JP5386232B2 - 紫外線照射装置 - Google Patents
紫外線照射装置 Download PDFInfo
- Publication number
- JP5386232B2 JP5386232B2 JP2009126651A JP2009126651A JP5386232B2 JP 5386232 B2 JP5386232 B2 JP 5386232B2 JP 2009126651 A JP2009126651 A JP 2009126651A JP 2009126651 A JP2009126651 A JP 2009126651A JP 5386232 B2 JP5386232 B2 JP 5386232B2
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- Prior art keywords
- wafer
- ultraviolet
- tape
- protective tape
- ring frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 title 1
- 230000001681 protective effect Effects 0.000 claims description 68
- 230000007246 mechanism Effects 0.000 claims description 51
- 239000004065 semiconductor Substances 0.000 claims description 20
- 230000001678 irradiating effect Effects 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 121
- 239000002390 adhesive tape Substances 0.000 description 54
- 239000000853 adhesive Substances 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 22
- 230000007723 transport mechanism Effects 0.000 description 16
- 238000003825 pressing Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Description
すなわち、半導体ウエハの表面に貼付けられた紫外線硬化型の保護テープに紫外線を照射する紫外線照射装置であって、
前記保護テープが貼付けられた半導体ウエハを載置保持する保持テーブルと、
前記保持テーブルを回転駆動させる駆動手段と、
少なくとも前記半導体ウエハの半径方向に配列した複数個の紫外線発光ダイオードと、
複数個の前記紫外線発光ダイオードと対向する位置に回転移動するとともに、半導体ウエハの載置位置まで下降し、各紫外線発光ダイオードの照度を測定するセンサと、
前記紫外線発光ダイオードごとに高さを変更させる昇降駆動機構と、
前記センサの検出結果に基づいて、保護テープ表面の単位面積当たりの積算光量が一定になるように、昇降駆動機構を作動させて各紫外線発光ダイオードの高さ調節する高さ制御部とを備え、
前記保護テープ付きの半導体ウエハを載置保持した保持テーブルを回転させながら紫外線発光ダイオードから保護テープ表面に向けて紫外線を照射したとき、当該保護テープの紫外線の照射領域における積算光量が一定になるように構成した
ことを特徴とする。
9 … 紫外線照射装置
11 … 紫外線発光ダイオード
12 … 紫外線照射ユニット
14 … 照度センサ
56 … 制御装置
57 … 演算処理部
W … 半導体ウエハ
PT … 保護テープ
Claims (2)
- 半導体ウエハの表面に貼付けられた紫外線硬化型の保護テープに紫外線を照射する紫外線照射装置であって、
前記保護テープが貼付けられた半導体ウエハを載置保持する保持テーブルと、
前記保持テーブルを回転駆動させる駆動手段と、
少なくとも前記半導体ウエハの半径方向に配列した複数個の紫外線発光ダイオードと、
複数個の前記紫外線発光ダイオードと対向する位置に回転移動するとともに、半導体ウエハの載置位置まで下降し、各紫外線発光ダイオードの照度を測定するセンサと、
前記紫外線発光ダイオードごとに高さを変更させる昇降駆動機構と、
前記センサの検出結果に基づいて、保護テープ表面の単位面積当たりの積算光量が一定になるように、昇降駆動機構を作動させて各紫外線発光ダイオードの高さ調節する高さ制御部とを備え、
前記保護テープ付きの半導体ウエハを載置保持した保持テーブルを回転させながら紫外線発光ダイオードから保護テープ表面に向けて紫外線を照射したとき、当該保護テープの紫外線の照射領域における積算光量が一定になるように構成した
ことを特徴とする紫外線照射装置。 - 請求項1に記載の紫外線照射装置において、
前記保護テープの周縁部に照射する補助用の紫外線発光ダイオードを備えた
ことを特徴とする紫外線照射装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009126651A JP5386232B2 (ja) | 2009-05-26 | 2009-05-26 | 紫外線照射装置 |
US12/768,645 US8258490B2 (en) | 2009-05-26 | 2010-04-27 | Ultraviolet irradiation device |
TW099116480A TWI498953B (zh) | 2009-05-26 | 2010-05-24 | 紫外線照射裝置 |
KR1020100048356A KR101720335B1 (ko) | 2009-05-26 | 2010-05-25 | 자외선 조사 장치 |
CN201010187036.7A CN101901745B (zh) | 2009-05-26 | 2010-05-26 | 紫外线照射装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009126651A JP5386232B2 (ja) | 2009-05-26 | 2009-05-26 | 紫外線照射装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010278066A JP2010278066A (ja) | 2010-12-09 |
JP5386232B2 true JP5386232B2 (ja) | 2014-01-15 |
Family
ID=43219171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009126651A Expired - Fee Related JP5386232B2 (ja) | 2009-05-26 | 2009-05-26 | 紫外線照射装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8258490B2 (ja) |
JP (1) | JP5386232B2 (ja) |
KR (1) | KR101720335B1 (ja) |
CN (1) | CN101901745B (ja) |
TW (1) | TWI498953B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5965133B2 (ja) * | 2011-11-17 | 2016-08-03 | リンテック株式会社 | 光照射装置および光照射方法 |
KR101476115B1 (ko) * | 2012-08-07 | 2014-12-23 | 세키스이가가쿠 고교가부시키가이샤 | 웨이퍼의 처리 방법 |
CN103220850A (zh) * | 2013-03-15 | 2013-07-24 | 深圳市润沃机电有限公司 | 一种使物体接受恒定辐照量的方法及装置 |
JP6314081B2 (ja) * | 2014-12-15 | 2018-04-18 | 東京エレクトロン株式会社 | 光照射装置 |
DE102015000263A1 (de) * | 2015-01-16 | 2016-07-21 | Xylem Ip Management S.À.R.L. | Verfahren zur Bestimmung des UV-Transmissionsgrades von Wasser |
KR101880271B1 (ko) * | 2015-05-07 | 2018-07-24 | (주)퓨렉스 | 반도체 패키지 제조용 인라인 시스템의 uv광 측정방법 |
US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
FR3080554B1 (fr) * | 2018-04-25 | 2021-03-12 | Skf Ab | Machine pour coller une piece sur un element de support avant les operations d'usinage et son procede |
KR102101228B1 (ko) * | 2018-06-20 | 2020-04-22 | (주)에이피텍 | Led 모듈 검사 및 포장 시스템 |
WO2023054318A1 (ja) * | 2021-09-29 | 2023-04-06 | リンテック株式会社 | 半導体装置の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01240681A (ja) * | 1988-03-22 | 1989-09-26 | Nippon Denso Co Ltd | 光硬化炉における光量可変装置 |
JPH04107828U (ja) * | 1991-03-04 | 1992-09-17 | 日東電工株式会社 | 紫外線照射装置 |
JP2877997B2 (ja) | 1991-08-29 | 1999-04-05 | 日東電工株式会社 | 半導体ウエハの処理方法 |
JP3360993B2 (ja) * | 1995-09-22 | 2003-01-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2000218156A (ja) * | 1998-11-25 | 2000-08-08 | Hooya Shot Kk | 紫外光照射装置 |
JP4311857B2 (ja) * | 2000-04-05 | 2009-08-12 | 日東電工株式会社 | 紫外線照射装置 |
JP3742986B2 (ja) * | 2000-07-25 | 2006-02-08 | 東京エレクトロン株式会社 | 基板処理装置 |
JP2003133301A (ja) * | 2001-10-26 | 2003-05-09 | Tokyo Electron Ltd | 半導体製造酸化膜生成装置及び方法、並びに紫外線照射装置 |
US20040134603A1 (en) * | 2002-07-18 | 2004-07-15 | Hideo Kobayashi | Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus |
JP2004342920A (ja) * | 2003-05-16 | 2004-12-02 | Seiko Epson Corp | 基板処理装置、基板の製造方法、並びに電気光学装置及び電子機器 |
JP4279738B2 (ja) * | 2004-07-22 | 2009-06-17 | リンテック株式会社 | 紫外線照射装置 |
JP2007026517A (ja) * | 2005-07-14 | 2007-02-01 | Ushio Inc | 紫外線照射装置 |
JP4588645B2 (ja) * | 2006-02-07 | 2010-12-01 | オリジン電気株式会社 | 樹脂膜形成装置、方法およびプログラム |
JP2007329300A (ja) * | 2006-06-08 | 2007-12-20 | Disco Abrasive Syst Ltd | 紫外線照射装置および紫外線照射装置を備えた切削機 |
WO2008142975A1 (ja) * | 2007-05-18 | 2008-11-27 | Tokyo Seimitsu Co., Ltd. | ダイシング装置およびダイシング方法 |
-
2009
- 2009-05-26 JP JP2009126651A patent/JP5386232B2/ja not_active Expired - Fee Related
-
2010
- 2010-04-27 US US12/768,645 patent/US8258490B2/en not_active Expired - Fee Related
- 2010-05-24 TW TW099116480A patent/TWI498953B/zh not_active IP Right Cessation
- 2010-05-25 KR KR1020100048356A patent/KR101720335B1/ko active IP Right Grant
- 2010-05-26 CN CN201010187036.7A patent/CN101901745B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101901745A (zh) | 2010-12-01 |
TW201110217A (en) | 2011-03-16 |
US20100301233A1 (en) | 2010-12-02 |
TWI498953B (zh) | 2015-09-01 |
US8258490B2 (en) | 2012-09-04 |
JP2010278066A (ja) | 2010-12-09 |
KR20100127714A (ko) | 2010-12-06 |
CN101901745B (zh) | 2014-06-18 |
KR101720335B1 (ko) | 2017-03-27 |
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