JP5301968B2 - Sheet sticking device and sticking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To keep a cutting means and a body to be pasted in a non-contact state when an adhesive sheet is cut and pasted. <P>SOLUTION: This sheet pasting device 10 includes a delivery means 12 for supporting the band-like adhesive sheet, a cutting means 14 which provides a closed loop-like slit C in the adhesive sheet S and forms a sheet S1 for pasting on the inside of the slit C and an unnecessary sheet S2 on the outside of the slit C, and a pressing means 16 for pasting the sheet S1 for pasting on a ring frame RF and a semiconductor wafer W. The cutting means 14 is provided so that the slit C can be formed in the adhesive sheet S when the adhesive sheet S is brought into contact with the pressing means 16. After the slit C is formed, the sheet S1 for pasting is pasted on the ring frame RF and the semiconductor wafer W by the pressing means 16. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly, to a sheet sticking apparatus and a sticking method capable of sticking a sticking sheet formed by cutting an adhesive sheet to an adherend.

  Conventionally, when a semiconductor wafer (hereinafter simply referred to as a “wafer”) and a ring frame are integrated, an adhesive sheet such as a dicing sheet or a mounting sheet is attached to the ring frame with the wafer disposed inside the ring frame. The method of sticking over is performed. As an apparatus for performing such sticking, for example, an apparatus disclosed in Patent Document 1 is known. In the sheet sticking device of the same document, after sticking an adhesive sheet to a ring frame and a wafer, the cutter blade is moved along a circumferential trajectory on the ring frame to form a cut in the adhesive sheet.

JP 2006-102822 A

  However, in the sheet sticking device described in Patent Document 1, when the cut is formed in the adhesive sheet, the cutter blade comes into contact with the ring frame, the surface of the ring frame is damaged, or the blade edge of the rotary blade is There is an inconvenience of being damaged. Further, when the notch is formed, dust such as shaving is generated by scraping the ring frame, and it becomes difficult to keep the wafer processing facility clean. Moreover, if the ring frame is damaged each time a notch is formed, the ring frame is reused and cannot be used for a long period of time, resulting in an increase in manufacturing running cost.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to keep the cutting means and the adherend in a non-contact state when cutting and sticking the adhesive sheet. It is in providing the sheet sticking apparatus and sticking method which can be performed.

In order to achieve the above object, the present invention provides a feeding means for feeding out a belt-like adhesive sheet, and a closed-loop cut provided in the adhesive sheet, and the inside of the cut is used as an adhesive sheet, while the outside of the cut is an unnecessary sheet. in the sheet sticking device provided with a cutting means formed by, a pressing means for affixing by pressing the sticking sheet to the adherend,
The pressing means includes a pressing roller that can roll while pressing the adhesive sheet against the adherend,
Said cutting means are taken and the cutter blade provided on the pressing roller, Ru and a platen roller to form a cut said biasing the adhesive sheet to the cutter blade, the configuration referred.

Further, the present invention provides a sheet pasting method in which a band-like adhesive sheet is provided with a closed-loop cut through a cutting means, the inside of the cut is formed as a sticking sheet, and is attached to an adherend through a pressing means. ,
When contacting the pressing means that rolls while pressing the adhesive sheet against the adherend, the cut is formed in the adhesive sheet, and then the pressing means presses and sticks the sticking sheet to the adherend, The method is taken.

  According to the present invention, when the adhesive sheet comes into contact with the pressing means, the cutting means is provided with a cut, so that the cut can be formed before the adhesive sheet is attached to the adherend. It can avoid that cutting means, such as a cutter blade, contact the surface of the ring frame used as an adherend. As a result, it is possible to prevent the ring frame from being scratched, to avoid generation of dust such as shavings, and to be able to use the ring frame for a long period of time, thereby suppressing an increase in manufacturing cost. It becomes.

  In addition, since the cutting means has a cutter blade provided on the pressing roller and a platen roller that biases the adhesive sheet to the cutter blade, the cutting is performed immediately before the adhesive sheet is attached to the adherend by a simple structure. Can be formed.

  In addition, since the elastic member is provided on the outer peripheral surface of the pressing member, the adhesive blade is pressed against the adherend without causing the cutter blade to contact the adherend while smoothly forming the cut by the cutter blade and the platen roller. Can be attached.

  Further, by providing the pressing roller with the suction means, the sticking sheet after being cut by the cutter blade and before being stuck to the adherend can be adsorbed to the outer peripheral surface of the pressing roller. Thereby, it is possible to prevent the sticking sheet from inadvertently hanging or being displaced before sticking to the adherend, and it is possible to eliminate sticking failure of the sticking sheet.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this specification, “upper”, “lower”, “left”, and “right” are used with reference to FIG. 1 unless otherwise specified.

  The schematic front view of the sheet sticking apparatus which concerns on FIG. 1 is shown by FIG. In this figure, a sheet sticking device 10 has a table 11 that supports a wafer W as an adherend and a ring frame RF, and an adhesive layer on one surface of a belt-like base material sheet above the table 11. A feeding means 12 for supporting the adhesive sheet S; a cutting means 14 for forming a closed-loop cut C in the adhesive sheet S; a pressing means 16 having a pressing roller 15 capable of rolling on the wafer W and the ring frame RF; The peeling means 18 is provided on the right side of the pressing roller 15.

  The table 11 is formed so that the wafer W is disposed in the opening of the ring frame RF and the ring frame RF and the wafer W can be sucked and held. A convex portion 11A is formed on the upper surface of the table 11, the wafer W is sucked and held on the upper surface of the convex portion 11A, and the ring frame RF is sucked and held on the outer side of the convex portion 11A. A protective sheet H is attached to the lower surface of the wafer W.

  The feeding means 12 is provided on the left side of the table 11 to support the adhesive sheet S, and is provided with a support shaft 21 rotatably provided via a motor M1, and a motor M2 below the support shaft 21 via a motor M2. A drive roller 22 provided rotatably, a pinch roller 23 sandwiching the adhesive sheet S between the drive roller 22, and a winding provided on the right side of the table 11 and provided rotatably via a motor M3. A shaft 24 is provided.

  As shown in FIGS. 2 to 4, the cutting means 14 includes a closed-loop cutter blade 26 projecting from the outer peripheral surface of the pressing roller 15, and a platen that urges the adhesive sheet S to the cutter blade 26. And a roller 27. When the adhesive sheet S passes between them, the cutter blade 26 and the platen roller 27 can form a notch C having a predetermined shape larger than the inner diameter of the ring frame RF and smaller than the outer diameter in the adhesive sheet S. Is provided. The platen roller 27 is set to have a diameter smaller than that of the pressing roller 15 and is supported by a slider 30 described later via a connecting member (not shown). Here, the adhesive sheet S portion surrounded by the notch C is used as the sticking sheet S1, while the adhesive sheet S portion located outside the notch C is formed as an unnecessary sheet S2, and the unnecessary sheet S2 is provided with the peeling means 18. After that, it is wound around the winding shaft 24.

  The pressing means 16 includes a pressing roller 15 that can be rotated via a motor M4, and a single-axis robot 31. The pressing roller 15 is moved in the left-right direction by the slider 30 of the single-axis robot 31. The pressing roller 15 is provided to be able to press and stick the adhesive sheet S to the ring frame RF and the wafer W by rolling leftward from the state shown in FIG. An elastic member 32 having a thickness larger than the protruding height of the cutter blade 26 is provided on the outer peripheral surface of the pressing roller 15. The elastic member 32 is made of a material having elasticity such as foamed resin such as EVA, sponge, rubber or the like, and is provided with slits 32 </ b> A corresponding to the installation area of the cutter blade 26. The elastic member 32 is recessed to such an extent that the platen roller 27 and the cutter blade 26 come into contact with each other to form a cut C in the adhesive sheet S, and the adhesive sheet S is attached to the ring frame RF and the wafer W via the pressing roller 15. The elastic force is set to such an extent that the cutter blade 26 and the ring frame RF do not come into contact with each other. Here, the pressing roller 15 is provided with a suction means 34 that can suck the adhesive sheet S. The suction means 34 includes a plurality of suction holes (not shown) that are formed in the pressing roller 15 and the elastic member 32 and connected to a decompression pump or the like. The suction hole is provided inside the cutter blade 26 having a circular shape, and as shown by an arrow in FIG. The suction hole may be the entire area of the cut C, and is not limited to that area.

  The peeling means 18 includes a peeling roller 36 that can be rotated via a motor M5, and a pinch roller 37 that sandwiches an unnecessary sheet S2 between the peeling roller 36 and moves in the left-right direction via a driving means (not shown). It is provided as possible.

  Next, the sticking method of sticking sheet S1 in this embodiment is demonstrated.

  First, the adhesive sheet S supported by the support shaft 21 is passed between the driving roller 22 and the pinch roller 23, between the pressing roller 15 and the platen roller 27, and between the peeling roller 36 and the pinch roller 37. The lead end is fixed to the winding shaft 24.

  Thereafter, the ring complaint RF and the wafer W are placed on the table 11 via a transfer means (not shown), and are sucked and held. Next, with the rotations of the motors M1 to M3 and M5 locked, the pressing roller 15 is moved to the left from the position indicated by the two-dot chain line in FIG. Thereby, the pressure roller 15 rolls while pressing the adhesive sheet S against the ring claim RF and the wafer W, and the adhesive sheet S is stuck on the upper surfaces of the ring claim RF and the wafer W.

  Here, during the rolling of the pressing roller 15, the adhesive sheet S immediately before being attached to the ring claim RF and the wafer W, that is, when passing between the pressing roller 15 and the platen roller 27, The elastic member 32 is recessed, and the platen roller 27 and the cutter blade 26 come into contact with each other to form a cut C in the adhesive sheet S (see FIGS. 2 and 4). The inner sticking sheet S1 in which the cuts C are formed is held by suction on the outer peripheral surface of the elastic member 32 through the suction means 34, and the sticking sheet S1 is stuck to the ring frame RF while maintaining this state. . Thereby, when the adhesive sheet S is in contact with the elastic member 32, that is, when passing between the cutter blade 26 and the platen roller 27, the cut C is formed, and then the pressing roller 15 is rolled to adhere. The sheet S can also be attached.

  When the pressing roller 15 is moved to the position shown in FIG. 5, the sticking sheet S in which the circular cuts C are formed is stuck to the wafer W and the ring complaint RF. Next, when the peeling means 18 is moved to the left via a driving means (not shown) while driving the motor M5, only the unnecessary sheet S2 is peeled from the ring frame RF as shown by a two-dot chain line in FIG. Lifted up. Then, the table 11 is lowered by a drive unit (not shown), and the wafer W integrated with the ring frame FR is transferred to another process by a transfer unit (not shown). Thereafter, with the rotations of the motors M4 and M5 being locked, the pressing roller 15 and the peeling means 18 are moved to the right, and the motors M1, M2 and M3 are driven in synchronism with the operation to drive the winding shaft 24. While the unnecessary sheet S <b> 2 is being wound up, and the new adhesive sheet S is fed out onto the table 11, the pressing roller 15, the peeling means 18, and the table 11 are returned to the initial positions. Then, the pasting sheet S1 can be pasted by the same operation.

Therefore, according to such an embodiment, since the notch C can be formed in the adhesive sheet S at the timing immediately after being wound around the pressing roller 15, the ring frame RF is damaged by a cutter blade or the like as in the prior art. Can be avoided.
Further, without forming the two-layer structure in which the adhesive sheet S is temporarily attached to a release sheet or the like, even if only the adhesive sheet S as in the present embodiment, after forming the cut C forming the adhesive sheet S1, This can be affixed. As a result, the cost of the adhesive sheet S can be reduced, and the extension and loosening of the adhesive sheet S1 due to the pulling force when peeling from the release sheet or the like can be suppressed, so that the adhesive sheet S1 can be applied well. It becomes possible to do. In addition, this invention does not exclude the adhesive sheet original fabric of the 2 layer structure which temporarily adhered the adhesive sheet S to the peeling sheet, or the layer structure beyond it. In other words, when an adhesive sheet original fabric in which a release sheet is temporarily attached to the adhesive sheet S is adopted, it is possible to provide a take-up shaft for winding the release sheet before the adhesive sheet S is attached to the adherend. Can do.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, as the adherend in the present invention, other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted, and the wafer W may be a silicon wafer or a compound wafer.

  Further, as shown in FIG. 6, the peeling means 18 may be configured to move simultaneously with the pressing roller 15. In this case, the apparatus configuration and control can be simplified.

  Furthermore, the adhesive sheet S is not limited to the one that mounts the wafer W on the ring frame RF, and may be a known adhesive sheet such as a protective sheet that is attached to the wafer W or the like to protect its circuit surface.

The schematic front view of the sheet sticking apparatus which concerns on embodiment. The principal part enlarged view of FIG. The schematic perspective view of a press roller and its peripheral structure. FIG. 3 is a partial cross-sectional view of FIG. The schematic front view during adhesion sheet sticking. The schematic front view which shows another form.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 12 Feeding means 14 Cutting means 15 Pressing roller 16 Pressing means 26 Cutter blade 27 Platen roller 32 Elastic member 34 Adsorbing means C Cutting RF ring frame (adhered body)
S Adhesive Sheet S1 Adhesive Sheet S2 Unnecessary Sheet W Semiconductor Wafer (Substrate)

Claims (2)

And feeding means for feeding a strip adhesive sheet, the notch in the closed loop is provided on the adhesive sheet, while the inside of the cut and the sticking sheet, a cutting means formed by an outer cut unnecessary sheet, the sticking In a sheet sticking apparatus provided with a pressing means for pressing and sticking the sheet to the adherend,
The pressing means includes a pressing roller that can roll while pressing the adhesive sheet against the adherend,
The cutting means includes a cutter blade provided on a pressing roller, and a platen roller that biases the adhesive sheet to the cutter blade to form the cut . In the sheet sticking method of providing a closed loop-like cut through a cutting means on the belt-shaped adhesive sheet, forming the inside of the cut as a sticking sheet, and sticking to the adherend through the pressing means,
When contacting the pressing means that rolls while pressing the adhesive sheet against the adherend, the notch is formed in the adhesive sheet, and then the pressing means presses and sticks the sticking sheet to the adherend. The sheet sticking method characterized by this.

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