JP5743598B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device including a touch panel device.

  In electronic devices such as portable terminal devices, the number of devices that employ a touch panel as an input mechanism is rapidly increasing. The touch panel includes a resistive film type, an optical type, a capacitance type, an ultrasonic type, and an electromagnetic induction type. Among these, the resistive film method and the capacitance method have a feature that they are relatively low cost and can be easily reduced in thickness and weight, and are widely used particularly in portable terminal devices. In portable terminal devices, many combinations of a liquid crystal display (LCD) and a touch panel have been proposed.

  In recent years, portable terminal devices have been widely used by individuals and companies due to the enhancement of communication services and the decrease in communication charges. In mobile terminal devices, not only calls (sending / receiving voice) but also Internet access and use of e-mail are rapidly increasing, and the area of the LCD is expanding due to an increase in the number of display characters. In addition, since portable terminal devices are becoming lighter, thinner, and smaller, the ratio of LCDs to the overall size of the devices is increasing, and demand for portable terminal devices combining LCDs and touch panels is increasing. Yes.

  An LCD driver chip for controlling the driving and display of the LCD is connected to the LCD. As this connection method, TAB (Tape Auto Bonding), COF (Chip on Film), COG (Chip on Glass), etc. are generally known. For mobile communication devices such as mobile phone devices, the thickness and mounting area are reduced. Since there are few, it is common to employ | adopt a COG system.

  LCDs are made by enclosing a liquid crystal material between two glass plates and attaching polarizing plates to the front and back of the combined glass. Transparent electrodes (ITO; Indium-Tin Oxide) are placed on the inner surface of each glass plate. ), And the electrode portion used for IC connection by the TAB, COF, and COG methods needs to expose the transparent electrode, and thus has a structure with only one glass plate.

  In such an electronic device, means for protecting a liquid crystal display, a driver chip, and the like from an external impact or the like is disclosed (for example, see Patent Document 1).

  The electro-optical device described in Patent Literature 1 includes a display panel and a frame that holds the display panel. The frame is formed of a metal frame and a resin, and the metal frame has a part of a side surface. The display panel has a protruding portion exposed from the resin on the display surface side.

JP 2009-69335 A

  The following analysis is given from the perspective of the present invention.

  FIG. 8 is a schematic cross-sectional view for explaining the problem to be solved by the present invention. In FIG. 8, the end 921a of the touch panel 921 is located on the LCD driver chip 913. In the electro-optical device described in Patent Document 1, the end of the substrate of the liquid crystal panel is positioned on the driver IC. In such a form, when a local impact force is applied to the electronic device from the outside, the end 921a of the touch panel 921 comes into contact with the driver chip 913 (circled portion in FIG. 8). As a result, the driver chip 913, the first glass plate 911, and the touch panel 920 may be damaged.

According to the 1st viewpoint of this invention, an electronic device provided with the touchscreen module which has a touchscreen, and a display module is provided. The display module is mounted on the same side as the second substrate in a region where the first substrate, the second substrate superimposed on a part of the first substrate, and the second substrate on the first substrate do not overlap, And a buffer material disposed on the first substrate and protecting the driver chip from contact between the driver chip and the touch panel. The touch panel module and the display module are arranged so that the touch panel and the second substrate face each other. The buffer material is disposed in a region where the second substrate is not overlapped and other than the driver chip mounting region.

  In the present invention, by disposing the buffer material around the driver chip, it is possible to prevent the driver chip and the display module from being damaged due to the contact between the touch panel module and the driver chip. Thereby, the reliability of an electronic device can be improved.

1 is a schematic partial cross-sectional view of an electronic device according to a first embodiment of the present invention. FIG. 2 is a schematic exploded perspective view of the electronic device shown in FIG. 1. FIG. 6 is a schematic partial cross-sectional view of an electronic device according to a second embodiment of the present invention. FIG. 4 is a schematic exploded perspective view of the electronic device shown in FIG. 3. FIG. 5 is a schematic plan view of some elements shown in FIGS. 3 and 4. FIG. 10 is a schematic partial cross-sectional view of an electronic apparatus according to a third embodiment of the present invention. FIG. 7 is a schematic exploded perspective view of the electronic device shown in FIG. 6. 1 is a schematic cross-sectional view for explaining a problem to be solved by the present invention.

  An electronic apparatus according to a first embodiment of the present invention will be described. FIG. 1 is a schematic partial cross-sectional view of an electronic apparatus according to the first embodiment of the present invention. FIG. 2 is a schematic exploded perspective view of the electronic apparatus according to the first embodiment of the present invention. The electronic device includes a display module 110, a touch panel module 120, and a frame 131. As the display, LCD, organic EL (Electro Luminescence), etc. can be used. In the following description, an LCD will be described as an example.

  The LCD module 110 includes an overlapped first substrate 111 and second substrate 112, a liquid crystal material (not shown) sealed between the first substrate 111 and the second substrate 112, the first substrate 111 and the second substrate 112. A polarizing plate (not shown) attached to the substrate 112, a driver chip 113 for controlling the operation (driving and display) of the LCD mounted on the first substrate 111 by COG (Chip on Glass) technology, and a driver A buffer material 114 for protecting the chip 113 and a backlight module 115 for illuminating the first substrate 111 and the second substrate 112 are provided. The first substrate 111 and the second substrate 112 have a base material such as tempered glass, and a transparent electrode film (not shown) such as ITO (Indium Tin Oxide) formed on the opposing surfaces. The first substrate 111 partially overlaps the second substrate 112. The driver chip 113 is mounted on a region of the first substrate 111 where the second substrate 112 does not overlap, that is, a region of the first substrate 111 exposed from the second substrate 112. The driver chip 113 is mounted on the same side as the second substrate with respect to the first substrate 111 so as to face the touch panel module 120. The backlight module 115 is disposed on the surface of the first substrate 111 opposite to the side on which the second substrate 112 is disposed.

  The touch panel module 120 includes a touch panel 121, a screen member 122 such as tempered glass and transparent resin for protecting the touch panel 121 and the LCD module 110, and an anti-scattering film 123 that prevents scattering of fragments when the screen member 122 is damaged. And having. The touch panel 121 includes a base material such as tempered glass or transparent resin, and a transparent electrode film such as ITO. As the scattering prevention film 123, for example, polyethylene terephthalate (PET) can be used. In the form shown in FIG. 1, the end 121 a of the touch panel 121 is located on the driver chip 113.

  The LCD module 110 and the touch panel module 120 are arranged so that the second substrate 112 and the touch panel 121 face each other. The touch panel 121 covers at least a part of the second substrate 112 and the driver chip 113. That is, the touch panel 121 and at least a part of the second substrate 112 and the driver chip 113 face each other.

  The frame 131 is for holding the LCD module 110 and the touch panel module 120. The frame 131 has a frame portion 131a formed of resin or the like and a seat portion 131b formed of sheet metal surrounded by the frame portion 131a. In the form shown in FIG. 1, the touch panel module 120 is held by the frame portion 131a, and the LCD module 110 is disposed on the seat portion 131b.

  The buffer material 114 is disposed on at least a part of the periphery of the driver chip 113 on the first substrate 111. In the form shown in FIG. 1 and FIG. 2, a buffer material is provided around the driver chip 113 except for the area facing the second substrate 112 in the driver chip 113, that is, between the driver chip 113 and the second substrate 112. 114 is arranged. Since the cushioning material 114 prevents direct contact between the touch panel 121 and the driver chip 113 when an external force is applied to the electronic device, it is preferable that the edge 121a of the touch panel 121 and the cushioning material 114 overlap in the planar projection. . In the form shown in FIGS. 1 and 2, the buffer material 114 is not formed on the driver chip 113, that is, does not cover the driver chip 113. The shape of the buffer material 114 is a U-shape that lacks the area of the driver chip 113.

In FIG. 1, the thickness (height) of the buffer material 114 is T ₁ , the thickness (height) of the driver chip 113 is T ₂ , and the thickness (height) of the second substrate 112 is T ₃ . To prevent direct contact between the driver chip 113 and the touch panel 121, the thickness _{T 1} of the cushioning member 114 and the thickness of the driver chip 113 is greater than _{T 2} preferably. Further, in order to maintain a thin, thickness T ₁ of the cushioning member 114 is the thickness of the second substrate 112 (height) less than T ₃ preferred.

  The material of the buffer material 114 is preferably a material that can absorb an impact. For example, the buffer material 114 preferably includes a material having a vibration frequency of 100 Hz or more and a loss coefficient tan δ of 0.5 or more at 20 ° C. Further, the material of the buffer material 114 is desirably rubber hardness A30 to A50 degrees. Rubber hardness is measured according to JISK6253. For example, as the buffer material 114, a vibration absorbing elastomer Miyafreq-ST Hs30 (manufactured by Miyasaka Rubber Co., Ltd.) can be used.

  According to the present embodiment, even if a local external impact is applied to the electronic device, the buffer material 114 can prevent direct contact between the touch panel module 120 and the driver chip 113. Thereby, damage to the touch panel module 120, the driver chip 113, and the first substrate 111 can be prevented.

  An electronic apparatus according to a second embodiment of the present invention will be described. FIG. 3 shows a schematic partial cross-sectional view of an electronic apparatus according to the second embodiment of the present invention. FIG. 4 shows a schematic exploded perspective view of an electronic apparatus according to the second embodiment of the present invention. FIG. 5 shows a schematic plan view of some of the elements shown in FIGS. 3 and 4, the same elements as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the second embodiment, the frame 131 does not support the region where the driver chip 113 is disposed. 3 and 4, the seat 131b of the frame 131 is not formed on the entire surface. The region where the seat 131b is not formed becomes a gap 131c of the frame 131. In FIG. 4, the gap 131c is hatched. In FIG. 5, the first substrate 111, the second substrate 112, the driver chip 113, and the buffer material 114 are indicated by thick lines, and the frame portion 131a, the seat portion 131b, and the gap portion 131c are indicated by thin lines.

The gap 131c is preferably formed in a region where the driver chip 113 is disposed. That is, it is preferable that the gap 131c overlaps with the driver chip 113 in the planar projection. In addition, it is more preferable that the gap 131c overlaps a region of the first substrate 111 where the second substrate 112 does not overlap in the planar projection. In the form shown in FIG. 3, the gap 131 c is at least a region from the end 111 a of the first substrate 111 to the end 112 a of the second substrate 112. Furthermore, it is more preferable that the gap 131c partially overlaps the second substrate 112 in the planar projection. For example, gap portion 131c and the second substrate 112, in order to relax the stress applied to the end portion 112a portion of the second substrate 112 in the first substrate 111, overlap the distance _{d 1} from the end portion 112a of the second substrate 112 It is more preferable. Distance _{d 1} can be set to, for example, 0Mm～3mm. If the overlap region between the gap 131c and the second substrate 112 is too large, the rigidity is lowered.

  According to the second embodiment, since the seat portion 131b is not formed below the driver chip 113 and the area where the first substrate 111 and the second substrate 112 do not overlap, a local external force is applied to the electronic device. Even so, the driver chip 113 and the first substrate 111 can relieve the pressure exerted by the touch panel module. Thereby, damage to the driver chip 113 and the first substrate 111 can be suppressed.

  In the above description, the mode in which the cushioning material 114 and the gap 131c are combined has been described. However, a mode in which the gap 131d is provided and the cushioning material 114 is not provided may be used. Can be suppressed.

  Other aspects of the second embodiment are the same as those of the first embodiment.

  An electronic apparatus according to a third embodiment of the present invention will be described. FIG. 6 shows a schematic partial cross-sectional view of an electronic apparatus according to the third embodiment of the present invention. FIG. 7 shows a schematic exploded perspective view of an electronic apparatus according to the third embodiment of the present invention. 6 and 7, the same elements as those in FIGS. 1 and 2 are denoted by the same reference numerals.

In the third embodiment, in addition to the second embodiment, the electronic device further includes a reinforcing material 116 formed on the end 112a of the second substrate 112 on the first substrate 111. The reinforcing material 116 reinforces the bonding force between the upper surface of the first substrate 111 and the side surface of the second substrate 112. The height T ₄ of the reinforcing material 116 on the first substrate 111 is preferably lower than the height T ₃ of the second substrate 112. As the reinforcing material 116, for example, a thermosetting resin, a thermoplastic resin, a room temperature curable resin (for example, EP001N (manufactured by Cemedine Co., Ltd.)), or an ultraviolet curable resin can be used.

  According to the third embodiment, since the bonding force between the first substrate 111 and the end portion 112a of the second substrate 112 is strengthened, a local external force is applied to the electronic device, and the first substrate 111 is stressed. Even if this happens, the rapid deformation of the first substrate 111 can be mitigated to prevent damage.

  In the above description, the mode in which the cushioning material 114, the gap portion 131c, and the reinforcing material 116 are combined has been described. Can be prevented from being damaged. Similarly, the buffer material 114 and the reinforcing material 116 may be provided and the gap portion 131c may not be provided, or the reinforcing material 116 and the gap portion 131c may be provided and the buffer material 114 may not be provided.

  Other aspects of the third embodiment are the same as in the first embodiment.

  The electronic device of the present invention has been described based on the above embodiment, but is not limited to the above embodiment, and is within the scope of the present invention and based on the basic technical idea of the present invention. It cannot be overemphasized that various deformation | transformation, a change, and improvement with respect to a form can be included. Further, various combinations, substitutions, or selections of various disclosed elements are possible within the scope of the claims of the present invention.

  Further problems, objects, and developments of the present invention will become apparent from the entire disclosure of the present invention including the claims.

  The present invention can be applied to an electronic device including a touch panel, such as a mobile phone, a portable audio device, a portable game machine, and a small personal computer.

  A part or all of the above embodiment may be described as in the following supplementary notes, but is not limited to the following description.

(Appendix 1)
A touch panel module having a touch panel;
A display module,
The display module has a first substrate, a second substrate superimposed on a part of the first substrate, and a region on the first substrate on the same side as the second substrate in a region where the second substrate does not overlap. A driver chip that controls the operation of the display module, and a buffer material that protects the driver chip from contact with the driver chip and the touch panel;
The electronic device, wherein the touch panel module and the display module are arranged so that the touch panel and the second substrate face each other.

(Appendix 2)
2. The electronic apparatus according to claim 1, wherein the buffer material is disposed at least at a part of the periphery of the driver chip on the first substrate.

(Appendix 3)
The electronic apparatus according to appendix 1 or 2, wherein the cushioning material covers the periphery of the driver chip other than the region facing the second substrate.

(Appendix 4)
4. The electronic device according to claim 1, wherein a thickness of the buffer material is equal to or greater than a thickness of the driver chip.

(Appendix 5)
5. The electronic device according to claim 1, wherein a thickness of the buffer material is equal to or less than a thickness of the second substrate.

(Appendix 6)
The electron according to any one of appendices 1 to 5, wherein the buffer material includes a material having a vibration frequency of 100 Hz or more and a loss coefficient tan δ of 0.5 or more at 20 degrees Celsius. machine.

(Appendix 7)
7. The electronic device according to any one of appendices 1 to 6, wherein the buffer material has a rubber strength measured in accordance with JISK6253 from A30 degrees to A50 degrees.

(Appendix 8)
A touch panel module having a touch panel;
A display module;
A frame for holding the touch panel module and the display module,
The display module has a first substrate, a second substrate superimposed on a part of the first substrate, and a region on the first substrate on the same side as the second substrate in a region where the second substrate does not overlap. A driver chip mounted and controlling the operation of the display module;
The touch panel module and the display module are arranged so that the touch panel and the second substrate face each other.
The frame includes a frame portion that supports the touch panel module, and a seat portion that supports the display module,
The electronic device, wherein the seat portion is not formed in a region overlapping with the driver chip in planar projection.

(Appendix 9)
A frame for holding the touch panel module and the display module;
The frame includes a frame portion that supports the touch panel module, and a seat portion that supports the display module,
The electronic device according to any one of appendices 1 to 7, wherein the seat portion is not formed in a region overlapping with the driver chip in planar projection.

(Appendix 10)
The electronic apparatus according to appendix 8 or 9, wherein the seat portion is not formed in a region of the first substrate where the second substrate does not overlap in planar projection.

(Appendix 11)
Supplementary notes 8 to 10, wherein the seat portion is not formed in a region where the second substrate does not overlap in the first substrate and in a range within 3 mm from the end portion of the second substrate from the region. The electronic device as described in any one of.

(Appendix 12)
A touch panel module having a touch panel;
A display module,
The display module has a first substrate, a second substrate superimposed on a part of the first substrate, and a region on the first substrate on the same side as the second substrate in a region where the second substrate does not overlap. A driver chip that is mounted and controls the operation of the display module; and a reinforcing material that increases the bonding force between the upper surface of the first substrate and the side surface of the second substrate;
The electronic device, wherein the touch panel module and the display module are arranged so that the touch panel and the second substrate face each other.

(Appendix 13)
The electronic device according to any one of appendices 1 to 11, further comprising a reinforcing material that increases a bonding force between the upper surface of the first substrate and the side surface of the second substrate.

(Appendix 14)
14. The electronic apparatus according to appendix 12 or 13, wherein the reinforcing material is formed lower than a thickness of the second substrate.

(Appendix 15)
The electronic device according to any one of Additional Notes 12 to 14, wherein the reinforcing material is a resin.

DESCRIPTION OF SYMBOLS 110 LCD module 111 1st board | substrate 111a edge part 112 2nd board | substrate 112a edge part 113 Driver chip 114 Buffer material 115 Backlight module 116 Reinforcement material 120 Touch panel module 121 Touch panel 121a Edge part 122 Screen member 123 Scattering prevention film 131 Frame 131a Frame part 131b Seat 131c Gap 910 LCD module 911 First glass plate 912 Second glass plate 913 LCD driver chip 920 Touch panel module 921 Touch panel 921a End 922 Screen glass

Claims (10)

A touch panel module having a touch panel;
A display module,
The display module has a first substrate, a second substrate superimposed on a part of the first substrate, and a region on the first substrate on the same side as the second substrate in a region where the second substrate does not overlap. A driver chip that is mounted and controls the operation of the display module ; and a buffer material that is disposed on the first substrate and protects the driver chip from contact between the driver chip and the touch panel;
The touch panel module and the display module are arranged so that the touch panel and the second substrate face each other .
The electronic apparatus according to claim 1, wherein the cushioning material is disposed in a region where the second substrate is not overlapped and other than the mounting region of the driver chip .   2. The electronic apparatus according to claim 1, wherein the buffer material is disposed on at least a part of the periphery of the driver chip on the first substrate.   3. The electronic device according to claim 1, wherein the buffer material covers a periphery of the driver chip other than a region facing the second substrate. 4.   4. The electronic device according to claim 1, wherein a thickness of the buffer material is equal to or greater than a thickness of the driver chip and equal to or less than a thickness of the second substrate.   5. The buffer material according to claim 1, wherein the buffer material includes a material having a vibration frequency of 100 Hz or more and a loss coefficient tan δ of 0.5 or more at 20 degrees Celsius. Electronics.   The electronic device according to any one of claims 1 to 5, wherein the buffer material has a rubber strength measured in accordance with JISK6253 from A30 degrees to A50 degrees. A frame for holding the touch panel module and the display module;
The frame includes a frame portion that supports the touch panel module, and a seat portion that supports the display module,
The electronic device according to claim 1, wherein the seat portion is not formed in a region overlapping with the driver chip in planar projection.   The electronic apparatus according to claim 7, wherein the seat portion is not formed in a region of the first substrate where the second substrate does not overlap in planar projection. 9. The seat portion is not formed in a region of the first substrate where the second substrate does not overlap and a region within 3 mm from an end of the second substrate on the region side. The electronic device as described in.   The electronic apparatus according to claim 1, further comprising a reinforcing material that increases a bonding force between an upper surface of the first substrate and a side surface of the second substrate.

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