JP5499330B2 - Solar cell bus bar - Google Patents

Description

  The present invention relates to a rectangular conductor for a solar cell (bus bar) that has higher conductivity than conventional OFC materials and TPC materials and has a higher flex life than conventional OFC materials.

  Crystalline or thin-film solar cell modules use a rectangular solar cell conductor (bus bar) for taking out current (see Patent Document 1 and Patent Document 2).

  For example, in a solar cell in which a thin film is grown on a glass substrate (so-called thin film solar cell), an insulator is placed on the thin film solar cell, and copper foil is used as a bus bar in a bus region that collects positive and negative power on the insulator. Is provided. Some bus bars have an insulator in advance, but the bus bars are placed vertically corresponding to the positions where the lead-out portions to the terminal box as connecting means for drawing electric power to the outside are arranged between these bus bars. It arrange | positions by bending, and a back surface protective material is piled up through the film of a filler on it. A sheet-like or glass plate or the like is used as the back surface protective material, but it has an opening, and the bus bar is configured to be exposed to the outside through this opening.

  The material of the flat conductor (bus bar) for solar cells is required to have contradictory properties such as good conductivity (high conductivity) and good bending properties. To date, development of copper materials that maintain high conductivity and bending resistance has been underway (see Patent Document 3 and Patent Document 4).

  For example, the invention according to Patent Document 3 is an invention relating to a conductor for a bending-resistant cable having good tensile strength, elongation, and electrical conductivity. In particular, oxygen-free copper having a purity of 99.99 wt% or more has a purity of 99.99 wt% or more. Bending Resistant Cable Conductor Formed with a Copper Alloy Containing 0.05 to 0.70 Mass% P and Purity 99.9 wt% or More in a Concentration Range of 0.0001 to 0.003 Mass% Have been described.

  In addition, the invention according to Patent Document 4 describes a bending-resistant copper alloy wire in which indium is 0.1 to 1.0 wt%, boron is 0.01 to 0.1 wt%, and the balance is copper.

Japanese Patent No. 3121811 JP 2003-86820 A JP 2002-363668 A Japanese Patent Laid-Open No. 9-256084

However, the invention according to Patent Document 3 is an invention related to a hard copper wire to the last, a specific evaluation regarding bending resistance has not been made, and a study on a soft copper wire with higher bending resistance has not been made. Absent. Moreover, since there is much quantity of an additional element, electroconductivity will fall. The soft copper wire has not yet been fully studied.

  Moreover, although the invention which concerns on patent document 4 is an invention regarding a soft copper wire, since the addition amount of an additional element is large similarly to the invention which concerns on patent document 3, electroconductivity will fall.

  On the other hand, it is conceivable to ensure high conductivity by selecting a highly conductive copper material such as oxygen-free copper (OFC) as a raw material copper material.

However, when this oxygen-free copper (OFC) is used as a raw material and it is used without adding other elements in order to maintain conductivity, oxygen-free copper can be obtained by increasing the degree of processing of the copper rough drawing wire. The idea of improving the bending resistance by making the crystal structure inside the wire fine may be effective, but in this case, it is suitable for use as a hard wire by work hardening by wire drawing, There is a problem that it cannot be applied to soft wires.

  In general, tough pitch copper (TPC) and the above-mentioned oxygen-free copper (OFC) are used as bus bar materials. However, in recent years, there has been an increase in environmental conservation, and from the viewpoint of effective use of solar energy. Therefore, further improvement in power generation efficiency of solar cells is desired, and development of further highly conductive materials to replace these tough copper or oxygen-free copper is urgently required.

In addition, the bus bar sometimes has to be laid with a small bending radius in a narrow portion of the terminal box, and there is a problem that an electrical adverse effect is caused due to the stress or damage of the bent portion or the bent portion.

  Further, as a rectangular solar cell conductor (bus bar) of a crystalline system, for example, it is common to use an integrated bus bar by soldering two solder-plated rectangular copper wires into a substantially L shape. However, since an intermetallic compound grows in the vicinity of the interface of the connection part, it causes an electrical failure due to a failure of the joint part.

  Therefore, the present invention provides a rectangular conductor for a solar cell (bus bar) that has higher conductivity than conventional OFC materials and TPC materials and has a higher bending life than conventional OFC materials. Objective.

In order to achieve the above object, the present invention provides a solar battery bus bar in which a plurality of solar cells are arranged in a straight line, and the cells are electrically connected to each other. 4 mass ppm to 55 mass ppm Ti and 2 mass ppm to 12 mass ppm in the and a sulfur and 2massppm the following 30 mass ppm exceeds oxygen, the remainder I is soft dilute copper alloy material der made of copper, an average grain size in the surface layer from the surface of the material to 50μm depth 20μm or less There is provided a bus bar for a solar cell.

Moreover, in the solar cell bus bar that connects the bus region that collects positive and negative power formed on the thin film solar cell , Ti of 4 massppm to 55 mass ppm, sulfur of 2 massppm to 12 mass ppm, oxygen of more than 2 massppm and oxygen of 30 mass ppm or less wherein the remainder it is soft dilute copper alloy material der made of copper, to provide a bus bar for a solar cell, wherein the average crystal grain size in the surface layer from the surface of the material to 50μm depth is 20μm or less .

  According to the present invention, it is possible to obtain a rectangular solar cell conductor (bus bar) having high conductivity as compared with conventional OFC materials and TPC materials and having a higher bending life than conventional OFC materials. This is an excellent effect.

It is a figure which shows the state which provided the bus bar for solar cells of this invention on the cell. It is a figure which shows the SEM image of a TiS particle | grain. It is a figure which shows the analysis result of FIG. Is a view showing an SEM image of the TiO ₂ particles. It is a figure which shows the analysis result of FIG. It is a figure which shows the SEM image of Ti-O-S particle | grains. It is a figure which shows the analysis result of FIG. It is a figure which shows the outline of a bending fatigue test. 7 is a graph showing the bending life of Comparative Material 13 and Example Material 7. 7 is a graph showing the bending life of the comparative material 14 and the working material 8 measured. 3 is a photograph of a cross-sectional structure in the width direction of a comparative material 14. 4 is a photograph of a cross-sectional structure in the width direction of the working material 8. It is a figure for demonstrating the measuring method of the average crystal grain size in the surface layer of a sample. It is a figure which shows the state which provided the bus-bar which bent 90 degree | times in the perpendicular direction on the cell. It is a figure which shows the bus-bar which gave 180 degree | times bending to the perpendicular direction. It is a figure which shows the bus-bar which gave 90 degrees bending in the horizontal direction.

  Hereinafter, a preferred embodiment of the present invention will be described in detail.

The solar cell bus bar (flat rectangular conductor) of the present invention is a bus bar in which a plurality of solar cells are arranged in a straight line and electrically connected as shown in FIG. The material of this bus bar is desired to have high conductivity and high bending life. Accordingly, first, the object of the present invention is to provide a bus bar material having a conductivity of 101.5% IACS (conductivity with a universal annealed copper standard having a resistivity of 1.7241 × 10 ⁻⁸ Ωm as 100%). It is to obtain a soft dilute copper alloy material as a soft copper material satisfying the above. A secondary purpose is to use SCR continuous casting equipment, have few surface flaws, have a wide manufacturing range, enable stable production, and have a processing rate of 90% for wire rods (for example, φ8mm → φ2.6mm). The development of materials with a softening temperature of 148 ° C or lower.

  The solar cell bus bar according to the present embodiment includes an additive element selected from the group consisting of Ti, Mg, Zr, B, Nb, Ca, V, Ni, Mn, and Cr, the balance being inevitable impurities and copper A soft dilute copper alloy material having a surface layer whose average crystal grain size from the surface of the material to a depth of 50 μm is 20 μm or less is used.

  The reason why the element selected from the group consisting of Ti, Mg, Zr, B, Nb, Ca, V, Ni, Mn, and Cr is selected as the additive element is that these elements are easily combined with other elements. This is because S can be trapped because it is easily combined with S, and the copper base material (matrix) can be highly purified. One or more additive elements may be included. Also, other elements and impurities that do not adversely affect the properties of the alloy can be included in the alloy.

  Further, in the preferred embodiment described below, it is described that the oxygen content is more than 2 and not more than 30 mass ppm, but depending on the addition amount of the additive element and the S content, In the range having the property of, it is possible to include more than 2 and 400 mass ppm.

  For high purity copper (6N, purity 99.9999%), the softening temperature at a workability of 90% is 130 ° C. Therefore, a raw material as a soft dilute copper alloy material capable of stably producing soft copper having a soft material with a conductivity of 101.5% IACS or more at a softening temperature of 130 ° C. or more and 148 ° C. or less capable of stable production and its production We examined to obtain the conditions.

  Here, using high-purity copper (4N) with an oxygen concentration of 1 to 2 mass ppm, using a small continuous casting machine (small continuous casting machine) in the laboratory, molten metal with several mass ppm of titanium (Ti) added to the molten metal. When the softening temperature is measured with a φ8 mm wire rod manufactured from No. 2.6 mm (working degree 90%), the softening temperature is not lower than this. The conductivity is about 101.7% IACS. Therefore, it was found that even when Ti was added at a low oxygen concentration, the softening temperature could not be lowered, and the electrical conductivity of high purity copper (6N) was worse than 102.8% IACS.

The reason for this is that sulfur is contained in several mass ppm or more as an unavoidable impurity during the production of molten metal, and sulphide such as TiS is not sufficiently formed between this sulfur and titanium, so that the softening temperature is not lowered. .

Therefore, in the present invention, in order to lower the softening temperature and improve the electrical conductivity, the two measures have been studied and the two effects have been combined to achieve the goal.

(A) Increase the oxygen concentration of the material to an amount exceeding 2 mass ppm and add titanium. Thereby, it is considered that TiS and titanium oxide (TiO ₂ ) and Ti—O—S particles are first formed in the molten copper (see the SEM images in FIGS. 2 and 4 and the analysis results in FIGS. 3 and 5). ). In FIGS. 3, 5, and 7, Pt and Pd are vapor deposition elements for observation.

(B) Next, by setting the hot rolling temperature lower (880 to 550 ° C.) than the normal copper production conditions (950 to 600 ° C.), dislocations are introduced into the copper and S is likely to precipitate. Like that. Thereby, precipitation of S on dislocations or precipitation of S using titanium oxide (TiO ₂ ) as nuclei, as an example, formation of Ti—O—S particles, etc., similar to molten copper (SEM image in FIG. 6). And the analysis result of FIG. 7). 2 to 7 evaluate the cross-section of a φ8 mm copper wire (wire rod) having the oxygen concentration, sulfur concentration, and Ti concentration shown in the third row from the top in Example 1 of Table 1 by SEM observation and EDX analysis. It is a thing. The observation conditions were an acceleration voltage of 15 keV and an emission current of 10 μA.

According to (a) and (b), sulfur in copper crystallizes and precipitates, and a copper wire rod that satisfies the softening temperature and conductivity after cold wire drawing can be obtained.

Next, in this invention, (1)-(4) was restrict | limited as a restriction | limiting of manufacturing conditions with SCR continuous casting equipment.

(1) About composition When obtaining a soft copper material with an electrical conductivity of 102% IACS or higher, pure copper containing inevitable impurities contains sulfur 3-12 mass ppm, oxygen 2 over 30 mass ppm, and Ti 4-25 mass ppm. The wire rod is preferably made of a soft dilute copper alloy material. In this embodiment, so-called low oxygen copper (LOC) is targeted because it contains oxygen exceeding 2 mass ppm and not more than 30 mass ppm.

  Usually, in the industrial production of pure copper, sulfur is taken into copper when producing electrolytic copper, so it is difficult to make sulfur 3 mass ppm or less. The upper limit of the sulfur concentration of general-purpose electrolytic copper is 12 mass ppm.

  As described above, if the amount of oxygen to be controlled is small, the softening temperature is unlikely to decrease. Further, if there is too much oxygen, surface scratches are likely to occur in the hot rolling process, so it is set to 30 mass ppm or less.

(2) Dispersed substances Sulfur and titanium form compounds or aggregates in the form of TiO, TiO ₂ , TiS, Ti—O—S, and the remaining Ti and S exist in the form of a solid solution. ing. TiO size is 200n
m or less, TiO ₂ is 1000 nm or less, TiS is 200 nm or less, and Ti—O—S is 300 nm or less.
A soft dilute copper alloy material distributed in crystal grains with a thickness of less than nm is used. A crystal grain means the crystal structure of copper.

However, since the size of the formed particles changes depending on the holding time of the molten copper during casting and the cooling condition, it is necessary to set casting conditions.

(3) Casting conditions By SCR continuous casting and rolling, a wire rod is manufactured with an ingot rod working degree of 90% (30 mm) to 99.8% (5 mm). As an example, a φ8 mm wire with a working degree of 99.3% The method of making a rod is used.

(A) Molten copper temperature in a melting furnace shall be 1100 degreeC or more and 1320 degrees C or less. When the temperature of the molten copper is high, blowholes increase, scratches are generated, and the particle size tends to increase. The reason why the temperature is set to 1100 ° C. or more is that copper is hardened and the production is not stable, but the molten copper temperature is preferably as low as possible.

(B) As for the hot rolling temperature, the temperature at the first rolling roll is 880 ° C. or lower, and the temperature at the final rolling roll is 550 ° C. or higher.

Unlike normal pure copper production conditions, crystallization of sulfur in molten copper and precipitation of sulfur during hot rolling are the subject of the present invention, so in order to reduce the solid solubility limit that is the driving force. The molten copper temperature and the hot rolling temperature are preferably (a) and (b).

The normal hot rolling temperature is such that the temperature at the first rolling roll is 950 ° C. or lower and the temperature at the final rolling roll is 600 ° C. or higher. In order to reduce the solid solution limit, The temperature at the first rolling roll is set to 880 ° C. or lower, and the temperature at the final rolling roll is set to 550 ° C. or higher.

  The reason why the temperature is set to 550 ° C. or more is that there are many flaws of the wire rod obtained at a temperature lower than this temperature, and the product does not become a product. The hot rolling temperature is preferably as low as possible, with the temperature at the first rolling roll being 880 ° C. or lower and the temperature at the final rolling roll being 550 ° C. or higher. By doing so, the softening temperature (after processing to φ8 to φ2.6) is infinitely close to Cu (6N, softening temperature 130 ° C.).

  A soft dilute copper alloy wire in which the conductivity of a wire rod having a diameter of φ8 mm is 101.5% IACS or more, and the softening temperature of the wire after cold wire drawing (for example, φ2.6 mm) is 130 ° C. to 148 ° C. Alternatively, a plate material can be obtained.

In order to use industrially, it is 9 in the soft copper wire of the industrially used purity manufactured from electrolytic copper.
8% IACS or more is necessary, and the softening temperature is 148 ° C. or less in view of its industrial value.
When Ti is not added, the temperature is 160 to 165 ° C. Since the softening temperature of high-purity copper (6N) was 127 to 130 ° C., the limit value is set to 130 ° C. from the obtained data. This slight difference is in inevitable impurities not found in high purity copper (6N).

The conductivity is about 101.7% IACS at the level of oxygen-free copper, and 102.8% IACS for high-purity copper (6N), so that the conductivity is as close as possible to high-purity copper (6N). Is desirable.
(4) Restriction of casting conditions The copper of the base material was controlled so as to be in a reduced state after being melted in the shaft furnace, that is, in the reducing gas (CO) atmosphere, the sulfur concentration of the constituent element of the diluted alloy, Ti A method of stably producing a wire rod for casting and rolling by controlling the concentration and oxygen concentration is preferable. Since the copper oxide is mixed and the particle size is large, the quality is lowered.

  Here, the reason for selecting Ti as the additive element is as follows.

  (A) Ti is easily bonded to sulfur in molten copper to form a compound.

  (B) It can be processed and handled more easily than other additive metals such as Zr.

  (C) It is less expensive than Nb or the like.

  (D) It is because it is easy to precipitate using an oxide as a nucleus.

  In the preferred embodiment of the present invention, Ti is selected as the additive element, but it is not limited to this, and any one of Ti, Mg, Zr, B, Nb, Ca, V, N, Mn, and Cr is used. One or more elements may be used as the additive element.

  As described above, the soft diluted copper alloy material of the present invention can be used as a molten solder plating material (wire, plate, foil), soft pure copper, high conductivity copper, soft copper wire, high productivity, conductivity, softening temperature It becomes possible to obtain a practical soft dilute copper alloy material having excellent surface quality.

Further, a plating layer may be formed on the surface of the soft diluted copper alloy wire of the present invention. As the plating layer, for example, a layer mainly composed of tin, nickel, and silver is applicable, and so-called Pb-free plating may be used.

  Further, the shape is not limited to a rectangular conductor, and may be a conductor having a round cross section or a rod-like conductor.

  In the above-described embodiment, the wire rod is manufactured by the SCR continuous casting rolling method, and the soft material is manufactured by hot rolling. However, the present invention is not limited to the twin roll continuous casting rolling method or the proper perch. You may make it manufacture by a type | formula continuous casting rolling method.

  Table 1 relates to experimental conditions and results.

First, as an experimental material, a φ8 mm copper wire (wire rod) with a processing degree of 99.3% was prepared with the oxygen concentration, sulfur concentration, and Ti concentration shown in Table 1. The φ8 mm copper wire is hot-rolled by SCR continuous casting and rolling. Ti flows the molten copper melted in the shaft furnace into the reed in the reducing gas atmosphere, guides the molten copper flowing in the reed to the casting pot of the same reducing gas atmosphere, and after adding Ti in this casting pot, An ingot rod was made with a mold formed between the cast ring and the endless belt through the nozzle. This ingot rod is hot-rolled to produce a φ8 mm copper wire. The experimental material was cold-drawn, the semi-softening temperature and conductivity at a size of φ2.6 mm were measured, and the dispersed particle size at a copper wire of φ8 mm was evaluated.

The oxygen concentration was measured with an oxygen analyzer (Leco ™ oxygen analyzer). Sulfur, T
Each concentration of i is a result of analysis with an ICP emission spectroscopic analyzer.

The measurement of the semi-softening temperature in the size of φ2.6 mm was obtained from the result of quenching in water after holding each temperature at 400 ° C. or less for 1 hour and conducting a tensile test. Results of tensile test at room temperature and 4
Semi-softening the temperature corresponding to the strength obtained by adding the tensile strengths of these two tensile tests and dividing by 2 using the results of the tensile test of the soft copper wire heat-treated at 00 ° C for 1 hour in the oil bath. Determined as temperature.

It is desirable that the dispersed particles have a small size and are distributed a lot. The reason is that the size is small and the number is large because it functions as a sulfur deposition site. That is, the case where the number of dispersed particles having a diameter of 500 μm or less was 90% or more was regarded as acceptable. Here, the “size” is the size of the compound and means the size of the major axis of the major axis and minor axis of the shape of the compound. Further, “particle” means TiO, TiO ₂ , TiS, or Ti—O—S. “90%” indicates the ratio of the number of corresponding particles to the total number of particles.

In Table 1, the comparative material 1 is a result of trial production of a copper wire having a diameter of φ8 mm in an Ar atmosphere in a laboratory, and is obtained by adding 0 to 18 mass ppm of Ti to a molten copper.

With this addition of Ti, 13 mass pp for a semi-softening temperature of 215 ° C. with zero addition of Ti.
m decreased to 160 ° C. and became minimum, and increased with the addition of 15,18 mass ppm, and the desired softening temperature did not fall below 148 ° C. Moreover, it was what does not satisfy 101.5% or more of electrical conductivity, and the comprehensive evaluation was x.

Therefore, a Ø8 mm copper wire (wire rod) was prototyped by adjusting the oxygen concentration to 7 to 8 mass ppm by the SCR continuous casting and rolling method.

The comparative material 2 has a small Ti concentration (0,2 ma) produced by SCR continuous casting and rolling.
ss ppm) and the conductivity is 102% IACS or higher, but the semi-softening temperature is 164,
Since it was 157 ° C. and did not satisfy the required 148 ° C. or lower, the overall evaluation was x.

About execution material 1, oxygen concentration and sulfur are almost constant (7-8 mass ppm, 5 ma
ss ppm) and the results of trial materials with different Ti concentrations (4 to 55 mass ppm).

In this Ti concentration range of 4 to 55 mass ppm, the softening temperature is 148 ° C. or lower, the conductivity is 98% IACS or higher, 102% IACS or higher, and the dispersed particle size is 500 nm.
The following particles are 90% or more, which is good. And the surface of the wire rod is clean,
All are satisfied as product performance (overall evaluation ○).

Here, a material satisfying a conductivity of 101.5% IACS or more has a Ti concentration of 4 to 25 mas.
When s ppm. When the Ti concentration was 13 mass ppm, the maximum conductivity was 102.4% IACS, and the conductivity was slightly lower in the vicinity of this concentration.
This is because when Ti is 13 mass ppm, the sulfur content in copper is captured as a compound, thereby showing conductivity close to that of high-purity copper (6N).

Therefore, both the semi-softening temperature and the conductivity can be satisfied by increasing the oxygen concentration and adding Ti.

  Comparative material 3 is a prototype material having a Ti concentration exceeding 25 mass ppm. The comparative material 3 satisfied the demand for the semi-softening temperature, but the electrical conductivity was lower than 101.5% IACS, so the overall evaluation was x.

The comparative material 4 is a prototype material having a Ti concentration as high as 60 mass ppm. This comparison material 3
Although the electrical conductivity satisfies the demand, the semi-softening temperature is 148 ° C. or higher, and the product performance is not satisfied. Furthermore, there are many surface defects on the wire rod, making it difficult to produce a product. Therefore, the addition amount of Ti is preferably less than 60 mass ppm.

Next, with respect to the embodiment material 2, the sulfur concentration is 5 mass ppm, and the Ti concentration is 13 to 10 ppm.
It is a prototype material in which the effect of oxygen concentration was examined by changing mass oxygen to oxygen ppm.

  With respect to the oxygen concentration, prototype materials having greatly different concentrations from 2 to 30 mass ppm or less were used. However, when oxygen is less than 2 mass ppm, production is difficult and stable production cannot be performed, so the overall evaluation is Δ. It was also found that even when the oxygen concentration was increased to 30 mass ppm, both the semi-softening temperature and the conductivity were satisfied.

Moreover, as shown in the comparative material 5, when oxygen was 40 mass ppm, there were many scratches on the surface of the wire rod, and the product did not become a product.

  Therefore, by setting the oxygen concentration in the range of more than 2 and 30 mass ppm or less, the semi-softening temperature, the conductivity of 102% IACS or more, and the dispersed particle size can be satisfied, and the wire rod surface is also clean. Yes, both can satisfy product performance.

Next, the implementation material 3 is an example of a prototype material in which the oxygen concentration and the Ti concentration are relatively close to each other, and the Ti concentration is changed to 4 to 20 mass ppm. In this material 3, the prototype material with less than 2 mass ppm of sulfur could not be realized from the raw material side, but by satisfying both the semi-softening temperature and the conductivity by controlling the concentrations of Ti and sulfur. Can do.

When the sulfur concentration of the comparative material 6 was 18 mass ppm and the Ti concentration was 13 mass ppm, the semi-softening temperature was high at 162 ° C., and the required characteristics could not be satisfied. Moreover, since the surface quality of the wire rod was particularly poor, it was difficult to commercialize the product.

From the above, when the sulfur concentration is 2 to 12 mass ppm, the semi-softening temperature and the electrical conductivity are 10
It was found that both the characteristics of 2% IACS or more and dispersed particle size were satisfied, the surface of the wire rod was clean, and all product performances were satisfied.

Moreover, although the examination result using Cu (6N) as the comparative material 7 was shown, the semi-softening temperature 127-1 was shown.
The temperature was 30 ° C., the conductivity was 102.8% IACS, and no particles with a dispersed particle size of 500 nm or less were observed.

表２は、製造条件としての、溶融銅の温度と圧延温度を示したものである。

Table 2 shows the molten copper temperature and rolling temperature as the production conditions.

The comparative material 8 is 1330-1350 degreeC whose molten copper temperature is high, and rolling temperature is 950-600.
The result of trial production of a wire rod of φ8 mm at ° C is shown.

  Although this comparative material 8 satisfied the semi-softening temperature and the electrical conductivity, the size of the dispersed particles was about 1000 nm, and the particles of 500 nm or more exceeded 10%. Therefore, this was inappropriate.

Implementation material 4 has a molten copper temperature of 1200 to 1320 ° C. and a lower rolling temperature of 880 to 550.
The result of trial production of a wire rod of φ8 mm at ° C is shown. About this implementation material 4, the wire surface quality and the dispersed particle size were also good, and the overall evaluation was good.

Comparative material 9 shows the result of trial manufacture of a wire rod of φ8 mm at a molten copper temperature of 1100 ° C. and a lower rolling temperature of 880 to 550 ° C. Since this comparative material 9 had a low molten copper temperature, it had many wire rod surface scratches and was not suitable for the product. This is because scratches are likely to occur during rolling because the molten copper temperature is low.

  Comparative material 10 shows the result of trial production of a wire rod having a diameter of 8 mm at a molten metal temperature of 1300 ° C. and a rolling temperature of 950 to 600 ° C., which is higher. Since this comparative material 10 has a high hot rolling temperature, the surface quality of the wire rod is good, but some of the dispersed particles are large, and the overall evaluation is x.

Comparative material 11 has a molten copper temperature of 1350 ° C. and a lower rolling temperature of 880 to 550 ° C. and φ8
The result of trial manufacture of a wire rod of mm is shown. Since this comparative material 11 had a high molten copper temperature, some of the dispersed particles had a large size, and the overall evaluation was x.

(Soft characteristics of soft dilute copper alloy wire)
Table 3 shows samples of the comparative material 12 using an oxygen-free copper wire and the embodiment material 5 using a soft dilute copper alloy wire containing 13 mass ppm Ti in low-oxygen copper, and annealing at different annealing temperatures for 1 hour. It is the table | surface which verified Vickers hardness (Hv) of what gave.

The implementation material 5 was the same as the alloy composition described in the implementation material 1 of Table 1. As a sample, a 2.6 mm diameter sample was used. According to this table, when the annealing temperature is 400 ° C., the Vickers hardness (Hv) of the comparative material 12 and the working material 5 is equivalent, and the annealing temperature is 6
Even at 00 ° C., the same Vickers hardness (Hv) is shown. From this, the soft dilute copper alloy wire of the present invention has sufficient soft properties and has excellent soft properties even in the region where the annealing temperature exceeds 400 ° C., even when compared with the oxygen-free copper wire. I understand that.

（軟質希薄銅合金線の耐力及び屈曲寿命についての検討）
表４は、無酸素銅線を用いた比較材１３と低酸素銅に１３ｍａｓｓ ｐｐｍのＴｉを含
有した軟質希薄銅合金線を用いた実施材６を試料とし、異なる焼鈍温度で１時間の焼鈍を
施したものの０．２％耐力値の推移を検証した表である。なお、試料としては、２．６ｍ
ｍ径の試料を用いた。

(Study on yield strength and bending life of soft dilute copper alloy wire)
Table 4 shows a comparative material 13 using an oxygen-free copper wire and an embodiment material 6 using a soft dilute copper alloy wire containing 13 mass ppm Ti in low oxygen copper, and annealed for 1 hour at different annealing temperatures. It is the table | surface which verified the transition of 0.2% proof stress value of what was given. As a sample, 2.6 m
An m-diameter sample was used.

  According to this table, when the annealing temperature is 400 ° C., the 0.2% proof stress value of the comparative material 13 and the execution material 6 is the same level, and at the annealing temperature of 600 ° C., the execution material 6 and the comparative material 12 are almost the same. It can be seen that the yield strength is 2%.

つぎに、本発明に係る軟質希薄銅合金線は、屈曲寿命の高さが要求されるが、無酸素銅
線を用いた比較材１４と低酸素銅にＴｉを添加した軟質希薄銅合金線を用いた実施材７に
おける屈曲寿命を測定した結果を図９に表す。ここでは試料としては、０．２６ｍｍ径の
線材に対して焼鈍温度４００℃で１時間の焼鈍を施したものを用い、比較材１４は比較材
１２と同様の成分組成であり、実施材７も実施材１と同様の成分組成のものを使用した。

Next, the soft dilute copper alloy wire according to the present invention is required to have a high flex life, but the comparative material 14 using an oxygen-free copper wire and the soft dilute copper alloy wire obtained by adding Ti to low oxygen copper are used. The result of measuring the bending life of the used material 7 is shown in FIG. Here, a sample obtained by subjecting a 0.26 mm diameter wire to an annealing temperature of 400 ° C. for 1 hour is used, the comparative material 14 has the same composition as the comparative material 12, and the implementation material 7 is also used. The component composition similar to that of Example 1 was used.

  Here, the bending life was measured by a bending fatigue test. The bending fatigue test is a test in which a load is applied and repeated bending strain of tension and compression is applied to the sample surface. The bending fatigue test is performed using a bending head 4 as shown in FIG. Set the sample 5 between the bending jigs 6 (rings) as shown in (A), hold it with the clamp 7, and turn the jig 90 degrees as shown in (B) with the load applied. give. By this operation, a compressive strain is applied to the surface of the wire rod in contact with the bending jig, and a tensile strain is applied to the opposite surface correspondingly. Thereafter, the state returns to the state (A) again. Next, it is rotated 90 degrees in the direction opposite to the direction shown in FIG. Also in this case, a compressive strain is applied to the surface of the wire rod in contact with the bending jig, and a tensile strain is applied to the surface on the opposite side, corresponding to the state (C). And it returns to the first state (A) from (C). The time required for one cycle of bending fatigue (A), (B), (A), (C), and (A) is 4 seconds. The surface bending strain can be obtained by the following equation.

Surface bending strain (%) = r / (R + r) × 100 (%), R: wire bending radius (30 mm), r = wire radius According to the experimental data of FIG. The bending life was higher than that of the material 13.

Moreover, the result of having measured the bending life in the comparative material 15 using an oxygen free copper wire and the implementation material 8 using the soft dilute copper alloy wire which added Ti to low oxygen copper is shown in FIG. Here, a sample obtained by subjecting a 0.26 mm diameter wire to an annealing temperature of 600 ° C. for 1 hour is used, the comparative material 15 has the same composition as the comparative material 12, and the implementation material 8 is also used. The component composition similar to that of Example 1 was used. The bending life was measured under the same conditions as in the measuring method of FIG. Also in this case, the working material 8 according to the present invention showed a higher bending life than the comparative material 15. This result is understood to be due to the fact that the execution materials 7 and 8 showed a larger 0.2% proof stress value than the comparative materials 14 and 15 under any annealing conditions. Is done.

(Examination on crystal structure of soft dilute copper alloy wire)
11 shows a photograph of the cross-sectional structure in the width direction of the sample of the embodiment material 8, and FIG. 12 shows a photograph of the cross-sectional structure in the width direction of the comparative material 15. FIG. 11 shows the crystal structure of the comparative material 15, and FIG. 12 shows the crystal structure of the working material 8. From this, it can be seen that the crystal structure of the comparative material 15 has uniform crystal grains of uniform size as a whole from the surface to the center. On the other hand, the crystal structure of the embodiment material 8 has a sparse crystal grain size as a whole, and it should be noted that the crystal grain size in the thin layer formed near the surface in the cross-sectional direction of the sample is internal. It is extremely small compared to the crystal grain size.

The inventors found that the fine crystal grain layer that was not formed in the comparative material 15 and appeared on the surface layer was the embodiment material 8.
It is thought that it contributes to the improvement of the bending characteristics.

If this is normal, if the annealing process is performed for 1 hour at an annealing temperature of 600 ° C., the comparative material 1
It is understood that the crystal grains uniformly coarsened by recrystallization as shown in FIG. 5 are formed, but in the case of the present invention, even if an annealing treatment is performed at an annealing temperature of 600 ° C. for 1 hour, Since the fine crystal grain layer remains on the surface layer, it is considered that a soft dilute copper alloy material having a good bending property was obtained while being a soft copper material.

And based on the cross-sectional photograph of the crystal structure shown to FIG. 11 and FIG. 12, the average crystal grain size in the surface layer of the sample of the implementation material 8 and the comparison material 15 was measured.

  Here, as shown in FIG. 13, the method for measuring the average grain size in the surface layer is on a line of 1 mm length from the surface of the cross section in the width direction of 0.26 mm diameter to the depth of 50 μm at 10 μm intervals in the depth direction. A value obtained by averaging the measured values of the crystal grain sizes in the range was defined as the average crystal grain size in the surface layer.

As a result of the measurement, the average crystal grain size in the surface layer of the comparative material 15 was 50 μm, whereas the average crystal grain size in the surface layer of the example material 8 was greatly different in that it was 10 μm. It is considered that the growth of cracks in the bending fatigue test was suppressed by the fine average grain size of the surface layer, and the bending fatigue life was extended (if the grain size is large, cracks propagate along the grain boundaries). If the crystal grain size is small, the direction of crack growth changes, so the growth is suppressed). As described above, this is considered to have caused a great difference in the bending characteristics between the comparative material and the working material.

Moreover, the average crystal grain size in the surface layer of the implementation material 6 which is 2.6 mm diameter, and the comparison material 13 is as follows.
The crystal grain size in a range of 10 mm in length at a depth of 50 μm in the depth direction from the surface of the cross section in the width direction of 2.6 mm diameter was measured.

As a result of the measurement, the average crystal grain size in the surface layer of the comparative material 13 was 100 μm, whereas the average crystal grain size in the surface layer of the example material 6 was 20 μm.

  As an effect of the present invention, the upper limit value of the average grain size of the surface layer is preferably 20 μm or less, and a value of 5 μm or more is assumed from the manufacturing limit value.

(About embodiment of flat conductor (bus bar) for solar cell of crystalline solar cell)
Of the material 1 (see Table 1) prototyped by the SCR continuous casting and rolling method, the third material from the top is cast at a molten copper temperature of 1320 ° C., and the rolling temperature is 880 ° C. to 550 ° C. and a wire of φ8 mm A rod (rough drawing wire) was prepared, and this was further drawn to obtain a strand having a diameter of 2.6 mm, and then an annealing treatment (annealing) was performed. Further, through a rolling process for forming the round wire into a flat, a rectangular copper wire having a width of 6 mm, a thickness of 0.23 mm, and a width of 5 mm and a thickness of 0.1 mm is obtained, and this is continuously immersed in a solder plating bath. A solder-plated wire was created. As shown in FIG. 1 and FIG. 14, a bus bar 1 was obtained by sandwiching a copper wire molded body, which was formed into an approximately L shape by soldering on the cell 2 by soldering, and was sandwiched between PET films. In FIG. 1 and FIG. 14, the insulating film covering the bus bar is omitted.

(About embodiment of flat conductor (bus bar) for solar cell of thin film solar cell)
Of the material 1, the third material from the top is cast at a molten copper temperature of 1320 ° C., and a wire rod (rough drawing wire) of φ8 mm at a rolling temperature of 880 ° C. to 550 ° C. is formed. After wire processing and obtaining a strand having a diameter of 2.6 mm, an annealing process was performed. Furthermore, a flat conductor having a thickness of 0.1 mm, a width of 5 mm, a thickness of 0.05 mm, and a width of 5 mm is obtained through a rolling process for forming the round wire into a flat, and this is continuously immersed in a solder plating bath. A solder-plated wire was created. Bus bars were obtained by sandwiching the upper and lower surfaces of these solder-plated rectangular conductors with a PET film.

  In the above two embodiments, since the same material as the third material from the top is used as the copper element wire in the upper embodiment 1, the following effects are recognized.

  Compared to conventional OFC and TPC materials, the conductor 1 is made of soft dilute copper alloy wire with Ti containing the inevitable impurities and the average grain size in the surface layer from the surface to a depth of 50 μm being 20 μm or less. Thus, it is possible to supply a bus bar with high conductivity equivalent to 6N and less cost than 6N.

  In addition, the bus bar of the present invention has better flexibility than OFC compared to conventional OFC materials, so it can be said that it is suitable for bending with a small bending radius.

  Therefore, the bus bar of the present invention has high conductivity as compared with the conventional OFC material and TPC material, and has a high bending life as compared with the conventional OFC material.

  It can be bent at a narrow angle or laid with a small bending radius in a narrow place. FIG. 15 shows the bus bar 1 bent 180 degrees in the vertical direction, and FIG. 16 shows the bus bar 1 bent 90 degrees in the horizontal direction. As described above, the bus bar of the present invention can be formed by bending one conductor wire in an arbitrary direction at an arbitrary angle, and uses an integrated bus bar in which a plurality of conductors are soldered as in the prior art. In addition, wiring materials such as bus bars and tab wires can alleviate electrical adverse effects caused by bending and repeated bending stresses and damages during installation.

  DESCRIPTION OF SYMBOLS 1 ... Bus bar (flat conductor), 2 ... Cell, 3 ... Interconnector, 4 ... Bending head, 5 ... Sample, 6 ... Ring, 7 ... Clamp

Claims (2)

In the solar battery bus bar, a plurality of solar cells are arranged in a straight line, and the cells are electrically connected to each other.
4mass ppm~55mass ppm of beyond sulfur and 2mass ppm of Ti and 2mass ppm~12mass ppm and a following oxygen 30Massppm, I balance soft dilute copper alloy material der made of copper, 50 [mu] m from the surface of the material An average crystal grain size in a surface layer up to a depth is 20 μm or less, and a solar cell bus bar. In a solar cell bus bar for connecting a bus region for collecting positive and negative power formed on a thin film solar cell,
4mass ppm~55mass ppm of beyond sulfur and 2mass ppm of Ti and 2mass ppm~12mass ppm and a following oxygen 30Massppm, I balance soft dilute copper alloy material der made of copper, 50 [mu] m from the surface of the material An average crystal grain size in a surface layer up to a depth is 20 μm or less, and a solar cell bus bar.

Images