JP5437801B2 - Multilayer sealant film - Google Patents
Multilayer sealant film Download PDFInfo
- Publication number
- JP5437801B2 JP5437801B2 JP2009520763A JP2009520763A JP5437801B2 JP 5437801 B2 JP5437801 B2 JP 5437801B2 JP 2009520763 A JP2009520763 A JP 2009520763A JP 2009520763 A JP2009520763 A JP 2009520763A JP 5437801 B2 JP5437801 B2 JP 5437801B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat seal
- pla
- adhesion promoter
- copolyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000565 sealant Substances 0.000 title description 4
- 229920000747 poly(lactic acid) Polymers 0.000 claims description 93
- 238000000576 coating method Methods 0.000 claims description 44
- 239000011248 coating agent Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 35
- 239000002318 adhesion promoter Substances 0.000 claims description 30
- 229920001634 Copolyester Polymers 0.000 claims description 29
- -1 polyethylene terephthalate Polymers 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 22
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- 229920002799 BoPET Polymers 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 229920001519 homopolymer Polymers 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 150000002334 glycols Chemical class 0.000 claims description 5
- 229920001038 ethylene copolymer Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 94
- 239000004626 polylactic acid Substances 0.000 description 48
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 12
- 229920000728 polyester Polymers 0.000 description 12
- 239000002131 composite material Substances 0.000 description 11
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 239000004310 lactic acid Substances 0.000 description 8
- 235000014655 lactic acid Nutrition 0.000 description 8
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- 229930182843 D-Lactic acid Natural products 0.000 description 4
- JVTAAEKCZFNVCJ-UWTATZPHSA-N D-lactic acid Chemical compound C[C@@H](O)C(O)=O JVTAAEKCZFNVCJ-UWTATZPHSA-N 0.000 description 4
- 239000005041 Mylar™ Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 229940022769 d- lactic acid Drugs 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000750 progressive effect Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- WHBMMWSBFZVSSR-UHFFFAOYSA-N 3-hydroxybutyric acid Chemical compound CC(O)CC(O)=O WHBMMWSBFZVSSR-UHFFFAOYSA-N 0.000 description 2
- FMHKPLXYWVCLME-UHFFFAOYSA-N 4-hydroxy-valeric acid Chemical compound CC(O)CCC(O)=O FMHKPLXYWVCLME-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000007765 extrusion coating Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- JJTUDXZGHPGLLC-UHFFFAOYSA-N lactide Chemical compound CC1OC(=O)C(C)OC1=O JJTUDXZGHPGLLC-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004530 micro-emulsion Substances 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 239000012748 slip agent Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical class OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 1
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 1
- 229940006015 4-hydroxybutyric acid Drugs 0.000 description 1
- IWHLYPDWHHPVAA-UHFFFAOYSA-N 6-hydroxyhexanoic acid Chemical compound OCCCCCC(O)=O IWHLYPDWHHPVAA-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229920002988 biodegradable polymer Polymers 0.000 description 1
- 239000004621 biodegradable polymer Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 150000002195 fatty ethers Chemical class 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 235000013611 frozen food Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 235000021485 packed food Nutrition 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920006381 polylactic acid film Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 150000003626 triacylglycerols Chemical class 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/052—Forming heat-sealable coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/054—Forming anti-misting or drip-proofing coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Description
本発明は、2006年7月14日に出願された米国仮出願第60/831,016号の優先権を主張し、この出願の全明細書を参照により本明細書に組み込む。 The present invention claims priority from US Provisional Application No. 60 / 831,016, filed July 14, 2006, the entire specification of which application is incorporated herein by reference.
ポリ乳酸(PLA)は、高度に生分解性のポリマーであり、例えばトウモロコシなどの天然原料から得られる。食品包装トレーの製造ためのPLAの使用はますます多くなっており、これは、少なくとも部分的には、ポリ乳酸が容易に生分解可能であること、およびポリ乳酸から製造されたトレーが非常に高い酸素量および透湿速度を有することに起因する。しかし、PLAから製造されたトレーは、わずか104 °F(40℃)の温度で軟化および変形する傾向がある。この欠点のため、PLAトレーに使用するためのふた用フィルムについての決定的に重要な要求は、ヒートシールが低い温度(200 °F前後、すなわち93℃前後)、短い滞留時間(2秒未満)で形成されなければならないことである。従来のシーラントフィルムは、十分に低い温度でPLAトレーにヒートシール(熱融着)しないか、あるいはヒートシール強度がシール後長期にわたると低下する。1層のアモルファスPLA層と1層の結晶性PLA層とを有する共押出しPLAフィルムは、低い温度でPLAトレーにシールされ得るが、このようなフィルムは、典型的には非常にもろく、容易に裂け、パッケージングライン、特に高速のパッケージングラインにうまく載らない。 Polylactic acid (PLA) is a highly biodegradable polymer and is obtained from natural raw materials such as corn. The use of PLA for the production of food packaging trays is increasing, which is because, at least in part, polylactic acid is readily biodegradable, and trays made from polylactic acid are highly This is due to having a high oxygen content and moisture transmission rate. However, trays made from PLA tend to soften and deform at temperatures as low as 104 ° F (40 ° C). Because of this drawback, critical requirements for lid films for use in PLA trays are low heat seal temperatures (around 200 ° F, ie around 93 ° C), short residence times (less than 2 seconds) It must be formed with. The conventional sealant film does not heat seal (heat fusion) to the PLA tray at a sufficiently low temperature, or the heat seal strength decreases when it is long after sealing. Coextruded PLA films with one amorphous PLA layer and one crystalline PLA layer can be sealed to PLA trays at low temperatures, but such films are typically very brittle and easily Rips and does not fit well on packaging lines, especially high speed packaging lines.
上述したとおり、PLAトレーに使用するための密封性能の要求と、実用的な通常の使用のために求められるフィルム加工性能との両方を満足するふた用フィルムを提供することが有利である。 As mentioned above, it would be advantageous to provide a lidding film that satisfies both the sealing performance requirements for use in PLA trays and the film processing performance required for practical normal use.
1つの態様では、本発明は、
a)ポリマー性ベース層を含む基材と、
b)前記基材上の、PLAポリマーを含むヒートシール層と
を含む多層フィルムを提供する。前記ヒートシール層は、その中に分散された接着促進剤をさらに含むか、あるいは、前記基材は、前記ポリマー性ベース層と前記ヒートシール層との間にあり且つ隣接している前記ポリマー性ベース層の表面上の層内に、接着促進剤をさらに含む。
In one aspect, the present invention provides:
a) a substrate comprising a polymeric base layer;
b) providing a multilayer film comprising a heat seal layer comprising a PLA polymer on the substrate. The heat seal layer further includes an adhesion promoter dispersed therein, or the substrate is between and adjacent to the polymer base layer and the heat seal layer. An adhesion promoter is further included in the layer on the surface of the base layer.
別の態様では、本発明は、開口部を有するうつわを含む密封容器であって、前記開口部が、請求項1に記載の多層フィルムを用いて、上述した通りフィルムのヒートシール層を有する側でシールされている密封容器を提供する。 In another aspect, the present invention is a sealed container comprising a container having an opening, the opening having a heat seal layer of the film as described above using the multilayer film according to claim 1. A sealed container is provided which is sealed with.
さらに別の態様では、本発明は、多層フィルムの製造方法を提供する。この方法は、
a)コーティング液を、ポリマー性ベース層を含む基材に適用する工程であって、
前記コーティング液が溶媒およびPLAポリマーを含み、
前記コーティング液が、接着促進剤をさらに含むか、あるいは、前記基材が、前記コーティング液を受容するための、前記ポリマー性ベース層の表面上の層の中に接着促進剤をさらに含むか、のいずれかである工程と、
b)溶媒を除去して、前記PLAポリマーを含むヒートシール層を形成させる工程と
を含む。
In yet another aspect, the present invention provides a method for producing a multilayer film. This method
a) applying a coating solution to a substrate comprising a polymeric base layer,
The coating solution includes a solvent and a PLA polymer;
The coating solution further comprises an adhesion promoter, or the substrate further comprises an adhesion promoter in a layer on the surface of the polymeric base layer for receiving the coating solution, A process that is either
b) removing the solvent to form a heat seal layer containing the PLA polymer.
さらなる態様では、本発明は、PLAポリマー、コポリエステル、および溶媒を含むコーティング組成物を提供する。 In a further aspect, the present invention provides a coating composition comprising a PLA polymer, a copolyester, and a solvent.
本発明者は、PLAポリマーをポリエチレンテレフタレート(PET)および他の多くの基材に適切に強く接着することが、本発明以前に公知の方法では非常に達成困難であることに気付いた。この問題および他の問題に取り組むために、本発明の多層フィルムは、ポリマー性ベース層を含む基材と、この基材上の、PLAポリマーを含むヒートシール層とを含む。このヒートシール層および基材の1つまたは双方は、接着促進剤をさらに含み、この接着促進剤は、PLAポリマーとポリマー性ベース層との間の接着性を高める一方、良好な低温ヒートシール特性を維持する。特に指定しない限り、本明細書で用いる用語「PLAポリマー」には、乳酸のホモポリマー、および少なくとも30モル%の乳酸繰り返し単位を含む乳酸のコポリマーが含まれる。基材が接着促進剤を1つの層として含む場合、この層は、ポリマー性ベース層の製造プロセスの際にインラインで、あるいはポリマー性ベース層を製造した後にオフラインで形成させることができる。一般に、ヒートシール層内に用いられることになるポリマー材料(すなわち「ヒートシール可能な」ポリマー)は、ポリマー性ベース層の軟化温度より少なくとも50 °F、典型的には少なくとも100 °F、より典型的には少なくとも150 °F低い軟化温度を有する熱可塑性ポリマーである。軟化温度は、好ましくは75 °Fより高い。 The inventor has realized that it is very difficult to achieve adequately adherent PLA polymers to polyethylene terephthalate (PET) and many other substrates using methods known prior to the present invention. To address this and other problems, the multilayer film of the present invention comprises a substrate comprising a polymeric base layer and a heat seal layer comprising a PLA polymer on the substrate. One or both of the heat seal layer and the substrate further comprises an adhesion promoter that enhances the adhesion between the PLA polymer and the polymeric base layer while providing good low temperature heat seal properties. To maintain. Unless otherwise specified, the term “PLA polymer” as used herein includes homopolymers of lactic acid and copolymers of lactic acid containing at least 30 mol% lactic acid repeat units. If the substrate includes the adhesion promoter as a layer, this layer can be formed in-line during the manufacturing process of the polymeric base layer or offline after the polymeric base layer is manufactured. In general, the polymeric material (ie, “heat sealable” polymer) that will be used in the heat seal layer is at least 50 ° F., typically at least 100 ° F. more typically than the softening temperature of the polymeric base layer. In particular, it is a thermoplastic polymer having a softening temperature that is at least 150 ° F lower. The softening temperature is preferably higher than 75 ° F.
接着促進剤をヒートシール層の中に分散させる場合、この分散液は、均一な溶液の形態をとることができ、あるいは、ヒートシール層は、異なる組成を有するポリマー性分散相とポリマー性連続相とを含むことができる。一部の実施態様では、接着促進剤は、これらの相の一方の50重量%を超えて占め、かつ、前記PLAポリマーは、これらの相の他方の相の50重量%を超えて占める。接着促進剤は、PLAポリマー中に分散されていてよく、あるいはその逆であってもよい。本発明の一部の実施態様のヒートシール層において存在する曇った外観は、異なる組成のポリマー相の存在を示すと考えられる。基材の乾燥後にこのような外観および良好なヒートシール性能をもたらす典型的な1つの配合は、アモルファスPLAポリマー〔PLA 4060D、NatureWorks LLC社(Minnetonka、MN)からのD,L-ポリ乳酸ポリマー〕30%と、コポリエステル(アゼライン酸/テレフタル酸/エチレングリコール、45/55/100モル当量)70%からなる。 When the adhesion promoter is dispersed in the heat seal layer, the dispersion can take the form of a uniform solution, or the heat seal layer can be composed of a polymeric dispersed phase and a polymeric continuous phase having different compositions. Can be included. In some embodiments, the adhesion promoter accounts for more than 50% by weight of one of these phases and the PLA polymer accounts for more than 50% by weight of the other of these phases. The adhesion promoter may be dispersed in the PLA polymer or vice versa. It is believed that the cloudy appearance present in the heat seal layer of some embodiments of the present invention indicates the presence of different composition polymer phases. One typical formulation that provides such an appearance and good heat seal performance after drying the substrate is an amorphous PLA polymer (PLA 4060D, D, L-polylactic acid polymer from NatureWorks LLC (Minnetonka, Minn.)). 30% and 70% copolyester (azeline acid / terephthalic acid / ethylene glycol, 45/55/100 molar equivalent).
本発明者は、接着促進剤を注意深く選択することによって、PLAが変形されない一方で、PLAポリマー層と基材との間の良好な接着がもたらされるために十分に低い温度で、トレーなどのPLA製品を密封することができる多層フィルムを製造することが可能であることを見いだした。さらに、機械的に強力なポリマー性ベース層の存在に少なくとも部分的によって、これらのフィルムは、典型的には、パッケージングラインにおける優れた加工性を示す。 The inventor has carefully selected the adhesion promoter so that the PLA is not deformed while the PLA, such as a tray, is at a sufficiently low temperature to provide good adhesion between the PLA polymer layer and the substrate. It has been found that it is possible to produce a multilayer film that can seal the product. Furthermore, these films typically exhibit excellent processability in packaging lines, at least in part due to the presence of a mechanically strong polymeric base layer.
任意の厚さの多層フィルムを、本発明に従って用いることができる。典型的には、ポリマー性ベース層は、12〜120ミクロンの範囲の厚さであってよい。ヒートシール層は、典型的には0.5〜20ミクロン、より典型的には2.0〜10ミクロンの範囲の厚さである。これらの比較的薄いヒートシール層は、典型的には、溶液コーティングによって製造することができ、他の方法(例えば、押出しコーティングまたは共押出しコーティングなど)によって達成することは困難である可能性がある。押出加工PLAポリマーの欠点は、予めポリマーを乾燥させて熱劣化を防止する必要があることである。この特別な工程は、PLAポリマーを溶液コーティングによって典型的な条件下(すなわち、PLAポリマーの熱変性温度未満の加工温度)で適用する場合にはなくすことができる。別個の接着促進層がPLAポリマーとポリマー性ベース層との間に存在する場合には、接着促進層は、典型的に、0.02〜5ミクロンの範囲の厚さである。 Any thickness of multilayer film can be used in accordance with the present invention. Typically, the polymeric base layer may be in the range of 12 to 120 microns. The heat seal layer is typically in the range of 0.5 to 20 microns, more typically 2.0 to 10 microns. These relatively thin heat seal layers can typically be produced by solution coating and can be difficult to achieve by other methods such as extrusion coating or coextrusion coating. . The disadvantage of extruded PLA polymers is that the polymers need to be dried beforehand to prevent thermal degradation. This special step can be eliminated if the PLA polymer is applied by solution coating under typical conditions (ie, processing temperatures below the thermal denaturation temperature of the PLA polymer). If a separate adhesion promoting layer is present between the PLA polymer and the polymeric base layer, the adhesion promoting layer is typically in the range of 0.02 to 5 microns thick.
ヒートシール層が、その中に溶解されたかまたは分散された接着促進剤を含む場合、接着促進剤の量は、促進剤とPLAモノマーとの合計重量の、典型的には少なくとも1重量%、より典型的には少なくとも10重量%、最も典型的には少なくとも20重量%、または少なくとも30重量%である。この量は、典型的には、最高で90重量%、より典型的には最高で70重量%、最も典型的には最高で40重量%である。ヒートシール層が比較的透明である(曇っていない)ことが求められる本発明の実施態様では、接着促進剤のPLAポリマーに対する相対的な量は、幾分低いことが好適である可能性がある。例えば、接着促進剤の量は、促進剤とPLAモノマーとの合計重量の、典型的には少なくとも20重量%、より典型的には少なくとも30重量%、最も典型的には少なくとも40重量%である。この量は、典型的には最高で60重量%、より典型的には最高で50重量%である。フィルムの表面上に水滴が形成されることを、そのような形成が促される環境で使用する場合(例えば、冷凍食品の包装など)に、避けることが望まれる場合には、以下にさらに記述するように、防曇剤を使用することもできる。多層フィルムを構成する成分を、以下にさらに詳細に論じ、次いで、どのようにフィルムを製造するかと、いくつかのフィルムの典型的な用途とを記述する。 When the heat seal layer includes an adhesion promoter dissolved or dispersed therein, the amount of adhesion promoter is typically at least 1% by weight of the total weight of the promoter and PLA monomer. Typically at least 10 wt%, most typically at least 20 wt%, or at least 30 wt%. This amount is typically up to 90% by weight, more typically up to 70% by weight and most typically up to 40% by weight. In embodiments of the invention where the heat seal layer is required to be relatively transparent (not cloudy), the relative amount of adhesion promoter to PLA polymer may be preferred to be somewhat lower. . For example, the amount of adhesion promoter is typically at least 20%, more typically at least 30%, most typically at least 40% by weight of the total weight of the promoter and PLA monomer . This amount is typically up to 60% by weight, more typically up to 50% by weight. If it is desired to avoid the formation of water droplets on the surface of the film when used in an environment where such formation is encouraged (eg, packaging of frozen foods), it is further described below. Thus, an antifogging agent can also be used. The components that make up the multilayer film are discussed in further detail below, and then describe how the film is made and some typical uses of the film.
[ヒートシール層]
ヒートシール層は、少なくとも1種のPLAポリマーを含む。本発明に従って用いるための好適なPLAポリマーの種類は、当分野で公知の任意の種類であってよく、乳酸のホモポリマーおよびコポリマーを含む。好適なコポリマーには、式:
HOC(R1)(R2)(CH2)nCOOH
(式中、R1およびR2は、それぞれ独立に、H、または置換もしくは非置換のC1〜C5基であり、nは、0〜10の整数である)
のコポリマーが含まれる。PLAポリマーはアモルファス(すなわち、示差走査熱量測定によって測定して少なくとも90%アモルファス)であってよく、あるいは、PLAポリマーは実質的に結晶性であってよい。典型的には最高で50%まで結晶性であり、より典型的には最高で20%まで結晶性である。PLAポリマーは、乳酸のホモポリマーであってよく、以下のモルホロジー的にはっきりと区別可能なポリマー:D-ポリ乳酸、L-ポリ乳酸、D,L-ポリ乳酸、およびメソ-ポリ乳酸の1種以上であってよい。D-ポリ乳酸およびL-ポリ乳酸は、相当する純粋な鏡像異性酸のポリマーであり、光学活性ポリマーである。D,L-ポリ乳酸は、ラセミ乳酸から製造される。すなわち、D,L-ポリ乳酸は、D-およびL-ポリ乳酸単位の明確な立体配座を有するD-ポリ乳酸とL-ポリ乳酸とのコポリマーである。メソ-ポリ乳酸は、等モルのD-ポリ乳酸およびL-ポリ乳酸のランダムコポリマーである。PLAホモポリマーのモルホロジーは、ポリマー骨格中のD異性体のL異性体に対する比によって支配されていることが知られている。典型的には、D-乳酸含有量が高いほど、ポリマーの結晶性が低い。
[Heat seal layer]
The heat seal layer includes at least one PLA polymer. Suitable PLA polymer types for use in accordance with the present invention may be any type known in the art, including homopolymers and copolymers of lactic acid. Suitable copolymers include the formula:
HOC (R 1 ) (R 2 ) (CH 2 ) n COOH
(Wherein R 1 and R 2 are each independently H or a substituted or unsubstituted C 1 to C 5 group, and n is an integer of 0 to 10)
These copolymers are included. The PLA polymer may be amorphous (ie, at least 90% amorphous as measured by differential scanning calorimetry), or the PLA polymer may be substantially crystalline. It is typically up to 50% crystalline and more typically up to 20% crystalline. PLA polymer may be a homopolymer of lactic acid and is one of the following morphologically distinct polymers: D-polylactic acid, L-polylactic acid, D, L-polylactic acid, and meso-polylactic acid It may be above. D-polylactic acid and L-polylactic acid are correspondingly pure enantiomeric polymers and optically active polymers. D, L-polylactic acid is produced from racemic lactic acid. That is, D, L-polylactic acid is a copolymer of D-polylactic acid and L-polylactic acid having a well-defined conformation of D- and L-polylactic acid units. Meso-polylactic acid is a random copolymer of equimolar D-polylactic acid and L-polylactic acid. It is known that the morphology of PLA homopolymer is governed by the ratio of D isomer to L isomer in the polymer backbone. Typically, the higher the D-lactic acid content, the lower the crystallinity of the polymer.
任意の公知の重合法、例えば、重縮合および開環重合などを、乳酸を重合させるために採用することができる。重縮合法では、例えば、L-乳酸、D-乳酸、またはこれらの混合物を、当分野で公知の脱水重縮合反応に直接かける。開環重合法では、ラクチド(すなわち、乳酸の環状二量体)を触媒の存在下で重合反応にかけてポリ乳酸を形成させる。ラクチドは、L-乳酸の二量体、D-乳酸の二量体、またはL-乳酸およびD-乳酸の混合二量体であってよい。これらの異性体を、混合し且つ重合させて、任意の所望の組成および結晶性を有するポリ乳酸を得ることができる。 Any known polymerization method, such as polycondensation and ring-opening polymerization, can be employed to polymerize lactic acid. In the polycondensation method, for example, L-lactic acid, D-lactic acid, or a mixture thereof is directly subjected to a dehydration polycondensation reaction known in the art. In the ring-opening polymerization method, lactide (that is, a cyclic dimer of lactic acid) is subjected to a polymerization reaction in the presence of a catalyst to form polylactic acid. The lactide may be a dimer of L-lactic acid, a dimer of D-lactic acid, or a mixed dimer of L-lactic acid and D-lactic acid. These isomers can be mixed and polymerized to obtain polylactic acid having any desired composition and crystallinity.
少量の鎖延長剤(例えば、ジイソシアネート化合物、エポキシ化合物、または酸無水物)を用いて、PLAポリマーの分子量を増大させることができる。ポリマーは、任意の分子量範囲内であってもよいが、通常、重量平均分子量は、60,000〜1,000,000ダルトンの範囲である。典型的には、分子量が60,000未満であると、適切な物理的特性が得られない場合がある。他方では、分子量が1,000,000より高いと、溶融粘度が過剰に高くなり、成形性が悪くなる。 Small amounts of chain extenders (eg, diisocyanate compounds, epoxy compounds, or acid anhydrides) can be used to increase the molecular weight of the PLA polymer. The polymer may be in any molecular weight range, but typically the weight average molecular weight is in the range of 60,000 to 1,000,000 daltons. Typically, if the molecular weight is less than 60,000, appropriate physical properties may not be obtained. On the other hand, if the molecular weight is higher than 1,000,000, the melt viscosity becomes excessively high and the moldability deteriorates.
PLAポリマーは、乳酸と1種以上のコモノマーとのコポリマーであってもよい。このようなコポリマーは、存在する場合には、合計で、PLAポリマーの50モル%未満、典型的には30モル%未満、より典型的には10モル%未満を占める。このようなコモノマーの例には、カプロラクトン;ヒドロキシカルボン酸(例えば、グリコール酸、3-ヒドロキシ酪酸、4-ヒドロキシ酪酸、4-ヒドロキシ吉草酸、および6-ヒドロキシカプロン酸など);ポリオール(例えば、エチレングリコール、プロピレングリコール、ブタンジオール、ネオペンチルグリコール、ポリ(エチレングリコール)、グリセロール、およびペンタエリスリトールなど);および多塩基酸(例えば、コハク酸、アジピン酸、セバシン酸、フマル酸、テレフタル酸、イソフタル酸、2,6-ナフタレンジカルボン酸、5-ナトリウムオキシスルホニルイソフタル酸、および5-テトラブチルホスホニウムスルホイソフタレート)が含まれる。本発明の一部の実施態様では、コモノマーは(存在する場合には)生分解性であることが好ましい。 The PLA polymer may be a copolymer of lactic acid and one or more comonomers. Such copolymers, when present, comprise a total of less than 50 mole percent, typically less than 30 mole percent, more typically less than 10 mole percent of the PLA polymer. Examples of such comonomers include caprolactone; hydroxycarboxylic acids (eg, glycolic acid, 3-hydroxybutyric acid, 4-hydroxybutyric acid, 4-hydroxyvaleric acid, and 6-hydroxycaproic acid); polyols (eg, ethylene Glycols, propylene glycol, butanediol, neopentyl glycol, poly (ethylene glycol), glycerol, and pentaerythritol); and polybasic acids (eg, succinic acid, adipic acid, sebacic acid, fumaric acid, terephthalic acid, isophthalic acid) 2,6-naphthalenedicarboxylic acid, 5-sodiumoxysulfonylisophthalic acid, and 5-tetrabutylphosphonium sulfoisophthalate). In some embodiments of the invention, the comonomer is preferably biodegradable (if present).
本発明の一部の実施態様では、フィルムは、防曇剤を、水滴の形成に起因するフィルムの内側表面の曇りの形成を低減または排除するために含む。防曇剤は、ヒートシール層内に分散され、かつ/あるいはヒートシール層の基材の反対側の表面上に存在する。一部の実施態様では、防曇剤はヒートシール層を形成させるために用いられる配合物の一部であってよく、防曇剤はヒートシール層中に広く分散されたままであってもよく、あるいは防曇剤は表面を被膜していてよい。あるいは、防曇剤は、浸漬、スプレー、もしくはコーティング(典型的には溶媒からのコーティング)により、ヒートシール層の表面に直接適用することができる。好適な防曇剤の例には、アルコキシル化脂肪エーテル〔例えば、ATMER(登録商標)502〕、ソルビタンエステル〔例えば、ATMER(登録商標)103〕、他の公知の非イオン性、陰イオン性、および陽イオン性の界面活性剤〔例えば、ポリアルキレン脂肪酸エステル、アルコキシル化フェノール、混合モノ-、ジ-、もしくはトリ-グリセリド、ポリヒドロキシアルコールの脂肪酸エステル、他のポリアルコキシル化された化合物など〕が含まれる。ATMER(登録商標)製品は、Ciba Specialty Chemical社(Tarrytown、NY)から入手可能である。ヒートシール層に含まれる場合、防曇剤は、典型的には、ヒートシール層の約0.1重量%〜15重量%、より典型的には、約0.5重量%〜10重量%を占める。ヒートシール層の表面に直接適用する場合、防曇剤の量は、典型的には、ヒートシール層の重量の約0.1重量%〜5重量%、より典型的には、約0.1重量%〜1重量%の範囲である。 In some embodiments of the invention, the film includes an antifogging agent to reduce or eliminate the formation of haze on the inner surface of the film due to the formation of water droplets. The antifogging agent is dispersed within the heat seal layer and / or is present on the surface of the heat seal layer opposite the substrate. In some embodiments, the antifogging agent may be part of a formulation used to form the heat seal layer, the antifogging agent may remain widely dispersed in the heat seal layer, Alternatively, the antifogging agent may coat the surface. Alternatively, the antifogging agent can be applied directly to the surface of the heat seal layer by dipping, spraying or coating (typically coating from a solvent). Examples of suitable anti-fogging agents include alkoxylated fatty ethers (eg ATMER® 502), sorbitan esters (eg ATMER® 103), other known nonionic, anionic, And cationic surfactants (eg, polyalkylene fatty acid esters, alkoxylated phenols, mixed mono-, di- or tri-glycerides, fatty acid esters of polyhydroxy alcohols, other polyalkoxylated compounds, etc.) included. ATMER® products are available from Ciba Specialty Chemical (Tarrytown, NY). When included in the heat seal layer, the anti-fogging agent typically comprises about 0.1% to 15%, more typically about 0.5% to 10% by weight of the heat seal layer. When applied directly to the surface of the heat seal layer, the amount of anti-fogging agent is typically about 0.1% to 5% by weight of the heat seal layer, more typically about 0.1% to 1%. It is in the range of wt%.
ヒートシール層には、無機粒子(例えば、シリカなど)、および/またはスリップ剤(例えば、ワックスなど)、および/またはポリテトラフルオロエチレン分散物が含まれていてよい。一部の用途では、酸化防止剤が含まれていてもよい。一部の実施態様では、ヒートシール層は、可塑剤(例えば、ポリグリコールもしくはポリエーテル、またはこれらのエステル)、粘着付与剤、および/または無機充填剤を含まないことができる。ヒートシール層はまた、一部の実施形態では、PLAポリマー以外の脂肪族ポリエステルを含まないこともできる。 The heat seal layer may include inorganic particles (such as silica) and / or slip agents (such as wax) and / or polytetrafluoroethylene dispersion. For some applications, an antioxidant may be included. In some embodiments, the heat seal layer can be free of plasticizers (eg, polyglycols or polyethers, or esters thereof), tackifiers, and / or inorganic fillers. The heat seal layer may also be free of aliphatic polyesters other than PLA polymers in some embodiments.
[接着促進剤]
本明細書において、用語「接着促進剤」は、ヒートシール層内のPLAポリマーに添加するか、またはヒートシール層とポリマー性ベース層との間の中間層として用いると、実施例の節における方法(ii)に従って測定して少なくとも200 g/インチのヒートシール強度をもたらす材料を意味する。この強度は、典型的には少なくとも300 g/インチであり、より典型的には少なくとも400 g/インチである。好ましくは、接着促進剤は、方法(ii)に従ってフィルムを剥がす際に凝集破壊状態をもたらし、ヒートシール層はそれぞれポリマー性ベース層に残り、かつ、分離は融着したヒートシール層内で起こる。好適な接着促進剤には、これらだけに限定されないが、エチレンコポリマー〔例えば、EVA(エチレン-ビニルアセテート)およびEMA(エチレン-メチルアクリレート)など〕、および粘着付与樹脂(例えば、ロジンエステルなど)が含まれる。
[Adhesion promoter]
As used herein, the term “adhesion promoter” is added to the PLA polymer in the heat seal layer, or when used as an intermediate layer between the heat seal layer and the polymeric base layer, the method in the Examples section. means a material that provides a heat seal strength of at least 200 g / inch measured according to (ii). This strength is typically at least 300 g / inch and more typically at least 400 g / inch. Preferably, the adhesion promoter provides a cohesive failure state when peeling the film according to method (ii), each heat seal layer remains in the polymeric base layer, and separation occurs within the fused heat seal layer. Suitable adhesion promoters include, but are not limited to, ethylene copolymers such as EVA (ethylene-vinyl acetate) and EMA (ethylene-methyl acrylate), and tackifying resins such as rosin esters. included.
一部の実施態様では、接着促進剤は、コポリエステル樹脂を含む。本明細書において用語「コポリエステル」は、少なくとも1種(好ましくは1種だか)の芳香族ジカルボン酸および少なくとも1種(好ましくは1種だか)の脂肪族ジカルボン酸、またはこれらの低級アルキルジエステル(最高で炭素原子14個のアルキルジエステル)とから、1種または2種のグリコールを用いて誘導されたポリエステルを意味する。コポリエステルの形成は、縮合またはエステル交換の公知の方法によって、一般に最高で約275℃までの温度で都合良く行わせることができる。代表的な芳香族ジカルボン酸には、テレフタル酸、イソフタル酸、フタル酸、および2,5-、2,6-、もしくは2,7-ナフタレンジカルボン酸が含まれる。代表的な脂肪族ジカルボン酸は、一般式 CnH2n(COOH)2(式中、nは2〜8である)の飽和脂肪族ジカルボン酸(例えば、コハク酸、セバシン酸、アジピン酸、アゼライン酸、スベリン酸、またはピメリン酸など)であり、セバシン酸、アジピン酸、およびアゼライン酸が好ましく、アゼライン酸がより好ましい。 In some embodiments, the adhesion promoter comprises a copolyester resin. As used herein, the term “copolyester” refers to at least one (preferably one) aromatic dicarboxylic acid and at least one (preferably one) aliphatic dicarboxylic acid, or lower alkyl diesters thereof ( Means a polyester derived from one or two glycols from up to 14 alkyl diesters of carbon atoms. The formation of the copolyester can be conveniently effected by known methods of condensation or transesterification, generally at temperatures up to about 275 ° C. Exemplary aromatic dicarboxylic acids include terephthalic acid, isophthalic acid, phthalic acid, and 2,5-, 2,6-, or 2,7-naphthalenedicarboxylic acid. Representative aliphatic dicarboxylic acids are saturated aliphatic dicarboxylic acids of the general formula C n H 2n (COOH) 2 where n is 2 to 8 (eg, succinic acid, sebacic acid, adipic acid, azelain). Acid, suberic acid, or pimelic acid), sebacic acid, adipic acid, and azelaic acid are preferred, and azelaic acid is more preferred.
一部の実施態様では、ポリエステルは、90%未満の芳香族ジカルボン酸(例えば、テレフタル酸など)と、少なくとも10%の脂肪族ジカルボン酸を含有する(%は、ポリエステルの全二酸含有量のモルパーセントである)。典型的には、芳香族ジカルボン酸の濃度は、少なくとも55モル%であり、60モル%以上であってもよい。この濃度は、コポリエステルのジカルボン酸成分に基づいて、典型的には約80モル%以下、より典型的には70重量%以下、最も典型的には65モル%以下である。コポリエステル中の脂肪族ジカルボン酸の濃度は、コポリエステル中のジカルボン酸成分に基づいて、典型的には少なくとも20モル%、より典型的には少なくとも35モル%であって、典型的には最高で45モル%までである。重量基準で表すと、芳香族および脂肪族のジカルボン酸の相対的な量はそれぞれの分子量にいくぶん依存するが、典型的には、少なくとも55重量%の芳香族ジカルボン酸と、少なくとも45重量%の脂肪族ジカルボン酸が存在する。 In some embodiments, the polyester contains less than 90% aromatic dicarboxylic acid (such as terephthalic acid) and at least 10% aliphatic dicarboxylic acid (% is the total diacid content of the polyester). Mole percent). Typically, the concentration of aromatic dicarboxylic acid is at least 55 mol% and may be 60 mol% or more. This concentration is typically about 80 mol% or less, more typically 70 wt% or less, and most typically 65 mol% or less, based on the dicarboxylic acid component of the copolyester. The concentration of the aliphatic dicarboxylic acid in the copolyester is typically at least 20 mol%, more typically at least 35 mol%, typically the highest, based on the dicarboxylic acid component in the copolyester. Up to 45 mol%. Expressed on a weight basis, the relative amounts of aromatic and aliphatic dicarboxylic acids are somewhat dependent on their respective molecular weights, but are typically at least 55% by weight aromatic dicarboxylic acid and at least 45% by weight. Aliphatic dicarboxylic acids are present.
好適なグリコールには、脂肪族グリコール(例えば、アルキレングリコールなど)が含まれる。さらに、好適なグリコールには、脂肪族ジオール(例えば、エチレングリコール、ジエチレングリコール、トリエチレングリコール、プロピレングリコール、1,3-ブタンジオール、1,4-ブタンジオール、1,5-ペンタンジオール、2,2-ジメチル-l,3-プロパンジオール、ネオペンチルグリコール、および1,6-ヘキサンジオールなど)が含まれる。エチレングリコールまたは1,4-ブタンジオールが典型的に用いられる。コポリエステルは、典型的には少なくとも50%アモルファスであり、完全にアモルファス(すなわち、示差走査熱量測定によって測定して少なくとも90%アモルファス)であってもよい。 Suitable glycols include aliphatic glycols such as alkylene glycols. In addition, suitable glycols include aliphatic diols (eg, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 2,2 -Dimethyl-1,3-propanediol, neopentyl glycol, and 1,6-hexanediol). Ethylene glycol or 1,4-butanediol is typically used. The copolyester is typically at least 50% amorphous and may be completely amorphous (ie, at least 90% amorphous as measured by differential scanning calorimetry).
前述したように、コポリエステルは、ヒートシール層内にPLAポリマーと共に分散されていてもよく、かつ/あるいは基材の一部を形成(すなわち、ポリマー性ベース層上に層を形成)していてもよい。 As described above, the copolyester may be dispersed with the PLA polymer in the heat seal layer and / or form part of the substrate (ie, form a layer on the polymeric base layer). Also good.
[ポリマー性ベース層]
ポリマー性ベース層は、当分野で公知の任意のフィルム形成性ポリマーを、それがPLAホモポリマーだけから製造されたフィルムより機械的に強度が高いことを条件に、含んでいてよい。例には、これらだけに限定されないが、ポリエステルフィルム、ナイロン(登録商標)フィルム、ポリエチレンもしくはエチレンコポリマーで作製されたフィルム、ポリプロピレンフィルム、および強化PLA材料で作製されたフィルムが含まれる。
[Polymeric base layer]
The polymeric base layer may include any film-forming polymer known in the art, provided that it is mechanically stronger than a film made solely from PLA homopolymer. Examples include, but are not limited to, polyester films, nylon films, films made of polyethylene or ethylene copolymers, polypropylene films, and films made of reinforced PLA materials.
本発明の一部の実施態様では、ポリマー性ベース層は、線状ポリエステル層、典型的には二軸配向線状ポリエステル層を含む。典型的には、線状ポリエステルは、約0.5〜約0.8、最も典型的には約0.6の固有粘度を有する。ポリエステルフィルムの例には、二軸配向ポリエチレンテレフタレート(PET)フィルム、および二軸配向ポリエチレンナフタレート(PEN)フィルムが含まれる。 In some embodiments of the present invention, the polymeric base layer comprises a linear polyester layer, typically a biaxially oriented linear polyester layer. Typically, the linear polyester has an intrinsic viscosity of about 0.5 to about 0.8, most typically about 0.6. Examples of polyester films include biaxially oriented polyethylene terephthalate (PET) film and biaxially oriented polyethylene naphthalate (PEN) film.
特に有用であるものは、二軸配向性であり且つヒートセット性であるポリエチレンテレフタレートである。このような材料は当分野において周知であり、例えば、Stokesの米国特許第4375494号(参照により本明細書に組み込む)に記載されている。 Particularly useful is polyethylene terephthalate that is biaxially oriented and heat set. Such materials are well known in the art and are described, for example, in Stokes US Pat. No. 4,375,494, incorporated herein by reference.
ポリエチレンテレフタレートポリマーの製造技術は、当業者に周知であり、例えば、Encyclopedia of Polymer Science and Engineering, 2nd. Ed., Vol. 12, Wiley, N. Y., pp. 1-313などの多くの文献に開示されている。ポリマーは、適切なジカルボン酸またはその低級アルキルジエステルをエチレングリコールと縮合させることによって典型的に得られる。ポリエチレンテレフタレートは、テレフタル酸またはそのエステルから形成され、ポリエチレンナフタレートは、2,6-ナフタレンジカルボン酸またはそのエステルから形成される。 Production techniques for polyethylene terephthalate polymers are well known to those skilled in the art, and are disclosed in, for example, many documents such as Encyclopedia of Polymer Science and Engineering, 2nd. Ed., Vol. 12, Wiley, NY, pp. 1-313. ing. The polymer is typically obtained by condensing a suitable dicarboxylic acid or its lower alkyl diester with ethylene glycol. Polyethylene terephthalate is formed from terephthalic acid or its ester, and polyethylene naphthalate is formed from 2,6-naphthalenedicarboxylic acid or its ester.
共押出しされた二層のポリエステル/コポリエステルフィルムを、その上にPLAをコーティングする基材として用いる場合、この二層フィルム複合体は、複数のオリフィスダイによる多段押出しまたは複合層の共押出し(例えば、米国特許第3871947号に広く記載されている)、その後の1方向もしくは2方向への延伸による分子配向、およびヒートセットを含む方法によって都合良く製造することができる。単一チャネルの共押出しとして知られている共押出しのための簡便な方法および装置が、米国特許第4165210号および英国特許明細書第1115007号に記載されている。この方法は、同時に、第一および第二のポリエステルの流れを2つの異なる押出機から押出し、これらの2つの流れをチューブを通して押出ダイのマニホールドに導き、さらに、2つのポリエステルを、2つのポリエステルが混合されることなく流れの相異なる領域を占めるような層流条件下で、そのダイを通して一緒に押し出すことによって、フィルム複合体を製造する。 When a co-extruded bi-layer polyester / copolyester film is used as the substrate on which the PLA is coated, the bi-layer film composite can be multi-stage extruded with multiple orifice dies or co-extruded with composite layers (e.g., , Widely described in U.S. Pat. No. 3,871,947), followed by molecular orientation by stretching in one or two directions, and heat-set methods. A convenient method and apparatus for coextrusion, known as single channel coextrusion, is described in U.S. Pat. No. 4,165,210 and British Patent Specification 1111507. This method simultaneously extrudes the first and second polyester streams from two different extruders, directs these two streams through the tube to the extrusion die manifold, and further converts the two polyesters into two Film composites are produced by extruding together through the die under laminar flow conditions that occupy different regions of the flow without mixing.
フィルム複合体のポリエチレンテレフタレート部分の二軸配向は、複合体を、順次2つの互いに直交した方向に、典型的には78℃〜125℃の範囲の温度で延伸させることによって達成することができる。一般に、複合体を延伸させるための条件は、第一の熱接着性層を部分的に結晶化させる働きをしうる。さらにこのような場合には、フィルム複合体を、寸法束縛条件下で、第一の熱接着性層結晶溶融温度より高いがポリエチレンテレフタレート部分の結晶溶融温度より低い温度でヒートセットさせることが好ましい。次いで、この複合体を、放冷するかまたは冷却して、第一の熱接着性層が本質的にアモルファスである一方、PET部分には高い結晶性が維持されるようにする。したがって、延伸操作に続いて、寸法束縛条件下、150℃〜250℃の範囲の温度でヒートセットさせることが好ましい。都合のよい延伸法およびヒートセット法は、米国特許第3107139号に記載されている。ここに記載されている、ポリエステルベース層、およびポリエステルベース層上のコポリエステル層を組み込んだ、共押出しされたフィルム複合体は、MELINEX(登録商標)301Hの名称の下で、DuPont Teijin Films社(Wilmington、DE)から商業的に入手可能である。上述したように、これらは、本発明に従って、PLAコーティング組成物中に追加的なコポリエステルを含ませて、あるいは追加的なコポリエステルを含ませないで、PLAポリマーでコーティングすることができる。 Biaxial orientation of the polyethylene terephthalate portion of the film composite can be achieved by stretching the composite sequentially in two mutually orthogonal directions, typically in the range of 78 ° C to 125 ° C. In general, the conditions for stretching the composite can serve to partially crystallize the first thermal adhesive layer. Furthermore, in such a case, it is preferable to heat-set the film composite at a temperature higher than the crystal melting temperature of the first thermoadhesive layer but lower than the crystal melting temperature of the polyethylene terephthalate portion under the dimension constraint conditions. The composite is then allowed to cool or cool so that the first thermal adhesive layer is essentially amorphous while the PET portion remains highly crystalline. Therefore, following the stretching operation, it is preferable to heat set at a temperature in the range of 150 ° C. to 250 ° C. under dimensional constraint conditions. A convenient stretching and heat setting method is described in US Pat. No. 3,107,139. The coextruded film composite described herein, incorporating a polyester base layer, and a copolyester layer on the polyester base layer, is manufactured under the name MELINEX® 301H by DuPont Teijin Films ( Wilmington, DE) is commercially available. As described above, they can be coated with PLA polymers in accordance with the present invention with or without additional copolyesters in the PLA coating composition.
[多層シーラントフィルムの製造]
本発明の多層フィルムは、ポリマー性基材を、溶媒中のPLAポリマー溶液(場合により、接着促進剤も含有する溶液)でコーティングすることによって製造することができる。本明細書において、用語「溶媒」は、PLAポリマーおよび接着促進剤の一方または双方のための揮発性の担体を意味し、得られる混合物は、エマルション、マイクロエマルション、または他の分散体であってよく、厳密な意味で完全な溶液であってもよい。好適な溶媒には、これらだけに限定されないが、水、テトラヒドロフラン、メチルエチルケトン、トルエンなどが含まれる。溶媒として水を用いる場合、乳化剤を使用してエマルションまたはマイクロエマルションを製造することができる。
[Manufacture of multilayer sealant film]
The multilayer film of the present invention can be produced by coating a polymeric substrate with a PLA polymer solution (optionally also containing an adhesion promoter) in a solvent. As used herein, the term “solvent” means a volatile carrier for one or both of the PLA polymer and adhesion promoter, and the resulting mixture is an emulsion, microemulsion, or other dispersion. It may be a complete solution in a strict sense. Suitable solvents include but are not limited to water, tetrahydrofuran, methyl ethyl ketone, toluene and the like. When water is used as a solvent, an emulsifier can be used to produce an emulsion or microemulsion.
PLAポリマーを単独で用いる場合、PLAポリマーがコーティングされる基材の側面は、接着促進層を有していなければならない。例えば、溶媒コーティングされたコポリエステル層を有するポリエステルフィルムを用いることができるが、共押出しされた多層(典型的には二層)のポリエステル/コポリエステルフィルムを用いることもできる。いずれの場合でも、PLAポリマーを、その後、基材上にコーティングして多層フィルムを得る。 When the PLA polymer is used alone, the side of the substrate on which the PLA polymer is coated must have an adhesion promoting layer. For example, a polyester film having a solvent-coated copolyester layer can be used, but a co-extruded multilayer (typically two-layer) polyester / copolyester film can also be used. In either case, the PLA polymer is then coated onto the substrate to obtain a multilayer film.
コーティングは、当分野に公知の任意の方法、例えば、反転計測およびグラビアを含む方法で行うことができる。本発明者は、溶媒コーティング法を用いることによって、比較的薄いヒートシール層(例えば、0.5〜20ミクロン)を有する多層フィルムを製造することが可能であることを見いだした。このような比較的薄い層は、他の方法(例えば、押出しまたは共押出しコーティングなど)によって得ることが困難であることが多い。したがって、本発明は、他の方法(例えば、ラミネーションまたは押出しコーティングなど)によって製造される他の構造体と比較して、高い面積-重量比を有する多層フィルムの入手を可能にする。さらに、より薄いヒートシール層により、一部の用途(例えば、シール包装された食品容器など)において有利な、より容易に除去可能な(剥離可能な)シールももたらされる。 Coating can be done by any method known in the art, for example, methods involving inversion metrology and gravure. The inventor has found that by using a solvent coating method, it is possible to produce a multilayer film having a relatively thin heat seal layer (eg, 0.5-20 microns). Such relatively thin layers are often difficult to obtain by other methods such as extrusion or coextrusion coating. The present invention thus makes it possible to obtain multilayer films having a high area-to-weight ratio compared to other structures produced by other methods, such as lamination or extrusion coating. In addition, a thinner heat seal layer also provides a more easily removable (peelable) seal that is advantageous in some applications (eg, sealed packaged food containers).
[多層シーラントフィルムの用途]
上述したように、本発明のフィルムは、特に、密閉容器(例えば、PLAトレイなど)において、容器にふたをするフィルムとして使用することができる。典型的には、このようなトレイまたは他のうつわは、ポリ乳酸ホモポリマーでできているが、乳酸とコモノマー(これらだけに限定されないが、ヒートシール層に用いるPLAポリマーについて上述により言及したコモノマーを含む)とのコポリマーを、本発明に従って用いてもよい。しかし、他の種類の容器を、これらのフィルムでシールすることもでき、このような使用も本発明において想定されている。本質的に、開口部を有する任意のうつわをフィルムの側面にヒートシール層を有する本発明の多層フィルムでシールすることができる。
[Use of multilayer sealant film]
As described above, the film of the present invention can be used as a film for covering a container, particularly in a closed container (for example, a PLA tray). Typically, such trays or other vessels are made of polylactic acid homopolymers, but are not limited to lactic acid and comonomers (including, but not limited to, the comonomers mentioned above for PLA polymers used in heat seal layers). Copolymers) may be used in accordance with the present invention. However, other types of containers can be sealed with these films, and such use is also envisaged in the present invention. Essentially any container with an opening can be sealed with the multilayer film of the present invention having a heat seal layer on the side of the film.
以下の試験法を下記実施例で用いる。 The following test methods are used in the examples below.
[試料の試験法]
(i)トレイへのヒートシール強度を、以下のように測定する。フィルムを、ヒートシール機上のPLAトレイ製容器のシートに、200 °F、35 psiの圧力で0.5秒間、そのヒートシール層によってヒートシールする。シールされたフィルムおよびトレイのストリップ(25 mm幅)を、シールに対して90 °で切り出し、Instron operatingを使用して0.25 m/分のクロスヘッド速度でシールを引き剥がすのに必要とされる荷重を測定する。この手順を通常4回繰り返し、5つの結果の平均値を算出する。
[Sample test method]
(I) The heat seal strength to the tray is measured as follows. The film is heat sealed to the PLA tray container sheet on the heat sealer with its heat seal layer at 200 ° F. and 35 psi pressure for 0.5 seconds. The required load to cut a sealed film and tray strip (25 mm wide) at 90 ° to the seal and peel off the seal using the Instron operating at a crosshead speed of 0.25 m / min Measure. This procedure is usually repeated 4 times and the average of the 5 results is calculated.
(ii)複合体フィルムのそれ自体へのヒートシール強度を、以下のように測定する。2つのフィルムサンプルのヒートシール層を、一緒に置き、35 psiの圧力下、230 °Fで0.5秒間加熱する。シールしたフィルムを室温に冷まし、シールした複合体を25 mm幅のストリップに切り出す。ヒートシール強度は、フィルムの層を0.25 m/分のクロスヘッド速度で引き剥がすために直線的な張力下で必要とされる、単位シール幅当たりの力を測定することによって決定する。 (Ii) The heat seal strength of the composite film to itself is measured as follows. The heat seal layers of the two film samples are placed together and heated at 230 ° F. for 0.5 seconds under a pressure of 35 psi. Allow the sealed film to cool to room temperature and cut the sealed composite into 25 mm wide strips. Heat seal strength is determined by measuring the force per unit seal width required under linear tension to peel the layers of film at a crosshead speed of 0.25 m / min.
(iii)結晶性の割合は、示差走査熱量分析によって測定することができる。5 mgの試料をフィルムから取り、Perkin Elmer DSC7B示差走査熱量計で0℃から300℃まで80℃/分で加熱する。結晶性の割合は、結晶性が全ての試料に存在することを前提とする。 (Iii) The crystallinity ratio can be measured by differential scanning calorimetry. A 5 mg sample is taken from the film and heated from 0 ° C. to 300 ° C. at 80 ° C./min with a Perkin Elmer DSC7B differential scanning calorimeter. The crystallinity ratio assumes that crystallinity is present in all samples.
[試料の調製]
コーティング溶液#1の調製:99 gのPLA 4060D(NatureWorks LLC(Minnetonka、MN)から購入した低結晶性D,L-ポリ乳酸ポリマー)、0.5 gのKEMAMIDE Eブロッキング防止剤(Witcoから購入)、およびSYLOID 244スリップ剤(W.R. Graceから購入)を、500 gのテトラヒドロフラン(THF)に添加した。この混合物を、30分間撹拌してコーティング溶液#1を得た。
[Sample preparation]
Preparation of Coating Solution # 1: 99 g PLA 4060D (low crystalline D, L-polylactic acid polymer purchased from NatureWorks LLC (Minnetonka, Minn.)), 0.5 g KEMAMIDE E antiblocking agent (purchased from Witco), and SYLOID 244 slip agent (purchased from WR Grace) was added to 500 g of tetrahydrofuran (THF). This mixture was stirred for 30 minutes to obtain Coating Solution # 1.
コーティング溶液#2の調製:69 gのPLA 4060D、30 gのアゼライン酸/テレフタル酸/エチレングリコールのコポリエステル(45/55/100モル当量)、0.5 gのKEMAMIDE E、および0.5 gのSYLOID 244を、400 gのテトラヒドロフラン(THF)に添加した。この混合物を、30分間撹拌してコーティング溶液#2を得た。 Preparation of Coating Solution # 2: 69 g PLA 4060D, 30 g azelaic acid / terephthalic acid / ethylene glycol copolyester (45/55/100 molar equivalent), 0.5 g KEMAMIDE E, and 0.5 g SYLOID 244 To 400 g of tetrahydrofuran (THF). This mixture was stirred for 30 minutes to give Coating Solution # 2.
試料1:コーティング溶液#1を、92ゲージMYLAR Eフィルム(DuPont Teijin Films社製の二軸配向ポリエチレンテレフタレートフィルム)上に、順送りのコーティング法によってコーティングした。ロールギャップを調整して、8 g/m2の乾燥コーティング重量を達成させた。濡れたコーティングを、100℃で1分間乾燥させた。 Sample 1: Coating solution # 1 was coated on 92 gauge MYLAR E film (biaxially oriented polyethylene terephthalate film manufactured by DuPont Teijin Films) by a progressive coating method. Adjust the roll gap was achieved a dry coating weight of 8 g / m 2. The wet coating was dried at 100 ° C. for 1 minute.
試料2:コーティング溶液#1を、MYLAR 100OLフィルム(DuPont Teijin Films社製造のコポリエステル層を有する二軸配向ポリエチレンテレフタレートフィルム)上に、順送りのコーティング法によってコーティングした。ロールギャップを調整して、8 g/m2の乾燥コーティング重量を達成させた。濡れたコーティングを、100℃で1分間乾燥させた。 Sample 2: Coating solution # 1 was coated on a MYLAR 100OL film (biaxially oriented polyethylene terephthalate film with a copolyester layer manufactured by DuPont Teijin Films) by a progressive coating method. Adjust the roll gap was achieved a dry coating weight of 8 g / m 2. The wet coating was dried at 100 ° C. for 1 minute.
試料3:コーティング溶液#2を、92ゲージMYLAR Eフィルム(DuPont Teijin Films社製)上に、順送りのコーティング法によってコーティングした。ロールギャップを調整して、8 g/m2の乾燥コーティング重量を達成させた。濡れたコーティングを、100℃で1分間乾燥させた。 Sample 3: Coating solution # 2 was coated on 92 gauge MYLAR E film (DuPont Teijin Films) by a progressive coating method. Adjust the roll gap was achieved a dry coating weight of 8 g / m 2. The wet coating was dried at 100 ° C. for 1 minute.
試料4:コーティング溶液#2を、MYLAR 100OLフィルム(DuPont Teijin Films社製)上に、順送りのコーティング法によってコーティングした。ロールギャップを調整して、8 g/m2の乾燥コーティング重量を達成させた。濡れたコーティングを、100℃で1分間乾燥させた。 Sample 4: Coating solution # 2 was coated on a MYLAR 100OL film (DuPont Teijin Films) by a progressive coating method. Adjust the roll gap was achieved a dry coating weight of 8 g / m 2. The wet coating was dried at 100 ° C. for 1 minute.
試料1〜4において調製したフィルムを、上述した方法(i)および(ii)に従って、それぞれ、PLAトレー製造ストック、およびそのフィルム自体に、ヒートシールさせた。得られたヒートシール強度を下記表にg/インチで示す。
試料1と2とを比較することにより、コポリエステルの中間層を有するベースフィルム上の、PLAのみを含有するヒートシール層(試料2)のヒートシール性能は、中間コポリエステル層を有さないベースフィルム上の、PLAのみを含有するヒートシール層(試料1)のヒートシール性能より良好であることが分かる。さらに、試料1と3とを比較することにより、中間コポリエステル層が存在しない場合、PLAヒートシール層にコポリエステルを添加すると(試料3)、PLAのみを含有するヒートシール層(試料1)より高いヒートシール強度が得られることが分かる。最後に、試料4を試料2または試料3のいずれかと比較することにより、PLAヒートシール層内にコポリエステルを含ませること、およびコポリエステルを中間層として含ませることにより、それぞれ含ませないものより良い性能がもたらされることが分かる。 By comparing Samples 1 and 2, the heat seal performance of the heat seal layer containing only PLA (Sample 2) on the base film having the copolyester intermediate layer is the base without the intermediate copolyester layer. It can be seen that the heat seal performance of the heat seal layer (sample 1) containing only PLA on the film is better. Further, by comparing Samples 1 and 3, when no intermediate copolyester layer is present, adding a copolyester to the PLA heat seal layer (Sample 3) results in a heat seal layer containing only PLA (Sample 1). It can be seen that high heat seal strength can be obtained. Finally, by comparing sample 4 with either sample 2 or sample 3, by including a copolyester in the PLA heat seal layer and by including the copolyester as an intermediate layer, respectively It turns out that good performance is brought about.
本発明を、特定の実施態様を参照することにより本明細書において説明および記述しているが、本発明がこれらの明らかにした詳細に限定されることを意図するものではない。むしろ、本発明から逸脱することなく特許請求の範囲およびその均等範囲内の詳細において、多様な変形がなされ得る。 Although the invention is illustrated and described herein with reference to specific embodiments, it is not intended that the invention be limited to these apparent details. Rather, various modifications may be made in the claims and details within their scope without departing from the invention.
Claims (13)
a)コーティング液を、ポリマー性ベース層を含む基材に適用する工程であって、
前記コーティング液が溶媒およびPLAポリマーを含み、
前記コーティング液が、接着促進剤をさらに含むか、あるいは前記基材が、前記コーティング液を受容するための前記ポリマー性ベース層の表面上の層内に、接着促進剤をさらに含むかのいずれかである、工程と、
b)溶媒を除去して、前記PLAポリマーを含むヒートシール層を形成させる工程と
を含み、
前記ポリマー性ベース層が、ポリエチレンテレフタート層を含み、
前記接着促進剤が、エチレンコポリマーであるか、または、1種以上のグリコール、少なくとも1種の芳香族ジカルボン酸、および少なくとも1種の脂肪族ジカルボン酸から誘導されるコポリエステル樹脂であり、かつ、
前記ヒートシール層が、0.5〜10ミクロンの範囲の厚さである、方法。 A method for producing a multilayer film for use in sealing a container,
a) applying a coating solution to a substrate comprising a polymeric base layer,
The coating solution includes a solvent and a PLA polymer;
Either the coating solution further comprises an adhesion promoter, or the substrate further comprises an adhesion promoter in a layer on the surface of the polymeric base layer for receiving the coating solution. A process,
b) removing the solvent to form a heat seal layer containing the PLA polymer,
The polymeric base layer comprises a polyethylene terephthalate layer;
The adhesion promoter is an ethylene copolymer or a copolyester resin derived from one or more glycols, at least one aromatic dicarboxylic acid, and at least one aliphatic dicarboxylic acid, and
The method wherein the heat seal layer has a thickness in the range of 0.5 to 10 microns.
a)コーティング液を、ポリマー性ベース層を含む基材に適用する工程であって、
前記コーティング液が溶媒およびPLAポリマーを含み、
前記基材が、前記コーティング液を受容するための前記ポリマー性ベース層の表面上の層内に、接着促進剤をさらに含む、工程と、
b)溶媒を除去して、前記PLAポリマーを含むヒートシール層を形成させる工程と
を含み、
前記コーティング液を適用する工程が、前記接着促進剤を有する前記表面に前記コーティング液を適用する工程を含み、
前記ポリマー性ベース層が、ポリエチレンテレフタート層を含み、
前記接着促進剤が、エチレンコポリマーであるか、または、1種以上のグリコール、少なくとも1種の芳香族ジカルボン酸、および少なくとも1種の脂肪族ジカルボン酸から誘導されるコポリエステル樹脂であり、かつ、
前記ヒートシール層が、0.5〜10ミクロンの範囲の厚さである、方法。 A method for producing a multilayer film for use in sealing a container,
a) applying a coating solution to a substrate comprising a polymeric base layer,
The coating solution includes a solvent and a PLA polymer;
The substrate further comprises an adhesion promoter in a layer on the surface of the polymeric base layer for receiving the coating fluid ;
b) removing the solvent to form a heat seal layer containing the PLA polymer;
Including
Applying said coating liquid, it sees contains the step of applying the coating liquid to the surface with the adhesion promoter,
The polymeric base layer comprises a polyethylene terephthalate layer;
The adhesion promoter is an ethylene copolymer or a copolyester resin derived from one or more glycols, at least one aromatic dicarboxylic acid, and at least one aliphatic dicarboxylic acid, and
The method wherein the heat seal layer has a thickness in the range of 0.5 to 10 microns .
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JP2013018549A (en) | 2013-01-31 |
EP2046873A2 (en) | 2009-04-15 |
US20130313260A1 (en) | 2013-11-28 |
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CN101563405B (en) | 2012-08-22 |
KR101470353B1 (en) | 2014-12-09 |
US9073674B2 (en) | 2015-07-07 |
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