JP5407383B2 - Exposure apparatus and device manufacturing method - Google Patents

Description

  The present invention relates to an exposure apparatus that exposes a substrate through a liquid and a device manufacturing method.

  In an exposure apparatus used in a photolithography process, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known. The immersion exposure apparatus has an immersion member around the last optical element of the projection optical system, and fills the optical path of the exposure light with the liquid using the immersion member.

US Patent Application Publication No. 2007/0132976

  In a liquid immersion exposure apparatus, if the liquid existing in the gap between the last optical element and the liquid immersion member enters or remains in a part where the liquid is not desired, exposure is performed by the heat of vaporization of the liquid. There is a possibility that a member in the apparatus is thermally deformed or the substrate is thermally deformed. When such a defect occurs, there is a possibility that an exposure defect such as a defect occurs in a pattern formed on the substrate. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to a first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the incident surface on which the exposure light is incident, the exit surface on which the exposure light is emitted, and the exit surface An optical member having an outer peripheral surface extending from the edge toward the incident surface side and a side portion at least partially facing the outer peripheral surface via a gap, and a position where exposure light from the emission surface and the emission surface can be irradiated An immersion member capable of forming an immersion space so that an optical path between the object and the object is filled with liquid, and the immersion member is disposed on at least a part of the side portion, and has an outer peripheral surface. An exposure apparatus having a first recovery port capable of recovering at least part of the liquid between the side portions is provided.

  According to the second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the incident surface on which the exposure light is incident, the exit surface on which the exposure light is emitted, and the exit surface An optical member having an outer peripheral surface extending from the edge toward the incident surface side and a side portion at least partially facing the outer peripheral surface via a gap, and a position where exposure light from the emission surface and the emission surface can be irradiated An immersion member capable of forming an immersion space so that an optical path between the object and the object is filled with liquid, and the side portion includes a first surface disposed around the outer peripheral surface, A first surface formed by the outer surface and the first surface at least one of the first surface and the second surface is inclined with respect to the outer peripheral surface. An exposure apparatus having an angle larger than a second angle formed by the outer peripheral surface and the second surface is provided.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first and second aspects, and developing the exposed substrate. .

  According to the present invention, the occurrence of defective exposure can be suppressed, and the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a sectional side view which shows the vicinity of the last optical element and liquid immersion member which concern on 1st Embodiment. It is the figure which expanded a part of FIG. It is a figure which shows the vicinity of the last optical element and liquid immersion member which concern on 1st Embodiment. It is a figure which shows the vicinity of the last optical element and liquid immersion member which concern on 2nd Embodiment. It is a figure which shows the vicinity of the last optical element and liquid immersion member which concern on 3rd Embodiment. It is a figure which shows the vicinity of the last optical element and liquid immersion member which concern on 4th Embodiment. It is a figure which shows the vicinity of the last optical element and liquid immersion member which concern on 5th Embodiment. It is a figure which shows the vicinity of the last optical element and liquid immersion member which concern on 6th Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX includes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and an illumination system IL that illuminates the mask M with exposure light EL. The projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and the immersion space LS can be formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. A liquid immersion member 3, an interferometer system 4 capable of measuring positional information of the mask stage 1 and the substrate stage 2, and a control device 5 for controlling the operation of the entire exposure apparatus EX.

  The mask M includes a reticle on which a device pattern projected onto the substrate P by the projection optical system PL is formed. The mask M includes a transmissive mask having a transparent plate such as a glass plate and a pattern formed using a light shielding film such as chrome on the transparent plate. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 6G of the first surface plate 6 while holding the mask M. The mask stage 1 is movable with respect to the illumination area IR on the guide surface 6G. The guide surface 6G is substantially parallel to the XY plane. The mask stage 1 moves on the guide surface 6G by the operation of a drive system (not shown) including an actuator such as a linear motor. In the present embodiment, the mask stage 1 is movable in three directions of the X axis, the Y axis, and the θZ direction by the operation of the drive system.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by the lens barrel 7.

  The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable on the guide surface 8G of the second surface plate 8 while holding the substrate P. The substrate stage 2 is movable with respect to the projection region PR on the guide surface 8G. The guide surface 8G is substantially parallel to the XY plane. The substrate stage 2 moves on the guide surface 8G by the operation of a drive system (not shown) including an actuator such as a linear motor. In the present embodiment, the substrate stage 2 is movable in six directions including the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system.

  The substrate stage 2 has a substrate holding part 2H that holds the substrate P in a releasable manner. In the present embodiment, the substrate holding unit 2H holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel. Further, the substrate stage 2 has an upper surface 2T disposed around the substrate holding part 2H. In the present embodiment, the upper surface 2T is a flat plane. In the present embodiment, the upper surface 2T is substantially parallel to the XY plane. In the present embodiment, the surface of the substrate P held by the substrate holding part 2H and the upper surface 2T are arranged in substantially the same plane (they are flush).

  The liquid immersion member 3 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. The liquid immersion member 3 is disposed in the vicinity of the terminal optical element 9 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 3 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 3 is disposed around the terminal optical element 9.

  The last optical element 9 includes an incident surface 10 on which the exposure light EL from the object plane (illumination system IL) of the projection optical system PL is incident, and an emission from which the exposure light EL is emitted toward the image plane of the projection optical system PL. It has the surface 11 and the outer peripheral surface 12 extended toward the entrance plane 10 side from the edge of the output surface 11. In the present embodiment, the projection region PR includes a position where the exposure light EL from the exit surface 11 of the last optical element 9 can be irradiated.

  In the liquid immersion member 3, the optical path of the exposure light EL between the exit surface 11 of the last optical element 9 and an object arranged at a position (projection region PR) where the exposure light EL from the exit surface 11 can be irradiated is liquid. The immersion space LS can be formed so as to be filled with LQ. In the present embodiment, the object that can be arranged in the projection region PR includes at least one of the substrate stage 2 and the substrate P held on the substrate stage 2. During the exposure of the substrate P, the immersion member 3 forms the immersion space LS so that the optical path of the exposure light EL between the last optical element 9 and the substrate P is filled with the liquid LQ.

  In the present embodiment, the liquid immersion member 3 has a lower surface 13 that can face an object disposed in the projection region PR. The liquid immersion member 3 forms a space capable of holding the liquid LQ between the lower surface 13 and the object arranged on the projection region PR side. The liquid LQ held between the emission surface 11 and the lower surface 13 on one side and the surface of the object on the other side fills the optical path of the exposure light EL between the last optical element 9 and the object with the liquid LQ. An immersion space LS is formed in

  In the present embodiment, the immersion space LS is formed so that a part of the surface of the substrate P including the projection region PR is covered with the liquid LQ during the exposure of the substrate P. During the exposure of the substrate P, an interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 13 of the liquid immersion member 3 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  The interferometer system 4 includes a first interferometer unit 4A that measures position information of the mask stage 1 and a second interferometer unit 4B that measures position information of the substrate stage 2. The first interferometer unit 4 </ b> A measures the position information of the mask stage 1 using the measurement mirror 1 </ b> R disposed on the mask stage 1. The second interferometer unit 4 </ b> B measures the position information of the substrate stage 2 using the measurement mirror 2 </ b> R disposed on the substrate stage 2. When performing the exposure process of the substrate P or when performing a predetermined measurement process, the control device 5 operates the drive system based on the measurement result of the interferometer system 4 to perform the mask stage 1 (mask M), And the position control of the substrate stage 2 (substrate P) is executed.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 5 controls the mask stage 1 and the substrate stage 2 in a state where the immersion space LS is formed, so that the mask M and the substrate P are placed on the emission surface 11 and the surface of the substrate P. Move in a predetermined scanning direction in the XY plane intersecting the optical path between the two. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction.

  On the substrate P, a plurality of shot areas, which are exposure target areas, are arranged in a matrix. For example, in order to expose the first shot region of the substrate P, the control device 5 moves the substrate P (first shot region) in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and the substrate P The mask M is moved in the Y-axis direction with respect to the illumination region IR of the illumination system IL in synchronization with the movement in the Y-axis direction, and the liquid LQ in the immersion space LS on the substrate P and the projection optical system PL. The first shot area is irradiated with exposure light EL via Thereby, an image of the pattern of the mask M is projected onto the first shot region of the substrate P, and the first shot region is exposed with the exposure light EL through the liquid LQ. After the exposure of the first shot area is completed, the control device 5 moves the substrate P in the X-axis direction (or the XY plane) with the immersion space LS formed in order to start the exposure of the next second shot area. An operation (stepping operation) that moves in the direction inclined with respect to the X-axis direction is executed to move the second shot area to the exposure start position. Then, the control device 5 starts exposure of the second shot area. The control device 5 performs a scan exposure operation for exposing the shot area while moving the shot area in the Y-axis direction with respect to the projection area PR, and after the exposure of the shot area is completed, sets the next shot area to the exposure start position. A plurality of shot areas on the substrate P are sequentially exposed while repeating the stepping operation for moving to.

  FIG. 2 is a side sectional view showing an example of the last optical element 9 and the liquid immersion member 3 according to this embodiment, and FIG. 3 is a side sectional view in which a part of FIG. 2 is enlarged. In the following, in order to simplify the description, the description will mainly be given of the state in which the terminal optical element 9 and the liquid immersion member 3 and the substrate P are opposed to each other as an example. As described above, an object other than the substrate P such as the substrate stage 2 can be disposed at a position facing the terminal optical element 9 and the liquid immersion member 3.

  2 and 3, the last optical element 9 emits the exposure light EL toward the incident surface 10 on which the exposure light EL from the object plane of the projection optical system PL is incident and the image plane of the projection optical system PL. And an outer peripheral surface 12 extending from the edge of the emission surface 11 toward the incident surface 10 side. The optical axis of the last optical element 9 is substantially parallel to the Z axis. In the present embodiment, the image plane of the projection optical system PL is substantially parallel to the XY plane.

  In the present embodiment, the incident surface 10 has a shape with a convex surface facing the object surface of the projection optical system PL. In the present embodiment, the incident surface 10 is a curved surface convex toward the object plane side of the projection optical system PL. In the present embodiment, the emission surface 11 is a plane substantially parallel to the XY plane. In the present embodiment, at least a part of the outer peripheral surface 12 is gradually separated from the image plane (surface of the substrate P) of the projection optical system PL in the radiation direction with respect to the optical axis of the terminal optical element 9 (projection optical system PL). It is inclined to.

  The incident surface 10 is a surface facing the object surface side of the projection optical system PL, and the exposure light EL passes through at least a part of the incident surface 10. Note that the exposure light EL does not have to pass through the entire incident surface 10. The exit surface 11 is a surface facing the image plane side of the projection optical system PL, and the exposure light EL passes through at least a part of the exit surface 11. Note that the exposure light EL does not have to pass through the entire emission surface 11.

  The projection optical system PL has a holding mechanism 14 that holds the terminal optical element 9. In the present embodiment, the holding mechanism 14 is supported by the lens barrel 7. The last optical element 9 is held by the lens barrel 7 via the holding mechanism 14.

  In the present embodiment, the last optical element 9 has a flange 15 disposed between the upper end of the outer peripheral surface 12 and the edge of the incident surface 10. In the present embodiment, the holding mechanism 14 holds at least a part of the flange 15. In the present embodiment, the incident surface 10 is disposed so as to face the internal space of the lens barrel 7. The holding mechanism 14 holds the terminal optical element 9 so that the optical axis of the terminal optical element 9 and the Z-axis direction are substantially parallel, and the exit surface 11 and the XY plane are approximately parallel.

  In the present embodiment, the space including the optical path on the image plane side of the projection optical system PL of the last optical element 9 is filled with the liquid LQ, and at least a part of the exit surface 11 and the outer peripheral surface 12 is in contact with the liquid LQ. Further, in this embodiment, there is no liquid LQ in the space including the optical path on the object plane side of the projection optical system PL of the terminal optical element 9, and the incident surface 10 is in contact with gas.

  In the present embodiment, the liquid immersion member 3 is an annular member. In the present embodiment, the liquid immersion member 3 includes a main body member 16 and a porous member 17. In the present embodiment, the main body member 16 is made of titanium. The porous member 17 is a plate-like member including a plurality of openings (openings or pores). In the present embodiment, the porous member 17 is a mesh plate in which a large number of small holes are formed in a mesh shape. In the present embodiment, the porous member 17 is made of titanium. As the porous member 17, a sintered member (for example, sintered metal) in which a large number of pores are formed, a foamed member (for example, foamed metal), or the like may be used.

  The body member 16 is at least partially disposed between the exit surface 11 of the terminal optical element 9 and the surface of the substrate P with respect to the Z-axis direction, and at least part of the outer peripheral surface 12 of the terminal optical element 9. The first recovery port 21 that is disposed on at least a part of the side part 19 that opposes the gap G and that can recover at least a part of the liquid LQ between the outer peripheral surface 12 and the side part 19. And. At least a part of the side portion 19 is disposed around the outer peripheral surface 12. In the present embodiment, the first recovery port 21 is disposed around the outer peripheral surface 12.

  The side portion 19 includes a first portion 191 disposed around the outer peripheral surface 12 and a second portion 192 disposed on the emission surface 11 side (substrate P side) with respect to the first portion 191. Further, the side portion 19 has an inner peripheral surface 20 at least partially facing the outer peripheral surface 12 with a gap G interposed therebetween. The inner peripheral surface 20 includes a first surface 201 disposed around the outer peripheral surface 12 and a second surface 202 disposed on the emission surface 11 side with respect to the first surface 201. In the present embodiment, the first surface 201 is a partial region of the inner peripheral surface 20 in the first portion 191. The second surface 202 is a partial region of the inner peripheral surface 20 in the second portion 192. The edge of the first portion 191 (first surface 201) on the exit surface 11 side and the edge of the second portion 192 (second surface 202) on the incident surface 10 side are adjacent to each other.

  The first recovery port 21 is disposed in the first portion 191 (first surface 201). The first portion 191 can recover the liquid LQ through the first recovery port 21. The second portion 192 (second surface 202) cannot recover the liquid LQ. In the present embodiment, the side portion 19 has a supply port 23 that can supply the liquid LQ onto the substrate P. The supply port 23 is disposed in the second portion 192.

  Further, the main body member 16 has a porous member 24 disposed in the first recovery port 21. The porous member 24 is a plate-like member including a plurality of openings (openings or pores). In the present embodiment, the porous member 24 is a mesh plate in which a large number of small holes are formed in a mesh shape. In the present embodiment, the porous member 24 is made of titanium. The mesh plate is bent along the outer peripheral surface 12. The surface of the porous member 24 facing the outer peripheral surface 12 constitutes a part of the inner peripheral surface 20 (first surface 201). As the porous member 24, a sintered member (for example, a sintered metal) in which a large number of pores are formed, a foamed member (for example, a foamed metal), or the like may be used.

  In the present embodiment, the outer peripheral surface 12 and the inner peripheral surface 20 are substantially parallel. The first gap G1 formed between the outer peripheral surface 12 and the inner peripheral surface 20 (first surface 201) of the first portion 191, and the inner peripheral surface 20 (second surface 202) of the outer peripheral surface 12 and the second portion 192. ) Is substantially the same as the second gap G2 formed between the first and second gaps.

  The plate portion 18 has an opening 25 in the center. The plate portion 18 is disposed around the opening 25 and has a lower surface 26 that can face the substrate P (object) disposed in the projection region PR, and an upper surface 27 opposite to the lower surface 26. At least a part of the upper surface 27 faces a part of the emission surface 11 via a gap. The exposure light EL emitted from the emission surface 11 can pass through the opening 25. For example, during exposure of the substrate P, the exposure light EL emitted from the emission surface 11 passes through the opening 25 and is irradiated on the surface of the substrate P through the liquid LQ.

  The main body member 16 includes a second recovery port 22 that can recover the liquid LQ on the substrate P at a position that can face the surface of the substrate P. The second recovery port 22 is formed in the main body member 16 and includes an opening facing the substrate P.

  The supply port 23 is connected to a liquid supply device 29 via a flow path 28. The liquid supply device 29 can supply clean and temperature-adjusted liquid LQ to the supply port 23. The flow path 28 includes a supply flow path formed inside the main body member 16 and a flow path formed by a supply pipe that connects the supply flow path and the liquid supply device 29. The liquid LQ delivered from the liquid supply device 29 is supplied to the supply port 23 via the flow path 28. The supply port 23 is disposed at a predetermined position of the main body member 16 facing the optical path in the vicinity of the optical path. In the present embodiment, the supply port 23 supplies the liquid LQ to the space between the emission surface 11 and the upper surface 27. The liquid LQ supplied from the supply port 23 is supplied onto the substrate P through the opening 25.

  The first recovery port 21 is connected to the first liquid recovery device 31 via the flow path 30. The first liquid recovery device 31 includes a vacuum system and can recover the liquid LQ by sucking the liquid LQ from the first recovery port 21. The flow path 30 includes a recovery flow path formed inside the main body member 16 and a flow path formed by a recovery pipe that connects the recovery flow path and the first liquid recovery device 31. The liquid LQ recovered from the first recovery port 21 is recovered by the first liquid recovery device 31 via the flow path 30.

  The second recovery port 22 is connected to the second liquid recovery device 33 via the flow path 32. The second liquid recovery device 33 includes a vacuum system and can recover the liquid LQ by sucking the liquid LQ from the second recovery port 22. The flow path 32 includes a recovery flow path formed inside the main body member 16 and a flow path formed by a recovery pipe that connects the recovery flow path and the second liquid recovery device 33. The liquid LQ recovered from the second recovery port 22 is recovered by the second liquid recovery device 33 via the flow path 32.

  In the present embodiment, the second recovery port 22 is disposed around the optical path of the exposure light EL. The second recovery port 22 is disposed at a predetermined position of the main body member 16 that can face the surface of the substrate P. The second recovery port 22 can recover at least a part of the liquid LQ on the surface of the substrate P facing the lower surface 13 of the liquid immersion member 3.

  The porous member 17 is disposed in the second recovery port 22. In the present embodiment, the lower surface 16 of the liquid immersion member 3 includes a lower surface 26 of the plate portion 18 and a lower surface 34 of the porous member 17 that is disposed around the lower surface 26 and can face the substrate P. The lower surface 13 faces the substrate P (object) disposed in the projection region PR.

  In the present embodiment, the control device 5 executes the liquid recovery operation using the second recovery port 22 in parallel with the liquid supply operation using the supply port 23, so that the terminal optical element 9 and the liquid immersion member on one side are performed. 3 and an immersion space LS are formed with the liquid LQ between the terminal optical element 9 and the other substrate P facing the liquid immersion member 3.

  In the present embodiment, the liquid LQ in the immersion space LS is held in a part of the gap G between the outer peripheral surface 12 and the side portion 19 (inner peripheral surface 20). As shown in FIG. 3, in this embodiment, when the substrate P is in the first movement state, the upper surface (interface, meniscus) of the liquid LQ in the gap G formed between the outer peripheral surface 12 and the inner peripheral surface 20. ) The liquid supply condition of the supply port 23 and the second recovery port 22 so that LH is disposed in the second gap G2 formed between the outer peripheral surface 12 and the second surface 202 (second portion 192). The liquid recovery conditions are determined. The first movement state is, for example, at least one of a state where the substrate P is stationary, a state where the substrate P is moving at a predetermined speed or less, and a state where the substrate P is linearly moved within a predetermined distance within the XY plane. Including one. The liquid supply condition includes the amount of liquid supplied from the supply port 23 per unit time. The liquid recovery condition includes the amount of liquid recovered from the second recovery port 22 per unit time.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described.

  In order to perform the exposure operation of the substrate P, the control device 5 forms an immersion space LS with the liquid LQ between the terminal optical element 9 and the immersion member 3 and the surface of the substrate P. The control device 5 sequentially exposes a plurality of shot regions on the substrate P via the projection optical system PL and the liquid LQ in the immersion space LS. In the present embodiment, at the time of exposure of the substrate P, the position of the interface LH of the liquid LQ in the gap G is maintained between the outer peripheral surface 12 and the second surface 202 (second gap G2). P moving conditions are determined in advance.

  FIG. 4 is a schematic diagram showing a state of the immersion space LS when the substrate P is moved in a predetermined direction in the XY plane with respect to the last optical element 9 and the immersion member 3 in a state where the immersion space LS is formed. It is. FIG. 4 shows a state in which the substrate P is moved in the −Y direction with respect to the last optical element 9 and the liquid immersion member 3 as an example.

  By the movement of the substrate P, the interface LG of the liquid LQ between the lower surface 13 of the liquid immersion member 3 and the substrate P moves in the −Y direction. Further, the movement of the substrate P may cause the interface LH of the liquid LQ between the outer peripheral surface 12 and the second surface 202 (second gap G2) to move toward the incident surface 10 side. The interface LH of the liquid LQ in the second gap G2 is changed to the incident surface 10 side by the movement of the substrate P according to the movement condition of the substrate P or according to the surface state of at least one of the outer peripheral surface 12 and the inner peripheral surface 20. There is a possibility to move greatly. For example, when the substrate P is moved in a second movement state different from the first movement state, there is a possibility that the interface LH of the liquid LQ moves greatly toward the incident surface 10 side. For example, when the substrate P moves at a predetermined speed or more, or when the linear movement distance of the substrate P when moving from the first position to the second position in the XY plane exceeds a predetermined distance, the liquid LQ changes to a predetermined state. There is a possibility that the interface LH of the liquid LQ may greatly move toward the incident surface 10 side. As a result, the liquid LQ in the second gap G2 passes through the opening 35 between the outer peripheral surface 12 and the upper end of the inner peripheral surface 20 via the space between the outer peripheral surface 12 and the first surface 201 (first gap G1). There is a possibility that the liquid LQ leaks to the outside of the gap G, or the leaked liquid LQ enters or remains in a region where the liquid LQ is not desired. When such leakage, penetration, or residue of the liquid LQ occurs, the member in the exposure apparatus EX may be thermally deformed or the substrate P may be thermally deformed by the heat of vaporization of the liquid LQ.

  In the present embodiment, the first recovery port 21 is provided in the liquid immersion member 3, and at least a part of the liquid LQ between the outer peripheral surface 12 and the side portion 19 can be recovered. The first recovery port 21 can recover the liquid LQ that has contacted the surface of the porous member 24. The surface of the porous member 24 is disposed in the first portion 191, and the first recovery port 21 exists between the outer peripheral surface 12 and the first portion 191 (first surface 201) (first gap G 1). The liquid LQ can be recovered. Therefore, even if the liquid LQ existing between the outer peripheral surface 12 and the second portion 192 (second surface 202) (second gap G2) tries to move to the incident surface 10 side (opening 35 side), the liquid LQ is When it moves to the first gap G1 before reaching the opening 35, it is recovered by the first recovery port 21. Therefore, leakage of the liquid LQ from the opening 35 to the outside is suppressed.

  In the present embodiment, the control device 5 continues to operate the first liquid recovery device 31 during the exposure of the substrate P. As a result, even if the interface LH of the liquid LQ largely moves toward the incident surface 10 due to some cause such as a change in the movement state of the substrate P, the liquid LQ can be recovered at the first recovery port 21.

  Note that when the interface LH of the liquid LQ is arranged in the second gap G2, the control device 5 stops the operation of the first liquid recovery device 31, and the liquid LQ in the second gap G2 moves to the first gap G1. When doing so, the operation of the first liquid recovery device 31 may be started. For example, a sensor capable of detecting the liquid LQ is disposed at the edge of the first surface 201 on the emission surface 11 side. The sensor does not detect the liquid LQ when the interface LH of the liquid LQ is disposed in the second gap G2, and detects the liquid LQ when the liquid LQ in the second gap G2 moves to the first gap G1. The sensor outputs the detection result to the control device 5. When the control device 5 determines that the liquid LQ in the second gap G2 has moved to the first gap G1 based on the detection result of the sensor, the control device 5 starts the operation of the first liquid recovery device 31 and performs the first recovery. The liquid recovery operation using the mouth 21 is started. This also prevents the liquid LQ from leaking out.

  Further, the control device 5 can control the operation of the first liquid recovery device 31 according to the movement state (including at least one of the movement speed and the linear movement distance) of the substrate P (substrate stage 2). For example, based on the measurement result of the interferometer system 4, it is determined that the moving speed of the substrate stage 2 is equal to or higher than a predetermined speed, or the linear moving distance of the substrate stage 2 is determined in advance. If it is determined that the distance is equal to or longer than the predetermined distance, the control device 5 starts the operation of the first liquid recovery device 31 and starts the liquid recovery operation using the first recovery port 21. On the other hand, when it is determined that the moving speed of the substrate stage 2 is equal to or less than the predetermined speed, or when it is determined that the linear moving distance of the substrate stage 2 is equal to or less than the predetermined distance, the control device 5 performs the first liquid recovery device 31. Stop the operation.

  As described above, according to the present embodiment, the first recovery port 21 that can recover at least part of the liquid LQ between the outer peripheral surface 12 and the side portion 19 (inner peripheral surface 20) is provided. The leakage of the liquid LQ can be suppressed. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.

  Further, according to the present embodiment, fluctuations in the position of the interface LH of the liquid LQ in the gap G can be suppressed. If the position of the interface LH of the liquid LQ varies greatly, the force that the liquid LQ gives to the last optical element 9 may vary. As a result, the position of the terminal optical element 9 may fluctuate or the optical characteristics of the terminal optical element 9 may change, resulting in an exposure failure. According to this embodiment, it is possible to suppress the occurrence of exposure failure.

  In the present embodiment, the outer peripheral surface 12 is inclined so as to gradually move away from the image plane of the projection optical system PL (the surface of the substrate P) in the radial direction with respect to the optical axis of the last optical element 9. Although described as an example, it may be perpendicular to the image plane, for example.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 5 is a diagram illustrating an example of the liquid immersion member 3B according to the second embodiment. As shown in FIG. 5, the liquid immersion member 3 </ b> B includes a plate portion 18 and a side portion 19 </ b> B that at least partially opposes the outer peripheral surface 12 with a gap G interposed therebetween. The side portion 19B has an inner peripheral surface 20B including a first surface 201B disposed around the outer peripheral surface 12 and a second surface 202B disposed on the emission surface 11 side with respect to the first surface 201B. The liquid immersion member 3B includes a supply port 23 that can supply the liquid LQ onto the substrate P, and a second recovery port 22 that can recover the liquid LQ on the substrate P. In the present embodiment, the liquid recovery member 3B is not provided with a first recovery port.

  At least one of the first surface 201B and the second surface 202B is inclined with respect to the outer peripheral surface 12. The first angle θ1 formed by the outer peripheral surface 12 and the first surface 201B is larger than the second angle θ2 formed by the outer peripheral surface 12 and the second surface 202B. In the present embodiment, the edge on the exit surface 11 side of the first surface 201B and the edge on the incident surface 10 side of the second surface 202B are adjacent to each other.

  In the present embodiment, the outer peripheral surface 12 and the second surface 202B are substantially parallel. The first surface 201B is inclined with respect to the second surface 202. The first surface 201B is inclined so that the space between the outer peripheral surface 12 and the first surface 201B gradually expands toward the incident surface 10 side.

  Also in the liquid immersion member 3B according to this embodiment, leakage of the liquid LQ from the opening 35B between the outer peripheral surface 12 and the upper end of the inner peripheral surface 20B can be suppressed. According to the present embodiment, for example, even if the liquid LQ existing between the outer peripheral surface 12 and the second surface 202B attempts to move to the incident surface 10 side (opening 35B side), for example, by movement of the substrate P, the outer peripheral surface. 12 and the first surface 201B are larger than the second gap G2 formed between the outer peripheral surface 12 and the second surface 202B, and therefore the outer peripheral surface 12 and the first surface 201B. The liquid LQ is restrained from moving toward the incident surface 10 side. Therefore, leakage of the liquid LQ from the opening 35B can be suppressed.

  Further, according to the present embodiment, for example, even if the gas present in at least a part of the first gap G1 becomes a bubble and is mixed into the liquid LQ, the liquid LQ (and consequently, the bubble present in the second gap G2). Movement to the liquid LQ) existing between the emission surface 11 and the surface of the substrate P is suppressed. In other words, bubbles are suppressed from being mixed in the liquid LQ that fills the optical path. Therefore, occurrence of exposure failure can be suppressed.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 6 is a diagram illustrating an example of a liquid immersion member 3C according to the third embodiment. The liquid immersion member 3C according to the third embodiment has a configuration in which the requirements of the liquid immersion member 3 according to the first embodiment described above and the requirements of the liquid immersion member 3B according to the second embodiment are combined. In FIG. 6, the liquid immersion member 3 </ b> C is disposed on the first surface 201 </ b> C and the inner surface 20 </ b> C including the second surface 202 </ b> C substantially parallel to the outer surface 12 and the first surface 201 </ b> C inclined with respect to the second surface 202 </ b> C. And a first recovery port 21 capable of recovering at least part of the liquid LQ between the outer peripheral surface 12 and the side portion 19C. The first gap G1 formed between the outer peripheral surface 12 and the first surface 201C is larger than the second gap G2 formed between the outer peripheral surface 12 and the second surface 202C. Also in the present embodiment, it is possible to suppress the occurrence of defects such as leakage of the liquid LQ and to suppress the occurrence of exposure failure.

  In the second and third embodiments described above, the second surface 202B (202C) is parallel to the outer peripheral surface 12, and the first surface 201B (201C) is inclined with respect to the second surface 202B (202C). However, the outer peripheral surface 12 and the second surface 202B (202C) may be non-parallel. For example, the second surface 202B (202C) may be inclined so that the space between the outer peripheral surface 12 and the second surface 202B (202C) gradually expands toward the incident surface 10 side, or gradually. The second surface 202B (202C) may be inclined so as to be narrowed. Even in that case, the first angle θ1 formed by the outer peripheral surface 12 and the first surface 201B (201C) is set to be larger than the second angle θ2 formed by the outer peripheral surface 12 and the second surface 202B (202C). , Leakage of the liquid LQ can be suppressed.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the first, second, and third embodiments described above, the exit surface 11 side edge of the first surface 201 (201B, 201C) and the entrance surface 10 side edge of the second surface 202 (202B, 202C) The case where the two are adjacent to each other has been described as an example. A characteristic part of the fourth embodiment is that a third surface is provided between the first surface and the second surface.

  FIG. 7 is a diagram illustrating an example of the liquid immersion member 3D according to the fourth embodiment. In FIG. 7, the liquid immersion member 3D is disposed between the first surface 201D, the second surface 202D disposed on the emission surface 11 side with respect to the first surface 201D, and between the first surface 201D and the second surface 202D. An inner peripheral surface 20D including the third surface 203D is provided. The third surface 203D is disposed between the edge of the first surface 201D on the exit surface 11 side and the edge of the second surface 202D on the incident surface 10 side. The edge on the exit surface 11 side of the first surface 201D and the edge on the incident surface 10 side of the third surface 203D are adjacent to each other. The edge on the incident surface 10 side of the second surface 202D and the edge on the exit surface 11 side of the third surface 203D are adjacent to each other.

  The angle formed by the outer peripheral surface 12 and the first surface 201D is the first angle θ1. An angle formed by the outer peripheral surface 12 and the second surface 202D is a second angle θ2. The angle formed by the outer peripheral surface 12 and the third surface 203D is the third angle θ3. In the present embodiment, the third angle θ3 is different from the first angle θ1 and the second angle θ2.

  In the present embodiment, the first angle θ1 and the second angle θ2 are substantially the same. In the present embodiment, the outer peripheral surface 12 and the first surface 201D are substantially parallel. The outer peripheral surface 12 and the second surface 202D are substantially parallel.

  In the present embodiment, the first gap G1 formed between the outer peripheral surface 12 and the first surface 201D is larger than the second gap G2 formed between the outer peripheral surface 12 and the second surface 202D. . A first recovery port 21 capable of recovering at least part of the liquid LQ between the outer peripheral surface 12 and the side portion 19D is disposed on the first surface 201D. A porous member 24 is disposed in the first recovery port 21.

  Also in the present embodiment, leakage of the liquid LQ and the like can be suppressed, and the occurrence of exposure failure can be suppressed.

  In the present embodiment, the first angle θ1 and the second angle θ2 may be different. For example, the first angle θ1 may be larger than the second angle θ2.

  In the present embodiment, the third surface 203D may be arcuate in the cross section including the optical axis of the last optical element 9. Further, at least a part of the first recovery port 21 may be disposed on the third surface 203D.

  In the present embodiment, the first recovery port 21 may be omitted.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 8 is a diagram illustrating an example of the liquid immersion member 3E according to the fifth embodiment. In FIG. 8, the liquid immersion member 3E has a side portion 19E including a first portion 191E and a second portion 192E. The second surface 202E of the second portion 192E is substantially parallel to the outer peripheral surface 12. The first portion 191E (first surface 201E) is inclined so that the space between the outer peripheral surface 12 and the first inclined surface 81 that is inclined so as to gradually narrow toward the incident surface 10 side, and to expand. A second inclined surface 82. In the present embodiment, the first inclined surface 81 and the second inclined surface 82 are alternately arranged from the exit surface 11 side toward the incident surface 10 side. Also in this embodiment, leakage of the liquid LQ can be suppressed.

<Sixth Embodiment>
Next, a sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 9 is a view showing the last optical element 9F and the liquid immersion member 3 according to the sixth embodiment. As shown in FIG. 9, the outer peripheral surface 12 </ b> F of the last optical element 9 </ b> F is disposed on the incident surface 10 side with respect to the third surface 41 adjacent to the edge of the exit surface 11 and the third surface 41. And a fourth surface 42 that is inclined with respect to. The liquid immersion member 3 described in the first embodiment is disposed around the last optical element 9F. An angle θ1F formed by the fourth surface 42 of the outer peripheral surface 12F and the first surface 201 of the liquid immersion member 3 is larger than an angle θ2F formed by the third surface 41 of the outer peripheral surface 12F and the second surface 202 of the liquid immersion member 3. . By so doing, it is possible to suppress the occurrence of problems such as leakage of the liquid LQ.

  In the present embodiment, the first recovery port 21 may be omitted.

  In the first to sixth embodiments described above, in the cross section including the optical axis of the last optical element 9, at least a part of the first surface 201 may be arcuate, or at least a part of the second surface 202 is a circle. It may be arcuate.

  In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 9 of the projection optical system PL is filled with the liquid LQ. For example, this is disclosed in International Publication No. 2004/019128. As described above, it is possible to employ a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 9 is also filled with the liquid LQ.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  In addition, the requirements of the above-described embodiments are that a multi-stage including a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to a stage type exposure apparatus. Three or more substrate stages can be arranged.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  In addition, the requirements of each of the above-described embodiments are that line and space patterns are formed on the substrate P by forming interference fringes on the substrate P as disclosed in, for example, WO 2001/035168. The present invention can also be applied to an exposure apparatus (lithography system) that exposes.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 10, a microdevice such as a semiconductor device includes a step 301 for designing a function / performance of the microdevice, a step 302 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 303, substrate processing step 304 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 305, an inspection step 306, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Liquid immersion member, 9 ... Termination optical element, 10 ... Incident surface, 11 ... Ejection surface, 12 ... Outer peripheral surface, 18 ... Plate part, 19 ... Side part, 20 ... Inner peripheral surface, 21 ... 1st recovery port, 22 ... 2nd recovery port, 23 ... supply port, 24 ... porous member, 191 ... 1st part, 192 ... 2nd part, 201 ... 1st surface, 202 ... 2nd surface, G ... gap, G1 ... first gap, G2 ... second gap, EL ... exposure light, EX ... exposure device, LQ ... liquid, LS ... immersion space, P ... substrate, PL ... projection optical system

Claims (17)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
Incident surface on which the exposure light is incident, an exit surface wherein the exposure light is emitted, and have a peripheral surface extending toward the incident side from the edge of the exit surface, a projection optical system that irradiates the exposure light An optical member closest to the image plane of the projection optical system ,
An optical path between the exit surface and an object disposed at a position where the exposure light from the exit surface can be irradiated is at least partly opposed to the outer peripheral surface through a gap. An immersion member capable of forming an immersion space so as to be filled with
The side portion includes a first portion disposed around the outer peripheral surface, and a second portion disposed on the emission surface side with respect to the first portion,
A first gap formed between the outer peripheral surface and the first portion is larger than a second gap formed between the outer peripheral surface and the second portion;
The liquid immersion member is disposed in the first portion of the side portion, and includes a first recovery port capable of recovering at least part of the liquid between the outer peripheral surface and the side portion, and the first recovery port. An exposure apparatus having a porous member disposed . The second part is an exposure apparatus according to claim 1, wherein the liquid is not possible recovery. Wherein arranged in the second portion, the exposure device according to claim 1 or 2, including a supply port capable of supplying the liquid. The exposure apparatus according to claim 1, wherein an edge of the first portion on the exit surface side and an edge of the second portion on the incident surface side are adjacent to each other. Before SL side, the includes a first surface which is disposed around the outer peripheral surface and a second surface disposed on the exit surface side with respect to the first surface, wherein with respect to the outer peripheral surface and the first surface and at least one of the inclination of the second surface, and the outer peripheral surface and the first surface and the first angle formed, the second angle larger than the claim outer peripheral surface and said second surface forms 1 The exposure apparatus as described in any one of -4 . The exposure apparatus according to claim 5 , wherein an edge of the first surface on the exit surface side and an edge of the second surface on the incident surface side are adjacent to each other. The exposure apparatus according to claim 5, wherein the side portion includes a third surface between an edge of the first surface on the exit surface side and an edge of the second surface on the incident surface side. The exposure apparatus according to claim 7, wherein a third angle formed by the outer peripheral surface and the third surface is different from both the first angle and the second angle. The exposure apparatus according to claim 5 , wherein the first surface is inclined with respect to the second surface. The exposure apparatus according to claim 5 , wherein the first surface is inclined so that a space between the outer peripheral surface and the first surface gradually increases toward the incident surface side. The exposure apparatus according to claim 5 , wherein the outer peripheral surface and the second surface are substantially parallel. The exposure apparatus according to claim 5 , wherein the first recovery port is disposed on the incident surface side of the first surface of the side portion. The exposure apparatus according to claim 1, wherein the liquid is recovered from the first recovery port according to the position of the liquid interface in the gap. The liquid immersion member, the are arranged on the lower surface of the liquid immersion member, of any one of claims 1 to 13 for the liquid on the surface of the object facing the lower surface comprises a second recovery port capable of recovering Exposure device. The object is in a state where the immersion space is formed, an exposure apparatus according to any one of claims 1-14 which moves in a direction intersecting the optical path between the exit surface and the object surface.   The exposure apparatus according to claim 1, wherein the object includes the substrate. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 16 ,
Developing the exposed substrate; and a device manufacturing method.

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