JP5612298B2 - 発光モジュールおよび車両用灯具 - Google Patents
発光モジュールおよび車両用灯具 Download PDFInfo
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- JP5612298B2 JP5612298B2 JP2009265246A JP2009265246A JP5612298B2 JP 5612298 B2 JP5612298 B2 JP 5612298B2 JP 2009265246 A JP2009265246 A JP 2009265246A JP 2009265246 A JP2009265246 A JP 2009265246A JP 5612298 B2 JP5612298 B2 JP 5612298B2
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- 239000004065 semiconductor Substances 0.000 claims description 98
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 47
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 description 35
- 230000004313 glare Effects 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/155—Surface emitters, e.g. organic light emitting diodes [OLED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/16—Laser light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
- F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
- F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
図3は、第1の実施の形態に係る発光モジュールの要部を示す断面図である。発光モジュール32は、第1発光ユニット36a、第2発光ユニット36b、第3発光ユニット36c、第4発光ユニット36dと、第1発光ユニット36a〜第4発光ユニット36dを支持する基板34と、を有する。なお、各発光ユニット36a〜36dを特に区別しない場合は、総称して発光ユニット36と示す。本実施の形態に係る基板34は、実装基板である。
図8は、第2の実施の形態に係る発光モジュールの要部を示す断面図である。なお、第1の実施の形態と同様の構成については説明を適宜省略する。本実施の形態に係る発光モジュール132は、蛍光体層244の光出射側の面に複数の溝62が形成されている。これにより、複数の半導体発光素子42a〜42dを蛍光体層244に対して固定した後であっても、半導体発光素子が固定されていない光出射側からの加工が容易に行える。各溝62には、第1の実施の形態で説明した材料と同様に光の透過を妨げる遮光材料が充填され遮光部158b,158c,158dが構成されている。これにより、光波長変換部材を複数の部材に切断することなく、一体のまま遮光部158b,158c,158dを形成することができる。
図11は、第3の実施の形態に係る発光モジュールの要部を示す断面図である。なお、上述の各実施の形態と同様の構成については説明を適宜省略する。発光モジュール432は、蛍光体層244の一部に遮光部358b〜358dが設けられている。遮光部358bは、隣接する半導体発光素子42a,42bの発光面43a,43bのそれぞれと対向する各領域60a,60bの境界に形成されている。遮光部358cは、隣接する半導体発光素子42b,42cの発光面43b,43cのそれぞれと対向する各領域60b,60cの境界に形成されている。遮光部358dは、隣接する半導体発光素子42c,42dの発光面43c,43dのそれぞれと対向する各領域60c,60dの境界に形成されている。
図12は、上述のように構成される車両用前照灯装置の照射制御部と車両側の車両制御部の構成を説明する機能ブロック図である。車両用前照灯装置100の照射制御部102は、車両104に搭載された車両制御部106の指示にしたがって電源回路108の制御を行い第1灯具ユニット18や第2灯具ユニット20の照射制御を行う。
Claims (5)
- 複数の半導体発光素子と、
配列された前記複数の半導体発光素子を支持する基板と、
前記複数の半導体発光素子の発光面に対向するように設けられ、前記半導体発光素子が発する光の波長を変換する板状の光波長変換部材と、を備え、
前記光波長変換部材は、
蛍光体粉末を用いて作成されたセラミック素地を焼結することにより得られ、10μm以上1000μm未満の厚さの板状に形成されたものを前記半導体発光素子のサイズに合わせて加工されている蛍光セラミックであり、
隣接する前記半導体発光素子の発光面のそれぞれと対向する各領域の境界に形成された遮光部を有することを特徴とする発光モジュール。 - 前記遮光部は、前記光波長変換部材に形成された溝に、光の透過を妨げる遮光材料が充填されることで構成されていることを特徴とする請求項1に記載の発光モジュール。
- 前記溝は、前記光波長変換部材の光出射側の面に形成されていることを特徴とする請求項2に記載の発光モジュール。
- 複数の半導体発光素子のそれぞれが個別に調光可能なように構成されていることを特徴とする請求項1乃至3のいずれかに記載の発光モジュール。
- 請求項1乃至4のいずれかに記載の発光モジュールと、
前記発光モジュールが備える複数の半導体発光素子を複数のグループに分けた場合にグループ毎に調光制御する制御回路と、
を備えることを特徴とする車両用灯具。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009265246A JP5612298B2 (ja) | 2009-11-20 | 2009-11-20 | 発光モジュールおよび車両用灯具 |
CN2010105246739A CN102080787A (zh) | 2009-11-20 | 2010-10-26 | 发光模块以及车辆用灯具 |
US12/913,731 US8475023B2 (en) | 2009-11-20 | 2010-10-27 | Light emitting module and automotive lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009265246A JP5612298B2 (ja) | 2009-11-20 | 2009-11-20 | 発光モジュールおよび車両用灯具 |
Related Child Applications (1)
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JP2014107771A Division JP5808840B2 (ja) | 2014-05-26 | 2014-05-26 | 発光モジュールおよび車両用灯具 |
Publications (2)
Publication Number | Publication Date |
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JP2011108589A JP2011108589A (ja) | 2011-06-02 |
JP5612298B2 true JP5612298B2 (ja) | 2014-10-22 |
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JP2009265246A Expired - Fee Related JP5612298B2 (ja) | 2009-11-20 | 2009-11-20 | 発光モジュールおよび車両用灯具 |
Country Status (3)
Country | Link |
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US (1) | US8475023B2 (ja) |
JP (1) | JP5612298B2 (ja) |
CN (1) | CN102080787A (ja) |
Families Citing this family (46)
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CN112879862A (zh) * | 2019-11-29 | 2021-06-01 | 华域视觉科技(上海)有限公司 | 可控制发光间隔的车灯结构及汽车 |
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2010
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US20110121731A1 (en) | 2011-05-26 |
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CN102080787A (zh) | 2011-06-01 |
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