JP5328281B2 - Manufacturing method of multilayer printed wiring board and multilayer printed wiring board obtained by using the method - Google Patents

Description

  The present invention relates to a method for producing a multilayer printed wiring board and a multilayer printed wiring board obtained by using the method.

  In recent years, portable electronic devices are required to have smaller batteries for the purpose of weight reduction. Moreover, even if the battery is downsized, low power consumption is indispensable in order to maintain a conventional battery life in units of equipment. Therefore, it is required for active elements such as LSIs incorporated in electronic devices to ensure operation reliability under a low voltage. As a result of improving the operation reliability under low voltage while satisfying these requirements, the multilayer printed wiring board as an interposer that mounts LSI etc. can reduce the interlayer insulation thickness and further reduce weight An attempt is being made.

  Therefore, a method of using a multilayer flexible printed wiring board obtained by forming a wiring on a flexible copper-clad laminate and then multilayering it as an interposer has been studied. However, in the flexible multilayer printed wiring board, it is difficult to reduce the total thickness of the base film and the adhesive layer to the target minimum required insulating layer thickness. Therefore, a method for manufacturing a multilayer printed wiring board in recent years includes a manufacturing method using a coreless buildup method in which insulating resin layers and conductor layers made of only a polymer material are alternately stacked without using a so-called core substrate. It has been adopted.

  For example, in Patent Document 1, a manufacturing method capable of easily obtaining a wiring substrate that does not have a core substrate and in which dielectric layers and conductor layers made of a polymer material are alternately laminated, and the manufacturing method can be obtained thereby. A wiring board is disclosed. Specifically, a multilayer printed wiring board structure in which a metal foil adhesion body in which two metal foils are separably adhered to each other on a support substrate is laminated, and dielectrics and conductor layers are alternately formed on the exposed metal foil. (Build-up wiring layer) is formed, and finally cut at the position where the two metal foils overlap to be separated between the metal foils to obtain a multilayer printed wiring board. And according to embodiment, the example which uses a glass epoxy board | substrate is described, It is the technique which uses a rigid board | substrate for a support substrate.

  Patent Document 2 discloses a method of manufacturing a wiring board that forms a build-up wiring layer in a state where it can be peeled off from a temporary board, and can be manufactured reliably and at low cost without causing any problems. ing. Specifically, a base layer is arranged in the wiring formation region on the prepreg, a metal foil larger than the base layer is placed so as to be in contact with the outer periphery of the wiring formation region, and the temporary substrate is heated and pressed. Creating. Thereafter, a build-up wiring layer is formed on the metal foil on the temporary substrate, and a peripheral member of the base layer of the structure is cut to obtain a wiring member having the build-up wiring layer formed on the metal foil. Yes. And if the description of Claim 3 of patent document 2 is seen, it can be understood that it is a technique on the assumption that a prepreg obtained by impregnating a resin into a glass nonwoven fabric and a rigid substrate is used as a temporary substrate.

JP 2005-79107 A JP 2007-158174 A

  However, after adopting the manufacturing method using the coreless buildup method disclosed in Patent Document 1 and Patent Document 2, the buildup wiring layer is formed on the support substrate of Patent Document 1 or the temporary substrate of Patent Document 2. Both substrates cannot be taken out as a multilayer printed wiring board manufacturing laminate unless their substrate ends are cut. That is, in the production of printed wiring boards, it is not preferable in view of increasing the board yield efficiency that affects production yield and production efficiency. Further, the end material generated when the end portion of the substrate is cut cannot be recycled and reused, and the manufacturing method simply generates a large amount of waste.

Here, the manufacturing process of the multilayer printed wiring board using the coreless buildup method described in Patent Document 2 will be described with reference to FIGS. As shown in FIG. 4A, on the surface of the insulating layer constituting material 4, a small copper foil 2S and a large copper foil 2L that is one size larger are arranged so as to cover the small copper foil 2S. And the laminated body shown in FIG.4 (b) is obtained by pressing. And the insulating layer 4 and the multilayer wiring circuit 6 are laminated | stacked on the large sized copper foil 2L by the buildup method, and it is set as the laminated body shown in FIG.5 (c). After that, the end portion is cut at the cutting line Cp shown in FIG. 5C, and the multilayer copper-clad shown in FIG. 5D is peeled off between the small copper foil 2S and the large copper foil 2L. The laminated plate 1 is obtained. Thereafter, the outer layer copper foil portion of the multilayer copper clad laminate 1 is etched to obtain a multilayer printed wiring board.

  As can be understood from the above, in the method of manufacturing a multilayer printed wiring board by the coreless buildup method, there is no need to increase raw material costs, and multilayer copper-clad for manufacturing a multilayer printed wiring board having a stable quality wiring layer is provided. In order to be able to manufacture a laminated board and prevent waste of resources, there has been a demand for a manufacturing method that generates less waste.

  Accordingly, as a result of earnest research, the present inventors have come up with the following multilayer printed wiring board manufacturing method and multilayer printed wiring board obtained by using the method.

Manufacturing method of multilayer printed wiring board: The manufacturing method of the multilayer printed wiring board according to the present invention is a method of manufacturing a multilayer printed wiring board by a coreless buildup method using a support substrate , and includes the following steps: It is characterized by.

Support substrate creation step: Surface having an organic anticorrosive coating on the surface of the copper foil using a base copper foil having an organic anticorrosive coating on the surface of the copper foil and an organic anticorrosive coating on the surface of the copper foil Is bonded to a semi-cured insulating layer constituting material to obtain a support substrate composed of the base copper foil and the insulating layer .
Build-up wiring layer forming step: A build-up wiring layer is formed on the surface of the base copper foil of the support substrate to obtain a support substrate with a build-up wiring layer.
Support substrate separation step with build-up wiring layer: The support copper substrate with build-up wiring layer is separated from the base copper foil and the insulating layer at the interface between the insulating layer of the support substrate and the organic anticorrosive coating, A copper clad laminate is obtained.
Multilayer printed wiring board forming step: Necessary processing is performed on the multilayer copper-clad laminate to obtain a multilayer printed wiring board.

  In the method for manufacturing a multilayer printed wiring board according to the present invention, the base copper foil manufacturing step is one or more selected from a nitrogen-containing organic compound, a sulfur-containing organic compound, and a carboxylic acid for organic rust prevention treatment. It is preferable to use an organic rust preventive.

The method for manufacturing a multilayer printed wiring board according to the present invention, the base copper foil manufacturing process, the base surface of a copper foil, an organic rust of mass conversion thickness thickness of 1mg / m ² ~100mg / m ² It is preferable to form an agent film .

  In the method for manufacturing a multilayer printed wiring board according to the present invention, it is preferable that the support substrate creation step is a support substrate having an adhesion strength of the base copper foil from the support of 1 gf / cm to 100 gf / cm.

In the support substrate making step of the method for producing a multilayer printed wiring board according to the present invention, the surface of the base copper foil provided with the organic anticorrosive coating and the insulating layer constituting material , compared with the size of the base copper foil It is also preferable to obtain a support substrate composed of the base copper foil / release film / insulating layer by laminating with a release film having a small size .

Multilayer printed wiring board according to the present invention: The multilayer printed wiring board according to the present invention is obtained by using the above-described method for producing a multilayer printed wiring board according to the present invention.

By using the method for manufacturing a multilayer printed wiring board according to the present invention, when manufacturing a multilayer copper-clad laminate by a build- up method, cutting the edge of the substrate when removing the insulating resin layer constituting the support substrate Is no longer necessary. As a result, when a multilayer copper-clad laminate is manufactured by the build-up method to which the present invention is applied, the plate cutting efficiency is increased, the production yield and the production efficiency are improved, and the amount of waste generated is reduced.

  Hereinafter, embodiments of a method for manufacturing a multilayer printed wiring board according to the present invention will be described.

Manufacturing method of multilayer printed wiring board: The manufacturing method of a multilayer printed wiring board according to the present invention is a method of manufacturing a multilayer printed wiring board by a coreless buildup method using a support substrate . Hereinafter, each step will be described.

Support substrate creation step: In this support substrate creation step, an organic rust preventive treatment is applied to the surface of the copper foil, and a base copper foil provided with an organic rust preventive coating on the surface of the copper foil is used. First, the base copper foil production of this base copper foil will be described. That is, as shown in FIG. 1 (A), a copper foil 2 is prepared, and the surface of the copper foil 2 is subjected to an organic rust prevention treatment. As shown in FIG. 1 (B), the surface of the copper foil 2 is applied. Base copper foil 2B provided with organic rust preventive coating 3 is obtained. In FIG. 1 (B), a form in which the organic rust preventive film 3 is provided on one side of the copper foil 2 is displayed, but the organic rust preventive film 3 is provided on both sides of the copper foil 2. I do not care.

  First, the copper foil referred to here will be described. The copper foil can be either an electrolytic copper foil produced by an electrolytic method or a rolled copper foil produced by a rolling method, and there is no limitation on the production method. Moreover, there is no special limitation regarding the thickness of the copper foil to be used. However, considering the ability to form a circuit when the layer formed of the copper foil is finally completely removed by etching or a fine fine pitch circuit is formed, it is preferable to use a thin copper foil. Further, it does not matter whether or not the surface of the copper foil is roughened. However, the smoother the bonding surface of the copper foil with the insulating layer constituent material, the resin layer and the copper constituting the support substrate. The adhesion strength at the time of separation at the interface with the foil layer is decreased, and separation is facilitated, which is preferable.

This organic rust preventive coating 3 is formed by mixing one or more selected from nitrogen-containing organic compounds, sulfur-containing organic compounds and carboxylic acids that function as organic rust preventives. It is preferable that Hereinafter, each compound will be described.

The nitrogen-containing organic compound as the organic rust preventive includes a nitrogen-containing organic compound having a substituent, and is referred to as 1,2,3-benzotriazole (hereinafter referred to as “BTA”) which is a triazole compound having a substituent. ), Carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H-1,2,4-triazole and 3-amino-1H-1,2,4-triazole, imidazole, etc. It is preferable.

It is preferable to use mercaptobenzothiazole, thiocyanuric acid, 2-benzimidazolethiol and the like as the sulfur-containing organic compound as the organic rust preventive.

  As the carboxylic acid as the organic rust preventive agent, it is particularly preferable to use a monocarboxylic acid, and it is particularly preferable to use oleic acid, linoleic acid, linolenic acid, or the like.

An organic rust preventive film is formed on the surface of the copper foil using the above organic rust preventive. At this time, the organic rust preventive film is formed by dissolving the above-described organic rust preventive in a solvent such as water or an organic solvent, and immersing the copper foil in the solution, or treating the solution with the organic rust preventive treatment layer. Methods such as showering, spraying, and dropping can be used on the copper foil surface to be formed, and there is no need to consider a particularly limited method as long as the solution and the copper foil surface can be sufficiently contacted. .

The concentration of the organic rust inhibitor in the solvent containing the organic rust inhibitor at this time is not particularly limited, and there is no problem even if the concentration is originally high or low. Because, considering the formation principle of the organic anticorrosive treatment layer, the organic anticorrosive adsorbs to the copper oxide on the surface of the copper foil, which is a metal, and from the adsorbed state, oxygen etc. present in the surface layer The organic rust preventive agent is stably present due to binding with the binder. That is, it is because it is thought that the monomolecular film of the organic rust preventive agent should cover the copper foil surface as a minimum.

  However, the higher the concentration of the organic rust inhibitor in the solvent, the faster the organic rust inhibitor is adsorbed on the copper foil surface. Naturally, an organic rust inhibitor treatment layer is formed on the copper foil surface. In consideration of the speed of the continuous production line (contact time: 5 to 60 seconds), the concentration of the organic rust inhibitor in the solvent is 0.01 g / l to 10 g / l, and the liquid temperature is 20 ° C. to 60 ° C. It is preferable to adopt the range.

Here, when the organic rust inhibitor concentration is less than 0.01 g / l, it is difficult to adsorb the organic rust inhibitor to the copper foil surface in a short time, and the organic rust preventive coating film to be formed The thickness varies, and the peeling stability at the interface between the insulating layer after pressing (the layer in which the insulating layer constituent material is cured) and the organic anticorrosive coating becomes unstable. On the other hand, even if the organic rust inhibitor concentration exceeds 10 g / l, the adsorption rate of the organic rust inhibitor on the copper foil surface is not particularly increased, which is not preferable from the viewpoint of production cost.

By using the rust preventive agent described above, it is easy to control the amount of adsorption in the sense of controlling the thickness of the organic rust preventive coating, and the adhesion strength between the insulating layer and the copper foil can be kept within a certain range. It becomes possible. As a result, the separation stability at the interface between the insulating layer (the layer in which the insulating layer constituent material is cured) and the organic rust preventive film is improved.

Therefore, the thickness of the formed organic rust preventive film, in other words, the amount of the organic rust preventive agent present on the copper foil surface is important. That is, it is preferable that the thickness of the organic antirust treatment film on the surface of the copper foil is in the range of 1 nm to 1 μm. Within the thickness range of the organic rust-proof coating, it is possible to ensure an appropriate peeled state at the interface between the build- up laminated insulating layer (layer in which the insulating layer constituent material is cured) and the organic rust-proof coating. When the thickness of the organic rust preventive film is less than 1 nm, the thickness of the organic rust preventive film made of the organic rust preventive agent on the copper foil surface varies, and a uniform organic rust preventive film cannot be formed. On the other hand, even if the thickness of the organic rust-proof coating exceeds 1 μm, the peeled state at the interface between the insulating layer after build- up lamination (layer in which the insulating layer constituent material is cured) and the organic rust-proof coating It will not be better than that.

The thickness of this organic rust preventive film is very thin at the nm to μm level. Therefore, it is desirable to select and use an appropriate analysis method according to the type of organic rust preventive used for the measurement of the thickness. However, it is preferable to use a transmission electron microscope (TEM) or a chemical quantitative analysis method. In chemical quantitative analysis, the organic rust inhibitor present on the copper foil surface is dissolved in a predetermined solvent selected according to the type of organic rust inhibitor, and the solvent is quantitatively analyzed using liquid chromatography. Etc. It is also possible to convert the film thickness by the calibration curve method by combining the observation using this transmission electron microscope and the chemical quantitative analysis method. For example, when BTA is used as an organic rust preventive agent, the thickness of the organic rust preventive film by TEM observation using a sample prepared by FIB is in the range of 1 nm to 20 nm. mass thickness of the analysis in terms organic rust-proofing coating ^is correlated as in the range of ^{1mg / m 2 ~100mg / m 2} .

The organic rust preventive film described above is sufficient if it exists on the outermost surface of the copper foil. Therefore, an inorganic rust-proofing layer such as zinc or zinc alloy may be formed on the surface of the copper foil, and an organic rust-proofing film may be provided on the surface. The combined use of an inorganic rust-proofing layer and an organic rust-proofing coating dramatically improves the oxidation resistance performance of the copper foil surface and improves long-term storage performance, while at the same time being resistant to various chemicals used when forming build- up wiring layers. It is preferable because chemical performance is improved.

Then, as shown in FIG. 1 (C), the base substrate foil 2B and the insulating layer 4 are prepared by laminating the surface of the base copper foil 2B with the organic rust preventive coating 3 on the insulating layer constituting material 4, as shown in FIG. A support substrate 5 is obtained. There is no particular limitation on the bonding here, and it is possible to adopt normal manufacturing conditions for a copper-clad laminate depending on the type of insulating layer constituent material used. In addition, in this specification and drawing, it is the same in drawing, without distinguishing clearly the insulating layer constituent material of a semi-hardened state, and the insulating layer (layer which the insulating layer constituent material hardened | cured) after hardening by heating. (4) is used.

Moreover, in this FIG.1 (C), the case where the surface provided with the organic rust preventive coating 3 of the base copper foil 2B on one side of the insulating layer constituting material 4 is shown. However, by using two base copper foils 2B, both surfaces of the insulating layer constituting material 4 are bonded to the surfaces of the base copper foil 2B having the organic rust preventive coating 3 and the base copper foil 2B is formed on both surfaces of the support substrate 5. It is also possible to produce a support substrate with a double-sided build-up wiring layer by forming a build-up wiring layer on both sides.

And in this support substrate preparation process, it bonds together in the state which pinched | released the release film 11 between the surface provided with the organic rust preventive agent film 3 of the said base copper foil 2B, and the insulating layer structural material 4, and the said base copper foil 2B It is also preferable to obtain a support substrate 5 ′ composed of: / release film 11 / insulating layer 4. For example, as shown in FIG. 3 (i), a release film 11 having a size slightly smaller than the size of the base copper foil 2B is disposed on the surface of the insulating layer constituting material 4, and insulation is provided thereon. A base copper foil 2B having the same size as that of the layer constituent material 4 is placed on top of each other and pressed to obtain a laminate shown in FIG. 3 (ii). This laminated body is not bonded at all in the central portion where the release film 11 is disposed. However, in the edge part where the release film 11 does not exist, the base copper foil 2B and the insulating layer 4 are temporarily in close contact with each other. The support substrate 5 ′ shown in FIG. 3 (ii) can also be used in the same manner as the support substrate 5 shown in FIG. 1C. In addition, since the said release film 11 is recyclable, it is preferable also from a viewpoint of effective utilization of resources and environmental protection.

Build-up wiring layer forming step: In this step, a build-up wiring layer 10 is formed in which insulating layers 4 and wiring layers including inner layer circuits 6 are alternately stacked on the surface of the base copper foil 2B of the support substrate 5. Then, the support substrate 20 with the buildup wiring layer shown in FIG. The build- up method used in the present invention is not particularly limited, but a typical one will be described as an example. For example, a method of providing a layer of the insulating layer constituting material 4 on the surface of the base copper foil 2B of the support substrate 5 by a method of laminating a resin film, a method of applying a resin composition, or the like can be employed. When a resin film is used as the insulating layer constituting material 4, a metal foil typified by a copper foil is simultaneously bonded to the surface of the resin film by press working, and thereafter, interlayer conduction means 7 such as via holes as necessary. In combination with the formation, the metal foil is etched to form the inner layer circuit 6. Alternatively, only the resin film can be bonded to the surface of the base copper foil 2B of the support substrate 5, and the pattern of the inner layer circuit 6 can be formed on the surface by a semi-additive method.

  When the insulating layer constituting material 4 is formed by applying a resin composition, the resin composition is applied to the surface of the base copper foil 2B of the support substrate 5, dried, cured, and polished. After the work is performed, a drilling process is performed at a desired position of the cured resin layer in order to form interlayer conduction means 7 such as a via hole if necessary. After that, the conductive paste is filled in the hole of the perforated part, the conductor post is inserted and arranged in the hole, and then the circuit shape is formed with the conductive paste on the surface of the cured resin layer, or semi-additive For example, the inner layer circuit 6 may be directly formed by a method.

  By repeating the formation operation of the build-up wiring layer by the method described above as many times as necessary, the support substrate 20 with the build-up wiring layer exemplarily shown in FIG. 2D is obtained. At this stage, a solder resist 9 can be applied to the outer layer surface including the outer layer circuit 8 as necessary.

  In the initial stage of forming the build-up wiring layer, the surface of the base copper foil 2B constituting the support substrate 5 is covered with a plating resist or the like except for the part where the circuit is formed, to form the circuit. An outer layer circuit pattern made of gold, tin, nickel or the like may be formed in advance and used. By doing in this way, the support substrate with a build-up wiring layer in which the outer layer circuit shape on the one surface side is already incorporated is obtained.

In this step, the support substrate 20 with the buildup wiring layer is separated at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5, and FIG. obtaining a multilayer copper-clad laminate 1 shown in). In addition, the multilayer copper clad laminated board 1 said here says the laminated body of the state which the buildup wiring layer 10 and the base copper foil 2B of the support substrate 5 contact | adhered. At this time, the separation of the support substrate 5 at the interface between the base copper foil 2B and the insulating layer 4 can be performed by peeling off, and is possible because the base copper foil 2B includes the organic rust preventive film 3. Become.

When the support substrate 5 ′ shown in FIG. 3 (ii) is used, the separation work at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5 of the support substrate 20 with the buildup wiring layer is performed. Since only the edge region of the support substrate 20 with the buildup wiring layer is sufficient, the separation work is facilitated, which is preferable.

The adhesion strength at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5 is preferably in the range of 1 gf / cm to 100 gf / cm when measured according to JIS C6481. . The lower the adhesion strength, the easier the separation work. However, during this adhesion strength build- up lamination, there may be a deviation due to the press pressure at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5, and a good press molding process may not be performed. . On the other hand, if the adhesion strength exceeds 100 gf / cm, the separation work at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5 becomes difficult when the size of the multilayer copper-clad laminate 1 is increased. It is no longer an image that can be easily separated.

Multilayer printed wiring board forming step: This step is performed by separating the support substrate 5 at the interface between the base copper foil 2B and the insulating layer 4 and using the multilayer copper clad laminate 1 to process the desired multilayer printed wiring board. It is a process to do.

If an example of the processing method from a multilayer copper clad laminated board to a multilayer printed wiring board said here is given, for example in the case of the multilayer copper clad laminated board 1 shown in FIG.2 (E) , the copper foil layer in the outer layer 2 can be etched to form outer layer circuit wiring to obtain a multilayer printed wiring board. In the case of the multilayer copper clad laminate 1 shown in FIG. 2 (E) , the copper foil layer 2 on the outer layer can be completely removed by etching and used as it is as a multilayer printed wiring board. . Further, the copper foil layer 2 on the outer layer of the multilayer copper clad laminate 1 shown in FIG. 2 (E) is completely removed by etching, and a circuit shape is formed with a conductive paste on the surface of the exposed resin layer. It is also possible to form a multilayer printed wiring board by directly forming an outer layer circuit by a semi-additive method or the like. Those skilled in the art can easily think about these steps, and thus the description using the drawings is omitted.

By using the manufacturing method of the multilayer printed wiring board by the coreless buildup method according to the present invention described above, it is not necessary to cut the edge of the substrate after the press working. As a result, the boarding efficiency of the multilayer printed wiring board is increased, the production yield is improved, the production efficiency is improved, and the amount of waste generated is reduced.

Form of multilayer printed wiring board according to the present invention: The multilayer printed wiring board according to the present invention is obtained by using the above-described method for producing a multilayer printed wiring board according to the present invention. The multilayer printed wiring board here is not particularly limited with respect to the thickness of the insulating layer, the thickness of the copper foil used, the number of these layers, and the like. It is naturally possible to provide interlayer conduction means such as via holes in the layers of the multilayer printed wiring board.

The multilayer printed wiring board according to the present invention is obtained by using a multilayer copper-clad laminate produced by the coreless buildup method described above. This multilayer copper-clad laminate does not require cutting of the substrate end when separating from the support substrate. Therefore, at the stage of processing from this multilayer copper-clad laminate to a multilayer printed wiring board, there is no surface adhesion of foreign matter that obstructs the etching process, such as metal pieces and resin pieces, generated when the substrate edge is cut. As a result, the circuit formability by etching for circuit formation is excellent, the etching yield is improved, and a high quality multilayer printed wiring board can be obtained.

When the multilayer printed wiring board manufacturing method according to the present invention is used, even if the multilayer printed wiring board is manufactured by the build- up method, it is not necessary to cut the edge of the substrate when removing the insulating resin layer constituting the support substrate. become. As a result, the boarding efficiency of the multilayer printed wiring board is increased, the production yield and the production efficiency are improved, and the amount of waste generated is reduced.

It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the coreless buildup method which concerns on this invention. It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the coreless buildup method which concerns on this invention. It is a conceptual diagram for demonstrating the form of the support substrate used in the process of multilayer printed wiring board manufacture by the coreless buildup method concerning this invention. It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the conventional coreless buildup method. It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the conventional coreless buildup method.

1 multilayer copper clad laminate 2 copper foil 2B base copper foil 2S copper foil (small size)
2L copper foil (large size)
DESCRIPTION OF SYMBOLS 3 Organic rust preventive coating 4 Insulating layer constituent material, insulating layer 5 Support substrate 6 Inner layer circuit 7 Interlayer conduction means 8 Outer layer circuit 9 Solder resist 10 Buildup wiring layer 11 Release film 20 Support substrate Cp with buildup wiring layer Cutting line

Claims (6)

A method of manufacturing a multilayer printed wiring board by a coreless buildup method using a support substrate ,
The manufacturing method of the multilayer printed wiring board characterized by including the following processes.
Support substrate creation step: Surface having an organic anticorrosive coating on the surface of the copper foil using a base copper foil having an organic anticorrosive coating on the surface of the copper foil and an organic anticorrosive coating on the surface of the copper foil Is bonded to a semi-cured insulating layer constituting material to obtain a support substrate composed of the base copper foil and the insulating layer .
Build-up wiring layer forming step: A build-up wiring layer is formed on the surface of the base copper foil of the support substrate to obtain a support substrate with a build-up wiring layer.
Support substrate separation step with build-up wiring layer: The support copper substrate with build-up wiring layer is separated from the base copper foil and the insulating layer at the interface between the insulating layer of the support substrate and the organic anticorrosive coating, A copper clad laminate is obtained.
Multilayer printed wiring board forming step: Necessary processing is performed on the multilayer copper-clad laminate to obtain a multilayer printed wiring board. The said base copper foil manufacturing process uses the 1 type, or 2 or more types of organic rust preventive agent selected from a nitrogen-containing organic compound, a sulfur containing organic compound, and carboxylic acid for organic rust prevention processing. The manufacturing method of the multilayer printed wiring board as described in 2 .. The base copper foil manufacturing process, the base on the surface of the copper foil, according to claim 1 or claim mass conversion thickness and forms an organic rust coating thickness of 1mg / m ² ~100mg / m ² Item 3. A method for producing a multilayer printed wiring board according to Item 2. The multilayer according to any one of claims 1 to 3, wherein in the support substrate creation step, a support substrate having an adhesion strength of the base copper foil from the support of 1 gf / cm to 100 gf / cm is obtained. Manufacturing method of printed wiring board. In the support substrate creating step, a release film having a size smaller than the size of the base copper foil is sandwiched between the surface of the base copper foil provided with the organic anticorrosive agent coating and the insulating layer constituting material. The manufacturing method of the multilayer printed wiring board in any one of Claims 1-4 which obtains the support substrate comprised by bonding and the said base copper foil / release film / insulating layer . A multilayer printed wiring board obtained by using the method for producing a multilayer printed wiring board according to any one of claims 1 to 5.

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