JP5565198B2 - Circuit composition adhesive injection device and circuit composition adhesive injection method - Google Patents

Description

  The present invention relates to an adhesive injection device for a circuit component and an adhesive injection method for a circuit component.

  As a method of forming a three-dimensional semiconductor integrated circuit, a plurality of semiconductor wafers on which integrated circuits are formed are stacked with a gap between them, and an adhesive is injected into the gap to form one three-dimensional integrated semiconductor wafer. A method of configuring is known. In the three-dimensional integrated semiconductor wafer produced by this method, connection bumps connected to the integrated circuit of each semiconductor wafer are provided between adjacent semiconductor wafers, and the connection bumps of adjacent semiconductor wafers are joined together. It is formed.

The adhesive is injected into the gap between the laminated semiconductor wafers by placing the laminated semiconductor wafer in the chamber and evacuating the adhesive inlet of the laminated semiconductor wafer in the adhesive while the chamber is evacuated. Is performed by returning the pressure to atmospheric pressure.
In this case, since the pressure in the gap between the laminated semiconductor wafers is lower than the atmospheric pressure, the adhesive is injected into the gap between the laminated semiconductor wafers by the vacuum differential pressure and the capillary action by setting the inside of the chamber to atmospheric pressure (for example, , See Patent Document 1).

Japanese Patent Laid-Open No. 11-261001

  However, the semiconductor wafer absorbs ambient gas during storage after manufacture. For this reason, in the step of injecting the adhesive into the gap between the stacked semiconductor wafers by the above method, the gas absorbed from each semiconductor wafer is released, and the pressure of the gap between the stacked semiconductor wafers is increased by this released gas. Due to the increase in the pressure in the gap between the laminated semiconductor wafers, it is difficult to completely inject the adhesive into the entire area of the gap between the laminated semiconductor wafers.

Adhesive injection device of the circuit structure of the invention according to claim 1 comprises a chamber for accommodating the adhesive container circuit component and the adhesive is housed with adhesive injection region, adhesive injection area from the circuit structure A discharge gas discharge means for deriving the gas released into the chamber from the inside, a decompression means for reducing the pressure in the chamber, and an adhesive injection means for injecting the adhesive into the adhesive injection region of the circuit structure the gas discharged from the chamber by emitting gas discharge means, after reducing the pressure in the chamber by vacuum means, comprising a control means for starting the injection of the adhesive into the adhesive injection region of the circuit structure, the release The gas discharge means includes a purge means for introducing an inert gas into the chamber and purging the gas released from the circuit structure into the adhesive injection region .
According to a second aspect of the present invention, there is provided an apparatus for injecting an adhesive for a circuit component, including a circuit component having an adhesive injection region and a chamber for storing an adhesive container storing the adhesive, and an adhesive injection region from the circuit component. A discharge gas discharge means for deriving the gas released into the chamber from the inside, a decompression means for reducing the pressure in the chamber, and an adhesive injection means for injecting the adhesive into the adhesive injection region of the circuit structure And a control means for starting the injection of the adhesive into the adhesive injection region of the circuit component after the gas is discharged from the chamber by the discharge gas discharge means and the pressure in the chamber is reduced by the pressure reduction means. The gas discharging means includes a heating means for heating the circuit structure and a temperature control means for controlling the heating means to a temperature range suitable for the circuit structure to release gas into the adhesive injection region.
According to a third aspect of the present invention, there is provided an apparatus for injecting an adhesive for a circuit structure, comprising: a circuit structure having an adhesive injection region; a chamber for storing an adhesive container containing the adhesive; and an adhesive injection region from the circuit structure. A discharge gas discharge means for deriving the gas released into the chamber from the inside, a decompression means for reducing the pressure in the chamber, and an adhesive injection means for injecting the adhesive into the adhesive injection region of the circuit structure And a control means for starting the injection of the adhesive into the adhesive injection region of the circuit component after the gas is discharged from the chamber by the discharge gas discharge means and the pressure in the chamber is reduced by the pressure reduction means. The gas discharge means includes a purge means for introducing an inert gas into the chamber and purging the gas released from the circuit structure into the chamber, a heating means for heating the circuit structure, and a heating means. Body, characterized in that it comprises a temperature control means for controlling the temperature range suitable for releasing gas into the adhesive injection region.
According to a sixth aspect of the present invention, there is provided an apparatus for injecting an adhesive for a circuit structure, comprising: a chamber for storing a circuit structure having an adhesive injection area; and a gas released from the circuit structure into the adhesive injection area. An exhaust chamber having discharge gas discharge means led out to the outside, an adhesive injection chamber for injecting the adhesive by bringing at least a part of the adhesive injection region of the circuit component conveyed from the exhaust chamber into contact with the adhesive, The adhesive injection chamber includes a first adhesive injection chamber that starts injection by bringing at least a part of the adhesive injection region of the circuit structure into contact with the adhesive, and the first adhesive injection chamber. It includes a second adhesive injection chamber for injecting adhesive into an uninjected area of the adhesive injection area following the adhesive injection process .

In the method for injecting an adhesive for a circuit component according to the present invention, after the pressure in the adhesive injection region of the circuit component disposed in the chamber is reduced together with the inside of the chamber, the injection of the adhesive into the adhesive injection region is started. In the method of injecting an adhesive for a circuit structure, the process is performed before the pressure in the chamber is reduced to start the injection of the adhesive, and the gas released from the circuit structure into the adhesive injection region is led out of the chamber. The discharge gas discharge step includes a purge step of introducing an inert gas into the chamber and purging the gas released from the circuit structure into the adhesive injection region. .

  According to the present invention, since the gas released from the circuit structure into the adhesive injection region is led out of the chamber, the injection of the adhesive into the adhesive injection region is ensured.

Sectional drawing which shows 1st Embodiment of the adhesive injection apparatus of the circuit structure of this invention, and shows the state before injection | pouring of an adhesive agent. Sectional drawing which shows the state which inject | pours an adhesive agent in the adhesive agent injection apparatus of the circuit structure shown by FIG. The circuit block diagram of the adhesive injection apparatus of the circuit structure shown by FIG. The exploded view for demonstrating the method of forming a circuit structure. Sectional drawing of a circuit structure. Sectional drawing of the circuit structure which shows the injection completion state of an adhesive agent. The top view of a part of circuit element body which shows the state which sealed the circumference | surroundings of the circuit structure body. The flowchart which shows 1st Embodiment of the adhesive agent injection | pouring method of the circuit structure of this invention. The chamber pressure time relational diagram showing the relationship between the chamber pressure and time. The chamber pressure-time relation diagram showing the relationship between the chamber pressure and time, and showing an example different from FIG. The chamber pressure-time relation diagram showing the relationship between the chamber pressure and time, and showing still another example of FIG. The flowchart which shows the modification of 1st Embodiment which concerns on the adhesive agent injection | pouring method of the circuit structure of FIG. The chamber internal pressure and heating temperature time relationship figure which shows the relationship between chamber internal pressure and time, and heating temperature and time. FIG. 14 is a relationship diagram of pressure in a chamber and time of heating temperature showing another example different from FIG. The flowchart which shows 2nd Embodiment of the adhesive agent injection method of the circuit structure of this invention. The chamber internal pressure and heating temperature time relationship figure which shows the relationship between the chamber internal pressure and time, temperature, and time concerning the modification of 2nd Embodiment of the adhesive agent injection method of the circuit structure of this invention. FIG. 17 is a relationship diagram between chamber pressure and heating temperature time, showing an example different from FIG. 16. The flowchart which concerns on the modification of 2nd Embodiment of the adhesive agent injection method of the circuit structure of this invention. The schematic of the apparatus cross section which shows the structure of the adhesive agent injection apparatus of the circuit structure of this invention.

  This was realized by deriving the gas released from the circuit structure into the chamber before the injection of the adhesive was started by reducing the pressure inside the chamber.

(First embodiment)
Hereinafter, a first embodiment of an adhesive injection device for a circuit component and an adhesive injection method for a circuit component according to the present invention will be described.
1 and 2 are sectional views showing a first embodiment of an adhesive injection device for a circuit component according to the present invention. FIG. 1 shows a state before the adhesive is injected, and FIG. 2 shows an adhesive. The state which is injecting is shown.
The injection device 10 has a wall portion 10B, and has a chamber 10A that is surrounded by the wall portion 10B and can be sealed from the outside. In the chamber 10A, an elevating mechanism 15 including a base 11, a shaft 12, and an elevating drive unit 13 is provided. The shaft 12 can be extended and retracted from the support portion 12, and the base 11 provided integrally with the shaft 12 can be raised and lowered. A heater 16 is provided in the chamber 10A.

The injection apparatus 10 is provided with an evacuation system 20 that evacuates the chamber 10A through the wall 10B, a gas introduction system 30 that introduces gas into the chamber 10A, and an adhesive introduction system 40 that introduces an adhesive. It has been.
The vacuum exhaust system 20 includes a pipe 21, an exhaust stop valve 22, an exhaust flow rate adjustment valve 23, and a vacuum pump 24. By driving the vacuum pump 24 and opening the exhaust stop valve 22 and the exhaust flow rate adjustment valve 23, the inside of the chamber 10 </ b> A can be decompressed via the pipe 21.
The gas introduction system 30 includes a pipe 31, an introduction stop valve 22, and an introduction flow rate adjustment valve 33. The introduction stop valve 32 and the introduction flow rate adjustment valve 33 are opened, and the inert gas can be introduced into the chamber 10A from the outside.

The adhesive introduction system 40 includes a pipe 41, a supply stop valve 42, and a supply flow rate adjustment valve 43.
Reference numeral 45 denotes an adhesive tank in which the adhesive 44 is accommodated, and one end 41 a of the pipe 41 of the adhesive introduction system 40 extends into the adhesive 44 accommodated in the adhesive tank 45. The other end 41b of the pipe 41 is introduced into the chamber 10A.
An adhesive container 46 in which an adhesive 44 a is stored is mounted on the base 11 of the lifting mechanism 15. Although not shown, a supply device such as a pump is connected to the pipe 41, the supply stop valve 42 and the supply flow rate adjustment valve 43 are opened, and the adhesive 44 accommodated in the adhesive tank 45 is placed in the chamber 10A. It is possible to supply in an adhesive container 46 arranged in

A circuit structure 50 is arranged above the adhesive container 46. The circuit structure 50 is supported by the holder 17. Although not shown, the holder 17 is held at a predetermined position in the chamber 10A by a fixing member attached to the wall surface 10B of the injection device 10, thereby bringing the circuit component 10 to a predetermined position above the lifting mechanism 15. Hold.
As shown in FIG. 7 which is an enlarged plan view of a part of the circuit structure 50, a sealing material 52 is provided on almost the entire outer periphery, and a sealing material 52 is provided on a part of the outer periphery. An unfilled inlet 51 is formed.

4 and 5 are cross-sectional views for explaining the structure and forming method of the circuit structure 50.
The circuit configuration body 50 is configured by stacking circuit element bodies 53, 54, and 55. The circuit element body 53 includes a semiconductor substrate 56 such as a silicon wafer, and an integrated circuit including a MOS transistor 57 having a gate G, a drain D, and a source S and a connection terminal portion 57a on the upper surface side of the semiconductor substrate 56. Is formed.
In each of the circuit element bodies 54 and 55, an integrated circuit including a MOS transistor 57 having a gate G, a drain D, and a source S is formed on a semiconductor substrate 56A such as a silicon wafer. The circuit element bodies 54 and 55 are formed with a plurality of connection wirings 58 formed in a direction perpendicular to the main surface of the semiconductor substrate 56A. Each connection wiring 58 has a connection terminal portion 58a protruding downward from the bottom surface of the semiconductor substrate 56A.

Similarly to the circuit element body 53, the circuit element bodies 54 and 55 are formed by forming an integrated circuit on the semiconductor substrate 56, and then removing the bottom surface of the semiconductor substrate 56 by an appropriate method such as polishing or etching. It is obtained by forming.
Then, the circuit element body 54 is mounted on the circuit element body 53 by aligning the connection terminal portions 57a and 58a, and the both terminal portions are joined. Also, the circuit element body 55 is mounted on the circuit element body 54. The connecting terminal portions 58a of both members are aligned and joined.

In this way, as shown in FIG. 5, in the circuit configuration body 50, the connection terminal portion 57a and the connection terminal portion 58a are interposed between the circuit element bodies 53-54 and 54-55. And the gap becomes the adhesive injection region 50A.
Thereafter, a sealing material 52 in which an injection port 51 is opened is formed around the circuit structure 50. The sealing structure is formed by immersing the circuit component 50 in a resin and then removing the portion that becomes the injection port 51, or forming the sealing material 52 having the injection port 51 by printing, an inkjet method, or the like. Alternatively, it can be formed by an appropriate method such as attaching an adhesive seal.

  The adhesive container in which the adhesive 44a is accommodated is lifted by the lifting mechanism 15 from the state illustrated in FIG. 1 located below the circuit component 50, and the circuit component 50 illustrated in FIG. It is possible to contact the inlet 51, and in this state, the adhesive 44a is injected into the adhesive injection region 50A of the circuit structure 50.

FIG. 3 is a circuit block diagram of the adhesive injection device for the circuit structure shown in FIG.
The control unit 81 controls the operation timing of the vacuum drive unit 82 that drives the vacuum pump 24 of the vacuum exhaust system 20. Further, the exhaust stop valve 22 is opened and closed, and the vacuum exhaust system 83 that adjusts the opening and closing amount of the exhaust flow rate adjustment valve 23 is controlled to make the inside of the chamber 10A have a predetermined degree of vacuum. Further, the gas introduction system adjusting unit 84 that opens and closes the introduction stop valve 32 of the gas introduction system 40 and adjusts the opening and closing amount of the introduction flow rate adjustment valve 33 is controlled. Further, the control unit 81 controls a heater temperature control unit 85 that controls the heating temperature by the heater 16.

An adhesive supply drive unit 86a for driving a pump (not shown) for supplying the adhesive 44 to the adhesive container 46 is controlled by an adhesive supply drive control unit 86, and the adhesive supply drive control unit 86 is The operation timing is controlled by the control unit 81. The elevating mechanism drive unit 87 a that drives the elevating mechanism 15 is controlled to be driven by the elevating mechanism drive control unit 87, and the operation timing of the elevating mechanism drive control unit 87 is controlled by the control unit 81.
Further, as will be described later, the control unit 81 drives a counter 91 that counts the number of operations of the evacuation system 20.

FIG. 8 is a flowchart showing an adhesive injection procedure of the circuit structure according to the first embodiment, and the operation thereof will be described below together with the flowchart of FIG.
First, as illustrated in FIG. 1, an adhesive container 46 in which an adhesive 44 a is stored is mounted on the base 11 of the elevating mechanism 15 in the chamber 10 </ b> A. The inlet (not shown) formed by opening the wall surface 10B of the injection apparatus 10 is opened, and the circuit structure 50 is placed in the chamber 10A (step S11). The holder 17 may be installed in the chamber 10A, and the circuit component 50 in which the sealing material 52 is previously formed on the outer periphery may be attached to the holder 17 installed in the chamber 10A. The circuit structure 50 may be attached to the holder 17 and the holder 17 may be attached to a fixing member fixed to the wall surface 10B of the injection device 10 in the chamber 10A.

  In step S12, the exhaust stop valve 22 and the exhaust flow rate adjustment valve 23 of the vacuum exhaust system 20 are opened, and the vacuum pumping is started to drive the vacuum pump 24 to evacuate the chamber 10A. In step S13, although not shown, the counter 91 that holds the number of evacuations N is incremented by 1, and the number of evacuations N is updated to N + 1. Then, in step S14, it is determined whether or not the updated number of evacuation times N is equal to or greater than a predetermined value k set in advance. If No, the process of step S15 is performed, and if Yes, the process of step S21 is performed. .

If the updated number of evacuations N is less than the predetermined value k, it is determined in step S15 whether or not the degree of vacuum in the chamber 10A has reached a predetermined low pressure. If No in step S15, evacuation is continued. When the degree of vacuum reaches a predetermined low pressure, for example, about 10 Pa, purging is started in step S16. That is, the introduction stop valve 32 of the gas introduction system 30 is opened, and an inert gas such as N ₂ (nitrogen) gas is introduced into the chamber 10A at the opening degree of the introduction flow rate adjustment valve 33. In this case, the exhaust stop valve 22 and the exhaust flow rate adjustment valve 23 of the vacuum exhaust system 20 are kept open.

  When the inert gas is introduced, the pressure in the chamber 10A increases. For this reason, the gas released from the circuit structure 50 to the adhesive injection region 50A is diluted with the introduced inert gas. That is, the purge is started. In this purge, purging and evacuation are continued until it is determined in step S17 that a predetermined high pressure has been reached. The above control can also be performed with the exhaust stop valve 22 and the exhaust flow rate adjustment valve 23 opened.

  If it is determined in step S18 that the predetermined high pressure has been reached, the introduction stop valve 32 of the gas introduction system 30 is closed, and the process returns to step S13. And the process of step S13-step S18 is repeated. If it is determined that the number of times of vacuuming N updated in step S15 has reached the predetermined value k, injection of the adhesive 44a is started in step S21. That is, the adhesive container 46 is raised by the elevating mechanism 15, and the inlet 51 of the circuit component 50 is brought into contact with the adhesive 44a.

FIG. 9 is a chamber pressure-time relationship diagram showing the relationship between the pressure in the chamber 10A and time.
The pressure in the chamber 10A is reduced by the processing from step S12 to step S15. If it is determined in step S15 that the pressure in the chamber 10A has reached a predetermined pressure, purging is started in step S16, and the chamber internal pressure 10A increases to approach atmospheric pressure. When the pressure in the chamber 10A reaches a predetermined high atmospheric pressure, the decompression process is started again, and thereafter the decompression and the purge are repeated. By this action, the gas released from the circuit structure 50 to the adhesive injection region 50A is discharged to the outside of the chamber 10A.

Then, when the updated number of evacuations N reaches a predetermined value k set in advance, for example, in the example shown in FIG. 9, k = 4. Injection of the adhesive 44a in S21 is started.
In FIG. 9, the purge is illustrated as being switched to evacuation while the pressure in the chamber 10A is lower than atmospheric pressure (ATM). However, the pressure in the chamber 10A for switching to evacuation is set to substantially the same pressure as the atmospheric pressure as shown in FIG. 10, or to a pressure higher than the atmospheric pressure as shown in FIG. Can be.

  In addition, in FIGS. 9 to 11, the predetermined value k of the number of times of vacuuming before moving to the adhesive injection process is shown in the case of k = 4 in all cases, but this predetermined value k is 2 or more. Any timing can be set after the timing indicated by the circles in FIGS.

  In the adhesive injection start process, the elevating mechanism 15 is driven, the adhesive container 46 mounted on the base 11 is raised, and the injection port 51 formed in the circuit structure 50 is immersed as shown in FIG. To do. When the state shown in FIG. 2 is reached, the chamber 10A is opened to the atmosphere in step S22. Thereby, the adhesive 44a starts to be injected into the adhesive injection region 50A of the circuit structure 50. Then, in step S23, the completion of the adhesive injection is determined by an appropriate means, for example, injection time or fluoroscopy of the circuit structure 50 by infrared irradiation.

FIG. 6 is a cross-sectional view showing a state where the injection of the adhesive into the circuit structure 50 is completed. The adhesive 44a is injected into the entire adhesive injection region 50A between the circuit element bodies 53-54 and 54-55.
In the flowchart shown in FIG. 8, steps S12 to S23 are controlled by the control unit 81, and the step of sealing the outer peripheral portion of the circuit structure 50 with the sealing material 52 is performed separately. However, as will be described later, the sealing process for sealing the outer peripheral portion of the circuit component 50 with the sealing material 52 and the process for injecting the adhesive into the adhesive injection region 50A in steps S21 to S23, respectively, Alternatively, an inline type apparatus (see FIG. 19) may be configured and performed.

  According to the above-described adhesive injection method for the circuit structure, the gas released from the circuit structure 50 to the adhesive injection region 50A is supplied to the chamber 10A before the chamber 10A is evacuated and the injection of the adhesive is started. Therefore, the adhesive can be injected in a state where the pressure in the adhesive injection region 50A is sufficiently low, and the reliability is improved. In this case, if there is a part where the pressure is high in the adhesive injection region 50A, a void (air bubble) is generated at the part, but in the present invention, the generation of air bubbles can be prevented. Moreover, since the speed | rate of adhesive injection becomes large, production efficiency improves.

(Modification of the first embodiment)
FIG. 12 is a flowchart of an adhesive injection procedure showing a modification of the first embodiment. In the adhesive injection procedure for the circuit configuration body according to the modified example, first, in step S31, the gas out of the circuit configuration body 50 is performed.
Among the components absorbed by the circuit structure 50, moisture and the like become water vapor by heating and are released together with other gases. Therefore, in advance, the circuit component 50 is heated outside the injection apparatus 10 or in another apparatus to perform a gas release process. And it accommodates in a cassette so that the circumference | surroundings of the circuit structure 50 may be covered with an inert gas, and introduce | transduces in the chamber 10A of the injection apparatus 10 in this state (step S32). In addition, you may perform the process which heats the circuit structure 50 and discharge | releases gas using the heater 16 in the injection apparatus in FIG. In this case, the order of step S32 and step S31 is reversed.

  In step S33, evacuation is started. When the inside of the chamber 10A reaches a predetermined pressure, for example, about 10 Pa, as shown in FIG. 2, the inlet 51 formed in the circuit structure 50 is brought into contact with the adhesive 44a (step S34). Next, by opening the chamber 10A to the atmosphere (step S35), the adhesive 44a starts to be injected into the adhesive injection region 50A of the circuit structure 50, and the process ends when the injection is completed in step S36.

  In the case of this modification, the gas discharged from the circuit structure 50 is discharged outside the injection apparatus 10, so that the tact time can be reduced. Moreover, the injection apparatus 10 can be made into a simple structure.

(Second Embodiment)
In the first embodiment, the release of the gas released from the circuit structure is led out of the injection device by purging and evacuation. On the other hand, in 2nd Embodiment, the discharge gas from a circuit structure body is guide | induced outside by heating and evacuating a circuit structure body.
The second embodiment will be described below along the flowchart of FIG.

  In step S41, the circuit structure 10 is placed in the chamber 10A. In step S42, evacuation is started. In step S43, heating of the circuit structure 50 is started. This step 43 is performed using the heater 16 shown in FIG. In step S44, the heating temperature by the heater 16 is controlled by PID (Proportional Integral Derivative) control or the like so as to be within a temperature range suitable for releasing gas from the circuit component 50 into the adhesive injection region 50A. When the adhesive 44a injected into the adhesive injection region 50A is an epoxy resin, the temperature range suitable for releasing the gas needs to be higher than 65 ° C. and lower than 95 ° C. When the temperature is lower than 65 ° C., there is almost no gas releasing action mainly including moisture, and when the temperature is higher than 95 ° C., the viscosity of the adhesive 44a increases, and the circuit component An increase in the amount of gas released from 50 and thermal damage to the sealing material 52 cause trouble in injection.

  When the gas is released, in step S45, as shown in FIG. 2, the inlet 51 formed in the circuit structure 50 is brought into contact with the adhesive 44a. In step S46, the chamber 10A is opened to the atmosphere. The adhesive 44a is injected into the adhesive injection region 10A, and the process ends when the injection is completed in step S47.

FIG. 13 is a relationship diagram between the pressure in the chamber and the time of heating, and the relationship between the pressure in the chamber and the heating temperature and time.
The pressure in the chamber is reduced by the process of step S42 and maintained in a vacuum state. By the processing in step S43, the temperature of the circuit component 50 (or the temperature of the heater 16) is controlled to be in the range of 65 ° C. to 95 ° C., and the gas released from the circuit component 50 to the adhesive injection region 50A. Is discharged from the chamber 10A by the vacuum exhaust system 20.

Then, when a time when gas is sufficiently discharged from the circuit structure 50 has elapsed, injection of the adhesive into the adhesive injection region 10A is started.
In FIG. 13, the start of heating is a step after the evacuation step in step S42. However, as shown in FIG. 14, the start of heating may be a pre-process of the evacuation process in step S42.
13 and 14, the temperature of the circuit component 50 due to heating is shown to rise linearly. However, with PID control, the initial value is steep and has a gentle curve near the ultimate temperature. Become.

  In the case of the second embodiment, the same effect as in the case of the first embodiment can be obtained. In addition, as in the modification of the first embodiment, the gas discharged from the circuit component 50 is discharged only by heating, so that the injection device 10 can have a simple structure.

(Modification of the second embodiment)
FIG. 18 shows a flowchart of a modification of the second embodiment. This modification is a method of repeatedly discharging gas by both purging and heating.
Hereinafter, the method of the modification of 2nd Embodiment is demonstrated.
In step S51, the circuit structure 50 is placed in the chamber 10A. In step S52, evacuation is started.

  When the predetermined time has elapsed after the process of step S52 is started, the circuit component 50 is heated by the heater 16 in step S53. In step S54, the heating temperature of the heater 16 is controlled by PID (Proportional Integral Derivative) control or the like so as to be within a temperature range suitable for releasing gas from the circuit component 50 into the adhesive injection region 50A.

  In step S55, purge is started. That is, an inert gas is introduced into the chamber 10A, and the pressure in the chamber 10A increases. As a result, the gas released from the circuit structure 50 to the adhesive injection region 50A is led out of the chamber 10A. When the purge is started, the count value M is updated to M + 1 in step S56.

  In step S57, it is determined whether or not the updated count value M is greater than or equal to a predetermined value l. If it is less than the predetermined value 1, the process returns to step S52. And the process of step S52-step S57 is repeated. If the updated count value M is greater than or equal to the predetermined value l, the adhesive 44a comes into contact with the injection port 51 provided in the circuit structure 50 in step S58, and injection of the adhesive 44a is started, and in step S59. The chamber 10A is opened to the atmosphere, and the process ends when the injection of the adhesive 44a is completed in step S60. Steps S58 to S60 are the same processes as steps S21 to S23 in the first embodiment.

FIG. 16 is a chamber internal pressure / heating temperature time relationship diagram illustrating a relationship between chamber internal pressure and time and heating temperature and time according to the second embodiment.
The chamber 10A is repeatedly depressurized and purged, and at the same time, the circuit component 50 is heated by the heater 16. In this case, the setting value M = 3 for the number of purges. After the depressurization and the purge are performed M times (the third and subsequent times in FIG. 16), the chamber 10A can be evacuated and injection of the adhesive 44a can be started. That is, in the figure, the start of the injection of the adhesive can be arbitrarily set after the circle mark.
In FIG. 16, the heating start timing is the post-evacuation process after the initial evacuation. However, as shown in FIG. 17, the heating start timing can be set as the pre-evacuation process of the first evacuation.

(Third embodiment)
In the third embodiment shown in FIG. 19, the injection apparatus 100 shown in FIG. The injection apparatus 100 includes a pretreatment chamber 105, a seal application chamber 110, a seal curing chamber 120, an exhaust chamber 130, a first injection chamber 140, an adhesive defoaming chamber 150, a second injection chamber 160, an adhesive setup chamber 170, Each chamber includes a wiping chamber 180 and an adhesive curing chamber 185. The boundary of each chamber is partitioned by an inlet / outlet valve 101.

  In the pretreatment chamber 105, the circuit component 50 and the holder 17 are loaded. This chamber is provided with an electrostatic elimination ionizer (not shown). In the seal application chamber 110, the seal material 52 is applied to the outer periphery of the circuit component 50. In this chamber, a roller 111 for applying the sealing material 52 and a support plate 112 for rotatably supporting the roller 111 are provided. In the seal curing chamber 120, the sealing material applied to the circuit component 50 is cured. This chamber is provided with a heater 121.

  In the exhaust chamber 130, the gas is discharged from the circuit structure 50 and the chamber is exhausted (purged). This chamber is provided with a heater 131 for heating the circuit structure 50 from the surroundings. In addition, a gas introduction system 135 having a control valve 138 and an introduction flow rate adjustment valve 136 is installed in the exhaust chamber 130, and a vacuum pump 132 and a turbo molecular pump 133 have control valves 134 and 136, respectively. It can be evacuated through.

In the first injection chamber 140, the adhesive 44a is brought into contact with the injection port 51 of the circuit component 50, and injection of the adhesive 44a is started. A vacuum pump 142 is provided in the first injection chamber 140 so as to evacuate via the control valve 143.
The adhesive defoaming chamber 150 is provided with a lifting mechanism 15, and a heater 151 is provided on the base 11 of the lifting mechanism 15. An adhesive container 46 in which an adhesive 44 a is stored is mounted on the table 11. The adhesive defoaming chamber 150 is provided with a vacuum pump 155 for evacuation. The vacuum degassing chamber 150 is evacuated by the vacuum pump 155 through the control valve 156 to degas the gas contained in the adhesive 44a, and then the inlet / outlet valve 101 is opened and the lifting mechanism 15 is used for bonding. The agent container 46 is raised and conveyed into the first injection chamber 140.

  The inside of the second injection chamber 160 is at atmospheric pressure, and the adhesive injection process is continued following the adhesive injection process in the first injection chamber 140 to complete the injection of the adhesive 44a. When the injection of the adhesive 44 a is completed, the inlet / outlet valve 101 is opened, the elevating mechanism 15 is lowered, and the adhesive container 46 containing the adhesive 44 a is conveyed to the adhesive setup chamber 170.

  The adhesive setup chamber 170 monitors the amount of the adhesive 44a accommodated in the adhesive container 46 with a sensor. If the amount is insufficient, the adhesive 44 accommodated in the adhesive tank 45 is removed from a pump or the like (not shown). Thus, the adhesive container 46 is replenished. Not only the amount of the adhesive 44a but also the viscosity of the adhesive 44a may be monitored to replenish the solvent.

  The wiping chamber 180 removes the adhesive adhered to the circuit component 50 by irradiating the circuit component 50 with the cleaning liquid from the nozzle 181. Adhesive removal by suction or physical removal by suction cloth wipe can also be used. The adhesive curing chamber 185 is a chamber for curing the adhesive 44a injected into the adhesive injection region 50A of the circuit component 50, and includes a heater 186.

Hereinafter, an adhesive injection process performed by the injection apparatus 100 will be described.
First, the circuit structure 50 shown in FIG. 5 is loaded into the pretreatment chamber 105 and is rotatably supported by the holder 17. After removing static electricity using an electrostatic removal ionizer, the inlet / outlet valve 101 is opened, and the circuit component 50 and the holder 17 are conveyed to the seal coating chamber 110.

  In the seal coating chamber 110, the roller 111 to which the sealing material is applied is brought into contact with the outer periphery of the circuit component 50 while the circuit component 50 is rotated by a driving mechanism (not shown) to seal the outer periphery of the circuit component 50. A material 52 is applied. In this case, as shown in FIG. 7, the rotation of the circuit component 50 is controlled so that the sealing material 52 is not transferred to the injection port 51.

  When the sealing material 52 is formed on the circuit component 50, the inlet / outlet valve 101 is opened and the circuit component 50 is conveyed to the seal curing chamber 120. In the seal curing chamber 120, the seal material 52 applied to the circuit component 50 is cured by the heater 121. The circuit structure 50 in which the sealing material 52 has been cured is conveyed to the exhaust chamber 130 with the inlet / outlet valve 101 opened.

In the exhaust chamber 130, the inside of the chamber is evacuated by the vacuum pump 132 and the turbo molecular pump 133. Since the turbo molecular pump 133 is provided, the evacuation of the exhaust chamber 130 is performed at a high speed and a high degree of vacuum. As a result, gas is released from the circuit component 50 into the adhesive injection region 50A. After evacuation, an inert gas is introduced from the gas introduction system 136 into the chamber. In this case, the control valve 136 is opened, and the gas released from the circuit component 50 is discharged to the outside of the chamber. It is also possible to control the control valve 136 in a closed state.
Depressurization and purging are repeated a plurality of times as in steps S12 to S17 in FIG. However, when there are few gas discharge | released from the circuit structure 50, you may make it each perform once. Next, the inlet / outlet valve 101 is opened and the circuit component 50 is transferred to the first injection chamber 140. The state at the time of conveyance is the conveyance in which the vacuum state is maintained, but the conveyance can be performed in a state where the pressure is returned to the atmospheric pressure.

  The inside of the first injection chamber 140 is depressurized by the vacuum pump 142 via the control valve 143, and in this first injection chamber 140, the adhesive container 46 containing the adhesive 44 a is raised by the elevating mechanism 15. Then, it contacts the inlet 51 of the circuit structure 50. Thereafter, the adhesive 44a is injected into the adhesive injection region 50A of the circuit component 50 in steps S21 to S22 of FIG. However, this injection is completed in a state where it is injected into a part of the adhesive injection region 50A of the circuit structure 50. Next, the circuit component 50 injected into a part of the adhesive injection region 50 </ b> A is conveyed to the second injection chamber 160 in a state of being in contact with the adhesive 44 a in the adhesive container 46.

  The inside of the second injection chamber 160 is open to atmospheric pressure. Therefore, following the injection of the adhesive 44a in the first injection chamber, the adhesive 44a is injected into the adhesive injection region 50A of the circuit component 50, and the injection of the adhesive 44a is performed by the circuit component. This is performed until the adhesive 44a is injected into the entire 50 adhesive injection region 50A. That is, the injection of the adhesive 44a into the adhesive injection region 50A of the circuit component 50 is completed.

When the injection of the adhesive is completed, the inlet / outlet valve 101 is opened and the circuit component 50 is conveyed to the wiping chamber 180. Further, the inlet / outlet valve 101 on the adhesive setup chamber 170 side of the second injection chamber 160 is opened, and the adhesive container 46 is lowered by the lifting mechanism 15 and moves to the adhesive setup chamber 170.
In the embodiment, the injection of the adhesive 44a into the adhesive injection region 50A is performed in the first injection chamber 140 and the second injection chamber 160, but the adhesive 44a is injected into the adhesive injection region 50A. The injection may be performed in one injection chamber.

  The adhesive is removed from the circuit component 50 transferred to the wiping chamber 180 by the cleaning liquid ejected from the nozzle 181. Removal can also be physical removal by night adhesive removal or suction wipe in a suction manner. Then, the inlet / outlet valve 101 is opened, and the circuit component 50 is conveyed to the adhesive curing chamber 185. In the adhesive curing chamber 185, the adhesive injected into the adhesive injection region 50A of the circuit component 50 is cured by the heater 186.

  On the other hand, the amount of the adhesive 44a accommodated in the adhesive container 46 moved to the adhesive setup chamber 170 is measured by a sensor. If the amount of the adhesive 44 a is sufficient, the adhesive container 46 is conveyed to the adhesive defoaming chamber 150. If the amount of the adhesive 44 a is insufficient, the adhesive 44 accommodated in the adhesive tank 45 is replenished in the adhesive container 46.

The adhesive 44a conveyed to the adhesive defoaming chamber 150 is defoamed. The inside of the adhesive defoaming chamber 15 is evacuated by the vacuum pump 155 and is heated by the heater 151 provided on the base 11 together with the air contained in the adhesive 44a. The gas expands and is released into the chamber, and is exhausted to the outside by the vacuum pump 155. That is, defoaming of the adhesive 44a is performed. Further, the viscosity of the adhesive 44a can be controlled to shorten the injection time.
The adhesive container 46 containing the defoamed adhesive 44 a opens the inlet / outlet valve 101, is lifted by the lifting mechanism 15, is moved to the first injection chamber 140, and is transported from the exhaust chamber 130. In contact with the inlet 51.
Thus, the adhesive container 46 containing the adhesive 44a circulates through the adhesive setup chamber 170-adhesive defoaming chamber 150-first injection chamber 140-second injection chamber 160.

  In the circuit component adhesive injection method of the third embodiment, the gas released from the circuit component 50 to the adhesive injection region 50A is led out of the chamber as in the first embodiment. It becomes possible to inject the adhesive in a state where the pressure in the injection region 50A is sufficiently low, and the reliability is improved. In addition, since the inline method is used, the tact time can be shortened and the production efficiency can be greatly improved.

The circuit element bodies 53 to 55 constituting the circuit structure 50 are exemplified by a semiconductor wafer on which an integrated circuit is formed. However, circuit elements such as thin film transistors are provided on an insulating substrate such as a glass plate or a ceramic plate. It can also be applied to cases.
The present invention can also be applied to the case where a multilayer wiring board is formed by using a laminated circuit board.

In addition, the adhesive injection device for the circuit component of the present invention can be variously modified and configured within the scope of the invention. In short, the circuit component and the adhesive having the adhesive injection region A chamber for storing an adhesive container in which an agent is stored, a discharge gas discharging means for leading gas released from the circuit component into the adhesive injection region to the outside, and a pressure reducing means for reducing the pressure in the chamber The adhesive injection means for injecting the adhesive into the adhesive injection region of the circuit component and the gas is discharged from the chamber by the discharge gas discharge means, and the pressure in the chamber is reduced by the pressure reducing means. Control means for initiating injection of adhesive into the adhesive injection region, and the discharge gas discharge means introduces an inert gas into the chamber and is released from the circuit structure into the adhesive injection region. Gas As long as it includes a purge means for over-di.
The circuit component adhesive injection device according to the present invention includes a circuit component having an adhesive injection region, a chamber for storing an adhesive container storing the adhesive, and a circuit component from the circuit component into the adhesive injection region. Release gas discharge means for deriving the released gas from the inside of the chamber, decompression means for reducing the pressure in the chamber, adhesive injection means for injecting adhesive into the adhesive injection area of the circuit component, and release And a control means for starting the injection of the adhesive into the adhesive injection region of the circuit structure after the gas is discharged from the chamber by the gas discharge means and the pressure in the chamber is reduced by the pressure reduction means. The means only needs to include heating means for heating the circuit structure and temperature control means for controlling the heating means to a temperature range suitable for the circuit structure to release gas into the adhesive injection region.
Furthermore, an adhesive injection device for a circuit component according to the present invention includes a circuit component having an adhesive injection region and a chamber for storing an adhesive container containing the adhesive, and the circuit component from the circuit component to the adhesive injection region. Release gas discharge means for deriving the released gas from the inside of the chamber, decompression means for reducing the pressure in the chamber, adhesive injection means for injecting adhesive into the adhesive injection area of the circuit component, and release And a control means for starting the injection of the adhesive into the adhesive injection region of the circuit structure after the gas is discharged from the chamber by the gas discharge means and the pressure in the chamber is reduced by the pressure reduction means. The means includes a purge means for introducing an inert gas into the chamber to purge the gas released from the circuit structure into the chamber, a heating means for heating the circuit structure, and a heating means. A temperature control means for controlling the temperature range suitable for releasing gas into the adhesive injection area, as long as it contains a.

In addition, the adhesive injection device for a circuit component according to the present invention guides the gas released from the circuit component into the adhesive injection region to the outside of the chamber, which houses the circuit component having the adhesive injection region. comprising an exhaust chamber having a discharge gas discharging means, an adhesive injection chamber to inject the adhesive in contact with the adhesive at least part of the adhesive injection region of the conveying circuit structure body from the exhaust chamber, and The adhesive injection chamber includes a first adhesive injection chamber that starts injection by bringing at least a part of the adhesive injection region of the circuit structure into contact with the adhesive, and injection of the adhesive in the first adhesive injection chamber What is necessary is just to include the 2nd adhesive agent injection | pouring chamber which inject | pours the adhesive agent to the uninjected area | region of an adhesive agent injection | pouring area | region following a process .

In the circuit component adhesive injection method of the present invention, the adhesive injection region of the circuit component disposed in the chamber is decompressed together with the chamber, and then the adhesive is injected into the adhesive injection region. In the method of injecting adhesive for a circuit structure to be started, the process is performed before decompressing the inside of the chamber and injecting the adhesive, and the gas released from the circuit structure into the adhesive injecting region is supplied to the outside of the chamber. The discharge gas discharge process includes a purge process for introducing an inert gas into the chamber and purging the gas released from the circuit structure into the adhesive injection region. That's fine.

DESCRIPTION OF SYMBOLS 10,100 Injection apparatus 15 Lifting mechanism 16 Heater 20 Vacuum exhaust system 30 Gas introduction system 40 Adhesive introduction system 44, 44a Adhesive resin layer 46 Adhesive container 50 Circuit structure 50A Adhesive injection area 51 Inlet 52 Sealing material 53 55 Circuit element body 81 Control unit 105 Pretreatment chamber 110 Seal application chamber 120 Seal curing chamber 130 Exhaust chamber 140 First injection chamber 150 Adhesive defoaming chamber 160 Second injection chamber 170 Adhesive setup chamber 180 Wiping chamber 185 Adhesive curing room

Claims (11)

A chamber for storing a circuit component having an adhesive injection region and an adhesive container storing the adhesive;
A discharge gas discharging means for deriving the gas released into the adhesive injection area from the circuit structure to the outside from the chamber,
Pressure reducing means for reducing the pressure in the chamber;
An adhesive injection means for injecting the adhesive into the adhesive injection region of the circuit component;
Wherein the discharge gas discharging means discharges the gas from the chamber, after reducing the pressure in the chamber by the pressure reducing means, and a control means for initiating the injection of the adhesive into the adhesive injection region of the circuit structure , comprising a,
The discharge gas discharge means includes purge means for introducing an inert gas into the chamber and purging the gas released from the circuit structure into the adhesive injection region. Adhesive injection device. A chamber for storing a circuit component having an adhesive injection region and an adhesive container storing the adhesive;
Released gas discharge means for leading the gas released from the circuit structure into the adhesive injection region to the outside from the chamber;
Pressure reducing means for reducing the pressure in the chamber ;
An adhesive injection means for injecting the adhesive into the adhesive injection region of the circuit component;
Control means for starting the injection of the adhesive into the adhesive injection region of the circuit structure after exhausting the gas from the chamber by the discharge gas exhausting means and reducing the pressure in the chamber by the decompression means; , And
It said discharge gas discharge means, the heating means and the heating means for heating the circuit structure, the temperature control in which the circuit component is controlled to a temperature range suitable for releasing gas before Kise' Chakuzai implanted region A device for injecting an adhesive for a circuit structure, characterized in that it comprises means. A chamber for storing a circuit component having an adhesive injection region and an adhesive container storing the adhesive;
Released gas discharge means for leading the gas released from the circuit structure into the adhesive injection region to the outside from the chamber;
Pressure reducing means for reducing the pressure in the chamber ;
An adhesive injection means for injecting the adhesive into the adhesive injection region of the circuit component;
Control means for starting the injection of the adhesive into the adhesive injection region of the circuit structure after exhausting the gas from the chamber by the discharge gas exhausting means and reducing the pressure in the chamber by the decompression means; , And
It said discharge gas discharge means includes a purge means for purging the gas released into said chamber from said circuit component by introducing an inert gas into the chamber, heating means and said heat for heating the circuit structure Temperature control means for controlling the temperature within a temperature range suitable for the circuit component to release gas into the adhesive injection region. 4. The circuit unit adhesive injection device according to claim 2 , wherein a temperature range controlled by the temperature control means is set to be higher than 65 ° C. and lower than 95 ° C. The apparatus for injecting the adhesive of the structure. In the adhesive injection device for a circuit component according to any one of claims 1 to 4 ,
Serial control means includes at least a pressure reduction in the chamber by the pressure reducing means, after one of the discharge of the chamber gas by the discharge gas discharge means performs a plurality of times, the adhesive injection region of the circuit structure An apparatus for injecting an adhesive for a circuit structure, comprising means for initiating injection of the adhesive into the circuit. A chamber containing a circuit structure having an adhesive injection region, and an exhaust chamber having discharge gas discharge means for deriving gas released from the circuit structure into the adhesive injection region to the outside of the chamber;
An adhesive injection chamber for injecting an adhesive by bringing at least a part of the adhesive injection region of the circuit component conveyed from the exhaust chamber into contact with the adhesive; and
Equipped with,
The adhesive injection chamber is
Following the first adhesive injection chamber that starts injection by bringing at least a part of the adhesive injection region of the circuit structure into contact with the adhesive, and subsequent to the adhesive injection processing in the first adhesive injection chamber An adhesive injection device for a circuit structure , comprising a second adhesive injection chamber for injecting an adhesive into an uninjected region of the adhesive injection region . The adhesive injection device for a circuit structure according to claim 6 , further comprising an adhesive defoaming chamber for defoaming the adhesive and transporting the adhesive to the adhesive injection chamber after defoaming. An apparatus for injecting an adhesive for a circuit structure. 8. The adhesive injection device for a circuit structure according to claim 7 , further comprising an adhesive setup chamber for supplying an adhesive to a container in which the adhesive is stored and transporting the same to the adhesive defoaming chamber. An apparatus for injecting an adhesive for a circuit structure, comprising: Within the adhesive injection region arranged circuit structure in the chamber, the pressure was reduced with the chamber, the adhesive injection method of the circuit structure to initiate the injection of the adhesive into the adhesive injection region,
A before the step of initiating the injection of the adhesive by reducing the pressure within the chamber, includes a discharge gas discharging step of deriving the gas released into the adhesive injection area from the circuit structure to the outside of the chamber ,
The discharge gas discharging step includes a purge step of introducing an inert gas into the chamber and purging the gas released from the circuit component into the adhesive injection region. Adhesive injection method. 10. The adhesive for injecting circuit components according to claim 9 , further comprising a pressure reducing step for reducing the pressure in the chamber before the purge step. Injection method. 10. The circuit component adhesive injection method according to claim 9 , wherein the discharge gas discharge step includes a heating step of heating the circuit component to a temperature range suitable for releasing gas into the adhesive injection region. A method for injecting an adhesive for a circuit structure, comprising:

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