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JP5367068B2 - Semiconductor wafer etching equipment - Google Patents

Semiconductor wafer etching equipment Download PDF

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JP5367068B2
JP5367068B2 JP2011509568A JP2011509568A JP5367068B2 JP 5367068 B2 JP5367068 B2 JP 5367068B2 JP 2011509568 A JP2011509568 A JP 2011509568A JP 2011509568 A JP2011509568 A JP 2011509568A JP 5367068 B2 JP5367068 B2 JP 5367068B2
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chucking
substrate
channel
annular
stage
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JP2011521453A5 (en
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ドミトリー ラボマースキー，
ティエン， ファク タン，
ラン ツエイ，
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

本発明は、半導体製造のための構成要素および装置に関する。より具体的には、本発明は、ウェハ台およびその半導体装置に関する。   The present invention relates to components and apparatus for semiconductor manufacturing. More specifically, the present invention relates to a wafer stage and its semiconductor device.

シリコンウェハを処理する場合、良質の製品では表面均一性が必要である。表面均一性が得られると、エッチング処理、洗浄処理、および／または前洗浄処理が実施されて、半導体材料、誘電体材料および／または金属材料が除去される。通常、エッチング処理では、半導体材料および生成された副生成物を除去するために、様々な反応物質および／またはプラズマを使用する。反応物質および副生成物は、望ましくないことに凝結してエッチング処理チャンバ内に粒子を形成することがある。処理チャンバ内に形成される粒子および／または副生成物は、基板の表面均一性に悪影響を及ぼすおそれがある。   When processing silicon wafers, good quality products require surface uniformity. Once surface uniformity is obtained, an etching process, a cleaning process, and / or a pre-cleaning process is performed to remove the semiconductor material, dielectric material, and / or metal material. Typically, the etching process uses various reactants and / or plasmas to remove semiconductor material and generated byproducts. Reactants and by-products can undesirably condense and form particles in the etching process chamber. Particles and / or by-products formed in the processing chamber can adversely affect the surface uniformity of the substrate.

従来のエッチング装置では、ウェハをエッチング処理用のエッチングチャンバ内で支持するための台が構成される。この台は、基板と接触する台の縁部のところに封止帯を有する。ウェハ上にエッチング液が堆積できるように、冷却水が台の中を流れて台を冷却する。台はまた、封止帯で囲まれた複数のチャッキング孔も有する。エッチング処理中、基板を台でチャッキングするためのチャッキング孔を通してガスが排気される。基板がチャックから外され台から持ち上げられた後、封止帯は、エッチング処理のエッチング液および／または副生成物にさらされる。エッチング液および／または副生成物は、台の中を流れる冷却ウェハによる冷却効果により、台の縁部に配置された封止帯上に凝結しやすくなる。別のウェハが台上にチャッキングされエッチングされるとき、封止帯上に凝結している副生成物および／または粒子により基板が傾き、その結果、不均一なウェハのエッチングになる可能性がある。   In a conventional etching apparatus, a table for supporting a wafer in an etching chamber for etching processing is configured. The pedestal has a sealing strip at the edge of the pedestal that contacts the substrate. Cooling water flows through the table to cool the table so that the etchant can be deposited on the wafer. The pedestal also has a plurality of chucking holes surrounded by a sealing strip. During the etching process, the gas is exhausted through a chucking hole for chucking the substrate with a table. After the substrate is removed from the chuck and lifted from the pedestal, the sealing strip is exposed to the etchant and / or byproduct of the etching process. The etching solution and / or by-products are likely to condense on the sealing band disposed at the edge of the table due to the cooling effect of the cooling wafer flowing in the table. When another wafer is chucked and etched on the table, the by-products and / or particles condensing on the sealing band can tilt the substrate, resulting in non-uniform wafer etching. is there.

本発明の諸実施形態は、封止帯を台の中心の方に、台の縁部から離して構成することによって、従来の既知のウェハチャックに勝る利益をもたらすウェハ台およびその半導体装置に関する。諸実施形態で、封止帯は、台のチャッキング開口とパージ開口の間に構成することができる。封止帯は、台の縁部から離して配置して、望ましくは昇華中に反応物および／または副生成物が封止帯上に凝結することを防止することができる。パージ開口を通って流れるパージガスもまた、望ましくは封止帯付近の反応物および／または副生成物を除去することができる。加えて、封止帯の位置により、望ましくは基板をチャッキングしている間に台上の基板が偏位することを防止することもできる。   Embodiments of the present invention relate to a wafer pedestal and its semiconductor device that provides advantages over prior known wafer chucks by constructing a sealing strip towards the center of the pedestal and away from the edge of the pedestal. In embodiments, the sealing band may be configured between the pedestal chucking opening and the purge opening. The sealing band can be placed away from the edge of the platform to desirably prevent reactants and / or byproducts from condensing on the sealing band during sublimation. The purge gas flowing through the purge opening can also desirably remove reactants and / or byproducts near the sealing zone. In addition, the position of the sealing band can also prevent the substrate on the table from being displaced while desirably chucking the substrate.

本発明の諸実施形態は、半導体装置のウェハ台を含む。ウェハ台は、基板を支持することができる。ウェハ台は、パージガスを流すように構成された少なくとも１つのパージ開口と、台の上に基板をチャッキングするように構成された少なくとも１つのチャッキング開口とを含むことができる。この台はまた、少なくとも１つのパージ開口と少なくとも１つのチャッキング開口との間に配置された封止帯を含むこともできる。封止帯は、基板を支持するように構成される。   Embodiments of the present invention include a wafer stage for a semiconductor device. The wafer stage can support the substrate. The wafer pedestal can include at least one purge opening configured to flow purge gas and at least one chucking opening configured to chuck a substrate over the pedestal. The platform can also include a sealing band disposed between the at least one purge opening and the at least one chucking opening. The sealing strip is configured to support the substrate.

本発明の付加的な実施形態は、半導体装置を含むことができる。この半導体装置は、処理領域を画定するチャンバを含むことができる。チャンバの上部領域にシャワーヘッドを配置することができる。チャンバの下部領域にウェハ台を配置することができる。このウェハ台は、パージガスを流すように構成された少なくとも１つのパージ開口と、台の上に基板をチャッキングするように構成された少なくとも１つのチャッキング開口とを含むことができる。この台はまた、少なくとも１つのパージ開口と少なくとも１つのチャッキング開口との間に配置された封止帯を含むこともできる。封止帯は、基板を支持するように構成される。   Additional embodiments of the present invention can include semiconductor devices. The semiconductor device can include a chamber that defines a processing region. A showerhead can be placed in the upper region of the chamber. A wafer stage can be placed in the lower region of the chamber. The wafer pedestal can include at least one purge opening configured to flow purge gas and at least one chucking opening configured to chuck a substrate over the pedestal. The platform can also include a sealing band disposed between the at least one purge opening and the at least one chucking opening. The sealing strip is configured to support the substrate.

本発明の本質および利点についてのさらなる理解は、本明細書の残りの部分および図面を参照することによって達成されよう。図面では、類似の構成部品を指すために、いくつかの図面全体を通して同じ参照数字が用いられている。いくつかの例では、多数の類似構成要素のうちの１つを表すために、サブ標示が参照数字に付けられハイフンの後に続く。既存のサブ標示を指定せずにある参照数字に言及する場合は、そのような多数の類似構成要素すべてを指すことが意図されている。   A further understanding of the nature and advantages of the present invention may be achieved by reference to the remaining portions of the specification and the drawings. In the drawings, the same reference numerals are used throughout several drawings to refer to similar components. In some examples, a sub-indication is appended to the reference numeral followed by a hyphen to represent one of a number of similar components. When referring to a reference numeral without specifying an existing sub-indication, it is intended to refer to all such many similar components.

本発明の例示的なエッチング装置の概略断面図である。1 is a schematic cross-sectional view of an exemplary etching apparatus of the present invention. 本発明の例示的ウェハ台を示す概略図である。1 is a schematic diagram illustrating an exemplary wafer stage of the present invention. FIG. 本発明による例示的台基部の上面図である。FIG. 3 is a top view of an exemplary platform base according to the present invention. 本発明の例示的ウェハ台の断面図である。1 is a cross-sectional view of an exemplary wafer stage of the present invention. 台の上の基板のチャッキングを示す概略図である。It is the schematic which shows the chucking of the board | substrate on a stand. 台からの基板のチャッキング解除を示す概略図である。It is the schematic which shows the chucking cancellation | release of the board | substrate from a base.

本発明は、シリコンウェハ、液晶ディスプレイ基板、太陽電池パネル基板などの基板その他をエッチング、洗浄または前洗浄するためのウェハ台および半導体装置に関する。諸実施形態では、ウェハ台は、化学気相成長（ＣＶＤ）チャンバなどの堆積チャンバ内で使用することができる。半導体装置のウェハ台は、基板を支持することができる。このウェハ台は、パージガスを流すように構成された少なくとも１つのパージ開口と、台の上に基板をチャッキングするように構成された少なくとも１つのチャッキング開口とを含むことができる。この台はまた、少なくとも１つのパージ開口と少なくとも１つのチャッキング開口との間に配置された封止帯を含むこともできる。封止帯は、基板を支持するように構成される。封止帯の構成は、反応物および／または副生成物が昇華時に封止帯上に凝結することを防止できることが望ましい。加えて、封止帯の位置は、基板のチャッキング時に基板が台上で偏位することを防止できることが望ましい。   The present invention relates to a wafer stage and a semiconductor device for etching, cleaning, or pre-cleaning a substrate such as a silicon wafer, a liquid crystal display substrate, and a solar cell panel substrate. In embodiments, the wafer stage can be used in a deposition chamber, such as a chemical vapor deposition (CVD) chamber. The wafer stage of the semiconductor device can support the substrate. The wafer pedestal can include at least one purge opening configured to flow purge gas and at least one chucking opening configured to chuck a substrate over the pedestal. The platform can also include a sealing band disposed between the at least one purge opening and the at least one chucking opening. The sealing strip is configured to support the substrate. The configuration of the sealing band is desirably capable of preventing the reactants and / or by-products from condensing on the sealing band during sublimation. In addition, it is desirable that the position of the sealing band can prevent the substrate from being displaced on the table when the substrate is chucked.

図１は、本発明の例示的エッチング装置の概略断面図である。図１で、エッチング装置１００は、処理領域（標示なし）を画定する処理チャンバ１３０を含む。エッチング装置１００はまた、処理チャンバ１３０内部の中心に置かれたウェハ台１２０上に載っている基板１０１に処理プラズマ１１５を分散させる管、パイプおよび／またはマニホルドなどのプラズマ分配装置１１０も含む。エッチング装置１００は、プラズマ分配装置１１０を介してプラズマ発生器１０５と流体結合させることができる。プラズマ発生器１０５は、基板１０１の上に送出される処理プラズマ１１５を発生させるように構成される。基板１０１は、下位置とシャワーヘッド１５０に近い上位置との間で、ピン１４０によって制御可能に移動させることができる。基板１０１は、半導体膜、ダイオード、デバイス、トランジスタ、相互接続部、回路、またはこれらの様々な組合せなど、少なくとも１つの半導体構造物を含むことができる。諸実施形態では、エッチング装置１００は、例えば、カリフォルニア州、Ｓａｎｔａ ＣｌａｒａのＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃから入手できるＳｉＣｏｎｉ（登録商標）Ｐｒｅｃｌｅａｎチャンバ／システムとすることができる。   FIG. 1 is a schematic cross-sectional view of an exemplary etching apparatus of the present invention. In FIG. 1, the etching apparatus 100 includes a processing chamber 130 that defines a processing region (not labeled). The etching apparatus 100 also includes a plasma distribution device 110 such as a tube, pipe and / or manifold that disperses the processing plasma 115 on the substrate 101 resting on a wafer stage 120 located centrally within the processing chamber 130. The etching apparatus 100 can be fluidly coupled to the plasma generator 105 via the plasma distribution apparatus 110. The plasma generator 105 is configured to generate a processing plasma 115 that is delivered onto the substrate 101. The substrate 101 can be controllably moved by pins 140 between a lower position and an upper position close to the shower head 150. The substrate 101 can include at least one semiconductor structure, such as a semiconductor film, a diode, a device, a transistor, an interconnect, a circuit, or various combinations thereof. In embodiments, the etching apparatus 100 can be, for example, a SiConi (R) Preclean chamber / system available from Applied Materials, Inc., Santa Clara, California.

プラズマ分配装置１１０は、プラズマ発生器１０５によって発生したエッチングプラズマ１１５を処理チャンバ１３０内に導入することができる。いくつかの実施形態では、エッチングプラズマ１１５の配給ラインは、（ｉ）チャンバに入る処理ガスの流れを自動または手動で遮断するために使用できるいくつかの安全遮断弁（図示せず）と、（ｉｉ）配給ライン中を通る処理プラズマ１１５の流れを測定する質量流量コントローラ（図示せず）とを含むことができる。   The plasma distribution device 110 can introduce the etching plasma 115 generated by the plasma generator 105 into the processing chamber 130. In some embodiments, the etch plasma 115 delivery line includes (i) a number of safety shut-off valves (not shown) that can be used to automatically or manually shut off the flow of process gas entering the chamber; ii) a mass flow controller (not shown) that measures the flow of process plasma 115 through the distribution line.

図１で、処理チャンバ１３０のチャンバ壁（標示なし）は、エッチング液および／またはエッチング処理の副生成物がチャンバ壁上に凝結することを実質的に防止する温度を有することができる。ウェハ台１２０は、基板１０１の表面にエッチング液を凝結させるために、エッチング液が基板１０１上の材料と相互作用できるように約−１００℃から約１０００℃の所望の温度をもたらす動作をすることが可能である。諸実施形態では、ウェハ台１２０の温度は約３０℃とすることができる。エッチング液は、基板１０１上の材料と相互作用して副生成物を生成する。副生成物の生成後、ピン１４０が、基板１０１をシャワーヘッド１５０に向けて持ち上げる動作をする。シャワーヘッド１５０は、副生成物を分解および／または昇華するために、約−５０℃から約１，０００℃の処理温度をもたらす動作をすることが可能である。諸実施形態では、シャワーヘッド１５０の温度は約１８０℃とすることができる。分解処理および／または昇華処理によって、基板１０１上の材料は除去される。副生成物を分解する処理は、例えば昇華処理とすることができる。   In FIG. 1, the chamber walls (not labeled) of the processing chamber 130 can have a temperature that substantially prevents the etchant and / or by-products of the etching process from condensing on the chamber walls. The wafer stage 120 operates to provide a desired temperature of about −100 ° C. to about 1000 ° C. so that the etchant can interact with the material on the substrate 101 in order to condense the etchant onto the surface of the substrate 101. Is possible. In embodiments, the temperature of the wafer stage 120 can be about 30 degrees Celsius. The etchant interacts with the material on the substrate 101 to generate a byproduct. After the by-product is generated, the pin 140 operates to lift the substrate 101 toward the shower head 150. The showerhead 150 can operate to provide a processing temperature of about −50 ° C. to about 1,000 ° C. to decompose and / or sublime the by-products. In embodiments, the temperature of the showerhead 150 can be about 180 degrees Celsius. The material on the substrate 101 is removed by the decomposition process and / or the sublimation process. The process for decomposing the by-product can be, for example, a sublimation process.

図１に示されるように、エッチング液、副生成物、および／または分解ガスを望ましくは除去するために、少なくとも１つのポンプチャネル１６０をエッチングチャンバ１３０内に構成することができる。ポンプチャネル１６０は、例えば、副生成物および／またはエッチング液を除去するように構成されているポンプまたはモータ（図示せず）と結合することができる。諸実施形態では、ポンプチャネル１６０は、少なくとも１つの開口部（図示せず）を有することができ、この開口部を通して副生成物を除去できることが望ましい。   As shown in FIG. 1, at least one pump channel 160 can be configured in the etch chamber 130 to desirably remove etchant, by-products, and / or decomposition gases. The pump channel 160 can be coupled to, for example, a pump or motor (not shown) that is configured to remove by-products and / or etchant. In embodiments, the pump channel 160 can have at least one opening (not shown) through which it is desirable to be able to remove by-products.

いくつかの実施形態では、高周波電源（図示せず）をプラズマ発生器１０５に結合して、エッチングプラズマ１１５を形成するようにエッチングガスを励起することができる。高周波電源は、約５ワットから約３０００ワットの高周波電力を与えるように動作可能である。高周波電源は、約１００ｋＨｚから約６４ＭＨｚの高周波で電力を配給することができる。   In some embodiments, a high frequency power source (not shown) can be coupled to the plasma generator 105 to excite the etching gas to form the etching plasma 115. The high frequency power supply is operable to provide about 5 watts to about 3000 watts of high frequency power. The high frequency power supply can distribute power at a high frequency of about 100 kHz to about 64 MHz.

システムコントローラ（図示せず）は、エッチングシステムの働きのすべてを制御することができる。システムコントローラは、メモリなどのコンピュータ可読媒体に記憶されたコンピュータプログラムであるシステム制御ソフトウェアを実行する。諸実施形態では、メモリはハードディスクドライブであるが、他の種類のメモリでもよい。コンピュータプログラムは、ある特定の処理のタイミング、ガスの混合、チャンバ圧力、チャンバ温度、および他のパラメータを指示する一連の命令を含む。例えば、フロッピー（登録商標）ディスクまたは他の適切なドライブを含む別のメモリデバイスに記憶された他のコンピュータプログラムもまた、コントローラを動作させるために使用することができる。   A system controller (not shown) can control all of the functions of the etching system. The system controller executes system control software that is a computer program stored in a computer-readable medium such as a memory. In embodiments, the memory is a hard disk drive, but may be other types of memory. The computer program includes a series of instructions that indicate the timing of certain processes, gas mixing, chamber pressure, chamber temperature, and other parameters. Other computer programs stored on another memory device including, for example, a floppy disk or other suitable drive can also be used to operate the controller.

基板を覆う膜の一部分をエッチングする処理は、上述のコントローラによって実行されるコンピュータプログラム製品を使用して実施することができる。コンピュータプログラムコードは、従来のコンピュータ可読プログラミング言語、例えば、６８０００アセンブリ言語、Ｃ、Ｃ＋＋、パスカル、フォートランその他で書くことができる。適切なプログラムコードは、従来のテキストエディタを使用して単一のファイルまたは多数のファイルに入力され、コンピュータのメモリシステムなどのコンピュータ使用可能媒体に記憶され、または取り入れられる。入力されたコードテキストが高級言語によるものである場合、そのコードはコンパイルされ、結果として得られたコンパイラコードが次に、プリコンパイルされたＭｉｃｒｏｓｏｆｔ Ｗｉｎｄｏｗｓ（登録商標）ライブラリルーチンの目的コードとリンクされる。リンクされ、コンパイルされた目的コードを実行するために、システムユーザはその目的コードを呼び出し、それによってコンピュータシステムがコードをメモリ内にロードすることになる。次に、ＣＰＵはコードを読み出し、実行して、プログラム内で識別されたタスクを行う。   The process of etching a portion of the film covering the substrate can be performed using a computer program product executed by the controller described above. The computer program code can be written in a conventional computer readable programming language, such as 68000 assembly language, C, C ++, Pascal, Fortran, etc. Appropriate program code is entered into a single file or multiple files using a conventional text editor, and stored or incorporated into a computer-usable medium, such as a computer memory system. If the entered code text is in a high-level language, the code is compiled and the resulting compiler code is then linked with the target code of the precompiled Microsoft Windows® library routine. . In order to execute the linked and compiled target code, the system user calls the target code, which causes the computer system to load the code into memory. The CPU then reads and executes the code to perform the task identified in the program.

図２は、本発明の例示的ウェハ台を示す概略図である。図２で、ウェハ台１２０は台１２０ａおよび台基部１２０ｂを含む。台１２０ａは、台基部１２０ｂと組立て結合することができる。諸実施形態では、台１２０ａは、酸化アルミニウム（Ａｌ２Ｏ３）台などのセラミック台である。ペデスタル台基部１２０ｂは、金属台とすることができる。金属台基部１２０ｂは、例えば、ろう付けされる複数の金属構成要素を含むことができる。 FIG. 2 is a schematic diagram illustrating an exemplary wafer stage of the present invention. In FIG. 2, the wafer table 120 includes a table 120a and a table base 120b. The base 120a can be assembled and coupled to the base 120b. In various embodiments, the pedestal 120a is a ceramic pedestal such as an aluminum oxide (Al 2 O 3 ) pedestal. The pedestal base 120b can be a metal base. The metal platform base 120b can include, for example, a plurality of metal components to be brazed.

図２に示されるように、台１２０ａは、少なくとも１つのチャッキング開口２１０、および少なくとも１つのパージ開口２３０を含む。さらに、台１２０ａは、チャッキング開口２１０とパージ開口２３０の間に配置された封止帯２２０を含むこともできる。封止帯２２０と台１２０ａは、同一の材料を有することができる。チャッキング開口２１０は、エッチング処理中に基板１０１（図１に示す）をウェハ台１２０上にチャッキングするように構成される。パージ開口２３０は、エッチング液および／または副生成物を封止帯２２０から取り除くためのパージガスを流すように構成される。封止帯２２０は、チャッキング状態時に基板１０１と接触し、かつ／または基板１０１を支持するように構成される。チャッキング開口２１０は、パージング開口２３０よりも台１２０ａの中心により近く配置することができる。諸実施形態では、封止帯２２０は、エッチング処理中に生成されたエッチング液および／または副生成物が封止帯２２０上に凝結することを実質的になくすことができるように、台１２０ａの縁部から離して配置される。   As shown in FIG. 2, the platform 120 a includes at least one chucking opening 210 and at least one purge opening 230. Further, the pedestal 120 a can also include a sealing band 220 disposed between the chucking opening 210 and the purge opening 230. The sealing band 220 and the base 120a can have the same material. The chucking opening 210 is configured to chuck the substrate 101 (shown in FIG. 1) on the wafer stage 120 during the etching process. The purge opening 230 is configured to flow a purge gas for removing the etchant and / or by-products from the sealing band 220. The sealing strip 220 is configured to contact and / or support the substrate 101 in a chucked state. The chucking opening 210 may be disposed closer to the center of the table 120a than the purging opening 230. In embodiments, the encapsulating band 220 may be formed on the pedestal 120a such that the etchant and / or by-products generated during the etching process can be substantially free from condensation on the encapsulating band 220. Located away from the edge.

諸実施形態では、封止帯２２０は、基板１０１（図１に示す）の上に加えられる処理圧力が、エッチング処理の間チャッキング圧力によって実質的に相殺されるように配置される。処理圧力をチャッキング圧力で実質的にゼロにすることによって、封止帯２２０の構成で、望ましくはエッチング処理中の基板１０１の中心および／または縁部の偏位を防止することができる。１２インチエッチング装置の実施形態では、封止帯２２０は、台１２０ａの中心から約２．５インチ〜約４インチに配置される。諸実施形態では、封止帯２２０は、台１２０ａの中心から約２．５インチ離れている。   In embodiments, the sealing band 220 is positioned such that the processing pressure applied over the substrate 101 (shown in FIG. 1) is substantially offset by the chucking pressure during the etching process. By making the processing pressure substantially zero at the chucking pressure, the configuration of the sealing band 220 can desirably prevent displacement of the center and / or edge of the substrate 101 during the etching process. In the 12-inch etcher embodiment, the sealing band 220 is located from about 2.5 inches to about 4 inches from the center of the platform 120a. In embodiments, the sealing strip 220 is about 2.5 inches away from the center of the platform 120a.

表１は、封止帯２２０の位置と、基板１０１の中心偏位および縁部偏位との関係を示す。表Ｉで、台１２０ａは約１２インチの直径を有し、ウェハ厚さは約７５０μｍ、処理圧力とチャッキング圧力との圧力差は約０．５トール、ヤング率（Ｅ）は約１８．８×１０６ｐｓｉ、ポアソン比（ｖ）は約０．２８である。 Table 1 shows the relationship between the position of the sealing band 220 and the center deviation and edge deviation of the substrate 101. In Table I, the pedestal 120a has a diameter of about 12 inches, the wafer thickness is about 750 μm, the pressure difference between the processing pressure and the chucking pressure is about 0.5 Torr, and the Young's modulus (E) is about 18.8. × 10 6 psi, Poisson's ratio (v) is about 0.28.

Figure 0005367068
Figure 0005367068

表１に示されるように、台１２０ａの中心から約２．５インチ離れた位置に配置された封止帯２２０では、台１２０ａの中心から約３、４、または６インチ離れた位置に配置された封止帯２２０よりも望ましい基板１０１の中心偏位および縁部偏位を得ることができる。本発明の範囲は、上記で説明した実施形態に限定されないことに留意されたい。当業者であれば、所望の中心偏位および縁部偏位が得られるように封止帯２２０の位置を修正することができる。   As shown in Table 1, the sealing band 220 located approximately 2.5 inches away from the center of the table 120a is located approximately 3, 4, or 6 inches away from the center of the table 120a. Thus, it is possible to obtain the center deviation and edge deviation of the substrate 101 which are more desirable than the sealing band 220. It should be noted that the scope of the present invention is not limited to the embodiments described above. One skilled in the art can modify the position of the sealing band 220 to achieve the desired center and edge deviations.

図２で、チャッキング開口２１０は、台１２０ａと台基部１２０ｂの間の環状チャッキングチャネル２１０ａと流体結合される。パージング開口２３０は、台１２０ａと台基部１２０ｂの間の環状パージングチャネル２３０ａと流体結合される。図３は、本発明による例示的台基部の上面図である。図３で、環状パージングチャネル２３０ａは、環状チャッキングチャネル２１０ａよりも台基部１２０ｂの中心から離れている。諸実施形態では、環状パージングチャネル２３０ａは、少なくとも１つの分離チャネル３１０によって環状チャッキングチャネル２１０ａと結合させることができる。各分離チャネル３１０は、環状パージングチャネル２３０ａを環状チャッキングチャネル２１０ａから分離するために、テフロン（登録商標）などの分離材料３１０ａを含む。１２インチエッチング装置の実施形態では、環状チャッキングチャネル２１０ａは、台基部１２０ｂの中心から約２．２５インチ離れていてよく、環状パージングチャネル２３０ａは、台基部１２０ｂの中心から約４．２５インチ離れていてよい。   In FIG. 2, the chucking opening 210 is fluidly coupled to the annular chucking channel 210a between the pedestal 120a and the pedestal base 120b. The purging opening 230 is fluidly coupled to the annular purging channel 230a between the pedestal 120a and the pedestal base 120b. FIG. 3 is a top view of an exemplary platform base according to the present invention. In FIG. 3, the annular purging channel 230a is further from the center of the pedestal base 120b than the annular chucking channel 210a. In embodiments, the annular purging channel 230a can be coupled to the annular chucking channel 210a by at least one separation channel 310. Each separation channel 310 includes a separation material 310a, such as Teflon, to separate the annular purging channel 230a from the annular chucking channel 210a. In a 12 inch etcher embodiment, the annular chucking channel 210a may be about 2.25 inches away from the center of the pedestal base 120b and the annular purging channel 230a is about 4.25 inches away from the center of the pedestal base 120b. It may be.

図４は、本発明の例示的ウェハ台の断面図である。図４で、台１２０ａは台基部１２０ｂの上に配置される。ガス入口通路４１０は、パージガスを供給するために環状パージングチャネル２３０ａと流体結合される。冷却チャネル４２０は、台基部１２０ｂおよび台１２０ａを所望の温度にするために、液体および／または気体などの冷却流体を供給するように台基部１２０ｂ内に構成される。開口４３０は、台１２０ａおよび台基部１２０ｂ内に構成され、その中を通ってピン１４０（図１に示す）が制御可能に移動できるようにして基板１０１（図１に示す）を持ち上げることができる。   FIG. 4 is a cross-sectional view of an exemplary wafer stage of the present invention. In FIG. 4, the table 120a is disposed on the table base 120b. The gas inlet passage 410 is fluidly coupled with the annular purging channel 230a for supplying purge gas. The cooling channel 420 is configured in the pedestal base 120b to supply a cooling fluid such as liquid and / or gas to bring the pedestal base 120b and the pedestal 120a to a desired temperature. An opening 430 is configured in the pedestal 120a and pedestal base 120b, through which the pins 140 (shown in FIG. 1) can be controllably moved to lift the substrate 101 (shown in FIG. 1). .

図５は、台の上の基板のチャッキングを示す概略図である。図５で、基板１０１は台１２０ａの上でチャッキングされて、封止帯２２０と接触する。縁部リング５１０が、台基部１２０ｂの上に台１２０ａを固定するように構成される。エッチング液の生成および／またはエッチング液の凝結の間、処理圧力が基板１０１の上に発生する。この処理圧力により、基板１０１の偏位が生じる可能性がある。基板１０１の偏位を回避するために、ガス流をチャッキング開口２１０を通じて排出して、処理圧力を実質的に相殺するチャッキング圧力を発生させることができる。加えて、パージ開口２３０、および台１２０ａと縁部リング５１０の間の隙間（標示なし）を通してパージガスを供給して、エッチング処理のエッチング液および／または副生成物を取り除くことができる。パージガスは、エッチング液および／または副生成物が封止帯２２０上に凝結することが実質的にないように、エッチング処理中に生成されたエッチング液および／または副生成物を除去することが望ましい。   FIG. 5 is a schematic diagram showing chucking of a substrate on a table. In FIG. 5, the substrate 101 is chucked on the table 120 a and comes into contact with the sealing band 220. An edge ring 510 is configured to secure the pedestal 120a on the pedestal base 120b. A process pressure is generated on the substrate 101 during the generation of the etchant and / or condensation of the etchant. This processing pressure may cause the substrate 101 to be displaced. To avoid deflection of the substrate 101, a gas flow can be exhausted through the chucking opening 210 to generate a chucking pressure that substantially cancels the process pressure. In addition, a purge gas may be supplied through the purge opening 230 and a gap (not labeled) between the pedestal 120a and the edge ring 510 to remove etchant and / or byproducts of the etching process. Desirably, the purge gas removes etchant and / or byproducts generated during the etching process so that the etchant and / or byproducts are substantially free of condensation on the sealing band 220. .

図６は、台からの基板のチャッキング解除を示す概略図である。昇華中、基板１０１はピン１４０（図６には示していないが図１に示す）によって、加熱されたシャワーヘッド１５０に向けて持ち上げられる。パージガスは、チャッキング開口２１０、パージング開口２３０、および／または台１２０ａと縁部リング５１０の間の隙間を通して供給されて、封止帯２２０上への粒子および／または副生成物の凝結を防止することができる。図示のように、封止帯２２０は、台１２０ａの縁部から離して配置される。エッチング液および／または副生成物は、基板１０１の縁部からある距離を流れて封止帯２２０に達し、その上に凝結する必要がある。この距離により望ましくは、封止帯２２０上に副生成物および／または粒子が凝結する可能性を低減することができる。封止帯２２０は、副生成物および／または粒子を凝結させることが実質的にないので、チャンバ１３０内で処理される基板１０１の表面は望ましくは平らにでき、均一なエッチングを実現することができる。   FIG. 6 is a schematic view showing the dechucking of the substrate from the table. During sublimation, the substrate 101 is lifted towards the heated shower head 150 by pins 140 (not shown in FIG. 6 but shown in FIG. 1). Purge gas is supplied through the chucking opening 210, purging opening 230, and / or the gap between the pedestal 120a and the edge ring 510 to prevent condensation of particles and / or byproducts on the sealing band 220. be able to. As illustrated, the sealing band 220 is disposed away from the edge of the table 120a. The etchant and / or by-product must flow a certain distance from the edge of the substrate 101 to reach the sealing band 220 and condense on it. This distance may desirably reduce the likelihood of by-products and / or particles condensing on the sealing band 220. Since the sealing band 220 is substantially free of by-products and / or particles, the surface of the substrate 101 processed in the chamber 130 can desirably be flattened to achieve uniform etching. it can.

いくつかの実施形態について説明してきたが、様々な修正形態、代替構造物、および等価物を本発明の趣旨から逸脱することなく使用できることが当業者には理解されよう。加えて、本発明を不必要に不明瞭にすることを避けるために、いくつかのよく知られた処理および要素については説明していない。したがって、上記の説明は、本発明の範囲を限定するものとして解釈されるべきではない。   While several embodiments have been described, those skilled in the art will appreciate that various modifications, alternative constructions, and equivalents can be used without departing from the spirit of the invention. In addition, some well-known processes and elements have not been described in order to avoid unnecessarily obscuring the present invention. Therefore, the above description should not be taken as limiting the scope of the invention.

ある範囲の値が与えられている場合、その範囲の上限と下限の間の、特に指示がない限り下限の１０分の１までの、各介在値もまた明確に開示されていることを理解されたい。提示された範囲内のどれかの提示値または介在値と、その提示された範囲内の他のどれかの提示値または介在値との間のそれぞれのより小さな範囲が包含される。これらのより小さな範囲の上限および下限は、別個にその範囲内に含まれることも除外されることもあり、そのより小さな範囲内に上下限のどちらかまたは両方が含まれ、あるいはどちらも含まれないそれぞれの範囲もまた、提示された範囲内の明確に除外されたいずれの限度も条件として、本発明の中に包含される。提示された範囲が一方または両方の限度を含む場合、これらの含まれた限度のどちらかまたは両方を除外する範囲もまた含まれる。   When a range of values is given, it is understood that each intervening value between the upper and lower limits of the range, up to 1/10 of the lower limit unless otherwise indicated, is also explicitly disclosed. I want. Each smaller range between any presented value or intervening value within the presented range and any other presented value or intervening value within the presented range is included. The upper and lower limits of these smaller ranges may be included or excluded separately within that range, and either or both of the upper and lower limits may be included within that smaller range, or both. Each non-exclusive range is also included in the present invention, subject to any expressly excluded limit within the stated range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included.

本明細書および添付の特許請求の範囲では、単数形「１つの（ａ）」、「１つの（ａｎ）」、および「その（ｔｈｅ）」は、特に指示がない限り複数の指示物を含む。したがって、例えば、「１つの方法」への言及は、複数のそのような方法を含み、「その前駆物質」への言及は、１つまたは複数の前駆物質、および当業者に知られているその等価物などへの言及を含む。   In this specification and the appended claims, the singular forms “a”, “an”, and “the” include plural referents unless the context clearly dictates otherwise. . Thus, for example, reference to “a method” includes a plurality of such methods, and reference to “a precursor thereof” is one or more precursors, and those known to those skilled in the art Includes references to equivalents and the like.

また、「備える（ｃｏｍｐｒｉｓｅ）」、「備えている（ｃｏｍｐｒｉｓｉｎｇ）」、「含む（ｉｎｃｌｕｄｅ）」、「含んでいる（ｉｎｃｌｕｄｉｎｇ）」、および「含む（ｉｎｃｌｕｄｅｓ）」という語は、本明細書および添付の特許請求の範囲では、提示された特徴、完全体、構成要素、またはステップの存在を明示するものであるが、他の１つまたは複数の特徴、完全体、構成要素、ステップ、動作、または群の、存在または追加を排除しない。   Also, the terms “comprising”, “comprising”, “include”, “including”, and “includes” are used herein and in the accompanying drawings. The claims claim that the presence of a feature, whole, component, or step is clearly stated, but one or more other features, whole, component, step, action, or Does not exclude the presence or addition of groups.

Claims (14)

半導体装置の、基板を支持できるウェハ台であって、前記ウェハ台は、
上表面を含み、前記上表面は、パージガスを流すように構成された複数のパージ開口と、前記台の上の前記基板をチャッキングするためにガスを除去するように構成された複数のチャッキング開口とを有し、
前記上表面上に配置され、前記基板に接触するように構成された封止帯を含み、前記封止帯は、前記複数のパージ開口と前記複数のチャッキング開口の間に配置されており、
前記封止帯を取り囲む凹部を含み、前記複数のパージ開口は前記凹部内に配置され、かつ、前記基板が前記ウェハ台に支持されているとき、前記封止帯が、前記基板の縁部より内側で前記基板と接触するように、かつ、前記基板の前記縁部が前記凹部上に伸びるように、前記凹部が、前記ウェハ台の前記上表面と前記基板の間に隙間を作るように、構成され、
前記封止帯が、エッチング処理中に生成される副生成物が前記封止帯上に形成されることが実質的にないように前記台の縁部から離れて前記台の中心に近づけて配置され、
前記封止帯が、前記台の前記中心から約６．３５ｃｍ〜約１０．１６ｃｍ離れている、ウェハ台。 A wafer stage capable of supporting a substrate of a semiconductor device, wherein the wafer stage is
Includes a top surface, said top surface includes a plurality of purge opening configured to flow a purge gas, a plurality of which are configured to remove gas to chucking the substrate on said stage chucking An opening ,
Disposed on said top surface includes a configured sealing strip to contact the substrate, the sealing band is arranged between said plurality of purge apertures plurality of chucking opening,
Including a recess surrounding the sealing band, wherein the plurality of purge openings are disposed in the recess, and when the substrate is supported by the wafer stage, the sealing band is closer to the edge of the substrate. Such that the recess creates a gap between the upper surface of the wafer stage and the substrate so that it contacts the substrate on the inside and the edge of the substrate extends over the recess. Configured,
The sealing band is disposed away from the edge of the table and close to the center of the table so that a by-product generated during the etching process is substantially not formed on the sealing band. And
A wafer stage, wherein the sealing strip is about 6.35 cm to about 10.16 cm from the center of the stage . 前記複数のチャッキング開口が、前記複数のパージ開口よりも前記台の中心により近い、請求項１に記載のウェハ台。 The wafer stage of claim 1, wherein the plurality of chucking openings are closer to the center of the stage than the plurality of purge openings. 前記封止帯が、エッチング処理中に処理圧力がチャッキング圧力によって実質的に補償されるように前記台の前記上表面上に配置される、請求項１に記載のウェハ台。   The wafer stage of claim 1, wherein the sealing band is disposed on the upper surface of the stage such that a processing pressure is substantially compensated by a chucking pressure during an etching process. 前記台と結合された台基部アセンブリをさらに含み、前記台がセラミック台であり、前記台基部アセンブリが金属台である、請求項１に記載のウェハ台。   The wafer pedestal of claim 1, further comprising a pedestal base assembly coupled to the pedestal, wherein the pedestal is a ceramic pedestal and the pedestal base assembly is a metal pedestal. 前記台基部アセンブリが少なくとも１つの環状チャッキングチャネル、および少なくとも１つの環状パージングチャネルを有し、前記少なくとも１つの環状チャッキングチャネルが、前記少なくとも１つの環状パージングチャネルよりも前記台基部アセンブリの中心に近い、請求項４に記載のウェハ台。 The pedestal base assembly has at least one annular chucking channel and at least one annular purging channel, the at least one annular chucking channel being more central to the pedestal base assembly than the at least one annular purging channel. The wafer stage according to claim 4 which is near. 前記複数のチャッキング開口が、前記少なくとも１つの環状チャッキングチャネルと流体結合され、前記複数のパージ開口が、前記少なくとも１つの環状パージングチャネルと流体結合される、請求項５に記載のウェハ台。 The wafer stage of claim 5 , wherein the plurality of chucking openings are fluidly coupled with the at least one annular chucking channel and the plurality of purge openings are fluidly coupled with the at least one annular purging channel. 前記環状チャッキングチャネルが、前記環状チャッキングチャネルと前記環状パージングチャネルを分離するように構成された少なくとも１つの分離チャネルによって、前記環状パージングチャネルと結合される、請求項６に記載のウェハ台。 The wafer stage of claim 6 , wherein the annular chucking channel is coupled to the annular purging channel by at least one separation channel configured to separate the annular chucking channel and the annular purging channel. 処理領域を画定するチャンバと、
前記チャンバの上部領域に配置されたシャワーヘッドと、
前記チャンバの下部領域に配置されたウェハ台とを含む半導体装置であって、前記ウェハ台は、
上表面を含み、前記上表面は、パージガスを流すように構成された複数のパージ開口と、前記台の上の前記基板をチャッキングするためにガスを除去するように構成された複数のチャッキング開口とを有し、
前記上表面上に配置され、前記基板に接触するように構成された封止帯を含み、前記封止帯は、前記複数のパージ開口と前記複数のチャッキング開口の間に配置されており、
前記封止帯を取り囲む凹部を含み、前記複数のパージ開口は前記凹部内に配置され、かつ、前記基板が前記ウェハ台に支持されているとき、前記封止帯が、前記基板の縁部より内側で前記基板と接触するように、かつ、前記基板の前記縁部が前記凹部上に伸びるように、前記凹部が、前記ウェハ台の前記上表面と前記基板の間に隙間を作るように、構成され、
前記封止帯が、エッチング処理中に生成される副生成物が前記封止帯上に形成されることが実質的にないように前記台の縁部から離れて前記台の中心に近づけて配置され、
前記封止帯が、前記台の前記中心から約６．３５ｃｍ〜約１０．１６ｃｍ離れている、半導体装置。 A chamber defining a processing region;
A showerhead disposed in the upper region of the chamber;
A semiconductor device including a wafer table disposed in a lower region of the chamber, wherein the wafer table is
Includes a top surface, said top surface includes a plurality of purge opening configured to flow a purge gas, a plurality of which are configured to remove gas to chucking the substrate on said stage chucking An opening ,
Disposed on said top surface includes a configured sealing strip to contact the substrate, the sealing band is arranged between said plurality of purge apertures plurality of chucking opening,
Including a recess surrounding the sealing band, wherein the plurality of purge openings are disposed in the recess, and when the substrate is supported by the wafer stage, the sealing band is closer to the edge of the substrate. Such that the recess creates a gap between the upper surface of the wafer stage and the substrate so that it contacts the substrate on the inside and the edge of the substrate extends over the recess. Configured,
The sealing band is disposed away from the edge of the table and close to the center of the table so that a by-product generated during the etching process is substantially not formed on the sealing band. And
The semiconductor device , wherein the sealing strip is about 6.35 cm to about 10.16 cm from the center of the platform . 前記複数のチャッキング開口が、前記複数のパージ開口よりも前記台の中心により近い、請求項８記載の半導体装置。 The semiconductor device according to claim 8 , wherein the plurality of chucking openings are closer to the center of the table than the plurality of purge openings. 前記封止帯が、エッチング処理中に処理圧力がチャッキング圧力によって実質的に補償されるように前記台の前記上表面上に配置される、請求項８に記載の半導体装置。 The semiconductor device according to claim 8 , wherein the sealing band is disposed on the upper surface of the stage such that a processing pressure is substantially compensated by a chucking pressure during an etching process. 前記ウェハ台が、前記台と結合された台基部アセンブリをさらに含み、前記台がセラミック台であり、前記台基部アセンブリが金属台である、請求項８に記載の半導体装置。 The semiconductor device according to claim 8 , wherein the wafer stage further includes a stage base assembly coupled to the stage, the stage being a ceramic stage, and the stage base assembly being a metal stage. 前記台基部アセンブリが少なくとも１つの環状チャッキングチャネル、および少なくとも１つの環状パージングチャネルを有し、前記少なくとも１つの環状チャッキングチャネルが、前記少なくとも１つの環状パージングチャネルよりも前記台基部アセンブリの中心に近い、請求項１１に記載の半導体装置。 The pedestal base assembly has at least one annular chucking channel and at least one annular purging channel, the at least one annular chucking channel being more central to the pedestal base assembly than the at least one annular purging channel. The semiconductor device according to claim 11, which is close. 前記複数のチャッキング開口が、前記少なくとも１つの環状チャッキングチャネルと流体結合され、前記複数のパージ開口が、前記少なくとも１つの環状パージングチャネルと流体結合される、請求項１２に記載の半導体装置。 The semiconductor device of claim 12 , wherein the plurality of chucking openings are fluidly coupled with the at least one annular chucking channel, and the plurality of purge openings are fluidly coupled with the at least one annular purging channel. 前記環状チャッキングチャネルが、前記環状チャッキングチャネルと前記環状パージングチャネルを分離するように構成された少なくとも１つの分離チャネルによって、前記環状パージングチャネルと結合される、請求項１３に記載の半導体装置。 The semiconductor device of claim 13 , wherein the annular chucking channel is coupled to the annular purging channel by at least one separation channel configured to separate the annular chucking channel and the annular purging channel.
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