JP5403980B2 - Apparatus and method for facilitating cooling of an electronic equipment rack using a water refrigerant compression system - Google Patents

Description

  The present invention relates to water cooling technology for electronic devices, and more particularly, the invention relates to an apparatus and method for cooling an electronic device, a refrigerant shielded electronic device, and a method for cooling an electronic device.

  Electronic devices including personal computers, servers, workstations, mainframe computers, and the like typically have a microprocessor unit (hereinafter referred to as MPU) or central processing unit in order to maintain its stable performance. A cooling device for cooling a heat source such as a unit (hereinafter referred to as a CPU) is required. In recent years, there has been a demand for operation of electronic devices with high performance and a high clock rate. And the generation of heat from electronic devices continues to increase new and old problems in computer technology.

  The problem is just MPU and / or CPU heat generation, but with recent MPUs with operating clock rates of a few gigahertz, the heat generation density exceeds the thermal density of the reactor, and in the near future There is a technical prediction that the solar heat generation density will be reached.

  One strategy to reduce the heat generation problem is to reduce the instructions per single core while maintaining overall performance with the MPU and / or CPU as a multi-core architecture. However, single-core clock rates are increasingly associated with increased performance, and the trade-off issue between heat dissipation and processor performance is a high barrier to modern processor technology. Conceivable.

  Furthermore, modern electronic devices tend to use a large number of MPUs and / or CPUs that operate cooperatively with each other, ie, so-called grid computing and the multi-core architecture described above, even if MPUs and / or CPUs are used. Although the clock rate is suppressed, the information processing density per unit electronic device increases. This trend will be accelerated in the future as multi-core architecture or grid computing between processors becomes more widespread and as high performance operation for electronic devices is required.

  In the data center that handles a huge amount of information such as Internet data, information for search engines, in-house data, etc. by the computing environment described above, a large number of computer computing facilities are arranged and cooperate with each other. Is operating. Such data centers tend to develop the computer computing performance of this data center in order to address the growing demand for high performance computer computing. Therefore, in relation to the global warming problem caused by computer computation and the reduction of the investment cost for the data center, the thermal management of the data center becomes an important problem that must be solved urgently.

  Another strategy for solving heat exhaust from MPUs and / or CPUs in electronic devices is known as a direct cooling architecture for MPUs and / or CPUs with a suitable refrigerant.

  FIG. 14 shows an exemplary cooling system 1400 using an air cooling mechanism for an electronic device. A cooling system 1400 shown in FIG. 14 is configured to cool an electronic device while performing air conditioning in a computer room. In the computer room space, an electronic device 1440 is disposed on the floor 1410 and performs various types of data processing. The electronic device 1440 can be, for example, a workstation, a server, and / or a mainframe computer.

  The chiller unit 1420 is installed in a computer room and supplies mainly cooled air (hereinafter referred to as cooling air) to a space 1450 provided under the floor 1410. The space 1450 provides a flow path such as cooling air. Floor 1410 includes a plurality of porous panels that allow cooling air to pass upwardly from space 1450 to the computer room.

  The position of the porous panel 1430 on the floor 1410 is determined depending on the position of the cooling air intake of the electronic device 1440. Cooling air is supplied to the air intake, that is, the space provided between the electronic devices facing each other on the low temperature side.

  Referring to FIG. 15, a schematic of an air flow 1500 of the cooling device shown in FIG. 15 is shown. The cooling air 1570 passes through the underfloor space 1595 and flows from the underfloor space 1595 into the computer room at the location of the porous panel 1580. The porous panel 1580 is installed between electronic devices that are positioned with their surfaces on the low temperature side facing each other.

  The cooling air is drawn into both electronic devices from the low temperature side, and performs heat exchange with the MPU and / or CPU incorporated in the electronic device. The heated air 1590 is then released from the high temperature side of both electronic devices. The heated and released air 1590 then flows upward and flows laterally toward the CRACs (ie, Computing Room Air Conditioners 1510, 1560), and the air conditioning within the CRACs 1510, 1560. The cooling air is regenerated by the member. The cooling air 1570 is then supplied again to the underfloor space 1595 for thermal management of the electronic device.

  In the conventional cooling device described above, the cooling air is mainly used for cooling the MPU and / or CPU. That is, most of the cooling air is consumed to cool the electronic device. And it is necessary to prepare the air conditioning equipment of a computer room as an individual air conditioning system. Alternatively, it is necessary to increase the cooling capacity of CARCs to handle the overall air conditioning in the computer room.

  To date, direct cooling architectures for electronic devices have been developed to handle heat removal of information processing devices. For example, Japanese Patent Laid-Open No. 2002-374086 (Patent Document 1) discloses a cooling device for a rack-mounted information processing apparatus. In the configuration disclosed in Patent Document 1, a rack including a water cooling configuration is used, and a water flow path is provided in each column of the rack cabinet. The water that has passed through the pillar is introduced into the rack and introduced into a water cooling jacket for the CPU / LSI, thereby cooling the elements in the rack.

  Japanese Patent Laying-Open No. 2005-100091 (Patent Document 2) discloses a cooling module arranged directly on a CPU in order to share a water cooling module and a forced air cooling module. It can be switched.

  Japanese Patent Laying-Open No. 2006-285670 (Patent Document 3) also discloses an information processing blade and an information processing apparatus including the blade. The disclosed blade is cooled by water passing through a water channel provided within the blade. A CPU or other heat source is installed on the blade in a heat exchange relationship with the blade, and the heat source is cooled by the water cooled blade.

  As described above, the water cooling architecture is considered suitable as a cooling architecture for electronic devices. However, water is known to have the potential drawback of causing electrical device leakage if water infiltrates the electronic device. When water leaks in the housing of the electronic device, the electronic device or equipment such as a data center is seriously damaged.

  Until now, many attempts have been made to solve the water leakage. For example, Japanese Patent Publication No. 7-117330 (Patent Document 4) discloses a cooling device in which a corrosive ion removing device is provided in a cooling water circulation path. The disclosed removal device selectively removes cations of corrosive factors to improve the corrosion protection of the cooling device.

  Attempts have been made to improve the risk of leaks from electronic device cooling systems, but the mechanisms of corrosion, such as piping, have not yet been fully elucidated. And since corrosion and its magnitude are substantially dependent on the particular environment in which the electronic device is located, in practice protection from problems due to corrosion under various conditions is still uncertain.

  In addition, factors causing water leakage include, for example, cracking or breakage due to impact, loose joint joint, and the like in addition to corrosion. For this reason, when all of the above factors are considered, it is difficult to solve the various factors and overcome the disadvantages.

As a result, there is still a need for an effective cooling system, and the need is that even if data center thermal management is provided, the advancement of devices and information processing technology will create a paradigm for high performance computing. It is getting bigger and bigger as it is realized. Furthermore, there is still a growing need to overcome the exhaust heat of electronic devices, and therefore, a new cooling device for electronic devices including MPUs and / or CPUs has been desired.
JP 2002-374086 A JP 2005-100091 A JP 2006-285670 A Japanese Patent Publication No.7-117330

  And the objective of this invention makes it possible to remove the heat | fever around MPU and / or CPU efficiently and safely, without the leakage of refrigerant | coolants, such as water, reducing the environmental load by computer calculation. It is to provide an apparatus for the above.

  Furthermore, another object of the present invention is to provide a data center in which a large number of electronic devices such as microcomputers, workstations, servers and mainframes are arranged in cooperation in order to cooperatively process valuable information. It is to provide a method for cooling an electronic device suitable for application.

  Still another object of the present invention is to provide an electronic device with a refrigerant shield that contributes to the global warming problem by suppressing heat discharge from the electronic device to the external environment and similarly reducing power consumption of the data center. It is to be.

  In order to solve the above-described problems of the conventional cooling device, the present invention provides an apparatus for cooling an electronic device in which a latent heat cooling device for a refrigerant such as water under reduced pressure with respect to ambient atmospheric pressure is employed. .

  In an embodiment of the present invention, an apparatus for cooling an electronic device can be provided. The electronic device includes a semiconductor element such as an MPU and a CPU cooled by a cooled refrigerant, or one of these. The refrigerant is cooled in the evaporator by the latent heat of vaporization of the refrigerant under a reduced pressure condition relative to the atmospheric pressure around the electronic device. When the refrigerant evaporates in the evaporator, the latent heat is removed, so that the refrigerant still in the liquid phase is cooled and a cooled refrigerant is prepared.

  The reduced pressure in the evaporator is maintained by a compressor connected by a bypass pipe that connects the evaporator of the refrigerant and the condenser.

  The cooled refrigerant is circulated through casings of electronic devices such as microcomputers, enterprise servers, workstations or mainframe computers, racks and computer computing nodes, or piping extending into at least one of these. , Cool the flow of air emitted from the electronic device. Thereby, the flow of air emitted from the electronic device can be prevented from severely detrimental to the air conditioning performance in a space such as a computer room where the electronic device is placed.

  Furthermore, according to the present invention, the refrigerant can be maintained below ambient atmospheric pressure in the region for heat exchange with the electronic device. And a refrigerant | coolant may be hold | maintained by the flow control member arrange | positioned upstream of a heat exchange area | region, in order to solve the leakage of the unexpected refrigerant | coolant. Thereby, the possibility of leakage of the refrigerant can be minimized.

  The refrigerant after heat exchange with the cooling air stream is returned to the evaporator for repeated exposure to reduced pressure to regenerate the cooled refrigerant.

  The condenser connected to the evaporator receives pressurized steam of the refrigerant downstream of the compressor, and the vacuum pump adjusts the pressure in the condenser while reducing the back pressure downstream of the compressor. The refrigerant in the condenser is cooled to approximately room temperature by a cooling tower, other suitable cooling equipment, or a heat exchange bath.

  In another embodiment of the present invention, an electronic device with a refrigerant shield can be provided. The electronic device with a refrigerant shield includes a computer operation node including a member for performing computer operation of information, a semiconductor element, a memory, an input / output unit, a bus, and a rack for holding a computer operation unit. The electronic device with the refrigerant shield further has a set of side walls. Each of the side walls is allowed to pass a refrigerant therein. In the electronic device with the refrigerant shield, a door-type heat exchange panel is detachably attached to a casing surrounding the computer computation node and the rack. The door heat exchange panel includes a serpentine heat exchange coil that receives the refrigerant and in which the pressure of the refrigerant is maintained below ambient atmospheric pressure.

  The electronic device with the refrigerant shield may further include a low temperature compartment and a fan disposed in the computer computing node. The low temperature compartment is cooled by the refrigerant while exchanging heat with the air flow passing through the computer computing node. The fan flows ambient air into the computer computing node to cool the member in the computer computing node, creating a flow of air toward the discharge side of the casing.

Yet another embodiment of the present invention provides a method for cooling an electronic device including a semiconductor element. This method
Generating a cooled refrigerant having a reduced pressure compared to ambient pressure;
Circulating the cooled refrigerant through a pipe passing through a heat exchange region of the electronic device on the high temperature side of the electronic device;
Performing heat exchange in the heat exchange region and the flow of air that has passed through the semiconductor element;
Returning the refrigerant after the heat exchange from the vapor of the refrigerant to a condenser for regenerating the refrigerant,
The pressure of the refrigerant is maintained below the atmospheric pressure in a heat exchange region with the air flow.

  The present invention will be described below with reference to embodiments shown in the drawings. However, it should be understood that the drawings described below are merely illustrative of the invention and do not limit the invention.

  FIG. 1 schematically illustrates a data center control system in which the apparatus, method, and shielded electronic device are implemented. The data center control system 100 includes a CRAC 110, a plurality of electronic devices 120 to 150, and an automatic environment monitoring facility (hereinafter referred to as AOEMF) 160. These devices are arranged on the floor panel 170 apart from the floor plank and form a space for utility piping. Floor panel 170 may have a section in which a through hole for introducing air cooled through this space (hereinafter referred to as cooling air) is formed.

  The CRAC 110 performs air conditioning in the computer room 195 and thermal management of devices in the computer room 195. The CRAC 110 receives the cooled refrigerant through the supply pipe 118 from the local infrastructure air conditioning system. The air in the computer room 195 is introduced into the CRAC 110 by the fan 112, exchanged heat by the heat exchanger 114, and then returned to the computer room 195.

  A cooled refrigerant such as water is supplied into the heat exchanger 114 to exchange heat with the air introduced into the CRAC 110. And the temperature of a refrigerant | coolant rises for this heat exchange. The heated refrigerant is then returned to the cooling device of the present invention to regenerate the cooled refrigerant. The refrigerant can be selected from known cooling media such as freons such as CFC, HCFC and HFC or natural media such as hydrocarbons, ammonia, carbon dioxide, air, water and the like. However, water is the most likely candidate as a refrigerant from the perspective of human health and the global environment. In the following description of the best embodiment, the present invention will be described on the assumption that the refrigerant is water.

  In the present embodiment, the electronic device includes a plurality of computer arithmetic units 120 to 150. However, the present invention is not limited to these, and other electronic devices such as routers and printers may exist in the computer room 195. The computer arithmetic units include servers 122 to 126, servers 132 to 136, servers 144 to 148, and servers 152 to 156, respectively. Each server includes at least a memory such as an MPU, a RAM and / or a ROM, and an I / O interface, and cooling air is supplied to each of the servers 122 to 126, 132 to 136, and 144 by a fan disposed in proximity to each server. 148, the servers 152 to 156 are introduced.

  In the embodiment shown in FIG. 1, the computer processing units 120-150 include different cooling architectures. The embodiment shown in FIG. 1 is an example of a variation of the cooling architecture, and the cooling architecture of the present invention need not be different between computer computing units; in other embodiments, the architecture shown in FIG. One type of cooling architecture selected can be introduced into the data center. As an example, the computer computing unit 120 includes a rear door heat exchanger 128 that is detachably attached to a casing or rack of the computer computing unit 120. When a rear door heat exchanger 128 is used, air passing through the servers 122-126 is released to the computer room 195 after heat exchange with the rear door heat exchanger 128. The cooled water (hereinafter referred to as cooling water) from the cooling device of the present invention is introduced into the rear door heat exchanger 128 and heat exchanged with the air discharged from the servers 122 to 126. Return to the cooling device to regenerate the cooling water. The rear door heat exchanger 128 of the computer processing unit 120 typically removes approximately 50% of the heat load on the server 120. Details of the configuration of the cooling device will be described later.

  Similarly, a front door heat exchanger 138 is disposed in the computer arithmetic unit 130. The front door heat exchanger 138 has substantially the same configuration as the rear door heat exchanger, and cooling water is introduced therein to exchange heat with the air discharged from the computer processing unit 130. The heated water is then returned to the cooling device of the present invention. Hereinafter, the rear door heat exchanger 128 and the front door heat exchanger 138 are generally referred to as a door heat exchanger (hereinafter referred to as DHEX (Door Heat EXchanger)). Details of the configuration of the cooling device and the DHEX will be described later.

  Still other implementations are employed in the computer processing unit 140. The computer arithmetic unit 140 is configured by an architecture called a sidecar in this specification. The computer arithmetic unit 140 encloses air in the housing 140 a of the computer arithmetic unit 140. The server rack 142 in the housing 140 a is configured as a heat exchanger in which water from the cooling device is circulated through a water channel formed in the rack 142. The air released from the server circulates in the housing 140a, whereby the exhaust heat from the computer arithmetic unit 140 is essentially cut off by controlling the heat balance. In the sidecar type architecture, the heat load of the server may be removed approximately 100% if the heat released from the computer processing unit 140 is ideally shielded in the housing 140a.

  Yet another implementation embodiment is provided in FIG. The computer arithmetic unit 150 includes a plurality of servers. Each server includes a cold plate 158a disposed in heat exchange relationship with MPU 158b. Cooling water from the cooling device is introduced into the cold plate 158a to cool the MPU 158b and returned to the cooling device to regenerate the cooling water. The plurality of computer arithmetic units 110 to 150 are supplied with water refrigerant through a series of pumps 118b to 118e. Each of the pumps 118b to 118e supplies water at less than atmospheric pressure via an independent pipe. Pumps 118b-118e are preferably selected from non-volumetric pumps such as turbo-type pumps, centrifugal pumps and / or screw pumps. Also, the pumps 118b to 118e function as flow control members, allowing backflow of water even when unexpected water leakage occurs and the pump positive pressure, that is, the pressure in the downstream direction of each pump increases to atmospheric pressure. . In other embodiments, the flow control member can be located in the data center control system 100, as clearly shown in FIG. Each of the flow control members is a pipe 192a connected to the upstream side of the heat exchange member via pressure sensitive valves 194a-e to deal with an emergency situation due to water leakage and to return water to the decompression side of the water return pipe. ~ 192e included. The pressure sensitive valves 194a to 194e have a pressure difference between the inlet side and the outlet side of 0.01 MPa to 0.101325 MPa in order to cope with the pressure increase in the heat exchange region in the computer arithmetic units 120 to 150. It is activated when the pressure exceeds a predetermined pressure threshold. This threshold value can be appropriately set according to a specific application, and the pressure sensitive valves 194a to 194e can be controlled by the controller 162.

  Regarding the computer arithmetic unit, the data center control system 100 further includes an AOEMF 160. The AOEMF 160 includes a controller 162, and detects at least one temperature selected from the ambient air temperature in the computer room, the server temperature, and the MPU temperature via the detection signal lines 180 and 190. The controller 162 feeds back the detection results to control the elements of the cooling device of the present invention to maintain air conditioning in the computer room 195 at a predetermined level. The AOEMF 160 may include a cooling architecture that is attached to any one of the computer processing units 120-150.

  Here, a schematic configuration of the cooling device 200 will be described with reference to FIG. The cooling device 200 includes an electronic device 210 and a water refrigerant compression chiller unit (hereinafter simply referred to as a WCU) 230 including a member surrounded by a broken-line rectangle. The electronic apparatus 210 includes at least an MPU and / or a CPU, and returns a computer calculation result to the outside to provide variable information or control an external device.

  The electronic device 210 can generally be selected from, for example, a personal computer, a server, a workstation, a mainframe computer, a peripheral interface computer, or any other combination thereof on the floor 220. Be placed. The floor 220 has a porous panel to take in the cooling air supplied by the individual A / C system, if it is already equipped, as shown in FIG. be able to. The cooling device 200 can preferably be configured in a data center of any building or underground tunnel in which a large number of computers are operated and managed to process various valuable information.

  The electronic device 210 is generally configured to include a set including a computer operation node 212 and a fan 214. Fan 214 creates an ambient temperature air flow 216 in the computer room that flows through computer computing node 210 as indicated by the arrows. The term “computer computing node” is used herein as a component of electronic device 210 that plays a major role in computer computing and surrounds the MPU and / or CPU, memory, and interface with them in a suitable package. refer. If the electronic device is a server, a plurality of computer compute nodes 212 are enclosed within it to provide the requested functionality of the server.

  The air flow that has passed through the computer computing node 212 is cooled to approximately ambient temperature by the heat exchange coil 234 according to an embodiment of the present invention and then released as the air flow 218. In other embodiments, the fan 214 may be located on the right side (hot side) of the electronic device 210 rather than on the left side (cold side). In this embodiment, the fan takes air from the computer compute node 212 toward the heat exchange coil 234 and passes it through the heat exchange coil.

  The heat exchange coil 234 extends through the electronic device 210 so that the air after being heated by heat exchange with the MPU or the like easily undergoes a heat exchange process with the heat exchange coil 234. . The region in the electronic device where the heat exchange coil 234 extends defines the heat exchange region of the electronic device. In the described embodiment, the heat exchange coil 234 provides the function of preventing hot air from being released directly into the computer room. Then, it is considered that the electronic device 210 does not give a significant additional heat load to the basic cooling device for the data center in which the electronic device 210 is arranged.

  The WCU 230 generates cooling water to be supplied to the electronic device 210. WCU 230 includes an evaporator 236 and a condenser 238 that store water as a refrigerant. The evaporator 236 evaporates water under conditions of reduced pressure compared to atmospheric pressure or ambient pressure in the computer room where the electronic device is located. The condenser 238 is disposed in communication with the evaporator 236 via a plurality of bypass pipes, and returns the water vapor transferred from the evaporator 236 to the liquid phase.

  The evaporator 236 and the condenser 238 communicate with each other by a connecting pipe 258 to maintain the water levels 254 and 256 in balance, stabilizing the head of water circulation through the cooling device.

  The remaining space in the evaporator 236 and the condenser 238 is also communicated by the bypass pipes 240, 244. Bypass tube 240 and bypass tube 244 include a compressor 242 and a bypass valve 246, respectively. As described above, the evaporator 236 operates as a refrigeration device that cools water by the latent heat of vaporization of the water therein. The remaining space in the evaporator 236 is exhausted by the compressor 242 for the purpose of cooling. The bypass valve 246 controls the pressure reduction level in the evaporator 236 by changing the opening / closing level of the valve. Similarly, the condenser 238 is exhausted by the vacuum pump 250 through a pipe communicating with the condenser 238, and the pressure in the remaining space in the condenser 238 is set to a steady state in order to supplement the pressurized water vapor transferred from the compressor 242. Yes.

  The compressor 242 can be selected from any type of compressor or pump. In the described embodiment, the compressor 242 can be a mechanical boost pump. Here, the mechanical booster pump has a phase difference of π / 2 radians and compresses the medium by means of a symmetrical and isomorphic rotor close to each other. Also, the bypass valve 246 can be any valve as long as the valve provides communication between the evaporator 236 and the capacitor 238 within a controlled range.

  The pressure in the evaporator 236 is therefore reduced. Within the evaporator 236, the latent heat of water is removed from the liquid phase water by evaporation of the water. Therefore, the WCU 230 can generate cooling water having an appropriate temperature range based on the evaporation rate of water and the latent heat of evaporation. The temperature of the cooling water can range from 0 ° C. to the ambient temperature of the computer room, and preferably the temperature can range from 0 ° C. to 25 ° C. This temperature can more preferably be set offset from the ambient temperature of the computer room to the cold side, i.e. predetermined depending on the specific settings of the data center backbone A / C system. A predetermined offset value can be set.

  Such a predetermined offset temperature can be set depending on specific conditions, and typically for computer computing units, the predetermined offset value ranges from about 10 ° C. to about 20 ° C. can do. Since the heat exchange efficiency is increased when the temperature difference is large, a lower temperature is suitable for the cooling efficiency. However, if the water temperature becomes too low beyond a given temperature difference, condensation of water from the surrounding air can occur.

  Similarly, in this embodiment, since the cooling device does not include the heating element for water, a temperature higher than the ambient temperature cannot be reached. And this invention can operate | move easily from the temperature which does not cause condensation of water to ambient temperature. The exhaust rate of the evaporator 236 by the compressor 242, and the cooperatively controlled bypass valve 246, takes into account the temperature of the cooling water to avoid water condensation from the atmosphere and is typically 0.101325 MPa. The pressure is maintained in consideration of the pressure difference that raises the water level to the top of the top of the pipe 232 while maintaining the pressure lower than the atmospheric pressure. Details of the water pressure condition will be described later.

  In another embodiment of the cooling device of FIG. 2, a plurality of pressure sensors can be placed in the pipe 232, thereby monitoring the water pressure in the pipe. In this embodiment, a control unit (not shown) for the cooling device 200 monitors the in-line pressure and controls the operation of the compressor 242 and the open / close level of the valve 246 to provide in-line for a range of operating periods. The pressure is maintained to be less than the atmosphere. Also, a control unit such as AOEMF 160 checks for water leaks from in-line pressure fluctuations and alerts the system administrator.

  Water 254 in the condenser 238 is supplied to the cooling tower 260 for temperature adjustment. The water refrigerant whose temperature has been adjusted by the cooling tower 260 is circulated through the pipe 262, dispersed in the condenser 238, and returned.

  The cooling tower 260 can be configured separately from other cooling towers for the campus backbone A / C line. Alternatively, when the data center building adopts a cooling water circulation type A / C system, the COP of the cooling device is higher than that of the best embodiment, but the cooling tower 260 is configured as a campus backbone A / C line. It may be shared with the cooling tower provided for the purpose. In still other embodiments of the present invention, the cooling tower 260 may employ an open water cooling architecture. In an open water cooling architecture, the water stored in the cooling tower 260 can be well water, river water and / or groundwater. This water is cooled or heated by geothermal heat if some heating is required depending on the natural climate at the data center location. In an alternative embodiment, the cooling tower 260 has a lower total COP for the best embodiment, but may be replaced by other suitable cooling equipment such as a turbo refrigeration device or a conventional inter-expansion refrigeration device. .

  The WCU 230 can create water cooled to a suitable temperature range by the latent heat of vaporization of water. The cooling water is then returned to the electronic device 210 via the pipe 232 for heat exchange again with the air flow passing through the computer computing node in the electronic device 210.

  Thereafter, the air stream 218 after heat exchange with the cooling water is released to the ambient environment, which allows this embodiment to reduce the penalties for the ambient temperature due to the heat generated by the computer operations. . This reduction in temperature reduces overall heat removal by approximately 50%. This reduction contributes to a reduction in the cooling capacity of the premises period A / C, thereby reducing the maintenance cost and / or the operation cost assuming a predetermined computer computing performance.

  Furthermore, in this embodiment, the pressure of the water circulating through the electronic device 210 is maintained below 0.101325 MPa as described above. The water pressure can be reduced to about 5 kPa (approximately 1/20 of atmospheric pressure). The range of reduced pressure can range from about 5 kPa to less than atmospheric pressure. Therefore, even if water leakage occurs, the leaked water does not immediately go outside the heat exchange coil 234, reducing the problem of water leakage. For this purpose, the present invention can include a flow control member for water. In one embodiment, such a flow control member can be a circulation pump 248. In this embodiment, the circulation pump 248 can be selected from a type that does not separate water within the pressure chamber or compartment by means of wings or gears to create a one-way flow for pumping, The so-called non-volumetric pump can be selected. Such a non-displacement pump can be selected from, for example, a turbine pump, a centrifugal pump and / or a screw pump configured in a can type that is suitably adapted to decompression conditions. In addition to the embodiments described above, another embodiment of the flow control member is to employ a water discharge pipe disposed in the upstream pipe of the heat exchange coil 234. The water discharge pipe communicates with the evaporator 236 via a pressure sensitive valve. The pressure sensitive valve is activated below atmospheric pressure, which prevents water flowing through the heat exchange coil 234 from leaking into the electronic device. The non-volumetric circulation pump and / or the water discharge pipe are activated by a pressure sensitive valve.

  Further, the circulation pump 248 is illustrated in one stage in FIG. 2 for illustrative purposes, however, the circulation pump 248 is replaced by a series of non-volumetric pumps to perform multi-stage pumping with each pump having a low head. Can be achieved. Since a low head pump is selected in a multi-stage pumping configuration, the cooling water pressure can be kept low relative to atmospheric pressure compared to single stage pumping.

  Circulation pump 252 and circulation pump 266 only serve to transfer water in the directions indicated by arrows C and D, respectively, and can be selected from any conventional type in consideration of performance.

  FIG. 3 shows a cooling device according to another embodiment. 3 has almost the same configuration as the cooling device shown in FIG. However, the cooling device 300 includes a heat exchange tank 360 in which water from the cooling tower 370 is circulated.

  In the second embodiment, the water is circulated not to the cooling tower 370 but to the heat exchange tank 360 via the pipe 362 in the direction of arrow C. The water is cooled in the heat exchange tank 360 and returned to the condenser 338 via a spray member disposed in the pipe 362.

  Water is supplied from the evaporator 336 through piping 332 to the electronic device 310 by a circulation pump 348 configured with an architecture similar to the embodiment shown in FIG. The cooling water then removes heat from the air stream 316 by heat exchange within the computer compute node 312. The cooled air stream 318 is discharged to the computer room and the heated water is returned to the evaporator 336. Thereafter, the regeneration cycle of the cooling water is repeated as shown in FIG.

  In the embodiment of FIG. 3, the cooling tower 370 can be shared with the campus backbone A / C line rather than providing an additional cooling tower for the cooling device. In a shared embodiment, the cooling device of the present invention is added to the electronic device by adding an additional piping 380 that transfers water in the direction of arrow D and connected to the cooling tower 370 for the campus A / C line. Is done. This is considered to have a minimal impact on the campus backbone A / C line. Therefore, the cooling device shown in FIG. 3 can further give a low introduction cost of the cooling device to the data center when the data center uses a water circulation type backbone A / C system. Also, in the embodiment of FIG. 3, the cooling tower 370 has a lower total COP for the best embodiment, but is replaced by other suitable cooling equipment such as a turbofan refrigeration device or an existing refrigeration device. You can also. In this embodiment, the cooling facility adjusts the water temperature of the heat exchange tank 360.

  Referring now to FIG. 4, details of an embodiment of a cooling mechanism 400 according to the present invention are shown. In the described embodiment, the so-called “enterprise server” electronic device 410 includes a plurality of computer computing nodes therein, each of which generates heat through its operation. The electronic device 410 may be a mainframe computer and / or any combination of servers, mainframe computers, and interface devices in other embodiments.

  Air 460 and 470 in the computer room is taken into the electronic device 410 from the low temperature side by the action of a fan (not shown) and passes between the computer computing nodes. The air that has flowed into the electronic device 410 is heated as a flow of air that moves in the direction illustrated by arrow 480. In the arrow 480, the base point side 480a is the low temperature side, and the tip side 480b is the high temperature side. In FIG. 4, the outline of the temperature distribution is shown by the hatching density of the arrows. As the shade becomes brighter, the temperature decreases. Typically, the tip side temperature is about 60 ° C. or higher due to heat exchange with the MPU and / or CPU.

  In the embodiment illustrated in FIG. 4, the heat exchange coil 234 or the heat exchange coil 334 is configured as part of a door heat exchanger 420 mounted at the rear or front of the electronic device 410. The electronic device 410 is disposed on a floor including a floor panel 440 having no porosity and a floor panel 450 having a porosity.

  The floor panel 440 and the porous floor panel 450 are supported sufficiently away from the base floor level 490, and provide a space 495 that is used as a utility space for cooling piping and the like. The porous floor panel 450 allows cooling air to flow from the space 495 into the computer room and electronic device 410. The floor is also provided with an opening 430 through which piping from the cooling device of the present invention is passed.

  In the configuration to be described, water is taken in by a pipe passed through the opening 430, and the water pipe is connected to a heat exchange coil that is an essential member of the DHEX 420. Water is taken and circulated in DHEX 420 through a heat exchange coil. Exactly the heated air passing through DHEX 420 is subjected to heat exchange with water flowing in the DHEX 420 heat exchange coil. The heated air is cooled to an appropriate temperature and then released into the ambient atmosphere of the computer room as indicated by arrow 480c.

  Here, another cooling mechanism 500 of the present invention will be described with reference to FIG. In the embodiment illustrated in FIG. 5, most of the configuration for air and water flow is the same as the embodiment shown in FIG. The embodiment of FIG. 5 includes a pump unit 535 for pressurizing in response to pressure loss during circulation in piping 530. The pump unit 535 ensures smooth water circulation against pressure loss and water head in the pipe while maintaining the water pressure at atmospheric pressure.

  FIG. 6 shows a detailed perspective view of the door heat exchanger (DHEX) panel 600 outlined in FIG. 6A shows a front perspective view, and FIG. 6B shows a rear perspective view. Here, the term “front” refers to the side facing the outside of the casing of the electronic device, and the term “rear” refers to the side facing the inside of the casing of the electronic device. The DHEX 600 of FIG. 6 includes a heat exchange coil 610, a support frame 620, and a support rim 630. The heat exchange coil 610 corresponds to 234 and 334 shown in FIGS. The heat exchange coil 610 has a serpentine structure extending in the horizontal and vertical directions of the DHEX panel 600, and ensures uniform and effective heat exchange over the effective area of the DHEX panel 600.

  The frame 620 reliably supports the heat exchange coil 610 and the support rim 630 extending from the support frame 620. The support rim 630 is attached to and detached from the front and / or rear of the computer arithmetic unit surrounding the members of the electronic device through a plurality of openings 640 and 650 by fixing means such as screws, bolts and nuts, and quick connectors. Fixed as possible. The heat exchange coil 610 communicates with an internal pipe 660 disposed on the lateral edge of the cooling region. Water flows from the heat exchange coil 610 through the internal pipe 660 and also flows to the heat exchange coil 610.

  Referring now to FIG. 7, an enlarged structure 700 of the DHEX panel 600 is shown. 7A shows a plan view of the DHEX panel 600, and FIG. 7B shows a side view from the direction of the arrow E. FIG. As shown in FIG. 7A, the heat exchange coil 610 densely covers the cooling region 680, thereby avoiding uneven heat exchange efficiency and improving the heat exchange performance. Similarly, as shown in FIG. 7 (b), the heat exchange coil 610 is used to increase the effective heat exchange area with the air flow and to improve the heat exchange performance of the DHEX panel 600. Inclined along the direction of flow.

  In order to allow the cooling water to circulate, a pipe 670 is connected to the WCU from the end of the internal pipe 660. The internal pipe 660 and the pipe 670 can be directly fixed by welding, soldering, or brazing. Alternatively, the internal pipe 660 and the pipe 670 are joined together by a suitable detachable connector in consideration of maintenance of the electronic device.

  FIG. 8 illustrates an exemplary embodiment of a water refrigerant shielded electronic device 800 with a DHEX panel 600. Here, in electronic device 800 with a water refrigerant shield, cooling water created by water refrigerant compression is supplied by the main WCU 230 or WCU 330 shown in FIGS. 2 and 3. In the embodiment shown in FIG. 8, the DHEX panel 600 is formed as a rear door heat exchanger. The shielded electronic device 800 includes a casing 810, a so-called attachment frame. The casing 810 surrounds a rack, a computer calculation node, various pipes, and the like. The same structure as that shown in FIG. 8 is applied to the front door type heat exchanger except that the position of the heat exchange panel is the front or rear and the direction of the air flow is different. can do. In the casing 810, a set of side walls 835 and 845 of a rack, a plurality of computer operation nodes (node # 1 to node #N), and a DHEX panel 850 are incorporated. Is provided. The rack safely supports the computer operation nodes (nodes # 1 to #N) in the casing 810.

  In the illustrated embodiment, the DHEX panel 850 is hinged at one rack end and attached to the rear end of the rack, thereby being individually incorporated into the rear casing. In an alternative embodiment, the DHEX panel 850 can be incorporated into the casing 810 by being hinged at one end of the casing 810, thereby integrating the handling of the DHEX panel 850 into the movement of the casing 810. In the shielded electronic device 800, cooling water is supplied from the side wall of the rack to the computer operation node 830 by the fitted connector. The sidewall provides a manifold for storing water while acting as a water flow path. Here, with reference to FIG. 8, the cooling mechanism of a water refrigerant shield is demonstrated in detail.

  As a first piping system, water from the A / C supply pipe 870 is led to WCU 1 in the WCU set 860. Here, the WCU set 860 includes WCU1 and WCU2 for regenerating cooling water according to the present invention. Cooling water from WCU 1 is introduced into the side wall 845. The side walls 835 and 845 include a plurality of splice connectors that face each other at the same vertical level. The computer computing node 830 is connected to each connector located at the same vertical level via a connection pipe 840 by a connector that does not leak water under nominal conditions.

  In the described embodiment, the side walls 835, 845 hold N computer computing nodes and cooling water is introduced from both side walls 835, 845 to the computer computing nodes to form a ladder-like flow path. Yes. The water flows through the computer computing node 830 while exchanging heat with members inside the computer computing node 830, for example. The water then flows out of the computer computing node 830 and is introduced into the side wall 845. Thereafter, the water flows in the reverse direction to the computer computing node (node # N-1) and is again introduced into the side wall 835. A similar flow path is provided up to the discharge position where pipe 815 to WCU1 connects. Water reaches the discharge point corresponding to the position where the water is discharged from the pipe 815 to the WCU 1.

  The second piping system 2 is provided by WCU2. As with the piping system 1, new cooling water flows. However, because the piping system 2 is provided for heat exchange at the DHEX panel 850, the cooling water from the WCU 2 is introduced at a low position on the side wall 835. The water discharged from the side wall 835 is pumped and led into the DHEX panel 850 from the connector 835a to the connector 850a attached to the lower end of the DHEX panel 850 for heat exchange in the DHEX panel 850. .

  The water introduced into the DHEX panel 850 flows through the heat exchange coil of the DHEX panel 850 and exchanges heat with the air flow that has passed through the computer computing node 830 and the like. Then, the heated water is discharged from the connector 850 b and propagated from the connector 845 a at the lower end of the side wall to the side wall 845 through the pipe 825. And the water which played the role is finally discharged | emitted from the discharge port formed in the side wall 845, is returned to WCU1, and the new water cooled from the returned water is reproduced | regenerated.

  The water flow described above is one possible embodiment that takes into account the pressure balance in the piping system 1 and the piping system 2. However, those skilled in the art will appreciate that the flow path design can be adjusted to take into account the particular configuration in the actual case.

  FIG. 9 shows a schematic block diagram 900 of the shielded electronic device 800 shown in FIG. As shown in FIG. 9, shielded electronic device 800 typically includes members within rectangle 910, such members including casing 920, computer computing node 940, and DHEX panel 960. The DHEX panel 960 is safely held on the front and / or back of the shielded electronic device. The DHEX panel 960 can be attached to the rack or casing 920 as described above. In the described embodiment, the DHEX panel 960 is attached to the rear side of the electronic device. The casing 920 extends from the front panel 930 having the air intake port 935 to the DHEX panel 960 and surrounds a member including the computer operation node 940 and the like. The WCU 970 communicates with the DHEX panel 960 via the pipes 980 and 990, thereby achieving heat exchange between the air flow and water, and further communicates with the computer computing node 940.

  In the embodiment shown in FIG. 9, the piping systems 980, 990 can be designed along the embodiment shown in FIG. However, the WCU 970 independently supplies water to the DHEX panel 960 and the computer computing node 940, such that the piping system 980 supplies water to the DHEX panel 960 and the piping system 990 supplies water to the computer computing node 940. can do.

  As indicated by a broken line, the piping system 980 extends from the WCU 970 to the inside of the computer computing node 940, further extends to the WCU 970, and returns water from the computer computing node 940 to the WCU 970. The piping extended to the inside of the computer computing node 940 provides a low temperature compartment. Thereby, the cooling air taken into the computer computing node 940 by the fan 995 is cooled by the low temperature compartment when the cooling air passes through it. The low-temperature compartment can be formed as a pipe flow path of a cooling pipe included in the pipe system. Alternatively, the cold compartment can be formed as a cold plate on which an MPU or the like is placed with a heat exchange relationship.

  Referring now to FIG. 10, a plan view of the computer computing node 940 is shown. The computer computing node 940 encloses several computer computing elements such as a CPU 1010, a PCI bus unit 1020, an I / O unit 1030, and a memory (DDR2 standard SRAM). Inside the computer computing node 940, the cooling pipe extends in the thickness direction in the direction of the computer computing node 940, that is, along the vertical direction of the paper surface, and provides a cold compartment 1050. In the described embodiment, the computer computing node 940 includes a plurality of CPUs 1010 and cooling fins attached to each CPU 1010 to improve air cooling efficiency. The CPU 1010 operates in a so-called multi-core or CPU grid architecture cooperative mode. In the described embodiment, the CPU 1010 is implemented with 8 CPU nodes, but there is no intrinsic limit to the number of CPUs or MPUs included in the computer computing node 940 according to the present invention.

  Piping 1070 communicates with the cooling tubes forming the cold compartment 1050, which introduces water from one rack sidewall and, after the heat exchange scheme described above, water from the computer computing core to the other rack sidewall. Can be returned. The computer computing node 940 further includes a fan 1060 for allowing cooling air to flow inside the computer computing node 940 while air cooling the elements therein.

  FIG. 11 shows an exemplary implementation of an embodiment of a shielded electronic device 1100 viewed from the rear side. The shielded electronic device 1100 to be described is implemented as an enterprise server 1100 for processing valuable in-house information, database information, or Internet information. The casing 1110 is disposed at a specific position on the floor 1150 and securely secures the DHEX panel 1120 at the rear end of the enterprise server 1100.

  The floor 1150 has openings 1160 through which the pipes 1130 and 1140 and other utility pipes pass from the space provided under the floor 1150. For example, the piping 1130 supplies cooling water from the WCU, and the piping 1140 returns water that has played a role in regenerating the cooling water to the WCU. Further, in order to easily use the cooling device already configured, a porous floor can be employed together with the cooling device of the present invention. Alternatively, only the cooling device of the present invention can be introduced if the environment of the computer room and the cooling performance of the data center allow.

ここで、冷却性能（COOLING CAPACITY）は、空間内に取り囲まれる熱源により決定され、冷却消費電力（COOLING CONSUMPTION POWER）は、熱源による熱排出を処理するための電力である。したがって、高い値のＣＯＰは、高い冷却効率を意味する。 Here, with reference to FIG. 12, the cooling performance of the cooling device when water is used as the refrigerant will be described. FIG. 12 shows the result of a cooling performance curve 1200 in which the value of COP (Coefficient Of Performance) is expressed with respect to the output water temperature for the input water temperature. The ordinate represents the COP value, and the abscissa represents the output water temperature. The experimental curve represents the input water temperature. The COP value was calculated using the known formula shown below:

Here, the cooling performance (COOLING CAPACITY) is determined by the heat source surrounded by the space, and the cooling power consumption (COOLING CONSUMPTION POWER) is electric power for processing heat discharge by the heat source. Therefore, a high value of COP means high cooling efficiency.

  As shown in FIG. 13, in the cooling device of the present invention, the COP value decreases as the output water temperature decreases, and the COP value decreases as the input water temperature decreases. These observations can be explained to some extent as indicating that if the input water temperature is the same, the hotter water requires more power to cool the water to the set temperature. On the other hand, when the input water temperature is lower than 18 ° C. which is the target output temperature, the water has to warm the input water, so that the power consumption is reduced and contributes to the increase of the COP value.

  As explained above, water temperatures below a given value are undesirable because water condenses around the piping and coils. In this regard, the temperature of the water, in the best embodiment, can range from about 10 ° C. to 20 ° C., taking into account the normal temperature and humidity conditions of the computer room. Here, for example, assume that the water is required to be 18 ° C. In this case, as shown in FIG. 13, the COP value of the present embodiment is in the range of about 4.5 to 15 or more.

  Similarly, in the comparative example using a conventional HFC chiller unit, the COP value for generating cooling water at 18 ° C. is 3.5. Although the COP values shown in FIG. 12 fluctuate in relation to the input and output water temperatures, the difference is considerable because the cooling devices are sophisticated for electronic device cooling and / or data center cooling. It is clear. As mentioned above, in order to avoid condensation of water, the water temperature is preferably several degrees Centigrade below the input water temperature or at most about 20 degrees Centigrade. In this temperature range, the cooling device of the present invention can provide excellent cooling efficiency and sufficient cooling performance in the electronic device.

  FIG. 13 shows another graph 1300 as an example for reducing temperature from an electronic device. In the graph 1300, the vertical axis represents the temperature (° C.) exhausted from the rear end of the electronic device, and the horizontal axis represents the time (minutes) from the start of the operation of the electronic device.

  As shown in FIG. 13, the output air temperature gradually increases from about 20 ° C. to about 60 ° C. for up to about 10 minutes. This temperature was quite high for an ambient temperature of about 20 ° C. Then, in the operating time at 10 minutes, water circulation to the DHEX panel was started. As shown in FIG. 13, the temperature of the discharged air stream rapidly decreased from about 60 ° C. to about 30 ° C. This means that the heat load of the computer arithmetic unit can be reduced to about half that of the conventional computer arithmetic unit.

  Furthermore, the present inventors conducted a simple test in order to improve the carbon dioxide emission using this cooling device. Then, the DHEX panel can remove up to 15 kVA (about 50000 BTU: British Thermal Unit) from the back of the 28 kVA electronic device. Thus, the implementation of a cooling device having a DHEX panel can reduce thermal issues and / or data center maintenance costs in the data center due to power consumption and carbon dioxide emissions.

  Further, the present invention provides maintenance / maintenance for large-scale computer computing facilities such as enterprises, government agencies and / or data centers of science and technology institutions, while maintaining computer computing performance and ensuring a robust structure of electronic devices. By reducing costs, total power consumption can be reduced. In addition to the outstanding advantages described above, maintenance costs for using anticorrosive additives and for managing water quality can be avoided, thereby reducing long-term maintenance costs.

  As described above, the present invention has been described with specific embodiments. However, the present invention is not limited to the specific embodiments described above. Those of ordinary skill in the art will recognize that there are numerous other embodiments, additions, deletions, and alternative embodiments based on the teachings of this description. However, the scope of the present invention is limited only by the appended claims.

The figure which shows the computer room air-conditioned by the data center control system containing the apparatus of this invention. The figure which shows the general structure of the cooling device 200. The figure which shows other embodiment of a cooling device. The figure which shows detailed embodiment of the cooling mechanism 400 by this invention. The figure which shows the other cooling mechanism 500 of this invention. The perspective view which shows the outline of the door-type heat exchanger (DHEX) panel 600. FIG. The figure which shows the enlarged structure of the DHEX panel 600. FIG. The figure which shows embodiment of the electronic apparatus 800 with a refrigerant | coolant shield. 9 is a schematic block diagram of the internal structure of the shielded electronic device shown in FIG. The top view which shows the outline of the computer operation node 940. FIG. The figure which shows embodiment of the typical mounting of the electronic device with a shield seen from the back side. The figure which shows the cooling performance of the cooling device at the time of using water as a refrigerant | coolant. The figure which shows the other graph 1300 as an example which reduces temperature from an electronic device. FIG. 4 shows an exemplary cooling device 1400 for an electronic device. The figure which shows the outline of the air flow 1500 of the cooling device 1400 of FIG.

Claims (20)

A cooling device for an electronic device including a semiconductor element, the cooling device comprising:
An evaporator that stores the refrigerant and evaporates the refrigerant under reduced pressure lower than the ambient pressure to generate a cooled refrigerant;
A condenser that communicates with the evaporator through a bypass pipe and regenerates the refrigerant from the refrigerant vapor;
The cooled refrigerant is supplied to a heat exchange region of the electronic device, heat exchange is performed with an air flow passing through the semiconductor element on a high temperature side of the electronic device, and the refrigerant after the heat exchange is decompressed. Return to the condenser via an underlying evaporator, and a flow control member disposed upstream of the heat exchange region,
The cooling device, wherein the pressure of the refrigerant is maintained below the ambient pressure in the heat exchange region via the flow control member. Before Kiba bypass pipe includes a compressor for returning the vapor of the refrigerant in the condenser, the cooling device further includes a second bypass pipe including a valve for controlling the vacuum in claim 1 The cooling device as described.   The cooling device according to claim 2, wherein a vacuum pump is connected to the capacitor to adjust a pressure inside the capacitor.   The cooling device according to claim 3, wherein the refrigerant in the condenser is circulated to a cooling facility or a heat exchange tank held in a cooling facility for adjusting the temperature of the refrigerant. The cooling device according to claim 1, wherein the refrigerant is water, and the semiconductor element is a microprocessor unit and a central processing unit, or any one of them.   The cooling device according to claim 1, wherein the electronic device is disposed in a computer room of a data center that manages computer operations by a computer.   The electronic device includes a computer arithmetic unit including a semiconductor element for performing computer information processing, a memory, an input / output unit and a bus, and a low-temperature compartment disposed in the computer arithmetic unit, and the heat exchange region includes 2. The cooling device according to claim 1, wherein the cooling device is a door-type heat exchange panel that is detachably attached to an electronic device and the piping for the refrigerant extends into the low-temperature compartment.   The cooling device according to claim 6, wherein the refrigerant is water, and the temperature of the water is lower than the ambient temperature of the cooling device over the cooling device.   The cooling device has at least one temperature selected from a temperature of ambient air in the computer room, a temperature of a computer calculation node, a temperature of the electronic device, and a temperature of the semiconductor element via a detection signal line. Including an environmental monitoring facility in a computer room including a controller for detecting, wherein the controller controls elements of the cooling device to maintain the temperature of the refrigerant from 10 ° C. to the temperature in the computer room However, the cooling device according to claim 6, wherein the ambient temperature in the computer room is set to a predetermined level. An electronic device with a refrigerant shield, wherein the electronic device with a refrigerant shield is
A computer operation node including a member for computer information processing, wherein the member includes a semiconductor element, a memory, an input / output unit, and a bus, and
A rack for holding the computer computing node, the rack including a set of side walls, each of the side walls allowing a refrigerant to pass through the side walls;
A door-type heat exchange panel that is detachably attached to the electronic device with the refrigerant shield, the door-type heat exchange panel receiving the refrigerant, and the pressure of the refrigerant via a flow control member for the refrigerant Including a serpentine heat exchange coil that is maintained below ambient pressure and returns the refrigerant after heat exchange to an evaporator for evaporating the refrigerant under reduced pressure below ambient pressure to produce a cooled refrigerant. An electronic device with a refrigerant shield, including a heat exchange panel.   The computer computing node includes a low temperature compartment disposed within the computer computing node and cooled by the refrigerant, and a fan, the fan computing the computer computing node to cool the member within the computer computing node. 11. An electronic device with a refrigerant shield according to claim 10, which causes a flow of air into a node toward the door heat exchange panel.   The refrigerant according to claim 11, wherein the air flow after passing through the semiconductor element is cooled by passing through the door-type heat exchange panel and then discharged to the outside of the electronic device with the refrigerant shield. Shielded electronic device.   The electronic device with a refrigerant shield according to claim 10, wherein the refrigerant is water, and the semiconductor element is a microprocessor unit and a central processing unit, or any one of them.   The electronic device with a refrigerant shield according to claim 10, wherein the electronic device with a refrigerant shield is disposed in a computer room of a data center that manages computer computations by a computer. A method for cooling an electronic device including a semiconductor element, the method comprising:
Generating a cooled refrigerant having a reduced pressure below ambient pressure;
Circulating the cooled refrigerant through a pipe passing through a heat exchange region of the electronic device on a high temperature side of the electronic device;
Performing heat exchange in the heat exchange region with the flow of air that has passed through the semiconductor element;
The refrigerant for regenerating the refrigerant from the vapor of the refrigerant is evaporated under reduced pressure lower than the ambient pressure, and the refrigerant after the heat exchange is returned via an evaporator that generates a cooled refrigerant. Including steps,
The method wherein the pressure of the refrigerant is maintained below the ambient pressure in the heat exchange region via a flow control member for the refrigerant.   16. The method of claim 15, further comprising controlling the reduced pressure by a compressor connected to a first bypass pipe for returning the steam and a valve connected to a second bypass pipe. Method.   The method of claim 16, further comprising adjusting the pressure inside the capacitor by a vacuum pump connected to the capacitor.   The method of claim 17, further comprising circulating the refrigerant in the condenser through a heat exchange tank or a cooling facility held by a cooling facility for harmonizing the temperature of the refrigerant. Method. The refrigerant is water, the semiconductor element is a microprocessor unit and / or a central processing unit, and the electronic device is in a computer room of a data center that manages computer operations by a computer. Wherein the method further comprises:
Detecting at least one temperature selected from an ambient air temperature in the computer room, a temperature of a computer computing node, a temperature of the electronic device, and a temperature of the semiconductor element via a detection signal line;
The method of claim 15, further comprising: controlling the ambient temperature in the computer room to a predetermined level while maintaining the temperature of the refrigerant from 10 ° C. to the temperature in the computer room. An electronic device with a refrigerant shield, wherein the electronic device with a refrigerant shield is
A computer operation node including a member for computer information processing, wherein the member includes a semiconductor element, a memory, an input / output unit, and a bus, and
A rack for holding the computer computing node, the rack including a set of side walls, each of the side walls allowing a refrigerant to pass through the side walls;
A door-type heat exchange panel that is detachably attached to the electronic device with the refrigerant shield, the door-type heat exchange panel receiving the refrigerant, and the pressure of the refrigerant via a flow control member for the refrigerant Including a serpentine heat exchange coil that is maintained below ambient pressure and returns the refrigerant after heat exchange to an evaporator for evaporating the refrigerant under reduced pressure below ambient pressure to produce a cooled refrigerant. Including heat exchange panels and
The computer computing node includes a low temperature compartment disposed within the computer computing node and cooled by the refrigerant, and a fan, the fan computing the computer computing node to cool the member within the computer computing node. Causing a flow of air into the node and to the door heat exchange panel, wherein the refrigerant is water, and the semiconductor element is a microprocessor unit and a central processing unit, or one of these, Electronic device with refrigerant shield.

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