JP5473261B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging apparatus that radiates heat from a substrate having a heat-generating component disposed in a closed space inside a resin casing and performs magnetic shielding.

  As a conventional example related to an electromagnetic shield and a heat dissipation structure provided in an imaging apparatus, a heat dissipation structure for a video camera described in Patent Document 1 is known. This is a video camera having a built-in power supply unit, in which heat generated by the power supply unit is transmitted to the casing of the video camera using a shield case of an electronic circuit unit other than the power supply unit.

JP-A-11-146239

  In an imaging device in which the housing is configured with a resin material having low thermal conductivity, the imaging device has a problem that the heat dissipation and electromagnetic shielding performance inside the housing are very poor compared to the case where the housing is configured with metal. is there.

  In order to ensure this heat dissipation in an imaging apparatus configured with a resin casing, a method of mounting a cooling fan or the like is conceivable. However, in addition to the problem of the dust-proof property of the imaging optical system and the electric substrate disposed inside the housing, the cost is high and the size is increased.

  In order to ensure electromagnetic shielding performance in an imaging device configured with a resin casing, a method of applying a conductive paint or vapor deposition process to the inside of the resin casing is conceivable. However, since the earth connection is made to the thin film, the electromagnetic shielding performance is not stable, and a painting or vapor deposition process is required, resulting in an increase in cost.

  An object of the present invention is to provide an imaging apparatus capable of solving the above-described problems and performing magnetic shielding as well as heat dissipation.

In order to achieve the above object, an imaging apparatus according to the present invention is arranged in a housing formed of a resin upper exterior member and a resin lower exterior member, and in a space closed by the housing, and A lens unit stacked on the resin lower exterior member; a substrate disposed in the space and stacked on the lens unit; and a first disposed on the space and stacked on the substrate. An image pickup apparatus comprising: an electromagnetic shield plate, wherein the first electromagnetic shield plate is in contact with a first heat generating component attached to an upper surface of the substrate via a heat dissipation sheet member, and the first electromagnetic shield plate is provided. and aperture shape and bent shape along the shape of the resin-made upper exterior member that is laminated on the electromagnetic shielding plate is formed, and in contact through a heat sheet member release and the resin of the upper exterior member, The imaging device Further, the second heat-generating component disposed between the lens unit and the substrate and mounted on the lower surface of the substrate is in contact with the first electromagnetic shield plate and in contact with the second heat-generating component. and characterized by having a second electromagnetic shield plate bending shape so as to follow the shape of the lower exterior member made of the resin is formed.

  The imaging apparatus according to the present invention enables heat dissipation and magnetic shielding.

  The present invention will be described in detail based on the embodiments shown in the drawings.

  FIG. 1 is an exploded perspective view of a part of a unit housing a substrate having an imaging optical system and a heat generating component in the imaging apparatus.

  The imaging device is hermetically sealed by a lower exterior member 1 and an upper exterior member 2 formed of a casing. Between the lower exterior member 1 and the upper exterior member 2, a lens unit 3, an electromagnetic shield plate 4, a substrate support sheet metal 5, a substrate 6, and an electromagnetic shield plate 7 are laminated from below.

  A plurality of, for example, three heating elements 6 a, 6 b, 6 c are mounted on the upper surface of the substrate 6. A heat radiating sheet member 11 is attached to the heat generating element 6a, and a heat radiating sheet member 12 is attached to the heat generating elements 6b and 6c. The heat radiating sheet members 11 and 12 are in close contact with the upper electromagnetic shield plate 7. The thickness of the heat radiating sheet members 11 and 12 is determined by the clearance tolerance between the substrate 6 and the heat generating elements 6a, 6b, and 6c and the electromagnetic shield plate 7.

  When the clearance tolerance swings to the maximum, the thickness of the heat dissipation sheet members 11 and 12 needs to be set so that the contact with the electromagnetic shield plate 7 can be maintained. Further, when the clearance tolerance is minimized, the thickness of the heat radiating sheet members 11 and 12 is set so that the heat generating elements 6a, 6b, and 6c mounted on the substrate 6 are not damaged by the deformation pressure, such as solder cracks. There is a need.

  When the thickness of the heat radiating sheet members 11 and 12 cannot be optimally selected due to the height of the heat generating elements 6a, 6b and 6c, the electromagnetic shield plate 7 is used to adjust the clearance with the heat generating elements 6a, 6b and 6c. However, the drawing processes 7a, 7b, and 7c may be performed. If only this clearance adjustment is required, the electromagnetic shield plate 7 may be partially cut and bent. However, in order not to reduce the electromagnetic shield effect, it is desirable to provide drawing processes 7a, 7b, and 7c.

  The electromagnetic shield plate 7 and the substrate 6 are both fixed to the substrate support metal plate 5 by screw fastening, and the electromagnetic shield plate 7 is connected to the ground pattern 6d on the substrate 6 at least at one place in order to obtain an electromagnetic shielding effect. ing.

  The electromagnetic shield plate 7 is in contact with the upper exterior member 2 directly or through the heat radiating sheet member 13. The upper exterior member 2 is made of a resin having low thermal conductivity, but may have a complicated shape due to the design and operation panel specifications.

  The heat radiation from the upper exterior member 2 having low thermal conductivity cannot be expected to diffuse inside the material of the upper exterior member 2, so it is necessary to conduct heat through as wide an area as possible. The electromagnetic shield plate 7 is formed with a drawn shape 7d or a bent shape 7e along the shape of the upper exterior member 2 in order to take as much contact area as possible on the inner surface of the upper exterior member 2.

  Further, the upper exterior member 2 secures a contact area as large as possible with the electromagnetic shield plate 7, so that the electromagnetic shield plate 7 has an aperture shape, an inner surface shape that cannot be secured by the bent shape 7 e, and an external shape. Alternatively, it may be a flat shape with a deformed shape or a grid-like rib.

  The electromagnetic shield plate 4 is connected to the opposite side of the ground pattern 6d of the substrate 6 directly or indirectly through the substrate support sheet metal 5 and has an electromagnetic shielding effect. When the heating element is provided on the opposite side, that is, the lower side of the substrate 6, the electromagnetic shield plate 4 is also in contact with the heating element via the heat radiating sheet members 14 and 15, similarly to the electromagnetic shield plate 7. It is structured. When the optimum thickness of the heat-dissipating sheet members 14 and 15 cannot be selected due to the clearance tolerance between the electromagnetic shield plate 4 and the heating elements 6a, 6b and 6c, the aperture shape 4a is also applied to the electromagnetic shield plate 4 in the same manner as the electromagnetic shield plate 7. Can also be added.

  The electromagnetic shield plate 4 is in contact with the electromagnetic shield plate 7 through a contact structure 4b by direct screw fastening or the like through the heat radiating sheet member 16, or indirectly through a component having high thermal conductivity such as the substrate support metal plate 5. The structure is in thermal contact. The heat transferred to the electromagnetic shield plate 4 is radiated from the upper exterior member 2 to the outside via the electromagnetic shield plate 7.

  When the electromagnetic shield plate 4 cannot make thermal contact with the electromagnetic shield plate 7, the electromagnetic shield plate 4 follows the shape of the upper exterior member 2 or the lower exterior member 1 in order to transmit heat of the heating elements 6 a, 6 b, 6 c independently. It may have a drawing or bending shape to make contact.

  With such a configuration, even in an imaging apparatus configured with a resin casing, it is possible to ensure electromagnetic shielding and heat dissipation performance with respect to the substrate 6 serving as a heat generation source and a noise generation source.

  FIG. 2 is an exploded perspective view of the second embodiment. Instead of the electromagnetic shield plate 7 above the substrate 6, an electromagnetic shield plate 8 and a heat radiating plate 9 are laminated.

  When the configuration of the first embodiment is not obtained by the electromagnetic shield plate 7 of the first embodiment in terms of structure, such as when the clearance between the electromagnetic shield plate 7 and the upper exterior member 2 is separated, the heat sink 9 is electromagnetic It is disposed between the shield plate 8 and the upper exterior member 2. The heat radiating plate 9 is configured to be in close contact via the electromagnetic shield plate 8 and the heat radiating sheet members 17 and 18.

  Further, the heat radiating plate 9 contacts the upper exterior member 2 directly or through the heat radiating sheet member 13. The heat radiating plate 9 has an aperture shape 9 a or a bent shape 9 b along the shape of the upper exterior member 2 in order to take as large a contact area as possible on the inner surface of the upper exterior member 2.

  The heat transferred to the electromagnetic shield plate 4 is radiated from the upper exterior member 2 to the outside through the electromagnetic shield plate 8 and the heat radiating plate 9. Alternatively, the electromagnetic shield plate 4 may have a close contact structure by direct screw fastening or the like, or a structure in contact with the heat dissipation plate 9 via the heat dissipation sheet members 14 and 15. The heat transferred to the electromagnetic shield plate 4 is radiated from the upper exterior member 2 to the outside through the electromagnetic shield plate 8 and the heat radiating plate 9.

  The electromagnetic shield plate 4 follows the shape of the upper exterior member 2 or the lower exterior member 1 in order to transmit heat of the heating elements 6a, 6b, 6c independently when the electromagnetic shield plate 4 cannot be in close contact with the electromagnetic shield plate 8 and the heat dissipation plate 9. A squeezed or bent shape may be provided for contact.

1 is an exploded perspective view of Example 1. FIG. 3 is an exploded perspective view of Example 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lower exterior member 2 Upper exterior member 3 Lens unit 4, 7, 8 Electromagnetic shield board 5 Board | substrate support metal plate 6 Board | substrate 6a, 6b, 6c Heat generating element 9 Heat sink 11-18 Heat sink sheet member

Claims (1)

A housing composed of a resin upper exterior member and a resin lower exterior member;
A lens unit disposed in a space closed by the housing and stacked on the resin lower exterior member;
A substrate disposed in the space and stacked on the lens unit;
A first electromagnetic shield plate disposed in the space and stacked on the substrate;
An imaging device comprising:
The first electromagnetic shield plate is in contact with a first heat generating component attached to the upper surface of the substrate via a heat radiating sheet member, and is laminated on the first electromagnetic shield plate. and aperture shape and bent shape along the shape of the member is formed, and in contact through a heat sheet member release and the resin of the upper exterior member,
The imaging device further includes:
A second heat-generating component disposed between the lens unit and the substrate and mounted on the lower surface of the substrate, contacting the heat-dissipating sheet member, and contacting the first electromagnetic shield plate; imaging apparatus characterized by having a second electromagnetic shield plate bending shape so as to follow the shape of the lower exterior member made of the resin is formed.

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