JP5511143B2 - Mounting machine - Google Patents

Description

  The present invention relates to a mounting machine for mounting electronic components on a substrate.

Generally, a mounting machine that mounts electronic components such as ICs, transistors, and capacitors on a substrate is equipped with a head unit that picks up the electronic components and transports them above the substrate, and the head unit can adsorb the electronic components. A nozzle is provided. In order to prevent mounting failure of electronic components, it is important that the electronic components are attracted to the suction nozzle in the correct posture. Therefore, the mounting machine has a camera that can capture the orientation of the electronic components attracted to the suction nozzle. Is provided.
JP-A-2005-236511 JP 2007-233502 A

  Conventionally, a mounting machine in which a camera is provided in a head unit (for example, Patent Document 1) and a mounting machine in which a camera is provided on a base (for example, Patent Document 2) are known.

  In the mounting machine in which the camera is provided in the head unit, it is possible to take an image of the suction posture of the electronic component when the head unit picks up the electronic component and then moves upward of the substrate. Since the movement time of the head unit is an indispensable time for the substrate mounting operation, the electronic component mounting operation can be efficiently performed by effectively using such time. However, since this camera is provided in the head unit, there is a demand for miniaturization as much as possible. For this reason, it is not easy to improve the performance of the camera, for example, by widening the field of view of the camera or increasing the imaging accuracy. For large electronic components and electronic components that require high-accuracy imaging, the suction posture recognition ( There is a problem that it is difficult to reliably perform component recognition.

  On the other hand, in mounting machines with a camera on the base, there is not a strong demand for downsizing the camera as in the mounting machines described above, so it is easy to improve the performance of the camera, and electronic devices that require large electronic components and high-precision imaging. It is possible to reliably recognize the suction posture of components and the like. However, in this mounting machine, the head unit that picks up the electronic components has to move to the position of the camera installed on the base, compared with the above-mentioned one in which the head unit can move directly above the substrate. There is a problem that the efficiency of mounting electronic components is poor.

  The present invention has been completed based on the above-described circumstances, and provides a mounting machine capable of reliably recognizing electronic components and efficiently mounting electronic components. Objective.

A mounting machine disclosed in the present specification is a mounting machine for mounting an electronic component on a substrate, and includes a suction unit that can suck the electronic component and transports the electronic component onto the substrate. A head-side camera that is provided in the head unit and images the suction posture of the electronic component sucked by the suction nozzle when the head unit transports the electronic component; and the suction nozzle installed on a base Based on the base-side camera that captures the suction posture of the electronic component sucked on, the illumination device that is provided on the base and illuminates the lower surface of the electronic component from the side, and the component data related to the electronic component, Camera selection means for selecting from the head-side camera and the base-side camera a camera for imaging the electronic component suction posture, and the head unit includes the suction unit. With nozzles are plurality, the base-side camera is capable capturing a side image of the lower surface of the of the head-side camera is assumed that a wide field of view and the electronic component, wherein the camera selection means, said When there is a large component that cannot be imaged by the head-side camera among the electronic component group that is adsorbed by a plurality of adsorption nozzles, the base-side camera is used as a camera for imaging the electronic component group. The lower surface image of the electronic component group is picked up by the base side camera , the large component is not present in the electronic component group, the lead component is not present, and the bump is provided on the lower surface. If the electronic components are present, the select group of electronic components the base side camera as the camera for taking an, together with the lower surface image of the electronic component group by the base-side camera is imaged The lighting device rises or turns on the lateral image of the lower surface of the electronic component by the base-side camera is captured, in the electronic component group, the large part is not present, said there are lead component First, when there is no electronic component with the bumps provided on the lower surface, the head side camera is selected as a camera for imaging the electronic component group, and the lower surface image of the electronic component group is selected by the head side camera. characterized in Rukoto imaged.

  According to such a configuration, an image of the suction posture of the electronic component is taken by the camera selected based on the component data of the electronic component. Therefore, the component recognition of the electronic component can be performed reliably, and the mounting operation of the electronic component can be performed efficiently.

If all the electronic component groups attracted to the head unit are of a size that can be recognized by the head-side camera, the suction orientation of the electronic component group is captured by the head-side camera and When an electronic component having a size that cannot be captured by the head-side camera is included, the suction posture of the electronic component group is captured by the base-side camera. Accordingly, it is possible to reliably recognize a large electronic component and to efficiently perform the mounting operation of the electronic component.
Furthermore, when an electronic component such as a BGA is included in the electronic component group, a side image of the lower surface can be taken to reliably recognize the presence or absence of a bump, a chip, etc. Mounting work can be performed efficiently.

  Further, the head unit is provided with a plurality of the suction nozzles, the base side camera has a higher resolution than the head side camera, and the camera selection means is based on a component type of the electronic component. A camera that captures an image of the electronic component group may be selected. The “component type” used here distinguishes electronic components depending on whether high-resolution imaging is required.

  According to such a configuration, since the camera is selected based on the component type of the electronic component, the component recognition of the electronic component requiring high-accuracy imaging can be reliably performed, and the mounting operation of the electronic component can be performed. It can be done efficiently.

  The head unit is provided with a plurality of the suction nozzles, the base is provided with illumination means for illuminating the lower surface of the electronic component from the side, and the base camera is on the lower surface side of the electronic component. It is also possible to capture a side image, and the camera selection means may select a camera that captures an image of the electronic component group based on a component type of the electronic component. The “component type” used here distinguishes electronic components depending on whether or not it is necessary to capture a side image of the lower surface.

  According to such a configuration, since the camera is selected based on the component type of the electronic component, for the electronic component that requires imaging of the side image of the lower surface, the electronic component is mounted while capturing the side image. Work can be performed efficiently.

  The head-side camera can capture a side image of the electronic component sucked by the suction nozzle, and the camera selection unit needs to capture the side image in the electronic component group. Is included, the head-side camera may be selected as a camera for imaging the electronic component.

  ADVANTAGE OF THE INVENTION According to this invention, the mounting machine which can perform the component recognition of an electronic component reliably, and can perform the mounting operation | work of an electronic component efficiently can be provided.

< Reference Example 1>
Reference Example 1 of the present invention will be described below with reference to FIGS.
The mounting machine 10 in this reference example is an apparatus for mounting the electronic component P on the board B. The board 11 is transported to the base 11 of the mounting machine 10 and stopped at a predetermined position (mounting work position). A pair of conveyors 12 that can be made are provided. The substrate B stopped at the mounting work position is shown by a two-dot chain line in FIG. In addition, on both sides of the pair of conveyors 12 (upper and lower sides in FIG. 1), component supply units 13 that supply electronic components P are provided, and a large number of tape feeders 14 are set in each component supply unit 13. Each tape feeder 14 is provided with a tape on which electronic parts P such as ICs, transistors, capacitors, etc. are attached at regular intervals. The supply of P is performed sequentially.

  The mounting machine 10 includes a head unit 15 that transfers the electronic component P from the component supply unit 13 to a mounting work position (above the board B). The head unit 15 is movable in the X-axis direction and the Y-axis direction (the X-axis direction is parallel to the transport direction of the substrate B, and the Y-axis direction is perpendicular to the X-axis direction) (see FIG. 1).

The head unit 15 is provided with a plurality of suction nozzles 16 (six in this reference example ) that can suck and hold the electronic components P from each tape feeder 14. The six suction nozzles 16 are arranged at equal intervals in the extending direction of the conveyor 12 (X-axis direction). Each suction nozzle 16 is connected to a negative pressure generator (not shown), and can hold the electronic component P detachably by the negative pressure suction force.

  The head unit 15 is provided with a head-side camera 17 capable of imaging each electronic component P sucked by the suction nozzle 16. The head-side camera 17 is attached to the head unit 15 so as to be slidable in the direction in which the suction nozzles 16 are arranged (X-axis direction), and normally the right end of the head unit 15 (see FIGS. 1 and 2). When the image of the electronic component P is picked up, it slides to the left.

In this reference example , the head-side camera 17 can capture an image of an electronic component P smaller than a 10 mm square (hereinafter referred to as a small component), that is, an electronic component P that falls within the reference imaging range with a single imaging. The maximum size is 10 mm square. The electronic component P having a size of 10 mm square or more is referred to as a large component.

  The head-side camera 17 can capture the lower surface image and the side surface image of the electronic component P while sliding in the left-right direction relative to the head unit 15. The head-side camera 17 has a camera holder 17A attached to the head unit 15 so as to be slidable. A component camera 31 that captures a lower surface image and a side image of the electronic component P is mounted on the camera holder 17A. It is mounted (see FIG. 3). The component camera 31 integrally includes a CCD line sensor 31A, an imaging lens 31B, and the like. The camera holder 17 </ b> A includes a first light source 32 that illuminates the lower surface of the electronic component P sucked by the suction nozzle 16 and a second light source 33 that illuminates the side surface of the electronic component P. The 1st light source 32 and the 2nd light source 33 are comprised by LED. Further, the camera holder 17A has three reflecting members (first reflecting member 34, second reflecting member 35, third reflecting light from the first light source 32 and light from the second light source 33 to the component camera 31 side. A reflective member 36) is provided.

  The light from the first light source 32 is reflected on the lower surface of the electronic component P, and the reflected light is guided to the component camera 31 side by the first reflecting member 34 and the third reflecting member 36. The light from the second light source 33 projects the electronic component P to the side and is guided to the component camera 31 side by the second reflecting member 35 and the third reflecting member 36. In this way, the head-side camera 17 can capture the lower surface image and the side surface image of the electronic component P with one component camera 31. The head-side camera 17 can selectively capture only the lower surface image, only the side image, and both the lower surface image and the side image of the electronic component P by the head side camera control means 24.

  By capturing a side image of the electronic component P, for example, when the suction force of the suction nozzle 16 is insufficient and the electronic component P is inclined with respect to the tip of the suction nozzle 16, the electronic component P The inclination can be recognized. Further, by capturing both the lower surface image and the side surface image of the electronic component P, for example, when the electronic component P is a small component and the lead pitch is very narrow, the recognition accuracy is improved. be able to.

  The base 11 includes a base-side camera 18 that includes a line sensor and can capture a lower surface image of the electronic component P sucked by the suction nozzle 16. A pair of base-side cameras 18 are provided on both sides of the conveyor 12, and are respectively installed at substantially central positions in the longitudinal direction of the base 11 (in the extending direction of the conveyor 12), in other words, on both sides of the mounting work position. The lower surface image of the electronic component P is captured when the head unit 15 that sucks the electronic component P passes above the base-side camera 18. The base-side camera 18 has a wider field of view than the head-side camera 17, can capture a large part at a time, and has a higher resolution than the head-side camera 17.

  A base-side illumination device 19 (corresponding to the illumination means of the present invention) that illuminates the lower surface of the electronic component P from the side is provided at the installation position of the base-side camera 18 in the base 11. As shown in FIG. 4, the base-side lighting device 19 includes an elevating part 19 </ b> A attached to the base 11 so as to be movable up and down in the vertical direction, and the elevating part 19 </ b> A is adsorbed by the adsorption nozzle 16. It is set to be able to ascend to the highest position within a range where it does not contact the electronic component P. Further, the elevating part 19A has a rectangular tube shape opened in the up-down direction, and the base side camera 18 is disposed inside thereof.

  On the inner peripheral surface of the elevating unit 19A, a light source unit 19B that irradiates light to the lower surface of the electronic component P from obliquely below is provided. The light source unit 19B includes a plurality of LEDs arranged in parallel in the vertical and horizontal directions (the axial direction and the circumferential direction of the lifting unit 19A), and is arranged at the upper end position of the lifting unit 19A. When the elevating part 19A is raised, the light source part 19B is arranged at a height position that is very close to the lower surface of the electronic component P. When the light source unit 19B is turned on when the elevating unit 19A is raised, the light illuminates the lower surface of the electronic component P from a slightly lower side. At this time, when the electronic component P is a BGA or the like in which a bump (ball-shaped solder) is provided on the lower surface instead of the lead, the light from the light source unit 19B is reflected on the peripheral edge of the bump, and the base side The camera 18 captures a ring-shaped reflection image (corresponding to the side image of the lower surface in the present invention). Here, the lower surface image of the electronic component P that is imaged regardless of the illumination of the base side illumination device 19 is an image in which the arrangement portion of the bump is planar in the electronic component P such as BGA regardless of the presence or absence of the bump. It is picked up as a (circular reflection image) and it is difficult to recognize the presence or absence of a bump or a chip. However, according to the illumination of the base side illuminating device 19, if there is a bump, a ring-shaped image whose peripheral portion is illuminated is obtained, and if there is no bump, a ring-shaped image cannot be obtained. Thus, the presence or absence of bumps can be reliably recognized. Further, the chipping of the bump can be recognized by the ring shape of the obtained image.

  The mounting machine 10 includes a component data storage device 21 in which various data related to all electronic components P mounted on the board B (component data related to the electronic components P) are stored. Specifically, for each electronic component P, the component type (chip component, lead component, etc.), component type (QFP, BGA, etc.), component size (external dimension is Amm square, etc.), and electronic component P is a lead component. In some cases, data related to the electronic component P itself, such as the lead pitch, is stored in association with each electronic component P, and in addition, a transfer order (first order) indicating the order in which each electronic component P is transferred by the head unit 15. 1 group, 2nd group, etc.), the identification number (1, 2, etc. from the right end) of the suction nozzle 16 to be sucked, the mounting position on the substrate B, etc. It is stored in association with each P. The component data of the electronic component P is stored in advance in association with the type of each board B.

  The mounter 10 includes a component conveyance control means 22 for controlling the movement and operation of the head unit 15 and a camera for imaging the electronic component P from the head side camera 17 and the base side camera 18 based on the component data. Camera selection means 23 to select, head side camera control means 24 for controlling movement and operation of the head side camera 17, base side camera control means 25 for controlling the operation of the base side camera 18, and base side illumination device Whether the suction posture of the electronic component P is correct based on the image of the electronic component P taken by the head side camera 17 or the base side camera 18 and the base side illumination control means 26 for controlling the raising and lowering and lighting of 19 A control unit 28 that functions as the component posture determination means 27 for determining whether or not is provided is provided.

  The camera selection unit 23 selects a camera according to the component size of each electronic component P. Specifically, if all of the electronic parts P group that are transferred in the same order by the head unit 15 are small parts, the camera selection unit 23 is a head-side camera as a camera that images the electronic parts P group. When 17 is selected and a large part is included in the electronic component P group, the base side camera 18 is selected as a camera for imaging the electronic component P group.

Next, the mounting operation of the electronic component P on the board B performed by the mounting machine 10 of this reference example will be described with reference to FIG.
When the operator selects the type of the board B to be produced on the mounting line, the mounting work routine shown in FIG. 6 is started, and the control unit 28 first determines the board B from the component data stored in the component data storage device 21. The component data of the electronic component P associated with the type is extracted (S10).

  Next, the control part 28 is a component of the electronic component P group (a group of electronic components P picked up simultaneously by the head unit 15) having the same transfer order from the component data of the electronic component P extracted in S10. Data is extracted (S11).

  When the component data of the electronic component P group is extracted, the component conveyance control means 22 of the control unit 28 moves the head unit 15 to the component supply unit 13 and sequentially sucks the electronic component P group to the suction nozzle 16. (S12). At this time, each electronic component P is sucked by a predetermined suction nozzle 16 based on the identification number of the suction nozzle 16 stored in the component data.

  Further, the camera selection means 23 of the control unit 28 determines whether or not a large component exists in the electronic component P group based on the component size of the component data of the electronic component P group extracted in S11. (S13).

  The camera selection unit 23 of the control unit 28 performs imaging of the electronic component P group by the base camera 18 when a large component is present in the electronic component P group (Yes in S13). Is selected (S14), and when there is no large component (No in S13), it is selected that the electronic camera P is imaged by the head side camera 17 (S15).

  When the base-side camera 18 is selected (S14), the component conveyance control means 22 of the control unit 28 moves the head unit 15 above the base-side camera 18 (S16), and controls the base-side camera. When the head unit 15 passes above the base-side camera 18, the means 25 captures the bottom surface image of each electronic component P with the base-side camera 18 (S17). Thereafter, the component conveyance control means 22 of the control unit 28 moves the head unit 15 above the substrate B (S18), and when the head unit 15 reaches above the substrate B, the suction nozzle 16 is lowered to electronic component P. Is implemented (S19). The component posture determination means 27 determines the suction posture of each electronic component P based on the lower surface image of the electronic component P that is captured when the head unit 15 moves from above the base-side camera 18 to above the substrate B. Make a decision. Then, when the suction posture of the electronic component P is defective, processing (correction of the suction posture, disposal of the electronic component P, etc.) is performed accordingly.

  On the other hand, when the head side camera 17 is selected (S15), the component transport control means 22 moves the head unit 15 above the board B, and the head side camera control means 24 moves the head side camera 17 to the head side camera 17. The lower surface image of the electronic component P is sequentially picked up by sliding to the left (S20). When the head unit 15 reaches above the substrate B, the suction nozzle 16 is lowered to mount the electronic component P (S19). The determination of the suction posture of each electronic component P by the component posture determination means 27 is performed based on the lower surface image of the electronic component P that is captured while the head unit 15 moves above the substrate B.

  Next, the control unit 28 determines whether or not the mounting operation has been completed for all the electronic components P extracted in S10 (S21). If the mounting operation has not been completed for all the electronic components P (No in S21), the control unit 28 extracts the component data of the electronic component P group to be picked up next by the head unit 15 (S11), Continue work. When the mounting work is completed for all the electronic components P (Yes in S21), the mounting work routine ends.

According to the reference example 1 configured as described above, the following effects can be obtained.
When all of the electronic parts P group sucked by the head unit 15 are small parts, the suction posture of the electronic parts P group is imaged by the head side camera 17. The head-side camera 17 can pick up the lower surface image of the electronic component P when the head unit 15 moves above the substrate B, and the electronic unit can effectively use the moving time of the head unit 15. The efficiency of the mounting operation of the component P can be improved. When the electronic component P group includes a large component that cannot be captured by the head-side camera 17, the lower surface image of the electronic component P group is captured by the base-side camera 18. Therefore, according to the mounting machine 10, not only small components that can be imaged by the head side camera 17 but also large components that cannot be imaged by the head side camera 17 can be recognized. That is, according to the mounting machine 10 of the present reference example , not only small components but also large components can be reliably recognized, and the electronic component P can be mounted efficiently.

<Reference Example 2 >
Next, the mounting machine 10 according to Reference Example 2 of the present invention will be described.
The mounting machine 10 of the reference example 2 is different from the reference example 1 in that the camera is selected based on the component type of the electronic component P. In addition, the same code | symbol is attached | subjected to the structure similar to the reference example 1, and the overlapping description is abbreviate | omitted.

  In this reference example, the camera selection unit 23 selects a camera based on the component type in the component data of the electronic component P. Specifically, if all of the electronic parts P group transferred by the head unit 15 are chip parts, the head-side camera 17 is selected as a camera for imaging the electronic parts P group, and the electronic parts P group is included in the electronic parts P group. When the lead component is included, the base side camera 18 is selected as a camera for imaging the electronic component P group. As a result, the lead component that requires higher imaging accuracy than the chip component can be imaged by the base-side camera 18 that has a higher resolution than the head-side camera 17.

The mounting operation of the electronic component P on the board B performed by the mounting machine 10 of the reference example 2 is substantially the same as the reference example 1 except for the operation related to the selection of the camera.
The mounting work routine of this reference example is started when the operator selects the type of the board B to be produced on the mounting line, as in the reference example 1, and the control unit 28 sets the electronic component P associated with the type of the board B. Component data is extracted (S10), and component data of the electronic component P group picked up by the head unit 15 is extracted from the component data (S11). And the component conveyance control means 22 of the control part 28 adsorb | sucks the said electronic component P group to the adsorption nozzle 16 in order (S12).

In place of the determination in S13 in Reference Example 1, the camera selection unit 23 has a lead component in the electronic component P group based on the component type in the component data of the electronic component P group extracted in S11. It is determined whether or not to do.

  If there is a lead component in the electronic component P group (Yes in S13), the camera selection means 23 selects that the base-side camera 18 performs imaging for the electronic component P group ( S14) If there is no lead component (No in S13), it is selected that the electronic camera P group is imaged by the head side camera 17 (S15).

When a camera is selected by the camera selection unit 23, the lower surface image of the electronic component P is picked up by the selected camera, and the electronic component P is mounted on the board B, as in Reference Example 1, When the mounting work of the electronic component P is completed, the mounting work routine is finished.

According to the reference example 2 configured as described above, the following effects are obtained.
When all of the electronic parts P group sucked by the head unit 15 are chip parts, the suction posture of the electronic parts P group is imaged by the head-side camera 17. When the lead component is included in the electronic component P group, the suction posture of the electronic component P group is imaged by the base side camera 18. Therefore, according to the mounting machine 10 of the present reference example, even if the electronic component P is required to have high imaging accuracy such as a lead component, the component recognition can be reliably performed, and the mounting operation of the electronic component P can be performed. Can be performed efficiently.

<Reference Example 3 >
Next, a mounting machine 10 according to Reference Example 3 of the present invention will be described.
The mounting machine 10 of this reference example is different from the reference example 1 in that the camera is selected based on the component type of the electronic component P. In addition, the same code | symbol is attached | subjected to the structure similar to the reference example 1, and the overlapping description is abbreviate | omitted.

  In the present reference example, the camera selection unit 23 selects a camera based on the component type in the component data of the electronic component P. Specifically, if all of the electronic components P group transported by the head unit 15 are electronic components P with leads such as GFP, the head side camera 17 is used as a camera for imaging the electronic components P group. select. On the other hand, when the electronic component P group includes an electronic component P provided with bumps such as BGA, the base-side camera 18 is selected as a camera for imaging the electronic component P group. Thereby, imaging of electronic parts P, such as BGA, can be performed with the base side camera 18 which can image the side image of a lower surface.

The mounting operation of the electronic component P on the board B performed by the mounting machine 10 of the reference example 3 is substantially the same as the reference example 1 except for the operation related to the selection of the camera.
The mounting work routine of this reference example is started when the operator selects the type of the board B to be produced on the mounting line, as in the reference example 1, and the control unit 28 sets the electronic component P associated with the type of the board B. Component data is extracted (S10), and component data of the electronic component P group picked up by the head unit 15 is extracted from the component data (S11). And the component conveyance control means 22 of the control part 28 adsorb | sucks the said electronic component P group to the adsorption nozzle 16 in order (S12).

In place of the determination in S13 in Reference Example 1, the camera selection unit 23 determines that an electronic component such as a BGA is included in the electronic component P group based on the component type in the component data of the electronic component P group extracted in S11. It is determined whether or not the part P is included.

  When the electronic component P such as BGA is present in the electronic component P group (Yes in S13), the camera selection unit 23 performs imaging of the electronic component P group by the base side camera 18. Is selected (S14), and when the electronic component P such as BGA does not exist (No in S13), it is selected that the head-side camera 17 performs imaging for the electronic component P group (S15).

When a camera is selected by the camera selection unit 23, the lower surface image of the electronic component P is captured by the selected camera, as in Reference Example 1. At this time, for the electronic component P such as BGA in the electronic component P group, when the lower surface image is captured by the base side camera 18 in S17, the base side lighting control means 26 of the control unit 28 sets the base side lighting device. 19 is raised and turned on, and the base-side camera control means 25 takes a side image of the lower surface by the base-side camera 18. When the mounting work for all the electronic components P is completed, the mounting work routine ends.

According to the reference example 3 configured as described above, the following effects can be obtained.
When all of the electronic components P group attracted to the head unit 15 are not electronic components P such as BGA, the suction posture of the electronic component P group is imaged by the head side camera 17. When an electronic component P such as BGA is included in the electronic component P group, the suction posture of the electronic component P group is captured by the base-side camera 18, and at this time, a side image of the lower surface is captured. Is made. Therefore, according to the mounting machine 10 of the present reference example, when an electronic component P such as BGA is included in the electronic component P, a side image of the lower surface is captured and the presence or absence of the bumps or the like is missing. Can be reliably recognized, and the electronic component P can be mounted efficiently.

<Implementation-shaped state>
Next, the mounting apparatus 10 according to an exemplary shape condition of the present invention by FIGS.
The mounting machine 10 of the present embodiment is different from the above-described reference example in that the selection of the camera is made in consideration of various conditions. In addition, the same code | symbol is attached | subjected to the structure similar to the said reference example, and the overlapping description is abbreviate | omitted.

  In the present embodiment, the camera selection unit 23 displays the component size of the electronic component P, the component type of the electronic component P, the component type of the electronic component P, and the side image of the electronic component P by the head-side camera 17. The camera is selected in consideration of all conditions whether or not it is necessary. The camera selection unit 23 stores information such as the type of the selected camera (base camera or head camera) in the selected camera storage area of the component data storage device 21 in association with each electronic component P. In the present embodiment, among the small components, an extremely small component having a predetermined size or less is defined as an electronic component P that requires a side image by the head side camera 17.

Mounting operation on the substrate B of the electronic component P to be made by the mounting apparatus 10 of the embodiment forms condition is as follows.
When the worker selects the type of board B to be produced on the mounting line, the mounting work routine shown in FIG. 7 is started. Then, the control unit 28 extracts component data of the electronic component P associated with the type of the board B from the component data stored in the component data storage device 21 (S100).

  And the camera selection means 23 of the control part 28 considers various conditions about all the electronic components P extracted in S100, selects the camera suitable for imaging of each electronic component P, and selects the selected camera electronically. The information is stored in the selected camera storage area of the component data storage device 21 in association with the component P (S101). The processing in S101 (referred to as selected camera storage processing) is performed as follows (see FIG. 8).

  In the selected camera storage processing routine, first, the control unit 28 extracts part data of the electronic parts P group having the same transfer order from the part data extracted in S100 (S200).

  When the component data of the electronic component P group is extracted, the camera selection unit 23 of the control unit 28 selects the electronic component P group based on the component size in the component data of the electronic component P group extracted in S200. It is determined whether or not there is a large component in the inside (S201). If a large component is present in the electronic component P group (Yes in S201), the camera selecting unit 23 selects that the base-side camera 18 performs imaging for the electronic component P group. “Base camera” is stored in the selected camera storage area of the component data storage device 21 (S202). That is, when a large part is mixed in the electronic part P group, the base side camera 18 is selected without considering other conditions.

  On the other hand, when there is no large component in the electronic component P group (No in S201), the camera selection unit 23 determines the electronic component P based on the component type in the component data of the electronic component P group. It is determined whether or not there is a lead component in the group (S203). If there is a lead component in the electronic component P group (Yes in S203), the camera selection unit 23 determines the electronic component P based on the component size in the component data of the electronic component P group. It is determined whether or not there is a minimal component in the group (S204). If there is no minimal component (No in S204), imaging of the electronic component P group is performed by the base side camera 18. And “base camera” is stored in the selected camera storage area of the component data storage device 21 (S202). If there is a minimal component in the electronic component P group (Yes in S204), the camera selection unit 23 performs imaging of the electronic component P group with the base-side camera 18, and the minimal component. Is selected to take a side image by the head-side camera 17. In the selected camera storage area of the component data storage device 21, “non-minimum component” of the electronic component P group is stored as “base-side camera”, and the minimum component is “base-side camera / head-side camera”. "Side image" is stored (S205). That is, when all of the electronic parts P group are small parts, but the lead parts are present in the parts, the base side camera 18 is selected, and the smallest part is included therein. Is stored that the side image is captured by the head-side camera 17 only for the minimal component.

  If there is no lead component in the electronic component P group (No in S203), the camera selection unit 23 selects the electronic component P group based on the component type in the component data of the electronic component P group. It is determined whether or not there is an electronic component P such as BGA (S206). If a BGA or the like is present in the electronic component P group (Yes in S206), the camera selection unit 23 determines whether or not a minimal component is present in the electronic component P group (S207). Similarly to the above, when there is no minimal component (No in S207), “base-side camera / side image of bottom surface” is stored in the selected camera storage area of the component data storage device 21 related to the electronic component P group. (S208) If there is a minimal component (Yes in S207), the component that is not the minimal component is stored as “base-side camera / side image of bottom surface”, and the minimal component is identified as “base-side camera / "Side image of the lower surface / side image of the head-side camera"

  Even when the electronic component P such as BGA does not exist in the electronic component P group (No in S206), the camera selection unit 23 determines whether or not the minimal component exists in the electronic component P group. However, if there is no minimum component (No in S210), it is selected that the lower side image is captured by the head side camera 17 for the electronic component P group and the selected camera storage of the component data storage device 21 is selected. “Head-side camera” is stored in the area (S211). On the other hand, if there is a minimal component (Yes in S210), the electronic component P group is imaged by the head-side camera 17, and the minimal component is imaged by the head-side camera 17. select. Then, the electronic component P that is not the minimal component in the electronic component P group is stored as “head-side camera”, and the minimal component is stored as “the side image by the head-side camera / head-side camera” (S212). That is, when all of the electronic parts P group are small parts, there are no lead parts, and there is no electronic part P such as BGA, the head side camera 17 performs all of the electronic parts P group. It is stored that the lower surface image is captured, and when a minimal component is included therein, it is stored that the side image is captured by the head-side camera 17 only for the minimal component.

  Next, the control unit 28 determines whether or not the storage process of the selected camera is completed for all the electronic components P extracted in S100 (S213), and the storage process is not completed for all the electronic components P. (No in S213), the component data of the electronic component P group that is next picked up by the head unit 15 is extracted (S200), and the processing is continued. When the storage process of the selected camera is completed for all the electronic components P (Yes in S213), the selected camera storage process routine ends.

  When the selected camera storage processing routine ends (S101), as shown in FIG. 7, the control unit 28 extracts component data of the electronic component P group picked up by the head unit 15 from the component data extracted in S100. Extracting (S102), the component conveyance control means 22 sucks the electronic component P group to the suction nozzle 16 in order (S103).

  Then, the camera selecting unit 23 determines whether or not “base camera” is stored in the selected camera storage area for the electronic component P group extracted in S102 (S104). If this storage has been made (Yes in S104), it is determined whether or not “lower side image” has been stored (S105). If not (No in S105), the control is performed. The component conveyance control means 22 of the unit 28 moves the head unit 15 above the base-side camera 18, and the base-side camera control means 25 captures the lower surface image by the base-side camera 18 (S106). Further, when the “side image of the lower surface” is stored in the selected camera storage area of the electronic component P group (No in S <b> 105), the component conveyance control means 22 of the control unit 28 is based on the head unit 15. The base-side camera control means 25 picks up the lower surface image by the base-side camera 18 and the base-side illumination control means 26 stores the “lower side image”. The base-side lighting device is raised and turned on in accordance with the timing of passage of the electronic component P, and the base-side camera control means 25 captures a side image of the lower surface of the electronic component P (S107). .

  Next, the camera selection unit 23 determines whether or not the “side image by the head side camera” is stored in the selected camera storage area for the electronic component P group (S108). (Yes in S108), the component conveyance control means 22 of the control unit 28 moves the head unit 15 above the substrate B, and the head-side camera control means 24 sets the side surface of the electronic component P on which the storage is made. An image is picked up by the head side camera 17 (S109). On the other hand, when there is no storage of “side image by the head side camera” (No in S108), the component conveyance control means 22 of the control unit 28 moves the head unit 15 above the substrate B (S110). When the head unit 15 reaches above the substrate B, the suction nozzle 16 is lowered to mount the electronic component P (S111).

  If “base camera” is not stored in the selected camera storage area (No in S104), “side image of head camera” is stored in the selected camera storage area for the electronic component P group. Whether or not exists is determined (S112). If the memory exists (Yes in S112), the component conveyance control means 22 of the control unit 28 moves the head unit 15 above the substrate B, and the head side camera control means 24 The lower surface image of the electronic component P is captured by the camera 17, and the side image of the electronic component P in which the “side image of the head side camera” is stored is captured (S113). On the other hand, when the “side image of the head side camera” is not stored (No in S112), the component conveyance control means 22 of the control unit 28 moves the head unit 15 above the substrate B, and the head side camera. The control means 24 captures only the lower surface image of the electronic component P group by the head side camera 17 (S114). When the head unit 15 reaches above the substrate B, the component conveyance control means 22 of the control unit 28 lowers the suction nozzle 16 to mount the electronic component P (S111).

  Next, the control unit 28 determines whether or not the mounting work has been completed for all the electronic components P extracted in S100 (S115), and if the mounting work has not been completed for all the electronic components P ( Next, the component data of the electronic component P group picked up by the head unit 15 is extracted (S100), and the operation is continued. When the mounting work is completed for all the electronic components P (Yes in S115), the mounting work routine ends.

According to the thus constructed embodiment shaped condition as described above, the following advantages.
The size of the electronic component P, the imaging accuracy required by the electronic component P, whether the side image of the lower surface of the electronic component P is required, and whether the side image captured by the head-side camera 17 is required With the selected camera in consideration of all of the above, it is possible to capture the suction posture of the electronic component P. Therefore, the component recognition of the electronic component P can be performed reliably, and the mounting operation of the electronic component P can be performed efficiently.

<Other embodiments>
The technology disclosed in the present specification is not limited to the embodiments described with reference to the above description and drawings, and includes, for example, the following various aspects .

(1) In the above embodiment, the head-side camera 17 can capture a side image and a bottom image, but it may capture only one of the images.
(2) In the above embodiment, the head-side camera 17 is provided with one component camera that can capture both the side image and the bottom image, but the head-side camera captures each image. Two component cameras may be provided.

  (3) In the above embodiment, the head-side camera 17 is slidable with respect to the head unit 15. However, the present invention is not limited to this, and the head-side camera is fixed with respect to the head unit, and the suction nozzle is relatively moved. You may do.

(4) In the above-described type state, camera selection means 23, and selects the camera based on component type, a lead component, although captured by base side camera 18 is a high-resolution, limited to this First, for example, the camera may be selected based on the lead pitch of the electronic component P, and the electronic component P having a lead pitch narrower than a predetermined pitch may be imaged by the base-side camera 18. The camera may be selected based on the above, and the QFP may be imaged by the base side camera 18. Furthermore, the supply method (tape feeder 14, tray, etc.) of each electronic component P is stored in the component data storage device 21 as one of the component data, and the electronic component P whose supply method is the tray is stored on the base side camera. Images may be taken, and various camera selection criteria can be employed.

(5) In the embodiment form state, a predetermined size following minimum components among small parts, but the electronic component P requiring a side image of the head-side camera 17 is not limited to this, for example, a predetermined weight or more electrons The component may be an electronic component that requires a side image.

The top view showing the schematic structure of the mounting machine concerning this embodiment Side view Schematic diagram of head side camera Schematic of base side lighting device Block diagram showing the electrical configuration of the mounting machine The flowchart which shows the flow of the mounting work by the mounting machine in the reference example 1. Flowchart illustrating a flow of a mounting operation by the mounting machine according to an type state Flow chart showing the flow of selected camera storage processing

B ... Substrate P ... Electronic component 10 ... Mounting machine 11 ... Base 15 ... Head unit 16 ... Suction nozzle 17 ... Head side camera 18 ... Base side camera 19 ... Base side illumination device (illumination means)
23 ... Camera selection means

Claims (3)

A mounting machine for mounting electronic components on a board,
A head unit including a suction nozzle capable of sucking the electronic component and transferring the electronic component onto the substrate;
A head-side camera that is provided in the head unit and images the suction posture of the electronic component sucked by the suction nozzle when the head unit transfers the electronic component;
A base-side camera that images the suction posture of the electronic component installed on the base and sucked by the suction nozzle;
An illumination device provided on the base and illuminating the lower surface of the electronic component from the side;
Camera selection means for selecting, from the head-side camera and the base-side camera, a camera that performs imaging of the suction posture of the electronic component based on component data relating to the electronic component;
The head unit is provided with a plurality of the suction nozzles, and the base-side camera has a wider field of view than the head-side camera and can capture a side image of the lower surface of the electronic component.
The camera selection means includes
When there is a large component that cannot be imaged by the head-side camera among the electronic component group adsorbed by the plurality of adsorption nozzles, the base-side camera is used as a camera for imaging the electronic component group And the lower surface image of the electronic component group is captured by the base-side camera ,
In the electronic component group, when the large component does not exist, the lead component does not exist, and the electronic component with the bump provided on the lower surface exists, the camera as an image pickup device for the electronic component group A base-side camera is selected, and the bottom-side image of the electronic component group is picked up by the base-side camera, and the lighting device is raised and turned on. An image is taken,
A camera that images the electronic component group when the large component does not exist in the electronic component group, the lead component does not exist, and the electronic component in which the bump is provided on the lower surface does not exist. the select head side camera, mounter lower surface image of the electronic component group by the head-side camera, wherein Rukoto captured as. The head unit is provided with a plurality of the suction nozzles, and the base side camera has a higher resolution than the head side camera,
The mounting apparatus according to claim 1, wherein the camera selection unit selects a camera that captures an image of the electronic component group based on a component type of the electronic component. The head-side camera is capable of capturing a side image of the electronic component sucked by the suction nozzle,
The camera selection unit selects the head-side camera as a camera for capturing an image of the electronic component when the electronic component group includes a component that needs to capture the side image. The mounting machine according to claim 1 or 2 .

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