copper foil according to the present invention includes a copper alloy foil containing one or more elements such as Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, V, and B. included. When the concentration of the above elements increases (for example, 10% by mass or more in total), the conductivity may decrease. The conductivity of the rolled copper foil is preferably 50% IACS or more, more preferably 60% IACS or more, and still more preferably 80% IACS or more. The copper alloy foil may contain a total of elements other than copper of 0 mass% or more and 50 mass% or less, may contain 0.0001 mass% or more and 40 mass% or less, may contain 0.0005 mass% or more and 30 mass% or less, and 0.001 mass%. More than 20 mass% may be included.
Moreover, the copper foil with a carrier which has a carrier, an intermediate | middle layer, and an ultra-thin copper layer in this order may be sufficient as the copper foil used in this invention. When the copper foil with a carrier is used in the present invention and the roughening treatment is performed, the roughening treatment is performed on the surface of the ultrathin copper layer. In addition, the copper foil with a carrier which is another embodiment of this invention is mentioned later.
The copper foil used in the present invention has a predetermined surface roughness Rz (ten-point average roughness (10-point average roughness)), as described later, on the surface to be surface-treated before forming the surface-treated surface S. According to JIS B0601 1994)) and 60 degree gloss.
Further, the carrier of the copper foil with carrier used in the present invention has a predetermined Rz (10-point average roughness (conforming to JIS B0601 1994)) and 60 degree gloss as described later on the surface on which the intermediate layer is provided. Must have a degree.
The thickness of the surface-treated copper foil according to the present invention is not particularly limited, but is typically 0.5 to 3000 μm, preferably 1.0 to 1000 μm, preferably 1.0 to 300 μm, preferably 1 0.0-100 μm, preferably 1.0-75 μm, preferably 1.0-40 μm, preferably 1.5-20 μm, preferably 1.5-15 μm, preferably 1.5-12 μm, preferably 1.5 10 μm.

Moreover, an example of the manufacturing conditions of the electrolytic copper foil which can be used for this invention is shown below.
<Electrolyte composition>
Copper: 90-110 g / L
Sulfuric acid: 90-110 g / L
Chlorine: 50-100ppm
Leveling agent 1 (bis (3sulfopropyl) disulfide): 10 to 30 ppm
Leveling agent 2 (amine compound): 10 to 30 ppm
As the amine compound, an amine compound having the following chemical formula can be used.

(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group, and an alkyl group.)
The balance of the treatment liquid used in the present invention for desmear treatment, electrolysis, surface treatment or plating is water unless otherwise specified.

<Production conditions>
Current density: 70 to 100 A / dm ²
Electrolyte temperature: 50-60 ° C
Electrolyte linear velocity: 3-5 m / sec
Electrolysis time: 0.5 to 10 minutes

Copper as roughening treatment - cobalt - nickel alloy plating, by electrolytic plating, coating weight is to be the 15~40mg / dm ² of copper -250~2400μg / dm ² of cobalt -50~1400μg / dm ² of nickel It can be carried out so as to form a ternary alloy layer. When the Co adhesion amount is less than 250 μg / dm ² , the heat resistance may be deteriorated, and the etching property may be deteriorated. When the amount of Co deposition exceeds 2400 μg / dm ² , the signal transmission loss increases. In addition, etching spots may occur, and acid resistance and chemical resistance may deteriorate. If the Ni adhesion amount is less than 50 μg / dm ² , the heat resistance may deteriorate. On the other hand, if the Ni adhesion amount exceeds 1400 μg / dm ² , the signal transmission loss increases. In addition, etching residue may increase. A preferable Co deposition amount is 300 to 2000 μg / dm ² , a more preferable Co deposition amount is 300 to 1800 μg / dm ² , a preferable nickel deposition amount is 100 to 1000 μg / dm ² , and a more preferable nickel deposition amount is 100 ˜800 μg / dm ² . Here, the etching stain means that Co remains without being dissolved when etched with copper chloride, and the etching residue means that Ni remains undissolved when alkaline etching is performed with ammonium chloride. It means to end.

An example of a plating bath and plating conditions for forming such a ternary copper-cobalt-nickel alloy plating is as follows:
Plating bath composition: Cu 10-20 g / L, Co 1-10 g / L, Ni 1-10 g / L
pH: 1-4
Temperature: 30-50 ° C
Current density D _k : 25 to 50 A / dm ²
Plating time: 0.2 to 3.0 seconds In one embodiment of the present invention, in the roughening treatment for forming the surface-treated surface S, the current density of the roughening treatment is higher than the conventional roughening treatment conditions. To increase the roughening time.

After the roughening treatment, one or more of layers selected from the group consisting of a heat-resistant layer, a rust-proof layer and a weather-resistant layer may be provided on the roughened surface. In addition, each layer may be a plurality of layers such as two layers, three layers, and the order of stacking the layers may be any order, and the layers may be stacked alternately.
In the surface-treated copper foil of the present invention, the “surface-treated surface” refers to the surface treatment when a surface treatment for providing a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. is performed after the roughening treatment. It means the surface of the surface-treated copper foil after performing. In addition, when the surface-treated copper foil is an ultra-thin copper layer of a copper foil with a carrier, the “surface-treated surface” is to provide a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. after the roughening treatment When the surface treatment is performed, the surface of the ultrathin copper layer after the surface treatment is performed.
Here, a known heat-resistant layer can be used as the heat-resistant layer. Further, for example, the following surface treatment can be used.
As the heat-resistant layer and the rust-proof layer, known heat-resistant layers and rust-proof layers can be used. For example, the heat-resistant layer and / or the anticorrosive layer is a group of nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements, iron, tantalum A layer containing one or more elements selected from nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements Further, it may be a metal layer or an alloy layer made of one or more elements selected from the group consisting of iron, tantalum and the like. The heat-resistant layer and / or rust preventive layer is a group of nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements, iron, and tantalum. An oxide, nitride, or silicide containing one or more elements selected from the above may be included. Further, the heat-resistant layer and / or the rust preventive layer may be a layer containing a nickel-zinc alloy. Further, the heat-resistant layer and / or the rust preventive layer may be a nickel-zinc alloy layer. The nickel-zinc alloy layer may contain 50 wt% to 99 wt% nickel and 50 wt% to 1 wt% zinc, excluding inevitable impurities. The total adhesion amount of zinc and nickel in the nickel-zinc alloy layer may be 5 to 1000 mg / m ² , preferably 10 to 500 mg / m ² , preferably 20 to 100 mg / m ² . Further, the ratio of the nickel adhesion amount and the zinc adhesion amount of the layer containing the nickel-zinc alloy or the nickel-zinc alloy layer (= nickel adhesion amount / zinc adhesion amount) is 1.5 to 10. It is preferable. Further, the nickel - in adhesion amount of nickel in the zinc alloy layer is preferably from ^{0.5mg / m 2 ~500mg / m 2} , 1mg / m 2 ~50mg / m 2 - zinc alloy layer or the nickel containing More preferably. When the heat-resistant layer and / or rust prevention layer is a layer containing a nickel-zinc alloy, the interface between the copper foil and the resin substrate is eroded by the desmear liquid when the inner wall such as a through hole or via hole comes into contact with the desmear liquid. It is difficult to improve the adhesion between the copper foil and the resin substrate. The rust prevention layer may be a chromate treatment layer. A known chromate treatment layer can be used for the chromate treatment layer. For example, the chromate-treated layer refers to a layer treated with a liquid containing chromic anhydride, chromic acid, dichromic acid, chromate or dichromate. Chromate treatment layer is any element such as cobalt, iron, nickel, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic and titanium (metal, alloy, oxide, nitride, sulfide, etc.) May be included). Specific examples of the chromate treatment layer include a pure chromate treatment layer and a zinc chromate treatment layer. In the present invention, a chromate treatment layer treated with an anhydrous chromic acid or potassium dichromate aqueous solution is referred to as a pure chromate treatment layer. In the present invention, a chromate treatment layer treated with a treatment liquid containing chromic anhydride or potassium dichromate and zinc is referred to as a zinc chromate treatment layer.

For example heat-resistant layer and / or anticorrosive layer has coating weight of 1 mg / m ² -100 mg / m ^2, preferably from 5 mg / m ² and to 50 mg / m ² of nickel or nickel alloy layer, the adhesion amount is 1 mg / m ² to 80 mg / m ^2, preferably it may be obtained by sequentially laminating a tin layer of ^{5mg / m 2 ~40mg / m 2} , wherein the nickel alloy layer of nickel - molybdenum, nickel - zinc, nickel - molybdenum - cobalt You may be comprised by any one of these. The heat-resistant layer and / or anticorrosive layer, it is ^{preferably, 10mg / m 2 ~70mg / m} 2 total deposition amount of nickel or nickel alloy and tin is 2mg / m ² ~150mg / m 2 It is more preferable. Further, the heat-resistant layer and / or the rust preventive layer is preferably [nickel or nickel adhesion amount in nickel or nickel alloy] / [tin adhesion amount] = 0.25 to 10, preferably 0.33 to 3. More preferred. When the heat-resistant layer and / or rust-preventing layer is used, the carrier-clad copper foil is processed into a printed wiring board, and the subsequent circuit peeling strength, the chemical resistance deterioration rate of the peeling strength, and the like are improved.
Further, as the heat-resistant layer and / or anticorrosive layer, cobalt nickel adhesion amount of 200~2400μg / dm ² of cobalt -50~1400μg / dm ² - nickel alloy plating layer, more preferably the amount of deposition is 200～2000Myug / cobalt -50~1000μg / dm ² of nickel cobalt dm ² - nickel alloy plating layer, more preferably adhesion amount of nickel 200~2000μg / dm ² of cobalt -50~700μg / dm ² of cobalt - nickel alloy plating A layer can be formed. This treatment can be regarded as a kind of rust prevention treatment in a broad sense. This cobalt-nickel alloy plating layer needs to be performed to such an extent that the adhesive strength between the copper foil and the substrate is not substantially reduced. If the amount of cobalt adhesion is less than 200 μg / dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance may be deteriorated. As another reason, if the amount of cobalt is small, the treated surface becomes reddish, which is not preferable. If the amount of cobalt deposition exceeds 2400 μg / dm ² , signal transmission loss increases, which is not preferable. In addition, etching spots may occur, and acid resistance and chemical resistance may deteriorate. As a heat-resistant layer and / or a rust-preventing layer, a preferable cobalt adhesion amount is 500 to 1000 μg / dm ² . On the other hand, when the nickel adhesion amount is less than 50 μg / dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance may be deteriorated. When nickel exceeds 1400 μg / dm ² , signal transmission loss increases. As a heat-resistant layer and / or a rust preventive layer, a preferable nickel adhesion amount is 50 to 600 μg / dm ² , and a more preferable nickel adhesion amount is 100 to 600 μg / dm ² .

An example of the conditions for cobalt-nickel alloy plating is as follows:
Plating bath composition: Co 1-20 g / L, Ni 1-20 g / L
pH: 1.5-3.5
Temperature: 30-80 ° C
Current density D _k : 6.0 to 20.0 A / dm ²
Plating time: 0.2 to 1 second

Moreover, you may form the zinc plating layer of 30-250 microgram / dm < ² > of the adhesion amount further on the said cobalt- nickel alloy plating. If the zinc adhesion amount is less than 30 μg / dm ² , the heat deterioration rate improving effect may be lost. On the other hand, when the zinc adhesion amount exceeds 250 μg / dm ² , the hydrochloric acid deterioration rate may be extremely deteriorated. Preferably, the zinc adhesion amount is 30 to 240 μg / dm ² , more preferably 80 to 220 μg / dm ² .

An example of the galvanizing conditions is as follows:
Plating bath composition: Zn 100 to 300 g / L
pH: 3-4
Temperature: 50-60 ° C
Current density D _k : 6.0 to 20.0 A / dm ²
Plating time: 0.2 to 1 second

  A zinc alloy plating layer such as zinc-nickel alloy plating may be formed in place of the zinc plating layer, and a rust prevention layer and a weather resistance layer are applied to the outermost surface by chromate treatment or application of a silane coupling agent. It may be formed.

Moreover, the roughening process is abbreviate | omitted and the plating process by the Ni plating bath of the following conditions can be used as a process which gives a heat-resistant plating layer and a rust prevention plating layer to the surface.
Ni: 15-25 g / L
pH: 2.5
Temperature: 35-45 ° C
Current density D _k : 6.0 to 20.0 A / dm ²
Plating time: 0.2 to 1 second

A known weathering layer can be used as the weathering layer. Moreover, as a weather resistance layer, a well-known silane coupling process layer can be used, for example, The silane coupling process layer formed using the following silanes can be used.
As the silane coupling agent used for the silane coupling treatment, a known silane coupling agent may be used. For example, an amino silane coupling agent, an epoxy silane coupling agent, or a mercapto silane coupling agent may be used. Silane coupling agents include vinyltrimethoxysilane, vinylphenyltrimethoxylane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, 4-glycidylbutyltrimethoxysilane, and γ-aminopropyl. Triethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) ptoxy) propyl-3-aminopropyltrimethoxysilane, imidazolesilane, triazinesilane, γ-mercaptopropyltrimethoxysilane or the like may be used.

  The silane coupling treatment layer may be formed using a silane coupling agent such as an epoxy silane, an amino silane, a methacryloxy silane, or a mercapto silane. In addition, you may use 2 or more types of such silane coupling agents in mixture. Especially, it is preferable to form using an amino-type silane coupling agent or an epoxy-type silane coupling agent.

  The amino silane coupling agent referred to here is N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) propyltrimethoxysilane, 3- Aminopropyltriethoxysilane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, N-phenylaminopropyltrimethoxysilane, N- (3 -Acryloxy-2-hydroxypropyl) -3-aminopropyltriethoxysilane, 4-aminobutyltriethoxysilane, (aminoethylaminomethyl) phenethyltrimethoxysilane, N- (2-aminoethyl-3-aminopropyl) Trimethoxysilane, N (2-Aminoethyl-3-aminopropyl) tris (2-ethylhexoxy) silane, 6- (aminohexylaminopropyl) trimethoxysilane, aminophenyltrimethoxysilane, 3- (1-aminopropoxy) -3,3- Dimethyl-1-propenyltrimethoxysilane, 3-aminopropyltris (methoxyethoxyethoxy) silane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, ω-aminoundecyltrimethoxysilane, 3- (2 -N-benzylaminoethylaminopropyl) trimethoxysilane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, (N, N-diethyl-3-aminopropyl) trimethoxysilane, (N, N- Dimethyl-3-aminopropyl) Limethoxysilane, N-methylaminopropyltrimethoxysilane, N-phenylaminopropyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) propyltrimethoxysilane, γ-aminopropyltriethoxysilane, N -Β (aminoethyl) γ-aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) ptoxy) propyl-3-aminopropyltrimethoxysilane Good.

The silane coupling treatment layer is 0.05 mg / m ^{2 to} 200 mg / m ² , preferably 0.15 mg / m ^{2 to} 20 mg / m ² , preferably 0.3 mg / m ^{2 to} 2.0 mg in terms of silicon atoms. / M ² is desirable. In the case of the above-mentioned range, the adhesiveness between the base resin and the surface-treated copper foil can be further improved.

When the surface treatment for forming the surface treatment surface S is not roughened, the surface-treated copper foil of the present invention has a lower current density than the roughening treatment so that the plating film cannot be uneven as described above. In addition, by processing at a higher current density than normal normal plating and in a shorter time than normal normal plating, and when performing roughening treatment, the roughening particles are reduced in size by increasing the current density. The surface treatment with a small roughness is possible by plating in a short time, thereby controlling the root mean square height Rq of the surface.
In the present invention, “normal plating” means plating that is not rough plating (burn plating).

[Root mean square height Rq of surface treated copper foil surface]
In the surface-treated copper foil of the present invention, the root-mean-square height Rq measured with a laser microscope having a laser beam wavelength of 405 nm on the surface-treated surface S is controlled to 0.14 to 0.63 μm. With such a configuration, the peel strength is increased and the resin is satisfactorily bonded to the resin, and the transparency of the resin after the copper foil is removed by etching is increased. As a result, alignment and the like when mounting an IC chip through a positioning pattern that is visible through the resin are facilitated. Moreover, since the surface unevenness | corrugation is very small, the length of the surface treatment copper foil surface equivalent to the length through which an electron flows becomes short, and a transmission loss becomes small. When the root mean square height Rq is less than 0.14 μm, the degree of unevenness on the surface of the copper foil becomes insufficient, causing a problem that the resin cannot be sufficiently bonded. On the other hand, if the root mean square height Rq is more than 0.63 μm, the unevenness of the resin surface after the copper foil is removed by etching becomes large, resulting in a problem that the transparency of the resin becomes poor. The root mean square height Rq measured with a laser microscope having a laser beam wavelength of 405 nm on the surface-treated surface S is more preferably 0.25 to 0.60 μm, still more preferably 0.32 to 0.56 μm.
Here, the root mean square height Rq of the surface is the degree of unevenness in the surface roughness measurement by a non-contact type roughness meter (laser microscope whose laser light wavelength is 405 nm) in accordance with JIS B 0601 (2001). , Which is expressed by the following formula, is the height of the unevenness (mountain) in the Z-axis direction of the surface roughness, and is the root mean square of the height Z (x) of the mountain at the reference length lr .
The root mean square height Rq of the height of the mountain at the reference length lr:
√ {(1 / lr) × ∫Z ² (x) dx (where integral is an integrated value from 0 to lr)}

[Ten point average roughness Rz of the surface-treated copper foil surface]
The surface-treated copper foil of the present invention may be a non-roughened copper foil or a roughened copper foil on which roughened particles are formed, and TD (in the rolling direction) measured with a contact-type roughness meter on the surface-treated surface S. The ten-point average roughness Rz (JIS B0601 1994) in the vertical direction (the width direction of the copper foil), in the case of an electrolytic copper foil, the direction perpendicular to the direction of the copper foil passing through the electrolytic copper foil manufacturing apparatus is 0. It is preferable that it is 20-0.64 micrometer. With such a configuration, the peel strength becomes higher, the resin adheres well to the resin, and the transparency of the resin after the copper foil is removed by etching becomes higher. As a result, alignment and the like when mounting an IC chip through a positioning pattern that is visible through the resin can be made easier. Moreover, since the surface unevenness | corrugation is very small, the length of the surface treatment copper foil surface equivalent to the length through which an electron flows becomes short, and a transmission loss becomes small. When the ten-point average roughness Rz of TD is less than 0.20 μm, the degree of unevenness on the surface of the copper foil may be insufficient, and there may be a problem that the resin cannot be sufficiently bonded. On the other hand, if the ten-point average roughness Rz of TD is more than 0.64 μm, the unevenness of the resin surface after the copper foil is removed by etching may increase, resulting in a problem of poor resin transparency. May occur. The ten-point average roughness Rz of TD measured with a contact-type roughness meter on the surface-treated surface S is more preferably 0.26 to 0.62 μm, still more preferably 0.40 to 0.55 μm.

Here, in order to obtain the effect of visibility and the effect of reducing transmission loss of the present invention, the surface on the treatment side of the copper foil before the surface treatment for forming the surface treatment surface S (the surface treatment copper foil is copper with carrier). In the case of an ultra-thin copper layer of the foil, TD (direction perpendicular to the rolling direction (the width direction of the copper foil) measured with a contact-type roughness meter on the side on which the intermediate layer of the carrier is provided before forming the intermediate layer) In the case of an electrolytic copper foil, this means the roughness (Rz (ten-point average roughness Rz (JIS B0601 1994)) of the direction perpendicular to the direction of the copper foil passing through the electrolytic copper foil production apparatus. It is necessary to control the glossiness (meaning 60-degree glossiness (measured according to JIS Z8741), the same in this specification)) and glossiness (same in the specification). Specifically, the TD of the TD measured with a contact-type roughness meter of the copper foil before the surface treatment (in the case where the surface-treated copper foil is an ultrathin copper layer of a copper foil with a carrier) The surface roughness (ten-point average roughness Rz) is 0.20 to 0.55 μm, preferably 0.20 to 0.42 μm.
Moreover, the copper foil before the surface treatment for forming the surface treatment surface S has a TD 60 degree gloss of 400 to 710%, and more preferably 500 to 710%. If the 60-degree glossiness of TD of the copper foil before the surface treatment is less than 400%, the transparency of the resin described above may be poorer than the case of 400% or more, and the signal transmission loss may increase. There is. If it exceeds 710%, it may be difficult to produce. As such a copper foil (meaning a carrier when the surface-treated copper foil is a copper foil with a carrier. The same applies hereinafter), rolling is performed by adjusting the oil film equivalent of the rolling oil (high gloss rolling) or rolling. Rolling can be performed by adjusting the roughness of the roll, or it can be produced by chemical polishing such as chemical etching or electrolytic polishing in a phosphoric acid solution. Moreover, it is producible by manufacturing electrolytic copper foil with a predetermined electrolyte solution and predetermined electrolysis conditions.

High gloss rolling can be performed by setting the oil film equivalent defined by the following formula to 8500 to 24000 or less.
Oil film equivalent = {(rolling oil viscosity [cSt]) × (sheet feeding speed [mpm] + roll peripheral speed [mpm])} / {(roll biting angle [rad]) × (yield stress of material [kg / mm ² ])}
The rolling oil viscosity [cSt] is a kinematic viscosity at 40 ° C.
In order to set the oil film equivalent to 8500 to 24000, a known method such as using a low-viscosity rolling oil or slowing the sheet passing speed may be used.
The surface roughness of the rolling roll can be, for example, 0.01 to 0.25 μm in terms of arithmetic average roughness Ra (JIS B0601 1994). When the value of the arithmetic average roughness Ra of the rolling roll is large, the TD roughness (Rz) of the surface of the copper foil before the surface treatment for forming the surface-treated surface S becomes large, and the copper foil before the surface treatment There is a tendency that the 60 degree glossiness of the TD on the surface is lowered. Further, when the value of the arithmetic average roughness Ra of the rolling roll is small, the TD roughness (Rz) of the surface of the copper foil before the surface treatment becomes small, and the TD 60 degree gloss of the surface of the copper foil before the surface treatment becomes small. Tend to be higher.
Chemical polishing is performed over a long period of time using an etching solution such as sulfuric acid-hydrogen peroxide-water system or ammonia-hydrogen peroxide-water system at a concentration lower than usual.

Moreover, the manufacturing conditions etc. of the electrolytic copper foil which can be used for this invention are as follows.
-Electrolyte composition Copper: 80-120 g / L
Sulfuric acid: 80-120 g / L
Chlorine: 30-100ppm
Leveling agent 1 (bis (3sulfopropyl) disulfide): 10 to 30 ppm
Leveling agent 2 (amine compound): 10 to 30 ppm
As the amine compound, an amine compound having the following chemical formula can be used.

(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group, and an alkyl group.)

Manufacturing conditions Current density: 70-100 A / dm ²
Electrolyte temperature: 50-65 ° C
Electrolyte linear velocity: 1.5-5 m / sec
Electrolysis time: 0.5 to 10 minutes (adjusted according to the thickness of copper to be deposited and current density)
Moreover, as an electrolytic copper foil that can be used in the present invention, an electrolytic copper foil HLP foil manufactured by JX Nippon Mining & Metals Co., Ltd. can be used.

[Slope of brightness curve]
After the surface-treated copper foil of the present invention was bonded to both surfaces of the polyimide base resin from the surface-treated surface S side, the copper foil on both surfaces was removed by etching, and a line-shaped mark was printed. When the printed material is laid under the exposed polyimide substrate and the printed material is photographed with a CCD camera over the polyimide substrate, the image obtained by photographing is in a direction perpendicular to the direction in which the observed line-shaped mark extends. In the observation point-lightness graph produced by measuring the lightness at each observation point along the line, the top average value Bt and the bottom average value Bb of the lightness curve generated from the end of the mark to the part where the mark is not drawn The difference is ΔB (ΔB = Bt−Bb), and in the observation point-lightness graph, the intersection point closest to the line mark among the intersection points of the lightness curve and Bt is t1. Then, in the depth range from the intersection of the lightness curve and Bt to 0.1ΔB on the basis of Bt, the intersection closest to the line mark among the intersections of the lightness curve and 0.1ΔB is t2. In addition, Sv defined by the equation (1) is 3.5 or more.
Sv = (ΔB × 0.1) / (t1-t2) (1)
In the observation position-lightness graph, the horizontal axis represents position information (pixel × 0.1), and the vertical axis represents the value of brightness (gradation).
Here, “top average value Bt of the lightness curve”, “bottom average value Bb of the lightness curve”, and “t1”, “t2”, and “Sv” described later will be described with reference to the drawings.
FIGS. 1A and 1B are schematic views for defining Bt and Bb when the mark width is about 0.3 mm. When the mark width is about 0.3 mm, a V-shaped brightness curve may be obtained as shown in FIG. 1A, or a brightness curve having a bottom as shown in FIG. 1B. . In any case, the “top average value Bt of the lightness curve” indicates the average value of lightness when measured at 5 locations (a total of 10 locations on both sides) at 30 μm intervals from the positions 50 μm away from the end positions on both sides of the mark . On the other hand, the “bottom average value Bb of the lightness curve” indicates the minimum value of lightness at the tip of the V-shaped valley when the lightness curve is V-shaped as shown in FIG. When it has the bottom of (b), the value of the center part of about 0.3 mm is shown. The mark width may be about 0.2 mm, 0.16 mm, or 0.1 mm. Furthermore, the “top average value Bt of the lightness curve” is 5 points at 30 μm intervals from a position 100 μm apart, a position 300 μm apart, or a position 500 μm apart from the end positions on both sides of the mark (total 10 on both sides). Location) It may be the average value of brightness when measured.
FIG. 2 is a schematic diagram that defines t1, t2, and Sv. “T1 (pixel × 0.1)” is a value indicating an intersection point closest to the line-shaped mark among intersection points of the lightness curve and Bt and a position of the intersection point (value on the horizontal axis of the observation point-lightness graph) ). “T2 (pixel × 0.1)” is the line-shaped mark among the intersections of the lightness curve and 0.1ΔB in the depth range from the intersection of the lightness curve and Bt to 0.1ΔB with reference to Bt. And the value (the value on the horizontal axis of the observation point-brightness graph) indicating the position of the intersection closest to. At this time, regarding the slope of the brightness curve indicated by the line connecting t1 and t2, Sv (gradation / pixel × 0.1) calculated by 0.1 ΔB in the y-axis direction and (t1−t2) in the x-axis direction. ). One pixel on the horizontal axis corresponds to a length of 10 μm. Further, Sv is measured on both sides of the mark, and a small value is adopted. Further, when the shape of the lightness curve is unstable and there are a plurality of the “intersections between the lightness curve and Bt”, the intersection closest to the mark is adopted.
In the image taken by the CCD camera, the brightness is high at the portion where the mark is not attached, but the brightness decreases as soon as the end of the mark is reached. If the visibility of the polyimide substrate is good, such a lowered state of brightness is clearly observed. On the other hand, if the visibility of the polyimide substrate is poor, the lightness does not suddenly drop from “high” to “low” in the vicinity of the mark end, but the state of decline is slow and the state of lightness decline is unclear. End up.
Based on such knowledge, the present invention is based on such a polyimide substrate from which the surface-treated copper foil of the present invention is bonded and removed, and a mark printed matter is placed under the polyimide substrate and photographed with a CCD camera over the polyimide substrate. The inclination of the lightness curve near the mark end portion drawn in the observation point-lightness graph obtained from the image is controlled. More specifically, the difference between the top average value Bt and the bottom average value Bb of the lightness curve is ΔB (ΔB = Bt−Bb), and the line of the intersections of the lightness curve and Bt in the observation point-lightness graph. In the depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with reference to Bt, the value indicating the position of the intersection closest to the shape mark (the value on the horizontal axis of the observation point-lightness graph) is t1. When the value indicating the position of the intersection closest to the line-shaped mark among the intersections of the lightness curve and 0.1ΔB (the observation point—the value on the horizontal axis of the lightness graph) is t2, the above equation (1) Sv defined by is 3.5 or more. According to such a configuration, the discrimination power of the mark over the polyimide by the CCD camera is improved without being affected by the type and thickness of the substrate resin. For this reason, it is possible to produce a polyimide substrate with excellent visibility, and the positioning accuracy by marking when performing a predetermined treatment on the polyimide substrate in an electronic substrate manufacturing process or the like is improved, thereby improving the yield. can get. Sv is preferably 3.9 or more, more preferably 4.5 or more, even more preferably 5.0 or more, and even more preferably 5.5 or more. The upper limit of Sv is not particularly limited, but is, for example, 70 or less, 30 or less, 15 or less, and 10 or less. According to such a configuration, the boundary between the mark and the non-mark portion becomes clearer, the positioning accuracy is improved, the error due to the mark image recognition is reduced, and the alignment can be performed more accurately.
Therefore, when the copper foil according to the embodiment of the present invention is used for a printed wiring board, when one printed wiring board and another printed wiring board are connected, connection failure is reduced and yield is improved.
In addition, it is preferable that the value of (DELTA) B ((DELTA) B (PI)) before sticking to the copper foil is 50 or more and 65 or less as for the polyimide film used for the measurement of the inclination of a brightness curve. This is because it becomes easier to measure Sv.

[Amount of adhesion of Ni and Co on the surface treated copper foil surface]
In the surface-treated copper foil of the present invention, when the surface-treated surface S contains Ni, the adhesion amount of Ni is 1400 μg / dm ² or less, and when the surface-treated surface S contains Co, the adhesion amount of Co is 2400 μg. / Dm ² or less. Here, the adhesion amounts of Ni and Co on the surface-treated surface S mean the total adhesion amount of Ni and Co contained in all the surface treatment layers formed on the surface of the copper foil. For example, when a roughened layer, a heat-resistant layer, a rust-proof layer, and a weather-resistant layer are provided on the surface of the copper foil, a roughened layer, a heat-resistant layer that is a surface-treated layer formed on the surface of the copper foil It means the total adhesion amount of Ni and Co contained in the rust-preventing layer and weatherproof layer.
According to the inventors' investigation, it has been found that the amount of the predetermined metal deposited on the surface treatment layer significantly affects the transmission loss. As a result of the study by the present inventor, it has been found that among such surface-treated metal species, Co and Ni, which have a relatively high permeability and a relatively low conductivity, affect transmission loss. Therefore, limiting the adhesion amount of Ni and / or Co as described above is effective for reducing transmission loss.
If the adhesion amount of Ni is greater than 1400 μg / dm ² , transmission loss increases, which is not preferable. On the other hand, it is not preferable that the adhesion amount of Co is larger than 2400 μg / dm ² because transmission loss increases.
In order to further reduce transmission loss, when the surface-treated surface S contains Ni, the adhesion amount of Ni is preferably 1000 μg / dm ² or less, preferably 900 μg / dm ² or less, and 800 μg / dm. ² or less is preferable, and 700 μg / dm ² or less is more preferable.
Moreover, when the surface treatment surface S contains Ni, the adhesion amount of Ni is preferably 100 μg / dm ² or more, more preferably 120 μg / dm ² or more, and more preferably 150 μg / dm ² or more. preferable. This is because when the adhesion amount of Ni is less than 100 μg / dm ² , the heat resistance may deteriorate.
Order to further reduce the transmission loss, the adhesion amount of Co in the case of surface treatment the surface S comprises a Co is preferably not more than 2000 [mu] g / dm ^2, is preferably 1800 [mu] g / dm ² or less, 1600μg / dm ² Or less, more preferably 1400 μg / dm ² or less.
Further, when the surface-treated surface S contains Co, the adhesion amount of Co is preferably 300 μg / dm ² or more, more preferably 350 μg / dm ² or more, and more preferably 400 μg / dm ² or more. preferable. This is because the heat resistance may be deteriorated when the adhesion amount of Co is less than 300 μg / dm ² .
In order to control the adhesion amount of Ni and Co within the above-mentioned range, the concentration of Ni and Co in the surface treatment (plating) solution such as roughening plating and heat-resistant layer is controlled, and the surface treatment is performed. It is effective to control the current density and surface treatment time. Increasing the concentration of Ni and Co in the surface treatment (plating) solution can increase the adhesion amount of Ni and Co. Further, when the Ni and Co concentrations are lowered, the amount of Ni and Co attached can be reduced. Further, if the current density during the surface treatment is increased and / or the surface treatment time is lengthened, the amount of deposited Ni and Co can be increased. Further, if the current density during the surface treatment is lowered and / or the surface treatment time is shortened, the amount of Ni and Co attached can be reduced.

  The surface-treated copper foil of the present invention has a TD ten-point average roughness measured with a laser microscope having a laser beam wavelength of 405 nm on the surface-treated surface S and / or the surface of the copper foil that is not the surface-treated surface S. Rz is preferably 0.35 μm or more. Furthermore, it is more preferable that the copper foil surface which is not the surface treatment surface S of the surface treatment copper foil of this invention is surface-treated. With such a configuration, by further increasing the contact area between the copper foil and the protective film, the problem of the protective film sticking to the copper foil during the lamination process with the resin substrate is better suppressed. be able to. The surface-treated copper foil of the present invention has a ten-point average roughness of TD measured with a laser microscope having a wavelength of laser light of 405 nm on the surface of the copper foil that is not the surface-treated surface S and / or the surface-treated surface S. Rz is more preferably 0.40 μm or more, even more preferably 0.50 μm or more, even more preferably 0.60 μm or more, and even more preferably 0.80 μm or more. In addition, the ten-point average of TD measured with the laser microscope whose wavelength of the laser beam of the surface-treated copper foil of this invention which is not the said surface-treated surface S and / or the said copper foil surface which is not the said surface-treated surface S is 405 nm. The upper limit of the roughness Rz need not be particularly limited, but is typically 4.0 μm or less, more typically 3.0 μm or less, more typically 2.5 μm or less, and more Typically, it is 2.0 μm or less.

  The surface-treated copper foil of the present invention has an arithmetic average roughness Ra of TD measured with a laser microscope whose wavelength of the laser light on the surface of the copper foil that is not the surface-treated surface S and / or the surface-treated surface S is 405 nm. Is preferably 0.05 μm or more. Furthermore, it is more preferable that the copper foil surface which is not the surface treatment surface S of the surface treatment copper foil of this invention is surface-treated. With such a configuration, by further increasing the contact area between the copper foil and the protective film, the problem of the protective film sticking to the copper foil during the lamination process with the resin substrate is better suppressed. be able to. The surface-treated copper foil of the present invention has an arithmetic average roughness Ra of TD measured with a laser microscope whose wavelength of the laser light on the surface of the copper foil that is not the surface-treated surface S and / or the surface-treated surface S is 405 nm. Is more preferably 0.08 μm or more, even more preferably 0.10 μm or more, still more preferably 0.20 μm or more, and even more preferably 0.30 μm or more. In addition, the arithmetic average roughness of TD measured with the laser microscope whose wavelength of the laser beam of the copper foil surface which is not the said surface treatment surface S and / or the said surface treatment surface S of the surface treatment copper foil of this invention is 405 nm. The upper limit of the thickness Ra need not be particularly limited, but is typically 0.80 μm or less, more typically 0.65 μm or less, more typically 0.50 μm or less, and more typically Is 0.40 μm or less.

  In the surface-treated copper foil of the present invention, the root mean square height Rq of TD measured with a laser microscope having a laser light wavelength of 405 nm on the surface of the copper foil that is not the surface-treated surface S is 0.08 μm or more. Is preferred. Furthermore, it is more preferable that the copper foil surface which is not the surface treatment surface S of the surface treatment copper foil of this invention is surface-treated. With such a configuration, by further increasing the contact area between the copper foil and the protective film, the problem of the protective film sticking to the copper foil during the lamination process with the resin substrate is better suppressed. be able to. In the surface-treated copper foil of the present invention, the root mean square height Rq of TD measured with a laser microscope having a laser light wavelength of 405 nm on the surface of the copper foil that is not the surface-treated surface S is 0.10 μm or more. Is more preferably 0.15 μm or more, still more preferably 0.20 μm or more, and even more preferably 0.30 μm or more. In addition, the upper limit of the root mean square height Rq of TD measured with the laser microscope whose wavelength of the laser beam of the copper foil surface which is not the said surface treatment surface S of the surface treatment copper foil of this invention is 405 nm has limitation. Although not required, it is typically 0.80 μm or less, more typically 0.60 μm or less, more typically 0.50 μm or less, and more typically 0.40 μm or less. is there.

The copper foil surface that is not the surface-treated surface S may be subjected to a treatment for providing a heat-resistant layer or a rust-proof layer by plating (plating that is not normal plating or rough plating) as the surface treatment. Moreover, the copper foil surface which is not the said surface treatment surface S may be roughened as surface treatment.
As for the roughening treatment, for example, the roughening treatment may be performed using a plating solution containing copper sulfate and an aqueous sulfuric acid solution, or the roughening treatment may be performed using a plating solution comprising copper sulfate and an aqueous sulfuric acid solution. . Alloy plating such as copper-cobalt-nickel alloy plating, copper-nickel-phosphorus alloy plating, or nickel-zinc alloy plating may also be used. Moreover, Preferably it can carry out by copper alloy plating. As the copper alloy plating bath, for example, a plating bath containing one or more elements other than copper and copper, more preferably any selected from the group consisting of copper and cobalt, nickel, arsenic, tungsten, chromium, zinc, phosphorus, manganese and molybdenum It is preferable to use a plating bath containing at least one kind.
Moreover, roughening processes other than said roughening process may be used with respect to the copper foil surface which is not the surface treatment surface S, and surface treatments other than said plating process may be used also when it is not a roughening process.
Moreover, the copper foil surface which is not the said surface treatment surface S may be surface-treated for forming an unevenness | corrugation in the surface.
As a surface treatment for forming irregularities on the surface, a surface treatment by electropolishing may be performed. For example, unevenness can be formed on the surface of the copper foil that is not the surface-treated surface S by electropolishing the surface of the copper foil that is not the surface-treated surface S in a solution composed of copper sulfate and a sulfuric acid aqueous solution. In general, the electrolytic polishing is intended to smooth the surface, but the surface treatment on the surface of the copper foil that is not the surface-treated surface S of the present invention forms concavities and convexities by electrolytic polishing. The method for forming the irregularities by electrolytic polishing may be performed by a known technique. Examples of known techniques of electropolishing for forming the unevenness include the methods described in JP-A-2005-240132, JP-A-2010-059547, and JP-A-2010-047842. As specific conditions for the treatment for forming irregularities by electrolytic polishing, for example,
Treatment solution: Cu: 20 g / L, H ₂ SO ₄ : 100 g / L, temperature: 50 ° C.
-Electropolishing current: 15 A / dm ²
-Electropolishing time: 15 seconds etc. are mentioned.
As surface treatment for forming irregularities on the surface of the copper foil that is not the surface-treated surface S, irregularities may be formed by mechanically polishing the copper foil surface that is not the surface-treated surface S, for example. Mechanical polishing may be performed by a known technique.
In addition, you may provide a heat-resistant layer, a rust prevention layer, and a weather resistant layer after the surface treatment of the copper foil surface which is not the surface treatment surface S in the surface treatment copper foil of this invention. The heat-resistant layer, the rust-proof layer, and the weather-resistant layer may be the method described in the above description or experimental example, or may be a known technique.

[Area ratio of copper foil surface]
The ratio A / B between the three-dimensional surface area A and the two-dimensional surface area B of the surface-treated surface S of the copper foil greatly affects the transparency of the resin. That is, if the surface roughness Rz is the same, the smaller the ratio A / B, the better the transparency of the resin. For this reason, as for the surface-treated copper foil of this invention, it is preferable that the said ratio A / B is 1.0-1.7, and it is more preferable that it is 1.0-1.6. Here, the ratio A / B of the three-dimensional surface area A and the two-dimensional surface area B of the roughened particles on the surface-treated surface S is, for example, when the surface is roughened, the surface area A of the roughened particles and the copper It can also be referred to as the ratio A / B with the area B obtained when the foil is viewed in plan from the surface treated surface S side.

  By controlling the current density and plating time of the surface treatment during the surface treatment such as the formation of the roughened particles, the surface state of the surface treated surface S of the copper foil after the surface treatment, the form and the formation density of the roughened particles are determined. The root mean square height Rq, Sv, surface roughness Rz, glossiness, and area ratio A / B of the copper foil surface can be controlled.

[Transmission loss]
When the transmission loss is small, attenuation of the signal when performing signal transmission at a high frequency is suppressed, so that a stable signal transmission can be performed in a circuit that transmits the signal at a high frequency. Therefore, a smaller transmission loss value is preferable because it is suitable for use in a circuit for transmitting a signal at a high frequency. After bonding the surface-treated copper foil to a commercially available liquid crystal polymer resin (Vecstar CTZ-50 μm manufactured by Kuraray Co., Ltd.), a microstrip line is formed by etching so that the characteristic impedance is 50Ω, and a network manufactured by HP When the transmission coefficient is measured using the analyzer HP8720C and the transmission loss at a frequency of 20 GHz and a frequency of 40 GHz is determined, the transmission loss at a frequency of 20 GHz is preferably less than 5.0 dB / 10 cm, and more preferably less than 4.1 dB / 10 cm. Preferably, it is less than 4.0 dB / 10 cm, more preferably less than 3.7 dB / 10 cm.

[Heat-resistant]
When the heat resistance is high, the adhesiveness between the surface-treated copper foil and the resin hardly deteriorates even in a high temperature environment, which is preferable because it can be used in a high temperature environment.
In the present invention, the heat resistance is evaluated by the peel strength retention rate. Surface treated surface S of the surface treated copper foil is a polyimide film with a thermosetting adhesive for laminating (thickness 50 μm, Upilex manufactured by Ube Industries) {Upilex (registered trademark) -VT, BPDA (biphenyltetracarboxylic dianhydride) system ( BPDA-PDA (paraphenylenediamine) -based polyimide resin substrate} and after heating at 150 ° C. for 168 hours, in accordance with IPC-TM-650, the tensile strength tester Autograph 100 has normal peel strength and The peel strength was measured after heating at 150 ° C. for 168 hours.
And the peel strength retention represented by following Formula was computed.
Peel strength retention (%) = 150 ° C., 168 hours after heating peel strength (kg / cm) / normal peel strength (kg / cm) × 100
The peel strength retention is preferably 50% or more, more preferably 60% or more, and even more preferably 70% or more.

[Copper foil with carrier]
The copper foil with a carrier which is another embodiment of the present invention includes a carrier, an intermediate layer laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer. And the said ultra-thin copper layer is the surface treatment copper foil which is one embodiment of the above-mentioned this invention. Moreover, the copper foil with a carrier may include a carrier, an intermediate layer, and an ultrathin copper layer in this order. The copper foil with a carrier may have a surface treatment layer such as a roughening treatment layer on one or both of the surface on the carrier side and the surface on the ultrathin copper layer side. Further, the carrier-attached copper foil may have a surface-treated surface such as a surface-treated surface S on the carrier-side surface and / or the surface opposite to the carrier side of the ultrathin copper layer. The copper foil with carrier preferably has a surface-treated surface such as the surface-treated surface S on the surface opposite to the carrier side of the ultrathin copper layer in order to improve work efficiency.
When a roughening treatment layer is provided on the carrier-side surface of the carrier-attached copper foil, when the carrier-attached copper foil is laminated on the support such as a resin substrate from the carrier-side surface side, the carrier and the support such as the resin substrate Has the advantage that it becomes difficult to peel off.

<Career>
Carriers that can be used in the present invention are typically metal foils or resin films, such as copper foil, copper alloy foil, nickel foil, nickel alloy foil, iron foil, iron alloy foil, stainless steel foil, aluminum foil, aluminum. It is provided in the form of alloy foil, insulating resin film (for example, polyimide film, liquid crystal polymer (LCP) film, polyethylene terephthalate (PET) film, polyamide film, polyester film, fluororesin film, etc.).
It is preferable to use a copper foil as a carrier that can be used in the present invention. This is because the copper foil has a high electrical conductivity, so that subsequent formation of an intermediate layer and an ultrathin copper layer is facilitated. The carrier is typically provided in the form of rolled copper foil or electrolytic copper foil. In general, the electrolytic copper foil is produced by electrolytic deposition of copper from a copper sulfate plating bath onto a drum of titanium or stainless steel, and the rolled copper foil is produced by repeating plastic working and heat treatment with a rolling roll. In addition to high-purity copper such as tough pitch copper and oxygen-free copper, the copper foil material is, for example, Sn-containing copper, Ag-containing copper, copper alloy added with Cr, Zr, Mg, etc., and Corson-based added with Ni, Si, etc. Copper alloys such as copper alloys can also be used.

  The thickness of the carrier that can be used in the present invention is not particularly limited, but may be appropriately adjusted to a thickness suitable for serving as a carrier, for example, 12 μm or more. However, if it is too thick, the production cost becomes high, so generally it is preferably 35 μm or less. Accordingly, the thickness of the carrier is typically 12-70 μm, more typically 18-35 μm.

  Further, as described above, the carrier used in the present invention needs to have controlled surface roughness Rz and glossiness on the side where the intermediate layer is formed. This is for controlling the root mean square height Rq, Sv, surface roughness Rz, glossiness and area ratio A / B of the copper foil surface of the surface on which the surface treatment of the ultrathin copper layer is performed.

<Intermediate layer>
An intermediate layer is provided on the carrier. Another layer may be provided between the carrier and the intermediate layer. In the intermediate layer used in the present invention, the ultrathin copper layer is hardly peeled off from the carrier before the copper foil with the carrier is laminated on the insulating substrate, while the ultrathin copper layer is separated from the carrier after the lamination step on the insulating substrate. There is no particular limitation as long as it can be peeled off. For example, the intermediate layer of the copper foil with a carrier of the present invention is Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn, alloys thereof, hydrates thereof, oxides thereof, One or two or more selected from the group consisting of organic substances may be included. The intermediate layer may be a plurality of layers.
Further, for example, the intermediate layer is a single metal layer composed of one kind of element selected from the element group composed of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the carrier side. Or forming an alloy layer composed of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn, A layer made of a hydrate or oxide of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn. It can comprise by forming.
Moreover, a well-known organic substance can be used for the intermediate | middle layer as said organic substance, and it is preferable to use any 1 or more types of a nitrogen containing organic compound, a sulfur containing organic compound, and carboxylic acid. For example, specific nitrogen-containing organic compounds include 1,2,3-benzotriazole, carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H, which are triazole compounds having a substituent. It is preferable to use -1,2,4-triazole and 3-amino-1H-1,2,4-triazole.
For the sulfur-containing organic compound, it is preferable to use mercaptobenzothiazole, 2-mercaptobenzothiazole sodium, thiocyanuric acid, 2-benzimidazolethiol, and the like.
As the carboxylic acid, it is particularly preferable to use a monocarboxylic acid, and it is particularly preferable to use oleic acid, linoleic acid, linolenic acid, or the like.
Further, for example, the intermediate layer can be configured by laminating nickel, a nickel-phosphorus alloy or a nickel-cobalt alloy, and chromium in this order on a carrier. Since the adhesive strength between nickel and copper is higher than the adhesive strength between chromium and copper, when the ultrathin copper layer is peeled off, it peels at the interface between the ultrathin copper layer and chromium. Further, the nickel of the intermediate layer is expected to have a barrier effect that prevents the copper component from diffusing from the carrier into the ultrathin copper layer. Adhesion amount of nickel in the intermediate layer is preferably 100 [mu] g / dm ² or more 40000μg / dm ² or less, more preferably 100 [mu] g / dm ² or more 4000μg / dm ² or less, more preferably 100 [mu] g / dm ² or more 2500 g / dm ² or less, more Preferably, it is 100 μg / dm ² or more and less than 1000 μg / dm ² , and the amount of chromium deposited on the intermediate layer is preferably 5 μg / dm ² or more and 100 μg / dm ² or less. When the intermediate layer is provided only on one side, it is preferable to provide a rust preventive layer such as a Ni plating layer on the opposite side of the carrier.
If the thickness of the intermediate layer becomes too large, the thickness of the intermediate layer may affect the glossiness of the roughened surface of the ultrathin copper layer after the surface treatment and the size and number of roughened particles. The thickness of the intermediate layer on the roughened surface of the thin copper layer is preferably 1-1000 nm, preferably 1-500 nm, preferably 2-200 nm, preferably 2-100 nm, More preferably, it is 3-60 nm. An intermediate layer may be provided on both sides of the carrier.

<Ultrathin copper layer>
An ultrathin copper layer is provided on the intermediate layer. Another layer may be provided between the intermediate layer and the ultrathin copper layer. Further, an ultrathin copper layer may be provided on both sides of the carrier. The ultra-thin copper layer having the carrier is a surface-treated copper foil that is one embodiment of the present invention. The thickness of the ultrathin copper layer is not particularly limited, but is generally thinner than the carrier, for example, 12 μm or less. Typically, it is 0.5 to 12 μm, and more typically 1.5 to 5 μm. Further, strike plating with a copper-phosphorus alloy may be performed before reducing the pinholes in the ultrathin copper layer before providing the ultrathin copper layer on the intermediate layer. Examples of the strike plating include a copper pyrophosphate plating solution.
The surface-treated surface S may be provided on one or both of the surface on the side opposite to the carrier side of the ultrathin copper layer and / or the surface on the carrier side of the ultrathin copper layer. Further, the surface-treated surface S is preferably provided on the surface opposite to the carrier-side surface of the ultrathin copper layer.
The ultrathin copper layer of the present invention is formed under the following conditions. By forming a smooth ultrathin copper layer, the root mean square height Rq, Sv, surface roughness Rz, glossiness and area ratio of the copper foil surface of the surface treated surface S after the surface treatment of the ultrathin copper layer This is to control A / B.
-Electrolyte composition Copper: 80-120 g / L
Sulfuric acid: 80-120 g / L
Chlorine: 30-100ppm
Leveling agent 1 (bis (3sulfopropyl) disulfide): 10 to 30 ppm
Leveling agent 2 (amine compound): 10 to 30 ppm
As the amine compound, an amine compound having the following chemical formula can be used.

(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group, and an alkyl group.)

Manufacturing conditions Current density: 70-100 A / dm ²
Electrolyte temperature: 50-65 ° C
Electrolyte linear velocity: 1.5-5 m / sec
Electrolysis time: 0.5 to 10 minutes (adjusted according to the thickness of copper to be deposited and current density)

[Resin layer on surface treated surface S]
A resin layer may be provided on the surface-treated surface S of the surface-treated copper foil of the present invention. The resin layer may be an insulating resin layer.

  The resin layer may be an adhesive, or an insulating resin layer in a semi-cured state (B stage state) for bonding. The semi-cured state (B stage state) is a state in which there is no sticky feeling even if the surface is touched with a finger, the insulating resin layer can be stacked and stored, and a curing reaction occurs when subjected to heat treatment. Including that.

  The resin layer may be an adhesive resin, that is, an adhesive, or an adhesive semi-cured (B stage state) insulating resin layer. The semi-cured state (B stage state) is a state in which there is no sticky feeling even if the surface is touched with a finger, the insulating resin layer can be stacked and stored, and a curing reaction occurs when subjected to heat treatment. Including that.

  The resin layer may contain a thermosetting resin or may be a thermoplastic resin. The resin layer may include a thermoplastic resin. The resin layer may contain a known resin, resin curing agent, compound, curing accelerator, dielectric, reaction catalyst, crosslinking agent, polymer, prepreg, skeleton material, and the like. The resin layer may be, for example, International Publication No. WO2008 / 004399, International Publication No. WO2008 / 053878, International Publication No. WO2009 / 084533, JP-A-11-5828, JP-A-11-140281, Patent 3184485, International Publication. No. WO 97/02728, Japanese Patent No. 3676375, Japanese Patent Laid-Open No. 2000-43188, Japanese Patent No. 3612594, Japanese Patent Laid-Open No. 2002-179722, Japanese Patent Laid-Open No. 2002-359444, Japanese Patent Laid-Open No. 2003-302068, Japanese Patent No. 3992225, Japanese Patent Laid-Open No. 2003 -249739, Japanese Patent No. 4136509, Japanese Patent Application Laid-Open No. 2004-82687, Japanese Patent No. 40251177, Japanese Patent Application Laid-Open No. 2004-349654, Japanese Patent No. 4286060, Japanese Patent Application Laid-Open No. 2005-262506, Japanese Patent No. 4570070, Japanese Patent Application Laid-Open No. No. 5-53218, Japanese Patent No. 3949676, Japanese Patent No. 4178415, International Publication No. WO2004 / 005588, Japanese Patent Application Laid-Open No. 2006-257153, Japanese Patent Application Laid-Open No. 2007-326923, Japanese Patent Application Laid-Open No. 2008-11169, and Japanese Patent No. 5024930. No. WO 2006/028207, Japanese Patent No. 4828427, JP 2009-67029, International Publication No. WO 2006/134868, Japanese Patent No. 5046927, JP 2009-173017, International Publication No. WO 2007/105635, Patent No. 5180815, International Publication Number WO2008 / 114858, International Publication Number WO2009 / 008471, Japanese Patent Application Laid-Open No. 2011-14727, International Publication Number WO2009 / 001850, International Publication Number WO2009 / 145179, International Publication Number Nos. WO2011 / 068157, JP-A-2013-19056 (resins, resin curing agents, compounds, curing accelerators, dielectrics, reaction catalysts, crosslinking agents, polymers, prepregs, skeletal materials, etc.) and / or You may form using the formation method and formation apparatus of a resin layer.

  The type of the resin layer is not particularly limited. For example, epoxy resin, polyimide resin, polyfunctional cyanate ester compound, maleimide compound, polymaleimide compound, maleimide resin, aromatic maleimide resin , Polyvinyl acetal resin, urethane resin, polyethersulfone (also referred to as polyethersulfone or polyethersulfone), polyethersulfone (also referred to as polyethersulfone or polyethersulfone) resin, aromatic polyamide resin, aromatic Polyamide resin polymer, rubber resin, polyamine, aromatic polyamine, polyamideimide resin, rubber modified epoxy resin, phenoxy resin, carboxyl group-modified acrylonitrile-butadiene resin, polyphenylene oxide, bismaleimide triazine tree Fat, thermosetting polyphenylene oxide resin, cyanate ester resin, carboxylic acid anhydride, polyvalent carboxylic acid anhydride, linear polymer having crosslinkable functional group, polyphenylene ether resin, 2,2-bis (4 -Cyanatophenyl) propane, phosphorus-containing phenol compound, manganese naphthenate, 2,2-bis (4-glycidylphenyl) propane, polyphenylene ether-cyanate resin, siloxane-modified polyamideimide resin, cyanoester resin, phosphazene resin, Select from the group of rubber-modified polyamide-imide resin, isoprene, hydrogenated polybutadiene, polyvinyl butyral, phenoxy, polymer epoxy, aromatic polyamide, fluororesin, bisphenol, block copolymerized polyimide resin, and cyanoester resin It can be mentioned resins containing one or more kinds as suitable to be.

The epoxy resin has two or more epoxy groups in the molecule and can be used without any problem as long as it can be used for electric / electronic materials. The epoxy resin is preferably an epoxy resin epoxidized using a compound having two or more glycidyl groups in the molecule. Also, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, brominated (brominated) epoxy Resin, phenol novolac type epoxy resin, naphthalene type epoxy resin, brominated bisphenol A type epoxy resin, orthocresol novolac type epoxy resin, rubber modified bisphenol A type epoxy resin, glycidylamine type epoxy resin, triglycidyl isocyanurate, N, N -Glycidyl amine compounds such as diglycidyl aniline, glycidyl ester compounds such as diglycidyl tetrahydrophthalate, phosphorus-containing epoxy resins, biphenyl type epoxy resins, One or two or more types selected from the group of phenyl novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylethane type epoxy resin can be used, or a hydrogenated product of the epoxy resin or Halogenated substances can be used.
As the phosphorus-containing epoxy resin, a known epoxy resin containing phosphorus can be used. The phosphorus-containing epoxy resin is, for example, an epoxy resin obtained as a derivative from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide having two or more epoxy groups in the molecule. Is preferred.

  The epoxy resin obtained as a derivative from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is converted to 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. After reacting naphthoquinone or hydroquinone to obtain a compound represented by the following chemical formula 4 (HCA-NQ) or chemical formula 5 (HCA-HQ), an epoxy resin is reacted with the OH group portion to obtain a phosphorus-containing epoxy resin. Is.

  The phosphorus-containing epoxy resin, which is the E component obtained using the above-mentioned compound as a raw material, is used by mixing one or two kinds of compounds having the structural formula shown in any one of the following chemical formulas 6 to 8. Is preferred. This is because the resin quality in a semi-cured state is excellent in stability, and at the same time, the flame retardant effect is high.

Further, as the brominated (brominated) epoxy resin, a known brominated (brominated) epoxy resin can be used. For example, the brominated (brominated) epoxy resin is a brominated epoxy resin having the structural formula shown in Chemical formula 9 obtained as a derivative from tetrabromobisphenol A having two or more epoxy groups in the molecule, It is preferable to use one or two brominated epoxy resins having the structural formula shown in FIG.

As the maleimide resin, aromatic maleimide resin, maleimide compound or polymaleimide compound, known maleimide resins, aromatic maleimide resins, maleimide compounds or polymaleimide compounds can be used. For example, as maleimide resin or aromatic maleimide resin or maleimide compound or polymaleimide compound, 4,4′-diphenylmethane bismaleimide, polyphenylmethane maleimide, m-phenylene bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl -5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl-1,3-phenylene bismaleimide, 4,4'-diphenyl ether bismaleimide, 4,4'-diphenylsulfone bismaleimide, 1, It is possible to use 3-bis (3-maleimidophenoxy) benzene, 1,3-bis (4-maleimidophenoxy) benzene and a polymer obtained by polymerizing the above compound with the above compound or other compounds. The maleimide resin may be an aromatic maleimide resin having two or more maleimide groups in the molecule, and an aromatic maleimide resin having two or more maleimide groups in the molecule and a polyamine or aromatic polyamine. Polymerization adducts obtained by polymerizing and may be used.
As the polyamine or aromatic polyamine, known polyamines or aromatic polyamines can be used. For example, as polyamine or aromatic polyamine, m-phenylenediamine, p-phenylenediamine, 4,4′-diaminodicyclohexylmethane, 1,4-diaminocyclohexane, 2,6-diaminopyridine, 4,4′-diaminodiphenylmethane, 2,2-bis (4-aminophenyl) propane, 4,4′-diaminodiphenyl ether, 4,4′-diamino-3-methyldiphenyl ether, 4,4′-diaminodiphenyl sulfide, 4,4′-diaminobenzophenone, 4,4′-diaminodiphenylsulfone, bis (4-aminophenyl) phenylamine, m-xylenediamine, p-xylenediamine, 1,3-bis [4-aminophenoxy] benzene, 3-methyl-4,4 ′ -Diaminodiphenylmethane, 3,3'-diethyl-4 4'-diaminodiphenylmethane, 3,3'-dichloro-4,4'-diaminodiphenylmethane, 2,2 ', 5,5'-tetrachloro-4,4'-diaminodiphenylmethane, 2,2-bis (3- Methyl-4-aminophenyl) propane, 2,2-bis (3-ethyl-4-aminophenyl) propane, 2,2-bis (2,3-dichloro-4-aminophenyl) propane, bis (2,3 -Dimethyl-4-aminophenyl) phenylethane, ethylenediamine and hexamethylenediamine, 2,2-bis (4- (4-aminophenoxy) phenyl) propane and the above compound and the above compound or other compounds were polymerized. A polymer or the like can be used. Moreover, 1 type, or 2 or more types of well-known polyamine and / or aromatic polyamine or the above-mentioned polyamine or aromatic polyamine can be used.
A known phenoxy resin can be used as the phenoxy resin. Moreover, what is synthesize | combined by reaction of bisphenol and a bivalent epoxy resin can be used as said phenoxy resin. As an epoxy resin, a well-known epoxy resin and / or the above-mentioned epoxy resin can be used.
As the bisphenol, known bisphenols can be used, and bisphenol A, bisphenol F, bisphenol S, tetrabromobisphenol A, 4,4′-dihydroxybiphenyl, HCA (9,10-Dihydro-9-Oxa- Bisphenol obtained as an adduct of 10-phosphophenanthrene-10-oxide) and quinones such as hydroquinone and naphthoquinone can be used.
As the linear polymer having a crosslinkable functional group, a known linear polymer having a crosslinkable functional group can be used. For example, the linear polymer having a crosslinkable functional group preferably has a functional group that contributes to the curing reaction of an epoxy resin such as a hydroxyl group or a carboxyl group. And it is preferable that the linear polymer which has this crosslinkable functional group is soluble in the organic solvent of the temperature of 50 to 200 degreeC of boiling points. Specific examples of the linear polymer having a functional group mentioned here include polyvinyl acetal resin, phenoxy resin, polyethersulfone resin, polyamideimide resin and the like.
The resin layer may contain a crosslinking agent. A known crosslinking agent can be used as the crosslinking agent. For example, a urethane-based resin can be used as the crosslinking agent.
A known rubber resin can be used as the rubber resin. For example, the rubber resin is described as a concept including natural rubber and synthetic rubber. The latter synthetic rubber includes styrene-butadiene rubber, butadiene rubber, butyl rubber, ethylene-propylene rubber, acrylonitrile butadiene rubber, acrylic rubber ( Acrylic ester copolymer), polybutadiene rubber, isoprene rubber and the like. Furthermore, when ensuring the heat resistance of the resin layer to be formed, it is also useful to select and use a synthetic rubber having heat resistance such as nitrile rubber, chloroprene rubber, silicon rubber, urethane rubber or the like. Regarding these rubber resins, it is desirable to have various functional groups at both ends in order to produce a copolymer by reacting with an aromatic polyamide resin or a polyamideimide resin. In particular, it is useful to use CTBN (carboxy group-terminated butadiene nitrile). Moreover, among acrylonitrile butadiene rubbers, a carboxyl-modified product can take a crosslinked structure with an epoxy resin and improve the flexibility of the cured resin layer. As the carboxyl-modified product, carboxy group-terminated nitrile butadiene rubber (CTBN), carboxy group-terminated butadiene rubber (CTB), and carboxy-modified nitrile butadiene rubber (C-NBR) can be used.
A known polyimide amide resin can be used as the polyamide imide resin. In addition, as the polyimide amide resin, for example, trimellitic anhydride, benzophenonetetracarboxylic anhydride and vitorylene diisocyanate are heated in a solvent such as N-methyl-2-pyrrolidone and / or N, N-dimethylacetamide. By heating the resin obtained by doing so, trimellitic anhydride, diphenylmethane diisocyanate and carboxyl group-terminated acrylonitrile-butadiene rubber in a solvent such as N-methyl-2-pyrrolidone and / or N, N-dimethylacetamide What is obtained can be used.
A known rubber-modified polyamideimide resin can be used as the rubber-modified polyamideimide resin. The rubber-modified polyamideimide resin is obtained by reacting a polyamideimide resin and a rubber resin. The reaction of the polyamide-imide resin and the rubber resin is performed for the purpose of improving the flexibility of the polyamide-imide resin itself. That is, the polyamideimide resin and the rubber resin are reacted to replace a part of the acid component (cyclohexanedicarboxylic acid or the like) of the polyamideimide resin with the rubber component. A known polyamideimide resin can be used as the polyamideimide resin. As the rubber resin, a known rubber resin or the aforementioned rubber resin can be used. Solvents used for dissolving the polyamideimide resin and the rubbery resin when polymerizing the rubber-modified polyamideimide resin include dimethylformamide, dimethylacetamide, N-methyl-2-pyrrolidone, dimethylsulfoxide, nitromethane, nitroethane, tetrahydrofuran , Cyclohexanone, methyl ethyl ketone, acetonitrile, γ-butyrolactone, and the like are preferably used alone or in combination.
A known phosphazene resin can be used as the phosphazene resin. The phosphazene resin is a resin containing phosphazene having a double bond having phosphorus and nitrogen as constituent elements. The phosphazene resin can dramatically improve the flame retardancy due to the synergistic effect of nitrogen and phosphorus in the molecule. In addition, unlike 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide derivatives, it exists stably in the resin, and the effect of preventing the occurrence of migration is obtained.
A known fluororesin can be used as the fluororesin. Examples of the fluororesin include PTFE (polytetrafluoroethylene (tetrafluoroethylene)), PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), FEP (tetrafluoroethylene / hexafluoropropylene copolymer (4.6). Fluoride)), ETFE (tetrafluoroethylene / ethylene copolymer), PVDF (polyvinylidene fluoride (difluoride)), PCTFE (polychlorotrifluoroethylene (trifluoride)), polyallylsulfone, aromatic A fluororesin composed of at least one thermoplastic resin selected from polysulfide and aromatic polyether and a fluororesin may be used.
The resin layer may contain a resin curing agent. A known resin curing agent can be used as the resin curing agent. For example, resin curing agents include amines such as dicyandiamide, imidazoles and aromatic amines, phenols such as bisphenol A and brominated bisphenol A, novolaks such as phenol novolac resins and cresol novolac resins, and acid anhydrides such as phthalic anhydride. Products, biphenyl type phenol resins, phenol aralkyl type phenol resins and the like can be used. The resin layer may contain one or more of the aforementioned resin curing agents. These curing agents are particularly effective for epoxy resins.
A specific example of the biphenyl type phenol resin is shown in Chemical formula 11.

  A specific example of the phenol aralkyl type phenol resin is shown in Chemical formula 12.

Known imidazoles can be used, for example, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl- 2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5- Hydroxymethylimidazole etc. are mentioned, These can be used individually or in mixture.
Of these, imidazoles having the structural formula shown in Chemical Formula 13 below are preferably used. By using the imidazole having the structural formula shown in Chemical Formula 13, the moisture absorption resistance of the semi-cured resin layer can be remarkably improved, and the long-term storage stability is excellent. This is because imidazoles function as a catalyst during curing of the epoxy resin and contribute as a reaction initiator that causes a self-polymerization reaction of the epoxy resin in the initial stage of the curing reaction.

As the amine resin curing agent, known amines can be used. As the amine resin curing agent, for example, the above-mentioned polyamines and aromatic polyamines can be used, and aromatic polyamines, polyamides, and these are obtained by polymerizing or condensing with epoxy resins or polyvalent carboxylic acids. One or more selected from the group of amine adducts to be used may be used. Examples of the resin curing agent for amines include 4,4′-diaminodiphenylenesulfone, 3,3′-diaminodiphenylenesulfone, 4,4-diaminodiphenylel, and 2,2-bis [4. It is preferable to use at least one of-(4-aminophenoxy) phenyl] propane and bis [4- (4-aminophenoxy) phenyl] sulfone.
The resin layer may contain a curing accelerator. A known curing accelerator can be used as the curing accelerator. For example, as the curing accelerator, tertiary amine, imidazole, urea curing accelerator and the like can be used.
The resin layer may include a reaction catalyst. A known reaction catalyst can be used as the reaction catalyst. For example, finely pulverized silica or antimony trioxide can be used as a reaction catalyst.

  The polyhydric carboxylic acid anhydride is preferably a component that contributes as a curing agent for the epoxy resin. The anhydride of the polyvalent carboxylic acid is phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, tetrahydroxyphthalic anhydride, hexahydroxyphthalic anhydride, methylhexahydroxyphthalic anhydride, nadine. Acid and methyl nadic acid are preferred.

The thermoplastic resin may be a thermoplastic resin having a functional group other than an alcoholic hydroxyl group polymerizable with an epoxy resin.
The polyvinyl acetal resin may have a functional group polymerizable with an epoxy resin or a maleimide compound other than an acid group and a hydroxyl group. The polyvinyl acetal resin may have a carboxyl group, an amino group or an unsaturated double bond introduced into the molecule.
Examples of the aromatic polyamide resin polymer include those obtained by reacting an aromatic polyamide resin and a rubber resin. Here, the aromatic polyamide resin is synthesized by condensation polymerization of an aromatic diamine and a dicarboxylic acid. As the aromatic diamine at this time, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylsulfone, m-xylenediamine, 3,3′-oxydianiline and the like are used. As the dicarboxylic acid, phthalic acid, isophthalic acid, terephthalic acid, fumaric acid or the like is used.
As the rubber resin to be reacted with the aromatic polyamide resin, a known rubber resin or the aforementioned rubber resin can be used.
This aromatic polyamide resin polymer is used for the purpose of not being damaged by under-etching by an etchant when etching a copper foil after being processed into a copper-clad laminate.

  The resin layer is a cured resin layer (the “cured resin layer” means a cured resin layer) and a half in order from the copper foil side (that is, the ultrathin copper layer side of the copper foil with carrier). The resin layer which formed the cured resin layer sequentially may be sufficient. The cured resin layer may be composed of a resin component of any one of a polyimide resin, a polyamideimide resin, and a composite resin having a thermal expansion coefficient of 0 ppm / ° C. to 25 ppm / ° C.

  Moreover, you may provide the semi-hardened resin layer whose thermal expansion coefficient after hardening is 0 ppm / degrees C-50 ppm / degrees C on the said cured resin layer. In addition, the thermal expansion coefficient of the entire resin layer after the cured resin layer and the semi-cured resin layer are cured may be 40 ppm / ° C. or less. The cured resin layer may have a glass transition temperature of 300 ° C. or higher. The semi-cured resin layer may be formed using a maleimide resin or an aromatic maleimide resin. The resin composition for forming the semi-cured resin layer preferably contains a maleimide resin, an epoxy resin, and a linear polymer having a crosslinkable functional group. As the epoxy resin, a known epoxy resin or an epoxy resin described in this specification can be used. In addition, as maleimide resins, aromatic maleimide resins, linear polymers having crosslinkable functional groups, known maleimide resins, aromatic maleimide resins, linear polymers having crosslinkable functional groups, or the aforementioned maleimide resins. An aromatic maleimide resin or a linear polymer having a crosslinkable functional group can be used.

Moreover, when providing the copper foil with a carrier which has a resin layer suitable for a three-dimensional molded printed wiring board manufacture use, it is preferable that the said cured resin layer is a polymeric polymer layer which has hardened | cured flexibility. The polymer layer is preferably made of a resin having a glass transition temperature of 150 ° C. or higher so that it can withstand the solder mounting process. The polymer polymer layer is preferably made of one or a mixture of two or more of a polyamide resin, a polyether sulfone resin, an aramid resin, a phenoxy resin, a polyimide resin, a polyvinyl acetal resin, and a polyamideimide resin. The thickness of the polymer layer is preferably 3 μm to 10 μm.
Moreover, it is preferable that the said high molecular polymer layer contains any 1 type, or 2 or more types of an epoxy resin, a maleimide-type resin, a phenol resin, and a urethane resin. The semi-cured resin layer is preferably composed of an epoxy resin composition having a thickness of 10 μm to 50 μm.

Moreover, it is preferable that the said epoxy resin composition contains each component of the following A component-E component.
Component A: An epoxy resin having one or more selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol AD type epoxy resin that have an epoxy equivalent of 200 or less and are liquid at room temperature.
B component: High heat-resistant epoxy resin.
Component C: Phosphorus-containing flame-retardant resin, which is any one of phosphorus-containing epoxy resin and phosphazene-based resin, or a resin obtained by mixing these.
Component D: A rubber-modified polyamide-imide resin modified with a liquid rubber component having a property that is soluble in a solvent having a boiling point in the range of 50 ° C. to 200 ° C.
E component: Resin curing agent.

The B component is a “high heat resistant epoxy resin” having a high so-called glass transition point Tg. The “high heat-resistant epoxy resin” referred to here is preferably a polyfunctional epoxy resin such as a novolac-type epoxy resin, a cresol novolac-type epoxy resin, a phenol novolac-type epoxy resin, or a naphthalene-type epoxy resin.
As the phosphorus-containing epoxy resin of component C, the aforementioned phosphorus-containing epoxy resin can be used. The phosphazene resin described above can be used as the C component phosphazene resin.
The rubber-modified polyamide-imide resin described above can be used as the rubber-modified polyamide-imide resin of component D. The resin curing agent described above can be used as the E component resin curing agent.

  A solvent is added to the resin composition shown above and used as a resin varnish, and a thermosetting resin layer is formed as an adhesive layer of a printed wiring board. The resin varnish is prepared by adding a solvent to the above resin composition so that the resin solid content is in the range of 30 wt% to 70 wt%, and the resin flow when measured in accordance with MIL-P-13949G in the MIL standard. A semi-cured resin film in the range of 5% to 35% can be formed. As the solvent, a known solvent or the aforementioned solvent can be used.

  The resin layer is a resin layer having a first thermosetting resin layer and a second thermosetting resin layer located on the surface of the first thermosetting resin layer in order from the copper foil side, The curable resin layer is formed of a resin component that does not dissolve in chemicals during desmear processing in the wiring board manufacturing process, and the second thermosetting resin layer dissolves in chemicals during desmear processing in the wiring board manufacturing process. Then, it may be formed using a resin that can be washed and removed. The first thermosetting resin layer may be formed using a resin component obtained by mixing one or more of polyimide resin, polyethersulfone, and polyphenylene oxide. The second thermosetting resin layer may be formed using an epoxy resin component. The thickness t1 (μm) of the first thermosetting resin layer is Rz (μm) of the roughened surface roughness of the copper foil with carrier, and the thickness of the second thermosetting resin layer is t2 (μm). Then, t1 is preferably a thickness that satisfies the condition of Rz <t1 <t2.

  The resin layer may be a prepreg in which a skeleton material is impregnated with a resin. The resin impregnated in the skeleton material is preferably a thermosetting resin. The prepreg may be a known prepreg or a prepreg used for manufacturing a printed wiring board.

The skeleton material may include aramid fibers, glass fibers, or wholly aromatic polyester fibers. The skeleton material is preferably an aramid fiber, a glass fiber, or a nonwoven fabric or woven fabric of wholly aromatic polyester fibers. The wholly aromatic polyester fiber is preferably a wholly aromatic polyester fiber having a melting point of 300 ° C. or higher. The wholly aromatic polyester fiber having a melting point of 300 ° C. or higher is a fiber produced using a resin called a so-called liquid crystal polymer, and the liquid crystal polymer contains 2-hydroxyl-6-naphthoic acid and p-hydroxybenzoic acid. The main component is an acid polymer. Since this wholly aromatic polyester fiber has a low dielectric constant and low dielectric loss tangent, it has excellent performance as a constituent material of an electrically insulating layer and can be used in the same manner as glass fiber and aramid fiber. is there.
In addition, in order to improve the wettability with the resin of the surface, it is preferable to perform the silane coupling agent process for the fiber which comprises the said nonwoven fabric and woven fabric. As the silane coupling agent at this time, a known amino-based or epoxy-based silane coupling agent or the aforementioned silane coupling agent can be used depending on the purpose of use.

  The prepreg is a prepreg obtained by impregnating a thermosetting resin into a nonwoven fabric using an aramid fiber or glass fiber having a nominal thickness of 70 μm or less, or a skeleton material made of glass cloth having a nominal thickness of 30 μm or less. Also good.

(When the resin layer contains a dielectric (dielectric filler))
The resin layer may include a dielectric (dielectric filler).
In the case where a dielectric (dielectric filler) is included in any of the above resin layers or resin compositions, it can be used for the purpose of forming the capacitor layer and increase the capacitance of the capacitor circuit. Examples of the dielectric (dielectric filler) include BaTiO ₃ , SrTiO ₃ , Pb (Zr—Ti) O ₃ (common name PZT), PbLaTiO ₃ · PbLaZrO (common name PLZT), SrBi ₂ Ta ₂ O ₉ (common name SBT), and the like. A composite oxide dielectric powder having a perovskite structure is used.

The dielectric (dielectric filler) may be powdery. When the dielectric (dielectric filler) is powdery, the powder characteristics of the dielectric (dielectric filler) are as follows. First, the particle size is 0.01 μm to 3.0 μm, preferably 0.02 μm to 2.0 μm. Must be in range. The particle size referred to here is indirect in which the average particle size is estimated from the measured values of the laser diffraction scattering type particle size distribution measurement method and the BET method because the particles form a certain secondary aggregation state. It cannot be used because the accuracy is inferior in measurement, and it refers to the average particle diameter obtained by directly observing a dielectric (dielectric filler) with a scanning electron microscope (SEM) and image analysis of the SEM image. It is. In this specification, the particle size at this time is indicated as DIA. The image analysis of the dielectric (dielectric filler) powder observed using a scanning electron microscope (SEM) in this specification is performed using IP-1000PC manufactured by Asahi Engineering Co., Ltd. Circular particle analysis was performed with a threshold value of 10 and an overlapping degree of 20, and the average particle diameter DIA was obtained.
According to the above-described embodiment, the resin layer containing the dielectric for forming the capacitor circuit layer having a low dielectric loss tangent is improved by improving the adhesion between the inner layer circuit surface of the inner layer core material and the resin layer containing the dielectric. The copper foil with a carrier which has can be provided.

Examples of the resin and / or resin composition and / or compound contained in the resin layer include methyl ethyl ketone (MEK), cyclopentanone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, toluene, methanol, ethanol, propylene glycol monomethyl ether , Dimethylformamide, dimethylacetamide, cyclohexanone, ethyl cellosolve, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide and the like to obtain a resin liquid (resin varnish). On the surface-treated surface S of the surface-treated copper foil, it is applied by, for example, a roll coater method, and then heated and dried as necessary to remove the solvent to obtain a B-stage state. For example, a hot air drying furnace may be used for drying, and the drying temperature may be 100 to 250 ° C, preferably 130 to 200 ° C. The composition of the resin layer is dissolved using a solvent, and the resin solid content is 3 wt% to 70 wt%, preferably 3 wt% to 60 wt%, preferably 10 wt% to 40 wt%, more preferably 25 wt% to 40 wt%. It is good also as a resin liquid. In addition, it is most preferable at this stage from an environmental standpoint to dissolve using a mixed solvent of methyl ethyl ketone and cyclopentanone. In addition, it is preferable to use the solvent whose boiling point is the range of 50 to 200 degreeC as a solvent.
The resin layer is preferably a semi-cured resin film having a resin flow in the range of 5% to 35% when measured according to MIL-P-13949G in the MIL standard.
In this specification, the resin flow is based on MIL-P-13949G in the MIL standard. Four 10 cm square samples are sampled from a resin-treated surface-treated copper foil with a resin thickness of 55 μm. A value calculated based on Equation 1 from the result of measuring the resin outflow weight at the time when the sample was laminated (laminate) under the conditions of a press temperature of 171 ° C., a press pressure of 14 kgf / cm ² , and a press time of 10 minutes. It is.

  The surface-treated copper foil (resin-treated surface-treated copper foil) provided with the resin layer is obtained by superposing the resin layer on a substrate and then thermocompressing the whole to thermally cure the resin layer, and then the surface-treated copper foil. When is an ultra-thin copper layer of a copper foil with a carrier, the carrier is peeled off to expose the ultra-thin copper layer (of course, the surface on the intermediate layer side of the ultra-thin copper layer is exposed) The surface-treated copper foil is used in a form in which a predetermined wiring pattern is formed from the surface opposite to the surface subjected to the roughening treatment.

  When this surface-treated copper foil with resin is used, the number of prepreg materials used in the production of the multilayer printed wiring board can be reduced. In addition, the copper-clad laminate can be manufactured even if the resin layer is made thick enough to ensure interlayer insulation or no prepreg material is used. At this time, the surface smoothness can be further improved by undercoating the surface of the substrate with an insulating resin.

In addition, when the prepreg material is not used, the material cost of the prepreg material is saved and the laminating process is simplified, which is economically advantageous. Moreover, the multilayer printed wiring board manufactured by the thickness of the prepreg material is used. The thickness is reduced, and there is an advantage that an extremely thin multilayer printed wiring board in which the thickness of one layer is 100 μm or less can be manufactured.
The thickness of the resin layer is preferably 0.1 to 120 μm.

When the thickness of the resin layer becomes thinner than 0.1 μm, the adhesive strength is reduced, and when this surface-treated copper foil with resin is laminated on the base material provided with the inner layer material without interposing the prepreg material, the circuit of the inner layer material It may be difficult to ensure interlayer insulation between the two. On the other hand, if the thickness of the resin layer is greater than 120 μm, it is difficult to form a resin layer having a target thickness in a single coating process, which may be economically disadvantageous because of extra material costs and man-hours.
In addition, when the surface-treated copper foil having a resin layer is used for manufacturing an extremely thin multilayer printed wiring board, the thickness of the resin layer is 0.1 μm to 5 μm, more preferably 0.5 μm to 5 μm, More preferably, the thickness is 1 μm to 5 μm in order to reduce the thickness of the multilayer printed wiring board.
When the resin layer includes a dielectric, the thickness of the resin layer is preferably 0.1 to 50 μm, preferably 0.5 μm to 25 μm, and more preferably 1.0 μm to 15 μm. preferable.
The total resin layer thickness with the cured resin layer and the semi-cured resin layer is preferably 0.1 μm to 120 μm, more preferably 5 μm to 120 μm, and preferably 10 μm to 120 μm, 10 μm to 60 μm. Are more preferred. The thickness of the cured resin layer is preferably 2 μm to 30 μm, preferably 3 μm to 30 μm, and more preferably 5 to 20 μm. Moreover, it is preferable that the thickness of a semi-hardened resin layer is 3 micrometers-55 micrometers, it is preferable that they are 7 micrometers-55 micrometers, and it is more desirable that it is 15-115 micrometers. If the total resin layer thickness exceeds 120 μm, it may be difficult to produce a thin multilayer printed wiring board. If the total resin layer thickness is less than 5 μm, it is easy to form a thin multilayer printed wiring board, but an insulating layer between inner layer circuits This is because the resin layer may become too thin and the insulation between the circuits of the inner layer tends to become unstable. Moreover, when the cured resin layer thickness is less than 2 μm, it may be necessary to consider the surface roughness of the surface-treated surface S of the surface-treated copper foil. Conversely, if the cured resin layer thickness exceeds 20 μm, the effect of the cured resin layer may not be particularly improved, and the total insulating layer thickness becomes thick.

When the thickness of the resin layer is 0.1 μm to 5 μm, in order to improve the adhesion between the resin layer and the surface-treated copper foil, a heat-resistant layer and / or a surface-treated surface S of the surface-treated copper foil is used. It is preferable to form a resin layer on the heat-resistant layer, the rust-proof layer, or the weather-resistant layer after providing the rust-proof layer and / or the weather-resistant layer.
In addition, the thickness of the above-mentioned resin layer says the average value of the thickness measured by cross-sectional observation in arbitrary 10 points | pieces.

  Furthermore, as another product form when this resin-treated surface-treated copper foil is an ultrathin copper layer of a carrier-added copper foil, on the surface-treated surface S of the ultrathin copper layer (surface-treated copper foil) After the resin layer is provided and the resin layer is in a semi-cured state, the carrier is then peeled off and can be manufactured in the form of an ultrathin copper layer with a resin (surface-treated copper foil) having no carrier.

  Below, some examples of the manufacturing process of the printed wiring board using the copper foil with a carrier which concerns on this invention are shown.

  In one embodiment of a method for producing a printed wiring board according to the present invention, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention, a step of laminating the copper foil with a carrier and an insulating substrate, and with the carrier After laminating the copper foil and the insulating substrate so that the ultrathin copper layer side faces the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the copper foil with carrier, and then a semi-additive method, a modified semi-conductor A step of forming a circuit by any one of an additive method, a partial additive method, and a subtractive method. It is also possible for the insulating substrate to contain an inner layer circuit.

  In the present invention, the semi-additive method refers to a method in which a thin electroless plating is performed on an insulating substrate or a copper foil seed layer, a pattern is formed, and then a conductive pattern is formed using electroplating and etching.

Therefore, in one embodiment of a method for producing a printed wiring board according to the present invention using a semi-additive method, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Removing all of the ultrathin copper layer exposed by peeling the carrier by a method such as etching or plasma using a corrosive solution such as acid
Providing a through hole or / and a blind via in the resin exposed by removing the ultrathin copper layer by etching;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the resin and the through hole or / and the blind via;
Providing a plating resist on the electroless plating layer;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using a semi-additive method, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Removing all of the ultrathin copper layer exposed by peeling the carrier by a method such as etching or plasma using a corrosive solution such as acid
Providing an electroless plating layer on the surface of the resin exposed by removing the ultrathin copper layer by etching;
Providing a plating resist on the electroless plating layer;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer and the ultrathin copper layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

  In the present invention, the modified semi-additive method is a method in which a metal foil is laminated on an insulating layer, a non-circuit forming portion is protected by a plating resist, and the copper is thickened in the circuit forming portion by electrolytic plating, and then the resist is removed. Then, a method of forming a circuit on the insulating layer by removing the metal foil other than the circuit forming portion by (flash) etching is indicated.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using the modified semi-additive method, the step of preparing the copper foil with carrier and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Providing a plating resist on the surface of the ultrathin copper layer exposed by peeling the carrier,
Forming a circuit by electrolytic plating after providing the plating resist;
Removing the plating resist;
Removing the ultra-thin copper layer exposed by removing the plating resist by flash etching;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using the modified semi-additive method, the step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a plating resist on the exposed ultrathin copper layer by peeling off the carrier;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer and the ultrathin copper layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

  In the present invention, the partial additive method means that a catalyst circuit is formed on a substrate provided with a conductor layer, and if necessary, a substrate provided with holes for through holes or via holes, and etched to form a conductor circuit. Then, after providing a solder resist or a plating resist as necessary, it refers to a method of manufacturing a printed wiring board by thickening through holes, via holes, etc. on the conductor circuit by electroless plating.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using a partly additive method, a step of preparing the copper foil with carrier and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Applying catalyst nuclei to the region containing the through-holes and / or blind vias;
Providing an etching resist on the surface of the ultrathin copper layer exposed by peeling the carrier,
Exposing the etching resist to form a circuit pattern;
Removing the ultrathin copper layer and the catalyst nucleus by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
A step of providing a solder resist or a plating resist on the surface of the insulating substrate exposed by removing the ultrathin copper layer and the catalyst core by a method such as etching or plasma using a corrosive solution such as an acid;
Providing an electroless plating layer in a region where the solder resist or plating resist is not provided,
including.

  In the present invention, the subtractive method refers to a method of forming a conductor pattern by selectively removing unnecessary portions of a copper foil on a copper clad laminate by etching or the like.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using a subtractive method, a step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Providing an electroplating layer on the surface of the electroless plating layer;
A step of providing an etching resist on the surface of the electrolytic plating layer or / and the ultrathin copper layer;
Exposing the etching resist to form a circuit pattern;
Removing the ultrathin copper layer and the electroless plating layer and the electrolytic plating layer by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using a subtractive method, a step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Forming a mask on the surface of the electroless plating layer;
Providing an electroplating layer on the surface of the electroless plating layer on which no mask is formed;
A step of providing an etching resist on the surface of the electrolytic plating layer or / and the ultrathin copper layer;
Exposing the etching resist to form a circuit pattern;
Removing the ultra-thin copper layer and the electroless plating layer by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
including.

  The process of providing a through hole or / and a blind via and the subsequent desmear process may not be performed.

Here, the specific example of the manufacturing method of the printed wiring board using the copper foil with a carrier of this invention is demonstrated in detail using drawing. Here, the carrier-attached copper foil having an ultrathin copper layer on which a roughened layer is formed will be described as an example. However, the present invention is not limited thereto, and the carrier has an ultrathin copper layer on which a roughened layer is not formed. The following method for producing a printed wiring board can be similarly performed using an attached copper foil.
First, as shown to FIG. 5-A, the copper foil with a carrier (1st layer) which has the ultra-thin copper layer in which the roughening process layer was formed on the surface is prepared.
Next, as shown in FIG. 5B, a resist is applied on the roughened layer of the ultrathin copper layer, exposed and developed, and the resist is etched into a predetermined shape.
Next, as shown in FIG. 5C, after forming a plating for a circuit, the resist is removed to form a circuit plating having a predetermined shape.
Next, as shown in FIG. 6-D, an embedded resin is provided on the ultrathin copper layer so as to cover the circuit plating (so that the circuit plating is buried), and then the resin layer is laminated, followed by another carrier attachment. A copper foil (second layer) is bonded from the ultrathin copper layer side.
Next, as shown to FIG. 6-E, a carrier is peeled from the copper foil with a carrier of the 2nd layer.
Next, as shown in FIG. 6-F, laser drilling is performed at a predetermined position of the resin layer to expose the circuit plating and form a blind via.
Next, as shown in FIG. 7G, copper is embedded in the blind via to form a via fill.
Next, as shown in FIG. 7H, circuit plating is formed on the via fill as shown in FIGS. 5-B and 5-C.
Next, as shown to FIG. 7-I, a carrier is peeled from the copper foil with a carrier of the 1st layer.
Next, as shown in FIG. 8J, the ultrathin copper layers on both surfaces are removed by flash etching to expose the surface of the circuit plating in the resin layer.
Next, as shown in FIG. 8K, bumps are formed on the circuit plating in the resin layer, and copper pillars are formed on the solder. Thus, the printed wiring board using the copper foil with a carrier of this invention is produced.

  As the another copper foil with a carrier (second layer), the copper foil with a carrier of the present invention may be used, a conventional copper foil with a carrier may be used, and a normal copper foil may be further used. Further, one or more circuits may be formed on the second-layer circuit shown in FIG. 7-H, and these circuits may be formed by a semi-additive method, a subtractive method, a partial additive method, or a modified semi-conductor method. You may carry out by any method of an additive method.

The copper foil with a carrier according to the present invention is preferably controlled so that the color difference on the surface of the ultrathin copper layer satisfies the following (1). In the present invention, the “color difference on the surface of the ultrathin copper layer” means the color difference on the surface of the ultrathin copper layer, or the color difference on the surface of the surface treatment layer when various surface treatments such as roughening treatment are applied. . That is, it is preferable that the copper foil with a carrier according to the present invention is controlled so that the color difference of the roughened surface of the ultrathin copper layer satisfies the following (1). In the surface-treated copper foil of the present invention, the term “roughened surface” means that when the surface treatment for providing a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. is performed after the roughening treatment, It means the surface of the surface-treated copper foil after the treatment. In addition, when the surface-treated copper foil is an ultrathin copper layer of a copper foil with a carrier, the “roughened surface” means that after the roughening treatment, a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. are provided. When the surface treatment is performed, the surface of the ultrathin copper layer after the surface treatment is performed.
(1) The color difference on the surface of the ultrathin copper layer has a color difference ΔE * ab based on JISZ8730 of 45 or more.

  Here, the color differences ΔL, Δa, and Δb are respectively measured with a color difference meter, and are shown using the L * a * b color system based on JIS Z8730, taking into account black / white / red / green / yellow / blue. It is a comprehensive index and is expressed as ΔL: black and white, Δa: reddish green, Δb: yellow blue. ΔE * ab is expressed by the following formula using these color differences.

The above-described color difference can be adjusted by increasing the current density when forming the ultrathin copper layer, decreasing the copper concentration in the plating solution, and increasing the linear flow rate of the plating solution.
Moreover, the above-mentioned color difference can also be adjusted by performing a roughening process on the surface of an ultra-thin copper layer and providing a roughening process layer. In the case of providing the roughening treatment layer, the current density is made higher than conventional (for example, 40 to 60 A) using an electrolytic solution containing copper and one or more elements selected from the group consisting of nickel, cobalt, tungsten, and molybdenum. / Dm ² ), and the processing time can be shortened (for example, 0.1 to 1.3 seconds). When a roughening layer is not provided on the surface of the ultrathin copper layer, use a plating bath in which the concentration of Ni is twice or more that of other elements, and use an ultrathin copper layer, heat resistant layer, rust preventive layer or chromate. Ni alloy plating (for example, Ni-W alloy plating, Ni-Co-P alloy plating, Ni-Zn alloy plating) is applied to the surface of the treatment layer or the silane coupling treatment layer at a lower current density (0.1 to 1.. 3A / dm ² ), and the processing time can be set long (20 to 40 seconds).

  When the color difference ΔE * ab based on JISZ8730 is 45 or more when the color difference on the surface of the ultrathin copper layer is 45 or more, for example, when forming a circuit on the surface of the ultrathin copper layer of the copper foil with carrier, The contrast becomes clear, and as a result, the visibility is good and the circuit alignment can be performed with high accuracy. The color difference ΔE * ab based on JISZ8730 on the surface of the ultrathin copper layer is preferably 50 or more, more preferably 55 or more, and even more preferably 60 or more.

  When the color difference on the surface of the ultrathin copper layer is controlled as described above, the contrast with the circuit plating becomes clear and the visibility becomes good. Therefore, in the manufacturing process of the printed wiring board as described above, for example, as shown in FIG. 5C, it is possible to accurately form the circuit plating at a predetermined position. Further, according to the method for manufacturing a printed wiring board as described above, since the circuit plating is embedded in the resin layer, for example, removal of the ultrathin copper layer by flash etching as shown in FIG. At this time, the circuit plating is protected by the resin layer and the shape thereof is maintained, thereby facilitating the formation of a fine circuit. Further, since the circuit plating is protected by the resin layer, the migration resistance is improved, and the continuity of the circuit wiring is satisfactorily suppressed. For this reason, formation of a fine circuit becomes easy. Also, as shown in FIGS. 8J and 8K, when the ultrathin copper layer is removed by flash etching, the exposed surface of the circuit plating is recessed from the resin layer, so that bumps are formed on the circuit plating. In addition, copper pillars can be easily formed thereon, and the production efficiency is improved.

  A known resin or prepreg can be used as the embedding resin (resin). For example, a prepreg that is a glass cloth impregnated with BT (bismaleimide triazine) resin or BT resin, an ABF film or ABF manufactured by Ajinomoto Fine Techno Co., Ltd. can be used. Moreover, the resin layer and / or resin and / or prepreg as described in this specification can be used for the embedding resin (resin).

  Moreover, the copper foil with a carrier used for the first layer may have a substrate or a resin layer on the surface of the copper foil with a carrier. By having the said board | substrate or resin layer, the copper foil with a carrier used for the first layer is supported, and since it becomes difficult to wrinkle, there exists an advantage that productivity improves. As the substrate or resin layer, any substrate or resin layer can be used as long as it has an effect of supporting the copper foil with carrier used in the first layer. For example, the carrier, prepreg, resin layer or known carrier, prepreg, resin layer, metal plate, metal foil, inorganic compound plate, inorganic compound foil, organic compound plate described herein as the substrate or resin layer, Organic compound foils can be used.

The surface-treated copper foil of the present invention can be bonded to a resin substrate from the surface-treated surface S side to produce a laminate. The resin substrate is not particularly limited as long as it has characteristics applicable to a printed wiring board or the like. For example, a paper base phenol resin, a paper base epoxy resin, a synthetic fiber cloth base epoxy resin for rigid PWB Glass cloth / paper composite base material epoxy resin, glass cloth / glass nonwoven fabric composite base material epoxy resin and glass cloth base material epoxy resin, etc. are used, polyester film, polyimide film, liquid crystal polymer (LCP) film, fluorine for FPC Resin, Teflon (registered trademark) film, etc. can be used. In addition, when a liquid crystal polymer (LCP) film, a fluororesin film, or a Teflon (registered trademark) film is used, the peel strength between the film and the surface-treated copper foil tends to be smaller than when a polyimide film is used. . Therefore, when a liquid crystal polymer (LCP) film or a fluororesin film is used, the copper circuit is covered with a coverlay after the copper circuit is formed, so that the film and the copper circuit are not easily peeled off, and the peel strength is reduced. The film can be prevented from peeling off from the copper circuit.
In addition, since a liquid crystal polymer (LCP) film and a fluororesin film have a small dielectric loss tangent, the copper clad laminated board using a liquid crystal polymer (LCP) film or a fluororesin film and the surface-treated copper foil which concerns on this invention, printed wiring Boards and printed circuit boards are suitable for high-frequency circuits (circuits that transmit signals at high frequencies). Further, the surface-treated copper foil according to the present invention has a small surface roughness Rz and a high glossiness, so that the surface is smooth and suitable for high-frequency circuit applications. In the present invention, the “printed wiring board” includes a printed wiring board, a printed circuit board, and a printed board on which components are mounted.

In the case of the rigid PWB, a prepreg is prepared by impregnating a base material such as a glass cloth with a resin and curing the resin to a semi-cured state. It can be performed by superposing a copper foil on the prepreg from the surface-treated surface S and heating and pressing it. In the case of FPC, it is laminated on a copper foil under high temperature and high pressure without using an adhesive on a substrate such as a polyimide film, or a polyimide precursor is applied, dried, cured, etc. A laminated board can be manufactured by performing.
The thickness of the polyimide base resin is not particularly limited, but generally 25 μm or 50 μm can be mentioned.

  The laminate of the present invention can be used for various printed wiring boards (PWB) and is not particularly limited. For example, from the viewpoint of the number of layers of the conductor pattern, the single-sided PWB, the double-sided PWB, and the multilayer PWB (3 It is applicable to rigid PWB, flexible PWB (FPC), and rigid flex PWB from the viewpoint of the type of insulating substrate material.

(Laminated board and printed wiring board positioning method using the same)
A method for positioning the laminate of the surface-treated copper foil and the resin substrate of the present invention will be described. First, a laminate of a surface-treated copper foil and a resin substrate is prepared. As a specific example of the laminate of the surface-treated copper foil and the resin substrate according to the present invention, at least one of a main substrate, an attached circuit substrate, and a resin substrate such as polyimide used for electrically connecting them. In an electronic device composed of a flexible printed circuit board with copper wiring formed on the surface, a laminated board manufactured by accurately positioning the flexible printed circuit board and crimping it to the wiring ends of the main circuit board and the attached circuit board Is mentioned. That is, in this case, the laminate is a laminate in which the wiring end portions of the flexible printed circuit board and the main body substrate are bonded together by pressure bonding, or the wiring edge portions of the flexible printed circuit board and the circuit board are bonded together by pressure bonding. Laminated board. The laminated board has a mark formed of a part of the copper wiring and a separate material. The position of the mark is not particularly limited as long as it can be photographed by photographing means such as a CCD camera through the resin constituting the laminated plate. In addition, when the surface-treated copper foil of this invention is the ultra-thin copper layer (ultra-thin copper layer which has a carrier) of copper foil with a carrier, from the laminated board of surface-treated copper foil and a resin substrate as needed Remove the carrier.

  In the laminated plate thus prepared, when the above-described mark is photographed by the photographing means through the resin, the position of the mark can be detected satisfactorily. And the position of the said mark can be detected in this way, and based on the position of the said detected mark, the positioning of the laminated board of surface-treated copper foil and a resin substrate can be performed favorably. Similarly, when a printed wiring board is used as the laminated board, the photographing means can detect the position of the mark well by such a positioning method, and the printed wiring board can be positioned more accurately.

  Therefore, when one printed wiring board and another printed wiring board are connected, it is considered that the connection failure is reduced and the yield is improved. In addition, as a method of connecting one printed wiring board and another printed wiring board, connection via soldering or anisotropic conductive film (ACF), anisotropic conductive paste (Anisotropic Conductive Paste, A known connection method such as connection via ACP) or connection via a conductive adhesive can be used. In the present invention, the “printed wiring board” includes a printed wiring board, a printed circuit board, and a printed board on which components are mounted. Also, it is possible to manufacture a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards according to the present invention, and at least one printed wiring board according to the present invention. One printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention can be connected, and an electronic apparatus can be manufactured using such a printed wiring board. In the present invention, “copper circuit” includes copper wiring. Furthermore, the printed wiring board of the present invention may be connected to a component to produce a printed wiring board. Further, at least one printed wiring board of the present invention is connected to another printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention. A printed wiring board in which two or more printed wiring boards are connected may be manufactured by connecting two or more printed wiring boards and components. Here, as “components”, connectors, LCDs (Liquid Crystal Display), electronic components such as glass substrates used in LCDs, ICs (Integrated Circuits), LSIs (Large scale integrated circuits), VLSIs (Very Large scale circuits). ), Electronic components including semiconductor integrated circuits such as ULSI (Ultra-Large Scale Integrated Circuit) (for example, IC chip, LSI chip, VLSI chip, ULSI chip), components for shielding electronic circuits, and covers on printed wiring boards, etc. Examples of the parts necessary to fix the are included.

The positioning method according to the embodiment of the present invention may include a step of moving a laminated board (including a laminated board of copper foil and a resin substrate and a printed wiring board). In the moving process, for example, it may be moved by a conveyor such as a belt conveyor or a chain conveyor, may be moved by a moving device provided with an arm mechanism, or may be moved by floating a laminated plate using gas. It may be moved by a moving means, a moving device or moving means (including a roller or a bearing) that moves a laminated plate by rotating an object such as a substantially cylindrical shape, a moving device or moving means that uses hydraulic pressure as a power source, Moving devices and moving means powered by air pressure, moving devices and moving means powered by motors, gantry moving linear guide stages, gantry moving air guide stages, stacked linear guide stages, linear motor drive stages, etc. It may be moved by a moving device or moving means having a stage. Moreover, you may perform the movement process by a well-known moving means.
The positioning method according to the embodiment of the present invention may be used for a surface mounter or a chip mounter.
Moreover, the printed wiring board which has the circuit provided on the resin board and the said resin board may be sufficient as the laminated board of the surface treatment copper foil and the resin board which are positioned in this invention. In that case, the mark may be the circuit.

In the present invention, “positioning” includes “detecting the position of a mark or an object”. In the present invention, “alignment” includes “after detecting the position of a mark or object, moving the mark or object to a predetermined position based on the detected position”.
In the printed wiring board, the circuit on the printed wiring board is used as a mark instead of the mark on the printed material, and the Sv value can be measured by photographing the circuit through a resin with a CCD camera. Also, for copper-clad laminates, after copper was etched into a line shape, the lined copper was used as a mark instead of a printed mark, and the lined copper was photographed with a CCD camera through the resin. Thus, the value of Sv can be measured.

As Examples 1-10, Examples 15-20, and Comparative Examples 1-5, each copper foil of Table 1 was prepared, and it plated on the conditions of Table 2 as surface treatment on one surface. went.
Moreover, about Examples 11-14, the various carriers described in Table 1 were prepared, an intermediate layer was formed on the surface of the carrier, and an ultrathin copper layer was formed on the surface of the intermediate layer under the following conditions. And the surface treatment of Table 2 was performed to the surface of an ultra-thin copper layer.
In addition, the surface treatment copper foil which does not perform a roughening process was also prepared. “No” in the “Roughening treatment” column of “Surface treatment” in Table 2 indicates that the surface treatment is not a roughening treatment, and “Yes” indicates that the surface treatment is a roughening treatment.
Example 11
<Intermediate layer>
(1) Ni layer (Ni plating)
An Ni layer having an adhesion amount of 1000 μg / dm ² was formed on the carrier by electroplating on a roll-to-roll type continuous plating line under the following conditions. Specific plating conditions are described below.
Nickel sulfate: 270-280 g / L
Nickel chloride: 35 to 45 g / L
Nickel acetate: 10-20g / L
Boric acid: 30-40 g / L
Brightener: Saccharin, butynediol, etc. Sodium dodecyl sulfate: 55-75 ppm
pH: 4-6
Bath temperature: 55-65 ° C
Current density: 10 A / dm ²
(2) Cr layer (electrolytic chromate treatment)
Next, after the surface of the Ni layer formed in (1) is washed with water and pickled, a Cr layer having an adhesion amount of 11 μg / dm ² is continuously formed on the Ni layer on a roll-to-roll-type continuous plating line. It was made to adhere by carrying out the electrolytic chromate process on the following conditions.
Potassium dichromate 1-10g / L, zinc 0g / L
pH: 7-10
Liquid temperature: 40-60 degreeC
Current density: 2 A / dm ²
<Ultrathin copper layer>
Next, after the surface of the Cr layer formed in (2) is washed with water and pickled, an ultrathin copper layer having a thickness of 1.5 μm is continuously formed on the Cr layer on a roll-to-roll-type continuous plating line. It was formed by electroplating under the following conditions to produce an ultrathin copper foil with a carrier.
Copper concentration: 90-110 g / L
Sulfuric acid concentration: 90-110 g / L
Chloride ion concentration: 50-90ppm
Leveling agent 1 (bis (3sulfopropyl) disulfide): 10 to 30 ppm
Leveling agent 2 (amine compound): 10 to 30 ppm
In addition, the following amine compound was used as the leveling agent 2.
(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group, and an alkyl group.)
Electrolyte temperature: 50-80 ° C
Current density: 100 A / dm ²
Electrolyte linear velocity: 1.5-5 m / sec
Example 12
<Intermediate layer>
(1) Ni-Mo layer (nickel molybdenum alloy plating)
A Ni—Mo layer having an adhesion amount of 3000 μg / dm ² was formed on the carrier by electroplating on a roll-to-roll continuous plating line under the following conditions. Specific plating conditions are described below.
(Liquid composition) Ni sulfate hexahydrate: 50 g / dm ³ , sodium molybdate dihydrate: 60 g / dm ³ , sodium citrate: 90 g / dm ³
(Liquid temperature) 30 ° C
(Current density) 1 to 4 A / dm ²
(Energization time) 3 to 25 seconds <Ultra-thin copper layer>
An ultrathin copper layer was formed on the Ni—Mo layer formed in (1). An ultrathin copper layer was formed under the same conditions as in Example 11 except that the thickness of the ultrathin copper layer was 3 μm.
Example 13
<Intermediate layer>
(1) Ni layer (Ni plating)
A Ni layer was formed under the same conditions as in Example 11.
(2) Organic layer (Organic layer formation treatment)
Next, the surface of the Ni layer formed in (1) is washed with water and pickled, and subsequently contains carboxybenzotriazole (CBTA) at a concentration of 1 to 30 g / L with respect to the Ni layer surface under the following conditions. An organic layer was formed by spraying an aqueous solution of 40 ° C. and pH 5 after 20 to 120 seconds of showering.
<Ultrathin copper layer>
An ultrathin copper layer was formed on the organic layer formed in (2). An ultrathin copper layer was formed under the same conditions as in Example 11 except that the thickness of the ultrathin copper layer was 2 μm.
Example 14
<Intermediate layer>
(1) Co-Mo layer (cobalt molybdenum alloy plating)
A Co—Mo layer having an adhesion amount of 4000 μg / dm ² was formed on the carrier by electroplating on a roll-to-roll continuous plating line under the following conditions. Specific plating conditions are described below.
(Liquid composition) Co sulfate 50 g / dm ³ , sodium molybdate dihydrate: 60 g / dm ³ , sodium citrate: 90 g / dm ³
(Liquid temperature) 30 ° C
(Current density) 1 to 4 A / dm ²
(Energization time) 3 to 25 seconds <Ultra-thin copper layer>
An ultrathin copper layer was formed on the Co—Mo layer formed in (1). An ultrathin copper layer was formed under the same conditions as in Example 11 except that the thickness of the ultrathin copper layer was 5 μm.

In addition, the rolled copper foil ("Tough pitch copper" in the "Kind" column of Table 1 indicates that it is a rolled copper foil) was produced as follows. After manufacturing a predetermined copper ingot and performing hot rolling, annealing and cold rolling of a 300-800 degreeC continuous annealing line were repeated, and the rolled sheet of 1-2 mm thickness was obtained. This rolled plate was annealed in a continuous annealing line at 300 to 800 ° C. and recrystallized, and finally cold-rolled to the thickness shown in Table 1 under the conditions shown in Table 1 to obtain a copper foil. “Tough pitch copper” in Table 1 indicates tough pitch copper standardized in JIS H3100 C1100.
Table 1 shows the points of the copper foil preparation process before the surface treatment. “High gloss rolling” means that the final cold rolling (cold rolling after the final recrystallization annealing) was performed at the value of the oil film equivalent. In addition, about Example 1, 2, the copper foil whose thickness of copper foil is 6 micrometers, 12 micrometers, and 35 micrometers was also manufactured.
In addition, the leveling agent 1 and leveling agent 2 of Example 2 are the leveling agent 1 and leveling agent 2 used for the plating bath at the time of ultrathin copper layer formation in above-mentioned Examples 11-14. Same as above.
Moreover, about Example 2, predetermined | prescribed surface treatment was performed to the precipitation surface (surface on the opposite side to the surface which is in contact with the electrolysis drum at the time of electrolytic copper foil manufacture). Moreover, about the electrolytic copper foil of Table 1, the surface roughness Rz and glossiness by the side of a precipitation surface are described.
In addition, about the surface treatment copper foil obtained in Examples 1-3, Examples 5-10, and the comparative example 1, the surface treatment copper foil which performed the surface treatment of Table 4 on the other surface was also manufactured. . Here, "Example No.-number" in Table 4 means that the other surface of the surface-treated copper foil obtained in the example was subjected to the surface treatment described in Table 4. For example, in Table 4, “Example 1-1” is obtained by performing the surface treatment described in Table 4 on the other surface of Example 1, and “Example 2-1” is that of Example 2. The other surface is subjected to the surface treatment described in Table 4.

Various evaluation was performed as follows about each sample of the Example and comparative example which were produced as mentioned above.
(1-1) Measurement of surface roughness (Rz);
About the copper foil after the surface treatment of each Example and Comparative Example, the surface roughness of the ten-point average roughness was measured in accordance with JIS B0601-1994 using a contact-type roughness meter Surfcoder SE-3C manufactured by Kosaka Laboratory Ltd. The surface was measured. With respect to the rolled copper foil, the measurement standard length was 0.8 mm, the evaluation length was 4 mm, the cut-off value was 0.25 mm, and the feed rate was 0.1 mm / second. Traveling direction: TD, that is, the measurement position in the width direction, or for electrolytic copper foil, the measurement position in the direction perpendicular to the traveling direction of the electrolytic copper foil in the electrolytic copper foil manufacturing apparatus (TD, that is, the width direction). , And 10 times each, and the average value of the 10 measurements was taken as the value of the surface roughness (Rz). When the surface-treated copper foil was an ultrathin copper layer of a copper foil with a carrier, the above measurement was performed on the surface-treated surface of the ultrathin copper layer.
In addition, the surface roughness (Rz) was calculated | required similarly about the copper foil before surface treatment.

(1-2) Measurement of the root mean square height Rq of the surface;
About the surface treatment surface of the copper foil after surface treatment of each Example and a comparative example, the root mean square height Rq of the copper foil surface was measured with the Olympus laser microscope OLS4000. Progression of electrolytic copper foil in an electrolytic copper foil manufacturing apparatus with an evaluation length of 647 μm and measurement of a direction perpendicular to the rolling direction (TD) for the rolled copper foil under conditions of zero cut-off value Values were obtained by measuring in a direction (TD) perpendicular to the direction. In addition, the measurement environmental temperature of the root mean square height Rq of the surface by a laser microscope was 23-25 degreeC. When the surface-treated copper foil was an ultrathin copper layer of a copper foil with a carrier, the above measurement was performed on the surface-treated surface of the ultrathin copper layer.

(2) Measurement of the surface roughness of the other surface (the surface of the copper foil that is not the surface-treated surface S);
About the other surface of each Example and a comparative example, it is preferable to measure the surface roughness using a non-contact method. Specifically, the state of the other surface after the surface treatment of each example and comparative example is evaluated by the roughness value measured with a laser microscope. This is because the state of the surface can be evaluated in more detail.

-Measurement of surface roughness (Rz);
About the other surface of the surface-treated copper foil of each example and comparative example (the other surface after the surface treatment when the other surface was subjected to surface treatment), the surface roughness was measured with an Olympus laser microscope OLS4000. (10-point average roughness) Rz was measured according to JIS B0601 1994. Using an objective lens 50 times, in the observation of the copper foil surface, the evaluation length is 258 μm, the cut-off value is zero, and the rolled copper foil is measured in the direction (TD) perpendicular to the rolling direction or electrolytic copper About foil, the value was calculated | required by the measurement of the direction (TD) perpendicular | vertical to the advancing direction of the electrolytic copper foil in the manufacturing apparatus of electrolytic copper foil, respectively. In addition, the measurement environmental temperature of surface roughness Rz by a laser microscope was 23-25 degreeC. Rz was arbitrarily measured at 10 locations, and the average value at 10 locations of Rz was defined as the value of surface roughness (10-point average roughness) Rz. Further, the wavelength of the laser beam of the laser microscope used for the measurement was 405 nm. The same measurement was performed on the surface-treated surface S.

Measurement of the root mean square height Rq of the surface;
For the other surface of the surface-treated copper foil of each example and comparative example (the other surface after the surface treatment when the other surface was subjected to surface treatment), the surface of the copper foil was measured with an Olympus laser microscope OLS4000. The root mean square height Rq was measured in accordance with JIS B0601 2001. Using an objective lens 50 times, in the observation of the copper foil surface, the evaluation length is 258 μm, the cut-off value is zero, and the rolled copper foil is measured in the direction (TD) perpendicular to the rolling direction or electrolytic copper About foil, the value was calculated | required by the measurement of the direction (TD) perpendicular | vertical to the advancing direction of the electrolytic copper foil in the manufacturing apparatus of electrolytic copper foil, respectively. In addition, the measurement environmental temperature of the root mean square height Rq of the surface by a laser microscope was 23-25 degreeC. Rq was measured arbitrarily at 10 locations, and the average value at 10 locations of the Rq was taken as the value of the root mean square height Rq. Further, the wavelength of the laser beam of the laser microscope used for the measurement was 405 nm. The same measurement was performed on the surface-treated surface S.

-Measurement of arithmetic mean roughness Ra of the surface;
For the other surface of the copper foil of each example / comparative example (the other surface after the surface treatment when the other surface is subjected to surface treatment), the surface roughness Ra is in accordance with JIS B0601-1994. Measured with a laser microscope OLS4000 manufactured by Olympus. Using an objective lens 50 times, in the observation of the copper foil surface, the evaluation length is 258 μm, the cut-off value is zero, and the rolled copper foil is measured in the direction (TD) perpendicular to the rolling direction. About foil, the value was calculated | required by the measurement of the direction (TD) perpendicular | vertical to the advancing direction of the electrolytic copper foil in the manufacturing apparatus of electrolytic copper foil, respectively. In addition, the measurement environmental temperature of arithmetic mean roughness Ra of the surface by a laser microscope was 23-25 degreeC. Ra was measured arbitrarily at 10 locations, and the average value of 10 locations of Ra was used as the value of arithmetic average roughness Ra. Further, the wavelength of the laser beam of the laser microscope used for the measurement was 405 nm. The same measurement was performed on the surface-treated surface S.

(3) Area ratio (A / B) of copper foil surface;
The surface area of the copper foil surface was measured by a laser microscope. About the surface treatment surface of the copper foil after the surface treatment of each Example and Comparative Example, using an Olympus laser microscope OLS4000, an area B equivalent to 647 μm × 646 μm at a magnification of 20 times the treatment surface (417,953 μm ^{2 in} actual data) The three-dimensional surface area A was measured, and setting was performed by a method of three-dimensional surface area A ÷ two-dimensional surface area B = area ratio (A / B). In addition, the measurement environmental temperature of the three-dimensional surface area A with a laser microscope was 23-25 degreeC. When the surface-treated copper foil was an ultrathin copper layer of a copper foil with a carrier, the above measurement was performed on the surface-treated surface of the ultrathin copper layer.

(4) Glossiness;
Gloss meter handy gloss meter PG-1 manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with JIS Z8741 is used. For rolled copper foil, the gloss at an incident angle of 60 degrees in the direction (TD) perpendicular to the rolling direction, or As for the electrolytic copper foil, the glossiness at an incident angle of 60 degrees in the direction (TD) perpendicular to the traveling direction of the electrolytic copper foil in the electrolytic copper foil manufacturing apparatus was measured for each copper foil before the surface treatment.

(5) Inclination of lightness curve The surface-treated copper foil was subjected to a polyimide film (Kaneka thickness 50 μm (Pixeo for double-layer copper-clad laminate (PIXEO) (polyimide type: FRS), copper) from the surface side where the surface treatment was performed. Bonded on both sides of polyimide film with adhesive layer for tension laminates, PMDA (pyromellitic anhydride) -based polyimide film (PMDA-ODA (4,4'-diaminodiphenyl ether) -based polyimide film))), surface treatment The copper foil was removed by etching (ferric chloride aqueous solution) to prepare a sample film. In addition, when the surface-treated copper foil is an ultrathin copper layer of the copper foil with carrier, the copper foil with carrier is bonded to both sides of the polyimide film from the surface side where the surface treatment of the ultrathin copper layer is performed, Then, after peeling a carrier, the ultra-thin copper layer was removed by etching (ferric chloride aqueous solution), and the sample film was produced. Subsequently, a printed material on which a line-shaped black mark is printed is laid under the sample film, and the printed material is photographed with a CCD camera (line CCD camera of 8192 pixels) through the sample film. In the observation point-lightness graph created by measuring the lightness of each observation point along the direction perpendicular to the direction in which the observed line-shaped mark extends, this occurs from the end of the mark to the part where no mark is drawn. The slope (angle) of the brightness curve was measured. FIG. 3 is a schematic diagram showing the configuration of the photographing apparatus used at this time and the method of measuring the inclination of the brightness curve.
Further, ΔB, t1, t2, and Sv were measured by the following photographing apparatus as shown in FIG. One pixel on the horizontal axis corresponds to a length of 10 μm.
The polyimide film used for the measurement of the slope of the lightness curve may be any polyimide film as long as the value of ΔB (ΔB (PI)) before being bonded to the copper foil is 50 or more and 65 or less. In addition, the value of ΔB (PI) of the polyimide film used in this example and the comparative example was 50 or more and 65 or less (for example, 59).
The above-mentioned “printed matter printed with a line-shaped black mark” is printed on white glossy paper having a glossiness of 43.0 ± 2 according to JIS P8208 (1998) (a copy of the dust measurement chart of FIG. 1) and JIS P8145 (2011) ( Annex JA (normative) Visual foreign substance comparison chart Figure JA.1- A copy of the visual foreign substance comparison chart) Various kinds of lines printed on the transparent film shown in FIG. (Contaminant) (Product name: Choyokai Co., Ltd. Product name: “Measurement table for dust-full size”, product number: JQA160-20151-1 (manufactured by the National Printing Bureau)) was used. .
The glossiness of the glossy paper was measured at an incident angle of 60 degrees using a gloss meter handy gloss meter PG-1 manufactured by Nippon Denshoku Industries Co., Ltd. based on JIS Z8741.
The photographing device is a CCD camera, a stage (white) on which a polyimide substrate is placed with a marked paper (glossy paper with impurities on it), an illumination power source that irradiates light onto the polyimide substrate photographing unit, and photographing. A transporting machine (not shown) is provided for transporting an evaluation polyimide substrate on which a paper with a mark of interest is placed on a stage. The main specifications of the camera are as follows:
・ Photographing device: Sheet inspection device Mujken manufactured by Nireco Corporation
Line CCD camera: 8192 pixels (160 MHz), 1024 gradation digital (10 bits)
・ Power supply for lighting: High frequency lighting power supply (power supply unit x 2)
・ Lighting: fluorescent lamp (30W, model name: FPL27EX-D, twin fluorescent lamp)
As a line for Sv measurement, a line indicated by an arrow drawn on the contaminant of FIG. 9 of 0.7 mm ² was used. The width of the line is 0.3 mm. Further, the line CCD camera field of view is arranged in a dotted line in FIG.
When shooting with a line CCD camera, the signal is confirmed at 256 gradations on the full scale, and the place where the black mark of the printed matter does not exist (on the white glossy paper above) without placing the polyimide film (polyimide substrate) to be measured. The lens aperture was adjusted so that the peak gradation signal of 230 ± 5 falls within the range (when a portion outside the mark printed on the contaminants is measured with a CCD camera from the transparent film side). The camera scan time (the time when the camera shutter is open and the time when light is captured) is fixed at 250 μs, and the lens aperture is adjusted so that it falls within the above gradation.
In the case of measuring ΔB and Sv using a line-shaped copper foil as a mark for a printed wiring board and a copper-clad laminate, a white gloss with a glossiness of 43.0 ± 2 is provided on the back surface of the line-shaped copper foil. Cover the paper, photograph with a CCD camera (line CCD camera of 8192 pixels) through the polyimide film, and for the image obtained by photographing, for each observation point along the direction perpendicular to the direction in which the observed copper foil extends In the observation point-lightness graph produced by measuring the lightness, the above-mentioned “line-shaped black mark is used except that ΔB and t1, t2, and Sv are measured from the lightness curve generated from the end of the mark to the portion without the mark. It is the same as the conditions for measuring ΔB and Sv using the “printed matter printed”.
For the lightness shown in FIG. 3, 0 means “black”, lightness 255 means “white”, and the gray level from “black” to “white” (black and white shading, gray scale) Is divided into 256 gradations for display.

(6) Visibility (resin transparency);
The surface-treated copper foil is coated with a polyimide film (Kaneka thickness 50 μm (Pixeo for double-layer copper-clad laminate (PIXEO) (polyimide type: FRS), adhesive layer for copper-clad laminate) from the surface side where the surface treatment is performed. A polyimide film and a PMDA (pyromellitic anhydride) -based polyimide film (PMDA-ODA (4,4′-diaminodiphenyl ether) -based polyimide film)) are bonded to both surfaces, and the surface-treated copper foil is etched (chlorinated chloride). A sample film was prepared by removing with a ferric aqueous solution. In addition, when the surface-treated copper foil is an ultrathin copper layer of the copper foil with carrier, the copper foil with carrier is bonded to both sides of the polyimide film from the surface side where the surface treatment of the ultrathin copper layer is performed, Then, after peeling a carrier, the ultra-thin copper layer was removed by etching (ferric chloride aqueous solution), and the sample film was produced. A printed material (black circle with a diameter of 6 cm) was attached to one surface of the obtained resin layer, and the visibility of the printed material was judged from the opposite surface through the resin layer. “◎” indicates that the outline of the black circle of the printed material is clear when the length is 90% or more of the circumference, and “Clear” indicates that the outline of the black circle is clear when the length is 80% or more and less than 90% of the circumference. “O” (passed above), a black circle with a clear outline of 0 to less than 80% of the circumference and a broken outline were evaluated as “x” (failed).

(7) Peel strength (adhesive strength);
Based on IPC-TM-650, the normal peel strength was measured with a tensile tester Autograph 100, and a normal peel strength of 0.7 N / mm or more could be used for laminated substrates. The peel strength was measured with a copper foil thickness of 12 μm. About the copper foil whose thickness is less than 12 micrometers, copper plating was performed and copper foil thickness was 12 micrometers. Moreover, when thickness was larger than 12 micrometers, it etched and copper foil thickness was 12 micrometers. For the measurement of the peel strength, a Kaneka-made polyimide film with a thickness of 50 μm (Pixeo for double-layer copper-clad laminate (PIXEO) (polyimide type: FRS), polyimide film with an adhesive layer for copper-clad laminate, PMDA (Pyro) Merit anhydride) -based polyimide film (PMDA-ODA (4,4′-diaminodiphenyl ether) -based polyimide film))) and the surface-treated surface of the surface-treated copper foil according to Examples and Comparative Examples of the present invention. A laminated sample was used. During measurement, the polyimide film is fixed to a hard substrate (stainless steel plate or synthetic resin plate (which does not have to be deformed during peel strength measurement)) with double-sided tape or instant adhesive. did. In Examples 11 to 14, the surface-treated copper foil (ultra-thin copper layer) was applied to the polyimide film (Kaneka thickness 50 μm (PIXEO for double-layer copper-clad laminate (PIXEO)) from the surface side where the surface treatment was performed. ) (Polyimide type: FRS), polyimide film with adhesive layer for copper-clad laminates, PMDA (pyromellitic anhydride) based polyimide film (PMDA-ODA (4,4'-diaminodiphenyl ether) based polyimide film)) ), The carrier was peeled off, and the peel strength was measured after copper plating was performed so that the thickness of the ultrathin copper layer laminated with the polyimide film was 12 μm.

(8) heat resistance;
The surface-treated copper foil is coated with a polyimide film (Kaneka thickness 50 μm (Pixeo for double-layer copper-clad laminate (PIXEO) (polyimide type: FRS), adhesive layer for copper-clad laminate) from the surface side where the surface treatment is performed. After bonding to a polyimide film, a PMDA (pyromellitic anhydride) -based polyimide film (PMDA-ODA (4,4′-diaminodiphenyl ether) -based polyimide film)), after heating at 150 ° C. for 168 hours, the IPC In accordance with -TM-650, the normal peel strength and the peel strength after heating for 168 hours were measured with a tensile tester Autograph 100.
And the peel strength retention represented by following Formula was computed.
Peel strength retention (%) = 150 ° C., 168 hours after heating peel strength (kg / cm) / normal peel strength (kg / cm) × 100
When the peel strength retention is 70% or more, the heat resistance is “◎”, and when the peel strength retention is 60% or more and less than 70%, the heat resistance is “◯” and the peel strength retention is 50% or more 60. When it was less than%, the heat resistance was “Δ”, and when the peel strength retention was less than 50%, the heat resistance was “x”. In addition, about Examples 11-14, after sticking a surface treatment copper foil (ultra thin copper layer) from the surface side where surface treatment is performed to a polyimide film (Kaneka thickness 50 micrometers), a carrier is exfoliated, Peel strength was measured after copper plating was performed so that the ultrathin copper layer laminated with the polyimide film had a thickness of 12 μm.

(9) Solder heat resistance evaluation;
The surface-treated copper foil is coated with a polyimide film (Kaneka thickness 50 μm (Pixeo for double-layer copper-clad laminate (PIXEO) (polyimide type: FRS), adhesive layer for copper-clad laminate) from the surface side where the surface treatment is performed. A polyimide film and a PMDA (pyromellitic anhydride) -based polyimide film (PMDA-ODA (4,4′-diaminodiphenyl ether) -based polyimide film))) were attached to both surfaces. About the obtained double-sided laminated board, the test coupon based on JISC6471 was created. The prepared test coupon was exposed to high temperature and high humidity of 85 ° C. and 85% RH for 48 hours, and then floated in a solder bath at 300 ° C. to evaluate solder heat resistance. After the solder heat resistance test, at the interface between the copper foil roughening surface and the polyimide resin adhesion surface, the area where the interface discolored due to blistering in an area of 5% or more of the copper foil area in the test coupon is x (failed), area When the color change was less than 5%, the case was evaluated as ◯, and the case where no color change occurred was evaluated as ◎.

(10) Yield The surface-treated copper foil is coated with a polyimide film (Kaneka thickness 50 μm (Pixeo for double-layer copper-clad laminate (PIXEO) (polyimide type: FRS), copper-clad laminate) from the surface side where the surface treatment is performed. Adhesive layer polyimide film, PMDA (pyromellitic anhydride) based polyimide film (PMDA-ODA (4,4'-diaminodiphenyl ether) based polyimide film))) and the copper foil etched ( FPC with a circuit width of L / S of 30 μm / 30 μm was prepared. After that, an attempt was made to detect a 20 μm × 20 μm square mark with a CCD camera through polyimide. “◎” when 9 times or more out of 10 times can be detected, “◯” when 7 to 8 times can be detected, “△” when 6 times can be detected, and when 5 times or less can be detected. Is “×”.
In addition, about Examples 11-14, after bonding surface treatment copper foil (ultra thin copper layer) on both surfaces of the polyimide film (Kaneka thickness 50 micrometers) from the surface side where surface treatment is performed, and peeling a carrier The yield was evaluated in the same manner as described above.

(11) Measurement of transmission loss After bonding the surface-treated copper foil with a commercially available liquid crystal polymer resin (Vecstar CTZ-50 μm manufactured by Kuraray Co., Ltd.) from the surface side where the surface treatment is performed, the characteristic impedance is etched. A microstrip line was formed so as to be 50Ω, and a transmission coefficient was measured using a network analyzer HP8720C manufactured by HP, and transmission loss at a frequency of 20 GHz and a frequency of 40 GHz was obtained. As an evaluation of transmission loss at a frequency of 20 GHz, を is less than 3.7 dB / 10 cm, を is 3.7 dB / 10 cm or more and less than 4.0 dB / 10 cm, ○ is 4.0 dB / 10 cm or more and less than 4.1 dB / 10 cm. 4.1 dB / 10 cm or more and less than 5.0 dB / 10 cm was evaluated as Δ, and 5.0 dB / 10 cm or more was evaluated as x.
In addition, when surface-treated copper foil was the ultra-thin copper layer of copper foil with a carrier, said measurement was performed about the surface where the surface treatment of the ultra-thin copper layer is performed.

(12) Adhesion amount of nickel and cobalt on the surface of the surface-treated copper foil The nickel adhesion amount and the cobalt adhesion amount on the surface where the surface treatment is performed are obtained by dissolving the sample with nitric acid having a concentration of 20% by mass. The measurement was performed by performing quantitative analysis by an atomic absorption method using an atomic absorption spectrophotometer (model: AA240FS). The size of the sample for measuring nickel and cobalt adhesion in the examples and comparative examples was 50 mm × 50 mm.
In addition, the measurement of the adhesion amount of nickel and cobalt on the surface subjected to the surface treatment was performed as follows. After prepreg (FR4) is heat-pressed and laminated on the surface of the surface-treated copper foil that has not been surface-treated, the surface of the surface-treated copper foil that has been surface-treated is dissolved by 2 μm in thickness. The adhesion amount of nickel and cobalt adhering to the surface of the copper foil subjected to the surface treatment was measured. And the adhesion amount of the obtained nickel and cobalt was made into the adhesion amount of the surface nickel and cobalt in which the surface treatment of the surface-treated copper foil is performed, respectively. It should be noted that the thickness of the surface-treated copper foil on the surface-treated side need not be exactly 2 μm, and it is clear that the entire surface-treated surface portion is dissolved (for example, , 1.5 to 2.5 μm) may be measured. In addition, when the surface-treated copper foil is an ultrathin copper layer of a copper foil with a carrier, first, the surface treatment of the ultrathin copper layer is performed after the prepreg (FR4) is first laminated on the surface on the carrier side by thermocompression bonding. Only the vicinity of the surface is dissolved (if the thickness of the ultra-thin copper layer is 1.4 μm or more, the surface of the ultra-thin copper layer is treated with a surface of 0. When the thickness of the ultrathin copper layer that dissolves only 5 μm thickness is less than 1.4 μm, only 20% of the thickness of the ultrathin copper layer dissolves from the surface on the surface treated with the ultrathin copper layer. The amount of nickel and cobalt deposited on the surface of the ultrathin copper layer that has been surface-treated is measured. And the adhesion amount of the obtained nickel and cobalt was made into the adhesion amount of the surface nickel and cobalt in which the surface treatment of the surface-treated copper foil is performed, respectively.
In addition, the said adhesion amount of nickel and cobalt says the adhesion amount (mass) of nickel and cobalt per sample unit area (1 dm < ² >).
In the printed wiring board or copper-clad laminate, the above-mentioned (1) surface roughness (Rz) and (2) root mean square of the surface of the copper circuit or copper foil surface are obtained by dissolving and removing the resin. Height Rq, (3) Area ratio (A / B) of copper foil surface, (12) Nickel and cobalt adhesion amount on the surface of surface-treated copper foil or copper circuit can be measured.

(13) Evaluation of copper foil wrinkles by laminating;
The surface-treated copper foils of Examples and Comparative Examples were laminated on both surfaces of a polyimide resin having a thickness of 25 μm from the one surface (surface-treated surface S) side, and the other surface of each surface-treated copper foil ( A state in which a 125 μm-thick protective film (made of polyimide) is laminated on the surface opposite to the surface treated surface S), that is, protective film / surface treated copper foil / polyimide resin / surface treated copper foil / protective film In a state of 5 layers, lamination processing was performed while applying heat and pressure using a laminate roll from the outside of both protective films, and surface-treated copper foil was bonded to both surfaces of the polyimide resin. Subsequently, after peeling off the protective films on both surfaces, visually observe the other surface of the surface-treated copper foil, confirm the presence or absence of wrinkles or lines, and when no wrinkles or lines occur at all, the length of the copper foil The case where only one wrinkle or streak was observed per 5 m was evaluated as “◯”, and the case where two or more wrinkles or streaks were observed per 5 m of the copper foil was evaluated as “x”.
The conditions and evaluation results of the above tests are shown in Tables 1 to 4.

(Evaluation results)
In each of Examples 1 to 20, the surface root-mean-square height Rq is in the range of 0.14 to 0.63 μm, Sv is 3.5 or more, and surface treatment is performed. When the surface contains Ni, the adhesion amount of Ni is 1400 μg / dm ² or less, and when the surface on which the surface treatment is performed contains Co, the adhesion amount of Co is 2400 μg / dm ² or less. Yes, visibility, peel strength, solder heat resistance evaluation and yield were good. Also, the transmission loss was small and good. In addition, the copper foils manufactured for Examples 1 and 2 and having thicknesses of 6 μm, 12 μm, and 35 μm had the same results as in Examples 1 and 2 having a thickness of 18 μm. That is, the copper foils manufactured for Examples 1 and 2 and having a thickness of 6 μm, 12 μm, and 35 μm all have a root mean square height Rq of 0.14 to 0.63 μm on the surface, and Sv is The visibility, peel strength, solder heat resistance evaluation, and yield were good.
In Comparative Example 1, the root mean square height Rq of the surface was less than 0.14 μm, and the peel strength and solder heat resistance were poor.
In Comparative Examples 2 to 5, the root mean square height Rq of the surface exceeded 0.63 μm, Sv was less than 3.5, and the visibility was poor.
In addition, the surface treatment is performed on both sides of the copper foil under the same conditions using the same copper foil as each of the above examples and comparative examples, and both sides of the carrier under the same conditions using the same carrier as the above examples, After the formation of the intermediate layer and the ultrathin copper layer, the same surface treatment was performed to produce a surface-treated copper foil, and as a result, the same evaluation results as in the above-mentioned Examples and Comparative Examples were obtained on both sides. In Example 2, the glossy surface of the copper foil (the surface on the side in contact with the drum during the production of the electrolytic copper foil) is subjected to electrolytic polishing and / or chemical polishing, whereby the TD roughness Rz and glossiness are obtained. Was made the same as the precipitation surface, and then a predetermined surface treatment was performed.
When surface treatment such as roughening treatment is performed on both surfaces of the copper foil, the surface treatment may be performed on both surfaces simultaneously, or the surface treatment may be separately performed on one surface and the other surface. In addition, when performing surface treatment on both surfaces simultaneously, it is good to perform surface treatment using the surface treatment apparatus (plating apparatus) which provided the anode on both surfaces side of copper foil. In this example, surface treatment was performed on both sides simultaneously.
Further, the ten-point average roughness Rz of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the surface of the copper foil subjected to the surface treatment of Examples 4 to 20 (surface treatment surface S) was 0. It was 35 μm or more. Moreover, arithmetic mean roughness Ra of TD measured with the laser microscope whose wavelength of the laser beam of the copper foil surface (surface treatment surface S) by which the surface treatment of Examples 4-20 was performed is 405 nm, all are 0.05 micrometer. That was all. Moreover, the root mean square height Rq of TD measured with the laser microscope whose wavelength of the laser beam of the copper foil surface (surface treatment surface S) by which the surface treatment of Examples 4-20 was carried out is 405 nm. It was 08 μm or more.
FIG. 4 shows (a) Comparative Example 1, (b) Example 1, (c) Example 2, (d) Example 3, (e) Example 4, and (f) in the Rz evaluation. Example 5, (g) Example 6, (h) Example 7, (i) Example 8, (j) Example 9, (k) Comparative Example 2, (l) SEM of the copper foil surface of Comparative Example 3 Each observation photograph is shown.
In Examples 1 to 20, the width of the mark is 0.3 mm to 0.16 mm (the third mark from the side closer to the description of 0.5 of the area 0.5 mm ² of the contaminant sheet (see FIG. 10). The same Sv value was measured after changing to the mark indicated by the arrow)), but in all cases, the Sv value was the same as that when the mark width was 0.3 mm.
Furthermore, in Examples 1 to 20 above, with respect to the “top average value Bt of the lightness curve”, positions 50 μm away from the end positions on both sides of the mark are taken as positions 100 μm apart, 300 μm apart, and 500 μm apart. From this position, the same Sv value was measured by changing to the average value of the brightness when measured at 5 locations (10 locations on both sides in total) at 30 μm intervals, but both Sv values were measured on both sides of the mark. The same value as the Sv value when the average value of brightness when measuring 5 locations at a distance of 30 μm from a position 50 μm away from the edge position of the sample (total 10 locations on both sides) is the “top average value Bt of the brightness curve” became.

Claims (30)

One copper foil surface and / or both copper foil surfaces are surface-treated surfaces S, and the root-mean-square height Rq measured by a laser microscope having a laser light wavelength of 405 nm is 0. .14 to 0.63 μm of surface-treated copper foil,
After bonding the copper foil from the surface treated surface S side to both sides of the polyimide resin substrate, the copper foil on both sides is removed by etching,
When a printed matter on which a line-shaped mark is printed is laid under the exposed polyimide substrate, and the printed matter is photographed with a CCD camera through the polyimide substrate,
For the image obtained by the photographing, an observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed line-shaped mark extends,
The difference between the top average value Bt and the bottom average value Bb of the lightness curve generated from the end of the mark to the part where the mark is not drawn is ΔB (ΔB = Bt−Bb), and the lightness in the observation point-lightness graph The value indicating the position of the intersection closest to the line-shaped mark among the intersections of the curve and Bt is t1, and the brightness is within a depth range from the intersection of the brightness curve and Bt to 0.1 ΔB with reference to Bt. When the value indicating the position of the intersection closest to the line-shaped mark among the intersections of the curve and 0.1ΔB is t2, Sv defined by the following equation (1) is 3.5 or more, The surface-treated surface S contains one or more elements selected from the group consisting of Ni and Co. When the surface-treated surface S contains Ni, the amount of Ni deposited is 1000 μg / dm ² or less. The surface treated surface S is A surface-treated copper foil in which the amount of Co deposited is 2000 μg / dm ² or less when Co is contained.
Sv = (ΔB × 0.1) / (t1-t2) (1) ^2. The surface-treated copper foil according to claim 1 , wherein when the surface-treated surface S contains Ni, the adhesion amount of Ni is 100 μg / dm ² or more. 3. The surface-treated copper foil according to claim 1, wherein when the surface-treated surface S contains Co, the adhesion amount of Co is 300 μg / dm ² or more. The surface treatment according to any one of claims 1 to 3 , wherein the root mean square height Rq measured with a laser microscope having a laser beam wavelength of 405 nm on the surface-treated surface S is 0.25 to 0.60 µm. Copper foil. The surface-treated copper foil as described in any one of Claims 1-4 in which Sv defined by (1) Formula in the said brightness curve becomes 3.9 or more. The surface-treated copper foil according to claim 5 , wherein Sv defined by the formula (1) in the brightness curve is 5.0 or more. The surface-treated copper foil according to any one of claims 1 to 6 , wherein a ten-point average roughness Rz of TD measured with a contact-type roughness meter of the surface-treated surface S is 0.20 to 0.64 µm. The surface-treated copper foil according to claim 7 , wherein the ten-point average roughness Rz of TD measured by a contact-type roughness meter of the surface-treated surface S is 0.26 to 0.62 μm. The surface-treated copper foil according to any one of claims 1 to 8 , wherein a ratio A / B between the three-dimensional surface area A and the two-dimensional surface area B of the surface-treated surface S is 1.0 to 1.7. The surface-treated copper foil according to claim 9 , wherein a ratio A / B of the three-dimensional surface area A and the two-dimensional surface area B of the surface-treated surface S is 1.0 to 1.6. The treated surface S is, copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, according to any one of claims 1 to 10 including chromium and any one or more selected from the group consisting of zinc Surface treated copper foil. Surface treated copper foil according to any one of claims 1 to 11 with a resin layer on the treated surface S. The surface-treated copper foil of Claim 12 in which the said resin layer contains a dielectric material. Carrier, intermediate layer, ultra-thin copper layer to a copper foil with carrier having in this order, the carrier copper foil is a surface treated copper foil according to the ultrathin copper layer is any one of claims 1 to 13 . The copper foil with a carrier of Claim 14 provided with the said ultra-thin copper layer on both surfaces of the said carrier. Treated copper foil or claim 14 or laminate produced by laminating a copper foil and a resin substrate with a carrier according to 15 according to any one of claims 1 to 13. Treated copper foil or claim 14 or 15 printed wiring board using the copper foil with carrier according to according to any one of claims 1 to 13. An electronic device using the printed wiring board according to claim 17 . A method for manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards according to claim 17 . At least one printed circuit board according to claim 17, comprising at least the step of connecting the printed circuit board which does not correspond to the printed wiring board according to the printed wiring board or claim 17 according to another claim 17 A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected. An electronic apparatus using one or more printed wiring boards produced by the method according to claim 19 or 20 . Printed wiring board according to claim 17, or a method of manufacturing the printed wiring board manufactured by the method according to claim 19 or 20, comprising at least a step of connecting the components, the printed wiring board. At least one printed circuit board according to claim 17, the printed wiring board by connecting the printed circuit board which does not correspond to the printed wiring board according to the printed wiring board or claim 17 according to another claim 17 Manufacturing A, and
A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected, including at least a step of connecting the printed wiring board A and a component. The printed wiring board according to claim 17 ,
A printed wiring board produced by the method according to claim 19 or 20 , and
Printed wiring board does not correspond to any of the printed wiring board manufactured by the method according to the printed wiring board or claim 19 or 20 according to claim 17,
One or more printed wiring boards selected from the group consisting of:
A printed wiring board manufactured by the method according to claim 22 ;
A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected. A step of preparing the carrier-attached copper foil according to claim 14 or 15 and an insulating substrate,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the carrier-attached copper foil and the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method. Forming a circuit on the ultrathin copper layer side surface or the carrier side surface of the copper foil with carrier according to claim 14 or 15 ,
Forming a resin layer on the ultrathin copper layer side surface or the carrier side surface of the copper foil with carrier so that the circuit is buried;
Forming a circuit on the resin layer;
After forming a circuit on the resin layer, peeling the carrier or the ultra-thin copper layer; and
After the carrier or the ultra-thin copper layer is peeled off, the ultra-thin copper layer or the carrier is removed to be buried in the resin layer formed on the ultra-thin copper layer-side surface or the carrier-side surface. A method of manufacturing a printed wiring board including a step of exposing a circuit that is connected. The step of forming a circuit on the resin layer comprises bonding another copper foil with a carrier on the resin layer from the ultrathin copper layer side, and using the copper foil with a carrier bonded to the resin layer, 27. The method for manufacturing a printed wiring board according to claim 26 , wherein the method is a forming step. The method for producing a printed wiring board according to claim 27 , wherein another copper foil with a carrier to be bonded onto the resin layer is the copper foil with a carrier according to claim 14 or 15 . The print according to any one of claims 26 to 28 , wherein the step of forming a circuit on the resin layer is performed by any one of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive method. A method for manufacturing a wiring board. Copper foil with carrier to form a circuit on the surface, to any one of claims 26 to 29 having a substrate or a resin layer on the surface of the surface or the ultra-thin copper layer-side of the carrier of the copper foil with the carrier The manufacturing method of the printed wiring board of description.