JP5258402B2 - Electron beam surface treatment apparatus and electron beam surface treatment method - Google Patents

Description

  The present invention relates to an electron beam surface treatment apparatus and an electron beam surface treatment method for performing metal surface treatment using an electron beam.

  In general, a die must be subjected to surface finishing after rough machining by a cutting machine or electric discharge machining. Conventionally, this finishing process is performed by polishing by a skilled worker, and much time and cost are required. Therefore, in order to smooth the surface of the object to be processed without relying on manual work, a technique for performing surface treatment by irradiating an electron beam over a wide range of the surface of the object to be processed (for example, Patent Document 1). And a technique (for example, see Patent Document 2) in which an electron beam is focused on the vicinity of an object to be processed and surface-treated by two-dimensional scanning is proposed.

Japanese Patent Laid-Open No. 2004-1086 (pages 3 to 5, FIG. 1) Japanese Patent Laying-Open No. 2006-35263 (pages 4-9, FIG. 1)

The technique described in Patent Document 1 can finish to a fine surface roughness, but since an electron beam is irradiated over a wide area, tensile residual stress is likely to occur after the surface layer is melted and solidified, Fine cracks are generated on the surface of the workpiece. Moreover, if the shape of the object to be processed is complicated, the surface cannot be irradiated with an electron beam uniformly. For this reason, local unevenness is likely to occur in the surface roughness.
In the technique described in Patent Document 2, the surface of the surface to be processed is focused, the beam diameter is about φ 0.03 mm, and the electron beam is digitally minutely (for example, 0.01 mm to 0.05 mm). Since the preset position is moved according to the data and two-dimensional scanning is performed, surface treatment can be performed even with a complicated shape, but the surface roughness can be improved only to about 1 μm.
When a material that improves the properties of the workpiece is applied to the surface to be processed, and is irradiated with an electron beam to be integrated with the surface to be processed, and the processing to improve the properties is performed, the conventional irradiation method uses a coating material after irradiation. There was a problem that the existence was uneven and uniform surface characteristics could not be obtained.

  The present invention has been made in order to solve the above-described problems, and suppresses the flow of molten metal in the molten region on the surface of the object to be processed, and can be finished to a fine surface roughness. And an electron beam surface treatment method.

In the electron beam surface treatment apparatus according to the present invention, a table on which an object to be processed is placed and moved in the XYZ directions, an electron beam irradiation apparatus for irradiating the object to be processed with an electron beam, the electron A deflection control device that controls a deflection lens that deflects the electron beam irradiated by the beam irradiation device, and a control device that controls the table and the electron beam irradiation device; the control device and the deflection control device control the deflection lens; an electron beam, is advanced while minutely oscillated back and forth with respect to the traveling direction of the electron beam is intended to scan the processing target area of the object to be processed by the electron beam.

As described above, the present invention includes a table configured to place an object to be processed and moved in the XYZ directions, an electron beam irradiation apparatus for irradiating the object to be processed with an electron beam, and the electron beam irradiation. A deflection control device that controls a deflection lens that deflects the electron beam irradiated by the apparatus, and a control device that controls the table and the electron beam irradiation device are provided. The control device and the deflection control device control the deflection lens, and the electron beam Is moved forward and backward with a slight vibration in the traveling direction of the electron beam, and the region to be processed of the object to be processed is scanned by the electron beam, so that the flow of molten metal due to melting in the region to be processed can be suppressed. , Flatness can be improved.

Embodiment 1 FIG.
FIG. 1 is a block diagram showing an electron beam surface treatment apparatus according to Embodiment 1 of the present invention.
In FIG. 1, an electron beam surface treatment apparatus 1 includes an XYZ table 4 (table) on which a processing target W is placed in a vacuum chamber 2, and an electron gun 8 that generates an electron beam toward the processing target W. And a converging lens 9 for converging the electron beam from the electron gun 8 and a deflecting lens 10 for deflecting the electron beam converged by the converging lens 9. The electron gun 8, the converging lens 9, and the deflection lens 10 constitute an electron beam irradiation device 3.
A vacuum exhaust device 5, a power supply device 6, and a control device 7 are provided outside the vacuum chamber 2. The vacuum evacuation device 5 evacuates the workpiece W after placing it on the XYZ table 4 until the inside of the vacuum chamber 2 reaches a predetermined degree of vacuum. The control device 7 is constituted by a microcomputer or the like, and controls each operation of the electron beam irradiation device 3, the XYZ table 4, the vacuum exhaust device 5, and the power supply device 6 based on a preset control program. The converging lens 9 is controlled so that the beam always focuses on the irradiation position on the surface of the workpiece W. The deflection control device 11 controls the deflection lens 10.

FIG. 2 is an explanatory diagram showing an electron beam trajectory of the electron beam surface treatment apparatus according to Embodiment 1 of the present invention.
In FIG. 2, the deflection control device 11 causes the electron beam to vibrate slightly back and forth with respect to the traveling direction as shown by a minute vibration locus 12. The electron beam trajectory 13 as a whole is drawn on the workpiece W under the control of the control device 7.

FIG. 3 is an explanatory diagram showing an electron beam trajectory in the processing target region of the electron beam surface processing apparatus according to Embodiment 1 of the present invention.
In FIG. 3, an electron beam trajectory 13 as a whole that is two-dimensionally scanned within the processing target region 14 that requires surface treatment of the workpiece W is shown.

Next, the operation will be described.
The electron beam surface treatment apparatus 1 according to Embodiment 1 performs surface treatment of an object to be processed W made of a ferrous metal such as steel, or a non-ferrous metal such as an aluminum alloy, a titanium alloy, or a cemented carbide, An electron beam irradiation device 3 and an XYZ table 4 are arranged in the vacuum chamber 2.
After the workpiece W is placed on the XYZ table 4, vacuuming is performed by the vacuum exhaust device 5 until the inside of the vacuum chamber 2 reaches a predetermined degree of vacuum. When the inside of the vacuum chamber 2 reaches a predetermined degree of vacuum, the control device 7 drives the XYZ table 4 to move the workpiece W to a position where an electron beam can be irradiated to a processing target area where surface processing is required. Then, the power supply device 6 is activated to generate an electron beam from the electron gun 8.
The electron beam irradiation device 3 irradiates the surface of the workpiece W with the electron beam. The electron beam is converged by the converging lens 9, then deflected by the deflection lens 10 and irradiated on the surface of the workpiece W. The
The control device 7 constituted by a microcomputer or the like controls each operation of the electron beam irradiation device 3, the XYZ table 4, the vacuum exhaust device 5, and the power supply device 6 based on a preset control program, The converging lens 9 is controlled so that the irradiation position on the surface of the workpiece W is always focused. At this time, the beam diameter is sufficiently small with respect to the processing region.

Next, the electron beam irradiation method in Embodiment 1 is demonstrated using FIG. 2, FIG.
As shown in FIG. 2, the deflection control device 11 causes the electron beam to vibrate slightly back and forth with respect to the traveling direction of the electron beam as shown by a minute vibration trajectory 12, while the control device 7 and the deflection control device 11 use the deflection lens. 10 is controlled to draw the beam trajectory 13 as a whole.
As shown in FIG. 3, the entire electron beam trajectory 13 is obtained by two-dimensionally scanning the processing target region 14 that requires surface treatment of the workpiece W so as not to cause melting unevenness.
In this way, when the electron beam is scanned within the region to be processed of the workpiece W, the scanning is performed while locally vibrating in the traveling direction, so that the electron beam proceeds with respect to the melting region formed at the time of scanning. Heat is input also in the direction rear. Thereby, the temperature field in the melting region is uniform or the temperature gradient is reduced.
When the temperature gradient in the melting region decreases, convection and vibration generated in the melting region can be reduced, the surface flatness is improved after solidification, and a fine surface roughness of about 0.5 μm in one scan. Can be finished.

  According to the first embodiment, when the electron beam is scanned in the processing target region of the workpiece W, the scanning is performed while locally oscillating back and forth in the traveling direction. The heat input to the molten region is also performed in the rearward direction, so that the temperature field in the molten region is uniform or the temperature gradient is reduced, and the convection and vibration generated in the molten region can be reduced. Thereafter, the flatness of the surface is improved, and it is possible to finish the surface with a fine surface roughness of about 0.5 μm by a single scan.

Embodiment 2. FIG.
In the second embodiment, the XYZ table 4 on which the workpiece W is placed is moved by the controller 7 while the electron beam is vibrated minutely back and forth with respect to the traveling direction by the deflection controller 11 in the first embodiment. By doing so, the beam trajectory 13 as a whole is drawn. At this time, the beam trajectory 13 as a whole may be drawn by controlling both the XYZ table 4 and the electron beam.

Embodiment 3 FIG.
FIG. 4 is an explanatory view showing an electron beam locus of an electron beam surface treatment apparatus according to Embodiment 3 of the present invention.
In FIG. 4, the deflection control device 11 scans the beam on the surface of the workpiece W so as to repeatedly draw a circular scanning locus 15 locally. When the electron beam and the workpiece W are relatively moved in this state, an electron beam locus 16 that repeatedly draws a circular scanning locus 15 is obtained locally. As a whole, the electron beam locus 17 is scanned in one direction.

The third embodiment is configured as shown in FIG. 1 of the first embodiment, and the electron beam scanning is performed as follows.
The deflection controller 11 scans the beam on the surface of the workpiece W so as to repeatedly draw a circular locus 15 locally. By controlling the deflecting lens 10 in this state, an electron beam locus 16 that locally draws a circular locus 15 is obtained, and an electron beam locus 17 that scans in one direction as a whole is drawn.
As shown in FIG. 3, the entire electron beam trajectory 17 is obtained by two-dimensional scanning so as not to cause melting unevenness in the processing target region 14 that requires surface treatment of the workpiece W.
As described above, when scanning the electron beam in the processing target region 14 of the workpiece W so as to repeatedly draw the locus of a circle locally, the molten region formed at the time of scanning is Heat input is also performed at the rear in the direction of travel. Thereby, the temperature field in the melting region is uniform or the temperature gradient is reduced. When the temperature gradient in the melting region decreases, convection and vibration generated in the melting region can be reduced, the surface flatness is improved after solidification, and a fine surface roughness of about 0.5 μm in one scan. Can be finished.

  According to the third embodiment, when the electron beam is scanned in the processing target region 14 of the workpiece W, the scanning is performed so as to repeatedly draw the locus of a circle locally. The heat input is also applied to the rear of the region in the direction of travel, so that the temperature field in the melting region is uniform or the temperature gradient is reduced, and convection and vibration generated in the melting region can be reduced. The surface flatness is improved, and it is possible to finish the surface with a fine surface roughness of about 0.5 μm by a single scan.

Embodiment 4 FIG.
In the fourth embodiment, the XYZ table 4 on which the workpiece W is placed is moved by the control device 7 while repeatedly drawing the locus 15 of the circle locally by the deflection control device 11 in the third embodiment. Thus, the beam trajectory 17 as a whole is drawn. At this time, the beam trajectory 17 as a whole may be drawn by controlling both the XYZ table 4 and the electron beam.

Embodiment 5 FIG.
In the fifth embodiment, a substance that improves the characteristics of the surface to be processed is uniformly applied on the surface to be processed (first step). The thickness to be applied is preferably 50 μm or less so that heat input to the surface to be treated is not hindered. After application to the surface to be processed, electron beam irradiation is performed by the irradiation method described in the first to fourth embodiments (second step). At this time, by controlling the output of the electron beam, a part of the coating substance can be sublimated and the amount of the remaining coating substance can be adjusted.
Generally, the coated material enters the melted region when the surface to be treated is melted, and is integrated by solidifying as it is. At this time, if a hot water flow is generated in the melting region, the coating substance is caused to flow into the melt, and deviation occurs when remaining. As a result, variations in characteristics occur, and surface roughness also deteriorates.
On the other hand, in the electron beam irradiation method according to the first to fourth embodiments, the flow of molten metal in the molten region can be suppressed. Therefore, if the coating is uniformly applied, the applied substance remains evenly even after processing. To do. Thereby, good characteristics and fine surface roughness can be obtained.

  According to the fifth embodiment, since the material for improving the characteristics of the surface to be processed is applied and then irradiated with the electron beam, the material is uniformly integrated with the surface to be processed without unevenness to improve the surface characteristics. be able to.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the electron beam surface treatment apparatus by Embodiment 1 of this invention. It is explanatory drawing which shows the electron beam locus | trajectory of the electron beam surface treatment apparatus by Embodiment 1 of this invention. It is explanatory drawing which shows the electron beam locus | trajectory in the process target area | region of the electron beam surface treatment apparatus by Embodiment 1 of this invention. It is explanatory drawing which shows the electron beam locus | trajectory of the electron beam surface treatment apparatus by Embodiment 3 of this invention by Embodiment 3 of this invention.

Explanation of symbols

1 electron beam surface treatment device, 2 vacuum chamber, 3 electron beam irradiation device,
4 XYZ table, 5 vacuum exhaust device, 6 power supply device, 7 control device, 8 electron gun,
9 Converging lens, 10 Deflection lens, 11 Deflection control device, 12 Micro vibration locus,
13 Electron beam trajectory as a whole, 14 processing target area, 15 scanning trajectory,
16 Electron beam trajectory, 17 Electron beam trajectory as a whole.

Claims (2)

A table configured to place an object to be processed and move in the XYZ directions;
An electron beam irradiation apparatus for irradiating the workpiece with an electron beam;
A deflection control device that controls a deflection lens that deflects the electron beam irradiated by the electron beam irradiation device;
And a control device for controlling the table and the electron beam irradiation device,
The control unit and the deflection control unit controls the deflection lens, the electron beam is advanced while minutely oscillated back and forth with respect to the traveling direction of the electron beam, the process target area of the object to be processed electron beam surface treatment apparatus, characterized in that for scanning by the electron beam. By controlling the deflection lens for deflecting the electron beam, the electron beam is advanced while minutely oscillated back and forth with respect to the traveling direction of the electron beam to scan the processing target area of the object to be processed by the electron beam An electron beam surface treatment method.

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