JP5691775B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a cooling means for a semiconductor module constituting a power conversion circuit.

A power conversion circuit such as a DC-DC converter circuit or an inverter circuit is used to generate a drive current for energizing an AC motor that is a power source of an electric vehicle or a hybrid vehicle, for example.
In general, in an electric vehicle, a hybrid vehicle, and the like, a large driving current is required to secure a large driving torque from an AC motor. Therefore, in the power conversion circuit that generates a drive current for the AC motor, heat generated from a semiconductor module including a power semiconductor element such as an IGBT constituting the power conversion circuit tends to increase.

Therefore, conventionally, there has been proposed a power conversion device in which a plurality of cooling pipes through which a coolant flows are stacked with a semiconductor module so that the plurality of semiconductor modules constituting the power conversion circuit can be cooled (Patent Document). 1, Patent Document 2).
In addition, as shown in Patent Documents 1 and 2, a power conversion device 9 in which a cooling pipe and a semiconductor module are laminated includes a semiconductor laminated body that is a laminated body of a semiconductor module 921 and a cooling pipe 922 as shown in FIG. A unit 92, a frame 93 in which an opening 931 that opens in a direction orthogonal to the stacking direction is formed and the semiconductor stacking unit 92 is disposed therein, and a pressure member 96 that pressurizes the semiconductor stacking unit 92 in the stacking direction. And have.

By the way, as described above, the power conversion device 9 may be installed in an environment that is susceptible to vibration, such as an electric vehicle or a hybrid vehicle.
In the power conversion device 9, the semiconductor stacking unit 92 is fixed in the stacking direction by pressing the semiconductor stacking unit 92 against the inner wall portion of the frame 93 by the pressing member 96 with a large force. Therefore, even if the vibration is applied, the semiconductor lamination unit 92 can be prevented from vibrating with respect to the frame 93 in the lamination direction.

JP 2007-166819 A JP 2007-166820 A

However, there are few fixed points of the semiconductor multilayer unit 92 with respect to the frame 93 in the direction orthogonal to the stacking direction and the opening direction of the opening 931 in the frame 93 (hereinafter referred to as the opening direction). Therefore, it is conceivable that the rigidity of the semiconductor laminated unit 92 is insufficient in an environment that is susceptible to vibration. In this case, for example, a displacement occurs between the pressure member 96 and the semiconductor multilayer unit 92, and the pressurizing force in the stacking direction is not easily transmitted to the semiconductor multilayer unit 92. As a result, a sufficient contact state between the semiconductor module 921 and the cooling pipe 922 cannot be obtained, and a cooling function of the semiconductor module 921 may be deteriorated.
Further, in some cases, there is a possibility that a deviation occurs between the semiconductor module 921 and the cooling pipe 922. If it does so, it will become difficult to obtain an appropriate contact position of both. As a result, the cooling function of the semiconductor module 921 may be reduced.
Furthermore, since the open part 931 is formed also about the frame 93, it is difficult to obtain high rigidity.

  Although not shown, the refrigerant introduction pipe is fixed by fixing the refrigerant introduction pipe 923 and the refrigerant discharge pipe 924 of the cooling pipe 922 on one end side of the semiconductor laminated unit 92 to the frame 93 using, for example, a pipe clamp or the like. It is conceivable to fix 923 and the refrigerant discharge pipe 924 in the opening direction. However, this fixing method is insufficient as a vibration isolating means in the opening direction of the semiconductor laminated unit 92.

  The present invention has been made in view of such problems, and can suppress the vibration of the semiconductor stacked unit with respect to the frame in the direction orthogonal to the stacking direction (the opening direction) and improve the rigidity of the frame. An object of the present invention is to provide a power conversion device that can perform the above-described operation.

The present invention provides a semiconductor laminated unit formed by laminating a semiconductor module containing a semiconductor element and a cooling pipe for cooling the semiconductor module;
A frame that has an open portion that opens in a direction perpendicular to the stacking direction of the semiconductor stacking unit, and the semiconductor stacking unit is disposed inside;
A plate fixed to the frame so as to cover the open portion,
The frame has a support part for supporting the semiconductor laminated unit from the side opposite to the open part,
Between the semiconductor laminated unit and the plate, an elastic member biased so as to press the semiconductor laminated unit toward the support portion is disposed ,
The semiconductor module has an end surface orthogonal to the opening direction at least on the opening portion side in the opening direction of the opening portion, and at least one of the main electrode terminal and the signal terminal protrudes from the end surface,
A chamfered portion that is chamfered so as to form an inclined surface is formed at both edges of the end surface in the direction perpendicular to the stacking direction and the opening direction,
The elastic member is located in the power conversion device, which is disposed between the chamfered portion and the plate (claim 1).

In the power conversion device according to the present invention, the elastic member is disposed between the semiconductor stacked unit and the plate. Thereby, the said semiconductor lamination | stacking unit can be elastically pressed toward the said support part. Thereby, the said semiconductor laminated unit can be fixed to the opening direction of the said open part. Therefore, it is possible to suppress vibration in a direction (the opening direction) perpendicular to the stacking direction of the semiconductor stacked unit with respect to the frame. As a result, it is possible to prevent a change in the contact state between the cooling pipe and the semiconductor module in the semiconductor laminated unit and to prevent a cooling function of the cooling pipe from being lowered.
Further, since the plate is fixed to the frame so as to cover the open part of the frame, the rigidity of the frame can be improved.

  As described above, according to the present invention, it is possible to provide a power conversion device that can suppress vibration in a direction orthogonal to the stacking direction of the semiconductor stacked units (the opening direction) and improve the rigidity of the frame. be able to.

Plane explanatory drawing of the power converter device in Example 1. FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. 3 is an enlarged explanatory view with a partial cross section of the arrangement state of the elastic member in the first embodiment. Plane explanatory drawing of the power converter device in a reference example . FIG. 5 is a cross-sectional view taken along line BB in FIG. 4. Plane | planar explanatory drawing of the power converter device in background art.

As the material of the frame, for example, a metal such as an aluminum material having excellent thermal conductivity is used, and as the material of the plate and the elastic member, for example, a metal such as a resin or an aluminum material is used. it can.
The elastic member may be formed separately from the plate or may be formed integrally with the plate.

Preferably, the elastic member is a leaf spring, and the plate is formed with a spring fixing portion capable of engaging and fixing at least a part of the elastic member. In this case, a large urging force can be easily obtained with a small size by using a leaf spring as the elastic member.
Further, by forming the spring fixing portion, the elastic member can be positioned and fixed with respect to the plate easily and accurately. Accordingly, the elastic member can be brought into contact with the semiconductor module at an accurate position, and the semiconductor laminated unit can be surely pressed toward the support portion.

The semiconductor module has an end surface orthogonal to the opening direction on at least the open portion side in the opening direction, and at least one of the main electrode terminal and the signal terminal protrudes from the end surface, and the end surface Chamfered portions that are chamfered so as to form inclined surfaces are formed at both edges of the stacking direction and the direction orthogonal to the opening direction (hereinafter, this is referred to as the width direction). elastic member, that is disposed between the chamfered portion and the plate.

Therefore , the elastic member can be brought into surface contact with the inclined surface of the chamfered portion. Thereby, the said semiconductor module can be pressed not only toward the said support part side in the said opening direction but toward the inner side of the said width direction. Therefore, not only the vibration in the opening direction but also the vibration in the width direction can be effectively suppressed for the semiconductor laminated unit.

Further, the inside of the frame, at one end in the stacking direction of the semiconductor laminate unit, it is preferable that pressing member for pressing the semiconductor laminate unit in the stacking direction are arranged (claim 3). In this case, the semiconductor lamination unit can be pressed and fixed in the lamination direction. In such a configuration, the elastic member can suppress the vibration in the opening direction of the semiconductor multilayer unit relative to the frame, thereby preventing a shift between the pressure member and the semiconductor multilayer unit. As a result, the pressing force in the stacking direction on the semiconductor stacked unit can be stabilized. Therefore, a sufficient contact state between the semiconductor module and the cooling pipe can be ensured. As a result, it is possible to prevent the cooling function of the semiconductor module from being lowered by the cooling pipe in the semiconductor laminated unit.

Moreover, it is preferable that the said elastic member is arrange | positioned in the said semiconductor lamination unit in the position near the said pressurization member rather than the center of the said lamination direction (Claim 4 ). In this case, it is possible to effectively suppress the vibration of a portion that is susceptible to the vibration in the opening direction in the semiconductor multilayer unit.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of this example includes a semiconductor stacked unit 2 in which a semiconductor module 21 incorporating a semiconductor element and a cooling pipe 22 that cools the semiconductor module 21 are stacked.
In addition, the power conversion device 1 includes an open portion 31 that opens in a direction (opening direction Z) orthogonal to the stacking direction X of the semiconductor stacked unit 2, a frame 3 that arranges the semiconductor stacked unit 2 inside, and an open portion. The plate 4 is fixed to the frame 3 so as to cover 31.

As shown in FIG. 2, the frame 3 has a support portion 32 that supports the semiconductor multilayer unit 2 from the side opposite to the opening portion 31.
Further, an elastic member 5 that is biased to press the semiconductor multilayer unit 2 toward the support portion 32 is disposed between the semiconductor multilayer unit 2 and the plate 4.

The elastic member 5 is a leaf spring, and the plate 4 is formed with a spring fixing portion 41 that can engage and fix at least a part of the elastic member 5.
Here, as shown in FIG. 3, the elastic member 5 includes a pressing portion 51 that presses the semiconductor laminated unit 2, an engaging portion 52 that engages with the spring fixing portion 41, and the pressing portion 51 and the engaging portion 52. And a base 53 to be connected.

  Moreover, in this example, the press part 51 of the elastic member 5, the engaging part 52, and the base 53 are comprised by the following shapes in the elastic member 5 which consists of leaf | plate springs. That is, the pressing portion 51 is formed of a bent portion formed by bending one end side portion of the elastic member 5 having a flat plate shape before processing in a downward direction in the opening direction Z. Further, the engaging portion 52 is formed of a folded portion formed by bending the other end side portion of the elastic member 5 downward in the opening direction Z and folding the tip portion toward the bent portion. The base 53 includes a flat plate portion between the pressing portion 51 and the engaging portion 52.

Further, as shown in FIGS. 2 and 3, the spring fixing portion 41 is formed on the lower surface 40 of the plate 4 on both sides in the direction (width direction Y) orthogonal to the stacking direction X in the plate 4. Further, a plurality of spring fixing portions 41 are formed in the stacking direction X in the plate 4 according to the number of the elastic members 5 arranged.
Each spring fixing portion 41 includes a protruding portion 42 that protrudes downward from the lower surface 40 of the plate 4 toward the lower side of the frame 3, and an extension that extends inward in the width direction Y from an end portion on the protruding side. It is formed inside the key-shaped part formed of the part 421.

Moreover, as shown in FIGS. 1-3, a pair of side wall part 422 is formed so that the spring fixing | fixed part 41 may be pinched | interposed from the both sides of the lamination direction X. As shown in FIG. That is, the spring fixing portion 41 is formed in the space portion between the lower surface 40 of the plate 4, the extending portion 421, and the pair of side wall portions 422. The spring fixing portion 41 is engaged with the engaging portion 52 of the elastic member 5 so that the elastic member 5 is fixed to the plate 4.
In this example, the frame 3, the plate 4, and the elastic member 5 are made of metal having excellent thermal conductivity.

  In addition, as shown in FIG. 2, the semiconductor module 21 has an end surface 210 orthogonal to the opening direction Z on the open portion 31 side in the opening direction Z, and a signal terminal 213 protrudes from the end surface 210. A main electrode terminal 212 protrudes from an end surface 211 opposite to the end surface 210 in the semiconductor module 21.

  The shape of the semiconductor module 21 is not limited to this. For example, each of the main electrode terminal 212 and the signal terminal 213 may protrude from either the end face 210 or the end face 211, or the main electrode terminal 212 and the signal terminal 213 from either the end face 210 or the end face 211. Both may be protruded.

Further, chamfered portions 215 chamfered so as to form inclined surfaces are formed at both edges of the end surface 210 in the direction orthogonal to the stacking direction X and the opening direction Z (width direction Y).
The elastic member 5 is disposed between the chamfered portion 215 and the plate 4. Specifically, the pressing portion 51 of the elastic member 5 is formed in surface contact with the chamfered portion 215.
Further, in this example, a plurality of pairs of elastic members 5 are arranged in the lamination direction X for all the semiconductor modules 21 in the semiconductor lamination unit 2, but the number of arrangement of the elastic members 5 is limited at all. is not.

  Further, as shown in FIG. 1, a pressure member 6 that pressurizes the semiconductor multilayer unit 2 in the stacking direction X is disposed inside the frame 3 at one end 23 in the stacking direction X of the semiconductor stacked unit 2. Yes. In addition, the arrangement | positioning location of the pressurization member 6 is not limited to this, For example, you may arrange | position the pressurization member 6 in the other edge part 25 of the lamination direction X of the semiconductor lamination unit 2. FIG. In this case, the pressurizing member 6 is disposed between the refrigerant introduction pipe 223 and the refrigerant discharge pipe 224.

  Further, as shown in FIGS. 1 to 3, the plate 4 is formed with a relief portion 45 formed of a through hole for projecting the signal terminal 213 of the semiconductor module 21 toward the outside of the frame 3. A plurality of escape portions 45 are formed in the stacking direction X between the pair of spring fixing portions 41. The escape portion 45 is configured so that the shape viewed from the opening direction Z is substantially rectangular, and all the signal terminals 213 of one semiconductor module 21 penetrate the respective escape portions 45.

  However, the shape and number of the relief portions 45 are not particularly limited as long as the signal terminals 213 can be escaped. Therefore, for example, the relief portion 45 may be formed in a square shape so that the group of signal terminals 213 in the semiconductor module 21 can escape to the outside. Alternatively, each of the signal terminals 213 may be formed with a through hole that can escape to the outside as the escape portion 45.

  Further, as shown in FIG. 2, a support portion 32 is formed on the frame 3 on the side opposite to the opening portion 31. The support portion 32 includes a first support portion 321 that supports the cooling pipe 22 and a second support portion 322 that supports the semiconductor module 21. That is, as shown in the figure, a pair of first support portions 321 are formed from the lower end surfaces of the side wall portions 33 of the frame 3 toward the inside in the width direction Y of the frame 3. A pair of second support portions 322 extending from the inner ends of the pair of first support portions 321 to the inner side in the width direction Y are formed via a stepped portion that is lowered downward. ing.

  Further, an opening 34 penetrating in the opening direction Z is formed between the pair of second support portions 322. The second support portion 322 supports the semiconductor module 21 so that the main electrode terminal 212 protrudes from the opening 34.

  The semiconductor module 21 includes a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (MOS field effect transistor). The semiconductor module 21 includes a main body portion 216 formed by resin-molding a switching element, a main electrode terminal 212 protruding from the main body portion 216 in opposite directions, and a signal terminal 213. Controlled power is input to and output from the main electrode terminal 212 to the semiconductor module 21, and a control current for controlling the switching element is input to the signal terminal 213.

  Further, as shown in FIG. 1, the semiconductor lamination unit 2 is constituted by alternately laminating semiconductor modules 21 and cooling pipes 22. And the semiconductor module 21 is clamped by the cooling pipe 22 from both main surfaces. One semiconductor module 21 is sandwiched between adjacent cooling pipes 22.

  Here, the semiconductor module 21 of this example is a so-called 2-in-1 type semiconductor module in which two semiconductor elements and two diodes are incorporated. However, the semiconductor module 21 is not limited to this. Therefore, for example, a semiconductor module containing one semiconductor element and one diode may be used, or a semiconductor module containing three or more semiconductor elements and diodes may be used.

  Further, as shown in FIG. 1, the plurality of cooling pipes 22 are long in a direction (width direction Y) orthogonal to the stacking direction X, and form a coolant channel along the width direction Y inside. The cooling pipes 22 adjacent to each other in the stacking direction X are connected to each other by connecting pipes 24 at both ends in the longitudinal direction.

  Further, the cooling pipe 22 has a refrigerant introduction pipe 223 and a refrigerant discharge pipe 224 at both ends in the width direction Y of the cooling pipe 22 arranged at one end in the stacking direction X. Thereby, the cooling medium introduced from the refrigerant introduction pipe 223 passes through the connection pipe 24 as appropriate, is distributed to the respective cooling pipes 22 and circulates in the longitudinal direction (width direction Y). The cooling medium exchanges heat with the semiconductor module 21 while flowing through each cooling pipe 22. Then, the cooling medium whose temperature has risen due to heat exchange passes through the downstream connecting pipe 24 as appropriate, is led to the cooling discharge pipe 224, and is discharged from the cooling pipe 22.

Next, the effect about the power converter device 1 of this example is demonstrated.
In the power conversion device 1 of this example, an elastic member 5 is disposed between the semiconductor multilayer unit 2 and the plate 4. As a result, the semiconductor multilayer unit 2 can be elastically pressed toward the support portion 32. Thereby, the semiconductor stacked unit 2 can be fixed in the opening direction Z of the opening 31. Therefore, vibration in a direction (opening direction Z) orthogonal to the stacking direction X of the semiconductor stacked unit 2 with respect to the frame 3 can be suppressed. As a result, a change in the contact state between the cooling pipe 22 and the semiconductor module 21 in the semiconductor laminated unit 2 can be prevented, and a decrease in the cooling function of the cooling pipe 22 can be prevented.
Further, since the plate 4 is fixed to the frame 3 so as to cover the open portion 31 of the frame 3, the rigidity of the frame 3 can be improved.

The elastic member 5 is a leaf spring, and the plate 4 is formed with a spring fixing portion 41 that can engage and fix at least a part of the elastic member 5. Accordingly, by using the elastic member 5 as a leaf spring, a large biasing force can be easily obtained with a small size.
Further, by forming the spring fixing portion 41, the elastic member 5 can be positioned and fixed with respect to the plate 4 easily and accurately. Thereby, the elastic member 5 can be brought into contact with the semiconductor module 21 at an accurate position, and the semiconductor laminated unit 2 can be reliably pressed toward the support portion 32.

Further, the semiconductor module 21 has an end surface 210 orthogonal to the opening direction Z on at least the open portion 31 side in the opening direction Z, and at least one of the main electrode terminal 212 and the signal terminal 213 protrudes from the end surface 210. .
Further, chamfered portions 215 that are chamfered so as to form inclined surfaces are formed at both edges of the end surface 210 in the direction orthogonal to the stacking direction X and the opening direction Z.
The elastic member 5 is disposed between the chamfered portion 215 and the plate 4.

  Thereby, the elastic member 5 can be brought into surface contact with the inclined surface of the chamfered portion 215. As a result, the semiconductor module 21 can be pressed not only toward the support portion 32 in the opening direction Z but also toward the inside in the width direction Y. Therefore, not only the vibration in the opening direction Z but also the vibration in the width direction Y can be effectively suppressed for the semiconductor multilayer unit 2.

  Further, inside the frame 3, a pressing member 6 that pressurizes the semiconductor multilayer unit 2 in the stacking direction X is disposed at one end 23 in the stacking direction X of the semiconductor multilayer unit 2. Thereby, the semiconductor lamination unit 2 can be pressed and fixed with respect to the lamination direction X. In such a configuration, the elastic member 5 can suppress the vibration in the opening direction Z of the semiconductor multilayer unit 2 with respect to the frame 3, thereby preventing the displacement between the pressure member 6 and the semiconductor multilayer unit 2. Thereby, the pressing force in the stacking direction X on the semiconductor stacked unit 2 can be stabilized. Therefore, a sufficient contact state between the semiconductor module 21 and the cooling pipe 22 can be ensured. As a result, it is possible to prevent the cooling function of the semiconductor module 21 from being lowered by the cooling pipe 22 in the semiconductor laminated unit 2.

  In addition, the elastic member 5 is disposed at a position closer to the pressing member 6 than the center in the stacking direction X in the semiconductor stacked unit 2. Thereby, the vibration can be effectively suppressed for the portion that is susceptible to the vibration in the opening direction Z in the semiconductor multilayer unit 2.

  As described above, according to this example, it is possible to provide a power conversion device that can suppress vibration in a direction (opening direction) orthogonal to the stacking direction of the semiconductor stacking unit and improve the rigidity of the frame. it can.

( Reference example )
In this example, as shown in FIGS. 4 and 5, the elastic member 5 is disposed between the cooling pipe 22 and the plate 4.
In this example, the elastic member 5 includes a wave-like portion 54 that can be elastically deformed, and a pair of standing portions 55 and 56 that are formed to rise in the elastic forming direction at both ends of the wave-like portion 54.

  A plurality of spring fixing portions 41 are formed on the plate 4 so as to correspond to the plurality of elastic members 5. The spring fixing portion 41 is configured by a substantially rectangular through hole penetrating in the opening direction Z of the frame 3. The elastic member 5 is positioned and fixed with respect to the plate 4 by engaging the standing portion 55 on one side of the elastic member 5 with the spring fixing portion 41.

Further, the standing portion 56 on the other side of the elastic member 5 is engaged with a groove formed on the upper end surface 221 of the cooling pipe 22. In the state where the plate 4 is fixed to the frame 3, the waved portion 54 of the elastic member 5 is compressed and deformed. Accordingly, the elastic member 5 can press the cooling pipe 22 toward the support portion 32 in the opening direction Z. As a result, the semiconductor laminated unit 2 is fixed to the frame 3.
Others are the same as in the first embodiment.

The elastic member 5 is disposed between the cooling pipe 22 and the plate 4. Thereby, the heat of the cooling pipe 22 can be radiated to the plate 4 through the elastic member 5. Therefore, the heat dissipation of the cooling pipe 22 can be improved.
In addition, the same effects as those of the first embodiment are obtained.

In addition, although the semiconductor lamination | stacking unit 2 shown in the said Example 1 is comprised by laminating | stacking the semiconductor module 21 and the cooling pipe 22 alternately as mentioned above, it is not limited to this. Therefore, for example, the semiconductor laminated unit 2 may be formed by laminating a plurality of refrigerant flow path integrated semiconductor modules formed with a refrigerant flow path on the outer periphery of the semiconductor module.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor lamination | stacking unit 21 Semiconductor module 22 Cooling pipe 3 Frame 31 Opening part 32 Supporting part 4 Plate 5 Elastic member

Claims (4)

A semiconductor laminated unit formed by laminating a semiconductor module containing a semiconductor element and a cooling pipe for cooling the semiconductor module;
A frame that has an open portion that opens in a direction perpendicular to the stacking direction of the semiconductor stacking unit, and the semiconductor stacking unit is disposed inside;
A plate fixed to the frame so as to cover the open portion,
The frame has a support part for supporting the semiconductor laminated unit from the side opposite to the open part,
Between the semiconductor laminated unit and the plate, an elastic member biased so as to press the semiconductor laminated unit toward the support portion is disposed ,
The semiconductor module has an end surface orthogonal to the opening direction at least on the opening portion side in the opening direction of the opening portion, and at least one of the main electrode terminal and the signal terminal protrudes from the end surface,
A chamfered portion that is chamfered so as to form an inclined surface is formed at both edges of the end surface in the direction perpendicular to the stacking direction and the opening direction,
The power conversion device , wherein the elastic member is disposed between the chamfered portion and the plate .   2. The power conversion device according to claim 1, wherein the elastic member is a leaf spring, and the plate is formed with a spring fixing portion capable of engaging and fixing at least a part of the elastic member. A power converter. 3. The power conversion device according to claim 1, wherein a pressure member that pressurizes the semiconductor multi-layer unit in the stacking direction is disposed inside the frame at one end in the stack direction of the semiconductor multi-layer unit. power converter, characterized in that is. 4. The power conversion device according to claim 3, wherein the elastic member is arranged at a position closer to the pressing member than a center in the stacking direction in the semiconductor stacked unit . 5.

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