JP5630383B2 - 配線体の接続構造、配線体、電子装置及び電子装置の製造方法 - Google Patents
配線体の接続構造、配線体、電子装置及び電子装置の製造方法 Download PDFInfo
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- JP5630383B2 JP5630383B2 JP2011125056A JP2011125056A JP5630383B2 JP 5630383 B2 JP5630383 B2 JP 5630383B2 JP 2011125056 A JP2011125056 A JP 2011125056A JP 2011125056 A JP2011125056 A JP 2011125056A JP 5630383 B2 JP5630383 B2 JP 5630383B2
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- metal plate
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- wiring board
- printed wiring
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 92
- 239000002184 metal Substances 0.000 claims description 92
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 230000002950 deficient Effects 0.000 description 8
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Liquid Crystal (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Planar Illumination Modules (AREA)
Description
1 配線体
2 金属板
3 フレキシブルプリント配線板
5 金属板連結手段
6 金属板連結手段
9 電子部品
10 第1の接続部
12 第2の接続部
14 金属板連結手段
Claims (14)
- 複数の配線体を接続する配線体の接続構造であって、
上記配線体は、熱伝導性を有する金属板と、上記金属板に接着剤を介して積層されたフレキシブルプリント配線板と、上記フレキシブルプリント配線板に搭載された電子部品とを備え、
上記金属板の少なくとも一側縁部から上記フレキシブルプリント配線板の一部を延出させて形成した第1の接続部を設ける一方、
上記金属板の少なくとも他側縁部に、隣接して配置された配線体の上記第1の接続部と接続される第2の接続部を設けるとともに、
上記金属板を連結する金属板連結手段を備えて構成される、配線体の接続構造。 - 上記第2の接続部は、上記金属板の他側縁部の内側に形成されている、請求項1に記載の配線体の接続構造。
- 上記第2の接続部は、上記金属板の他側縁部から上記フレキシブルプリント配線板の一部を延出させて形成されている、請求項1に記載の配線体の接続構造。
- 上記金属板連結手段は、各金属板に一体形成されるとともに隣接する金属板同士を互いに連結できる嵌合部を備えて構成される、請求項1から請求項3のいずれか1項に記載の配線体の接続構造。
- 上記金属板連結手段は、列状配置された複数の金属板に掛け渡し状に設けられる連結部材を備えて構成される、請求項1から請求項3のいずれか1項に記載の配線体の接続構造。
- 上記金属板連結手段はネジ手段を備えて構成されている、請求項1から請求項5のいずれか1項に記載の配線体の接続構造。
- 上記第1の接続部と上記第2の接続部は、互いに接続されるコネクタ部材を備えて構成されている、請求項1から請求項6のいずれか1項に記載の配線体の接続構造。
- 上記第1の接続部は、フレキシブルプリント配線板に形成された配線を露出して形成された接続電極部と、上記接続電極部形成部位の裏面に積層された補強部材とを備えて構成されるとともに、
上記第2の接続部は、上記接続電極部を挿入できるコネクタ部材を備えて構成される、請求項1から請求項7のいずれか1項に記載の配線体の接続構造。 - 請求項1から請求項8のいずれか1項に記載の配線体の接続構造に用いられる配線体。
- 請求項1から請求項8のいずれか1項に記載された配線体の接続構造を備える、電子装置。
- 上記電子部品としての発光素子が搭載された、請求項10に記載の照明装置。
- 複数の配線体を連結して構成される電子装置の製造方法であって、
連結手段を有する金属板を準備する金属板準備工程と、
第1の接続部と第2の接続部とを備え、上記第1の接続部と上記第2の接続部の少なくとも一方が、上記金属板の一側縁部から延出するように形成されたフレキシブルプリント配線板を準備するフレキシブルプリント配線板準備工程と、
上記金属板に、接着剤を介して上記フレキシブルプリント配線板を積層するフレキシブルプリント配線板積層工程と、
上記フレキシブルプリント配線板上に電子部品を搭載する電子部品搭載工程と、
上記工程を経て形成された複数の配線体を、上記連結手段を介して連結する金属板連結工程と、
隣接して配置される各配線体の上記第1の接続部と上記第2の接続部とを接続するフレキシブルプリント配線板接続工程とを含む、電子装置の製造方法。 - 上記金属板連結工程において、隣接する金属板を、上記連結手段を介して互いに連結する、請求項12に記載の電子装置の製造方法。
- 上記金属板連結工程において、複数の金属板に掛け渡し状に設けられる連結部材に対して各金属板を連結する、請求項12に記載の電子装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011125056A JP5630383B2 (ja) | 2011-06-03 | 2011-06-03 | 配線体の接続構造、配線体、電子装置及び電子装置の製造方法 |
PCT/JP2012/064019 WO2012165520A1 (ja) | 2011-06-03 | 2012-05-31 | 配線体の接続構造、配線体、電子装置、照明装置及び電子装置の製造方法 |
TW101119724A TW201304289A (zh) | 2011-06-03 | 2012-06-01 | 配線體之連接構造、配線體、電子裝置、照明裝置、及電子裝置之製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011125056A JP5630383B2 (ja) | 2011-06-03 | 2011-06-03 | 配線体の接続構造、配線体、電子装置及び電子装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012253213A JP2012253213A (ja) | 2012-12-20 |
JP5630383B2 true JP5630383B2 (ja) | 2014-11-26 |
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Family Applications (1)
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JP2011125056A Expired - Fee Related JP5630383B2 (ja) | 2011-06-03 | 2011-06-03 | 配線体の接続構造、配線体、電子装置及び電子装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5630383B2 (ja) |
TW (1) | TW201304289A (ja) |
WO (1) | WO2012165520A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI512233B (zh) * | 2013-01-25 | 2015-12-11 | Chi Lin Optoelectronics Co Ltd | 發光裝置及包含發光裝置之顯示器 |
KR101588498B1 (ko) * | 2013-07-24 | 2016-01-25 | 주식회사 엘지화학 | 연성인쇄회로기판의 구조체의 제조방법 |
JP6355038B2 (ja) * | 2013-10-30 | 2018-07-11 | パナソニックIpマネジメント株式会社 | 光源モジュール及び照明装置 |
CN103742817A (zh) * | 2014-01-28 | 2014-04-23 | 施中天 | 快装热管led灯具 |
DE202014100686U1 (de) * | 2014-02-17 | 2015-06-01 | Zumtobel Lighting Gmbh | Leiterplatte mit speziellen Kupplungsbereichen |
JP2017028034A (ja) * | 2015-07-17 | 2017-02-02 | 大日本印刷株式会社 | Led素子用のフレキシブル基板間の接続構造 |
CN109348615B (zh) * | 2018-11-09 | 2020-02-28 | 惠州市华星光电技术有限公司 | 显示模组 |
JP7498693B2 (ja) * | 2021-11-01 | 2024-06-12 | Necパーソナルコンピュータ株式会社 | 電子機器及び基板装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1131890A (ja) * | 1997-07-10 | 1999-02-02 | Matsushita Electric Ind Co Ltd | 回路基板 |
JP2001203314A (ja) * | 2000-01-20 | 2001-07-27 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP2004146540A (ja) * | 2002-10-23 | 2004-05-20 | Denso Corp | 接続型回路基板ならびに製造方法 |
JP2005243970A (ja) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | 複合回路基板 |
KR101150386B1 (ko) * | 2007-02-05 | 2012-06-01 | 프린코 코포레이션 | 다층기판 간의 상호 연결 구조 및 그 제조방법 |
-
2011
- 2011-06-03 JP JP2011125056A patent/JP5630383B2/ja not_active Expired - Fee Related
-
2012
- 2012-05-31 WO PCT/JP2012/064019 patent/WO2012165520A1/ja active Application Filing
- 2012-06-01 TW TW101119724A patent/TW201304289A/zh unknown
Also Published As
Publication number | Publication date |
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TW201304289A (zh) | 2013-01-16 |
WO2012165520A1 (ja) | 2012-12-06 |
JP2012253213A (ja) | 2012-12-20 |
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