JP5417250B2 - Embossed carrier tape, method for manufacturing the same, and packaged part wound body - Google Patents

Description

  The present invention relates to an embossed carrier tape for storing electrical components, electronic components and the like in a component storage portion, a method for manufacturing the tape, and a packaged component wound body.

When transporting an electronic component or the like to a mounting machine, a carrier tape provided with a concave component storage portion for storing a component such as an electronic component is used.
As a carrier tape, a part of the base material is removed by punching, then a bottom tape is attached to the back of the base material and a punched carrier tape with a component storage part is processed into a concave shape. In general, an embossed carrier tape in which a component storage portion (embossed portion) is formed, a press carrier tape in which a component storage portion is provided by compressing a part of a base material, and the like are generally used.

  In recent years, miniaturization of electronic components has progressed. For example, vertical and horizontal dimensions are 1.6 × 0.8 mm (1608 chips), 1.0 × 0.5 mm (1005 chips), 0.6 × 0.3 mm ( 0603 chips), carrier tapes suitable for housing fine parts such as electronic parts of 0.4 × 0.2 mm (0402 chips) have come to be used.

Carrier tapes used for such fine parts are generally those using a paper base material as a base material, and carrier tapes using a paper base material are generally punched carrier tapes or press carrier tapes. It was. Since these carrier tapes are subjected to shearing or compression processing by a press punch when providing a component storage portion, there is a problem that foreign matters such as burrs and burrs are generated. Such foreign matter causes a reduction in mounting accuracy and mounting rate. Further, when a paper base material is used, dimensional changes due to moisture absorption, generation of paper powder due to friction between paper base materials or between the paper base material and the mounting machine guide, mounting errors due to peeling charging, and the like are likely to occur.
For this reason, instead of a carrier tape using a paper base material, an embossed carrier tape made of plastic having excellent cost and dimensional accuracy is used.
In addition, as described above, the size of the components to be stored has become smaller and lighter, and since high-speed mounting has been performed, the components adhere to the embossed carrier tape or cover tape due to static electricity, and the components are removed. There arises a problem that it cannot be stored normally. For this reason, the market demand of the conductive embossed carrier tape to which conductivity was given is increasing.

  An embossed carrier tape using a resin base material is, for example, that a base sheet is disposed between a punch and a die having a punch receiving hole into which the punch is inserted, and then the punch is inserted into the punch receiving hole. And formed by press molding for stretching the base sheet. A clearance is formed between the side surface of this punch and the inner peripheral surface of the punch receiving hole. By forming this clearance, local excessive stretching of the base sheet is prevented, and the embossed carrier tape The strength of the is maintained.

  Such an embossed carrier tape has a taper shape in which the inner surface of the component storage portion spreads toward the opening, and the peripheral edge of the opening of the component storage portion is a curved surface derived from the manufacture thereof. And ease of mounting, ease of molding, and the like. If the embossed carrier tape has a curved surface at the periphery of the opening of the component storage part, the shape accuracy such as the rectangularity of the opening part decreases, and it is difficult to store the part in a predetermined position. When the side surface is tapered, it is difficult to stably store the fine parts. For example, when a fine component is stored, the gap between the inner surface of the component storage part and the fine part is large, and it is difficult to store the fine part at a predetermined position, or the fine part moves in the part storage part. Since it is easy, even if it is stored at a predetermined position at the beginning, the position may be shifted due to vibration or impact. Such low storage stability hinders speeding up of the taping machine, high mounting density in the mounting process, and narrow adjacent mounting, and decreases storage stability during taping, mounting accuracy and mounting rate during mounting. Cause it.

  In order to solve such a problem, an embossed carrier tape in which a base material between a plurality of recesses is compressed and thinned has been proposed (for example, Patent Document 1). According to the embossed carrier tape of Patent Document 1, the dimensional accuracy of the recesses, the storage stability during taping, the mounting accuracy during mounting, the mounting rate, and the like are improved.

JP 2006-272952 A

However, the above-described technique still cannot satisfy the storage stability of the embossed carrier tape.
In particular, when an embossed carrier tape having a shallow interior (concave portion) of the component storage unit is manufactured by press molding in order to store a thin fine component, the inclination of the inner surface of the component storage unit is directed from the inner bottom surface toward the opening. , Will become more widespread. In addition, the curvature radius of the curved surface at the periphery of the opening of the component storage portion is easily increased. This is because a clearance is formed between the punch receiving hole and the punch. Therefore, if the punch insertion distance into the punch receiving hole is shortened, stretching of the punch receiving hole in the depth direction in the base material sheet is reduced. This is because the bending of the base sheet with respect to the depth direction of the punch receiving hole is reduced at the periphery of the receiving hole. Then, when the inclination of the inner side surface of the component storage portion increases or the curvature radius of the curved surface around the opening portion increases, there is a problem that the stored components are likely to be displaced or popped out.
On the other hand, if the clearance between the punch and the punch receiving hole is simply narrowed in order to reduce the inclination of the inner surface of the component storage unit, the substrate sheet may be stretched locally, resulting in a form defect such as breakage. is there. In addition, simply reducing the taper angle of the inner surface of the component storage portion or reducing the opening area of the recess opening portion causes a problem that it becomes difficult to store the component in the component storage portion.
The present invention has been made in view of the above circumstances, and it is possible to easily store components in the component storage portion, and to emboss carrier tape that can stabilize the storage state of components in the component storage portion, a manufacturing method thereof, and packaging The purpose is a part winding body.

[1] The embossed carrier tape of the present invention is provided with a concave component storage portion that opens on one surface of a long resin base material sheet and bulges on the other surface of the base material sheet. In the embossed carrier tape, on the other surface of the base sheet, a pair of first grooves extending in the width direction of the base sheet with the optional part storage part sandwiched between the peripheral parts of the optional part storage part The depth of the first groove is smaller than the thickness of the base sheet.
[2] In the embossed carrier tape of the present invention, on the other surface of the base sheet, on the periphery of the optional component storage portion, the optional component storage portion is sandwiched in the length direction of the base sheet. A pair of extending second groove portions are formed, and the second groove portion has a depth smaller than the thickness of the base sheet, and the first groove portion and the second groove portion with respect to the arbitrary component storage portion, Is an embossed carrier tape according to [1], wherein the embossed carrier tape is spaced apart.
[3] The embossed carrier tape of the present invention is the embossed carrier tape according to [2], wherein the depth of the first groove is different from the depth of the second groove.
[4] The embossed carrier tape according to [2] or [3], wherein in the embossed carrier tape of the present invention, the depth of the first groove is deeper than the depth of the second groove. It is a carrier tape.
[5] The embossed carrier tape of the present invention is characterized in that the depth of the first groove portion becomes deeper from both ends toward the center in the length direction thereof. The embossed carrier tape according to any one of the above.
[6] The embossed carrier tape according to [2], wherein the embossed carrier tape according to the present invention is such that the depth of the second groove portion increases in the length direction from the both ends toward the center. It is a tape.
[7] In the embossed carrier tape of the present invention, the opening of the component storage portion is substantially rectangular, and the opposing inner side surfaces are inclined in a direction away from the inner bottom side toward the opening, The angle formed between the inner side surface along the length direction of the base sheet and the depth direction of the component storage portion is the inner side surface along the width direction of the base sheet and the depth direction of the component storage portion. The embossed carrier tape according to [2], wherein the embossed carrier tape is larger than the angle formed by.

  [8] The packaged part wound body of the present invention has a part housed in the part housing part of the embossed carrier tape according to any one of [1] to [7], and covers an opening of the part housing part. It is sealed with a tape and wound on a reel.

[9] A method for producing an embossed carrier tape according to the present invention is the method for producing an embossed carrier tape according to any one of [1] to [7], wherein the forming convex portion corresponds to the shape of the component storage portion. The base sheet with a first mold having: a second mold including a forming recess for receiving the forming protrusion and a first protrusion corresponding to the shape of the first groove. Clamping and forming the component storage portion by extending the base sheet to the formation recess by the formation convex portion, and forming the first groove portion by the first protrusion. To do.
[10] A method for producing an embossed carrier tape according to the present invention is the method for producing an embossed carrier tape according to [2], wherein the first mold has a forming convex portion corresponding to the shape of the component housing portion. And a second convex ridge corresponding to the shape of the first groove and a second convex ridge corresponding to the shape of the second groove. The mold sandwiches the base sheet, and the forming convex portion extends the base sheet to the forming concave portion to form the component storage portion, and the first convex strip The second groove is formed by one groove and the second protrusion.
[11] The embossed carry tape manufacturing method of the present invention is characterized in that the height of the first protrusion is higher than the height of the second protrusion. It is a manufacturing method of a carrier tape.

 ADVANTAGE OF THE INVENTION According to this invention, while being able to accommodate components in a component storage part easily, the storage state of the components in a component storage part can be stabilized.

(A) It is a top view of the embossed carrier tape concerning embodiment of this invention. (B) It is B1-B1 sectional drawing in (a). (C) It is C1-C1 sectional drawing in (a). It is a perspective view which shows an example of the packaging component winding body of this invention. It is a fragmentary sectional view which shows an example of the manufacturing apparatus of the embossed carrier tape of this invention. (A) It is a top view of the 2nd metal mold | die of the manufacturing apparatus of the embossed carrier tape of FIG. (B) It is B2-B2 sectional drawing of (a). (C) It is C2-C2 sectional drawing of (a). It is a fragmentary sectional view of the embossing carrier tape manufacturing device explaining the manufacturing method of the present invention. It is a fragmentary sectional view which shows an example of the 2nd metal mold | die of the manufacturing apparatus of the embossed carrier tape of this invention. (A) It is a top view of the components package which accommodated components in the embossed carrier tape of an Example. (B) It is B3-B3 sectional drawing of (a). (A) It is a fragmentary sectional view of the embossing carrier tape manufacturing apparatus used for the comparative example. (B) It is a top view of the 2nd metal mold | die of (a). (A) It is a top view of the embossed carrier tape of a comparative example. (B) It is B4-B4 sectional drawing in (a). (C) It is C4-C4 sectional drawing in (a). (A) It is a top view of the components packaging body in which components were accommodated in the embossed carrier tape of the comparative example. (B) It is B5-B5 sectional drawing of (a).

(Embossed carrier tape)
An example of the embossed carrier tape of the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the embossed carrier tape 1 has both ends in the width direction of a long base sheet 2 as side edges 3 and side edges 4, and opens on one surface of the base sheet 2. A plurality of component storage portions 10 are provided, and a plurality of first groove portions 20 and second groove portions 30 are formed on the other surface of the base sheet 2. In the base material sheet 2, a plurality of component storage units 10 are arranged side by side in the longitudinal direction of the base material sheet 2, and an optional component storage unit 10 and a component storage adjacent to the optional component storage unit 10 are stored. A flat portion 5 is formed between the portion 10 and the portion 10. In addition, a plurality of sprocket holes (feed holes) 6 are arranged in parallel in the base sheet 2 so as to be spaced apart in the length direction of the base sheet 2 between the component storage portion 10 and the side edge portion 3. .

The component storage unit 10 is formed with a recess 13 having one surface of the base sheet 2 as a recess opening 12, and the bottom of the component storage unit 10 has a concave shape bulging out on the other surface of the base sheet 2. ing. The recess opening 12 has a substantially rectangular shape in plan view in which the width direction of the base sheet 2 is long and the length direction of the base sheet 2 is short.
The recess periphery 14 that is the periphery in the longitudinal direction of the recess opening 12 is a curved surface that gradually falls in the depth direction of the recess 13 from the flat portion 5, and the recess periphery 15 that is the periphery in the short direction of the recess opening 12. Is a curved surface that gradually falls from the flat portion 5 in the depth direction of the recess 13. The concave portion 13 includes a concave portion peripheral portion 14, a concave portion peripheral portion 15, an inner bottom surface 16, an inner side surface 18 that continues from the concave portion peripheral portion 14 to the inner bottom surface 16, and an inner side surface 19 that continues from the concave portion peripheral portion 15 to the inner bottom surface 16. It is formed with. The opposing inner side surfaces 18 are inclined surfaces that are separated from the inner bottom surface 16 toward the recess opening 12, and the opposing inner side surfaces 19 are inclined surfaces that are separated from the inner bottom surface 16 toward the recess opening 12. Yes.

 The first groove 20 is the outer peripheral edge 11 of the component storage unit 10 on the other surface of the base sheet 2, that is, the surface of the bottom of the component storage unit 10 (that is, the outer side of the component storage unit 10 in the base sheet 2. It is formed so as to extend in the width direction of the base material sheet 2 and to face the part storage portion 10 with the side surface 17 rising. The second groove 30 is formed so as to extend in the length direction of the base sheet 2 and to face the outer peripheral edge 11 of the component storage 10 with the component storage 10 interposed therebetween. In this embodiment, a pair of first groove portions 20 are substantially parallel to the inner side surface 18 and a pair of second groove portions 30 are substantially parallel to the inner side surface 19 with respect to an arbitrary component storage portion 10. It is said that. And the 1st groove part 20 and the 2nd groove part 30 which were formed with respect to the arbitrary component storage parts 10 are spaced apart.

The base material sheet 2 is a long sheet slit into an arbitrary width dimension.
The material of the base sheet 2 is not particularly limited as long as it is made of resin. For example, polystyrene, polyvinyl chloride, polyester, polyamide, polyacetal, polyurethane, nylon, acrylic resin, polycarbonate, polyolefin resin, fluorine resin, and these Thermosetting resins such as a thermoplastic resin such as a polymer alloy in which two or more are mixed, a phenol resin, a melamine resin, a urea resin, a diallyl phthalate resin, and the like can be given. Among these, a thermoplastic resin is preferable. In addition, these resins and polymer alloys containing these resins can be applied to nonionic surfactants, cationic surfactants, anionic surfactants and other antistatic agents, conductive carbon, carbon and stainless steel, etc. Conductive fibers, conductive metal oxides such as tin oxide and titanium oxide, those added with a conductive agent such as organic conductive materials such as aniline, pyrrole, and thiophene to impart antistatic properties and conductivity, and resin bases It may be a conductive plastic substrate such as an antistatic agent or a conductive material applied to the surface of the material to provide an antistatic layer or a conductive layer. The base sheet 2 may be a laminate of two or more layers of the same resin or different resins.
The thickness of the base material sheet 2 can be determined in consideration of the size of components to be stored, and is set to 0.1 to 1 mm, for example.

The depth of the component storage unit 10, that is, the distance from the recess opening 12 to the inner bottom surface 16 can be determined in consideration of the size of the component to be stored.
The width of the inner bottom surface 16 of the component storage unit 10, that is, the distance between the inner side surfaces 18 facing each other in the short direction of the inner bottom surface 16 can be determined in consideration of the size of the component to be stored.
The length of the inner bottom surface 16 of the component storage unit 10, that is, the distance between the inner side surfaces 19 opposed in the longitudinal direction of the inner bottom surface 16 can be determined in consideration of the size of the component to be stored.

In the component storage unit 10, the smaller the angle (taper angle) formed between the depth direction of the component storage unit 10 and the inner surface 18, that is, the inner surface 18 is perpendicular to the surface of the recess opening 12 (taper angle = 0). The closer to (°), the higher the shape accuracy of the recess opening 12 and the more stable the component storage state. Accordingly, the taper angle of the inner side surface 18 can be determined in consideration of the depth of the component storage unit 10. For example, if the component storage unit 10 is large enough to store a 0402 size component, the taper angle of the inner side surface 18 is 0.5-10. ° is preferable, and 1 to 5 ° is more preferable.
The component storage unit 10 is configured such that the smaller the angle (taper angle) formed between the depth direction of the component storage unit 10 and the inner side surface 19, that is, the closer the inner side surface 19 is perpendicular to the surface of the recess opening 12, The shape accuracy of the opening 12 is increased, and the storage state of the parts is stabilized. On the other hand, since the storage of the component in the component storage unit 10 may be performed by sliding the component in the width direction of the base sheet 2, it is difficult to store the component if the taper angle of the inner surface 19 is too small. . From the viewpoint of achieving both stability of the housed component and ease of housing of the component, the taper angle of the inner surface 19 is preferably 0.5 to 10 °, and more preferably 1 to 5 °. If it is 0.5 ° or more, the taper makes it easy to store the component, and if it is 10 ° or less, the stabilization of the component by the inner surface 19 is not impaired.

  The taper angle of the inner surface 18 and the taper angle of the inner surface 19 may be the same or different. When the taper angle of the inner side surface 18 and the taper angle of the inner side surface 19 are different, it is preferable that (taper angle of the inner side surface 19)> (taper angle of the inner side surface 18). Increasing the taper angle of the inner side surface 19 makes it easier for the component to slide into the component storage portion 10, and reducing the taper angle of the inner side surface 18 eliminates play between the stored component and the inner side surface 18. This is because the storage state of the is stable.

As the curvature radius r of the recess peripheral portion 14 is smaller, the component storage unit 10 has a higher shape accuracy of the recess opening 12 and a smaller taper angle of the inner side surface 18 so that the component storage state is stabilized. The radius of curvature r of the peripheral edge 14 of the recess can be determined in consideration of the area of the recess opening 12 and the like. For example, if the component storage unit 10 is large enough to store a 0402 size component, it is preferably less than 0.30 mm. , Less than 0.20 mm is more preferable, and less than 0.12 mm is more preferable. If it is less than 0.30 mm, the stored components can be stabilized.
In the component storage unit 10, the shape accuracy of the recess opening 12 increases as the width of the recess peripheral portion 14, that is, the distance (curved surface width) R <b> 1 between the inner surface 18 and the flat portion 5 in plan view, and the inner surface 18 increases. This reduces the taper angle and stabilizes the storage state of the parts. Accordingly, the curved surface width R1 can be determined in consideration of the area of the recess opening 12, and the like. For example, if the component storage unit 10 is large enough to store a 0402 size component, it is preferably less than 0.30 mm. Less than 20 mm is more preferable, and less than 0.12 mm is more preferable.

As the curvature radius r of the recess peripheral portion 15 is smaller, the component storage portion 10 has a higher shape accuracy of the recess opening 12 and a smaller taper angle of the inner side surface 19 so that the component storage state is stabilized. The radius of curvature r of the recess peripheral portion 15 can be determined in consideration of the area of the recess opening 12 and the like. For example, if the component storage portion 10 is large enough to store a 0402 size component, it is 0.05 to less than 30 mm. Is preferable, and 0.10 or more and less than 0.30 mm are more preferable. If it is 0.05 mm or more, it is easy to store the components, and if it is less than 0.30 mm, the stored components can be stabilized.
In the component storage unit 10, the shape accuracy of the recess opening 12 increases as the width of the recess peripheral portion 15, that is, the distance (curved surface width) R <b> 2 between the inner surface 19 and the flat portion 5 in plan view, and the inner surface 19 increases. This reduces the taper angle and stabilizes the storage state of the parts. On the other hand, when the curved surface width R <b> 2 is too small, it is difficult to store the component in the component storage unit 10. Therefore, the curved surface width R2 can be determined in consideration of the area of the concave opening 12 and the like. For example, if the component storage unit 10 is large enough to store a 0402 size component, it is preferably 0.05 mm or more and less than 30 mm. It is more preferably 0.10 mm or more and less than 0.30 mm.

The radius of curvature r of the peripheral edge portion 14 and the radius of curvature r of the peripheral edge portion 15 may be the same or different. When the curvature radius r of the recess peripheral portion 14 and the curvature radius r of the recess peripheral portion 15 are different, (the curvature radius r of the recess peripheral portion 14) <(the curvature radius r of the recess peripheral portion 15) is preferable. Usually, the components are stored in the embossed carrier tape 1 by sliding the components in the width direction of the base sheet 2. By increasing the radius of curvature r of the peripheral edge 15 of the recess, the component can easily slide into the component storage unit 10.
The curved surface width R1 and the curved surface width R2 may be the same or different. When the curved surface width R1 and the curved surface width R2 are different, it is preferable that R2> R1. Increasing the curved surface width R2 makes it easier for the components to slide into the component storage unit 10, and reducing the curved surface width R1 eliminates play between the stored components and the component storage unit 10 so that the components can be stored. Stabilize.

  The length L1 of the first groove portion 20 can be determined according to the size of the inner bottom surface 16, and is preferably 10% or more and less than 100%, for example, 50% or more and 100% with respect to the length of the inner bottom surface 16 in the longitudinal direction. Less than% is more preferable. If it is 10% or more, the taper angle of the inner side surface 18 can be made sufficiently small, and if it is less than 100%, the taper angle of the inner side surface 19 can be controlled arbitrarily without interfering with the formation of the inner side surface 19. It is.

The depth D1 of the 1st groove part 20 should just be smaller than the thickness of the base material sheet 2, for example, 10-90% of the thickness of the base material sheet 2 is preferable, and 40-80% is more preferable. If the depth D <b> 1 is smaller than the thickness of the base material sheet 2, the smoothness of the flat portion 5 is maintained, and the component can be easily stored in the component storage portion 10. Furthermore, if the depth D1 is 10% or more of the thickness of the base sheet, the effect of forming the first groove portion 20 is easily obtained, and if it is 90% or less, the base sheet 2 is prevented from being broken. it can.
The width W1 of the first groove portion 20 can be determined in consideration of the depth D1 of the first groove portion 20, the thickness of the base sheet 2, the interval between the component storage portions 10, and the like. 10 to 200% of the depth D1 is preferably 40 to 100%. If it is less than 10%, the strength of the rib formed on the second mold described later becomes insufficient, and the rib may be deformed during molding. If it exceeds 200%, the interval between adjacent component storage portions 10 is widened, and the number of component storage portions 10 per unit length in the embossed carrier tape 1 is reduced.

The length L2 of the second groove portion 30 can be determined according to the size of the inner bottom surface 16, and is preferably 10% or more and less than 100%, for example, 50% to 100% with respect to the length of the inner bottom surface 16 in the short direction. Less than% is more preferable. If it is 10% or more, the taper angle of the inner surface 19 can be made sufficiently small, and if it is less than 100%, it does not interfere with the formation of the inner surface 18 and the taper angle of the inner surface 18 can be controlled arbitrarily. It is.
The width W2 of the second groove portion 30 is the same as the width W1 of the first groove portion 20, and the depth D2 of the second groove portion 30 is the same as the depth D1 of the first groove portion 20.
The depth D1 and the second depth D2 of the first groove 20 may be the same or different. However, in the component storage unit 10, in order to reduce the taper angle and the curved surface width R1 of the inner side surface 18 as much as possible, and appropriately increase the taper angle and the curved surface width R2 of the inner side surface 19, D1> D2 is preferable. The depth D2 is more preferably 50% or less of the depth D1.
In addition, the width W1 and the second width W2 of the first groove portion 20 may be the same or different.

(Wrapping body for packaging parts)
The packaged part wound body of the present invention is a part packaged body in which a part is housed in a part housing part of an embossed carrier tape and a recess opening part is sealed with a cover tape, and is wound around a reel. An example of the packaged part wound body of the present invention will be described with reference to FIGS.
In the packaged part wound body 50 shown in FIG. 2, the embossed carrier tape 1 storing the part 60 in the part storage unit 10 is sealed with a cover tape 54 to form a part package 51, and the part package 51 is a reel 52. Is wound into a wound body.

 Examples of the component 60 stored in the component storage unit 10 include electronic components such as ceramic capacitors, resistors, IC chips, inductors, and LEDs, and electrical components such as shield members and connectors.

  A conventionally known cover tape 54 can be used, and examples thereof include the same material as that of the base sheet 2.

 The method of sealing the recessed opening 12 with the cover tape 54 can be determined in consideration of the material of the base sheet 2 and the material of the cover tape 54. For example, the embossed carrier tape 1 and the cover tape 54 are bonded with an adhesive. Examples thereof include a method in which both ends of the width direction of the base sheet 2 are bonded with an adhesive, heat fusion, or ultrasonic fusion.

(Production method)
The embossed carrier tape manufacturing method of the present invention is a method in which a base sheet is sandwiched between a first mold and a second mold to form a component storage section, a first groove section, and a second groove section. is there.

<Manufacturing equipment>
An embossed carrier tape manufacturing apparatus (hereinafter sometimes simply referred to as a manufacturing apparatus) used for manufacturing the embossed carrier tape of the present invention will be described below with reference to the drawings.
3 is a partial cross-sectional view of a manufacturing apparatus including a first mold and a second mold, and FIG. 4A is a plan view of the second mold, and FIG. c) is a partial cross-sectional view of a second mold.
As illustrated in FIG. 3, the manufacturing apparatus 100 includes a first mold 110 and a second mold 120, and includes a pressing surface 111 of the first mold 110 and a pressing surface 121 of the second mold 120. Are opposed to each other.

  The first mold 110 is provided with a stripper 112 in which a punch hole 116 is formed and a draw punch 114 provided in the punch hole 116 so as to be freely inserted and removed. It is made into the substantially square pillar shape of the shape corresponding to the inner bottom face 16 (FIG. 1) of the components accommodating part 10. As shown in FIG.

The second mold 120 includes a die 122, and a punch receiving hole 126 for receiving the draw punch 114 protruding from the punch hole 116 is formed in the die 122. An opening (receiving hole opening) 127 of the punch receiving hole 126 formed on the clamping surface 121 has a shape corresponding to the contour shape of the outer peripheral edge 11 of the component storage unit 10, and the punch receiving hole 126 has an inner periphery thereof. The surface and the side surface of the draw punch 114 are separated by an arbitrary distance. As shown in FIG. 4, on the clamping surface 121 of the die 122, a first rib 124 extending in the longitudinal direction of the receiving hole opening 127 on the periphery of the receiving hole opening 127 of the punch receiving hole 126, and the receiving hole A second rib 134 extending in the short direction of the opening 127 is provided upright.
The first rib 124 is erected substantially perpendicular to the pinching surface 121, and the rib end surface 125 is substantially parallel to the pinching surface 121. The first rib 124 has a length l1 corresponding to the length L1 (FIG. 1) of the first groove portion 20, and a height h1 corresponding to the depth D1 (FIG. 1) of the first groove portion 20. The width w1 corresponds to the width W1 (FIG. 1) of the first groove portion 20. The second rib 134 is erected substantially perpendicular to the pinching surface 121, and the rib end surface 135 is substantially parallel to the pinching surface 121. The second rib 134 has a length l2 corresponding to the length L2 (FIG. 1) of the second groove 30 and a height h2 corresponding to the depth D2 (FIG. 1) of the second groove 30. The width w2 corresponds to the width W2 (FIG. 1) of the second groove 30.
Therefore, the height h1 of the first rib 124 and the height h2 of the second rib 134 may be the same or different. When the height h1 of the first rib 124 and the height h2 of the second rib 134 are different, h1> h2 is preferable, and the height h2 is more preferably 50% or less of the height h1. With such a height, it becomes easier to store the component in the component storage unit 10 and the component storage state can be further stabilized.

  The “forming convex portion corresponding to the shape of the component storage portion” is the draw punch 114, and the “forming concave portion for receiving the forming convex portion” is the punch receiving hole 126, and “the shape of the first groove portion is The “corresponding first ridge” is the first rib 124, and the “second ridge corresponding to the shape of the second groove” is the second rib 134.

<Method for producing embossed carrier tape>
The manufacturing method of the present invention will be described with reference to FIGS. FIG. 5 is a partial cross-sectional view of the manufacturing apparatus showing a state in which the base sheet 2 is sandwiched between the first mold 110 and the second mold 120.
First, the first mold 110 and the second mold 120 are arranged in a state where the pressing surface 111 and the pressing surface 121 are opposed to each other (FIG. 3). Between the pressing surface 111 and the pressing surface 121, the base sheet 2 heated to an arbitrary temperature and softened is fed.
After the base sheet 2 is fed between the pressing surface 111 and the pressing surface 121, the base sheet 2 is pressed by the first mold 110 and the second mold 120. At this time, the first ribs 124 formed on the pressing surface 121 compress the base sheet 2 to form the first groove portion 20, and the second ribs 134 compress the base sheet 2 to compress the base sheet 2. A second groove 30 is formed.
Next, the draw punch 114 is projected from the punch hole 116 so as to be inserted into the punch receiving hole 126. The protruded draw punch 114 pushes the base sheet 2 into the punch receiving hole 126 with the punch end surface 117 pressed against the base sheet 2. The pressed base sheet 2 is stretched in the punch receiving hole 126 to form the component storage portion 10, which becomes the embossed carrier tape 1. At this time, since the base sheet 2 is firmly sandwiched between the first rib 124 and the second rib 134 formed at the periphery of the receiving hole opening 127, when the base sheet 2 is pushed into the punch receiving hole 126, The material sheet 2 does not shift toward the punch receiving hole 126 and is sufficiently stretched. As a result, the component storage section 10 has a small radius of curvature r and curved surface width R1 (FIG. 1) of the peripheral edge portion 14 of the recess, and a small radius of curvature r and curved surface width R2 (FIG. 1) of the peripheral edge portion 15 of the recess. 19 (FIG. 1), the taper angle is small, and the shape accuracy of the recess opening 12 is high. In addition, the radius of curvature r of the peripheral corner portion of the concave opening 12, that is, the boundary portion between the concave peripheral portion 14 and the concave peripheral portion 15 is larger than that of the concave peripheral portion 14 and the concave peripheral portion 15.

(how to use)
Next, an example of how to use the embossed carrier tape of the present invention will be described with reference to FIGS.
First, as shown in FIG. 1, the embossed carrier tape 1 is arranged so that the concave opening 12 is vertically upward, and the components are accommodated in the component accommodating portion 10 while being conveyed in the direction of arrow F. Since the first groove portion 20 and the second groove portion 30 are formed apart from the component storage portion 10 in the embossed carrier tape 1, the interference of the second groove portion 30 with respect to the inner surface 18, the inner surface 19 Therefore, the inner side surface 18 and the inner side surface 19 have an arbitrary taper angle with high accuracy. Further, since the first groove portion 20 and the second groove portion 30 with respect to the component storage portion 10 are separated from each other, the boundary portion between the concave portion peripheral portion 14 and the concave portion peripheral portion 15 has a relatively large curvature radius r, and the component 60 can be stored in the component storage unit 10 easily and stably.

After the components are stored in the component storage section 10, the recess opening 12 is sealed with the cover tape 54 and wound around the reel 52 while forming the component package 51, thereby obtaining the packaged component wound body 50 shown in FIG. 2.
Next, as shown in FIG. 2, the component packaging body 51 is unwound from the reel 52 and conveyed to the mounting device for the component 60 while peeling the cover tape 54. At this time, since the component storage unit 10 has a high shape accuracy of the recess opening 12 and the taper angle of the inner side surface 18 and the taper angle of the inner side surface 19 are small, the component 60 is included in the component storage unit 10. Thus, the storage position can be stably conveyed without shifting the storage position or popping out of the component storage unit 10.
The component 60 is supplied to the mounting machine while maintaining an arbitrary storage state, and is taken out from the component storage unit 10 and used for manufacturing an electronic product or the like. At this time, since the storage state of the component 60 is stable, the mounter can mount the component 60 with high mounting accuracy and a high mounting rate.

Since the embossed carrier tape of the present invention has a pair of first groove portions that extend in the width direction of the base sheet and is located between the component storage portions on the outer peripheral edge of the component storage portion. The taper angle of the inner surface along the width direction of the base sheet and the radius of curvature r of the peripheral edge of the recess following the inner surface are small. And since the components stored in the component storage section are clamped by the inner surface in the width direction of the base sheet, the storage position is stored in the component storage section in a stable storage state without shifting or popping out. The
In addition, since the embossed carrier tape has the first groove portion compressed in the base sheet, even when the embossed carrier tape is transported in the length direction, the rigidity of the first groove portion The deformation of the component storage unit is suppressed, the component can be easily stored, and the stable storage state of the component can be maintained.
Furthermore, since the first groove is formed on the surface opposite to the surface where the recess opening is formed, it does not hinder the storage of the component in the component storage portion.

Since the embossed carrier tape of the present embodiment is formed with the second groove portion, the shape accuracy of the recessed portion opening portion becomes higher, and the storage state of the parts can be further stabilized.
In addition, since the first groove portion and the second groove portion with respect to an arbitrary component storage portion are formed apart from each other, the radius of curvature r of the peripheral corner portion of the recess opening portion becomes relatively large, and the component storage portion Easier storage of parts

  According to the packaged part wound body of the present invention, since the parts are stored in the part storage part where the shape accuracy of the concave opening is high and the taper angle of the opposing inner surface is small, the parts are stored even during transport. The state is good, and the mounting accuracy and mounting rate during mounting can be improved.

  According to the manufacturing method of the present invention, since the second mold having the first rib corresponding to the first groove portion of the embossed carrier tape is used, the embossed carrier tape of the present invention easily including the first groove portion is used. Can be manufactured with high accuracy. In addition, since the second mold includes the second rib corresponding to the second groove, the embossed carrier tape of the present invention including the second groove can be easily manufactured.

In the above-described embodiment, the second groove 30 has the same depth from one end to the other end in the length direction, but the present invention is not limited to this. For example, the depth of the second groove portion 30 may be increased in the length direction from the both ends toward the center. By forming such a second groove portion, the component storage portion reduces the taper angle of the inner surface corresponding to the deepest portion of the second groove portion and the radius of curvature r of the peripheral edge of the recess following this inner surface, The taper angle of the inner surface corresponding to the shallowest portion of the second groove and the radius of curvature r of the peripheral edge of the recess following the inner surface can be increased. By providing such a component storage portion, it is possible to further facilitate the storage of components while maintaining a stable storage state of components.
An example of a manufacturing apparatus for forming the second groove portion includes a second mold 220 shown in FIG. The second mold 220 is configured such that the height of the second rib 234 increases as the length of the second rib 234 increases from both ends in the length direction. That is, the second rib 234 has an end surface 235 that is a curved surface that bulges in the height direction.
Alternatively, the second rib 234 shown in FIG. 6 may increase linearly from both ends toward the center, or may increase stepwise. These shapes can be selected according to the desired shape of the second groove.
Note that the first rib 124 may have the same shape as the second rib 234. By making the 1st rib 124 the same shape as the 2nd rib 234, the depth can become deep as the 1st groove part 20 goes to the center from the both ends in the length direction.

  Further, for example, the second mold 120 may have a curved surface in a cross section in which the rib end surface 125 is orthogonal to the length direction of the first rib 124. Similarly to the first rib 124, the second rib 134 may have a rib end surface 135 having a curved cross section perpendicular to the length direction of the second rib 134.

In the above-described embodiment, the embossed carrier tape 1 has the first groove portion 20 and the second groove portion 30, but the present invention is not limited to this, and the second groove portion 30 is formed. It does not have to be. If the first groove portion 20 is formed, the component 60 stored in the component storage portion 10 is maintained in a stable storage state.
Such an embossed carrier tape can be manufactured by using the second mold 120 as a second mold that includes the first rib 124 and does not include the second rib 134.

In the above-described embodiment, the component storage unit 10 has a bottomed rectangular tube shape in which the concave opening 12 is substantially rectangular in plan view, but the shape of the component storage unit can be determined according to the components to be stored, for example, The recessed opening may be a bottomed substantially cylindrical shape that is circular or elliptical in plan view, and the recessed opening may be a bottomed polygonal cylinder such as a triangle, pentagon, or hexagon in plan view.
In addition, in the above-described embodiment, the draw punch 114 has a substantially quadrangular prism shape, but the present invention is not limited to this, and the shape of the draw punch 114 can be determined according to the shape of the component storage unit 10.

  In the above-described embodiment, the embossed carrier tape 1 is manufactured by press molding using the first mold 110 and the second mold 120, but the manufacturing method of the embossed carrier tape 1 is not limited to this. For example, in addition to press molding, pressure molding, vacuum molding, or a molding method combining these may be used.

 Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited thereto.

Example 1
A mold similar to the manufacturing apparatus 100 of FIG. 3 was used, and a polystyrene resin sheet having a thickness of 0.2 mm was used as an embossed carrier tape similar to the embossed carrier tape 1 shown in FIG. The second mold was the same as that shown in FIG.
<Rib specification>
First rib length l1: 0.27 mm
First rib width w1: 0.1 mm
First rib height h1: 0.1 mm
Second rib length l2: 0.13 mm
Second rib width w2: 0.1 mm
Second rib height h2: 0.1 mm
End face shape of draw punch: rectangular, long = 0.4mm, short = 0.2mm
Shape of receiving hole opening: rectangular, long = 0.5 mm, short = 0.3

  This embossed carry tape has the same form as the embossed carrier tape 1 shown in FIG. 1. The component storage portion is a size for a 0402 size ceramic capacitor, that is, the inner bottom surface of the component storage portion has a length of 0.4 mm, The width is 0.2 mm.

  The 0402 size ceramic capacitor 160 was housed in this embossed carrier tape, and the housing state, stowability, and rotation suppression were evaluated, and the results are shown in Table 1.

<Evaluation of storage>
The evaluation of the storability of parts will be described with reference to FIG. 200,000 ceramic capacitors 160 were sequentially stored in the component storage unit 10 and evaluated according to the storage state. Specifically, when the ceramic capacitor 160 is slid and stored from the side edge 3 side of the base sheet 2 while the embossed carrier tape is conveyed in the direction of arrow F, the ceramic capacitor 160 is correctly placed in the component storage unit 10. “○” if the percentage of storage was 99.99% or more, “△” if the percentage was correctly stored is 99% or more and less than 99.99%, and the percentage that was correctly stored was less than 99%. It was set as “x”.

<Evaluation of storage state>
The storage state evaluation method will be described with reference to FIG.
FIG. 7 illustrates a state in which the ceramic capacitor 160 is accommodated in the embossed carrier tape 1.
The embossed carrier tape in which the ceramic capacitor 160 is accommodated in the component accommodating portion in “<Evaluation of storability>” is allowed to stand so that the concave opening 12 is vertically upward, and the horizontal direction of the accommodated ceramic capacitor 160 is The inclination and vertical inclination were measured by the following methods. With respect to 100 random ceramic capacitors 160, horizontal inclination and vertical inclination were measured, and storage stability was evaluated using the maximum value.
As shown in FIG. 7A, the horizontal inclination passes through the concave horizontal line Q1 passing through the center of the concave opening 12 in the longitudinal direction of the concave opening 12 and the center of the ceramic capacitor 160 in the longitudinal direction of the ceramic capacitor 160. This is an angle θ1 formed with the component horizontal line P1.
As shown in FIG. 7B, the vertical inclination is such that the concave vertical line Q2 passing through the center of the concave portion 13 in the depth direction of the component storage portion 10 and the center of the ceramic capacitor 160 in the height direction of the ceramic capacitor 160. This is the angle θ2 formed by the passing part vertical line P2.
The measured horizontal inclination and vertical inclination were classified and evaluated according to the following evaluation criteria.

≪Evaluation criteria≫
Less than 10 °: ○ (There is no fear of misalignment or popping out of parts being transported)
10 ° or more: × (There is a risk of misalignment or popping out of the parts being transported)

  As a result of the measurement, the horizontal direction inclination of the embossed carrier tape 1 obtained in this example was 9 ° and “◯”, and the vertical direction inclination was 4.0 ° and “◯”.

<Evaluation of rotation suppression>
After the ceramic capacitor is stored in the component storage part of the embossed carrier tape, the recess opening is closed with a cover tape to form a component package, and 100 random ceramic capacitors according to JIS C0806-3 “FIG. The inclination of the part was measured according to the sketch “A”. The maximum values of the measurement results of the component inclination are classified into the following criteria, and the results are shown in Table 1.
10 ° or less: ○
More than 10 ° and less than 20 °: △
20 ° or more: ×

(Comparative Example 1)
Using a manufacturing apparatus 600 shown in FIG. 8, a polystyrene resin sheet having a thickness of 0.2 mm was used as an embossed carrier tape similar to the embossed carrier tape 700 shown in FIG.
The manufacturing apparatus 600 in FIG. 8 will be described. In FIG. 8, the same components as those in the manufacturing apparatus 100 of FIG. 3 are denoted by the same reference numerals, and the description thereof is omitted.
As shown in FIG. 8, the manufacturing apparatus 600 includes a first mold 110 and a second mold 620, and includes a pressing surface 111 of the first mold 110 and a pressing surface 621 of the second mold 620. Are opposed to each other.
The second mold 620 includes a die 622, and a punch receiving hole 126 for receiving the draw punch 114 is formed in the die 622. And the rib is not formed in the clamping surface 621, but the clamping surface 621 is a flat surface.
In this manufacturing apparatus 600, the punch punch end surface 117 has a length of 0.4 mm and a short side of 0.2 mm, and the receiving hole opening has a length of 0.5 mm and a short side of 0.3 mm.

FIG. 9 shows an embossed carrier tape 700 obtained in this comparative example.
As shown in FIG. 9, the embossed carrier tape 700 has a component storage portion 710 that opens on one surface of the base sheet 2, and no groove is formed on the outer peripheral edge 711 of the component storage portion 710. . The component storage unit 710 is formed with a recess 713 having one surface of the base sheet 2 as a recess opening 712, and the bottom of the component storage unit 710 has a concave shape bulging out on the other surface of the base sheet 2. ing. The recess opening 712 has a substantially rectangular shape in plan view, and the recess 713 has a curved surface in which the periphery of the recess 714 gradually decreases from the flat portion 5 in the depth direction of the recess 713. The concave portion 713 is formed by a concave portion peripheral portion 714, an inner bottom surface 716, and an inner side surface 718 that continues from the concave portion peripheral portion 714 to the inner bottom surface 716. It has a shape that expands as you go.

  The 0402 size ceramic capacitor 160 was housed in this embossed carrier tape, and the housing state, stowability, and rotation suppression were evaluated, and the results are shown in Table 1.

<Evaluation of storage state>
The evaluation method of the storage state was performed as follows in the same manner as in Example 1 except that the embossed carrier tape was changed to the embossed carrier tape of this comparative example.
FIG. 10 illustrates a state in which the ceramic capacitor 160 is housed in the embossed carrier tape 700.
The storage state was evaluated by standing the embossed carrier tape 700 in which the ceramic capacitor 160 was stored such that the opening 712 was vertically upward, and the horizontal and vertical inclinations of the stored ceramic capacitor 160.
As shown in FIG. 10 (a), the horizontal inclination is such that the concave horizontal line Q3 passing through the center of the concave opening 713 in the longitudinal direction of the concave opening 712 and the center of the ceramic capacitor 160 in the longitudinal direction of the ceramic capacitor 160 in plan view. Is an angle θ3 formed with the part horizontal line P1 passing through.
As shown in FIG. 10B, the vertical inclination is such that the concave vertical line Q4 passing through the center of the concave portion 713 in the depth direction of the component storage portion 710 and the center of the ceramic capacitor 160 in the height direction of the ceramic capacitor 160. This is the angle θ4 formed by the passing part vertical line P2.

  In the same manner as in Example 1, the horizontal inclination and the vertical inclination were measured, and the maximum value of the measured horizontal inclination and the maximum value of the vertical inclination were classified and evaluated as evaluation criteria.

(Examples 2-3)
An embossed carrier tape was produced in the same manner as in Example 1 except that the height of the first rib and the height of the second rib in the second mold were the specifications shown in Table 1. In the table, “0.00” in the item of the height of the rib means that no rib was formed.
About the obtained embossed carrier tape, it carried out similarly to Example 1, evaluated the accommodation state, the accommodation property, and rotation suppression, and Table 1 shows the evaluation result.

Example 4
The second rib is the same as in Example 1 except that the rib end surface is a curved surface that bulges in the height direction of the second rib as in the second rib 234 shown in FIG. An embossed carrier tape was produced. The second rib has a radius of curvature r = 0.7 mm at the end face of the rib, a height at the center in the length direction of 0.1 mm, and a height at both ends in the length direction of 0 mm.
About the obtained embossed carrier tape, it carried out similarly to Example 1, evaluated the accommodation state, the accommodation property, and rotation suppression, and Table 1 shows the evaluation result.

(Comparative Example 2)
The same manufacturing apparatus as in Comparative Example 1 was used except that a rib (height 0.1 mm, width 0.1 mm) was formed around the opening of the opening of the punch receiving hole of the second mold. Thus, an embossed carrier tape was produced. In this embossed carrier tape, a groove portion that circulates around the component storage portion is formed on the outer peripheral edge of the component storage portion on the surface opposite to the recess opening. With respect to the obtained embossed carry tape, in the same manner as in Example 1, the storage state, storage property, and rotation suppression were evaluated, and the evaluation results are shown in Table 1.

As shown in Table 1, each of the embossed carrier tapes of Examples 1 to 4 to which the present invention is applied has a storability of “△” or “◯”, and the evaluation of the storage state and rotation suppression is “◯”. there were. Among them, Examples 2 to 3 in which the depth of the second groove portion is shallower than the depth of the first groove portion, and the depth of the second groove portion becomes deeper toward the center from both ends in the length direction. In Example 4, the storage performance was improved.
On the other hand, in Comparative Example 1 in which the first groove portion and the second groove portion were not formed, the storage property was “O”, but the horizontal inclination was “X”, and the component rotation suppression was “Δ”. there were. In addition, the embossed carrier tape of Comparative Example 2 in which the first groove and the second groove were not separated from each other had extremely poor storage properties.

DESCRIPTION OF SYMBOLS 1 Embossed carry tape 2 Base material sheet 10 Component accommodating part 11 Outer periphery 12 Recessed opening part 14, 15 Recessed peripheral surface 16 Inner bottom face 18, 19 Inner side surface 20 First groove part 30 Second groove part 50 Packaging component winding body 54 Cover tape 60 Parts 110 First mold 114 Draw punch 120, 220 Second mold 124 First rib 134, 234 Second rib 126 Punch receiving hole 160 Ceramic capacitor

Claims (11)

In the embossed carrier tape provided with a concave-shaped component storage part that opens on one side of the long resin base sheet, bulges on the other side of the base sheet,
The other surface of the substrate sheet, said the periphery of the component housing, a pair of first grooves extending in the width direction of the base sheet across the front SL unit equipment container is formed,
The embossed carrier tape, wherein the first groove has a depth smaller than a thickness of the base sheet. On the other surface of the substrate sheet, the peripheral edge of the front Symbol portions equipment container, a pair of second grooves extending in the longitudinal direction of the base sheet across the front SL unit equipment container is formed,
The depth of the second groove is smaller than the thickness of the base sheet,
Wherein said first groove to the previous SL unit equipment container second groove and is of, characterized in that spaced, embossed carrier tape according to claim 1.   The embossed carrier tape according to claim 2, wherein the first groove portion has a depth different from that of the second groove portion.   The embossed carrier tape according to claim 2 or 3, wherein the depth of the first groove is deeper than the depth of the second groove.   The embossed carrier tape according to any one of claims 1 to 4, wherein the first groove portion has a depth that increases in depth from the both ends toward the center.   3. The embossed carrier tape according to claim 2, wherein the depth of the second groove portion increases in the length direction from the both ends toward the center. 4.   The component storage portion has a substantially rectangular opening, and the inner side surfaces facing each other incline in a direction away from the inner bottom surface toward the opening, along the length direction of the base sheet. The angle formed between the inner surface and the depth direction of the component storage portion is larger than the angle formed between the inner surface along the width direction of the base sheet and the depth direction of the component storage portion. The embossed carrier tape according to claim 2, wherein:   A component is stored in the component storage portion of the embossed carrier tape according to any one of claims 1 to 7, and the opening of the component storage portion is sealed with a cover tape and wound around a reel. Wrapped body of packaging parts characterized by It is a manufacturing method of an embossed carrier tape given in any 1 paragraph of Claims 1-7,
A first mold having a forming protrusion corresponding to the shape of the component storage portion; a forming recess for receiving the forming protrusion; and a first protrusion corresponding to the shape of the first groove. The base sheet is clamped with a second mold provided, and the component storage section is formed by extending the base sheet to the formation recess by the formation protrusion, and the first protrusion The method for producing an embossed carrier tape is characterized in that the first groove is formed. A method for producing an embossed carrier tape according to claim 2,
A first mold having a forming convex portion corresponding to the shape of the component storage portion; a forming concave portion for receiving the forming convex portion; a first convex portion corresponding to the shape of the first groove portion; A second mold having a second protrusion corresponding to the shape of the second groove portion sandwiches the base sheet, and the forming convex portion extends the base sheet into the forming recess. The embossed carrier tape is formed by forming the component housing portion and forming the first groove portion with the first protrusion and the second groove portion with the second protrusion. Method.   11. The method for manufacturing an embossed carrier tape according to claim 10, wherein a height of the first protrusion is higher than a height of the second protrusion.

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