JP5634108B2 - Optical sheet, light source module, lighting device using light source module, liquid crystal display device, and video display device - Google Patents

Description

  The present invention relates to an optical sheet, a light source module, an illumination device using the light source module, a liquid crystal display device, and an image display device.

  Conventionally, a light source in which an LED chip is sealed with a transparent resin performs light extraction using directly emitted light from the resin and reflected light inside the resin.

  Patent Document 1 discloses the following configuration. A direct emission region that directly emits light of the light emitting element to the outside and a total reflection region that totally reflects the light of the light emitting element are formed at the front interface of the mold resin that seals the light emitting element. The direct emission region is formed in a convex lens shape. A light reflecting portion having a concave mirror shape is provided on the back surface of the mold resin. A part of the light emitted from the light emitting element is emitted forward by receiving a lens action when passing directly through the emission region. Another part of the light emitted from the light emitting element is totally reflected by the total reflection region, then reflected by the light reflecting portion, and emitted forward from the total reflection region. Like the convex surface for taking out directly emitted light and the concave surface of the light reflecting portion after being totally reflected, light is condensed by the interface of the concavo-convex structure with thickness.

JP 2002-94129 A

  An object of the present invention is to provide a light source module having a light collecting and diffusing function with a thin structure for light extraction, and an illumination device, a liquid crystal display device, and an image display device using the light source module.

The features of the present invention for solving the above-described problems are as follows.
(1) A wiring board, a point light source disposed on the wiring board, and a transparent structure that is formed on the wiring board and covers the point light source, on the light emitting side of the transparent structure A plurality of convex portions are formed on the surface, and the plurality of convex portions are formed by alternately forming the first surface and the second surface, and each of the plurality of convex portions is the first surface Two conical surfaces formed by moving a half line from the point light source toward the light emitting side surface of the transparent structure are formed as a first cone. A surface and a second conical surface, and the distance between the bullet-shaped or flat light extraction surface and the point light source changes toward the perpendicular of the wiring board passing through the point light source, and the first surface is A portion of the light extraction surface is similar along the first conical surface and the second conical surface The second surface is a part of the first conical surface or the second conical surface, and the plurality of convex portions are arranged on the light emitting side of the transparent structure. A light source module characterized by being arranged in a plane on the surface.
(2) In the light source module according to (1), the plurality of convex portions include convex portions that are symmetric with respect to a perpendicular of the wiring board passing through the point light source.
(3) In the above (1), the plurality of convex portions have different shape ratios with respect to two axes orthogonal to each other on the wiring board plane, and are symmetrical with respect to the perpendicular of the wiring board passing through the point light source. The light source module characterized by including the convex part which becomes.
(4) In the above (2) or (3), the direction in which the intensity of the light distribution pattern from the point light source is maximized is a central axis, and the central axis is perpendicular to the normal of the wiring board passing through the point light source. A light source module that is tilted.
(5) In any one of (1) to (4), there are a plurality of light extraction surfaces, and one of the plurality of light extraction surfaces is discretely selected, and each of the plurality of convex portions is A light source module formed.
(6) In any one of the above (1) to (5), the transparent structure includes a sealing portion and an interface forming portion, the sealing portion covers the point light source, and the plurality of the interface forming portions include The light source module is characterized in that a convex portion is formed.
(7) In the above (6), an air layer is formed between the sealing part and the interface forming part, the air layer has a spherical shell shape, and the sealing part is formed at the center of the air layer. A light source module that is arranged.
(8) The light source module according to (6), wherein an adhesive layer is formed between the sealing portion and the interface forming portion.
(9) In any one of the above (1) to (8), the point light source is composed of a transparent resin in which an LED chip and a phosphor are dispersed, and the LED chip is covered with the transparent resin. module.
(10) In any one of the above (1) to (8), the point light source includes an LED chip, a first transparent resin that does not include a phosphor, and a second transparent resin in which the phosphor is dispersed. The transparent resin covers the LED chip, and the second transparent resin covers the first transparent resin.
(11) The light source module according to any one of the above (1) to (10), wherein a flat region is partially formed on the light emitting side surface of the transparent structure.
(12) The light source module according to (11), wherein the flat region is formed at a central portion or a peripheral portion of the transparent structure.
(13) The light source module according to any one of (1) to (12), wherein each of the plurality of convex portions has the same thickness.
(14) The light source module according to any one of (1) to (13), wherein a plurality of the light source modules are arranged to form a surface light source.
(15) In the illumination device having the light source module according to any one of (1) to (14), a line light source module in which one or more of the light source modules are arranged, and a light guide plate that emits light from the line light source module; A lighting device comprising:
(16) In the illumination device having the light source module according to (14), the illumination device includes a diffusion plate that emits light from the light source module, and the diffusion plate includes base resin, fine particles, and fluorescent fine particles, An illumination device, wherein the fine particles and the fine particles of the phosphor are dispersed in a base resin, and the refractive index of the fine particles is different from the refractive index of the base resin.
(17) A liquid crystal panel having a pair of substrates and a liquid crystal layer sandwiched between the pair of substrates, a pair of polarizing plates disposed on both surfaces of the liquid crystal panel, and the illumination device of (14) above And the illumination device emits light to the liquid crystal panel.
(18) A video display device comprising: the liquid crystal display device according to (17); a signal processing unit that performs video signal processing on the liquid crystal display device; a power source unit that supplies power; and a speaker. .
(19) A wiring board, a point light source disposed on the wiring board, and a transparent structure that is formed on the wiring board and covers the point light source, on the light emitting side of the transparent structure A plurality of convex portions are formed on the surface, and the plurality of convex portions are formed by alternately forming the first surface and the second surface, and each of the plurality of convex portions is the first surface Two conical surfaces formed by moving a half line from the point light source toward the light emitting side surface of the transparent structure are formed as a first cone. A surface and a second conical surface, and the distance between the bullet-shaped or flat light extraction surface and the point light source changes toward the perpendicular of the wiring board passing through the point light source, and the first surface is A portion of the light extraction surface along the first conical surface and the second conical surface. The second surface is a part of the first conical surface or the second conical surface, and the plurality of convex portions are arranged on the light emitting side of the transparent structure. The transparent structure is composed of a sealing portion and an interface forming portion, the sealing portion covers the point light source, and the plurality of convex portions are formed in the interface forming portion, An optical sheet used in a light source module in which an adhesive layer is formed between a stop portion and the interface forming portion, wherein the optical sheet includes the interface forming portion and the adhesive layer. Sheet.

  According to the present invention, an optical sheet, a light source module, an illumination device using the light source module, a liquid crystal display device, and an image display device that realize a light collection and diffusion function with a thin structure for light extraction and improve luminance uniformity, etc. Can provide. Problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

It is sectional drawing of the light source module of this invention. It is a top view of a light source module, and gives sectional drawing in the AA of FIG. It is a radiation pattern figure of the light source module of FIG. It is a top view which shows the internal surface of a light source module. It is sectional drawing in the BB line position of FIG. 4 of a light source module. It is sectional drawing in the CC line position of FIG. 4 of a light source module. It is a top view of a light source module. It is a top view of a light source module. It is a top view of a light source module. It is a top view of a light source module. It is a radiation pattern figure of a light source module. It is a radiation pattern figure of a light source module. It is sectional drawing of a light source module. It is a top view of a light source module. It is a radiation pattern figure of a light source module. It is sectional drawing of a light source module. It is a radiation pattern figure of a light source module. It is sectional drawing of a light source module. It is sectional drawing of a light source module. It is sectional drawing of a light source module. It is sectional drawing of the interface formation part of a light source module. It is sectional drawing of a light source module. It is sectional drawing of a light source module. It is sectional drawing of the transparent structure of a light source module. It is sectional drawing of a light source module. It is sectional drawing of a light source module. It is sectional drawing of a light source module. It is sectional drawing of a several light source module. It is a top view of the transparent structure of a light source module. It is the EE sectional view taken on the line of FIG. 19a. It is a top view of a direct type illuminating device. It is the FF sectional view taken on the line of FIG. It is a top view of the optical sheet used for a direct type illuminating device. It is the GG sectional view taken on the line of FIG. It is a top view of the integral partition wall used for a direct type illuminating device. It is the HH sectional view taken on the line of FIG. It is sectional drawing of the liquid crystal display device incorporating a direct illuminating device. It is a top view of a light source module. It is the II sectional view taken on the line of FIG. It is a top view of a linear light source module. It is the JJ sectional view taken on the line of FIG. It is a top view of the block type illuminating device using a linear light source module. It is the KK sectional view taken on the line of FIG. It is sectional drawing of the liquid crystal display device using a block type illuminating device. It is a top view of a linear light source module. It is the LL sectional view taken on the line of FIG. It is a top view of the edge type illuminating device using a linear light source module. It is the MM sectional view taken on the line of FIG. It is sectional drawing of the liquid crystal display device using an edge type illuminating device. It is a back surface layout figure of the video display apparatus using a liquid crystal display device.

  As seen in LED light sources, a light source PKG (light source module) covered with a transparent resin, which is also a sealing material, or glass is basically emitted light (radiated light) from a point light source. In order to collect and diffuse the light emitted from the LED chip or the like, a projecting convex structure such as a cannonball type or a flat type is used with respect to the interface of the transparent resin.

  As a result, the interface structure for extracting light has a problem that the central portion becomes thick instead of a planar shape, which is essentially disadvantageous in terms of thinning and bonding. A large structure is disadvantageous in terms of weight reduction with an increase in volume. Furthermore, there is also a problem that efficiency is lowered due to the coupling structure between the light source module and the structure forming the optical path.

On the other hand, Fresnel lenses have been used for the thin structure of conventional lenses. The Fresnel lens is applied to parallel light (collimated light) and cannot be applied to light emitted from a point light source such as an LED light source. Of course, if the distance between the LED light source and the lens is made sufficiently long, parallel light can be obtained, but it is practically difficult as a light source module for mounting an LED chip. Characteristically, since the Fresnel lens forms an interface with parallel light, it cannot provide a functional interface structure with respect to light emitted from a point light source. It is necessary to provide a new thin interface structure for the emitted light of the point light source.

  The present invention provides a thin structure in which a transparent resin (or glass) interface covering a light source has a function of condensing and diffusing light emitted from the light source. Take up the form. As the light source, an LED chip (monochrome chip, RGB3 chip, or RGB chip), a PKG (monochrome LED, tricolor LED, and phosphor white LED) on which the LED chip is mounted, an OLED element, or the like is used.

(1) Basic structure and configuration:
In the light source module, means for forming an interface for condensing and diffusing with a planar transparent resin includes a wiring board, a light source formed on the wiring board, and a transparent structure formed on the wiring board and covering the light source. The transparent structure has a plurality of convex portions (uneven portions) on the light extraction surface, and each of the plurality of convex portions has a cross section with respect to the light extraction surface whose distance from the light source is not constant, A part of a light extraction surface which is divided and enlarged along two adjacent conical surfaces divided by a plurality of conical surfaces formed by the movement of a half line from a light source, and a part of the conical surface (an inclined surface) The surface is arranged in a plane and arranged alternately. Each of the plurality of convex portions has a structure in which a symmetrical shape is incorporated around the central axis, and a plurality of central axes that form a plurality of conical surfaces may be used.

  This realizes an ultra-thin and lightweight structure as well as appropriate control of the radiation pattern emitted from the light source module and improvement in luminance uniformity. In addition, since the optical path inside the resin for the emitted light can be greatly shortened, the absorption loss due to the transparent resin is reduced, and the light extraction efficiency is improved.

  In this case, if the necessity for reducing the thickness of the light source module is low, it is not necessary to arrange the surface in a completely flat planar shape while maintaining the light collecting and diffusing function. It can also be arranged in the outer shape.

(2) Light collecting and diffusing structure with anisotropy:
The above-described transparent structure is divided by two elliptical conical surfaces that are divided by elliptical conical surfaces flattened in the direction of one axis (y) out of two axes (x, y) perpendicular to the central axis (z-axis). , And a portion of the light extraction surface that is similarly reduced (may be enlarged) along and a portion of the elliptical conical surface (of the inclined surface). By flattening in the y-axis direction, the radiation pattern in the y-axis direction is sharper (narrower) than in the x-axis direction, and anisotropy is given to the radiation characteristics (pattern). That is, a one-dimensional linear light source is formed by emitting (diffusing) a wide viewing angle in the x-axis direction and emitting (condensing) the viewing angle in a narrow limited area in the y-axis direction. Is realized.

(3) Combination structure of a plurality of different light extraction surfaces:
In another embodiment of the interface of the transparent structure, since one light extraction surface can be divided and arranged at a plurality of small uneven interfaces as described above, a plurality of light extraction surfaces having different light collecting and diffusing functions can be simultaneously provided. It is a point which can form a division | segmentation interface by using individually.

  The light extraction surface before dividing into a plurality of small uneven interfaces is usually one. In the case of the interface of the present invention, it is possible to use a plurality of overlapping (pre-division) interfaces that are physically impossible with one conventional interface, discretely selecting each divided small interface, It is a point that can be continuously arranged and formed so as to be combined into one interface. Since multiple interfaces that collect and diffuse light can be used at the same time in a discrete manner, in addition to being thinner and lighter, it is easy to optimally control the radiation intensity and radiation pattern (light distribution pattern) for the light source, making the brightness uniform. The effect which improves drastically etc. is acquired.

(4) Making an optical sheet by separating the function of the light extraction surface (single-sided processing):
The transparent structure is divided into two parts, a sealing part that covers the light source from the functional surface and an interface forming part having an uneven structure that collects light from the light collecting and diffusing, and the latter interface forming part is used as an optical sheet (optical film). By assembling the optical sheet to the sealing portion with an adhesive sheet, it is possible to significantly improve the assemblability, yield, and usability of the light source module.

(5) Optical sheeting by separating the function of the light extraction surface (double-side processing):
A transparent structure obtained by further deforming (4) is provided. The transparent structure is separated into a sealing portion that covers the light source and an interface forming portion (optical sheet) having a concavo-convex structure that extracts light, and is divided into two. The latter optical sheet is processed on both sides to include a light extraction surface forming part having a light collecting and diffusing function and a concave structure part facing the sealing part. Unlike the case of (4), the concave structure portion facing the sealing portion eliminates the need for direct bonding with the sealing portion via an air layer.

  Thereby, in addition to the improvement of assembly of a light source module, a yield, and usability, the adhesive sheet used for bonding in (4) is removed from the optical path to improve optical characteristics (light extraction).

  The sealing part that covers the light source has a convex hemispherical shape, and a light source such as an LED chip is arranged at the center (a point light source for the outer interface of the sealing part) and does not depend on the refractive index of the sealing material. In addition, the light extraction characteristic from the sealing portion is ensured. On the other hand, the sheet-like interface forming part has a light extraction surface with a concavo-convex structure that condenses and diffuses, as well as the opposite side surface, that is, the surface in contact with the sealing part, rather than the convex hemisphere of the sealing part A concave hemisphere with a large diameter is formed. The convex hemispherical shape of the sealing portion and the concave hemispherical shape of the interface forming portion are assembled and arranged in a structure that overlaps with each other through the air layer so that the spherical centers coincide. The light emitted from the light source in the sealing part is incident perpendicularly to the convex hemispherical interface, and reflection and refraction are suppressed and removed, so that the light extraction characteristic (efficiency) for the air layer is reduced without depending on the refractive index. Suppress. Furthermore, since the light emitted from the sealing portion is incident perpendicularly to the concave hemispherical interface whose center coincides with the convex hemispherical shape, the light is also reflected similarly to the incident surface of the interface forming portion. , Refraction is suppressed and removed.

  Therefore, the interface forming portion efficiently emits the light emitted from the light source as in the case where there is no air layer between the sealing portion (when the transparent structure is not separated into the interface forming portion and the sealing portion). It can be taken out.

  Even when an LED chip or the like having a high refractive index is used as the light source of the sealing portion, as described above, the light extraction characteristic (efficiency) from the sealing portion can be secured without depending on the refractive index of the sealing material. Therefore, there is also an advantage that the sealing portion can be formed using a transparent resin having a high refractive index in order to further improve the light extraction characteristic (efficiency) from the LED chip.

  The present invention will be described in more detail with reference to specific examples. The following examples show specific examples of the contents of the present invention, and the present invention is not limited to these examples, but by those skilled in the art within the scope of the technical idea disclosed in this specification. Various changes and modifications are possible. Further, in all the drawings for explaining the embodiments, the same reference numerals are given to those having the same function, and repeated explanation thereof is omitted.

  FIG. 1 is a cross-sectional view of a light source module 1 according to the first embodiment and shows an optical structure. FIG. 2 is a top view of the light source module 1, and a cross section taken along line AA represents FIG. FIG. 3 is a radiation pattern showing a relative light quantity ratio with respect to the radiation angle θ of the light source module 1 of FIGS.

  FIG. 4 is a top view of the light source module 1 with the transparent structure 5 and the peripheral frame 4 removed in FIG. FIG. 5 is a cross-sectional view taken along line BB of the light source module 1 shown in FIG. FIG. 6 is a cross-sectional view taken along line CC of the light source module 1 shown in FIG.

  1 and 2, the light source module 1 has an LED chip 2 as a light source disposed at the center of the wiring board 3 and is transparent so that it can be accommodated in a peripheral frame 4 having a rectangular outer shape and an inclined inner surface. Covered with a structure 5.

  The transparent structure 5 in FIG. 1 has a plurality of convex portions 7 (uneven portions) on the light extraction surface 6, and each of the plurality of convex portions 7 has a structure in which a symmetrical shape is incorporated around the central axis 10. There are a plurality of conical surfaces 11 on the same central axis 10 formed by the movement of the semi-line 9 coming out of the LED chip 2 with respect to the light extraction surface 8 whose cross-section is not constant with the LED chip 2 (center part). A portion 12 of the light extraction surface that is similarly reduced (may be enlarged) along two adjacent conical surfaces 11-1 and 11-2, and a portion 13 (of the inclined surface) of the conical surface. And the surface is arranged side by side on a planar light extraction surface 6.

  As a result, the emitted light 14 from the light source module 1 is collected by the light extraction surface 6 in which the plurality of convex portions 7 are arranged in a planar shape in the form of being extracted in the same direction as the emission light 15 with respect to the light extraction surface 8. ing. By appropriately controlling the radiation pattern, it is possible to improve the luminance uniformity at the time of condensing, and at the same time, the thickness is reduced to 16 and the accompanying weight reduction structure is realized.

  When it is not necessary to collect and diffuse the total luminous flux from the LED chip 2, the transparent structure 5 is partially or locally symmetrical with respect to the central axis described above. Some structures may be applied.

  As shown in the cross-sectional structure of FIG. 1, an interface structure in which the groove depth 17 is further reduced can be obtained by dividing the plurality of convex portions 7 arranged on the light extraction surface 6 into multiple parts and miniaturizing them. The groove depth at this time is selected depending on the material, die machining accuracy, diffraction conditions, cost, and the like, and can usually be reduced to about several μm.

  The radiation pattern of FIG. 3 shows the condensing characteristic 18-1 obtained by the transparent structure 5 of FIG. 1, and the amount of light is extracted within a radiation angle of about 45 degrees. The light collection characteristic 18-2 shows a case where the light collection performance is improved by making the light extraction surface 8 of FIG. From the structure of the light source module 1 in FIG. 1, by increasing the aspect ratio (height / diameter on the central axis) of the bullet-shaped shape, the light collecting property is further enhanced, but total reflection at the light extraction surface 8 is likely to occur. There are certain limits.

  Usually, in order to prevent the light extraction efficiency from decreasing with respect to the emitted light 14 and the emitted light 15 from the LED chip 2, a part 12 of the light extraction surface (the light extraction surface 8 is similarly reduced at the same time as the light collecting property). The structure and material conditions are added so that the incident angle is less than the critical angle so that it is not totally reflected at the interface.

  As a light source of the light source module 1, an LED-PKG (a package in which a chip is sealed) may be used instead of the LED chip 2. As a result of the simplification of the process of the light source module 1, it is possible to obtain an effect of improving assemblability, yield and reliability.

  The wiring substrate 3 shown in FIG. 4 has a wiring structure formed on both sides, and a front electrode pattern (solid line portion) 20 (20-1, 20-2, 20-3) and a back surface through a plurality of Cu through holes 19. The electrode pattern (broken line portion) 21 (21-1, 21-2, 21-3) is electrically connected. The electrode pattern 20 includes an electrode pattern 20-1 and 20-2 for connecting to the electrode (not shown) of the LED chip 2 with Au wires 22-1 and 22-2, and a die for mounting the LED chip 2. It is formed with the electrode pattern 20-3 of the bonding part. The central electrode pattern 20-3 has a high heat dissipation structure (low heat) connected to the electrode pattern 21-3 of the wiring board 3 through a plurality of Cu through holes 19 in order to dissipate the heat generated in the LED chip 2 to the back surface. Resistance structure).

  As shown in FIGS. 5 and 6, the wiring board 3 is a glass epoxy board, and electrode patterns 20 (20-1, 20-2, 20-3), 21 (21-21, 21-21) formed on both sides. 2, 21-3), and white resist layers 23 and 24 having high reflectivity and high reliability are formed on the surface of the wiring board 3. In some cases, a flexible wiring board having high thermal conductivity is used for the wiring board 3 because of the ease of assembly when the light source module 1 is incorporated into the optical device.

  The resist layer 24 on the back surface may not be a high reflectivity material if it is not directly related to optical properties. In the openings 25 (25-1, 25-2, 25-3) and 26 (26-1, 26-2, 26-3) where the resist layers 23 and 24 are not formed on the electrode patterns 20 and 21, a resist is provided. After the layers 23 and 24 are formed, Ni / Au plating is performed on the Cu foil pattern. The opening 25 secures an area for DB / WB of the LED chip 2 and covers the other area with the resist layer 23 to reflect the radiated light. The opening 26 on the back surface is provided for solder connection of the light source module 1 to an external wiring board (not shown) or an external heat dissipation structure (not shown). In the opening 25 (25-3) formed in the electrode pattern 20-3, in order to improve the high reflection characteristic with respect to the light emitted from the LED chip 2 to the back surface, a die made of Ag paste on the Ni / Au plating A bonding layer 27 is formed. As a metallizing method, the opening 25 (25-3) including the opening 26 may be subjected to Ni / Ag plating instead of Ni / Au plating. As another method, instead of Ag plating, highly reliable Sn plating with high reflection characteristics (85% or more, equivalent to Ag) is used, and a white (or transparent) die bonding layer with high reliability and high heat dissipation is used. It may be thin (about 1 to 20 μm). In this case, a silicone-based resin containing a white high thermal conductive filler (such as alumina particles) may be used for the die bonding layer.

  As a case where the white resist layers 23 and 24 are not used, a white ceramic (alumina) substrate may be used for the wiring substrate 3 instead of the glass epoxy substrate. The peripheral frame 4 is formed by molding a white reflective sheet (acrylic resin) with a mold. Instead of the white reflective sheet, the outer shape of the peripheral frame 4 may be formed of a white ceramic substrate having a high reflectance or a white resist layer formed by lamination. In the case of a white ceramic substrate, high reflectance and high efficiency characteristics can be obtained with high reliability by using a multilayer ceramic substrate in which the wiring substrate 3 and the peripheral frame 4 are integrated.

  FIG. 7 a is a top view showing an optical structure of the light source module 29 using the transparent structure 28 according to the second embodiment. It is a modification with respect to the transparent structure 5 of Example 1 shown in FIG. 1, FIG.

  Similarly, FIG. 7 b is a top view showing an optical structure of the light source module 33 using the transparent structure 36 according to the second embodiment. It is another modification with respect to the transparent structure 5 of Example 1. FIG.

  In the basic structure of the light source module 29 shown in FIG. 7 a, an LED chip 30 as a light source is arranged in the center, and the inner region of a rectangular (elongated) peripheral frame 31 is covered with a transparent structure 28. . The interface of the transparent structure 28 (uneven surface repeated with a solid line and a broken line) is concentrically formed so as to fit inside the peripheral frame 31.

  In the basic structure of the light source module 33 shown in FIG. 7b, an LED chip 34 as a light source is arranged in the center, and the inner region of a peripheral frame 35 having a circular shape (may be an elliptical shape) is covered with a transparent structure 36. ing. The interface of the transparent structure 36 (uneven surface repeated with a solid line and a broken line) is concentrically formed so as to fit inside the peripheral frame 35.

  As shown in FIGS. 7a and 7b, thin transparent structures 28 and 36 are formed in accordance with the outer shape of the light source modules 29 and 33 including peripheral frames 31 and 35 such as rectangles and circles, respectively, and a light condensing pattern is formed. Have been able to get.

  FIG. 8A is a top view showing an optical structure of the light source module 38 using the transparent structure 37 according to the third embodiment. It is a modification with respect to the transparent structure 28 of Example 2 shown to FIG.

  Similarly, FIG. 8 b is a top view showing an optical structure of the light source module 42 using the transparent structure 41 according to the third embodiment. It is another modification with respect to the transparent structure 36 of Example 2 shown in FIG. 7b.

  8c and 8d are radiation patterns showing the relative light quantity ratios with respect to the radiation angle θ of the light source modules 38 and 42, respectively.

  In the basic structure of the light source module 38 shown in FIG. 8 a, an LED chip 39 as a light source is arranged at the center, and the inner region of a rectangular (elongated) peripheral frame 40 is covered with a transparent structure 37. Yes. The interface of the transparent structure 37 (uneven surface repeated with a solid line and a broken line) fits inside the peripheral frame 40, but is flattened in the y-axis direction and viewed from the z-axis direction (center axis). It is formed with a shape ratio (such as an elliptical shape) different from the concentric circle in the axial direction. As a result, in a plane perpendicular to the central axis that is the z-axis direction, a structure in which a line-symmetric structure having a different shape ratio with respect to two orthogonal x and y axes is incorporated. In the case where it is not necessary to collect and diffuse all the luminous fluxes as targets, the transparent structures 37 and 41 may apply the above structure partially or locally to the entire interface structure.

  The radiation pattern at this time is shown in FIG. The characteristic 45 in the y-axis direction has a light collecting characteristic showing strong directivity. On the other hand, the characteristic 46 in the x-axis direction has a diffusion characteristic that is made almost uniform by widening the viewing angle. By providing anisotropy in the biaxial direction, a linear light source that distributes (radiates) light in a one-dimensional (x-axis) direction is efficiently realized.

  In the basic structure of the light source module 42 shown in FIG. 8B, an LED chip 43 as a light source is arranged at the center, and the inner area of a peripheral frame 44 having a circular shape (may be an elliptical shape) is covered with the transparent structure 41. ing. The interface of the transparent structure 41 (uneven surface repeated with a solid line and a broken line) is a shape that fits inside the peripheral frame 44, but, as in FIG. 8a, a shape different from the concentric circle flattened in the y-axis direction ( An elliptical shape).

  The radiation pattern at this time is shown in FIG. Similar to the case of FIG. 8c, the y-axis direction characteristic 47 shows strong directivity, and the x-axis direction characteristic 46 has a diffusion characteristic in which the viewing angle is widened to be almost uniform, thereby making it linear in the z-axis direction. The light source is realized efficiently.

  An embodiment using this embodiment will also be described in an embodiment described later.

  FIG. 9 is a cross-sectional view showing an optical structure of the light source module 49 using the transparent structure 50 according to the fourth embodiment. FIG. 10 is a top view of the light source module 49, and a cross section taken along the line DD represents FIG. FIG. 11 is a radiation pattern showing the ratio of the amount of radiation with respect to the radiation angle θ of the light source module 49.

  9 and 10, the light source module 49 has an LED chip 51 as a light source disposed at the center of the wiring board 52 and is covered with a transparent structure 50 so as to fit in a rectangular peripheral frame 53.

  The transparent structure 50 has a thickness obtained by dividing the light extraction surface 55 indicated by a broken line in FIG. 9 into a plurality of conical surfaces 59 (59-1, 59-2, 59-3...) And reducing the similarity. A flat surface 57 (a part of) is formed by removing 56, and the light source module 49 is significantly reduced in thickness and weight. The light rays 60-1 and 60-2 from the LED chip 51 have the same emission direction due to the similarity reduction of the shape even if the interfaces 61-1 and 61-2 are different.

  The light extraction surface 55 before being flattened incorporates a rotationally symmetric shape around the central axis (z-axis) 52, and has a concave shape in which the vicinity (dotted line portion) 53 of the central axis 52 is recessed. Is forming. The light extraction surface 55 has convex light extraction surfaces 55-1 and 55-2 that are symmetrical with respect to the two second central axes 54-1 and 54-2 in the cross-sectional view of FIG. Dimensionally, it is formed so as to incorporate an outline formed by rotating the light extraction surface 55-1 or 55-2 around the central axis 52. Also in this case, when it is not necessary to collect and diffuse all the light beams, the transparent structure 50 may be partially or locally applied to the entire interface structure.

  The second central axes 54-1 and 54-2 radiating from the LED chip 51 are oriented in the direction of θ = about 45 degrees with respect to the central axis 52, and the radiation characteristic 58 shown in FIG. 11 is obtained. Yes. The radiation characteristic 58 is symmetric around the central axis 52, and the amount of light is reduced with respect to the direction of the central axis 52 by the convex light extraction surfaces 55-1 and 55-2, and the second central axis 54- The amount of light in the direction 1,54-2, that is, in the peripheral oblique direction is increased.

  As a result, by inclining the central axis 54 of the transparent structure 50 of the light source module 49, an effect of maximizing the intensity of the light distribution pattern in the 45 degree direction is obtained. The effect of maximizing the light intensity can be obtained.

  FIG. 12 is a cross-sectional view showing an optical structure of the light source module 62 using the transparent structure 63 according to the fifth embodiment. It is a modification with respect to the transparent structure 5 of Example 1 shown in FIG. 1, FIG. FIG. 13 is a radiation pattern showing the ratio of the amount of radiation with respect to the radiation angle θ of the light source module 62.

  A transparent structure 63 using three rotationally symmetric convex light extraction surfaces 64-1, 64-2, and 64-3 indicated by broken lines is formed around the central axis 66.

  Since the transparent structure 63 can be arranged by dividing one light extraction surface 8 into a plurality of small concavo-convex interfaces as described in FIG. 1 of the first embodiment, it is different as shown in FIG. 12 by expanding this. A fine uneven interface 65 is formed by simultaneously using three (including N cases) light extraction surfaces 64-1, 64-2, and 64-3 having a condensing and diffusing function.

  Usually, there is one light extraction surface (for example, only 64-1) before dividing into the plurality of uneven surfaces 65. In the case of the transparent structure 63 of the present invention, three overlapping (before division) light extraction surfaces 64-1, 64-2, and 64-3 that are physically impossible at one conventional interface are used. The same conical surface 69-1, 69-2, 69-3, 69-4. . . . Are divided finely by one of the interfaces 70-1, 70-2, 70-3. . . . Are selected and combined to reduce the similarity along two adjacent conical surfaces, and the assembly of the concave and convex interfaces 65 is continuously arranged so as to form one flat surface 71 together with a part of the inclined surface of the conical surface. , Forming. At this time, the outgoing lights 67-1, 67-2, 67-3 from the uneven interface 65 of the transparent structure 63 are emitted from the three light extraction surfaces 64-1, 64-2, 64-3. -1, 68-2, 68-3 are taken out in the same direction.

  Since the transparent structure 63 can use three different light extraction surfaces 64-1, 64-2, and 64-3 at the same time discretely, in addition to thinning and lightening, the radiation intensity and radiation pattern ( As shown in FIG. 13, a radiation characteristic 72 that realizes easy control of the light distribution pattern) and greatly improves brightness uniformity is realized.

  14a and 14b are cross-sectional views showing optical structures of light source modules 75 and 76 using transparent structures 73 and 74, respectively, according to the sixth embodiment. It is a modification with respect to the transparent structure 63 of Example 5 shown in FIG.

  In the transparent structures 73 and 74, one convex plane and a concave plane each having a fine uneven interface are formed as light extraction surfaces 77 and 78, respectively. In this way, by providing the light extraction surfaces 77 and 78 with a degree of freedom, a shape suitable for the connection surface (not shown) with the optical device can be formed, and the effect of improving the coupling efficiency at the time of light extraction can be obtained. can get. Further, the effect of facilitating the built-in structure and the close contact structure can be obtained by thinning the interface.

  FIG. 15 a is a cross-sectional view of a light source module 80 using a transparent structure 79 according to the seventh embodiment. FIGS. 15b and 15c show a sectional view of the light source module 85 in which the transparent structure 79 constituting the light source module 80 is divided into two parts, and the interface forming part 82 and the interface forming part 82 are removed.

  The interface forming part 82 is formed of a concavo-convex structure 81 for extracting light and an adhesive layer 86 formed on the back surface thereof. The sealing portion 84 of the light source module 85 excluding the interface forming portion 82 covers the LED chip 83 and is surrounded by the wiring substrate 88 and the peripheral frame 89, and can be easily attached to each other at the connection surface 87 with the interface forming portion 82. Therefore, it is formed with a flat surface.

  By separating the transparent structure 79 into the sealing portion 84 that covers the LED chip 83 from the functional surface and the interface forming portion 82 that has the concavo-convex structure 81 that extracts light, the latter interface forming portion 82 is converted into an optical sheet (optical film). ). By bonding the optical sheet to the connection surface 87 of the sealing portion 84 with the adhesive sheet 86, there is an effect that the assemblability, yield, usability, total cost, etc. of the light source module 80 are greatly improved.

  FIG. 16 a is a cross-sectional view of the light source module 89 using the transparent structure 88 according to the eighth embodiment. FIG. 16 b shows a transparent structure 88, and FIG. 16 c shows a cross-sectional view of the light source module 90 with the transparent structure 88 separated from the light source module 89. It is one of the modifications of the light source modules 1 and 80 shown in FIG.

  The transparent structure 5 shown in FIG. 1 is deformed with a structure separated into two, a transparent structure 88 and a sealing portion 91 sandwiching an air layer 92 shown in FIG. 16a. On both surfaces of the transparent structure 88, a light extraction surface forming portion 93 having a condensing and diffusing function and a concave structure portion 94 facing the sealing portion 91 are formed.

  The sealing part 91 has a convex hemispherical outer shape, and an LED chip 97 is arranged at the center (a point light source for the outer boundary of the sealing part 91) to extract light from the sealing part 91. The characteristics are secured. On the upper surface of the LED chip 97 that is an excitation light source, a transparent resin 96 in which a phosphor is dispersed is formed with a constant thickness (5 to 50 μmt). The sealing portion 91 is formed in a convex hemispherical shape by covering the LED chip 97 and the transparent resin 96 in which the phosphor is dispersed, and the periphery thereof with a transparent resin not including the phosphor.

  The emitted light from the LED chip 97 is extracted directly from the side as excitation light (blue light) and from the upper surface, the phosphor emission and excitation light (blue light) are taken out. In Example 8 of FIG. 16a, the peripheral frame 4 shown in Example 1 is omitted. However, when the excitation light from the side surface is extracted, the peripheral frame 4 is temporarily reflected, and the reflected light is condensed and diffused. It is made to enter into the light extraction surface formation part 93 provided with. Since the peripheral frame 4 is equivalently a new light source, a reflection structure that effectively makes the light incident on the light extraction surface forming portion 93 is formed.

  When monochromatic light is used instead of white light, a structure in which the LED chip is covered with a transparent resin that does not disperse the phosphor is used.

  The concave structure portion 94 forms a concave hemispherical shape having a larger diameter than the convex hemispherical shape of the sealing portion 91. The convex hemispherical shape and the concave hemispherical shape are assembled so as to overlap each other via the air layer 92 so that the centers of the spherical shapes coincide with each other. The light 95 emitted from the LED chip 97 and the phosphor 96 in the sealing portion 91 is perpendicularly incident on the convex hemispherical interface of the sealing portion 91, and reflection and refraction are suppressed and removed, so that it depends on the refractive index n. Without securing the light extraction characteristics with respect to the air layer 92. Further, the emitted light 95 from the sealing portion 91 is incident perpendicularly to the concave structure portion 94 having a concave hemispherical shape because the LED chip 97 is aligned with the center of the convex hemispherical shape, and is similarly reflected and refracted. Has been suppressed and removed.

  Therefore, in the transparent structure 88, when there is no air layer 92 between the sealing part 91 and the concave structure part 94 facing the transparent structure 88 (as in Example 1, the transparent structure is separated into the interface forming part and the sealing part). In the same manner as in the case where the light is not emitted, the emitted light 95 from the light source composed of the LED chip 97 and the phosphor 96 can be efficiently extracted. Furthermore, by separating the structure of the transparent structure 88 and the sealing portion 91, even when the refractive index of the LED chip 97 is high, the degree of freedom of material selection with respect to the refractive index and the like can be widened, and the light extraction efficiency is greatly increased. The advantage is that it can be improved. Since a transparent resin material having a high refractive index can be used only for the sealing portion 91, cost merit can be obtained in addition to improvement of light extraction characteristics.

  The concave structure portion 94 facing the sealing portion 91 eliminates the need for direct bonding (adhesive sheet 86 in the seventh embodiment) via the air layer 92 between the sealing portion 91 and the light source module 89. Assembly, yield, and usability are improved. Furthermore, an effect of improving optical characteristics (light extraction efficiency, etc.) is obtained by removing the adhesive sheet 86 in Example 7 used for pasting from the optical path 95.

  By using the light source module 89 of FIG. 16a as a basic unit, it can be used as a linear light source or a surface light source as in the embodiments described later by arranging a plurality of linearly or planarly repeated elements.

  The transparent structure 88 of FIG. 16b and the light source module 90 of FIG. 16c are fixed to each other by the adhesive sheet 100 shown in FIG.

  FIG. 17 a is a cross-sectional view of the light source module 101 using the transparent structure 102 and the sealing portion 103 according to the ninth embodiment. It is a modification with respect to the sealing part 91 of Example 8 shown to FIG. 16a.

  The sealing portion 103 includes a blue LED chip 104 and a transparent resin 105 in which a phosphor is dispersed. The LED chip 104 is substantially hemispherically covered with the transparent resin 105. The shape of the transparent resin 105 is formed by die molding or potting. The thickness 106 of the transparent resin 105 in which the phosphor covering the LED chip 104 is dispersed is set to 100 to 500 μmt in order to transmit excitation light. In the transparent resin 105, a YAG (Ce) phosphor using the LED chip 104 as an excitation light source is dispersed and used. Similarly, the three-wavelength phosphor may be dispersed using a UV-LED as an excitation light source.

  The transparent structure 105 of the sealing portion is formed of a hemispherical transparent resin in which a phosphor is dispersed. Blue light (excitation light, emitted light) from the LED chip 104 and yellow light from the YAG phosphor are extracted with a uniform intensity distribution.

  FIG. 17 b is a cross-sectional view of the light source module 107 using the transparent structure 108 and the sealing portion 109 according to the tenth embodiment. It is a modification with respect to the sealing part 91 of Example 8 shown to FIG. 16a.

  The sealing portion 109 includes an LED chip 110, a first transparent resin 111 that does not include a phosphor, and a second transparent resin 112 in which the phosphor is dispersed. The first transparent resin 111 covers the LED chip 110. The second transparent resin 112 covers the first transparent resin 111. The first transparent resin 111 and the second transparent resin 112 are covered with a substantially hemispherical shape centered on the LED chip 111. The second transparent resin 112 makes the thickness 113 of the spherical shell viewed from the LED chip 110 substantially constant (100 to 500 μmt) and transmits the excitation light uniformly. In the second transparent resin 112, a YAG (Ce) phosphor using the blue LED chip 110 as an excitation light source is dispersed. By forming the transparent resin in which the phosphor of the sealing portion 109 is dispersed into a hemispherical shell shape, the chromaticity and spectrum of white light can be easily controlled by changing the thickness of the spherical shell.

  Similarly, the three-wavelength phosphor may be dispersed using a UV-LED as an excitation light source.

  18 is a cross-sectional view when a plurality of light source modules 114 (114-1, 114-2...) According to the eleventh embodiment are arranged. The light source module 114 is a modification of the light source module 89 in the eighth embodiment shown in FIG. 16a. 19a is a top view of the transparent structure 115 (115-1, 115-2...) Of the light source module 114, and FIG. 19b is a cross-sectional view taken along line EE of FIG.

  In the plurality of light source modules 114 (114-1, 114-2...), A transparent structure 115 and a sealing portion 117 are formed on the wiring board 116, and a reflection partition wall is formed in the peripheral portion between the light source modules 114. 118 is formed.

  The sealing portion 117 is composed of an LED chip 119 that is an excitation light source for white light emission and a transparent resin 120 in which a phosphor is dispersed. The outer shape of the sealing portion 117 is a convex hemisphere, and the LED chip 119 is arranged in the center (point light source). Has been).

  On both surfaces of the transparent structure 115, a light extraction surface forming part 121 having a light collecting and diffusing function and a concave structure part 122 facing the sealing part 117 are formed.

  The concave structure portion 122 forms a concave hemispherical shape having a larger diameter than the convex hemispherical shape of the sealing portion 117. The convex hemispherical shape and the concave hemispherical shape are assembled by being arranged in a structure that overlaps with each other through the air layer 123 so that the centers of the spherical shapes coincide with each other.

  In Example 8 of FIG. 16a, the peripheral frame 4 shown in Example 1 is omitted. However, when extracting the radiation light in the side surface direction, the high-reflectivity reflective partition wall 118 corresponding to the peripheral frame 4 is temporarily provided. The reflected light 124 is reflected and is incident on the light extraction surface forming portion 121 having a condensing and diffusing function. Since the reflection partition wall 118 corresponds to a new light emission source, a reflection structure that vertically enters incident light (reflected light 124) to the light extraction surface forming portion 121 is formed, and the light extraction characteristic (efficiency) is effectively improved. It is improving.

  The light extraction surface forming unit 121 in this case is an interface 125 corresponding to a part 13 of the conical surface (an inclined surface) of FIG. 1 described in the first embodiment, and uses an interface that is not used for light collection and diffusion. Yes. That is, a condition for perpendicular incidence with respect to a plurality of interfaces 125 based on three points: LED chip 119 (light emitting point), reflection partition wall 118 (reflection point), and interface 125 (incident point) of light extraction surface forming unit 121. Thus, the side shape 129 of the reflection partition wall 118 is calculated.

  Since the reflection partition wall 118 is reflected by the side surface shape 129 in contact with the transparent structure 115, the reflection partition wall 118 may be hollow. That is, the formation of the side surface shape 129 can also be realized by applying and forming a reflective film on the transparent structure 115 side, and an effect of improving assembling and reducing costs by reducing the number of parts can be obtained. Furthermore, by making the refractive index n of the transparent structure 115 high (n ≧ 2) with the side surface shape 129, total reflection can be generated to obtain the reflected light 124, and the assemblability is further improved.

  The wiring board 116 has a double-sided wiring structure as shown in FIG. 18, and wiring patterns 126-1 and 126-2 are formed through Cu through holes 127 on both sides at the center of the board on which the LED chip 119 is mounted for each light source module 114. The high heat dissipation structure is formed by the AGSP substrate structure. On the surface of the wiring board 116, a white resist 128 having a high reflectivity is formed in a region excluding the Cu through hole 127. A wiring pattern 126-2 formed on the back surface of the wiring substrate 116 is fixed to a heat radiating housing 130 made of a thin aluminum plate via a highly heat conductive adhesive sheet 131, and efficiently dissipates heat generated from the LED chip 119. Yes.

  In some cases, a thin carbon sheet (0.1 to 1.0 mmt) having high thermal conductivity is used as the heat radiating housing 130. The anisotropic thermal conductivity in the horizontal direction of the plane is at the Cu level, and the heat dissipation from the heat generating portion of the wiring pattern 126-2 to the peripheral portion (not shown) is improved to provide a high heat dissipation structure to the outside air. Realize. At the same time, the weight can be reduced by changing the aluminum sheet to the carbon sheet.

  The structure of the wiring pattern 126-2 is a heat spread structure using a thick copper foil (50 to 150 μmt) having a shape larger by one digit or more than the area of the LED chip 119 and the Cu through-hole 127, to the heat radiating case 130. High heat dissipation is ensured.

  Ni / Ag plating is applied to the surface of the wiring pattern 126-1 on the Cu through hole 127 on which the LED chip 119 is mounted, and the light flux from the LED chip 119 is reflected. In order to ensure high reliability and optical characteristics, Ni / Ag / Au plating or Ni / Sn plating may be used. For the connection between the Cu through hole 127 and the LED chip 119, the back surface of the LED chip 119 is metallized and fixed (die bonding) by Au / Au or Au / Sn bonding. When the back metallization is not formed, it is directly fixed with a white silicone resin (high reflectivity member). In this case, the thickness is reduced within 1 to 20 μm in order to reduce the thermal resistance of the fixing portion. When a white alumina substrate is used for the wiring substrate 116, a transparent silicone resin (transmission) may be used for the die bonding material of the LED chip 119 and reflected by the alumina substrate.

  The assembly structure of the light source module 114 is such that the sealing portion 117 and the reflective partition wall 118 surrounding the periphery thereof are arranged on the wiring substrate 116, and the transparent structure 115 is bonded via the adhesive sheet 132 so as to cover them. , Is formed. Adjacent reflective partition walls 118-1, 118-2. . . . As described above, in order to improve the light extraction characteristic (efficiency), it is formed in an integrated form using a step structure or the like. In the assembly structure, the transparent structure 115 in which the reflective partition wall 118 is incorporated may be pasted together with the adhesive sheet 132 on the wiring board 116 on which the sealing portion 117 is formed.

  20a is a top view of a direct illumination device 134 in which a large number of light source modules 133 (133-1, 133-2, 133-3...) According to the twelfth embodiment are arranged vertically and horizontally in a plane. This is a modification of the eleventh embodiment. FIG. 20B is a cross-sectional view of the direct illumination device 134 of FIG. FIG. 20a shows a case where the diffusion plate 135 shown in FIG. 20b is removed.

  The light source module 133 (133-1, 133-2, 133-3...) Has a sealing portion 138 and a transparent structure 137 formed on the wiring board 136, and in the peripheral portion between the light source modules 133. A reflective partition wall 139 is formed.

  The sealing portion 138 includes an LED chip 140 that is an excitation light source that emits white light and a transparent resin 141 in which a phosphor covering the LED chip 140 is dispersed. The outer shape of the sealing portion 138 is a convex hemisphere, and the LED chip 140 is formed at the center. Arranged (point light source).

  In the present embodiment, the LED chip 140 is used as the excitation light source as the light source. Instead, an LED chip, a phosphor, and a PKG (ceramic PKG, plastic PKG) mounted with a transparent resin are used as the white light source. In some cases. In this case, since the transparent resin 141 in which the phosphor is dispersed is not particularly required, the PKG can be covered with the transparent resin in which the phosphor is not dispersed. Furthermore, when the PKG (structure) can ensure the reliability and light extraction characteristics of the LED chip, the PKG may not be covered with a transparent resin in order to simplify the assembly process and reduce the cost.

  On the other hand, in PKG, although the LED chip 140 of an excitation light source is mounted, a phosphor may not be formed. In this case, as in the case of the present embodiment, the PKG on which the LED chip 140 is mounted can be covered with a transparent resin 141 in which a phosphor is dispersed. By mounting and separating the phosphor and the LED chip that is the excitation light source, effects of simplifying the assembly process, improving yield, and reducing costs can be obtained.

  Furthermore, when the LED chip 140 emits white light by RGB three-color light emission (three colors are formed on one chip or three colors are formed on three chips), the transparent resin 141 in which the phosphor is dispersed may be unnecessary. it can.

  The direct illumination device 134 includes a heat radiating housing 142, a large number of light source modules 133 (a drive circuit for the LED chip 140 and a power supply unit are omitted), and a diffusion plate 135 that emits light from the light source modules 133. .

  Instead of the diffusion plate 135, a thin plate of acrylic transparent resin 141 in which a phosphor is dispersed or a diffusion plate made of a sheet may be used. In this case, the light source module 133 forms a white light source by using the LED chip 140 as a blue LED or UV-LED excitation light source without using a phosphor for the sealing portion 138. This is because the phosphor of the white light source can be separated from the light source module 133 and the phosphor can be separately dispersed and formed on the diffusion plate 135 of the lighting device 134. In the light source module 133, the structure is simplified and the assembly structure and the manufacturing process are simplified at the same time as the phosphors are separated, and the yield improvement and the characteristic variation reduction can be easily realized.

  The light source module 133 is fixed to the heat radiating housing 142 via the adhesive sheet 143 having high thermal conductivity, and the diffusion plate 135 is disposed on the light extraction surface side of the light source module 133 via the air layer 148 and diffuses with the heat radiating housing 142. The plate 135 is configured to be incorporated in the outer frame housing 144.

  FIG. 21 a is a top view of the optical sheet 145 in which a large number of transparent structures 137 constituting the light source module 133 used in the direct illumination device 134 are arranged in a plane. 21b is a cross-sectional view taken along the line GG of FIG. 21a.

  As in the case of Example 11, the optical sheet 145 composed of a large number of transparent structures 137 has a concave / convex interface 146 that optimizes radiation characteristics on the side from which light is extracted, and a concave hemisphere 147 on the opposite side. ing. The concave hemisphere 147 is arranged with its central portion aligned with the convex hemisphere of the sealing portion 138 shown in FIGS. 20a and 20b.

  FIG. 22 a is an integrated partition wall 149 of the light source module 133 used in the direct type illumination device 134, and is a top view in which a large number of partition walls 139 are integrally molded. 22b is a cross-sectional view taken along line HH in FIG. 22a.

  In addition to the wiring board 136 and the transparent structure 137 constituting the light source module 133, the reflection partition wall 139 is integrated, thereby simplifying the assembly process of the direct type lighting device 134 and improving the assembly and yield. Furthermore, cost reduction is realized.

  FIG. 23 is a cross-sectional view of a liquid crystal display device 150 in which the direct illumination device 134 is incorporated.

  Since the direct type illumination device 134 is used as a white light source, a thin plate or sheet of acrylic transparent resin in which fine particles having a different refractive index from the base resin and phosphor particles are mixed and dispersed on the diffusion plate 135 as described above. The film is formed effectively and functionally, and the LED chip 140 of the light source module 133 is a blue LED or a UV-LED. In particular, the diffusion plate 135 may be formed using only phosphor fine particles instead of transparent fine particles having a refractive index different from that of the acrylic transparent resin.

  A styrene resin, a vinyl chloride resin, a polycarbonate resin, or the like may be used in place of the acrylic resin.

  When the emitted light extracted from the LED chip 140 to the air layer 148 through the transparent structure 137 enters the diffusion plate 135, a color difference depending on the incident angle may occur due to the influence of the thickness of the phosphor layer. is there. In order to eliminate this, the amount of dispersion of the phosphor layers as seen from the direction of the LED chip 140 (point light source) which is an excitation light source is made equal. In other words, a distribution in which the dispersion density is reduced as the distance from the LED chip 140 increases is formed on the diffusion plate 135. As a result, the color tone of white light is made uniform with respect to the viewing angle, and at the same time, the amount of phosphor used is reduced and the cost is reduced.

  White light from the diffusion plate 135 of the direct type illumination device 134 is disposed on both surfaces of the liquid crystal panel 151 having a pair of substrates and a liquid crystal layer sandwiched between the pair of substrates via the optical sheet 153. It is taken out through the pair of deflecting plates 152a and polarizing plate 152b.

  By arranging a plurality of thin light source modules 133 vertically and horizontally, two-dimensional area control can be performed at the same time as ultra-thin and light weight, and low power consumption is realized. The heat generation in the light source module 133 incorporated in the direct type illumination device 134 is a direct type, so the outer area of the light source module 133 is evenly distributed in the basic unit, and high heat dissipation from the heat radiating housing 142 directly into the air. It has. Heat is radiated to the outside through an opening 154 on a slit provided in the external housing 153.

  24A is a top view of another light source module 154 according to the thirteenth embodiment, and FIG. 24B is a cross-sectional view taken along the line II of FIG. 24A. The thirteenth embodiment is also a modification of the third embodiment.

  FIG. 25a shows a linear light source module in which the light source modules 154 (154-1, 154-2, 154-3, 154-4...) According to the thirteenth embodiment are routed and arranged in a straight line on the wiring board 162. 163 is a top view of FIG.

  FIG. 25b shows a structure in which the heat radiation substrate 164 is attached to the linear light source module 163 using the adhesive sheet 165 having high thermal conductivity, and is a cross-sectional view taken along line JJ in FIG. 25a.

  FIG. 25c is a top view when the diffuser plate 167 is removed from the block illumination device 166 using the linear light source module 163 according to the thirteenth embodiment. FIG. 25d is a cross-sectional view taken along the line KK of FIG. 25c.

  FIG. 25E is a cross-sectional view of a liquid crystal display device 168 using a block illumination device 166 according to the thirteenth embodiment.

  In the light source module 154, an LED chip 155 and a peripheral frame 156 that is also a reflection partition wall disposed in the periphery are mounted on a wiring board 157, and a transparent structure 158 is formed thereon.

  Both the wiring board 157 and the peripheral frame 156 are made of white ceramic having high reflectivity. The light source module 154 is manufactured by stacking a peripheral frame 156 on a wiring board 157 and integrally forming a plurality of pieces. The wiring pattern (not shown in the figure) of the wiring board 157 is through-hole connected with two-layer wiring as in the first embodiment.

  In some cases, instead of white ceramics, a highly heat conductive lead electrode is used to form white plastic PKG with high reflectivity.

  The transparent structure 158 has an uneven structure 160 formed on the light extraction surface 159, and realizes a significant reduction in thickness by removing the thickness 161 of the transparent resin. At the same time, the transparent structure 158 diffuses and collects light in the x and y axis directions. The radiation pattern of the sex is formed. The light source module 154 can efficiently realize a linear light source that radiates in the Z-axis direction by forming an anisotropic radiation pattern as shown in FIG.

  Further, the height of the concavo-convex structure 160 is formed lower than the highest portion of the peripheral frame 156 taking advantage of the thinning effect of the transparent structure 158. This prevents damage to the concavo-convex structure 160 of the transparent structure 158 when the light source module 154 is mounted and handled.

  Heat generated by the linear light source module 163 is uniformly dissipated from the heat dissipation substrate 164 to the heat dissipation casing 169 of the block type lighting device 166 and efficiently extracted into the air.

  The heat dissipating board 164 (164-1, 164-2...) Discretized for each block is formed by processing a part of the heat dissipating case 169 to form a plurality of U-shaped protrusions, which are perpendicular to each other. It is formed by bending and integrated.

  The block type illumination device 166 of FIG. 25c is divided into N × M blocks and is controlled to be lit by the drive circuit units 173 (173-1, 173-2) arranged on both sides to optimize the luminance adjustment. This reduces power consumption.

  The block type lighting device 166 has a required number of light source modules 154 (in this embodiment, anisotropic radiation) in order to ensure the luminance of the linear light source modules 163 with respect to the block side surfaces 171 of the integrated light guide plate 170. The light is incident by being arranged close to one by pattern formation. By realizing a thin transparent structure 158 with respect to the light source module 154 (thickness reduction 161 with respect to the hemispherical shape), the transparent structure 158 is controlled block by block at the same time as the light collection and diffusion characteristics of the light source module 154 are controlled. Brightness unevenness can be suppressed by being arranged close to the side surface portion 171. Further, a diffuser plate 167 is disposed on the integrated light guide plate 170 from which light from the linear light source module 163 is emitted via an air layer 172 to reduce luminance unevenness for each block.

  Further, a white resist having a high reflectance is formed on the routing wiring substrate 162 constituting the linear light source module 163, and the block side surface portion 171 of the integrated light guide plate 170 is routed between the routing wiring substrate 162. Absorption loss is reduced for multiple reflections.

  In the present embodiment, the LED chip 155 is used as the light source, but a white light source that is basically composed of the excitation light source and the phosphor described in the ninth to twelfth embodiments may be used instead.

As a modification, in the light source module 154, only the blue LED or the UV-LED is used for the LED chip 155, and the phosphor may be separated from the light source module 154.
That is, in the light source module 154, there is a method in which only the excitation light is efficiently extracted from the transparent structure 158, and then the phosphor formed and arranged outside the light source module 154 is excited to emit light to form white light.

  The fluorescent material may be disposed at the side surface portion 171 of each block of the integrated light guide plate 170 immediately after the excitation light emission is taken out. In this case, a thin acrylic resin sheet or film in which a phosphor is dispersed is fixed to the side surface portion 171 of each block with a transparent adhesive sheet (not shown), and white light is applied to each block of the integrated light guide plate 170. Make it incident. As a modification, the acrylic resin sheet in which the phosphor is dispersed may be integrally formed with a transparent adhesive sheet in order to disperse the phosphor fine particles while being fixed to the side surface portion.

  When a color difference occurs, the dispersion amount of the phosphor is made equal to the solid angle Ω viewed from the direction of the LED chip 155 (point light source) that is an excitation light source in order to remove the color difference. That is, a distribution in which the dispersion density decreases as the distance from the LED chip 155 increases is formed on the side surface portion 171. Thereby, the color tone of white light can be made uniform with respect to the light guide plate 170, and at the same time, the amount of phosphor used can be reduced and the cost can be reduced.

  As another modification, after taking out uniformed excitation light emission from the integrated light guide plate 170, a phosphor may be formed and arranged on the diffusion plate 167 in order to reduce luminance unevenness between N × M blocks. The diffuser plate 167 can form white illumination by using a diffuser plate in which a phosphor is dispersed instead of a conventional diffuser plate, or by dispersing only the phosphor. The phosphor is separated from the light source module, and the phosphor is formed on the diffusion plate 167 as diffusion fine particles. Thereby, the function with respect to a structural member is isolate | separated and added in the illuminating device. As a result, the assembly of the light source module is improved, and the increase in the member cost and the manufacturing cost of the lighting device is suppressed and eliminated.

  In the liquid crystal display device 168 shown in FIG. 25e, a liquid crystal panel 175 having a pair of substrates and a liquid crystal layer sandwiched between the pair of substrates, the white light 174 extracted from the diffusion plate 167 of the block type illumination device 166 shown in FIG. 25c; Then, it is taken out as a display pattern such as an image through a pair of deflecting plates 176a and polarizing plates 176b arranged on both surfaces of the liquid crystal panel 175.

  FIG. 26A is a top view of the linear light source module 179 in which the light source modules 177 (177-1, 177-2...) According to the fourteenth embodiment are routed and arranged linearly on the wiring board 178. . FIG. 26 a is a modification of FIG. 25 a in the thirteenth embodiment.

  FIG. 26 b shows a structure in which the linear light source module 179 is attached to the heat sink 180 with the radiation fins 182, and corresponds to a cross-sectional view taken along line LL in FIG.

  FIG. 26c is a top view of the edge type illumination device 183 in which the linear light source modules 179 (179-1, 179-2) according to the fourteenth embodiment are arranged on both sides when the diffusion plate 181 of FIG. 26d is removed. is there. 26d is a cross-sectional view taken along line MM in FIG. 26c.

  FIG. 26E is a cross-sectional view of a liquid crystal display device 184 using an edge illumination device 183 according to the fourteenth embodiment.

  As shown in FIG. 26a, the linear light source module 179 has a plurality of light source modules 177 arranged and mounted on a routing wiring board 178. In the region excluding the electrode connection portion (not shown in the figure) of the light source module 177, A white resist having a high reflectance (80% or more) is formed.

The lead wiring board 178 is an insulating layer made of an aluminum or copper thin plate (about 0.5 to 1.5 mm) and a high thermal conductivity epoxy resin (thermal conductivity: 3.0 W / (K · m ² ) or more). Cu pattern wiring layer (Ni / Ag plating or Ni / solder plating) and heat resistant UV-resistant white resist layer (40 μm or more) are formed in this order to achieve a high heat dissipation structure and high reliability.

  As shown in FIG. 26B, the heat radiation path for the heat generation of the light source module 177 has a structure in which the wiring board 178 having a high heat radiation structure is used and fixed to the heat sink 180 with the heat radiation fins 182 via the adhesive sheet 181 having a high thermal conductivity. .

  As shown in FIGS. 26c and 26d, the edge type illumination device 183 has two sets of linear light source modules 179-1 and 179-2 arranged on both sides, and a division corresponding to the arrangement of the light source modules 177 between them. The light guide plate 185 (185-1, 185-2, 185-3...) Is arranged. The light guide plate 185 is made of a transparent acrylic resin. In order to make the emitted light 188 in FIG. 26d uniform in the Y-axis direction, a light guide plate 185 is disposed below the diffusion plate 181 via an air layer, and a convex reflection surface 190 indicated by a broken line is formed on the back side. To extract the reflected light. Further, the reflection sheet 189 is also disposed below the convex reflection surface 190 with respect to the transmitted light.

  In the embodiment, one light source module 177 corresponds to one of the light guide plates 185, but a plurality of light source modules 177 may correspond to each other due to the divided structure of the light guide plate 185. As shown in FIGS. 8a and 8c, the light source module 177 is a thin type that is narrowed down (condensed) in the y-axis direction and diffused in the x-axis direction to obtain a linear light source that radiates (distributes light) in the z-axis direction. A transparent structure is formed, an anisotropic radiation pattern is obtained, and at the same time, a close contact structure with the light guide plate 185 is formed, so that the coupling efficiency with the light guide plate 185 is greatly improved.

  The plurality of divided light guide plates 185 (185-1, 185-2, 185-3...) Have slit grooves 186 (186 shown by broken lines between the adjacent light guide plates 185-k and 185-k-1. -K) is formed from the back surface side (negative direction of the y-axis), and the surface has an integrated structure. The slit groove 186 is formed by a V-groove cut (X-axis direction cross section) and is filled with an air layer to suppress optical interference. Instead of filling the V-groove cut space with an air layer, a reflective layer may be formed on the surface of the V-groove to provide a reflection function. Even when there is no need to suppress optical interference, a V-groove cut for filling the space with an air layer may be formed to absorb and relieve structural distortion such as warpage due to thermal expansion.

  In the edge type illumination device 183 according to the fourteenth embodiment, two sets of linear light source modules 179-1 and 179-2 are arranged on both sides, but two sets on the upper and lower sides are required in order to cope with an increase in area and brightness. Alternatively, it may be composed of four sets including two upper and lower sets.

  The linear light source modules 179-1 and 179-2 have heat sinks 180-1 with heat radiation fins 182-1 and heat radiation fins 182-2 as a heat radiation structure shown in FIG. A heat sink 180-2 is formed.

  The edge-type lighting device 183 has a structure in which the linear light source module 179, the light guide plate 185, and the heat sink 180 with the radiation fins 182 are arranged on the z-axis 187 indicated by a one-dot chain line, thereby reducing the height (thickness) 191. It is easily realized.

The heat radiating fins 182 and the heat sink 180 are formed using aluminum and copper, respectively. However, an integrated structure formed using only aluminum may be used. Furthermore, in order to realize a significant weight reduction of the edge-type lighting device 183, the edge-type lighting device 183 can be integrally formed using a composite material of aluminum and carbon or copper and carbon. In this case, utilizing the anisotropic thermal conductivity depending on the carbon fiber, the fin efficiency can be greatly improved by providing a high thermal conductivity equal to or higher than the copper level in the z-axis 187 direction. The groove forming direction of the heat dissipating fins 182 is the y-axis direction, realizing heat dissipation by natural convection. Fine openings 193 are formed on the left and right and top and bottom of the plastic outer case 192 to optimize the effect of the heat dissipating fins 182 on natural body convection.

  The drive circuit section (not shown) at this time is mounted in the space above and below both sides of the lead wiring boards 178-1 and 178-2 so as not to affect the height (thickness) 191 of the edge type illumination device 183. Built in.

  In the liquid crystal display device 184 shown in FIG. 26e, the white light 188 extracted from the diffusion plate 181 of the side edge type illumination device 183 shown in FIGS. 26c and 26d has a pair of substrates and a liquid crystal layer sandwiched between the pair of substrates. A display pattern such as an image is taken out through the liquid crystal panel 194 and a pair of deflecting plates 195a and polarizing plates 195b disposed on both surfaces of the liquid crystal panel 194.

  In the liquid crystal display device 184, the material of the heat dissipating fins 182 and the heat sink 180 is reduced in weight by the edge-type lighting device 183, thereby realizing a significant reduction in thickness and weight.

  FIG. 27 shows an example of a video display device 196 using the liquid crystal display device 184 according to the fourteenth embodiment, and shows a plan view of the internal arrangement on the back side of the video display device 196.

  The video display device 196 includes power supply units 198-1 and 198-2 for supplying power to an edge type illumination device (backlight device) 183, a liquid crystal panel (display unit) 194, etc. on both sides of the back side rear surface 197. And a signal processing unit 199 that performs signal processing such as contrast and frame rate on the video signal supplied to the liquid crystal panel (display unit) 194, and structures 200-1 and 200-2 such as speakers. Note that the video display device of this embodiment can also be applied to a liquid crystal display device (backlight device) using the direct illumination device 134 and the block illumination device 166 described in Embodiments 12 and 13.

DESCRIPTION OF SYMBOLS 1 Light source module 2 LED chip 3 Wiring board 4 Peripheral frame 5 Transparent structure 7 Convex part 8 Light extraction surface 10 Center axis 19 Through hole 20 Electrode pattern 22-1 and 22-2 Wire 23, 24 Resist layer 25, 26 Opening part

Claims (16)

A wiring board;
A point light source disposed on the wiring board;
A transparent structure that is formed on the wiring board and covers the point light source;
A plurality of convex portions are formed on the light emitting side surface of the transparent structure,
The plurality of convex portions are formed by alternately forming the first surface and the second surface,
Each of the plurality of convex portions is configured by the first surface and the second surface,
Two adjacent conical surfaces among a plurality of conical surfaces formed by moving a half line from the point light source toward the light emitting side surface of the transparent structure are defined as a first conical surface and a second conical surface,
The distance between the light extraction surface and the point light source is changing toward the perpendicular of the wiring board passing through the point light source,
The first surface is a surface obtained by reducing or enlarging a part of the light extraction surface along the first conical surface and the second conical surface,
The second surface is part of the first conical surface or the second conical surface;
The plurality of convex portions are arranged in a plane on the surface of the light emitting side of the transparent structure,
The plurality of protrusions include protrusions that are different in shape ratio with respect to two axes orthogonal to each other in the wiring board plane, and are symmetrical with respect to a perpendicular of the wiring board that passes through the point light source.
The direction in which the intensity of the light distribution pattern from the point light source is maximum is the central axis,
The light source module, wherein the central axis is inclined with respect to a normal of the wiring board passing through the point light source. In claim 1,
The light source module according to claim 1, wherein the plurality of convex portions include convex portions that are symmetrical with respect to a perpendicular of the wiring board that passes through the point light source. In claim 1 or 2,
There are a plurality of light extraction surfaces,
Each of the plurality of convex portions is formed by discretely selecting one of the plurality of light extraction surfaces. In any one of Claims 1 thru | or 3,
The transparent structure is composed of a sealing part and an interface forming part,
The sealing portion covers the point light source,
The light source module, wherein the plurality of convex portions are formed in the interface forming portion. In claim 4,
An air layer is formed between the sealing portion and the interface forming portion,
The air layer has a spherical shell shape,
The light source module according to claim 1, wherein the sealing portion is disposed at a central portion of the air layer. In claim 4,
A light source module, wherein an adhesive layer is formed between the sealing portion and the interface forming portion. In any one of Claims 1 thru | or 6.
The point light source is composed of a transparent resin in which an LED chip and a phosphor are dispersed,
The light source module, wherein the LED chip is covered with the transparent resin. In any one of Claims 1 thru | or 6.
The point light source comprises an LED chip, a first transparent resin not containing a phosphor, and a second transparent resin in which the phosphor is dispersed,
The first transparent resin covers the LED chip,
The light source module, wherein the second transparent resin covers the first transparent resin. In any one of Claims 1 thru | or 8.
A light source module, wherein a flat region is partially formed on a surface of the transparent structure on a light emitting side. In claim 9,
The light source module according to claim 1, wherein the flat region is formed at a central portion or a peripheral portion of the transparent structure. In any one of Claims 1 thru | or 10.
A thickness of each of the plurality of convex portions is equal. In any one of Claims 1 thru | or 11,
A light source module comprising a plurality of the light source modules arranged as a surface light source. In the illuminating device which has a light source module in any one of Claims 1 thru | or 12,
A linear light source module in which one or more of the light source modules are arranged;
And a light guide plate that emits light from the line light source module. The lighting device having the light source module according to claim 12.
A diffusion plate that emits light from the light source module;
The diffusion plate is composed of base resin, fine particles and phosphor fine particles,
The fine particles and phosphor fine particles are dispersed in the base resin,
The illumination device according to claim 1, wherein a refractive index of the fine particles is different from a refractive index of the base resin. A pair of substrates;
A liquid crystal panel having a liquid crystal layer sandwiched between a pair of substrates;
A pair of polarizing plates disposed on both sides of the liquid crystal panel;
A lighting device according to claim 12,
The liquid crystal display device, wherein the illumination device emits light to the liquid crystal panel. A liquid crystal display device according to claim 15;
A signal processing unit that performs video signal processing on the liquid crystal display device;
A power supply unit for supplying power;
A video display device having a speaker;

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