JP5647912B2 - Electronic circuit device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic circuit device and a manufacturing method thereof.

In a conventional electronic circuit device, for example, as in Patent Document 1, a heat-generating electronic device that generates heat by energization, such as a semiconductor package including a power transistor, is fixed to a heat-dissipating member such as a heat sink. Some are electrically connected to the substrate. The circuit board is fixed to the heat radiating member by screws, separately from the heat generating electronic device.
Conventionally, a heat generating electronic device is often fixed on a heat radiating member by screwing. However, as in Patent Document 1, for example, the heat generating electronic device is fixed by being pressed against the heat radiating member by a biasing force of a biasing member such as a leaf spring. There is also. Specifically, one end of the biasing member is fixed to the heat radiating member by screwing, and the other end is brought into contact with a heat generating electronic device disposed on the heat radiating member, thereby generating heat by the biasing force of the biasing member. The electronic device is pressed against the heat dissipation member.

Japanese Utility Model Publication No. 5-67082

  However, in each of the above conventional configurations, since the heat generating electronic device and the circuit board are individually fixed to the heat radiating member, the number of steps for mounting the heat generating electronic device and the circuit board is increased, and the manufacturing efficiency of the electronic circuit device is increased. There is a problem that becomes low.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an electronic circuit device capable of improving manufacturing efficiency and a method of manufacturing the same.

In order to solve this problem, an electronic circuit device of the present invention includes a heat dissipating member, a device main body mounted on the mounting surface of the heat dissipating member, and an external terminal protruding above the mounting surface from the device main body. A heat-generating electronic device comprising: a heat-dissipating member fixed to the heat-dissipating member in a state of being spaced above the device body mounted on the mounting surface; and joining the external terminal to the heat-generating electronic device. A circuit board to be electrically connected; and an urging member having one end fixed to the circuit board and the other end abutting against the device main body placed on the mounting surface. while being fixed to the heat dissipation member, contact the device body is pressed against the mounting surface by the biasing force of the biasing member, one end of the biasing member, which is joined to the circuit board via a bonding agent Part is formed, and the joining part is inserted into a joining hole formed through the circuit board in the thickness direction, and is connected to one end part of the circuit board and the biasing member with respect to the heat radiating member. An insertion hole is formed through which a fixing screw for screwing one end of the circuit board and the biasing member is inserted, and the insertion hole of the biasing member is positioned at a distance from the joint portion. In addition, the insertion hole of the circuit board is located at a distance from the bonding hole .

According to the electronic circuit device, with the circuit board fixed to the heat dissipation member, the device body is pressed against the mounting surface of the heat dissipation member by the biasing force of the biasing member, so that the heat generating electronic device is also attached to the mounting surface of the heat dissipation member. It will be fixed. In other words, by simply fixing the circuit board to the heat radiating member, the heat generating electronic device can be simultaneously fixed to the mounting surface of the heat radiating member.
Therefore, it is possible to reduce the man-hours for attaching the heat generating electronic device and the circuit board to the heat radiating member, and to improve the manufacturing efficiency of the electronic circuit device.

Further, by using a bonding agent as in the above configuration, one end of the biasing member can be firmly fixed to the circuit board.

In the above configuration, the urging member can be easily attached to the circuit board simply by inserting the joining portion into the joining hole of the circuit board.
Moreover, it can prevent that the junction part of an urging member shifts with respect to the junction location of a circuit board by inserting a junction part in the hole for a circuit board.

In the above configuration, the insertion position of the fixing screw with respect to the urging member and the circuit board and the insertion position of the joining portion of the urging member with respect to the bonding hole of the circuit board are arranged with a space therebetween, The positional deviation of the urging member with respect to the circuit board can be reliably prevented.
Further, in addition to the above configuration, when a plurality of joining portions of the biasing member and a plurality of joint holes for the circuit board are formed, when the one end portion of the biasing member is screwed to the heat radiating member with the fixing screw, Even if the stress applied to the area where the insertion hole is formed in the biasing member is transmitted to the joint, this stress is distributed to the plurality of joints, that is, distributed to the plurality of joints between the joint and the circuit board. Therefore, the stress applied to each joint portion can be relaxed.
When the electronic circuit device is manufactured, the joining portion of the biasing member is fixed to the circuit board with the bonding agent, and then the circuit board and the biasing member are radiated with the fixing screw. It is preferable to screw to the member.
In this case, when the circuit board is fixed to the heat radiating member with the fixing screw, the biasing member can be prevented from rotating together with the fixing screw, so that the displacement of the biasing member with respect to the circuit board can be prevented. It becomes possible.

In the electronic circuit device, it is more preferable that a plurality of the joining portions and the joining holes are formed, and each joining portion is individually inserted into the plurality of joining holes.
In this configuration, the direction of the biasing member with respect to the circuit board after the plurality of joints are individually inserted into the respective bonding holes until the biasing member is fixed to the circuit board with the bonding agent. Can be reliably prevented. In other words, the biasing member can be easily positioned with respect to the circuit board simply by inserting a plurality of joints into the respective joint holes.

Furthermore, in the electronic circuit device, when the one end portion of the urging member is screwed to the heat radiating member with the fixing screw, the stress applied to the portion where the insertion hole is formed in the urging member is It is preferable that the biasing member is relaxed by a screwing stress relaxation portion formed between the joint portion and the insertion hole forming portion.
In this configuration, when one end of the urging member is screwed to the heat radiating member with the fixing screw, the stress applied to the formation region of the insertion hole in the urging member is transmitted to the joint portion, and the joint portion, the circuit board, It is possible to prevent stress concentration from occurring at the joint portion. Therefore, it is possible to secure the bonding state between the bonding portion of the urging member and the circuit board by the bonding agent and improve the reliability of the electronic circuit device.

Further, in the electronic circuit device, one end portion of the biasing member is electrically connected to the wiring pattern of the circuit board via the joint portion, and is electrically connected to the heat dissipation member via the fixing screw. May be.
This configuration eliminates the need for a separate wiring member that electrically connects the heat dissipation member and the wiring pattern of the circuit board, thereby simplifying the configuration of the electronic circuit device.
In this configuration, when it is desired to ground the circuit pattern of the circuit board and the electric circuit of the electronic circuit device constituted by a heat generating electronic device or the like electrically connected to the circuit pattern, the electronic circuit can be obtained by simply grounding the heat dissipating member. The electric circuit of the apparatus can be easily grounded via the biasing member, the fixing screw, and the heat radiating member.

  Further, in the electronic circuit device, one end of the biasing member is disposed on the upper surface of the circuit board facing the same side as the mounting surface of the heat dissipation member, and the other end of the biasing member is the circuit. It may be inserted through a through-hole penetrating in the thickness direction of the board and protrude from the lower surface of the circuit board facing the mounting surface of the heat dissipation member.

Furthermore, in the electronic circuit device, the mounting surface may be a bottom surface of a recess that is recessed from a flat top surface of the heat dissipation member facing the circuit board.
In this configuration, at least the device body of the heat generating electronic device is accommodated in the recess of the heat dissipation member, so that the thickness dimension of the electronic circuit device can be set small. In other words, the electronic circuit device can be thinned.

Further, in the electronic circuit device, the heat-generating electronic device is accommodated in the recess and is translated in a direction along the upper surface of the heat radiating member, and an orthogonal direction of the upper surface of the heat radiating member is an axis. It is preferable that the rotational movement is restricted.
In this configuration, when the electronic circuit device is manufactured, after the heat generating electronic device is placed on the mounting surface of the heat dissipation member, the circuit board to which the biasing member is attached is fixed to the heat dissipation member. It is possible to reliably prevent the positional deviation of the heat generating electronic device with respect to the circuit board and the heat dissipation member. Therefore, when the circuit board is fixed to the heat radiating member, it is possible to reliably prevent the joint portion of the external terminal of the heat generating electronic device from being displaced with respect to the circuit board.

Furthermore, in the electronic circuit device, stress applied to the other end portion is relieved between the one end portion and the other end portion of the biasing member based on contact of the other end portion with the device body. It is preferable that an abutting stress relaxation portion is formed.
In this configuration, the stress applied to the other end of the biasing member is transmitted to the one end while the other end of the biasing member is in contact with the device body, and the stress is applied to the fixed portion between the one end and the circuit board. Concentration can be prevented from occurring. Therefore, it is possible to secure a fixed state between the one end portion of the urging member and the circuit board and improve the reliability of the electronic circuit device.

Further, in the electronic circuit device, when a plurality of the heat generating electronic devices are mounted on the mounting surface, the other end portion of the biasing member is in contact with the one end portion so as to contact each device body. And is preferably divided into a plurality of parts.
In this configuration, since a plurality of heat generating electronic devices can be collectively fixed to the heat radiating member by one urging member, the number of mounting steps of the plurality of heat generating electronic devices and the circuit board to the heat radiating member can be reduced, and the electronic circuit device The production efficiency can be further improved.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacture efficiency of an electronic circuit apparatus can be aimed at by reducing the attachment man-hour of the heat generating electronic device and circuit board with respect to a thermal radiation member.

It is a perspective view showing an electronic circuit device concerning one embodiment of the present invention. FIG. 2 is an exploded perspective view showing a state where a circuit board is separated from a heat dissipation member in the electronic circuit device of FIG. 1. It is AA arrow sectional drawing of FIG. It is BB arrow sectional drawing of FIG. It is a schematic perspective view which shows the accommodation process which accommodates a heat-emitting electronic device in the recessed part of a thermal radiation member in the method of manufacturing the electronic circuit apparatus shown in FIG. It is a sectional side view which shows the principal part of the electronic circuit apparatus which concerns on other embodiment of this invention. FIG. 7 is a side sectional view showing a modification of the electronic circuit device shown in FIG. 6. It is a sectional side view which shows the principal part of the electronic circuit apparatus which concerns on the 1st specific example of other embodiment of this invention. FIG. 9 is a side sectional view showing a state before the urging member is fixed to the heat radiating member with a fixing screw in the electronic circuit device shown in FIG. 8. It is a schematic plan view which shows the state which looked at the heat radiating member and biasing member shown in FIG. 9 from the upper direction of the heat radiating member. It is a sectional side view which shows the principal part of the electronic circuit apparatus which concerns on the 2nd example of other embodiment of this invention. It is a disassembled perspective view which shows the state which removed the biasing member shown in FIG. 11 from the heat radiating member. It is a schematic plan view which shows the state which looked at the heat radiating member and biasing member shown in FIG. 11 from the upper direction of the heat radiating member. It is DD sectional view taken on the line of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 4, an electronic circuit device 1 according to this embodiment includes a plurality (two in the illustrated example) of heat generating electronic devices 2, a heat radiating member 3, a circuit board 4, and a biasing member 5. It is roughly comprised with.
The heat generating electronic device 2 generates heat when energized like a semiconductor package including a power transistor, and the device main body 21 and a plurality of electrical connections (three in the illustrated example) protruding from the device main body 21. The external terminal 22 is configured.

The device main body 21 in the present embodiment is formed in a rectangular plate shape in plan view, and is configured, for example, by embedding a semiconductor element (not shown) that generates heat when energized in a resin.
On the other hand, the plurality of external terminals 22 are made of a copper material or the like, and are formed so as to protrude from the same side surface 21c of the device body 21 in a direction along the main surface (the upper surface 21a or the lower surface 21b) of the device body 21. More specifically, each external terminal 22 protrudes from one side surface 21c facing the longitudinal direction of the device body 21 having a rectangular shape in plan view. Each external terminal 22 is formed in a substantially L shape by bending the distal end portion 24 in the protruding direction with respect to the proximal end portion 23. Thereby, the front-end | tip part 24 of each external terminal 22 is extended in the plate | board thickness direction of the device main body 21 so that it may protrude above the upper surface 21a of the device main body 21. FIG.
In the present embodiment, the longitudinal dimension of the base end portion 23 of one external terminal 22A is set longer than the base end portion 23 of the other external terminal 22B. On the other hand, the longitudinal dimension of the tip portion 24 of one external terminal 22A is set to be the same as that of the tip portion 24 of the other external terminal 22B.

The heat radiating member 3 is made of a conductive material having excellent thermal conductivity, such as aluminum, and is formed in a plate shape thicker than the device main body 21.
The heat radiating member 3 is formed with a recess 31 that is recessed from the upper surface 3 a and accommodates the heat generating electronic device 2. The recess 31 in the present embodiment is formed in a rectangular shape in a side sectional view and a rectangular shape in a plan view, in other words, the recess 31 is formed in a substantially rectangular parallelepiped shape. In the present embodiment, the bottom surface 31 a of the recess 31 forms a mounting surface on which the heat generating electronic device 2 is placed.

Here, the width dimension and the longitudinal dimension of the recess 31 that is rectangular in plan view are set to be slightly larger in consideration of the thickness of the insulating sheet 6 to be described later. In the present embodiment, the width dimension of the heat generating electronic device 2 is the dimension in the width direction of the device body 21 that is rectangular in plan view. Further, the longitudinal dimension of the heat generating electronic device 2 is obtained by adding the longitudinal dimension of the base end portion 23 of the external terminal 22 to the longitudinal dimension of the device body 21 that is rectangular in plan view.
Thus, since the width dimension and the longitudinal dimension of the concave portion 31 are set, the heat generating electronic device 2 is accommodated in the concave portion 31 and is in a direction along the upper surface 3a of the heat radiating member 3 (perpendicular to the depth direction of the concave portion 31). , And the rotational movement around the orthogonal direction of the upper surface 3a of the heat radiating member 3 (the depth direction of the recess 31) are restricted.

The depth dimension of the recess 31 in the illustrated example is such that almost the entire device body 21, the base end portion 23 of the external terminal 22, and a part of the distal end portion 24 of the external terminal 22 are accommodated in the recess 31. In the state where the heat generating electronic device 2 is accommodated in the recess 31, the upper part of the device main body 21 and the remaining part of the distal end portion 24 of the external terminal 22 protrude from the upper surface 3 a of the heat radiating member 3.
A plurality of the recesses 31 formed as described above are formed in the heat dissipation member 3. In the present embodiment, two recesses 31 are illustrated, and these recesses 31 are arranged at intervals in the width direction.

And the whole inner surface (bottom surface 31a and inner surface 31b) of each recessed part 31 is covered with the insulating sheet 6 which has electrical insulation. As shown in FIG. 5, the insulating sheet 6 is configured by integrally forming a bottom surface covering portion 61 that covers the bottom surface 31 a of the concave portion 31 and a side surface covering portion 62 that covers the inner side surface 31 b of the concave portion 31. Here, the side surface covering portion 62 is divided into a plurality (four in this embodiment), and the plurality of side surface covering portions 62 are individually connected to the periphery of the bottom surface covering portion 61.
If it demonstrates more concretely, the planar view shape of the bottom face coating | cover part 61 will be formed in the planar view polygonal shape (this embodiment rectangular shape in planar view) corresponding to the shape of the bottom face 31a of the recessed part 31. FIG. On the other hand, the planar view shape of the plurality of side surface covering portions 62 is formed in a shape corresponding to the planar view shape (in the present embodiment, a rectangular shape in plan view) of each inner side surface 31b of the flat concave portion 31, respectively. The part 62 is individually connected to each side of the bottom surface covering part 61.

Therefore, as shown in FIGS. 2 and 3, in a state where the insulating sheet 6 is disposed on the inner surface of the recess 31, each side surface covering portion 62 is bent with respect to the bottom surface covering portion 61. The covering portions 62 are arranged so as to cover the bottom surface 31a and the inner side surfaces 31b of the concave portion 31, respectively.
Each side surface covering portion 62 arranged so as to cover the entire inner side surface 31 b extends upward from the bottom surface 31 a of the recess 31, and a tip portion thereof protrudes upward from the upper surface 3 a of the heat radiating member 3. That is, the size of each side surface covering portion 62 is set larger than that of each inner side surface 31b.

Further, a part (three in the illustrated example) of the side surface covering portions 62 has a semicircular shape in a plan view that is recessed inward from the front end in the extending direction of the side surface covering portion 62 extending from the peripheral edge of the bottom surface covering portion 61 among the peripheral edges. The hollow part 63 is formed. The recessed portion 63 is located above the upper surface 3 a of the heat radiating member 3 in a state where the insulating sheet 6 is disposed on the inner surface of the recessed portion 31. Therefore, even if the recess 63 is formed in the side surface covering portion 62, the inner side surface 31 b of the recess 31 is covered with the side surface covering portion 62 and is not exposed.
The remaining (one in the illustrated example) side surface covering portion 62 is disposed between the front end portion 24 of the external terminal 22 and the inner side surface 31b of the recess 31, and therefore, of the front end portion 24 of the external terminal 22. The remaining recess 63 is not formed in the remaining side surface covering portion 62 so that the electrical insulation distance between the portion projecting upward from the upper surface 3a of the heat radiating member 3 and the heat radiating member 3 is increased. .
The insulating sheet 6 configured as described above is disposed between the device main body 21 and the heat radiating member 3, so that the heat conductivity of the device main body 21 can be efficiently released to the heat radiating member 3. More preferably, it is made of a high material.

In addition to the recesses 31 described above, a plurality of (five in the illustrated example) engagement protrusions 32 projecting from the upper surface 3 a of the heat radiating member 3 are arranged so as to surround each recess 31. The engagement protrusion 32 engages the above-described depression 63 of the insulating sheet 6 when the electronic circuit device 1 is manufactured, and is formed in a columnar shape corresponding to the depression 63.
In the present embodiment, the engagement protrusions 32 are arranged one by one at positions spaced from the three sides of each recess 31 that is rectangular in plan view. That is, the three engaging protrusions 32 are arranged so as to surround the same recess 31. Of the three engaging protrusions 32 surrounding the same recessed portion 31, the two engaging protrusions 32 are arranged at positions sandwiching the same recessed portion 31. More specifically, the width direction of the recessed portion 31. Is arranged.

The remaining one of the three engaging protrusions 32 surrounding the same recessed portion 31 is arranged on one side in the longitudinal direction of the recessed portion 31 and is external to the heat generating electronic device 2 accommodated in the recessed portion 31. An engagement protrusion 32 is not formed at a position adjacent to the terminal 22.
In the illustrated example, only one engagement protrusion 32 is formed between two adjacent recesses 31. For example, two engagement protrusions 32 that individually surround the two recesses 31 are formed. It may be.

Further, the heat radiating member 3 is formed with a plurality of (two in the illustrated example) cylindrical protrusions 33 (two in the illustrated example) protruding from the upper surface 3a. A circuit board 4 to be described later is arranged on the front end surface 33a of the plurality of cylindrical protrusions 33. That is, in the heat radiating member 3, the height position of the circuit board 4 with respect to the upper surface 3 a of the heat radiating member 3 is set by the protruding height of the plurality of cylindrical protrusions 33. In the present embodiment, the circuit board 4 disposed on the upper surface 3 a of the heat radiating member 3 is positioned above the device body 21 disposed in the recess 31 with a space therebetween, and in the recess 31. The protruding heights of the plurality of cylindrical protrusions 33 are set so as not to contact the insulating sheet 6 disposed on the surface. The protruding heights of the plurality of cylindrical protrusions 33 with respect to the upper surface 3a of the heat radiating member 3 are set to be equal to each other. Are parallel.
The screw holes 33b of the respective cylindrical protrusions 33 are for screwing screws (fixing screws 7) for fixing the circuit board 4 to the heat dissipation member 3. In addition, in the example of illustration, although the screw hole 33b of the cylindrical protrusion 33 is extended below the upper surface 3a of the thermal radiation member 3, it is not restricted to this.

As shown in FIGS. 1 to 4, the circuit board 4 is generally configured by forming a wiring pattern (not shown) constituting an electric circuit of the electronic circuit device 1 together with the heat generating electronic device 2 on the upper surface 4 a and the lower surface 4 b. Has been. The circuit board 4 is formed with an insertion hole 41, a through hole 42, a connection hole 43, and a bonding hole 44 that penetrate in the thickness direction.
The insertion hole 41 is for inserting a fixing screw 7 for screwing the circuit board 4 into the heat radiating member 3, and the hole diameter is larger than the outer diameter of the shaft portion of the fixing screw 7, and It is smaller than the outer diameter of the head of the fixing screw 7 and the outer diameter of the cylindrical protrusion 33. The insertion holes 41 are formed in a number (two in the illustrated example) corresponding to the cylindrical protrusions 33 of the heat dissipation member 3.
The through-hole 42 allows a part of an urging member 5 to be described later to be inserted, and in a state where the circuit board 4 is fixed to the heat radiating member 3, the concave portion 31 of the heat radiating member 3 and the heat generating electronic device 2 accommodated therein. It is located above. The through holes 42 are formed in a number corresponding to the recesses 31 of the heat radiating member 3 (two in the illustrated example).

When the circuit board 4 is fixed to the heat radiating member 3, the connection hole 43 connects the front end portion 24 of the external terminal 22 of the heat generating electronic device 2 accommodated in the recess 31 from the lower surface 4 b side to the upper surface 4 a side. Is to be inserted through. The tip 24 of the external terminal 22 that is inserted through the connection hole 43 and protrudes toward the upper surface 4a of the circuit board 4 is bonded to the wiring pattern on the upper surface 4a of the circuit board 4 by a conductive bonding agent such as solder. Thus, the heat generating electronic device 2 is electrically connected to the circuit board 4.
The joining hole 44 is for inserting a joining portion of the urging member 5 described later, and is located at an interval from the insertion hole 41. In the present embodiment, the direction in which the bonding holes 44 and the insertion holes 41 are arranged is set to a direction orthogonal to the arrangement direction of the two through holes 42. In the illustrated example, the bonding hole 44 is located between the two through holes 42. Further, a plurality (three in the illustrated example) of the bonding holes 44 are formed. In the illustrated example, the plurality of bonding holes 44 are arranged in the arrangement direction of the two through holes 42.

The urging member 5 is formed by punching or bending a plate material that is conductive and elastically deformable, such as a copper material. The urging member 5 includes one end 51 fixed to the circuit board 4 side, the other end 52 that contacts the upper surface 21 a of the device body 21 of the heat generating electronic device 2 housed in the recess 31, and one end 51. And an elastically deformable portion 53 formed between the second end portion 52 and the other end portion 52.
One end portion 51 of the urging member 5 is arranged mainly on the upper surface 4a side of the circuit board 4 and extends in the arrangement direction of the through holes 42 of the circuit board 4 in the longitudinal direction of the frame part 511. It has a substantially disc-shaped bulging portion 513 and a rod-shaped joining projection 512 formed in the middle portion. In addition, the elastic deformation part 53 mentioned later is connected to the both ends of the longitudinal direction of the frame part 511. As shown in FIG.

  The bulging portion 513 of the urging member 5 is formed so as to bulge from one side portion of the frame portion 511, and an insertion hole 516 that penetrates in the thickness direction is formed in the bulging portion 513. Has been. Similar to the insertion hole 41 of the circuit board 4, the insertion hole 516 of the biasing member 5 allows the fixing screw 7 to be inserted. That is, the inner diameter of the insertion hole 516 of the biasing member 5 is set to be larger than the outer diameter of the shaft portion of the fixing screw 7 and smaller than the head portion of the fixing screw 7.

The joining protrusion 512 of the urging member 5 protrudes from the other side portion of the frame portion 511 in the width direction of the frame portion 511 and is located at a distance from the insertion hole 516 described above. The bonding projection 512 is bent at the base end portion so that the tip portion can be inserted into the bonding hole 44 of the circuit board 4.
More specifically, the base end portion of the bonding projection 512 is formed in a substantially U-shaped cross section so as to swell above the circuit board 4, whereby the tip end portion of the bonding projection 512 is It extends in the thickness direction of the substrate 4. The base end portion of the joining protrusion 512 formed in a U shape is elastically deformable, and is attached when the one end 51 of the biasing member 5 is screwed to the heat radiating member 3 by the fixing screw 7. A screwing stress relaxation portion 515 that relaxes stress applied to the bulging portion 513 of the urging member 5 by elastic deformation is formed. In other words, the screwing stress relaxation portion 515 plays a role of preventing the stress generated during screwing from being transmitted to the tip portion of the bonding projection 512.

Then, the tip portion of the bonding projection 512 that is inserted into the bonding hole 44 and protrudes toward the lower surface 4b of the circuit board 4 is bonded to the lower surface 4b of the circuit board 4 by a bonding agent 517 such as solder. The force member 5 is fixed to the circuit board 4. That is, the tip portion of the bonding projection 512 forms a bonding portion 514 that is bonded to the circuit board 4 via the bonding agent 517. In the present embodiment, the joining portion 514 is joined to a predetermined wiring pattern on the circuit board 4, and thereby the urging member 5 is electrically connected to the predetermined wiring pattern on the circuit board 4.
The bonding protrusions 512 formed in this way are formed in the same number as the bonding holes 44 of the circuit board 4 (three in the illustrated example), and the bonding portions 514 of the bonding protrusions 512 are formed on the circuit board 4. The plurality of bonding holes 44 are individually inserted. The plurality of joints 514 are arranged at intervals in the longitudinal direction of the frame part 511.

On the other hand, the elastically deforming portion 53 and the other end portion 52 of the urging member 5 are formed so as to protrude in the width direction of the frame portion 511 from the other side portion of the frame portion 511 at both ends in the longitudinal direction of the frame portion 511. Yes. That is, in this embodiment, two sets of the elastic deformation part 53 and the other end part 52 are formed.
Each elastic deformation portion 53 is bent at the base end portion so that the tip end portion and the other end portion 52 connected thereto can be inserted into the through hole 42 of the circuit board 4. If it demonstrates concretely, the base end part of each elastic deformation part 53 is formed in the cross-sectional substantially U shape so that it may swell above the circuit board 4. FIG. As a result, the distal end portion of the elastic deformation portion 53 extends in the plate thickness direction of the circuit board 4, and the elastic deformation portion 53 and the other end portion 52 of the urging member 5 are inserted into the through hole 42 of the circuit board 4. , And can protrude from the lower surface 4 b of the circuit board 4. Further, the distal end portion of the elastic deformation portion 53 that becomes a boundary with the other end portion 52 of the urging member 5 is also bent so that the other end portion 52 can come into surface contact with the upper surface 21 a of the device main body 21. It has become.

In the electronic circuit device 1 configured as described above, when the circuit board 4 is fixed to the heat radiating member 3 with the fixing screw 7, the other end 52 of the biasing member 5 contacts the upper surface 21 a of the device body 21. At the same time, the elastic deformation portion 53 is elastically deformed. The device body 21 is pressed against the bottom surface 31 a of the recess 31 by the biasing force of the biasing member 5 based on the elastic deformation of the elastic deformation portion 53. That is, the heat generating electronic device 2 is fixed to the heat radiating member 3.
In this pressed state, stress is applied to the other end 52 based on the abutment of the other end 52 of the urging member 5 against the device body 21, and this stress is elastically deformed to have a substantially U-shaped cross section. When the base end portion of the portion 53 is elastically deformed, it is difficult to transmit to the one end portion 51 of the biasing member 5. That is, the base end portion of the elastic deformation portion 53 is a contact stress relaxation portion 531 that relieves stress applied to the other end portion 52 of the biasing member 5.

  In addition, in a state where the circuit board 4 is fixed to the heat radiating member 3, a predetermined wiring pattern of the circuit board 4 is electrically connected to the heat radiating member 3. More specifically, when the circuit board 4 is fixed to the heat radiating member 3, the urging member 5 and the heat radiating member are brought into contact with the bulging portion 513 of the urging member 5 by the fixing screw 7 having conductivity. 3 are electrically connected to each other via the fixing screw 7, and the predetermined wiring pattern is electrically connected to the heat radiating member 3 via the biasing member 5 and the fixing screw 7.

Next, an example of a method for manufacturing the electronic circuit device 1 having the above configuration will be described.
When manufacturing the electronic circuit device 1, first, as illustrated in FIG. 5, the insulating sheet 6 and the heat generating electronic device 2 are accommodated one by one in each recess 31 of the heat radiating member 3 (accommodating step).
In this accommodation step, first, as shown in FIGS. 5A and 5B, the insulating sheet 6 is placed on the upper surface (front surface) 3 a of the heat radiating member 3 so that the entire opening of the recess 31 is covered with the insulating sheet 6. (Sheet placement step).

  The insulating sheet 6 in this step is disposed on the concave portion 31 and covers the opening in a rectangular shape in plan view, and a plurality (in the periphery of the opening of the concave portion 31 connected to each side of the cover portion 65 ( In the example shown in the figure, there are four peripheral portions 66, and as a whole, has a substantially cross shape in plan view. The cover portion 65 is formed in a rectangular shape in plan view corresponding to the bottom surface 31 a of the recess 31, and corresponds to the bottom surface covering portion 61 in the state of the electronic circuit device 1 after manufacture. Each peripheral portion 66 is formed in a rectangular shape in plan view corresponding to each inner side surface 31 b of the recess 31, and corresponds to the side surface covering portion 62 in the state of the electronic circuit device 1 after manufacture.

In this sheet arranging step, a plurality (three in the illustrated example) of the recesses 63 formed in a part (three in the illustrated example) of the peripheral portion 66 are disposed around the recess 31. The insulating sheet 6 is disposed on the heat radiating member 3 so that the mating protrusions 32 enter individually and the engaging protrusions 32 that enter the respective recessed portions 63 come into contact with the peripheral portion 66.
In this arrangement state, each recess 63 is engaged with each engagement protrusion 32, and the insulating sheet 6 is sandwiched between the two engagement protrusions 32, so that the insulating sheet along the upper surface 3 a of the heat radiating member 3. The movement of 6 is restricted. That is, the plurality of engaging protrusions 32 of the heat radiating member 3 serve as positioning portions for the insulating sheet 6.

After the sheet placement step, as shown in FIGS. 5B and 5C, the heat generating electronic device 2 is inserted into the recess 31 (device insertion step). In this step, the cover portion 65 of the insulating sheet 6 is pushed into the recess 31 by the heat generating electronic device 2. Further, as the cover portion 65 is pushed into the recess 31, each peripheral portion 66 of the insulating sheet 6 is inserted into the recess 31 while being bent with respect to the cover portion 65.
In the state after this step, as shown in FIGS. 2 and 3, since the size of the recess 31 in plan view corresponds to the size of the heat generating electronic device 2, the heat generating electronic device 2 accommodated in the recess 31 is The parallel movement in the direction along the upper surface 3a of the heat radiating member 3 and the rotational movement about the orthogonal direction of the upper surface 3a of the heat radiating member 3 are restricted. That is, the heat generating electronic device 2 is positioned with respect to the heat radiating member 3.

  Further, in the state after the above-described steps, the cover portion 65 of the insulating sheet 6 is disposed as the bottom surface covering portion 61 so as to be sandwiched between the bottom surface 31a of the recess 31 and the device body 21, and the plurality of peripheral portions 66 are respectively side surfaces. The covering portion 62 is disposed so as to be sandwiched between each inner side surface 31 b of the recess 31 and the device body 21 or the external terminal 22. Thereby, the heat generating electronic device 2 and the heat dissipation member 3 are electrically insulated.

Further, when the electronic circuit device 1 is manufactured, the urging member 5 is attached to the circuit board 4 as shown in FIGS.
In this step, first, each joining portion 514 of the biasing member 5 is inserted into each joining hole 44 from the upper surface 4a side of the circuit board 4, and each other end portion 52 of the biasing member 5 is also inserted. Is inserted into each through hole 42 from the upper surface 4 a side of the circuit board 4, and the one end 51 of the biasing member 5 is disposed on the upper surface 4 a of the circuit board 4. In this state, the plurality of joining portions 514 are individually inserted into the plurality of joining holes 44, so that the insertion holes 516 of the urging member 5 are arranged at positions where they overlap the insertion holes 41 of the circuit board 4. As a result, the position and orientation of the biasing member 5 with respect to the circuit board 4 are determined.
Next, each joining portion 514 is joined to the lower surface 4b of the circuit board 4 with a joining agent 517 such as solder, whereby the one end portion 51 of the biasing member 5 is fixed to the circuit board 4 and the attachment process is completed.

And after these accommodation processes and attachment processes are completed, as shown in FIGS. 1, 3, and 4, the circuit board 4 and the urging member 5 fixed thereto are fixed to the heat radiating member 3 by the fixing screws 7. The manufacture of the electronic circuit device 1 is completed by fixing with screws (substrate fixing step).
In this substrate fixing step, first, the insertion holes 516 of the circuit board 4 and the urging member 5 are overlapped with the screw holes 33b of the cylindrical protrusion 33 of the heat radiating member 3, and each other end portion of the urging member 5 is also provided. The circuit board 4 is disposed on the cylindrical protrusion 33 of the heat radiating member 3 so that 52 contacts the upper surface 21 a of each device body 21. Then, the shaft portion of the fixing screw 7 is inserted from the upper surface 4 a side of the circuit board 4 into the biasing member 5 and the insertion hole 41 of the circuit board 4, and then screwed into the screw hole 33 b of the cylindrical protrusion 33. .

By attaching the fixing screw 7 in this way, the bulging portion 513 of the circuit board 4 and the biasing member 5 is sandwiched between the head of the fixing screw 7 and the cylindrical protrusion 33, and therefore the circuit board 4 and The urging member 5 is fixed to the heat radiating member 3.
Further, by fixing the urging member 5 to the heat radiating member 3 with the fixing screw 7, each other end 52 of the urging member 5 abuts on the upper surface 21 a of the device body 21 and each elastic deformation portion 53 is elastically deformed. Thus, the device body 21 is pressed against the bottom surface 31 a of the recess 31. That is, the heat generating electronic device 2 is fixed to the heat radiating member 3. In other words, this substrate fixing step also serves as a device fixing step for fixing the heat generating electronic device 2 accommodated in the recess 31 to the heat radiating member 3.

As described above, according to the electronic circuit device 1 of the present embodiment, the device body 21 is in the state of the recess 31 of the heat dissipation member 3 by the biasing force of the biasing member 5 with the circuit board 4 fixed to the heat dissipation member 3. The heat generating electronic device 2 is also fixed to the bottom surface 31 a of the recess 31 of the heat radiating member 3 by being pressed against the bottom surface 31 a. In other words, the heat-generating electronic device 2 can be fixed to the heat dissipation member 3 at the same time only by fixing the circuit board 4 to the heat dissipation member 3.
Further, since the other end portion 52 of the biasing member 5 is divided into a plurality of one end portions 51 so as to be individually in contact with the plurality of device main bodies 21, one biasing member is formed. 5, a plurality of heat generating electronic devices 2 can be fixed to the heat radiating member 3 at a time.
From the above, the man-hours for attaching the heat generating electronic device 2 and the circuit board 4 to the heat radiating member 3 can be reduced, and the manufacturing efficiency of the electronic circuit device 1 can be improved.

  Then, between the one end portion 51 and the other end portion 52 of the biasing member 5, the contact stress relaxation that relieves the stress applied to the other end portion 52 based on the contact of the other end portion 52 with the device main body 21. Since the portion 531 is formed, this stress is transmitted to the one end portion 51 of the urging member 5, and stress concentration is prevented from occurring at the fixing portion between the circuit board 4 and the one end portion 51 of the urging member 5. it can. Therefore, the circuit board 4 and the one end portion 51 of the urging member 5 can be secured and the reliability of the electronic circuit device 1 can be improved. Note that the above-described fixing portion indicates, for example, the joint portion 514 of the urging member 5 or the bulging portion 513 for fixing with screws.

In addition, since one end 51 of the urging member 5 is formed with a bonding portion 514 that is bonded to the circuit board 4 by the bonding agent 517, the one end 51 of the urging member 5 is firmly attached to the circuit board 4. Can be fixed to.
Further, since the joining portion 514 is inserted into the joining hole 44 of the circuit board 4, the urging member 5 can be easily attached to the circuit board 4. Further, by inserting the joint portion 514 into the joint hole 44, it is possible to prevent the joint portion 514 of the biasing member 5 from being displaced with respect to the joint portion of the circuit board 4.

Further, since the plurality of bonding portions 514 are individually inserted into the plurality of bonding holes 44 of the circuit board 4, until the biasing member 5 is fixed to the circuit board 4 by the bonding agent 517, It is possible to reliably prevent the biasing member 5 from being displaced with respect to the circuit board 4. In other words, the urging member 5 can be easily positioned with respect to the circuit board 4 simply by inserting the plurality of joining portions 514 into the joining holes 44.
Further, the circuit board 4 can also be formed by the above-described joining portion 514 and joining hole 44 and the biasing member 5 and the screwing insertion hole 41 formed in the circuit board 4 being spaced apart from each other. It is possible to reliably prevent the displacement of the biasing member 5 with respect to.

Further, since the screwing stress relaxation portion 515 is formed between the joint portion 514 and the bulging portion 513 of the urging member 5, the one end portion 51 of the urging member 5 is connected to the heat radiating member 3 by the fixing screw 7. When screwing to the joint portion 514, stress applied to the bulging portion 513 of the urging member 5 is transmitted to the joint portion 514, and stress concentration can be prevented from occurring at the joint portion between the joint portion 514 and the circuit board 4.
In addition, since a plurality of joining protrusions 512 of the biasing member 5 are formed at positions spaced from the bulging portion 513, one end 51 of the biasing member 5 is attached to the heat radiating member 3. The stress applied to the bulging portion 513 of the urging member 5 when screwing is dispersed to the plurality of bonding projections 512, and the stress applied to the screwing stress relaxation portion 515 of each bonding projection 512 can be relaxed.
Therefore, it is possible to secure the bonding state between the bonding portion 514 of the biasing member 5 and the circuit board 4 by the bonding agent 517 and improve the reliability of the electronic circuit device 1.

Furthermore, the device body 21 of the heat generating electronic device 2 is accommodated in the recess 31 of the heat radiating member 3, so that the thickness dimension of the electronic circuit device 1 can be set small and the electronic circuit device 1 can be thinned. .
In addition, the exothermic electronic device 2 accommodated in the recess 31 in the accommodating step is restricted from being translated in the direction along the upper surface 3a of the heat radiating member 3 and rotating around the orthogonal direction of the upper surface 3a of the heat radiating member 3. Therefore, it is possible to reliably prevent the positional deviation of the heat generating electronic device 2 with respect to the circuit board 4 and the heat radiating member 3 between the housing process and the completion of the board fixing process. Therefore, when the circuit board 4 is fixed to the heat radiating member 3, it is possible to reliably prevent the joint portion of the external terminal 22 of the heat generating electronic device 2 from being displaced with respect to the circuit board 4.

In the electronic circuit device 1 of the present embodiment, the predetermined wiring pattern of the circuit board 4 is electrically connected to the heat dissipation member 3 via the biasing member 5 and the fixing screw 7. Therefore, a separate wiring member for electrically connecting the electronic circuit device 3 to the electronic circuit device 1 is not required, and the configuration of the electronic circuit device 1 can be simplified.
In addition, when it is desired to ground a predetermined wiring pattern of the circuit board 4 and the electric circuit of the electronic circuit device 1 constituted by the heat generating electronic device 2 and the like electrically connected thereto, the grounding member 3 is simply grounded. The electric circuit of the electronic circuit device 1 can be easily grounded via the biasing member 5, the fixing screw 7 and the heat radiating member 3.

  Furthermore, according to the method for manufacturing the electronic circuit device 1 of the present embodiment, after the biasing member 5 is fixed to the circuit board 4, the circuit board 4 and the biasing member 5 are fixed to the heat radiating member 3 by the fixing screws 7. Since it is screwed, it is possible to prevent the biasing member 5 from rotating together with the fixing screw 7 at the time of screwing and to prevent the biasing member 5 from being displaced relative to the circuit board 4. .

Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, when the concave portion 31 of the heat dissipation member 3 in plan view is formed so as to restrict the parallel movement and the rotational movement of the heat generating electronic device 2 accommodated therein, the inner portion of the concave portion 31 as in the above embodiment. The side surface 31b is not limited to be formed so as to be in surface contact with the side surface of the device main body 21, but may be formed so as to be in point contact, for example. In other words, the planar view shape of the recess 31 may be formed in an arbitrary shape that is not constrained by the planar view shape of the heat generating electronic device 2.
Further, the recess 31 is not limited to be formed so as to restrict the parallel movement and the rotational movement of the heat generating electronic device 2 accommodated therein. For example, as shown in FIGS. The heat generating electronic device 2 may be formed so as to simply be accommodated, for example, by setting it larger than the heat generating electronic device 2.

In this case, as shown in FIGS. 6 and 7, the heat-generating electronic device 2 may be positioned in the recess 31 using the biasing member 5.
If it demonstrates concretely, it will bulge to the lower surface 4b side of the circuit board 4 in the part located between the contact stress relaxation part 531 and the other end part 52 among the elastic deformation parts 53 of the urging member 5. A pressing spring portion 532 having a U-shaped cross section is formed. The pressing spring portion 532 enters between the one inner side surface 31 b of the recess 31 and the side surface of the device body 21, thereby pressing the heat generating electronic device 2 against the other inner side surface 31 b of the recess 31 by its elastic force. it can. That is, the heat generating electronic device 2 can be positioned in the recess 31 by the pressing spring portion 532.
In the configuration shown in FIG. 6, since the pressing spring portion 532 biases the heat generating electronic device 2 in the longitudinal direction, the external terminal 22 is pressed against the inner side surface 31 b of the recess 31 and excessively applied to the external terminal 22. There is a risk of stress. Therefore, for example, as shown in FIG. 7, it is more preferable to consider the arrangement of the pressing spring portion 532 so that the urging force of the pressing spring portion 532 is applied in the width direction of the heat generating electronic device 2.

Furthermore, in the said embodiment, although the other end part 52 of the urging member 5 is divided | segmented into two or more so that the several heat generating electronic device 2 can be fixed to the heat radiating member 3 collectively, it is not divided | segmented, for example Also good. That is, one urging member 5 may be configured to fix, for example, only one heat generating electronic device 2 to the heat radiating member 3.
Further, although the joining portion 514 of the urging member 5 is inserted into the joining hole 44 of the circuit board 4, it may be joined to the upper surface 4 a of the circuit board 4 by, for example, a bonding agent 517.

Further, the joining portion 514 of the biasing member 5 for fixing the biasing member 5 to the circuit board 4 is not limited to being formed on the bonding projection 512, and is formed on the frame portion 511 or the bulging portion 513, for example. May be. In other words, the frame portion 511 and the bulging portion 513 of the urging member 5 may be bonded to the upper surface 4 a of the circuit board 4 by the bonding agent 517.
Further, when the insertion hole 516 for inserting the shaft portion of the fixing screw 7 is formed in the urging member 5, the urging member 5 is attached to the heat radiating member 3 simultaneously with the circuit board 4 by the fixing screw 7. For example, the urging member 5 may not be formed with the joint portion 514 because it can be fixed.

Moreover, in the said embodiment, although the one end part 51 of the urging | biasing member 5 was fixed in the upper surface 4a side of the circuit board 4, it is fixed in the lower surface 4b side of the circuit board 4 as shown, for example in FIG. May be. In this configuration, the one end portion 51 of the biasing member 5 is disposed on the lower surface 4b side of the circuit board 4 together with the other end portion 52 and the elastic deformation portion 53, so that the other end portion is provided on the circuit board 4 as in the above embodiment. It is not necessary to form the through hole 42 through which the 52 and the elastically deformable portion 53 are inserted, and the configuration of the electronic circuit device can be simplified.
When the one end 51 of the urging member 5 is disposed on the lower surface 4b side of the circuit board 4, the one end 51 of the urging member 5 is disposed on the upper surface 4a side of the circuit board 4, The joining portion 514 of the urging member 5 may be fixed to the circuit board 4 by joining to the circuit board 4. For example, without using the joining portion 514, only the fixing screw 7 is used simultaneously with the circuit board 4. It may be fixed to the heat dissipation member 3.

By the way, when the urging member 5 is fixed to the heat radiating member 3 simultaneously with the circuit board 4 only by the fixing screw 7, the urging member 5 and the circuit board are placed on the heat radiating member 3 before fixing with the fixing screw 7. It is necessary to arrange 4 in order.
However, the urging force of the urging member 5 that presses the device main body 21 is obtained by fixing one end portion 51 of the urging member 5 to the heat radiating member 3 and elastically deforming the elastic deformation portion 53. Therefore, as shown in FIG. 9, the elastic deformation portion 53 is not elastically deformed in a state before the one end portion 51 of the urging member 5 is fixed to the heat radiating member 3. The one end 51 floats above the tip surface 33 a of the cylindrical protrusion 33.

This lifting makes the arrangement state of the urging member 5 unstable, so that the urging member 5 is urged after the urging member 5 is arranged on the heat radiating member 3 until it is fixed by the fixing screw 7. There is a risk of causing a positional shift of the member 5.
The biasing member 5 is displaced in such a way that, for example, all parts of the biasing member 5 such as the insertion hole 516 and the other end 52 are shifted from each part of the heat radiation member 3 such as the screw hole 33b and the recess 31. In addition to the displacement of the entire biasing member 5, for example, even if the insertion hole 516 of the biasing member 5 is positioned at the screw hole 33 b of the heat radiating member 3, the other end 52 of the biasing member 5. However, there is a deviation in the direction of the urging member 5 that deviates from the position of the recess 31 of the heat radiating member 3.

  In order to suppress the occurrence of the displacement of the urging member 5 described above, it is preferable to provide locking means 8 and 9 on the heat dissipating member 3 and the urging member 5 as shown in FIGS. Hereinafter, two specific examples of the locking means 8 and 9 will be described.

[First specific example of locking means]
The locking means 8 in the configuration shown in FIGS. 8 to 10 includes a flat locking surface (engagement portion) 33 c formed on the outer peripheral surface of the cylindrical protrusion 33 of the heat radiating member 3 and one end portion 51 of the biasing member 5. And a flat-plate-like locking projection 518 that engages with the locking surface 33c by surface contact.
The locking surface 33 c of the cylindrical protrusion 33 extends perpendicular to the upper surface 3 a of the heat radiating member 3. In addition, the locking surface 33c of the cylindrical protrusion 33 in the illustrated example is formed at a position that sandwiches the screw hole 33b of the cylindrical protrusion 33 together with the recess 31 in plan view, but at least the locking of the biasing member 5 It suffices if it is formed at a position where the projection 518 can be brought into surface contact.

The locking projection 518 of the biasing member 5 is a flat plate that is sandwiched between the heat dissipation member 3 and the circuit board 4 when the circuit board 4 is screwed to the heat dissipation member 3 in the one end 51 of the biasing member 5. (Bent portion 513B; the portion where the insertion hole 516 is formed) is bent at a right angle. The locking projection 518 is positioned such that the insertion hole 516 of the biasing member 5 overlaps the screw hole 33b, and the other end 52 of the biasing member 5 is accommodated in the recess 31. In the state of being arranged on the top, it comes into surface contact with the locking surface 33c of the cylindrical protrusion 33.
The dimensions of the locking projection 518 protruding from the held portion 513B are the states before the biasing member 5 disposed on the heat dissipation member 3 is fixed to the heat dissipation member 3 as shown in FIG. Even so, the locking projection 518 is set so as to come into surface contact with the locking surface 33 c of the cylindrical projection 33.

In a state where the locking projection 518 of the urging member 5 is in surface contact with the locking surface 33c of the cylindrical projection 33, as shown in FIGS. There is no parallel movement in one direction (X direction) in which the protrusions 33 are arranged in order. In other words, the parallel movement of the urging member 5 in one direction with respect to the heat radiating member 3 is restricted by the locking means 8.
In addition, the locking projection 518 of the biasing member 5 is in surface contact with the locking surface 33c of the cylindrical projection 33, and the insertion hole 516 of the biasing member 5 is disposed so as to overlap the screw hole 33b. Then, the other end 52 of the urging member 5 is not displaced from the device main body 21 in the recess 31. In other words, the rotation of the urging member 5 around the insertion hole 516 of the urging member 5 is restricted by the locking means 8 in plan view.

  As described above, in the configuration shown in FIGS. 8 to 10, the shaft portion of the fixing screw 7 is inserted into the insertion holes 41 and 516 of the circuit board 4 and the biasing member 5, and the screw holes 33 b of the cylindrical protrusion 33 are inserted. When screwed, the biasing member 5 does not rotate around the insertion hole 516. Therefore, after the urging member 5 is arranged on the heat radiating member 3 and before it is fixed with the fixing screw 7, a deviation in the direction of the urging member 5 with respect to the heat radiating member 3 and the heat generating electronic device 2 occurs. Can be prevented. As a result, the other end 52 of the urging member 5 is held on the device main body 21 in the recess 31, and the urging member 5 can be easily positioned with respect to the heat radiating member 3 and the heat generating electronic device 2.

[Second specific example of locking means]
The locking means 9 in the configuration shown in FIGS. 11 to 14 is formed in a locking groove (engagement portion) 34 that is recessed from the distal end surface 33 a of the cylindrical projection 33 of the heat radiating member 3 and one end portion 51 of the biasing member 5. And a flat-plate-shaped locking projection 518 which is engaged by being inserted into the locking groove 34.
As shown in FIGS. 11 to 14, the locking groove 34 of the heat radiating member 3 is formed so as to have a narrow width and extend linearly in plan view, and both ends in the longitudinal direction of the locking groove 34 are formed by the cylindrical protrusions 33. Open to the outer peripheral surface. Further, a convex portion 34 b that protrudes from the bottom surface 34 a of the locking groove 34 is formed in a middle portion of the locking groove 34 in the longitudinal direction of the bottom surface 34 a of the locking groove 34. By forming the convex portion 34b, the depth dimension of the locking groove 34 is set deep at both ends in the longitudinal direction and shallow at a midway portion in the longitudinal direction. The bottom surface 34a of the locking groove 34 in the illustrated example is set at the same height as the top surface 3a of the heat radiating member 3, but may be set higher or lower than the top surface 3a of the heat radiating member 3, for example. Further, the locking groove 34 in the illustrated example is formed at a position so as to sandwich the screw hole 33b of the cylindrical projection 33 together with the recess 31 in plan view, but at least the locking projection 518 of the biasing member 5 is inserted. It may be formed in a possible position.

The locking projection 518 of the urging member 5 is bent at a right angle with respect to the held portion 513B in the one end 51 of the urging member 5, as in the case of the configuration of FIGS. . In addition, the protrusion 34b in the locking groove 34 is inserted into the locking protrusion 518 protruding in the protruding direction from the held portion 513B when the locking protrusion 518 is inserted into the locking groove 34. A stop recess 518a is formed.
In the illustrated urging member 5, the width dimension of the held portion 513 </ b> B and the other end portion 52 along the longitudinal dimension of the locking groove 34 is set to be smaller than the width dimension of the locking projection 518. However, it may be set to be equal to or larger than the width dimension of the locking projection 518, for example.

  Note that the dimensions of the locking grooves 34 and the protrusions 34 b formed in the heat radiating member 3 and the dimensions of the locking protrusions 518 and the locking recesses 518 a formed in the biasing member 5 are arranged on the heat radiating member 3. Even when the biasing member 5 is fixed to the heat radiating member 3 (the elastic deformation portion 53 is not elastically deformed), the locking projection 518 is inserted into the locking groove 34, And the convex part 34b in the latching groove | channel 34 is set so that the latching recessed part 518a of the latching protrusion part 518 may enter. In addition, each dimension of the locking groove 34, the protrusion 34b, the locking projection 518, and the locking recess 518a is such that the held portion 513B of the urging member 5 is disposed on the distal end surface 33a of the cylindrical projection 33. It is also set to be able to.

The engaging protrusion 518 of the biasing member 5 configured as described above is inserted into the engaging groove 34 of the heat radiating member 3, and the protrusion 34 b in the engaging groove 34 is inserted into the engaging recess of the engaging protrusion 518. The biasing member 5 does not translate along the upper surface 3a of the heat radiating member 3 in the state where it enters the 518a. In other words, the parallel movement of the urging member 5 with respect to the heat radiating member 3 is restricted by the locking means 9. Further, in this state, the rotation of the urging member 5 around the insertion hole 516 of the urging member 5 is also restricted by the locking means 9.
Further, in a state where the flat locking projection 518 is inserted into the locking groove 34, the insertion hole 516 of the biasing member 5 is positioned so as to overlap the screw hole 33 b of the cylindrical projection 33, and the biasing The other end 52 of the member 5 is disposed on the device main body 21 disposed in the recess 31.

As described above, in the configuration shown in FIGS. 11 to 14, the shaft portion of the fixing screw 7 is inserted into the insertion holes 41 and 516 of the circuit board 4 and the biasing member 5, and the screw holes 33 b of the cylindrical protrusion 33 are inserted. When screwed, the biasing member 5 does not rotate around the insertion hole 516. Therefore, after the urging member 5 is arranged on the heat radiating member 3 and before it is fixed with the fixing screw 7, a deviation in the direction of the urging member 5 with respect to the heat radiating member 3 and the heat generating electronic device 2 occurs. Can be prevented. That is, the urging member 5 can be easily positioned with respect to the heat radiating member 3 and the heat generating electronic device 2.
Further, since the parallel movement of the urging member 5 with respect to the heat radiating member 3 is also restricted simply by inserting the flat-plate-like locking projection 518 into the locking groove 34, the urging member 5 is arranged on the heat radiating member 3. It is also possible to prevent the displacement of the entire biasing member 5 from the time it is fixed later with the fixing screw 7. As a result, the insertion hole 516 of the urging member 5 is held in a state where it overlaps with the screw hole 33b of the cylindrical protrusion 33, and the screwing operation of the circuit board 4 and the urging member 5 with the fixing screw 7 is simplified. It can be carried out.

  In addition, although the both ends of the longitudinal direction of the locking groove 34 which comprises the locking means 9 shown in FIGS. 11-14 opened to the outer peripheral surface of the cylindrical protrusion 33, it does not need to open, for example. In this case, the locking projection 518 of the urging member 5 only needs to be set to a size and shape that can be inserted into the locking groove 34. In this configuration, the parallel movement of the urging member 5 with respect to the heat radiating member 3 can be restricted by the inner surface of the locking groove 34, so that the protrusion 34 b and the locking protrusion 518 in the locking groove 34 are engaged. The stop recess 518a may not be particularly formed.

  Furthermore, in the said embodiment, although the insulating sheet 6 was distribute | arranged so that the whole inner surface of the recessed part 31 might be covered, it is distribute | arranged so that at least the thermal radiation member 3 and the heat generating electronic device 2 may be electrically insulated. Just do it. Therefore, for example, when the conductive portion is not exposed on the outer surface of the device body 21, the insulating sheet 6 may be disposed on at least the inner surface of the recess 31 facing the external terminal 22. However, in the case of considering the improvement in the manufacturing efficiency of the electronic circuit device as in the above embodiment, the inner side surface 31b of the recess 31 is arranged so that the insulating sheet 6 enters the recess 31 together with the heat generating electronic device 2 in the device insertion process. In addition, it is preferable that the insulating sheet 6 is disposed not only on a part of the bottom surface 31 a of the recess 31.

Moreover, the depth dimension of the recessed part 31 of the heat radiating member 3 is not restricted to the thing of the said embodiment, For example, only the lower part of the device main body 21 enters in the recessed part 31, and the whole external terminal 22 is rather than the upper surface 3a of the heat radiating member 3. You may set so that it may be located upwards.
Furthermore, the depth dimension of the recess 31 is such that, for example, the entire device body 21 enters the recess 31 so that the upper surface 21 a of the device body 21 is positioned lower than the upper surface 3 a of the heat radiating member 3. Only the tip portion may be set so as to protrude from the upper surface 3 a of the heat radiating member 3.

  In this case, the circuit board 4 is not limited to being fixed to the heat radiating member 3 in a state of being spaced from the upper surface 3a of the heat radiating member 3 as in the above embodiment. You may fix in the mounted state. That is, the cylindrical protrusion 33 may not be formed on the heat radiating member 3. Even in such a configuration, since the circuit board 4 is arranged at a distance above the device body 21 arranged in the recess 31, the biasing member can be obtained simply by fixing the circuit board 4 to the heat radiating member 3. The heat generating electronic device 2 can be pressed against the bottom surface 31 a of the recess 31 by the urging force of 5.

Moreover, although the recessed part 31 was formed in the heat radiating member 3, for example, the upper surface 3a of the heat radiating member 3 may be used as the mounting surface of the device body 21 without forming the recessed part 31. In this case, the protrusion height of the cylindrical protrusion 33 is set higher than the height dimension of the device body 21 disposed on the upper surface 3 a of the heat dissipation member 3, so that the device disposed on the upper surface 3 a of the heat dissipation member 3. The circuit board 4 can be fixed to the heat radiating member 3 with a space above the main body 21.
Furthermore, although the device main body 21 constituting the heat generating electronic device 2 is formed in a rectangular plate shape in plan view, the device body 21 is not limited to this, and may have an arbitrary shape such as a circular shape in plan view.

Further, the external terminal 22 of the heat generating electronic device 2 may protrude from an arbitrary outer surface of the device body 21 as long as it protrudes upward from at least the upper surface 21a of the device body 21, and the length of the external terminal 22 and the bending position thereof. Etc. may be arbitrarily set.
Furthermore, the heat generating electronic device 2 of the electronic circuit device according to the present invention is not limited to a semiconductor element sealed with a resin, and at least generates a heat by energization and is mounted on the mounting surface of the heat dissipation member 3. The external terminal 22 for electrical connection protruding from 21 may be anything that protrudes above the mounting surface.

DESCRIPTION OF SYMBOLS 1 Electronic circuit apparatus 2 Heat generating electronic device 21 Device main body 21a Upper surface 21b Lower surface 21c Side surface 22, 22A, 22B External terminal 3 Heat radiation member 3a Upper surface 31 Recessed portion 31a Bottom surface (mounting surface)
31b Inner side surface 32 Engagement protrusion (positioning part)
33 cylindrical protrusion 33c locking surface (engagement part)
34 Locking groove (engagement part)
4 Circuit board 4a Upper surface 4b Lower surface 41 Insertion hole 42 Through hole 44 Joining hole 5 Energizing member 51 One end part 512 Joining protrusion 513 Swelling part 513B Nipped part 514 Joining part 515 Screwing stress relaxation part 516 Insertion hole 517 Bonding agent 518 Locking protrusion 518a Locking recess 52 Other end 53 Elastic deformation portion 531 Contact stress relaxation portion 532 Pressing spring portion 6 Insulating sheet 61 Bottom surface covering portion 62 Side surface covering portion 63 Recessed portion 65 Cover portion 66 Surrounding portion 7 Fixing screw 8, 9 Locking means

Claims (10)

A heat dissipating member;
A device main body placed on the mounting surface of the heat dissipation member, and a heat generating electronic device including an external terminal protruding above the mounting surface from the device main body,
A circuit board that is fixed to the heat radiating member in a state of being spaced above the device body mounted on the mounting surface, and that is electrically connected to the heat generating electronic device by joining the external terminals; ,
One end portion is fixed to the circuit board, and the other end portion is provided with a biasing member that comes into contact with the device main body placed on the mounting surface,
With the circuit board fixed to the heat dissipation member, the device body is pressed against the mounting surface by the urging force of the urging member ,
A joining portion to be joined to the circuit board via a joining agent is formed at one end portion of the biasing member,
The joint is inserted through a joint hole formed through the circuit board in the thickness direction,
An insertion hole is formed in one end of the circuit board and the urging member to allow a fixing screw to screw the one end of the circuit board and the urging member to the heat radiating member.
The insertion hole of the urging member is positioned with a space from the bonding portion, and the insertion hole of the circuit board is positioned with a space from the bonding hole. Circuit device. 2. The electronic circuit device according to claim 1 , wherein a plurality of the joint portions and the joint holes are formed, and each joint portion is individually inserted into the plurality of joint holes. When the one end of the urging member is screwed to the heat radiating member with the fixing screw, the stress applied to the portion where the insertion hole is formed in the urging member is affected by the joint portion of the urging member. The electronic circuit device according to claim 1 , wherein the electronic circuit device is relaxed by a screwing stress relaxation portion formed between the insertion hole and a portion where the insertion hole is formed. Claims one end of the biasing member, while being electrically connected to the wiring pattern of the circuit substrate through the junction, characterized in that it is electrically connected to said heat radiating member via the fixing screw The electronic circuit device according to any one of claims 1 to 3 . One end of the biasing member is disposed on the upper surface of the circuit board facing the same side as the mounting surface of the heat dissipation member,
The other end of the urging member is inserted into a through-hole penetrating in the thickness direction of the circuit board and protrudes from the lower surface of the circuit board facing the mounting surface of the heat dissipation member. The electronic circuit device according to any one of claims 1 to 4 . 6. The electronic circuit device according to claim 1 , wherein the mounting surface is a bottom surface of a concave portion that is recessed from a flat upper surface of the heat radiating member facing the circuit board. The exothermic electronic device is restricted in parallel movement in the direction along the upper surface of the heat radiating member and rotational movement about the orthogonal direction of the upper surface of the heat radiating member while being accommodated in the recess. The electronic circuit device according to claim 6 . A contact stress relaxation portion is formed between the one end portion and the other end portion of the biasing member to relieve stress applied to the other end portion based on the contact of the other end portion with the device body. The electronic circuit device according to any one of claims 1 to 7 , wherein the electronic circuit device is provided. A plurality of the heat generating electronic devices are placed on the mounting surface,
The said other end part of the said urging | biasing member is divided | segmented into plurality with respect to the said one end part so that it may contact | abut each device main body, The any one of Claim 1-8 characterized by the above-mentioned. The electronic circuit device according to item. A manufacturing method for manufacturing the electronic circuit device according to claim 1 ,
After fixing the joining portion of the biasing member to the circuit board by the joining agent,
A method of manufacturing an electronic circuit device, wherein the circuit board and the biasing member are screwed to the heat radiating member with the fixing screw.

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