JP5675396B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus that emits a laser beam from a processing head and simultaneously ejects a processing gas to perform cutting processing.

In conventional laser cutting using a processing gas, the center of the processing nozzle that ejects the processing gas and the center of the optical axis of the laser beam are decentered, and the optical axis of the laser beam is shifted from the center of the processing nozzle to the direction of processing It is widely known that the high-quality cutting process can be performed by controlling the flow direction of the melt and the sputter adhesion region.
As a method of decentering the machining nozzle center and the optical axis of the laser beam, a method of moving the machining nozzle to an arbitrary position on a plane orthogonal to the laser beam by using two drive motors as drive devices, or a laser beam A method of moving to an arbitrary position on a curved surface with the optical axis as a normal is disclosed (for example, see Patent Document 1).
As another method, the amount of eccentricity at the center of the machining nozzle relative to the laser beam optical axis is set in advance depending on the workpiece material, plate thickness, etc. A method for maintaining the direction is disclosed (for example, see Patent Document 2).
On the other hand, a method of swinging a mirror and a processed lens by a crank mechanism using a small motor is also disclosed (for example, Patent Document 3).

Japanese Patent No. 3287112 (paragraph [0009], FIGS. 1 to 4) JP-A-11-90663 (paragraphs [0012] to [0015], FIGS. 3 and 4) JP-A-5-169285 (paragraphs [0010] and [0011], FIGS. 1 to 7)

However, according to the above-mentioned Patent Documents 1 and 2, the machining head main body is always subjected to the pressure of the machining gas, and requires a structure for moving while maintaining airtightness and a pressure-resistant structure against the gas pressure. However, there is a problem that the structure of the processing head main body becomes complicated and the weight increases.
Further, in the case of a laser processing apparatus that scans the processing head body, if the weight of the processing head body increases, a load is applied to the scanning mechanism of the processing head body, the scanning speed decreases, and the scanning accuracy deteriorates. It was.
Further, according to the above-mentioned Patent Document 3, a mechanical mechanism such as a ball screw, a spur gear (spur gear), or a crank mechanism is required to convert the rotational motion of the drive motor into a linear motion. The conventional feed mechanism has a problem in that it is difficult to avoid backlash and the like, and therefore positioning accuracy is limited.

  An object of the present invention is to solve the above problems, and a laser processing apparatus capable of decentering the center of the opening of the processing nozzle and the optical axis of the laser beam with high accuracy at high speed. It is intended to be provided to.

A laser processing apparatus according to the present invention includes a laser oscillator that oscillates a laser beam,
A processing head main body to which the laser beam is transmitted via a laser beam transmission system, a processing nozzle attached to an end of the processing head main body and having an opening directed toward the work, and a gas for supplying the processing gas to the processing nozzle A supply device, and a partition plate provided in the processing nozzle or the processing head main body and preventing the processing gas from entering the processing head main body through the processing nozzle,
The processing head body includes a processing lens for condensing the laser beam toward the workpiece, a processing lens holding mechanism that surrounds the processing lens and holds a peripheral edge, and the processing lens on the optical axis of the laser beam. A magnetic movement mechanism that moves linearly in two axes by magnetic drive with an electromagnet in a vertical plane is provided .
The magnetic movement mechanism includes an elastic hinge that is provided upright with respect to a driving plane of the processing lens and restricts the processing lens from moving in the direction of the optical axis .
The elastic hinge includes a first leaf spring that can be deformed in one direction along the drive plane and a second leaf spring that can be deformed in a direction perpendicular to the one direction along the drive plane. Has been
The first plate spring has one end fixed to a fixed base supported by the magnetic movement mechanism and the other end fixed to an intermediate plate provided on the opposite side of the magnetic movement mechanism from the fixed base. And
One end of the second leaf spring is fixed to the processing lens holding mechanism, and the other end is fixed to the intermediate plate.

A laser processing apparatus according to the present invention includes a laser oscillator that oscillates a laser beam, a processing head body that transmits the laser beam via a laser beam transmission system, and an opening that is attached to an end of the processing head body. A machining nozzle directed to the workpiece, a gas supply device for supplying the machining gas to the machining nozzle, and the machining gas provided in the machining nozzle or the machining head main body enters the machining head main body through the machining nozzle And a partition plate for preventing
The processing head body includes a processing lens for condensing the laser beam toward the workpiece, a processing lens holding mechanism that surrounds the processing lens and holds a peripheral edge, and the processing lens on the optical axis of the laser beam. A magnetic movement mechanism that moves the biaxial curve by magnetic drive with an electromagnet within a vertical curved surface,
The magnetic movement mechanism includes an elastic hinge that is provided upright with respect to a driving plane of the processing lens and restricts the processing lens from moving in the direction of the optical axis .
The elastic hinge includes a first leaf spring that can be deformed in one direction along the drive plane and a second leaf spring that can be deformed in a direction perpendicular to the one direction along the drive plane. Has been
The first plate spring has one end fixed to a fixed base supported by the magnetic movement mechanism and the other end fixed to an intermediate plate provided on the opposite side of the magnetic movement mechanism from the fixed base. And
One end of the second leaf spring is fixed to the processing lens holding mechanism, and the other end is fixed to the intermediate plate.

According to the laser processing apparatus according to the present invention, since the processing gas is prevented from entering the processing head main body by the partition plate, the processing head main body does not need an airtight and pressure-resistant structure against the processing gas, The structure can be simplified and the weight can be reduced.
Further, since the processing lens is moved biaxially or biaxially by a magnetic movement mechanism that can be miniaturized instead of a mechanical feed mechanism, the machining head body is miniaturized.
Further, the processing lens moves at high speed and is positioned with high accuracy by the magnetic attraction generated by the current flowing through the electromagnet.

It is a block diagram which shows the laser processing apparatus by Embodiment 1 of this invention. It is sectional drawing which shows the usage condition of the process head main body of FIG. 1, a process nozzle, and a workpiece | work. It is sectional drawing which shows another usage condition of the process head main body of FIG. 1, a process nozzle, and a workpiece | work. It is a block diagram which shows the magnetic moving mechanism of FIG. It is a block diagram which shows the usage condition of the magnetic moving mechanism of FIG. It is a block diagram which shows the magnetic moving mechanism of the laser processing apparatus by Embodiment 2 of this invention. FIG. 7A is a block diagram showing a magnetic movement mechanism 4B of the laser machining apparatus according to Embodiment 3 of the present invention, and FIG. 7B is a cross section taken along the line AA ′ of FIG. 7A. FIG. 7C is a cross-sectional view taken along line BB ′ in FIG. FIG. 8A is a block diagram showing the magnetic movement mechanism of the laser machining apparatus according to Embodiment 4 of the present invention, and FIG. 8B is a cross-sectional view taken along the line AA ′ in FIG. FIG. 8C is a cross-sectional view taken along the line BB ′ in FIG. 9 (a) to 9 (c) are schematic diagrams of the laser machining apparatus according to Embodiment 4 of the present invention when the machining lens is moved. It is a figure which shows the modification of the leaf | plate spring for y direction movements of Embodiment 4 of this invention. It is a block diagram which shows the laser processing apparatus by Embodiment 5 of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or equivalent members and parts will be described with the same reference numerals.

Embodiment 1 FIG.
1 is a block diagram showing a laser processing apparatus according to Embodiment 1 of the present invention.
In each figure, the surface to be cut is the xy plane, and the direction perpendicular to it is defined as the z-axis.
The laser processing apparatus 30 includes a laser oscillator 11 that oscillates a laser beam 7, a laser beam transmission system 20 that transmits the laser beam 7 into the processing head main body 3 via a plurality of mirrors 12, and the processing head main body 3. Based on the attached processing nozzle 2, a gas supply device for supplying the processing gas 6 to the processing nozzle 2, the type of the work 5 and the processing conditions, the supply amount of the processing gas 6, the beam output of the laser oscillator 11, the processing And a control device 16 for controlling the driving of the head body 3.
Here, the workpiece 5 is made of various materials such as metal, resin, ceramic, glass, and crystal. In particular, when the workpiece 5 is a metal, the processing gas 6 can generate a metal oxidation heat and perform cutting at a higher speed.

FIG. 2 is a cross-sectional view of the processing head main body 3, the processing nozzle 2, and the workpiece 5 of FIG. 1, and shows a detailed configuration at the time of piercing (processing for forming a through hole at a cutting processing start position).
The processing head body 3 is provided around the processing lens holding mechanism 17, a circular processing lens 13 disposed on the central axis of the processing head, a processing lens holding mechanism 17 that surrounds the processing lens 13 and holds a peripheral edge portion. The processing lens 13 is provided opposite to the processing lens 13 and the magnetic movement mechanism 4 for linearly moving the processing lens 13 in a plane perpendicular to the optical axis 1 of the laser beam 7, and the processing gas 6 is processed through the processing nozzle 2. And a partition plate 21 for preventing entry into the head main body 3.
In the processing nozzle 2, the tip end of the processing gas introduction pipe 22 faces the inside, and an opening facing the workpiece 5 is formed at the tip.
The gas supply device includes, for example, a gas cylinder 14 containing oxygen (O ₂ ) gas or nitrogen (N ₂ ) gas, a processing gas introduction pipe 22 that connects the gas cylinder 14 and the processing nozzle 2, and the processing gas introduction pipe. 22 and a gas valve 15 that adjusts the supply amount of the processing gas 6.
A compressor that supplies high-pressure air may be used instead of the gas cylinder 14.
The control device 16 is connected to the gas valve 15, the laser oscillator 11, and the magnetic movement mechanism 4. Based on the type of workpiece and the processing conditions, the control device 16 supplies the processing gas 6, the beam output of the laser oscillator 11, and the processing lens 13. Control the position.

In this laser processing apparatus 30, the laser beam 7 oscillated from the laser oscillator 11 is guided into the processing head main body 3 through the laser beam transmission system 20, and is condensed by the processing lens 13 in the processing head main body 3. The workpiece 5 is irradiated through the opening 8 at the tip of 2. Since the laser processing apparatus 30 shown in FIG. 2 is during piercing processing, the workpiece 5 is stationary, and the optical axis 1 of the laser beam 7 is the center of the processing lens 13 and the opening 8 of the processing nozzle 2. It coincides with the center 9.
On the other hand, the processing gas 6 is introduced into the processing nozzle 2 from the processing gas introduction pipe 22 and is ejected to the workpiece 5 from the opening 8 of the processing nozzle 2. In the work 5, the material is heated, melted and blown off by the laser beam 7 and the processing gas 6. By this operation, the piercing hole 5a is formed, and a through hole serving as a cutting start position is formed.

FIG. 3 is a cross-sectional view of the processing head main body 3, the processing nozzle 2, and the workpiece 5 of FIG. 1, and shows details during the cutting process.
A cutting groove 5b is formed in a portion of the workpiece 5 scanned with the laser beam 7, and cutting is performed.
Here, when the processing lens 13 moves the processing lens central axis 23 in the direction of reference numeral 24 with respect to the optical axis 1 by the magnetic movement mechanism 4, the laser beam 7 is bent in the direction of the processing lens central axis 23 and processed. The light is collected on the lens center axis 23. As the laser beam 7 is bent, the position of the laser beam 7 at the opening 8 of the processing nozzle 2 is away from the opening center 9.
For example, as shown in FIG. 3, when the position of the laser beam 7 is decentered with respect to the opening center 9 in the processing progress direction, the processing gas 6 and the melt 10 are cut after the cutting groove 5b is formed. It flows smoothly along the groove 5b.
Here, the magnetic movement mechanism 4 is a combination of mechanisms that perform biaxial linear movement, and is controlled to an arbitrary position based on the type of workpiece 5 and processing conditions.
Here, the amount of eccentricity of the laser beam 7 is selected according to parameters such as the processing material of the workpiece 5, the thickness, the type of the processing gas 6, the spraying amount, the processing speed, and the intensity of the laser beam 7.

FIG. 4 is a configuration diagram showing the magnetic movement mechanism 4 of FIG.
A first actuator 25a, a second actuator 25b, a third actuator 25c, and a fourth actuator 25d are attached to the processing lens holding mechanism 17 that holds the processing lens 13 from four directions.
The first actuator 25a and the second actuator 25b provided to face the first actuator 25a move the processing lens 13 in the x direction.
The third actuator 25c and the fourth actuator 25d provided to face the third actuator 25c move the processing lens 13 in the y direction.
The first actuator 25 a to the fourth actuator 25 d are each composed of an electromagnet 26 fixed to a rectangular fixed base 48 and a magnetic target 27 fixed to the processing lens holding mechanism 17 so as to face each electromagnet 26. It is configured.
In FIG. 4, as shown in FIG. 2, the control device 16 controls each electromagnet of each of the first actuator 25 a to the fourth actuator 25 d so that the optical axis 1 of the processing lens 13 passes through the center of the laser beam 7. 26 controls the current flowing through 26.

On the other hand, FIG. 5 shows a state where the processing lens central axis 23 is decentered from the optical axis 1 as shown in FIG.
Here, by increasing the current flowing through the electromagnet 26 of the first actuator 25a and pulling the magnetic target 27 toward the electromagnet 26, the processed lens holding mechanism 17 integrated with the magnetic target 27 is pulled toward the x negative side. The processing lens 13 is moved in the x minus direction.
This example is an example, and the processing lens holding mechanism 17 is within a range in which the electromagnet 26 and the magnetic target 27 do not contact each other by changing the value of the current flowing through each electromagnet 26 of each of the first actuator 25a to the fourth actuator 25d. Can be moved to an arbitrary position on the xy plane, that is, the processing lens 13 can be moved to an arbitrary position on the xy plane.

According to the laser processing apparatus 30 of the first embodiment, since the processing gas 6 is prevented from entering the processing head main body 3 by the partition plate 21, the processing head main body 3 is airtight against the processing gas 6. In addition, the pressure-resistant structure is not required, the structure can be simplified and the weight can be reduced.
Further, since the processing lens 13 is linearly moved biaxially by the magnetic movement mechanism 4 that can be reduced in size instead of the mechanical feed mechanism, the processing head main body 3 is reduced in size.
Further, the processing lens 13 moves at high speed and is positioned with high accuracy by a magnetic attraction generated by the current flowing through the electromagnet 26.
Therefore, the center of the processing nozzle 2 and the optical axis 1 of the laser beam 7 are eccentric with high speed and high accuracy, and the optical axis 1 of the laser beam 7 is offset from the opening center 9 of the processing nozzle 2 in the processing progress direction. Thus, the processing gas 6 and the melt 10 can flow smoothly along the cutting groove 5b, and high-quality cutting can be performed.

Embodiment 2. FIG.
FIG. 6 is a configuration diagram showing a magnetic movement mechanism 4A of the laser machining apparatus 30 according to Embodiment 2 of the present invention.
In Embodiment 2 of the present invention, one end of the spring 41 of the first plate is connected to each of the four corners of the rectangular processed lens holding mechanism 17A. In FIG. 6, one end of a second leaf spring 42 extending outward at a substantially right angle to the first leaf spring 41 is connected to the other end of each first leaf spring 41 extending in the vertical direction. Has been. The connecting portions of the first plate spring 41 and the second plate spring 42 that face each other are connected by a holding member 40. The other end of the second leaf spring 42 is connected to the fixed base 48.
The leaf springs 41 and 42 are wide in the z direction and thin in the x or y direction, and the processing lens holding mechanism 17A is restricted in movement in the z direction and is perpendicular to the optical axis 1 of the laser beam 7. It can move in the plane.
The first support plate spring 41 is produced by punching a thin plate of a spring steel material such as stainless steel, phosphor bronze, beryllium copper or the like into a rectangular flat plate. The second support plate spring 42 is made of the same material as the first support plate spring 41 and is formed in the same shape.
Further, the holding member 40 is manufactured by forming a thick plate material such as aluminum into a rectangular flat plate.
The first leaf spring 41, the second leaf spring 42, and the holding member 40 constitute an elastic hinge that restricts the processing lens 13 from moving in the z direction that is the direction of the optical axis 1.
Other configurations are the same as those of the laser processing apparatus 30 of the first embodiment.

FIG. 6 shows a state where the processing lens 13 is moving in the x minus direction.
In this state, the current flowing through the electromagnet 26 of the first actuator 25a and the second actuator 25b is controlled by a signal from the control device 16, and the first leaf spring 41 is bent in the xy plane, and the actuators 25a, 25a, The position of the processing lens holding mechanism 17A is held at a position where the electromagnetic force of 25b and the elastic force of the first leaf spring 41 are balanced.
Further, in order to move the processing lens 13 in the y direction, the current flowing through the electromagnet 26 of the third actuator 25c and the fourth actuator 25d is controlled by a signal from the control device 16, and both ends are fixed to the holding member 40. Four second leaf springs 42 fixed to the base 48 are bent in the xy plane, and the processing lens is positioned at a position where the electromagnetic force of the actuators 25c and 25d and the elastic force of the second leaf spring 42 are balanced. The position of the holding mechanism 17A is held.

  According to the laser processing apparatus 30 according to this embodiment, the same effect as that of the laser processing apparatus 30 according to the first embodiment can be obtained, and the magnetic moving mechanism 4A has the processing lens 13 in the direction of the optical axis 1. Since the elastic hinge that restricts the movement in the z direction is provided, the distance between the processing lens 13 and the workpiece 5 can be more reliably and constant compared with the laser processing apparatus 30 of the first embodiment. Can do.

Embodiment 3 FIG.
FIG. 7A is a configuration diagram showing the magnetic movement mechanism 4B of the laser machining apparatus 30 according to Embodiment 3 of the present invention, and FIG. 7B is along the line AA ′ of FIG. 7A. 7C is a cross-sectional view taken along the line BB ′ of FIG. 7A. In FIG. 7A, the center of the processing lens 13 is the optical axis 1 of the laser beam 7. Indicates a matching state.
In the embodiment of the present invention, the preload magnetic target 44 is embedded in a portion facing each electromagnet 26 in the processed lens holding mechanism 17B. Further, in the rectangular processed lens holding mechanism 17B, magnetic target 46 for magnetic fluid is embedded in each corner.
A preloading electromagnet 43 is embedded in the fixed base 48 so as to be opposed to the preloading magnetic target 44, and a magnetic fluid electromagnet 45 is embedded so as to be opposed to the magnetic fluid magnetic target 46. A magnetic fluid 47 is sandwiched between the magnetic target 46 for magnetic fluid and the electromagnet 45 for magnetic fluid.
The magnetic target 46 for magnetic fluid and the electromagnet 45 for magnetic fluid form a magnetic field for preventing the magnetic fluid 47 from flowing out.
Further, the preload magnetic target 44 and the magnetic fluid electromagnet 45 generate magnetic force for keeping the processing lens holding mechanism 17 at a constant distance in the z direction with respect to the fixed base 48.

Here, a configuration in which the magnetic fluid 47 that can be held by a magnetic field and does not require a two-dimensional sealing material as a two-dimensional static pressure guide is used for the static pressure guide, but other than water, oil, air, etc. Static pressure guides using these materials may be used.
Here, the preload electromagnet 43, the preload magnetic material target 44, the magnetic fluid electromagnet 45, the magnetic fluid magnetic target 46 and the magnetic fluid 47 constitute a static pressure guide means. The movement of the processing lens 13 in the direction of the optical axis 1 is regulated by static pressure guidance.
Other configurations are the same as those of the laser processing apparatus 30 of the first embodiment.

  The laser processing apparatus 30 according to this embodiment can obtain the same effects as those of the laser processing apparatus 30 according to the first embodiment, and the magnetic movement mechanism 4B has a z-direction in which the processing lens 13 is in the direction of the optical axis 1. Since the static pressure guide means for restricting the movement is provided, the distance between the processing lens 13 and the workpiece 5 can be ensured more reliably and consistently as compared with the laser processing apparatus 30 of the first embodiment. Can do.

Embodiment 4 FIG.
FIG. 8A is a configuration diagram showing the magnetic movement mechanism 4C of the laser machining apparatus 30 according to Embodiment 4 of the present invention, and FIG. 8B is along the line AA ′ in FIG. 8A. 8C is a cross-sectional view taken along the line BB ′ in FIG. 8A. In FIG. 8A, the center of the processing lens 13 is the optical axis 1 of the laser beam 7. In FIG. Indicates a matching state.
In the embodiment of the present invention, each of the four x-direction moving leaf springs 51 is fixed at the lower end to the fixing base 48 and the upper end is fixed to the corner in the x direction of the rectangular intermediate plate 49. Yes.
Further, the four leaf springs 52 for moving in the y direction are respectively fixed at the lower ends at the corners in the y direction of the processing lens holding mechanism 17C and at the upper ends at the corners in the y direction of the rectangular intermediate plate 49. Yes.
Here, the leaf springs 51 and 52 for moving in the x and y directions are produced by punching a thin plate of a spring steel material such as stainless steel, phosphor bronze, and beryllium copper into a rectangular flat plate.
The magnetic target 27 facing the electromagnet 26 is embedded in the processing lens holding mechanism 17C.
Other configurations are the same as those of the laser processing apparatus 30 of the first embodiment.

In this laser processing apparatus 30, by passing a current through each electromagnet 26 of the first actuator 25a and the second actuator 25b, the electromagnet 26 attracts the magnetic target 27, and the processing lens holding mechanism 17C moves in the x direction. Moving. During this movement, the y-direction moving leaf spring 52 and the intermediate plate 49 also move in the x direction, and the x-direction moving leaf spring 51 is elastically deformed.
Further, by passing a current through each electromagnet 26 of the third actuator 25c and the fourth actuator 25d, the electromagnet 26 attracts the magnetic target 27, and the processed lens holding mechanism 17C moves in the y direction. During this movement, the x-direction moving leaf spring 51 and the intermediate plate 49 also move in the y direction, and the y-direction moving leaf spring 52 is elastically deformed.

FIG. 9A is a schematic diagram showing a case where the center of the processing lens 13 and the optical axis 1 of the laser beam 7 coincide with each other in the magnetic movement mechanism 4C according to the fourth embodiment.
At this time, the x-direction moving leaf spring 51 is upright, and the distance LA between the processing lens 13 and the workpiece 5 is maximized.
On the other hand, as shown in FIG. 9B, the length of the x-direction moving leaf spring 51 does not change, so that the center of the processing lens 13 moves away from the optical axis 1 of the laser beam 7 in the x direction. The moving leaf spring 51 is tilted, and the processing lens 13 slightly approaches the fixed base 48. As a result, the distance LB from the workpiece 5 is shortened. Thereby, the focal position 60 of the laser beam 7 on the workpiece 5 changes.
The y-direction moving leaf spring 52 also has the same behavior as the x-direction moving leaf spring 51, and the distance LB between the processing lens 13 and the workpiece 5 becomes short, and the focal position of the laser beam 7 on the workpiece 5 is reduced. 60 changes.

Usually, the movement amount of the processing lens 13 in the x direction and the y direction is smaller than the size of the opening 8 of the processing nozzle 2 and is about 1 mm or less, and the change amount of the focal position 60 in the workpiece 5 is several tens of μm or less. The actual machining of the workpiece 5 is not affected.
However, when it is necessary to process the precise workpiece 5 with high accuracy, the change in the focal position 60 may affect the machining result of the workpiece 5.

Incidentally, as shown in FIG. 9C, the laser beam 67 is decentered with respect to the center of the processing lens 13 with respect to the first focal position 61 when the laser beam 7 passes through the center of the processing lens 13. The second focal position 62 can be shortened by passing through.
Therefore, when there is an influence due to the change of the focal position 60 in the workpiece 5, the machining lens in which the focal position 60 in the workpiece 5 does not change even if the machining lens 13 moves slightly in the direction approaching the workpiece 5. 13 may be designed.
In other words, a normal spherical single lens has a characteristic (spherical aberration) that the focal position of the outer peripheral light is short with respect to the light at the center of the lens. By using this aberration, the shape of the processing lens 13 or the combination of the lenses can be changed. Just choose.

FIG. 10 is a view showing a modification of the y-direction moving leaf spring 52 in the fourth embodiment of the present invention.
This plate spring 52 for moving in the y direction includes a first plate spring portion 53 having one end connected to the intermediate plate 49, a second plate spring portion 55 having one end connected to the processing lens holding mechanism 17C, and a second plate spring portion 55. This is a folding spring structure constituted by a coupling member 54 in which the other end portion of the first leaf spring portion 53 and the other end portion of the second leaf spring portion 55 are joined.
The y-direction moving leaf spring 52 shown in FIG. 8 has one end connected to the intermediate plate 49 and the other end connected to the processing lens holding mechanism 17C. The x-direction moving leaf spring 51 extending in the vertical direction from the fixed base 48 is shorter.
When the processing lens holding mechanism 17C moves in the y direction, the y-direction moving leaf spring 52 is elastically deformed in the y-direction, but the y-direction moving leaf spring 52 having the folded structure has the first leaf spring portion 53 and The second leaf spring portion 55 is elastically deformed, and the amount of elastic deformation in the y direction can be increased.
Therefore, the magnetic movement mechanism 4C that is short in the z direction can be realized by adopting the folded spring spring 52 for moving in the y direction and shortening the overall length of the linear leaf spring 51 for moving in the x direction. .

Embodiment 5 FIG.
FIG. 11 is a block diagram showing a laser processing apparatus 30 according to the fifth embodiment of the present invention.
In the embodiment of the present invention, a part of the laser path of the laser beam transmission system 20 of the laser processing apparatus 30 can be expanded and contracted, and the moving body 31 is constituted by the processing head main body 3 and the processing nozzle 2. The workpiece 5 is processed while being moved in a direction parallel to the workpiece 5 or in a direction perpendicular to the optical axis 1.
Other configurations are the same as those of the laser processing apparatus 30 of the first embodiment.

In the laser processing apparatus 30 according to the fifth embodiment of the present invention, the magnetic movement mechanism 4 of the first embodiment is incorporated in the processing head main body 3 in the processing head main body 3, and the processing lens 13 is moved. Rather than adopting a mechanical mechanism such as a ball screw, spur gear (spur gear), crank mechanism, etc., it moves directly using the magnetic moving mechanism 4C, and even during acceleration / deceleration of the moving body 31, mechanical such as backlash The occurrence of delay is suppressed, and the workpiece 5 can be machined at high speed and with high accuracy.
In addition, even if the magnetic movement mechanism 4A of the second embodiment, the magnetic movement mechanism 4B of the third embodiment, and the magnetic movement mechanism 4C of the fourth embodiment are incorporated in the processing head main body 3, it is similarly fast and highly accurate. A laser processing apparatus 30 capable of processing the workpiece 5 can be obtained.

  In the laser processing apparatuses 30 of the first to fifth embodiments, the partition plate 21 is provided in the processing head main body 3, but a partition plate may be provided in the processing nozzle.

  1 optical axis, 2 machining nozzle, 3 machining head body, 4, 4A, 4B, 4C magnetic movement mechanism, 5 workpiece, 5a piercing hole, 5b cutting groove, 6 machining gas, 7 laser beam, 8 aperture, 9 aperture center, 10 Melt, 11 Laser oscillator, 12 Mirror, 13 Processing lens, 14 Gas supply device, 15 Gas valve, 16 Control device, 17, 17A, 17B, 17C Processing lens holding mechanism, 20 Laser beam transmission system, 21 Partition plate, 22 Processing gas introduction pipe, 23 processing lens central axis, 24 processing lens moving direction, 25a first actuator, 25b second actuator, 25c third actuator, 25d fourth actuator, 26 electromagnet, 27 magnetic target, 30 Laser processing apparatus, 31 movable body, 40 holding member, 41 1 leaf spring, 42 second leaf spring, 43 preload electromagnet, 44 preload magnetic target, 45 magnetic fluid electromagnet, 46 magnetic fluid magnetic target, 47 magnetic fluid, 48 fixing base, 49 intermediate plate, 51 x-direction leaf spring, 52 y-direction leaf spring, 52 y-direction moving leaf spring, 53 first leaf spring portion, 54 coupling member, 55 second leaf spring portion, 60 condensing position, 61 first collection Light position, 62 Second focusing position, 67 Laser beam, LA Distance between processing lens and workpiece, LB Distance between processing lens and workpiece.

Claims (5)

A laser oscillator for oscillating a laser beam;
A machining head main body through which the laser beam is transmitted via a laser beam transmission system;
A machining nozzle attached to the end of the machining head body and whose opening is directed to the workpiece;
A gas supply device for supplying the processing gas to the processing nozzle;
A partition plate provided in the processing nozzle or the processing head main body and preventing the processing gas from entering the processing head main body through the processing nozzle;
The processing head body includes a processing lens for condensing the laser beam toward the workpiece, a processing lens holding mechanism that surrounds the processing lens and holds a peripheral edge, and the processing lens on the optical axis of the laser beam. A magnetic movement mechanism that moves linearly in two axes by magnetic drive with an electromagnet in a vertical plane is provided.
The magnetic movement mechanism includes an elastic hinge that is provided upright with respect to a driving plane of the processing lens and restricts the processing lens from moving in the direction of the optical axis .
The elastic hinge includes a first leaf spring that can be deformed in one direction along the drive plane and a second leaf spring that can be deformed in a direction perpendicular to the one direction along the drive plane. Has been
The first plate spring has one end fixed to a fixed base supported by the magnetic movement mechanism and the other end fixed to an intermediate plate provided on the opposite side of the magnetic movement mechanism from the fixed base. And
The second plate spring is a laser processing apparatus in which one end is fixed to the processing lens holding mechanism and the other end is fixed to the intermediate plate. A laser oscillator for oscillating a laser beam;
A machining head main body through which the laser beam is transmitted via a laser beam transmission system;
A machining nozzle attached to the end of the machining head body and whose opening is directed to the workpiece;
A gas supply device for supplying the processing gas to the processing nozzle;
A partition plate provided in the processing nozzle or the processing head main body and preventing the processing gas from entering the processing head main body through the processing nozzle;
The processing head body includes a processing lens for condensing the laser beam toward the workpiece, a processing lens holding mechanism that surrounds the processing lens and holds a peripheral edge, and the processing lens on the optical axis of the laser beam. A magnetic movement mechanism that moves the biaxial curve by magnetic drive with an electromagnet within a vertical curved surface,
The magnetic movement mechanism includes an elastic hinge that is provided upright with respect to a driving plane of the processing lens and restricts the processing lens from moving in the direction of the optical axis.
The elastic hinge includes a first leaf spring that can be deformed in one direction along the drive plane and a second leaf spring that can be deformed in a direction perpendicular to the one direction along the drive plane. Has been
The first plate spring has one end fixed to a fixed base supported by the magnetic movement mechanism and the other end fixed to an intermediate plate provided on the opposite side of the magnetic movement mechanism from the fixed base. And
The second plate spring is a laser processing apparatus in which one end is fixed to the processing lens holding mechanism and the other end is fixed to the intermediate plate. The second leaf spring includes a first leaf spring portion whose one end is connected to the intermediate plate, a second leaf spring portion whose one end is connected to the processing lens holding mechanism, and the first plate. 3. The laser processing apparatus according to claim 1 , wherein the laser processing apparatus has a folded spring structure configured by a coupling member that couples the other end of the spring part and the other end of the second leaf spring part. The said processing head main body and the said processing nozzle are movable in the direction parallel to the said workpiece | work, or a perpendicular | vertical direction with respect to the said optical axis, The any one of Claims 1-3 characterized by the above-mentioned. Laser processing equipment. The central axis of the uncut lens, the laser machining apparatus according to any one of claim 1 to 4, characterized in that located in the processing advancing direction than the center of the opening of the processing nozzle.

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