JP5353284B2 - Non-contact IC label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC label whose reliability and security nature are high, and whose design effect is also high. <P>SOLUTION: The non-contact IC label 1 having an IC chip 5 by which data communication is attainable with an external reader by non-contact is characterized by providing: a transparent label base material 2; a functional layer 6 which is provided on a lower surface of the label base material 2; a conductive layer 3 which is provided by being joined to a lower surface of the functional layer 6 and functions as an antenna of the IC chip 5; a connection layer 4 which is electrically connected to the IC chip 5; a mask layer 7 provided between the conductive layer 3 and the connection layer 4 to perform capacitance coupling of the conductive layer 3 and the connection layer 4; and an insulating concealment layer 8 which is provided between the conductive layer 3 and the connection layer 4, and disables visual recognition of the connection layer 4 under visible light from the label base material 2. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a non-contact IC label that includes an optical change device that exhibits an optical visual effect and that can send and receive data to and from an external data reader without contact.

  Conventionally, non-contact IC labels having an IC chip and an antenna are used for merchandise management in retail stores, rental stores, and the like. This is a non-contact IC label, the product to be managed is attached as an adherend, the data stored in the IC chip is read and written by a dedicated data read / write device, and the product entry / exit management, inventory management, lending management, etc. are performed Is. Since the IC chip is provided, not only the product code but also abundant information such as the arrival date and the person in charge can be managed together with the product. Particularly in article management, non-contact IC labels using microwaves are often used because the communication distance is as long as 1 to 2 m compared to those using electrostatic coupling or electromagnetic induction.

  Further, as non-contact IC labels become widespread, it is expected to combine an optical variable device (hereinafter referred to as “OVD”) with the non-contact IC label. OVD is a general term for multilayer thin films that change color depending on the viewing angle by overlapping holograms, diffraction gratings, and thin films with different optical characteristics that can express stereoscopic images and special decorative images using light interference. Since these OVDs give a unique impression such as a three-dimensional image and a color change, they have an excellent decorative effect, and are used for general printed materials such as various packaging materials, picture books, catalogs and the like. Furthermore, since OVD requires advanced manufacturing techniques, it is also used for credit cards, securities, certificates, etc. as a means for preventing forgery.

Combining the above-mentioned contactless IC label and OVD, realizes a higher level of forgery prevention effect by combining the data read / write function of the contactless IC label with the anti-counterfeiting function and decoration effect of OVD. Or there exists an advantage that the label which has a decoration effect and a merchandise management function can be comprised.
As an example, a non-contact type data transmitter / receiver has been proposed in which hologram processing is performed on a required position of a thin metal plate provided with a conductive metal layer and the conductive metal layer is used as an antenna pattern (see, for example, Patent Document 1). .

JP 2002-42088 A

  When forming the non-contact type data transmitter / receiver described in Patent Document 1, the upper surface of the non-contact type data transmitter / receiver is generally formed from a transparent label base material so that the hologram can be viewed. It is. However, if the label base material is transparent, the antenna pattern connected to the conductive metal layer is also visible from the top surface, which is a factor that impairs the appearance. In order to enable communication, the entire antenna pattern cannot be covered with the conductive metal layer, which causes a problem in that it becomes an obstacle to improving the design.

  The present invention has been made in view of the above circumstances, and has a function suitable for authentication and the like based on the ability to mechanically read data in an IC chip possessed by a non-contact IC tag, and advanced technology possessed by an optical change device. For non-contact IC labels that have functions and design features that are suitable for security measures related to optical properties and manufacturing difficulties, the design of antenna patterns and other parts that may impair design properties has been improved to make it more difficult to see. An object of the present invention is to provide a non-contact IC tag having excellent properties.

The non-contact IC label according to the first aspect of the present invention is a non-contact IC label having an IC chip capable of data communication without contact with an external reading device, the transparent label base material, and the label base material An optical change device provided on the lower surface of the optical change device; a conductive layer provided bonded to the lower surface of the optical change device and functioning as an antenna of the IC chip; and a connection layer electrically connected to the IC chip; An insulating layer provided between the conductive layer and the connection layer, for capacitively coupling the conductive layer and the connection layer, and without being provided between the conductive layer and the insulating layer. An insulating concealing layer provided between the optical change device and the connection layer, which makes it impossible to visually recognize the connection layer under visible light from the label base material, and the insulating layer and the The connection layer is the concealment Characterized in that it is bonded directly without interposing a.

  The “lower surface” refers to a surface on the side facing the adherend when the non-contact IC label is attached to the adherend such as an article.

According to the non-contact IC label described above, since the insulating layer and the connection layer are directly bonded without interposing a concealing layer, an IC label in which the generation of coupling loss is suppressed while maintaining a high design effect. Can be configured.

The end of the insulating layer on the connection layer side and the end of the connection layer on the insulating layer side may be directly joined.

The article according to the second aspect of the present invention is characterized in that the non-contact IC label of the present invention is adhered.
According to the article of the present invention, a high design effect is imparted by the non-contact IC label, and high security can be ensured.

  According to the non-contact IC label of the present invention, a function suitable for authentication and the like by mechanically reading data in an IC chip possessed by a non-contact IC tag, and optical characteristics by an advanced technology possessed by an optical change device For non-contact IC labels that have functions and design features suitable for security measures related to manufacturing difficulties, the antenna pattern and other components that may impair design properties have been improved so that the structure is difficult to see, resulting in better design A contactless IC tag can be provided.

It is a top view which shows the non-contact IC label of 1st Embodiment of this invention. It is a bottom view of the non-contact IC label. It is sectional drawing in the AA of FIG. It is a top view which shows the non-contact IC label of 2nd Embodiment of this invention. It is sectional drawing in the BB line of FIG. It is sectional drawing which shows the modification of the non-contact IC label of this invention. It is sectional drawing in the position corresponding to the AA line of FIG. 1 of the non-contact IC label of 3rd Embodiment of this invention. It is sectional drawing in the AA of FIG. It is a figure which shows the model of the simulation using a three-dimensional electromagnetic field simulator. It is a figure which shows the structure of the dielectric layer used for the simulation. It is a figure which shows the structure of the dielectric layer used for the simulation. It is a graph which shows the result of the simulation. It is a graph which shows the result of the simulation.

A non-contact IC label (hereinafter simply referred to as “IC label”) according to a first embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is a plan view showing an IC label 1 of this embodiment, and FIG. 2 is a bottom view of the IC label 1. As shown in FIGS. 1 and 2, the IC label 1 includes a transparent label substrate 2 provided on the upper surface, a conductive layer 3 provided on the lower surface side of the label substrate 2, and a lower surface side of the conductive layer 3. Are provided with a connection layer 4 and an IC chip 5 mounted on the connection layer 4.

  The label substrate 2 is made of a transparent resin or the like that allows the conductive layer 3 to be visually recognized. Specifically, for example, a transparent sheet-like material made of a resin such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), acrylonitrile, butadiene, styrene copolymer synthetic resin (ABS), or the like is preferably used. it can. In addition, the label base material 2 may not necessarily be colorless as long as the lower conductive layer 3 can be visually recognized, and may be formed of a colored material having transparency.

3 is a cross-sectional view taken along line AA in FIG. A functional layer 6 functioning as OVD is formed on the surface of the label substrate 2 facing the conductive layer 3. The functional layer 6 is a layered structure in which a three-dimensional image is expressed or a color shift that changes in color depending on the viewing angle, and a relief type or volume type hologram or a plurality of types of diffraction gratings are arranged as pixels. Diffraction grating images such as grating images and pixelgrams, ceramics that cause color shift, thin film laminates of metal materials, and the like are appropriately selected and formed by known methods.
Among these, in consideration of mass productivity and cost, a relief hologram (diffraction grating) or a multilayer thin film type is preferable.

  The conductive layer 3 is formed as a deposited film by depositing a metal such as aluminum on the functional layer 6. The conductive layer 3 can be formed in a desired shape by covering with a mask layer (insulating layer) 7 having a desired shape made of polyamideimide or the like and subjected to a demetallization process, thereby improving the design. In the IC label 1 of this embodiment, as shown in FIGS. 1 and 2, the conductive layer 3 is formed in a butterfly shape as an example.

  The conductive layer 3 is connected to the IC chip 5 through the connection layer 4 to enable non-contact communication of the IC chip 5 and enhance the visual effect exhibited by the functional layer 6. In particular, when the functional layer 6 is a relief hologram, a diffraction grating, or the like, these diffraction effects are enhanced, so that a more beautiful design can be obtained and the forgery can be prevented.

  In the lower surface of the mask layer 7 and the lower surface of the label base 2, the connection layer 4 and the IC chip 5 are visible when the IC label 1 is viewed from the upper surface (plan view). A concealing layer 8 is provided to make it invisible underneath.

As will be described later, the masking layer 8 is formed of a non-conductive material so that the conductive layer 3 and the connection layer 4 can be capacitively coupled. In the present embodiment, the concealing layer 8 is formed by printing non-conductive ink.
Moreover, the concealing layer 8 of this embodiment is formed using the infrared rays transmission ink which has the characteristic which permeate | transmits infrared rays among nonelectroconductive inks. As a material for forming such a concealing layer, a gelatin film, a paint containing an infrared transmitting dye such as Orazole Black or Orazole 2RG, a normal ultraviolet curable process ink, or the like can be used. This has the advantage that the mounting state of the IC chip 5 with respect to the connection layer 4 can be confirmed. This will be described later.

  The appearance of the shielding layer 8 under visible light is not particularly limited as long as the connection layer 4 and the IC chip 5 are not visible in plan view. For example, it may reflect visible light of a predetermined wavelength to exhibit a specific color, or may be black that absorbs visible light of all wavelengths. Further, visible light having all wavelengths may be reflected.

The concealing layer 8 of various aspects as described above can be used properly depending on the purpose. For example, in the case of a specific color, only the conductive layer 3 in the shape of a butterfly is obtained by aligning the color of the adherend such as the article to which the IC label 1 is adhered and the color of the concealing layer 8. Has the appearance of being adhered to the adherend. Therefore, the design can be enhanced so as to give the user a more natural impression.
On the other hand, a material that reflects visible light of all wavelengths has a mirror-like appearance and cannot be distinguished from the conductive layer 3 under visible light. If the upper surface of the connection layer 4 and the IC chip 5 is completely covered with the conductive layer 3, non-contact communication of the IC chip 5 cannot be performed. When provided, the connection layer 4 and the IC chip 5 can be embedded integrally with the conductive layer 3 in terms of appearance under visible light.

  The connection layer 4 that assists the data communication of the IC chip 5 is printed on the lower surface of the concealing layer 8 using a conductive paste such as silver paste ink by a known method, for example, as shown in FIG. Is formed. As shown in FIG. 2, the end portion of the connection layer 4 is formed so as to overlap the conductive layer 3 in plan view. The printed connection layer 4 has a thickness of about 5 micrometers (μm) and hardly affects the flatness of the IC label 1.

  The IC chip 5 is made of silicon single crystal or the like, and is mounted by being electrically connected to the connection layer 4 by bonding a bump (not shown) by heat and pressure using an anisotropic conductive adhesive or the like. The conductive layer 3 and the connection layer 4 are electrically connected by capacitive coupling using the insulating mask layer 7 and the concealing layer 8 interposed between them as a dielectric, and the IC chip 5 is connected to the outside. The non-contact data communication of the radio system is possible with the reader. The frequencies used for communication between the IC chip 5 and an external reader are a microwave band (2.45 GHz) and a UHF wave band (850 to 950 MHz).

The IC chip 5 may be provided with identification information (unique ID, hereinafter referred to as “UID”) that is different from each other. The UID is made up of, for example, numbers, English letters, symbols, or a combination thereof, and the corresponding UID is stored in the memory of each IC chip.
When such an IC chip is used, traceability of the IC chip (or an IC label with the IC chip) can be ensured by reading and using the UID.

  An adhesive layer 9 is provided on the entire lower portion of the concealing layer 8 including the IC chip 5 and the connection layer 4, and the lower surface of the IC label 1 can be adhered to an adherend such as various articles by its adhesive force. .

  In the IC label 1 configured as described above, the functional layer 6 is formed on one surface of the label substrate 2, the metal vapor deposition film is formed on the functional layer 6, and the conductor layer 3 is formed using the mask layer 7. It can be manufactured by forming in a desired shape, further providing the concealing layer 8 and the connection layer 4 in order by printing, mounting the IC chip 5 on the connection layer 4, and finally providing the adhesive layer 9. The concealing layer 8 and the connection layer 4 are efficiently formed by, for example, first printing the concealment layer 8 on a multicolor screen printing machine, then printing the connection layer 4, and putting a drying step immediately after the printing. it can.

  In order to ensure the reliability of the communication performance of the IC label 1, it is important that the IC chip 5 is appropriately mounted on the connection layer 4. One method for confirming the mounting state is to check the bump (antenna connection terminal) traces of the IC chip 5 appearing on the connection layer 4.

  The bump mark is a square or circular shape of the IC paste 5 having a height of about 10 μm, and the silver paste ink layer forming the connection layer 4 is crushed in the layer direction by the bump pressurization, and the shape of the bump is the connection layer 4. It can be seen as a silhouette on the top. If the amount of pressure applied to the IC chip 5 from the lower surface side of the connection layer 4 is too large, the bumps will break through the connection layer 4, resulting in poor electrical contact. If the amount of pressurization is too small, conductor components such as nickel balls having a diameter of several μm contained in the anisotropic conductive adhesive do not come into contact with the bumps of the IC chip 5 or the connection layer 4. Result in poor contact. Therefore, whether or not this pressurization is appropriately performed can be confirmed by visually observing the bump trace with a microscope or the like.

  Since the concealing layer 8 of the present embodiment is formed of the ink that transmits infrared rays as described above, when the infrared rays are irradiated, the infrared rays pass through the concealing layer 8 to visually recognize the connection portion 4 and the IC chip 5. Can do. Since the bump trace is a shadow and not a color change, it can be seen even under a single wavelength in the infrared region. Therefore, by using an infrared camera or the like, after the IC label 1 is manufactured, the mounting state of the IC chip 5 with respect to the connection layer 4 can be confirmed, and the reliability of the communication performance of the IC label 1 can be kept high. it can.

  According to the IC label 1 of the present embodiment, since the concealing layer 8 is provided between the transparent label substrate 2 and the connection layers 4 and 5, the IC label 1 is usually adhered to the adherend. As long as it is used in an environment, the connection layer 4 and the IC chip 5 cannot be viewed from the upper surface of the IC label 1. That is, the user can visually recognize the conductive layer 3 formed in a desired shape and the functional layer 6 as an OVD provided on the upper surface of the conductive layer 3. Therefore, the connection layer 4 and the IC chip 5 do not impair the design and aesthetics of the conductive layer 3 and the functional layer 6, and an IC label can be configured that has both high design and security.

  Moreover, since the masking layer 8 is formed of ink that transmits infrared rays, the connection portion 4 and the IC chip 5 can be visually recognized by irradiating infrared rays. Therefore, forgery products imitating only the appearance under visible light can be easily identified by irradiating with infrared rays and visually observing them. Therefore, an IC label with higher security can be configured.

  In addition, since the functional layer 6 is provided on the conductive layer 3, the decoration effect of the IC label 1 can be enhanced, and forgery can be made more difficult to improve security. Further, when the OVD provided in the functional layer 6 requires a reflective layer, the conductive layer 3 made of a metal thin film can be used as the reflective layer, so that an increase in the number of parts and man-hours can be suppressed, and the IC label 1 Performance can be improved.

  Furthermore, since the mask layer 7, the concealing layer 8, and the connection layer 4 are formed by printing, an IC label that is easy to manufacture and can be manufactured at low cost can be obtained.

  Next, an IC label according to a second embodiment of the present invention will be described with reference to FIGS. The difference between the IC label 11 of the present embodiment and the IC label 1 described above is that an information layer is further provided. In the following description, the same reference numerals are given to the same components as those in the first embodiment described above, and duplicate descriptions are omitted.

  4 is a plan view of the IC label 11, and FIG. 5 is a cross-sectional view taken along line BB in FIG. As shown in FIGS. 4 and 5, the information layer 12 is provided between the concealing layer 8 and the adhesive layer 9 at a position that does not overlap with the conductive layer 3 or the connection layer 4 in plan view. In order to make the information layer 12 visible by the method described later, basically, it is necessary not to overlap the conductive layer 3 or the connection layer 4. The portion may overlap with the conductive layer 3 or the connection layer 4.

  The information layer 12 is made of an infrared absorbing ink containing an infrared absorber. Examples of infrared absorbers include phthalocyanine pigments that exhibit a light green color when dispersed in medium, aminium salts, metal complex systems (metal complex dyes, etc.), phosphate glass systems that exhibit a light brown color, and nitrate glass systems. Absorbents can be employed. The information layer 12 can be continuously formed together with the hiding layer 8 and the connection layer 4 by a multicolor screen printer or the like, and can include desired information such as a serial number and a manufacturing factory.

If the UID recorded on the IC chip 5 of the IC label is recorded on the information layer 12, even if the IC chip 5 breaks down and becomes unreadable, the UID recorded on the information layer 12 Can be traced by the IC chip.
In addition, an appropriate code that can know information related to the manufacture of the IC label 1 (for example, any one or more of a manufacturing date, a manufacturing lot, a manufacturing factory, etc.) may be recorded in the information layer 12. Even by such a method, traceability of manufacturing conditions can be obtained when a defect occurs in the IC label 1.

  As the printing means for recording the above-described various information on the information layer 12, it is preferable to perform printing with a printing machine capable of printing variable information so that different information can be recorded on each of the printed materials relatively easily. . A typical example is an inkjet technique.

Also with the IC label 11 of this embodiment, the same effect as the above-described IC label 1 can be obtained.
Further, since information such as characters formed on the information layer 12 is on the lower surface side of the concealment layer 8, it cannot be viewed in a plan view under visible light. However, when infrared rays are irradiated, the infrared rays pass through the masking layer 8 and are absorbed by the infrared absorbing ink that forms the information layer 12. As a result, the brightness of the portion of the information layer 12 is lowered, and the information described in the information layer 12 can be visually recognized from the upper surface of the IC label 11 as shown in FIG. Therefore, an IC label with higher security can be configured.

  In the present embodiment, the example in which the information layer 12 is provided on the IC label 11 has been described. Instead of this, an infrared absorbing ink is used on the surface of the adherend 100 as in the modification shown in FIG. An information layer 12A may be provided. By adhering the IC label 1 of the first embodiment on the information layer 12A so that the information layer 12A is not covered with the conductive layer 3 or the connection layer 4, the effect substantially similar to that of the IC label 11 of the present embodiment is obtained. Can be obtained. In FIG. 6, since the IC label 1 is shown as a cross section cut at a position corresponding to the line BB in FIG. 4, the connection layer and the IC chip are not shown.

  Next, a third embodiment of the present invention will be described with reference to FIGS. The difference between the IC label 21 of the present embodiment and the above-described IC label 1 is the position and size of providing the concealing layer.

  FIG. 7 is a cross-sectional view of the IC label 21. The shape of the IC label 21 in plan view is substantially the same as the IC label 1 shown in FIG. 1, and FIG. 7 shows a cross-sectional view of the IC label 21 at a position corresponding to the line AA in FIG.

  The formation area of the non-conductive ink concealment layer 22 formed by the printing method is adjusted by adjusting the design of the printing plate. That is, the concealing layer 22 is adjusted so as not to exist in the region where the connection layer 23 and the conductive layer 3 indicated by the dashed line ellipse B in FIG. 7 overlap in the thickness direction of the IC label 21. For this reason, the connection layer 23 and the mask layer 7 are in direct contact with no shielding layer 22 interposed therebetween.

  FIG. 8 is a diagram showing the cross-sectional view of the IC label 1 shown in FIG. 3 again for comparison with the IC label 21. A concealing layer 8 is formed between the connection layer 4 and the mask layer 7 in the range of the ellipse C indicated by the wavy line, and the mask layer 7 and the concealing layer 8 serve as a dielectric and are capacitively coupled. The conductive layer 3 and the connection layer 4 are electrically connected. The thickness of the non-conductive ink of the masking layer 8 is about 4 μm, which is a necessary thickness for visually hiding the connection layer 4.

  In the capacitive coupling, the capacitance is determined mainly by factors such as the area of the electrodes, the interval between the electrodes, and the dielectric constant of the sandwiched dielectric. Since the thickness of the mask layer 7 made of polyamideimide or the like is about 1 μm, it hardly affects the capacitance by itself, but when the thickness of the masking layer 8 is about 4 μm as described above, the dielectric constant is 2 Since it is not so high as about ˜4, the capacity becomes insufficient, and as a result, coupling loss may occur.

The relationship between the dielectric thickness and the electric loss in the capacitive coupling was simulated using a three-dimensional electromagnetic field simulator (HFSS). FIG. 9 is a diagram showing the simulation model used.
The ends of two aluminum thin films (thickness 1 μm) 25 and 26 having the same width (1.5 mm) as the connection layer 4 and the connection layer 23 in a plan view and a length of 3 mm are connected to the insulating dielectric layer 27. Overlaid in the thickness direction across. Then, the amount of wrapping of the aluminum thin films 25 and 26 (the amount of overlap in the longitudinal direction of the aluminum thin films 25 and 26) is changed, and the state of capacitive coupling is measured using a 2.45 GHz signal source with a resistance value (Re value) and It examined as a change of the reactance value (Im value).

  10 and 11 are diagrams showing a model of the dielectric layer used in this simulation. The dielectric layer 27A shown in FIG. 10 is a type of only the polyamideimide layer 28 (thickness 1 μm) that is supposed to have no concealing layer, and the dielectric layer 27B shown in FIG. 11 is made of the polyamideimide layer 28 and an insulating ink. This is a type comprising a concealing layer 29 (thickness 4 μm). The dielectric constants of the polyamideimide layer 28 and the concealing layer 29 were set to 3.5 and 2.0, respectively. The results of this simulation are shown below.

FIG. 12 is a graph showing a simulation result when the dielectric layer 27A is used. As shown in FIG. 12, when the wrap amount was 0.5 mm or more, both the Re value and the Im value were close to 0Ω.
On the other hand, in the simulation result when the dielectric layer 27B is used, as shown in FIG. 13, the Re value and the Im value are finally close to 0Ω when the wrap amount reaches 2 mm.

  From the above results, when the concealing layer 29 having a certain thickness or more is interposed between the aluminum thin films 25 and 26 as in the case of using the dielectric layer 27B, the dielectric layer 27A composed of only the polyamideimide layer 28 is used. It was shown that a larger amount of wrapping is required to obtain a sufficient capacitance as compared with the case of using. Considering that the label width of a standard non-contact IC label is 20 to 40 mm, the design constraints for securing a wrap amount of 2 mm or more between the conductive layer and the connection layer in the antenna design are not small. Conceivable.

  According to the IC label 21 of the present embodiment, the masking layer 22 is not interposed between the mask layer 7 and the connection layer 23, and the shape of the masking layer 22 is adjusted so that both are directly connected. As shown in the simulation result shown in FIG. 12, even if the area of the overlapping region of the conductive layer 3 and the connection layer 23 is reduced, both the resistance value and the reactance value are close to 0Ω, and sufficient electrostatic capacity can be secured. it can. As a result, the amount of silver paste ink used to form the connection layer 23 can be reduced, and the manufacturing cost can be further reduced.

  In addition, since the shape of the conductive layer 3 can be designed with little awareness of the amount of wrapping with the connection layer 4, the degree of freedom in designing the antenna made of the conductive layer 3 can be expanded, and an IC label with a high design effect can be easily obtained. Can be manufactured.

  Further, in the plan view of the IC label 21, the region of the connection layer 23 that overlaps the conductive layer 3 is not visible due to light reflection of the conductive layer 3, so that the concealing layer 22 is interposed between the conductive layer 3 and the connection layer 23. However, the appearance is not different from the IC label 1 of the first embodiment. Therefore, an IC label in which generation of coupling loss is suppressed while maintaining a high design effect can be obtained.

  The impedance matching of the IC label 21 is generally performed by a procedure of generating a impedance on the antenna side using a part of the conductive layer 3 and the connection layer 23 and matching the impedance with the input impedance of the IC chip 5. However, instead of this, an impedance matching circuit may be incorporated in the connection layer 23. Even in this case, the same effect can be obtained by reducing the area of the overlapping region of the conductive layer 3 and the connection layer 23.

  The embodiments of the present invention have been described above, but the technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. is there.

  For example, in each of the above-described embodiments, the example in which the conductive layer 3 is directly provided on the label base material 2 has been described, but instead, a metal vapor deposition film is formed in a desired shape on a film-like base material. Then, the conductive layer may be formed by bonding to the label substrate 2.

Further, instead of forming the concealing layer 8 by printing, a concealing layer may be formed by bonding a film-like material having similar optical characteristics to the lower surface side of the conductive layer 3. In this case, the concealing layer 8 can also be used as an insulating layer for capacitive coupling between the conductive layer 3 and the connection layer 4, and an IC label having a simpler structure can be obtained.
On the other hand, instead of the method of forming the connection layer 4 by printing, a metal thin film is formed on one surface of a base material made of a sheet-like insulating material by sputtering or vapor deposition, or printing using a conductive paste or the like. A conductive layer may be formed by the above method to form a connection layer, an IC chip may be mounted on this connection layer to form an inlet, and an IC label may be formed by bonding to the lower surface side of the concealing layer 8.
However, if the concealing layer and the connection layer are formed by printing, it is difficult to take out only the connection layer and the IC chip from the IC label as an inlet, so that it is more difficult to forge the IC label and the security can be improved. preferable.

  Furthermore, in each of the above-described embodiments, the example in which the concealing layer 8 is provided on the entire lower surface of the label base material 2 has been described, but instead of this, the connection layer 4 and the IC chip 5 are only partially covered. It may be provided.

  In addition, in each of the above-described embodiments, the example in which the shielding layer 8 has a property of transmitting infrared rays has been described. However, the shielding layer is formed of a material having a property of transmitting light having a wavelength other than visible light, for example, ultraviolet rays. However, by irradiating with ultraviolet rays, effects such as confirmation of mounting state and improvement of security can be obtained as in the case of the above-described IC label. In this case, when the information layer is provided, the information layer may be formed with ultraviolet absorbing ink containing various ultraviolet absorbers such as benzotriazole, benzoate, benzophenone, and triazine.

  Further, in the manufacture of the IC label of the present invention, when the anisotropic conductive adhesive is cured at the time of manufacture, for example, at the time of chip mounting, etc. There is a possibility that the color tone of the ink may change due to the flow of ink in the ink and other causes. When such a thing is concerned on a process, it is mentioned as one of the countermeasures to employ | adopt the heat resistant ink which has high heat resistance as a material which forms a concealment layer, and a color tone does not change with heating and pressurization. Specific examples of heat-resistant inks include oil-based inks, water-based inks, ultraviolet curable printing inks, and the like, and inks having a light-resistant ink function may also be included. As an example of the product, Japanese Patent Application Laid-Open No. 2006-225004 discloses a trade name FDOLS manufactured by Toyo Ink Manufacturing Co., Ltd.

  In the IC label of the present invention, the mask layer 7 as an insulating layer is not essential. Therefore, the IC label may be configured such that the connection layer 4 is provided directly on the conductive layer 3 by a method such as printing, and the conductive layer 3 and the connection layer 4 are directly electrically connected. In this case, the mask layer 7 may be removed after the demetalization process of the conductive layer 3.

  Further, in the IC label of the present invention, an optical change device is not essential. Therefore, when it is not necessary to mount an optical change device according to specifications, a conductive layer may be provided directly on the lower surface side of the label base material, and an IC label without the functional layer 6 may be configured.

1, 11, 21 Non-contact IC label 2 Label base 3 Conductive layer 4, 23 Connection layer 5 IC chip 6 Functional layer 7 Mask layer (insulating layer)
8, 22 Concealment layer 12, 12A Information layer

Claims (3)

A non-contact IC label having an IC chip capable of non-contact data communication with an external reader,
A transparent label substrate,
An optical change device provided on the lower surface of the label substrate;
A conductive layer provided bonded to the lower surface of the optical change device and functioning as an antenna of the IC chip;
A connection layer electrically connected to the IC chip;
An insulating layer provided between the conductive layer and the connection layer for capacitively coupling the conductive layer and the connection layer;
Provided between the optical change device and the connection layer without being provided between the conductive layer and the insulating layer, making it impossible to visually recognize the connection layer from above the label base material under visible light An insulating concealing layer,
With
The non-contact IC label, wherein the insulating layer and the connection layer are directly bonded without interposing the concealing layer. The contactless IC label according to claim 1, wherein an end of the insulating layer on the connection layer side and an end of the connection layer on the insulating layer side are directly bonded. Article contactless IC label according to claim 1 or 2, characterized in that bonded.

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