JP5315607B2 - Light emitting device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device having the high adhesion of a coating member even in an extremely thin type and preventing a coating member from being peeled from a recess and a substrate. <P>SOLUTION: The light-emitting device 1 has a light-emitting element 10, a laminated substrate 20 having a placing region 29 placing the light-emitting element 10 on a top face 20b and the coating member 30 coating the light-emitting element 10 and the top face 20b of the laminated substrate 20. In the light-emitting device 1, trench sections 20a are formed on the top face 20b of the laminated substrate 20 while being adjoined to the placing region 29 of the light-emitting element 10, and the trench sections 20a are filled with the coating member 30. In the light-emitting device 1, the trench sections 20a have an engaging structure engaging the coating member 30 with the laminated substrate 20. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a light emitting device and a method for manufacturing the same, and more particularly, to a light emitting device light emitting device and a method for manufacturing the same.

2. Description of the Related Art A light-emitting device using a semiconductor light-emitting element is known in which a light-emitting element placed on a substrate is surrounded by a reflecting plate and a recess is formed by the reflecting plate and the substrate (see, for example, Patent Document 1). In this example, in order to make the amount of the covering member (for example, sealing resin) filled in the concave portion of the light emitting device constant, a groove is provided on the upper surface of the reflecting plate, and the sealing resin overflowing from the concave portion flows into the groove. I am doing so.
As a similar light emitting device, a device in which a concave portion is provided in a substrate, a light emitting element is first placed in the concave portion, and then a sealing resin is filled (for example, see Patent Document 2). This document discloses that a sealing resin is raised to function as a lens.
As another light emitting device, an extremely thin device suitable for a side view is also known (for example, see Patent Document 3). This light-emitting device is configured by mounting a light-emitting element on a substrate and raising a sealing resin thereon.
JP-A-8-32120 JP-A-5-29659 JP 2006-229055 A

  Since the sealing resin has a role of protecting the light emitting device from the external environment, if the sealing resin is peeled off from the inner wall of the recess or the substrate, moisture or the like reaches the light emitting element, and the quality of the light emitting element deteriorates. There is. Furthermore, if the sealing resin is completely removed, the light emitting element may be damaged. Therefore, suppressing peeling and dropping of the sealing resin is important in extending the life of the light emitting device.

  In the light emitting device of Patent Document 1, since the surface of the sealing resin is equal to the upper surface of the reflector, the sealing resin is unlikely to come into contact with the outside, and the possibility of causing peeling is low. However, as in Patent Document 2 and Patent Document 3, if the sealing resin protrudes from the recess or the substrate, it is easy to come into contact with the outside, and the sealing resin is likely to be peeled off or dropped off. In particular, in Patent Document 3, since the light-emitting device is extremely thin, the width of the contact surface between the substrate and the sealing resin is narrow, and the risk of the covering member peeling off due to an external impact is extremely high.

  Accordingly, an object of the present invention is to provide a light-emitting device that has high sealing resin adhesion and is difficult to peel off from a recess or a substrate even when the sealing resin is extremely thin. It is another object of the present invention to provide a manufacturing method suitable for mass production of light emitting devices in which a sealing resin is hardly peeled off from a recess or a substrate.

The light emitting device of the present invention is configured by laminating a light emitting element and a plurality of substrates, a laminated substrate having a placement region on the top surface for placing the light emitting element, and the light emitting element and the laminated substrate. A cover member covering the upper surface, wherein the upper surface of the multilayer substrate is provided with a bottomed groove portion adjacent to the placement region of the light emitting element, The member includes a first coating layer that covers the light emitting element, and a second coating layer that is disposed so as to cover the upper side of the first coating layer and fill the groove portion, and the groove portion includes the first coating layer. 2 having a locking structure for locking the covering layer to the laminated substrate;
Each of the plurality of substrates is formed of a material selected from the group consisting of alumina, aluminum nitride, silicon nitride, boron nitride, BT resin, and glass epoxy.

  When the covering member is filled in the groove portion, the contact area between the covering member and the groove portion is increased, and peeling of the covering member can be suppressed. Further, since the groove portion has a locking structure, the covering member can be reliably locked to the groove portion. Accordingly, the covering member can be reliably prevented from falling off not only in the conventional light emitting device having the concave portion but also in the light emitting device not having the concave portion.

The method for manufacturing a light-emitting device according to the present invention includes a light-emitting element, a multilayer substrate having a placement area for placing the light-emitting element on an upper surface, and a coating that covers the light-emitting element and the upper surface of the multilayer substrate. A groove portion is provided on the upper surface of the multilayer substrate adjacent to the placement region of the light emitting element, the groove member is filled with the covering member, and the covering member is connected to the multilayer substrate. A method of manufacturing a light emitting device capable of simultaneously forming a plurality of light emitting devices having a locking structure to be stopped,
(1) a step in a plurality of substrates are laminated to form a multilayer substrate having a groove portion that having a locking structure,
(2) placing a plurality of light emitting elements on the placement area adjacent to the groove on the top surface of the multilayer substrate;
(3) forming the covering member on the light emitting element and the upper surface of the laminated substrate;
(4) the cut of the laminated substrate in a longitudinal direction substantially vertical grooves, possess a step of singulating a plurality of light emitting devices, and
The covering member includes a first covering layer and a second covering layer;
Forming the covering member comprises:
Covering the light emitting element with the first covering layer;
Covering the upper surface of the first coating layer with the second coating layer, and filling the groove with the second coating layer,
The first coating layer is formed by line coating and is formed so as not to enter the groove due to surface tension .

  According to this manufacturing method, it is possible to easily manufacture a light emitting device having a groove having a complicated cross-sectional shape. In addition, a plurality of light emitting devices can be manufactured at the same time, which is suitable for mass production.

  Even if the light emitting device of the present invention is very thin, the covering member has high adhesion, and the covering member is unlikely to peel off from the recess or the substrate. In the manufacturing method of the present invention, a plurality of light emitting devices whose covering members are difficult to peel off from the recesses or the substrate can be manufactured simultaneously, which is suitable for mass production.

  Hereinafter, a light-emitting device and a manufacturing method thereof according to the present invention will be described with reference to embodiments and examples. However, the present invention is not limited to this embodiment and example.

<Embodiment 1>
The light emitting device 1 of the present invention shown in FIG. 1 includes a laminated substrate 20 in which four substrates are laminated, a light emitting element 10 placed on the upper surface 20b of the laminated substrate 20, and the upper surface 20b of the light emitting element 10 and the laminated substrate 20. And a covering member 30 that covers

The laminated substrate 20 is obtained by sequentially laminating a first substrate 21, a second substrate 22, a third substrate 23, and a fourth laminated substrate 24. The first substrate 21 has a narrower width than the other substrates, and a rectangular step is formed between the first substrate 21 and the second substrate 22. Each of the third substrate 23 and the fourth substrate 24 has a cut portion and communicates with each other to form a groove 20a. The groove portion 20 a is opened on the upper surface 20 b of the multilayer substrate 20. Since the second substrate 22 has no cut portion that communicates with the groove 20 a, the bottom of the groove 20 a becomes the upper surface of the second substrate 22.
Near the center of the upper surface 20b of the multilayer substrate 20 is a placement region 29 for the light emitting element 10, and a pair of upper surface substrates 51 are formed. In the present invention, the groove 20 a is disposed adjacent to the placement region 29.

  In the present invention, the groove portion 20 a has a locking structure for locking the covering member 30 to the laminated substrate 20. This locking structure is preferably a structure that prevents the covering member 30 from easily falling off the laminated substrate 20. For example, when the groove portion 20a having a constant width formed in a direction perpendicular to the upper surface 20b of the multilayer substrate 20 is used as the locking structure, the covering member 30 is less likely to drop off than when the groove portion 20a is not provided. However, it is considered that when the covering member 30 is pulled upward along the direction in which the groove 20a extends (that is, the direction perpendicular to the upper surface 20b of the laminated substrate 20), it is relatively easy to drop off. Therefore, in the present invention, by forming the groove 20a, not only the contact area between the laminated substrate 20 and the covering member 30 is simply increased to increase the bonding force, but the covering member 30 is attached to the laminated substrate 20 by mechanical means. By locking, the falling off of the covering member 30 is effectively suppressed.

In the present embodiment, the groove portion 20a is provided with a narrow portion 24a and a wide portion 23a, and the narrow portion 24a is positioned on the upper surface side 20b of the multilayer substrate 20 rather than the wide portion 23a, thereby forming a locking structure. ing. Thereby, the covering member 30 filled in the groove 21a is locked by the step between the wide portion 23a and the narrow portion 24a, and is not easily dropped by the pulling force toward the upper surface 20b of the laminated substrate 20.
In the example of FIG. 1, the narrow portion 24 a is formed by a cut portion of the fourth substrate 24, and the wide portion 23 a is formed by a cut portion of the third substrate 23.

In the light emitting device 1 shown in FIG. 1, the covering member 30 is formed in a cylindrical lens shape, and light spreading radially from the light emitting element 10 can be efficiently extracted in the upper surface direction.
In this example, the covering member 30 is configured by laminating a first covering layer 31 and a second covering layer 32. The first coating layer 31 covers the light emitting element 10, and the second coating layer 32 is disposed so as to cover the upper side of the first coating layer 31. When it has such a two-layer structure, different functions can be imparted to each. For example, if the fluorescent material 40 is mixed in either the first cover layer 31 or the second cover layer 32, the light emission color of the light emitting device can be made different from the light emission color of the light emitting element 10. In particular, when the fluorescent material 40 is mixed into the first covering layer 31 as in the present embodiment, (1) the fluorescent material 40 is disposed in the vicinity of the light emitting element 10, and can be brought close to a point light source. 2) Even if it is a small amount of fluorescent substance, it is preferable in the point that it can be made a predetermined color, and (3) a small amount of fluorescent substance can emit light more efficiently.
In addition to the fluorescent material 40, the first coating layer 31 and the second coating layer 32 may contain a light diffusing material, an antioxidant, an ultraviolet reflecting member, or the like as necessary.

In the present embodiment, the covering member 30 has a two-layer structure. In this case, it is preferable that the outer second covering layer 32 is filled in the groove portion 20a. This is preferable because it is possible to prevent the second coating layer 32 from being detached from the substrate and to prevent the first coating layer 31 from dropping off.
In the present invention, the groove portion 20a is disposed adjacent to the placement region 29 and is not formed inside the placement region 29. Therefore, the first covering layer 31 is formed in the placement region 29 and the outside thereof is formed. If the second coating layer 32 is filled, the second coating layer 32 can be filled in the groove 20a.
There is no problem that the first coating layer 31 is filled in a part of the groove 20a.

  It is preferable that the groove 20a extends in the direction perpendicular to the paper surface of FIG. 1 and is exposed to the outside from at least one side surface of the laminated substrate 20a. If the groove part 20a is exposed from the side surface of the laminated substrate 20a, the air in the groove part 20a is likely to escape when the covering member 30 is filled in the groove part 20a. Therefore, since it is difficult for bubbles to be formed in the covering member 30 inside the groove portion 20a, the covering member 30 can be reliably locked to the groove portion 20a, and the adhesion between the covering member 30 and the laminated substrate 20 can be improved.

When a semiconductor light emitting element is used as the light emitting element 10, the protection element 70 may be incorporated in the circuit so that an excessive voltage is not applied to the light emitting element 10. The protection element 70 is often mounted in the same mounting area 29 as the light emitting element 10. In this case, the protection element 70 may block light from the light emitting element 10 or absorb light. is there. In the present invention, the protective element 70 can be disposed in the groove portion 20a, and the problem of light shielding and light absorption by the protective element 70 does not occur.
However, depending on the form of the groove 20a, it is difficult to wire the protective element 70. In that case, it is preferable to dispose the protective element 70 on the upper surface of the multilayer substrate 20.

The light emitting element 10 is placed on the placement region 29 of the multilayer substrate 20. The positive electrode or the negative electrode of the light emitting element 10 is electrically connected to each of the pair of upper surface electrodes 51 formed in the placement region 29 by the conductive wire 11.
In the form of FIG. 1, one upper surface electrode 51 is formed large, and the light emitting element 10 is disposed thereon. In addition to this, both the upper surface electrodes 51 may be formed small, and the light emitting element 10 may be directly disposed on the upper surface 20 b of the multilayer substrate 20.

  A through hole 53 penetrating from the upper surface 20 b to the lower surface of the multilayer substrate 20 is formed immediately below the upper surface electrode 21. A plated layer 54 is applied to the inner surface of the through hole 53, and a filling material 55 is filled in the plated layer 54. Since the upper surface electrode 51 is electrically connected to the lower surface electrode 52 through the plating layer 54, the light emitting element 10 can emit light by connecting the lower surface electrode 52 and the external electrode.

  When the laminated substrate 20 is laminated, an adhesive layer 61 can be used. The adhesive layer 61 is disposed between the layers of the first substrate 21 to the fourth substrate 24. The adhesive layer 61 is made of an insulating adhesive material in order to prevent a short circuit of the lower surface electrode 52 and a short circuit between the plated layers 54 in the through hole 53.

Next, a method for manufacturing the light emitting device according to this embodiment will be described.
(1. Production of laminated substrate 20)
FIG. 2 shows a state before the first substrate 21 to the fourth substrate 24 are stacked. The illustrated first substrate 21 to fourth substrate 24 are for forming a plurality of light emitting devices 1 simultaneously.
The first substrate 21 has a plurality of (two in this example) first through holes 81 having a constant lateral width and a predetermined length formed substantially in parallel. On the upper and lower surfaces of the first substrate 21 and the inner wall of the first through hole 81, a lower electrode 52 made of a continuous metal film is formed. The lower surface electrodes 52 formed in the first through holes 81 are separated from each other on the upper surface side. The first substrate 21 is exposed from this separated portion.

In the third substrate 23, a plurality of (two in this example) second through holes 82 having a constant lateral width and a predetermined length are formed substantially in parallel.
The fourth substrate 24 is also formed with a plurality of (two in this example) elongated third through-holes 83 having a constant lateral width and a predetermined length substantially in parallel. The third through hole 83 is positioned so as to communicate with the second through hole 82 when stacked. The width of the third through hole 83 is narrower than the width of the second through hole 82. An upper surface electrode 51 made of a continuous metal film is formed on the upper surface of the fourth substrate 24. Note that a metal film is not formed on the lower surface of the fourth substrate 24 and the inner surface of the third through hole 83.
The second substrate 22 is a plate-like body on which no through hole or metal film is formed, and separates between the first through hole 81 and the second through hole 82.

  The first substrate 21 to the fourth substrate 24 of FIG. 2 are stacked with an adhesive layer 61 such as an adhesive sheet interposed therebetween to form a stacked substrate 15 as shown in FIG. 3A. In this example, the groove portion 20a formed by communicating the second through hole 82 and the third through hole 83 has an L-shaped cross section.

(2. Processing of laminated substrate 20)
A plurality of through holes 53 penetrating from the lower surface of the first substrate 21 to the upper surface of the fourth substrate 24 are formed in the laminated substrate 20 laminated as shown in FIG. 4A (see FIG. 3B).
The formed through hole 53 is provided with a plating layer 54 on the inner surface of the through hole 53 and then filled with a filling material 55 (metal paste or epoxy resin) inside the through hole 34. Thereafter, both ends of the through hole 34 are covered with a metal film. The metal film is electrically connected to the plating layer and is integrated with the upper surface electrode 51 and the lower surface electrode 52. Thereby, the upper surface electrode 16 and the lower surface electrode 27 are electrically connected (refer FIG. 4C).

  The upper surface electrode 51 formed on the upper surface of the fourth substrate 24 is also partially removed and separated into two upper surface electrodes 51. Further, the lower electrode 52 formed on the lower surface of the first substrate 21 is partially removed and separated into two lower electrodes 52 as shown in FIG. 3C. Note that the lower electrode 52 and the upper electrode 51 can be formed into a desired shape when partially removed.

(3. Mounting of light emitting element 18)
Next, the light emitting element 10 is mounted on the obtained multilayer substrate 20. The light emitting element 10 is die-bonded to the upper surface electrode 52. And the electrode (not shown) of the light emitting element 10 and the upper surface electrode 51 of the laminated substrate 20 are wire-bonded by the conductive wire 11 (see FIG. 3D). When simultaneously manufacturing a plurality of light emitting devices 10, a plurality of light emitting elements 10 are arranged along the longitudinal direction of the third through hole 83, or a plurality of light emission is performed in a direction along the direction orthogonal to the third through hole 83. The element 10 can be arranged (see FIG. 4A).
In this example, the light emitting element 10 is so-called face-up mounted, but may be flip-chip mounted.

(4. Formation of the first covering member 31 and the second covering member 32)
A first covering member 31 is formed on the upper surfaces of the light emitting element 10 and the laminated substrate 20 (see FIGS. 3E and 4A). The first covering member 30 can be formed by line coating. In the line application in the present embodiment, the tubes for supplying the coating material for the first covering member 31 are moved above the light emitting elements 10 arranged along the longitudinal direction of the groove 20a, while the plurality of light emitting elements 10 are applied. Is a method of covering with a continuous first covering member 31. The first coating layer 31 is disposed only on the upper surface electrode 51 without entering the groove 20 a due to surface tension.
In the present embodiment, since the first covering member 31 contains a fluorescent substance, it is preferable to mix the fluorescent substance in advance with the covering material used for line coating.

Next, the second covering member 32 is formed so as to cover the first covering member 31 (see FIGS. 3E and 4B). For the formation of the second covering member 32, a mold 90 having a cylindrical cross section can be used. As shown in FIG. 4B, the clothing material for the second covering member 32 is injected into the concave portion 91 of the mold 90, and the laminated substrate 20 that is reversed is pressed and compression-molded there. At this time, the first covering member 31 formed on the upper surface 20 b of the laminated substrate 20 is made to coincide with the position of the concave portion 91 of the mold 90. According to this method, since the groove 20a extends long in one direction, the second covering member 32 easily enters the groove 20a while extruding air. Therefore, the second covering member 32 can be filled in the groove 20a without bubbles.

(5. Division into light-emitting device 1)
The laminated substrate 20 is divided by a dicing blade and separated into individual light emitting devices 1. Specifically, as shown in FIG. 4C, a dividing line C1 that is substantially perpendicular to the direction in which the groove 20a extends (longitudinal direction of the third through-hole 83), and a dividing line that is substantially parallel to the direction in which the groove 20a extends. The laminated substrate 20 is divided by C2. After the division, the individual light emitting devices 1 are obtained as shown in FIG. 3F.

  In the manufacturing method of the present embodiment, through holes 82 and 83 having different widths are formed in the third substrate 23 and the fourth substrate 24, and these through holes are communicated at the time of stacking, so that it is difficult to form by cutting. The letter-shaped groove 20a can be easily formed. In addition, a large number of light emitting devices 1 having the same shape can be formed at the same time, which is suitable for mass production. Moreover, even if it is manufacture of the small light-emitting device 1, if it manufactures with the laminated substrate 20 of the dimension shape comparatively easy to handle and it divides at the end, it can manufacture easily.

In this embodiment, in FIG. 4C, the space between C <b> 1-C <b> 1 is narrowed to form a thin side view light emitting device 1, but the space between C <b> 1-C <b> 1 is widened to form the top view light emitting device 1. Can also be formed.
Further, the completed light emitting device 1 can be used with a rubber cap such as silicone rubber.

Hereinafter, each structure of the light-emitting device 1 is demonstrated in detail.
(Laminated substrate 20)
The first substrate 21 to the fourth substrate 24 are not particularly limited as long as the materials have appropriate mechanical strength and insulating properties. For example, a ceramic substrate such as alumina, aluminum nitride, silicon nitride, boron nitride, BT resin, glass epoxy, or the like can be used. Moreover, what laminated | stacked the multilayered epoxy resin sheet may be used.
The upper surface electrode 51 and the lower surface electrode 52 formed on the multilayer substrate 20 can be formed from thin films such as Au, Ag, Cu, W, Pt, and Rh. As a thin film forming method, methods such as plating, vapor deposition, sputtering, and printing can be used.

(Light emitting element 10)
For the light emitting element 10, a semiconductor light emitting element is preferably used. In particular, when a white light emitting device for a backlight is manufactured, a method of converting a part of emitted light into another color by a fluorescent material using a light emitting diode that emits a short wavelength to the light emitting element can be employed. Below, the combination of the light emitting diode and fluorescent substance which can be utilized for a white light-emitting device is demonstrated.

As a light-emitting diode suitable for constituting a white light-emitting device, used after using nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) that the be able to. This light emitting diode has In _x Ga _1-x N (0 <x <1) as a light emitting layer, and the light emission wavelength can be arbitrarily changed from about 365 nm to 650 nm depending on the degree of mixed crystal.

  When white light is emitted, considering the complementary color relationship with the light emitted from the fluorescent material, the light emission wavelength of the light emitting diode 8 is preferably set to 400 nm or more and 530 nm or less, and is set to 420 nm or more and 490 nm or less. It is more preferable. Note that an LED chip that emits light having an ultraviolet wavelength shorter than 400 nm can also be applied by selecting the type of fluorescent material.

(Coating member 30)
The covering member 30 includes the first covering layer 31 and the second covering layer 32. However, the covering member 30 may be only one layer, or may be three or more layers. By using a laminate of a plurality of layers, a resin having excellent heat resistance and light resistance is used for the lower layer side (for example, the first coating layer 31), and weather resistance is excellent for the upper layer side (for example, the second coating layer 32). Clothing materials having different physical properties can be used for each layer, such as using a resin.
A silicone resin, an epoxy resin, or the like can be disposed on the first coating layer 31, but a silicone resin is preferable from the viewpoint of light resistance.
A silicone resin, an epoxy resin, or the like can be disposed on the second coating layer 32, but a hard silicone resin or an epoxy resin is preferable from the viewpoint of weather resistance.

(Fluorescent substance 40)
The fluorescent material 40 may be any material that absorbs light from the light emitting element 10 and converts the wavelength into light of a different wavelength. For example, it is mainly composed of nitride-based fluorescent materials / oxynitride-based fluorescent materials / sialon-based fluorescent materials mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid-based substances such as Eu, and transition metal-based elements such as Mn Activated alkaline earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate phosphor, alkaline earth sulfide phosphor, Alkaline earth thiogallate fluorescent material, alkaline earth silicon nitride fluorescent material, germanate fluorescent material, or rare earth aluminate fluorescent material, rare earth silicate fluorescent material mainly activated with lanthanoid elements such as Ce It is preferably at least one selected from organic and organic complexes mainly activated by a lanthanoid element such as Eu. As specific examples, the following fluorescent materials can be used, but the present invention is not limited thereto.

The nitride fluorescent materials mainly activated by lanthanoid elements such as Eu and Ce are M ₂ Si ₅ N ₈ : Eu, MAlSiN ₃ : Eu, MAl _1-X B _X SiN ₃ : Eu (M is Sr , Ca, Ba, Mg, and Zn. 0 <X <1). In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M Is at least one selected from Sr, Ca, Ba, Mg, and Zn.

An oxynitride fluorescent material mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) Etc.).

Eu, SiAlON-based fluorescent material activated mainly with lanthanoid elements such as Ce _{is, M p / 2 Si 12-} p-q Al p + q O q N 16-p: Ce, M-Al-Si-O-N (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3).

Alkaline earth halogen apatite fluorescent materials mainly activated by lanthanoid-based elements such as Eu and transition metal-based elements such as Mn include M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba). X is at least one selected from F, Cl, Br and I. R is any one of Eu, Mn, Eu and Mn. Etc.).

The alkaline earth metal borate halogen fluorescent substance includes M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, Cl , Br, or I. R is Eu, Mn, or any one of Eu and Mn.).

Alkaline earth metal aluminate fluorescent materials include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is Eu, Mn, or any one of Eu and Mn).

Examples of the alkaline earth sulfide fluorescent material include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.

Rare earth aluminate fluorescent materials mainly activated with lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ There is a YAG-based fluorescent material represented by a composition formula. Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu or the like.

Other fluorescent materials include ZnS: Eu, Zn ₂ GeO ₄ : Mn, MGa ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is At least one selected from F, Cl, Br, and I).

The above-mentioned fluorescent substance contains at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti instead of Eu or in addition to Eu as desired. You can also.
In addition, fluorescent materials other than the above-described fluorescent materials and having the same performance and effect can be used.

  These fluorescent materials can use fluorescent materials having emission spectra in yellow, red, green, and blue by the excitation light of the light-emitting element, and emission spectra in yellow, blue-green, orange, etc., which are intermediate colors between them. Fluorescent materials having can also be used. By using these fluorescent materials in various combinations, surface-mounted light emitting devices having various emission colors can be manufactured.

For example, using a GaN-based compound semiconductor that emits blue light, a Y ₃ Al ₅ O ₁₂ : Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce fluorescent material is irradiated to convert the wavelength. Do. A surface-mount light-emitting device that emits white light by a mixed color of light from a light-emitting element and light from a fluorescent material can be provided.

For example, CaSi ₂ O ₂ N ₂ : Eu or SrSi ₂ O ₂ N ₂ : Eu that emits light from green to yellow, and (Sr, Ca) ₅ (PO ₄ ) ₃ Cl: Eu that emits blue light as a fluorescent material, By using a fluorescent material 60 composed of Ca ₂ Si ₅ N ₈ : Eu or CaAlSiN ₃ : Eu that emits red light, a surface-mount light-emitting device that emits white light with good color rendering can be provided. . This uses the three primary colors of red, blue, and green, so that the desired white light can be achieved simply by changing the blend ratio of the first and second fluorescent materials. Can do.

(Light diffusing material)
In order to diffuse light emitted from the light emitting element 10 and reduce color unevenness, a light diffusing material may be uniformly dispersed in the covering member 30. In particular, if the first coating layer 31 contains the fluorescent material 40 and the second coating layer 32 contains a light diffusing material, the color unevenness can be further reduced. As the light diffusing material, silica, titanium oxide or the like can be used.

<Modification 1>
The cross-sectional shape of the groove 20a can be various forms other than the L-shape as shown in FIG. 5A.
For example, as shown in FIG. 5B, if the width of the second through hole of the third substrate 23 is further widened to form the groove portion 20a having an inverted T-shaped cross section, the engagement member 30 is locked to the groove portion 20a. This is preferable because the stopping force is increased.

If the number of substrates to be stacked is increased and a through hole is formed in each substrate to form a groove portion, the groove portion 20a having a more complicated cross-sectional shape can be formed. For example, as shown in FIGS. 5C and 5D, through holes (second through hole 82, third through hole 83, and fourth through hole) of three substrates (third substrate 23, fourth substrate 24, and fifth substrate 25). If the groove portion 20a is formed from the hole 84), the groove portion 20a having a T-shaped cross section (FIG. 5C) or a cross shape (FIG. 5D) can be formed.
Further, as shown in FIGS. 5E to 5G, through holes (second through hole 82, third through hole) of four substrates (third substrate 23, fourth substrate 24, fifth substrate 25, and sixth substrate 26). 83, the fourth through-hole 84 and the fifth through-hole 85), if the groove 20a is formed, the cross-sectional shape is a combination of two L-shaped shapes (FIG. 5E) or two inverted T-shaped combinations. Various shapes of the groove 20a can be formed, such as a shape like that shown in FIG. 5F or a shape like a combination of an L shape and an inverted T shape (FIG. 5G).

  As another example, the groove 30a is formed from the through holes (the second through hole 82 and the third through hole 83) of the two substrates (the third substrate 23 and the fourth substrate 24) as in the first embodiment. There are also variations to form. For example, as shown in FIG. 5H, the locking structure can be configured by the second through hole 82 and the third through hole 83 having the same width. In this case, the substrate is laminated so that the center position of the second through hole 82 and the center position of the third through hole 83 are shifted and partially communicated. As a result, a step is formed inside the groove 20a, so that the filled covering member 30 can be mechanically locked. In addition, since the substrates on which through holes having the same size and shape are formed may be slightly shifted and stacked, the types of components can be reduced.

<Embodiment 2>
As shown in FIG. 6, the light emitting device 1 according to the present embodiment is implemented except that the laminated substrate 20 is formed of three sheets of a first substrate 21 to a third substrate 23. This is the same as the first embodiment.
In the present embodiment, the laminated substrate 20 does not include a flat substrate having no through hole. For this reason, the formation position of the through hole must be determined so that the first through hole 81 of the first substrate 21 and the second through hole 82 of the second substrate 22 do not communicate with each other.
In the present embodiment, since the number of substrates constituting the multilayer substrate 20 can be reduced, the multilayer substrate 20 is suitable for thinning.

<Embodiment 3>
In the light emitting device 1 according to the present embodiment, as illustrated in FIG. 7, the laminated substrate 20 is formed of two sheets of a first substrate 21 and a second substrate 23, and a cross section of the groove 20 a. Except for the difference in shape, this is the same as in the first and second embodiments.

The groove 20 a is inclined with respect to the upper surface 20 b of the multilayer substrate 20. By this inclination, the covering member 30 is prevented from being detached from the laminated substrate 20. That is, if the groove 20a includes such an inclined portion, it can function as a locking structure.
Further, when the upper surface electrode 51 is formed to both sides of the placement region 29, the first coating layer 31 is formed in a mountain shape up to the position of the upper surface electrode 51 due to surface tension. If the groove 20a is formed adjacent to the placement region 29, the second coating layer 32 can flow into the groove 420a along the first coating layer 431 formed in a mountain shape. Air hardly remains in the groove 20a.

  In the formation of the laminated substrate 20 of the present embodiment, the first substrate 21 and the second substrate 22 are laminated after excavating the groove 20a on the upper surface of the second substrate 22 as shown in FIG. A dicing blade or the like can be used for excavation of the groove 20a.

<Embodiment 4>
The light emitting device 1 according to the present embodiment is the same as that of the first embodiment except that the placement region 29 of the multilayer substrate 20 is narrowed as shown in FIG.
In the present embodiment, the upper surface electrode 51 is not formed in the placement region 29. The upper surface electrode 51 is formed at a position sandwiching the groove 20 a from the placement region 29. Therefore, in order to conduct the light emitting element 10 and the upper surface electrode 51, the conductive wire 11 is stretched beyond the groove 20a.
In the present embodiment, the placement region 29 is narrowed, and the first coating layer 31 is disposed only on the upper surface thereof, so that the amount of the fluorescent material 240 contained in the first coating layer can be reduced.

<Embodiment 5>
As shown in FIG. 10, the light emitting device 1 according to the present embodiment is the same as that of the first embodiment except that the placement region 29 of the multilayer substrate 20 includes a flat portion 29 a and a tapered portion 29 b. It is the same.
The mounting region 29 includes a flat portion 29a on which the light emitting element 10 is mounted and a tapered portion 29b formed on both sides of the flat portion 29a and extending upward. The light emitted from the light emitting element 10 spreads radially, but when light is reflected by the tapered portion 29b, the light emission directivity of the light emitting element can be adjusted to improve the light extraction efficiency.
In addition, since the first coating layer 31 is formed in the recess formed by the flat portion 29a and the tapered portion 29b, even if the coating material has a low viscosity that cannot be used in line coating, the first coating layer 31 It can be used as a coating material.

  In the present embodiment, the first coating layer 31 is formed in the recess of the placement region 29 with a flat surface, so that the contact area with the second coating layer 32 is narrow, and the second coating layer 32 Adhesiveness with the laminated substrate 20 is significantly lowered. However, in the present invention, it is possible to prevent the second coating layer 332 from being pulled out by forming the groove portion 20a having the locking structure in the laminated substrate 20 and filling the second coating layer 32 therewith.

In the formation of the laminated substrate 20 of the present embodiment, as shown in FIG. 11, a tapered through-hole 290 having a tapered surface 29 b extending upward is formed in the fourth substrate 24, and the first substrate 21 is formed. -The 4th board | substrate 24 is laminated | stacked. The tapered through hole 290 is sealed by the upper surface of the third substrate 23. Therefore, the flat portion 29 a of the placement region 29 is constituted by the upper surface of the third substrate 23.
The tapered through hole 290 of the fourth substrate 24 may not be penetrated as a tapered groove portion, and the bottom surface of the tapered groove portion may be a flat portion 29a.

  The semiconductor device of the present invention can be used for a device that uses a device that requires extremely thin light-emitting components, such as a backlight of a liquid crystal display.

1 is a schematic cross-sectional view showing a light emitting device according to Embodiment 1. FIG. FIG. 3 is a perspective view showing a state before lamination of a laminated substrate of the light emitting device according to Embodiment 1. 5 is a schematic cross-sectional view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 5 is a schematic perspective view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 5 is a schematic cross-sectional view showing the method for manufacturing the light-emitting device according to Embodiment 1. FIG. 5 is a schematic perspective view showing a manufacturing process of the light-emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 3 is a schematic cross-sectional view showing one form of a groove portion of the light emitting device according to Embodiment 1. FIG. 6 is a schematic cross-sectional view showing a light emitting device according to Embodiment 2. FIG. 6 is a schematic cross-sectional view showing a light emitting device according to Embodiment 3. FIG. 6 is a perspective view showing a state before lamination of a laminated substrate of a light emitting device according to Embodiment 3. FIG. 7 is a schematic cross-sectional view showing a light emitting device according to Embodiment 4. FIG. 6 is a schematic perspective view showing a light emitting device according to Embodiment 5. FIG. FIG. 10 is a perspective view showing a state before lamination of a laminated substrate of a light emitting device according to Embodiment 5.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light emitting element 20 Laminated substrate 20a Groove part 21 1st board | substrate 22 2nd board | substrate 23 3rd board | substrate 24 4th board | substrate 30 Coating | coated member 31 1st coating layer 32 2nd coating layer 40 Fluorescent substance 51 Upper surface electrode 52 Lower surface electrode 53 Through hole

Claims (16)

A light emitting element;
A laminated substrate having a plurality of substrates stacked and having a mounting region on the top surface for mounting the light emitting element;
A light-emitting device comprising: a cover member that covers the light-emitting element and the upper surface of the multilayer substrate;
On the upper surface of the multilayer substrate, a bottomed groove is provided adjacent to the placement region of the light emitting element,
The covering member includes a first covering layer that covers the light emitting element, and a second covering layer that is disposed so as to cover the upper side of the first covering layer and fill the groove.
The groove has a locking structure for locking the second coating layer to the laminated substrate,
Each of the plurality of substrates is formed of a material selected from the group consisting of alumina, aluminum nitride, silicon nitride, boron nitride, BT resin, and glass epoxy.   The light emitting device according to claim 1, wherein the groove is exposed to the outside from at least one side surface of the multilayer substrate. The groove includes a narrow portion and a wide portion wider than the narrow portion;
3. The light emitting device according to claim 1, wherein the narrow portion is arranged on the upper surface side of the laminated substrate with respect to the wide portion to constitute the locking structure.   The light emitting device according to claim 3, wherein the locking structure of the groove portion includes any one of an L shape, an inverted T shape, a horizontal T shape, or a cross shape in a cross-sectional shape of the groove portion. . The groove includes an inclined portion formed obliquely with respect to the upper surface of the laminated substrate;
The light emitting device according to claim 1, wherein the inclined portion constitutes the locking structure.   The light emitting device according to claim 1, wherein the first covering layer includes a fluorescent material.   The light emitting device according to claim 6, wherein the second covering layer includes a light diffusing material.   2. The mounting area of the laminated substrate includes a flat portion on which the light emitting element is mounted, and a tapered portion that is provided adjacent to the flat portion and extends upward. 8. The light emitting device according to any one of 7.   The light emitting device according to claim 1, wherein the groove is exposed from both side surfaces of the multilayer substrate.   The light emitting device according to claim 1, wherein a protective element is placed inside the groove. A light emitting element;
A laminated substrate having a mounting region on the top surface for mounting the light emitting element;
A covering member that covers the light emitting element and the upper surface of the multilayer substrate;
A groove is provided on the upper surface of the multilayer substrate adjacent to the placement region of the light emitting element,
A method of manufacturing a light emitting device capable of simultaneously forming a plurality of light emitting devices having a locking structure in which the groove member is filled with the covering member and the covering member is locked to the laminated substrate,
(1) Laminating a plurality of substrates to form a laminated substrate having a groove having a locking structure;
(2) placing a plurality of light emitting elements on the placement area adjacent to the groove on the top surface of the multilayer substrate;
(3) forming a covering member on the upper surface of the light emitting element and the laminated substrate;
(4) cutting the laminated substrate in a direction substantially perpendicular to the longitudinal direction of the groove, and singulating into a plurality of light emitting devices,
The covering member includes a first covering layer and a second covering layer;
Forming the covering member comprises:
Covering the light emitting element with the first covering layer;
Covering the upper surface of the first coating layer with the second coating layer, and filling the groove with the second coating layer,
The method of manufacturing a light emitting device, wherein the first coating layer is formed by line coating and is formed so as not to enter the groove due to surface tension. Forming the laminated substrate comprises:
A first substrate having a plurality of elongated first through holes formed substantially parallel to each other;
A second substrate laminated on the upper surface side of the first substrate;
A third substrate having a plurality of elongated second through holes formed substantially parallel to each other;
A fourth substrate having a plurality of elongated through holes formed substantially in parallel with each other and having a third through hole formed to be narrower than the second through hole and aligned with the second through hole. And laminating in this order to form the laminated substrate, and communicating the second through-hole and the third through-hole to form the groove portion having the locking structure. The manufacturing method as described. Forming the laminated substrate comprises:
A first substrate having a plurality of elongated first through holes formed substantially parallel to each other;
A second substrate laminated on the upper surface side of the first substrate;
A third substrate having a plurality of elongated second through holes formed substantially parallel to each other;
A plurality of elongated through-holes formed substantially parallel to each other, the third through-hole having the same dimensions as the second through-hole and positioned so as to partially coincide with the position of the second through-hole Forming the laminated substrate in this order, and forming the groove portion having the locking structure by communicating the second through hole and the third through hole. The manufacturing method according to claim 11. Forming the laminated substrate comprises:
A first substrate having a plurality of elongated first through holes formed substantially parallel to each other;
A plurality of elongated through holes formed substantially in parallel with each other, the second substrate having a second through hole formed at a position different from the first through hole;
A third substrate having a plurality of elongated through holes formed substantially in parallel with each other and having a narrower width than the second through hole and formed in alignment with the second through hole And laminating in this order to form the laminated substrate, and communicating the second through-hole and the third through-hole to form the groove portion having the locking structure. The manufacturing method as described. A light emitting element;
A laminated substrate having a mounting region on the top surface for mounting the light emitting element;
A covering member that covers the light emitting element and the upper surface of the multilayer substrate;
A groove is provided on the upper surface of the multilayer substrate adjacent to the placement region of the light emitting element,
A method of manufacturing a light emitting device capable of simultaneously forming a plurality of light emitting devices having a locking structure in which the groove member is filled with the covering member and the covering member is locked to the laminated substrate,
(1) On the upper surface of the first substrate provided with a plurality of elongated first through holes formed substantially parallel to each other,
Laminating a second substrate on which a plurality of elongated cutting grooves having a cross-sectional shape corresponding to the groove portions are formed substantially in parallel so that the cutting grooves are positioned on the upper surface;
(2) placing a plurality of light emitting elements on the placement area adjacent to the cutting groove on the top surface of the multilayer substrate;
(3) forming the covering member on the light emitting element and the upper surface of the laminated substrate;
(4) cutting the laminated substrate in a direction substantially perpendicular to the longitudinal direction of the cutting groove, and dividing into a plurality of light emitting devices,
The covering member includes a first covering layer and a second covering layer;
Forming the covering member comprises:
Covering the light emitting element with the first covering layer;
Covering the upper surface of the first coating layer with the second coating layer, and filling the groove with the second coating layer,
The method of manufacturing a light emitting device, wherein the first coating layer is formed by line coating and is formed so as not to enter the groove due to surface tension.   The method for manufacturing a light emitting device according to claim 11, wherein the first covering layer contains a fluorescent material.

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