JP5565520B1 - Resin composition for solar cell encapsulant, solar cell encapsulant and solar cell module - Google Patents
Resin composition for solar cell encapsulant, solar cell encapsulant and solar cell module Download PDFInfo
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- JP5565520B1 JP5565520B1 JP2013271090A JP2013271090A JP5565520B1 JP 5565520 B1 JP5565520 B1 JP 5565520B1 JP 2013271090 A JP2013271090 A JP 2013271090A JP 2013271090 A JP2013271090 A JP 2013271090A JP 5565520 B1 JP5565520 B1 JP 5565520B1
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- JP
- Japan
- Prior art keywords
- solar cell
- silicoaluminophosphate
- resin composition
- aluminum
- general formula
- Prior art date
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- 239000008393 encapsulating agent Substances 0.000 title claims abstract description 35
- 239000011342 resin composition Substances 0.000 title claims abstract description 22
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 25
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 15
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 8
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003566 sealing material Substances 0.000 claims description 51
- 239000002245 particle Substances 0.000 claims description 13
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 12
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 7
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 229910000323 aluminium silicate Inorganic materials 0.000 claims 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 17
- 230000001681 protective effect Effects 0.000 abstract description 12
- 230000007774 longterm Effects 0.000 abstract 1
- -1 dichlorohexanone peroxide Chemical class 0.000 description 22
- 238000010248 power generation Methods 0.000 description 21
- 239000005038 ethylene vinyl acetate Substances 0.000 description 20
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000006087 Silane Coupling Agent Substances 0.000 description 12
- 238000004132 cross linking Methods 0.000 description 11
- 239000003431 cross linking reagent Substances 0.000 description 9
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 7
- 239000004611 light stabiliser Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- 239000005995 Aluminium silicate Substances 0.000 description 5
- 235000012211 aluminium silicate Nutrition 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 2
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- FGHOOJSIEHYJFQ-UHFFFAOYSA-N (2,4-ditert-butylphenyl) dihydrogen phosphite Chemical compound CC(C)(C)C1=CC=C(OP(O)O)C(C(C)(C)C)=C1 FGHOOJSIEHYJFQ-UHFFFAOYSA-N 0.000 description 1
- SXJSETSRWNDWPP-UHFFFAOYSA-N (2-hydroxy-4-phenylmethoxyphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C(O)=CC=1OCC1=CC=CC=C1 SXJSETSRWNDWPP-UHFFFAOYSA-N 0.000 description 1
- SYXTYIFRUXOUQP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy butaneperoxoate Chemical compound CCCC(=O)OOOC(C)(C)C SYXTYIFRUXOUQP-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- VNFXPOAMRORRJJ-UHFFFAOYSA-N (4-octylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCCCCCC)=CC=C1OC(=O)C1=CC=CC=C1O VNFXPOAMRORRJJ-UHFFFAOYSA-N 0.000 description 1
- OMWSZDODENFLSV-UHFFFAOYSA-N (5-chloro-2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=C(Cl)C=C1C(=O)C1=CC=CC=C1 OMWSZDODENFLSV-UHFFFAOYSA-N 0.000 description 1
- FYRCDEARNUVZRG-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CC(C)CC(C)(C)C1 FYRCDEARNUVZRG-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- VBQCFYPTKHCPGI-UHFFFAOYSA-N 1,1-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CCCCC1 VBQCFYPTKHCPGI-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- WSOMHEOIWBKOPF-UHFFFAOYSA-N 2,6-ditert-butyl-4-[(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)methyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CP2(=O)C3=CC=CC=C3C3=CC=CC=C3O2)=C1 WSOMHEOIWBKOPF-UHFFFAOYSA-N 0.000 description 1
- JLZIIHMTTRXXIN-UHFFFAOYSA-N 2-(2-hydroxy-4-methoxybenzoyl)benzoic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1C(O)=O JLZIIHMTTRXXIN-UHFFFAOYSA-N 0.000 description 1
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 1
- LEVFXWNQQSSNAC-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 LEVFXWNQQSSNAC-UHFFFAOYSA-N 0.000 description 1
- LGTOWDJWJQJQAO-UHFFFAOYSA-N 2-(5-methoxybenzotriazol-2-yl)-4,6-dimethylphenol Chemical compound N1=C2C=C(OC)C=CC2=NN1C1=CC(C)=CC(C)=C1O LGTOWDJWJQJQAO-UHFFFAOYSA-N 0.000 description 1
- MJFOVRMNLQNDDS-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-dimethylphenol Chemical compound CC1=CC(C)=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MJFOVRMNLQNDDS-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- NLWDAUDWBLSJGK-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-tert-butyl-6-methylphenol Chemical compound CC1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O NLWDAUDWBLSJGK-UHFFFAOYSA-N 0.000 description 1
- WXHVQMGINBSVAY-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 WXHVQMGINBSVAY-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- OUWPEHOSUWXUFV-UHFFFAOYSA-N 4-(benzotriazol-2-yl)-3-methylphenol Chemical compound CC1=CC(O)=CC=C1N1N=C2C=CC=CC2=N1 OUWPEHOSUWXUFV-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- IEMHIOUNBGZEAG-UHFFFAOYSA-N 4-tert-butyl-2-(5-chlorobenzotriazol-2-yl)phenol Chemical compound CC(C)(C)C1=CC=C(O)C(N2N=C3C=C(Cl)C=CC3=N2)=C1 IEMHIOUNBGZEAG-UHFFFAOYSA-N 0.000 description 1
- WEFMTVNJCFTOFQ-UHFFFAOYSA-N 6-decoxybenzo[c][2,1]benzoxaphosphinine Chemical compound C1=CC=C2P(OCCCCCCCCCC)OC3=CC=CC=C3C2=C1 WEFMTVNJCFTOFQ-UHFFFAOYSA-N 0.000 description 1
- QLZINFDMOXMCCJ-UHFFFAOYSA-N 7-(7-hydroxyheptylperoxy)heptan-1-ol Chemical compound OCCCCCCCOOCCCCCCCO QLZINFDMOXMCCJ-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004255 Butylated hydroxyanisole Substances 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- LXKJJSNNQBGPKZ-UHFFFAOYSA-N C1(=CC=CC=C1)NCCC[Si](OC)(OC)OC.NCCC[Si](OCC)(OCC)OCC Chemical compound C1(=CC=CC=C1)NCCC[Si](OC)(OC)OC.NCCC[Si](OCC)(OCC)OCC LXKJJSNNQBGPKZ-UHFFFAOYSA-N 0.000 description 1
- NTFPXUXETMDZOD-UHFFFAOYSA-N CCCCCCCCCCCCCCCCCCP(O)(O1)OC11OP(CCCCCCCCCCCCCCCCCC)(O)OCC1(C)C Chemical compound CCCCCCCCCCCCCCCCCCP(O)(O1)OC11OP(CCCCCCCCCCCCCCCCCC)(O)OCC1(C)C NTFPXUXETMDZOD-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- WPRJQTPRJVGWCZ-UHFFFAOYSA-N OC1=C(C(=O)C2=CC=CC=C2)C=CC(=C1)OCCCCCCCCCCCCCCCCCC.OC1=C(C(=O)C2=CC=CC=C2)C=CC(=C1)OCCCCCCCCCCCC Chemical compound OC1=C(C(=O)C2=CC=CC=C2)C=CC(=C1)OCCCCCCCCCCCCCCCCCC.OC1=C(C(=O)C2=CC=CC=C2)C=CC(=C1)OCCCCCCCCCCCC WPRJQTPRJVGWCZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- SODJJEXAWOSSON-UHFFFAOYSA-N bis(2-hydroxy-4-methoxyphenyl)methanone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1O SODJJEXAWOSSON-UHFFFAOYSA-N 0.000 description 1
- SXXILWLQSQDLDL-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=CC=C1 SXXILWLQSQDLDL-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- RPPBZEBXAAZZJH-UHFFFAOYSA-N cadmium telluride Chemical compound [Te]=[Cd] RPPBZEBXAAZZJH-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- JFHGLVIOIANSIN-UHFFFAOYSA-N dimethyl butanedioate;1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound COC(=O)CCC(=O)OC.CC1(C)CC(O)CC(C)(C)N1CCO JFHGLVIOIANSIN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- QKYJUAQCVQCEKS-UHFFFAOYSA-N ethene;ethyl 2-methylprop-2-enoate Chemical compound C=C.CCOC(=O)C(C)=C QKYJUAQCVQCEKS-UHFFFAOYSA-N 0.000 description 1
- VKLYZBPBDRELST-UHFFFAOYSA-N ethene;methyl 2-methylprop-2-enoate Chemical compound C=C.COC(=O)C(C)=C VKLYZBPBDRELST-UHFFFAOYSA-N 0.000 description 1
- HGVPOWOAHALJHA-UHFFFAOYSA-N ethene;methyl prop-2-enoate Chemical compound C=C.COC(=O)C=C HGVPOWOAHALJHA-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001463 metal phosphate Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- LKTCWOYIQVKYIV-UHFFFAOYSA-N n-butyl-4-chloro-n-(1,2,2,6,6-pentamethylpiperidin-4-yl)-1,3,5-triazin-2-amine Chemical compound N=1C=NC(Cl)=NC=1N(CCCC)C1CC(C)(C)N(C)C(C)(C)C1 LKTCWOYIQVKYIV-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- KCRLWVVFAVLSAP-UHFFFAOYSA-N octyl dihydrogen phosphite Chemical compound CCCCCCCCOP(O)O KCRLWVVFAVLSAP-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- AHIHJODVQGBOND-UHFFFAOYSA-M propan-2-yl carbonate Chemical compound CC(C)OC([O-])=O AHIHJODVQGBOND-UHFFFAOYSA-M 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- CXVGEDCSTKKODG-UHFFFAOYSA-N sulisobenzone Chemical compound C1=C(S(O)(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 CXVGEDCSTKKODG-UHFFFAOYSA-N 0.000 description 1
- PFBLRDXPNUJYJM-UHFFFAOYSA-N tert-butyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(C)(C)C PFBLRDXPNUJYJM-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
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- Sealing Material Composition (AREA)
Abstract
【課題】透明性が良好で、長期の使用でも表面保護ガラスとの密着性の低下を抑制し、耐PID性が良好な太陽電池封止材を成形できる太陽電池封止材用樹脂組成物を提供する。
【解決手段】エチレン共重合体およびシリコアルミノリン酸塩を含む太陽電池封止材用樹脂組成物である。なおシリコアルミノリン酸塩は、下記一般式(1)で表す組成を満たす比率のケイ酸成分とアルミニウム成分を有するケイ酸アルミニウムをリン酸で処理してなる化合物である。一般式(1)SiO2・nAl2O3(ただし、nは0.001〜0.5)。上記一般式(1)のアルミニウム成分の10〜99.9モル%がリン酸アルミニウムに転化していることが好ましい。
【選択図】図1A resin composition for a solar cell encapsulant that has good transparency, suppresses a decrease in adhesion to a surface protective glass even after long-term use, and can mold a solar cell encapsulant with good PID resistance. provide.
A resin composition for a solar cell encapsulant comprising an ethylene copolymer and silicoaluminophosphate. Silicoaluminophosphate is a compound obtained by treating aluminum silicate having a ratio of a silicate component and an aluminum component satisfying the composition represented by the following general formula (1) with phosphoric acid. General formula (1) SiO 2 · nAl 2 O 3 (where n is 0.001 to 0.5). It is preferable that 10-99.9 mol% of the aluminum component of the general formula (1) is converted into aluminum phosphate.
[Selection] Figure 1
Description
本発明は、太陽電池封止材の製造に使用する太陽電池封止材用樹脂組成物に関する。 The present invention relates to a resin composition for a solar cell sealing material used for manufacturing a solar cell sealing material.
エコロジーの観点から太陽光発電システム(以下、太陽電池ともいう)は、クリーンなエネルギー源として幅広く使用されており、太陽電池のさらなる高効率化、長寿命化などを目指した技術開発が推進されている。 From an ecological point of view, photovoltaic power generation systems (hereinafter also referred to as solar cells) are widely used as clean energy sources, and technological development aimed at further increasing the efficiency and extending the life of solar cells is being promoted. Yes.
太陽電池は、複数の太陽電池モジュールを組み合わせたものであるが、太陽電池モジュールに組み込む発電素子は、シリコン等の半導体を用いて太陽光エネルギーを直接電気エネルギーに変換することで発電している。しかし、前記半導体は直接外気と接触すると発電機能が低下するため、発電素子を太陽電池封止材(以下、封止材ともいう)で被覆することで保護している。前記封止材として、現在では架橋エチレン−酢酸ビニル樹脂(以下、EVAともいう)が低コスト、透明性および発電素子への接着性等の観点から使用されている。しかし、EVAは、絶縁性が低いため、発電時のリーク電流が半導体に流れ、半導体に悪影響を及ぼすことが問題となっている。 A solar cell is a combination of a plurality of solar cell modules, and a power generation element incorporated in the solar cell module generates power by directly converting solar energy into electrical energy using a semiconductor such as silicon. However, since the power generation function is lowered when the semiconductor is in direct contact with the outside air, the power generation element is protected by being covered with a solar cell sealing material (hereinafter also referred to as a sealing material). Currently, a crosslinked ethylene-vinyl acetate resin (hereinafter also referred to as EVA) is used as the sealing material from the viewpoints of low cost, transparency, adhesion to power generation elements, and the like. However, since EVA has low insulating properties, there is a problem that a leak current during power generation flows to the semiconductor and adversely affects the semiconductor.
また、近年ではメガソーラなどの大規模太陽光発電システムが各地に設置されているが、発電した電流の伝達損失を下げる目的で、システム電圧を600〜1000V程度に上げて送電する高電圧化が進んでいる。前記高電圧化により、太陽電池モジュール内のフレームと半導体との電位差が大きくなる。また、表面保護ガラスも封止材と比較すると電気抵抗が低いことから、発電素子と表面保護ガラス間でもその電位差が大きくなる。これにより大規模太陽光発電システムの太陽電池モジュールの発電素子表面にイオンが集積し、電子の移動を妨げてしまうことで変換効率を低下させるPID(Potential Induced Degradation)現象が発生する。このPID現象の対策として、発電素子に対する電流のリークをできる限り防ぐ必要がある。そこで封止材の体積抵抗率を増大させて電流のリークを防止することが問題となっている。 In recent years, large-scale solar power generation systems such as mega solar have been installed in various places, but for the purpose of reducing the transmission loss of the generated current, the system voltage has been raised to about 600 to 1000 V and the transmission voltage has been increased. It is out. The increase in voltage increases the potential difference between the frame and the semiconductor in the solar cell module. Further, since the surface protection glass also has a lower electrical resistance than the sealing material, the potential difference between the power generation element and the surface protection glass also increases. As a result, ions are accumulated on the surface of the power generation element of the solar cell module of the large-scale solar power generation system, and a PID (Potential Induced Degradation) phenomenon occurs in which conversion efficiency is reduced by hindering the movement of electrons. As a countermeasure against this PID phenomenon, it is necessary to prevent current leakage to the power generating element as much as possible. Therefore, it is a problem to increase the volume resistivity of the sealing material to prevent current leakage.
PID現象の改善を直接の目的とはしていないが、封止材の体積抵抗率を増やす検討がされている。特許文献1では、珪素原子に直接結合する官能基の炭素原子数が4以下のシランカップリング剤を配合した封止材が開示されている。また、特許文献2および3では、EVAに代えてエチレン-αオレフィン共重合体等のポリオレフィン樹脂を使用した。封止材が開示されている。また、特許文献4では、カオリナイトを焼成したメタカオリンを配合した封止材が開示されている。 Although the improvement of the PID phenomenon is not directly aimed at, the volume resistivity of the sealing material is being studied. Patent Document 1 discloses a sealing material containing a silane coupling agent having a functional group directly bonded to a silicon atom and having 4 or less carbon atoms. In Patent Documents 2 and 3, a polyolefin resin such as an ethylene-α olefin copolymer is used instead of EVA. An encapsulant is disclosed. Moreover, in patent document 4, the sealing material which mix | blended the metakaolin which baked kaolinite is disclosed.
しかし、特定のシランカップリング剤を配合した封止材は、分子量が低いシランカップリング剤を配合しているため、封止材を成形する際の加熱工程でシランカップリング剤が揮発する問題、または、成形後にシランカップリング剤がブリードアウトする問題があり所望の性能が得られていなかった。また、ポリオレフィン樹脂は、EVAと比較して透明性、耐ブロッキング性、架橋性が低い問題があり、さらに太陽電池モジュールが夏季に高温に晒された際、ポリオレフィン樹脂が流動する現象(クリープ現象)を起こす問題があるため、ポリオレフィン樹脂を使用した封止材は一般的ではなかった。また、メタカオリンを配合した封止材は、透明性が不足し、また今後の太陽電池の大容量化を考慮すると体積抵抗率が10の15乗台であるため性能が不足する問題があった。 However, since a sealing material containing a specific silane coupling agent contains a silane coupling agent having a low molecular weight, the problem of volatilization of the silane coupling agent in the heating process when molding the sealing material, Or, there is a problem that the silane coupling agent bleeds out after molding, and the desired performance has not been obtained. In addition, polyolefin resin has problems of low transparency, blocking resistance and crosslinkability compared to EVA, and also phenomenon that polyolefin resin flows when solar cell module is exposed to high temperature in summer (creep phenomenon). Therefore, a sealing material using a polyolefin resin has not been common. Moreover, the sealing material blended with metakaolin has a problem that the transparency is insufficient, and considering the future increase in the capacity of solar cells, the volume resistivity is on the order of 10 15, so that the performance is insufficient.
本発明は、透明性が良好で、長期間使用した場合でも表面保護ガラスとの密着性の低下を抑制し、耐PID性が良好な太陽電池封止材を成形できる太陽電池封止材用樹脂組成物および太陽電池封止材の提供を目的とする。 The present invention is a resin for solar cell encapsulant that has good transparency, suppresses a decrease in adhesion with surface protective glass even when used for a long period of time, and can form a solar cell encapsulant with good PID resistance It aims at provision of a composition and a solar cell sealing material.
本発明の太陽電池封止材用樹脂組成物は、エチレン共重合体およびシリコアルミノリン酸塩を含む構成である。 The resin composition for a solar cell encapsulant of the present invention has a configuration containing an ethylene copolymer and a silicoaluminophosphate.
上記構成の本発明によれば、シリコアルミノリン酸塩はエチレン共重合体と分散性が良好であることから封止材は、透明性および密着性が良好である。また前記封止材は、シリコアルミノリン酸塩の配合により体積抵抗率を大幅に増加したことで耐PID性が向上した。 According to the present invention having the above configuration, since the silicoaluminophosphate has good dispersibility with the ethylene copolymer, the sealing material has good transparency and adhesion. Moreover, the said sealing material improved PID resistance by having increased the volume resistivity significantly by the mixing | blending of silicoaluminophosphate.
本発明により透明性が良好で、長期間使用した場合でも表面保護ガラスとの密着性の低下を抑制し、耐PID性が良好な太陽電池封止材を成形できる太陽電池封止材用樹脂組成物を提供できた。 Resin composition for solar cell encapsulant that can form a solar cell encapsulant that has good transparency, suppresses a decrease in adhesion to surface protective glass even when used for a long time, and has good PID resistance I was able to provide things.
以下、本発明を詳細に説明する。なお、本明細書において、「任意の数A以上、任意の数B以下」及び「任意の数A〜任意の数B」の記載は、数A及び数Aより大きい範囲であって、数B及び数Bより小さい範囲を意味する。 Hereinafter, the present invention will be described in detail. In the present specification, the description of “any number A or more and any number B or less” and “any number A to any number B” is a range larger than the number A and the number A, and the number B And a range smaller than the number B.
本発明の太陽電池封止材用樹脂組成物は、エチレン共重合体およびシリコアルミノリン酸塩を含む。太陽電池封止材用樹脂組成物(以下、樹脂組成物ともいう)は、シート状に成形して太陽電池封止材として使用することが好ましい。さらに前記太陽電池封止材は、発電素子を挟み込み封止(被覆)することで太陽電池モジュールを構成する部材として使用することが好ましい。 The resin composition for a solar cell encapsulant of the present invention contains an ethylene copolymer and a silicoaluminophosphate. A resin composition for a solar cell encapsulant (hereinafter also referred to as a resin composition) is preferably formed into a sheet and used as a solar cell encapsulant. Further, the solar cell sealing material is preferably used as a member constituting the solar cell module by sandwiching and sealing (covering) the power generation element.
〔エチレン共重合体〕
本発明においてエチレン共重合体は、二種類以上の単量体の混合物を重合した共重合体である。前記エチレン共重合体は、重合に使用する単量体の少なくとも一種類がエチレン単量体であれば良い。具体的には、エチレン酢酸ビニル共重合体(EVA)、エチレンアクリル酸メチル共重合体、エチレンアクリル酸エチル共重合体、エチレンメタクリル酸メチル共重合体、エチレンメタクリル酸エチル共重合体、エチレン酢酸ビニル系多元共重合体、エチレンアクリル酸メチル系多元共重合体、エチレンアクリル酸エチル系多元共重合体、エチレンメタクリル酸メチル系多元共重合体、エチレンメタクリル酸エチル系多元共重合体などが挙げられる。これらの中でも透明性、ラミネート性の面からEVAが好ましく、酢酸ビニル含有量15〜40モル%のEVAがより好ましく、酢酸ビニル含有量25〜35モル%のエチレン酢酸ビニル共重合体がさらに好ましい。
[Ethylene copolymer]
In the present invention, the ethylene copolymer is a copolymer obtained by polymerizing a mixture of two or more types of monomers. In the ethylene copolymer, at least one monomer used for polymerization may be an ethylene monomer. Specifically, ethylene vinyl acetate copolymer (EVA), ethylene methyl acrylate copolymer, ethylene ethyl acrylate copolymer, ethylene methyl methacrylate copolymer, ethylene ethyl methacrylate copolymer, ethylene vinyl acetate Examples thereof include an ethylene multi-component copolymer, an ethylene methyl acrylate multi-component copolymer, an ethylene ethyl acrylate multi-component copolymer, an ethylene methyl methacrylate multi-component copolymer, and an ethylene ethyl methacrylate multi-component copolymer. Among these, EVA is preferable from the viewpoint of transparency and laminating properties, EVA having a vinyl acetate content of 15 to 40 mol% is more preferable, and an ethylene vinyl acetate copolymer having a vinyl acetate content of 25 to 35 mol% is more preferable.
前記エチレン共重合体は、成形性、機械的強度などを考慮すると、メルトフローレート(JIS K7210準拠)が0.1〜60g/10minであることが好ましく、0.5〜45g/10minがより好ましい。なおメルトフローレートはMFRともいう。 In view of moldability, mechanical strength, etc., the ethylene copolymer preferably has a melt flow rate (based on JIS K7210) of 0.1 to 60 g / 10 min, more preferably 0.5 to 45 g / 10 min. . The melt flow rate is also referred to as MFR.
〔シリコアルミノリン酸塩〕
本発明においてシリコアルミノリン酸塩を配合した樹脂組成物を使用した封止材は、体積抵抗率が高く絶縁性が向上するため耐PID性が向上する。前記シリコアルミノリン酸塩は、絶縁性を低下させ、耐PID性を低下させる導電性物質(イオンおよびラジカル等)を捕集できる。前記導電性物質は、エチレン共重合中の加水分解物イオン(H+、COO−等)、ガラスの電気分解により発生するNa+イオンや安定剤由来の金属イオン(例えばCa2+、Zn2+、Mg2+)等が挙げられる。シリコアルミノリン酸塩は、例えば、前記金属イオンを捕集するとイオン交換反応により、直ちに難水溶性のリン酸金属塩を生成するため封止材の体積抵抗率を高くできる。
[Silicoaluminophosphate]
In the present invention, a sealing material using a resin composition containing silicoaluminophosphate has a high volume resistivity and improved insulation, so that the PID resistance is improved. The silicoaluminophosphate can collect conductive substances (such as ions and radicals) that reduce insulation and reduce PID resistance. The conductive material includes hydrolyzate ions (H + , COO −, etc.) during ethylene copolymerization, Na + ions generated by the electrolysis of glass, and metal ions derived from stabilizers (for example, Ca 2+ , Zn 2+ , Mg 2+ ) and the like. Silicoaluminophosphate can increase the volume resistivity of the sealing material because, for example, when the metal ions are collected, a water-insoluble metal phosphate is immediately generated by an ion exchange reaction.
前記シリコアルミノリン酸塩は、公知の化合物を使用できるが、本発明では、下記一般式(1)で表す組成を満たす比率のケイ酸成分とアルミニウム成分を有するケイ酸アルミニウムをリン酸で処理してなる化合物であり、下記一般式(1)の酸化アルミニウム成分の10〜99.9%がリン酸アルミニウムに転化している化合物が好ましい。
一般式(1) SiO2・nAl2O3
(ただし、nは0.001〜0.5)
A known compound can be used as the silicoaluminophosphate, but in the present invention, an aluminum silicate having a ratio of a silicic acid component and an aluminum component satisfying the composition represented by the following general formula (1) is treated with phosphoric acid. A compound in which 10 to 99.9% of the aluminum oxide component of the following general formula (1) is converted to aluminum phosphate is preferable.
General formula (1) SiO 2 · nAl 2 O 3
(However, n is 0.001 to 0.5)
シリコアルミノリン酸塩は、ケイ酸成分を含む酸化アルミニウムをリン酸処理して、前記アルミニウム成分をリン酸アルミニウムに転化することで得られる。前記シリコアルミノリン酸塩は、合成した非晶質ケイ酸アルミニウムまたはカオリンないし焼成カオリンのようなケイ酸成分と酸化アルミニウム成分を主として構成する鉱物をリン酸処理して得ることができる。以下、合成した非晶質ケイ酸アルミニウムを用いた前記シリコアルミノリン酸塩の製法の1例を挙げて説明する。なおシリコアルミノリン酸塩の製法が限定されないことはいうまでもない。
シリコアルミノリン酸塩は、シリカゾル(SiO2)に対する硫酸アルミニウム{Al2
(SO4)3}のモル比がSiO2/Al2(SO4)3=20となるように混合し、室温(25℃程度)、大気圧下でpH1〜5に調整して共沈させる。この際にpHを低くすると平均粒子径を大きくでき、pHを高くすると平均粒子径を小さく出来る。この溶液を60℃で4時間熟成させた後、水洗、乾燥して、非晶質ケイ酸アルミニウムを得る。次に、85%リン酸80gをイオン交換水1000mlに加え水溶液とした後、撹拌下に、非晶質ケイ酸アルミニウム 100gを加えて5分間良く混合してスラリーを得る。前記スラリーをステンレス製バットに移し替え、100℃にて一昼夜蒸発乾固する。得られた乾燥ケーキをサンプルミルにて粉砕することでシリコアルミノリン酸塩を製造できる。製造したシリコアルミノリン酸塩のリン酸アルミニウムの比率は、島津シーケンシャル形蛍光X線分析装置LAB CENTER XRF−1700によって測定し、前記装置搭載のFP(ファンダメンタル・パラメータ)法によってサンプル中に含まれるアルミニウムとリンの重量を定量分析し、酸化アルミニウム成分とリン酸アルミニウム成分のモル比を求めた。
Silicoaluminophosphate is obtained by subjecting aluminum oxide containing a silicate component to phosphoric acid treatment and converting the aluminum component into aluminum phosphate. The silicoaluminophosphate can be obtained by subjecting a mineral mainly composed of a silicic acid component and an aluminum oxide component such as synthesized amorphous aluminum silicate or kaolin or calcined kaolin to a phosphoric acid treatment. Hereinafter, an example of a method for producing the silicoaluminophosphate using the synthesized amorphous aluminum silicate will be described. Needless to say, the production method of silicoaluminophosphate is not limited.
Silicoaluminophosphate is made of aluminum sulfate {Al 2 to silica sol (SiO 2 ).
(SO 4 ) 3 } is mixed so that the molar ratio is SiO 2 / Al 2 (SO 4 ) 3 = 20, and co-precipitated by adjusting the pH to 1 to 5 at room temperature (about 25 ° C.) and atmospheric pressure. . At this time, if the pH is lowered, the average particle diameter can be increased, and if the pH is increased, the average particle diameter can be decreased. This solution is aged at 60 ° C. for 4 hours, then washed with water and dried to obtain amorphous aluminum silicate. Next, 80 g of 85% phosphoric acid is added to 1000 ml of ion-exchanged water to form an aqueous solution, and then 100 g of amorphous aluminum silicate is added with stirring and mixed well for 5 minutes to obtain a slurry. The slurry is transferred to a stainless steel vat and evaporated to dryness at 100 ° C. overnight. Silicoaluminophosphate can be produced by pulverizing the obtained dried cake with a sample mill. The ratio of the aluminum phosphate of the manufactured silicoaluminophosphate was measured by Shimadzu sequential fluorescent X-ray analyzer LAB CENTER XRF-1700, and the aluminum contained in the sample by the FP (fundamental parameter) method mounted on the apparatus. And the weight of phosphorus were quantitatively analyzed to determine the molar ratio of the aluminum oxide component and the aluminum phosphate component.
前記シリコアルミノリン酸塩は、エチレン共重合体100重量部に対して0.01〜1重量部を配合することが好ましく、0.1〜0.5重量部がより好ましい。0.01〜1重量部で配合することで透明性と耐PID性を高い水準で両立し易くなり、密着性がより低下し難くなる。また、樹脂組成物は、シリコアルミノリン酸塩を高濃度に配合した太陽電池封止材用マスターバッチであっても良い。かかる場合、エチレン共重合体100重量部に対してシリコアルミノリン酸塩を1〜20重量部配合することが好ましく、1〜10重量部がより好ましい。樹脂組成物をマスターバッチとして製造し、それと希釈樹脂を用いて封止材を製造するとシリコアルミノリン酸塩を封止材中により均一に分散できる。最終的に封止材中のシリコアルミノリン酸塩は、エチレン共重合体100重量部に対して0.01〜1重量部程度であることが好ましい。 The silicoaluminophosphate is preferably blended in an amount of 0.01 to 1 part by weight, more preferably 0.1 to 0.5 part by weight, based on 100 parts by weight of the ethylene copolymer. By mix | blending by 0.01-1 weight part, it becomes easy to make transparency and PID resistance compatible at a high level, and adhesiveness becomes difficult to fall more. In addition, the resin composition may be a master batch for solar cell encapsulating material in which silicoaluminophosphate is blended at a high concentration. In this case, it is preferable to mix 1 to 20 parts by weight of silicoaluminophosphate with respect to 100 parts by weight of the ethylene copolymer, and more preferably 1 to 10 parts by weight. When a resin composition is produced as a master batch and a sealing material is produced using the resin composition and a diluted resin, the silicoaluminophosphate can be more uniformly dispersed in the sealing material. Finally, the silicoaluminophosphate in the sealing material is preferably about 0.01 to 1 part by weight with respect to 100 parts by weight of the ethylene copolymer.
前記シリコアルミノリン酸塩の平均粒子径は、0.1〜150μmが好ましく、1〜100μmがより好ましい。0.1〜150μmの範囲にあることで、生産性、透明性および封止材の平滑性をより高い水準で満たすことができる。なお平均粒子径は、電子顕微鏡の拡大写真(千倍〜1万倍程度)から10〜20個程度の粒子径を平均した数値である。 The average particle size of the silicoaluminophosphate is preferably 0.1 to 150 μm, and more preferably 1 to 100 μm. By being in the range of 0.1 to 150 μm, productivity, transparency, and smoothness of the sealing material can be satisfied at a higher level. The average particle diameter is a numerical value obtained by averaging about 10 to 20 particle diameters from an enlarged photograph (about 1000 to 10,000 times) of an electron microscope.
また前記シリコアルミノリン酸塩のBET比表面積は、5〜200m2/gが好ましく、10〜100m2/gがより好ましい。5〜200m2/gの範囲にあることで導電性物質をさらに捕集できるため、透明性がより向上し、密着性がより低下し難くなる。 Moreover, 5-200 m < 2 > / g is preferable and, as for the BET specific surface area of the said silicoaluminophosphate, 10-100 m < 2 > / g is more preferable. Since a conductive substance can be further collected by being in the range of 5-200 m < 2 > / g, transparency improves more and adhesiveness becomes difficult to fall more.
〔太陽電池封止材樹脂組成物〕
本発明の太陽電池封止材樹脂組成物は、エチレン共重合体およびシリコアルミノリン酸塩に加えて、任意成分として架橋剤、架橋助剤、シランカップリング剤、紫外線吸収剤、光安定剤、酸化防止剤、光拡散剤、波長変換剤、着色剤、分散剤、および難燃剤等の添加剤を配合することができる。また、前記任意成分は、封止材を製造する際に配合することもできる。
[Solar cell encapsulant resin composition]
In addition to the ethylene copolymer and the silicoaluminophosphate, the solar cell encapsulant resin composition of the present invention includes, as optional components, a crosslinking agent, a crosslinking aid, a silane coupling agent, an ultraviolet absorber, a light stabilizer, Additives such as antioxidants, light diffusing agents, wavelength converting agents, colorants, dispersants, and flame retardants can be blended. Moreover, the said arbitrary component can also be mix | blended when manufacturing a sealing material.
前記架橋剤は、エチレン酢酸ビニル共重合体の高温使用下における熱変形を防止するために使用する。架橋剤は有機過酸化物が好ましい。具体的には、例えばtert−ブチルパーオキシイソプロピルカーボネート、tert−ブチルパーオキシ−2− エチルヘキシルイソプロピルカーボネート、tert−ブチルパーオキシアセテート、tert−ブチルクミルパーオキサイド、2,5−ジメチル−2,5−ジ(tert−ブチルパーオキシ)ヘキサン、ジ−tert−ブチルパーオキサイド、2,5−ジメチル−2,5−ジ(tert−ブチルパーオキシ)ヘキシン−3、2,5−ジメチル−2,5−ジ(tert−ブチルパーオキシ)ヘキサン、1,1−ジ(tert−ヘキシルパーオキシ)−3,3,5−トリメチルシクロヘキサン、1,1−ジ(tert−ブチルパーオキシ)シクロヘキサン、1,1−ジ(tert−ヘキシルパーオキシ)シクロヘキサン、1,1−ジ(tert−アミルパーオキシ)シクロヘキサン、2,2−ジ(tert−ブチルパーオキシ)ブタン、メチルエチルケトンパーオキサイド、2,5−ジメチルヘキシル−2,5−ジパーオキシベンゾエート、tert−ブチルハイドロパーオキサイド、p−メンタンハイドロパーオキサイド、ジベンゾイルパーオキサイド、p−クロルベンゾイルパーオキサイド、tert−ブチルパーオキシイソブチレート、n −ブチル−4,4−ジ(tert−ブチルパーオキシ)バレレート、エチル−3,3−ジ(tert−ブチルパーオキシ)ブチレート、ヒドロキシヘプチルパーオキサイド、ジクロヘキサノンパーオキサイド、1,1−ジ(tert−ブチルパーオキシ)3,3,5−トリメチルシクロヘキサン、n−ブチル−4,4−ジ(tert−ブチルパーオキシ)バレレート、および2,2−ジ(tert−ブチルパーオキシ)ブタン等が挙げられる。
架橋剤は、エチレン共重合体100重量部に対して、0.05〜3重量部配合するのが好ましい。
The crosslinking agent is used for preventing thermal deformation of the ethylene vinyl acetate copolymer under high temperature use. The crosslinking agent is preferably an organic peroxide. Specifically, for example, tert-butyl peroxyisopropyl carbonate, tert-butyl peroxy-2-ethylhexyl isopropyl carbonate, tert-butyl peroxyacetate, tert-butylcumyl peroxide, 2,5-dimethyl-2,5- Di (tert-butylperoxy) hexane, di-tert-butylperoxide, 2,5-dimethyl-2,5-di (tert-butylperoxy) hexyne-3, 2,5-dimethyl-2,5- Di (tert-butylperoxy) hexane, 1,1-di (tert-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-di (tert-butylperoxy) cyclohexane, 1,1- Di (tert-hexylperoxy) cyclohexane, 1,1- Di (tert-amylperoxy) cyclohexane, 2,2-di (tert-butylperoxy) butane, methyl ethyl ketone peroxide, 2,5-dimethylhexyl-2,5-diperoxybenzoate, tert-butyl hydroperoxide , P-menthane hydroperoxide, dibenzoyl peroxide, p-chlorobenzoyl peroxide, tert-butylperoxyisobutyrate, n-butyl-4,4-di (tert-butylperoxy) valerate, ethyl-3 , 3-Di (tert-butylperoxy) butyrate, hydroxyheptyl peroxide, dichlorohexanone peroxide, 1,1-di (tert-butylperoxy) 3,3,5-trimethylcyclohexane, n-butyl-4, 4-di (t ert-butylperoxy) valerate, 2,2-di (tert-butylperoxy) butane, and the like.
The crosslinking agent is preferably added in an amount of 0.05 to 3 parts by weight with respect to 100 parts by weight of the ethylene copolymer.
前記架橋助剤は、架橋剤の架橋反応の効率的に進行させるために使用する。架橋助剤は、ポリアリル化合物やポリアクリロキシ化合物のような不飽和化合物が好ましい。具体的には、例えばトリアリルイソシアヌレート、トリアリルシアヌレート、ジアリルフタレート、ジアリルフマレート、ジアリルマレエート、エチレングリコールジアクリレート、エチレングリコールジメタクリレート、およびトリメチロールプロパントリメタクリレート等が挙げられる。
架橋助剤は、エチレン共重合体100重量部に対して、0.05〜3重量部配合するのが好ましい。
The crosslinking aid is used in order to efficiently advance the crosslinking reaction of the crosslinking agent. The crosslinking aid is preferably an unsaturated compound such as a polyallyl compound or a polyacryloxy compound. Specific examples include triallyl isocyanurate, triallyl cyanurate, diallyl phthalate, diallyl fumarate, diallyl maleate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, and trimethylolpropane trimethacrylate.
The crosslinking aid is preferably blended in an amount of 0.05 to 3 parts by weight with respect to 100 parts by weight of the ethylene copolymer.
前記シランカップリング剤は、表面保護ガラスや発電素子等に対する密着性を向上させるために使用する。シランカップリング剤は、ビニル基、アクリロキシ基およびメタクリロキシ基等の官能基、ならびにアルコキシ基のような加水分解性官能基を有する化合物である。具体的には、例えばビニルトリクロルシラン、ビニルトリス(βメトキシエトキシ)シラン、ビニルトリエトキシシラン、ビニルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、N−β(アミノエチル)γ−アミノプロピルトリメトキシシラン、N−β(アミノエチル)γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルトリエトキシシラン、N−フェニル−γ−アミノプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、およびγ−クロロプロピルトリメトキシシランなどが挙げられる。
シランカップリング剤は、エチレン共重合体とシリコアルミノリン酸塩の合計100重量部に対して、0.05〜3重量部配合するのが好ましい。
The silane coupling agent is used in order to improve adhesion to a surface protective glass or a power generation element. The silane coupling agent is a compound having a functional group such as a vinyl group, an acryloxy group and a methacryloxy group, and a hydrolyzable functional group such as an alkoxy group. Specifically, for example, vinyltrichlorosilane, vinyltris (βmethoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxy Silane, γ-glycidoxypropylmethyldiethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, and the like.
The silane coupling agent is preferably added in an amount of 0.05 to 3 parts by weight based on 100 parts by weight of the total of the ethylene copolymer and the silicoaluminophosphate.
前記紫外線吸収剤は、耐候性を向上さるために使用する。紫外線吸収剤は、ベンゾフェノン系化合物、ベンゾトリアゾール系化合物、トリアジン系化合物、サリチル酸エステル系化合物等が好ましい。具体的には、例えば2−ヒドロキシ−4−メトキシベンゾフェノン、2−ヒドロキシ−4−メトキシ−2’−カルボキシベンゾフェノン、2−ヒドロキシ−4−オクトキシベンゾフェノン、2−ヒドロキシ−4− n−ドデシルオキシベンゾフェノン、2−ヒドロキシ−4−n−オクタデシルオキシベンゾフェノン、2−ヒドロキシ−4−ベンジルオキシベンゾフェノン、2−ヒドロキシ−4−メトキシ−5−スルホベンゾフェノン、2−ヒドロキシ−5−クロロベンゾフェノン、2,4−ジヒドロキシベンゾフェノン、2,2’−ジヒドロキシ−4−メトキシベンゾフェノン、2,2’−ジヒドロキシ−4,4’−ジメトキシベンゾフェノン、2,2’,4,4’−テトラヒドロキシベンゾフェノン、2−(2−ヒドロキシ−5−メチルフェニル)ベンゾトリアゾール、2−(2−ヒドロキシ−5−t−ブチルフェニル)ベンゾトリアゾール、2−(2−ヒドロキシ−3,5−ジメチルフェニル)ベンゾトリアゾール、2−(2−メチル−4−ヒドロキシフェニル)ベンゾトリアゾール、2−(2−ヒドロキシ−3−メチル−5−t−ブチルフェニル)ベンゾトリアゾール、2−(2−ヒドロキシ−3,5−ジ−t−ブチルフェニル)ベンゾトリアゾール、2−(2−ヒドロキシ−3、5−ジメチルフェニル)−5−メトキシベンゾトリアゾール、2−(2−ヒドロキシ−3−t−ブチル−5−メチルフェニル)−5−クロロベンゾトリアゾール、2−(2−ヒドロキシ−5−t−ブチルフェニル)−5−クロロベンゾトリアゾール、2−[4,6−ビス(2,4−ジメチルフェニル)−1,3,5−トリアジン−2−イル]−5−(オクチルオキシ)フェノール、2−(4,6−ジフェニル−1,3, 5−トリアジン−2−イル)−5−(ヘキシルオキシ)フェノール、フェニルサリチレート、およびp−オクチルフェニルサリチレート等が挙げられる。
紫外線吸収剤は、エチレン共重合体100重量に対して、0.01〜3重量部配合するのが好ましい。
The ultraviolet absorber is used for improving weather resistance. The ultraviolet absorber is preferably a benzophenone compound, a benzotriazole compound, a triazine compound, a salicylic acid ester compound, or the like. Specifically, for example, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxy-2′-carboxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-n-dodecyloxybenzophenone 2-hydroxy-4-n-octadecyloxybenzophenone, 2-hydroxy-4-benzyloxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, 2-hydroxy-5-chlorobenzophenone, 2,4-dihydroxy Benzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxybenzophenone, 2,2 ′, 4,4′-tetrahydroxybenzophenone, 2- (2-hydroxy- 5-methylphenyl) Nzotriazole, 2- (2-hydroxy-5-t-butylphenyl) benzotriazole, 2- (2-hydroxy-3,5-dimethylphenyl) benzotriazole, 2- (2-methyl-4-hydroxyphenyl) Benzotriazole, 2- (2-hydroxy-3-methyl-5-t-butylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-t-butylphenyl) benzotriazole, 2- (2- Hydroxy-3,5-dimethylphenyl) -5-methoxybenzotriazole, 2- (2-hydroxy-3-tert-butyl-5-methylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-5- t-butylphenyl) -5-chlorobenzotriazole, 2- [4,6-bis (2,4-dimethylphenyl) -1 3,5-triazin-2-yl] -5- (octyloxy) phenol, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5- (hexyloxy) phenol, phenyl Examples include salicylate and p-octylphenyl salicylate.
The ultraviolet absorber is preferably blended in an amount of 0.01 to 3 parts by weight with respect to 100 parts by weight of the ethylene copolymer.
前記光安定剤は、耐候性を向上さるために使用し、紫外線吸収剤と併用すると耐候性がさらに向上する。光安定剤は、ヒンダードアミン系化合物が好ましい。具体的には、例えばコハク酸ジメチル−1−(2−ヒドロキシエチル)−4−ヒドロキシ−2,2,6,6−テトラメチルピペリジン重縮合物、ポリ[{6−(1,1,3,3−テトラメチルブチル)アミノ−1,3,5−トリアジン−2,4−ジイル}{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}ヘキサメチレン{{2,2,6,6−テトラメチル−4−ピペリジル)イミノ}]、N,N’−ビス(3−アミノプロピル)エチレンジアミン−2,4−ビス[N−ブチル−N−(1,2,2,6,6−ペンタメチル−4−ピペリジル)アミノ]−6−クロロ−1,3,5−トリアジン縮合物、ビス(2,2,6,6−テトラメチル−4−ピペリジル)セパレート、および2−(3,5−ジ−tert−4−ヒドロキシベンジル)−2−n−ブチルマロン酸ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)などが挙げられる。
光安定剤は、エチレン共重合体100重量部に対して、0.01〜3重量部配合するのが好ましい。
The light stabilizer is used for improving weather resistance, and when used in combination with an ultraviolet absorber, the weather resistance is further improved. The light stabilizer is preferably a hindered amine compound. Specifically, for example, dimethyl succinate-1- (2-hydroxyethyl) -4-hydroxy-2,2,6,6-tetramethylpiperidine polycondensate, poly [{6- (1,1,3,3 3-tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {{2,2,6 , 6-tetramethyl-4-piperidyl) imino}], N, N′-bis (3-aminopropyl) ethylenediamine-2,4-bis [N-butyl-N- (1,2,2,6,6). -Pentamethyl-4-piperidyl) amino] -6-chloro-1,3,5-triazine condensate, bis (2,2,6,6-tetramethyl-4-piperidyl) separate, and 2- (3,5 -Di-tert-4-hydroxybenze Bis-2-n-butylmalonate (1,2,2,6,6-pentamethyl-4-piperidyl) and the like.
The light stabilizer is preferably blended in an amount of 0.01 to 3 parts by weight with respect to 100 parts by weight of the ethylene copolymer.
前記酸化防止剤は、高温下での安定性を向上させるために使用する。酸化防止剤は、モノフェノール系化合物、ビスフェノール系化合物、高分子型フェノール系化合物、硫黄系化合物、燐酸系化合物等が好ましい。具体的には、例えば2,6−ジ−tert−ブチル−p−クレゾール、ブチル化ヒドロキシアニゾール、2,6−ジ−tert−ブチル−4−エチルフェノール、2,2’−メチレン−ビス−(4−メチル−6−tert−ブチルフェノール)、2,2’−メチレン−ビス−(4−エチル−6−tert−ブチルフェノール)、4,4’−チオビス−(3−メチル−6−tert−ブチルフェノール)、4,4’−ブチリデン−ビス−(3−メチル−6−tert−ブチルフェノール)、3,9−ビス〔{1,1−ジメチル−2−{β−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ}エチル}2,4,8,10−テトラオキサスピロ〕5,5−ウンデカン、1,1,3−トリス−(2−メチル−4−ヒドロキシ−5−tert−ブチルフェニル)ブタン、1,3,5−トリメチル−2,4,6−トリス(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)ベンゼン、テトラキス−{メチレン−3−(3’,5’−ジ−tert−ブチル−4’−ヒドロキスフェニル)プロピオネート}メタン、ビス{(3,3’−ビス−4’−ヒドロキシ−3’−tert−ブチルフェニル)ブチリックアシッド}グルコールエステル、ジラウリルチオジプロピオネート、ジミリスチルチオジプロピオネート、ジステアリルチオプロピオネート、トリフェニルホスファイト、ジフェニルイソデシルホスファイト、フェニルジイソデシルホスファイト、4,4’−ブチリデン−ビス−(3−メチル−6−tert−ブチルフェニル−ジ−トリデシル)ホスファイト、サイクリックネオペンタンテトライルビス(オクタデシルホスファイト)、トリスジフェニルホスファイト、ジイソデシノレペンタエリスリトールジホスファイト、9,10−ジヒドロ− 9 −オキサ−10−ホスファフェナスレン−10−オキサイド、10−(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)−9,10−ジヒドロ−9−オキサ−10−ホスファフェナンスレン−10−オキサイド、10−デシロキシ−9,10−ジヒドロ−9−オキサ−10−ホスファフェナンスレン、サイクリックネオペンタンテトライルビス(2,4−ジ−tert−ブチルフェニル)ホスファイト、サイクリックネオペンタンテトライルビス(2,6−ジ−tert−メチルフェニル)ホスファイト、および2,2−メチレンビス(4,6−tert−ブチルフェニル)オクチルホスファイト等が挙げられる。
酸化防止剤は、エチレン共重合体100重量部に対して、0.05〜3重量部配合するのが好ましい。
The said antioxidant is used in order to improve stability under high temperature. The antioxidant is preferably a monophenol compound, a bisphenol compound, a polymer phenol compound, a sulfur compound, a phosphoric acid compound, or the like. Specifically, for example, 2,6-di-tert-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-tert-butyl-4-ethylphenol, 2,2′-methylene-bis- (4-methyl-6-tert-butylphenol), 2,2'-methylene-bis- (4-ethyl-6-tert-butylphenol), 4,4'-thiobis- (3-methyl-6-tert-butylphenol) ), 4,4′-butylidene-bis- (3-methyl-6-tert-butylphenol), 3,9-bis [{1,1-dimethyl-2- {β- (3-tert-butyl-4- Hydroxy-5-methylphenyl) propionyloxy} ethyl} 2,4,8,10-tetraoxaspiro] 5,5-undecane, 1,1,3-tris- (2-methyl-4-hydro Ci-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, tetrakis- {methylene-3 -(3 ', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate} methane, bis {(3,3'-bis-4'-hydroxy-3'-tert-butylphenyl) butyric Acid} glycol ester, dilauryl thiodipropionate, dimyristyl thiodipropionate, distearyl thiopropionate, triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, 4,4′-butylidene- Bis- (3-methyl-6-tert-butylphenyl-di-tridecyl) phosphite, sa Crick neopentanetetrayl bis (octadecyl phosphite), trisdiphenyl phosphite, diisodecinorepentaerythritol diphosphite, 9,10-dihydro-9-oxa-10-phosphaphenalene-10-oxide, 10- (3,5-di-tert-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-decyloxy-9,10-dihydro-9 -Oxa-10-phosphaphenanthrene, cyclic neopentanetetraylbis (2,4-di-tert-butylphenyl) phosphite, cyclic neopentanetetraylbis (2,6-di-tert-methyl) Phenyl) phosphite and 2,2-methylenebis (4,6 -Tert-butylphenyl) octyl phosphite and the like.
The antioxidant is preferably added in an amount of 0.05 to 3 parts by weight with respect to 100 parts by weight of the ethylene copolymer.
本発明の太陽電池封止材用樹脂組成物は、エチレン共重合体とシリコアルミノリン酸塩とを一般的な高速せん断型混合機であるヘンシェルミキサーまたはスーパーミキサー等に投入し混合した後、二本ロール、三本ロール、加圧ニーダー、バンバリーミキサー、単軸混練押出し機または二軸混練押出し機等を用いて溶融混練を行いペレット状に押出し成形して得ることができる。また、前記溶融混錬後にシート状に加工した後、ペレット状に成形することもできる。 The resin composition for a solar cell encapsulant of the present invention is prepared by adding an ethylene copolymer and a silicoaluminophosphate to a general high-speed shear mixer, such as a Henschel mixer or a super mixer, and then mixing them. It can be obtained by melt-kneading using a main roll, three-roll, pressure kneader, Banbury mixer, single-screw kneading extruder or biaxial kneading extruder, and extruding into a pellet. Moreover, after processing into the sheet form after the said melt-kneading, it can also shape | mold into a pellet form.
本発明の太陽電池封止材は、前記太陽電池封止材用樹脂組成物または太陽電池封止材用マスターバッチをT−ダイ押出機、カレンダー成形機等の一般的な成形機を使用してシート状に成形することで製造できる。前記成形の際に、架橋剤、架橋助剤、シランカップリング剤、紫外線吸収剤、光安定剤および酸化防止剤を配合して成形することもできる。
前記封止材の厚みは、0.1〜2mm程度が好ましい。
The solar cell encapsulant of the present invention is obtained by using a general molding machine such as a T-die extruder, a calendar molding machine, etc., for the solar cell encapsulant resin composition or solar cell encapsulant masterbatch. It can be manufactured by molding into a sheet. In the molding, a crosslinking agent, a crosslinking assistant, a silane coupling agent, an ultraviolet absorber, a light stabilizer and an antioxidant can be blended and molded.
The thickness of the sealing material is preferably about 0.1 to 2 mm.
本発明の太陽電池モジュールの構成の一例を図1を用いて説明する。図1の太陽電池モジュールは、太陽側から表面保護ガラス11、太陽電池封止材12A、発電素子13、太陽電池封止材12B、裏面保護部材14の順に重ね、加熱・圧着することで製造できる。少なくとも太陽電池封止材12Aに本発明の太陽電池封止材を使用する。裏面保護部材14は、ガラス、またはアルミニウムをフッ化ビニルフィルムで挟んだ構成のシートまたはアルミニウムを耐加水分解性ポリエチレンテレフタレートフィルムで挟んだ構成のシート等が好ましい。また、加熱・加圧は、一般的には、真空ラミネーターを使用できる。なお本発明の太陽電池モジュールが図1の構成に限定されないことはいうまでも無い。
An example of the configuration of the solar cell module of the present invention will be described with reference to FIG. The solar cell module of FIG. 1 can be manufactured by stacking the surface
前記発電素子は、単結晶シリコン、多結晶シリコン、アモルファスシリコンなどのシリコン系、ガリウム−砒素、銅−インジウムーセレン、カドミウム−テルルなどのIII−V族やII−VI族化合物半導体系等の各種太陽電池素子を用いることができる。 The power generating element is made of silicon such as single crystal silicon, polycrystalline silicon, amorphous silicon, III-V group such as gallium-arsenic, copper-indium-selenium, cadmium-tellurium, II-VI group compound semiconductors, etc. Various solar cell elements can be used.
次に本発明の実施例を示して更に詳細を説明するが、本発明はこれらによって限定されるものではない。例中、「部」とは「重量部」、「%」とは「重量%」をそれぞれ意味するものとする。 EXAMPLES Next, although an Example of this invention is shown and it demonstrates still in detail, this invention is not limited by these. In the examples, “part” means “part by weight”, and “%” means “% by weight”.
実施例で使用した原料は、以下のとおりである。 The raw materials used in the examples are as follows.
<エチレン共重合体>
(A−1)EVA(酢酸ビニル含有量:28モル%、MFR:20g/10min)
(A−2)EVA(酢酸ビニル含有量:33モル%、MFR:14g/10min)
<フィラー>
(B−1)シリコアルミノリン酸塩(平均粒子径:5μm、一般式(1)のn=0.1、酸化アルミニウムからリン酸アルミニウムへモル数換算で45%転化した。)
(B−2)シリコアルミノリン酸塩(平均粒子径:50μm、一般式(1)のn=0.1、酸化アルミニウムからリン酸アルミニウムへモル数換算で45%転化した。)
(B−3)シリコアルミノリン酸塩(平均粒子径:100μm、一般式(1)のn=0.1、酸化アルミニウムからリン酸アルミニウムへモル数換算で45%転化した。)
(B−4)リン酸アルミニウム、平均粒子径:1μm
(B−5)含水カオリン、平均粒子径:0.4μm
(B−6)乾式カオリン、平均粒子径:0.8μm
(B−7)焼成カオリン、平均粒子径:4μm
<Ethylene copolymer>
(A-1) EVA (vinyl acetate content: 28 mol%, MFR: 20 g / 10 min)
(A-2) EVA (vinyl acetate content: 33 mol%, MFR: 14 g / 10 min)
<Filler>
(B-1) Silicoaluminophosphate (average particle size: 5 μm, n = 0.1 in the general formula (1), 45% conversion from aluminum oxide to aluminum phosphate in terms of moles)
(B-2) Silicoaluminophosphate (average particle size: 50 μm, n = 0.1 in the general formula (1), 45% conversion from aluminum oxide to aluminum phosphate in terms of moles)
(B-3) Silicoaluminophosphate (average particle size: 100 μm, n = 0.1 in the general formula (1), 45% conversion from aluminum oxide to aluminum phosphate in terms of moles)
(B-4) Aluminum phosphate, average particle size: 1 μm
(B-5) Hydrous kaolin, average particle size: 0.4 μm
(B-6) Dry kaolin, average particle size: 0.8 μm
(B-7) calcined kaolin, average particle size: 4 μm
(実施例1)
〔太陽電池封止材用マスターバッチの製造〕
(A−1)EVA 95部および(B−1)シリコアルミノリン酸塩 5部をスーパーミキサー(カワタ社製)に投入し、温度25℃、時間3分間の条件で撹拌して混合物を得た。次いで前記混合物を二軸押出し機(日本プラコン社製)に投入し、押し出し、ペレタイザーでカットすることで太陽電池封止材用マスターバッチを得た。
別途、(A−1)EVA 91.25部、光安定剤8.75部を使用して、上記同様の方法で安定化剤マスターバッチを得た。
また別途、(A−1)EVA 85部、架橋剤5部、架橋助剤5部、シランカップリング剤5部をスーパーミキサーに投入し、撹拌することで架橋剤マスターバッチを得た。
Example 1
[Manufacture of master batch for solar cell encapsulant]
(A-1) 95 parts of EVA and 5 parts of (B-1) silicoaluminophosphate were put into a super mixer (manufactured by Kawata) and stirred at a temperature of 25 ° C. for 3 minutes to obtain a mixture. . Next, the mixture was put into a twin screw extruder (manufactured by Nippon Placon Co., Ltd.), extruded, and cut with a pelletizer to obtain a master batch for a solar cell encapsulant.
Separately, using 91.25 parts of (A-1) EVA and 8.75 parts of light stabilizer, a stabilizer masterbatch was obtained in the same manner as described above.
Separately, 85 parts of (A-1) EVA, 5 parts of a crosslinking agent, 5 parts of a crosslinking aid, and 5 parts of a silane coupling agent were added to a super mixer and stirred to obtain a crosslinking agent master batch.
〔太陽電池封止材樹脂組成物の製造〕
得られた太陽電池封止材用マスターバッチ、安定化剤マスターバッチ、架橋剤マスターバッチ、および(A−1)EVAを用いて、(A−1)EVAが99.9部、(B−1)シリコアルミノリン酸塩が0.1部の比率の混合物を得た。次いで前記混合物をT−ダイ押出機に投入し温度110℃でシート状に押出し成形することで厚さ0.5mmの太陽電池封止材を作製した。なお、太陽電池封止材が含む原料は下記の通りであり、原料の配合量は、EVA 100重量部に対して、以下の量になるように配合している。
・原料
架橋剤:2,5−ジメチル−2,5−ジ(tert-ブチルパーオキシ)ヘキサン 0.6部
架橋助剤:トリアリルイソシアヌレート 0.6部
シランカップリング剤:γ−メタクリロキシプロピルトリメトキシシラン 0.6部
光安定剤:N,N’−ビス(3−アミノプロピル)エチレンジアミン−2,4−ビス[N−ブチル−N−(1,2,2,6,6−ペンタメチル−4−ピペリジル)アミノ]−6−クロロ−1,3,5−トリアジン縮合物 0.4部
[Manufacture of solar cell encapsulant resin composition]
Using the obtained solar cell encapsulant masterbatch, stabilizer masterbatch, crosslinker masterbatch, and (A-1) EVA, (A-1) EVA was 99.9 parts, (B-1 ) A mixture with a ratio of 0.1 part of silicoaluminophosphate was obtained. Next, the mixture was put into a T-die extruder and extruded into a sheet at a temperature of 110 ° C. to prepare a solar cell sealing material having a thickness of 0.5 mm. In addition, the raw material which a solar cell sealing material contains is as follows, and the compounding quantity of a raw material is mix | blended so that it may become the following quantity with respect to 100 weight part of EVA.
・ Raw material cross-linking agent: 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane 0.6 part Cross-linking aid: triallyl isocyanurate 0.6 part Silane coupling agent: γ-methacryloxypropyl Trimethoxysilane 0.6 part Light stabilizer: N, N′-bis (3-aminopropyl) ethylenediamine-2,4-bis [N-butyl-N- (1,2,2,6,6-pentamethyl- 4-piperidyl) amino] -6-chloro-1,3,5-triazine condensate 0.4 part
〔太陽電池モジュールの製造〕
得られた太陽電池封止材から太陽電池封止材12Aおよび太陽電池封止材12Bを準備し、前記太陽電池封止材12A、発電素子13、太陽電池封止材12Bの順に重ね、さらに図1に示すように厚さ3mmの表面保護ガラス11および裏面保護部材14を使用して積層した後、真空ラミネーターに投入し、真空下、145℃17分間の条件で加熱及び加圧し、封止材を架橋させることで太陽電池モジュールを作製した。なお、真空ラミネーターは、LM−50×50−S(エヌ・ピー・シー社製)を使用した。
[Manufacture of solar cell modules]
A
(実施例2〜12、比較例1〜5)
エチレン共重合体およびフィラーを表1および表2の原料と配合量に変更した以外は、実施例1と同様の行うことでそれぞれ実施例2〜12および比較例1〜5の太陽電池封止材、ならびに太陽電池モジュールを得た。
(Examples 2 to 12, Comparative Examples 1 to 5)
Except having changed the ethylene copolymer and the filler to the raw materials and blending amounts shown in Tables 1 and 2, the solar cell encapsulants of Examples 2 to 12 and Comparative Examples 1 to 5 are the same as in Example 1, respectively. The solar cell module was obtained.
〔外観評価〕
得られた太陽電池封止材を前記真空ラミネーターを使用して、上記同様の条件で加熱加圧することで封止材を架橋することで試料とした。得られた試料について、ヘーズメーター(BYK Gardner社製)を使用して全光線透過率およびHAZEを測定することで外観を評価した。
[Appearance evaluation]
The obtained solar cell encapsulant was used as a sample by crosslinking the encapsulant by heating and pressing under the same conditions as described above using the vacuum laminator. About the obtained sample, the external appearance was evaluated by measuring a total light transmittance and HAZE using a haze meter (made by BYK Gardner).
[剥離強度]
剥離強度を測定することで密着性を評価した。
まず測定試料の作成方法について図2を示して説明する。得られた太陽電池封止材から太陽電池封止材22を準備した。図2に示すように厚さ3mmのガラス板21、太陽電池封止材22、剥離処理面を下面に向けた剥離性シート23、および厚さ100μmのポリエチレンテレフタレートフィルムシート24を順次重ね積層体とした。前記積層体を前記真空ラミネーターを使用して、上記同様の条件で加熱加圧することで封止材を架橋した。なお、剥離性シートは積層体全長の半分の長さであり、積層体の全長の60%部分について、ポリエチレンテレフタレートフィルムシート24は、太陽電池封止材22と密着していない。
次いで、前記積層体を幅1cm幅の短冊状に切り取り試料とした。前記試料を温度23℃、湿度50%RH環境下に24時間静置した後、剥離速度100mm/min、剥離角180°の条件で剥離強度を測定した。なお図2の上側を上面、下側を下面とする。なお剥離強度の測定はJIS K 6854−2に準拠した。
[Peel strength]
The adhesion was evaluated by measuring the peel strength.
First, a method for preparing a measurement sample will be described with reference to FIG. A solar cell sealing material 22 was prepared from the obtained solar cell sealing material. As shown in FIG. 2, a 3 mm thick glass plate 21, a solar cell sealing material 22, a peelable sheet 23 with a peeled surface facing the bottom surface, and a 100 μm thick polyethylene terephthalate film sheet 24 are sequentially stacked and laminated. did. The laminate was crosslinked by heating and pressing the laminate under the same conditions as described above using the vacuum laminator. The peelable sheet is half the total length of the laminate, and the polyethylene terephthalate film sheet 24 is not in close contact with the solar cell sealing material 22 for 60% of the total length of the laminate.
Next, the laminate was cut into a strip shape having a width of 1 cm and used as a sample. The sample was allowed to stand for 24 hours in an environment of a temperature of 23 ° C. and a humidity of 50% RH, and then the peel strength was measured under the conditions of a peel rate of 100 mm / min and a peel angle of 180 °. In FIG. 2, the upper side is the upper surface and the lower side is the lower surface. The peel strength was measured according to JIS K 6854-2.
〔体積抵抗率〕
得られた太陽電池封止材を前記真空ラミネーターを使用して、上記同様の条件で加熱加圧することで封止材を架橋することで試料とした。前記試料についてデジタル超高抵抗/微少電流計 R8340(アドバンテスト社製)を使用して、体積抵抗率を測定した。
[Volume resistivity]
The obtained solar cell encapsulant was used as a sample by crosslinking the encapsulant by heating and pressing under the same conditions as described above using the vacuum laminator. The volume resistivity of the sample was measured using a digital ultrahigh resistance / microammeter R8340 (manufactured by Advantest).
〔変換効率保持率〕
太陽電池モジュールについて、まずI−V特性を測定し、初期変換効率を算出した後、前記太陽電池モジュールを85℃85%RHに設定した恒温恒湿試験機に投入し1000時間静置を行い、前記初期変換効率と同様に変換効率を算出した。次いで、前記太陽電池モジュールを前記恒温恒湿試験機に投入し同条件でさら1000時間静置を行い前記初期変換効率と同様に変換効率を算出した。なお、変換効率は、入光エネルギーとI−V特性測定から算出した最大出力(Pm)と、発電素子の面積から算出した。評価は初期変換効率を100とし、太陽電池モジュールの85℃85%RH経時試験後(1000時間後、2000時間後)の変換効率に対する初期変換効率の割合から変換効率保持率とした。I−V特性の測定には、株式会社ウシオスペックス製太陽電池用ソーラシミュレータ MS−180AAA及びDENKEN製太陽電池特性検査テスター DKPVT−30を使用した。また、I−V特性の測定で得られたIsc(短絡電流)41は、図4に示したI−V特性のグラフにおける電圧が0V時の電流値を示す。またVoc(開放電圧)42は、電流値が0A時の電圧値を示し、Pm(最大出力)43は、電流値と電圧値の積の最大値を示している。
[Conversion efficiency retention]
For the solar cell module, first, the IV characteristics were measured and the initial conversion efficiency was calculated. Then, the solar cell module was put into a constant temperature and humidity tester set at 85 ° C. and 85% RH and left for 1000 hours, The conversion efficiency was calculated in the same manner as the initial conversion efficiency. Next, the solar cell module was put into the constant temperature and humidity tester and allowed to stand for 1000 hours under the same conditions, and the conversion efficiency was calculated in the same manner as the initial conversion efficiency. The conversion efficiency was calculated from the incident energy and the maximum output (Pm) calculated from the IV characteristic measurement and the area of the power generation element. In the evaluation, the initial conversion efficiency was set to 100, and the conversion efficiency retention was determined from the ratio of the initial conversion efficiency to the conversion efficiency after the 85 ° C. and 85% RH aging test of the solar cell module (after 1000 hours and after 2000 hours). For the measurement of the IV characteristics, solar simulator solar simulator MS-180AAA manufactured by USHIO SPEX CO., LTD. And DENKEN solar cell characteristics inspection tester DXPVT-30 were used. Further, Isc (short-circuit current) 41 obtained by measuring the IV characteristic indicates a current value when the voltage in the graph of the IV characteristic shown in FIG. 4 is 0V. Voc (open voltage) 42 indicates the voltage value when the current value is 0 A, and Pm (maximum output) 43 indicates the maximum product of the current value and the voltage value.
〔耐PID性〕
PID試験を以下の方法で行い耐PID性を評価した。結果は表4に示す。
まず、図3に示す太陽電池モジュールを作製した。具体的には、厚さ3mmの表面保護ガラス31、太陽電池封止材32A、発電素子33、太陽電池封止材32B、裏面保護部材34の順に重ね、前記真空ラミネーターを使用して前記同様の条件で加熱圧着して太陽電池モジュールを得て、さらに金属フレーム35に固定した。次いで、図3の通りプラス出力端子及びマイナス出力端子を発電素子にマイナス極、金属フレーム35をプラス極として配線することで試料を作成した。そして試験前の試料について初期としてI−V特性(IscおよびPm)ならびに漏れ電流を測定し、初期の漏れ電流は全ての実施例及び比較例において、0Aであることを確認した。
なお、I−V特性は、太陽電池用ソーラシミュレータ MS−180AAA(ウシオスペックス社製)及び太陽電池特性検査テスター DKPVT−30(DENKEN社製)を使用して測定した。
また漏れ電流は、図3のように発電素子をマイナス極、金属フレーム35をプラス極として出力端子を設置し、1000Vの電圧を印加することで金属フレーム35から封止材を通り、発電素子へと流れる電流値を測定した。
次いで、前記試料を下記条件でPID試験を行い試験後のI−V特性および漏れ電流を測定した。Pm保持率=(初期のPm値/試験後のPm値)×100
・試験条件
温度60℃、湿度85%RH環境下、印加電圧:1000Vで96時間経時した。
なお、前記測定は、PID現象を促進させるために、表面保護ガラスを水で覆い、発電素子と表面保護ガラスとの電位差をより高くした上で行った。
[PID resistance]
The PID resistance was evaluated by the following method. The results are shown in Table 4.
First, the solar cell module shown in FIG. 3 was produced. Specifically, a surface
The IV characteristics were measured using a solar cell solar simulator MS-180AAA (manufactured by Ushio Spex) and a solar cell characteristic inspection tester DXPVT-30 (manufactured by DENKEN).
In addition, as shown in FIG. 3, the leakage current is generated by setting the power generation element as a negative pole and the
Next, the sample was subjected to a PID test under the following conditions, and the IV characteristics and leakage current after the test were measured. Pm retention rate = (initial Pm value / Pm value after test) × 100
Test conditions: A temperature of 60 ° C. and a humidity of 85% RH, and an applied voltage of 1000 V for 96 hours.
In addition, in order to promote the PID phenomenon, the measurement was performed after covering the surface protective glass with water and increasing the potential difference between the power generation element and the surface protective glass.
11:表面保護ガラス
12A:太陽電池封止材
12B:太陽電池封止材
13:発電素子
14:裏面保護部材
21:ガラス板
22:太陽電池封止材
23:剥離性シート
24:ポリエチレンテレフタレートシート
31:表面保護ガラス
32A:太陽電池封止材
32B:太陽電池封止材
33:発電素子
34:裏面保護部材
35:金属フレーム
41:Isc短絡電流
42:Voc開放電圧
43:Pm最大出力
11:
Claims (6)
前記シリコアルミノリン酸塩は、下記一般式(1)で表す組成を満たす比率のケイ酸成分とアルミニウム成分を有する非晶質ケイ酸アルミニウムをリン酸で処理してなる化合物であり、
一般式(1) SiO 2 ・nAl 2 O 3
(ただし、nは0.001〜0.5)
上記一般式(1)の酸化アルミニウム成分の10〜99.9モル%がリン酸アルミニウムに転化していることを特徴とする、太陽電池封止材用樹脂組成物。 Ethylene copolymer and the silicoaluminophosphate seen including,
The silicoaluminophosphate is a compound obtained by treating amorphous aluminum silicate having a ratio of a silicate component and an aluminum component satisfying the composition represented by the following general formula (1) with phosphoric acid,
General formula (1) SiO 2 · nAl 2 O 3
(However, n is 0.001 to 0.5)
A resin composition for a solar cell sealing material, wherein 10 to 99.9 mol% of the aluminum oxide component of the general formula (1) is converted into aluminum phosphate .
前記シリコアルミノリン酸塩は、下記一般式(1)で表す組成を満たす比率のケイ酸成分とアルミニウム成分を有する非晶質ケイ酸アルミニウムをリン酸で処理してなる化合物であり、
一般式(1) SiO 2 ・nAl 2 O 3
(ただし、nは0.001〜0.5)
上記一般式(1)の酸化アルミニウム成分の10〜99.9モル%がリン酸アルミニウムに転化してなり、
前記エチレン共重合体100重量部に対して前記シリコアルミノリン酸塩を1〜20重量部含有する太陽電池封止材用マスターバッチ。 Including an ethylene copolymer and silicoaluminophosphate,
The silicoaluminophosphate is a compound obtained by treating amorphous aluminum silicate having a ratio of a silicate component and an aluminum component satisfying the composition represented by the following general formula (1) with phosphoric acid,
General formula (1) SiO 2 · nAl 2 O 3
(However, n is 0.001 to 0.5)
10-99.9 mol% of the aluminum oxide component of the general formula (1) is converted into aluminum phosphate,
The masterbatch for solar cell sealing materials which contains 1-20 weight part of said silicoaluminophosphate with respect to 100 weight part of said ethylene copolymers.
The solar cell module provided with the solar cell sealing material of Claim 5 .
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CN107793628A (en) * | 2016-08-29 | 2018-03-13 | 住友化学株式会社 | Method for the masterbatch of solar cell sealing plate and for manufacturing solar cell sealing plate |
KR20220056205A (en) * | 2019-08-30 | 2022-05-04 | 다우 글로벌 테크놀로지스 엘엘씨 | Encapsulant film for photovoltaic power generation containing fumed alumina |
CN112824468B (en) * | 2019-11-19 | 2022-12-30 | 杭州福斯特应用材料股份有限公司 | Composition for forming PID (potential induced degradation) -resistant packaging adhesive film, PID-resistant packaging adhesive film and solar module |
KR20240080494A (en) | 2022-11-30 | 2024-06-07 | 롯데케미칼 주식회사 | Ethylene alpha-olefin copolymer, resin composition for encapsulant of solar cell comprising the same and encapsulant for solar cell prepared using the same |
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JP2011125847A (en) * | 2009-11-19 | 2011-06-30 | Ibiden Co Ltd | Honeycomb structure and method for producing the same |
WO2013150730A1 (en) * | 2012-04-06 | 2013-10-10 | 三井化学東セロ株式会社 | Solar cell module |
JP2013211452A (en) * | 2012-03-30 | 2013-10-10 | Mitsubishi Plastics Inc | Sealing material for solar cell and solar cell module using the same |
WO2013176227A1 (en) * | 2012-05-24 | 2013-11-28 | 東ソー株式会社 | Silicoaluminophosphate, method for producing same, and solid acid catalyst comprising same |
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2013
- 2013-12-27 JP JP2013271090A patent/JP5565520B1/en active Active
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- 2014-12-15 KR KR1020140180063A patent/KR20150077305A/en not_active Application Discontinuation
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JP2011125847A (en) * | 2009-11-19 | 2011-06-30 | Ibiden Co Ltd | Honeycomb structure and method for producing the same |
JP2013211452A (en) * | 2012-03-30 | 2013-10-10 | Mitsubishi Plastics Inc | Sealing material for solar cell and solar cell module using the same |
WO2013150730A1 (en) * | 2012-04-06 | 2013-10-10 | 三井化学東セロ株式会社 | Solar cell module |
WO2013176227A1 (en) * | 2012-05-24 | 2013-11-28 | 東ソー株式会社 | Silicoaluminophosphate, method for producing same, and solid acid catalyst comprising same |
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JP2016092354A (en) * | 2014-11-11 | 2016-05-23 | 凸版印刷株式会社 | Seal film for solar battery and solar battery module |
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CN104744793A (en) | 2015-07-01 |
CN104744793B (en) | 2018-10-02 |
JP2015126170A (en) | 2015-07-06 |
KR20150077305A (en) | 2015-07-07 |
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