JP5673819B2 - Method for measuring characteristics of electronic components - Google Patents

Description

  The present invention relates to a method for measuring characteristics of an electronic component, and more particularly to a method for measuring characteristics of an electronic component on which an IC is mounted.

  An electronic component such as an IC chip is operated by inputting a test signal to the electronic component, and the characteristic is measured by the response signal.

  For example, Patent Document 1 discloses a method of measuring an electronic component using a plurality of testers (measuring instruments). This measurement method uses a plurality of testers, measures the characteristics of an electronic component with a tester for a certain measurement item, transports the electronic component, and measures the characteristics of the electronic component with another tester for another measurement item. .

JP 2010-156709 A

  When measuring using a plurality of testers as in Patent Document 1, there is no problem as long as the component has only a single function such as a capacitor or a filter, but there are a plurality of measurement items such as a wireless communication module. In addition, in an electronic component that requires a certain amount of time to activate the module, a process and time for starting up (activating) the electronic component are required each time measurement is performed by a tester.

  In addition, in a wireless communication module or the like, a process and time for falling are required to write data such as measurement results in a memory in the module after the measurement is completed.

  If such a startup and shutdown process is performed after the electronic parts are transported and connected to the tester, the tester will be ready for measurement for the startup and shutdown time, and the time required for the characteristic measurement process will be increased. There is a problem of becoming longer. In addition, if there is time during which the tester is not operating for start-up and shut-down during the characteristic measurement process, the equipment cost to pass on to the product price increases. Testers used for measuring characteristics of wireless communication modules and the like are expensive and have a great influence on manufacturing costs.

  In view of such circumstances, the present invention intends to provide a method for measuring characteristics of an electronic component that can increase the operating rate of a measuring instrument.

  In order to solve the above problems, the present invention provides a method for measuring characteristics of an electronic component configured as follows.

The method for measuring the characteristics of an electronic component is as follows: (a) a first process that activates the electronic component to make it measurable, and (b) a measurement that can be performed by the first process. And (c) writing data to the electronic component based on the measurement result obtained by the second processing. Thereafter, a third process for stopping the activation of the electronic component is sequentially performed. A plurality of sub measurement systems each including a jig on which the electronic component is mounted and a control device that controls activation, stop, and operation of the electronic component mounted on the jig are used. The jigs of the sub measurement systems are connected to the measuring devices. Of the control devices of the sub measurement systems, only the control device of the sub measurement system is connected to the measuring device, and the control device of the sub measurement system is connected to the control device of the other sub measurement system. Connect to. The control device for the sub measurement system is used to supervise the control for performing the first to third processes on the electronic components mounted on the jigs of the sub measurement systems. During the characteristic measurement step of performing the second process on the electronic component that is in a state that can be measured by the first process, the electron before the characteristic measurement of performing the second process after the characteristic measurement step The first process is performed on the part.

According to the above method, during the characteristic measurement process for performing the second processing, the first processing is performed for the electronic component that is to be subjected to the second processing thereafter. Thereby, the operating time of the measuring device can be increased by shortening or eliminating the waiting time of the second process. One sub-measurement system control device can grasp the measurement status of all sub-measurement systems and optimize the measurement state, thereby shortening the measurement time and other sub-measurement system control devices and measuring instruments. Wiring for connecting can be eliminated.

  Preferably, during the characteristic measurement process, the third process is performed on the electronic component that has been subjected to the second process before the characteristic measurement process.

  In this case, the measuring device performs the second process on the other electronic component while the third process is performed on the certain electronic component. Thereby, the operation rate of a measuring device can be raised.

  According to the present invention, the operating rate of the measuring device can be increased.

It is a basic lineblock diagram of a measurement system. Example 1 It is a block diagram of a measurement system. Example 1 It is a timing chart figure when measuring an electronic component. Example 1

  Embodiments of the present invention will be described below with reference to FIGS.

  <Example 1> A method for measuring characteristics of an electronic component of Example 1 will be described with reference to FIGS.

  FIG. 1 is a basic configuration diagram of a measurement system 10 that measures the characteristics of wireless communication modules 2a, 2b,..., 2x, which are electronic components on which an IC is mounted, using an RF tester 12 that is a single measuring instrument. . As shown in FIG. 1, a plurality of sub measurement systems 13 a, 13 b,..., 13 x are connected to one measuring device (RF tester) 12.

  Sub measurement systems 13a, 13b,..., 13x have the same configuration, and jigs on which electronic components 2a, 2b,..., 2x (wireless communication modules A, B,. , 14x (stages A, B,..., X) and the electronic components 2a, 2b,..., 2x mounted on the jigs 14a, 14b,. Control devices 20a, 20b,..., 20x (module control personal computers A, B,..., X). The jigs 14a, 14b, ..., 14x (stages A, B, ..., X) of the sub measurement systems 13a, 13b, ..., 13x and the control devices 20a, 20b, ..., 20x are connected to the measuring instrument 12, respectively. Has been.

  In the electronic component characteristic measuring method according to the first embodiment, while the second process of measuring the characteristic of the electronic component mounted on the jig of a certain sub-measurement system is performed by the measuring instrument 12, another measurement system is used. For (a) the first process that activates the electronic component mounted on the jig to make it measurable and (b) the electronic component that has been measured by the measuring instrument 12 (second process), After writing data based on the measurement result obtained by the second process, the third process for stopping the activation of the electronic component, or (c) the fourth process for replacing the electronic component mounted on the jig I do.

  As a result, the time during which the measuring instrument 12 is in a measurement waiting state can be shortened or eliminated, and the operating time during which the measuring instrument 12 actually measures the characteristics of the electronic component can be lengthened. That is, by performing the first process on another electronic component while the second process is being performed on an electronic component, the first process is completed when the second process is performed next. The operating rate of the measuring device can be increased by reducing or eliminating the waiting time. In addition, since the measuring device performs the second process on other electronic components while the third and fourth processes are performed on a certain electronic component, the operating rate of the measuring device can be increased.

  Next, a specific example in the case where there are two sub measurement systems will be described with reference to FIGS.

  FIG. 2 is a configuration diagram of a measurement system 10a including two sub measurement systems 13a and 13b. As shown in FIG. 2, the sub measurement systems 13a and 13b include jigs 14a and 14b (stages A and B) on which electronic components 2a and 2b (wireless communication modules A and B) are mounted, and a jig 14a. , 14b, control circuit boards 22a, 22b, power supplies 28a, 28b, and control devices 20a, 20b (module control personal computers A, B) for controlling the start, stop, and operation of the electronic components 2a, 2b. Including.

  The jigs 14a and 14b are connected to the measuring instrument 12 via RF cables 30a and 30b, and are connected to the control circuit boards 22a and 22b via flat cables 31a and 31b. The jigs 14a and 14b and the control circuit boards 22a and 22b are connected to power supplies 28a and 28b via power cables 36a to 39a and 36b to 39b, respectively, and power is supplied from the power supplies 28a and 28b. The control devices 20a and 20b are connected to the control circuit boards 22a and 22b via the UART cables 32a and 32b, and are connected to the power supplies 28a and 28b via the GPIB cables 34a and 34b. The control devices 20a and 20b control operations of the control circuit boards 22a and 22b and the power supplies 28a and 28b.

  The control devices 20a and 20b of the sub measurement systems 13a and 13b are connected to each other by a LAN cable 35. Only the control device 20a of one sub measurement system 13a is connected to the measuring instrument 12 via the USB cable 33. The control device 20a of the one sub-measurement system 13a controls the overall measurement system 10a. That is, the control device 20a of one of the sub-measurement systems 13a supervises control for performing the first to fourth processes on the electronic components 2a and 2b mounted on the jigs 14a and 14b of the respective sub-measurement 13a and 13b systems. .

  In this case, since the control device 20a of one sub measurement system 13a can grasp the measurement status of all the sub measurement systems 13a and 13b and optimize the measurement state, the measurement time can be shortened or another sub measurement system can be used. The wiring for connecting the control device 20b of the system 13b and the measuring device 20 can be eliminated.

  Next, the operation when measuring the characteristics of the electronic component using the measurement system 10a will be described with reference to the timing chart of FIG.

  As shown in FIG. 3A, the measuring instrument 12 is always in an ON state that can be measured.

  In the section 51, the first process 60a is performed on the electronic component (module A) mounted on the jig of one of the sub measurement systems. In this section 51, the second process 62b is performed on the electronic component (module B) mounted on the other sub-measurement system jig.

  In the next section 52, the second process 62a is performed on the electronic component (module A) mounted on the jig of one of the sub measurement systems. In this section 52, the third process 64b is performed on the electronic component (module B) mounted on the other sub measurement system jig, and then the electronic component mounted on the other sub measurement system jig is mounted. A fourth process 68b to be replaced is performed, and then a first process 60b is performed on the electronic component (module B) newly mounted on the jig of the other sub measurement system.

  In the next section 53, the second process 62b is performed on the electronic component (module B) mounted on the other sub-measurement system jig. In this section 53, the third process 64a is performed on the electronic component (module A) mounted on the jig of one sub measurement system, and then the electronic component mounted on the jig of one sub measurement system is A fourth process 68a to be replaced is performed, and then a first process 60a is performed on the electronic component (module A) newly mounted on the jig of one of the sub measurement systems.

  Similarly, in the sections 54, 55,..., (A) the second processing 62a, 62b, (b) the third processing 64a, 64b, the fourth processing and 68a, 68b and the first processing 60a and 60b are alternately performed.

  When the electronic component to be measured is a wireless communication module, the control device 20a operates as follows.

  In the first processing 60a, 60b, the power supplies 28a, 28b are turned on to activate the wireless communication module mounted on the jigs 14a, 14b, and the data (Config file) to be read when the wireless communication module is activated, Read out from the memory of the wireless communication module mounted on the jigs 14a and 14b, and establish communication between the wireless communication module mounted on the jigs 14a and 14b and the control circuit boards 22a and 22b. Control is performed so as to perform an initial setting for enabling measurement of the wireless communication module mounted on the.

  In the second processing 62a and 62b, control signals are transmitted from the control circuit boards 22a and 22b, the wireless communication modules mounted on the jigs 14a and 14b are operated, and transmission at a radio frequency is performed using the measuring instrument 12. Control to measure electrical characteristics such as reception.

  In the third processing 64a and 64b, data is processed based on the result of measuring the characteristics in the second processing 62a and 62b, and data (such as pass / fail judgment data) that can be used in subsequent processes is calculated. And data for identifying the wireless communication module (MAC address) are written in a memory in the wireless communication module mounted on the jigs 14a and 14b, and then the wireless communication module mounted on the jigs 14a and 14b Processing for terminating communication with the control circuit boards 22a and 22b is performed, and then control is performed to stop the power supply from the power supplies 28a and 28b to the wireless communication modules mounted on the jigs 14a and 14b.

  In the wireless communication module, in the taping (packing) process after the characteristic measurement, the pass / fail judgment data in the memory is read, and only the non-defective product is taped.

  Since the time required for the second process for performing the RF measurement is sufficiently long in the wireless communication module, during the characteristic measurement process for performing the RF measurement (second process) of one of the sub measurement systems, The first process can be performed on the electronic component that performs the RF measurement (second process) after the characteristic measurement process.

The time required for the first processing 60a, 60b is t1, the time required for the second processing 62a, 62b is t2, the time required for the third processing 64a, 64b is t3, and the time required for the fourth processing 68a, 68b. t4
t2 ≧ t1 + t3 + t4
If the above condition is satisfied, the operation rate of the measuring device 12 can be made 100% by alternately measuring the two sub-measuring systems 13a and 13b using one measuring device 12.

In general,
n × t2 ≧ t1 + t3 + t4
Assuming that the smallest positive integer that satisfies n is n, and the number of sub-measurement systems is (1 + n) or more, each sub-measurement system is measured using one measuring instrument, and the operating rate of the measuring instrument is 100%. Can be.

  <Summary> As described above, while measuring the characteristics of an electronic component mounted on a jig of a certain sub-measurement system, by performing the processing before and after the measurement on the other sub-measurement system, The measurement waiting time can be shortened or eliminated, and the operating time of the measuring device can be increased and the operating rate of the measuring device can be increased. When the operating rate of the measuring instrument is increased, labor costs and capital investment can be suppressed, and the cost required for measuring the characteristics of electronic components can be reduced.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

2a, 2b,..., 2x electronic components 10, 10a measuring system 12 measuring instruments 13a, 13b,..., 13x sub-measuring systems 14a, 14b, ..., 14x jigs 20a, 20b, ..., 20x control devices 22a, 22b control circuit Substrate 28a, 28b Power supply 51-55 Section 60a, 60b 1st process 62a, 62b 2nd process 64a, 64b 3rd process 68a, 68b 4th process

Claims (2)

About electronic parts with IC
A first process for activating the electronic component to make it measurable;
A second process for measuring the characteristics of the electronic component in a state that can be measured by the first process using a measuring instrument;
A third process for stopping activation of the electronic component after writing data to the electronic component based on the measurement result obtained by the second process;
In the method for measuring the characteristics of electronic parts,
Using a plurality of sub-measurement systems each including a jig on which the electronic component is mounted, and a control device that controls activation, stop, and operation of the electronic component mounted on the jig,
The jigs of the sub measurement systems are connected to the measuring devices,
Of the control devices of the sub measurement systems, only the control device of the sub measurement system is connected to the measuring device, and the control device of the sub measurement system is connected to the control device of the other sub measurement system. Connected to
Using the control device of the sub measurement system, the control for performing the first to third processes on the electronic components mounted on the jig of each sub measurement system is integrated,
During the characteristic measurement step of performing the second process on the electronic component that is in a state that can be measured by the first process, the electron before the characteristic measurement of performing the second process after the characteristic measurement step A method for measuring characteristics of an electronic component, wherein the first processing is performed on the component. During the characteristic measurement process,
The method for measuring characteristics of an electronic component according to claim 1, wherein the third process is performed on the electronic component that has been subjected to the second process before the characteristic measurement step.

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