JP5449719B2 - WIRING BOARD, IC ELECTRIC CHARACTERISTIC TESTING WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD - Google Patents

Description

  The present invention relates to a wiring board, an IC electrical characteristic inspection wiring board, and a manufacturing method of the wiring board.

Conventionally, a tester has been used for testing semiconductor chips and integrated circuits formed on a semiconductor wafer such as silicon. Such a circuit inspection is performed by connecting a probe of an electrical characteristic measurement wiring board such as a probe card connected to the tester to the semiconductor chip or the integrated circuit (Patent Document 1).
JP 2006-98146 A

  On the other hand, in recent years, it is desired to measure the electrical characteristics of a plurality of semiconductor elements at the same time, not for each semiconductor element formed on a semiconductor wafer. However, since the semiconductor wafer reaches a size of several tens of centimeters at the maximum, when measuring the electrical characteristics of a plurality of semiconductor elements formed on such a semiconductor wafer at the same time, a wiring board for measuring electrical characteristics is used. Must be expanded to a size of several tens of centimeters.

  On the other hand, when the electrical characteristics of a plurality of semiconductor elements are simultaneously measured using the electrical characteristic measurement wiring board as described above, the electrical characteristics are within a preset range (voltage and current ranges). It is necessary to. Therefore, the resistance value of the wiring board for measurement, particularly the resistance value of the wiring actually used for measurement, must be set to a predetermined value.

  When measuring the resistance of the wiring in the measurement wiring board as described above, the measurement probe is directly contacted with the wiring of the measurement wiring board, or is measured by contacting the connection pad or via pad that is continuous with the wiring. Or do it.

  However, if the measurement probe is brought into contact with the connection pad or the via pad, the connection pad or the via pad may be deformed or depressed due to the pressure at that time, and the measurement wiring board may be defective. May end up.

  For example, if the connection pad is deformed, the probe pin connection accuracy deteriorates, the electrical contact between the measurement wiring board and the semiconductor wafer becomes incomplete, and the electrical characteristics of the semiconductor wafer are improved. It may become impossible to measure accurately. Further, if the via pad is deformed, the overall wiring resistance in the measurement wiring board including the wiring described above changes, and similarly, the electrical characteristics of the semiconductor wafer cannot be measured with high accuracy. Or the disconnection may cause malfunction of the wiring board for measurement.

  When the resistance value is measured by bringing the measurement probe into direct contact with the wiring, the resistance value is greatly influenced by the contact state of the measurement probe with the wiring. For example, when the width of the wiring is reduced, it is difficult to maintain a good contact state with the measurement probe, and thus it is difficult to measure the target resistance value.

  The present invention is capable of simultaneously measuring the electrical characteristics of a plurality of semiconductor elements formed on a semiconductor wafer, in a so-called electrical characteristic measurement wiring board, without damaging the wiring board, without damaging the wiring board. The purpose is to measure accurately.

In order to achieve the above object, the present invention provides:
An insulating substrate having through holes formed in the thickness direction;
A via pad formed on at least one main surface of the insulating substrate so as to cover the opening of the through hole;
A connection pad disposed on the at least one main surface of the insulating substrate and spaced apart from the via pad;
Wiring for electrically connecting the via pad and the connection pad;
In a wiring board comprising
A measurement pad for measuring a resistance value with a width larger than the width of the wiring so as to be electrically connected to the wiring between the via pad and the connection pad ;
A resistor disposed between the measurement pad and the via pad so as to be in contact with the measurement pad;
The via pad, the connection pad, the wiring, the measurement pad, and the resistor are present in the same main surface of the insulating substrate,
The present invention relates to a wiring board (first wiring board), wherein probe pins are connected to the connection pads .

The present invention also provides:
A step of preparing an insulating substrate in which through holes are formed in the thickness direction;
Forming a via pad on at least one main surface of the insulating substrate so as to cover the opening of the through hole; and
Forming a connection pad on the at least one main surface of the insulating substrate so as to be spaced apart from the via pad;
Forming a wiring electrically connecting the via pad and the connection pad on the at least one main surface of the insulating substrate ;
Forming a measurement pad for measuring a resistance value, which is disposed between the via pad and the connection pad so as to be in electrical contact with the wiring and is larger than a width of the wiring;
Forming a resistor disposed in contact with the measurement pad between the measurement pad and the via pad;
It is related with the manufacturing method (1st manufacturing method) of a wiring board characterized by comprising.

  In the first wiring board and the first manufacturing method, in addition to the via pad, the connection pad and the wiring constituting the conventional (for measurement) wiring board, a resistance value measurement having a width larger than the wiring width is separately provided. Pads are provided. The via pad electrically connects a wiring formed on both main surfaces of the insulating substrate or a wiring and an external terminal, and its deformation greatly changes the wiring resistance of the entire wiring substrate. In addition to giving, it may cause disconnection. Further, the connection pads are directly used for the electrical characteristic evaluation of the semiconductor wafer by attaching probe pins, and the deformation thereof greatly changes the characteristic evaluation.

  As described above, the via pad and the connection pad are extremely important components for the wiring board for measurement, and deformation thereof should be avoided as much as possible.

  On the other hand, the resistance value measuring pad is a pad provided incidentally to measure the wiring resistance of the wiring board. Therefore, even a slight deformation does not affect the wiring resistance or the like of the entire wiring board, and does not affect the electrical characteristics evaluation of the actual semiconductor wafer. Therefore, by measuring the wiring resistance of the wiring board by bringing a measurement probe into contact with the resistance value measuring pad, the wiring can be obtained without causing the problems associated with the deformation of the via pad and the deformation of the connection pad. The wiring resistance of the substrate can be measured.

In the present invention, a resistor is provided between the measurement pad and the via pad so as to be in contact with the measurement pad.

When simultaneously measuring the electrical characteristics of a plurality of semiconductor elements formed on a semiconductor wafer using an electrical characteristics measurement wiring board, the electrical characteristics are within a preset range (voltage and current ranges). It is necessary to. Therefore, the resistance value of the wiring board for measurement, particularly the resistance value of the wiring actually used for measurement, must be set to a predetermined value. Therefore, there is a case where a resistor is interposed in the middle of the wiring so that the wiring resistance of the wiring board becomes a desired value.

  In such a case, in this embodiment, since the measurement pad is provided so as to be in contact with the resistor, the resistance value of the resistor via the measurement pad, or the wiring resistance of the entire wiring board Can be carried out without causing the problems associated with the deformation of the via pad and the deformation of the connection pad.

The present invention also provides:
An insulating substrate having through holes formed in the thickness direction;
A via pad formed on at least one main surface of the insulating substrate so as to cover the opening of the through hole;
On the at least one main surface of the insulating substrate, a connection pad disposed apart from the via pad;
Wiring for electrically connecting the via pad and the connection pad;
A wiring board characterized by comprising:
The connection pad and the resistance value measuring pad are integrated.
The present invention relates to a wiring board (second wiring board).

Furthermore, the present invention provides
A step of preparing an insulating substrate in which through holes are formed in the thickness direction;
Forming a via pad on at least one main surface of the insulating substrate so as to cover the opening of the through hole; and
Forming a connection pad in which a measurement region is defined so as to be spaced apart from the via pad on the at least one main surface of the insulating substrate;
Forming a wiring for electrically connecting the via pad and the connection pad;
It is related with the manufacturing method (2nd manufacturing method) of a wiring board characterized by comprising.

  In the second wiring board and the second manufacturing method, a part of the connection pad is used as a resistance value measurement pad, and so to speak, the connection pad and the resistance value measurement pad are integrated. This resistance value measuring pad is also a pad provided incidentally in order to measure the wiring resistance in the wiring board.

  Therefore, even a slight deformation does not affect the wiring resistance or the like of the entire wiring board, and does not affect the electrical characteristics evaluation of the actual semiconductor wafer. Therefore, by measuring the wiring resistance of the wiring board by bringing a measurement probe into contact with the resistance value measuring pad, the wiring can be obtained without causing the above-described problems associated with breakage of the via pad or deformation of the connection pad. The wiring resistance of the substrate can be measured.

  Further, since the wiring resistance is measured by bringing a measurement probe into contact with the resistance value measuring pad and the via pad, the resistance value of the entire wiring between the via pad and the connection pad can be measured almost accurately. .

  As described above, according to the present invention, in a so-called electrical characteristic measurement wiring board capable of simultaneously measuring the electrical characteristics of a plurality of semiconductor elements formed on a semiconductor wafer, the resistance value is set as described above. Accurate measurement can be performed without damaging the wiring board.

  The details of the present invention as well as other features and advantages are described below.

(First embodiment)
FIG. 1 is a plan view showing a schematic configuration of a wiring board according to the first embodiment, and FIGS. 2 and 3 are a cross-sectional view and a side view showing an enlarged region A of the wiring board shown in FIG. is there. 4 to 6 are enlarged configuration diagrams showing via pads, connection pads, and wiring regions formed on one main surface of the wiring board shown in FIG. In addition, in FIGS. 1-6, in order to clarify the characteristic of this aspect, it may differ from an actual structure. In particular, in FIGS. 4 to 6, the configuration is simplified to clarify the features of this aspect.

  As shown in FIGS. 1 to 3, the wiring substrate 10 according to this aspect includes an insulating substrate 11, a via pad 12 formed on the main surface 11 </ b> A of the insulating substrate 11, and a connection disposed separately from the via pad 12. A pad 13 and a wiring 14 for connecting the via pad 12 and the connection pad 13 are provided. A through hole 11B is formed in the insulating substrate 11, and the via pad 12 is formed so as to cover the opening of the through hole 11B. In addition, a measurement pad 15 for measuring a resistance value is formed between the via pad 12 and the connection pad 13 so as to be in electrical contact with the wiring 14.

  An interlayer connector (not shown) is formed in the through hole 11B, and is electrically connected to an external terminal (not shown) formed on the main surface opposite to the main surface 11A.

  The measurement pad 15 is a characteristic component of this aspect and will be described in detail below.

  Since the size of the connection pad 13 is smaller than the size of the via pad 12, the connection pad 13 is arranged in an integrated manner.

The insulating substrate 11 can be made of various ceramics such as alumina (Al ₂ O ₃ ) ceramics, mullite (3Al ₂ O ₃ .2SiO ₂ ) ceramics, aluminum nitride (AlN) ceramics, and glass ceramics. When a ceramic substrate is used, high rigidity can be imparted to the insulating substrate 11, so that when the electrical characteristics of the semiconductor wafer (a plurality of semiconductor elements formed thereon) are later measured, It is possible to prevent the probe pins formed in step S from sinking into the insulating substrate 11 and causing poor connection. Moreover, mass production becomes easy by using a ceramic substrate.

  However, the insulating substrate 11 is not only the ceramic substrate described above, but also tetrafluoroethylene resin (polytetrafluoroethylene; PTFE), tetrafluoroethylene / ethylene copolymer resin (tetrafluoroethylene-ethylene copolymer resin; ETFE), Substrates made of fluororesin such as tetrafluoroethylene / perfluoroalkoxyethylene copolymer resin (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin; PFA), substrates made of glass epoxy resin, substrates made of resin such as polyimide, etc. But you can.

  The thickness of the insulating substrate 11 is not particularly limited, but is about 0.1 mm to 10.0 mm.

  The via pad 12, the connection pad 13, the wiring 14 and the measurement pad 15 are formed by a thin film formation method, a metallization method using a printing paste, a method of patterning by etching a metal foil, a method of transferring a patterned metal foil, or a plating method. Etc. can be formed. Usually, the via pad 12 to the measurement pad 15 are formed in the same process.

  In the case of plating, for example, a sputtering method is used to form a Ti / Cu film having a thickness of about 0.1 μm on the main surface 11A of the insulating substrate 11, then a resist is formed, and a Cu / Ni film is formed by electrolytic plating. After the resist stripping and plating film stack is etched in the thickness direction to form a ridge shape, a Ni / Au film is formed by electrolytic plating (overplating) on the obtained ridge shape stack. can do.

  Note that the size and line width of the via pad 12, the connection pad 13, the wiring 14, and the measurement pad 15 are implemented by controlling the pattern width of the resist.

  Next, the measurement pad 15 will be described. FIG. 4 is a configuration diagram showing an arrangement example of the measurement pads 15. In the example shown in FIG. 4, a case where one measurement pad 15 is formed between the via pad 12 and the connection pad 13 is shown. The measurement pad 15 is provided for measuring the resistance of the wiring 14. Further, in order to facilitate the measurement, the diameter (width) is made larger than the line width of the wiring 14 as is apparent from the drawing. The width of the measurement pad 15 means the width of the conductor portion of the measurement pad 15 that is substantially parallel to the width direction of the wiring 14.

  When the resistance of the wiring 14 is measured between the via pad 12 and the measurement pad 15, the resistance of the wiring 14 is extended over a longer distance by arranging the measurement pad 15 as close as possible to the connection pad 13. The resistance value close to the resistance of the wiring 14 itself can be obtained. Further, when the resistance of the wiring 14 is measured between the connection pad 13 and the measurement pad 15, the resistance of the wiring 14 is made longer by arranging the measurement pad 15 as close as possible to the via pad 12. The resistance value close to the resistance of the wiring 14 itself can be obtained.

  Since the connection pad 13 is generally narrower than the via pad 12, when the single measurement pad 15 is provided as shown in FIG. The resistance of the wiring 14 is measured with respect to the pad 15 for use.

  The via pad 12 is for electrically connecting wirings and external terminals formed on both main surfaces of the insulating substrate 11, and its deformation greatly changes the overall wiring resistance of the wiring substrate 10. In addition to the occurrence of disconnection, it may cause disconnection or the like. Further, the connection pad 13 is directly used for the electrical characteristic evaluation of the semiconductor wafer by attaching the probe pin, and its deformation greatly changes the characteristic evaluation.

  As described above, the via pad 12 and the connection pad 13 are extremely important components for the wiring board 10 for measurement, and deformation thereof should be avoided as much as possible.

  On the other hand, the measurement pad 15 is a pad provided incidentally in the wiring substrate 10 in order to measure the wiring resistance. Therefore, even a slight deformation does not have any influence on the wiring resistance or the like of the entire wiring board 10, and does not have any influence on the actual electrical characteristic evaluation of the semiconductor wafer. Therefore, by measuring the wiring resistance of the wiring board 10 by bringing the measuring probe into contact with the measuring pad 15, the wiring board can be obtained without causing the problems associated with the deformation of the via pad 12 and the deformation of the connection pad 13 described above. Ten wiring resistances can be measured.

  However, in the embodiment as shown in FIG. 4, only one measurement pad 15 is provided, and when the resistance of the actual wiring 14 is measured, the via pad 12 or the like must also be used. Therefore, preferably, as shown in FIG. 5, two measurement pads 15 are provided between the via pad 12 and the connection pad 13. In this case, when measuring the resistance of the wiring 14, the measurement probe is brought into contact with the two measurement pads 15.

  Therefore, the resistance of the wiring 14 can be measured over a longer distance by bringing one measurement pad 15 as close as possible to the via pad 12 and making the other measurement pad 15 as close as possible to the connection pad 13. In addition, a resistance value close to the resistance of the wiring 14 itself can be obtained.

  In order to measure the resistance of the wiring 14 more accurately even when the above requirements are not necessarily satisfied, the distance A between the two measurement pads 15 is set to the measurement pad 15 and the via pad 12 located on the left side. And the distance C between the measurement pad 15 located on the right side and the connection pad 13 is preferably larger.

  In FIG. 5, the number of measurement pads 15 is two, but can be three or more as necessary.

  4 and 5, the shape of the measurement pad 15 is circular, but it may be octagonal as shown in FIG. Such a measurement pad 15 having a polygonal shape as shown in FIG. 6 is excellent in high frequency characteristics. That is, if the measurement pad 15 is circular, a reflected wave is generated when a high frequency is incident on the measurement pad 15, thereby causing the impedance of the entire wiring board 10, that is, the resistance value to deviate from the initial set value. May end up.

  Therefore, when the electrical characteristics of the semiconductor wafer are measured using the wiring substrate 10, there may be a problem that the electrical characteristics change depending on the frequency used. However, such a problem can be avoided by making the shape of the measurement pad 15 polygonal.

  In addition, by making the measurement pad 15 polygonal, it becomes easy to distinguish from the via pad 12 and / or the connection pad 13 having a circular shape.

  In addition, the polygonal shape in this example means a thing more than a pentagon.

(Second Embodiment)
7 and 8 are schematic configuration diagrams of the wiring board in the second embodiment, and are formed on one main surface of the wiring board shown in FIG. 1 corresponding to FIGS. 4 to 6 in the first embodiment. It is a block diagram which expands and shows the area | region of the performed via pad, the connection pad, and wiring. 7 and 8 are illustrated with a simplified configuration in order to clarify the features of this aspect.

  In the example shown in FIG. 7, a resistor 17 is provided between the via pad 12 and the connection pad 13, and one measurement pad 15 is formed so as to be in contact with the resistor 17. In this embodiment, the resistor 17 is connected to the wiring 14 so that the resistance value of the wiring 14 including the resistor 17, that is, the resistance value of the wiring substrate 10 becomes a desired value. When the electrical characteristics of a plurality of semiconductor elements formed on the wafer are measured, the electrical characteristics are set within a preset range (voltage and current ranges).

  Therefore, in the example shown in FIG. 7, the resistance of the wiring 14 including the resistor 17 is measured by bringing the measurement probe into contact with the measurement pad 15 and the via pad 12. At this time, since the resistance value of the wiring 14 is sufficiently smaller than the resistance value of the resistor 17, the resistance value of the resistor 17 can be substantially measured by the above-described measurement.

  Further, since the resistor 17 constitutes the wiring of the wiring board 10, the resistance value measurement of the resistor 17 substantially measures the wiring resistance of the wiring board 10.

  In the example shown in FIG. 8, a resistor 17 is provided between the via pad 12 and the connection pad 13, and two measurement pads 15 are formed so as to be in contact with both side surfaces of the resistor 17. Therefore, in the example illustrated in FIG. 8, the resistance value of the resistor 17 can be directly measured by bringing the measurement probe into contact with the two measurement pads 15. As described above, since the resistor 17 constitutes the wiring of the wiring substrate 10, the resistance value measurement of the resistor 17 substantially measures the wiring resistance of the wiring substrate 10.

  The characteristics required for the insulating substrate 11 and other via pads 12 are the same as those in the first embodiment.

(Third embodiment)
9 and 10 are schematic configuration diagrams of the wiring board according to the third embodiment. The wiring board is formed on one main surface of the wiring board shown in FIG. 1 corresponding to FIGS. 4 to 6 in the first embodiment. It is a block diagram which expands and shows the area | region of the made via pad, the connection pad, and the wiring. 9 and 10 are illustrated with a simplified configuration in order to clarify the features of this aspect.

  In the example shown in FIG. 9, the via pad 12 and the connection pad 13 are electrically connected by the wiring 14, and the resistance measurement pad 15 is integrally formed with the connection pad 13. The resistance value measurement pad 15 is a pad provided incidentally in the wiring board 10 in order to measure the wiring resistance.

  Therefore, even a slight deformation does not have any influence on the wiring resistance or the like of the entire wiring board 10, and does not have any influence on the actual electrical characteristic evaluation of the semiconductor wafer. Therefore, by measuring the wiring resistance of the wiring board by bringing the measurement probe into contact with the resistance value measuring pad 15, the wiring board can be obtained without causing the above-described problems associated with damage to the via pad or deformation of the connection pad. Ten wiring resistances can be measured.

  Further, by performing measurement by bringing a measurement probe into contact with the resistance value measurement pad 15 and the via pad 12, the resistance value of the entire wiring 14 between the via pad 12 and the connection pad 13 can be measured almost accurately. .

  In the example shown in FIG. 10, the side of the resistance value measurement pad 15 integrated with the connection pad 13 that comes into contact with the wiring 14 is narrowed in a tapered shape toward the via pad 12. Even in this case, the wiring board 10 has excellent high-frequency characteristics. That is, when the measurement pad 15 is narrowed toward the via pad 12 in a tapered manner, generation of a reflected wave is suppressed when a high frequency is incident on the measurement pad 15. Therefore, the impedance of the entire wiring board 10, that is, the resistance value does not deviate from the initially set value.

  The characteristics required for the insulating substrate 11 and other via pads 12 are the same as those in the first embodiment.

(Fourth embodiment)
In order to use the wiring board 10 described in the first to third embodiments as an actual electrical characteristic measurement wiring board (IC electrical characteristic inspection wiring board), probe pins are connected to the connection pads 13. It is formed so as to extend upward. For example, as shown in FIG. 11 which is an enlarged cross-sectional view corresponding to FIG. 2, the probe pin 18 extending upward is formed on the connection pad 13. Then, the electrical characteristics of the semiconductor element are evaluated by bringing the probe pin 18 into contact with the semiconductor element on the semiconductor wafer to be measured and applying a predetermined voltage and current.

  The present invention has been described in detail with specific examples. However, the present invention is not limited to the above contents, and various modifications and changes can be made without departing from the scope of the present invention.

It is a top view which shows schematic structure of the wiring board in 1st Embodiment. It is sectional drawing which expands and shows the part of the area | region A of the wiring board shown in FIG. It is a side view which expands and shows the part of the area | region A of the wiring board shown in FIG. FIG. 2 is an enlarged configuration diagram illustrating a via pad, a connection pad, and a wiring region formed on one main surface of the wiring board illustrated in FIG. 1. Similarly, it is the block diagram which expands and shows the area | region of the via pad, connection pad, and wiring which were formed on one main surface of the wiring board shown in FIG. Similarly, it is the block diagram which expands and shows the area | region of the via pad, connection pad, and wiring which were formed on one main surface of the wiring board shown in FIG. It is a schematic block diagram of the wiring board in 2nd Embodiment. Similarly, it is a schematic block diagram of the wiring board in 2nd Embodiment. It is a schematic block diagram of the wiring board in 3rd Embodiment. Similarly, it is a schematic block diagram of the wiring board in 3rd Embodiment. It is a schematic sectional drawing of the wiring board in 4th Embodiment.

Explanation of symbols

11 Insulating Substrate 12 Via Pad 13 Connection Pad 14 Wiring 15 (Resistance Value) Measurement Pad 17 Resistor 18 Probe Pin

Claims (7)

An insulating substrate having through holes formed in the thickness direction;
A via pad formed on at least one main surface of the insulating substrate so as to cover the opening of the through hole;
A connection pad disposed on the at least one main surface of the insulating substrate and spaced apart from the via pad;
Wiring for electrically connecting the via pad and the connection pad;
In a wiring board comprising
A measurement pad for measuring a resistance value with a width larger than the width of the wiring so as to be electrically connected to the wiring between the via pad and the connection pad ;
A resistor disposed between the measurement pad and the via pad so as to be in contact with the measurement pad;
The via pad, the connection pad, the wiring, the measurement pad, and the resistor are present in the same main surface of the insulating substrate,
A wiring board, wherein a probe pin is connected to the connection pad .   The wiring board according to claim 1, wherein two or more measurement pads are provided between the via pad and the connection pad.   The wiring board according to claim 2, wherein a distance between the measurement pads is larger than a distance between the measurement pad and the via pad and a distance between the measurement pad and the connection pad. 4. The wiring board according to claim 2, wherein the resistor is disposed between the two or more measurement pads so as to be in contact with the measurement pads.   The wiring board according to claim 1, wherein the measurement pad is a pentagon or more polygon. The wiring board according to any one of claims 1 to 5 ,
Probe pins electrically connected to the connection pads of the wiring board;
A circuit board for testing IC electrical characteristics, comprising: A step of preparing an insulating substrate in which through holes are formed in the thickness direction;
Forming a via pad on at least one main surface of the insulating substrate so as to cover the opening of the through hole; and
Forming a connection pad on the at least one main surface of the insulating substrate so as to be spaced apart from the via pad;
Forming a wiring electrically connecting the via pad and the connection pad on the at least one main surface of the insulating substrate ;
Forming a measurement pad for measuring a resistance value, which is disposed between the via pad and the connection pad so as to be in electrical contact with the wiring and is larger than a width of the wiring;
Forming a resistor disposed in contact with the measurement pad between the measurement pad and the via pad;
A method of manufacturing a wiring board, comprising:

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