JP5598972B2 - Surface processing equipment - Google Patents

Description

  The present invention relates to a surface processing apparatus.

  Conventionally, as one method of processing the surface of an object to be processed (glass, crystal, silicon wafer, etc.), an etching solution delivered from a nozzle is locally supplied to the surface to be processed of the object to be processed. There is known so-called local wet etching in which an etching process is performed on the entire surface of a processing object by moving the processing object relatively (for example, Patent Document 1).

  As shown in FIG. 22, the surface processing apparatus described in Patent Document 1 is provided so as to surround the periphery of the delivery port 910 and the delivery port 910 that sends the etchant, and the etchant sent from the delivery port 910 The nozzle 900 has a suction port 920 for suction. The delivery port 910 has a longitudinal shape (substantially rectangular) extending in one direction. In the surface processing apparatus described in Patent Document 1, the nozzle 900 can be moved in a direction perpendicular to the extending direction of the suction port 920 along the surface to be processed of the object to be processed. In such a surface processing apparatus, a desired etching process is performed on an object to be processed by moving the nozzle 900 along the surface to be processed while sucking the suction port 920 while feeding an etching solution from the delivery port 910. I do.

  However, in the surface processing apparatus of Patent Document 1, as shown in FIG. 22, rather than the area of the region 921 of the suction port 920 that mainly sucks the etchant sent from the central portion 911 in the longitudinal direction of the delivery port 910, Areas 922 and 923 of the suction port 920 that mainly sucks the etching solution sent from both end portions 912 and 913 of the delivery port 910 are larger. For this reason, the flow rate of the etching solution sent out at the central portion 911 and the both end portions 912 and 913 of the delivery port 910 is different, or the center portion 911 and the both end portions 912 and 913 of the delivery port 910 are spaced from the surface to be processed. The amount of the etching solution intervening is different. As a result, the etching rate (etching amount per unit time) in the region where the etchant on the surface to be processed is supplied varies, and the target object cannot be etched (in other words, in other words, There is a problem that the etching accuracy is reduced).

JP 2007-200754 A

  An object of the present invention is to provide a surface processing apparatus capable of uniformizing an etching rate in a region to which an etching solution is supplied on a surface to be processed and performing desired etching on the object to be processed. .

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
The surface processing apparatus of this application example is a processing apparatus that processes the workpiece by supplying an etching solution to the workpiece,
A support base for supporting the object to be processed;
A delivery port that is provided so as to be movable with respect to the support table and that sends the etching solution to the object to be processed supported by the support table, and a suction that sucks the etchant sent from the delivery port. A nozzle having a mouth,
Each of the suction port and the delivery port has a longitudinal shape extending in a direction crossing the moving direction of the nozzle, and is arranged in the moving direction of the nozzle.
The suction port is arranged on the rear side in the moving direction of the nozzle of the delivery port ,
The nozzle has a guide groove for guiding the etching solution from the delivery port to the suction port .
Thereby, the surface processing apparatus which can equalize the etching rate in the area | region where the etching liquid of the to-be-processed surface is supplied, and can perform desired etching with respect to a to-be-processed object can be provided. In particular, by having the guide groove, the etching solution supplied to the surface to be processed can be smoothly guided to the suction port.
[Application Example 2]
In the surface processing apparatus of this application example, it is preferable that the guide groove extends in a moving direction of the nozzle.
Thereby, the etching liquid supplied to the surface to be processed can be more smoothly guided to the suction port.
[Application Example 3]
In the surface processing apparatus of this application example, the nozzle has a first opening and a second opening,
According to the moving direction of the nozzle, the first opening is used as the delivery port, the second opening is used as the suction port, and the first opening is used as the suction port. It is preferable that the state to be the delivery port can be switched.
As a result, when the nozzle moves to one opening side or to the other opening side, an arbitrary area of the surface to be processed is delayed from the etching solution outlet and the suction port is Since it passes, the etching solution sent from the delivery port and supplied to the surface to be processed can be smoothly sucked from the suction port. Therefore, the etching solution supplied to the surface to be processed can be sucked evenly from the suction port evenly and reliably.
[Application Example 4]
In the surface processing apparatus of this application example, it is preferable that the suction port and the delivery port have the same length in the longitudinal direction.
As a result, the etching solution is uniformly distributed in the region in the surface to be processed to which the etching solution is supplied, and the etching rate in the region becomes uniform.
[Application Example 5]
In the surface processing apparatus of this application example, it is preferable that the suction port and the delivery port have the same shape.
As a result, the balance between the amount of the etchant sent from the delivery port and the amount of the etchant sucked from the suction port becomes good, and the etchant can be uniformly dispersed on the surface to be processed.
[Application Example 6]
The surface processing apparatus of this application example is a processing apparatus that processes the workpiece by supplying an etching solution to the workpiece,
A support base for supporting the object to be processed;
A delivery port that is provided so as to be movable with respect to the support table and that sends the etching solution to the object to be processed supported by the support table, and a suction that sucks the etchant sent from the delivery port. A nozzle having a mouth,
Each of the suction port and the delivery port has a longitudinal shape extending in a direction crossing the moving direction of the nozzle, and is arranged in the moving direction of the nozzle.
The nozzle has a pair of suction ports arranged to face each other via the delivery port,
The etching solution is sucked from the suction port on the rear side in the movement direction of the nozzle of the pair of suction ports.
Thereby, the surface processing apparatus which can equalize the etching rate in the area | region where the etching liquid of the to-be-processed surface is supplied, and can perform desired etching with respect to a to-be-processed object can be provided. Further, in any case where the nozzle moves to one suction port side or moves to the other suction port side, an arbitrary region of the surface to be processed is delayed from the etching solution delivery port to the suction port. Therefore, the etching solution fed from the delivery port and supplied to the surface to be processed can be smoothly sucked from the suction port. Therefore, the etching solution supplied to the surface to be processed can be sucked evenly from the suction port evenly and reliably.
[Application Example 7]
In the surface processing apparatus of this application example, it is preferable that the pair of suction ports are provided symmetrically with respect to the delivery port and have the same shape and size.
Thereby, the suction amount per unit time of the etching solution can be made equal between the case where the etching solution is sucked from one suction port and the case where the etching solution is sucked from the other suction port. Therefore, in any case, the etching process can be performed on the surface to be processed under the same conditions (etching rate).
[Application Example 8]
The surface processing apparatus of this application example is a processing apparatus that processes the workpiece by supplying an etching solution to the workpiece,
A support base for supporting the object to be processed;
A delivery port that is provided so as to be movable with respect to the support table and that sends the etching solution to the object to be processed supported by the support table, and a suction that sucks the etchant sent from the delivery port. A nozzle having a mouth,
Each of the suction port and the delivery port has a longitudinal shape extending in a direction crossing the moving direction of the nozzle, and is arranged in the moving direction of the nozzle.
The nozzle has a pair of the delivery ports disposed to face each other through the suction port,
The etching solution is sent out from the delivery port on the side of the nozzle in the moving direction of the pair of delivery ports.
Thereby, the surface processing apparatus which can equalize the etching rate in the area | region where the etching liquid of the to-be-processed surface is supplied, and can perform desired etching with respect to a to-be-processed object can be provided. In addition, in any case where the nozzle moves to one delivery port side or moves to the other delivery port side, the suction port is delayed from the etching solution delivery port in any region of the surface to be processed. Therefore, the etching solution fed from the delivery port and supplied to the surface to be processed can be smoothly sucked from the suction port. Therefore, the etching solution supplied to the surface to be processed can be sucked evenly from the suction port evenly and reliably.
[Application Example 9]
In the surface processing apparatus according to this application example, it is preferable that the pair of delivery ports are provided symmetrically with respect to the suction port and have the same shape and size.
Thereby, the amount of etching solution per unit time can be made equal between the case where the etching solution is sent out from one sending port and the case where the etching solution is sent out from the other sending port. Therefore, in any case, the etching process can be performed on the surface to be processed under the same conditions (etching rate).

[Application Example 10 ]
In the surface processing apparatus of this application example , it is preferable that a moving speed control unit that controls the moving speed of the nozzle is provided.

[Application Example 11 ]
In the surface processing apparatus of this application example , it is preferable that the suction port and the delivery port each have a rectangular shape.
As a result, the etching solution is sent out from each part of the delivery port at a uniform flow rate, supplied to the surface to be processed, and then sucked from each part of the suction port at a uniform flow rate without deviation. As a result, the etching solution is uniformly distributed in a region in the surface to be processed to which the etching solution is supplied at a predetermined time, and the etching rate in the region becomes uniform.

[Application Example 12 ]
In the surface processing apparatus of this application example, the nozzle may suck the etching solution from the suction port so that the etching solution is uniformly distributed in a region in the surface to be processed to which the etching solution is supplied. preferable.

It is a figure which shows 1st Embodiment of the surface processing apparatus of this invention. It is a top view which shows the shape and moving direction of the nozzle which the surface processing apparatus shown in FIG. 1 has. It is a longitudinal cross-sectional view of the nozzle shown in FIG. It is a top view of the nozzle shown in FIG. It is a block diagram of the temperature control part which the surface processing apparatus shown in FIG. 1 has. It is a block diagram which shows the structure of the control part which the surface processing apparatus shown in FIG. 1 has. It is a perspective view which shows the nozzle with which the surface processing apparatus concerning 2nd Embodiment is provided. It is a top view of the nozzle shown in FIG. It is a block diagram of the surface processing apparatus concerning 3rd Embodiment. It is a top view of the nozzle which the surface processing apparatus shown in FIG. 9 has. It is a top view which shows the movement route | root of the nozzle shown in FIG. It is a figure explaining the switching means which the surface processing apparatus shown in FIG. 9 has. It is a block diagram of the surface processing apparatus concerning 4th Embodiment. It is a top view of the nozzle which the surface processing apparatus shown in FIG. 13 has. It is a top view which shows the movement route of the nozzle shown in FIG. It is a figure explaining the switching means which the surface processing apparatus shown in FIG. 13 has. It is a block diagram of the surface processing apparatus concerning 5th Embodiment. It is a perspective view of the nozzle which the surface processing apparatus shown in FIG. 17 has. It is a top view which shows the movement route of the nozzle shown in FIG. It is a figure explaining the switching means which the surface processing apparatus shown in FIG. 17 has. It is a top view which shows the modification of the nozzle which the surface processing apparatus shown in FIG. 1 has. It is a top view which shows the conventional nozzle.

Hereinafter, the surface processing apparatus of this invention is demonstrated in detail based on embodiment shown to an accompanying drawing.
<First Embodiment>
FIG. 1 is a view showing a first embodiment of the surface processing apparatus of the present invention, FIG. 2 is a plan view showing the shape and moving direction of the nozzle of the surface processing apparatus shown in FIG. 1, and FIG. 4 is a plan view of the nozzle shown in FIG. 2, FIG. 5 is a configuration diagram of a temperature control unit included in the surface processing apparatus shown in FIG. 1, and FIG. 6 is a surface processing shown in FIG. It is a block diagram which shows the structure of the control part which an apparatus has. In the following description, the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.

The surface processing apparatus 1 is an apparatus that performs a desired etching process on a workpiece (object to be processed) 10 by local wet etching.
The constituent material of the workpiece 10 subjected to the etching treatment is not particularly limited. For example, various glasses such as quartz glass and alkali-free glass, crystalline materials such as quartz, various ceramics such as alumina, silica, and titania, silicon, Consists of various semiconductor materials such as gallium arsenide, carbon materials such as diamond and graphite, dielectric materials such as various plastics (resin materials) such as polyethylene, polystyrene, polycarbonate, polyethylene terephthalate, liquid crystal polymer, phenol resin, acrylic resin, etc. And various other metal materials such as aluminum, copper, and iron-based metals.

Moreover, the shape of the workpiece | work 10 is not specifically limited, For example, plate shape, a block shape, etc. may be sufficient. Moreover, the planar view shape of the workpiece | work 10 is also not specifically limited, For example, a square, a rectangle, circular, etc. may be sufficient. Hereinafter, for convenience of explanation, the workpiece 10 will be described as a representative plate having a rectangular shape in plan view.
As shown in FIG. 1, the surface processing apparatus 1 includes a support device 2 that supports a workpiece 10, and an etching solution supply device 3 that supplies an etching solution to a surface 101 to be processed of the workpiece 10 supported by the support device 2. Have. Such a surface processing apparatus 1 supplies an etching solution to the surface to be processed 101 of the work 10 supported by the support device 2 by the etching liquid supply device 3, thereby to the workpiece 10 (the surface to be processed 101). It is configured to perform a desired etching process.

Hereinafter, the support device 2 and the etching solution supply device 3 will be sequentially described in detail.
[Supporting device]
As shown in FIG. 1, the support device 2 includes a chucking plate (support base) 21 and fixing means 22.
(Chucking plate)
The chucking plate 21 has a function of supporting the workpiece 10. The chucking plate 21 having such a function has a plate shape in this embodiment. However, the shape of the chucking plate 21 is not particularly limited as long as the workpiece 10 can be supported, and may not be a plate shape.

  The lower surface of the chucking plate 21 constitutes a chucking surface 211 that supports the workpiece 10. The chucking surface 211 is constituted by a flat surface, for example. Thereby, when the workpiece 10 is supported on the chucking surface 211, the workpiece 10 can be prevented from being deformed following the shape of the chucking surface 211. In addition, when the workpiece 10 is supported on the chucking surface 211, a gap is not easily formed between the chucking surface 211 and the workpiece 10, so that the workpiece 10 can be surely and easily secured by the fixing means 22 using air chucking. Can be fixed to the chucking surface 211.

(Fixing means)
The fixing means 22 has a function of fixing the workpiece 10 to the chucking surface 211. By fixing the workpiece 10 to the chucking surface 211, the posture and position of the workpiece 10 with respect to the chucking plate 21 can be kept constant during the etching process, so that a desired etching process can be performed on the workpiece 10. . In particular, in the surface processing apparatus 1 as in the present embodiment, since the workpiece 10 is supported so as to be suspended from the chucking plate 21, the fixing means 22 can prevent the workpiece 10 from falling from the chucking plate 21. it can.

  As shown in FIG. 1, the fixing means 22 includes a plurality of intake holes 221 formed in the chucking plate 21 and opened to the chucking surface 211, and suction pumps 222 connected to the intake holes 221. Yes. The opening of each intake hole 221 is closed by the work 10 in a state where the work 10 is supported by the chucking surface 211. Such a fixing means 22 sucks and fixes the workpiece 10 to the chucking surface 211 by operating the suction pump 222 while the workpiece 10 is supported on the chucking surface 211 and reducing the pressure in each intake hole 221. To do. According to the fixing means 22 having such a configuration, the workpiece 10 can be easily fixed to the chucking surface 211. Moreover, the workpiece | work 10 can be easily removed from the chucking surface 211 only by returning the inside of the air intake hole 221 to a normal pressure.

[Etching solution supply device]
The etching solution supply device 3 has a function of supplying the etching solution to the processing target surface 101 of the workpiece 10 fixed to the chucking plate 21. As shown in FIG. 1, the etching solution supply device 3 includes a nozzle 4 that is movably provided along a surface to be processed 101 of a workpiece 10, a control unit 6 that controls driving of the nozzle 4, and an etching solution. 4 and an etchant circulation device 7 for sending out and collecting.

(nozzle)
As shown in FIG. 1, the nozzle 4 is provided below the work 10 fixed to the chucking plate 21. Further, the nozzle 4 has two through holes 41 and 42 opened on the upper surface thereof (surface facing the surface to be processed 101). In such a nozzle 4, the etching solution is sent from the upper surface of the nozzle 4 through the through hole 41 and sucked through the through hole 42. That is, in the nozzle 4, the upper opening of the through hole 41 constitutes an etching solution outlet 4 a, and the upper opening of the through hole 42 constitutes an etching solution suction port 4 b.

  As shown in FIG. 2, the nozzle 4 of the present embodiment has a longitudinal shape extending in the lateral direction in FIG. In the surface processing apparatus 1, the nozzle 4 is moved one-dimensionally in the vertical direction in FIG. 2 (that is, the direction orthogonal to the extending direction of the nozzle 4) while sending and sucking the etching solution from the nozzle 4. An etching solution is supplied to the entire surface 101 to be processed, and a desired etching process is performed on the workpiece 10.

  Such nozzle 4 is fed from the outlet 4a and uniformly sucks the etching solution supplied to the surface to be processed 101 from the suction port 4b without unevenness, whereby the flow rate of the etching solution on the surface of the surface to be processed 101 ( As shown in FIG. 3, the etching rate of the region S1 (S1a to S1e) in the surface 101 to which the etching solution is supplied at a predetermined time is made uniform. It is configured as follows. As a result, a desired etching process can be performed on the surface 101 to be processed with high accuracy.

  Here, various methods can be cited as a method for equalizing the etching rate in the region S1, and the etching solution supplied to the surface to be processed 101 by using the nozzle 4 so that the etching solution is uniformly distributed in the region S1. Is preferably configured to be sucked from the suction port 4b. In general, the etching rate of the etchant with respect to the surface to be processed 101 varies depending on the amount of etchant supplied to the surface to be processed 101 (the supply amount per unit time). Therefore, according to the method as described above, the etching rate in the region S1 can be made uniform easily and reliably.

Hereinafter, the configuration of the nozzle 4 capable of realizing such a method will be described in detail.
As shown in FIG. 4, the delivery port 4 a and the suction port 4 b are formed side by side in the moving direction of the nozzle 4. Moreover, the delivery port 4a is located in the moving direction front side of the nozzle 4 with respect to the suction port 4b. With this arrangement, the suction port 4b passes through an arbitrary region of the processing surface 101 behind the delivery port 4a, so that the etching solution sent from the delivery port 4a and supplied to the processing surface 101 is sucked. Suction can be smoothly performed from the mouth 4b. Therefore, the etching solution supplied to the surface to be processed 101 can be sucked evenly from the suction port 4b more evenly.

  As shown in FIG. 4, the delivery port 4 a and the suction port 4 b have a rectangular shape with the direction perpendicular to the moving direction of the nozzle 4 as the longitudinal direction. In particular, in this embodiment, the delivery port 4a and the suction port 4b have the same length in the longitudinal direction (long side), and the end portions located on the same side are parallel to the moving direction of the nozzle 4 Located on the top. By forming the delivery port 4a and the suction port 4b in such a shape, the following effects can be exhibited.

  For example, for convenience of explanation, as shown in FIG. 4, the delivery port 4a and the suction port 4b are divided into three equal parts in the longitudinal direction and divided into three regions Sa, Sb, and Sc at both ends and the center. In this case, the etching solution sent out from the region Sa of the delivery port 4a is sucked from the region Sa of the suction port 4b located at the rear in the movement direction of the nozzle 4 after being supplied to the processing target surface 101. The etching solution delivered from the region Sb of the delivery port 4a is sucked from the region Sb of the suction port 4b after being supplied to the treated surface 101, and the etching solution delivered from the region Sc of the delivery port 4a is treated with the treated surface. After being supplied to 101, it is sucked from the region Sc of the suction port 4b.

  Since the delivery port 4a and the suction port 4b have a rectangular shape and the width (the length in the moving direction of the nozzle 4) is constant throughout the longitudinal direction, the amount of the etching solution delivered from the delivery port 4a is In the longitudinal direction of the delivery port 4a (three regions Sa to Sc), the amounts of the etching solution sucked from the suction port 4b are similarly equal to each other in the longitudinal direction of the suction port 4b (three regions). Sa to Sc). Therefore, the etching solution is sent out from each part (three regions Sa to Sc) of the delivery port 4a at an equal flow rate and supplied to the processing surface 101, and then each part (regions Sa to Sc) of the suction port 4b. ) From the same flow rate without any deviation. As a result, the etching solution is uniformly distributed in the region S1 in the processing target surface 101 to which the etching solution is supplied at a predetermined time, and the etching rate in the region S1 becomes uniform.

  Here, the width of the delivery port 4a and the suction port 4b (length in the moving direction of the nozzle 4) is not particularly limited, but when the width of the delivery port 4a is Wa and the width of the suction port 4b is Wb, Wb Is preferably 0.5 Wa or more and 1.5 Wa or less, and more preferably Wb is equal to Wa. As a result, the balance between the amount of etching solution sent out from the delivery port 4a and the amount of etching solution sucked out from the suction port 4b becomes good, and the etching solution can be uniformly dispersed in the region S1 and supplied. On the other hand, when Wb is smaller than 0.5 Wa, it is supplied to the surface 101 to be processed, although it varies depending on the difference between the amount of etching liquid sent from the outlet 4a and the amount of etching liquid sucked from the suction port 4b. There is a possibility that the suction of the etched etching solution does not catch up and an excessive amount of the etching solution is supplied to the surface 101 to be processed, and the supply amount of the etching solution varies within the region S1. On the contrary, when Wb is larger than 1.5 Wa, the amount of the etching solution supplied to the surface 101 to be processed is excessively reduced, and as a result, bubbles are generated and the etching solution is supplied in the region S1. Variations in quantity can occur.

(Etch solution circulation device)
As shown in FIG. 1, the etching solution circulation device 7 includes a delivery pipe 71 that sends the etching solution from the delivery port 4 a of the nozzle 4, a recovery pipe 72 that collects the etching solution from the suction port 4 b of the nozzle 4, and an etching solution. A storage tank 73 for storing the liquid, a liquid feed pump 74 for sending the etching liquid from the storage tank 73 to the delivery pipe 71, a flow rate adjusting valve 75 and a flow meter 76 for regulating the flow rate of the etching liquid sent to the delivery pipe 71, A suction pump 77 for sucking and collecting the etching liquid (etching liquid used for the etching process) adhering to the surface 101 to be processed of the workpiece 10 and a temperature for adjusting the temperature of the etching liquid sent from the nozzle 4 And a control unit 78.

  Each of these devices is connected in the order of a storage tank 73, a liquid feed pump 74, a flow rate adjustment valve 75, a flow meter 76, a delivery pipe 71, and a recovery pipe 72, and the recovery pipe 72 and the storage tank 73 are connected to circulate. A path 79 is formed. The suction pump 77 sucks the etching solution from the suction port 4b by reducing the pressure in the storage tank 73. In addition, it is preferable to use what has flexibility so that the movement of the nozzle 4 can be followed for the delivery pipe | tube 71 and the collection | recovery pipe | tube 72. FIG. Further, all the parts that come into contact with the etching solution are made of a material that is not corroded by the etching solution.

The etchant circulating through the circulation path 79 may be selected according to the constituent material of the workpiece 10. For example, a glass material workpiece 10, quartz, quartz or the like, when those containing SiO ₂ as material, the etching solution is desirable to use a mixed solution of hydrofluoric acid or hydrofluoric acid and ammonium fluoride. Further, when the workpiece 10 includes Si as a material such as a Si semiconductor wafer, the etching solution includes a mixed solution of hydrofluoric acid and nitric acid, a mixed solution of hydrofluoric acid, nitric acid and acetic acid, or potassium hydroxide. It is desirable to use

Moreover, you may contain an abrasive | polishing agent in such an etching liquid in order to raise an etching rate and to remove the roughness component with a short spatial wavelength. Examples of the abrasive include alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), silicon carbide (SiC), carbon boride (B ₄ C), diamond, dichromium trioxide (Cr ₂ O ₃ ), cerium dioxide. Fine particles composed of (CeO ₂ ), titanium dioxide (TiO ₂ ), silicon dioxide (SiO ₂ ), magnesium oxide (MgO), boron nitride (BN), or a mixture of two or more of these fine particles can be used. . Further, platinum (Pt) fine particles can be suitably used as an abrasive in that they are not eroded by the etching solution.

  The temperature control unit 78 has a function of maintaining the etching solution in the storage tank 73 at a predetermined temperature. Thereby, the etching liquid sent out from the delivery port 4a can be maintained at a predetermined temperature. Here, the etching rate (etching depth per unit time) for the workpiece 10 varies depending on the temperature of the etching solution, and generally the etching rate increases as the temperature of the etching solution increases. Therefore, by providing the temperature controller 78 and maintaining the temperature of the etching solution delivered from the delivery port 4a at a desired temperature, the entire surface 101 of the workpiece 10 is etched at a desired etching rate. The workpiece 10 can be etched with higher accuracy.

  The configuration of such a temperature control unit 78 is not particularly limited, but for example, a configuration as shown in FIG. 5 can be used. In the configuration shown in FIG. 5, the temperature control unit 78 is provided in the storage tank 73, is provided in the storage tank 73, and is provided in the storage tank 73 and a temperature detection element 781 that detects the temperature of the etching solution in the storage tank 73. The heater 782 for heating the etching solution therein and a drive control unit 783 for controlling the driving (ON / OFF, output value) of the heater 782 based on the detection result of the temperature detection element 781. According to such a configuration, the configuration of the temperature control unit 78 can be simplified, and the etching solution in the storage tank 73 can be more reliably set to a predetermined temperature. The temperature controller 78 may further include a cooling unit that cools the etching solution in the storage tank 73. By combining the heater 782 and the cooling means, the etching solution in the storage tank 73 can be more accurately maintained at a predetermined temperature.

The temperature detection element 781 is not particularly limited as long as the temperature of the etching solution in the storage tank 73 can be detected. For example, a contact-type temperature sensor such as a platinum resistance thermometer or a thermistor, a radiation thermometer ( A non-contact temperature sensor such as a thermopile can be used.
The heater 782 is not particularly limited as long as the etching solution in the storage tank 73 can be heated. For example, a linear heating element such as a nichrome wire may be used, or a planar heating element such as a silicon rubber heater may be used. The body may be used. Further, the arrangement of the heater 782 is not particularly limited as long as the etching liquid in the storage tank 73 can be heated, and may be installed in the vicinity of the outer periphery of the storage tank 73.

  Note that the temperature control unit 78 of the present embodiment is configured to set the etching solution in the storage tank 73 to a predetermined temperature, but if the temperature of the etching solution sent from the delivery port 4a can be maintained at the predetermined temperature, It is not limited to this. For example, the temperature control unit 78 may be provided in the middle of the delivery pipe 71 to control the temperature of the etching solution flowing in the delivery pipe 71, or may be provided in the middle of the recovery pipe 72 to flow in the recovery pipe 72. The temperature of the etching solution may be controlled.

(Control part)
As shown in FIG. 6, the control unit 6 stores a nozzle moving device 61 that moves the nozzle 4 in a plane (on the surface to be processed 101), and a profile of the surface of the workpiece 10 before and after processing. The storage unit 62, the two profiles and the etching amount per unit time (etching depth) of the etching solution, the calculation unit 63 that calculates the movement speed of the nozzle 4, and the movement speed of the nozzle 4 based on the calculation result. And a movement control unit 64 for controlling the nozzle moving device 61 so as to keep the separation distance between the nozzle 4 and the workpiece 10 constant.
The surface processing apparatus 1 has been described above.

Next, the operation of the surface processing apparatus 1 will be described.
[Test process]
First, before using the surface processing apparatus 1, as a preliminary experiment, using a sample (test piece) made of the same material as the workpiece 10, an etching solution having a predetermined constant flow rate is supplied from the nozzle 4 (feed port 4 a). In this case, the etching depth per unit time (etched depth) is calculated. The etching depth is measured while moving the nozzle 4 at a constant speed. Then, by performing this measurement at a plurality of speeds, the relationship between the moving speed of the nozzle 4 and the etching depth can be obtained. If the processing depth to be etched at each point on the processing target surface 101 of the workpiece 10 is determined, the moving speed of the nozzle 4 can be determined from the relationship between the moving speed of the nozzle 4 and the processing depth obtained here.

[Process for measuring shape of workpiece 10 before etching]
Next, the profile before processing of the processing target surface 101 of the workpiece 10 is measured. This measurement can be performed using an existing surface shape measuring device or surface roughness measuring device. The obtained measurement result is stored in the storage unit 62 of the control unit 6. Next, the calculation unit 63 determines the workpiece 10 to be processed based on the difference between the profile of the workpiece surface 101 of the workpiece 10 before machining and the target workpiece 10 after machining, which is stored in the storage unit 62. An etching depth to be processed at each position on the processing surface 101 is calculated. The calculation unit 63 further calculates the moving speed of the nozzle 4 at each position on the processing target surface 101 from the relationship between the moving speed of the nozzle 4 and the etching depth.

[Etching process]
The temperature control unit 78 is driven to heat the etching solution to a predetermined temperature, and the liquid supply pump 74 is operated to adjust the flow rate adjusting valve 75, whereby the etching solution is supplied from the storage tank 73 through the nozzle 4 at a predetermined constant flow rate. Is sent out. Next, the nozzle 4 is moved by the nozzle moving device 61 controlled by the movement control unit 64 so as to pass through the entire surface 101 of the workpiece 10 at the speed determined as described above. At the same time, the suction pump 77 is operated to suck the etching solution from the surface 101 of the workpiece 10 into the storage tank 73. Thereby, at each point of the processing target surface 101 of the workpiece 10, the above-described calculated depth to be processed is etched, and a desired profile is obtained.

Second Embodiment
Next, a second embodiment of the surface processing apparatus of the present invention will be described.
FIG. 7 is a perspective view showing a nozzle provided in the surface processing apparatus according to the second embodiment, and FIG. 8 is a plan view of the nozzle shown in FIG.
Hereinafter, the surface processing apparatus according to the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

The surface processing apparatus according to the second embodiment of the present invention is the same as the first embodiment described above except that the configuration of the nozzle is different. 7 and 8, the same reference numerals are given to the same configurations as those in the first embodiment described above.
As shown in FIG. 7, the nozzle 4 </ b> A of the present embodiment has a plurality of guide grooves 45 </ b> A that open to the upper surface (the surface facing the processing surface 101). Each of the plurality of guide grooves 45A is formed so as to communicate the delivery port 4a and the suction port 4b. Each of the plurality of guide grooves 45A extends in the moving direction of the nozzle 4A.
Such a guide groove 45A is a guide groove that guides (guides) the etching solution fed from the delivery port 4a and supplied to the processing surface 101 to the suction port 4b. By forming such a guide groove 45A, the etching solution supplied to the processing target surface 101 can be smoothly guided to the suction port 4b.

  Specifically, for example, as shown in FIG. 8, the etching solution fed from the region Sb of the delivery port 4a and supplied to the processing target surface 101 is more reliably applied to the suction port 4b by the action of the guide groove 45A. It can be guided to the region Sb and sucked from the region Sb of the suction port 4b. Similarly, the etching solution sent from the regions Sa and Sc of the delivery port 4a and supplied to the processing surface 101 can be more reliably sucked from the regions Sa and Sc of the suction port 4b. That is, by forming the guide groove 45A, the etching solution sent from the region Sb of the delivery port 4a is sucked from the region Sa or the region Sc of the suction port 4b or etched from the region sa of the delivery port 4a. The liquid can be effectively prevented from being sucked in the region Sb or the region Sc of the suction port 4b, and the etching solution supplied to the processing surface 101 can be more reliably transferred to each part ( It is possible to suck from the regions Sa to Sc) at an equal flow rate without deviation.

In particular, in the present embodiment, since each guide groove 45A is formed to extend in the moving direction of the nozzle 4A, the above effect becomes more remarkable.
In addition, the cross-sectional shape of each guide groove 45A is not specifically limited, For example, a semicircle, a square, and a triangle may be sufficient. Further, the depth (maximum depth) of each guide groove 45A is not particularly limited, and can be, for example, about 0.01 mm or more and 1 mm or less. Further, the pitch of each guide groove 45A is not particularly limited, and may be, for example, 0.01 mm or more and 1 mm or less.
According to the second embodiment as described above, the same effect as that of the first embodiment can be exhibited.

<Third Embodiment>
Next, a third embodiment of the surface processing apparatus of the present invention will be described.
9 is a configuration diagram of a surface processing apparatus according to the third embodiment, FIG. 10 is a plan view of a nozzle included in the surface processing apparatus shown in FIG. 9, and FIG. 11 is a plane showing a movement route of the nozzle shown in FIG. FIG. 12 and FIG. 12 are diagrams for explaining the switching means of the surface processing apparatus shown in FIG. In the following description, the upper side in FIG. 9 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the surface processing apparatus of the third embodiment will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.
The surface processing apparatus according to the third embodiment is the same as that of the first embodiment described above except that the configuration of the nozzles is different and a switching unit that switches the circulation path is provided. In FIG. 9, FIG. 10, FIG. 11, and FIG. 12, the same reference numerals are given to the same configurations as those of the first embodiment described above.

  As shown in FIG. 9, the nozzle 4B included in the surface processing apparatus 1B of the present embodiment is formed with two through holes 461 and 462 that open to the upper surface (the surface facing the surface to be processed 101). The nozzle 4B is configured to send the etching solution from one of the through holes 461 and 462 and to suck the etching solution from the other. Which of the through holes 461 and 462 is used to send the etchant and from which the etchant is sucked is selected according to the moving direction of the nozzle 4.

  As shown in FIG. 10, the through holes 461 and 462 are formed side by side in the moving direction of the nozzle 4. The openings 461a and 462a of the through holes 461 and 462 have rectangular shapes extending in a direction perpendicular to the moving direction of the nozzle 4, respectively. In the present embodiment, the openings 461a and 462a have the same shape and size. As described above, by making the openings 461a and 462a have the same shape and size, the etching solution is sent out from the opening 461a and sucked from the opening 462a, and the etching solution is sent out from the opening 462a and sucked from the opening 461a. The balance between the feeding and suction of the etching solution can be made equal. Therefore, in any of the above cases, the surface 101 can be etched under the same conditions (etching rate).

  Further, in the nozzle 4B of the present embodiment, the lengths of the openings 461a and 462a in the longitudinal direction are shorter than the width of the processing target surface 101 in the same direction. Therefore, for example, as shown in FIG. 11, the nozzle 4B is moved in the vertical direction in FIG. 11 while reciprocating in the horizontal direction in FIG. The “moving direction of the nozzle 4B” refers to the moving direction of the nozzle 4B on the processing target surface 101, and refers to the horizontal direction in FIG.

  In such a nozzle 4B, when the nozzle 4B moves from the left to the right of the movement route R shown in FIG. 11 (in the state indicated by R1 in FIG. 11), the opening located on the front side in the movement direction of the nozzle 4B. The etching solution is sent from 461a (that is, the opening 461a is used as a sending port), and the etching solution is sucked from the opening 462a that is located on the rear side in the movement direction (that is, the opening 462a is used as a suction port). On the other hand, when moving from right to left (in the state indicated by R2 in FIG. 11), the etching solution is sent from the opening 462a located on the front side in the movement direction of the nozzle 4B, and located on the rear side in the movement direction. The etching solution is sucked from the opening 461a.

  As a result, the suction port passes through any area of the surface 101 to be processed with a delay from the etchant delivery port regardless of the movement direction from right to left or left to right in FIG. It is possible to smoothly suck the etching solution delivered from the surface and supplied to the processing surface 101 from the suction port. Therefore, the etching solution supplied to the surface to be processed 101 can be sucked evenly from the suction port 4b more evenly.

Switching means 8 for switching between a state in which the etching solution is sent from the opening 461a and the etching solution is sucked from the opening 462a and a state in which the etching solution is sent from the opening 462a and the etching solution is sucked from 461a located on the rear side in the moving direction. Although there is no particular limitation, for example, the following configuration can be adopted.
As shown in FIG. 12, the switching means 8 includes a first connecting pipe 81 that connects the delivery pipe 71 connected to the through hole 461 and the recovery pipe 72 connected to the through hole 462, and the first of the delivery pipe 71. A second connecting pipe 82 that connects the through hole 461 side with respect to the connecting part R1 with the first connecting pipe 81 and the storage tank 73 side with respect to the connecting part R3 with the first connecting pipe 81 of the recovery pipe 72; A connecting portion R1 between the valve 831 provided in the middle of the first connecting pipe 81, the valve 832 provided in the middle of the second connecting pipe 82, and the first connecting pipe 81 of the delivery pipe 71 and the second Between the connecting portion R2 of the recovery pipe 72 and the connecting portion R4 of the recovery pipe 72 and the connecting portion R4 of the second connecting pipe 82. Valve 834 and valves for controlling opening and closing of these four valves 831 to 834 And a control unit (not shown).

In such a switching means 8, the valves 831 and 832 are closed (the state in which the etching solution cannot pass) and the valves 833 and 834 are in the open state (the state in which the etching solution can pass) by the valve control unit. The etching solution can be sent out from the opening 461a and the etching solution can be sucked from the opening 462a. On the other hand, when the valves 831 and 832 are opened and the valves 833 and 834 are closed, the etching solution can be sent out from the opening 462a and the etching solution can be sucked out from the opening 461a.
According to the third embodiment as described above, the same effect as that of the second embodiment can be exhibited.

<Fourth embodiment>
Next, a fourth embodiment of the surface processing apparatus of the present invention will be described.
13 is a configuration diagram of a surface processing apparatus according to the fourth embodiment, FIG. 14 is a plan view of a nozzle included in the surface processing apparatus shown in FIG. 13, and FIG. 15 is a plane showing a movement route of the nozzle shown in FIG. FIGS. 16A and 16B are diagrams for explaining the switching means of the surface processing apparatus shown in FIG. In the following description, the upper side in FIG. 13 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the surface processing apparatus according to the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.
The surface processing apparatus according to the fourth embodiment is the same as that of the first embodiment described above except that the configuration of the nozzles is different and a switching unit that switches the circulation path is provided. In FIG. 13, FIG. 14, FIG. 15, and FIG. 16, the same reference numerals are given to the same configurations as those of the first embodiment described above.

  As shown in FIG. 13, three through holes 471, 472, and 473 are formed in the nozzle 4 </ b> C included in the surface processing apparatus 1 </ b> C of the present embodiment. In such a nozzle 4 </ b> C, the etching solution is sent from the upper surface of the nozzle 4 </ b> C through the through-hole 472 and sucked through the through-hole 471 or the through-hole 473. That is, in the nozzle 4C, the upper opening of the through hole 472 constitutes the etching solution delivery port 4a, and the upper openings of the through holes 471 and 773 constitute the etching solution suction ports 4b 'and 4b ".

  As shown in FIG. 14, each of the delivery port 4a and the suction ports 4b ′ and 4b ″ has a rectangular shape extending in a direction orthogonal to the moving direction of the nozzle 4C, and the length in the longitudinal direction thereof is mutually In addition, the delivery port 4a and the suction ports 4b ′, 4b ″ are formed so as to be aligned in the moving direction of the nozzle 4C and between the two suction ports 4b ′, 4b ″. Yes.

In particular, in the present embodiment, the two suction ports 4b ′ and 4b ″ are formed symmetrically with respect to the delivery port 4a. In the present embodiment, the two suction ports 4b ′ and 4b ″ have the same shape as each other. , Have a size.
In the nozzle 4C, the lengths in the longitudinal direction of the delivery port 4a and the suction ports 4b ′, 4b ″ are shorter than the width of the surface 101 to be processed in the same direction. Therefore, for example, as shown in FIG. 15, the etching liquid is supplied to the entire surface 101 to be processed by reciprocating in the horizontal direction in Fig. 15. The "moving direction of the nozzle 4C" refers to the surface to be processed. The moving direction of the nozzle 4C on 101 is referred to as the horizontal direction in FIG.

  In such a nozzle 4C, when the nozzle 4C moves from the left to the right of the movement route R shown in FIG. 15 (in the state indicated by R1 in FIG. 15), the etching solution is sent out from the delivery port 4a. Of the two suction ports 4b ′ and 4b ″, the etching solution is sucked from the suction port 4b ′ located on the rear side in the movement direction of the nozzle 4C. On the contrary, it moves from right to left (indicated by R2 in FIG. 15). In the state), the etching solution is sent out from the delivery port 4a, and the etching solution is sucked from the suction port 4b ″ located on the rear side in the moving direction of the nozzle 4C of the two suction ports 4b ′ and 4b ″.

  As a result, regardless of the movement direction from right to left and left to right in FIG. 15, an arbitrary region of the surface to be processed 101 is delayed behind the etching solution delivery port 4 a (suction port 4 b ′, 4b ″ passes through the suction port on the side that actually sucks), so that the etching solution fed from the delivery port 4a and supplied to the surface to be processed 101 can be smoothly sucked from the suction port. The etching solution supplied to the processing target surface 101 can be reliably sucked uniformly from the suction port without deviation.

  In particular, in the present embodiment, as described above, the two suction ports 4b ′ and 4b ″ are formed symmetrically with respect to the delivery port 4a and have the same shape and size as each other. The suction amount per unit time of the etchant can be made equal between the case where the etchant is sucked from the suction port 4b ′ and the case where the etchant is sucked from the suction port 4b ″. Therefore, in any of the above cases, the surface 101 can be etched under the same conditions (etching rate).

Switching means 8C for switching between a state in which the etching solution is sent from the delivery port 4a and the etching solution is sucked from the suction port 4b 'and a state in which the etching solution is sent from the delivery port 4a and the etching solution is sucked from the suction port 4b " Although there is no particular limitation, for example, the following configuration can be adopted.
As shown in FIG. 16, the recovery pipe 72 is bifurcated in the middle, one of which is connected to the suction port 4b ′ and the other is connected to the suction port 4b ″. The valve 841C provided on the suction port 4b ′ side with respect to the branch portion of the recovery pipe 72, the valve 842C provided on the suction port 4b ″ side with respect to the branch portion of the recovery pipe 72, and opening and closing of these valves 841C and 842C. And a valve controller (not shown) for controlling.

In such a switching means 8C, the valve controller 842C closes the valve 842C (a state in which the etching solution cannot pass) and opens the valve 841C (a state in which the etching solution can pass), thereby causing the suction port 4b. It can be in a state where the etching solution is sucked from. Conversely, by opening the valve 842C and closing the valve 841C, the etching liquid can be sucked from the suction port 4b ″.
According to the fourth embodiment as described above, the same effect as that of the first embodiment can be exhibited.

<Fifth Embodiment>
Next, a fifth embodiment of the surface processing apparatus of the present invention will be described.
17 is a configuration diagram of a surface processing apparatus according to a fifth embodiment, FIG. 18 is a perspective view of a nozzle included in the surface processing apparatus shown in FIG. 17, and FIG. 19 is a plane showing a movement route of the nozzle shown in FIG. FIG. 20 and FIG. 20 are diagrams for explaining the switching means of the surface processing apparatus shown in FIG. In the following description, the upper side in FIG. 17 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the surface processing apparatus according to the fifth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.
The surface processing apparatus according to the fifth embodiment is the same as the first embodiment described above except that the configuration of the nozzles is different and a switching unit that switches the circulation path is provided. In FIGS. 17, 18, 19, and 20, the same reference numerals are given to the same configurations as those of the first embodiment described above.

  As shown in FIG. 17, three through holes 481, 482, and 483 are formed in the nozzle 4 </ b> D included in the surface processing apparatus 1 </ b> D of the present embodiment. In such a nozzle 4 </ b> D, the etching solution is sent from the upper surface of the nozzle 4 </ b> D through the through-hole 481 or the through-hole 483 and sucked through the through-hole 482. That is, in the nozzle 4D, the upper openings of the through holes 481 and 483 constitute the etching solution outlets 4a 'and 4a ", and the upper openings of the through holes 472 constitute the etching solution suction port 4b.

  As shown in FIG. 18, the delivery ports 4a ′, 4a ″ and the suction port 4b each have a rectangular shape extending in a direction orthogonal to the moving direction of the nozzle 4D, and the lengths in the longitudinal direction thereof are mutually Further, the outlets 4a ′, 4a ″ and the suction port 4b are formed so that the suction ports 4b are arranged in the moving direction of the nozzle 4D and between the two outlets 4a ′, 4a ″. Yes.

In particular, in this embodiment, the two outlets 4a ′ and 4a ″ are formed symmetrically with respect to the suction port 4b. In the present embodiment, the two outlets 4a ′ and 4a ″ have the same shape as each other. , Have a size.
In the nozzle 4D, the lengths of the delivery ports 4a ′, 4a ″ and the suction port 4b in the longitudinal direction are shorter than the width of the surface to be processed 101 in the same direction. Therefore, for example, as shown in FIG. 19, the etchant is supplied to the entire surface 101 to be processed by reciprocally moving in the horizontal direction in Fig. 19. The "moving direction of the nozzle 4D" refers to the surface to be processed. The moving direction of the nozzle 4D on 101 is referred to as the horizontal direction in FIG.

  In such a nozzle 4D, when the nozzle 4D moves from the left to the right of the movement route R shown in FIG. 19 (in the state indicated by R1 in FIG. 19), the two outlets 4a ′ and 4a ″ The etching solution is sent out from the delivery port 4a ″ located on the front side in the movement direction of the nozzle 4D, and the etching solution is drawn from the suction port 4b. On the other hand, when moving from right to left (in the state indicated by R2 in FIG. 19), the delivery port 4a ′ positioned on the front side in the movement direction of the nozzle 4D out of the two delivery ports 4a ′ and 4a ″. The etching solution is sent from the suction port, and the etching solution is sucked from the suction port 4b.

  As a result, regardless of the movement direction from right to left and left to right in FIG. Since the suction port 4b passes behind the delivery port (sending port on the delivery side), the etching solution fed from the delivery port and supplied to the surface 101 can be smoothly sucked from the suction port 4b. The etching solution supplied to the processing target surface 101 can be reliably sucked uniformly from the suction port without deviation.

  In particular, in the present embodiment, as described above, the two outlets 4a ′ and 4a ″ are formed symmetrically with respect to the suction port 4b and have the same shape and size as each other. The amount of the etching solution per unit time can be made equal between when the etching solution is sent out from the delivery port 4a ′ and when it is sent out from the delivery port 4a ″. Therefore, in any of the above cases, the surface 101 can be etched under the same conditions (etching rate).

Switching means 8D for switching between a state in which the etching solution is sent from the delivery port 4a ′ and the etching solution is sucked from the suction port 4b and a state in which the etching solution is sent from the delivery port 4a ″ and the etching solution is sucked from the suction port 4b Although there is no particular limitation, for example, the following configuration can be adopted.
As shown in FIG. 20, the delivery pipe 71 is bifurcated in the middle, one of which is connected to the delivery port 4a ′ and the other is connected to the delivery port 4a ″. A valve 851D provided on the delivery port 4a ′ side from the branch portion of the delivery pipe 71, a valve 852D provided on the delivery port 4a ″ side from the branch portion of the delivery pipe 71, and opening and closing of these valves 851D and 852D. And a valve controller (not shown) for controlling.

In such switching means 8D, the valve control unit causes the valve 852D to be in a closed state (a state in which the etching solution cannot pass) and a valve 851D to be in an open state (a state in which the etching solution can pass). It can be in a state where the etching solution is sent from '. Conversely, by setting the valve 852D in the open state and the valve 851D in the closed state, the etching solution can be sent out from the delivery port 4a ″.
According to the fifth embodiment as described above, the same effect as that of the first embodiment can be exhibited.
As mentioned above, although the surface processing apparatus of this invention was demonstrated based on embodiment of illustration, this invention is not limited to these, The structure of each part is substituted by the thing of the arbitrary structures which have the same function. can do. Moreover, other arbitrary structures and processes may be added. Moreover, you may combine each embodiment mentioned above suitably.

  In the above-described embodiment, the configuration has been described in which the delivery port 4a (4a ′, 4a ″) and the suction port 4b (4b ′, 4b ″) are both rectangular and the lengths in the longitudinal direction are equal to each other. The shapes of the delivery port 4a and the suction port 4b are not particularly limited as long as the etching solution fed from the delivery port 4a and supplied to the surface to be processed 101 can be sucked uniformly from the suction port 4b.

For example, as shown in FIG. 21A, the delivery port 4a and the suction port 4b are both rectangular, but their length and width may be different from each other. In this case, the length of the suction port 4b in the longitudinal direction is preferably about 0.8 times or more and 1.2 times or less of the length of the delivery port 4a in the longitudinal direction.
Moreover, as shown in FIG.21 (b), although the delivery port 4a and the suction port 4b have comprised rectangular shape, the structure where the extension direction is not parallel may be sufficient.

Further, as shown in FIG. 21C, both the delivery port 4a and the suction port 4b may have a shape in which the width gradually increases from the center in the longitudinal direction toward the edge.
Moreover, as shown in FIG.21 (d), both the delivery port 4a and the suction port 4b may be a shape where the width | variety reduces gradually toward the edge from the center part of a longitudinal direction.
Moreover, as shown in FIG.22 (e), the delivery port 4a is a shape where the width | variety reduces gradually toward an edge part from the center part of a longitudinal direction, and the suction port 4b is a center part of the longitudinal direction. The shape may gradually increase from the edge toward the edge. Moreover, the reverse may be sufficient.

  Further, as shown in FIG. 22 (f), the suction port 4b may have a shape having the same length as the delivery port 4a but a different width. Here, when the widths are different, as shown in the figure, when two different points P1 and P2 are set in the longitudinal direction, the width W1 and the point P2 at the position corresponding to the point P1 of the outlet 4a are set. The ratio of the width W2 at the corresponding position (W1 / W2) and the ratio of the width W3 at the position corresponding to the point P1 of the suction port 4b and the width W4 at the position corresponding to the point P2 (W3 / W4) Say equal.

  1, 1A, 1B, 1C, 1D ... Surface processing device 2 ... Supporting device 21 ... Chucking plate 211 ... Chucking surface 22 ... Fixing means 221 ... Suction hole 222 ... Suction pump 3 ... Etching Liquid supply device 4, 4A, 4B, 4C, 4D ... Nozzle 4a, 4a ', 4a "... Outlet 4b, 4b', 4b" ... Suction port 41, 42, 461, 462, 471, 472, 473 , 481, 482, 483... Through hole 45A... Guide groove 461a, 462a... Opening 6... Control unit 61. Nozzle moving device 62 .... Storage unit 63 .. Calculation unit 64. ... Etch solution circulation device 71 ... Delivery pipe 72 ... Recovery pipe 73 ... Storage tank 74 ... Liquid feed pump 75 ... Flow control valve 76 ... Flow meter 77 ... Suction pump 78 …… Temperature control unit 781 …… Temperature detection element 782 …… Heater 783 …… Drive control unit 79 …… Circuit path 8, 8C, 8D …… Switching means 81 …… First connecting pipe 82 …… Second Connecting pipe 831, 832, 833, 834, 841 C, 842 C, 851 D, 852 D …… Valve 900 …… Nozzle 910 …… Outlet 911 …… Center part 912, 913 …… End part 920 …… Suction port 923 ... Area 10 ... Workpiece 101 ... Surface to be processed R1, R2, R3, R4 ... Connection part S1, Sa, Sb, Sc ... Area W1, W2, W3, W4, Wa, Wb ... Width

Claims (12)

A processing apparatus for processing an object to be processed by supplying an etching solution to the object to be processed,
A support base for supporting the object to be processed;
A delivery port that is provided so as to be movable with respect to the support table and that sends the etching solution to the object to be processed supported by the support table, and a suction that sucks the etchant sent from the delivery port. A nozzle having a mouth,
Each of the suction port and the delivery port has a longitudinal shape extending in a direction crossing the moving direction of the nozzle, and is arranged in the moving direction of the nozzle.
The suction port is arranged on the rear side in the moving direction of the nozzle of the delivery port ,
The surface processing apparatus according to claim 1, wherein the nozzle has a guide groove that guides the etching solution from the delivery port to the suction port . The surface processing apparatus according to claim 1 , wherein the guide groove extends in a moving direction of the nozzle. The nozzle has a first opening and a second opening;
According to the moving direction of the nozzle, the first opening is used as the delivery port, the second opening is used as the suction port, and the first opening is used as the suction port. The surface processing apparatus of Claim 1 or 2 which can switch the state made into a delivery port. The surface processing apparatus according to any one of claims 1 to 3, wherein the suction port and the delivery port have the same length in the longitudinal direction. The surface processing apparatus according to any one of claims 1 to 4 , wherein the suction port and the delivery port have the same shape.   A processing apparatus for processing an object to be processed by supplying an etching solution to the object to be processed,
  A support base for supporting the object to be processed;
  A delivery port that is provided so as to be movable with respect to the support table and that sends the etching solution to the object to be processed supported by the support table, and a suction that sucks the etchant sent from the delivery port. A nozzle having a mouth,
  Each of the suction port and the delivery port has a longitudinal shape extending in a direction crossing the moving direction of the nozzle, and is arranged in the moving direction of the nozzle.
  The nozzle has a pair of suction ports arranged to face each other via the delivery port,
  The surface processing apparatus, wherein the etching solution is sucked from the suction port on the rear side in the moving direction of the nozzle of the pair of suction ports. The surface processing apparatus according to claim 6 , wherein the pair of suction ports are provided symmetrically with respect to the delivery port and have the same shape and size as each other.   A processing apparatus for processing an object to be processed by supplying an etching solution to the object to be processed,
  A support base for supporting the object to be processed;
  A delivery port that is provided so as to be movable with respect to the support table and that sends the etching solution to the object to be processed supported by the support table, and a suction that sucks the etchant sent from the delivery port. A nozzle having a mouth,
  Each of the suction port and the delivery port has a longitudinal shape extending in a direction crossing the moving direction of the nozzle, and is arranged in the moving direction of the nozzle.
  The nozzle has a pair of the delivery ports disposed to face each other through the suction port,
  The surface processing apparatus characterized by sending out the said etching liquid from the said delivery port in the moving direction front side of the said nozzle among said one pair of delivery ports. The surface processing apparatus according to claim 8 , wherein the pair of delivery ports are provided symmetrically with respect to the suction port and have the same shape and size as each other. The surface processing apparatus as described in any one of Claim 1 thru | or 9 provided with the moving speed control part which controls the moving speed of the said nozzle. The surface processing apparatus according to claim 10 , wherein each of the suction port and the delivery port has a rectangular shape. The nozzle is, in any one of claims 1 to 11 wherein the etchant sucks the etchant from the suction port to the etchant to a region within said treated surface supplied is distributed evenly The surface processing apparatus as described.

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