JP5436214B2 - 標準インターフェースを備えた電子装置ケーシング - Google Patents
標準インターフェースを備えた電子装置ケーシング Download PDFInfo
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- JP5436214B2 JP5436214B2 JP2009535662A JP2009535662A JP5436214B2 JP 5436214 B2 JP5436214 B2 JP 5436214B2 JP 2009535662 A JP2009535662 A JP 2009535662A JP 2009535662 A JP2009535662 A JP 2009535662A JP 5436214 B2 JP5436214 B2 JP 5436214B2
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- 239000004020 conductor Substances 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
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- 238000000034 method Methods 0.000 claims description 9
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- 238000007789 sealing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000004642 Polyimide Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
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- 238000003908 quality control method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
DE102004033559A1において、ケーシングの内側とケーシングの外側との間に配置されていて、ケーシング壁に不動に包埋射出成形されているか、又はプレス加工されて包囲されている接続部が記載されている。この場合、ケーシング壁は中空室を有していて、この中空室内に付加的なシール材料が供給される。シール材料は電気的な接続部を包囲し、ケーシング壁を抜ける電気的な接続部の貫通案内部をシールする。付加的には、シール材料によって、カバー及び/又は底部を備えたケーシング壁のシールが可能になる。
従って本発明の課題は、フレキシブルなプリント配線板として形成された、ケーシング内室とケーシング外室との間における少なくとも1つの電子的な接続部を備えた、電子的な制御装置のための複数のケーシングのための可変のコンセプトを提示することである。電子的な接続部は、ケーシングの外側に位置する構成要素への、統一的で簡単でフレキシブルな接続を可能にする。更に電気的な接続部の貫通案内部のシールは、有利には、気密であることが望ましく、高い機械的な負荷及び高い化学的な負荷に対して、高温時であっても制御装置の全寿命にわたって耐えることが望ましい。このことは、本発明によれば請求項1記載の装置及び、請求項8記載の当該装置を製造するための方法によって達成される。
Claims (10)
- 電子的な装置のためのケーシング(2)であって、該ケーシング(2)が少なくとも1つのケーシング底部(3)と、ケーシングカバー(4)と、ケーシング底部(3)に固定されたフレキシブルなプリント配線板の形式の少なくとも1つの電子的な接続部(5)と、ケーシングカバー(4)の内部において電子的な接続部(5)に接続されている電子的な基板(7)とを有しており、電子的な接続部(5)の端部領域は前記ケーシングの外側に位置する構成要素と直接的に接触接続される、電子的な装置のためのケーシングにおいて、
電子的な接続部(5)が、前記ケーシングの外側に位置する構成要素と直接的に接触接続するための少なくとも1つの開放された銅導体路の領域(9)を有しており、該領域の幅が、前記ケーシングの外側に位置する構成要素の接触接続部形式に適合されており、前記領域の長さが、前記接触接続部形式が前記開放された銅導体路の領域(9)に接触接続するために必要としているよりも大きく設定されていて、ケーシング底部(3)が、ケーシングカバー(4)よりも大きな底面を有していて、少なくとも1つの開放された銅導体路の領域(9)が、接触接続部カバー(11)によってのみ覆われていることを特徴とする、電子的な装置のためのケーシング。 - 平行に延在する複数の開放された銅導体路の領域(9)を有している、請求項1記載のケーシング。
- 電子的な接続部(5)が多層のフレキシブルなプリント配線板である、請求項1又は2記載のケーシング。
- フレキシブルなプリント配線板(5)がケーシング底部(3)を越えて突出している、請求項1から3までのいずれか一項記載のケーシング。
- 電子的な接続部(5)が少なくとも2つ又は複数のフレキシブルなプリント配線板(17)から形成される、請求項1から4までのいずれか一項記載のケーシング。
- ケーシングの外側に位置する構成要素が、電子的な接続部(5)に直接溶接されているか、又ははんだ付けされている、請求項1から5までのいずれか一項記載のケーシング。
- 請求項1から6までのいずれか一項記載の特徴を備えたケーシング(2)を製造するための方法において、
少なくとも1つの電子的な接続部(5)を、ケーシング底部(3)に設け、且つ前記ケーシングカバー(4)の内部の電子的な基板(7)と、前記ケーシングの外側に位置する構成要素とに接続し、ケーシングカバー(4)をシールゾーン(6)において電子的な接続部(5)に取り付けることを特徴とする、ケーシングを製造するための方法。 - 電子的な基板(7)と電子的な接続部(5)との接続を、太径ワイヤボンディングを介して行い、周辺の構成要素と電子的な接続部(5)との接続を、はんだ付け、溶接又は圧着を介して行う、請求項7記載の方法。
- 少なくとも1つのフレキシブルなプリント配線板を、電子的な接続部(5)としてケーシング底部(3)にラミネートする、請求項7又は8記載の方法。
- 請求項1から6までのいずれか一項記載のケーシング(2)を自動車の伝達制御部のために使用することを特徴とする、ケーシングの使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006052459.4 | 2006-11-07 | ||
DE102006052459A DE102006052459A1 (de) | 2006-11-07 | 2006-11-07 | Elektronikgehäuse mit Standardinterface |
PCT/EP2007/061249 WO2008055766A1 (de) | 2006-11-07 | 2007-10-22 | Elektronikgehäuse mit standardinterface |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010508675A JP2010508675A (ja) | 2010-03-18 |
JP5436214B2 true JP5436214B2 (ja) | 2014-03-05 |
Family
ID=39106181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009535662A Expired - Fee Related JP5436214B2 (ja) | 2006-11-07 | 2007-10-22 | 標準インターフェースを備えた電子装置ケーシング |
Country Status (6)
Country | Link |
---|---|
US (1) | US8674220B2 (ja) |
EP (1) | EP2033269B1 (ja) |
JP (1) | JP5436214B2 (ja) |
CN (1) | CN101548437B (ja) |
DE (1) | DE102006052459A1 (ja) |
WO (1) | WO2008055766A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008009947A1 (de) * | 2008-02-20 | 2009-08-27 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Vorrichtung zur Aufnahme eines elektrischen/elektronischen Bauteils und entsprechendes Montageverfahren sowie Abdeckung für eine solche Vorrichtung |
DE102010061976A1 (de) * | 2010-11-25 | 2012-05-31 | Robert Bosch Gmbh | Befestigtes elektronisches Getriebesteuerungsmodul |
DE102011076661B4 (de) * | 2011-05-30 | 2024-03-14 | Zf Friedrichshafen Ag | Steuervorrichtung für ein Getriebe eines Fahrzeugs und Verfahren zum Montieren einer Steuervorrichtung für ein Getriebe eines Fahrzeugs |
DE102012200986A1 (de) * | 2012-01-24 | 2013-07-25 | Zf Friedrichshafen Ag | Leiterplatte für ein elektronisches Steuergerät, Verfahren zum Bestücken einer Leiterplatte, elektronisches Steuergerät mit einer Leiterplatte und Verfahren zum Montieren eines Steuergeräts |
CN103391691B (zh) * | 2012-05-10 | 2016-08-10 | 深南电路有限公司 | 电路板及其制造方法 |
JP6927323B2 (ja) * | 2017-12-01 | 2021-08-25 | 日本電信電話株式会社 | 平面光波路型光デバイス |
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DE10340974A1 (de) | 2003-09-05 | 2005-03-24 | Robert Bosch Gmbh | Steuergeräteeinheit und Verfahren zur Hestellung derselben |
DE102004033559A1 (de) | 2004-07-09 | 2006-02-09 | Zf Friedrichshafen Ag | Abdichtung eines Steuergerätes |
DE102004036683A1 (de) | 2004-07-28 | 2006-03-30 | Siemens Ag | Steuervorrichtung, insbesondere mechatronisches Getriebe- oder Motorsteuergerät |
DE102004050687B4 (de) | 2004-10-18 | 2019-01-31 | Continental Automotive Gmbh | Kontaktierungsanordnung für eine flexible Leiterplatte und deren Verwendung |
DE102005002813B4 (de) | 2005-01-20 | 2006-10-19 | Robert Bosch Gmbh | Steuermodul |
DE102005003448B4 (de) | 2005-01-25 | 2015-08-20 | Continental Automotive Gmbh | Systemkomponente eines Steuergerätes und Steuergerät mit einer solchen Systemkomponente |
JP4556715B2 (ja) * | 2005-03-14 | 2010-10-06 | オムロン株式会社 | 配線基板の製造方法、配線基板、回路素子、通信装置、および計測装置 |
DE102005015717A1 (de) | 2005-03-31 | 2006-10-05 | Robert Bosch Gmbh | Elektrische Schaltungsanordung |
-
2006
- 2006-11-07 DE DE102006052459A patent/DE102006052459A1/de not_active Withdrawn
-
2007
- 2007-10-22 WO PCT/EP2007/061249 patent/WO2008055766A1/de active Application Filing
- 2007-10-22 US US12/513,615 patent/US8674220B2/en not_active Expired - Fee Related
- 2007-10-22 CN CN200780035557.7A patent/CN101548437B/zh not_active Expired - Fee Related
- 2007-10-22 JP JP2009535662A patent/JP5436214B2/ja not_active Expired - Fee Related
- 2007-10-22 EP EP07821613.2A patent/EP2033269B1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
CN101548437B (zh) | 2014-04-23 |
US20100067202A1 (en) | 2010-03-18 |
WO2008055766A1 (de) | 2008-05-15 |
JP2010508675A (ja) | 2010-03-18 |
US8674220B2 (en) | 2014-03-18 |
EP2033269B1 (de) | 2013-09-11 |
EP2033269A1 (de) | 2009-03-11 |
DE102006052459A1 (de) | 2008-06-05 |
CN101548437A (zh) | 2009-09-30 |
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